ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
Dual-Channel, 14-/12-Bit, 160/125/65MSPS Ultralow-Power ADC
Check for Samples: ADS4222, ADS4225, ADS4226, ADS4242, ADS4245, ADS4246
FEATURES
APPLICATIONS
•
•
•
•
1
Ultralow Power with Single 1.8V Supply,
CMOS Output:
– 183mW total power at 65MSPS
– 277mW total power at 125MSPS
– 332mW total power at 160MSPS
High Dynamic Performance:
– 88dBc SFDR at 170MHz
– 71.4dBFS SNR at 170MHz
Crosstalk: > 90dB at 185MHz
Programmable Gain up to 6dB for
SNR/SFDR Trade-off
DC Offset Correction
Output Interface Options:
– 1.8V parallel CMOS interface
– Double data rate (DDR) LVDS with
programmable swing:
– Standard swing: 350mV
– Low swing: 200mV
Supports Low Input Clock Amplitude
Down to 200mVPP
Package: QFN-64 (9mm × 9mm)
23
•
•
•
•
•
•
•
Wireless Communications Infrastructure
Software Defined Radio
Power Amplifier Linearization
DESCRIPTION
The ADS424x/422x are low-speed variants of the
ADS42xx ultralow-power family of dual-channel,
14-bit/12-bit analog-to-digital converters (ADCs).
Innovative design techniques are used to achieve
high-dynamic
performance,
while
consuming
extremely low power with 1.8V supply. This topology
makes the ADS424x/422x well-suited for multi-carrier,
wide-bandwidth communications applications.
The ADS424x/422x have gain options that can be
used to improve SFDR performance at lower
full-scale input ranges. These devices include a dc
offset correction loop that can be used to cancel the
ADC offset. Both DDR (double data rate) LVDS and
parallel CMOS digital output interfaces are available
in a compact QFN-64 PowerPAD™ package.
The devices include internal references while the
traditional reference pins and associated decoupling
capacitors have been eliminated. All devices are
specified over the industrial temperature range
(–40°C to +85°C).
ADS424x/422x FAMILY COMPARISON (1)
(1)
250MSPS
160MSPS
125MSPS
65MSPS
ADS424x
14-bit family
ADS4249
ADS4246
ADS4245
ADS4242
ADS422x
12-bit family
ADS4229
ADS4226
ADS4225
ADS4222
See for details on migrating from the ADS62P49 family.
PERFORMANCE SUMMARY
ADS4246
ADS4245
ADS4242
ADS4226
ADS4225
ADS4222
SFDR (dBc), fIN = 20MHz
86
88
91
86
88
91
SFDR (dBc), fIN = 170MHz
82
88
85
82
88
85
SNR (dBFS), fIN = 20MHz
72.8
73.4
73.6
70.5
70.8
70.9
SNR (dBFS), fIN = 170MHz
70.4
71.4
71.2
69.5
69.9
69.9
Total power (mW/channel)
166
138
91
166
138
91
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
PRODUCT
PACKAGELEAD
ADS4246
ADS4245
ADS4242
ADS4226
ADS4225
ADS4222
(1)
(2)
PACKAGE
DESIGNATOR
QFN-64
RGC
QFN-64
RGC
QFN-64
RGC
QFN-64
RGC
QFN-64
RGC
QFN-64
RGC
SPECIFIED
TEMPERATURE
RANGE
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
ECO PLAN (2)
GREEN (RoHS, no
Sb/Br)
GREEN (RoHS, no
Sb/Br)
GREEN (RoHS, no
Sb/Br)
GREEN (RoHS, no
Sb/Br)
GREEN (RoHS, no
Sb/Br)
GREEN (RoHS, no
Sb/Br)
LEAD/BALL
FINISH
Cu/NiPdAu
Cu/NiPdAu
Cu/NiPdAu
Cu/NiPdAu
Cu/NiPdAu
Cu/NiPdAu
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT MEDIA
ADS4246IRGCT
Tape and reel
ADS4246IRGCR
Tape and reel
ADS4245IRGCT
Tape and reel
ADS4245IRGCR
Tape and reel
ADS4242IRGCT
Tape and reel
ADS4242IRGCR
Tape and reel
ADS4226IRGCT
Tape and reel
ADS4226IRGCR
Tape and reel
ADS4225IRGCT
Tape and reel
ADS4225IRGCR
Tape and reel
ADS4222IRGCT
Tape and reel
ADS4222IRGCR
Tape and reel
AZ4246
AZ4245
AZ4242
AZ4226
AZ4225
AZ4222
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
Eco Plan is the planned eco-friendly classification. Green (RoHS, no Sb/Br): TI defines Green to mean Pb-Free (RoHS compatible) and
free of Bromine- (Br) and Antimony- (Sb) based flame retardants. Refer to the Quality and Lead-Free (Pb-Free) Data web site for more
information.
The ADS424x/422x are pin-compatible with the previous generation ADS62P49 family of data converters; this
architecture enables easy migration. However, there are some important differences between the two device
generations, summarized in Table 1.
Table 1. Migrating from the ADS62P49
ADS62P49 FAMILY
ADS424x/422x FAMILY
PINS
Pin 22 is NC (not connected)
Pin 22 is AVDD
Pins 38 and 58 are DRVDD
Pins 38 and 58 are NC (do not connect, must be floated)
Pins 39 and 59 are DRGND
Pins 39 and 59 are NC (do not connect, must be floated)
SUPPLY
AVDD is 3.3V
AVDD is 1.8V
DRVDD is 1.8V
No change
INPUT COMMON-MODE VOLTAGE
VCM is 1.5V
VCM is 0.95V
SERIAL INTERFACE
Protocol: 8-bit register address and 8-bit register data
No change in protocol
New serial register map
EXTERNAL REFERENCE
Supported
2
Not supported
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Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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ABSOLUTE MAXIMUM RATINGS (1)
ADS424x/422x
MIN
MAX
Supply voltage range, AVDD
–0.3
2.1
V
Supply voltage range, DRVDD
–0.3
2.1
V
Voltage between AGND and DRGND
–0.3
0.3
V
Voltage between AVDD to DRVDD (when AVDD leads DRVDD)
–2.4
2.4
V
Voltage between DRVDD to AVDD (when DRVDD leads AVDD)
–2.4
2.4
V
–0.3
Minimum
(1.9, AVDD + 0.3)
V
(2)
–0.3
AVDD + 0.3
V
RESET, SCLK, SDATA, SEN,
CTRL1, CTRL2, CTRL3
–0.3
3.9
V
+85
°C
+125
°C
INP_A, INM_A, INP_B, INM_B
Voltage applied to input pins
CLKP, CLKM
–40
Operating free-air temperature range, TA
Operating junction temperature range, TJ
–65
Storage temperature range, Tstg
ESD rating
(1)
(2)
UNIT
+150
°C
2
kV
Human body model (HBM)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
When AVDD is turned off, it is recommended to switch off the input clock (or ensure the voltage on CLKP, CLKM is less than |0.3V|).
This configuration prevents the ESD protection diodes at the clock input pins from turning on.
THERMAL INFORMATION
ADS42xx
THERMAL METRIC (1)
RGC
UNITS
64 PINS
θJA
Junction-to-ambient thermal resistance
23.9
θJCtop
Junction-to-case (top) thermal resistance
10.9
θJB
Junction-to-board thermal resistance
4.3
ψJT
Junction-to-top characterization parameter
0.1
ψJB
Junction-to-board characterization parameter
4.4
θJCbot
Junction-to-case (bottom) thermal resistance
0.6
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2011, Texas Instruments Incorporated
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ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range, unless otherwise noted.
ADS424x/422x
PARAMETER
MIN
NOM
MAX
UNIT
Analog supply voltage, AVDD
1.7
1.8
1.9
V
Digital supply voltage, DRVDD
1.7
1.8
1.9
V
SUPPLIES
ANALOG INPUTS
Differential input voltage range
2
VPP
VCM ± 0.05
Input common-mode voltage
V
(1)
400
MHz
Maximum analog input frequency with 1VPP input amplitude (1)
600
MHz
Maximum analog input frequency with 2VPP input amplitude
CLOCK INPUT
Input clock sample rate (ADS4242/ADS4222)
Low-speed mode enabled (by default after reset)
1
65
MSPS
1
80
MSPS
80
125
MSPS
1
80
MSPS
160
MSPS
Input clock sample rate (ADS4245/ADS4225)
Low-speed mode enabled (2)
Low-speed mode disabled
(2)
(by default after reset)
Input clock sample rate (ADS4246/ADS4226)
Low-speed mode enabled (2)
Low-speed mode disabled
(2)
(by default after reset)
80
Sine wave, ac-coupled
Input clock amplitude differential
(VCLKP – VCLKM)
0.2
1.5
VPP
LVPECL, ac-coupled
1.6
VPP
LVDS, ac-coupled
0.7
VPP
LVCMOS, single-ended, ac-coupled
1.5
V
Input clock duty cycle
Low-speed mode disabled
35
50
65
%
Low-speed mode enabled
40
50
60
%
DIGITAL OUTPUTS
Maximum external load capacitance from each output pin to DRGND, CLOAD
5
Differential load resistance between the LVDS output pairs (LVDS mode), RLOAD
Ω
100
–40
Operating free-air temperature, TA
(1)
(2)
pF
+85
°C
See the Theory of Operation section in the Application Information.
See the Serial Interface Configuration section for details on programming the low-speed mode.
HIGH-PERFORMANCE MODES (1) (2)
PARAMETER
DESCRIPTION
High-performance mode
Set the HIGH PERF MODE register bit to obtain best performance across sample clock and
input signal frequencies.
Register address = 03h, data = 03h
High-frequency mode
Set the HIGH FREQ MODE CH A and HIGH FREQ MODE CH B register bits for high input
signal frequencies greater than 200MHz.
Register address = 4Ah, data = 01h
Register address = 58h, data = 01h
(1)
(2)
4
It is recommended to use these modes to obtain best performance.
See the Serial Interface Configuration section for details on register programming.
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ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
ELECTRICAL CHARACTERISTICS: ADS4246/ADS4245/ADS4242
Typical values are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, 50% clock duty cycle, –1dBFS differential analog input, LVDS
interface, and 0dB gain, unless otherwise noted. Minimum and maximum values are across the full temperature range:
TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.8V.
PARAMETER
TEST CONDITIONS
ADS4246 (160MSPS)
ADS4245 (125MSPS)
ADS4242 (65MSPS)
MIN
MIN
MIN
TYP
Resolution
Signal-to-noise ratio
SNR
SINAD
SFDR
72.8
THD
fIN = 70MHz
72.5
fIN = 100MHz
72.2
72.6
71.2
fIN = 300MHz
HD2
HD3
dBFS
71.4
70.4
dBFS
69.4
69.3
69.4
dBFS
fIN = 20MHz
72.6
73.2
73.5
dBFS
fIN = 70MHz
72.1
72.3
dBFS
fIN = 100MHz
71.7
72.3
72.1
dBFS
70.8
71.2
70.2
dBFS
fIN = 300MHz
68
68.5
68.2
dBFS
fIN = 20MHz
86
88
91
dBc
fIN = 70MHz
84
88
dBc
fIN = 100MHz
82
85
87
dBc
82
88
85
dBc
fIN = 300MHz
78
78
74
dBc
fIN = 20MHz
84
86
88
dBc
fIN = 70MHz
81
85
dBc
fIN = 100MHz
81
83
85
dBc
80
84
82
dBc
fIN = 300MHz
76
75
73
dBc
fIN = 20MHz
86
88
91
dBc
fIN = 70MHz
84
88
dBc
fIN = 100MHz
82
85
87
dBc
82
88
85
dBc
fIN = 300MHz
78
78
74
dBc
fIN = 20MHz
92
93
95
dBc
fIN = 70MHz
86
90
dBc
fIN = 100MHz
93
89
96
dBc
94
90
87
dBc
fIN = 300MHz
80
81
81
dBc
fIN = 20MHz
90
95
98
dBc
fIN = 70MHz
92
97
dBc
fIN = 100MHz
89
93
95
dBc
89
91
93
dBc
fIN = 300MHz
91
89
92
dBc
f1 = 46MHz, f2 = 50MHz,
each tone at –7dBFS
96
96
98
dBFS
f1 = 185MHz, f2 = 190MHz,
each tone at –7dBFS
83
92
92
dBFS
fIN = 170MHz
Two-tone intermodulation
distortion
Bits
dBFS
69
67.5
72
70
72
72
77
73.4
UNIT
72.3
fIN = 170MHz
Worst spur
(other than second and third harmonics)
14
72.5
fIN = 170MHz
Third-harmonic distortion
MAX
dBFS
fIN = 170MHz
Second-harmonic distortion
TYP
73.6
fIN = 170MHz
Total harmonic distortion
MAX
14
fIN = 20MHz
fIN = 170MHz
Spurious-free dynamic range
TYP
14
fIN = 170MHz
Signal-to-noise and
distortion ratio
MAX
70
69
73.5
72
73.5
73.5
78
72.9
72.6
86
84
86
89
94
69.5
68.5
73.5
72
73.5
73.5
79
IMD
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ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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ELECTRICAL CHARACTERISTICS: ADS4246/ADS4245/ADS4242 (continued)
Typical values are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, 50% clock duty cycle, –1dBFS differential analog input, LVDS
interface, and 0dB gain, unless otherwise noted. Minimum and maximum values are across the full temperature range:
TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.8V.
PARAMETER
TEST CONDITIONS
Crosstalk
Input overload recovery
ADS4246 (160MSPS)
ADS4245 (125MSPS)
ADS4242 (65MSPS)
MIN
MIN
MIN
TYP
MAX
TYP
MAX
TYP
MAX
UNIT
20-MHz full-scale signal on
channel under observation;
170-MHz full-scale signal on
other channel
95
95
95
dB
Recovery to within 1%
(of full-scale) for 6dB overload
with sine-wave input
1
1
1
Clock
cycle
AC power-supply rejection
ratio
PSRR
For 100mVPP signal on AVDD
supply, up to 10MHz
> 30
> 30
> 30
dB
Effective number of bits
ENOB
fIN = 70MHz
(ADS4245, ADS4242)
fIN = 170MHz (ADS4246)
11.5
11.5
11.4
LSBs
Differential nonlinearity
DNL
fIN = 70MHz
(ADS4245, ADS4242)
fIN = 170MHz (ADS4246)
Integrated nonlinearity
INL
fIN = 70MHz
(ADS4245, ADS4242)
fIN = 170MHz (ADS4246)
6
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–0.97
±0.5
1.7
±2
±5
–0.97
±0.5
1.7
±2
±5
–0.97
±0.5
1.7
LSBs
±2
±5
LSBs
Copyright © 2011, Texas Instruments Incorporated
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ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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ELECTRICAL CHARACTERISTICS: ADS4226/ADS4225/ADS4222
Typical values are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, 50% clock duty cycle, –1dBFS differential analog input, LVDS
interface, and 0dB gain, unless otherwise noted. Minimum and maximum values are across the full temperature range:
TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.8V.
