ADC32J24IRGZ25

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 ADC32J2x Dual-Channel, 12-Bit, 50-MSPS to 160-MSPS, Analog-to-Digital Converter with JESD204B Interface 1 Features 3 Description • • • • • The ADC32J2x is a high-linearity, ultra-low power, dual-channel, 12-bit, 50-MSPS to 160-MSPS, analogto-digital converter (ADC) family. The devices are designed specifically to support demanding, high input frequency signals with large dynamic range requirements. A clock input divider allows more flexibility for system clock architecture design and the SYSREF input enables complete system synchronization. The devices support JESD204B interfaces in order to reduce the number of interface lines, thus allowing for high system integration density. The JESD204B interface is a serial interface, where the data of each ADC are serialized and output over only one differential pair. An internal phaselocked loop (PLL) multiplies the incoming ADC sampling clock by 20 to derive the bit clock that is used to serialize the 12-bit data from each channel. The devices support subclass 1 with interface speeds up to 3.2 Gbps. 1 • • • • • • • Dual Channel 12-Bit Resolution Single 1.8-V Supply Flexible Input Clock Buffer with Divide-by-1, -2, -4 SNR = 70.3 dBFS, SFDR = 88 dBc at fIN = 70 MHz Ultralow Power Consumption: – 227 mW/Ch at 160 MSPS Channel Isolation: 105 dB Internal Dither JESD204B Serial Interface: – Subclass 0, 1, 2 Compliant up to 3.2 Gbps – Supports One Lane per ADC up to 160 MSPS Support for Multichip Synchronization Pin-to-Pin Compatible with 14-Bit Version (ADC32J4X) Package: VQFN-48 (7 mm × 7 mm) Device Information(1) PART NUMBER PACKAGE 2 Applications • • • • • • • • • • (1) For all available packages, see the package option addendum at the end of the datasheet. 7.00 mm × 7.00 mm FFT with Dither On (fS = 160 MSPS, SNR = 70.3 dBFS, fIN = 10 MHz, SFDR = 92.6 dBc) 0 -10 -20 -30 Amplitude (dBFS) Multi-Carrier, Multi-Mode Cellular Base Stations Radar and Smart Antenna Arrays Munitions Guidance Motor Control Feedback Network and Vector Analyzers Communications Test Equipment Nondestructive Testing Microwave Receivers Software Defined Radios (SDRs) Quadrature and Diversity Radio Receivers VQFN (48) BODY SIZE (NOM) ADC32J2X -40 -50 -60 -70 -80 -90 -100 -110 -120 0 16 32 48 Frequency (MHz) 64 80 D201 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 7.15 7.16 7.17 7.18 1 1 1 2 3 3 5 Absolute Maximum Ratings ...................................... 5 ESD Ratings.............................................................. 5 Recommended Operating Conditions....................... 5 Thermal Information .................................................. 6 Electrical Characteristics........................................... 6 Electrical Characteristics: ADC32J22, ADC32J23.... 7 Electrical Characteristics: ADC32J24, ADC32J25.... 7 AC Performance: ADC32J25 .................................... 8 AC Performance: ADC32J24 .................................. 10 AC Performance: ADC32J23 ................................ 12 AC Performance: ADC32J22 ................................ 14 Digital Characteristics ........................................... 16 Timing Requirements ............................................ 17 Typical Characteristics: ADC32J25 ...................... 18 Typical Characteristics: ADC32J24 ...................... 24 Typical Characteristics: ADC32J23 ...................... 30 Typical Characteristics: ADC32J22 ...................... 36 Typical Characteristics: Common Plots ................ 42 7.19 Typical Characteristics: Contour Plots .................. 43 8 Parameter Measurement Information ................ 44 9 Detailed Description ............................................ 46 8.1 Timing Diagrams ..................................................... 44 9.1 9.2 9.3 9.4 9.5 9.6 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ Programming........................................................... Register Maps ......................................................... 46 46 46 53 54 58 10 Applications and Implementation...................... 72 10.1 Application Information.......................................... 72 10.2 Typical Applications .............................................. 73 11 Power Supply Recommendations ..................... 75 12 Layout................................................................... 76 12.1 Layout Guidelines ................................................. 76 12.2 Layout Example .................................................... 76 13 Device and Documentation Support ................. 77 13.1 13.2 13.3 13.4 13.5 Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 77 77 77 77 77 14 Mechanical, Packaging, and Orderable Information ........................................................... 77 4 Revision History Changes from Original (May 2015) to Revision A • 2 Page Changed from product preview to production data ................................................................................................................ 1 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 5 Device Comparison Table INTERFACE Serial LVDS JESD204B RESOLUTION (Bits) 25 MSPS 50 MSPS 80 MSPS 125 MSPS 160 MSPS 12 ADC3221 ADC3222 ADC3223 ADC3224 — 14 ADC3241 ADC3242 ADC3243 ADC3244 — 12 — ADC32J22 ADC32J23 ADC32J24 ADC32J25 14 — ADC32J42 ADC32J43 ADC32J44 ADC32J45 6 Pin Configuration and Functions DAM DAP AVDD DBM DBP SYNCP~ SYNCM~ NC NC AVDD NC NC RGZ Package 48-Pin VQFN Top View 48 47 46 45 44 43 42 41 40 39 38 37 OVRA 1 36 OVRB NC 2 35 NC DVDD 3 34 DVDD AVDD 4 33 PDN AVDD 5 32 AVDD NC 6 31 NC NC 7 30 NC AVDD 8 29 AVDD AVDD 9 28 AVDD INAP 10 27 INBP INAM 11 26 INBM AVDD 12 25 AVDD 13 14 15 16 17 18 19 20 21 22 23 24 SCLK SDATA SEN SDOUT AVDD CLKM CLKP AVDD RESET SYSREFP SYSREFM VCM GND Pad (Back Side) Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 3 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com Pin Functions PIN NAME I/O NO. DESCRIPTION AVDD 4, 5, 8, 9, 12, 17, 20, 25, 28, 29, 32, 39, 46 I Analog 1.8-V power supply CLKM 18 I Negative differential clock input for the ADC CLKP 19 I Positive differential clock input for the ADC DAM 48 O Negative serial JESD204B output for channel A DAP 47 O Positive serial JESD204B output for channel A DBM 45 O Negative serial JESD204B output for channel B DBP 44 O Positive serial JESD204B output for channel B DVDD 3,34 I Digital 1.8-V power supply GND PowerPAD™ I Ground, 0 V INAM 11 I Negative differential analog input for channel A INAP 10 I Positive differential analog input for channel A INBM 26 I Negative differential analog input for channel B INBP 27 I Positive differential analog input for channel B 2, 6, 7, 30, 31, 35, 37, 38, 40, 41 — Do not connect OVRA 1 O Overrange indicator for channel A OVRB 36 O Overrange indicator for channel B PDN 33 I Power-down control. This pin has an internal 150-kΩ pulldown resistor. RESET 21 I Hardware reset; active high. This pin has an internal 150-kΩ pulldown resistor. SCLK 13 I Serial interface clock input. This pin has an internal 150-kΩ pulldown resistor. SDATA 14 I Serial Interface data input. This pin has an internal 150-kΩ pulldown resistor. SDOUT 16 O Serial interface data output SEN 15 I Serial interface enable; active low. This pin has an internal 150-kΩ pullup resistor to AVDD. SYNCM~ 42 I Positive JESD204B synch input SYNCP~ 43 I Negative JESD204B synch input SYSREFM 23 I Negative external SYSREF input SYSREFP 22 I Positive external SYSREF input VCM 24 O Common-mode voltage output for analog inputs NC 4 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Supply voltage range, AVDD Supply voltage range, DVDD Voltage applied to input pins: Temperature range MAX UNIT 2.1 V –0.3 2.1 V INAP, INBP –0.3 AVDD + 0.3 V CLKP, CLKM –0.3 AVDD + 0.3 V SYSREFP, SYSREFM, SYNCP~, SYNCM~ –0.3 AVDD + 0.3 V SCLK, SEN, SDATA, RESET, PDN –0.3 AVDD + 0.3 V Operating free-air, TA –40 85 °C 125 °C 150 °C Operating junction, TJ Storage, Tstg (1) MIN –0.3 –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings V(ESD) (1) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) Electrostatic discharge VALUE UNIT ±2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT SUPPLIES AVDD Analog supply voltage range 1.7 1.8 1.9 V DVDD Digital supply voltage range 1.7 1.8 1.9 V ANALOG INPUT VID Differential input voltage VIC Input common-mode voltage For input frequencies < 450 MHz 2 VPP For input frequencies < 600 MHz 1 VPP VCM ± 0.025 V CLOCK INPUT Input clock frequency Sampling clock frequency Input clock amplitude (differential) 160 (1) 25 MSPS Sine wave, ac-coupled 1.5 V LPECL, ac-coupled 1.6 V LVDS, ac-coupled 0.7 V Input clock duty cycle 50% Input clock common-mode voltage 0.95 V DIGITAL OUTPUTS CLOAD Maximum external load capacitance from each output pin to GND 3.3 pF RLOAD Single-ended load resistance 100 Ω (1) With the clock divider enabled by default for divide-by-1. Maximum sampling clock frequency for the divide-by-4 option is 640 MSPS. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 5 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.4 Thermal Information ADC32J2x THERMAL METRIC (1) RGZ (VQFN) UNIT 48 PINS RθJA Junction-to-ambient thermal resistance 25.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 18.9 °C/W RθJB Junction-to-board thermal resistance 3.0 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.5 Electrical Characteristics Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, Maximum sampling rate, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG INPUT Differential input full-scale 2.0 VPP Input resistance Differential at dc 6.5 kΩ Input capacitance Differential at dc 5.2 pF 0.95 V VCM common-mode voltage output VCM output current capability 10 mA Input common-mode current Per analog input pin 1.5 µA/MSPS Analog input bandwidth (3 dB) 50-Ω differential source driving 50-Ω termination across INP and INM 450 MHz DC ACCURACY Offset error EG(REF) Gain error as a result of internal reference inaccuracy alone EG(CHAN) Gain error of channel alone –20 20 mV –3 3 %FS ±1 Temperature coefficient of EG(CHAN) –0.017 %FS Δ%FS/°C CHANNEL-TO-CHANNEL ISOLATION Crosstalk 6 Submit Documentation Feedback fIN = 10 MHz 105 dB fIN = 100 MHz 105 dB fIN = 200 MHz 105 dB fIN = 230 MHz 105 dB fIN = 300 MHz 105 dB Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 7.6 Electrical Characteristics: ADC32J22, ADC32J23 Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, Maximum sampling rate, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. ADC32J22 PARAMETER MIN TYP ADC clock frequency ADC32J23 MAX MIN TYP 50 Resolution 12 MAX UNIT 80 MSPS 12 Bits 1.8-V analog supply current 134 267 152 272 mA 1.8-V digital supply current 22 40 31 46 mA 281 435 329 450 mW Total power dissipation Global power-down dissipation 5 5 mW Wake-up time from global power-down 85 85 µs Standby power-down dissipation 99 105 mW Wake-up time from standby power-down 35 35 µs 7.7 Electrical Characteristics: ADC32J24, ADC32J25 Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, Maximum sampling rate, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. ADC32J24 PARAMETER MIN TYP ADC clock frequency ADC32J25 MAX MIN TYP 125 Resolution 12 1.8-V analog supply current 1.8-V digital supply current Total power dissipation Global power-down dissipation Wake-up time from global power-down Standby power-down dissipation Wake-up time from standby power-down Copyright © 2014–2015, Texas Instruments Incorporated MAX UNIT 160 MSPS 12 177 292 Bits 192 302 mA 46 65 56 80 mA 401 535 454 560 mW 5 5 mW 85 85 µs 112 118 mW 35 35 µs Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 7 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.8 AC Performance: ADC32J25 Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. ADC32J25 (fS = 160 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN TYP DITHER OFF MAX MIN TYP MAX UNIT DYNAMIC AC CHARACTERISTICS fIN = 10 MHz 70.3 70.5 69.8 70.0 fIN = 100 MHz 69.5 69.7 fIN = 170 MHz 68.6 69.1 fIN = 230 MHz 67.8 68.3 149.3 149.5 148.8 149.0 fIN = 100 MHz 148.5 148.7 fIN = 170 MHz 147.7 148.1 fIN = 230 MHz 146.8 147.3 fIN = 10 MHz 70.2 70.4 69.7 69.9 Signal-to-noise and distortion ratio fIN = 100 MHz 69.4 68.8 fIN = 170 MHz 68.4 68.8 fIN = 230 MHz 67.5 67.8 11.4 11.4 11.3 11.3 fIN = 100 MHz 11.2 11.3 fIN = 170 MHz 11.1 11.1 fIN = 230 MHz 10.9 10.9 91 88 86 85 fIN = 100 MHz 85 84 fIN = 170 MHz 83 82 fIN = 230 MHz 81 80 91 92 93 93 fIN = 100 MHz 92 93 fIN = 170 MHz 83 82 fIN = 230 MHz 81 80 fIN = 10 MHz 91 88 86 85 fIN = 100 MHz 85 84 fIN = 170 MHz 91 87 fIN = 230 MHz 87 87 99 95 98 94 fIN = 100 MHz 96 94 fIN = 170 MHz 91 90 fIN = 230 MHz 91 89 fIN = 70 MHz SNR Signal-to-noise ratio 68 fIN = 10 MHz fIN = 70 MHz Noise spectral density (averaged across Nyquist zone) NSD fIN = 70 MHz SINAD –147.5 67.3 fIN = 10 MHz fIN = 70 MHz ENOB Effective number of bits 10.9 fIN = 10 MHz fIN = 70 MHz SFDR Spurious-free dynamic range 78 fIN = 10 MHz fIN = 70 MHz HD2 Second-order harmonic distortion fIN = 70 MHz HD3 Third-order harmonic distortion 78 78 fIN = 10 MHz fIN = 70 MHz Non HD2, HD3 8 Spurious-free dynamic range (excluding HD2, HD3) Submit Documentation Feedback 87 dBFS dBFS/Hz dBFS Bits dBc dBc dBc dBc Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 AC Performance: ADC32J25 (continued) Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. ADC32J25 (fS = 160 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN fIN = 10 MHz IMD3 Total harmonic distortion Two-tone, third-order intermodulation distortion MAX MIN TYP 87 85 84 83 fIN = 100 MHz 83 82 fIN = 170 MHz 81 80 fIN = 230 MHz 78 77 fIN1 = 45 MHz, fIN2 = 50 MHz 91 91 86 86 fIN = 70 MHz THD TYP DITHER OFF fIN1 = 185 MHz, fIN2 = 190 MHz 75 MAX