ADC32J23IRGZ25

PCN Number: 20161114000 Title: ADC32xx/34xx Product Family Design Change Customer Contact: PCN Manager Proposed 1st Ship Date: Change Type: Assembly Site Design Test Site Wafer Bump Site Wafer Fab Site Software Nov 15, 2016 PCN Date: Dept: Nov 15, 2016 Quality Services Estimated Sample Availability: Assembly Process Electrical Specification Packing/Shipping/Labeling Wafer Bump Material Wafer Fab Materials Part number change Date provided at sample request Assembly Materials Mechanical Specification Test Process Wafer Bump Process Wafer Fab Process PCN Details Description of Change: Texas Instruments Incorporated is announcing an information only notification for a design change on the ADC32xx/34xx product family of devices. The following observations are made when a device listed in the product affected table (below) is used for 1st time on the board. 1. ADC’s gain error (1) shows a ‘glitch’ when a fresh device is tested. a. For quad channel part (ADC34xx/34Jxx), channel A and D show the glitch together, while channel B and C show it together. For dual channel part (ADC32xx/32Jxx), glitch occurs at the same time for channel A and B. b. When glitch occurs, the gain error increases by ~0.5%. c. The glitch shows a very slow settling profile with a time constant of ‘hours’. d. Once settled, the glitch doesn’t occur again, i.e. the glitch occur only once for a given device. e. This issue doesn’t cause any impact on AC performance. f. 2. The issue affects only time-domain applications. Lab test show that glitch in gain error is a result of glitch in ADC’s reference voltage as shown in figure 1 Figure 1 Glitch on ADC reference voltage Texas Instruments Incorporated PCN# 20161114000 3. Root cause Figure 2 explains the circuitry inside a quad channel device (ADC34xx/34Jxx) which causes the problem. For the dual channel device (ADC32xx/32Jxx), channel A&D represent the two channels. Figure 2 Reference Voltage generation inside ADC3xxx/3xJxx devices • • • Bias Voltages (V1,V2) and (V3,V4) are used to generate currents for reference driver for channel A&D, and channel B&C respectively. Inside device, there are two unused cells to generate current (one for channel A&D, other for channel B&C). The bias voltage of these unused cells is chosen by multiplexer. The selection line of multiplexer is driven by a floating input inverter. This floating gate of inverter in unused cell causes V1 and V2 to short temporarily, resulting in glitch in reference output of CHA and CHD. Same phenomenon is seen by CHB and CHC. 4. Solution The floating gate of inverter in unused cell is connected to deterministic state (AVDD supply) in new Silicon. While it solves the problem, it doesn’t impact any parameter (performance, power or timing) of device in any possible way since the unused cell is not used anywhere in design for any purpose. This change did not necessitate a manufacturing or silicon process requalification. However, a full test yield and bin analysis was performed on a representative device from each product family. None of the evaluated devices showed any meaningful differences from the current yield and bin distributions. Affected devices are listed in the product affected section of this document. Reason for Change: To fix design glitch Texas Instruments Incorporated PCN# 20161114000 Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative): The design improvement does not affect the specified form fit or function of the device and therefore it represents an application drop-in replacement. There will be no accompanying changes to the device specifications. Changes to product identification resulting from this PCN: There is no change to the device marking. The Die Rev designator for the affected devices will change as shown in the table and sample label below: Current Die Rev [2P] A New Die Rev [2P] B Sample product shipping label (not actual product label) Product Affected: ADC3221IRGZR ADC32J22IRGZT ADC3421IRTQR ADC34J22IRGZ25 ADC3221IRGZT ADC32J23IRGZ25 ADC3421IRTQT ADC34J22IRGZR ADC3222IRGZR ADC32J23IRGZR ADC3422IRTQ25 ADC34J22IRGZT ADC3222IRGZT ADC32J23IRGZT ADC3422IRTQR ADC34J23IRGZ25 ADC3223IRGZ25 ADC32J24IRGZ25 ADC3422IRTQT ADC34J23IRGZR ADC3223IRGZR ADC32J24IRGZR ADC3423IRTQ25 ADC34J23IRGZT ADC3223IRGZT ADC32J24IRGZT ADC3423IRTQR ADC34J24IRGZ25 ADC3224IRGZ25 ADC32J25IRGZ25 ADC3423IRTQT ADC34J24IRGZR ADC3224IRGZR ADC32J25IRGZR ADC3424IRTQ25 ADC34J24IRGZT ADC3224IRGZT ADC32J25IRGZT ADC3424IRTQR ADC34J25IRGZ25 ADC3241IRGZ25 ADC32J42IRGZ25 ADC3424IRTQT ADC34J25IRGZR ADC3241IRGZR ADC32J42IRGZR ADC3441IRTQ25 ADC34J25IRGZT ADC3241IRGZT ADC32J42IRGZT ADC3441IRTQR ADC34J42IRGZ25 ADC3242IRGZ25 ADC32J43IRGZ25 ADC3441IRTQT ADC34J42IRGZR ADC3242IRGZR ADC32J43IRGZR ADC3442IRTQ25 ADC34J43IRGZ25 ADC3242IRGZT ADC32J43IRGZT ADC3442IRTQR ADC34J43IRGZR ADC3243IRGZ25 ADC32J44IRGZ25 ADC3442IRTQT ADC34J43IRGZT ADC3243IRGZR ADC32J44IRGZR ADC3443IRTQ25 ADC34J44IRGZ25 ADC3243IRGZT ADC32J44IRGZT ADC3443IRTQR ADC34J44IRGZR ADC3244IRGZ25 ADC32J45IRGZ25 ADC3443IRTQT ADC34J44IRGZT ADC3244IRGZR ADC32J45IRGZR ADC3444IRTQ25 ADC34J45IRGZ25 ADC3244IRGZT ADC32J45IRGZT ADC3444IRTQR ADC34J45IRGZR ADC32J22IRGZR ADC3421IRTQ25 ADC3444IRTQT ADC34J45IRGZT Texas Instruments Incorporated PCN# 20161114000 For questions regarding this notice, e-mails can be sent to the regional contacts shown below, or you can contact your local Field Sales Representative. Location USA Europe Asia Pacific Japan Texas Instruments Incorporated E-Mail PCNAmericasContact@list.ti.com PCNEuropeContact@list.ti.com PCNAsiaContact@list.ti.com PCNJapanContact@list.ti.com PCN# 20161114000