74ACT11374
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
SCAS217A – JULY 1987 – REVISED APRIL 1996
D
D
D
D
D
D
D
D
D
DB, DW, OR NT PACKAGE
(TOP VIEW)
Eight D-Type Flip-Flops in a Single Package
3-State Bus Driving True Outputs
Full Parallel Access for Loading
Inputs Are TTL-Voltage Compatible
Flow-Through Architecture Optimizes
PCB Layout
Center-Pin VCC and GND Configurations
Minimize High-Speed Switching Noise
EPICt (Enhanced-Performance Implanted
CMOS) 1-mm Process
500-mA Typical Latch-Up Immunity at
125°C
Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, and Standard
Plastic 300-mil DIPs (NT)
1Q
2Q
3Q
4Q
GND
GND
GND
GND
5Q
6Q
7Q
8Q
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
OE
1D
2D
3D
4D
VCC
VCC
5D
6D
7D
8D
CLK
description
This 8-bit flip-flop features 3-state outputs designed specifically for driving highly-capacitive or relatively
low-impedance loads. It is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus
drivers, and working registers.
The eight flip-flops of the 74ACT11374 are edge-triggered D-type flip-flops. On the positive transition of the clock
(CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.
An output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low
logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus
lines significantly. The high-impedance third state provides the capability to drive bus lines in a bus-organized
system without need for interface or pullup components.
OE does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
The 74ACT11374 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each flip-flop)
INPUTS
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
L
X
L
H
X
Q0
Q0
L
↓
X
Q0
H
X
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
74ACT11374
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
SCAS217A – JULY 1987 – REVISED APRIL 1996
logic symbol†
24
OE
13
CLK
23
1D
22
2D
3D
4D
5D
6D
7D
8D
EN
C1
1
1D
2
21
3
20
4
17
9
16
10
15
11
14
12
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
OE
CLK
1D
2D
3D
4D
5D
6D
7D
8D
2
24
13
23
C1
1D
1
22
C1
1D
2
21
C1
1D
3
20
C1
1D
4
17
C1
1D
9
16
C1
1D
10
15
C1
1D
11
14
C1
1D
12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
74ACT11374
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
SCAS217A – JULY 1987 – REVISED APRIL 1996
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . 0.65 W
DW package . . . . . . . . . . . . . . . . . . 1.7 W
NT package . . . . . . . . . . . . . . . . . . . 1.3 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils,
except for the NT package, which has a trace length of zero.
recommended operating conditions
MIN
MAX
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
IOH
Output voltage
0
High-level input voltage
2
UNIT
V
V
0.8
V
VCC
VCC
V
High-level output current
–24
mA
IOL
Dt/Dv
Low-level output current
24
mA
0
10
ns/V
TA
Operating free-air temperature
–40
85
°C
Input transition rise or fall rate
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
V
3
74ACT11374
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
SCAS217A – JULY 1987 – REVISED APRIL 1996
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
4.5 V
IOH = –50
50 mA
VOH
24 mA
IOH = –24
IOH = –75 mA{
IOZ
II
TA = 25°C
TYP
MAX
IOL = 24 mA
IOL = 75 mA{
VO = VCC or GND
ICC
VI = VCC or GND
VI = VCC or GND,
DICC}
One input at 3.4 V,
Ci
VI = VCC or GND
VO = VCC or GND
MIN
4.4
4.4
5.5 V
5.4
5.4
4.5 V
3.94
3.8
5.5 V
4.94
MAX
UNIT
V
4.8
5.5 V
IOL = 50 mA
VOL
MIN
3.85
4.5 V
0.1
5.5 V
0.1
0.1
0.1
4.5 V
0.36
0.44
5.5 V
0.36
0.44
5.5 V
V
1.65
5.5 V
±0.5
±5
mA
5.5 V
±0.1
±1
mA
IO = 0
5.5 V
8
80
mA
Other inputs at GND or VCC
5.5 V
0.9
1
mA
5V
4
pF
Co
5V
10
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC.
pF
timing requirements over recommended ranges of supply voltages and operating free-air
temperature (unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
MAX
UNIT
0
55
MHz
fclock
tw
Clock frequency
0
Pulse duration, CLK low or CLK high
9
9
ns
tsu
th
Setup time, data before CLK↑
3
3
ns
5.5
5.5
ns
Hold time, data after CLK↑
55
MIN
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
PARAMETER
fmax
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
4
FROM
(INPUT)
TO
(OUTPUT)
CLK
Any Q
OE
Any Q
OE
Any Q
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TA = 25°C
MIN
TYP
MAX
MIN
MAX
55
70
1.5
8.5
10.7
1.5
55
12.4
1.5
8.5
11.3
1.5
13
1.5
7.5
11
1.5
12.3
1.5
7.5
11
1.5
12.3
1.5
11
12.7
1.5
13.2
1.5
8
10
1.5
10.8
UNIT
MHz
ns
ns
ns
74ACT11374
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
SCAS217A – JULY 1987 – REVISED APRIL 1996
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
d
TEST CONDITIONS
Outputs enabled
flip flop
Power dissipation capacitance per flip-flop
pF
CL = 50 pF,
Outputs disabled
TYP
f = 1 MHz
107
96
UNIT
pF
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
LOAD CIRCUIT
3V
Timing Input
1.5 V
0V
tw
tsu
3V
Input
1.5 V
th
1.5 V
3V
1.5 V
1.5 V
Data Input
0V
0V
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
Output
Control
(low-level
enabling)
3V
Input
1.5 V
1.5 V
0V
tPHL
tPLH
In-Phase
Output
50% VCC
50% VCC
0V
tPZL
VOH
50% VCC
VOL
Output
Waveform 2
S1 at GND
(see Note B)
[ VCC
tPLZ
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
3V
1.5 V
1.5 V
50% VCC
VOL
tPHZ
tPZH
VOLTAGE WAVEFORMS
20% VCC
50% VCC
80% VCC
VOH
[0V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
74ACT11374DBLE
OBSOLETE
SSOP
DB
24
TBD
Call TI
74ACT11374DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11374DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11374DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11374DWR
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11374DWRE4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11374DWRG4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11374NT
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
74ACT11374NTE4
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
74ACT11374DWR
Package Package Pins
Type Drawing
SOIC
DW
24
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
10.75
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
15.7
2.7
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74ACT11374DWR
SOIC
DW
24
2000
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
74ACT11374DW
ACTIVE
SOIC
DW
24
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ACT11374
Samples
74ACT11374DWR
ACTIVE
SOIC
DW
24
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ACT11374
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of