ADC3224IRGZ25

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 ADC322x Dual-Channel, 12-Bit, 25-MSPS to 125-MSPS, Analog-to-Digital Converters 1 Features 3 Description • • • • • • The ADC322x are a high-linearity, ultra-low power, dual-channel, 12-bit, 25-MSPS to 125-MSPS, analogto-digital converter (ADC) family. The devices are designed specifically to support demanding, high input frequency signals with large dynamic range requirements. An input clock divider allows more flexibility for system clock architecture design and the SYSREF input enables complete system synchronization. The ADC322x family supports serial low-voltage differential signaling (LVDS) in order to reduce the number of interface lines, thus allowing for high system integration density. The serial LVDS interface is two-wire, where each ADC data are serialized and output over two LVDS pairs. An internal phase-locked loop (PLL) multiplies the incoming ADC sampling clock to derive the bit clock that is used to serialize the 12-bit output data from each channel. In addition to the serial data streams, the frame and bit clocks are also transmitted as LVDS outputs. 1 • • • • • • Dual Channel 12-Bit Resolution Single Supply: 1.8 V Serial LVDS Interface (SLVDS) Flexible Input Clock Buffer with Divide-by-1, -2, -4 SNR = 70.2 dBFS, SFDR = 87 dBc at fIN = 70 MHz Ultra-Low Power Consumption: – 116 mW/Ch at 125 MSPS Channel Isolation: 105 dB Internal Dither and Chopper Support for Multi-Chip Synchronization Pin-to-Pin Compatible with 14-Bit Version Package: VQFN-48 (7 mm × 7 mm) 2 Applications • • • • • • • • • • • Multi-Carrier, Multi-Mode Cellular Base Stations Radar and Smart Antenna Arrays Munitions Guidance Motor Control Feedback Network and Vector Analyzers Communications Test Equipment Nondestructive Testing Microwave Receivers Software-Defined Radios (SDRs) Quadrature and Diversity Radio Receivers Handheld Radio and Instrumentation Device Information(1) PART NUMBER ADC322x PACKAGE VQFN (48) BODY SIZE (NOM) 7.00 mm × 7.00 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. space space space space space space Performance at fS = 125 MSPS, fIN = 10 MHz (SNR = 70.6 dBFS, SFDR = 100 dBc) 0 -10 -20 Amplitude (dBFS) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 D201 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 7.15 7.16 7.17 7.18 1 1 1 2 4 4 6 Absolute Maximum Ratings ...................................... 6 ESD Ratings.............................................................. 6 Recommended Operating Conditions....................... 6 Thermal Information .................................................. 7 Electrical Characteristics: ADC3221, ADC3222 ....... 7 Electrical Characteristics: ADC3223, ADC3224 ....... 7 Electrical Characteristics: General ............................ 8 AC Performance: ADC3221...................................... 9 AC Performance: ADC3222.................................... 11 AC Performance: ADC3223.................................. 13 AC Performance: ADC3224.................................. 15 Digital Characteristics ........................................... 17 Timing Requirements: General ............................. 17 Timing Requirements: LVDS Output..................... 18 Typical Characteristics: ADC3221 ........................ 19 Typical Characteristics: ADC3222 ........................ 24 Typical Characteristics: ADC3223 ........................ 29 Typical Characteristics: ADC3224 ........................ 34 7.19 Typical Characteristics: Common ......................... 39 7.20 Typical Characteristics: Contour ........................... 40 8 Parametric Measurement Information ............... 41 9 Detailed Description ............................................ 43 8.1 Timing Diagrams ..................................................... 41 9.1 9.2 9.3 9.4 9.5 9.6 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ Programming........................................................... Register Maps ......................................................... 43 43 44 48 49 53 10 Applications and Implementation...................... 64 10.1 Application Information.......................................... 64 10.2 Typical Applications .............................................. 65 11 Power-Supply Recommendations ..................... 67 12 Layout................................................................... 68 12.1 Layout Guidelines ................................................. 68 12.2 Layout Example .................................................... 68 13 Device and Documentation Support ................. 69 13.1 13.2 13.3 13.4 13.5 Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 69 69 69 69 69 14 Mechanical, Packaging, and Orderable Information ........................................................... 69 4 Revision History Changes from Revision A (March 2015) to Revision B Page • Added Digital Inputs section to Digital Characteristics table ................................................................................................ 17 • Updated Figure 19, Figure 20, Figure 23, Figure 24, Figure 25 and, Figure 26 ................................................................. 22 • Updated Figure 50, Figure 53, Figure 54, Figure 55, and Figure 56 ................................................................................... 27 • Updated Figure 79, Figure 80, Figure 83, Figure 84, Figure 85, and Figure 86 ................................................................. 32 • Updated Figure 109, Figure 110, Figure 113, Figure 114, Figure 115, and Figure 116. ..................................................... 37 • Changed conditions of Figure 122 and Figure 124 ............................................................................................................. 39 • Changed Figure 129............................................................................................................................................................. 41 • Changed SNR and Clock Jitter section: changed typical thermal noise value in description of and changed Figure 137 to reflect updated thermal noise value .............................................................................................................. 45 • Changed Table 3 .................................................................................................................................................................. 46 • Changed Lane to Wire in Figure 138 .................................................................................................................................. 47 • Changed Register Map Summary table: changed FLIP BITS to FLIP WIRE in register 04h, changed bit 7 in register 70Ah, and added register 13h .............................................................................................................................................. 53 • Changed Summary of Special Mode Registers section: changed title, moved section to correct location ......................... 54 • Changed lane to wire in register 03h description ................................................................................................................ 54 • Changed register 04h: changed FLIP BITS to FLIP WIRE and changed description of bit 0.............................................. 55 • Changed register 0Ah and 0Bh descriptions........................................................................................................................ 57 • Added register 13h ............................................................................................................................................................... 58 • Changed register 70Ah to include the DIS CLK FILT register bit ........................................................................................ 63 2 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Changes from Original (July 2014) to Revision A • Page Released to Production Data.................................................................................................................................................. 1 Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 3 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 5 Device Comparison Table INTERFACE Serial LVDS JESD204B RESOLUTION (Bits) 25 MSPS 50 MSPS 80 MSPS 125 MSPS 160 MSPS 12 ADC3221 ADC3222 ADC3223 ADC3224 — 14 ADC3241 ADC3242 ADC3243 ADC3244 — 12 — ADC32J22 ADC32J23 ADC32J24 ADC32J2x5 14 — ADC32J42 ADC32J43 ADC32J44 ADC32J45 6 Pin Configuration and Functions 4 DA0M DA0P DA1M DA1P DCLKM DCLKP FCLKM FCLKP DB0M DB0P DB1M DB1P RGZ Package 48-Pin VQFN Top View 48 47 46 45 44 43 42 41 40 39 38 37 DVDD 4 33 DVDD GND 5 32 GND AVDD 6 GND Pad 31 PDN AVDD 7 (Back Side) 30 AVDD AVDD 8 29 AVDD AVDD 9 28 AVDD INAP 10 27 INBP INAM 11 26 INBM AVDD 12 25 AVDD 13 14 15 16 17 18 19 20 21 22 Submit Documentation Feedback 23 24 VCM GND SYSREFM 34 SYSREFP 3 RESET GND AVDD DVDD CLKP 35 CLKM 2 AVDD DVDD SDOUT GND SEN 36 SDATA 1 SCLK GND Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Pin Functions PIN NAME NO. I/O DESCRIPTION AVDD 6-9, 12, 17, 20, 25, 28-30 I Analog 1.8-V power supply CLKM 18 I Negative differential clock input for the ADC CLKP 19 I Positive differential clock input for the ADC DA0M 48 O Negative serial LVDS output for channel A0 DA0P 47 O Positive serial LVDS output for channel A0 DA1M 46 O Negative serial LVDS output for channel A1 DA1P 45 O Positive serial LVDS output for channel A1 DB0M 40 O Negative serial LVDS output for channel B0 DB0P 39 O Positive serial LVDS output for channel B0 DB1M 38 O Negative serial LVDS output for channel B1 DB1P 37 O Positive serial LVDS output for channel B1 DCLKM 44 O Negative bit clock output DCLKP 43 O Positive bit clock output DVDD 2, 4, 33, 35 I Digital 1.8-V power supply FCLKM 42 O Negative frame clock output FCLKP 41 O Positive frame clock output GND 1, 3, 5, 32, 34, 36, PowerPAD™ I Ground, 0 V INAM 11 I Negative differential analog input for channel A INAP 10 I Positive differential analog input for channel A INBM 26 I Negative differential analog input for channel B INBP 27 I Positive differential analog input for channel B PDN 31 I Power-down control. This pin can be configured via the SPI. This pin has an internal 150-kΩ pull-down resistor. RESET 21 I Hardware reset; active high. This pin has an internal 150-kΩ pull-down resistor. SCLK 13 I Serial interface clock input. This pin has an internal 150-kΩ pull-down resistor. SDATA 14 I Serial interface data input. This pin has an internal 150-kΩ pull-down resistor. SDOUT 16 O Serial interface data output SEN 15 I Serial interface enable; active low. This pin has an internal 150-kΩ pull-up resistor to AVDD. SYSREFM 23 I Negative external SYSREF input SYSREFP 22 I Positive external SYSREF input VCM 24 O Common-mode voltage for analog inputs Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 5 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Analog supply voltage range, AVDD –0.3 2.1 V Digital supply voltage range, DVDD V Voltage applied to input pins Temperature –0.3 2.1 INAP, INBP, INAM, INBM –0.3 min (1.9, AVDD + 0.3) CLKP, CLKM –0.3 AVDD + 0.3 SYSREFP, SYSREFM –0.3 AVDD + 0.3 SCLK, SEN, SDATA, RESET, PDN –0.3 3.9 Operating free-air, TA –40 85 Operating junction, TJ Storage, Tstg (1) V 125 –65 °C 150 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) VALUE UNIT ±2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions (1) over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT SUPPLIES AVDD Analog supply voltage range 1.7 1.8 1.9 V DVDD Digital supply voltage range 1.7 1.8 1.9 V ANALOG INPUT VID Differential input voltage VIC Input common-mode voltage For input frequencies < 450 MHz 2 For input frequencies < 600 MHz 1 VPP VCM ± 0.025 V CLOCK INPUT Input clock frequency Sampling clock frequency Sine wave, ac-coupled Input clock amplitude (differential) 15 (2) 0.2 125 (3) 1.5 LVPECL, ac-coupled 1.6 LVDS, ac-coupled 0.7 Input clock duty cycle 35% Input clock common-mode voltage MSPS 50% VPP 65% 0.95 V DIGITAL OUTPUTS CLOAD Maximum external load capacitance from each output pin to GND 3.3 pF RLOAD Differential load resistance placed externally 100 Ω (1) (2) (3) 6 To reset the device for the first time after power-up, only use the RESET pin; see the Register Initialization section. See Table 3 for details. With the clock divider enabled by default for divide-by-1. Maximum sampling clock frequency for the divide-by-4 option is 500 MSPS. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 7.4 Thermal Information ADC322x THERMAL METRIC (1) RGZ (VQFN) UNIT 48 PINS RθJA Junction-to-ambient thermal resistance 25.