UNIT dBc dBFS DNL Differential nonlinearity fIN = 70 MHz ±0.1 ±0.1 LSBs INL Integrated nonlinearity fIN = 70 MHz ±0.4 ±0.4 LSBs Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 9 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.9 AC Performance: ADC32J24 Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. ADC32J24 (fS = 125 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN TYP DITHER OFF MAX MIN TYP MAX UNIT DYNAMIC AC CHARACTERISTICS fIN = 10 MHz 70.3 70.5 70.1 70.3 fIN = 100 MHz 70.1 70.2 fIN = 170 MHz 69.4 69.8 fIN = 230 MHz 68.7 69.2 148.3 148.5 148.1 148.3 fIN = 100 MHz 148.0 148.2 fIN = 170 MHz 147.3 147.8 fIN = 230 MHz 146.7 147.2 fIN = 10 MHz 70.3 70.4 70.1 70.3 Signal-to-noise and distortion ratio fIN = 100 MHz 70.0 70.1 fIN = 170 MHz 69.2 69.6 fIN = 230 MHz 68.3 68.8 11.4 11.4 11.4 11.4 fIN = 100 MHz 11.3 11.4 fIN = 170 MHz 11.2 11.3 fIN = 230 MHz 11.1 11.1 93 92 91 90 fIN = 100 MHz 90 90 fIN = 170 MHz 85 84 fIN = 230 MHz 82 81 93 92 91 90 fIN = 100 MHz 90 90 fIN = 170 MHz 85 84 fIN = 230 MHz 82 81 fIN = 10 MHz 96 92 95 90 fIN = 100 MHz 95 92 fIN = 170 MHz 88 86 fIN = 230 MHz 90 93 98 96 99 95 fIN = 100 MHz 97 96 fIN = 170 MHz 97 94 fIN = 230 MHz 96 91 fIN = 70 MHz SNR Signal-to-noise ratio 68.8 fIN = 10 MHz fIN = 70 MHz Noise spectral density (averaged across Nyquist zone) NSD fIN = 70 MHz SINAD –146.8 67.6 fIN = 10 MHz fIN = 70 MHz ENOB Effective number of bits 11 fIN = 10 MHz fIN = 70 MHz SFDR Spurious-free dynamic range 78.5 fIN = 10 MHz fIN = 70 MHz HD2 Second-order harmonic distortion fIN = 70 MHz HD3 Third-order harmonic distortion 78.5 80 fIN = 10 MHz fIN = 70 MHz Non HD2, HD3 10 Spurious-free dynamic range (excluding HD2, HD3) Submit Documentation Feedback 87 dBFS dBFS/Hz dBFS Bits dBc dBc dBc dBc Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 AC Performance: ADC32J24 (continued) Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. ADC32J24 (fS = 125 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN fIN = 10 MHz IMD3 Total harmonic distortion Two-tone, third-order intermodulation distortion MAX MIN TYP 91 88 89 87 fIN = 100 MHz 88 88 fIN = 170 MHz 83 82 fIN = 230 MHz 80 79 fIN1 = 45 MHz, fIN2 = 50 MHz 91 91 86 86 fIN = 70 MHz THD TYP DITHER OFF fIN1 = 185 MHz, fIN2 = 190 MHz 75 MAX UNIT dBc dBFS DNL Differential nonlinearity fIN = 70 MHz ±0.1 ±0.1 LSBs INL Integrated nonlinearity fIN = 70 MHz ±0.4 ±0.4 LSBs Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 11 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.10 AC Performance: ADC32J23 Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. ADC32J23 (fS = 80 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN TYP DITHER OFF MAX MIN TYP MAX UNIT DYNAMIC AC CHARACTERISTICS fIN = 10 MHz 70.3 70.4 70.1 70.2 fIN = 100 MHz 70.0 70.2 fIN = 170 MHz 69.6 69.9 fIN = 230 MHz 69.1 69.3 146.3 146.4 146.2 146.3 fIN = 100 MHz 146.0 146.2 fIN = 170 MHz 145.6 145.9 fIN = 230 MHz 145.1 145.3 fIN = 10 MHz 70.2 70.4 70.1 70.3 Signal-to-noise and distortion ratio fIN = 100 MHz 70.0 70.1 fIN = 170 MHz 69.5 69.7 fIN = 230 MHz 68.7 69.0 fIN = 70 MHz SNR Signal-to-noise ratio 68.7 fIN = 10 MHz fIN = 70 MHz Noise spectral density (averaged across Nyquist zone) NSD fIN = 70 MHz SINAD fIN = 10 MHz ENOB Effective number of bits –144.8 67.6 11.4 11.4 fIN = 70 MHz 11 11.4 11.4 fIN = 100 MHz 11.3 11.3 fIN = 170 MHz 11.2 11.3 fIN = 230 MHz 11.1 11.1 96 92 95 92 fIN = 100 MHz 91 88 fIN = 170 MHz 85 84 fIN = 230 MHz 81 80 96 95 95 94 fIN = 100 MHz 94 92 fIN = 170 MHz 85 84 fIN = 230 MHz 81 80 fIN = 10 MHz 98 92 99 92 fIN = 100 MHz 91 88 fIN = 170 MHz 87 85 fIN = 230 MHz 83 82 99 92 98 92 fIN = 100 MHz 97 92 fIN = 170 MHz 95 92 fIN = 230 MHz 95 92 fIN = 10 MHz fIN = 70 MHz SFDR Spurious-free dynamic range 79.5 fIN = 10 MHz fIN = 70 MHz HD2 Second-order harmonic distortion fIN = 70 MHz HD3 Third-order harmonic distortion 79.5 81 fIN = 10 MHz fIN = 70 MHz Non HD2, HD3 12 Spurious-free dynamic range (excluding HD2, HD3) Submit Documentation Feedback 87 dBFS dBFS/Hz dBFS Bits dBc dBc dBc dBc Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 AC Performance: ADC32J23 (continued) Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. ADC32J23 (fS = 80 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN fIN = 10 MHz IMD3 Total harmonic distortion Two-tone, third-order intermodulation distortion MAX MIN TYP 93 90 93 89 fIN = 100 MHz 88 85 fIN = 170 MHz 82 81 fIN = 230 MHz 79 78 fIN1 = 45 MHz, fIN2 = 50 MHz 90 90 89 89 fIN = 70 MHz THD TYP DITHER OFF fIN1 = 185 MHz, fIN2 = 190 MHz 77 MAX UNIT dBc dBFS DNL Differential nonlinearity fIN = 70 MHz ±0.1 ±0.1 LSBs INL Integrated nonlinearity fIN = 70 MHz ±0.4 ±0.4 LSBs Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 13 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.11 AC Performance: ADC32J22 Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. ADC32J22 (fS = 50 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN TYP 69.3 DITHER OFF MAX MIN TYP MAX UNIT DYNAMIC AC CHARACTERISTICS fIN = 10 MHz SNR Signal-to-noise ratio 70.2 70.3 fIN = 70 MHz 70.0 70.1 fIN = 100 MHz 69.9 70.0 fIN = 170 MHz 69.4 69.7 fIN = 230 MHz 68.0 68.1 fIN = 10 MHz 144.1 144.3 fIN = 70 MHz 143.9 144.1 fIN = 100 MHz 143.8 144.0 fIN = 170 MHz 143.4 143.7 fIN = 230 MHz 141.9 142.1 70.1 70.2 69.9 70.0 Signal-to-noise and distortion ratio fIN = 100 MHz 69.8 69.9 fIN = 170 MHz 69.2 69.5 fIN = 230 MHz 67.6 67.6 Noise spectral density (averaged across Nyquist zone) NSD fIN = 10 MHz –143.3 68.1 fIN = 70 MHz SINAD fIN = 10 MHz ENOB Effective number of bits 11.4 11.4 fIN = 70 MHz 11.3 11.3 fIN = 100 MHz 11.3 11.3 fIN = 170 MHz 11.2 11.2 fIN = 230 MHz 10.9 10.9 95 92 fIN = 70 MHz 94 90 fIN = 100 MHz 91 89 fIN = 170 MHz 85 85 fIN = 230 MHz 82 82 fIN = 10 MHz SFDR Spurious-free dynamic range fIN = 10 MHz HD2 Second-order harmonic distortion Third-order harmonic distortion 96 95 98 97 fIN = 100 MHz 92 91 fIN = 170 MHz 85 85 fIN = 230 MHz 82 82 95 92 fIN = 70 MHz 94 90 fIN = 100 MHz 91 89 fIN = 170 MHz 88 88 fIN = 230 MHz 82 82 fIN = 10 MHz Non HD2, HD3 14 Spurious-free dynamic range (excluding HD2, HD3) Submit Documentation Feedback 80.5 fIN = 70 MHz fIN = 10 MHz HD3 11 80.5 81 98 91 fIN = 70 MHz 87 95 92 fIN = 100 MHz 90 90 fIN = 170 MHz 96 91 fIN = 230 MHz 93 91 dBFS dBFS/Hz dBFS Bits dBc dBc dBc dBc Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 AC Performance: ADC32J22 (continued) Typical values are at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. ADC32J22 (fS = 50 MSPS) DITHER ON PARAMETER TEST CONDITIONS MIN TYP 78 92 88 fIN = 70 MHz 91 87 fIN = 100 MHz 88 86 fIN = 170 MHz 83 82 fIN = 230 MHz 78 78 fIN1 = 45 MHz, fIN2 = 50 MHz 89 89 86 86 fIN = 10 MHz THD IMD3 Total harmonic distortion Two-tone, third-order intermodulation distortion DITHER OFF fIN1 = 185 MHz, fIN2 = 190 MHz MAX MIN TYP MAX UNIT dBc dBFS DNL Differential nonlinearity fIN = 70 MHz ±0.1 ±0.1 LSBs INL Integrated nonlinearity fIN = 70 MHz ±0.4 ±0.4 LSBs Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 15 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.12 Digital Characteristics The dc specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level 0 or 1. AVDD = DVDD = 1.8 V and –1-dBFS differential input, unless otherwise noted. PARAMETER TEST CONDITIONS MIN 1.2 TYP MAX UNIT DIGITAL INPUTS (RESET, SCLK, SEN, SDATA, PDN) (1) VIH High-level input voltage All digital inputs support 1.8-V and 3.3-V logic levels VIL Low-level input voltage All digital inputs support 1.8-V and 3.3-V logic levels IIH SEN High-level input current IIL Low-level input current V 0.4 V 0 µA RESET, SCLK, SDATA, PDN 10 µA SEN 10 µA 0 µA RESET, SCLK, SDATA, PDN DIGITAL INPUTS (SYNCP~, SYNCM~, SYSREFP, SYSREFM) VIH High-level input voltage 1.3 V VIL Low-level input voltage 0.5 V V(CM_DIG) Common-mode voltage for SYNC~ and SYSREF 0.9 V DVDD V DIGITAL OUTPUTS (SDOUT, OVRA, OVRB) VOH High-level output voltage VOL Low-level output voltage DVDD – 0.1 0.1 V DIGITAL OUTPUTS (JESD204B Interface: DxP, DxM) (2) VOH High-level output voltage AVDD V VOL Low-level output voltage AVDD – 0.4 V VOD Output differential voltage 0.4 V VOC Output common-mode voltage AVDD – 0.2 V Transmitter short-circuit current zos (2) 16 –100 Single-ended output impedance Output capacitance inside the device, from either output to ground Output capacitance (1) Transmitter pins shorted to any voltage between –0.25 V and 1.45 V 100 mA 50 Ω 2 pF The RESET, SCLK, SDATA, and PDN pins have a 150-kΩ (typical) internal pulldown resistor to ground and the SEN pin has a 150-kΩ (typical) pullup resistor to AVDD. 50-Ω, single-ended external termination to 1.8 V. Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 7.13 Timing Requirements Typical values are at 25°C, AVDD = DVDD = 1.8 V, and –1-dBFS differential input, unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = 85°C. See Figure 143. MIN TYP MAX UNIT 0.85 1.25 1.65 ns SAMPLE TIMING CHARACTERISTICS Aperture delay Aperture delay matching between two channels on the same device Aperture delay matching between two devices at the same temperature and supply voltage Aperture jitter ±70 ps ±150 ps 200 fS rms Wake-up time to valid data after coming out of STANDBY mode 35 100 µs Wake-up time to valid data after coming out of global power-down 85 300 µs tSU_SYNC~ Setup time for SYNC~ referenced to input clock rising edge tH_SYNC~ Hold time for SYNC~ referenced to input clock rising edge tSU_SYSREF Setup time for SYSREF referenced to input clock rising edge tH_SYSREF Hold time for SYSREF referenced to input clock rising edge 1 ns 100 ps 1 ns 100 ps CML OUTPUT TIMING CHARACTERISTICS Unit interval 320 Serial output data rate tR, tF 1667 ps 3.125 Gbps Total jitter: 3.125 Gbps (20X mode, fS = 156.25 MSPS) 0.3 P-PUI Data rise time, data fall time: rise and fall times measured from 20% to 80%, differential output waveform, 600 Mbps ≤ bit rate ≤ 3.125 Gbps 105 ps Table 1. Latency in Different Modes (1) (2) MODE 20X 40X LATENCY (N Cycles) TYPICAL DATA DELAY (tD, ns) ADC latency PARAMETER 17 0.29 × tS + 3 Normal OVR latency 9 0.5 × tS + 2 Fast OVR latency 7 0.5 × tS + 2 From SYNC~ falling edge to CGS phase (3) 15 0.3 × tS + 4 From SYNC~ rising edge to ILA sequence (4) 17 0.3 × tS + 4 ADC latency 16 0.85 × tS + 3.9 Normal OVR latency 9 0.5 × tS + 2 Fast OVR latency 7 0.5 × tS + 2 From SYNC~ falling edge to CGS phase (3) 14 0.9 × tS + 4 12 0.9 × tS + 4 From SYNC~ rising edge to ILA sequence (1) (2) (3) (4) (4) Overall latency = latency + tD. tS is the time period of the ADC conversion clock. Latency is specified for subclass 2. In subclass 0, the SYNC~ falling edge to CGS phase latency is 16 clock cycles in 10X mode and 15 clock cycles in 20X mode. Latency is specified for subclass 2. In subclass 0, the SYNC~ rising edge to ILA sequence latency is 11 clock cycles in 10X mode and 11 clock cycles in 20X mode. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 17 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.14 Typical Characteristics: ADC32J25 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, 32k-point FFT, dither enabled, and special modes written, unless otherwise noted. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 16 32 48 Frequency (MHz) 64 0 80 fS = 160 MSPS, SNR = 70.3 dBFS, fIN = 10 MHz, SFDR = 92.6 dBc 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) 64 80 D202 Figure 2. FFT for 10-MHz Input Signal (Dither Off) 0 -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 16 32 48 Frequency (MHz) 64 80 0 16 D203 fS = 160 MSPS, SNR = 69.8 dBFS, fIN = 70 MHz, SFDR = 86 dBc 32 48 Frequency (MHz) 64 80 D204 fS = 160 MSPS, SNR = 70.1 dBFS, fIN = 70 MHz, SFDR = 85 dBc Figure 3. FFT for 70-MHz Input Signal (Dither On) Figure 4. FFT for 70-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) 32 48 Frequency (MHz) fS = 160 MSPS, SNR = 70.5 dBFS, fIN = 10 MHz, SFDR = 92.6 dBc Figure 1. FFT for 10-MHz Input Signal (Dither On) -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 16 32 48 Frequency (MHz) 64 80 D205 fS = 160 MSPS, SNR = 69.1 dBFS, fIN = 170 MHz, SFDR = 83 dBc Figure 5. FFT for 170-MHz Input Signal (Dither On) 18 16 D201 Submit Documentation Feedback 0 16 32 48 Frequency (MHz) 64 80 D206 fS = 160 MSPS, SNR = 69.3 dBFS, fIN = 170 MHz, SFDR = 83 dBc Figure 6. FFT for 170-MHz Input Signal (Dither Off) Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J25 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, 32k-point FFT, dither enabled, and special modes written, unless otherwise noted. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 16 32 48 Frequency (MHz) 64 0 80 fS = 160 MSPS, SNR = 68.1 dBFS, fIN = 270 MHz, SFDR = 78.6 dBc 0 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) 0 -40 -50 -60 -70 -80 -60 -70 -80 -90 -100 -110 -110 -120 -120 80 0 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) 0 -10 -40 -50 -60 -70 -80 -60 -70 -80 -90 -100 -110 -110 -120 -120 80 D211 fS = 160 MSPS, IMD = 92.3 dBFS, fIN1 = 46 MHz, fIN2 = 50 MHz Copyright © 2014–2015, Texas Instruments Incorporated D210 -50 -100 Figure 11. FFT for Two-Tone Input Signal (–7 dBFS at 46 MHz and 50 MHz) 80 -40 -90 64 64 Figure 10. FFT for 450-MHz Input Signal (Dither Off) 0 32 48 Frequency (MHz) 32 48 Frequency (MHz) fS = 160 MSPS, SNR = 63 dBFS, fIN = 450 MHz, SFDR = 66.6 dBc Figure 9. FFT for 450-MHz Input Signal (Dither On) 16 16 D209 fS = 160 MSPS, SNR = 62.9 dBFS, fIN = 450 MHz, SFDR = 66 dBc 0 D208 -50 -100 64 80 -40 -90 32 48 Frequency (MHz) 64 Figure 8. FFT for 270-MHz Input Signal (Dither Off) -10 16 32 48 Frequency (MHz) fS = 160 MSPS, SNR = 68.6 dBFS, fIN = 270 MHz, SFDR = 78.9 dBc Figure 7. FFT for 270-MHz Input Signal (Dither On) 0 16 D207 0 16 32 48 Frequency (MHz) 64 80 D212 fS = 160 MSPS, IMD = 99.3 dBFS, fIN1 = 46 MHz, fIN2 = 50 MHz Figure 12. FFT for Two-Tone Input Signal (–36 dBFS at 46 MHz and 50 MHz) Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 19 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com Typical Characteristics: ADC32J25 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, 32k-point FFT, dither enabled, and special modes written, unless otherwise noted. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 16 32 48 Frequency (MHz) 64 80 0 fS = 160 MSPS, IMD = 82.5 dBFS, fIN1 = 185 MHz, fIN2 = 190 MHz -80 -80 -85 -85 Two-Tone IMD (dBFS) Two-Tone IMD (dBFS) 64 80 D214 Figure 14. FFT for Two-Tone Input Signal (–36 dBFS at 185 MHz and 190 MHz) -90 -95 -100 -105 -90 -95 -100 -105 -31 -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -110 -35 -7 -31 D215 Figure 15. Intermodulation Distortion vs Input Amplitude (46 MHz and 50 MHz) -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -7 D216 Figure 16. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) 100 71 Dither_EN Dither_DIS Dither_EN Dither_DIS 70 92 69 SFDR (dBc) SNR (dBFS) 32 48 Frequency (MHz) fS = 160 MSPS, IMD = 98.9 dBFS, fIN1 = 185 MHz, fIN2 = 190 MHz Figure 13. FFT for Two-Tone Input Signal (–7 dBFS at 185 MHz and 190 MHz) -110 -35 16 D213 68 84 76 67 68 66 60 65 0 50 100 150 200 250 Frequency (MHz) 300 350 Figure 17. Signal-to-Noise Ratio vs Input Frequency 20 Submit Documentation Feedback 400 D217 0 50 100 150 200 250 Frequency (MHz) 300 350 400 D218 Figure 18. Spurious-Free Dynamic Range vs Input Frequency Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J25 (continued) Typical values are at TA = 25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, 32k-point FFT, dither enabled, and special modes written, unless otherwise noted. 120 74.5 10 MHz 70 MHz 100 MHz 170 MHz 10 MHz 70 MHz 100 MHz 170 MHz 110 70.5 SFDR (dBc) 68.5 100 90 66.5 80 64.5 70 60 62.5 1 2 3 4 Digital Gain (dB) 5 0 6 Figure 19. Signal-to-Noise Ratio vs Digital Gain and Input Frequency 73 120 69 90 68 60 30 68 60 67 30 67 0 66 -70 -10 SNR (dBFS) 90 SFDR (dBc,dBFS) 69 -20 D220 70 120 -40 -30 Amplitude (dBFS) 0 D221 Figure 21. Performance vs Input Amplitude (30 MHz) 71 0 -60 -50 -40 -30 Amplitude (dBFS) -20 -10 100 SNR SFDR 70.6 90 70.4 80 70.2 70 60 1.1 D223 Figure 23. Performance vs Input Common-Mode Voltage (30 MHz) SNR (dBFS) 100 SFDR (dBc) SNR (dBFS) 70.8 Copyright © 2014–2015, Texas Instruments Incorporated D222 69.75 110 0.9 0.95 1 1.05 Input Common - Mode Voltage (V) 0 Figure 22. Performance vs Input Amplitude (170 MHz) SNR SFDR 70 0.85 6 71 70 -50 5 180 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 150 150 -60 3 4 Digital Gain (dB) 72 71 66 -70 2 Figure 20. Spurious-Free Dynamic Range vs Digital Gain and Input Frequency 210 SNR (dBFS) SFDR (dBc) 180 SFDR (dBFS) 72 1 D219 SFDR (dBc,dBFS) 0 SNR (dBFS) 230 MHz 270 MHz 400 MHz 69.5 90 69.25 80 69 70 68.75 60 68.5 0.85 0.9 0.95 1 1.05 Input Common - Mode Voltage (V) SFDR (dBc) SNR (dBFS) 72.5 230 MHz 270 MHz 400 MHz 50 1.1 D224 Figure 24. Performance vs Input Common-Mode Voltage (170 MHz) Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 21 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com Typical Characteristics: ADC32J25 (continued) Typical values are at TA = 25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, 32k-point FFT, dither enabled, and special modes written, unless otherwise noted. 69.6 94 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 92 AVDD = 1.85 V AVDD = 1.9 V AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 69.4 AVDD = 1.85 V AVDD = 1.9 V SNR (dBFS) SFDR (dBc) 69.2 90 88 69 68.8 68.6 86 68.4 84 -40 -15 10 35 Temperature (°C) 60 68.2 -40 85 -15 D225 Figure 25. Spurious-Free Dynamic Range vs AVDD Supply and Temperature 10 35 Temperature (°C) 60 85 D226 Figure 26. Signal-to-Noise Ratio vs AVDD Supply and Temperature 69.5 93 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V 92 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V DVDD = 1.9 V 69.3 DVDD = 1.85 V DVDD = 1.9 V SNR (dBFS) SFDR (dBc) 91 90 89 88 69.1 68.9 87 68.7 86 85 -40 -15 10 35 Temperature (°C) 60 68.5 -40 85 D227 Figure 27. Spurious-Free Dynamic Range vs DVDD Supply and Temperature 84 90 110 85 D128 85 140 SNR SFDR 120 80 100 75 80 72 80 70 60 68 70 65 40 60 20 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) 60 2.2 D229 Figure 29. Performance vs Clock Amplitude (40 MHz) Submit Documentation Feedback 55 0.2 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) SFDR (dBc) 90 SNR (dBFS) 76 SFDR (dBc) SNR (dBFS) 60 100 64 0.2 22 10 35 Temperature (°C) Figure 28. Signal-to-Noise Ratio vs DVDD Supply and Temperature SNR SFDR 80 -15 0 2.2 D230 Figure 30. Performance vs Clock Amplitude (150 MHz) Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J25 (continued) Typical values are at TA = 25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, 32k-point FFT, dither enabled, and special modes written, unless otherwise noted. 70.8 100 96 70.2 92 70 88 69.8 69.6 30 84 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 94 SNR SFDR 70.3 SNR (dBFS) 70.4 SFDR (dBc) SNR (dBFS) SNR SFDR 69.8 90 69.3 88 68.8 86 68.3 84 67.8 30 80 70 92 35 40 D231 Figure 31. Performance vs Clock Duty Cycle (40 MHz) 45 50 55 60 Input Clock Duty Cycle (%) 65 SFDR (dBc) 70.6 82 70 D232 Figure 32. Performance vs Clock Duty Cycle (150 MHz) 43.03 40 20 0.61 0.15 2046 2045 2044 0 2047 Code Occurrence (%) 60 D233 Output Code (LSB) RMS noise = 1.3 LSBs Figure 33. Idle Channel Histogram Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 23 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.15 Typical Characteristics: ADC32J24 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 0 62.5 fS = 125 MSPS, SNR = 70.2 dBFS, fIN = 10 MHz, SFDR = 99.3 dBc 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) 50 62.5 D402 Figure 35. FFT for 10-MHz Input Signal (Dither Off) 0 -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 0 12.5 D403 fS = 125 MSPS, SNR = 70 dBFS, fIN = 70 MHz, SFDR = 91 dBc 0 -10 -20 -20 -30 -30 Amplitude (dBFS) 0 -50 -60 -70 -80 62.5 D404 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 50 Figure 37. FFT for 70-MHz Input Signal (Dither Off) -10 -40 25 37.5 Frequency (MHz) fS = 125 MSPS, SNR = 70.2 dBFS, fIN = 70 MHz, SFDR = 90 dBc Figure 36. FFT for 70-MHz Input Signal (Dither On) Amplitude (dBFS) 25 37.5 Frequency (MHz) fS = 125 MSPS, SNR = 70.6 dBFS, fIN = 10 MHz, SFDR = 93.8 dBc Figure 34. FFT for 10-MHz Input Signal (Dither On) -120 0 24 12.5 D401 12.5 25 37.5 Frequency (MHz) 50 62.5 D404 0 12.5 25 37.5 Frequency (MHz) 50 62.5 D406 fS = 125 MSPS, SNR = 69.3 dBFS, fIN = 170 MHz, SFDR = 85 dBc fS = 125 MSPS, SNR = 69.9 dBFS, fIN = 70 MHz, SFDR = 84 dBc Figure 38. FFT for 170-MHz Input Signal (Dither On) Figure 39. FFT for 170-MHz Input Signal (Dither Off) Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J24 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. -40 -50 -60 -70 -80 -60 -70 -80 -90 -100 -100 -110 -110 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 0 12.5 D407 fS = 125 MSPS, SNR = 68.8 dBFS, fIN = 270 MHz, SFDR = 80.5 dBc 25 37.5 Frequency (MHz) 50 62.5 D408 fS = 125 MSPS, SNR = 69.3 dBFS, fIN = 270 MHz, SFDR = 79.9 dBc Figure 40. FFT for 270-MHz Input Signal (Dither On) Figure 41. FFT for 270-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) -50 -90 -120 -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 0 12.5 D409 fS = 125 MSPS, SNR = 63.5 dBFS, fIN = 450 MHz, SFDR = 68.6 dBc 25 37.5 Frequency (MHz) 50 62.5 D410 fS = 125 MSPS, SNR = 63.8 dBFS, fIN = 450 MHz, SFDR = 68.8 dBc Figure 42. FFT for 450-MHz Input Signal (Dither On) Figure 43. FFT for 450-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) -40 -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 D411 fS = 125 MSPS, IMD = 94.7 dBFS, fIN1 = 46 MHz, fIN2 = 50 MHz Figure 44. FFT for Two-Tone Input Signal (–7dBFS at 46 MHz and 50 MHz) Copyright © 2014–2015, Texas Instruments Incorporated 0 12.5 25 37.5 Frequency (MHz) 50 62.5 D412 fS = 125 MSPS, IMD = 98.73 dBFS, fIN1 = 46 MHz, fIN2 = 50 MHz Figure 45. FFT for Two-Tone Input Signal (–36 dBFS at 46 MHz and 50 MHz) Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com Typical Characteristics: ADC32J24 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 0 fS = 125 MSPS, IMD = 96.2 dBFS, fIN1 = 185 MHz, fIN2 = 190 MHz -80 -80 -85 -85 Two-Tone IMD (dBFS) Two-Tone IMD (dBFS) 50 62.5 D414 Figure 47. FFT for Two-Tone Input Signal (–36 dBFS at 185 MHz and 190 MHz) -90 -95 -100 -105 -90 -95 -100 -105 -110 -35 -31 -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -110 -35 -7 -31 D415 Figure 48. Intermodulation Distortion vs Input Amplitude (46 MHz and 50 MHz) -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -7 D416 Figure 49. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) 100 71.1 Dither_EN Dither_DIS 70.5 Dither_EN Dither_DIS 95 69.9 SFDR (dBc) SNR (dBFS) 25 37.5 Frequency (MHz) fS = 125 MSPS, IMD = 97 dBFS, fIN1 = 185 MHz, fIN2 = 190 MHz Figure 46. FFT for Two-Tone Input Signal (–7 dBFS at 185 MHz and 190 MHz) 69.3 90 85 68.7 80 68.1 75 70 67.5 0 50 100 150 200 250 Frequency (MHz) 300 350 Figure 50. Signal-to-Noise Ratio vs Input Frequency 26 12.5 D413 Submit Documentation Feedback 400 D417 0 50 100 150 200 250 Frequency (MHz) 300 350 400 D418 Figure 51. Spurious-Free Dynamic Range vs Input Frequency Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J24 (continued) Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 120 74.5 10 MHz 70 MHz 100 MHz 170 MHz 10 MHz 70 MHz 100 MHz 170 MHz 110 70.5 SFDR (dBc) 68.5 100 90 66.5 80 64.5 70 60 62.5 0 1 2 3 4 Digital Gain (dB) 5 0 6 71 160 70 120 69 80 68 40 67 -70 0 -50 -40 -30 Amplitude (dBFS) -20 -10 3 4 Digital Gain (dB) 72 SNR (dBFS) 72 240 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 200 -60 2 5 6 D420 Figure 53. Spurious-Free Dynamic Range vs Digital Gain and Input Frequency SFDR (dBc,dBFS) 73 1 D419 Figure 52. Signal-to-Noise Ratio vs Digital Gain and Input Frequency SNR (dBFS) 230 MHz 270 MHz 400 MHz 71 180 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 150 70 120 69 90 68 60 67 30 66 -70 SFDR (dBc,dBFS) SNR (dBFS) 72.5 230 MHz 270 MHz 400 MHz 0 -60 -50 -40 -30 Amplitude (dBFS) -20 -10 0 D422 0 Figure 55. Performance vs Input Amplitude (170 MHz) D421 Figure 54. Performance vs Input Amplitude (30 MHz) 110 70 100 70.8 100 70.6 90 70.4 80 70.2 70 70 0.85 0.9 0.95 1 1.05 Input Common - Mode Voltage (V) 60 1.1 D423 Figure 56. Performance vs Input Common-Mode Voltage (30 MHz) Copyright © 2014–2015, Texas Instruments Incorporated SNR (dBFS) SNR SFDR SFDR (dBc) SNR (dBFS) SNR SFDR 69.8 90 69.6 80 69.4 70 69.2 60 69 0.85 0.9 0.95 1 1.05 Input Common - Mode Voltage (V) SFDR (dBc) 71 50 1.1 D424 Figure 57. Performance vs Input Common-Mode Voltage (170 MHz) Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 27 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com Typical Characteristics: ADC32J24 (continued) Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 69.8 90 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 69.6 SNR (dBFS) SFDR (dBc) 88 86 84 69.2 69 -15 10 35 Temperature (°C) 60 68.8 -40 85 -15 D425 Figure 58. Spurious-Free Dynamic Range vs AVDD Supply and Temperature 10 35 Temperature (°C) 60 85 D426 Figure 59. Signal-to-Noise Ratio vs AVDD Supply and Temperature 70 89 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V 88 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V DVDD = 1.9 V 69.8 87 SNR (dBFS) SFDR (dBc) AVDD = 1.85 V AVDD = 1.9 V 69.4 82 80 -40 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V 86 DVDD = 1.85 V DVDD = 1.9 V 69.6 69.4 85 69.2 84 83 -40 -15 10 35 Temperature (°C) 60 69 -40 85 D427 Figure 60. Spurious-Free Dynamic Range vs DVDD Supply and Temperature 84 90 110 85 D428 85 140 SNR SFDR 120 80 100 75 80 72 80 70 60 68 70 65 40 60 20 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) 60 2.2 D429 Figure 62. Performance vs Clock Amplitude (40 MHz) Submit Documentation Feedback 55 0.2 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) SFDR (dBc) 90 SNR (dBFS) 76 SFDR (dBc) SNR (dBFS) 60 100 64 0.2 28 10 35 Temperature (°C) Figure 61. Signal-to-Noise Ratio vs DVDD Supply and Temperature SNR SFDR 80 -15 0 2.2 D430 Figure 63. Performance vs Clock Amplitude (150 MHz) Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J24 (continued) Typical values are at TA = 25°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 70.8 104 100 70.4 96 70.2 92 70 69.8 30 88 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 90 SNR SFDR 70.3 SNR (dBFS) 70.6 SFDR (dBc) SNR (dBFS) SNR SFDR 69.8 86 69.3 84 68.8 82 68.3 80 67.8 30 84 70 88 35 40 D431 Figure 64. Performance vs Clock Duty Cycle (40 MHz) 45 50 55 60 Input Clock Duty Cycle (%) 65 SFDR (dBc) 70.8 78 70 D432 Figure 65. Performance vs Clock Duty Cycle (150 MHz) 100 Code Occurrence (%) 80 60 40 20 2047 2046 2045 2044 2043 0 D433 Output Code (LSB) RMS noise = 1.4 LSBs Figure 66. Idle Channel Histogram Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 29 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.16 Typical Characteristics: ADC32J23 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 8 16 24 Frequency (MHz) 32 0 40 fS = 80 MSPS, SNR = 70.1 dBFS, fIN = 10 MHz, SFDR = 95.4 dBc -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) 0 -50 -60 -70 -80 40 D602 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 8 16 24 Frequency (MHz) 32 40 0 8 D603 fS = 80 MSPS, SNR = 70.1 dBFS, fIN = 70 MHz, SFDR = 93 dBc -10 -10 -20 -20 -30 -30 Amplitude (dBFS) 0 -50 -60 -70 -80 40 D604 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 32 Figure 70. FFT for 70-MHz Input Signal (Dither Off) 0 -40 16 24 Frequency (MHz) fS = 80 MSPS, SNR = 70.3 dBFS, fIN = 70 MHz, SFDR = 92 dBc Figure 69. FFT for 70-MHz Input