ADC141S625CIMMX/NOPB

PCN Number: 20140916000 PCN Date: 09/29/2014 Title: Add Cu as Alternative Wire Base Metal for Selected Device(s) Customer Contact: PCN Manager Phone: +1(214)480-6037 Dept: Quality Services Estimated Sample Date provided at st Proposed 1 Ship Date: 12/29/2014 Availability: sample request Change Type: Assembly Site Design Wafer Bump Site Assembly Process Data Sheet Wafer Bump Material Assembly Materials Part number change Wafer Bump Process Mechanical Specification Test Site Wafer Fab Site Packing/Shipping/Labeling Test Process Wafer Fab Materials Wafer Fab Process PCN Details Description of Change: Texas Instruments is pleased to announce the qualification of Cu as an additional bond wire option for devices listed in “Product affected” section below. Devices will remain in current assembly facility and there will be no other piece part changes: Pkg Wire From Wire To SOIC, SOT23, VSSOP, & TSSOP Au, 0.9 &1.0mil Cu, 0.96mil or Au, 0.9 & 1.0mil TO263 Au, 1.3 & 2.0mil Au, 1.3 & 2.0mil or Cu, 1.3 & 2.0mil Reason for Change: Continuity of supply. 1) To align with world technology trends and use wiring with enhanced mechanical and electrical properties 2) Maximize flexibility within our Assembly/Test production sites. 3) Cu is easier to obtain and stock Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative): None Changes to product identification resulting from this PCN: None Product Affected: ADC08351CIMTCE/NOPB LM25085MYX/NOPB LM5035DMH/NOPB SM72240MFE-3.08/NOPB ADC141S625CIMM/NOPB LM25101CMY/NOPB LM5035DMHX/NOPB SM72240MFE-4.63/NOPB ADC141S625CIMMX/NOPB LM25118MH/NOPB LM5035MH/NOPB SM72240MFX-3.08/NOPB DAC121S101CIMMX/NOPB LM25118MHE/NOPB LM5035MHX/NOPB SM72240MFX-4.63/NOPB EMB1402MT/NOPB LM25118MHX/NOPB LM5039MH/NOPB SM73301MF/NOPB EMB1402MTE/NOPB LM2743MTC/J7002889 LM5039MHX/NOPB SM73301MFE/NOPB EMB1402MTX/NOPB LM2743MTCX/J7002890 LM5085MM/NOPB SM73301MFX/NOPB EMB1439MA/NOPB LM317KTTR LM5085MME/NOPB SM73303MM/NOPB EMB1439MAE/NOPB LM317KTTRG3 LM5085MMX/NOPB SM73303MME/NOPB EMB1439MAX/NOPB LM337KTTR LM5085MY/NOPB SM73303MMX/NOPB EMB1485MF/NOPB LM337KTTRG3 LM5085MYE/NOPB SM73306MA/NOPB EMB1485MFE/NOPB LM3407MY/NOPB LM5085MYX/NOPB SM73306MAE/NOPB EMB1485MFX/NOPB LM3407MYX/NOPB LM5100CMY/NOPB SM73306MAX/NOPB LDC5553MM-1/NOPB LM3431AMH/NOPB LM5100CMYE/NOPB SM73403MF/NOPB Texas Instruments, Inc. PCN# 20140916000 LDC5553MME-1/NOPB LM3431AMHX/NOPB LM5100CMYX/NOPB SM73403MFE/NOPB LDC5553MMX-1/NOPB LM3431MH/NOPB LM5101CMY/NOPB SM73403MFX/NOPB LDC6994BIME/NOPB LM3431MHX/NOPB LM5101CMYE/NOPB TL2575-05IKTTR LDC6994BIMX/NOPB LM3447MT/NOPB LM5101CMYX/NOPB TL2575-05IKTTRG3 LDC963ACM3/NOPB LM3447MTE/NOPB LM5118MH/NOPB TL2575-12IKTTR LDC963ACM3E/NOPB LM3447MTX/NOPB LM5118MHX/NOPB TL2575-15IKTTR LDC963ACM3X/NOPB LM3724EM5-3.08/NOPB LM7372MR TL2575-33IKTTR LDC963BIM3/NOPB LM4050CEM3-8.2/NO LM7372MR/NOPB TL2575-ADJIKTTR