PARAMETER
TEST CONDITIONS
ADS4226 (160MSPS)
ADS4225 (125MSPS)
ADS4222 (65MSPS)
MIN
MIN
MIN
TYP
Resolution
Signal-to-noise ratio
SNR
SINAD
SFDR
70.5
THD
fIN = 70MHz
70.3
fIN = 100MHz
70.1
70.3
69.5
fIN = 300MHz
HD2
HD3
dBFS
69.9
69.9
dBFS
68.2
68.1
68.2
dBFS
fIN = 20MHz
70.4
70.7
70.8
dBFS
fIN = 70MHz
70.1
70.2
dBFS
fIN = 100MHz
69.8
70.1
70.1
dBFS
69.3
69.5
68.7
dBFS
fIN = 300MHz
67.6
67.5
67.2
dBFS
fIN = 20MHz
86
88
91
dBc
fIN = 70MHz
84
88
dBc
fIN = 100MHz
82
85
87
dBc
82
88
85
dBc
fIN = 300MHz
78
78
74
dBc
fIN = 20MHz
84
86
88
dBc
fIN = 70MHz
81
85
dBc
fIN = 100MHz
81
83
85
dBc
80
84
82
dBc
fIN = 300MHz
76
75
73
dBc
fIN = 20MHz
86
88
91
dBc
fIN = 70MHz
84
88
dBc
fIN = 100MHz
82
85
87
dBc
82
88
85
dBc
fIN = 300MHz
78
78
74
dBc
fIN = 20MHz
92
93
95
dBc
fIN = 70MHz
86
90
dBc
fIN = 100MHz
93
89
96
dBc
94
90
87
dBc
fIN = 300MHz
80
81
81
dBc
fIN = 20MHz
90
95
98
dBc
fIN = 70MHz
92
97
dBc
fIN = 100MHz
89
93
95
dBc
89
91
93
dBc
fIN = 300MHz
91
89
92
dBc
f1 = 46MHz, f2 = 50MHz,
each tone at –7dBFS
96
96
98
dBFS
f1 = 185MHz, f2 = 190MHz,
each tone at –7dBFS
83
92
92
dBFS
fIN = 170MHz
Two-tone intermodulation
distortion
Bits
dBFS
67.5
66.5
70
68
70
70
75
70.8
UNIT
70.2
fIN = 170MHz
Worst spur
(other than second and third harmonics)
12
70.3
fIN = 170MHz
Third-harmonic distortion
MAX
dBFS
fIN = 170MHz
Second-harmonic distortion
TYP
70.9
fIN = 170MHz
Total harmonic distortion
MAX
12
fIN = 20MHz
fIN = 170MHz
Spurious-free dynamic range
TYP
12
fIN = 170MHz
Signal-to-noise and
distortion ratio
MAX
68.0
67.0
72.5
70.0
72.5
72.5
76.0
70.5
70.3
86
84
86
89
94
68.0
67.0
72.5
71.0
72.5
72.5
77.0
IMD
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ELECTRICAL CHARACTERISTICS: ADS4226/ADS4225/ADS4222 (continued)
Typical values are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, 50% clock duty cycle, –1dBFS differential analog input, LVDS
interface, and 0dB gain, unless otherwise noted. Minimum and maximum values are across the full temperature range:
TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.8V.
PARAMETER
TEST CONDITIONS
Crosstalk
Input overload recovery
ADS4225 (125MSPS)
ADS4222 (65MSPS)
MIN
MIN
MIN
TYP
MAX
TYP
MAX
TYP
MAX
UNIT
20MHz full-scale signal on
channel under observation;
170MHz full-scale signal on
other channel
95
95
95
dB
Recovery to within 1%
(of full-scale) for 6dB overload
with sine-wave input
1
1
1
Clock
cycle
30
30
30
dB
11.2
11.3
11.1
AC power-supply rejection
ratio
PSRR
For 100mVPP signal on AVDD
supply, up to 10MHz
Effective number of bits
ENOB
fIN = 70MHz
(ADS4225, ADS4222)
fIN = 170MHz (ADS4226)
Differential nonlinearity
DNL
fIN = 70MHz
(ADS4225, ADS4222)
fIN = 170MHz (ADS4226)
Integrated nonlinearity
INL
fIN = 70MHz
(ADS4225, ADS4222)
fIN = 170MHz (ADS4226)
8
ADS4226 (160MSPS)
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–0.8
±0.13
1.5
±0.5
±3.5
–0.8
±0.13
1.5
±0.5
±3.5
–0.8
LSBs
±0.13
1.2
LSBs
±0.5
±2.5
LSBs
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ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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ELECTRICAL CHARACTERISTICS: GENERAL
Typical values are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, 50% clock duty cycle, and –1dBFS differential analog input,
unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = +85°C,
AVDD = 1.8V, and DRVDD = 1.8V.
ADS4246/ADS4226 (160MSPS)
PARAMETER
MIN
TYP
ADS4245/ADS4225 (125MSPS)
MAX
MIN
TYP
ADS4242/ADS4222 (65MSPS)
MAX
MIN
TYP
MAX
UNIT
ANALOG INPUTS
Differential input voltage range (0dB gain)
2
2
2
VPP
0.75
0.75
0.75
kΩ
Differential input capacitance (at 200MHz)
3.7
3.7
3.7
pF
Analog input bandwidth
(with 50Ω source impedance, and 50Ω termination)
550
550
550
MHz
Analog input common-mode current
(per input pin of each channel)
1.5
1.5
1.5
µA/MSPS
0.95
0.95
0.95
4
4
4
Differential input resistance (at 200MHz)
Common-mode output voltage
VCM
VCM output current capability
V
mA
DC ACCURACY
–15
Offset error
Temperature coefficient of offset error
Gain error as a result of internal
reference inaccuracy alone
EGREF
Gain error of channel alone
2.5
15
–15
0.003
EGCHAN
Temperature coefficient of EGCHAN
–2
2
±0.1
2.5
15
–15
0.003
–1
0.002
2.5
15
0.003
–2
2
–2
2
±0.1
±0.1
0.002
0.002
mV
mV/°C
–1
%FS
%FS
Δ%/°C
POWER SUPPLY
IAVDD
Analog supply current
123
150
105
130
73
85
mA
IDRVDD
Output buffer supply current
LVDS interface, 350mV swing with 100Ω external
termination, fIN = 2.5MHz
111
135
99
120
78
95
mA
IDRVDD
Output buffer supply current
CMOS interface, no load capacitance (1)
fIN = 2.5MHz
61
49
28
mA
Analog power
222
189
133
mW
Digital power
LVDS interface, 350mV swing with 100Ω external
termination, fIN = 2.5MHz
199
179
131
mW
Digital power
CMOS interface, no load capacitance (1)
fIN = 2.5MHz
109
88
50
mW
Global power-down
(1)
25
25
25
mW
In CMOS mode, the DRVDD current scales with the sampling frequency, the load capacitance on output pins, input frequency, and the
supply voltage (see the CMOS Interface Power Dissipation section in the Application Information).
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DIGITAL CHARACTERISTICS
At AVDD = 1.8V and DRVDD = 1.8V, unless otherwise noted. DC specifications refer to the condition where the digital
outputs do not switch, but are permanently at a valid logic level '0' or '1'.
ADS424x/422x
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUTS (RESET, SCLK, SDATA, SEN, CTRL1, CTRL2, CTRL3) (1)
High-level input voltage
All digital inputs support 1.8V
and 3.3V CMOS logic levels
Low-level input voltage
High-level input current
Low-level input current
1.3
V
0.4
V
SDATA, SCLK (2)
VHIGH = 1.8V
10
µA
SEN (3)
VHIGH = 1.8V
0
µA
SDATA, SCLK
VLOW = 0V
0
µA
SEN
VLOW = 0V
10
µA
DIGITAL OUTPUTS, CMOS INTERFACE (DA[13:0], DB[13:0], CLKOUT, SDOUT)
DRVDD – 0.1
High-level output voltage
DRVDD
Low-level output voltage
0
V
0.1
Output capacitance (internal to device)
V
pF
DIGITAL OUTPUTS, LVDS INTERFACE
High-level output
differential voltage
VODH
With an external
100Ω termination
270
350
430
mV
Low-level output
differential voltage
VODL
With an external
100Ω termination
–430
–350
–270
mV
Output common-mode voltage
VOCM
0.9
1.05
1.25
V
(1)
(2)
(3)
SCLK, SDATA, and SEN function as digital input pins in serial configuration mode.
SDATA, SCLK have internal 150kΩ pull-down resistor.
SEN has an internal 150kΩ pull-up resistor to AVDD. Because the pull-up is weak, SEN can also be driven by 1.8V or 3.3V CMOS
buffers.
DAn_P
DBn_P
Logic 0
VODL = -350mV
Logic 1
(1)
VODH = +350mV
(1)
DAn_M
DBn_M
VOCM
GND
(1) With external 100Ω termination.
Figure 1. LVDS Output Voltage Levels
10
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PIN CONFIGURATION: LVDS MODE
49 DRGND
50 DA8M
51 DA8P
52 DA10M
53 DA10P
54 DA12M
55 DA12P
56 CLKOUTM
57 CLKOUTP
58 NC
59 NC
60 DB0M
61 DB0P
62 DB2M
63 DB2P
64 SDOUT
RGC PACKAGE(2)
QFN-64
(TOP VIEW)
DRVDD
1
48
DRVDD
DB4M
2
47
DA6P
DB4P
3
46
DA6M
DB6M
4
45
DA4P
DB6P
5
44
DA4M
DB8M
6
43
DA2P
DB8P
7
42
DA2M
DB10M
8
41
DA0P
DB10P
9
40
DA0M
DB12M 10
39
NC
DB12P 11
38
NC
RESET 12
37
CTRL3
SCLK 13
36
CTRL2
SDATA 14
35
CTRL1
SEN 15
34
AVDD
AVDD 16
33
AVDD
AGND 32
AGND 31
INM_A 30
INP_A 29
AGND 28
AGND 27
CLKM 26
CLKP 25
AGND 24
VCM 23
AVDD 22
AGND 21
INM_B 20
INP_B 19
AGND 18
AGND 17
Thermal Pad
(Connected to DRGND)
(2) The PowerPAD is connected to DRGND.
NOTE: NC = do not connect; must float.
Figure 2. ADS4246/ADS4245/ADS4242 LVDS Mode
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49 DRGND
50 DA6M
51 DA6P
52 DA8M
53 DA8P
54 DA10M
55 DA10P
56 CLKOUTM
57 CLKOUTP
58 NC
59 NC
60 NC
61 NC
62 DB0M
63 DB0P
64 SDOUT
RGC PACKAGE(3)
QFN-64
(TOP VIEW)
DRVDD
1
48
DRVDD
DB2M
2
47
DA4P
DB2P
3
46
DA4M
DB4M
4
45
DA2P
DB4P
5
44
DA2M
DB6M
6
43
DA0P
DB6P
7
42
DA0M
DB8M
8
41
NC
DB8P
9
40
NC
DB10M 10
39
NC
DB10P 11
38
NC
RESET 12
37
CTRL3
SCLK 13
36
CTRL2
SDATA 14
35
CTRL1
SEN 15
34
AVDD
AVDD 16
33
AVDD
AGND 32
AGND 31
INM_A 30
INP_A 29
AGND 28
AGND 27
CLKM 26
CLKP 25
AGND 24
VCM 23
AVDD 22
AGND 21
INM_B 20
INP_B 19
AGND 18
AGND 17
Thermal Pad
(Connected to DRGND)
(3) The PowerPAD is connected to DRGND.
NOTE: NC = do not connect; must float.
Figure 3. ADS4226/ADS4225/ADS4222 LVDS Mode
12
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Pin Descriptions: LVDS Mode
PIN NUMBER
PIN NAME
# OF PINS
FUNCTION
1, 48
DRVDD
2
Input
Output buffer supply
DESCRIPTION
12
RESET
1
Input
Serial interface RESET input.
When using the serial interface mode, the internal registers must be initialized
through a hardware RESET by applying a high pulse on this pin or by using the
software reset option; refer to the Serial Interface Configuration section.
In parallel interface mode, the RESET pin must be permanently tied high. SCLK
and SEN are used as parallel control pins in this mode. This pin has an internal
150kΩ pull-down resistor.
13
SCLK
1
Input
This pin functions as a serial interface clock input when RESET is low. It controls
the low-speed mode selection when RESET is tied high; see Table 5 for detailed
information. This pin has an internal 150kΩ pull-down resistor.
14
SDATA
1
Input
Serial interface data input; this pin has an internal 150kΩ pull-down resistor.
15
SEN
1
Input
This pin functions as a serial interface enable input when RESET is low. It
controls the output interface and data format selection when RESET is tied high;
see Table 6 for detailed information. This pin has an internal 150kΩ pull-up
resistor to AVDD.
16, 22, 33, 34
AVDD
4
Input
Analog power supply
17, 18, 21, 24,
27, 28, 31, 32
AGND
8
Input
Analog ground
19
INP_B
1
Input
Differential analog positive input, channel B
20
INM_B
1
Input
Differential analog negative input, channel B
23
VCM
1
Output
25
CLKP
1
Input
Differential clock positive input
26
CLKM
1
Input
Differential clock negative input
29
INP_A
1
Input
Differential analog positive input, channel A
30
INM_A
1
Input
Differential analog negative input, channel A
35
CTRL1
1
Input
Digital control input pins. Together, they control the various power-down modes.
36
CTRL2
1
Input
Digital control input pins. Together, they control the various power-down modes.
37
CTRL3
1
Input
Digital control input pins. Together, they control the various power-down modes.
49, PAD
DRGND
2
Input
Output buffer ground
56
CLKOUTM
1
Output
Differential output clock, complement
57
CLKOUTP
1
Output
Differential output clock, true
64
SDOUT
1
Output
This pin functions as a serial interface register readout when the READOUT bit is
enabled. When READOUT = 0, this pin is in high-impedance state.