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 18.9 °C/W RθJB Junction-to-board thermal resistance 3.0 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.5 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.5 Electrical Characteristics: ADC3221, ADC3222 typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, maximum sampling rate, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) ADC3241 PARAMETER MIN TYP ADC clock frequency ADC3242 MAX MIN TYP 125 MAX UNIT 125 MSPS 1.8-V analog supply current 31 71 39 81 mA 1.8-V digital supply current 35 65 43 75 mA 118 205 147 245 mW 5 17 5 17 mW 78 103 78 103 mW Total power dissipation Global power-down dissipation Standby power-down dissipation 7.6 Electrical Characteristics: ADC3223, ADC3224 typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, maximum sampling rate, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) ADC3243 PARAMETER MIN TYP ADC clock frequency ADC3244 MAX MIN TYP 80 1.8-V analog supply current 1.8-V digital supply current Total power dissipation Global power-down dissipation Standby power-down dissipation Copyright © 2014–2016, Texas Instruments Incorporated 50 91 65 MAX UNIT 125 MSPS 106 mA 52 85 64 95 mA 183 285 233 325 mW 5 17 5 17 mW 72 103 78 103 mW Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 7 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 7.7 Electrical Characteristics: General typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, maximum sampling rate, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RESOLUTION Resolution 12 Bits ANALOG INPUT Differential input full-scale RIN Input resistance Differential at dc CIN Input capacitance Differential at dc VOC(VCM) VCM common-mode voltage output 2.0 VPP 6.6 kΩ 3.7 pF 0.95 VCM output current capability V 10 mA Input common-mode current Per analog input pin 1.5 µA/MSPS Analog input bandwidth (3 dB) 50-Ω differential source driving 50-Ω termination across INP and INM 540 MHz DC ACCURACY EO Offset error αEO Temperature coefficient of offset error –25 EG(REF) Gain error as a result of internal reference inaccuracy alone EG(CHAN) Gain error of channel alone α(EGCHAN) Temperature coefficient of EG(CHAN) 25 ±0.024 –2% mV mV/C 2% –2 ±0.008 %FS Δ%FS/°C CHANNEL-TO-CHANNEL ISOLATION Crosstalk (1) (1) 8 fIN = 10 MHz 105 fIN = 100 MHz 105 fIN = 200 MHz 105 fIN = 230 MHz 105 fIN = 300 MHz 105 dB Crosstalk is measured with a –1-dBFS input signal on one channel and no input on the other channel. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 7.8 AC Performance: ADC3221 typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) ADC3221 (fS = 25 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN TYP DITHER OFF MAX MIN TYP MAX UNIT DYNAMIC AC CHARACTERISTICS fIN = 10 MHz 70.9 71.2 70.8 71.1 fIN = 70 MHz 70.6 70.9 fIN = 100 MHz 70.3 70.6 fIN = 170 MHz 69.7 69.9 fIN = 230 MHz 68.8 69 fIN = 10 MHz 70.2 70.6 fIN = 20 MHz 70.2 70.5 fIN = 70 MHz 69.9 70.2 fIN = 100 MHz 69.6 69.9 fIN = 170 MHz 69.2 69.3 fIN = 230 MHz 68.2 68.4 fIN = 10 MHz –141.9 –142.2 fIN = 20 MHz –141.8 –139.5 –142.1 fIN = 70 MHz –141.6 –141.9 fIN = 100 MHz –141.3 –141.6 fIN = 170 MHz –140.7 –140.9 fIN = 230 MHz –139.8 –140.0 70.9 71.1 fIN = 20 MHz Signal-to-noise ratio (from 1-MHz offset) SNR Signal-to-noise ratio (full Nyquist band) NSD (1) Noise spectral density (averaged across Nyquist zone) 68.5 fIN = 10 MHz fIN = 20 MHz SINAD (1) Signal-to-noise and distortion ratio 70.8 71 fIN = 70 MHz 70.6 70.7 fIN = 100 MHz 70.2 70.3 fIN = 170 MHz 69.6 69.6 fIN = 230 MHz 68.5 68.5 fIN = 10 MHz 11.5 11.5 11.5 11.5 fIN = 70 MHz 11.4 11.5 fIN = 100 MHz 11.4 11.4 fIN = 170 MHz 11.3 11.3 fIN = 230 MHz 11.1 11.1 96 88 93 89 fIN = 70 MHz 93 87 fIN = 100 MHz 85 82 fIN = 170 MHz 86 83 fIN = 230 MHz 81 80 fIN = 20 MHz ENOB (1) Effective number of bits 68.1 11 fIN = 10 MHz fIN = 20 MHz SFDR (1) Spurious-free dynamic range 82 dBFS dBFS dBFS/Hz dBFS Bits dBc Reported from a 1-MHz offset. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 9 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com AC Performance: ADC3221 (continued) typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) ADC3221 (fS = 25 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN fIN = 10 MHz Second-order harmonic distortion 95 fIN = 70 MHz 101 95 fIN = 100 MHz 95 93 fIN = 170 MHz 88 87 fIN = 230 MHz 81 81 96 88 93 92 fIN = 70 MHz 93 87 fIN = 100 MHz 85 82 fIN = 170 MHz 87 83 fIN = 230 MHz 82 80 fIN = 10 MHz 99 92 fIN = 20 MHz Non HD2, HD3 Spurious-free dynamic range (excluding HD2, HD3) IMD3 10 Total harmonic distortion Two-tone, third-order intermodulation distortion Submit Documentation Feedback 82 101 91 fIN = 70 MHz 99 93 fIN = 100 MHz 98 92 fIN = 170 MHz 99 92 fIN = 230 MHz 97 93 fIN = 10 MHz 94 85 92 85 fIN = 70 MHz 91 85 fIN = 100 MHz 86 82 fIN = 170 MHz 84 81 fIN = 230 MHz 78 77 fIN1 = 45 MHz, fIN2 = 50 MHz –95 –94 fIN1 = 185 MHz, fIN2 = 190 MHz –90 –89 fIN = 20 MHz THD TYP 97 fIN = 20 MHz Third-order harmonic distortion MIN 102 82 fIN = 10 MHz HD3 DITHER OFF MAX 106 fIN = 20 MHz HD2 TYP 87 80 MAX UNIT dBc dBc dBc dBc dBFS Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 7.9 AC Performance: ADC3222 typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) ADC3222 (fS = 50 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN TYP DITHER OFF MAX MIN TYP MAX UNIT DYNAMIC AC CHARACTERISTICS fIN = 10 MHz 70.9 71.1 70.9 71.1 fIN = 70 MHz 70.7 70.9 fIN = 100 MHz 70.5 70.7 fIN = 170 MHz 70 70.1 fIN = 230 MHz 69.3 69.6 fIN = 10 MHz 70.3 70.5 fIN = 20 MHz 70.1 70.3 fIN = 70 MHz 70.1 70.3 fIN = 100 MHz 69.9 70.2 fIN = 170 MHz 69.5 69.5 fIN = 230 MHz 68.7 69 fIN = 10 MHz –144.9 –145.1 fIN = 20 MHz –144.9 –142.5 –145.1 fIN = 70 MHz –144.7 –144.9 fIN = 100 MHz –144.5 –144.7 fIN = 170 MHz –144.0 –144.1 fIN = 230 MHz –143.3 –143.6 70.8 71 fIN = 20 MHz Signal-to-noise ratio (from 1-MHz offset) SNR Signal-to-noise ratio (full Nyquist band) NSD (1) Noise spectral density (averaged across Nyquist zone) 68.5 fIN = 10 MHz fIN = 20 MHz SINAD (1) Signal-to-noise and distortion ratio 70.8 71 fIN = 70 MHz 68 70.6 70.8 fIN = 100 MHz 70.4 70.6 fIN = 170 MHz 69.8 69.9 fIN = 230 MHz 69 69.1 11.5 11.5 11.5 11.5 fIN = 70 MHz 11.4 11.5 fIN = 100 MHz 11.4 11.4 fIN = 170 MHz 11.3 11.3 fIN = 230 MHz 11.2 11.2 89 95 95 91 fIN = 70 MHz 95 93 fIN = 100 MHz 88 86 fIN = 170 MHz 85 83 fIN = 230 MHz 82 81 fIN = 10 MHz fIN = 20 MHz ENOB (1) Effective number of bits 11 fIN = 10 MHz fIN = 20 MHz SFDR (1) Spurious-free dynamic range 82 dBFS dBFS/Hz dBFS Bits dBc Reported from a 1-MHz offset. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 11 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com AC Performance: ADC3222 (continued) typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) ADC3222 (fS = 50 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN fIN = 10 MHz Second-order harmonic distortion 94 fIN = 70 MHz 97 94 fIN = 100 MHz 94 93 fIN = 170 MHz 89 89 fIN = 230 MHz 83 83 89 96 94 95 fIN = 70 MHz 95 93 fIN = 100 MHz 88 86 fIN = 170 MHz 85 83 fIN = 230 MHz 83 81 fIN = 10 MHz 99 95 fIN = 20 MHz Non HD2, HD3 Spurious-free dynamic range (excluding HD2, HD3) IMD3 12 Total harmonic distortion Two-tone, third-order intermodulation distortion Submit Documentation Feedback 82 101 93 fIN = 70 MHz 99 94 fIN = 100 MHz 100 94 fIN = 170 MHz 99 93 fIN = 230 MHz 97 93 fIN = 10 MHz 89 89 93 87 fIN = 70 MHz 92 88 fIN = 100 MHz 90 86 fIN = 170 MHz 83 81 fIN = 230 MHz 80 78 fIN1 = 45 MHz, fIN2 = 50 MHz –95 –92 fIN1 = 185 MHz, fIN2 = 190 MHz –92 –92 fIN = 20 MHz THD TYP 97 fIN = 20 MHz Third-order harmonic distortion MIN 100 82 fIN = 10 MHz HD3 DITHER OFF MAX 103 fIN = 20 MHz HD2 TYP 87 80 MAX UNIT dBc dBc dBc dBc dBFS Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 7.10 AC Performance: ADC3223 typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) ADC3223 (fS = 80 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN TYP DITHER OFF MAX MIN TYP MAX UNIT DYNAMIC AC CHARACTERISTICS fIN = 10 MHz 70.7 70.9 70.6 70.8 fIN = 100 MHz 70.5 70.7 fIN = 170 MHz 70.1 70.3 fIN = 230 MHz 69.7 69.9 fIN = 10 MHz 70.3 70.5 fIN = 70 MHz 70.2 70.5 fIN = 100 MHz 70.1 70.4 fIN = 170 MHz 69.7 69.9 fIN = 70 MHz Signal-to-noise ratio (from 1-MHz offset) SNR Signal-to-noise ratio (full Nyquist band) 68.5 fIN = 230 MHz NSD (1) Noise spectral density (averaged across Nyquist zone) 69.4 69.6 fIN = 10 MHz –146.7 –146.9 fIN = 70 MHz –146.6 –144.5 –146.8 fIN = 100 MHz –146.5 –146.7 fIN = 170 MHz –146.1 –146.3 fIN = 230 MHz –145.7 –145.9 70.7 70.9 fIN = 10 MHz fIN = 70 MHz SINAD (1) Signal-to-noise and distortion ratio 70.6 70.8 fIN = 100 MHz 70.5 70.6 fIN = 170 MHz 70 70.2 fIN = 230 MHz 69.5 69.6 fIN = 10 MHz 11.4 11.5 11.4 11.5 fIN = 100 MHz 11.4 11.4 fIN = 170 MHz 11.3 11.4 fIN = 230 MHz 11.3 11.3 88 95 fIN = 70 MHz ENOB (1) Effective number of bits 68.1 11.02 fIN = 10 MHz fIN = 70 MHz SFDR (1) Spurious-free dynamic range 94 93 fIN = 100 MHz 82 93 92 fIN = 170 MHz 88 87 fIN = 230 MHz 85 84 dBFS dBFS/Hz dBFS Bits dBc Reported from a 1-MHz offset. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 13 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com AC Performance: ADC3223 (continued) typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) ADC3223 (fS = 80 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN fIN = 10 MHz Second-order harmonic distortion Third-order harmonic distortion 94 fIN = 100 MHz 95 93 fIN = 170 MHz 88 87 fIN = 230 MHz 85 85 fIN = 10 MHz 89 95 94 94 fIN = 100 MHz 95 96 fIN = 170 MHz 93 90 fIN = 230 MHz 89 85 82 94 93 100 95 fIN = 100 MHz 99 96 fIN = 170 MHz 99 95 fIN = 230 MHz 98 95 fIN = 10 MHz 88 91 fIN = 70 MHz Spurious-free dynamic range (excluding HD2, HD3) fIN = 70 MHz THD IMD3 14 Total harmonic distortion Two-tone, third-order intermodulation distortion Submit Documentation Feedback TYP 99 82 fIN = 10 MHz Non HD2, HD3 MIN 95 fIN = 70 MHz HD3 DITHER OFF MAX 104 fIN = 70 MHz HD2 TYP 87 91 89 fIN = 100 MHz 79.5 91 88 fIN = 170 MHz 86 84 fIN = 230 MHz 83 81 fIN1 = 45 MHz, fIN2 = 50 MHz –94 –94 fIN1 = 185 MHz, fIN2 = 190 MHz –92 –90 MAX UNIT dBc dBc dBc dBc dBFS Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 7.11 AC Performance: ADC3224 typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) ADC3224 (fS = 125 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN TYP DITHER OFF MAX MIN TYP MAX UNIT DYNAMIC AC CHARACTERISTICS fIN = 10 MHz 70.5 70.8 70.4 70.7 fIN = 100 MHz 70.3 70.6 fIN = 170 MHz 69.9 70.2 fIN = 230 MHz 69.4 69.8 fIN = 10 MHz 70.3 70.6 fIN = 70 MHz 70.2 70.5 fIN = 100 MHz 70.2 70.4 fIN = 170 MHz 69.7 70.0 fIN = 70 MHz Signal-to-noise ratio (from 1-MHz offset) SNR Signal-to-noise ratio (full Nyquist band) 68.5 fIN = 230 MHz NSD (1) Noise spectral density (averaged across Nyquist zone) 69.2 69.6 fIN = 10 MHz –148.5 –148.8 fIN = 70 MHz –148.4 –146.5 –148.7 fIN = 100 MHz –148.3 –148.6 fIN = 170 MHz –147.9 –148.2 fIN = 230 MHz –147.4 –147.8 70.5 70.6 fIN = 10 MHz fIN = 70 MHz SINAD (1) Signal-to-noise and distortion ratio 70.4 70.6 fIN = 100 MHz 70.2 70.3 fIN = 170 MHz 69.7 69.9 fIN = 230 MHz 69.2 69.5 fIN = 10 MHz 11.4 11.4 11.4 11.4 fIN = 100 MHz 11.4 11.4 fIN = 170 MHz 11.3 11.3 fIN = 230 MHz 11.2 11.2 93 87 fIN = 70 MHz ENOB (1) Effective number of bits 68 11 fIN = 10 MHz fIN = 70 MHz SFDR (1) Spurious-free dynamic range 95 89 fIN = 100 MHz 82 89 86 fIN = 170 MHz 86 85 fIN = 230 MHz 83 83 dBFS dBFS/Hz dBFS Bits dBc Reported from a 1-MHz offset. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 15 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com AC Performance: ADC3224 (continued) typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) ADC3224 (fS = 125 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN fIN = 10 MHz Second-order harmonic distortion Third-order harmonic distortion 96 fIN = 100 MHz 91 91 fIN = 170 MHz 86 85 fIN = 230 MHz 83 83 fIN = 10 MHz 94 87 95 89 fIN = 100 MHz 91 86 fIN = 170 MHz 96 89 fIN = 230 MHz 88 85 99 96 99 95 fIN = 100 MHz 99 95 fIN = 170 MHz 99 92 fIN = 230 MHz 97 92 fIN = 10 MHz 91 85 fIN = 70 MHz Spurious-free dynamic range (excluding HD2, HD3) fIN = 70 MHz THD IMD3 16 Total harmonic distortion Two-tone, third-order intermodulation distortion Submit Documentation Feedback TYP 96 84 82 fIN = 10 MHz Non HD2, HD3 MIN 96 fIN = 70 MHz HD3 DITHER OFF MAX 96 fIN = 70 MHz HD2 TYP 87 91 86 fIN = 100 MHz 80 87 83 fIN = 170 MHz 85 82 fIN = 230 MHz 82 80 fIN1 = 45 MHz, fIN2 = 50 MHz –96 –95 fIN1 = 185 MHz, fIN2 = 190 MHz –92 –88 MAX UNIT dBc dBc dBc dBc dBFS Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 7.12 Digital Characteristics the dc specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level 0 or 1; AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL INPUTS (RESET, SCLK, SDATA, SEN, PDN) VIH High-level input voltage All digital inputs support 1.8-V and 3.3-V CMOS logic levels VIL Low-level input voltage All digital inputs support 1.8-V and 3.3-V CMOS logic levels IIH High-level input current Low-level input current IIL RESET, SDATA, SCLK, PDN 1.3 V 0.4 VHIGH = 1.8 V 10 VHIGH = 1.8 V 0 RESET, SDATA, SCLK, PDN VLOW = 0 V 0 SEN VLOW = 0 V 10 SEN (1) V µA µA DIGITAL INPUTS (SYSREFP, SYSREFM) VIH High-level input voltage 1.3 V VIL Low-level input voltage 0.5 V Common-mode voltage for SYSREF 0.9 V DIGITAL OUTPUTS, CMOS INTERFACE (SDOUT) VOH High-level output voltage VOL Low-level output voltage DVDD – 0.1 DVDD V 0 0.1 V DIGITAL OUTPUTS, LVDS INTERFACE VODH High-level output differential voltage With an external 100-Ω termination 280 350 460 mV VODL Low-level output differential voltage With an external 100-Ω termination –460 –350 –280 mV VOCM Output common-mode voltage (1) 1.05 V SEN has an internal 150-kΩ pull-up resistor to AVDD. SPI pins (SEN, SCLK, SDATA) can be driven by 1.8-V or 3.3-V CMOS buffers. 