LDC963BIM3E/NOPB LM5015MH/NOPB LM7372MRX TL2575-ADJIKTTRG3 LDC963BIM3X/NOPB LM5015MHE/NOPB LM7372MRX/NOPB TL2575HV-05IKTTR LDC963CIM3/NOPB LM5015MHX/NOPB LMC555IM/NOPB TL2575HV-05IKTTRG3 LDC963CIM3E/NOPB LM5021MM-1/NOPB LMC555IMX/NOPB TL2575HV-12IKTTR LDC963CIM3X/NOPB LM5021MM-1/S7003080 LMC8101MMX/NOPB TL2575HV-12IKTTRG3 LDCV963AIM5/NOPB LM5021MM-2/NOPB LME49726MY/NOPB TL2575HV-15IKTTR LDCV963AIM5E/NOPB LM5021MMX-1/NOPB LME49726MYX/NOPB TL2575HV-33IKTTR LDCV963AIM5X/NOPB LM5021MMX-2 LMP2012MM/CY TL2575HV-ADJIKTTR LHV720MA/NOPB LM5021MMX-2/NOPB LMV342MMX/MESN TL750L05CKTTR LHV720MAX/NOPB LM5027AMH/NOPB LMV602MM/NOPB TL750L05CKTTRG3 LM1971M LM5027AMHX/NOPB LMV602MMX/NOPB TL780-05CKTTR LM1971M/NOPB LM5027MH/NOPB LMV604MT/NOPB TL780-05CKTTRG3 LM1971MX LM5027MH-1/NOPB LMV604MTX/NOPB TL783CKTTR LM1971MX/NOPB LM5027MHX/NOPB LMV611MF/NOPB TL783CKTTRG3 LM25085AMM/NOPB LM5027MHX-1/NOPB LMV611MFX/NOPB TLV1117-50CKTTR LM25085AMME/NOPB LM5034MTCX/S7002252 LMV612MM/NOPB TLV1117CKTTR LM25085AMMX/NOPB LM5034MTCX/S7003093 LMV612MMX/NOPB TLV1117CKTTRG3 LM25085AMY/NOPB LM5035AMH/NOPB LMV614MT/NOPB TLV1117IKTTR LM25085AMYE/NOPB LM5035AMH-1/NOPB LMV614MTX/NOPB TLV1117IKTTRG3 LM25085AMYX/NOPB LM5035AMHX/NOPB LMV722MM/MESN UA7805CKTTR LM25085MM/NOPB LM5035AMHX-1/NOPB LMV7271MFX/HFLF UA7805CKTTRG3 LM25085MME/NOPB LM5035BMH/NOPB LMV7271MFX/NOPB UA7812CKTTR LM25085MMX/NOPB LM5035BMHX/NOPB LMV774MT/CY UA7812CKTTRG3 LM25085MY/NOPB LM5035CMH/NOPB SM72240MF-3.08/NOPB UA7815CKTTR LM25085MYE/NOPB LM5035CMHX/NOPB SM72240MF-4.63/NOPB UA7905CKTTR Texas Instruments, Inc. PCN# 20140916000 Qualification Data: Approved June, 2009 This qualification has been developed for the validation of this change. The qualification data validates that the proposed change meets the applicable released technical specifications. Qual Vehicle 1: TLE4275QKTTRQ1 (MSL3 260C) Package Construction Details Assembly Site: NFME # Pins-Designator, Family: 5-KTT, TO-263 Lead frame (Finish, Base): Cu, Matte Sn Qualification: Plan Mold Compound: R-07 Mount Compound: A-05 Bond Wire, Diameter: 2.0 mil Cu wire Test Results Sample Size/Fail Reliability Test Conditions **Temperature Cycle **High Temperature Storage **Autoclave **Biased HAST -65/150C (750 cycles) 150C (1000 hrs) 121C (96 hrs) 130C/85%RH (240 hrs) Lot 1 Lot 2 Lot 3 75/0 50/0 84/0 79/0 75/0 82/0 79/0 77/0 82/0 85/0 Note: **Preconditioning: MSL 3@260C Reference Qualification Data: Approved May, 2013 Qual Vehicle 2: LMC7101AIM5/NOPB (MSL 1-260C) Package Construction Details Assembly Site: TIEM # Pins-Designator, Family: 5-DBV, SOT Leadframe (Finish, Base): Qualification: Plan Matte Sn, Cu Test Results Reliability Test Mount Compound: 8075531 Mold Compound: 8095181 Bond Wire: 0.96 Mil Dia., Cu Sample Size / Fail Conditions **High Temp. Storage Bake **Biased HAST **Autoclave ** Temperature Cycle Note: **Preconditioning: MSL 1@260C 