ADC08351CILQX/NOPB

ADC08351 www.ti.com SNAS026E – JUNE 2000 – REVISED MARCH 2013 ADC08351 8-Bit, 42 MSPS, 40 mW A/D Converter Check for Samples: ADC08351 FEATURES DESCRIPTION • • • • • The ADC08351 is an easy to use low power, low cost, small size, 42 MSPS analog-to-digital converter that digitizes signals to 8 bits. The ADC08351 uses an unique architecture that achieves 7.2 Effective Bits with a 4.4 MHz input and 42 MHz clock frequency and 6.8 Effective Bits with a 21 MHz input and 42 MHz clock frequency. Output formatting is straight binary coding. 1 2 Low Input Capacitance Internal Sample-and-Hold Function Single +3V Operation Power Down Feature TRI-STATE Outputs KEY SPECIFICATIONS • • • • • Resolution: 8 Bits Maximum Sampling Frequency: 42MSPS (min) ENOB @ fCLK = 42 MHz, fIN = 4.4 MHz: 7.2 Bits (typ) Ensured No Missing Codes Power Consumption: 40 mW (typ); 48 mW (max) (Excluding Reference Current) APPLICATIONS • • • • • • • • • Video Digitization Digital Still Cameras Set Top Boxes Digital Camcorders Communications Medical Imaging Personal Computer Video CCD Imaging Electro-Optics To minimize system cost and power consumption, the ADC08351 requires minimal external components and includes input biasing to allow optional a.c. input signal coupling. The user need only provide a +3V supply and a clock. Many applications require no separate reference or driver components. The excellent dc and ac characteristics of this device, together with its low power consumption and +3V single supply operation, make it ideally suited for many video and imaging applications, including use in portable equipment. Total power consumption is reduced to less than 7 mW in the power-down mode. Furthermore, the ADC08351 is resistant to latch-up and the outputs are short-circuit proof. Fabricated on a 0.35 micron CMOS process, the ADC08351 is offered in TSSOP and WQFN (a molded lead frame-based chip-scale package), and is designed to operate over the industrial temperature range of −40°C to +85°C. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated ADC08351 SNAS026E – JUNE 2000 – REVISED MARCH 2013 www.ti.com ADC08351 Block Diagram Pin Configuration Figure 1. 20-Pin TSSOP - Top View 2 Figure 2. 24-Pin WQFN (CSP) - Bottom View Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: ADC08351 ADC08351 www.ti.com SNAS026E – JUNE 2000 – REVISED MARCH 2013 PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS (1) Pin No. Symbol 17 (17) VIN Analog signal input. Conversion range is 0.5 VP-P to 0.68 VA. 14 (14) VREF Positive reference voltage input. Operating range of this voltage is 0.75V to VA. This pin should be bypassed with a 10 µF tantalum or aluminum electrolytic capacitor and a 0.1 µF ceramic chip capacitor. 1 (22) OE CMOS/TTL compatible digital input that, when low, enables the digital outputs of the ADC08351. When high, the outputs are in a high impedance state. 12 (11) CLK CMOS/TTL compatible digital clock input. VIN is sampled on the falling edge of CLK input. Equivalent Circuit Description CMOS/TTL compatible digital input that, when high, puts the ADC08351 into the power down mode, where it consumes minimal power. When this pin is low, the ADC08351 is in the normal operating mode. 15 (15) PD 3 thru 10 (1 thru 8) D0–D7 Conversion data digital output pins. D0 is the LSB, D7 is the MSB. Valid data is output just after the rising edge of the CLK input. These pins are enabled by bringing the OE pin low. 11, 13 (10, 12) VD Positive digital supply pin. Connect to a clean, quiet voltage source of +3V. VA and VD should have a common supply and be separately bypassed with a 10 µF tantalum or aluminum electrolytic capacitor and a 0.1 µF ceramic chip capacitor. See Layout and Grounding for more information. 2, 20 (21, 23) DGND The ground return for the digital supply. AGND and DGND should be connected together close to the ADC08351. 16 (16) VA Positive analog supply pin. Connected to a clean, quiet voltage source of +3V. VA and VD should have a common supply and be separately bypassed with a 10 µF tantalum or aluminum electrolytic capacitor and a 0.1 µF ceramic chip capacitor. See Layout and Grounding for more information. 18, 19 (18, 19) AGND The ground return for the analog supply. AGND and DGND should be connected together close to the ADC08351 package. (1) WQFN pins in parentheses These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: ADC08351 3 ADC08351 SNAS026E – JUNE 2000 – REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) (2) (3) Supply Voltage (VA, VD) 4.2V −0.3V to 4.2V Voltage on Any Input or Output Pin Ground Difference (AGND–DGND) ±100 mV −0.5 to (VA + 0.5V) CLK, OE Voltage Range Digital Output Voltage (VOH, VOL) VD to DGND Input Current at Any Pin (4) ±25 mA Package Input Current (4) ±50 mA See (5) Package Dissipation at TA = 25°C ESD Susceptibility (6) Human Body Model Machine Model Soldering Temp., Infrared, 10 sec. (7) (3) (4) (5) (6) (7) 200V 235°C −65°C to +150°C Storage Temperature (1) (2) 4000V All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. When the input voltage at any pin exceeds the power supplies (that is, less than AGND or DGND, or greater than VA or VD), the current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two. The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax - TA)/θJA. For the 20-pin TSSOP, θJA is 135°C/W, so PDMAX = 926 mW at 25°C and 481 mW at the maximum operating ambient temperature of 85°C. Note that the power dissipation of this device under normal operation will typically be about 68 mW (40 mW quiescent power + 23 mW reference ladder power + 5 mW due to 1 TTL loan on each digital output). The values for maximum power dissipation listed above will be reached only when the ADC08351 is operated in a severe fault condition (e.g., when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided. Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through ZERO Ohms. See AN-450, “Surface Mounting Methods and Their Effect on Product Reliability”, or the section entitled “Surface Mount” found in any post 1986 Texas Instruments Linear Data Book, for other methods of soldering surface mount devices. Operating Ratings (1) (2) −40°C TA ≤ +85°C Operating Temperature Range Supply Voltage (VA, VD) +2.7V to +3.6V Ground Difference |DGND–AGND| 0V to 100 mV VIN Voltage Range (VP-P) (1) (2) 4 0.5V to 0.68 VA Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: ADC08351 ADC08351 www.ti.com SNAS026E – JUNE 2000 – REVISED MARCH 2013 Converter Electrical Characteristics The following specifications apply for VA = VD = +3.0 VDC, VREF = 2.4V, VIN = 1.63 VP-P, OE = 0V, CL = 20 pF, fCLK = 42 MHz, 50% duty cycle, unless otherwise specified. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C (1) (2) Symbol Parameter Typical (3) Conditions Limits (3) Units (Limits) DC Accuracy INL Integral Non Linearity Error DNL Differential Non Linearity ±0.7 ±0.6 Missing Codes ±1.4 LSB (max) +1.3 LSB (max) −1.0 LSB (min) 0 (max) EZ Zero Scale Offset Error −17 mV EFS Full Scale Offset Error −7 mV Video Accuracy DP Differential Phase Error fCLK = 20 MHz, Video Ramp Input 1.0 Degree DG Differential Gain Error fCLK = 20 MHz, Video Ramp Input 1.5 % (CLK LOW) 4 pF (CLK HIGH) 11 pF Analog Input and Reference Characteristics CIN VIN Input Capacitance VIN = 1.5V + 0.7 Vrms RIN RIN Input Resistance 7.2 kΩ FPBW Full-Power Bandwidth 120 MHz VREF Reference Input Voltage 0.735 V IREF Reference Input Current At pin 14 VA V 7.7 mA PD = Low 10.5 mA PD = High 1 mA PD = Low, No Digital Output Load 2.9 mA PD = High 0.5 Total Operating Current Excluding Reference Current, VIN = 0 VDC 13.4 16 mA (max) Power Consumption (active) PD = Low (excluding reference current) 40.2 48 mW (max) Power Consumption (power down) PD = High (excluding reference current)