7.13 Timing Requirements: General typical values are at TA = 25°C, AVDD = DVDD = 1.8 V, and –1-dBFS differential input (unless otherwise noted); minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = 85°C tA Aperture delay MIN TYP MAX UNIT 1.24 1.44 1.64 ns Aperture delay matching between two channels of the same device ±70 Aperture delay variation between two devices at same temperature and supply voltage tJ Aperture jitter Wake-up time ADC latency (1) tSU_SYSREF tH_SYSREF (1) SYSREF reference time ps ±150 ps 130 fS rms Time to valid data after exiting standby power-down mode 35 65 Time to valid data after exiting global power-down mode (in this mode, both channels power down) 85 140 2-wire mode (default) 9 1-wire mode 8 Setup time for SYSREF referenced to input clock rising edge 1000 Hold time for SYSREF referenced to input clock rising edge 100 µs Clock cycles ps Overall latency = ADC latency + tPDI. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 17 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 7.14 Timing Requirements: LVDS Output typical values are at TA = 25°C, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, 6x serialization (2-wire mode), CLOAD = 3.3 pF (1), and RLOAD = 100 Ω (2) (unless otherwise noted); minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = 85°C (3) (4) MIN TYP tSU Data setup time: data valid to zero-crossing of differential output clock (CLKOUTP – CLKOUTM) (5) MAX 0.43 0.5 ns tHO Data hold time: zero-crossing of differential output clock (CLKOUTP – CLKOUTM) to data becoming invalid (5) 0.48 0.58 ns Clock propagation delay: input clock falling edge cross-over to 1-wire mode frame clock rising edge cross-over 2-wire mode (15 MSPS < sampling frequency < 125 MSPS) 2.7 4.5 tPDI tDELAY Delay time 6.5 0.44 × tS + tDELAY 3 4.5 UNIT 5.9 ns ns LVDS bit clock duty cycle: duty cycle of differential clock (CLKOUTP – CLKOUTM) 49% tFALL, tRISE Data fall time, data rise time: rise time measured from –100 mV to 100 mV, 15 MSPS ≤ Sampling frequency ≤ 125 MSPS 0.11 ns tCLKRISE, tCLKFALL Output clock rise time, output clock fall time: rise time measured from –100 mV to 100 mV, 10 MSPS ≤ Sampling frequency ≤ 125 MSPS 0.11 ns (1) (2) (3) (4) (5) CLOAD is the effective external single-ended load capacitance between each output pin and ground. RLOAD is the differential load resistance between the LVDS output pair. Measurements are done with a transmission line of a 100-Ω characteristic impedance between the device and load. Setup and hold time specifications take into account the effect of jitter on the output data and clock. Timing parameters are ensured by design and characterization and are not tested in production. Data valid refers to a logic high of 100 mV and a logic low of –100 mV. Table 1. LVDS Timing at Lower Sampling Frequencies: 6X Serialization (2-Wire Mode) SETUP TIME (tSU, ns) HOLD TIME (tHO, ns) SAMPLING FREQUENCY (MSPS) MIN TYP MIN TYP 25 2.61 3.06 2.75 3.12 40 1.69 1.9 1.8 1.98 60 1.11 1.23 1.18 1.31 80 0.81 0.89 0.88 0.97 100 0.6 0.68 0.68 0.77 MAX MAX Table 2. LVDS Timings at Lower Sampling Frequencies: 12X Serialization (1-Wire Mode) SETUP TIME (tSU, ns) SAMPLING FREQUENCY (MSPS) 18 MIN TYP 25 1.3 40 0.76 50 HOLD TIME (tHO, ns) MIN TYP 1.48 1.32 1.57 0.88 0.79 0.97 0.57 0.68 0.61 0.77 60 0.42 0.55 0.45 0.62 70 0.35 0.44 0.4 0.51 80 0.26 0.35 0.35 0.43 Submit Documentation Feedback MAX MAX Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 7.15 Typical Characteristics: ADC3221 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -60 -70 -80 -90 -100 -100 -110 -110 -120 0 2.5 5 7.5 Frequency (MHz) 10 0 12.5 2.5 D801 SFDR = 95.2 dBc, SNR = 71.2 dBFS, SINAD = 71.2 dBFS, THD = 94.1 dBc, HD2 = 106.0 dBc, HD3 = 95.2 dBc 5 7.5 Frequency (MHz) 10 12.5 D802 SFDR = 90.4 dBc, SNR = 71.6 dBFS, SINAD = 71.5 dBFS, THD = 88.6 dBc, HD2 = 90.4 dBc, HD3 = 105.5 dBc Figure 1. FFT for 10-MHz Input Signal (Dither On) Figure 2. FFT for 10-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) -50 -90 -120 -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 2.5 5 7.5 Frequency (MHz) 10 12.5 0 2.5 D803 SFDR = 91.6 dBc, SNR = 71.1 dBFS, SINAD = 71.1 dBFS, THD = 91 dBc, HD2 = 105.3 dBc, HD3 = 91.6 dBc 5 7.5 Frequency (MHz) 10 12.5 D804 SFDR = 90.6 dBc, SNR = 71.4 dBFS, SINAD = 71.3 dBFS, THD = 88.4 dBc, HD2 = 90.6 dBc, HD3 = 101.1 dBc Figure 3. FFT for 70-MHz Input Signal (Dither On) Figure 4. FFT for 70-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) -40 -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 2.5 5 7.5 Frequency (MHz) 10 12.5 D805 0 2.5 5 7.5 Frequency (MHz) 10 12.5 D806 SFDR = 86.8 dBc, SNR = 70.2 dBFS, SINAD = 70.1 dBFS, THD = 84.8 dBc, HD2 = 89.9 dBc, HD3 = 86.8 dBc SFDR = 88.2 dBc, SNR = 70.5 dBFS, SINAD = 70.4 dBFS, THD = 85.7 dBc, HD2 = 88.2 dBc, HD3 = 92.3 dBc Figure 5. FFT for 170-MHz Input Signal (Dither On) Figure 6. FFT for 170-MHz Input Signal (Dither Off) Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 19 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Typical Characteristics: ADC3221 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 2.5 5 7.5 Frequency (MHz) 10 12.5 0 2.5 D807 5 7.5 Frequency (MHz) 10 12.5 D808 SFDR = 75.3 dBc, SNR = 68.7 dBFS, SINAD = 67.7 dBFS, THD = 73.8 dBc, HD2 = 75.3 dBc, HD3 = 79.8 dBc Figure 7. FFT for 270-MHz Input Signal (Dither On) Figure 8. FFT for 270-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) SFDR = 75.7 dBc, SNR = 68.6 dBFS, SINAD = 67.8 dBFS, THD = 74.9 dBc, HD2 = 75.7 dBc, HD3 = 82.8 dBc -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 2.5 5 7.5 Frequency (MHz) 10 12.5 0 2.5 D809 5 7.5 Frequency (MHz) 10 12.5 D810 SFDR = 68.2 dBc, SNR = 66.5 dBFS, SINAD = 66.5 dBFS, THD = 87.1 dBc, HD2 = 68.2 dBc, HD3 = 92.7 dBc Figure 9. FFT for 450-MHz Input Signal (Dither On) Figure 10. FFT for 450-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) SFDR = 68.2 dBc, SNR = 66.6 dBFS, SINAD = 66.6 dBFS, THD = 92.7 dBc, HD2 = 68.2 dBc, HD3 = 87.8 dBc -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 2.5 5 7.5 Frequency (MHz) 10 fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 84 dBFS, each tone at –7 dBFS Figure 11. FFT for Two-Tone Input Signal (–7 dBFS at 46 MHz and 50 MHz) 20 -40 Submit Documentation Feedback 12.5 D811 0 2.5 5 7.5 Frequency (MHz) 10 12.5 D812 fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 105 dBFS, each tone at –36 dBFS Figure 12. FFT for Two-Tone Input Signal (–36 dBFS at 46 MHz and 50 MHz) Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Typical Characteristics: ADC3221 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 2.5 5 7.5 Frequency (MHz) 10 12.5 0 2.5 fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 91 dBFS, each tone at –7 dBFS 10 12.5 D814 fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 105 dBFS, each tone at –36 dBFS Figure 13. FFT for Two-Tone Input Signal (–7 dBFS at 185 MHz and 190 MHz) Figure 14. FFT for Two-Tone Input Signal (–36 dBFS at 185 MHz and 190 MHz) -85 -85 -90 -90 Two-Tone IMD (dBFS) Two-Tone IMD (dBFS) 5 7.5 Frequency (MHz) D813 -95 -100 -105 -95 -100 -105 -110 -35 -31 -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -110 -35 -7 -31 D815 Figure 15. Intermodulation Distortion vs Input Amplitude (46 MHz and 50 MHz) -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -7 D816 Figure 16. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) 100 72.5 Dither_EN Dither_DIS 71.5 Dither_EN Dither_DIS 95 SFDR (dBc) SNR (dBFS) 90 70.5 69.5 68.5 85 80 75 70 67.5 65 60 66.5 0 50 100 150 200 250 300 Input Frequency (MHz) 350 400 D817 Figure 17. Signal-to-Noise Ratio vs Input Frequency Copyright © 2014–2016, Texas Instruments Incorporated 0 50 100 150 200 250 300 Input Frequency (MHz) 350 400 D818 Figure 18. Spurious-Free Dynamic Range vs Input Frequency Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 21 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Typical Characteristics: ADC3221 (continued) 71.5 200 71 160 70.5 120 70 80 69.5 40 -50 -40 -30 Amplitude (dBFS) -20 -10 71 150 70 100 69 50 68 -70 0 -60 72 250 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 200 0 0 -60 -50 D819 Figure 19. Performance vs Input Amplitude (30 MHz) 78 -40 -30 Amplitude (dBFS) -20 -10 D820 Figure 20. Performance vs Input Amplitude (170 MHz) 105 76 88 76 100 74 95 72 90 70 85 0.9 0.95 1 1.05 Input Common-Mode Voltage (V) SNR (dBFS) SNR SFDR SFDR (dBc) SNR (dBFS) SNR SFDR 68 0.85 80 1.1 74 86 72 84 70 82 68 80 66 0.85 D821 Figure 21. Performance vs Input Common-Mode Voltage (30 MHz) 0.9 0.95 1 1.05 Input Common-Mode Voltage (V) 78 1.1 D822 Figure 22. Performance vs Input Common-Mode Voltage (170 MHz) 102 72 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 100 AVDD = 1.85 V AVDD = 1.9 V AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 71.6 98 SNR (dBFS) SFDR (dBc) 0 SFDR (dBc) 69 -70 SNR (dBFS) 72 SNR (dBFS) 73 280 SNR (dBFS) SFDR (dBc) 240 SFDR (dBFS) SFDR (dBc,dBFS) 72.5 SFDR (dBc,dBFS) typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) 96 AVDD = 1.85 V AVDD = 1.9 V 71.2 70.8 94 70.4 92 90 -40 -15 10 35 Temperature (°C) 60 85 D823 Figure 23. Spurious-Free Dynamic Range vs AVDD Supply and Temperature (30 MHz) 22 Submit Documentation Feedback 70 -40 -15 10 35 Temperature (°C) 60 85 D824 Figure 24. Signal-to-Noise Ratio vs AVDD Supply and Temperature (30 MHz) Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Typical Characteristics: ADC3221 (continued) typical values are at TA = 25°C, ADC sampling rate = 25 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) 72 99 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V 98 71.6 SNR (dBFS) 97 SFDR (dBc) DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V DVDD = 1.9 V 96 DVDD = 1.85 V DVDD = 1.9 V 71.2 70.8 95 70.4 94 10 35 Temperature (°C) 60 70 -40 85 Figure 25. Spurious-Free Dynamic Range vs DVDD Supply and Temperature (30 MHz) 75 76 85 D826 74 96 SNR SFDR 92 72 88 72 92.5 70 84 71 90 68 80 70 87.5 66 76 69 85 64 72 68 82.5 62 68 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Differential Clock Amplitude (Vpp) 2 SNR (dBFS) 95 SFDR (dBc) SNR (dBFS) 60 73 67 0.2 80 2.2 60 0.2 71.5 96 70.9 94 70.7 92 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 90 70 D829 Figure 29. Performance vs Clock Duty Cycle (30 MHz) Copyright © 2014–2016, Texas Instruments Incorporated SNR (dBFS) 71.1 64 2.2 D828 90 SNR SFDR 70.4 SFDR (dBc) 98 2 70.6 100 71.3 0.6 0.8 1 1.2 1.4 1.6 1.8 Differential Clock Amplitude (Vpp) Figure 28. Performance vs Differential Clock Amplitude (150 MHz) SNR SFDR 70.5 30 0.4 D827 Figure 27. Performance vs Differential Clock Amplitude (40 MHz) SNR (dBFS) 10 35 Temperature (°C) Figure 26. Signal-to-Noise Ratio vs DVDD Supply and Temperature (30 MHz) 100 SNR SFDR 97.5 74 -15 D825 SFDR (dBc) -15 88 70.2 86 70 84 69.8 82 69.6 80 69.4 30 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 SFDR (dBc) 93 -40 78 70 D830 Figure 30. Performance vs Clock Duty Cycle (150 MHz) Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 23 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 7.16 Typical Characteristics: ADC3222 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -70 -80 -90 -100 -110 -110 -120 5 10 15 Frequency (MHz) 20 0 25 5 D601 SFDR = 88.5 dBc, SFDR = 99.8 dBc (non 23), SNR = 71.1 dBFS, SINAD = 71 dBFS, THD = 88.1 dBc, HD2 = 109.9 dBc, HD3 = 88.5 dBc -10 -20 -20 -30 -30 Amplitude (dBFS) 0 -10 -50 -60 -70 -80 20 25 D602 Figure 32. FFT for 10-MHz Input Signal (Dither Off) 0 -40 10 15 Frequency (MHz) SFDR = 84.6 dBc, SFDR = 96.1 dBc (non 23), SNR = 71.4 dBFS, SINAD = 71.1 dBFS, THD = 83.2 dBc, HD2 = 91.6 dBc, HD3 = 84.6 dBc Figure 31. FFT for 10-MHz Input Signal (Dither On) Amplitude (dBFS) -60 -100 0 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 5 10 15 Frequency (MHz) 20 25 0 5 D603 SFDR = 101.6 dBc, SFDR = 100.3 dBc (non 23), SNR = 70.9 dBFS, SINAD = 70.9 dBFS, THD = 98.1 dBc, HD2 = 106.6 dBc, HD3 = 101.6 dBc -10 -20 -20 -30 -30 Amplitude (dBFS) 0 -10 -50 -60 -70 -80 25 D604 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 20 Figure 34. FFT for 70-MHz Input Signal (Dither Off) 0 -40 10 15 Frequency (MHz) SFDR = 90.2 dBc, SFDR = 94.7 dBc (non 23), SNR = 71.2 dBFS, SINAD = 71.1 dBFS, THD = 86.7 dBc, HD2 = 90.6 dBc, HD3 = 90.2 dBc Figure 33. FFT for 70-MHz Input Signal (Dither On) Amplitude (dBFS) -50 -90 -120 -120 0 5 10 15 Frequency (MHz) 20 25 D605 SFDR = 85.9 dBc, SFDR = 99.1 dBc (non 23), SNR = 70.4 dBFS, SINAD = 70.2 dBFS, THD = 84.8 dBc, HD2 = 92.7 dBc, HD3 = 85.9 dBc Figure 35. FFT for 170-MHz Input Signal (Dither On) 24 -40 Submit Documentation Feedback 0 5 10 15 Frequency (MHz) 20 25 D606 SFDR = 89.3 dBc, SFDR = 93 dBc (non 23), SNR = 70.7 dBFS, SINAD = 70.6 dBFS, THD = 85.8 dBc, HD2 = 89.3 dBc, HD3 = 111.9 dBc Figure 36. FFT for 170-MHz