Signal (Dither On) Amplitude (dBFS) 32 Figure 68. FFT for 10-MHz Input Signal (Dither Off) 0 -40 16 24 Frequency (MHz) fS = 80 MSPS, SNR = 70.4 dBFS, fIN = 10 MHz, SFDR = 89.7 dBc Figure 67. FFT for 10-MHz Input Signal (Dither On) -120 0 8 16 24 Frequency (MHz) 32 40 D605 fS = 80 MSPS, SNR = 69.3 dBFS, fIN = 170 MHz, SFDR = 86 dBc Figure 71. FFT for 170-MHz Input Signal (Dither On) 30 8 D601 Submit Documentation Feedback 0 8 16 24 Frequency (MHz) 32 40 D606 fS = 80 MSPS, SNR = 69.6 dBFS, fIN = 10 MHz, SFDR = 85 dBc Figure 72. FFT for 170-MHz Input Signal (Dither Off) Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J23 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 8 16 24 Frequency (MHz) 32 40 0 fS = 80 MSPS, SNR = 68.9 dBFS, fIN = 270 MHz, SFDR = 76.9 dBc 32 40 D608 Figure 74. FFT for 270-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) 16 24 Frequency (MHz) fS = 80 MSPS, SNR = 69 dBFS, fIN = 270 MHz, SFDR = 76.5 dBc Figure 73. FFT for 270-MHz Input Signal (Dither On) -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 8 16 24 Frequency (MHz) 32 40 0 8 D609 fS = 80 MSPS, SNR = 62.7 dBFS, fIN = 450 MHz, SFDR = 67.6 dBc 16 24 Frequency (MHz) 32 40 D610 fS = 80 MSPS, SNR = 61.8 dBFS, fIN = 450 MHz, SFDR = 67.4 dBc Figure 75. FFT for 450-MHz Input Signal (Dither On) Figure 76. FFT for 450-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) 8 D607 -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 8 16 24 Frequency (MHz) 32 40 D611 fS = 80 MSPS, IMD = 96 dBFS, fIN1 = 46 MHz, fIN2 = 50 MHz Figure 77. FFT for Two-Tone Input Signal (–7 dBFS at 46 MHz and 50 MHz) Copyright © 2014–2015, Texas Instruments Incorporated 0 8 16 24 Frequency (MHz) 32 40 D612 fS = 80 MSPS, IMD = 98.5 dBFS, fIN1 = 46 MHz, fIN2 = 50 MHz Figure 78. FFT for Two-Tone Input Signal (–36 dBFS at 46 MHz and 50 MHz) Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 31 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com Typical Characteristics: ADC32J23 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 8 16 24 Frequency (MHz) 32 40 0 fS = 80 MSPS, IMD = 92.1 dBFS, fIN1 = 185 MHz, fIN2 = 190 MHz 16 24 Frequency (MHz) 32 40 D614 fS = 80 MSPS, IMD = 97.5 dBFS, fIN1 = 185 MHz, fIN2 = 190 MHz Figure 79. FFT for Two-Tone Input Signal (–7 dBFS at 185 MHz and 190 MHz) Figure 80. FFT for Two-Tone Input Signal (–36 dBFS at 185 MHz and 190 MHz) -80 -80 -85 -85 Two-Tone IMD (dBFS) Two-Tone IMD (dBFS) 8 D613 -90 -95 -100 -105 -90 -95 -100 -105 -110 -35 -31 -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -110 -35 -7 -31 D615 Figure 81. Intermodulation Distortion vs Input Amplitude (46 MHz and 50 MHz) -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -7 D616 Figure 82. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) 100 71.1 Dither_EN Dither_DIS 70.5 Dither_EN Dither_DIS 95 SFDR (dBc) SNR (dBFS) 90 69.9 69.3 68.7 80 75 68.1 70 65 67.5 0 50 100 150 200 250 Frequency (MHz) 300 350 Figure 83. Signal-to-Noise Ratio vs Input Frequency 32 85 Submit Documentation Feedback 400 D617 0 50 100 150 200 250 Frequency (MHz) 300 350 400 D618 Figure 84. Spurious-Free Dynamic Range vs Input Frequency Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J23 (continued) Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 120 74.5 10 MHz 70 MHz 100 MHz 170 MHz 10 MHz 70 MHz 100 MHz 170 MHz 110 70.5 SFDR (dBc) 68.5 100 90 66.5 80 64.5 70 60 62.5 1 2 3 4 Digital Gain (dB) 5 0 6 Figure 85. Signal-to-Noise Ratio vs Digital Gain and Input Frequency 70 150 69 120 68 90 67 60 66 30 65 -70 0 -60 -50 -40 -30 Amplitude (dBFS) -20 -10 3 4 Digital Gain (dB) 72 SNR (dBFS) 71 240 SNR (dBFS) SFDR (dBc) 210 SFDR (dBFS) 180 72 2 5 D620 71 180 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 150 70 120 69 90 68 60 67 30 66 -70 0 D621 Figure 87. Performance vs Input Amplitude (30 MHz) 70.8 0 -60 -50 -40 -30 Amplitude (dBFS) -20 -10 110 70.2 90 70.2 80 70 70 60 1.1 D723 Figure 89. Performance vs Input Common-Mode Voltage (30 MHz) SNR (dBFS) 70.4 SFDR (dBc) SNR (dBFS) 100 Copyright © 2014–2015, Texas Instruments Incorporated D622 100 SNR SFDR 70.6 0.9 0.95 1 1.05 Input Common - Mode Voltage (V) 0 Figure 88. Performance vs Input Amplitude (170 MHz) SNR SFDR 69.8 0.85 6 Figure 86. Spurious-Free Dynamic Range vs Digital Gain and Input Frequency SFDR (dBc,dBFS) 73 1 D619 SFDR (dBc,dBFS) 0 SNR (dBFS) 230 MHz 270 MHz 400 MHz 70 90 69.8 80 69.6 70 69.4 60 69.2 0.85 0.9 0.95 1 1.05 Input Common - Mode Voltage (V) SFDR (dBc) SNR (dBFS) 72.5 230 MHz 270 MHz 400 MHz 50 1.1 D624 Figure 90. Performance vs Input Common-Mode Voltage (170 MHz) Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 33 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com Typical Characteristics: ADC32J23 (continued) Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 70.2 88 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 86 85 69.6 69.4 83 69.2 -15 10 35 Temperature (°C) 60 69 -40 85 -15 D625 Figure 91. Spurious-Free Dynamic Range vs AVDD Supply and Temperature 10 35 Temperature (°C) 60 85 D626 Figure 92. Signal-to-Noise Ratio vs AVDD Supply and Temperature 70 88 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V 87 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V DVDD = 1.9 V 69.8 86 SNR (dBFS) SFDR (dBc) AVDD = 1.85 V AVDD = 1.9 V 69.8 84 82 -40 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 70 SNR (dBFS) SFDR (dBc) 87 AVDD = 1.85 V AVDD = 1.9 V 85 DVDD = 1.85 V DVDD = 1.9 V 69.6 69.4 84 69.2 83 82 -40 -15 10 35 Temperature (°C) 60 69 -40 85 D627 Figure 93. Spurious-Free Dynamic Range vs DVDD Supply and Temperature 80 85 110 85 D628 80 140 SNR SFDR 120 75 100 70 80 68 80 65 60 64 70 60 40 55 20 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) 60 2.2 D629 Figure 95. Performance vs Clock Amplitude (40 MHz) Submit Documentation Feedback 50 0.2 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) SFDR (dBc) 90 SNR (dBFS) 72 SFDR (dBc) SNR (dBFS) 60 100 60 0.2 34 10 35 Temperature (°C) Figure 94. Signal-to-Noise Ratio vs DVDD Supply and Temperature SNR SFDR 76 -15 0 2.2 D630 Figure 96. Performance vs Clock Amplitude (150 MHz) Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J23 (continued) Typical values are at TA = 25°C, ADC sampling rate = 80 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 71.4 104 100 70.4 96 70.2 92 70 69.8 30 88 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 90 SNR SFDR 70.8 SNR (dBFS) 70.6 SFDR (dBc) SNR (dBFS) SNR SFDR 70.2 86 69.6 84 69 82 68.4 80 67.8 30 84 70 88 35 40 D631 Figure 97. Performance vs Clock Duty Cycle (40 MHz) 45 50 55 60 Input Clock Duty Cycle (%) 65 SFDR (dBc) 70.8 78 70 D632 Figure 98. Performance vs Clock Duty Cycle (150 MHz) Code Occurrence (%) 80 60 40 20 2046 2045 2044 2043 2042 0 D633 Ouput Code (LSB) RMS noise = 1.4 LSBs Figure 99. Idle Channel Histogram Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 35 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.17 Typical Characteristics: ADC32J22 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. -40 -50 -60 -70 -80 -70 -80 -90 -100 -110 -110 -120 5 10 15 Frequency (MHz) 20 0 25 5 D801 fS = 50 MSPS, SNR = 70.2 dBFS, fIN = 10 MHz, SFDR = 97.6 dBc -10 -10 -20 -20 -30 -30 Amplitude (dBFS) 0 -50 -60 -70 -80 20 25 D802 Figure 101. FFT for 10-MHz Input Signal (Dither Off) 0 -40 10 15 Frequency (MHz) fS = 50 MSPS, SNR = 70.4 dBFS, fIN = 10 MHz, SFDR = 90.8 dBc Figure 100. FFT for 10-MHz Input Signal (Dither On) Amplitude (dBFS) -60 -100 0 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 5 10 15 Frequency (MHz) 20 25 0 5 D803 fS = 50 MSPS, SNR = 69.9 dBFS, fIN = 70 MHz, SFDR = 92 dBc -10 -10 -20 -20 -30 -30 Amplitude (dBFS) 0 -50 -60 -70 -80 25 D804 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 20 Figure 103. FFT for 70-MHz Input Signal (Dither Off) 0 -40 10 15 Frequency (MHz) fS = 50 MSPS, SNR = 70.1 dBFS, fIN = 70 MHz, SFDR = 91 dBc Figure 102. FFT for 70-MHz Input Signal (Dither On) Amplitude (dBFS) -50 -90 -120 -120 0 5 10 15 Frequency (MHz) 20 25 D805 fS = 50 MSPS, SNR = 68.6 dBFS, fIN = 170 MHz, SFDR = 86 dBc Figure 104. FFT for 170-MHz Input Signal (Dither On) 36 -40 Submit Documentation Feedback 0 5 10 15 Frequency (MHz) 20 25 D806 fS = 50 MSPS, SNR = 69.1 dBFS, fIN = 170 MHz, SFDR = 85 dBc Figure 105. FFT for 170-MHz Input Signal (Dither Off) Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J22 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 5 10 15 Frequency (MHz) 20 25 0 10 15 Frequency (MHz) 20 25 D808 fS = 50 MSPS, SNR = 68.6 dBFS, fIN = 270 MHz, SFDR = 75.6 dBc Figure 106. FFT for 270-MHz Input Signal (Dither On) Figure 107. FFT for 270-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) fS = 50 MSPS, SNR = 68.4 dBFS, fIN = 270 MHz, SFDR = 75.7 dBc -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 5 10 15 Frequency (MHz) 20 25 0 5 D809 fS = 50 MSPS, SNR = 65.3 dBFS, fIN = 450 MHz, SFDR = 67.4 dBc 10 15 Frequency (MHz) 20 25 D810 fS = 50 MSPS, SNR = 65.2 dBFS, fIN = 450 MHz, SFDR = 67 dBc Figure 108. FFT for 450-MHz Input Signal (Dither On) Figure 109. FFT for 450-MHz Input Signal (Dither Off) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) 5 D807 -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 5 10 15 Frequency (MHz) 20 25 D811 fS = 50 MSPS, IMD = 90.2 dBFS, fIN1 = 46 MHz, fIN2 = 50 MHz Figure 110. FFT for Two-Tone Input Signal (–7dBFS at 46 MHz and 50 MHz) Copyright © 2014–2015, Texas Instruments Incorporated 0 5 10 15 Frequency (MHz) 20 25 D812 fS = 50 MSPS, IMD = 95.5 dBFS, fIN1 = 46 MHz, fIN2 = 50 MHz Figure 111. FFT for Two-Tone Input Signal (–36 dBFS at 46 MHz and 50 MHz) Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 37 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com Typical Characteristics: ADC32J22 (continued) 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 5 10 15 Frequency (MHz) 20 25 0 fS = 50 MSPS, IMD = 91.2 dBFS, fIN1 = 185 MHz, fIN2 = 190 MHz 20 25 D814 Figure 113. FFT for Two-Tone Input Signal (–36 dBFS at 185 MHz and 190 MHz) -80 -80 -85 -85 Two-Tone IMD (dBFS) Two-Tone IMD (dBFS) 10 15 Frequency (MHz) fS = 50 MSPS, IMD = 96.8 dBFS, fIN1 = 185 MHz, fIN2 = 190 MHz Figure 112. FFT for Two-Tone Input Signal (–7 dBFS at 185 MHz and 190 MHz) -90 -95 -100 -105 -110 -35 5 D813 -90 -95 -100 -105 -31 -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -110 -35 -7 -31 D815 -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -7 D816 Figure 114. Intermodulation Distortion vs Input Amplitude (46 MHz and 50 MHz) Figure 115. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) 71 100 Dither_EN Dither_DIS 70 Dither_EN Dither_DIS 95 SFDR (dBc) SNR (dBFS) 90 69 68 67 80 75 66 70 65 65 0 50 100 150 200 250 Frequency (MHz) 300 350 Figure 116. Signal-to-Noise Ratio vs Input Frequency 38 85 Submit Documentation Feedback 400 D817 0 50 100 150 200 250 Frequency (MHz) 300 350 400 D818 Figure 117. Spurious-Free Dynamic Range vs Input Frequency Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J22 (continued) Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 120 73.5 10 MHz 70 MHz 100 MHz 170 MHz 10 MHz 70 MHz 100 MHz 170 MHz 110 69.5 SFDR (dBc) 67.5 100 90 65.5 80 63.5 70 60 61.5 1 2 3 4 Digital Gain (dB) 5 0 6 Figure 118. Signal-to-Noise Ratio vs Digital Gain and Input Frequency 70 120 69 90 68 60 67 -60 -50 -40 -30 Amplitude (dBFS) -20 -10 6 D820 71 70 120 69 90 68 60 30 67 30 0 66 -70 0 D821 70.7 0 -60 -50 -40 -30 Amplitude (dBFS) -20 -10 0 D822 Figure 121. Performance vs Input Amplitude (170 MHz) 70.5 100 SNR SFDR 70.4 108 SNR SFDR 104 70.3 100 70.2 96 70.1 92 70 88 69.9 84 70.1 94 69.9 92 0.9 0.95 1 1.05 Input Common - Mode Voltage (V) 90 1.1 D823 Figure 122. Performance vs Input Common-Mode Voltage (30 MHz) Copyright © 2014–2015, Texas Instruments Incorporated SNR (dBFS) 96 SFDR (dBc) 98 70.3 69.7 0.85 5 180 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 150 Figure 120. Performance vs Input Amplitude (30 MHz) 70.5 3 4 Digital Gain (dB) 72 SNR (dBFS) 71 180 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 150 66 -70 2 Figure 119. Spurious-Free Dynamic Range vs Digital Gain and Input Frequency SFDR (dBc,dBFS) SNR (dBFS) 72 1 D819 SFDR (dBc,dBFS) 0 SNR (dBFS) 230 MHz 270 MHz 400 MHz 69.8 0.85 0.9 0.95 1 1.05 Input Common - Mode Voltage (V) SFDR (dBc) SNR (dBFS) 71.5 230 MHz 270 MHz 400 MHz 80 1.1 D824 Figure 123. Performance vs Input Common-Mode Voltage (170 MHz) Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 39 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com Typical Characteristics: ADC32J22 (continued) Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 100 71.3 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 70.9 SNR (dBFS) SFDR (dBc) 98 AVDD = 1.85 V AVDD = 1.9 V 96 94 AVDD = 1.85 V AVDD = 1.9 V 70.5 70.1 69.7 92 90 -40 69.3 -15 10 35 Temperature (°C) 60 68.9 -40 85 Figure 124. Spurious-Free Dynamic Range vs AVDD Supply and Temperature 10 35 Temperature (°C) 60 85 D826 Figure 125. Signal-to-Noise Ratio vs AVDD Supply and Temperature 102 70.7 DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V DVDD = 1.9 V DVDD = 1.7 V DVDD = 1.75 V DVDD = 1.8 V 70.5 SNR (dBFS) 100 SFDR (dBc) -15 D825 98 96 DVDD = 1.85 V DVDD = 1.9 V 70.3 70.1 69.9 94 92 -40 69.7 -15 10 35 Temperature (°C) 60 69.5 -40 85 D827 Figure 126. Spurious-Free Dynamic Range vs DVDD Supply and Temperature 78 85 110 85 D828 80 140 SNR SFDR 120 75 100 70 80 66 80 65 60 62 70 60 40 55 20 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) 60 2.2 D829 Figure 128. Performance vs Clock Amplitude (40 MHz) Submit Documentation Feedback 50 0.2 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) SFDR (dBc) 90 SNR (dBFS) 70 SFDR (dBc) SNR (dBFS) 60 100 58 0.2 40 10 35 Temperature (°C) Figure 127. Signal-to-Noise Ratio vs DVDD Supply and Temperature SNR SFDR 74 -15 