SN74AVCB164245
16-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
www.ti.com
SCES394D – JUNE 2002 – REVISED JUNE 2005
•
FEATURES
•
•
•
•
•
Member of the Texas Instruments Widebus™
Family
DOC™ Circuitry Dynamically Changes Output
Impedance, Resulting in Noise Reduction
Without Speed Degradation
Dynamic Drive Capability Is Equivalent to
Standard Outputs With IOH and IOL of ±24 mA
at 2.5-V VCC
Control Inputs VIH/VIL Levels Are Referenced
to VCCB Voltage
If Either VCC Input Is at GND, Both Ports Are in
the High-Impedance State
•
•
•
•
Overvoltage-Tolerant Inputs/Outputs Allow
Mixed-Voltage-Mode Data Communications
Ioff Supports Partial-Power-Down Mode
Operation
Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over Full 1.4-V to 3.6-V
Power-Supply Range
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION
This 16-bit (dual-octal) noninverting bus transceiver uses two separate configurable power-supply rails. The
A port is designed to track VCCA. VCCA accepts any supply voltage from 1.4 V to 3.6 V. The B port is designed to
track VCCB. VCCB accepts any supply voltage from 1.4 V to 3.6 V. This allows for universal low-voltage
bidirectional translation between any of the 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
The SN74AVCB164245 is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the outputs so the buses are
effectively isolated.
The SN74AVCB164245 is designed so that the control pins (1DIR, 2DIR, 1OE, and 2OE) are supplied by VCCB.
To ensure the high-impedance state during power up or power down, OE should be tied to VCCB through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down. If either VCC input is at GND,
both ports are in the high-impedance state.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
ORDERABLE PART NUMBER
FBGA – GRD
Tape and reel
74AVCB164245GRDR
FBGA – ZRD (Pb-Free)
Tape and reel
74AVCB164245ZRDR
TSSOP – DGG
Tape and reel
SN74AVCB164245GR
TVSOP – DGV
Tape and reel
SN74AVCB164245VR
VFBGA – GQL
Tape and reel
SN74AVCB164245KR
VFBGA – ZQL (Pb-Free)
Tape and reel
74AVCB164245ZQLR
TOP-SIDE MARKING
WB4245
AVCB164245
WB4245
WB4245
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus, DOC are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2005, Texas Instruments Incorporated
SN74AVCB164245
16-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
SCES394D – JUNE 2002 – REVISED JUNE 2005
TERMINAL ASSIGNMENTS
DGG OR DGV PACKAGE
(TOP VIEW)
1DIR
1B1
1B2
GND
1B3
1B4
VCCB
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
VCCB
2B5
2B6
GND
2B7
2B8
2DIR
2
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1OE
1A1
1A2
GND
1A3
1A4
VCCA
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
VCCA
2A5
2A6
GND
2A7
2A8
2OE
www.ti.com
SN74AVCB164245
16-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
www.ti.com
SCES394D – JUNE 2002 – REVISED JUNE 2005
TERMINAL ASSIGNMENTS
(56-Ball GQL/ZQL Package) (1)
GQL OR ZQL PACKAGE
(TOP VIEW)
1 2 3 4 5 6
A
B
C
D
E
F
G
H
J
K
(1)
1
2
3
4
5
6
A
1DIR
NC
NC
NC
NC
1OE
B
1B2
1B1
GND
GND
1A1
1A2
C
1B4
1B3
VCCB
VCCA
1A3
1A4
D
1B6
1B5
GND
GND
1A5
1A6
E
1B8
1B7
1A7
1A8
F
2B1
2B2
2A2
2A1
G
2B3
2B4
GND
GND
2A4
2A3
H
2B5
2B6
VCCB
VCCA
2A6
2A5
J
2B7
2B8
GND
GND
2A8
2A7
K
2DIR
NC
NC
NC
NC
2OE
NC - No internal connection
GRD OR ZRD PACKAGE
(TOP VIEW)
1
2
3
4
5
6
TERMINAL ASSIGNMENTS
(54-Ball GRD/ZRD Package) (1)
A
B
1
2
3
4
5
6
A
1B1
NC
1DIR
1OE
NC
1A1
B
1B3
1B2
NC
NC
1A2
1A3
C
1B5
1B4
VCCB
VCCA
1A4
1A5
C
D
1B7
1B6
GND
GND
1A6
1A7
D
E
2B1
1B8
GND
GND
1A8
2A1
E
F
G
H
(1)
F
2B3
2B2
GND
GND
2A2
2A3
G
2B5
2B4
VCCB
VCCA
2A4
2A5
H
2B7
2B6
NC
NC
2A6
2A7
J
2B8
NC
2DIR
2OE
NC
2A8
NC - No internal connection
xxxxx
J
xxxxx
xxxxx
xxxxx
xxxxx
FUNCTION TABLE
(EACH 8-BIT SECTION)
INPUTS
OPERATION
OE
DIR
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
3
SN74AVCB164245
16-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
www.ti.com
SCES394D – JUNE 2002 – REVISED JUNE 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
1DIR
1
2DIR
48
1A1
25
1OE
47
2A1
2
24
2OE
36
13
1B1
2B1
To Seven Other Channels
To Seven Other Channels
Pin numbers shown are for the DGG and DGV packages.
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCCA
VCCB
VI
MIN
MAX
–0.5
4.6
I/O ports (A port)
–0.5
4.6
I/O ports (B port)
–0.5
4.6
Control inputs
–0.5
4.6
A port
–0.5
4.6
B port
–0.5
4.6
A port
–0.5 VCCA + 0.5
B port
–0.5 VCCB + 0.5
Supply voltage range
Input voltage
range (2)
UNIT
V
V
VO
Voltage range applied to any output in the high-impedance or
power-off state (2)
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
50
mA
100
mA
Continuous current through VCCA, VCCB, or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
DGG package
70
DGV package
58
GQL/ZQL package
28
GRD/ZRD package
(1)
(2)
(3)
(4)
4
V
V
°C/W
36
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
www.ti.com
SN74AVCB164245
16-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
SCES394D – JUNE 2002 – REVISED JUNE 2005
Recommended Operating Conditions
(1) (2) (3)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCCA
Supply voltage
VCCI
1.4
3.6
V
VCCB
Supply voltage
1.4
3.6
V
VIH
High-level input voltage
VIL
Low-level input voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
Data inputs
Data inputs
Control inputs
(referenced to VCCB)
Control inputs
(referenced to VCCB)
VCCI × 0.65
1.95 V to 2.7 V
1.7
2.7 V to 3.6 V
2
1.4 V to 1.95 V
VCCI × 0.35
1.95 V to 2.7 V
0.7
2.7 V to 3.6 V
0.8
1.4 V to 1.95 V
VCCB × 0.65
1.95 V to 2.7 V
1.7
2.7 V to 3.6 V
2
1.4 V to 1.95 V
VCCB × 0.35
1.95 V to 2.7 V
0.7
2.7 V to 3.6 V
0.8
0
VCCO
3-state
0
3.6
Input transition rise or fall rate
TA
Operating free-air temperature
1.4 V to 1.6 V
–2
1.65 V to 1.95 V
–4
2.3 V to 2.7 V
–8
3 V to 3.6 V
–12
1.4 V to 1.6 V
2
1.65 V to 1.95 V
4
2.3 V to 2.7 V
8
3 V to 3.6 V
12
–40
V
V
Active state
Low-level output current
UNIT
V
3.6
∆t/∆v
(1)
(2)
(3)
1.4 V to 1.95 V
0
High-level output current
IOL
VCCO
V
V
V
mA
mA
5
ns/V
85
°C
VCCI is the VCC associated with the data input port.
VCCO is the VCC associated with the data output port.
All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
5
SN74AVCB164245
16-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
www.ti.com
SCES394D – JUNE 2002 – REVISED JUNE 2005
Electrical Characteristics (1) (2)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
VOL
II
Control inputs
A port
Ioff
B port
TEST CONDITIONS
B port
A port
ICCA
MIN TYP (3)
MAX
VI = VIH
1.4 V to 3.6 V
1.4 V to 3.6 V
IOH = –2 mA
VI = VIH
1.4 V
1.4 V
IOH = –4 mA
VI = VIH
1.65 V
1.65 V
1.2
IOH = –8 mA
VI = VIH
2.3 V
2.3 V
1.75
IOH = –12 mA
VI = VIH
3V
3V
2.3
IOH = 100 µA
VI = VIL
1.4 V to 3.6 V
1.4 V to 3.6 V
0.2
IOH = 2 mA
VI = VIL
1.4 V
1.4 V
0.35
IOH = 4 mA
VI = VIL
1.65 V
1.65 V
0.45
IOH = 8 mA
VI = VIL
2.3 V
2.3 V
0.55
IOH = 12 mA
VI = VIL
3V
3V
0.7
1.4 V to 3.6 V
3.6 V
±2.5
0V
0 to 3.6 V
±10
0 to 3.6 V
0V
±10
3.6 V
3.6 V
±12.5
0V
3.6 V
±12.5
3.6 V
0V
±12.5
1.6 V
1.6 V
20
1.95 V
1.95 V
20
2.7 V
2.7 V
30
0V
3.6 V
–40
3.6 V
0V
40
3.6 V
3.6 V
40
VI = VCCB or GND
VI or VO = 0 to 3.6 V
VO = VCCO or GND,
VI = VCCI or GND
VI = VCCI or GND,
ICCB
VCCB
IOH = –100 µA
A or B ports
IOZ (4)
VCCA
VI = VCCI or GND,
OE = VIH
OE = don't
care
IO = 0
IO = 0
UNIT
VCCO – 0.2
1.05
V
1.6 V
1.6 V
20
1.95 V
1.95 V
20
2.7 V
2.7 V
30
0V
3.6 V
40
3.6 V
0V
–40
3.6 V
3.6 V
40
V
µA
µA
µA
µA
µA
Ci
Control inputs
VI = 3.3 V or GND
3.3 V
3.3 V
4
pF
Cio
A or B ports
VO = 3.3 V or GND
3.3 V
3.3 V
5
pF
(1)
(2)
(3)
(4)
6
VCCO is the VCC associated with the output port.
VCCI is the VCC associated with the input port.
All typical values are at TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
SN74AVCB164245
16-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
www.ti.com
SCES394D – JUNE 2002 – REVISED JUNE 2005
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (see Figure 2)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
ten
OE
tdis
OE
VCCB = 1.5 V
0.1 V
VCCB = 1.8 V
0.15 V
VCCB = 2.5 V
0.2 V
VCCB = 3.3 V
0.3 V
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
1.7
6.7
1.9
6.3
1.8
5.5
1.7
5.8
A
1.8
6.8
2.2
7.4
2.1
7.6
2.1
7.3
A
2.5
8.4
2.4
7.4
2.1
5.2
1.9
4.2
B
2.1
9
2.9
9.8
3.2
10
3
9.8
A
2.2
6.9
2.3
6.1
1.3
3.6
1.3
3
B
2.1
7.1
2.3
6.4
1.7
5.1
1.6
4.8
UNIT
ns
ns
ns
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (see Figure 2)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
ten
OE
tdis
OE
VCCB = 1.5 V
0.1 V
VCCB = 1.8 V
0.15 V
VCCB = 2.5 V
0.2 V
VCCB = 3.3 V
0.3 V
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
1.7
6.7
1.8
6
1.7
4.7
1.6
4.3
A
1.4
5.5
1.8
6
1.8
5.8
1.8
5.5
A
2.6
8.5
2.5
7.5
2.2
5.3
1.9
4.2
B
1.8
7.6
2.6
7.7
2.6
7.6
2.6
7.4
A
2.3
7
2.3
6.1
1.3
3.6
1.3
3
B
1.8
7
2.5
6.3
1.8
4.7
1.7
4.4
UNIT
ns
ns
ns
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (see Figure 2)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
B
A
ten
OE
tdis
OE
VCCB = 1.5 V
0.1 V
MIN
VCCB = 1.8 V
0.15 V
VCCB = 2.5 V
0.2 V
VCCB = 3.3 V
0.3 V
MAX
MIN
MAX
MIN
MAX
MIN
MAX
1.6
6
1.8
5.6
1.5
4
1.4
3.4
1.3
4.6
1.7
4.4
1.5
4
1.4
3.7
A
3.1
8.5
2.5
7.5
2.2
5.3
1.9
4.2
B
1.7
5.7
2.2
5.5
2.2
5.3
2.2
5.1
A
2.4
7
3
6.1
1.4
3.6
1.2
3
B
1.2
5.8
1.9
5
1.4
3.6
1.3
3.3
UNIT
ns
ns
ns
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (see Figure 2)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
ten
OE
tdis
OE
VCCB = 1.5 V
0.1 V
VCCB = 1.8 V
0.15 V
VCCB = 2.5 V
0.2 V
VCCB = 3.3 V
0.3 V
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
1.5
5.9
1.7
5.4
1.5
3.7
1.4
3.1
A
1.3
4.5
1.6
3.8
1.5
3.3
1.4
3.1
A
2.6
8.3
2.5
7.4
2.2
5.2
1.9
4.1
B
1.6
4.9
2
4.5
2
4.3
1.9
4.1
A
2.3
7
3
6
1.3
3.5
1.2
3.5
B
1.3
6.9
2.1
5.5
1.6
3.8
1.5
3.5
UNIT
ns
ns
ns
7
SN74AVCB164245
16-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
www.ti.com
SCES394D – JUNE 2002 – REVISED JUNE 2005
Operating Characteristics
VCCA and VCCB = 3.3 V, TA = 25°C
PARAMETER
TEST CONDITIONS
Power dissipation capacitance per transceiver,
A-port input, B-port output
CpdA
(VCCA)
CpdB
(VCCB)
TYP
Outputs enabled
Outputs disabled
CL = 0,
7
f = 10 MHz
Power dissipation capacitance per transceiver,
B-port input, A-port output
Outputs enabled
Outputs disabled
7
Power dissipation capacitance per transceiver,
A-port input, B-port output
Outputs enabled
20
Power dissipation capacitance per transceiver,
B-port input, A-port output
Outputs enabled
Outputs disabled
UNIT
14
CL = 0,
20
7
f = 10 MHz
14
Outputs disabled
pF
pF
7
Output Description
The DOC™ circuitry is implemented, which, during the transition, initially lowers the output impedance to
effectively drive the load and, subsequently, raises the impedance to reduce noise. Figure 1 shows typical VOL vs
IOL and VOH vs IOH curves to illustrate the output impedance and drive capability of the circuit. At the beginning of
the signal transition, the DOC circuit provides a maximum dynamic drive that is equivalent to a high-drive
standard-output device. For more information, refer to the TI application reports, AVC Logic Family Technology
and Applications, literature number SCEA006, and Dynamic Output Control (DOC™) Circuitry Technology and
Applications, literature number SCEA009.
3.2
TA = 25°C
Process = Nominal
− Output Voltage − V
2.8
2.4
VCC = 3.3 V
2.0
1.6
VCC = 2.5 V
1.2
OH
VCC = 1.8 V
0.8
V
VOL − Output Voltage − V
2.8
TA = 25°C
Process = Nominal
2.4
2.0
1.6
1.2
0.8
VCC = 3.3 V
0.4
0.4
0
17
34
51
68
85 102 119
IOL − Output Current − mA
136
153
170
VCC = 2.5 V
−160 −144 −128 −112 −96 −80 −64 −48
IOH − Output Current − mA
Figure 1. Typical Output Voltage vs Output Current
8
VCC = 1.8 V
−32 −16
0
SN74AVCB164245
16-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
www.ti.com
SCES394D – JUNE 2002 – REVISED JUNE 2005
PARAMETER MEASUREMENT INFORMATION
2 × VCCO
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCCO
GND
RL
tw
LOAD CIRCUIT
VCCI
VCCI/2
Input
VCCO
CL
RL
VTP
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
15 pF
30 pF
30 pF
30 pF
2 kΩ
1 kΩ
500 Ω
500 Ω
0.1 V
0.15 V
0.15 V
0.3 V
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VCCB
Output
Control
(low-level
enabling)
VCCB/2
VCCB/2
0V
tPZL
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
VCCO/2
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOH
VCCO/2
VOL
tPLZ
VCCO
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
VCCO/2
VOL + VTP
VOL
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
tPHZ
VCCO/2
VOH − VTP
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
Figure 2. Load Circuit and Voltage Waveforms
9
PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
TBD
Call TI
Call TI
-40 to 85
Device Marking
(4/5)
74AVCB164245GRDR
OBSOLETE
BGA
MICROSTAR
JUNIOR
GRD
54
74AVCB164245GRE4
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AVCB164245
74AVCB164245GRG4
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AVCB164245
74AVCB164245VRE4
ACTIVE
TVSOP
DGV
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
WB4245
74AVCB164245ZQLR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQL
56
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
WB4245
74AVCB164245ZRDR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZRD
54
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
WB4245
SN74AVCB164245GR
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AVCB164245
SN74AVCB164245KR
OBSOLETE
BGA
MICROSTAR
JUNIOR
GQL
56
TBD
Call TI
Call TI
-40 to 85
WB4245
SN74AVCB164245VR
ACTIVE
TVSOP
DGV
48
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
WB4245
2000
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2015
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74AVCB164245 :
• Automotive: SN74AVCB164245-Q1
• Enhanced Product: SN74AVCB164245-EP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
74AVCB164245ZQLR
BGA MI
CROSTA
R JUNI
OR
ZQL
56
1000
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
74AVCB164245ZRDR
BGA MI
CROSTA
R JUNI
OR
ZRD
54
1000
330.0
16.4
5.8
8.3
1.55
8.0
16.0
Q1
SN74AVCB164245GR
TSSOP
DGG
48
2000
330.0
24.4
8.6
13.0
1.8
12.0
24.0
Q1
SN74AVCB164245VR
TVSOP
DGV
48
2000
330.0
16.4
7.1
10.2
1.6
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74AVCB164245ZQLR
BGA MICROSTAR
JUNIOR
ZQL
56
1000
336.6
336.6
28.6
74AVCB164245ZRDR
BGA MICROSTAR
JUNIOR
ZRD
54
1000
336.6
336.6
28.6
SN74AVCB164245GR
TSSOP
DGG
48
2000
367.0
367.0
45.0
SN74AVCB164245VR
TVSOP
DGV
48
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OUTLINE
ZQL0056A
JRBGA - 1 mm max height
SCALE 2.100
PLASTIC BALL GRID ARRAY
4.6
4.4
B
A
BALL A1 CORNER
7.1
6.9
1 MAX
C
SEATING PLANE
0.35
TYP
0.15
BALL TYP
0.1 C
3.25 TYP
(0.625) TYP
SYMM
K
(0.575) TYP
J
H
G
5.85
TYP
SYMM
F
E
D
C
56X
NOTE 3
B
A
0.65 TYP
BALL A1 CORNER
1
2
3
4
5
0.45
0.35
0.15
0.08
C B A
C
6
0.65 TYP
4219711/B 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. No metal in this area, indicates orientation.
www.ti.com
EXAMPLE BOARD LAYOUT
ZQL0056A
JRBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
(0.65) TYP
56X ( 0.33)
2
1
3
4
5
6
A
(0.65) TYP
B
C
D
E
SYMM
F
G
H
J
K
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
0.05 MAX
METAL UNDER
SOLDER MASK
0.05 MIN
EXPOSED METAL
( 0.33)
METAL
( 0.33)
SOLDER MASK
OPENING
EXPOSED METAL
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4219711/B 01/2017
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99).
www.ti.com
EXAMPLE STENCIL DESIGN
ZQL0056A
JRBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
56X ( 0.33)
(0.65) TYP
1
2
3
4
5
6
A
(0.65) TYP
B
C
D
E
SYMM
F
G
H
J
K
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4219711/B 01/2017
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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