Input Signal (Dither Off) Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Typical Characteristics: ADC3222 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 5 10 15 Frequency (MHz) 20 25 0 5 D607 SFDR = 74.7 dBc, SFDR = 95.2 dBc (non 23), SNR = 69.2 dBFS, SINAD = 68.1 dBFS, THD = 73.7 dBc, HD2 = 74.7 dBc, HD3 = 80.9 dBc -10 -20 -20 -30 -30 Amplitude (dBFS) 0 -10 -50 -60 -70 -80 20 25 D608 Figure 38. FFT for 270-MHz Input Signal (Dither Off) 0 -40 10 15 Frequency (MHz) SFDR = 74.5 dBc, SFDR = 91.1 dBc (non 23), SNR = 69.4 dBFS, SINAD = 68.1 dBFS, THD = 72.9 dBc, HD2 = 74.5 dBc, HD3 = 78.2 dBc Figure 37. FFT for 270-MHz Input Signal (Dither On) Amplitude (dBFS) -40 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 5 10 15 Frequency (MHz) 20 25 0 5 D609 10 15 Frequency (MHz) 20 25 D610 SFDR = 68.1 dBc, SNR = 67.7 dBFS, SINAD = 67.6 dBFS, THD = 86.6 dBc, HD2 = 68.1 dBc, HD3 = 87.3 dBc Figure 39. FFT for 450-MHz Input Signal (Dither On) Figure 40. FFT for 450-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) SFDR = 68.2 dBc, SNR = 67.4 dBFS, SINAD = 67.3 dBFS, THD = 86.4 dBc, HD2 = 68.2 dBc, HD3 = 87.3 dBc -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 5 10 15 Frequency (MHz) 20 25 D611 0 5 10 15 Frequency (MHz) 20 fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 85.4 dBFS, each tone at –7 dBFS fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 103 dBFS, each tone at –36 dBFS Figure 41. FFT for Two-Tone Input Signal (–7 dBFS at 46 MHz and 50 MHz) Figure 42. FFT for Two-Tone Input Signal (–36 dBFS at 46 MHz and 50 MHz) Copyright © 2014–2016, Texas Instruments Incorporated 25 D612 Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 25 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Typical Characteristics: ADC3222 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 5 10 15 Frequency (MHz) 20 25 0 5 fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 95 dBFS, each tone at –7 dBFS -80 -80 -85 -85 Two-Tone IMD (dBFS) Two-Tone IMD (dBFS) 25 D614 Figure 44. FFT for Two-Tone Input Signal (–36 dBFS at 185 MHz and 190 MHz) -90 -95 -100 -105 -90 -95 -100 -105 -31 -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -110 -35 -7 -31 D615 Figure 45. Intermodulation Distortion vs Input Amplitude (46 MHz and 50 MHz) -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -7 D616 Figure 46. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) 100 72 Dither_EN Dither_DIS Dither_EN Dither_DIS 95 71 90 SFDR (dBc) SNR (dBFS) 20 fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 105 dBFS, each tone at –36 dBFS Figure 43. FFT for Two-Tone Input Signal (–7 dBFS at 185 MHz and 190 MHz) -110 -35 10 15 Frequency (MHz) D613 70 69 85 80 75 70 68 65 60 67 0 50 100 150 200 250 300 Input Frequency (MHz) 350 400 D617 Figure 47. Signal-to-Noise Ratio vs Input Frequency 26 Submit Documentation Feedback 0 50 100 150 200 250 300 Input Frequency (MHz) 350 400 D618 Figure 48. Spurious-Free Dynamic Range vs Input Frequency Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Typical Characteristics: ADC3222 (continued) 71 160 70.5 120 70 80 69.5 40 71.5 240 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 200 71 160 70.5 120 70 80 69.5 40 0 -60 -50 -40 -30 -20 Input Amplitude (dBFS) -10 69 -70 0 0 -60 -50 D619 Figure 49. Performance vs Input Amplitude (30 MHz) 78 -40 -30 Amplitude (dBFS) -20 -10 D620 Figure 50. Performance vs Input Amplitude (170 MHz) 94 76 88 76 92 74 90 72 88 70 86 0.9 0.95 1 1.05 Input Common-Mode Voltage (V) SNR (dBFS) SNR SFDR SFDR (dBc) SNR (dBFS) SNR SFDR 68 0.85 0 84 1.1 74 86 72 84 70 82 68 80 66 0.85 D621 Figure 51. Performance vs Input Common-Mode Voltage (30 MHz) 0.9 0.95 1 1.05 Input Common-Mode Voltage (V) SFDR (dBc) 69 -70 72 SNR (dBFS) 71.5 240 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 200 SFDR (dBc,dBFS) SNR (dBFS) 72 SFDR (dBc,dBFS) typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) 78 1.1 D622 Figure 52. Performance vs Input Common-Mode Voltage (170 MHz) 72 96 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 94 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V 71.6 AVDD = 1.85 V AVDD = 1.9 V 90 SNR (dBFS) SFDR (dBc) 92 88 86 71.2 70.8 84 70.4 82 80 -40 -15 10 35 Temperature (°C) 60 85 D623 Figure 53. Spurious-Free Dynamic Range vs AVDD Supply and Temperature (30 MHz) Copyright © 2014–2016, Texas Instruments Incorporated 70 -40 -15 10 35 Temperature (°C) 60 85 D624 Figure 54. Signal-to-Noise Ratio vs AVDD Supply and Temperature (30 MHz) Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 27 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Typical Characteristics: ADC3222 (continued) typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) 72 92 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V 71.6 90 SNR (dBFS) SFDR (dBc) 91 DVDD = 1.85 V DVDD = 1.9 V 89 DVDD = 1.85 V DVDD = 1.9 V 71.2 70.8 88 70.4 87 10 35 Temperature (°C) 60 70 -40 85 Figure 55. Spurious-Free Dynamic Range vs DVDD Supply and Temperature (30 MHz) 71 86 69 84 67 82 65 80 63 78 61 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Differential Clock Amplitude (Vpp) 2 77 SNR (dBFS) 73 90 SNR SFDR 88 76 2.2 86 71 84 69 82 67 80 65 78 63 76 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Differential Clock Amplitude (Vpp) 90 70.7 88 70.5 86 84 70 D629 Submit Documentation Feedback SNR (dBFS) 70.9 Figure 59. Performance vs Clock Duty Cycle (30 MHz) 28 D628 70.6 SFDR (dBc) SNR (dBFS) 92 65 74 2.2 90 SNR SFDR 71.1 45 50 55 60 Input Clock Duty Cycle (%) 2 Figure 58. Performance vs Differential Clock Amplitude (150 MHz) 94 40 D626 73 SNR SFDR 35 85 90 SNR SFDR 88 61 0.2 Figure 57. Performance vs Differential Clock Amplitude (40 MHz) 70.3 30 60 75 D627 71.3 10 35 Temperature (°C) Figure 56. Signal-to-Noise Ratio vs DVDD Supply and Temperature (30 MHz) SFDR (dBc) SNR (dBFS) 75 -15 D625 SFDR (dBc) -15 70.4 88 70.2 86 70 84 69.8 82 69.6 30 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 SFDR (dBc) 86 -40 80 70 D630 Figure 60. Performance vs Clock Duty Cycle (150 MHz) Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 7.17 Typical Characteristics: ADC3223 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 8 16 24 Frequency (MHz) 32 0 40 8 D401 16 24 Frequency (MHz) 32 40 D402 SFDR = 83.9 dBc, SNR = 71.1 dBFS, SINAD = 70.9 dBFS, THD = 82.6 dBc, HD2 = 91.8 dBc, HD3 = 83.9 dBc Figure 61. FFT for 10-MHz Input Signal (Dither On) Figure 62. FFT for 10-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) SFDR = 88.9 dBc, SNR = 70.9 dBFS, SINAD = 70.8 dBFS, THD = 88.6 dBc, HD2 = 108.1 dBc, HD3 = 88.9 dBc -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 8 16 24 Frequency (MHz) 32 40 0 8 D403 16 24 Frequency (MHz) 32 40 D404 SFDR = 85.5 dBc, SNR = 71.1 dBFS, SINAD = 70.9 dBFS, THD = 83.8 dBc, HD2 = 91.9 dBc, HD3 = 85.5 dBc Figure 63. FFT for 70-MHz Input Signal (Dither On) Figure 64. FFT for 70-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) SFDR = 91.6 dBc, SNR = 70.8 dBFS, SINAD = 70.8 dBFS, THD = 91 dBc, HD2 = 112.2 dBc, HD3 = 91.6 dBc -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 8 16 24 Frequency (MHz) 32 40 D405 0 8 16 24 Frequency (MHz) 32 40 D406 SFDR = 95.8 dBc, SNR = 70.4 dBFS, SINAD = 70.3 dBFS, THD = 92.9 dBc, HD2 = 102.1 dBc, HD3 = 95.8 dBc SFDR = 91.0 dBc, SNR = 70.7 dBFS, SINAD = 70.6 dBFS, THD = 88 dBc, HD2 = 91.0 dBc, HD3 = 97.2 dBc Figure 65. FFT for 170-MHz Input Signal (Dither On) Figure 66. FFT for 170-MHz Input Signal (Dither Off) Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 29 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Typical Characteristics: ADC3223 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 8 16 24 Frequency (MHz) 32 40 0 8 D407 16 24 Frequency (MHz) 32 40 D408 SFDR = 75.6 dBc, SNR = 69.7 dBFS, SINAD = 68.6 dBFS, THD = 74.5 dBc, HD2 = 75.6 dBc, HD3 = 81.6 dBc Figure 67. FFT for 270-MHz Input Signal (Dither On) Figure 68. FFT for 270-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) SFDR = 75.8 dBc, SNR = 69.4 dBFS, SINAD = 68.5 dBFS, THD = 74.6 dBc, HD2 = 75.8 dBc, HD3 = 80.9 dBc -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 8 16 24 Frequency (MHz) 32 40 0 8 D409 16 24 Frequency (MHz) 32 40 D410 SFDR = 78.4 dBc, SNR = 67.9 dBFS, SINAD = 67.5 dBFS, THD = 77 dBc, HD2 = 78.4 dBc, HD3 = 84.3 dBc Figure 69. FFT for 450-MHz Input Signal (Dither On) Figure 70. FFT for 450-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) SFDR = 77.7 dBc, SNR = 67.7 dBFS, SINAD = 67.3 dBFS, THD = 77.2 dBc, HD2 = 77.7 dBc, HD3 = 89.0 dBc -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 30 -40 8 16 24 Frequency (MHz) 32 40 D411 0 8 16 24 Frequency (MHz) 32 fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 87.5 dBFS, each tone at –7 dBFS fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 105 dBFS, each tone at –36 dBFS Figure 71. FFT for Two-Tone Input Signal (–7 dBFS at 46 MHz and 50 MHz) Figure 72. FFT for Two-Tone Input Signal (–36 dBFS at 46 MHz and 50 MHz) Submit Documentation Feedback 40 D412 Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Typical Characteristics: ADC3223 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -60 -70 -80 -90 -100 -100 -110 -110 -120 0 8 16 24 Frequency (MHz) 32 40 0 8 16 24 Frequency (MHz) D413 32 40 D414 fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 89 dBFS, each tone at –7 dBFS fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 105 dBFS, each tone at –36 dBFS Figure 73. FFT FOR Two-Tone Input Signal (–7 dBFS at 185 MHz and 190 MHz) Figure 74. FFT FOR Two-Tone Input Signal (–36 dBFS at 185 MHz and 190 MHz) -80 -85 -85 Two-Tone IMD (dBFS) -90 Two-Tone IMD (dBFS) -50 -90 -120 -95 -100 -105 -110 -35 -90 -95 -100 -105 -31 -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -110 -35 -7 -31 D415 Figure 75. Intermodulation Distortion vs Input Amplitude (46 MHz and 50 MHz) -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -7 D416 Figure 76. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) 100 72 Dither_EN Dither_DIS Dither_EN Dither_DIS 95 SFDR (dBc) 71 SNR (dBFS) -40 70 69 90 85 80 68 75 70 67 0 50 100 150 200 250 300 Input Frequency (MHz) 350 400 D417 Figure 77. Signal-to-Noise Ratio vs Input Frequency Copyright © 2014–2016, Texas Instruments Incorporated 0 50 100 150 200 250 300 Input Frequency (MHz) 350 400 D418 Figure 78. Spurious-Free Dynamic Range vs Input Frequency Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 31 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Typical Characteristics: ADC3223 (continued) 71 160 70.5 120 70 80 69.5 40 71 180 SNR (dBFS) SFDR (dBc) 160 SFDR (dBFS) 140 70.5 120 70 100 71.5 69.5 80 69 60 68.5 40 0 -60 -50 -40 -30 Amplitude (dBFS) -20 -10 68 -70 0 20 -60 -50 D419 Figure 79. Performance vs Input Amplitude (30 MHz) 76 -40 -30 Amplitude (dBFS) -20 -10 D421 D420 Figure 80. Performance vs Input Amplitude (170 MHz) 92 76 92 74 90 72 88 70 86 68 84 0.9 0.95 1 1.05 Input Common-Mode Voltage (V) SNR (dBFS) SNR SFDR SFDR (dBc) SNR (dBFS) SNR (dBFS) SFDR (dBc) 66 0.85 82 1.1 72 88 70 86 68 84 0.9 0.95 1 1.05 Input Common-Mode Voltage (V) 82 1.1 D422 D420 D421 71 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 70.6 SNR (dBFS) 93 SFDR (dBc) 90 Figure 82. Performance vs Input Common-Mode Voltage (170 MHz) 95 91 89 87 AVDD = 1.85 V AVDD = 1.9 V 70.2 69.8 69.4 -15 10 35 Temperature (°C) 60 85 D423 Figure 83. Spurious-Free Dynamic Range vs AVDD Supply and Temperature (170 MHz) 32 74 66 0.85 Figure 81. Performance vs Input Common-Mode Voltage (30 MHz) 85 -40 0 SFDR (dBc) 69 -70 72 SNR (dBFS) 71.5 240 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 200 SFDR (dBc,dBFS) SNR (dBFS) 72 SFDR (dBc,dBFS) typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) Submit Documentation Feedback 69 -40 -15 10 35 Temperature (°C) 60 85 D424 Figure 84. Signal-to-Noise Ratio vs AVDD Supply and Temperature (170 MHz) Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Typical Characteristics: ADC3223 (continued) typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) 71 95 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V 70.6 SNR (dBFS) 91 89 70.2 69.8 69.4 87 -15 10 35 Temperature (°C) 60 69 -40 85 Figure 85. Spurious-Free Dynamic Range vs DVDD Supply and Temperature (170 MHz) 72.5 99 70.5 98 70 97 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Differential Clock Amplitude (Vpp) 2 SNR (dBFS) 71 93 90 70 87 68 84 66 81 0.4 D427 Figure 87. Performance vs Differential Clock Amplitude (40 MHz) 0.6 0.8 1 1.2 1.4 1.6 1.8 Differential Clock Amplitude (Vpp) 92 88 70.7 86 70.5 84 65 82 70 D429 Figure 89. Performance vs Clock Duty Cycle (30 MHz) Copyright © 2014–2016, Texas Instruments Incorporated SNR (dBFS) 70.9 45 50 55 60 Input Clock Duty Cycle (%) D428 70.8 SFDR (dBc) SNR (dBFS) 90 40 78 2.2 92 SNR SFDR 71.1 35 2 Figure 88. Performance vs Differential Clock Amplitude (150 MHz) SNR SFDR 70.3 30 D426 72 64 0.2 96 2.2 71.3 85 SNR SFDR SFDR (dBc) SNR (dBFS) 100 60 74 101 71.5 10 35 Temperature (°C) Figure 86. Signal-to-Noise Ratio vs DVDD Supply and Temperature (170 MHz) 102 SNR SFDR 72 -15 D425 SFDR (dBc) 85 -40 69.5 0.2 DVDD = 1.85 V DVDD = 1.9 V 70.6 90 70.4 88 70.2 86 70 84 69.8 30 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 SFDR (dBc) SFDR (dBc) 93 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V DVDD = 1.9 V 82 70 D430 Figure 90. Performance vs Clock Duty Cycle (150 MHz) Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 33 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 7.18 Typical Characteristics: ADC3224 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 0 62.5 SFDR = 101.1 dBc, SNR = 70.6 dBFS, SINAD = 70.6 dBFS, THD = 97.6 dBc, HD2 = 107.0 dBc, HD3 = 106.0 dBc 50 62.5 D202 Figure 92. FFT for 10-MHz Input Signal (Chopper On, Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) 25 37.5 Frequency (MHz) SFDR = 90.6 dBc, SNR = 70.9 dBFS, SINAD = 70.8 dBFS, THD = 86 dBc, HD2 = 91.8 dBc, HD3 = 90.6 dBc Figure 91. FFT for 10 MHz Input Signal (Chopper On, Dither On) -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 0 12.5 D203 25 37.5 Frequency (MHz) 50 62.5 D204 SFDR = 91.1 dBc, SNR = 70.8 dBFS, SINAD = 70.8 dBFS, THD = 86.8 dBc, HD2 = 91.1 dBc, HD3 = 95.1 dBc Figure 93. FFT for 70-MHz Input Signal (Dither On) Figure 94. FFT for 70-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) SFDR = 99.2 dBc, SNR = 70.5 dBFS, SINAD = 70.5 dBFS, THD = 94.8 dBc, HD2 = 102.9 dBc, HD3 = 99.2 dBc -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 34 12.5 D201 12.5 25 37.5 Frequency (MHz) 50 62.5 D205 0 12.5 25 37.5 Frequency (MHz) 50 62.5 D206 SFDR = 93.6 dBc, SNR = 70.0 dBFS, SINAD = 70.0 dBFS, THD = 91.4 dBc, HD2 = 93.6 dBc, HD3 = 101.3 dBc SFDR = 90.6 dBc, SNR = 70.5 dBFS, SINAD = 70.4 dBFS, THD = 87.8 dBc, HD2 = 98.6 dBc, HD3 = 90.6 dBc Figure 95. FFT for 170-MHz Input Signal (Dither On) Figure 96. FFT for 170 MHz Input Signal (Dither Off) Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Typical Characteristics: ADC3224 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 0 12.5 D207 25 37.5 Frequency (MHz) 50 62.5 D208 SFDR = 76.1 dBc, SNR = 69.7 dBFS, SINAD = 68.8 dBFS, THD = 74.9 dBc, HD2 = 76.1 dBc, HD3 = 81.5 dBc Figure 97. FFT for 270-MHz Input Signal (Dither On) Figure 98. FFT for 270-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) SFDR = 76.2 dBc, SNR = 69.4 dBFS, SINAD = 68.6 dBFS, THD = 74.9 dBc, HD2 = 76.2 dBc, HD3 = 81.2 dBc -40 -50 -60 -70 -80 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 0 12.5 D209 SFDR = 75.5 dBc, SNR = 67.4 dBFS, SINAD = 66.7 dBFS, THD = 73.8 dBc, HD2 = 75.5 dBc, HD3 = 78.7 dBc -10 -20 -20 -30 -30 Amplitude (dBFS) 0 -10 -50 -60 -70 -80 50 62.5 D210 Figure 100. FFT for 450-MHz Input Signal (Dither Off) 0 -40 25 37.5 Frequency (MHz) SFDR = 75.2 dBc, SNR = 68 dBFS, SINAD = 67.0 dBFS, THD = 72.5 dBc, HD2 = 76.5 dBc, HD3 = 75.2 dBc Figure 99. FFT for 450-MHz Input Signal (Dither On) Amplitude (dBFS) -40 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 88 dBFS, each tone at –7 dBFS Figure 101. FFT for Two-Tone Input Signal (–7 dBFS at 46 MHz and 50 MHz) Copyright © 2014–2016, Texas Instruments Incorporated D211 0 12.5 25 37.5 Frequency (MHz) 50 62.5 D212 fIN1 = 46 MHz, fIN2 = 50 MHz, IMD3 = 105 dBFS, each tone at –36 dBFS Figure 102. FFT for Two-Tone Input Signal (–36 dBFS at 46 MHz and 50 MHz) Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 35 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Typical Characteristics: ADC3224 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 0 fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 87.5 dBFS, each tone at –7 dBFS -80 -85 -85 Two-Tone IMD (dBFS) Two-Tone IMD (dBFS) -80 -90 -95 -100 62.5 D214 -90 -95 -100 -105 -31 -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -110 -35 -7 -31 D215 Figure 105. Intermodulation Distortion vs Input Amplitude (46 MHz and 50 MHz) -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -7 D216 Figure 106. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) 100 72 Dither_EN Dither_DIS Dither_EN Dither_DIS 95 SFDR (dBc) 71 SNR (dBFS) 50 Figure 104. FFT for Two-Tone Input Signal (–36 dBFS at 185 MHz and 190 MHz) -105 70 69 90 85 80 68 75 70 67 0 50 100 150 200 250 300 Input Frequency (MHz) 350 400 D217 Figure 107. Signal-to-Noise Ratio vs Input Frequency 36 25 37.5 Frequency (MHz) fIN1 = 185 MHz, fIN2 = 190 MHz, IMD3 = 96.5 dBFS, each tone at –36 dBFS Figure 103. FFT for Two-Tone Input Signal (–7 dBFS at 185 MHz and 190 MHz) -110 -35 12.5 D213 Submit Documentation Feedback 0 50 100 150 200 250 300 Input Frequency (MHz) 350 400 D218 Figure 108. Spurious-Free Dynamic Range vs Input Frequency Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Typical Characteristics: ADC3224 (continued) 71 160 70.5 120 70 80 69.5 40 71 180 SNR (dBFS) SFDR (dBc) 160 SFDR (dBFS) 140 70.5 120 70 100 71.5 69.5 80 69 60 68.5 40 0 -60 -50 -40 -30 Amplitude (dBFS) -20 -10 68 -70 0 20 -60 -50 D219 Figure 109. Performance vs Input Amplitude (30 MHz) 76 -40 -30 Amplitude (dBFS) 92 70 90 68 88 SNR (dBFS) 72 SFDR (dBc) SNR (dBFS) 94 92 74 90 72 88 70 86 68 84 66 0.85 86 1.1 D221 Figure 111. Performance vs Input Common-Mode Voltage (30 MHz) 0.9 0.95 1 1.05 Input Common-Mode Voltage (V) 82 1.1 D001 D222 Figure 112. Performance vs Input Common-Mode Voltage (170 MHz) 92 72 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 71.2 SFDR (dBc) 90 SFDR (dBc) D220 SNR (dBFS) SFDR (dBc) 74 0.95 1 1.05 Input Common-Mode Voltage (V) 0 Figure 110. Performance vs Input Amplitude (170 MHz) SNR SFDR 0.9 -10 76 96 66 0.85 -20 SFDR (dBc) 69 -70 72 SNR (dBFS) 71.5 240 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 200 SFDR (dBc,dBFS) SNR (dBFS) 72 SFDR (dBc,dBFS) typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) 88 86 84 AVDD = 1.85 V AVDD = 1.9 V 70.4 69.6 68.8 82 -40 -15 10 35 Temperature (°C) 60 85 D223 Figure 113. Spurious-Free Dynamic Range vs AVDD Supply and Temperature (170 MHz) Copyright © 2014–2016, Texas Instruments Incorporated 68 -40 -15 10 35 Temperature (°C) 60 85 D224 Figure 114. Signal-to-Noise Ratio vs AVDD Supply and Temperature (170 MHz) Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 37 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Typical Characteristics: ADC3224 (continued) typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) 71 92 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V 70.6 SNR (dBFS) 88 86 70.2 69.8 69.4 84 -15 10 35 Temperature (°C) 60 69 -40 85 Figure 115. Spurious-Free Dynamic Range vs DVDD Supply and Temperature (170 MHz) 94 SNR (dBFS) 93 71.5 92 71 91 70.5 90 70 89 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Differential Clock Amplitude (Vpp) 2 73 SNR (dBFS) SNR SFDR 86 70 84 69 82 68 80 67 78 66 76 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Differential Clock Amplitude (Vpp) 92 70.3 90 69.9 88 86 70 D229 Submit Documentation Feedback SNR (dBFS) 70.7 Figure 119. Performance vs Clock Duty Cycle (30 MHz) 38 D228 70.5 SFDR (dBc) SNR (dBFS) 94 65 74 2.2 90 SNR SFDR 71.1 45 50 55 60 Input Clock Duty Cycle (%) 2 Figure 118. Performance vs Differential Clock Amplitude (150 MHz) 96 40 D226 71 SNR SFDR 35 85 90 SNR SFDR 88 D227 Figure 117. Performance vs Differential Clock Amplitude (40 MHz) 69.5 30 60 72 65 0.2 88 2.2 71.5 10 35 Temperature (°C) Figure 116. Signal-to-Noise Ratio vs DVDD Supply and Temperature (170 MHz) SFDR (dBc) 72.5 72 -15 D225 SFDR (dBc) 82 -40 69.5 0.2 DVDD = 1.85 V DVDD = 1.9 V 70.3 87.5 70.1 85 69.9 82.5 69.7 80 69.5 30 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 SFDR (dBc) SFDR (dBc) 90 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V DVDD = 1.9 V 77.5 70 D230 Figure 120. Performance vs Clock Duty Cycle (150 MHz) Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 7.19 Typical Characteristics: Common typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when chopper is enabled (unless otherwise noted) 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 -5 -10 Amplitude (dBFS) -15 CMRR (dB) -20 -25 -30 -35 -40 -45 -50 -55 -60 0 50 100 150 200 250 Frequency of Input Common-Mode Signal (MHz) 0 300 50 62.5 D006 fIN = 170.1 MHz, fCMRR = 5 MHz, ACMRR = 50 mVPP, SINAD = 69.66 dBFS, SFDR = 75.66 dBc Figure 121. Common-Mode Rejection Ratio vs Common-Mode Signal Frequency Figure 122. Common-Mode Rejection Ratio Spectrum 0 -10 Amplitude (dBFS) -15 PSRR (dB) 25 37.5 Frequency (MHz) fIN = 30 MHz, AIN = –1 dBFS, common-mode signal amplitude = 50 mVPP -5 -20 -25 -30 -35 -40 -45 -50 0 12.5 D005 50 100 150 200 250 Frequency of Signal on Supply (MHz) 300 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 12.5 D007 fIN = 30 MHz, AIN = –1 dBFS, test signal amplitude = 50 mVPP 25 37.5 Frequency (MHz) 50 62.5 D008 fIN = 30.1 MHz, fPSRR = 3 MHz, APSRR = 50 mVPP, SINAD = 58.51 dBFS, SFDR = 60.53 dBc Figure 123. Power-Supply Rejection Ratio vs Power-Supply Signal Frequency Figure 124. Power-Supply Rejection Ratio Spectrum 200 180 AVDD POWER DVDD POWER TOTAL POWER Power (mW) 160 140 120 100 80 60 40 10 20 30 40 50 60 Sampling Speed (MSPS) 70 80 D009 Figure 125. Power vs Sampling Speed (One-Wire Mode) Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 39 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 7.20 Typical Characteristics: Contour typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = 1.8 V, DVDD = 1.8 V, –1dBFS differential input, 2-VPP full-scale, 32k-point FFT, chopper disabled, and SNR reported with a 1-MHz offset from dc when chopper is disabled and from fS / 2 when is chopper enabled (unless otherwise noted) 90 110 Sampling Frequency, MSPS 80 85 120 80 90 100 75 90 90 85 80 75 80 70 70 60 90 50 85 40 30 90 50 100 150 70 75 80 200 250 300 Input Frequency, MHz 70 75 350 80 400 450 85 90 Figure 126. Spurious-Free Dynamic Range (SFDR) 120 70.5 Sampling Frequency, MSPS 110 69.5 70 69 68.5 100 68 90 80 70.5 70 69.5 70 69 68.5 60 68 50 40 30 70.5 71 50 66.5 100 67 69.5 70 150 67.5 68.5 69 200 250 300 Input Frequency, MHz 68 68.5 69 67.5 68 69.5 350 67 400 70 70.5 450 71 Figure 127. Signal-to-Noise Ratio (SNR) 40 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 8 Parametric Measurement Information 8.1 Timing Diagrams DAn_P DBn_P Logic 0 Logic 1 VODL = -410 mV (1) VODH = +410 mV (1) DAn_M DBn_M VOCM GND (1) With an external 100-Ω termination. Figure 128. Serial LVDS Output Voltage Levels CLKIN FCLK DCLK 1-Wire (12x Serialization) Dx0P Dx0M D 9 D 10 D 11 D 0 D 1 D 2 D 3 D 4 D 5 D 6 D 7 D 8 D 9 D 10 D 11 D 0 DCLK Dx0P Dx0M Dx1P Dx1M SAMPLE N-1 D 5 D 0 D 1 D 2 D 3 D 4 D 5 D 0 D 11 D 6 D 7 D 8 D 9 D 10 D 11 D 6 SAMPLE N 2-Wire (6x Serialization) SAMPLE N+1 Figure 129. Output Timing Diagram Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 41 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Timing Diagrams (continued) DCLK t HO Dx0P Dx0M t SU Figure 130. Setup and Hold Time N+10 N+1 N+9 Sample N TA Input Signal on INxP, INxM Pins Data Latency(1) = 9 Input Clock Cycles Sample N CLKINP, CLKINM tPDI FCLKP, FCLKM DCLKP, DCLKM (1) DCLK edges are centered within the data valid window. DA0P, DA0M, DB0P, DB0M 4 5 0 1 2 3 DA1P, DA1M, DB1P, DB1M 10 11 6 7 8 9 10 11 tsu th 4 5 Sample N 4 5 0 1 2 3 6 7 8 9 10 11 Sample N+1 Overall latency = data latency + tPDI. Figure 131. Latency Diagram 42 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 9 Detailed Description 9.1 Overview The ADC322x are a high-linearity, ultra-low power, dual-channel, 12-bit, 25-MSPS to 125-MSPS, analog-todigital converter (ADC) family. The ADC322x runs off of a single 1.8-V supply and supports system synchronization though the SYSREF pin. Output data are available in standard LVDS format accompanied with bit-clock and frame-clock outputs. 9.2 Functional Block Diagram INAP INAM 12-Bit ADC CLKP CLKM DA0P DA0M Digital Encoder and Serializer Divide by 1,2,4 DA1P DA1M Bit Clock DCLKP DCLKM PLL Frame Clock SYSREFP SYSREFM Copyright © 2014–2016, Texas Instruments Incorporated DB1P DB1M SDOUT SDATA SCLK Configuration Registers RESET Common Mode DB0P DB0M Digital Encoder and Serializer PDN VCM 12-Bit ADC SEN INBP INBM FCLKP FCLKM Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 43 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 9.3 Feature Description 9.3.1 Analog Inputs The ADC322x analog signal inputs are designed to be driven differentially. Each input pin (INP, INM) must swing symmetrically between (VCM + 0.5 V) and (VCM – 0.5 V), resulting in a 2-VPP (default) differential input swing. The input sampling circuit has a 3-dB bandwidth that extends up to 540 MHz (50-Ω source driving a 50-Ω termination between INP and INM). 9.3.2 Clock Input The device clock inputs can be driven differentially (sine, LVPECL, or LVDS) or single-ended (LVCMOS), with little or no difference in performance between them. The common-mode voltage of the clock inputs is set to 0.95 V using internal 5-kΩ resistors. The self-bias clock inputs of the ADC322x can be driven by the transformercoupled, sine-wave clock source or by the ac-coupled, LVPECL and LVDS clock sources, as shown in Figure 132, Figure 133, and Figure 134. See Figure 135 for details regarding the internal clock buffer. 0.1 mF 0.1 mF Zo CLKP Differential Sine-Wave Clock Input CLKP RT Typical LVDS Clock Input 0.1 mF 100 W CLKM Device 0.1 mF Zo RT = termination resistor, if necessary. CLKM Figure 132. Differential Sine-Wave Clock Driving Circuit Zo Device Figure 133. LVDS Clock Driving Circuit 0.1 mF CLKP 150 W Typical LVPECL Clock Input 100 W Zo 0.1 mF CLKM Device 150 W Figure 134. LVPECL Clock Driving Circuit 44 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Clock Buffer LPKG 2 nH 20 W CLKP CBOND 1 pF CEQ CEQ 5 kW RESR 100 W 1.4 V LPKG 2 nH 20 W 5 kW CLKM CBOND 1 pF RESR 100 W NOTE: CEQ is 1 pF to 3 pF and is the equivalent input capacitance of the clock buffer. Figure 135. Internal Clock Buffer A single-ended CMOS clock can be ac-coupled to the CLKP input, with CLKM connected to ground with a 0.1-μF capacitor, as shown in Figure 136. However, for best performance the clock inputs must be driven differentially, thereby reducing susceptibility to common-mode noise. For high input frequency sampling, TI recommends using a clock source with very low jitter. Band-pass filtering of the clock source can help reduce the effects of jitter. There is no change in performance with a non-50% duty cycle clock input. 0.1 mF CMOS Clock Input CLKP 0.1 mF CLKM Device Figure 136. Single-Ended Clock Driving Circuit 9.3.2.1 SNR and Clock Jitter The signal-to-noise ratio of the ADC is limited by three different factors, as shown in Equation 1. Quantization noise (typically 74 dB for a 12-bit ADC) and thermal noise limit SNR at low input frequencies, and clock jitter sets SNR for higher input frequencies. SNRADC[dBc] § 20 ˜ log ¨10 ¨ © SNR Quantizatoin Noise 20 · ¸ ¸ ¹ 2 § ¨10 ¨ © SNR Thermal Noise 20 · ¸ ¸ ¹ 2 § ¨10 ¨ © SNR Jitter 20 · ¸ ¸ ¹ 2 (1) The SNR limitation resulting from sample clock jitter can be calculated with Equation 2. SNRJitter [dBc] 20 ˜ log( 2S ˜ f in ˜ TJitter ) (2) The total clock jitter (TJitter) has two components: the internal aperture jitter (130 fs for the device), which is set by the noise of the clock input buffer, and the external clock. TJitter can be calculated with Equation 3. TJitter (TJitter , Ext .Clock _ Input ) 2 (TAperture _ ADC ) 2 Copyright © 2014–2016, Texas Instruments Incorporated (3) Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 45 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com External clock jitter can be minimized by using high-quality clock sources and jitter cleaners as well as band-pass filters at the clock input and a faster clock slew rate improves ADC aperture jitter. The devices have a typical thermal noise of 73.5 dBFS and an internal aperture jitter of 130 fs. The SNR, depending on the amount of external jitter for different input frequencies. Figure 137 shows SNR (from 1 MHz offset leaving the 1/f flicker noise) for different jitter of clock driver. 72 Ext Clock Jitter 35 fs 50 fs 100 fs 150 fs 200 fs 71 SNR (dBFS) 70 69 68 67 66 65 64 10 100 Input Frequency (MHz) 1000 Figure 137. SNR vs Frequency for Different Clock Jitter 9.3.3 Digital Output Interface The devices offer two different output format options, thus making interfacing to a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC) easy. Each option can be easily programmed using the serial interface, as shown in Table 3. The output interface options are: • One-wire, 1X frame clock, 12X serialization with the DDR bit clock and • Two-wire, 1X frame clock, 6X serialization with the DDR bit clock. Table 3. Interface Rates MAXIMUM RECOMMENDED SAMPLING FREQUENCY (MSPS) INTERFACE OPTIONS One-wire Two-wire (1) SERIALIZATIO N MIN 15 12X MAX BIT CLOCK FREQUENCY (MHz) FRAME CLOCK FREQUENCY (MHz) SERIAL DATA RATE PER WIRE (Mbps) 90 15 180 65 390 65 780 60 20 120 375 125 750 (1) 20 (1) 6X 125 Use the LOW SPEED ENABLE register bits for low speed operation; see Table 22. 9.3.3.1 One-Wire Interface: 12X Serialization In this interface option, the device outputs the data of each ADC serially on a single LVDS pair (one-wire). The data are available at the rising and falling edges of the bit clock (DDR bit clock). The ADC outputs a new word at the rising edge of every frame clock, starting with the MSB. The data rate is a 12X sample frequency (12X serialization). 46 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 9.3.3.2 Two-Wire Interface: 6X Serialization The two-wire interface is recommended for sampling frequencies above 65 MSPS. The output data rate is a 6X sample frequency because six data bits are output every clock cycle on each differential pair. Each ADC sample is sent over the two wires with the six MSBs on Dx1P, Dx1M and the six LSBs on Dx0P, Dx0M, as shown in Figure 138. CLKIN FCLK DCLK 1-Wire (12x Serialization) Dx0P Dx0M D 9 D 10 D 11 D 0 D 1 D 2 D 3 D 4 D 5 D 6 D 7 D 8 D 9 D 10 D 11 D 0 DCLK Dx0P Dx0M Dx1P Dx1M SAMPLE N-1 D 5 D 0 D 1 D 2 D 3 D 4 D 5 D 0 D 11 D 6 D 7 D 8 D 9 D 10 D 11 D 6 SAMPLE N 2-Wire (6x Serialization) SAMPLE N+1 Figure 138. Output Timing Diagram Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 47 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 9.4 Device Functional Modes 9.4.1 Input Clock Divider The devices are equipped with an internal divider on the clock input. The clock divider allows operation with a faster input clock, thus simplifying the system clock distribution design. The clock divider can be bypassed for operation with a 125-MHz clock; the divide-by-2 option supports a maximum input clock of 250 MHz and the divide-by-4 option provides a maximum input clock frequency of 500 MHz. 9.4.2 Chopper Functionality 0 0 -20 -20 -40 -40 Attenuation (dB) Attenuation (dB) The devices are equipped with an internal chopper front-end. Enabling the chopper function swaps the ADC noise spectrum by shifting the 1/f noise from dc to fS / 2. Figure 139 shows the noise spectrum with the chopper off and Figure 140 shows the noise spectrum with the chopper on. This function is especially useful in applications requiring good ac performance at low input frequencies or in dc-coupled applications. The chopper can be enabled via SPI register writes and is recommended for input frequencies below 30 MHz. The chopper function creates a spur at fS / 2 that must be filtered out digitally. -60 -80 -100 -60 -80 -100 -120 -120 0 10 20 30 40 Frequency (MHz) 50 60 0 10 D016 fS = 125 MSPS, fIN = 10 MHz 20 30 40 Frequency (MHz) 50 60 D017 fS = 125 MSPS, fIN = 10 MHz Figure 139. Chopper Off Figure 140. Chopper On 9.4.3 Power-Down Control The power-down functions of the ADC322x can be controlled either through the parallel control pin (PDN) or through an SPI register setting (see register 15h). The PDN pin can also be configured via the SPI to a global power-down or standby functionality, as shown in Table 4. Table 4. Power-Down Modes FUNCTION 48 POWER CONSUMPTION (mW) WAKE-UP TIME (µs) Global power-down 5 85 Standby 81 35 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 9.4.3.1 Improving Wake-Up Time From Global Power-Down The device has an internal low-pass filter in the sampling clock path. This low-pass filter helps improve the aperture jitter of the device. However, in applications where input frequencies are < 200 MHz, noise from the aperture jitter does not dominate the overall SNR of the device. In such applications, the wake-up time from a global power-down can be reduced by bypassing the low-pass filter using the DIS CLK FILT register bit (write 80h to register address 70Ah). As shown in Table 5, setting the DIS CLK FILT bit improves the wake-up time from a global power-down from 85 µs to 55 µs. Table 5. Wake-Up Time From Global Power-Down WAKE-UP TIME DIS CLK FILT REGISTER BIT GLOBAL PDN REGISTER BIT TYP MAX UNIT 0 0→1→0 85 140 µs 1 0→1→0 55 81 µs 9.4.4 Internal Dither Algorithm 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) The ADC322x use an internal dither algorithm to achieve high SFDR and a clean spectrum. However, the dither algorithm marginally degrades SNR, creating a trade-off between SNR and SFDR. If desired, the dither algorithm can be turned off by using the DIS DITH CHx registers bits. Figure 141 and Figure 142 show the effect of using dither algorithms. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 fS = 125 MSPS, SNR = 70.5 dBFS, fIN = 70 MHz, SFDR = 99.2 dBc Figure 141. FFT with Dither On 62.5 D203 0 12.5 25 37.5 Frequency (MHz) 50 62.5 D204 fS = 125 MSPS, SNR = 70.8 dBFS, fIN = 70 MHz, SFDR = 91.1 dBc Figure 142. FFT Dither Off 9.5 Programming The ADC322x can be configured using a serial programming interface, as described in this section. 9.5.1 Serial Interface The device has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial interface enable), SCLK (serial interface clock), SDATA (serial interface data), and SDOUT (serial interface data output) pins. Serially shifting bits into the device is enabled when SEN is low. Serial data SDATA are latched at every SCLK rising edge when SEN is active (low). The serial data are loaded into the register at every 24th SCLK rising edge when SEN is low. When the word length exceeds a multiple of 24 bits, the excess bits are ignored. Data can be loaded in multiples of 24-bit words within a single active SEN pulse. The interface can function with SCLK frequencies from 20 MHz down to very low speeds (of a few hertz) and also with a non-50% SCLK duty cycle. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 49 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Programming (continued) 9.5.1.1 Register Initialization After power-up, the internal registers must be initialized to their default values through a hardware reset by applying a high pulse on the RESET pin (of durations greater than 10 ns), as shown in Figure 143. If required, the serial interface registers can be cleared during operation either: 1. Through a hardware reset, or 2. By applying a software reset. When using the serial interface, set the RESET bit (D0 in register address 06h) high. This setting initializes the internal registers to the default values and then self-resets the RESET bit low. In this case, the RESET pin is kept low. 9.5.1.1.1 Serial Register Write The device internal register can be programmed with these steps: 1. Drive the SEN pin low, 2. Set the R/W bit to 0 (bit A15 of the 16-bit address), 3. Set bit A14 in the address field to 1, 4. Initiate a serial interface cycle by specifying the address of the register (A13 to A0) whose content must be written, and 5. Write the 8-bit data that are latched in on the SCLK rising edge. Figure 143 and Table 6 show the timing requirements for the serial register write operation. Register Address [13:0] SDATA R/W 1 A13 A12 A11 A1 Register Data [7:0] A0 D7 D6 D5 D4 =0 D3 D2 D1 D0 tDH tSCLK tDSU SCLK tSLOADS tSLOADH SEN RESET Figure 143. Serial Register Write Timing Diagram Table 6. Serial Interface Timing (1) MIN TYP UNIT 20 MHz fSCLK SCLK frequency (equal to 1 / tSCLK) tSLOADS SEN to SCLK setup time 25 ns tSLOADH SCLK to SEN hold time 25 ns tDSU SDIO setup time 25 ns tDH SDIO hold time 25 ns (1) 50 > dc MAX Typical values are at 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, and AVDD = DVDD = 1.8 V, unless otherwise noted. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 9.5.1.1.2 Serial Register Readout The device includes a mode where the contents of the internal registers can be read back using the SDOUT pin. This readback mode can be useful as a diagnostic check to verify the serial interface communication between the external controller and the ADC. The procedure to read the contents of the serial registers is as follows: 1. Drive the SEN pin low. 2. Set the R/W bit (A15) to 1. This setting disables any further writes to the registers. 3. Set bit A14 in the address field to 1. 