ADC11C170
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SNAS412B – JULY 2007 – REVISED APRIL 2013
ADC11C170 11-Bit, 170 MSPS, 1.1 GHz Bandwidth A/D Converter with CMOS Outputs
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FEATURES
DESCRIPTION
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The ADC11C170 is a high-performance CMOS
analog-to-digital converter capable of converting
analog input signals into 11-Bit digital words at rates
up to 170 Mega Samples Per Second (MSPS). This
converter uses a differential, pipelined architecture
with digital error correction and an on-chip sampleand-hold circuit to minimize power consumption and
the external component count, while providing
excellent dynamic performance. A unique sampleand-hold stage yields a full-power bandwidth of 1.1
GHz. The ADC11C170 operates from dual +3.3V and
+1.8V power supplies and consumes 747 mW of
power at 170 MSPS.
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1.1 GHz Full Power Bandwidth
Internal Sample-and-Hold Circuit
Low Power Consumption
Internal Precision 1.0V Reference
Single-Ended or Differential Clock Modes
Clock Duty Cycle Stabilizer
Dual +3.3V and +1.8V Supply Operation (+/10%)
Power-Down and Sleep Modes
Offset Binary or 2's Complement Output Data
Format
Pin-Compatible: ADC14155, ADC12C170,
ADC11C125
48-pin WQFN Package, (7x7x0.8mm, 0.5mm
Pin-Pitch)
APPLICATIONS
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High IF Sampling Receivers
Wireless Base Station Receivers
Power Amplifier Linearization
Multi-carrier, Multi-mode Receivers
Test and Measurement Equipment
Communications Instrumentation
Radar Systems
KEY SPECIFICATIONS
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Resolution 11 Bits
Conversion Rate 170 MSPS
SNR (fIN = 70 MHz) 65.1 dBFS (typ)
SFDR (fIN = 70 MHz) 85.4 dBFS (typ)
ENOB (fIN = 70 MHz) 10.5 bits (typ)
Full Power Bandwidth 1.1 GHz (typ)
Power Consumption 715 mW (typ)
The separate +1.8V supply for the digital output
interface allows lower power operation with reduced
noise. A power-down feature reduces the power
consumption to 5 mW while still allowing fast wake-up
time to full operation. In addition there is a sleep
feature which consumes 50 mW of power and has a
faster wake-up time.
The differential inputs provide a full scale differential
input swing equal to 2 times the reference voltage. A
stable 1.0V internal voltage reference is provided, or
the ADC11C170 can be operated with an external
reference.
Clock mode (differential versus single-ended) and
output data format (offset binary versus 2's
complement) are pin-selectable. A duty cycle
stabilizer maintains performance over a wide range of
input clock duty cycles.
The ADC11C170 is pin compatible with
ADC11C125, ADC12C170, and ADC14155.
the
It is available in a 48-lead WQFN package and
operates over the industrial temperature range of
−40°C to +85°C.
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2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2013, Texas Instruments Incorporated
ADC11C170
SNAS412B – JULY 2007 – REVISED APRIL 2013
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Block Diagram
INTERNAL
REFERENCE
VREF
VRP
VRM
VRN
11
VIN+
VIN-
11BIT HIGH SPEED
PIPELINE ADC
SHA
D0 - D10
DIGITAL
CORRECTION
OVR
DRDY
CLK+
CLK-
CLOCK/DUTY CYCLE
STABILIZER
AGND
VA
37
VA
VA
AGND
VRP
VRN
AGND
38
39
40
41
42
43
44
VRM
VREF
45
6
31
ADC11C170
(Top View)
7
30
8
29
9
28
10
27
11
26
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DRGND
DRDY
OVR
D10 (MSB)
D9
D8
D7
D6
D5
DRGND
VDR
24
25
VDR
D4
D3
23
22
D2
21
D1
20
(LSB) D0
19
OGND
OGND
12
18
* Exposed pad must be soldered to ground
plane to ensure rated performance.
VD
2
AGND
32
13
CLK-
5
17
CLK+
33
OGND
AGND
4
16
VA
34
VDR
CLK_SEL/DF
3
DRGND
VA
PD/Sleep
35
15
VIN+
AGND
36
2
DGND
VIN-
46
48
AGND
1
14
VA
47
VA
Connection Diagram
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Pin Descriptions and Equivalent Circuits
Pin No.
Symbol
Equivalent Circuit
Description
ANALOG I/O
3
VIN−
4
VIN+
43
VRP
45
VRM
Differential analog input pins. The differential full-scale input
signal level is two times the reference voltage with each input
pin signal centered on a common mode voltage, VCM.
VA
AGND
VA
VRM
VA
44
VRN
VRN
VREF
VA
These pins should each be bypassed to AGND with a low ESL
(equivalent series inductance) 0.1 µF capacitor placed very
close to the pin to minimize stray inductance. A 0.1 µF
capacitor should be placed between VRP and VRN as close to
the pins as possible, and a 10 µF capacitor should be placed
in parallel.
VRP and VRN should not be loaded. VRM may be loaded to
1mA for use as a temperature stable 1.5V reference.
It is recommended to use VRM to provide the common mode
voltage, VCM, for the differential analog inputs, VIN+ and VIN−.
VRP
AGND
VA
IDC
46
VREF
AGND
This pin can be used as either the +1.0V internal reference
voltage output (internal reference operation) or as the external
reference voltage input (external reference operation).
To use the internal reference, VREF should be decoupled to
AGND with a 0.1 µF, low equivalent series inductance (ESL)
capacitor. In this mode, VREF defaults as the output for the
internal 1.0V reference.
To use an external reference, overdrive this pin with a low
noise external reference voltage. The input impedance looking
into this pin is 9kΩ. Therefore, to overdrive this pin, the output
impedance of the external reference source should be VA), the current at that pin should be
limited to ±5 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power
supplies with an input current of ±5 mA to 10.
The maximum allowable power dissipation is dictated by TJ,max, the junction-to-ambient thermal resistance, (θJA), and the ambient
temperature, (TA), and can be calculated using the formula PD,max = (TJ,max - TA )/θJA. The values for maximum power dissipation listed
above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the
power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided.
Human Body Model is 100 pF discharged through a 1.5 kΩ resistor. Machine Model is 220 pF discharged through 0 Ω
Reflow temperature profiles are different for lead-free and non-lead-free packages.
Operating Ratings (1) (2)
Operating Temperature
−40°C ≤ TA ≤ +85°C
Supply Voltage (VA, VD)
+3.0V to +3.6V
Output Driver Supply (VDR)
+1.6V to +2.0V
−0.05V to (VA + 0.05V)
CLK
Clock Duty Cycle
30/70 %
Analog Input Pins
0V to 2.6V
VCM
1.4V to 1.6V
≤100mV
|AGND-DGND|
(1)
(2)
6
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the
maximum Operating Ratings is not recommended.
All voltages are measured with respect to GND = AGND = DGND = DRGND = 0V, unless otherwise specified.
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Converter Electrical Characteristics
Unless otherwise specified, the following specifications apply: VIN = -1dBFS, AGND = DGND = DRGND = 0V, VA = VD =
+3.3V, VDR = +1.8V, Internal VREF = +1.0V, fCLK = 170 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock Mode, Offset
Binary Format. Typical values are for TA = 25°C. Boldface limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA =
25°C (1) (2) (3)
Symbol
Parameter
Conditions
Typical
(4)
Limits
Units
(Limits)
11
Bits (min)
2
LSB (max)
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes
INL
Integral Non Linearity
DNL
PGE
(5)
Full Scale Input
Differential Non Linearity
±0.62
Full Scale Input
±0.38
Positive Gain Error
NGE
Negative Gain Error
TC GE
Gain Error Tempco
VOFF
Offset Error (VIN+ = VIN−)
TC VOFF
Offset Error Tempco
+1.57
-1.23
−40°C ≤ TA ≤ +85°C
LSB (min)
0.96
LSB (max)
-0.94
LSB (min)
3.7
%FS (max)
-1.8
%FS (min)
1.8
%FS (max)
-3.7
%FS (min)
0.89
%FS (max)
-1.3
%FS (min)
+8.0
−0.12
−40°C ≤ TA ≤ +85°C
-2
ppm/°C
+0.5
ppm/°C
Under Range Output Code
0
0
Over Range Output Code
2047
2047
REFERENCE AND ANALOG INPUT CHARACTERISTICS
VCM
Common Mode Input Voltage
VRM
Reference Ladder Midpoint Output Voltage
Output load = 1 mA
CIN
VIN Input Capacitance (each pin to GND) (6)
VIN = 1.5 Vdc ±
0.5 V
VREF
Reference Voltage (7)
1.5
V
1.5
V
(CLK HIGH)
9
pF
(CLK LOW)
6
pF
1.00
V
9
kΩ
Reference Input Resistance
(1)
The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided
current is limited per Note 4 under Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above
2.6V or below GND as described in the Operating Ratings section.
VA
I/O
To Internal Circuitry
AGND
(2)
(3)
(4)
(5)
(6)
(7)
To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
With the test condition for VREF = +1.0V (2VP-P differential input), the 11-Bit LSB is 976.6 µV.
Typical figures are at TA = 25°C and represent most likely parametric norms at the time of product characterization. The typical
specifications are not ensured.
Integral Non Linearity is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through
positive and negative full-scale.
The input capacitance is the sum of the package/pin capacitance and the sample and hold circuit capacitance.
Optimum performance will be obtained by keeping the reference input in the 0.9V to 1.1V range. The LM4051CIM3-ADJ (SOT-23
package) is recommended for external reference applications.
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Dynamic Converter Electrical Characteristics
Unless otherwise specified, the following specifications apply: VIN = -1dBFS, AGND = DGND = DRGND = 0V, VA = VD =
+3.3V, VDR = +1.8V, Internal VREF = +1.0V, fCLK = 170 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock Mode, Offset
Binary Format. Typical values are for TA = 25°C. Boldface limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA =
25°C (1) (2) (3)
Symbol
Parameter
Conditions
Typical
(4)
Limits
Units
(Limits)
DYNAMIC CONVERTER CHARACTERISTICS, AIN= -1dBFS
FPBW
SNR
SFDR
ENOB
THD
H2
Signal-to-Noise Ratio
Spurious Free Dynamic Range
Effective Number of Bits
Total Harmonic Disortion
Second Harmonic Distortion
H3
(1)
Full Power Bandwidth
Third Harmonic Distortion
-1 dBFS Input, −3 dB Corner
1.1
fIN = 10 MHz
65.2
fIN = 70 MHz
65.1
fIN = 150 MHz
64.9
dBFS
fIN = 250 MHz
64.6
dBFS
fIN = 400 MHz
63.8
dBFS
fIN = 10 MHz
86.4
fIN = 70 MHz
85.4
fIN = 150 MHz
82.4
dBFS
fIN = 250 MHz
83.4
dBFS
fIN = 400 MHz
69.8
dBFS
fIN = 10 MHz
10.5
fIN = 70 MHz
10.5
fIN = 150 MHz
10.5
Bits
fIN = 250 MHz
10.4
Bits
fIN = 400 MHz
10.1
Bits
fIN = 10 MHz
-83.1
dBFS
fIN = 70 MHz
-83.2
fIN = 150 MHz
-78.9
dBFS
fIN = 250 MHz
-78.5
dBFS
fIN = 400 MHz
-67.2
dBFS
fIN = 10 MHz
-93.5
fIN = 70 MHz
-93.4
fIN = 150 MHz
-82.4
dBFS
fIN = 250 MHz
-83.4
dBFS
fIN = 400 MHz
-74.0
dBFS
fIN = 10 MHz
-93.2
fIN = 70 MHz
-87.9
fIN = 150 MHz
-88.8
dBFS
fIN = 250 MHz
-83.5
dBFS
fIN = 400 MHz
-69.8
dBFS
GHz
dBFS
64.0
dBFS
dBFS
74.0
dBFS
Bits
10.2
-72.0
Bits
dBFS
dBFS
-80.0
dBFS
dBFS
-74
dBFS
The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided
current is limited per Note 4 under Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above
2.6V or below GND as described in the Operating Ratings section.
VA
I/O
To Internal Circuitry
AGND
(2)
(3)
(4)
8
To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
With the test condition for VREF = +1.0V (2VP-P differential input), the 11-Bit LSB is 976.6 µV.
Typical figures are at TA = 25°C and represent most likely parametric norms at the time of product characterization. The typical
specifications are not ensured.
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Dynamic Converter Electrical Characteristics (continued)
Unless otherwise specified, the following specifications apply: VIN = -1dBFS, AGND = DGND = DRGND = 0V, VA = VD =
+3.3V, VDR = +1.8V, Internal VREF = +1.0V, fCLK = 170 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock Mode, Offset
Binary Format. Typical values are for TA = 25°C. Boldface limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA =
25°C(1)(2)(3)
Symbol
SINAD
Parameter
Conditions
Signal-to-Noise and Distortion Ratio
Typical
(4)
Limits
Units
(Limits)
fIN = 10 MHz
65.2
fIN = 70 MHz
65.0
dBFS
fIN = 150 MHz
64.7
dBFS
fIN = 250 MHz
64.4
dBFS
fIN = 400 MHz
62.4
dBFS
63.3
dBFS
Logic and Power Supply Electrical Characteristics
Unless otherwise specified, the following specifications apply: VIN = -1 dBFS, AGND = DGND = DRGND = 0V, VA = VD =
+3.3V, VDR = +1.8V, Internal VREF = +1.0V, fCLK = 170 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock Mode, Offset
Binary Format. Typical values are for TA = 25°C. Boldface limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA =
25°C (1) (2) (3)
Symbol
Parameter
Conditions
Typical
(4)
Limits
Units
(Limits)
CLK INPUT CHARACTERISTICS
VIN(1)
Logical “1” Input Voltage
VD = 3.6V
2.0
V (min)
VIN(0)
Logical “0” Input Voltage
VD = 3.0V
0.8
V (max)
IIN(1)
Logical “1” Input Current
VIN = 3.3V
10
µA
IIN(0)
Logical “0” Input Current
VIN = 0V
−10
µA
CIN
Input Capacitance
5
pF
DIGITAL OUTPUT CHARACTERISTICS (D0–D11, DRDY, OVR)
VOUT(1)
Logical “1” Output Voltage
IOUT = −0.5 mA , VDR = 1.8V
1.2
V (min)
VOUT(0)
Logical “0” Output Voltage
IOUT = 1.6 mA, VDR = 1.8V
0.4
V (max)
+ISC
Output Short Circuit Source Current
VOUT = 0V
−10
mA
−ISC
Output Short Circuit Sink Current
VOUT = VDR
10
mA
COUT
Digital Output Capacitance
5
pF
POWER SUPPLY CHARACTERISTICS
IA
Analog Supply Current
Full Operation
207
252
mA (max)
ID
Digital Supply Current
Full Operation
9.9
10.5
mA (max)
IDR
Digital Output Supply Current
Full Operation (5)
13
(1)
mA
The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided
current is limited per Note 4 under Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above
2.6V or below GND as described in the Operating Ratings section.
VA
I/O
To Internal Circuitry
AGND
(2)
(3)
(4)
(5)
To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
With the test condition for VREF = +1.0V (2VP-P differential input), the 11-Bit LSB is 976.6 µV.
Typical figures are at TA = 25°C and represent most likely parametric norms at the time of product characterization. The typical
specifications are not ensured.
IDR is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins,
the supply voltage, VDR, and the rate at which the outputs are switching (which is signal dependent). IDR=VDR(C0 x f0 + C1 x f1 +....C11 x
f11) where VDR is the output driver power supply voltage, Cn is total capacitance on the output pin, and fn is the average frequency at
which that pin is toggling.
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Logic and Power Supply Electrical Characteristics (continued)
Unless otherwise specified, the following specifications apply: VIN = -1 dBFS, AGND = DGND = DRGND = 0V, VA = VD =
+3.3V, VDR = +1.8V, Internal VREF = +1.0V, fCLK = 170 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock Mode, Offset
Binary Format. Typical values are for TA = 25°C. Boldface limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA =
25°C(1)(2)(3)
Symbol
Parameter
(4)
Excludes IDR (6)
Power Consumption
(6)
Typical
Conditions
Limits
Units
(Limits)
715
mW
Power Down Power Consumption
5
mW
Sleep Power Consumption
50
mW
IDR is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins,
the supply voltage, VDR, and the rate at which the outputs are switching (which is signal dependent). IDR=VDR(C0 x f0 + C1 x f1 +....C11 x
f11) where VDR is the output driver power supply voltage, Cn is total capacitance on the output pin, and fn is the average frequency at
which that pin is toggling.
Timing and AC Characteristics
Unless otherwise specified, the following specifications apply: VIN = -1dBFS, AGND = DGND = DRGND = 0V, VA = VD =
+3.3V, VDR = +1.8V, Internal VREF = +1.0V, fCLK = 170 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock Mode, Offset
Binary Format. Typical values are for TA = 25°C. Timing measurements are taken at 50% of the signal amplitude. Boldface
limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C (1) (2) (3)
Symbol
Limits
Units
(Limits)
Maximum Clock Frequency
170
MHz (max)
Minimum Clock Frequency
5
MHz (min)
Parameter
Typical
Conditions
(4)
tCH
Clock High Time
2.7
tCL
Clock Low Time
2.7
ns
ns
Clock
Cycles
Conversion Latency
tOD
Output Delay of CLK to
DATA
Relative to falling edge of
CLK
2.0
tDV
Data Output Setup Time
Time output data is valid
before the output edge of
DRDY (5)
1.9
1.35
ns (min)
tDNV
Data Output Hold Time
Time till output data is not
valid after the output edge of
DRDY (5)
1.9
1.35
ns (min)
tAD
Aperture Delay
0.5
ns
Aperture Jitter
0.08
ps rms
3.0
ms
Power Down Recovery Time
(1)
0.1 µF on pins 43, 44; 10 µF
and 0.1 µF between pins 43,
44; 0.1 µF and 10 µF on pins
45, 46
ns
The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided
current is limited per Note 4 under Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above
2.6V or below GND as described in the Operating Ratings section.
VA
I/O
To Internal Circuitry
AGND
(2)
(3)
(4)
(5)
10
To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
With the test condition for VREF = +1.0V (2VP-P differential input), the 11-Bit LSB is 976.6 µV.
Typical figures are at TA = 25°C and represent most likely parametric norms at the time of product characterization. The typical
specifications are not ensured.
This test parameter is specified by design and characterization.
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Timing and AC Characteristics (continued)
Unless otherwise specified, the following specifications apply: VIN = -1dBFS, AGND = DGND = DRGND = 0V, VA = VD =
+3.3V, VDR = +1.8V, Internal VREF = +1.0V, fCLK = 170 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock Mode, Offset
Binary Format. Typical values are for TA = 25°C. Timing measurements are taken at 50% of the signal amplitude. Boldface
limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C(1)(2)(3)
Symbol
Parameter
Conditions
Sleep Recovery Time
0.1 µF on pins 43, 44; 10 µF
and 0.1 µF between pins 43,
44; 0.1 µF and 10 µF on pins
45, 46
Typical
(4)
Limits
Units
(Limits)
100
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µs
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Specification Definitions
APERTURE DELAY is the time after the falling edge of the clock to when the input signal is acquired or held for
conversion.
APERTURE JITTER (APERTURE UNCERTAINTY) is the variation in aperture delay from sample to sample.
Aperture jitter manifests itself as noise in the output.
CLOCK DUTY CYCLE is the ratio of the time during one cycle that a repetitive digital waveform is high to the
total time of one period. The specification here refers to the ADC clock input signal.
COMMON MODE VOLTAGE (VCM) is the common DC voltage applied to both input terminals of the ADC.
CONVERSION LATENCY is the number of clock cycles between initiation of conversion and when that data is
presented to the output driver stage. Data for any given sample is available at the output pins the Pipeline Delay
plus the Output Delay after the sample is taken. New data is available at every clock cycle, but the data lags the
conversion by the pipeline delay.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise
and Distortion Ratio or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and says that the converter is
equivalent to a perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental
drops 3 dB below its low frequency value for a full scale input.
GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated as:
Gain Error = Positive Full Scale Error − Negative Full Scale Error
(1)
It can also be expressed as Positive Gain Error and Negative Gain Error, which are calculated as:
PGE = Positive Full Scale Error - Offset Error NGE = Offset Error - Negative Full Scale Error
(2)
INTEGRAL NON LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from
negative full scale (½ LSB below the first code transition) through positive full scale (½ LSB above the last code
transition). The deviation of any given code from this straight line is measured from the center of that code value.
INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two
sinusoidal frequencies being applied to the ADC input at the same time. It is defined as the ratio of the power in
the intermodulation products to the total power in the original frequencies. IMD is usually expressed in dBFS.
LSB (LEAST SIGNIFICANT BIT) is the bit that has the smallest value or weight of all bits. This value is VFS/2n,
where “VFS” is the full scale input voltage and “n” is the ADC resolution in bits.
MISSING CODES are those output codes that will never appear at the ADC outputs. The ADC11C170 is
ensured not to have any missing codes.
MSB (MOST SIGNIFICANT BIT) is the bit that has the largest value or weight. Its value is one half of full scale.
NEGATIVE FULL SCALE ERROR is the difference between the actual first code transition and its ideal value of
½ LSB above negative full scale.
OFFSET ERROR is the difference between the two input voltages [(VIN+) – (VIN-)] required to cause a transition
from code 2047 to 2048.
OUTPUT DELAY is the time delay after the falling edge of the clock before the data update is presented at the
output pins.
PIPELINE DELAY (LATENCY) See CONVERSION LATENCY.
POSITIVE FULL SCALE ERROR is the difference between the actual last code transition and its ideal value of
1½ LSB below positive full scale.
POWER SUPPLY REJECTION RATIO (PSRR) is a measure of how well the ADC rejects a change in the power
supply voltage. PSRR is the ratio of the Full-Scale output of the ADC with the supply at the minimum DC supply
limit to the Full-Scale output of the ADC with the supply at the maximum DC supply limit, expressed in dB.
12
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SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms
value of the sum of all other spectral components below one-half the sampling frequency, not including
harmonics or DC.
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the
input signal to the rms value of all of the other spectral components below half the clock frequency, including
harmonics but excluding d.c.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the
input signal and the peak spurious signal, where a spurious signal is any signal present in the output spectrum
that is not present at the input.
TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dB, of the rms total of the first nine harmonic
levels at the output to the level of the fundamental at the output. THD is calculated as
(3)
where f1 is the RMS power of the fundamental (output) frequency and f2 through f10 are the RMS power of the
first 9 harmonic frequencies in the output spectrum.
SECOND HARMONIC DISTORTION (2ND HARM) is the difference expressed in dB, between the RMS power in
the input frequency at the output and the power in its 2nd harmonic level at the output.
THIRD HARMONIC DISTORTION (3RD HARM) is the difference, expressed in dB, between the RMS power in
the input frequency at the output and the power in its 3rd harmonic level at the output.
Timing Diagram
Sample N + 8
Sample N + 7
Sample N + 9
|
Sample N + 6
Sample N
Sample N + 10
VIN
tAD
Clock N + 7
Clock N
1
fCLK
|
90%
CLK
90%
10%
10%
tCH
tCL
tf
tr
|
Latency
tOD
|
DRDY
tDV
| |
D0 - D10
tDNV
Data N - 1
Data N
Data N + 1
Data N + 2
Figure 1. Output Timing
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Transfer Characteristic
Figure 2. Transfer Characteristic (Offset Binary Format)
14
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Typical Performance Characteristics, DNL, INL
Unless otherwise specified, the following specifications apply: VIN = -1dBFS, AGND = DGND = DRGND = 0V, VA = VD =
+3.3V, VDR = +1.8V, Internal VREF = +1.0V, fCLK = 170 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock Mode, Offset
Binary Format. Typical values are for TA = 25°C. (1) (2) (3)
(1)
DNL
INL
Figure 3.
Figure 4.
The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided
current is limited per Note 4 under Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above
2.6V or below GND as described in the Operating Ratings section.
VA
I/O
To Internal Circuitry
AGND
(2)
(3)
To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
With the test condition for VREF = +1.0V (2VP-P differential input), the 11-Bit LSB is 976.6 µV.
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Typical Performance Characteristics, Dynamic Performance
Unless otherwise specified, the following specifications apply: VIN = -1dBFS, AGND = DGND = DRGND = 0V, VA = VD =
+3.3V, VDR = +1.8V, Internal VREF = +1.0V, fCLK = 170 MHz, fIN = 70 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock
Mode, Offset Binary Format. Typical values are for TA = 25°C.
16
SNR, SINAD, SFDR
vs.
fIN
DISTORTION
vs.
fIN
Figure 5.
Figure 6.
SNR, SINAD, SFDR
vs.
VA
DISTORTION
vs.
VA
Figure 7.
Figure 8.
SNR, SINAD, SFDR
vs.
VDR
DISTORTION
vs.
VDR
Figure 9.
Figure 10.
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Typical Performance Characteristics, Dynamic Performance
Unless otherwise specified, the following specifications apply: VIN = -1dBFS, AGND = DGND = DRGND = 0V, VA = VD =
+3.3V, VDR = +1.8V, Internal VREF = +1.0V, fCLK = 170 MHz, fIN = 70 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock
Mode, Offset Binary Format. Typical values are for TA = 25°C.
SNR, SINAD, SFDR
vs.
VREF
DISTORTION
vs.
VREF
Figure 11.
Figure 12.
SNR, SINAD, SFDR
vs.
Temperature
DISTORTION
vs.
Temperature
Figure 13.
Figure 14.
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Typical Performance Characteristics, Dynamic Performance
Unless otherwise specified, the following specifications apply: VIN = -1dBFS, AGND = DGND = DRGND = 0V, VA = VD =
+3.3V, VDR = +1.8V, Internal VREF = +1.0V, fCLK = 170 MHz, fIN = 70 MHz, VCM = VRM, CL = 5 pF/pin, Single-Ended Clock
Mode, Offset Binary Format. Typical values are for TA = 25°C.
18
Spectral Response @ 70 MHz Input
Spectral Response @ 150 MHz Input
Figure 15.
Figure 16.
Spectral Response @ 250 MHz Input
Spectral Response @ 411 MHz Input
Figure 17.
Figure 18.
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FUNCTIONAL DESCRIPTION
Operating on dual +3.3V and +1.8V supplies, the ADC11C170 digitizes a differential analog input signal to 11
bits, using a differential pipelined architecture with error correction circuitry and an on-chip sample-and-hold
circuit to ensure maximum performance.
The user has the choice of using an internal 1.0V stable reference, or using an external reference. The
ADC11C170 will accept an external reference between 0.9V and 1.1V (1.0V recommended) which is buffered
on-chip to ease the task of driving that pin. The +1.8V output driver supply reduces power consumption and
decreases the noise at the output of the converter.
The quad state function pin CLK_SEL/DF (pin 8) allows the user to choose between using a single-ended or a
differential clock input and between offset binary or 2's complement output data format. The digital outputs are
CMOS compatible signals that are clocked by a synchronous data ready output signal (DRDY, pin 34) at the
same rate as the clock input. For the ADC11C170 the clock frequency can be between 5 MSPS and 170 MSPS
(typical) with fully specified performance at 170 MSPS. The analog input is acquired at the falling edge of the
clock and the digital data for a given sample is output on the falling edge of the DRDY signal and is delayed by
the pipeline for 7 clock cycles. The data should be captured on the rising edge of the DRDY signal.
Power-down is selectable using the PD/Sleep pin (pin 7). A logic high on the PD/Sleep pin disables everything
except the voltage reference circuitry and reduces the converter power consumption to 5 mW. When PD/Sleep is
biased to VA/2 the the chip enters sleep mode. In sleep mode everything except the voltage reference circuitry
and its accompanying on chip buffer is disabled; power consumption is reduced to 50 mW. For normal operation,
the PD/Sleep pin should be connected to the analog ground (AGND). A duty cycle stabilizer maintains
performance over a wide range of clock duty cycles.
APPLICATIONS INFORMATION
OPERATING CONDITIONS
We recommend that the following conditions be observed for operation of the ADC11C170:
3.0V ≤ VA ≤ 3.6V
VD = VA
VDR = 1.8V
5 MHz ≤ fCLK ≤ 170 MHz
1.0V internal reference
0.9V ≤ VREF ≤ 1.1V (for an external reference)
VCM = 1.5V (from VRM)
Single Ended Clock Mode
ANALOG INPUTS
Signal Inputs
Differential Analog Input Pins
The ADC11C170 has one pair of analog signal input pins, VIN+ and VIN−, which form a differential input pair. The
input signal, VIN, is defined as
VIN = (VIN+) – (VIN−)
(4)
Figure 19 shows the expected input signal range. Note that the common mode input voltage, VCM, should be
1.5V. Using VRM (pin 45) for VCM will ensure the proper input common mode level for the analog input signal. The
peaks of the individual input signals should each never exceed 2.6V. Each analog input pin of the differential pair
should have a peak-to-peak voltage equal to the reference voltage, VREF, be 180° out of phase with each other
and be centered around VCM.The peak-to-peak voltage swing at each analog input pin should not exceed the
value of the reference voltage or the output data will be clipped.
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Figure 19. Expected Input Signal Range
For single frequency sine waves the full scale error in LSB can be described as approximately
EFS = 2048 ( 1 - sin (90° + dev))
(5)
Where dev is the angular difference in degrees between the two signals having a 180° relative phase relationship
to each other (see Figure 20). For single frequency inputs, angular errors result in a reduction of the effective full
scale input. For complex waveforms, however, angular errors will result in distortion.
Figure 20. Angular Errors Between the Two Input Signals Will Reduce the Output Level or Cause
Distortion
It is recommended to drive the analog inputs with a source impedance less than 100Ω. Matching the source
impedance for the differential inputs will improve even ordered harmonic performance (particularly second
harmonic).
Table 1 indicates the input to output relationship of the ADC11C170.
Table 1. Input to Output Relationship
VIN+
VIN−
Binary Output
2’s Complement Output
VCM − VREF/2
VCM + VREF/2
000 0000 0000
100 0000 0000
VCM − VREF/4
VCM + VREF/4
010 0000 0000
110 0000 0000
VCM
VCM
100 0000 0000
000 0000 0000
VCM + VREF/4
VCM − VREF/4
110 0000 0000
010 0000 0000
VCM + VREF/2
VCM − VREF/2
111 1111 1111
011 1111 1111
Negative Full-Scale
Mid-Scale
Positive Full-Scale
Driving the Analog Inputs
The VIN+ and the VIN− inputs of the ADC11C170 have an internal sample-and-hold circuit which consists of an
analog switch followed by a switched-capacitor amplifier. The analog inputs are connected to the sampling
capacitors through NMOS switches, and each analog input has parasitic capacitances associated with it.
When the clock is high, the converter is in the sample phase. The analog inputs are connected to the sampling
capacitor through the NMOS switches, which causes the capacitance at the analog input pins to appear as the
pin capacitance plus the internal sample and hold circuit capacitance (approximately 9 pF). While the clock level
remains high, the sampling capacitor will track the changing analog input voltage. When the clock transitions
from high to low, the converter enters the hold phase, during which the analog inputs are disconnected from the
sampling capacitor. The last voltage that appeared at the analog input before the clock transition will be held on
the sampling capacitor and will be sent to the ADC core. The capacitance seen at the analog input during the
hold phase appears as the sum of the pin capacitance and the parasitic capacitances associated with the sample
and hold circuit of each analog input (approximately 6 pF). Once the clock signal transitions from low to high, the
analog inputs will be reconnected to the sampling capacitor to capture the next sample. Usually, there will be a
difference between the held voltage on the sampling capacitor and the new voltage at the analog input. This will
cause a charging glitch that is proportional to the voltage difference between the two samples to appear at the
analog input pin. The input circuitry must be fast enough to allow the sampling capacitor to settle before the clock
signal goes low again, as incomplete settling can degrade the SFDR performance.
20
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A single-ended to differential conversion circuit is shown in Figure 21. A transformer is preferred for high
frequency input signals. Terminating the transformer on the secondary side provides two advantages. First, it
presents a real broadband impedance to the ADC inputs and second, it provides a common path for the charging
glitches from each side of the differential sample-and-hold circuit.
One short-coming of using a transformer to achieve the single-ended to differential conversion is that most RF
transformers have poor low frequency performance. A differential amplifier can be used to drive the analog inputs
for low frequency applications. The amplifier must be fast enough to settle from the charging glitches on the
analog input resulting from the sample-and-hold operation before the clock goes high and the sample is passed
to the ADC core.
The SFDR performance of the converter depends on the external signal conditioning circuity used, as this affects
how quickly the sample-and-hold charging glitch will settle. An external resistor and capacitor network as shown
in Figure 21 should be used to isolate the charging glitches at the ADC input from the external driving circuit and
to filter the wideband noise at the converter input. These components should be placed close to the ADC inputs
because the analog input of the ADC is the most sensitive part of the system, and this is the last opportunity to
filter that input. For Nyquist applications the RC pole should be at the ADC sample rate. The ADC input
capacitance in the sample mode should be considered when setting the RC pole. For wideband undersampling
applications, the RC pole should be set at about 1.5 to 2 times the maximum input frequency to maintain a linear
delay response.
Input Common Mode Voltage
The input common mode voltage, VCM, should be in the range of 1.4V to 1.6V and be a value such that the peak
excursions of the analog signal do not go more negative than ground or more positive than 2.6V. It is
recommended to use VRM (pin 45) as the input common mode voltage.
Reference Pins
The ADC11C170 is designed to operate with an internal 1.0V reference, or an external 1.0V reference, but
performs well with external reference voltages in the range of 0.9V to 1.1V. The internal 1.0 Volt reference is the
default condition when no external reference input is applied to the VREF pin. If a voltage in the range of 0.9V to
1.1V is applied to the VREF pin, then that voltage is used for the reference. The VREF pin should always be
bypassed to ground with a 0.1 µF capacitor close to the reference input pin. Lower reference voltages will
decrease the signal-to-noise ratio (SNR) of the ADC11C170. Increasing the reference voltage (and the input
signal swing) beyond 1.1V may degrade THD for a full-scale input, especially at higher input frequencies.
It is important that all grounds associated with the reference voltage and the analog input signal make connection
to the ground plane at a single, quiet point to minimize the effects of noise currents in the ground path.
The Reference Bypass Pins (VRP, VRM, and VRN) are made available for bypass purposes. All these pins should
each be bypassed to ground with a 0.1 µF capacitor. A 0.1 µF and a 10 µF capacitor should be placed between
the VRP and VRN pins, as shown in Figure 21. This configuration is necessary to avoid reference oscillation,
which could result in reduced SFDR and/or SNR. VRM may be loaded to 1mA for use as a temperature stable
1.5V reference. The remaining pins should not be loaded.
Smaller capacitor values than those specified will allow faster recovery from the power down and sleep modes,
but may result in degraded noise performance. Loading any of these pins, other than VRM, may result in
performance degradation.
The nominal voltages for the reference bypass pins are as follows:
VRM = 1.5 V
VRP = VRM + VREF / 2
VRN = VRM − VREF / 2
Control Inputs
Power-Down & Sleep (PD/Sleep)
The power-down and sleep modes can be enabled through this three-state input pin. Table 2 shows how to
utilize these options.
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Table 2. Power Down/Sleep Selection Table
PD Input Voltage
Power State
VA
Power-down
VA/2
Sleep
AGND
On
The power-down and sleep modes allows the user to conserve power when the converter is not being used. In
the power-down state all bias currents of the analog circuitry, excluding the reference are shut down which
reduces the power consumption to 5 mW with no clock running. In sleep mode some additional buffer circuitry is
left on to allow an even faster wake time; power consumption in the sleep mode is 50 mW with no clock running.
In both of these modes the output data pins are undefined and the data in the pipeline is corrupted.
The Exit Cycle time for both the sleep and power-down mode is determined by the value of the capacitors on the
VRP, VRM and VRN reference bypass pins (pins 43, 44 and 45). These capacitors lose their charge when the ADC
is not operating and must be recharged by on-chip circuitry before conversions can be accurate. For power-down
mode the Exit Cycle time is about 3 ms with the recommended component values. The Exit Cycle time is faster
for sleep mode. Smaller capacitor values allow slightly faster recovery from the power down and sleep mode, but
can result in a reduction in SNR, SINAD and ENOB performance.
Clock Mode Select/Data Format (CLK_SEL/DF)
Single-ended versus differential clock mode and output data format are selectable using this quad-state function
pin. Table 3 shows how to select between the clock modes and the output data formats.
Table 3. Clock Mode and Data Format Selection Table
CLK_SEL/DF Input Voltage
Clock Mode
Output Data Format
VA
Differential
2's Complement
(2/3) * VA
Differential
Offset Binary
(1/3) * VA
Single-Ended
2's Complement
AGND
Single-Ended
Offset Binary
CLOCK INPUTS
The CLK+ and CLK− signals control the timing of the sampling process. The CLK_SEL/DF pin (pin 8) allows the
user to configure the ADC for either differential or single-ended clock mode. In differential clock mode, the two
clock signals should be exactly 180° out of phase from each other and of the same amplitude. In the singleended clock mode, the clock signal should be routed to the CLK+ input and the CLK− input should be tied to
AGND in combination with the correct setting from Table 3.
To achieve the optimum noise performance, the clock inputs should be driven with a stable, low jitter clock signal
in the range indicated in the Electrical Table. The clock input signal should also have a short transition region.
This can be achieved by passing a low-jitter sinusoidal clock source through a high speed buffer gate. This
configuration is shown in Figure 21. The trace carrying the clock signal should be as short as possible and
should not cross any other signal line, analog or digital, not even at 90°. Figure 21 shows the recommended
clock input circuit.
The clock signal also drives an internal state machine. If the clock is interrupted, or its frequency is too low, the
charge on the internal capacitors can dissipate to the point where the accuracy of the output data will degrade.
This is what limits the minimum sample rate.
The clock line should be terminated at its source in the characteristic impedance of that line. Take care to
maintain a constant clock line impedance throughout the length of the line. Refer to Application Note AN-905
(SNLA035) for information on setting characteristic impedance.
It is highly desirable that the the source driving the ADC clock pins only drive that pin. However, if that source is
used to drive other devices, then each driven pin should be AC terminated with a series RC to ground, such that
the resistor value is equal to the characteristic impedance of the clock line and the capacitor value is
(6)
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where tPD is the signal propagation rate down the clock line, "L" is the line length and ZO is the characteristic
impedance of the clock line. This termination should be as close as possible to the ADC clock pin but beyond it
as seen from the clock source. Typical tPD is about 150 ps/inch (60 ps/cm) on FR-4 board material. The units of
"L" and tPD should be the same (inches or centimeters).
The duty cycle of the clock signal can affect the performance of the A/D Converter. Because achieving a precise
duty cycle is difficult, the ADC11C170 has a Duty Cycle Stabilizer. It is designed to maintain performance over a
clock duty cycle range of 30% to 70%.
DIGITAL OUTPUTS
Digital outputs consist of the 1.8V CMOS signals D0-D10, DRDY, OVR and OGND.
The ADC11C170 has 16 CMOS compatible data output pins: 11 data output bits corresponding to the converted
input value, a data ready (DRDY) signal that should be used to capture the output data, an over-range indicator
(OVR) which is set high when the sample amplitude exceeds the 11-Bit conversion range and three output
ground pins (OGND) which should be ignored except when used for compatibility with a 12 or 14 bit part. Valid
data is present at these outputs while the PD/Sleep pin is low.
Data should be captured and latched with the rising edge of the DRDY signal. Depending on the setup and hold
time requirements of the receiving circuit (ASIC), either the rising edge or the falling edge of the DRDY signal
can be used to latch the data. Generally, rising-edge capture would maximize setup time with minimal hold time;
while falling-edge-capture would maximize hold time with minimal setup time. However, actual timing for the
falling-edge case depends greatly on the CLK frequency and both cases also depend on the delays inside the
ASIC. Refer to the AC Electrical Characteristics table.
Be very careful when driving a high capacitance bus. The more capacitance the output drivers must charge for
each conversion, the more instantaneous digital current flows through VDR and DRGND. These large charging
current spikes can cause on-chip ground noise and couple into the analog circuitry, degrading dynamic
performance. Adequate bypassing, limiting output capacitance and careful attention to the ground plane will
reduce this problem. Additionally, bus capacitance beyond the specified 5 pF/pin will cause tOD to increase,
reducing the setup and hold time of the ADC output data. The result could be an apparent reduction in dynamic
performance.
To minimize noise due to output switching, the load currents at the digital outputs should be minimized. This can
be done by using a programmable logic device (PLD) such as the LC4032V-25TN48C to level translate the ADC
output data from 1.8V to 3.3V for use by any other circuitry. Only one load should be connected to each output
pin. The outputs of the ADC11C170 have 40Ω on-chip series resistors to limit the output currents at the digital
outputs. Additionally, inserting series resistors of about 22Ω at the digital outputs, close to the ADC pins, will
isolate the outputs from trace and other circuit capacitances and limit the output currents, which could otherwise
result in performance degradation. See Figure 21.
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+3.3V from
Regulator
+3.3V from
Regulator
+1.8V from
Regulator
0.01 PF
0.1 PF
10 PF 0.1 PF
44
43
10 PF
0.1 PF
0.1 PF
2
0.1 PF
2
1
V DR 15
V DR 25
V DR 36
CLK_SEL/DF
1k
24.9
DRGND
DRGND
DRGND
11 CLK+
12 CLK-
DGND
15 pF
DRDY 34
OVR 33
32
(MSB) D10
31
D9
30
D8
29
D7
28
D6
27
D5
24
D4
23
D3
22
D2
21
D1
20
(LSB) D0
19
OGND
18
OGND
17
OGND
0.01 PF
x2
0.1 PF
x2
0.1 PF
x4
22
LC4032V-25TN48C
PLD
11-bit
Digital
Output
Word
16
26
35
0.1 PF
7
PD/Sleep
8
PD/Sleep
CLK_SEL/DF
33.2
14
24.9
Flux XFMR: ADT1-1WT or ETC1-1T
Balun XFMR: ADT1-12 or ETC1-1-13
(See ADC11C125 8VHU¶V *XLGH IRU
other Input Network Configurations)
VA
CLKIN
ADC11C170
3 VIN4 V +
IN
15 pF
0.1 PF
V RP
15 pF
33.2
24.9
0.1 PF
V RN
AGND
AGND
AGND
AGND
AGND
AGND
AGND
1
0.1 PF
V RM
2
5
10
38
39
42
48
VIN
VREF
0.1 PF
45
0.1 PF
49.9
VA
VA
VA
VA
VA
VA
VA
46
10 PF
+3.3V from
Regulator
0.01 PF
x4
0.1 PF
x3
13
1
6
9
37
40
41
48
0.01 PF
x6
VD
0.1 PF
x6
+1.8V from
Regulator
0.01 PF
x3
1k
NC7WV125K8X
High Speed Buffer
If 14-bit compatibility is not required do not connect pins 17 - 19. If 12-bit compatibility if not required do not connect
pin 19.
Figure 21. Application Circuit using Transformer Drive Circuit.
POWER SUPPLY CONSIDERATIONS
The power supply pins should be bypassed with a 0.1 µF capacitor and with a 0.01 µF ceramic chip capacitor
close to each power pin. Leadless chip capacitors are preferred because they have low series inductance.
As is the case with all high-speed converters, the ADC11C170 is sensitive to power supply noise. Accordingly,
the noise on the analog supply pin should be kept below 100 mVP-P.
No pin should ever have a voltage on it that is in excess of the supply voltages, not even on a transient basis. Be
especially careful of this during power turn on and turn off.
The VDR pin provides power for the output drivers and may be operated from a supply in the range of 1.6V to
2.0V. This enables lower power operation, reduces the noise coupling effects from the digital outputs to the
analog circuitry and simplifies interfacing to lower voltage devices and systems. Note, however, that tOD
increases with reduced VDR. A level translator may be required to interface the digital output signals of the
ADC11C170 to non-1.8V CMOS devices.
LAYOUT AND GROUNDING
Proper grounding and proper routing of all signals are essential to ensure accurate conversion. Maintaining
separate analog and digital areas of the board, with the ADC11C170 between these areas, is required to achieve
specified performance.
The ground return for the data outputs (DRGND) carries the ground current for the output drivers. The output
current can exhibit high transients that could add noise to the conversion process. To prevent this from
happening, the DRGND pins should NOT be connected to system ground in close proximity to any of the
ADC11C170's other ground pins.
Capacitive coupling between the typically noisy digital circuitry and the sensitive analog circuitry can lead to poor
performance. The solution is to keep the analog circuitry separated from the digital circuitry, and to keep the
clock line as short as possible.
24
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The effects of the noise generated from the ADC output switching can be minimized through the use of 22Ω
resistors in series with each data output line. Locate these resistors as close to the ADC output pins as possible.
Since digital switching transients are composed largely of high frequency components, total ground plane copper
weight will have little effect upon the logic-generated noise. This is because of the skin effect. Total surface area
is more important than is total ground plane area.
Generally, analog and digital lines should cross each other at 90° to avoid crosstalk. To maximize accuracy in
high speed, high resolution systems, however, avoid crossing analog and digital lines altogether. It is important to
keep clock lines as short as possible and isolated from ALL other lines, including other digital lines. Even the
generally accepted 90° crossing should be avoided with the clock line as even a little coupling can cause
problems at high frequencies. This is because other lines can introduce jitter into the clock line, which can lead to
degradation of SNR. Also, the high speed clock can introduce noise into the analog chain.
Best performance at high frequencies and at high resolution is obtained with a straight signal path. That is, the
signal path through all components should form a straight line wherever possible.
Be especially careful with the layout of inductors and transformers. Mutual inductance can change the
characteristics of the circuit in which they are used. Inductors and transformers should not be placed side by
side, even with just a small part of their bodies beside each other. For instance, place transformers for the analog
input and the clock input at 90° to one another to avoid magnetic coupling.
The analog input should be isolated from noisy signal traces to avoid coupling of spurious signals into the input.
Any external component (e.g., a filter capacitor) connected between the converter's input pins and ground or to
the reference input pin and ground should be connected to a very clean point in the ground plane.
All analog circuitry (input amplifiers, filters, reference components, etc.) should be placed in the analog area of
the board. All digital circuitry and dynamic I/O lines should be placed in the digital area of the board. The
ADC11C170 should be between these two areas. Furthermore, all components in the reference circuitry and the
input signal chain that are connected to ground should be connected together with short traces and enter the
ground plane at a single, quiet point. All ground connections should have a low inductance path to ground.
DYNAMIC PERFORMANCE
To achieve the best dynamic performance, the clock source driving the CLK input must have a sharp transition
region and be free of jitter. Isolate the ADC clock from any digital circuitry with buffers, as with the clock tree
shown in Figure 22 . The gates used in the clock tree must be capable of operating at frequencies much higher
than those used if added jitter is to be prevented. Best performance will be obtained with a single-ended drive
input drive, compared with a differential clock.
As mentioned in Layout and Grounding, it is good practice to keep the ADC clock line as short as possible and to
keep it well away from any other signals. Other signals can introduce jitter into the clock signal, which can lead to
reduced SNR performance, and the clock can introduce noise into other lines. Even lines with 90° crossings
have capacitive coupling, so try to avoid even these 90° crossings of the clock line.
Figure 22. Isolating the ADC Clock from other Circuitry with a Clock Tree
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REVISION HISTORY
Changes from Revision A (April 2013) to Revision B
•
26
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 25
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PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
ADC11C170CISQ/NOPB
ACTIVE
Package Type Package Pins Package
Drawing
Qty
WQFN
RHS
48
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
TBD
Call TI
Call TI
Op Temp (°C)
Device Marking
(4/5)
-40 to 85
ADC11C170
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
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(6)
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
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