SN74ALVCH16269
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES019N – JULY 1995 – REVISED JULY 2004
FEATURES
•
•
•
•
•
•
•
DGG OR DL PACKAGE
(TOP VIEW)
Member of the Texas Instruments Widebus™
Family
Operates From 1.65 V to 3.6 V
Max tpd of 5 ns at 3.3 V
±24-mA Output Drive at 3.3 V
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
OEA
OEB1
2B3
GND
2B2
2B1
VCC
A1
A2
A3
GND
A4
A5
A6
A7
A8
A9
GND
A10
A11
A12
VCC
1B1
1B2
GND
1B3
NC
SEL
DESCRIPTION/ORDERING INFORMATION
This 12-bit to 24-bit registered bus exchanger is
designed for 1.65-V to 3.6-V VCC operation.
The SN74ALVCH16269 is used in applications in
which two separate ports must be multiplexed onto,
or demultiplexed from, a single port. The device is
particularly suitable as an interface between
synchronous
DRAMs
and
high-speed
microprocessors.
Data is stored in the internal B-port registers on the
low-to-high transition of the clock (CLK) input when
the appropriate clock-enable (CLKENA) inputs are
low. Proper control of these inputs allows two
sequential 12-bit words to be presented as a 24-bit
word on the B port. For data transfer in the B-to-A
direction, a single storage register is provided. The
select (SEL) line selects 1B or 2B data for the A
outputs. The register on the A output permits the
fastest possible data transfer, extending the period
during which the data is valid on the bus. The control
terminals are registered so that all transactions are
synchronous with CLK. Data flow is controlled by the
active-low output enables (OEA, OEB1, OEB2).
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
OEB2
CLKENA2
2B4
GND
2B5
2B6
VCC
2B7
2B8
2B9
GND
2B10
2B11
2B12
1B12
1B11
1B10
GND
1B9
1B8
1B7
VCC
1B6
1B5
GND
1B4
CLKENA1
CLK
NC − No internal connection
ORDERING INFORMATION
PACKAGE (1)
TA
SSOP - DL
-40°C to 85°C
TSSOP - DGG
VFBGA - GQL
VFBGA - ZQL (Pb-free)
(1)
ORDERABLE PART NUMBER
Tube
SN74ALVCH16269DL
Tape and reel
SN74ALVCH16269DLR
Tape and reel
SN74ALVCH16269DGGR
Tape and reel
SN74ALVCH16269KR
74ALVCH16269ZQLR
TOP-SIDE MARKING
ALVCH16269
ALVCH16269
VH269
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2004, Texas Instruments Incorporated
SN74ALVCH16269
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES019N – JULY 1995 – REVISED JULY 2004
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
To ensure the high-impedance state during power up or power down, a clock pulse should be applied as soon as
possible, and OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined
by the current-sinking capability of the driver. Due to OE being routed through a register, the active state of the
outputs cannot be determined before the arrival of the first clock pulse.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
GQL OR ZQL PACKAGE
(TOP VIEW)
1
3
4
5
TERMINAL ASSIGNMENTS
6
1
2
3
4
5
6
A
A
2B3
OEB1
OEA
OEB2
CLKENA2
2B4
B
B
2B1
2B2
GND
GND
2B5
2B6
C
C
A2
A1
VCC
VCC
2B7
2B8
D
D
A4
A3
GND
GND
2B9
2B10
E
E
A6
A5
2B11
2B12
F
F
A7
A8
1B11
1B12
G
G
A9
A10
GND
1B9
1B10
H
A11
A12
VCC
VCC
1B7
1B8
J
1B1
1B2
GND
GND
1B5
1B6
K
1B3
NC
SEL
CLK
CLKENA1
1B4
H
J
K
2
2
GND
SN74ALVCH16269
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES019N – JULY 1995 – REVISED JULY 2004
FUNCTION TABLES
OUTPUT ENABLE
INPUTS
OUTPUTS
CLK OEA OEB
A
1B, 2B
Z
Z
Active
↑
H
↑
H
L
Z
↑
L
H
Active
Z
↑
L
L
Active
Active
H
A-TO-B STORAGE (OEB = L)
INPUTS
OUTPUTS
CLKENA1
CLKENA2
CLK
A
1B
2B
L
H
↑
L
L
2B0 (1)
L
H
↑
H
H
2B0 (1)
L
L
↑
L
L
L
H
(1)
L
L
↑
H
H
H
L
↑
L
1B0 (1)
L
H
L
↑
H
1B0 (1)
H
H
H
X
X
1B0 (1)
2B0 (1)
Output level before the indicated steady-state input conditions were
established
B-TO-A STORAGE (OEA = L)
INPUTS
OUTPUT
CLK
SEL
1B
2B
A
X
H
X
X
A0 (1)
X
L
X
X
A0 (1)
↑
H
L
X
L
↑
H
H
X
H
↑
L
X
L
L
↑
L
X
H
H
(1)
Output level before the indicated
steady-state input conditions
were established
3
SN74ALVCH16269
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES019N – JULY 1995 – REVISED JULY 2004
LOGIC DIAGRAM (POSITIVE LOGIC)
CLK
OEB1
29
C1
2
1D
C1
OEB2
CLKENA1
CLKENA2
56
1D
30
55
C1
SEL
OEA
28
1D
1
1D
1 of 12 Channels
C1
G1
A1
8
C1
1
1D
23
1B1
1
CE
C1
1D
6
CE
C1
1D
Pin numbers shown are for the DGG and DL packages.
4
2B1
www.ti.com
SN74ALVCH16269
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
SCES019N – JULY 1995 – REVISED JULY 2004
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage range
MIN
MAX
-0.5
4.6
Except I/O ports (2)
-0.5
4.6
I/O ports (2) (3)
-0.5
VCC + 0.5
-0.5
VCC + 0.5
UNIT
V
VI
Input voltage range
VO
Output voltage range (2) (3)
IIK
Input clamp current
VI < 0
-50
mA
IOK
Output clamp current
VO < 0
-50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through each VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
DGG package
81
DL package
74
GQL/ZQL package
(1)
(2)
(3)
(4)
V
V
°C/W
42
-65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 4.6 V maximum.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
MIN
MAX
1.65
3.6
Low-level input voltage
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
VIL
UNIT
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
0.8
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
VCC = 1.65 V
-4
VCC = 2.3 V
-12
VCC = 2.7 V
-12
VCC = 3 V
-24
VCC = 1.65 V
4
VCC = 2.3 V
12
VCC = 2.7 V
12
VCC = 3 V
24
-40
mA
mA
10
ns/V
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
5
SN74ALVCH16269
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES019N – JULY 1995 – REVISED JULY 2004
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = -100 µA
IOH = -6 mA
2.3 V
2
2.3 V
1.7
2.7 V
2.2
3V
2.4
IOH = -24 mA
3V
2
IOL = 100 µA
MAX
V
1.65 V to 3.6 V
0.2
1.65 V
0.45
IOL = 6 mA
2.3 V
0.4
2.3 V
0.7
IOL = 24 mA
2.7 V
0.4
3V
0.55
±5
VI = VCC or GND
3.6 V
VI = 0.58 V
1.65 V
25
VI = 1.07 V
1.65 V
-25
VI = 0.7 V
2.3 V
45
VI = 1.7 V
2.3 V
-45
VI = 0.8 V
3V
75
3V
-75
VI = 2 V
UNIT
1.2
IOL = 4 mA
IOL = 12 mA
II(hold)
TYP (1)
VCC - 0.2
1.65 V
IOH = -12 mA
II
1.65 V to 3.6 V
MIN
IOH = -4 mA
VOH
VOL
VCC
V
µA
µA
3.6 V
±500
IOZ (3)
VO = VCC or GND
3.6 V
±10
µA
ICC
VI = VCC or GND, IO = 0
3.6 V
40
µA
∆ICC
One input at VCC - 0.6 V, Other inputs at VCC or GND
3 V to 3.6 V
750
µA
VI = 0 to 3.6
V (2)
Ci
Control inputs
VI = VCC or GND
3.3 V
3.5
pF
Cio
A or B ports
VO = VCC or GND
3.3 V
9
pF
(1)
(2)
(3)
6
All typical values are at VCC = 3.3 V, TA = 25°C.
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
For I/O ports, the parameter IOZ includes the input leakage current.
SN74ALVCH16269
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES019N – JULY 1995 – REVISED JULY 2004
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 2.5 V
± 0.2 V
VCC = 1.8 V
MIN
Clock frequency
tw
Pulse duration, CLK high or low
th
(1)
Setup time
Hold time
MIN
(1)
fclock
tsu
MAX
(1)
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
MAX
MIN
MAX
135
3.3
MIN
135
135
3.3
3.3
A data before CLK↑
(1)
2
2
1.7
B data before CLK↑
(1)
2.2
2.1
1.8
SEL before CLK↑
(1)
1.6
1.6
1.3
CLKENA1 or CLKENA2 before CLK↑
(1)
1
1.2
0.9
OE before CLK↑
(1)
1.5
1.6
1.3
A data after CLK↑
(1)
0.7
0.6
0.6
B data after CLK↑
(1)
0.7
0.6
0.6
SEL after CLK↑
(1)
1.1
0.7
0.7
CLKENA1 or CLKENA2 after CLK↑
(1)
1
0.8
1.1
OE after CLK↑
(1)
0.8
0.8
0.8
UNIT
MAX
MHz
ns
ns
ns
This information was not available at the time of publication.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 1.8 V
MIN
(1)
fmax
(1)
TYP
tpd
CLK
ten
CLK
tdis
CLK
VCC = 2.5 V
± 0.2 V
MIN
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
MAX
MIN
135
MAX
135
MIN
UNIT
MAX
135
MHz
B
(1)
1
8.2
7.3
1
6.2
A
(1)
1
6.4
5.8
1
5
B
(1)
1
7.9
6.7
1
6.1
A
(1)
1
7.6
6.2
1
5.9
B
(1)
1
8.1
6.9
1
6.1
A
(1)
1
7.5
6.8
1
5.6
ns
ns
ns
This information was not available at the time of publication.
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
Cpd
(1)
Power dissipation
capacitance per exchanger
All outputs enabled
All outputs disabled
TEST CONDITIONS
CL = 50 pF, f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
(1)
87
120
(1)
80.5
118
UNIT
pF
This information was not available at the time of publication.
7
SN74ALVCH16269
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES019N – JULY 1995 – REVISED JULY 2004
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUT
VCC
1.8 V
2.5 V ± 0.2 V
2.7 V
3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
tw
VI
Timing
Input
VM
VM
VM
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VM
VM
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VLOAD/2
VM
tPZH
VOH
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPHL
VM
VI
VM
tPZL
VI
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VI
Data
Input
VM
0V
0V
tsu
Output
VI
VM
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VOH
VM
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
8
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
74ALVCH16269DGGRE4
ACTIVE
TSSOP
DGG
56
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
74ALVCH16269DGGRG4
ACTIVE
TSSOP
DGG
56
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
74ALVCH16269DLG4
ACTIVE
SSOP
DL
56
20
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
74ALVCH16269DLRG4
ACTIVE
SSOP
DL
56
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74ALVCH16269DGGR
ACTIVE
TSSOP
DGG
56
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74ALVCH16269DL
ACTIVE
SSOP
DL
56
20
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74ALVCH16269DLR
ACTIVE
SSOP
DL
56
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74ALVCH16269KR
NRND
BGA
MICROSTAR
JUNIOR
GQL
56
1000
TBD
SNPB
Level-1-240C-UNLIM
Samples Not Available
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jul-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74ALVCH16269DGGR TSSOP
SN74ALVCH16269DLR
SSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGG
56
2000
330.0
24.4
8.6
15.6
1.8
12.0
24.0
Q1
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
SN74ALVCH16269KR
BGA MI
CROSTA
R JUNI
OR
GQL
56
1000
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
SN74ALVCH16269KR
BGA MI
CROSTA
R JUNI
OR
GQL
56
1000
330.0
16.4
4.8
7.3
1.45
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jul-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ALVCH16269DGGR
TSSOP
DGG
56
2000
346.0
346.0
41.0
SN74ALVCH16269DLR
SSOP
DL
56
1000
346.0
346.0
49.0
SN74ALVCH16269KR
BGA MICROSTAR
JUNIOR
GQL
56
1000
333.2
345.9
28.6
SN74ALVCH16269KR
BGA MICROSTAR
JUNIOR
GQL
56
1000
333.2
345.9
28.6
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and
Automotive
www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
Wireless
www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions
www.ti.com/lprf
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