4. Initiate a serial interface cycle specifying the address of the register (A[13:0]) whose content must be read. 5. The device outputs the contents (D[7:0]) of the selected register on the SDOUT pin. 6. The external controller can latch the contents at the SCLK rising edge. 7. To enable register writes, reset the R/W register bit to 0. When READOUT is disabled, the SDOUT pin is in a high-impedance mode. If serial readout is not used, the SDOUT pin must float. Figure 144 shows a timing diagram of the serial register read operation. Data appear on the SDOUT pin at the SCLK falling edge with an approximate delay (tSD_DELAY) of 20 ns, as shown in Figure 145. Register Data: 'RQ¶W &DUH Register Address [13:0] SDATA R/W 1 A13 A12 A11 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D1 D0 =1 Register Read Data [7:0] SDOUT D7 D6 D5 D4 D3 D2 SCLK SEN Figure 144. Serial Register Read Timing Diagram SCLK tSD_DELAY SDOUT Figure 145. SDOUT Timing Diagram Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 51 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 9.5.2 Register Initialization After power-up, the internal registers must be initialized to their default values through a hardware reset by applying a high pulse on the RESET pin, as shown in Figure 146 and Table 7. Power Supplies t1 RESET t2 t3 SEN Figure 146. Initialization of Serial Registers after Power-Up Table 7. Power-Up Timing MIN t1 Power-on delay: delay from power up to active high RESET pulse t2 Reset pulse width: active high RESET pulse width t3 Register write delay: delay from RESET disable to SEN active TYP MAX 1 10 100 UNIT ms 1000 ns ns If required, the serial interface registers can be cleared during operation either: 1. Through a hardware reset, or 2. By applying a software reset. When using the serial interface, set the RESET bit (D0 in register address 06h) high. This setting initializes the internal registers to the default values and then self-resets the RESET bit low. In this case, the RESET pin is kept low. 52 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 9.6 Register Maps Table 8. Register Map Summary REGISTER ADDRESS REGISTER DATA A[13:0] (Hex) 7 6 Register 01h 0 0 Register 03h 0 0 Register 04h 0 Register 05h 0 5 4 3 0 0 0 0 0 0 0 ODD EVEN 0 0 0 0 0 0 FLIP WIRE 0 0 0 0 0 0 1W-2W TEST PATTERN EN RESET DIS DITH CHA 2 DIS DITH CHB 1 0 Register 06h 0 0 0 0 0 0 Register 07h 0 0 0 0 0 0 0 OVR ON LSB 0 ALIGN TEST PATTERN DATA FORMAT Register 09h 0 0 0 0 Register 0Ah 0 0 0 0 Register 0Bh CHB TEST PATTERN 0 CHA TEST PATTERN 0 Register 0Eh 0 0 0 0 0 0 0 LOW SPEED ENABLE CUSTOM PATTERN[11:4] Register 0Fh CUSTOM PATTERN[3:0] 0 Register 13h 0 0 0 0 0 0 Register 15h 0 CHA PDN CHB PDN 0 STANDBY GLOBAL PDN 0 CONFIG PDN PIN Register 25h LVDS SWING Register 27h CLK DIV 0 0 0 0 0 0 Register 41Dh 0 0 0 0 0 0 HIGH IF MODE0 0 Register 422h 0 0 0 0 0 0 DIS CHOP CHA 0 Register 434h 0 0 DIS DITH CHA 0 DIS DITH CHA 0 0 0 Register 439h 0 0 0 0 SP1 CHA 0 0 0 Register 51Dh 0 0 0 0 0 0 HIGH IF MODE1 0 Register 522h 0 0 0 0 0 0 DIS CHOP CHB 0 Register 534h 0 0 DIS DITH CHB 0 DIS DITH CHB 0 0 0 Register 539h 0 0 0 0 SP1 CHB 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PDN SYSREF Register 608h Register 70Ah HIGH IF MODE[3:2] DIS CLK FILT 0 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 53 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 9.6.1 Summary of Special Mode Registers Table 9 lists the location, value, and functions of special mode registers in the device. Table 9. Special Modes Summary MODE REGISTER SETTINGS DESCRIPTION Special modes Registers 439h (bit 3) and 539h (bit 3) Always set these bits high for best performance Disable dither Registers 1h (bits 5-2), 434h (bits 5 and 3), and 534h (bits 5 and 3) Disable dither to improve SNR Disable chopper Registers 422h (bit 1) and 522h (bit 1) Disable chopper to shift 1/f noise floor at dc High IF modes Registers 41Dh (bit 1), 51Dh (bit 1), and 608h (bits 7-6) Improves HD3 for IF > 100 MHz 9.6.2 Serial Register Description 9.6.2.1 Register 01h Figure 147. Register 01h 7 0 W-0h 6 0 W-0h 5 4 3 DIS DITH CHA R/W-0h 2 DIS DITH CHB R/W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 10. Register 01h Description Bit Field Type Reset Description 7-6 0 W 0h Must write 0 0h These bits enable or disable the on-chip dither. Control this bit with bits 5 and 3 of register 434h. 00 = Default 11 = Dither is disabled for channel A. In this mode, SNR typically improves by 0.2 dB at 70 MHz. 5-4 DIS DITH CHA R/W 3-2 DIS DITH CHB R/W 0h These bits enable or disable the on-chip dither. Control this bit with bits 5 and 3 of register 434h. 00 = Default 11 = Dither is disabled for channel B. In this mode, SNR typically improves by 0.2 dB at 70 MHz. 1-0 0 W 0h Must write 0 9.6.2.2 Register 03h Figure 148. Register 03h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 ODD EVEN R/W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 11. Register 03h Description Bit Field Type Reset Description 7-1 0 W 0h Must write 0 ODD EVEN R/W 0h This bit selects the bit sequence on the output wires (in 2-wire mode only). 0 = Bits 0, 1, and 2 appear on wire 0; bits 7, 8, and 9 appear on wire 1 1 = Bits 0, 2, and 4 appear on wire 0; bits 1, 3, and 5 appear on wire 1 0 54 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 9.6.2.3 Register 04h Figure 149. Register 04h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 FLIP WIRE R/W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 12. Register 04h Description Bit Field Type Reset Description 7-1 0 W 0h Must write 0 0h This bit flips the data on the output wires. Valid only in two wire configuration. 0 = Default 1 = Data on output wires is flipped. Pin D0x becomes D1x, and vice versa. 0 FLIP WIRE R/W 9.6.2.4 Register 05h Figure 150. Register 05h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 1W-2W R/W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 13. Register 05h Description Bit Field Type Reset Description 7-1 0 W 0h Must write 0 0h This bit transmits output data on either one or two wires. 0 = Output data are transmitted on two wires (Dx0P, Dx0M and Dx1P, Dx1M) 1 = Output data are transmitted on one wire (Dx0P, Dx0M). In this mode, the recommended fS is less than 62.5 MSPS. 0 1W-2W R/W 9.6.2.5 Register 06h Figure 151. Register 06h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 TEST PATTERN EN R/W-0h 0 RESET W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 14. Register 06h Description Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 TEST PATTERN EN R/W 0h This bit enables test pattern selection for the digital outputs. 0 = Normal output 1 = Test pattern output enabled 0 RESET W 0h This bit applies a software reset. This bit resets all internal registers to the default values and selfclears to 0. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 55 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 9.6.2.6 Register 07h Figure 152. Register 07h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 OVR ON LSB R/W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 15. Register 07h Description Bit Field Type Reset Description 7-1 0 W 0h Must write 0 OVR ON LSB R/W 0h This bit provides the overrange (OVR) information on the LSB bits. 0 = Output data bit 0 functions as the LSB of the 12-bit data 1 = Output data bit 0 carries the OVR information. 0 9.6.2.7 Register 09h Figure 153. Register 09h 7 6 5 4 3 2 0 0 0 0 0 0 W-0h W-0h W-0h W-0h W-0h W-0h 1 ALIGN TEST PATTERN R/W-0h 0 DATA FORMAT R/W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 16. Register 09h Description 56 Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 ALIGN TEST PATTERN R/W 0h This bit aligns the test patterns across the outputs of both channels. 0 = Test patterns of both channels are free running 1 = Test patterns of both channels are aligned 0 DATA FORMAT R/W 0h This bit programs the digital output data format. 0 = Twos complement 1 = Offset binary Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 9.6.2.8 Register 0Ah Figure 154. Register 0Ah 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 2 1 CHA TEST PATTERN R/W-0h 0 LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 17. Register 0Ah Description Bit Field Type Reset Description 7-4 0 W 0h Must write 0 0h These bits control the test pattern for channel A after the TEST PATTERN EN bit is set. 0000 = Normal operation 0001 = All 0's 0010 = All 1's 0011 = Toggle pattern: data alternate between 101010101010 and 010101010101 0100 = Digital ramp: data increment by 1 LSB every clock cycle from code 0 to 4095 0101 = Custom pattern: output data are the same as programmed by the CUSTOM PATTERN register bits 0110 = Deskew pattern: data are AAAh 1000 = PRBS pattern: data are a sequence of pseudo random numbers 1001 = 8-point sine-wave: data are a repetitive sequence of the following eight numbers that form a sine-wave: 0, 599, 2048, 3496, 4095, 3496, 2048, and 599 Others = Do not use 3-0 CHA TEST PATTERN R/W 9.6.2.9 Register 0Bh Figure 155. Register 0Bh 7 6 5 CHB TEST PATTERN R/W-0h 4 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 18. Register 0Bh Description Bit Field Type Reset Description 7-4 CHB TEST PATTERN R/W 0h These bits control the test pattern for channel B after the TEST PATTERN EN bit is set. 0000 = Normal operation 0001 = All 0's 0010 = All 1's 0011 = Toggle pattern: data alternate between 101010101010 and 010101010101 0100 = Digital ramp: data increment by 1 LSB every clock cycle from code 0 to 4095 0101 = Custom pattern: output data are the same as programmed by the CUSTOM PATTERN register bits 0110 = Deskew pattern: data are AAAh 1000 = PRBS pattern: data are a sequence of pseudo random numbers 1001 = 8-point sine-wave: data are a repetitive sequence of the following eight numbers that form a sine-wave: 0, 599, 2048, 3496, 4095, 3496, 2048, and 599 Others = Do not use 3-0 0 W 0h Must write 0 Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 57 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 9.6.2.10 Register 0Eh Figure 156. Register 0Eh 7 6 5 4 3 CUSTOM PATTERN[11:4] R/W-0h 2 1 0 LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 19. Register 0Eh Description Bit Field Type Reset Description 7-0 CUSTOM PATTERN[11:4] R/W 0h These bits set the 12-bit custom pattern (bits 11-4) for all channels. 9.6.2.11 Register 0Fh Figure 157. Register 0Fh 7 6 5 CUSTOM PATTERN[3:0] R/W-0h 4 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 20. Register 0Fh Description Bit Field Type Reset Description 7-4 CUSTOM PATTERN[3:0] R/W 0h These bits set the 12-bit custom pattern (bits 3-0) for all channels. 3-0 0 W 0h Must write 0 9.6.2.12 Register 13h Figure 158. Register 13h 7 0 W-0h 6 0 R/W-0h 5 0 R/W-0h 4 0 W-0h 3 0 R/W-0h 2 0 R/W-0h 1 0 LOW SPEED ENABLE W-0h R/W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 21. Register 13h Description Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1-0 LOW SPEED ENABLE R/W 0h Enables low speed operation in 1-wire and 2-wire mode. Depending upon sampling frequency, write this bit as per Table 22. Table 22. LOW SPEED ENABLE Register Bit Settings Across fS fS (MSPS) 58 REGISTER BIT LOW SPEED ENABLE MIN MAX 1-WIRE MODE 2-WIRE MODE 25 125 00 00 20 25 10 11 15 20 10 Not supported Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 9.6.2.13 Register 15h Figure 159. Register 15h 7 0 W-0h 6 CHA PDN R/W-0h 5 CHB PDN R/W-0h 4 0 W-0h 3 STANDBY R/W-0h 2 GLOBAL PDN R/W-0h 1 0 W-0h 0 CONFIG PDN PIN R/W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 23. Register 15h Description Bit Field Type Reset Description 7 0 W 0h Must write 0 6 CHA PDN R/W 0h 0 = Normal operation 1 = Power-down channel A 5 CHB PDN R/W 0h 0 = Normal operation 1 = Power-down channel B 4 0 W 0h Must write 0 3 STANDBY R/W 0h The ADCs of both channels enter standby. 0 = Normal operation 1 = Standby 2 GLOBAL PDN R/W 0h 0 = Normal operation 1 = Global power-down 1 0 W 0h Must write 0 0h This bit configures the PDN pin as either a global power-down or standby pin. 0 = Logic high voltage on the PDN pin sends the device into global power-down 1 = Logic high voltage on the PDN pin sends the device into standby 0 CONFIG PDN PIN R/W 9.6.2.14 Register 25h Figure 160. Register 25h 7 6 5 4 3 2 1 0 LVDS SWING R/W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 24. Register 25h Description Bit Field Type Reset Description 7-0 LVDS SWING R/W 0h These bits control the swing of the LVDS outputs (including the data output, bit clock, and frame clock). For details see Table 25. Table 25. LVDS Output Swing BITS 7-4 BITS 3-0 0h 0h Default (±425 mV) Dh 9h Swing reduces by 50 mV Eh Ah Swing reduces by 100 mV Fh Dh Swing reduces by 300 mV Ch Eh Swing increases by 100 mV Others Others Do not use Copyright © 2014–2016, Texas Instruments Incorporated LVDS OUTPUT SWING Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 59 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 9.6.2.15 Register 27h Figure 161. Register 27h 7 6 CLK DIV R/W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 26. Register 27h Description Bit Field Type Reset Description 7-6 CLK DIV R/W 0h These bits set the internal clock divider for the input sampling clock. 00 = Divide-by-1 01 = Divide-by-1 10 = Divide-by-2 11 = Divide-by-4 5-0 0 W 0h Must write 0 9.6.2.16 Register 41Dh Figure 162. Register 41Dh 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 HIGH IF MODE0 R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 27. Register 41Dh Description Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 HIGH IF MODE0 R/W 0h This bit improves HD3 for IF > 100 MHz. 0 = Normal operation For best HD3 at IF > 100 MHz, set HIGH IF MODE[3:0] to 1111. 0 0 W 0h Must write 0 9.6.2.17 Register 422h Figure 163. Register 422h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 DIS CHOP CHA R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 28. Register 422h Description 60 Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 DIS CHOP CHA R/W 0h Disable chopper. Set this bit to shift a 1/f noise floor at dc. 0 = 1/f noise floor is centered at fS / 2 (default) 1 = Chopper mechanism is disabled; 1/f noise floor is centered at dc 0 0 W 0h Must write 0 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 9.6.2.18 Register 434h Figure 164. Register 434h 7 0 W-0h 6 0 W-0h 5 DIS DITH CHA R/W-0h 4 0 W-0h 3 DIS DITH CHA R/W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 29. Register 434h Description Bit Field Type Reset Description 7-6 0 W 0h Must write 0 5 DIS DITH CHA R/W 0h Set this bit with bits 5 and 4 of register 01h. 00 = Default 11 = Dither is disabled for channel A. In this mode, SNR typically improves by 0.5 dB at 70 MHz. 4 0 W 0h Must write 0 3 DIS DITH CHA R/W 0h Set this bit with bits 5 and 4 of register 01h. 00 = Default 11 = Dither is disabled for channel A. In this mode, SNR typically improves by 0.5 dB at 70 MHz. 0 W 0h Must write 0 2-0 9.6.2.19 Register 439h Figure 165. Register 439h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 SP1 CHA R/W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 30. Register 439h Description Bit Field Type Reset Description 7-4 0 W 0h Must write 0 SP1 CHA R/W 0h Special mode for best performance on channel A. Always write 1 after reset. 0 W 0h Must write 0 3 2-0 9.6.2.20 Register 51Dh Figure 166. Register 51Dh 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 HIGH IF MODE1 R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 31. Register 51Dh Description Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 HIGH IF MODE1 R/W 0h This bit improves HD3 for IF > 100 MHz. 0 = Normal operation For best HD3 at IF > 100 MHz, set HIGH IF MODE[3:0] to 1111. 0 0 W 0h Must write 0 Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 61 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 9.6.2.21 Register 522h Figure 167. Register 522h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 DIS CHOP CHB R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 32. Register 522h Description Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 DIS CHOP CHB R/W 0h Disable chopper. Set this bit to shift a 1/f noise floor at dc. 0 = 1/f noise floor is centered at fS / 2 (default) 1 = Chopper mechanism is disabled; 1/f noise floor is centered at dc 0 0 W 0h Must write 0 9.6.2.22 Register 534h Figure 168. Register 534h 7 0 W-0h 6 0 W-0h 5 DIS DITH CHA R/W-0h 4 0 W-0h 3 DIS DITH CHA R/W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 33. Register 534h Description Bit Field Type Reset Description 7-6 0 W 0h Must write 0 5 DIS DITH CHA R/W 0h Set this bit with bits 3 and 2 of register 01h. 00 = Default 11 = Dither is disabled for channel B. In this mode, SNR typically improves by 0.5 dB at 70 MHz. 4 0 W 0h Must write 0 3 DIS DITH CHA R/W 0h Set this bit with bits 3 and 2 of register 01h. 00 = Default 11 = Dither is disabled for channel B. In this mode, SNR typically improves by 0.5 dB at 70 MHz. 0 W 0h Must write 0 2-0 9.6.2.23 Register 539h Figure 169. Register 539h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 SP1 CHB R/W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 34. Register 539h Description 62 Bit Field Type Reset Description 7-4 0 W 0h Must write 0 3 SP1 CHB R/W 0h Special mode for best performance on channel B. Always write 1 after reset. 0 0 W 0h Must write 0 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 9.6.2.24 Register 608h Figure 170. Register 608h 7 6 HIGH IF MODE[3:2] R/W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 35. Register 608h Description Bit Field Type Reset Description 7-6 HIGH IF MODE[3:2] R/W 0h This bit improves HD3 for IF > 100 MHz. 0 = Normal operation For best HD3 at IF > 100 MHz, set HIGH IF MODE[3:0] to 1111. 5-0 0 W 0h Must write 0 9.6.2.25 Register 70Ah Figure 171. Register 70Ah 7 DIS CLK FILT R/W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 PDN SYSREF R/W-0h LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset Table 36. Register 70Ah Description Bit 7 6-1 0 Field Type Reset Description DIS CLK FILT R/W 0h Set this bit to improve wake-up time from global power-down mode; see the Improving Wake-Up Time From Global PowerDown section for details. 0 W 0h Must write 0 0h If the SYSREF pins are not used in the system, the SYSREF buffer must be powered down by setting this bit. 0 = Normal operation 1 = Powers down the SYSREF buffer PDN SYSREF R/W Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 63 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 10 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information Typical applications involving transformer-coupled circuits are discussed in this section. Transformers (such as ADT1-1WT or WBC1-1) can be used up to 250 MHz to achieve good phase and amplitude balances at the ADC inputs. When designing the dc-driving circuits, the ADC input impedance must be considered. Figure 172 and Figure 173 show the impedance (Zin = Rin || Cin) across the ADC input pins. 6 Differential Capacitance, Cin (pF) Differential Resistance, Rin (kOhm) 10 1 0.1 4 3 2 1 0.01 0 100 200 300 400 500 600 700 Frequency (MHz) 800 900 1000 Figure 172. Differential Input Resistance (RIN) 64 5 Submit Documentation Feedback D024 0 100 200 300 400 500 600 700 Frequency (MHz) 800 900 1000 D025 D001 Figure 173. Differential Input Capacitance (CIN) Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 10.2 Typical Applications 10.2.1 Driving Circuit Design: Low Input Frequencies 39 nH 0.1 PF INP 0.1 PF 50 Ÿ 0.1 PF 50 Ÿ 25 Ÿ 22 pF 25 Ÿ 50 Ÿ 50 Ÿ INM 1:1 1:1 0.1 PF 39 nH VCM Device Figure 174. Driving Circuit for Low Input Frequencies 10.2.1.1 Design Requirements For optimum performance, the analog inputs must be driven differentially. An optional 5-Ω to 15-Ω resistor in series with each input pin can be kept to damp out ringing caused by package parasitic. The drive circuit may have to be designed to minimize the affect of kick-back noise generated by sampling switches opening and closing inside the ADC, as well as ensuring low insertion loss over the desired frequency range and matched impedance to the source. 10.2.1.2 Detailed Design Procedure A typical application involving using two back-to-back coupled transformers is shown in Figure 174. This circuit is optimized for low input frequencies. An external R-C-R filter using 50-Ω resistors and a 22-pF capacitor is used with the series inductor (39 nH); this combination helps absorb the sampling glitches. 10.2.1.3 Application Curve Figure 175 shows the performance obtained by using the circuit shown in Figure 174. 0 -10 -20 Amplitude (dBFS) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 D201 fS = 125 MSPS, SNR = 70.6 dBFS, fIN = 10 MHz, SFDR = 101.1 dBc Figure 175. Performance FFT at 10 MHz (Low Input Frequency) Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 65 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com Typical Applications (continued) 10.2.2 Driving Circuit Design: Input Frequencies Between 100 MHz to 230 MHz 0.1 PF 10 Ÿ INP 0.1 PF 0.1 PF 15 Ÿ 25 Ÿ 56 nH 10 pF 25 Ÿ 15 Ÿ INM 1:1 1:1 10 Ÿ 0.1 PF VCM Device Figure 176. Driving Circuit for Mid-Range Input Frequencies (100 MHz < fIN < 230 MHz) 10.2.2.1 Design Requirements See the Design Requirements section for further details. 10.2.2.2 Detailed Design Procedure When input frequencies are between 100 MHz to 230 MHz, an R-LC-R circuit can be used to optimize performance, as shown in Figure 176. 10.2.2.3 Application Curve Figure 177 shows the performance obtained by using the circuit shown in Figure 176. 0 -10 -20 Amplitude (dBFS) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 D205 fS = 125 MSPS, SNR = 70 dBFS, fIN = 170 MHz, SFDR = 93.6 dBc Figure 177. Performance FFT at 170 MHz (Mid Input Frequency) 66 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 Typical Applications (continued) 10.2.3 Driving Circuit Design: Input Frequencies Greater than 230 MHz 0.1 PF 0.1 PF 10 Ÿ INP 0.1 PF 25 Ÿ 25 Ÿ INM 1:1 1:1 10 Ÿ 0.1 PF VCM Device Figure 178. Driving Circuit for High Input Frequencies (fIN > 230 MHz) 10.2.3.1 Design Requirements See the Design Requirements section for further details. 10.2.3.2 Detailed Design Procedure For high input frequencies (> 230 MHz), using the R-C-R or R-LC-R circuit does not show significant improvement in performance. However, a series resistance of 10 Ω can be used as shown in Figure 178. 10.2.3.3 Application Curve Figure 179 shows the performance obtained by using the circuit shown in Figure 178. 0 -10 -20 Amplitude (dBFS) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 D209 fS = 125 MSPS, SNR = 67.4 dBFS, fIN = 450 MHz, SFDR = 75.5 dBc Figure 179. Performance FFT at 450 MHz (High Input Frequency) 11 Power-Supply Recommendations The device requires a 1.8-V nominal supply for AVDD and DVDD. There are no specific sequence power-supply requirements during device power-up. AVDD and DVDD can power up in any order. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 67 ADC3221, ADC3222, ADC3223, ADC3224 SBAS672B – JULY 2014 – REVISED MARCH 2016 www.ti.com 12 Layout 12.1 Layout Guidelines The ADC322x EVM layout can be used as a reference layout to obtain the best performance. A layout diagram of the EVM top layer is provided in Figure 180. Some important points to remember during laying out the board are: 1. Analog inputs are located on opposite sides of the device pin out to ensure minimum crosstalk on the package level. To minimize crosstalk onboard, the analog inputs must exit the pin out in opposite directions, as shown in the reference layout of Figure 180 as much as possible. 2. In the device pin out, the sampling clock is located on a side perpendicular to the analog inputs in order to minimize coupling between them. This configuration is also maintained on the reference layout of Figure 180 as much as possible. 3. Keep digital outputs away from analog inputs. When these digital outputs exit the pin out, the digital output traces must not be kept parallel to the analog input traces because this configuration can result in coupling from digital outputs to analog inputs and degrade performance. All digital output traces to the receiver (such as an FPGA or an ASIC) must be matched in length to avoid skew among outputs. 4. At each power-supply pin (AVDD and DVDD), a 0.1-µF decoupling capacitor must be kept close to the device. A separate decoupling capacitor group consisting of a parallel combination of 10-µF, 1-µF, and 0.1-µF capacitors can be kept close to the supply source. 12.2 Layout Example Analog Input Routing Sampling Clock Routing ADC32xx Digital Output Routing Figure 180. Typical Layout of the ADC322x Board 68 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 ADC3221, ADC3222, ADC3223, ADC3224 www.ti.com SBAS672B – JULY 2014 – REVISED MARCH 2016 13 Device and Documentation Support 13.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 37. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY ADC3221 Click here Click here Click here Click here Click here ADC3222 Click here Click here Click here Click here Click here ADC3223 Click here Click here Click here Click here Click here ADC3224 Click here Click here Click here Click here Click here 13.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 13.3 Trademarks E2E is a trademark of Texas Instruments. PowerPAD is a trademark of Texas Instruments, Inc. All other trademarks are the property of their respective owners. 13.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 13.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC3221 ADC3222 ADC3223 ADC3224 69 PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADC3221IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ3221 ADC3221IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ3221 ADC3222IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ3222 ADC3222IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ3222 ADC3223IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ3223 ADC3223IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ3223 ADC3224IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ3224 ADC3224IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ3224 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 20-Jan-2017 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 3-Apr-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing ADC3221IRGZR VQFN RGZ 48 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC3221IRGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC3222IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC3222IRGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC3223IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC3223IRGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC3224IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC3224IRGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Apr-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADC3221IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6 ADC3221IRGZT VQFN RGZ 48 250 213.0 191.0 55.0 ADC3222IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6 ADC3222IRGZT VQFN RGZ 48 250 213.0 191.0 55.0 ADC3223IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6 ADC3223IRGZT VQFN RGZ 48 250 213.0 191.0 55.0 ADC3224IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6 ADC3224IRGZT VQFN RGZ 48 250 213.0 191.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice. This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services. These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation modules, and samples (http://www.ti.com/sc/docs/sampterms.htm). Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated