ADC11DL066CIVS/NOPB

ADC11DL066 www.ti.com SNAS223C – MARCH 2004 – REVISED MARCH 2013 ADC11DL066 Dual 11-Bit, 66 MSPS, 450 MHz Input Bandwidth A/D Converter w/Internal Reference Check for Samples: ADC11DL066 FEATURES DESCRIPTION • • • • • The ADC11DL066 is a dual, low power monolithic CMOS analog-to-digital converter capable of converting analog input signals into 11-bit digital words at 66 Megasamples per second (MSPS), minimum. This converter uses a differential, pipeline architecture with digital error correction and an onchip sample-and-hold circuit to minimize die size and power consumption while providing excellent dynamic performance and a 450 MHz Full Power Bandwidth. Operating on a single 3.3V power supply, the ADC11DL066 achieves 10.3 effective bits and consumes just 686 mW at 66 MSPS, including the reference current. The Power Down feature reduces power consumption to 75 mW. 1 2 Binary or 2’s Complement Output Format Single +3.3V Supply Operation Outputs 2.4V to 3.3V Compatible Power Down Mode On-Chip Reference APPLICATIONS • • • • • • • Ultrasound and Imaging Instrumentation Communications Receivers Sonar/Radar xDSL Cable Modems DSP Front Ends KEY SPECIFICATIONS • • • • • • Resolution 11 Bits DNL ±0.25 LSB (typ) SNR (fIN = 10 MHz) 64 dB (typ) SFDR (fIN = 10 MHz) 80 dB (typ) Data Latency 6 Clock Cycles Power Consumption – Operating 686 mW (typ) – Power Down 75 mW (typ) The differential inputs provide a full scale differential input swing equal to 2 times VREF with the possibility of a single-ended input. Full use of the differential input is recommended for optimum performance. The digital outputs from the two ADCs are available on separate 11-bit buses with an output data format choice of offset binary or two’s complement. To ease interfacing to lower voltage systems, the digital output driver power pins of the ADC11DL066 can be connected to a separate supply voltage in the range of 2.4V to the digital supply voltage. This device is available in the 64-lead TQFP package and will operate over the industrial temperature range of −40°C to +85°C. An evaluation board is available to ease the evaluation process. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2013, Texas Instruments Incorporated ADC11DL066 SNAS223C – MARCH 2004 – REVISED MARCH 2013 www.ti.com Connection Diagram 2 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: ADC11DL066 ADC11DL066 www.ti.com SNAS223C – MARCH 2004 – REVISED MARCH 2013 Stage 1 Stage 2 Stage 3 Stage n | | S/H VIN A- Stage 9 Stage 10 2 || 2 VA Stage 11 AGND 2 || VIN A+ | | Block Diagram 22 Timing Control 11-Stage Pipeline Converter 3 CLK VD Digital Correction DGND 11 11 VRP A Output Buffers VRM A DA0-DA10 OEA VRN A VDR INT/EXT REF DR GND Bandgap Reference VREF VRP B OF 11 Output Buffers VRM B VRN B DB0-DB10 OEB 11 DGND PD Digital Correction VD 3 11-Stage Pipeline Converter Timing Control 22 Stage 2 Stage 3 Stage n 2 | | Stage 1 2 | | S/H VIN B+ || || 2 VIN B- Stage 9 Stage 10 Stage 11 VA AGND Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: ADC11DL066 3 ADC11DL066 SNAS223C – MARCH 2004 – REVISED MARCH 2013 www.ti.com Pin Descriptions and Equivalent Circuits Pin No. Symbol Equivalent Circuit Description ANALOG I/O 15 2 VINA+ VINB+ 16 1 VINA− VINB− 7 VREF 11 INT/EXT REF Differential analog Inputs. With a 1.0V reference voltage the differential full-scale input signal level is 2.0 VP-P with each input pin voltage centered on a common mode voltage, VCM. The negative input pins may be connected to VCM for single-ended operation, but a differential input signal is required for best performance. VA Reference input. This pin should be bypassed to AGND with a 0.1 µF capacitor when an external reference is used. VREF is 1.0V nominal and should be between 0.8V to 1.5V. Reference source select pin. With a logic low at this pin the internal 1.0V reference is selected and the VREF pin need not be driven. With a logic high on this pin an external reference voltage should be applied to VREF input pin 7. DGND 13 5 VRPA VRPB 14 4 VRMA VRMB These pins are high impedance reference bypass pins; they are not reference output pins. Bypass per Reference Pins. DO NOT LOAD these pins. 12 6 VRNA VRNB DIGITAL I/O 60 CLK VD 22 41 OEA OEB 59 PD 21 OF OEA and OEB are the output enable pins that, when low, holds their respective data output pins in the active state. When either of these pins is high, the corresponding outputs are in a high impedance state. PD is the Power Down input pin. When high, this input puts the converter into the power down mode. When this pin is low, the converter is in the active mode. DGND 4 Digital clock input. The range of frequencies for this input is as specified in the electrical tables with ensured performance at 66 MHz. The input is sampled on the rising edge of this input. Output Format pin. A logic low on this pin causes output data to be in offset binary format. A logic high on this pin causes the output data to be in 2’s complement format. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: ADC11DL066 ADC11DL066 www.ti.com SNAS223C – MARCH 2004 – REVISED MARCH 2013 Pin No. Symbol 25 – 29 34 – 39 DA0–DA10 43–47 52–57 Equivalent Circuit DB0–DB10 Description Digital data output pins that make up the 11-bit conversion results of their respective converters. DA0 and DB0 are the LSBs, while DA10 and DB10 are the MSBs of the output words. Output levels are TTL/CMOS compatible. ANALOG POWER 9, 18, 19, 62, 63 VA 3, 8, 10, 17, 20, 61, 64 AGND Positive analog supply pins. These pins should be connected to a quiet +3.3V source and bypassed to AGND with 0.1 µF capacitors located within 1 cm of these power pins, and with a 10 µF capacitor. The ground return for the analog supply. DIGITAL POWER Positive digital supply pin. This pin should be connected to the same quiet +3.3V source as is VA and be bypassed to DGND with a 0.1 µF capacitor located within 1 cm of the power pin and with a 10 µF capacitor. 33, 48 VD 32, 49 DGND The ground return for the digital supply. 24, 42 DGND These two pins are grounded internally and may be grounded or left unconnected. 30, 51 23, 31, 40, 50, 58 VDR DR GND Positive digital supply pin for the ADC11DL066's output drivers. This pin should be connected to a voltage source of +2.4V to VD and be bypassed to DR GND with a 0.1 µF capacitor. If the supply for this pin is different from the supply used for VA and VD, it should also be bypassed with a 10 µF capacitor. VDR should never exceed the voltage on VD. All bypass capacitors should be located within 1 cm of the supply pin. The ground return for the digital supply for the ADC11DL066's output drivers. These pins should be connected to the system digital ground, but not be connected in close proximity to the ADC11DL066's DGND or AGND pins. See LAYOUT AND GROUNDING for more details. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: ADC11DL066 5 ADC11DL066 SNAS223C – MARCH 2004 – REVISED MARCH 2013 Absolute Maximum Ratings www.ti.com (1) (2) (3) VA, VD, VDR 4.2V ≤ 100 mV |VA–VD| −0.3V to (VA or VD +0.3V) Voltage on Any Input or Output Pin Input Current at Any Pin Package Input Current (4) ±25 mA (4) ±50 mA Package Dissipation at TA = 25°C ESD Susceptibility See Human Body Model Machine Model Soldering Temperature, Infrared, 10 sec. (6) 2500V (6) 250V (7) 235°C −65°C to +150°C Storage Temperature (1) (2) (3) (4) (5) (6) (7) (5) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two. The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature, (TA), and can be calculated using the formula PDMAX = (TJmax - TA ) / θJA. The values for maximum power dissipation will only be reached when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided. Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω. The 235°C reflow temperature refers to infrared reflow. For Vapor Phase Reflow (VPR), the following Conditions apply: Maintain the temperature at the top of the package body above 183°C for a minimum 60 seconds. The temperature measured on the package body must not exceed 220°C. Only one excursion above 183°C is allowed per reflow cycle. Operating Ratings (1) (2) Operating Temperature −40°C ≤ TA ≤ +85°C Supply Voltage (VA, VD) +3.0V to +3.6V Output Driver Supply (VDR) +2.4V to VD VREF Input 0.8V to 1.5V −0.05V to (VD + 0.05V) CLK, PD, OE 0V to (VA − 0.5V) Analog Input Pins Common Mode Input Voltage VCM 0.5V to 1.8V ≤100mV |AGND–DGND| (1) (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified. Package Thermal Resistance 6 Package θJ-A 64-Lead TQFP 50°C / W Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: ADC11DL066 ADC11DL066 www.ti.com SNAS223C – MARCH 2004 – REVISED MARCH 2013 Converter Electrical Characteristics Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V,PD = 0V, INT/EXT REF pin = +3.3V, VREF = +1.0V, fCLK = 66 MHz, fIN = 10 MHz, tr = tf = 2 ns, CL = 15 pF/pin. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C (1) (2) (3) Symbol Parameter Conditions Typical Limits 11 Bits (min) ±0.5 ±1.6 LSB (max) ±0.25 ±0.68 LSB (max) 0.4 ±4 %FS (max) −0.1 ±3.6 %FS (max) +1.3 -1.6 %FS (max) %FS (min) (4) (4) Units (Limits) STATIC CONVERTER CHARACTERISTICS Resolution with No Missing Codes (5) INL Integral Non Linearity DNL Differential Non Linearity PGE Positive Gain Error NGE Negative Gain Error TC GE Gain Error Tempco −40°C ≤ TA ≤ +85°C VOFF Offset Error (VIN+ = VIN−) TC VOFF Offset Error Tempco 0.5 −0.18 −40°C ≤ TA ≤ +85°C ppm/°C 0.1 ppm/°C Under Range Output Code 0 0 Over Range Output Code 2047 2047 REFERENCE AND ANALOG INPUT CHARACTERISTICS VCM Common Mode Input Voltage CIN VIN Input Capacitance (each pin to GND) VREF Reference Voltage 1.0 VIN = 2.5 Vdc + 0.7 Vrms (CLK LOW) 8 (CLK HIGH) 7 (6) 1.00 Reference Input Resistance 0.5 V (min) 1.8 V (max) pF pF 0.8 V (min) 1.5 V (max) 100 MΩ 0 dBFS Input, Output at −3 dB 450 MHz fIN = 1 MHz, VIN = −0.5 dBFS 64 fIN = 10 MHz, VIN = −0.5 dBFS 64 fIN = 33 MHz, VIN = −0.5 dBFS 62 DYNAMIC CONVERTER CHARACTERISTICS FPBW SNR Full Power Bandwidth Signal-to-Noise Ratio dB 62 dB (min) dB (1) The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided current is limited per Note 4 under Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above VA or below GND by more than 100 mV. As an example, if VA is +3.3V, the full-scale input voltage must be ≤+3.4V to ensure accurate conversions. (2) (3) (4) To specify accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin. With the test condition for VREF = +1.0V (2VP-P differential input), the 11-bit LSB is 976 µV. Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average Outgoing Quality Level). Integral Non Linearity is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive and negative full-scale. Optimum performance will be obtained by keeping the reference input in the 0.8V to 1.5V range. The LM4051CIM3-ADJ (SOT-23 package) is recommended for external reference applications. (5) (6) Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: ADC11DL066 7 ADC11DL066 SNAS223C – MARCH 2004 – REVISED MARCH 2013 www.ti.com Converter Electrical Characteristics (continued) Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V,PD = 0V, INT/EXT REF pin = +3.3V, VREF = +1.0V, fCLK = 66 MHz, fIN = 10 MHz, tr = tf = 2 ns, CL = 15 pF/pin. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C (1) (2) (3) Symbol SINAD ENOB THD H2 H3 SFDR Parameter Conditions Typical (4) Limits (4) Units (Limits) fIN = 1 MHz, VIN = −0.5 dBFS 63 fIN = 10 MHz, VIN = −0.5 dBFS 63 fIN = 33 MHz, VIN = −0.5 dBFS 62 dB fIN = 1 MHz, VIN = −0.5 dBFS 10.3 Bits fIN = 10 MHz, VIN = −0,5 dBFS 10.3 fIN = 33 MHz, VIN = −0,5 dBFS 10.1 fIN = 1 MHz, VIN = −0.5 dBFS −78 fIN = 10 MHz, VIN = −0.5 dBFS −78 fIN = 33 MHz, VIN = −0.5 dBFS −78 fIN = 1 MHz, VIN = −0.5 dBFS −84 fIN = 10 MHz, VIN = −0.5 dBFS −84 fIN = 33 MHz, VIN = −0.5 dBFS −84 fIN = 1 MHz, VIN = −0.5 dBFS −84 fIN = 10 MHz, VIN = −0.5 dBFS −84 fIN = 33 MHz, VIN = −0.5 dBFS −83 fIN = 1 MHz, VIN = −0.5 dBFS 80 fIN = 10 MHz, VIN = −0.5 dBFS 80 fIN = 33 MHz, VIN = −0.5 dBFS 74 dB Channel—Channel Offset Match ±0.03 %FS Channel—Channel Channel gain Match ±0.1 %FS 10 MHz Tested, Channel; 20 MHz Other Channel 80 dB 10 MHz Tested, Channel; 195 MHz Other Channel 63 dB Signal-to-Noise and Distortion Effective Number of Bits Total Harmonic Distortion Second Harmonic Third Harmonic Spurious Free Dynamic Range dB 62 10.0 dB (min) Bits (min) Bits dB -69.7 dB (max) dB dB −73.5 dB (max) dB dB −73.3 dB (max) dB dB 73.5 dB (min) INTER-CHANNEL CHARACTERISTICS Crosstalk 8 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: ADC11DL066 ADC11DL066 www.ti.com SNAS223C – MARCH 2004 – REVISED MARCH 2013 DC and Logic Electrical Characteristics Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V, PD = 0V, INT/EXT REF pin = 3.3V, VREF = +1.0V, fCLK = 66 MHz, fIN = 10 MHz, tr = tf = 2 ns, CL = 15 pF/pin. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C (1) (2) (3) Symbol Parameter Conditions Typical (4) Limits (4) Units (Limits) CLK, PD, OE DIGITAL INPUT CHARACTERISTICS VIN(1) Logical “1” Input Voltage VD = 3.6V 2.0 V (min) VIN(0) Logical “0” Input Voltage VD = 3.0V 1.0 V (max) IIN(1) Logical “1” Input Current VIN = 3.3V 10 µA IIN(0) Logical “0” Input Current VIN = 0V −10 µA CIN Digital Input Capacitance 5 pF D0–D11 DIGITAL OUTPUT CHARACTERISTICS VOUT(1) Logical “1” Output Voltage IOUT = −0.5 mA VOUT(0) Logical “0” Output Voltage IOUT = 1.6 mA, VDR = 3V IOZ TRI-STATE Output Current +ISC Output Short Circuit Source Current −ISC Output Short Circuit Sink Current COUT Digital Output Capacitance VDR = 2.5V 2.3 V (min) VDR = 3V 2.7 V (min) 0.4 V (max) VOUT = 2.5V or 3.3V 100 nA VOUT = 0V −100 nA VOUT = 0V −20 mA VOUT = VDR 20 mA 5 pF POWER SUPPLY CHARACTERISTICS IA Analog Supply Current PD Pin = DGND, VREF = 1.0V PD Pin = VDR 197 14 237 mA (max) mA ID Digital Supply Current PD Pin = DGND PD Pin = VDR, fCLK = 0 11 8.7 35 mA (max) mA Digital Output Supply Current PD Pin = DGND, CL = 0 pF PD Pin = VDR, fCLK = 0 (5) IDR