0 2.2 D830 Figure 129. Performance vs Clock Amplitude (150 MHz) Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Characteristics: ADC32J22 (continued) Typical values are at TA = 25°C, ADC sampling rate = 50 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 92 SNR SFDR 69.9 97.5 69.1 88 69.8 95 68.9 86 69.7 92.5 68.7 84 69.6 90 68.5 82 69.5 30 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 SNR (dBFS) 69.3 SFDR (dBc) 100 70 SNR (dBFS) 69.5 102.5 SNR SFDR 68.3 30 87.5 70 35 40 D831 Figure 130. Performance vs Clock Duty Cycle (40 MHz) 45 50 55 60 Input Clock Duty Cycle (%) 65 90 SFDR (dBc) 70.1 80 70 D832 Figure 131. Performance vs Clock Duty Cycle (150 MHz) Code Occurrence (%) 80 60 40 20 2045 2044 2043 2042 2041 0 D833 Output Code (LSB) RMS noise = 1.3 LSBs Figure 132. Idle Channel Histogram Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 41 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 7.18 Typical Characteristics: Common Plots 0 ±35 ±20 ±40 ±40 ±45 CMRR (dB) Amplitude (dBFS) Typical values are at TA = 25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. ±60 Input Frequency = 30MHz 50-mVPP Signal Superimposed on VCM ±50 ±80 ±55 ±100 ±60 ±65 ±120 0 16 32 48 64 0 80 30 60 90 120 150 180 210 240 270 300 Common-Mode Test Signal Frequency (MHz)) Frequency (MHz) C041 C040 fS = 160 MSPS, fCM = 10 MHz, 50 mVPP, fIN = 30 MHz, Amplitude (fIN + fCM ) = –98 dBFS, Amplitude (fIN – fCM ) = –91 dBFS Figure 134. CMRR vs Test Signal Frequency Figure 133. CMRR FFT 0 ±25 ±35 ±40 PSRR (dB) Amplitude (dBFS) Input Frequency = 30MHz 50-mVPP Signal Superimposed on AVDD ±30 ±20 ±60 ±40 ±45 ±80 ±50 ±100 ±55 ±60 ±120 0 16 32 48 64 0 80 30 60 90 120 150 180 210 240 270 300 Test Signal Frequency On Supply (MHz) Frequency (MHz) C043 C042 fS = 160 MSPS, fPSRR = 5 MHz, 50 mVPP, fIN = 30 MHz, Amplitude (fIN + fPSRR ) = –65 dBFS, Amplitude (fIN – fPSRR ) = –67 dBFS Figure 136. PSRR vs Test Signal Frequency Figure 135. PSRR FFT for AVDD Supply 500 400 Analog Power Digital Power Total Power 400 350 Power Consumption (mW) Power Consumption (mW) 450 350 300 250 200 150 100 300 250 200 150 100 50 50 0 0 20 40 60 80 100 120 Sampling Speed (MSPS) 140 Figure 137. Power vs Sampling Frequency (20X Mode) 42 Analog Power Digital Power Total Power Submit Documentation Feedback 160 D009 0 10 20 30 40 50 60 Sampling Speed (MSPS) 70 80 D010 Figure 138. Power vs Sampling Frequency (40X Mode) Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 7.19 Typical Characteristics: Contour Plots Typical values are at TA = 25°C, 50% clock duty cycle, AVDD = DVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 160 160 88 70 88 92 140 76 80 84 68 72 Sampling Frequency, MSPS Sampling Frequency, MSPS 84 64 120 92 100 84 88 80 76 72 68 96 80 96 60 92 50 88 100 65 84 80 150 70 75 80 88 120 84 100 80 92 84 92 350 85 400 450 90 75 80 88 92 68 200 250 300 Input Frequency, MHz 75 80 92 60 64 76 72 140 50 95 100 150 70 Figure 139. Spurious-Free Dynamic Range (SFDR) for 0-dB Gain 75 80 200 250 300 Input Frequency, MHz 75 80 70 350 400 85 450 90 Figure 140. Spurious-Free Dynamic Range (SFDR) for 6-dB Gain 160 160 62.5 69.5 140 66 67 69 65 68 70 120 100 67 69.5 66 69 68 70 80 60 70 69.5 50 63 100 64 150 65 69 68 200 250 300 Input Frequency, MHz 66 67 350 68 67 66 400 450 69 Figure 141. Signal-to-Noise Ratio (SNR) for 0-dB Gain Copyright © 2014–2015, Texas Instruments Incorporated 70 Sampling Frequency, MSPS Sampling Frequency, MSPS 64 140 65 64.5 65.5 64 63 63.5 66 120 64.5 100 65.5 64 65 66 80 60 65.5 50 62 100 62.5 150 63 64.5 65 200 250 300 Input Frequency, MHz 63.5 64 64.5 64 350 400 450 65 65.5 66 Figure 142. Signal-to-Noise Ratio (SNR) for 6-dB Gain Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 43 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 8 Parameter Measurement Information 8.1 Timing Diagrams N+3 N+2 Sample N N+4 N + Latency + 1 N + Latency N+1 N + Latency + 2 tA CLKP Input Clock CLKM ADC Latency (1) tD (2) DxP, DxM N - Latency-1 N + Latency N - Latency+1 N - Latency+2 (1) Overall latency = ADC latency + tD. (2) x = A for channel A and B for channel B. N - Latency+3 N-1 N N+1 N+1 Figure 143. ADC Latency CLKINP Input Clock CLKINM tSU_SYNC~ tH_SYNC~ SYNC~ tD SYNC~ Asserted Latency CGS Phase (1) DxP, DxM Data (1) Data Data Data Data Data Data Data Data K28.5 x = A for channel A and B for channel B. Figure 144. SYNC~ Latency in CGS Phase 44 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Timing Diagrams (continued) CLKINP Input Clock CLKINM tSU_SYNC~ tH_SYNC~ SYNC~ tD SYNC~ Deasserted Latency ILA Sequence (1) DxP, DxM K28.5 (1) K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.0 K28.0 x = A for channel A and B for channel B. Figure 145. SYNC~ Latency in ILAS Phase Sample N tSU_SYSREF Sample N tSU_SYNC~ tH_SYSREF CLKIN tH_SYNC~ CLKIN SYSREF SYNC~ Figure 146. SYSREF Timing (Subclass 1) Copyright © 2014–2015, Texas Instruments Incorporated Figure 147. SYNC~ Timing (Subclass 2) Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 45 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9 Detailed Description 9.1 Overview The ADC32J2x are a high-linearity, ultra-low power, dual-channel, 12-bit, 50-MSPS to 160-MSPS, analog-todigital converter (ADC) family. The devices are designed specifically to support demanding, high input frequency signals with large dynamic range requirements. A clock input divider allows more flexibility for system clock architecture design and the SYSREF input enables complete system synchronization. The devices support a JESD204B interface in order to reduce the number of interface lines, thus allowing for high system integration density. The JESD204B interface is a serial interface, where the data of each ADC are serialized and output over only one differential pair. An internal phase-locked loop (PLL) multiplies the incoming ADC sampling clock by 20 to derive the bit clock that is used to serialize the 12-bit data from each channel. The devices support subclass 0, 1, 2 with interface data rates up to 3.2 Gbps. 9.2 Functional Block Diagram INAP, INAM CLKP, CLKM DAP, DAM Digital Encoder and JESD204B 12-Bit ADC OVRA PLL Divide by 1,2,4 SYNCP, SYNCM SYSREFP, SYSREFM Common Mode OVRD SDOUT SDATA SCLK SEN Configuration Registers PDN VCM DBP, DBM Digital Encoder and JESD204B 12-Bit ADC RESET INBP, INBM 9.3 Feature Description 9.3.1 Analog Inputs The ADC32J2x analog signal inputs are designed to be driven differentially. Each input pin (INP, INM) must swing symmetrically between (VCM + 0.5 V) and (VCM – 0.5 V), resulting in a 2-VPP (default) differential input swing. The input sampling circuit has a 3-dB bandwidth that extends up to 450 MHz (50-Ω source driving 50-Ω termination between INP and INM). 46 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Feature Description (continued) 9.3.2 Clock Input The device clock inputs can be driven differentially (sine, LVPECL, or LVDS) or single-ended (LVCMOS), with little or no difference in performance between them. The common-mode voltage of the clock inputs is set to 1.4 V using internal 5-kΩ resistors. The self-bias clock inputs of the ADC32J2x can be driven by the transformercoupled, sine-wave clock source or by the ac-coupled, LVPECL and LVDS clock sources, as shown in Figure 148, Figure 149, and Figure 150. See Figure 151 for details regarding the internal clock buffer. 0.1 mF 0.1 mF Zo CLKP Differential Sine-Wave Clock Input CLKP RT Typical LVDS Clock Input 0.1 mF 100 W CLKM Device 0.1 mF Zo NOTE: RT = termination resistor, if necessary. CLKM Figure 148. Differential Sine-Wave Clock Driving Circuit Zo Device Figure 149. LVDS Clock Driving Circuit 0.1 mF CLKP 150 W Typical LVPECL Clock Input 100 W Zo 0.1 mF CLKM Device 150 W Figure 150. LVPECL Clock Driving Circuit Clock Buffer LPKG 2 nH 20 W CLKP CBOND 1 pF 5 kW RESR 100 W CEQ CEQ 1.4 V LPKG 2 nH 20 W 5 kW CLKM CBOND 1 pF RESR 100 W NOTE: CEQ is 1 pF to 3 pF and is the equivalent input capacitance of the clock buffer. Figure 151. Internal Clock Buffer Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 47 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com A single-ended CMOS clock can be ac-coupled to the CLKP input, with CLKM connected to ground with a 0.1-μF capacitor, as shown in Figure 152. However, for best performance the clock inputs must be driven differentially, thereby reducing susceptibility to common-mode noise. For high input frequency sampling, a clock source with very low jitter is recommended. Band-pass filtering of the clock source can help reduce the effects of jitter. There is no change in performance with a non-50% duty cycle clock input. 0.1 mF CMOS Clock Input CLKP 0.1 mF CLKM Device Figure 152. Single-Ended Clock Driving Circuit 9.3.2.1 SNR and Clock Jitter The signal-to-noise ratio of the ADC is limited by three different factors: quantization noise, thermal noise, and jitter noise, as shown in Equation 1. Quantization noise is typically not noticeable in pipeline converters and is 74 dB for a 12-bit ADC. Thermal noise limits SNR at low input frequencies and clock jitter sets SNR for higher input frequencies. §  SNRQuantizatoin Noise 20 SNRADC[dBc] 20 ˜ log ¨10 ¨ © 2 · §  SNRThermal Noise ¸  ¨10 20 ¸ ¨ ¹ © 2 · §  SNRJitter ¸  ¨10 20 ¸ ¨ ¹ © · ¸ ¸ ¹ 2 (1) The SNR limitation resulting from sample clock jitter can be calculated with Equation 2: SNRJitter [dBc] 20 ˜ log( 2S ˜ f in ˜ TJitter ) (2) The total clock jitter (TJitter) has two components: the internal aperture jitter (200 fs for the device) that is set by the noise of the clock input buffer and the external clock. TJitter can be calculated with Equation 3: TJitter (TJitter , Ext .Clock _ Input ) 2  (TAperture _ ADC ) 2 (3) External clock jitter can be minimized by using high-quality clock sources and jitter cleaners as well as band-pass filters at the clock input and a faster clock slew rate improves the ADC aperture jitter. The devices have a thermal noise of 73.5 dBFS and internal aperture jitter of 200 fs. The SNR, depending on the amount of external jitter for different input frequencies, is shown in Figure 153. 71 Ext Clock Jitter 35 fs 50 fs 100 fs 150 fs 200 fs 70 SNR (dBFS) 69 68 67 66 65 64 10 100 Input Frequency (MHz) 1000 D001 D036 Figure 153. SNR vs Frequency and Jitter 48 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 9.3.2.2 Input Clock Divider The devices are equipped with an internal divider on the clock input. The divider allows operation with a faster input clock, thus simplifying the system clock distribution design. The clock divider can be bypassed (divide-by-1) for operation with a 160-MHz clock, the divide-by-2 option supports a maximum input clock of 320 MHz, and the divide-by-4 option supports a maximum input clock frequency of 640 MHz. 9.3.3 Power-Down Control The power-down functions of the ADC32J2x can be controlled either through the parallel control pin (PDN) or through an SPI register setting (see register 15h). The PDN pin can also be configured via SPI to a global powerdown or standby functionality. Table 2. Power-Down Modes FUNCTION POWER CONSUMPTION (mW) WAKE-UP TIME (µs) Global power-down 5 85 Standby 118 35 9.3.4 Internal Dither Algorithm 0 0 -10 -10 -20 -20 -30 -30 Amplitude (dBFS) Amplitude (dBFS) The ADC32J2x uses an internal dither algorithm to achieve high SFDR and a clean spectrum. However, the dither algorithm marginally degrades SNR, creating a trade-off between SNR and SFDR. If desired, the dither algorithm can be turned off by using the DIS DITH CHx registers bits. Figure 154 and Figure 155 show the effect of using dither algorithms. -40 -50 -60 -70 -80 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 16 32 48 Frequency (MHz) 64 fS = 160 MSPS, SNR = 69.8 dBFS, fIN = 70 MHz, SFDR = 88.1 dBc Figure 154. FFT with Dither On Copyright © 2014–2015, Texas Instruments Incorporated 80 D203 0 16 32 48 Frequency (MHz) 64 80 D204 fS = 160 MSPS, SNR = 70.1 dBFS, fIN = 70 MHz, SFDR = 85.4 dBc Figure 155. FFT with Dither Off Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 49 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.3.5 JESD204B Interface The ADC32J2x support device subclass 0, 1, and 2 with a maximum output data rate of 3.2 Gbps for each serial transmitter, as shown in Figure 156. The data of each ADC are serialized by 20X using an internal PLL and then transmitted out on one differential pair each. An external SYSREF (subclass 1) or SYNC (subclass 2) signal is used to align all internal clock phases and the local multiframe clock to a specific sampling clock edge. This process allows synchronization of multiple devices in a system and minimizes timing and alignment uncertainty. SYSREF SYNC~ INA JESD 204B DA INB JESD 204B DB Sample Clock Figure 156. JESD204B Interface The JESD204B transmitter block consists of the transport layer, the data scrambler, and the link layer, as shown in Figure 157. The transport layer maps the ADC output data into the selected JESD204B frame data format and determines if the ADC output data or test patterns are transmitted. The link layer performs the 8b or 10b data encoding and the synchronization and initial lane alignment using the SYNC input signal. Optionally, data from the transport layer can be scrambled. JESD204B Block Transport Layer ADC Link Layer Frame Data Mapping 8b, 10b Encoding Scrambler 1+x14+x15 Test Patterns DA DB Comma Characters Initial Lane Alignment SYNC Figure 157. JESD204B Block 50 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 9.3.5.1 JESD204B Initial Lane Alignment (ILA) The initial lane alignment process is started by the receiving device by asserting the SYNC signal. When a logic high is detected on the SYNC input pins, the ADC32J2x starts transmitting comma (K28.5) characters to establish code group synchronization. When synchronization is complete, the receiving device de-asserts the SYNC signal and the ADC32J2x starts the initial lane alignment sequence with the next local multiframe clock boundary. The ADC32J2x transmits four multiframes, each containing K frames (K is SPI programmable). Each multiframe contains the frame start and end symbols; the second multiframe also contains the JESD204 link configuration data. 9.3.5.2 JESD204B Test Patterns There are three different test patterns available in the transport layer of the JESD204B interface. The ADC32J2x supports a clock output, an encoded, and a PRBS (215 – 1) pattern. These patterns can be enabled via SPI register writes and are located in address 26h (bits 7:6). 9.3.5.3 JESD204B Frame Assembly The JESD204B standard defines the following parameters: • L is the number of lanes per link, • M is the number of converters per device, • F is the number of octets per frame clock period, and • S is the number of samples per frame. Table 3 lists the available JESD204B format and valid range for the ADC32J2x. The ranges are limited by the SERDES line rate and the maximum ADC sample frequency. Table 3. LMFS Values and Interface Rate L M F S MINIMUM ADC SAMPLING RATE (MSPS) MAXIMUM fSERDES (Mbps) MAXIMUM ADC SAMPLING RATE (Msps) MAXIMUM fSERDES (GSPS) MODE 2 2 2 1 15 300 160 3.2 20X (default) 1 2 4 1 10 400 80 3.2 40X The detailed frame assembly for quad-channel mode is shown in Figure 158. The frame assembly configuration can be changed from 20X (default) to 40X by setting the registers listed in Table 4. 0000 B1[3:0], B1[11:4] 0000 A1[3:0], A1[11:4] 0000 0000 0000 B1[3:0], B0[3:0], A1[3:0], B1[11:4] B0[11:4] A1[11:4] 0000 0000 0000 B0[3:0], A0[3:0], A0[3:0], Lane DB A0[11:4] Lane DA A0[11:4] LMFS = 1241 B0[11:4] LMFS = 2221 Figure 158. JESD Frame Assembly Table 4. Configuring 40X Mode ADDRESS DATA 2Bh 01h 30h 11h Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 51 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.3.5.4 Digital Outputs The ADC32J2x JESD204B transmitter uses differential CML output drivers. The CML output current is programmable from 5 mA to 20 mA using SPI register settings. The output driver expects to drive a differential 100-Ω load impedance and place the termination resistors as close to the receiver inputs as possible to avoid unwanted reflections and signal distortion. Because the JESD204B employs 8b, 10b encoding, the output data stream is dc-balanced and ac-coupling can be used to avoid the need to match up common-mode voltages between the transmitter and receivers. Connect the termination resistors to the termination voltage, as shown in Figure 159. Vterm R t = ZO Transmission Line, Zo R t = ZO 0.1 PF DAP, DBP Receiver DAM, DBM 0.1 PF Figure 159. CML Output Connections Figure 160 shows the data eye measurements of the device JESD204B transmitter against the JESD204B transmitter mask at 3.125 Gbps (156.25 MSPS, 20X mode), respectively. 300 Voltage (mV) 150 0 -150 -300 -200 -150 -100 -50 0 50 100 150 200 Time (ps) Figure 160. Eye Diagram: 3.125 Gbps 52 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 9.4 Device Functional Modes 9.4.1 Digital Gain The input full-scale amplitude can be selected between 1 VPP to 2 VPP (default is 2 VPP) by choosing the appropriate digital gain setting via an SPI register write. Digital gain provides an option to trade-off SNR for SFDR performance. A larger input full-scale increases SNR performance (2 VPP is recommended for maximum SNR) whereas reduced input swing typically results in better SFDR performance. Table 5 lists the available digital gain settings. Table 5. Digital Gain vs Full-Scale Amplitude DIGITAL GAIN (dB) MAX INPUT VOLTAGE (VPP) 0 2.0 0.5 1.89 1 1.78 1.5 1.68 2 1.59 2.5 1.50 3 1.42 3.5 1.34 4 1.26 4.5 1.19 5 1.12 5.5 1.06 6 1.00 9.4.2 Overrange Indication The ADC32J2x provides two different overrange indications. The normal OVR (default) is triggered if the final 12bit data output exceeds the maximum code value. The fast OVR is triggered if the input voltage exceeds the programmable overrange threshold and is presented after just nine clock cycles, thus enabling a quicker reaction to an overrange event. By default, the normal overrange indication is output on the OVRx pins (where x is A, B, C, or D). The fast OVR indication can be presented on the overrange pins instead by using the SPI register map. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 53 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.5 Programming The ADC32J2x can be configured using a serial programming interface, as described in this section. 9.5.1 Serial Interface The device has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial interface enable), SCLK (serial interface clock), SDATA (serial interface data), and SDOUT (serial interface data output) pins. Serially shifting bits into the device is enabled when SEN is low. Serial data SDATA are latched at every SCLK rising edge when SEN is active (low). The serial data are loaded into the register at every 24th SCLK rising edge when SEN is low. When the word length exceeds a multiple of 24 bits, the excess bits are ignored. Data can be loaded in multiples of 24-bit words within a single active SEN pulse. The interface can function with SCLK frequencies from 20 MHz down to very low speeds (of a few hertz) and also with a non-50% SCLK duty cycle. 9.5.1.1 Register Initialization After power-up, the internal registers must be initialized to their default values through a hardware reset by applying a high pulse on the RESET pin (of durations greater than 10 ns); see Figure 161. If required, the serial interface registers can be cleared during operation either: 1. Through a hardware reset, or 2. By applying a software reset. When using the serial interface, set the RESET bit (D0 in register address 06h) high. This setting initializes the internal registers to the default values and then self-resets the RESET bit low. In this case, the RESET pin is kept low. 9.5.1.1.1 Serial Register Write The device internal register can be programmed with these steps: 1. Drive the SEN pin low, 2. Set the R/W bit to 0 (bit A15 of the 16-bit address), 3. Set bit A14 in the address field to 1, 4. Initiate a serial interface cycle by specifying the address of the register (A13 to A0) whose content must be written, and 5. Write the 8-bit data that are latched in on the SCLK rising edge. 54 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Programming (continued) Figure 161 and Table 6 show the timing requirements for the serial register write operation. Register Address [13:0] SDATA R/W 1 A13 A12 A11 A1 Register Data [7:0] A0 D7 D6 D5 D4 =0 D3 D2 D1 D0 tDH tSCLK tDSU SCLK tSLOADS tSLOADH SEN RESET Figure 161. Serial Register Write Timing Diagram Table 6. Serial Interface Timing (1) MIN TYP UNIT 20 MHz fSCLK SCLK frequency (equal to 1 / tSCLK) tSLOADS SEN to SCLK setup time 25 ns tSLOADH SCLK to SEN hold time 25 ns tDSU SDIO setup time 25 ns tDH SDIO hold time 25 ns (1) > dc MAX Typical values are at 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, and AVDD = DVDD = 1.8 V, unless otherwise noted. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 55 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.5.1.1.2 Serial Register Readout The device includes a mode where the contents of the internal registers can be read back using the SDOUT pin. This readback mode may be useful as a diagnostic check to verify the serial interface communication between the external controller and the ADC. Given below is the procedure to read contents of serial registers: 1. Drive the SEN pin low. 2. Set the R/W bit (A15) to 1. This setting disables any further writes to the registers. 3. Set bit A14 in the address field to 1. 4. Initiate a serial interface cycle specifying the address of the register (A13 to A0) whose content must be read. 5. The device outputs the contents (D7 to D0) of the selected register on the SDOUT pin. 6. The external controller can latch the contents at the SCLK rising edge. 7. To enable register writes, reset the R/W register bit to 0. When READOUT is disabled, the SDOUT pin is in a high-impedance mode. If serial readout is not used, the SDOUT pin must float. Figure 162 shows a timing diagram of the serial register read operation. Data appear on the SDOUT pin at the SCLK falling edge with an approximate delay (tSD_DELAY) of 20 ns, as shown in Figure 163. Register Data: 'RQ¶W&DUH Register Address [13:0] SDATA R/W 1 A13 A12 A11 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D1 D0 =1 Register Read Data [7:0] SDOUT D7 D6 D5 D4 D3 D2 SCLK SEN Figure 162. Serial Register Read Timing Diagram SCLK tSD_DELAY SDOUT Figure 163. SDOUT Timing Diagram 56 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 9.5.2 Register Initialization After power-up, the internal registers must be initialized to their default values through a hardware reset by applying a high pulse on the RESET pin, as shown in Figure 164 and Table 7. Power Supplies t1 RESET t2 t3 SEN Figure 164. Initialization of Serial Registers after Power-Up Table 7. Power-Up Timing MIN t1 Power-on delay from power up to active high RESET pulse t2 Reset pulse duration: active high RESET pulse duration 10 t3 Register write delay from RESET disable to SEN active 100 TYP MAX UNIT 1 ms 1000 ns ns If required, the serial interface registers can be cleared during operation either: 1. Through hardware reset, or 2. By applying a software reset. When using the serial interface, set the RESET bit (D0 in register address 06h) high. This setting initializes the internal registers to the default values and then self-resets the RESET bit low. In this case, the RESET pin is kept low. 9.5.3 Start-Up Sequence After power-up, the sequence described in Table 8 can be used to set up the ADC32J2x for basic operation. Table 8. Start-Up Settings STEP DESCRIPTION 1 Supply all supply voltages. There is no required power supply sequence for AVDD and DVDD 2 Pulse hardware reset (low to high to low) on pin 24 3 Optional configure LMFS of JESD204B interface to LMFS = 1241 (default is LMFS = 2221) 4 Pulse SYNCb from low to high to transmit data from k28.5 sync mode Copyright © 2014–2015, Texas Instruments Incorporated REGISTER ADDRESS AND DATA — — Address 2Bh, data 01h Address 30h, data 11h — Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 57 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.6 Register Maps Table 9. Register Map Summary REGISTER ADDRESS (A[13:0], Hex) REGISTER DATA 7 6 01 0 0 03 0 0 04 0 06 4 3 0 0 0 0 0 0 0 07 0 0 0 08 0 0 0 09 0 0 0A 0 0 0B 0C 5 2 1 0 0 0 0 0 CHA GAINEN 0 0 0 0 CHB GAINEN 0 0 0 0 TEST PATTERN EN RESET SPECIAL MODE1 CHA EN FOVR 0 SPECIAL MODE1 CHB 0 0 0 0 ALIGN TEST PATTERN DATA FORMAT 0 0 DIS DITHER CHA DIS DITHER CHB 0 0 0 0 0 0 0D 0 0 0 0 0 0 0 0 CHA DIGITAL GAIN CHB DIGITAL GAIN 0 0E CUSTOM PATTERN [11:4] 0F 0 0 13 LOW SPEED MODE 0 CUSTOM PATTERN [3:0] 0 0 0 0 0 0 15 0 CHA PDN CHB PDN 0 STANDBY GLOBAL PDN 0 CONFIG PDN PIN 27 2A CLK DIV SERDES TEST PATTERN 0 0 0 0 0 0 IDLE SYNC TRP LAYER TESTMODE EN FLIP ADC DATA LANE ALIGN FRAME ALIGN TXMIT LINKDATA DIS 2B 0 0 0 0 0 0 CTRL K CTRL F 2F SCRAMBLE EN 0 0 0 0 0 0 0 0 0 30 31 OCTETS PER FRAME 0 0 34 3A 0 SUBCLASSV SYNC REG 3B 58 CHA TEST PATTERN CHB TEST PATTERN FRAMES PER MULTIFRAME 0 SYNC REQ EN 0 LINK LAYER TESTMODE SEL [2:0] 0 0 LINK LAYER RPAT 0 OUTPUT CURRENT SEL 0 PULSE DET MODES 3C FORCE LMFC COUNT 422 0 0 0 0 0 0 434 0 0 DIS DITH CHA 0 DIS DITH CHA LMFC COUNT INIT RELEASE ILANE SEQ SPECIAL MODE2 CHA 0 0 0 0 0 0 522 0 0 0 0 0 0 SPECIAL MODE2 CHB 534 0 0 DIS DITH CHB 0 DIS DITH CHB 0 0 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 9.6.1 Summary of Special Mode Registers Table 10 lists the location, value, and functions of special mode registers in the device. Table 10. Special Modes Summary MODE Dither mode Special mode 1 Special mode 2 LOCATION VALUE AND FUNCTION DIS DITH CHA 01h (bits 5-4), 434h (bits 5, 3) DIS DITH CHB 01h (bits 3-2), 534h (bits 5, 3) SPECIAL MODE 1 CHA 07h (bits 4-2) SPECIAL MODE 1 CHB 08h (bits 4-2) SPECIAL MODE 2 CHA 422h (bits 1-0) SPECIAL MODE 2 CHB 522h (bits 1-0) Creates a noise floor cleaner and improves SFDR; see the Internal Dither Algorithm section. 0000 = Dither disabled 1111 = Dither enabled Use for improved HD3. 000 = Default after reset 010 = Use for frequency < 120 MHz 111 = Use for frequency > 120 MHz Helps improve HD2. 00 = Default after reset 11 = Improves HD2 9.6.2 Serial Register Descriptions 9.6.2.1 Register 01h (address = 01h) Figure 165. Register 01h 7 0 W-0h 6 0 W-0h 5 4 DIS DITHER CHA R/W-0h 3 2 DIS DITHER CHB R/W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 11. Register 01h Field Descriptions Bit Field Type Reset Description 7-6 0 W 0h Must write 0 0h These bits enable or disables the on-chip dither. Control these bits with bits 5 and 3 of register 434h. 00 = Dither enabled 11 = Dither disabled. Improves SNR by 0.2 dB for input frequencies up to 170 MHz. 5-4 DIS DITHER CHA R/W 3-2 DIS DITHER CHB R/W 0h These bits enable or disables the on-chip dither. Control these bits with bits 5 and 3 of register 534h. 00 = Dither enabled 11 = Dither disabled. Improves SNR by 0.2 dB for input frequencies up to 170 MHz. 1-0 0 W 0h Must write 0 Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 59 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.6.2.2 Register 03h (address = 03h) Figure 166. Register 03h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 CHA GAINEN R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 12. Register 03h Field Descriptions Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 CHA GAINEN R/W 0h Digital gain enable bit for channel A. 0 = Digital gain disabled 1 = Digital gain enabled 0 0 W 0h Must write 0 9.6.2.3 Register 04h (address = 04h) Figure 167. Register 04h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 CHB GAINEN R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 13. Register 04h Field Descriptions Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 CHB GAINEN R/W 0h Digital gain enable bit for channel B. 0 = Digital gain disabled 1 = Digital gain enabled 0 0 W 0h Must write 0 9.6.2.4 Register 06h (address = 06h) Figure 168. Register 06h 7 6 5 4 3 2 0 0 0 0 0 0 W-0h W-0h W-0h W-0h W-0h W-0h 1 TEST PATTERN EN R/W-0h 0 RESET R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 14. Register 06h Field Descriptions 60 Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 TEST PATTERN EN R/W 0h This bit enables the test pattern selection for the digital outputs. 0 = Normal operation 1 = Test pattern output enabled 0 RESET R/W 0h Software reset applied. This bit resets all internal registers to the default values and selfclears to 0. Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 9.6.2.5 Register 07h (address = 07h) Figure 169. Register 07h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 3 SPECIAL MODE1 CHA R/W-0h 2 1 EN FOVR R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 15. Register 07h Field Descriptions Bit Field Type Reset Description 7-5 0 W 0h Must write 0 4-2 SPECIAL MODE1 CHA R/W 0h 010 = For frequencies < 120 MHz 111 = For frequencies > 120 MHz 1 EN FOVR R/W 0h 0 = Normal OVR on OVRx pins 1 = Enable fast OVR on OVRx pins 0 0 W 0h Must write 0 9.6.2.6 Register 08h (address = 08h) Figure 170. Register 08h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 3 SPECIAL MODE1 CHB R/W-0h 2 1 0 R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 16. Register 08h Field Descriptions Bit Field Type Reset Description 7-5 0 W 0h Must write 0 4-2 SPECIAL MODE1 CHB R/W 0h 010 = For frequencies < 120 MHz 111 = For frequencies > 120 MHz 1-0 0 W 0h Must write 0 9.6.2.7 Register 09h (address = 09h) Figure 171. Register 09h 7 6 5 4 3 2 1 0 0 0 0 0 0 ALIGN TEST PATTERN W-0h W-0h W-0h W-0h W-0h W-0h R/W-0h 0 DATA FORMAT R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 17. Register 09h Field Descriptions Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 ALIGN TEST PATTERN R/W 0h This bit aligns test patterns across the outputs of the four channels. 0 = Test patterns of four channels are free running 1 = Test patterns of all 4 channels are aligned 0 DATA FORMAT R/W 0h This bit sets the digital output data format. 0 = Twos complement 1 = Offset binary Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 61 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.6.2.8 Register 0Ah (address = 0Ah) Figure 172. Register 0Ah 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 2 1 CHA TEST PATTERN R/W-0h 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 18. Register 0Ah Field Descriptions Bit Field Type Reset Description 7-4 0 W 0h Must write 0 0h These bits control the test pattern for channel A after the TEST PATTERN EN bit is set. 0000 = Normal operation 0001 = All 0's 0010 = All 1's 0011 = Toggle pattern: data alternate between 10101010101010 and 01010101010101. 0100 = Digital ramp: data increments by 1 LSB every clock cycle from code 0 to 4095. 0101 = Custom pattern: output data are the same as programmed by the CUSTOM PATTERN register bits. 0110 = Deskew pattern: data are AAAh. 1000 = PRBS pattern: data are a sequence of pseudo random numbers. 1001 = 8-point sine-wave: data are a repetitive sequence of the following eight numbers that form a sine-wave: 0, 599, 2048, 3496, 4095, 3496, 2048, 599. Others = Do not use 3-0 CHA TEST PATTERN R/W 9.6.2.9 Register 0Bh (address = 0Bh) Figure 173. Register 0Bh 7 6 5 CHB TEST PATTERN R/W-0h 4 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 19. Register 0Bh Field Descriptions Bit 62 Field Type Reset Description 7-4 CHB TEST PATTERN R/W 0h These bits control the test pattern for channel B after the TEST PATTERN EN bit is set. 0000 = Normal operation 0001 = All 0's 0010 = All 1's 0011 = Toggle pattern: data alternate between 10101010101010 and 01010101010101. 0100 = Digital ramp: data increment by 1 LSB every clock cycle from code 0 to 4095. 0101 = Custom pattern: output data are the same as programmed by the CUSTOM PATTERN register bits. 0110 = Deskew pattern: data are AAAh. 1000 = PRBS pattern: data are a sequence of pseudo random numbers. 1001 = 8-point sine-wave: data are a repetitive sequence of the following eight numbers that form a sine-wave: 0, 599, 2048, 3496, 4095, 3496, 2048, 599. Others = Do not use 3-0 0 W 0h Must write 0 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 9.6.2.10 Register 0Ch (address = 0Ch) Figure 174. Register 0Ch 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 2 1 CHA DIGITAL GAIN R/W-0h 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 20. Register 0Ch Field Descriptions Bit Field Type Reset Description 7-4 0 W 0h Must write 0 3-0 CHA DIGITAL GAIN R/W 0h These bits set the digital gain for individual channels. For register settings see Table 21. Table 21. Channel Digital Gain REGISTER VALUE DIGITAL GAIN (dB) MAXIMUM INPUT VOLTAGE (VPP) 0000 0 2.0 0001 0.5 1.89 0010 1 1.78 0011 1.5 1.68 0100 2 1.59 0101 2.5 1.50 0110 3 1.42 0111 3.5 1.34 1000 4 1.26 1001 4.5 1.19 1010 5 1.12 1011 5.5 1.06 1100 6 1.00 9.6.2.11 Register 0Dh (address = 0Dh) Figure 175. Register 0Dh 7 6 5 CHB DIGITAL GAIN R/W-0h 4 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 22. Register 0Dh Field Descriptions Bit Field Type Reset Description 7-4 CHB DIGITAL GAIN R/W 0h These bits set the digital gain for the individual channels. For register settings see Table 21. 3-0 0 W 0h Must write 0 Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 63 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.6.2.12 Register 0Eh (address = 0Eh) Figure 176. Register 0Eh 7 6 5 4 3 CUSTOM PATTERN[11:4] R/W-0h 2 1 0 LEGEND: R/W = Read/Write; -n = value after reset Table 23. Register 0Eh Field Descriptions Bit Field Type Reset Description 7-0 CUSTOM PATTERN[11:4] R/W 0h These bits set the custom pattern[11:4] for all channels. 9.6.2.13 Register 0Fh (address = 0Fh) Figure 177. Register 0Fh 7 6 5 4 CUSTOM PATTERN[3:0] R/W-0h 3 2 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 24. Register 0Fh Field Descriptions Bit Field Type Reset Description 7-2 CUSTOM PATTERN[3:0] R/W 0h These bits set the custom pattern[3:0] for all channels. 1-0 0 W 0h Must write 0 9.6.2.14 Register 13h (address = 13h) Figure 178. Register 13h 7 LOW SPEED MODE R/W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 25. Register 13h Field Descriptions Bit 7 6-0 64 Field Type Reset Description LOW SPEED MODE R/W 0h Use this bit for sampling frequencies < 25 MSPS. 0 = Normal operation 1 = Low-speed mode is enabled 0 W 0h Must write 0 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 9.6.2.15 Register 15h (address = 15h) Figure 179. Register 15h 7 6 5 4 3 0 CHA PDN CHB PDN 0 STANDBY W-0h R/W-0h R/W-0h W-0h R/W-0h 2 GLOBAL PDN R/W-0h 1 0 W-0h 0 PDN PIN DISABLE R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 26. Register 15h Field Descriptions Bit Field Type Reset Description 7 0 W 0h Must write 0 6 CHA PDN R/W 0h Power-down channel A. 0 = Normal operation 1 = Power-down channel A if PDN PIN DISABLE register bit is set 5 CHB PDN R/W 0h Power-down channel B. 0 = Normal operation 1 = Power-down channel B if PDN PIN DISABLE register bit is set 4 0 W 0h Must write 0 3 STANDBY R/W 0h ADCs of both channels enter standby. 0 = Normal operation 1 = Standby 2 GLOBAL PDN R/W 0h Global power-down. 0 = Normal operation 1 = Global power-down 1 0 W 0h Must write 0 0 PDN PIN DISABLE R/W 0h This bit disables the power-down control from the pin. 0 = Normal operation 1 = Power-down pin is disabled, use register settings for powerdown operations 9.6.2.16 Register 27h (address = 27h) Figure 180. Register 27h 7 6 CLK DIV R/W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 27. Register 27h Field Descriptions Bit Field Type Reset Description 7-6 CLK DIV R/W 0h Internal clock divider for the input sample clock. 00 = Clock divider bypassed 01 = Divide-by-1 10 = Divide-by-2 11 = Divide-by-4 5-0 0 W 0h Must write 0 Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 65 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.6.2.17 Register 2Ah (address = 2Ah) Figure 181. Register 2Ah 7 6 5 SERDES TEST PATTERN IDLE SYNC R/W-0h R/W-0h 4 TRP LAYER TESTMODE EN R/W-0h 3 2 1 FLIP ADC DATA LANE ALIGN FRAME ALIGN R/W-0h R/W-0h R/W-0h 0 TX LINK CONFIG DATA DIS R/W-0h LEGEND: R/W = Read/Write; -n = value after reset Table 28. Register 2Ah Field Descriptions Bit Field Type Reset Description 7-6 SERDES TEST PATTERN R/W 0h 00 = Normal operation 01 = Outputs clock pattern: output is 10101010 pattern 10 = Encoded pattern: output is 1111111100000000 11 = PRBS sequence: output is 215 – 1 5 IDLE SYNC R/W 0h This bit sets the output pattern when SYNC is high. 0 = Sync code is k28.5 (BCBCh) 1 = Sync code is BC50h 4 TRP LAYER TESTMODE EN R/W 0h This bit generates the long transport layer test pattern mode according to 5.1.6.3 clause of the JESD204B specification. 0 = Test mode disabled 1 = Test mode enabled 3 FLIP ADC DATA R/W 0h 0 = Normal operation 1 = Output data order is reversed: MSB – LSB 0h This bit inserts a lane alignment character (K28.3) for the receiver to align to the lane boundary per section 5.3.3.5 of the JESD204B specification. 0 = Normal operation 1 = Inserts lane alignment characters 2 LANE ALIGN R/W 1 FRAME ALIGN R/W 0h This bit inserts a frame alignment character (K28.7) for the receiver to align to the lane boundary per section 5.3.3.4 of the JESD204B specification. 0 = Normal operation 1 = Inserts frame alignment characters 0 TX LINK CONFIG DATA DIS R/W 0h This bit disables sending the initial link alignment (ILA) sequence when SYNC is de-asserted. 0 = Normal operation 1 = ILA disabled 9.6.2.18 Register 2Bh (address = 2Bh) Figure 182. Register 2Bh 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 CTRL K R/W-0h 0 CTRL F R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 29. Register 2Bh Field Descriptions 66 Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 CTRL K R/W 0h Enable bit for number of frames per multiframe. 0 = Default is 9 (20X mode) frames per multiframe 1 = Frames per multiframe can be set in register 31h 0 CTRL F R/W 0h Enable bit for number of octets per frame. 0 = 20X mode using one lane per ADC (default is F = 2) 1 = Octets per frame can be specified in register 30h Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 9.6.2.19 Register 2Fh (address = 2Fh) Figure 183. Register 2Fh 7 SCRAMBLE EN R/W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 30. Register 2Fh Field Descriptions Bit 7 6-0 Field Type Reset Description SCRAMBLE EN R/W 0h Scramble enable bit in the JESD204B interface. 0 = Scrambling disabled 1 = Scrambling enabled 0 W 0h Must write 0 9.6.2.20 Register 30h (address = 30h) Figure 184. Register 30h 7 6 5 4 3 OCTETS PER FRAME R/W-0h 2 1 0 LEGEND: R/W = Read/Write; -n = value after reset Table 31. Register 30h Field Descriptions Bit Field Type Reset Description 7-0 OCTETS PER FRAME R/W 0h These bits set the number of octets per frame (F). 01 = 20X serialization: two octets per frame 11 = 40X serialization: four octets per frame 9.6.2.21 Register 31h (address = 31h) Figure 185. Register 31h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 3 2 1 FRAMES PER MULTI FRAME R/W-0h 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 32. Register 31h Field Descriptions Bit Field Type Reset Description 7-5 0 W 0h Must write 0 4-0 FRAMES PER MULTI FRAME R/W 0h These bits set the number of frames per multiframe. After reset, the default settings for frames per multiframe are: 20X mode: K = 8 For each mode, do not set K to a lower value. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 67 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.6.2.22 Register 34h (address = 34h) Figure 186. Register 34h 7 6 SUBCLASSV R/W-0h 5 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 33. Register 34h Field Descriptions Bit Field Type Reset Description 7-5 SUBCLASSV R/W 0h JESD204B subclass setting. 000 = Subclass 0 backward compatibility with JESD204A 001 = Subclass 1 deterministic latency using SYSREF signal 010 = Subclass 2 deterministic latency using SYNC detection 4-0 0 W 0h Must write 0 9.6.2.23 Register 3Ah (address = 3Ah) Figure 187. Register 3Ah 7 SYNC REQ R/W-0h 6 SYNC REQ EN R/W-0h 5 0 W-0h 4 0 W-0h 3 2 1 OUTPUT CURRENT SEL R/W-0h 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 34. Register 3Ah Field Descriptions Bit Type Reset Description 7 SYNC REQ R/W 0h This bit generates a synchronization request only when the SYNC REQ EN register bit is set. 0 = Normal operation 1 = Generates sync request 6 SYNC REQ EN R/W 0h 0 = Sync request is made with the SYNCP~, SYNCM~ pins 1 = Sync request is made with the SYNC REQ register bit 0 W 0h Must write 0 0h JESD output buffer current selection. 0000 = 16 mA 0001 = 15 mA 0010 = 14 mA 0011 = 13 mA 0100 = 20 mA 0101 = 19 mA 0110 = 18 mA 0111 = 17 mA 1000 = 8 mA 1001 = 7 mA 1010 = 6 mA 1011 = 5 mA 1100 = 12 mA 1101 = 11 mA 1110 = 10 mA 1111 = 9 mA 5-4 3-0 68 Field OUTPUT CURRENT SEL Submit Documentation Feedback R/W Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 9.6.2.24 Register 3Bh (address = 3Bh) Figure 188. Register 3Bh 7 6 5 4 LINK LAYER RPAT R/W-0h LINK LAYER TESTMODE R/W-0h 3 2 1 0 PULSE DET MODES W-0h R/W-0h 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 35. Register 3Bh Field Descriptions Bit Field Type Reset Description LINK LAYER TESTMODE R/W 0h These bits generate a pattern according to clause 5.3.3.8.2 of the JESD204B document. 000 = Normal ADC data 001 = D21.5 (high-frequency jitter pattern) 010 = K28.5 (mixed frequency jitter pattern) 011 = Repeat initial lane alignment (generates K28.5 character and repeat lane alignment sequences continuously) 100 = 12 octet RPAT jitter pattern 4 LINK LAYER RPAT R/W 0h This bit changes the running disparity in the modified RPAT pattern test mode (only when link layer test mode = 100). 0 = Normal operation 1 = Changes disparity 3 0 W 0h Must write 0 PULSE DET MODES R/W 0h These bits select different detection modes for SYSREF (subclass 1) and SYNC (subclass2). For register settings see Table 36. 7-5 2-0 Table 36. PULSE DET MODES Register Settings D2 D1 D0 0 Don’t care 0 Allow all pulses to reset input clock dividers 1 Don’t care 0 Do not allow reset of analog clock dividers Don’t care 0 to 1 transition 1 Allow one pulse immediately after the 0 to1 transition to reset the divider Copyright © 2014–2015, Texas Instruments Incorporated FUNCTIONALITY Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 69 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.6.2.25 Register 3Ch (address = 3Ch) Figure 189. Register 3Ch 7 FORCE LMFC COUNT R/W-0h 6 5 4 3 2 1 0 LMFC COUNT INIT RELEASE ILAN SEQ R/W-0h R/W-0h LEGEND: R/W = Read/Write; -n = value after reset Table 37. Register 3Ch Field Descriptions Bit 7 6-2 Field Type Reset Description FORCE LMFC COUNT R/W 0h 0 = Normal operation 1 = Enables using different starting value for LMFC counter 0h If SYSREF is transmitted to the digital block, the LMFC count resets to 0 and K28.5 stops transmitting when the LMFC count reaches 31. The initial value that the LMFC count resets to can be set using LMFC COUNT INIT. In this manner, the Rx can be synchronized early because the Rx receives the LANE ALIGNMENT SEQUENCE early. The FORCE LMFC COUNT register bit must be enabled. 0h These bits delay the lane alignment sequence generation by 0, 1, 2, or 3 multiframes after the code group synchronization. 00 = 0 01 = 1 10 = 2 11 = 3 LMFC COUNT INIT 1-0 R/W RELEASE ILAN SEQ R/W 9.6.2.26 Register 422h (address = 422h) Figure 190. Register 422h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 SPECIAL MODE2 CHA R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 38. Register 422h Field Descriptions 70 Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 SPECIAL MODE2 CHA R/W 0h Always write 1 for improved HD2 performance. 0 0 W 0h Must write 0 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 9.6.2.27 Register 434h (address = 434h) Figure 191. Register 434h 7 0 W-0h 6 0 W-0h 5 DIS DITH CHA R/W-0h 4 0 W-0h 3 DIS DITH CHA R/W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 39. Register 434h Field Descriptions Bit Field Type Reset Description 7-6 0 W 0h Must write 0 5 DIS DITH CHA R/W 0h Set this bit along with bits 5 and 4 of register 01h. 00 = Default 11 = Dither is disabled for channel A. In this mode, SNR typically improves by 0.5 dB at 70 MHz. 4 0 W 0h Must write 0 3 DIS DITH CHA R/W 0h Set this bit along with bits 5 and 4 of register 01h. 00 = Default 11 = Dither is disabled for channel A. In this mode, SNR typically improves by 0.5 dB at 70 MHz. 0 W 0h Must write 0 2-0 9.6.2.28 Register 522h (address = 522h) Figure 192. Register 522h 7 0 W-0h 6 0 W-0h 5 0 W-0h 4 0 W-0h 3 0 W-0h 2 0 W-0h 1 SPECIAL MODE2 CHB R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 40. Register 522h Field Descriptions Bit Field Type Reset Description 7-2 0 W 0h Must write 0 1 SPECIAL MODE2 CHB R/W 0h Always write 1 for better HD2 performance. 0 0 W 0h Must write 0 Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 71 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 9.6.2.29 Register 534 (address = 534h) Figure 193. Register 534 7 0 W-0h 6 0 W-0h 5 DIS DITH CHB R/W-0h 4 0 W-0h 3 DIS DITH CHB R/W-0h 2 0 W-0h 1 0 W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 41. Register 534 Field Descriptions Bit Field Type Reset Description 7-6 0 W 0h Must write 0 5 DIS DITH CHB R/W 0h Set this bit along with bits 3 and 2 of register 01h. 00 = Default 11 = Dither is disabled for channel B. In this mode, SNR typically improves by 0.5 dB at 70 MHz. 4 0 W 0h Must write 0 3 DIS DITH CHB R/W 0h Set this bit along with bits 3 and 2 of register 01h. 00 = Default 11 = Dither is disabled for channel B. In this mode, SNR typically improves by 0.5 dB at 70 MHz. 0 W 0h Must write 0 2-0 10 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information Typical applications involving transformer-coupled circuits are discussed in this section. Transformers (such as ADT1-1WT or WBC1-1) can be used up to 250 MHz to achieve good phase and amplitude balances at ADC inputs. When designing the dc driving circuits, the ADC input impedance must be considered. Figure 194 and Figure 195 show the impedance (Zin = Rin || Cin) across the ADC input pins. 6 Differential Capacitance, Cin (pF) Differential Resistance, Rin (kOhm) 10 1 0.1 4 3 2 1 0.01 0 100 200 300 400 500 600 700 Frequency (MHz) 800 900 1000 Figure 194. Differential Input Resistance, Rin 72 5 Submit Documentation Feedback D024 0 100 200 300 400 500 600 700 Frequency (MHz) 800 900 1000 D025 Figure 195. Differential Input Capacitance, Cin Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 10.2 Typical Applications 10.2.1 Driving Circuit Design: Low Input Frequencies 39 nH 0.1 PF INP 0.1 PF 50 Ÿ 0.1 PF 50 Ÿ 25 Ÿ 22 pF 25 Ÿ 50 Ÿ 50 Ÿ INM 1:1 1:1 0.1 PF 39 nH VCM Device Figure 196. Driving Circuit for Low Input Frequencies 10.2.1.1 Design Requirements For optimum performance, the analog inputs must be driven differentially. An optional 5-Ω to 15-Ω resistor in series with each input pin can be kept to damp out ringing caused by package parasitics. The drive circuit may have to be designed to minimize the impact of kick-back noise generated by sampling switches opening and closing inside the ADC, as well as ensuring low insertion loss over the desired frequency range and matched impedance to the source. 10.2.1.2 Detailed Design Procedure A typical application using two back-to-back coupled transformers is illustrated in Figure 196. The circuit is optimized for low input frequencies. An external R-C-R filter using 50-Ω resistors and a 22-pF capacitor is used. With the series inductor (39 nH), this combination helps absorb the sampling glitches. 10.2.1.3 Application Curve Figure 197 shows the performance obtained by using the circuit shown in Figure 196. 0 -10 -20 Amplitude (dBFS) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 16 32 48 Frequency (MHz) 64 80 D201 fS = 160 MSPS, SNR = 70.3 dBFS, fIN = 10 MHz, SFDR = 92.6 dBc Figure 197. FFT for 10-MHz Input Signal (Dither On) Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 73 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com Typical Applications (continued) 10.2.2 Driving Circuit Design: Input Frequencies Between 100 MHz to 230 MHz 0.1 PF 10 Ÿ INP 0.1 PF 0.1 PF 15 Ÿ 25 Ÿ 56 nH 10 pF 25 Ÿ 15 Ÿ INM 1:1 1:1 10 Ÿ 0.1 PF VCM Device Figure 198. Driving Circuit for Mid-Range Input Frequencies (100 MHz < fIN < 230 MHz) 10.2.2.1 Design Requirements See the Design Requirements section for further details. 10.2.2.2 Detailed Design Procedure When input frequencies are between 100 MHz to 230 MHz, an R-LC-R circuit can be used to optimize performance, as shown in Figure 198. 10.2.2.3 Application Curve Figure 199 shows the performance obtained by using the circuit shown in Figure 198. 0 -10 -20 Amplitude (dBFS) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 16 32 48 Frequency (MHz) 64 80 D205 fS = 160 MSPS, SNR = 69.1 dBFS, fIN = 170 MHz, SFDR = 93.5 dBc Figure 199. FFT for 170-MHz Input Signal (Dither On) 74 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 Typical Applications (continued) 10.2.3 Driving Circuit Design: Input Frequencies Greater than 230 MHz 0.1 PF 0.1 PF 10 Ÿ INP 0.1 PF 25 Ÿ 25 Ÿ INM 1:1 1:1 10 Ÿ 0.1 PF VCM Device Figure 200. Driving Circuit for High Input Frequencies (fIN > 230 MHz) 10.2.3.1 Design Requirements See the Design Requirements section for further details. 10.2.3.2 Detailed Design Procedure For high input frequencies (> 230 MHz), using the R-C-R or R-LC-R circuit does not show significant improvement in performance. However, a series resistance of 10 Ω can be used as shown in Figure 200. 10.2.3.3 Application Curve Figure 201 shows the performance obtained by using the circuit shown in Figure 200. 0 -10 -20 Amplitude (dBFS) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 16 32 48 Frequency (MHz) 64 80 D209 fS = 160 MSPS, SNR = 62.9 dBFS, fIN = 450 MHz, SFDR = 66 dBc Figure 201. FFT for 450-MHz Input Signal (Dither On) 11 Power Supply Recommendations The device requires a 1.8-V nominal supply for AVDD and DVDD. There are no specific sequence power-supply requirements during device power-up. AVDD and DVDD can power up in any order. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 75 ADC32J22, ADC32J23, ADC32J24, ADC32J25 SBAS668A – MAY 2014 – REVISED JUNE 2015 www.ti.com 12 Layout 12.1 Layout Guidelines The ADC32J2x EVM layout can be used as a reference layout to obtain the best performance. A layout diagram of the EVM top layer is provided in Figure 202. Some important points to remember when laying out the board are: 1. Analog inputs are located on opposite sides of the device pin out to ensure minimum crosstalk on the package level. To minimize crosstalk onboard, the analog inputs must exit the pin out in opposite directions, as shown in the reference layout of Figure 202 as much as possible. 2. In the device pin out, the sampling clock is located on a side perpendicular to the analog inputs in order to minimize coupling between them. This configuration is also maintained on the reference layout of Figure 202 as much as possible. 3. Keep digital outputs away from the analog inputs. When these digital outputs exit the pin out, the digital output traces must not be kept parallel to the analog input traces because this configuration may result in coupling from digital outputs to analog inputs and degrade performance. All digital output traces to the receiver [such as a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC)] must be matched in length to avoid skew among outputs. 4. At each power-supply pin (AVDD and DVDD), keep a 0.1-µF decoupling capacitor close to the device. A separate decoupling capacitor group consisting of a parallel combination of 10-µF, 1-µF, and 0.1-µF capacitors can be kept close to the supply source. 12.2 Layout Example Analog Input Routing ADC3xJxx Sampling Clock Routing Digital Output Routing Clock Distribution IC Analog input for CHB Analog input for CHA Figure 202. Typical Layout of the ADC32J2x Board 76 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 ADC32J22, ADC32J23, ADC32J24, ADC32J25 www.ti.com SBAS668A – MAY 2014 – REVISED JUNE 2015 13 Device and Documentation Support 13.1 Related Links Table 42 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 42. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY ADC32J22 Click here Click here Click here Click here Click here ADC32J23 Click here Click here Click here Click here Click here ADC32J24 Click here Click here Click here Click here Click here ADC32J25 Click here Click here Click here Click here Click here 13.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 13.3 Trademarks E2E is a trademark of Texas Instruments. PowerPAD is a trademark of Texas Instruments, Inc. All other trademarks are the property of their respective owners. 13.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 13.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ADC32J22 ADC32J23 ADC32J24 ADC32J25 77 PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADC32J22IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ32J22 ADC32J22IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ32J22 ADC32J23IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ32J23 ADC32J23IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ32J23 ADC32J24IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ32J24 ADC32J24IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ32J24 ADC32J25IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ32J25 ADC32J25IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ32J25 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 20-Jan-2017 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 1-Jul-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing ADC32J22IRGZR VQFN RGZ 48 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC32J22IRGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC32J23IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC32J23IRGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC32J24IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC32J24IRGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC32J25IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADC32J25IRGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 1-Jul-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADC32J22IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6 ADC32J22IRGZT VQFN RGZ 48 250 213.0 191.0 55.0 ADC32J23IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6 ADC32J23IRGZT VQFN RGZ 48 250 213.0 191.0 55.0 ADC32J24IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6 ADC32J24IRGZT VQFN RGZ 48 250 213.0 191.0 55.0 ADC32J25IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6 ADC32J25IRGZT VQFN RGZ 48 250 213.0 191.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice. This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services. These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation modules, and samples (http://www.ti.com/sc/docs/sampterms.htm). Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated