ADC082S021
www.ti.com
SNAS282D – APRIL 2005 – REVISED MARCH 2013
ADC082S021 2 Channel, 50 ksps to 200 ksps, 8-Bit A/D Converter
Check for Samples: ADC082S021
FEATURES
DESCRIPTION
•
•
•
•
The ADC082S021 is a low-power, two-channel
CMOS 8-bit analog-to-digital converter with a highspeed serial interface. Unlike the conventional
practice of specifying performance at a single sample
rate only, the ADC082S021 is fully specified over a
sample rate range of 50 ksps to 200 ksps. The
converter is based upon a successive-approximation
register architecture with an internal track-and-hold
circuit. It can be configured to accept one or two input
signals at inputs IN1 and IN2.
1
2
Specified Over a Range of Sample Rates.
Two Input Channels
Variable Power Management
Single Power Supply with 2.7V - 5.25V Range
KEY SPECIFICATIONS
•
•
•
•
DNL: ±0.04 LSB (typ)
INL: ±0.04 LSB (typ)
SNR: 49.6 dB (typ)
Power Consumption:
– 3V Supply 1.6 mW (typ)
– 5V Supply 5.8 mW (typ)
The output serial data is straight binary, and is
compatible with several standards, such as SPI™,
QSPI™, MICROWIRE, and many common DSP
serial interfaces.
The ADC082S021 operates with a single supply that
can range from +2.7V to +5.25V. Normal power
consumption using a +3V or +5V supply is 1.6 mW
and 5.8 mW, respectively. The power-down feature
reduces the power consumption to just 0.12 µW using
a +3V supply, or 0.35 µW using a +5V supply.
APPLICATIONS
•
•
•
Portable Systems
Remote Data Acquisition
Instrumentation and Control Systems
The ADC082S021 is packaged in an 8-lead VSSOP
package. Operation over the industrial temperature
range of −40°C to +85°C.
Table 1. Pin-Compatible Alternatives by Resolution and Speed (1)
Resolution
(1)
Specified for Sample Rate Range of:
50 to 200 ksps
200 to 500 ksps
500 ksps to 1 Msps
12-bit
ADC122S021
ADC122S051
ADC122S101
10-bit
ADC102S021
ADC102S051
ADC102S101
8-bit
ADC082S021
ADC082S051
ADC082S101
All devices are fully pin and function compatible.
Connection Diagram
CS
1
8
SCLK
VA
2
7
DOUT
GND
3
6
DIN
IN2
4
5
IN1
ADC082S021
Figure 1. VSSOP Package
See Package Number DGK0008A
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated
ADC082S021
SNAS282D – APRIL 2005 – REVISED MARCH 2013
www.ti.com
Block Diagram
IN1
MUX
T/H
IN2
8-BIT
SUCCESSIVE
APPROXIMATION
ADC
VA
CONTROL
LOGIC
CS
GND
GND
SCLK
DIN
DOUT
Pin Descriptions and Equivalent Circuits
Pin No.
Pin Name
Description
ANALOG I/O
5,4
IN1 and IN2
Analog inputs. These signals can range from 0V to VA.
DIGITAL I/O
8
SCLK
Digital clock input. This clock directly controls the conversion and readout processes.
7
DOUT
Digital data output. The output samples are clocked out at this pin on falling edges of the
SCLK pin.
6
DIN
Digital data input. The ADC082S021's Control Register is loaded through this pin on rising
edges of the SCLK.
1
CS
Chip select. On the falling edge of CS, a conversion process begins. Conversions continue
as long as CS is held low.
2
VA
Positive supply pin. This pin should be connected to a quiet +2.7V to +5.25V source and
bypassed to GND with a 1 µF capacitor and a 0.1 µF monolithic capacitor located within 1
cm of the power pin.
3
GND
POWER SUPPLY
2
The ground return for the die.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
ADC082S021
www.ti.com
SNAS282D – APRIL 2005 – REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2) (3)
−0.3V to 6.5V
Analog Supply Voltage VA
−0.3V to VA +0.3V
Voltage on Any Pin to GND
Input Current at Any Pin (4)
Package Input Current
±10 mA
(4)
±20 mA
See (5)
Power Consumption at TA = 25°C
Human Body Model
ESD Susceptibility (6)
2500V
Machine Model
250V
Junction Temperature
+150°C
Storage Temperature
−65°C to +150°C
(1)
(2)
(3)
(4)
(5)
(6)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
All voltages are measured with respect to GND = 0V, unless otherwise specified.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin should be limited to
10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 10 mA to two. The Absolute Maximum Rating specification does not apply to the VA pin. The current into the VA pin is
limited by the Analog Supply Voltage specification.
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula
PDMAX = (TJmax − TA)/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in
a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is
reversed). Obviously, such conditions should always be avoided.
Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through zero ohms
Operating Ratings (1) (2)
−40°C ≤ TA ≤ +85°C
Operating Temperature Range
VA Supply Voltage
+2.7V to +5.25V
−0.3V to VA
Digital Input Pins Voltage Range
Clock Frequency
50 kHz to 16 MHz
Analog Input Voltage
(1)
(2)
0V to VA
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
All voltages are measured with respect to GND = 0V, unless otherwise specified.
Package Thermal Resistance (1)
(1)
Package
θJA
8-lead VSSOP
250°C / W
Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. Reflow temperature
profiles are different for lead-free and non-lead-free packages.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
3
ADC082S021
SNAS282D – APRIL 2005 – REVISED MARCH 2013
www.ti.com
ADC082S021 Converter Electrical Characteristics (1)
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 ksps to 200
ksps, CL = 50 pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C.
Parameter
Test Conditions
Typical
Limits (2)
8
Bits
±0.04
±0.2
LSB (max)
Units
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes
INL
Integral Non-Linearity
DNL
Differential Non-Linearity
±0.04
±0.2
LSB (max)
VOFF
Offset Error
+0.52
±0.7
LSB (max)
OEM
Channel to Channel Offset Error Match
±0.01
±0.3
LSB (max)
FSE
Full-Scale Error
+0.51
±0.7
LSB (max)
FSEM
Channel to Channel Full-Scale Error
Match
+0.01
±0.3
LSB (max)
DYNAMIC CONVERTER CHARACTERISTICS
SINAD
Signal-to-Noise Plus Distortion Ratio
VA = +2.7 to 5.25V
fIN = 39.9 kHz, −0.02 dBFS
49.6
49.1
dB (min)
SNR
Signal-to-Noise Ratio
VA = +2.7 to 5.25V
fIN = 39.9 kHz, −0.02 dBFS
49.6
49.2
dB (min)
THD
Total Harmonic Distortion
VA = +2.7 to 5.25V
fIN = 39.9 kHz, −0.02 dBFS
−76
−62
dB (max)
SFDR
Spurious-Free Dynamic Range
VA = +2.7 to 5.25V
fIN = 39.9 kHz, −0.02 dBFS
68
63
dB (min)
ENOB
Effective Number of Bits
VA = +2.7 to 5.25V
fIN = 39.9 kHz, −0.02 dBFS
7.9
7.9
Bits (min)
Channel-to-Channel Crosstalk
VA = +5.25V
fIN = 40.2 kHz
−73
dB
Intermodulation Distortion, Second
Order Terms
VA = +5.25V
fa = 40.161 kHz, fb = 41.015 kHz
−78
dB
Intermodulation Distortion, Third Order
Terms
VA = +5.25V
fa = 40.161 kHz, fb = 41.015 kHz
−73
dB
VA = +5V
11
MHz
VA = +3V
8
MHz
IMD
FPBW
-3 dB Full Power Bandwidth
ANALOG INPUT CHARACTERISTICS
VIN
Input Range
IDCL
DC Leakage Current
CINA
Input Capacitance
0 to VA
V
±1
µA (max)
Track Mode
33
pF
Hold Mode
3
pF
DIGITAL INPUT CHARACTERISTICS
VIH
Input High Voltage
VIL
Input Low Voltage
IIN
Input Current
CIND
Digital Input Capacitance
(1)
(2)
4
VA = +5.25V
2.4
V (min)
VA = +3.6V
2.1
V (min)
0.8
V (max)
VIN = 0V or VIN = VA
±10
µA (max)
4
pF (max)
2
Min/max specification limits are ensured by design, test, or statistical analysis.
Tested limits are ensured to TI's AOQL (Average Outgoing Quality Level).
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
ADC082S021
www.ti.com
SNAS282D – APRIL 2005 – REVISED MARCH 2013
ADC082S021 Converter Electrical Characteristics(1) (continued)
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 ksps to 200
ksps, CL = 50 pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C.
Typical
Limits (2)
Units
ISOURCE = 200 µA
VA − 0.03
VA − 0.5
V (min)
ISOURCE = 1 mA
VA − 0.1
ISINK = 200 µA
0.03
0.4
V (max)
ISINK = 1 mA
0.1
±0.01
±1
µA (max)
2
4
pF (max)
Parameter
Test Conditions
DIGITAL OUTPUT CHARACTERISTICS
VOH
Output High Voltage
VOL
Output Low Voltage
IOZH, IOZL TRI-STATE Leakage Current
COUT
TRI-STATE Output Capacitance
Output Coding
Straight (Natural) Binary
POWER SUPPLY CHARACTERISTICS (CL = 10 pF)
VA
Analog Supply Voltage
2.7
V (min)
5.25
V (max)
VA = +5.25V,
fSAMPLE = 200 ksps, fIN = 40 kHz
1.1
1.7
mA (max)
VA = +3.6V,
fSAMPLE = 200 ksps, fIN = 40 kHz
0.45
0.8
mA (max)
VA = +5.25V,
fSAMPLE = 0 ksps
200
nA
VA = +3.6V,
fSAMPLE = 0 ksps
200
nA
Power Consumption, Normal Mode
(Operational, CS low)
VA = +5.25V
5.8
8.9
mW (max)
VA = +3.6V
1.6
2.9
mW (max)
Power Consumption, Shutdown (CS
high)
VA = +5.25V
1.05
µW
VA = +3.6V
0.72
µW
Supply Current, Normal Mode
(Operational, CS low)
IA
Supply Current, Shutdown (CS high)
PD
AC ELECTRICAL CHARACTERISTICS
fSCLK
Maximum Clock Frequency
See (3)
See (3)
fS
Sample Rate
tCONV
Conversion Time
DC
SCLK Duty Cycle
fSCLK = 3.2 MHz
tACQ
Track/Hold Acquisition Time
Throughput Time
(3)
0.8
MHz (min)
3.2
MHz (max)
50
ksps (min)
200
ksps (max)
13
SCLK cycles
30
% (min)
70
% (max)
Full-Scale Step Input
3
SCLK cycles
Acquisition Time + Conversion Time
16
SCLK cycles
50
This is the frequency range over which the electrical performance is specified. The device is functional over a wider range which is
specified under Operating Ratings.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
5
ADC082S021
SNAS282D – APRIL 2005 – REVISED MARCH 2013
www.ti.com
ADC082S021 Timing Specifications
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 0.8 MHz to 3.2 MHz, fSAMPLE = 50 ksps to 200
ksps, CL = 50 pF, Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C.
Parameter
Test Conditions
−3.5
VA = +5.0V
−0.5
VA = +3.0V
+4.5
VA = +5.0V
+1.5
VA = +3.0V
+4
VA = +5.0V
+2
VA = +3.0V
+16.5
VA = +5.0V
+15
Units
10
ns (min)
10
ns (min)
30
ns (max)
30
ns (max)
Setup Time SCLK High to CS Falling Edge
See (2)
tCLH
Hold time SCLK Low to CS Falling Edge
See (2)
tEN
Delay from CS Until DOUT active
tACC
Data Access Time after SCLK Falling Edge
tSU
Data Setup Time Prior to SCLK Rising Edge
+3
10
ns (min)
tH
Data Valid SCLK Hold Time
+3
10
ns (min)
tCH
SCLK High Pulse Width
tCL
SCLK Low Pulse Width
Output Falling
CS Rising Edge to DOUT High-Impedance
Output Rising
6
VA = +3.0V
Limits (1)
tCSU
tDIS
(1)
(2)
Typical
0.5 x tSCLK 0.3 x tSCLK
ns (min)
0.5 x tSCLK 0.3 x tSCLK
ns (min)
VA = +3.0V
1.7
VA = +5.0V
1.2
VA = +3.0V
1.0
VA = +5.0V
1.0
20
ns (max)
Tested limits are ensured to TI's AOQL (Average Outgoing Quality Level).
Clock may be either high or low when CS is asserted as long as setup and hold times tCSU and tCLH are strictly observed.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
ADC082S021
www.ti.com
SNAS282D – APRIL 2005 – REVISED MARCH 2013
Timing Diagrams
Power Down
Power Up
Track
Power Up
Hold
Track
Hold
CS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
9
8
10
SCLK
Control register
Control register
DIN
b7
b6
b5
b4
DOUT
b3
b2
b1
DB7
DB6 DB5
b0
b7
DB4
DB3
DB2
DB1
b6
b5
b4
DB0
b3
b2
b1
b0
DB7
DB6
DB5
DB4
DB3
Figure 2. ADC082S021 Operational Timing Diagram
Figure 3. Timing Test Circuit
CS
tCONVERT
tACQ
tCH
SCLK
1
2
3
4
tEN
6
7
Z3
tSU
Z2
Z1
11
8
12
13
14
15
tACC
tCL
DOUT
DIN
5
DB7
Z0
DB6
16
tDIS
DB5
DB1
DB4
DB0
Tri-State
Zero
Zero
Zero
Zero
tH
DONT DONTC ADD2
ADD1
ADD0
DONTC DONTC DONTC
Figure 4. ADC082S021 Serial Timing Diagram
CS
tCSU
SCLK
tCLH
SCLK
Figure 5. SCLK and CS Timing Parameters
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
7
ADC082S021
SNAS282D – APRIL 2005 – REVISED MARCH 2013
www.ti.com
Specification Definitions
ACQUISITION TIME is the time required to acquire the input voltage. That is, it is time required for the hold
capacitor to charge up to the input voltage.
APERTURE DELAY is the time between the fourth falling SCLK edge of a conversion and the time when the
input signal is acquired or held for conversion.
CONVERSION TIME is the time required, after the input voltage is acquired, for the ADC to convert the input
voltage to a digital word.
CROSSTALK is the coupling of energy from one channel into the other channel, or the amount of signal energy
from one analog input that appears at the measured analog input.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB.
DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The
specification here refers to the SCLK.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise
and Distortion or SINAD. ENOB is defined as (SINAD − 1.76) / 6.02 and says that the converter is equivalent to
a perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental
drops 3 dB below its low frequency value for a full scale input.
FULL SCALE ERROR (FSE) is a measure of how far the last code transition is from the ideal 1½ LSB below
VREF+ and is defined as:
VFSE = Vmax + 1.5 LSB – VREF+
where
•
Vmax is the voltage at which the transition to the maximum code occurs. FSE can be expressed in Volts, LSB
or percent of full scale range.
(1)
GAIN ERROR is the deviation of the last code transition (111...110) to (111...111) from the ideal (VREF − 1.5
LSB), after adjusting for offset error.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from
negative full scale (½ LSB below the first code transition) through positive full scale (½ LSB above the last code
transition). The deviation of any given code from this straight line is measured from the center of that code value.
INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components that are present at
the output and are not present at the input and result from two sinusoidal frequencies being applied to the ADC
input at the same time. It is defined as the ratio of the power in the intermodulation products to the total power in
one of the original frequencies. IMD is usually expressed in dB.
MISSING CODES are those output codes that will never appear at the ADC outputs. These codes cannot be
reached with any input value. The ADC082S021 is specified not to have any missing codes.
OFFSET ERROR is the deviation of the first code transition (000...000) to (000...001) from the ideal (i.e. GND +
0.5 LSB).
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal at the
converter output to the rms value of the sum of all other spectral components below one-half the sampling
frequency, not including d.c. or harmonics included in the THD specification.
SIGNAL TO NOISE PLUS DISTORTION (S/(N+D) or SINAD or SNDR) is the ratio, expressed in dB, of the rms
value of the input signal at the output to the rms value of all of the other spectral components below half the
clock frequency, including all harmonics but excluding DC.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the
input signal at the output and the peak spurious signal, where a spurious signal is any signal present in the
output spectrum that is not present at the input, excluding d.c.
8
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
ADC082S021
www.ti.com
SNAS282D – APRIL 2005 – REVISED MARCH 2013
TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dBc, of the rms total of the first five harmonic
components at the output to the rms level of the input signal frequency as seen at the output. THD is calculated
as
THD = 20 ‡ log10
A f 22 +
+ A f 62
A f 12
where
•
Af1 is the RMS power of the input frequency at the output and Af2 through Af6 are the RMS power in the first 5
harmonic frequencies. Accurate THD measurement requires a spectrally pure sine wave (monotone) at the
ADC input.
(2)
THROUGHPUT TIME is the minimum time required between the start of two successive conversion. It is the
acquisition time plus the conversion and read out times. In the case of the ADC082S021, this is 16 SCLK
periods.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
9
ADC082S021
SNAS282D – APRIL 2005 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
10
DNL - VA = 3.0V
INL - VA = 3.0V
Figure 6.
Figure 7.
DNL - VA = 5.0V
INL - VA = 5.0V
Figure 8.
Figure 9.
DNL vs. Supply
INL vs. Supply
Figure 10.
Figure 11.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
ADC082S021
www.ti.com
SNAS282D – APRIL 2005 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
DNL vs. Clock Frequency
INL vs. Clock Frequency
Figure 12.
Figure 13.
DNL vs. Clock Duty Cycle
INL vs. Clock Duty Cycle
Figure 14.
Figure 15.
DNL vs. Temperature
INL vs. Temperature
Figure 16.
Figure 17.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
11
ADC082S021
SNAS282D – APRIL 2005 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
12
SNR vs. Supply
THD vs. Supply
Figure 18.
Figure 19.
SNR vs. Clock Frequency
THD vs. Clock Frequency
Figure 20.
Figure 21.
SNR vs. Clock Duty Cycle
THD vs. Clock Duty Cycle
Figure 22.
Figure 23.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
ADC082S021
www.ti.com
SNAS282D – APRIL 2005 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
SNR vs. Input Frequency
THD vs. Input Frequency
Figure 24.
Figure 25.
SNR vs. Temperature
THD vs. Temperature
Figure 26.
Figure 27.
SFDR vs. Supply
SINAD vs. Supply
Figure 28.
Figure 29.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
13
ADC082S021
SNAS282D – APRIL 2005 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
14
SFDR vs. Clock Frequency
SINAD vs. Clock Frequency
Figure 30.
Figure 31.
SFDR vs. Clock Duty Cycle
SINAD vs. Clock Duty Cycle
Figure 32.
Figure 33.
SFDR vs. Input Frequency
SINAD vs. Input Frequency
Figure 34.
Figure 35.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
ADC082S021
www.ti.com
SNAS282D – APRIL 2005 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
SFDR vs. Temperature
SINAD vs. Temperature
Figure 36.
Figure 37.
ENOB vs. Supply
ENOB vs. Clock Frequency
Figure 38.
Figure 39.
ENOB vs. Clock Duty Cycle
ENOB vs. Input Frequency
Figure 40.
Figure 41.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
15
ADC082S021
SNAS282D – APRIL 2005 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
TA = +25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 0.8 MHz to 3.2 MHz, fIN = 39.9 kHz unless otherwise stated.
16
ENOB vs. Temperature
Spectral Response - 3V, 200 ksps
Figure 42.
Figure 43.
Spectral Response - 5V, 200 ksps
Power Consumption vs. Throughput
Figure 44.
Figure 45.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
ADC082S021
www.ti.com
SNAS282D – APRIL 2005 – REVISED MARCH 2013
APPLICATIONS INFORMATION
ADC082S021 OPERATION
The ADC082S021 is a successive-approximation analog-to-digital converter designed around a chargeredistribution digital-to-analog converter. Simplified schematics of the ADC082S021 in both track and hold modes
are shown in Figure 46 and Figure 47, respectively. In Figure 46, the ADC082S021 is in track mode: switch SW1
connects the sampling capacitor to one of two analog input channels through the multiplexer, and SW2 balances
the comparator inputs. The ADC082S021 is in this state for the first three SCLK cycles after CS is brought low.
Figure 47 shows the ADC082S021 in hold mode: switch SW1 connects the sampling capacitor to ground,
maintaining the sampled voltage, and switch SW2 unbalances the comparator. The control logic then instructs
the charge-redistribution DAC to add fixed amounts of charge to the sampling capacitor until the comparator is
balanced. When the comparator is balanced, the digital word supplied to the DAC is the digital representation of
the analog input voltage. The ADC082S021 is in this state for the fourth through sixteenth SCLK cycles after CS
is brought low.
The time when CS is low is considered a serial frame. Each of these frames should contain an integer multiple of
16 SCLK cycles, during which time a conversion is performed and the result is clocked out at the DOUT pin while
the multiplexer address for the next conversion is clocked in at the DIN pin.
CHARGE
REDISTRIBUTION
DAC
IN1
MUX
SAMPLING
CAPACITOR
IN2
SW1
+
SW2
GND
-
CONTROL
LOGIC
VA
2
Figure 46. ADC082S021 in Track Mode
CHARGE
REDISTRIBUTION
DAC
IN1
MUX
SAMPLING
CAPACITOR
IN2
SW1
+
SW2
GND
-
CONTROL
LOGIC
VA
2
Figure 47. ADC082S021 in Hold Mode
USING THE ADC082S021
An ADC082S021 timing diagram and a serial interface timing diagram for the ADC082S021 are shown in the
Timing Diagrams section. CS is chip select, which initiates conversions and frames the serial data transfers.
SCLK (serial clock) controls both the conversion process and the timing of serial data. DOUT is the serial data
output pin, where the conversion result is sent out as a serial data stream, MSB first. Data to be written to the
ADC082S021's Control Register is placed at DIN, the serial data input pin. New data is written in at DIN with
each conversion.
A serial frame is initiated on the falling edge of CS and ends on the rising edge of CS. Each frame must contain
an integer multiple of 16 rising SCLK edges. The ADC output data (DOUT) is in a high impedance state when
CS is high and is active when CS is low. Thus, CS acts as an output enable. Additionally, the device goes into a
power down state when CS is high and also between continuous conversion cycles.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
17
ADC082S021
SNAS282D – APRIL 2005 – REVISED MARCH 2013
www.ti.com
During the first 3 cycles of SCLK, the ADC is in the track mode acquiring the input voltage. For the next 13 SCLK
cycles, the conversion is accomplished and the data is clocked out, MSB first, starting with the 5th clock. If there
is more than one conversion in a frame, the ADC will re-enter the track mode on the falling edge of SCLK after
the N*16th rising edge of SCLK, and re-enter the hold/convert mode on the N*16+4th falling edge of SCLK,
where "N" is an integer.
When CS is brought high, SCLK is internally gated off. If SCLK is stopped in the low state while CS is high, the
subsequent fall of CS will generate a falling edge of the internal version of SCLK, putting the ADC into the track
mode. This is seen by the ADC as the first falling edge of SCLK. If SCLK is stopped with SCLK high, the ADC
enters the track mode on the first falling edge of SCLK after the falling edge of CS.
During each conversion, data is clocked into the ADC at DIN on the first 8 rising edges of SCLK after the fall of
CS. For each conversion, it is necessary to clock in the data indicating the input that is selected for the
conversion after the current one. See Table 2, Table 3, and Table 4.
If CS and SCLK go low within the times defined by tCSU and tCLH, the rising edge of SCLK that begins clocking
data in at DIN may or may not be one clock cycle later than expected. It is, therefore, best to strictly observe the
minimum tCSU and tCLH times given in the Timing Specifications.
There are no power-up delays or dummy conversions required with the ADC082S021. The ADC is able to
sample and convert an input to full conversion immediately following power up. The first conversion result after
power-up will be that of IN1.
Table 2. Control Register Bits
Bit 7 (MSB)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
DONTC
DONTC
ADD2
ADD1
ADD0
DONTC
DONTC
DONTC
Table 3. Control Register Bit Descriptions
Bit #:
Symbol:
7 - 6, 2 - 0
DONTC
3
ADD0
4
ADD1
5
ADD2
Description
Don't care. The value of these bits do not affect the device.
These bits determine which input channel will be sampled and converted in the next track/hold
cycle. The mapping between codes and channels is shown in Table 4.
Table 4. Input Channel Selection
18
ADD2
ADD1
ADD0
Input Channel
x
0
0
IN1 (Default)
x
0
1
IN2
x
1
x
Not allowed. The output signal at the DOUT pin is indeterminate if ADD1 is high.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
ADC082S021
www.ti.com
SNAS282D – APRIL 2005 – REVISED MARCH 2013
ADC082S021 TRANSFER FUNCTION
The output format of the ADC082S021 is straight binary. Code transitions occur midway between successive
integer LSB values. The LSB width for the ADC082S021 is VA/256. The ideal transfer characteristic is shown in
Figure 48. The transition from an output code of 0000 0000 to a code of 0000 0001 is at 1/2 LSB, or a voltage of
VA/512. Other code transitions occur at steps of one LSB.
111...111
111...000
|
|
ADC CODE
111...110
1LSB = VA/256
011...111
000...010
|
000...001
000...000
0V
1 LSB
+VA - 1 LSB
ANALOG INPUT
Figure 48. Ideal Transfer Characteristic
TYPICAL APPLICATION CIRCUIT
A typical application of the ADC082S021 is shown in Figure 49. Power is provided, in this example, by the Texas
Instruments LP2950 low-dropout voltage regulator, available in a variety of fixed and adjustable output voltages.
The power supply pin is bypassed with a capacitor network located close to the ADC082S021. Because the
reference for the ADC082S021 is the supply voltage, any noise on the supply will degrade device noise
performance. To keep noise off the supply, use a dedicated linear regulator for this device, or provide sufficient
decoupling from other circuitry to prevent noise from reaching the ADC082S021 supply pin. Because of the
ADC082S021's low power requirements, it is also possible to use a precision reference as a power supply to
maximize performance. The four-wire interface is shown connected to a microprocessor or DSP.
LP2950
1 PF
VA
0.1 PF
5V
1 PF
0.1 PF
SCLK
IN1
CS
ADC082S021
DIN
IN2
MICROPROCESSOR
DSP
DOUT
GND
Figure 49. Typical Application Circuit
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
19
ADC082S021
SNAS282D – APRIL 2005 – REVISED MARCH 2013
www.ti.com
ANALOG INPUTS
An equivalent circuit for one of the ADC082S021's input channels is shown in Figure 50. Diodes D1 and D2
provide ESD protection for the analog inputs. At no time should any input go beyond (VA + 300 mV) or (GND −
300 mV), as these ESD diodes will begin conducting, which could result in erratic operation. For this reason,
these ESD diodes should NOT be used to clamp the input signal.
The capacitor C1 in Figure 50 has a typical value of 3 pF, and is mainly the package pin capacitance. Resistor
R1 is the on resistance of the multiplexer and track / hold switch, and is typically 500 ohms. Capacitor C2 is the
ADC082S021 sampling capacitor and is typically 30 pF. The ADC082S021 will deliver best performance when
driven by a low-impedance source to eliminate distortion caused by the charging of the sampling capacitance.
This is especially important when using the ADC082S021 to sample AC signals. Also important when sampling
dynamic signals is a band-pass or low-pass filter to reduce harmonics and noise, improving dynamic
performance.
VA
D1
R1
500
C2
30 pF
VIN
C1
3 pF
D2
Conversion Phase - Switch Open
Track Phase - Switch Closed
Figure 50. Equivalent Input Circuit
DIGITAL INPUTS AND OUTPUTS
The ADC082S021's digital output DOUT is limited by, and cannot exceed, the supply voltage, VA. The digital
input pins are not prone to latch-up and, and although not recommended, SCLK, CS and DIN may be asserted
before VA without latchup risk.
POWER SUPPLY CONSIDERATIONS
The ADC082S021 is fully powered-up whenever CS is low, and fully powered-down whenever CS is high, with
one exception: the ADC082S021 automatically enters power-down mode between the 16th falling edge of a
conversion and the 1st falling edge of the subsequent conversion (see Timing Diagrams).
The ADC082S021 can perform multiple conversions back to back; each conversion requires 16 SCLK cycles.
The ADC082S021 will perform conversions continuously as long as CS is held low.
20
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
ADC082S021
www.ti.com
SNAS282D – APRIL 2005 – REVISED MARCH 2013
Power Management
When the ADC082S021 is operated continuously in normal mode, the maximum throughput is fSCLK/16.
Throughput may be traded for power consumption by running fSCLK at its maximum 3.2 MHz and performing
fewer conversions per unit time, putting the ADC082S021 into shutdown mode between conversions. A plot of
typical power consumption versus throughput is shown in the Typical Performance Characteristics section. To
calculate the power consumption for a given throughput, multiply the fraction of time spent in the normal mode by
the normal mode power consumption and add the fraction of time spent in shutdown mode multiplied by the
shutdown mode power consumption. Generally, the user will put the part into normal mode and then put the part
back into shutdown mode. Note that the curve of power consumption vs. throughput is nearly linear. This is
because the power consumption in the shutdown mode is so small that it can be ignored for all practical
purposes.
Power Supply Noise Considerations
The charging of any output load capacitance requires current from the power supply, VA. The current pulses
required from the supply to charge the output capacitance will cause voltage variations on the supply. If these
variations are large enough, they could degrade SNR and SINAD performance of the ADC. Furthermore,
discharging the output capacitance when the digital output goes from a logic high to a logic low will dump current
into the die substrate, which is resistive. Load discharge currents will cause "ground bounce" noise in the
substrate that will degrade noise performance if that current is large enough. The larger is the output
capacitance, the more current flows through the die substrate and the greater is the noise coupled into the
analog channel, degrading noise performance.
To keep noise out of the power supply, keep the output load capacitance as small as practical. If the load
capacitance is greater than 50 pF, use a 100 Ω series resistor at the ADC output, located as close to the ADC
output pin as practical. This will limit the charge and discharge current of the output capacitance and improve
noise performance.
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
21
ADC082S021
SNAS282D – APRIL 2005 – REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision C (March 2013) to Revision D
•
22
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 21
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: ADC082S021
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
ADC082S021CIMM/NOPB
ACTIVE
VSSOP
DGK
8
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
X16C
ADC082S021CIMMX/NOPB
ACTIVE
VSSOP
DGK
8
3500
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
X16C
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
工商网监
湘ICP备2023018690号