150C (500, 1000 Hrs) 130C/85%/33.3 psia (96 hrs), 121C (96 hrs) -65C/+150C (500 Cyc) Lot 1 77/0 77/0 77/0 77/0 Lot 2 -77/0 77/0 77/0 Lot 3 -77/0 77/0 77/0 Reference Qualification Data: Approved July, 2014 Qual Vehicle 3: LM431CCM3/NOPB (MSL1-235C) Package Construction Details Assembly Site: TIEM # Pins-Designator, Family: 3-DBV, SOT Leadframe (Finish, Base): Qualification: Plan Matte Sn, Cu Test Results Reliability Test Mount Compound: 8075531 Mold Compound: 8095181 Conditions **Autoclave 121C (96 hrs) **Temperature Cycle -65C/+150C (500 Cyc) **High Temp. Storage Bake 150C (500, 1000 Hrs) Note: **Preconditioning: MSL 1@235C Texas Instruments, Inc. Bond Wire: 0.96 Mil Dia., Cu Sample Size / Fail Lot 1 77/0 77/0 77/0 Lot 2 77/0 77/0 77/0 PCN# 20140916000 Lot 3 77/0 77/0 77/0 Reference Qualification Data: Approved April, 2004 Qual Vehicle 4: LM2594HVM-ADJ (MSL 1-235C) Assembly Site: TIEM Package Construction Details Mound Compound: # Pins-Designator, Family: 8-D, SOIC Leadframe (Finish, Base): Qualification: Plan SnPb, Cu Test Results Reliability Test Mold Compound: Bond Wire: 8075531 8095181 1.5 Mil Dia., Cu Sample Size / Fail Lot 1 Lot 2 Lot 3 77/0 77/0 77/0 77/0 77/0 77/0 Conditions **Autoclave 121C 121C, 2 ATM (96 hrs) **Temperature Cycle -65C/+150C (500 Cyc) Note: **Preconditioning: MSL 1@235C Reference Qualification Data: Approved October, 2012 Qual Vehicle 5: LMC6482AIM/NOPB (MSL 1-260C) Assembly Site: TIEM Package Construction Details Mount Compound: # Pins-Designator, Family: 8-D, SOIC Leadframe (Finish, Base): Qualification: Plan Matte Sn, Cu Test Results Mold Compound: Bond Wire: Reliability Test Conditions **Biased HAST **Autoclave 121C 130C/85%RH (96 Hrs) 121C, 2 ATM (96 hrs) 8075531 8095181 1 Mil Dia., Cu Sample Size / Fail Lot 1 Lot 2 Lot 3 77/0 77/0 77/0 77/0 77/0 77/0 77/0 77/0 **High Temperature Storage 150C (1000 hrs) **Temperature Cycle -65C/+150C (500 Cyc) Note: **Preconditioning: MSL 1@260C 77/0 77/0 -77/0 Reference Qualification Data: Approved January, 2014 Qual Vehicle 6: LMC6482IMMNOPB (MSL 1-260C) Assembly Site: TIEM Package Construction Details Mount Compound: # Pins-Designator, Family: 8-DGK, MSOP Leadframe (Finish, Base): Qualification: Plan Matte Sn, Cu Test Results Reliability Test Mold Compound: Conditions **Autoclave 121C 121C, 2 ATM (96 hrs) **Temperature Cycle -65C/+150C (500 Cyc) Note: **Preconditioning: MSL 1@260C Texas Instruments, Inc. Bond Wire: 8075531 8096859 1 Mil Dia., Cu Sample Size / Fail Lot 1 Lot 2 Lot 3 80/0 80/0 80/0 77/0 77/0 77/0 PCN# 20140916000 Reference Qualification Data: Approved May, 2013 Qual Vehicle 7: LMV852MMX/NOPB (MSL 1-260C) Assembly Site: TIEM Package Construction Details Mount Compound: # Pins-Designator, Family: 8-DGK, MSOP Leadframe (Finish, Base): Qualification: Plan Matte Sn, Cu Test Results Reliability Test Mold Compound: Bond Wire: 8075531 8096859 0.96 Mil Dia., Cu Sample Size / Fail Lot 1 Lot 2 Lot 3 80/0 80/0 80/0 77/0 77/0 77/0 Conditions **Autoclave 121C 121C, 2 ATM (96 hrs) **Temperature Cycle -65C/+150C (500 Cyc) Note: **Preconditioning: MSL 1@260C Reference Qualification Data: Approved July, 2014 Qual Vehicle 8: LMV852MM/NOPB (MSL 1-260C) Assembly Site: TIEM Package Construction Details Mount Compound: # Pins-Designator, Family: 8-DGK, MSOP Leadframe (Finish, Base): Qualification: Plan Matte Sn, Cu Test Results Reliability Test Mold Compound: Bond Wire: 8075531 4209002 0.96 Mil Dia., Cu Sample Size / Fail Lot 1 Lot 2 Lot 3 77/0 77/0 77/0 77/0 77/0 77/0 Conditions **Autoclave 121C 121C, 2 ATM (96 hrs) **Temperature Cycle -65C/+150C (500 Cyc) Note: **Preconditioning: MSL 1@260C Reference Qualification Data: Approved June, 2013 Qual Vehicle 9: LM5037MT/NOPB (MSL 1-260C) Assembly Site: TIEM Package Construction Details Mount Compound: # Pins-Designator, Family: 16-PW, TSSOP Leadframe (Finish, Base): Qualification: Plan Matte Sn, Cu Test Results Mold Compound: Reliability Test Conditions **Biased Temp. Humidity **Autoclave 121C **Temperature Cycle ** High Temperature Storage Note: **Preconditioning: MSL 1@260C 85C/85%RH (1000 hrs) 121C, 2 ATM (96 hrs) -65C/+150C (500 Cyc) 150C (1000 hrs) Texas Instruments, Inc. Bond Wire: 8075531 8095181 1.0 Mil Dia., Cu Sample Size / Fail Lot 1 Lot 2 Lot 3 77/0 77/0 77/0 77/0 77/0 77/0 77/0 77/0 77/0 77/0 77/0 77/0 PCN# 20140916000 Reference Qualification Data: Approved July, 2014 Qual Vehicle 10: LM3657MH/NOPB (MSL 1-260C) Assembly Site: TIEM Package Construction Details Mount Compound: # Pins-Designator, Family: 14-PWP, TSSOP Leadframe (Finish, Base): Qualification: Plan Matte Sn, Cu Test Results Reliability Test Mold Compound: Bond Wire: 8075531 8095181 0.96 Mil Dia., Cu Sample Size / Fail Lot 1 Lot 2 Lot 3 77/0 77/0 77/0 77/0 77/0 77/0 Conditions **Autoclave 121C 121C, 2 ATM (96 hrs) **Temperature Cycle -65C/+150C (500 Cyc) Note: **Preconditioning: MSL 1@260C Reference Qualification Data: Approved July, 2014 Qual Vehicle 11: SCANSTA111MTX (MSL 1-260C) Assembly Site: TIEM Package Construction Details Mount Compound: # Pins-Designator, Family: 48-DGG, TSSOP Leadframe (Finish, Base): Qualification: Plan Matte Sn, Cu Test Results Reliability Test Mold Compound: Bond Wire: Conditions **Autoclave 121C 121C, 2 ATM (96 hrs) **Temperature Cycle -65C/+150C (500 Cyc) Note: **Preconditioning: MSL 1@260C 8075531 8095181 0.96 Mil Dia., Cu Sample Size / Fail Lot 1 Lot 2 Lot 3 77/0 77/0 77/0 77/0 77/0 77/0 For questions regarding this notice, e-mails can be sent to the regional contacts shown below or your local Field Sales Representative. Location USA Europe Asia Pacific Japan Texas Instruments, Inc. E-Mail PCNAmericasContact@list.ti.com PCNEuropeContact@list.ti.com PCNAsiaContact@list.ti.com PCNJapanContact@list.ti.com PCN# 20140916000