Refer to
Figure 2 and
Figure 3
DA0P, DA0M
2
Output
Channel A differential output data pair, D0 and D1 multiplexed
Refer to
Figure 2 and
Figure 3
DA2P, DA2M
2
Output
Channel A differential output data D2 and D3 multiplexed
Refer to
Figure 2 and
Figure 3
DA4P, DA4M
2
Output
Channel A differential output data D4 and D5 multiplexed
Refer to
Figure 2 and
Figure 3
DA6P, DA6M
2
Output
Channel A differential output data D6 and D7 multiplexed
Refer to
Figure 2 and
Figure 3
DA8P, DA8M
2
Output
Channel A differential output data D8 and D9 multiplexed
Refer to
Figure 2 and
Figure 3
DA10P, DA10M
2
Output
Channel A differential output data D10 and D11 multiplexed
Refer to
Figure 2 and
Figure 3
DA12P, DA12M
2
Output
Channel A differential output data D12 and D13 multiplexed (ADS424x only)
Refer to
Figure 2 and
Figure 3
DB0P, DB0M
2
Output
Channel B differential output data pair, D0 and D1 multiplexed
Refer to
Figure 2 and
Figure 3
DB2P, DB2M
2
Output
Channel B differential output data D2 and D3 multiplexed
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This pin outputs the common-mode voltage (0.95V) that can be used externally to
bias the analog input pins
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Pin Descriptions: LVDS Mode (continued)
PIN NUMBER
PIN NAME
# OF PINS
FUNCTION
Refer to
Figure 2 and
Figure 3
DB4P, DB4M
2
Output
Channel B differential output data D4 and D5 multiplexed
Refer to
Figure 2 and
Figure 3
DB6P, DB6M
2
Output
Channel B differential output data D6 and D7 multiplexed
Refer to
Figure 2 and
Figure 3
DB8P, DB8M
2
Output
Channel B differential output data D8 and D9 multiplexed
Refer to
Figure 2 and
Figure 3
DB10P, DB10M
2
Output
Channel B differential output data D10 and D11 multiplexed
Refer to
Figure 2 and
Figure 3
DB12P, DB12M
2
Output
Channel B differential output data D12 and D13 multiplexed (ADS424x only)
Refer to
Figure 38,
Figure 39,
Figure 56, and
Figure 57
NC
8 (ADS422x)
4 (ADS424x)
—
14
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DESCRIPTION
Do not connect, must be floated
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PIN CONFIGURATION: CMOS MODE
49 DRGND
50 DA8
51 DA9
52 DA10
53 DA11
54 DA12
55 DA13
56 UNUSED
57 CLKOUT
58 NC
59 NC
60 DB0
61 DB1
62 DB2
63 DB3
64 SDOUT
RGC PACKAGE(4)
QFN-64
(TOP VIEW)
DRVDD
1
48
DRVDD
DB4
2
47
DA7
DB5
3
46
DA6
DB6
4
45
DA5
DB7
5
44
DA4
DB8
6
43
DA3
DB9
7
42
DA2
DB10
8
41
DA1
DB11
9
40
DA0
DB12 10
39
NC
DB13 11
38
NC
RESET 12
37
CTRL3
SCLK 13
36
CTRL2
SDATA 14
35
CTRL1
SEN 15
34
AVDD
AVDD 16
33
AVDD
AGND 32
AGND 31
INM_A 30
INP_A 29
AGND 28
AGND 27
CLKM 26
CLKP 25
AGND 24
VCM 23
AVDD 22
AGND 21
INM_B 20
INP_B 19
AGND 18
AGND 17
Thermal Pad
(Connected to DRGND)
(4) The PowerPAD is connected to DRGND.
NOTE: NC = do not connect; must float.
Figure 4. ADS4246/ADS4245/ADS4242 CMOS Mode
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49 DRGND
50 DA6
51 DA7
52 DA8
53 DA9
54 DA10
55 DA11
56 UNUSED
57 CLKOUT
58 NC
59 NC
60 NC
61 NC
62 DB0
63 DB1
64 SDOUT
RGC PACKAGE(5)
QFN-64
(TOP VIEW)
DRVDD
1
48
DRVDD
DB2
2
47
DA5
DB3
3
46
DA4
DB4
4
45
DA3
DB5
5
44
DA2
DB6
6
43
DA1
DB7
7
42
DA0
DB8
8
41
NC
DB9
9
40
NC
DB10 10
39
NC
DB11 11
38
NC
RESET 12
37
CTRL3
SCLK 13
36
CTRL2
SDATA 14
35
CTRL1
SEN 15
34
AVDD
AVDD 16
33
AVDD
AGND 32
AGND 31
INM_A 30
INP_A 29
AGND 28
AGND 27
CLKM 26
CLKP 25
AGND 24
VCM 23
AVDD 22
AGND 21
INM_B 20
INP_B 19
AGND 18
AGND 17
Thermal Pad
(Connected to DRGND)
(5) The PowerPAD is connected to DRGND.
NOTE: NC = do not connect; must float.
Figure 5. ADS4226/ADS4225/ADS4222 CMOS Mode
16
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Pin Descriptions: CMOS Mode
PIN NUMBER
PIN NAME
# OF
PINS
1, 48
DRVDD
2
FUNCTION
Input
Output buffer supply
DESCRIPTION
12
RESET
1
Input
Serial interface RESET input.
When using the serial interface mode, the internal registers must be initialized through a
hardware RESET by applying a high pulse on this pin or by using the software reset
option; refer to the Serial Interface Configuration section.
In parallel interface mode, the RESET pin must be permanently tied high. SDATA and
SEN are used as parallel control pins in this mode. This pin has an internal 150kΩ
pull-down resistor.
13
SCLK
1
Input
This pin functions as a serial interface clock input when RESET is low. It controls the
low-speed mode when RESET is tied high; see Table 5 for detailed information. This pin
has an internal 150kΩ pull-down resistor.
14
SDATA
1
Input
Serial interface data input; this pin has an internal 150kΩ pull-down resistor.
15
SEN
1
Input
This pin functions as a serial interface enable input when RESET is low. It controls the
output interface and data format selection when RESET is tied high; see Table 6 for
detailed information. This pin has an internal 150kΩ pull-up resistor to AVDD.
16, 22, 33, 34
AVDD
4
Input
Analog power supply
17, 18, 21, 24, 27, 28,
31, 32
AGND
8
Input
Analog ground
19
INP_B
1
Input
Differential analog positive input, channel B
20
INM_B
1
Input
Differential analog negative input, channel B
23
VCM
1
Output
25
CLKP
1
Input
Differential clock positive input
26
CLKM
1
Input
Differential clock negative input
29
INP_A
1
Input
Differential analog positive input, channel A
30
INM_A
1
Input
Differential analog negative input, channel A
35
CTRL1
1
Input
Digital control input pins. Together, they control various power-down modes.
36
CTRL2
1
Input
Digital control input pins. Together, they control various power-down modes.
37
CTRL3
1
Input
Digital control input pins. Together, they control various power-down modes.
49, PAD
DRGND
2
Input
Output buffer ground
56
UNUSED
1
—
57
CLKOUT
1
Output
CMOS output clock
64
SDOUT
1
Output
This pin functions as a serial interface register readout when the READOUT bit is
enabled. When READOUT = 0, this pin is in high-impedance state.
Refer to Figure 4 and
Figure 5
DA0 to DA11
12
Output
Channel A ADC output data bits, CMOS levels
This pin outputs the common-mode voltage (0.95V) that can be used externally to bias
the analog input pins
This pin is not used in the CMOS interface
Refer to Figure 4
DA12 to DA13
2
Output
Channel A ADC output data bits, CMOS levels (ADS424x only)
Refer to Figure 4 and
Figure 5
DB0 to DB11
12
Output
Channel B ADC output data bits, CMOS levels
Refer to Figure 4
DB12 to DB13
2
Output
Channel B ADC output data bits, CMOS levels (ADS424x only)
—
NC
1
—
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FUNCTIONAL BLOCK DIAGRAM
AVDD
AGND
DRVDD
DRGND
LVDS Interface
DA0P
DA0M
DA2P
DA2M
DA4P
INP_A
Sampling
Circuit
INM_A
Digital and
DDR
Serializer
14-Bit
ADC
DA4M
DA6P
DA6M
DA8P
DA8M
DA10P
DA10M
DA12P
DA12M
CLKP
Output
Clock Buffer
CLOCKGEN
CLKM
CLKOUTP
CLKOUTM
DB0P
DB0M
DB2P
DB2M
DB4P
INP_B
Sampling
Circuit
INM_B
Digital and
DDR
Serializer
14-Bit
ADC
DB4M
DB6P
DB6M
DB8P
DB8M
DB10P
DB10M
DB12P
DB12M
CTRL3
CTRL1
SDOUT
CTRL2
SEN
SCLK
RESET
ADS424x
SDATA
Control
Interface
Reference
VCM
Figure 6. ADS4246/45/42 Block Diagram
18
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AVDD
AGND
DRVDD
DRGND
LVDS Interface
DA0P
DA0M
DA2P
DA2M
DA4P
INP_A
Sampling
Circuit
INM_A
Digital and
DDR
Serializer
12-Bit
ADC
DA4M
DA6P
DA6M
DA8P
DA8M
DA10P
DA10M
CLKP
Output
Clock Buffer
CLOCKGEN
CLKM
CLKOUTP
CLKOUTM
DB0P
DB0M
DB2P
DB2M
DB4P
INP_B
Sampling
Circuit
INM_B
Digital and
DDR
Serializer
12-Bit
ADC
DB4M
DB6P
DB6M
DB8P
DB8M
DB10P
DB10M
CTRL3
CTRL1
SDOUT
CTRL2
SEN
SCLK
RESET
ADS422x
SDATA
Control
Interface
Reference
VCM
Figure 7. ADS4226/25/22 Block Diagram
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TIMING CHARACTERISTICS: LVDS AND CMOS MODES (1)
Typical values are at +25°C, AVDD = 1.8 V, DRVDD = 1.8V, sampling frequency = 160MSPS, sine wave input clock, 1.5VPP
clock amplitude, CLOAD = 5pF (2), and RLOAD = 100Ω (3), unless otherwise noted. Minimum and maximum values are across the
full temperature range: TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.7V to 1.9V.
PARAMETER
tA
DESCRIPTION
Aperture delay
tJ
Aperture delay matching
Between the two channels of the same device
Variation of aperture delay
Between two devices at the same temperature and
DRVDD supply
MIN
TYP
MAX
0.5
0.8
1.1
Aperture jitter
Time to valid data after coming out of STANDBY
mode
Wakeup time
Time to valid data after coming out of GLOBAL
power-down mode
UNIT
ns
±70
ps
±150
ps
140
fS rms
50
100
µs
100
500
µs
Default latency after reset
16
Clock
cycles
Digital functions enabled (EN DIGITAL = 1)
24
Clock
cycles
1.5
2.0
ns
0.35
0.6
ns
5.0
6.1
ADC latency (4)
DDR LVDS MODE (5)
Data setup time
Data valid (6) to zero-crossing of CLKOUTP
tH
Data hold time
Zero-crossing of CLKOUTP to data becoming
invalid (6)
tPDI
Clock propagation delay
Input clock rising edge cross-over to output clock
rising edge cross-over
LVDS bit clock duty cycle
Duty cycle of differential clock,
(CLKOUTP-CLKOUTM)
tRISE,
tFALL
Data rise time,
Data fall time
tCLKRISE,
tCLKFALL
Output clock rise time,
Output clock fall time
tSU
7.5
ns
49
%
Rise time measured from –100mV to +100mV
Fall time measured from +100mV to –100mV
1MSPS ≤ Sampling frequency ≤ 160MSPS
0.13
ns
Rise time measured from –100mV to +100mV
Fall time measured from +100mV to –100mV
1MSPS ≤ Sampling frequency ≤ 160MSPS
0.13
ns
PARALLEL CMOS MODE
tSU
Data setup time
Data valid (7) to zero-crossing of CLKOUT
1.6
2.5
ns
tH
Data hold time
Zero-crossing of CLKOUT to data becoming invalid (7)
2.3
2.7
ns
Clock propagation delay
Input clock rising edge cross-over to output clock
rising edge cross-over
4.5
6.4
Output clock duty cycle
Duty cycle of output clock, CLKOUT
1MSPS ≤ Sampling frequency ≤ 160MSPS
tRISE,
tFALL
Data rise time,
Data fall time
tCLKRISE,
tCLKFALL
Output clock rise time
Output clock fall time
tPDI
(1)
(2)
(3)
(4)
(5)
(6)
(7)
20
8.5
ns
46
%
Rise time measured from 20% to 80% of DRVDD
Fall time measured from 80% to 20% of DRVDD
1MSPS ≤ Sampling frequency ≤ 160MSPS
1
ns
Rise time measured from 20% to 80% of DRVDD
Fall time measured from 80% to 20% of DRVDD
1MSPS ≤ Sampling frequency ≤ 160MSPS
1
ns
Timing parameters are ensured by design and characterization and not tested in production.
CLOAD is the effective external single-ended load capacitance between each output pin and ground
RLOAD is the differential load resistance between the LVDS output pair.
At higher frequencies, tPDI is greater than one clock period and overall latency = ADC latency + 1.
Measurements are done with a transmission line of 100Ω characteristic impedance between the device and the load. Setup and hold
time specifications take into account the effect of jitter on the output data and clock.
Data valid refers to a logic high of +100mV and a logic low of –100mV.
Data valid refers to a logic high of 1.26V and a logic low of 0.54V
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Table 2. LVDS Timings at Lower Sampling Frequencies
SAMPLING
FREQUENCY
(MSPS)
MIN
TYP
65
5.9
80
4.5
105
SETUP TIME (ns)
tPDI, CLOCK PROPAGATION
DELAY (ns)
HOLD TIME (ns)
MAX
MIN
TYP
6.6
0.35
5.2
0.35
3.1
3.6
125
2.3
150
1.7
MAX
MIN
TYP
MAX
0.6
5.0
6.1
7.5
0.6
5.0
6.1
7.5
0.35
0.6
5.0
6.1
7.5
2.9
0.35
0.6
5.0
6.1
7.5
2.2
0.35
0.6
5.0
6.1
7.5
Table 3. CMOS Timings at Lower Sampling Frequencies
TIMINGS SPECIFIED WITH RESPECT TO CLKOUT
SAMPLING
FREQUENCY
(MSPS)
SETUP TIME (ns)
tPDI, CLOCK PROPAGATION
DELAY (ns)
HOLD TIME (ns)
MIN
TYP
MIN
TYP
MIN
TYP
MAX
65
6.1
7.2
MAX
6.7
7.1
MAX
4.5
6.4
8.5
80
4.7
5.8
5.3
5.8
4.5
6.4
8.5
105
3.4
4.3
3.8
4.3
4.5
6.4
8.5
125
2.7
3.6
3.1
3.6
4.5
6.4
8.5
150
1.9
2.8
2.5
2.9
4.5
6.4
8.5
CLKM
Input
Clock
CLKP
tPDI
Output
Clock
CLKOUT
tSU
Output
Data
DAn,
DBn
tH
Dn
(1)
(1) Dn = bits D0, D1, D2, etc. of channels A and B.
Figure 8. CMOS Interface Timing Diagram
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N+4
N+3
N+2
N+1
Sample
N
N + 18
N + 17
N + 16
Input
Signal
tA
Input
Clock
CLKP
CLKM
CLKOUTM
CLKOUTP
tPDI
tH
DDR
LVDS
16 Clock Cycles
tSU
(1)
(2)
Output Data
DAnP/M, DBnP/M
O
E
O
E
N - 16
O
E
N - 15
O
E
N - 14
O
O
E
N - 13
E
N - 12
O
E
N-1
O
E
N
O
E
O
E
O
N+1
tPDI
CLKOUT
tSU
Parallel
CMOS
16 Clock Cycles
Output Data
DAn, DBn
N - 16
N - 15
N - 14
tH
(1)
N - 13
N-1
N
N+1
(1) ADC latency after reset. At higher sampling frequencies, tPDI is greater than one clock cycle, which then makes the overall latency = ADC
latency + 1.
(2) E = even bits (D0, D2, D4, etc.); O = odd bits (D1, D3, D5, etc.).
Figure 9. Latency Timing Diagram
22
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CLKOUTM
CLKOUTP
DA0, DB0
D0
D1
D0
D1
DA2, DB2
D2
D3
D2
D3
DA4, DB4
D4
D5
D4
D5
DA6, DB6
D6
D7
D6
D7
DA8, DB8
D8
D9
D8
D9
DA10, DB10
D10
D11
D10
D11
DA12, DB12
D12
D13
D12
D13
Sample N
Sample N + 1
Figure 10. ADS4246/45/42 LVDS Interface Timing Diagram
CLKOUTM
CLKOUTP
DA0, DB0
D0
D1
D0
D1
DA2, DB2
D2
D3
D2
D3
DA4, DB4
D4
D5
D4
D5
DA6, DB6
D6
D7
D6
D7
DA8, DB8
D8
D9
D8
D9
DA10, DB10
D10
D11
D10
D11
Sample N
Sample N + 1
Figure 11. ADS4226/25/22 LVDS Interface Timing Diagram
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DEVICE CONFIGURATION
The ADS424x/422x can be configured independently using either parallel interface control or serial interface
programming.
PARALLEL CONFIGURATION ONLY
To put the device into parallel configuration mode, keep RESET tied high (AVDD). Then, use the SEN, SCLK,
CTRL1, CTRL2, and CTRL3 pins to directly control certain modes of the ADC. The device can be easily
configured by connecting the parallel pins to the correct voltage levels (as described in Table 4 to Table 7).
There is no need to apply a reset and SDATA can be connected to ground.
In this mode, SEN and SCLK function as parallel interface control pins. Some frequently-used functions can be
controlled using these pins. Table 4 describes the modes controlled by the parallel pins.
Table 4. Parallel Pin Definition
PIN
CONTROL MODE
SCLK
Low-speed mode selection
SEN
Output data format and output interface selection
CTRL1
CTRL2
Together, these pins control the power-down modes
CTRL3
SERIAL INTERFACE CONFIGURATION ONLY
To enable this mode, the serial registers must first be reset to the default values and the RESET pin must be
kept low. SEN, SDATA, and SCLK function as serial interface pins in this mode and can be used to access the
internal registers of the ADC. The registers can be reset either by applying a pulse on the RESET pin or by
setting the RESET bit high. The Serial Register Map section describes the register programming and the register
reset process in more detail.
USING BOTH SERIAL INTERFACE AND PARALLEL CONTROLS
For increased flexibility, a combination of serial interface registers and parallel pin controls (CTRL1 to CTRL3)
can also be used to configure the device. To enable this option, keep RESET low. The parallel interface control
pins CTRL1 to CTRL3 are available. After power-up, the device is automatically configured according to the
voltage settings on these pins (see Table 7). SEN, SDATA, and SCLK function as serial interface digital pins and
are used to access the internal registers of the ADC. The registers must first be reset to the default values either
by applying a pulse on the RESET pin or by setting the RESET bit to '1'. After reset, the RESET pin must be kept
low. The Serial Register Map section describes register programming and the register reset process in more
detail.
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PARALLEL CONFIGURATION DETAILS
The functions controlled by each parallel pin are described in Table 5, Table 6, and Table 7. A simple way of
configuring the parallel pins is shown in Figure 12.
Table 5. SCLK Control Pin
VOLTAGE APPLIED ON SCLK
(1)
DESCRIPTION
Low
Low-speed mode is disabled
High
Low-speed mode is enabled (1)
Low-speed mode is enabled in the ADS4222/42 by default.
Table 6. SEN Control Pin
VOLTAGE APPLIED ON SEN
DESCRIPTION
0
(+50mV/0mV)
Twos complement and parallel CMOS output
(3/8) AVDD
(±50mV)
Offset binary and parallel CMOS output
(5/8) 2AVDD
(±50mV)
Offset binary and DDR LVDS output
AVDD
(0mV/–50mV)
Twos complement and DDR LVDS output
Table 7. CTRL1, CTRL2, and CTRL3 Pins
CTRL1
CTRL2
CTRL3
DESCRIPTION
Low
Low
Low
Normal operation
Low
Low
High
Not available
Low
High
Low
Not available
Low
High
High
Not available
High
Low
Low
Global power-down
High
Low
High
Channel A standby, channel B is active
High
High
Low
Not available
High
High
High
MUX mode of operation, channel A and B data are
multiplexed and output on the DB[13:0] pins.
AVDD
(5/8) AVDD
3R
(5/8) AVDD
GND
AVDD
2R
(3/8) AVDD
3R
(3/8) AVDD
To Parallel Pin
Figure 12. Simple Scheme to Configure the Parallel Pins
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SERIAL INTERFACE DETAILS
The ADC has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial
interface enable), SCLK (serial interface clock), and SDATA (serial interface data) pins. Serial shift of bits into the
device is enabled when SEN is low. Serial data SDATA are latched at every SCLK falling edge when SEN is
active (low). The serial data are loaded into the register at every 16th SCLK falling edge when SEN is low. When
the word length exceeds a multiple of 16 bits, the excess bits are ignored. Data can be loaded in multiples of
16-bit words within a single active SEN pulse. The first eight bits form the register address and the remaining
eight bits are the register data. The interface can work with SCLK frequencies from 20MHz down to very low
speeds (of a few hertz) and also with non-50% SCLK duty cycle.
Register Initialization
After power-up, the internal registers must be initialized to the default values. Initialization can be accomplished
in one of two ways:
1. Either through hardware reset by applying a high pulse on the RESET pin (of width greater than 10ns), as
shown in Figure 13; or
2. By applying a software reset. When using the serial interface, set the RESET bit high. This setting initializes
the internal registers to the default values and then self-resets the RESET bit low. In this case, the RESET
pin is kept low.
Register Address
SDATA
A6
A7
A5
A4
A3
Register Data
A2
A1
A0
D7
D6
D5
tSCLK
D4
D3
tDSU
D2
D1
D0
tDH
SCLK
tSLOADS
tSLOADH
SEN
RESET
Figure 13. Serial Interface Timing
Table 8. Serial Interface Timing Characteristics (1)
PARAMETER
MIN
TYP
> DC
MAX
UNIT
20
MHz
fSCLK
SCLK frequency (equal to 1/tSCLK)
tSLOADS
SEN to SCLK setup time
25
ns
tSLOADH
SCLK to SEN hold time
25
ns
tDSU
SDATA setup time
25
ns
tDH
SDATA hold time
25
ns
(1)
Typical values at +25°C; minimum and maximum values across the full temperature range: TMIN = –40°C to TMAX = +85°C,
AVDD = 1.8V, and DRVDD = 1.8V, unless otherwise noted.
Serial Register Readout
The device includes a mode where the contents of the internal registers can be read back. This readback mode
may be useful as a diagnostic check to verify the serial interface communication between the external controller
and the ADC. To use readback mode, follow this procedure:
1. Set the READOUT register bit to '1'. This setting disables any further writes to the registers.
2. Initiate a serial interface cycle specifying the address of the register (A7 to A0) whose content has to be
read.
3. The device outputs the contents (D7 to D0) of the selected register on the SDOUT pin (pin 64).
4. The external controller can latch the contents at the SCLK falling edge.
5. To enable register writes, reset the READOUT register bit to '0'.
The serial register readout works with both CMOS and LVDS interfaces on pin 64.
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When READOUT is disabled, the SDOUT pin is in high-impedance state. If serial readout is not used, the
SDOUT pin must float.
Register Address A[7:0] = 00h
0
SDATA
0
0
0
0
0
Register Data D[7:0] = 01h
0
0
0
0
0
0
0
0
0
1
SCLK
SEN
The SDOUT pin is in high-impedance state.
SDOUT
a) Enable serial readout (READOUT = 1)
Register Address A[7:0] = 45h
SDATA
A6
A7
A5
A4
A3
A2
Register Data D[7:0] = XX (don’t care)
A0
A1
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
1
0
0
SCLK
SEN
SDOUT
The SDOUT pin functions as serial readout (READOUT = 1).
b) Read contents of Register 45h. This register has been initialized with 04h (device is put into global power-down mode.)
Figure 14. Serial Readout Timing Diagram
Table 9. Reset Timing (Only when Serial Interface is Used) (1)
PARAMETER
CONDITIONS
MIN
t1
Power-on delay
Delay from AVDD and DRVDD power-up to active RESET
pulse
t2
Reset pulse width
Active RESET signal pulse width
t3
Register write delay
Delay from RESET disable to SEN active
(1)
TYP
MAX
UNIT
1
ms
10
ns
1
100
µs
ns
Typical values at +25°C; minimum and maximum values across the full temperature range: TMIN = –40°C to TMAX = +85°C, unless
otherwise noted.
Power Supply
AVDD, DRVDD
t1
RESET
t2
t3
SEN
NOTE: A high pulse on the RESET pin is required in the serial interface mode when initialized through a hardware reset. For parallel
interface operation, RESET must be permanently tied high.
Figure 15. Reset Timing Diagram
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SERIAL REGISTER MAP
Table 10 summarizes the functions supported by the serial interface.
Table 10. Serial Interface Register Map (1)
REGISTER
ADDRESS
REGISTER DATA
A[7:0] (Hex)
D7
D6
D5
D4
D3
D2
D1
D0
00
0
0
0
0
0
0
RESET
READOUT
0
0
0
0
0
0
0
0
0
0
01
03
LVDS SWING
25
29
CH A GAIN
2B
0
0
CH B GAIN
3D
0
0
3F
0
0
ENABLE
OFFSET
CORR
0
0
0
0
CH B TEST PATTERNS
0
0
0
CUSTOM PATTERN D[13:8]
CUSTOM PATTERN D[7:0]
41
LVDS CMOS
CMOS CLKOUT STRENGTH
0
0
42
CLKOUT FALL POSN
CLKOUT RISE POSN
EN DIGITAL
0
0
DIS OBUF
0
45
STBY
LVDS
CLKOUT
STRENGTH
4A
0
0
0
0
0
0
0
HIGH FREQ
MODE CH B (2)
58
0
0
0
0
0
0
0
HIGH FREQ
MODE CH A (2)
LVDS DATA
STRENGTH
0
0
PDN GLOBAL
0
0
BF
CH A OFFSET PEDESTAL
0
0
C1
CH B OFFSET PEDESTAL
0
0
0
0
CF
FREEZE
OFFSET
CORR
0
DB
0
0
0
0
0
0
0
LOW SPEED
MODE CH B (3)
EF
0
0
0
EN LOW
SPEED
MODE (3)
0
0
0
0
F1
0
0
0
0
0
0
EN LVDS SWING
0
LOW SPEED
MODE CH A (3)
0
0
F2
28
CH A TEST PATTERNS
0
0
40
(1)
(2)
(3)
DATA FORMAT
HIGH PERF MODE
0
0
OFFSET CORR TIME CONSTANT
0
0
Multiple functions in a register can be programmed in a single write operation. All registers default to '0' after reset.
These bits improve SFDR on high frequencies. The frequency limit is 200MHz.
Low-speed mode is not applicable for the ADS4242 and ADS4222.
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DESCRIPTION OF SERIAL REGISTERS
Register Address 00h (Default = 00h)
7
6
5
4
3
2
1
0
0
0
0
0
0
0
RESET
READOUT
Bits[7:2]
Always write '0'
Bit 1
RESET: Software reset applied
This bit resets all internal registers to the default values and self-clears to 0 (default = 1).
Bit 0
READOUT: Serial readout
This bit sets the serial readout of the registers.
0 = Serial readout of registers disabled; the SDOUT pin is placed in high-impedance state.
1 = Serial readout enabled; the SDOUT pin functions as a serial data readout with CMOS logic
levels running from the DRVDD supply. See the Serial Register Readout section.
Register Address 01h (Default = 00h)
7
6
5
4
3
2
LVDS SWING
Bits[7:2]
1
0
0
0
LVDS SWING: LVDS swing programmability
These bits program the LVDS swing. Set the EN LVDS SWING bit to '1' before programming
swing.
000000 = Default LVDS swing; ±350mV with external 100Ω termination
011011 = LVDS swing increases to ±410mV
110010 = LVDS swing increases to ±465mV
010100 = LVDS swing increases to ±570mV
111110 = LVDS swing decreases to ±200mV
001111 = LVDS swing decreases to ±125mV
Bits[1:0]
Always write '0'
Register Address 03h (Default = 00h)
7
6
5
4
3
2
1
0
0
0
0
0
0
HIGH PERF MODE
Bits[7:2]
Always write '0'
Bits[1:0]
HIGH PERF MODE: High-performance mode
00
01
10
11
=
=
=
=
0
Default performance
Do not use
Do not use
Obtain best performance across sample clock and input signal frequencies
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Register Address 25h (Default = 00h)
7
6
5
4
3
CH A GAIN
Bits[7:4]
2
0
1
0
CH A TEST PATTERNS
CH A GAIN: Channel A gain programmability
These bits set the gain programmability in 0.5dB steps for channel A.
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
=
=
=
=
=
=
=
=
=
=
=
=
=
0dB gain (default after reset)
0.5dB gain
1dB gain
1.5dB gain
2dB gain
2.5dB gain
3dB gain
3.5dB gain
4dB gain
4.5dB gain
5dB gain
5.5dB gain
6dB gain
Bit 3
Always write '0'
Bits[2:0]
CH A TEST PATTERNS: Channel A data capture
These bits verify data capture for channel A.
000 = Normal operation
001 = Outputs all 0s
010 = Outputs all 1s
011 = Outputs toggle pattern.
For the ADS424x, output data D[13:0] are an alternating sequence of 10101010101010 and
01010101010101.
For the ADS422x, the output data D[11:0] are an alternating sequence of 101010101010 and
010101010101.
100 = Outputs digital ramp.
For the ADS424x, output data increment by one LSB (14-bit) every clock cycle from code 0 to code
16383.
For the ADS422x, output data increment by one LSB (12-bit) every fourth clock cycle from code 0
to code 4095.
101 = Outputs custom pattern; use registers 3Fh and 40h to set the custom pattern
110 = Unused
111 = Unused
Register Address 29h (Default = 00h)
7
6
5
0
0
0
4
3
DATA FORMAT
Bits[7:5]
Always write '0'
Bits[4:3]
DATA FORMAT: Data format selection
00
01
10
11
Bits[2:0]
30
=
=
=
=
2
1
0
0
0
0
Twos complement
Twos complement
Twos complement
Offset binary
Always write '0'
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Register Address 2Bh (Default = 00h)
7
6
5
4
CH B GAIN
Bits[7:4]
3
0
2
1
0
CH B TEST PATTERNS
CH B GAIN: Channel B gain programmability
These bits set the gain programmability in 0.5dB steps for channel B.
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
=
=
=
=
=
=
=
=
=
=
=
=
=
0dB gain (default after reset)
0.5dB gain
1dB gain
1.5dB gain
2dB gain
2.5dB gain
3dB gain
3.5dB gain
4dB gain
4.5dB gain
5dB gain
5.5dB gain
6dB gain
Bit 3
Always write '0'
Bits[2:0]
CH B TEST PATTERNS: Channel B data capture
These bits verify data capture for channel B.
000 = Normal operation
001 = Outputs all 0s
010 = Outputs all 1s
011 = Outputs toggle pattern.
For the ADS424x, output data D[13:0] are an alternating sequence of 10101010101010 and
01010101010101.
For the ADS422x, the output data D[11:0] are an alternating sequence of 101010101010 and
010101010101.
100 = Outputs digital ramp.
For the ADS424x, output data increment by one LSB (14-bit) every clock cycle from code 0 to code
16383.
For the ADS422x, output data increment by one LSB (12-bit) every fourth clock cycle from code 0
to code 4095.
101 = Outputs custom pattern; use registers 3Fh and 40h to set the custom pattern
110 = Unused
111 = Unused
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Register Address 3Dh (Default = 00h)
7
6
5
4
3
2
1
0
0
0
ENABLE OFFSET CORR
0
0
0
0
0
Bits[7:6]
Always write '0'
Bit 5
ENABLE OFFSET CORR: Offset correction setting
This bit enables the offset correction.
0 = Offset correction disabled
1 = Offset correction enabled
Bits[4:0]
Always write '0'
Register Address 3Fh (Default = 00h)
7
0
6
5
4
3
2
1
0
0
CUSTOM
PATTERN D13
CUSTOM
PATTERN D12
CUSTOM
PATTERN D11
CUSTOM
PATTERN D10
CUSTOM
PATTERN D9
CUSTOM
PATTERN D8
Bits[7:6]
Always write '0'
Bits[5:0]
CUSTOM PATTERN D[13:8]
These are the six upper bits of the custom pattern available at the output instead of ADC data.
Note that for the ADS424x, the custom pattern is 14-bit. The ADS422x custom pattern is 12-bit.
Register Address 40h (Default = 00h)
7
6
5
4
3
2
1
0
CUSTOM
PATTERN D7
CUSTOM
PATTERN D6
CUSTOM
PATTERN D5
CUSTOM
PATTERN D4
CUSTOM
PATTERN D3
CUSTOM
PATTERN D2
CUSTOM
PATTERN D1
CUSTOM
PATTERN D0
Bits[7:0]
CUSTOM PATTERN D[7:0]
These are the eight upper bits of the custom pattern available at the output instead of ADC data.
Note that for the ADS424x, the custom pattern is 14-bit. The ADS422x custom pattern is 12-bit;
use the CUSTOM PATTERN D[13:2] register bits.
32
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Register Address 41h (Default = 00h)
7
6
LVDS CMOS
Bits[7:6]
5
4
CMOS CLKOUT STRENGTH
3
2
0
0
1
0
DIS OBUF
LVDS CMOS: Interface selection
These bits select the interface.
00 = DDR LVDS interface
01 = DDR LVDS interface
10 = DDR LVDS interface
11 = Parallel CMOS interface
Bits[5:4]
CMOS CLKOUT STRENGTH
These bits control the strength of the CMOS output clock.
00 = Maximum strength (recommended)
01 = Medium strength
10 = Low strength
11 = Very low strength
Bits[3:2]
Always write '0'
Bits[1:0]
DIS OBUF
These bits power down data and clock output buffers for both the CMOS and LVDS output
interface. When powered down, the output buffers are in 3-state.
00 = Default
01 = Power-down data output buffers for channel B
10 = Power-down data output buffers for channel A
11 = Power-down data output buffers for both channels as well as the clock output buffer
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Register Address 42h (Default = 00h)
7
6
5
CLKOUT FALL POSN
Bits[7:6]
2
1
0
0
0
0
of the output clock advances by 450 ps
of the output clock advances by 150 ps
of the output clock is delayed by 550 ps
of the output clock is delayed by 150 ps
of the output clock advances by 100 ps
CLKOUT RISE POSN
In LVDS mode:
00 = Default
01 = The rising edge
10 = The rising edge
11 = The rising edge
In CMOS mode:
00 = Default
01 = The rising edge
10 = Do not use
11 = The rising edge
Bit 3
3
EN DIGITAL
CLKOUT FALL POSN
In LVDS mode:
00 = Default
01 = The falling edge
10 = The falling edge
11 = The falling edge
In CMOS mode:
00 = Default
01 = The falling edge
10 = Do not use
11 = The falling edge
Bits[5:6]
4
CLKOUT RISE POSN
of the output clock advances by 450 ps
of the output clock advances by 150 ps
of the output clock is delayed by 250 ps
of the output clock is delayed by 150 ps
of the output clock advances by 100 ps
EN DIGITAL: Digital function enable
0 = All digital functions disabled
1 = All digital functions (such as test patterns, gain, and offset correction) enabled
Bits[2:0]
34
Always write '0'
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Register Address 45h (Default = 00h)
7
6
5
4
3
2
1
0
STBY
LVDS CLKOUT
STRENGTH
LVDS DATA
STRENGTH
0
0
PDN GLOBAL
0
0
Bit 7
STBY: Standby setting
0 = Normal operation
1 = Both channels are put in standby; wakeup time from this mode is fast (typically 50µs).
Bit 6
LVDS CLKOUT STRENGTH: LVDS output clock buffer strength setting
0 = LVDS output clock buffer at default strength to be used with 100Ω external termination
1 = LVDS output clock buffer has double strength to be used with 50Ω external termination
Bit 5
LVDS DATA STRENGTH
0 = All LVDS data buffers at default strength to be used with 100Ω external termination
1 = All LVDS data buffers have double strength to be used with 50Ω external termination
Bits[4:3]
Always write '0'
Bit 2
PDN GLOBAL
0 = Normal operation
1 = Total power down; all ADC channels, internal references, and output buffers are powered
down. Wakeup time from this mode is slow (typically 100µs).
Bits[1:0]
Always write '0'
Register Address 4Ah (Default = 00h)
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
HIGH FREQ MODE CH B
Bits[7:1]
Always write '0'
Bit 0
HIGH FREQ MODE CH B: High-frequency mode for channel B
0 = Default
1 = Use this mode for high input frequencies
Register Address 58h (Default = 00h)
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
HIGH FREQ MODE CH A
Bits[7:1]
Always write '0'
Bit 0
HIGH FREQ MODE CH A: High-frequency mode for channel A
0 = Default
1 = Use this mode for high input frequencies
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Register Address BFh (Default = 00h)
7
6
5
4
3
2
CH A OFFSET PEDESTAL
Bits[7:2]
1
0
0
0
CH A OFFSET PEDESTAL: Channel A offset pedestal selection
When the offset correction is enabled, the final converged value after the offset is corrected is the
ADC midcode value. A pedestal can be added to the final converged value by programming these
bits. See the Offset Correction section. Channels can be independently programmed for different
offset pedestals by choosing the relevant register address.
For the ADS424x, the pedestal ranges from –32 to +31, so the output code can vary from
midcode-32 to midcode+32 by adding pedestal D7-D2.
For the ADS422x, the pedestal ranges from –8 to +7, so the output code can vary from midcode-8
to midcode+7 by adding pedestal D7-D4.
Bits[1:0]
36
ADS422x (Program Bits D[7:4])
ADS424x (Program Bits D[7:2])
0111 = Midcode+7
0110 = Midcode+6
0101 = Midcode+5
…
0000 = Midcode
1111 = Midcode-1
1110 = Midcode-2
1101 = Midcode-3
…
1000 = Midcode-8
011111 = Midcode+31
011110 = Midcode+30
011101 = Midcode+29
…
000000 = Midcode
111111 = Midcode-1
111110 = Midcode-2
111101 = Midcode-3
…
100000 = Midcode-32
Always write '0'
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Register Address C1h (Default = 00h)
7
6
5
4
3
2
CH B OFFSET PEDESTAL
Bits[7:2]
1
0
0
0
CH B OFFSET PEDESTAL: Channel B offset pedestal selection
When offset correction is enabled, the final converged value after the offset is corrected is the ADC
midcode value. A pedestal can be added to the final converged value by programming these bits;
see the Offset Correction section. Channels can be independently programmed for different offset
pedestals by choosing the relevant register address.
For the ADS424x, the pedestal ranges from –32 to +31, so the output code can vary from
midcode-32 to midcode+32 by adding pedestal D[7:2]. For the ADS422x, the pedestal ranges
from –8 to +7, so the output code can vary from midcode-8 to midcode+7 by adding pedestal
D[7:4].
Bits[1:0]
ADS422x (Program Bits D[7:4])
ADS424x (Program Bits D[7:2])
0111 = Midcode+7
0110 = Midcode+6
0101 = Midcode+5
…
0000 = Midcode
1111 = Midcode-1
1110 = Midcode-2
1101 = Midcode-3
…
1000 = Midcode-8
011111 = Midcode+31
011110 = Midcode+30
011101 = Midcode+29
…
000000 = Midcode
111111 = Midcode-1
111110 = Midcode-2
111101 = Midcode-3
…
100000 = Midcode-32
Always write '0'
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Register Address CFh (Default = 00h)
7
6
FREEZE OFFSET CORR
0
Bit 7
5
4
3
2
OFFSET CORR TIME CONSTANT
1
0
0
0
FREEZE OFFSET CORR: Freeze offset correction setting
This bit sets the freeze offset correction estimation.
0 = Estimation of offset correction is not frozen (the EN OFFSET CORR bit must be set)
1 = Estimation of offset correction is frozen (the EN OFFSET CORR bit must be set); when frozen,
the last estimated value is used for offset correction of every clock cycle. See the Offset Correction
section.
Bit 6
Always write '0'
Bits[5:2]
OFFSET CORR TIME CONSTANT
The offset correction loop time constant in number of clock cycles. Refer to the Offset Correction
section.
Bits[1:0]
Always write '0'
Register Address DBh (Default = 00h)
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
LOW SPEED MODE CH B
Bits[7:1]
Always write '0'
Bit 0
LOW SPEED MODE CH B: Channel B low-speed mode enable
This bit enables the low-speed mode for channel B. Set the EN LOW SPEED MODE bit to '1'
before using this bit.
0 = Low-speed mode is disabled for channel B
1 = Low-speed mode is enabled for channel B
Register Address EFh (Default = 00h)
7
6
5
4
3
2
1
0
0
0
0
EN LOW SPEED MODE
0
0
0
0
Bits[7:5]
Always write '0'
Bit 4
EN LOW SPEED MODE: Enable control of low-speed mode through serial register bits
(ADS42x5 and ADS42x6 only)
This bit enables the control of the low-speed mode using the LOW SPEED MODE CH B and LOW
SPEED MODE CH A register bits.
0 = Low-speed mode is disabled
1 = Low-speed mode is controlled by serial register bits
Bits[3:0]
38
Always write '0'
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Register Address F1h (Default = 00h)
7
6
5
4
3
2
1
0
0
0
0
0
0
EN LVDS SWING
Bits[7:2]
Always write '0'
Bits[1:0]
EN LVDS SWING: LVDS swing enable
0
These bits enable LVDS swing control using the LVDS SWING register bits.
00 = LVDS swing control using the LVDS SWING register bits is disabled
01 = Do not use
10 = Do not use
11 = LVDS swing control using the LVDS SWING register bits is enabled
Register Address F2h (Default = 00h)
7
6
5
4
3
2
1
0
0
0
0
0
LOW SPEED MODE CH A
0
0
0
Bits[7:4]
Always write '0'
Bit 3
LOW SPEED MODE CH A: Channel A low-speed mode enable
This bit enables the low-speed mode for channel A. Set the EN LOW SPEED MODE bit to '1'
before using this bit.
0 = Low-speed mode is disabled for channel A
1 = Low-speed mode is enabled for channel A
Bits[2:0]
Always write '0'
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TYPICAL CHARACTERISTICS: ADS4246
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR 20MHz INPUT SIGNAL
FFT FOR 170MHz INPUT SIGNAL
0
0
SFDR = 89.8dBc
SINAD = 72.8dBFS
SNR = 72.9dBFS
THD = 87.9dBc
−20
−20
−40
Amplitude (dB)
Amplitude (dB)
−40
−60
−60
−80
−80
−100
−100
−120
SFDR = 89.8dBc
SINAD = 71.3dBFS
SNR = 71.2dBFS
THD = 88.2dBc
0
10
20
30
40
50
Frequency (MHz)
60
70
−120
80
0
10
20
Figure 16.
FFT FOR 300MHz INPUT SIGNAL
80
FFT FOR TWO-TONE INPUT SIGNAL
SFDR = 76.5dBc
SINAD = 68.4dBFS
SNR = 69.3dBFS
THD = 74.5dBc
Each Tone at
−7dBFS Amplitude
fIN1 = 185.1MHz
fIN2 = 190.1MHz
Two−Tone IMD = 83.6dBFS
SFDR = 95.1dBFS
−20
−40
Amplitude (dB)
−40
Amplitude (dB)
70
0
−20
−60
−60
−80
−80
−100
−100
0
10
20
30
40
50
Frequency (MHz)
Figure 18.
40
60
Figure 17.
0
−120
30
40
50
Frequency (MHz)
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60
70
80
−120
0
10
20
30
40
50
Frequency (MHz)
60
70
80
Figure 19.
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TYPICAL CHARACTERISTICS: ADS4246 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR TWO-TONE INPUT SIGNAL
SFDR vs INPUT FREQUENCY
0
90
Each Tone at
−7dBFS Amplitude
fIN1 = 46.1MHz
fIN2 = 50.1MHz
Two−Tone IMD = 96.2dBFS
SFDR = 103.2dBFS
−20
85
SFDR (dBc)
Amplitude (dB)
−40
−60
80
75
−80
70
−100
Gain = 0dB
Gain = 6dB
0
10
20
30
40
50
Frequency (MHz)
60
70
65
80
200
250
300
350
400
SNR vs INPUT FREQUENCY (CMOS)
73
72
72
71
71
70
70
69
68
66
66
65
65
64
Gain = 0dB
Gain = 6dB
150
200
250
300
350
Input Frequency (MHz)
Figure 22.
Copyright © 2011, Texas Instruments Incorporated
500
450
500
68
67
100
450
69
67
50
150
SNR vs INPUT FREQUENCY
73
0
100
Figure 21.
74
63
50
Figure 20.
74
64
0
Input Frequency (MHz)
SNR (dBFS)
SNR (dBFS)
−120
400
450
500
63
Gain = 0dB
Gain = 6dB
0
50
100
150
200
250
300
350
400
Input Frequency (MHz)
Figure 23.
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TYPICAL CHARACTERISTICS: ADS4246 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
SFDR vs GAIN AND INPUT FREQUENCY
SINAD vs GAIN AND INPUT FREQUENCY
90
72
71
86
70
69
SINAD (dBFS)
78
74
67
66
65
64
70
66
68
150MHz
170MHz
220MHz
0
0.5
1
1.5
2
2.5 3 3.5 4
Digital Gain (dB)
300MHz
400MHz
470MHz
4.5
5
5.5
150MHz
170MHz
220MHz
63
62
6
0
0.5
1
1.5
2.5 3 3.5 4
Digital Gain (dB)
4.5
5
Figure 25.
PERFORMANCE vs INPUT AMPLITUDE
PERFORMANCE vs INPUT AMPLITUDE
78
5.5
Input Frequency = 150MHz
110
76
100
76
100
75
90
75
90
74
80
74
80
73
70
73
70
72
60
72
60
71
50
71
50
70
70
40
40
SFDR(dBc)
SFDR(dBFS)
SNR
20
−70
−60
−50
−40
−30
Amplitude (dBFS)
Figure 26.
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−20
−10
0
SFDR (dBc, dBFS)
77
SNR (dBFS)
110
30
6
77
120
Input Frequency = 40MHz
SFDR(dBc,dBFS)
2
Figure 24.
120
42
300MHz
400MHz
470MHz
69
30
68
20
−70
SNR (dBFS)
SFDR (dBc)
82
69
SFDR (dBc)
SFDR (dBFS)
SNR
−60
−50
−40
−30
Amplitude (dBFS)
−20
−10
68
0
67
Figure 27.
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TYPICAL CHARACTERISTICS: ADS4246 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
75
77
120
87
74.5
86
74
85
73.5
84
73
83
72.5
82
72
81
71.5
SFDR (dBc, dBFS)
Input Frequency = 150MHz
SNR (dBFS)
SFDR (dBc)
Input Frequency = 40MHz
110
76
100
75
90
74
80
73
70
72
60
71
50
70
69
40
80
0.8
0.85
71
1.1
0.9
0.95
1
1.05
Input CommonMode Voltage (V)
SFDR (dBc)
SFDR (dBFS)
SNR
30
SFDR
SNR
SNR (dBFS)
88
20
−70
−60
−50
−40
−30
Amplitude (dBFS)
−20
−10
68
0
67
Figure 28.
Figure 29.
SFDR vs TEMPERATURE AND AVDD SUPPLY
SNR vs TEMPERATURE AND AVDD SUPPLY
72
91
Input Frequency = 150MHz
Input Frequency = 150MHz
89
71.5
87
71
83
SNR (dBFS)
SFDR (dBc)
85
81
79
70
77
75
73
71
−40
70.5
AVDD = 1.65
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
−15
AVDD = 1.85
AVDD = 1.90
AVDD = 1.95
10
35
Temperature (°C)
Figure 30.
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69.5
60
85
69
−40
AVDD = 1.65
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
−15
AVDD = 1.85
AVDD = 1.90
AVDD = 1.95
10
35
Temperature (°C)
60
85
Figure 31.
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TYPICAL CHARACTERISTICS: ADS4246 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs DRVDD SUPPLY VOLTAGE
PERFORMANCE vs INPUT CLOCK AMPLITUDE
74.5
88
73
85
72.5
84
72
71.5
83
SFDR (dBc)
Input Frequency = 40MHz
SNR (dBFS)
71
82
87
74
86
73.5
85
73
84
72.5
72
83
SFDR
SNR
81
1.65
1.7
1.75
1.8
1.85
DRVDD Supply (V)
SFDR
SNR
70.5
1.95
1.9
82
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
71.5
2.2
Differential Clock Amplitude (VPP)
Figure 32.
Figure 33.
PERFORMANCE vs INPUT CLOCK AMPLITUDE
PERFORMANCE vs INPUT CLOCK DUTY CYCLE
74
88.5
75
85
Input Frequency = 150MHz
Input Frequency = 10MHz
84
74
83
73
82
72
81
71
80
70
79
69
73.5
88
73
THD (dBc)
SNR (dBFS)
SFDR (dBc)
87.5
72.5
87
72
86.5
71.5
86
68
78
SFDR
SNR
77
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Differential Clock Amplitude (VPP)
Figure 34.
44
SNR (dBFS)
SFDR (dBc)
Input Frequency = 150MHz
SNR (dBFS)
86
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2
67
2.2
SNR
THD
85.5
25
30
35
40
45
50
55
60
Input Clock Duty Cycle (%)
65
70
75
71
Figure 35.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4246 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
OUTPUT NOISE HISTOGRAM
(WITH INPUTS SHORTED TO VCM)
INTEGRATED NONLINEARITY
80
1.5
Input Frequency=20MHz
74.11
RMS Noise = 1.17LSB
1.2
70
0.9
60
Code Occurrence (%)
INL (LSB)
0.6
0.3
0
−0.3
51.98
50
43.17
40
30
−0.6
20
−0.9
13.08
10
−1.2
1.69 0.06
0.01 0.11 1.33
−1.5
13.88
0
4000
8000
12000
Output Code (LSB)
Figure 36.
Copyright © 2011, Texas Instruments Incorporated
16000
0
8211 8212 8213 8214 8215 8216 8217 8218 8219 8220
Output Code (LSB)
Figure 37.
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45
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4245
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR 20MHz INPUT SIGNAL
FFT FOR 170MHz INPUT SIGNAL
0
0
SFDR = 89.7dBc
SINAD = 73dBFS
SNR = 73.1dBFS
THD = 88.4dBc
−20
−20
−40
Amplitude (dB)
Amplitude (dB)
−40
−60
−60
−80
−80
−100
−100
−120
SFDR = 86.7dBc
SINAD = 71.2dBFS
SNR = 71.4dBFS
THD = 83.8dBc
0
10
20
30
40
Frequency (MHz)
50
−120
60
0
10
20
Figure 38.
FFT FOR 300MHz INPUT SIGNAL
FFT FOR TWO-TONE INPUT SIGNAL
SFDR = 73.4dBc
SINAD = 67.7dBFS
SNR = 69.2dBFS
THD = 72.3dBc
Each Tone at
−7dBFS Amplitude
fIN1 =185MHz
fIN2 =190MHz
Two−Tone IMD = 94dBFS
SFDR = 92.8dBFS
−20
−40
Amplitude (dB)
−40
Amplitude (dB)
60
0
−20
−60
−60
−80
−80
−100
−100
0
10
20
30
40
Frequency (MHz)
Figure 40.
46
50
Figure 39.
0
−120
30
40
Frequency (MHz)
Submit Documentation Feedback
50
60
−120
0
10
20
30
40
Frequency (MHz)
50
60
Figure 41.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4245 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR TWO-TONE INPUT SIGNAL
SFDR vs INPUT FREQUENCY
0
90
Each Tone at
−7dBFS Amplitude
fIN1 =46MHz
fIN2 =50MHz
Two−Tone IMD = 96.9dBFS
SFDR = 105.3dBFS
−20
85
SFDR (dBc)
Amplitude (dB)
−40
−60
80
75
−80
70
−100
Gain = 0dB
Gain = 6dB
0
10
20
30
40
Frequency (MHz)
50
65
60
200
250
300
350
400
SNR vs INPUT FREQUENCY (CMOS)
73
72
72
71
71
70
70
69
68
66
66
65
65
64
Gain = 0dB
Gain = 6dB
150
200
250
300
350
Input Frequency (MHz)
Figure 44.
Copyright © 2011, Texas Instruments Incorporated
500
450
500
68
67
100
450
69
67
50
150
SNR vs INPUT FREQUENCY
73
0
100
Figure 43.
74
63
50
Figure 42.
74
64
0
Input Frequency (MHz)
SNR (dBFS)
SNR (dBFS)
−120
400
450
500
63
Gain = 0dB
Gain = 6dB
0
50
100
150
200
250
300
350
400
Input Frequency (MHz)
Figure 45.
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47
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4245 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
SFDR vs GAIN AND INPUT FREQUENCY
SINAD vs GAIN AND INPUT FREQUENCY
94
72
92
71
90
88
70
86
69
SINAD (dBFS)
SFDR (dBc)
84
82
80
78
68
67
66
76
65
74
72
64
150MHz
170MHz
220MHz
68
66
0
0.5
1
1.5
2
2.5 3 3.5 4
Digital Gain (dB)
300MHz
400MHz
470MHz
4.5
5
5.5
150MHz
170MHz
220MHz
63
62
6
0
0.5
1
1.5
4.5
5
PERFORMANCE vs INPUT AMPLITUDE
PERFORMANCE vs INPUT AMPLITUDE
76.5
100
76
90
75
80
74
70
73
60
72
71
80
75
70
74.5
60
74
50
73.5
50
73
40
72.5
30
−70
SFDR(dBc)
SFDR(dBFS)
SNR
−50
−40
−30
Amplitude (dBFS)
Figure 48.
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−20
−10
0
SFDR(dBc,dBFS)
75.5
SNR (dBFS)
90
−60
6
77
110
76
40
5.5
Input Frequency = 150MHz
100
SFDR(dBc,dBFS)
2.5 3 3.5 4
Digital Gain (dB)
Figure 47.
Input Frequency = 40MHz
48
2
Figure 46.
110
30
−70
300MHz
400MHz
470MHz
SFDR(dBc)
SFDR(dBFS)
SNR
−60
−50
−40
−30
Amplitude (dBFS)
−20
−10
SNR (dBFS)
70
70
0
69
Figure 49.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4245 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
73.8
90
73
89
Input Frequency = 150MHz
87
72.75
88
73.6
85
72.5
87
73.5
83
72.25
86
73.4
81
72
85
73.3
79
71.75
84
73.2
77
71.5
73.1
75
83
71.25
SFDR
SNR
82
0.8
0.85
0.9
0.95
1
Input CommonMode (V)
SFDR
SNR
73
1.1
1.05
SNR (dBFS)
73.7
SFDR (dBc)
89
SNR (dBFS)
SFDR (dBc)
Input Frequency = 40MHz
73
0.8
0.85
71
1.1
0.9
0.95
1
1.05
Input CommonMode Voltage (V)
Figure 50.
Figure 51.
SFDR vs TEMPERATURE AND AVDD SUPPLY
SNR vs TEMPERATURE AND AVDD SUPPLY
73
91
Input Frequency = 150MHz
Input Frequency = 150MHz
89
72.5
87
72
83
SNR (dBFS)
SFDR (dBc)
85
81
79
71
77
75
73
71
−40
71.5
AVDD = 1.65
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
−15
AVDD = 1.85
AVDD = 1.9
AVDD = 1.95
10
35
Temperature (°C)
Figure 52.
Copyright © 2011, Texas Instruments Incorporated
70.5
60
85
70
−40
AVDD = 1.65
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
AVDD = 1.85
AVDD = 1.90
AVDD = 1.95
−15
10
35
Temperature (°C)
60
85
Figure 53.
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49
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4245 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs DRVDD SUPPLY VOLTAGE
PERFORMANCE vs INPUT CLOCK AMPLITUDE
73
88
74.5
90
72.5
89
74
86
72
88
73.5
85
71.5
87
73
84
71
86
72.5
70.5
85
83
SFDR (dBc)
87
72
SFDR
SNR
1.7
1.75
1.8
1.85
DRVDD Supply (V)
SFDR
SNR
70
1.95
1.9
84
0.2
0.4
0.6
1.4
1.6
1.8
2
71.5
2.2
Figure 55.
PERFORMANCE vs INPUT CLOCK AMPLITUDE
PERFORMANCE vs INPUT CLOCK DUTY CYCLE
75
89
75
88
74
86
73
84
72
82
71
80
70
78
69
76
68
74
67
72
66
70
SFDR
SNR
0.4
0.6
0.8
1
1.2
1.4
1.6
Differential Clock Amplitude (VPP)
Figure 56.
Submit Documentation Feedback
1.8
2
THD (dBc)
Input Frequency = 10MHz
SNR (dBFS)
SFDR (dBc)
1.2
Figure 54.
Input Frequency = 150MHz
50
1
Differential Clock Amplitude (VPP)
90
68
0.2
0.8
88
74.5
87
74
86
73.5
85
73
72.5
84
65
64
2.2
SNR (dBFS)
82
1.65
SNR (dBFS)
Input Frequency = 40MHz
SNR (dBFS)
SFDR (dBc)
Input Frequency = 150MHz
SNR
THD
83
25
30
35
40
45
50
55
60
Input Clock Duty Cycle (%)
65
70
75
72
Figure 57.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4245 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
OUTPUT NOISE HISTOGRAM
(WITH INPUTS SHORTED TO VCM)
INTEGRATED NONLINEARITY
40
1.5
RMS Noise = 1.1LSB
Input Frequency=20MHz
1.2
35
33.31
0.9
30
Code Occurrence (%)
INL (LSB)
0.6
0.3
0
−0.3
28.49
25
20
18.26
15
12.23
−0.6
10
−0.9
4.52
5
−1.2
2.46
0.47
0.01 0.23
−1.5
0
4000
8000
12000
Output Code (LSB)
Figure 58.
Copyright © 2011, Texas Instruments Incorporated
16000
0
8212 8213 8214 8215 8216 8217 8218 8219 8220 8221
Output Code (LSB)
Figure 59.
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51
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4242
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR 20MHz INPUT SIGNAL
FFT FOR 170MHz INPUT SIGNAL
0
0
SFDR = 91.6dBc
SINAD = 73.2dBFS
SNR = 73.3dBFS
THD = 88.9dBc
−20
−20
−40
Amplitude (dB)
Amplitude (dB)
−40
−60
−60
−80
−80
−100
−100
−120
SFDR = 88.6dBc
SINAD = 71.2dBFS
SNR = 71.4dBFS
THD = 84.2dBc
0
5
10
15
20
Frequency (MHz)
25
−120
30 32.5
0
5
10
Figure 60.
FFT FOR 300MHz INPUT SIGNAL
FFT FOR TWO-TONE INPUT SIGNAL
SFDR = 76.7dBc
SINAD = 68.8dBFS
SNR = 69.4dBFS
THD = 76.3dBc
Each Tone at
−7dBFS Amplitude
fIN1 =185MHz
fIN2 =190MHz
Two−Tone IMD = 92.2dBFS
SFDR = 93.4dBFS
−20
−40
Amplitude (dB)
−40
Amplitude (dB)
30 32.5
0
−20
−60
−60
−80
−80
−100
−100
0
5
10
15
20
Frequency (MHz)
Figure 62.
52
25
Figure 61.
0
−120
15
20
Frequency (MHz)
Submit Documentation Feedback
25
30 32.5
−120
0
5
10
15
20
Frequency (MHz)
25
30 32.5
Figure 63.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4242 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR TWO-TONE INPUT SIGNAL
SFDR vs INPUT FREQUENCY
0
95
Each Tone at
−7dBFS Amplitude
fIN1 =46MHz
fIN2 =50MHz
Two−Tone IMD = 98dBFS
SFDR = 102.7dBFS
−20
90
85
SFDR (dBc)
Amplitude (dB)
−40
−60
80
−80
75
−100
70
Gain = 0dB
Gain = 6dB
0
5
10
15
20
Frequency (MHz)
25
65
30 32.5
200
250
300
350
400
SNR vs INPUT FREQUENCY (CMOS)
73
72
72
71
71
70
70
69
68
66
66
65
65
64
Gain = 0dB
Gain = 6dB
150
200
250
300
350
Input Frequency (MHz)
Figure 66.
Copyright © 2011, Texas Instruments Incorporated
500
450
500
68
67
100
450
69
67
50
150
SNR vs INPUT FREQUENCY
73
0
100
Figure 65.
74
63
50
Figure 64.
74
64
0
Input Frequency (MHz)
SNR (dBFS)
SNR (dBFS)
−120
400
450
500
63
Gain = 0dB
Gain = 6dB
0
50
100
150
200
250
300
350
400
Input Frequency (MHz)
Figure 67.
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53
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4242 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
SFDR vs GAIN AND INPUT FREQUENCY
SINAD vs GAIN AND INPUT FREQUENCY
94
72
92
71
90
88
70
86
SINAD (dBFS)
SFDR (dBc)
84
82
80
78
76
69
68
67
74
66
72
150MHz
170MHz
220MHz
68
66
0
0.5
1
1.5
300MHz
400MHz
470MHz
2
150MHz
170MHz
220MHz
65
2.5 3 3.5 4
Digital Gain (dB)
4.5
5
5.5
64
6
0
0.5
1
1.5
2.5 3 3.5 4
Digital Gain (dB)
4.5
5
Figure 69.
PERFORMANCE vs INPUT AMPLITUDE
PERFORMANCE vs INPUT AMPLITUDE
77
5.5
Input Frequency = 150MHz
110
76.5
110
78
100
76
100
77
90
76
80
75
70
74
60
73
72
80
75
70
74.5
60
74
50
73.5
50
73
40
40
SFDR(dBc)
SFDR(dBFS)
SNR
20
−70
−60
−50
−40
−30
Amplitude (dBFS)
Figure 70.
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−20
−10
0
SFDR(dBc,dBFS)
75.5
SNR (dBFS)
90
30
6
79
120
Input Frequency = 40MHz
SFDR(dBc,dBFS)
2
Figure 68.
120
54
300MHz
400MHz
470MHz
72.5
30
72
20
−70
SNR (dBFS)
70
71
SFDR(dBc)
SFDR(dBFS)
SNR
−60
−50
−40
−30
Amplitude (dBFS)
−20
−10
70
0
69
Figure 71.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4242 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
74.2
72
85
Input Frequency = 40MHz
71.9
74
83
71.8
89.5
73.9
82
71.7
89
73.8
81
71.6
88.5
73.7
80
71.5
88
73.6
79
71.4
87.5
73.5
78
71.3
87
73.4
77
71.2
73.3
76
90
86.5
SFDR
SNR
86
0.8
0.85
SFDR (dBc)
84
SNR (dBFS)
74.1
90.5
SFDR (dBc)
Input Frequency = 150MHz
73.2
1.1
0.9
0.95
1
1.05
Input CommonMode Voltage (V)
SFDR
SNR
75
0.8
0.85
71.1
71
1.1
0.9
0.95
1
1.05
Input CommonMode Voltage (V)
Figure 72.
Figure 73.
SFDR vs TEMPERATURE AND AVDD SUPPLY
SNR vs TEMPERATURE AND AVDD SUPPLY
88
SNR (dBFS)
91
72
Input Frequency = 150MHz
Input Frequency = 150MHz
86
71.5
SNR (dBFS)
SFDR (dBc)
84
82
71
70.5
80
78
76
−40
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
AVDD = 1.85
AVDD = 1.90
AVDD = 1.95
−15
70
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
10
35
Temperature (°C)
Figure 74.
Copyright © 2011, Texas Instruments Incorporated
60
85
69.5
−40
−15
AVDD = 1.85
AVDD = 1.90
AVDD = 1.95
10
35
Temperature (°C)
60
85
Figure 75.
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ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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TYPICAL CHARACTERISTICS: ADS4242 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs DRVDD SUPPLY VOLTAGE
PERFORMANCE vs INPUT CLOCK AMPLITUDE
75
87
77
92
Input Frequency = 150MHz
72
83
71
82
70
81
1.65
1.7
1.75
1.8
1.85
DRVDD Supply (V)
69
1.95
1.9
75
89
74
88
73
87
72
86
71
85
70
SFDR
SNR
83
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
69
68
2.2
Differential Clock Amplitude (VPP)
Figure 76.
Figure 77.
PERFORMANCE vs INPUT CLOCK AMPLITUDE
PERFORMANCE ACROSS INPUT CLOCK DUTY CYCLE
75
73
82
72
80
71
78
70
76
69
74
68
72
67
70
66
68
65
64
SFDR
SNR
64
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Differential Clock Amplitude (VPP)
Figure 78.
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2
Input Frequency = 10MHz
90
74.5
89
74
88
73.5
87
73
72.5
86
SNR
THD
63
62
2.2
SNR (dBFS)
84
66
75
91
74
THD (dBc)
Input Frequency = 150MHz
86
SNR (dBFS)
88
SFDR (dBc)
90
84
SFDR
SNR
56
76
SNR (dBFS)
84
SFDR (dBc)
73
SNR (dBFS)
85
62
0.2
91
74
86
SFDR (dBc)
Input Frequency = 40MHz
85
30
35
40
45
50
55
60
Input Clock Duty Cycle (%)
65
70
72
Figure 79.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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TYPICAL CHARACTERISTICS: ADS4242 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
OUTPUT NOISE HISTOGRAM
(WITH INPUTS SHORTED TO VCM)
INTEGRATED NONLINEARITY
1.5
40
1.2
35
RMS Noise = 1.1LSB
33.31
0.9
30
Code Occurrence (%)
INL (LSB)
0.6
0.3
0
−0.3
28.49
25
20
18.26
15
12.23
−0.6
10
−0.9
4.52
5
−1.2
0.23
0.47
0.01
−1.5
0
4000
8000
Output Code (LSB)
Figure 80.
Copyright © 2011, Texas Instruments Incorporated
12000
16000
0
8212 8213 8214 8215 8216 8217 8218 8219 8220 8221
Output Code (LSB)
Figure 81.
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ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4226
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR 20MHz INPUT SIGNAL
FFT FOR 170MHz INPUT SIGNAL
0
0
SFDR = 89.7dBc
SINAD = 70.5dBFS
SNR = 70.6dBFS
THD = 80.0dBc
−20
−20
−40
Amplitude (dB)
Amplitude (dB)
−40
−60
−60
−80
−80
−100
−100
−120
SFDR = 90.1dBc
SINAD = 69.5dBFS
SNR = 69.6dBFS
THD = 88.1dBc
0
10
20
30
40
50
Frequency (MHz)
60
70
−120
80
0
10
20
Figure 82.
FFT FOR 300MHz INPUT SIGNAL
80
FFT FOR TWO-TONE INPUT SIGNAL
SFDR = 76.2dBc
SINAD = 67.3dBFS
SNR = 67.9dBFS
THD = 74.4dBc
Each Tone at
−7dBFS Amplitude
fIN1 = 185.1MHz
fIN2 = 190.1MHz
Two−Tone IMD = 86.5dBFS
SFDR = 92.1dBFS
−20
−40
Amplitude (dB)
−40
Amplitude (dB)
70
0
−20
−60
−60
−80
−80
−100
−100
0
10
20
30
40
50
Frequency (MHz)
Figure 84.
58
60
Figure 83.
0
−120
30
40
50
Frequency (MHz)
Submit Documentation Feedback
60
70
80
−120
0
10
20
30
40
50
Frequency (MHz)
60
70
80
Figure 85.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4226 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR TWO-TONE INPUT SIGNAL
SFDR vs INPUT FREQUENCY
0
90
Each Tone at
−7dBFS Amplitude
fIN1 = 46.1MHz
fIN2 = 50.1MHz
Two−Tone IMD = 98.2dBFS
SFDR = 101.7dBFS
−20
85
SFDR (dBc)
Amplitude (dB)
−40
−60
80
75
−80
70
−100
Gain = 0dB
Gain = 6dB
0
10
20
30
40
50
Frequency (MHz)
60
70
65
80
200
250
300
350
400
SNR vs INPUT FREQUENCY (CMOS)
71
70
70
69
69
68
67
65
65
64
Gain = 0dB
Gain = 6dB
150
200
250
300
350
Input Frequency (MHz)
Figure 88.
Copyright © 2011, Texas Instruments Incorporated
500
450
500
67
66
100
450
68
66
50
150
SNR vs INPUT FREQUENCY
71
0
100
Figure 87.
72
63
50
Figure 86.
72
64
0
Input Frequency (MHz)
SNR (dBFS)
SNR (dBFS)
−120
400
450
500
63
Gain = 0dB
Gain = 6dB
0
50
100
150
200
250
300
350
400
Input Frequency (MHz)
Figure 89.
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ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4226 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
SFDR vs GAIN AND INPUT FREQUENCY
SINAD vs GAIN AND INPUT FREQUENCY
90
70
69
86
68
SINAD (dBFS)
SFDR (dBc)
82
78
67
66
65
74
64
66
150MHz
170MHz
220MHz
0
0.5
1
1.5
2
2.5 3 3.5 4
Digital Gain (dB)
300MHz
400MHz
470MHz
4.5
5
5.5
150MHz
170MHz
220MHz
63
62
6
0
0.5
1
1.5
4.5
5
PERFORMANCE vs INPUT AMPLITUDE
PERFORMANCE vs INPUT AMPLITUDE
73
80
71.5
70
71
60
70.5
70
50
SFDR(dBc)
SFDR(dBFS)
SNR
−50
−40
−30
Amplitude (dBFS)
Figure 92.
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−20
−10
0
SFDR(dBc,dBFS)
72
72.5
100
SNR (dBFS)
90
−60
6
Input Frequency = 150MHz
72.5
40
5.5
110
73
100
SFDR(dBc,dBFS)
2.5 3 3.5 4
Digital Gain (dB)
Figure 91.
Input Frequency = 40MHz
60
2
Figure 90.
110
30
−70
300MHz
400MHz
470MHz
90
72
80
71.5
70
71
60
70.5
50
70
40
69.5
69.5
30
69
20
−70
SFDR(dBc)
SFDR(dBFS)
SNR
−60
−50
−40
−30
Amplitude (dBFS)
−20
−10
SNR (dBFS)
70
69
0
68.5
Figure 93.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4226 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
73
72
84
Input Frequency = 150MHz
72.5
83
71.5
86
72
82
71
85
71.5
81
70.5
84
71
80
70
83
70.5
79
69.5
82
70
78
69
69.5
77
81
SFDR (dBc)
87
SNR (dBFS)
SFDR (dBc)
Input Frequency = 40MHz
68.5
SFDR
SNR
80
0.8
0.85
SFDR
SNR
69
1.1
0.9
0.95
1
1.05
Input CommonMode Voltage (V)
76
0.8
0.85
Figure 95.
SFDR vs TEMPERATURE AND AVDD SUPPLY
SNR vs TEMPERATURE AND AVDD SUPPLY
91
70
Input Frequency = 150MHz
Input Frequency = 150MHz
89
69.8
87
69.6
85
69.4
83
69.2
SNR (dBFS)
SFDR (dBc)
68
1.1
0.9
0.95
1
1.05
Input CommonMode Voltage (V)
Figure 94.
81
79
69
68.8
77
68.6
75
68.4
73
71
−40
SNR (dBFS)
88
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
−15
AVDD = 1.85
AVDD = 1.90
AVDD = 1.95
10
35
Temperature (°C)
Figure 96.
Copyright © 2011, Texas Instruments Incorporated
68.2
60
85
68
−40
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
AVDD = 1.85
AVDD = 1.90
AVDD = 1.95
−15
10
35
Temperature (°C)
60
85
Figure 97.
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61
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4226 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs DRVDD SUPPLY VOLTAGE
PERFORMANCE vs INPUT CLOCK AMPLITUDE
71.5
72
88
Input Frequency = 40MHz
71
87
71.5
85
70.5
86
71
84
70
85
70.5
83
69.5
84
70
69
83
82
SFDR (dBc)
86
SNR (dBFS)
69.5
SFDR
SNR
81
1.65
1.7
1.75
1.8
1.85
DRVDD Supply (V)
SFDR
SNR
68.5
1.95
1.9
82
0.2
0.4
0.6
1.4
1.6
1.8
2
69
2.2
Figure 99.
PERFORMANCE vs INPUT CLOCK AMPLITUDE
PERFORMANCE vs INPUT CLOCK DUTY CYCLE
71.5
73
88
84
71
83
70.5
82
70
81
69.5
80
69
79
68.5
78
68
77
67.5
76
SFDR
SNR
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Differential Clock Amplitude (VPP)
Figure 100.
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2
67
66.5
2.2
THD (dBc)
Input Frequency = 10MHz
SNR (dBFS)
SFDR (dBc)
1.2
Figure 98.
Input Frequency = 150MHz
62
1
Differential Clock Amplitude (VPP)
85
75
0.2
0.8
88
72.5
87
72
86
71.5
86
71
86
70.5
85
70
SNR (dBFS)
SFDR (dBc)
Input Frequency = 150MHz
SNR (dBFS)
87
69.5
84
SNR
THD
84
25
30
35
40
45
50
55
60
Input Clock Duty Cycle (%)
65
70
75
69
Figure 101.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4225
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR 20MHz INPUT SIGNAL
FFT FOR 170MHz INPUT SIGNAL
0
0
SFDR = 89.7dBc
SINAD = 70.6dBFS
SNR = 72.6dBFS
THD = 89.2dBc
−20
−20
−40
Amplitude (dB)
Amplitude (dB)
−40
−60
−60
−80
−80
−100
−100
−120
SFDR = 86.8dBc
SINAD = 69.5dBFS
SNR = 69.6dBFS
THD = 83.7dBc
0
10
20
30
40
Frequency (MHz)
50
−120
60
0
10
20
Figure 102.
FFT FOR 300MHz INPUT SIGNAL
60
FFT FOR TWO-TONE INPUT SIGNAL
0
SFDR = 73.5dBc
SINAD = 66.9dBFS
SNR = 67.9dBFS
THD = 72.7dBc
−20
Each Tone at
−7dBFS Amplitude
fIN1 = 185.1MHz
fIN2 = 190.1MHz
Two−Tone IMD = 93.4dBFS
SFDR = 91.1dBFS
−20
−40
Amplitude (dB)
−40
Amplitude (dB)
50
Figure 103.
0
−60
−60
−80
−80
−100
−100
−120
30
40
Frequency (MHz)
0
10
20
30
40
Frequency (MHz)
Figure 104.
Copyright © 2011, Texas Instruments Incorporated
50
60
−120
0
10
20
30
40
Frequency (MHz)
50
60
Figure 105.
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63
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4225 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR TWO-TONE INPUT SIGNAL
SFDR vs INPUT FREQUENCY
0
90
Each Tone at
−7dBFS Amplitude
fIN1 = 46.1MHz
fIN2 = 50.1MHz
Two−Tone IMD = 96.2dBFS
SFDR = 101.9dBFS
−20
85
SFDR (dBc)
Amplitude (dB)
−40
−60
80
75
−80
70
−100
Gain = 0dB
Gain = 6dB
0
10
20
30
40
Frequency (MHz)
50
150
200
250
300
350
400
SNR vs INPUT FREQUENCY
SNR vs INPUT FREQUENCY (CMOS)
71
70
70
69
69
68
67
65
65
64
Gain = 0dB
Gain = 6dB
150
200
250
300
350
Input Frequency (MHz)
Figure 108.
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500
450
500
67
66
100
450
68
66
50
100
Figure 107.
71
0
50
Figure 106.
72
63
0
Input Frequency (MHz)
72
64
64
65
60
SNR (dBFS)
SNR (dBFS)
−120
400
450
500
63
Gain = 0dB
Gain = 6dB
0
50
100
150
200
250
300
350
400
Input Frequency (MHz)
Figure 109.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4225 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
SFDR vs GAIN AND INPUT FREQUENCY
SINAD vs GAIN AND INPUT FREQUENCY
71
94
92
70
90
88
86
68
SINAD (dBFS)
SFDR (dBc)
84
82
80
78
66
76
74
64
72
150MHz
170MHz
220MHz
68
66
0
0.5
1
1.5
2
2.5 3 3.5 4
Digital Gain (dB)
300MHz
400MHz
470MHz
4.5
5
5.5
150MHz
170MHz
220MHz
62
6
0
0.5
1
1.5
2
2.5 3 3.5 4
Digital Gain (dB)
4.5
5
Figure 110.
Figure 111.
PERFORMANCE vs INPUT AMPLITUDE
PERFORMANCE vs INPUT AMPLITUDE
74
120
5.5
Input Frequency = 150MHz
110
73.5
110
73
100
73
100
72.5
80
72
70
71.5
60
71
50
40
SFDR (dBc)
SFDR (dBFS)
SNR
20
−70
−60
−50
−40
−30
Amplitude (dBFS)
−20
Figure 112.
Copyright © 2011, Texas Instruments Incorporated
−10
0
90
72
80
71.5
70
71
60
70.5
70.5
50
70
70
40
SFDR(dBc,dBFS)
72.5
SNR (dBFS)
90
30
6
73.5
120
Input Frequency = 40MHz
SFDR (dBc, dBFS)
300MHz
400MHz
470MHz
69.5
30
69
20
−70
SNR (dBFS)
70
69.5
SFDR(dBc)
SFDR(dBFS)
SNR
−60
−50
−40
−30
Amplitude (dBFS)
−20
−10
69
0
68.5
Figure 113.
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65
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: ADS4225 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
72
72
89
Input Frequency = 150MHz
71.8
87
71.5
90
71.5
85
71
88
71.2
83
70.5
86
71
81
70
84
70.8
79
69.5
82
70.5
77
69
70.2
75
80
SFDR (dBc)
92
SNR (dBFS)
SFDR (dBc)
Input Frequency = 40MHz
68.5
SFDR
SNR
78
0.8
0.85
0.9
0.95
1
Input CommonMode (V)
SFDR
SNR
70
1.1
1.05
SNR (dBFS)
94
73
0.8
0.85
68
1.1
0.9
0.95
1
1.05
Input CommonMode Voltage (V)
Figure 114.
Figure 115.
SFDR vs TEMPERATURE AND AVDD SUPPLY
SNR vs TEMPERATURE AND AVDD SUPPLY
70.5
90
Input Frequency = 150MHz
Input Frequency = 150MHz
88
70.2
86
70
69.8
82
SNR (dBFS)
SFDR (dBc)
84
80
78
69.5
69.2
76
69
74
72
70
−40
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
−15
AVDD = 1.85
AVDD = 1.90
AVDD = 1.95
10
35
Temperature (°C)
Figure 116.
66
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68.8
60
85
68.5
−40
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
AVDD = 1.85
AVDD = 1.90
AVDD = 1.95
−15
10
35
Temperature (°C)
60
85
Figure 117.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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TYPICAL CHARACTERISTICS: ADS4225 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs DRVDD SUPPLY VOLTAGE
PERFORMANCE vs INPUT CLOCK AMPLITUDE
72
72
90
Input Frequency = 40MHz
71.5
89
71.5
86
71
88
71
85
70.5
87
70.5
84
70
86
70
69.5
85
83
SFDR (dBc)
87
SNR (dBFS)
69.5
SFDR
SNR
82
1.65
1.7
1.75
1.8
1.85
DRVDD Supply (V)
69
1.95
1.9
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
69
2.2
Figure 118.
Figure 119.
PERFORMANCE vs INPUT CLOCK AMPLITUDE
PERFORMANCE vs INPUT CLOCK DUTY CYCLE
72
71
86
70.5
84
70
82
69.5
80
69
78
68.5
76
68
74
67.5
72
67
70
66.5
68
66
66
65.5
65
SFDR
SNR
62
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Differential Clock Amplitude (VPP)
Figure 120.
Copyright © 2011, Texas Instruments Incorporated
2
Input Frequency = 10MHz
THD (dBc)
88
64
73
90
71.5
SNR (dBFS)
Input Frequency = 40MHz
90
60
0.2
84
0.2
Differential Clock Amplitude (VPP)
92
SFDR (dBc)
SFDR
SNR
89
72.5
88
72
87
71.5
86
71
85
70.5
84
70
69.5
83
THD
SNR
64.5
64
2.2
SNR (dBFS)
SFDR (dBc)
Input Frequency = 150MHz
SNR (dBFS)
88
82
30
35
40
45
50
55
60
Input Clock Duty Cycle (%)
65
70
69
Figure 121.
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67
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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TYPICAL CHARACTERISTICS: ADS4222
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR 20MHz INPUT SIGNAL
FFT FOR 170MHz INPUT SIGNAL
0
0
SFDR = 90.9dBc
SINAD = 70.8dBFS
SNR = 70.9dBFS
THD = 88.1dBc
−20
−20
−40
Amplitude (dB)
Amplitude (dB)
−40
−60
−60
−80
−80
−100
−100
−120
SFDR = 88.2dBc
SINAD = 69.5dBFS
SNR = 69.7dBFS
THD = 84.9dBc
0
5
10
15
20
Frequency (MHz)
25
−120
30 32.5
0
5
10
Figure 122.
FFT FOR 300MHz INPUT SIGNAL
FFT FOR TWO-TONE INPUT SIGNAL
SFDR = 88.8dBc
SINAD = 72.6dBFS
SNR = 72.6dBFS
THD = 89.2dBc
Each Tone at
−7dBFS Amplitude
fIN1 = 185.1MHz
fIN2 = 190.1MHz
Two−Tone IMD = 91.6dBFS
SFDR = 94.9dBFS
−20
−40
Amplitude (dB)
−40
Amplitude (dB)
30 32.5
0
−20
−60
−60
−80
−80
−100
−100
0
5
10
15
20
Frequency (MHz)
Figure 124.
68
25
Figure 123.
0
−120
15
20
Frequency (MHz)
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25
30 32.5
−120
0
5
10
15
20
Frequency (MHz)
25
30 32.5
Figure 125.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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TYPICAL CHARACTERISTICS: ADS4222 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
FFT FOR TWO-TONE INPUT SIGNAL
SFDR vs INPUT FREQUENCY
0
95
Each Tone at
−7dBFS Amplitude
fIN1 = 46.1MHz
fIN2 = 50.1MHz
Two−Tone IMD =
98.9 dBFS
SFDR = 100.4 dBFS
−20
85
SFDR (dBc)
Amplitude (dB)
−40
90
−60
80
−80
75
−100
70
Gain = 0dB
Gain = 6dB
0
5
10
15
20
Frequency (MHz)
25
65
30 32
200
250
300
350
400
SNR vs INPUT FREQUENCY (CMOS)
71
70
70
69
69
68
67
65
65
64
Gain = 0dB
Gain = 6dB
150
200
250
300
350
Input Frequency (MHz)
Figure 128.
Copyright © 2011, Texas Instruments Incorporated
500
450
500
67
66
100
450
68
66
50
150
SNR vs INPUT FREQUENCY
71
0
100
Figure 127.
72
63
50
Figure 126.
72
64
0
Input Frequency (MHz)
SNR (dBFS)
SNR (dBFS)
−120
400
450
500
63
Gain = 0dB
Gain = 6dB
0
50
100
150
200
250
300
350
400
Input Frequency (MHz)
Figure 129.
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69
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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TYPICAL CHARACTERISTICS: ADS4222 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
SFDR vs GAIN AND INPUT FREQUENCY
SINAD vs GAIN AND INPUT FREQUENCY
94
71
150MHz
170MHz
220MHz
92
70
90
300MHz
400MHz
470MHz
88
69
86
SINAD (dBFS)
SFDR (dBc)
84
82
80
78
76
68
67
66
74
65
72
70
150MHz
170MHz
220MHz
68
66
0
0.5
1
1.5
300MHz
400MHz
470MHz
2
64
Input Frequency = 150MHz
2.5 3 3.5 4
Digital Gain (dB)
4.5
5
5.5
63
6
0
0.5
1
1.5
2
2.5 3 3.5 4
Digital Gain (dB)
4.5
5
Figure 130.
Figure 131.
PERFORMANCE vs INPUT AMPLITUDE
PERFORMANCE vs INPUT AMPLITUDE
73.5
120
5.5
6
73.5
120
Input Frequency = 40MHz
Input Frequency = 150MHz
110
73
100
110
73
100
72.5
71.5
70
60
71
50
SFDR(dBc,dBFS)
72
80
SNR (dBFS)
SFDR (dBc, dBFS)
90
90
72
80
71.5
70
71
60
70.5
50
70
SNR (dBFS)
72.5
70.5
40
30
20
−70
−60
−50
−40
−30
Amplitude (dBFS)
Figure 132.
70
69.5
40
SFDR(dBc)
SFDR(dBFS)
SNR
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−20
−10
70
0
69.5
SFDR(dBc)
SFDR(dBFS)
SNR
30
20
−70
−60
−50
−40
−30
Amplitude (dBFS)
−20
−10
69
0
68.5
Figure 133.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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TYPICAL CHARACTERISTICS: ADS4222 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
PERFORMANCE vs INPUT COMMON-MODE VOLTAGE
72
70.8
85
Input Frequency = 150MHz
71.8
84
70.6
90
71.6
83
70.4
89
71.4
82
70.2
88
71.2
81
70
87
71
80
69.8
86
70.8
79
69.6
85
70.6
78
69.4
84
70.4
77
69.2
70.2
76
83
SFDR
SNR
82
0.8
0.85
SFDR (dBc)
91
SNR (dB)
SFDR (dBc)
Input Frequency = 40MHz
70
1.1
0.9
0.95
1
1.05
Input Common−Mode Voltage (V)
SFDR
SNR
75
0.8
0.85
69
68.8
1.1
0.9
0.95
1
1.05
Input Common−Mode Voltage (V)
Figure 134.
Figure 135.
SFDR vs TEMPERATURE AND AVDD SUPPLY
SNR vs TEMPERATURE AND AVDD SUPPLY
88
SNR (dBFS)
92
70
Input Frequency = 150MHz
Input Frequency = 150MHz
87
86
69.8
85
SNR (dBFS)
SFDR (dBc)
84
83
82
69.5
69.2
81
80
79
78
77
−40
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
AVDD = 1.85
AVDD = 1.90
AVDD = 1.95
−15
69
10
35
Temperature (°C)
Figure 136.
Copyright © 2011, Texas Instruments Incorporated
60
85
68.8
−40
AVDD = 1.7
AVDD = 1.75
AVDD = 1.80
AVDD = 1.85
AVDD = 1.90
AVDD = 1.95
−15
10
35
Temperature (°C)
60
85
Figure 137.
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71
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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TYPICAL CHARACTERISTICS: ADS4222 (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
PERFORMANCE vs DRVDD SUPPLY VOLTAGE
PERFORMANCE vs INPUT CLOCK AMPLITUDE
71
72.5
92
Input Frequency = 150MHz
69.5
84
SFDR (dBc)
70
85
SNR (dBFS)
70.5
86
69
83
1.70
1.75
1.80
1.85
DRVDD Supply (V)
68.5
1.95
1.90
72
90
71.5
89
71
88
70.5
87
70
86
69.5
85
69
84
68.5
83
SFDR
SNR
82
1.65
91
SFDR
SNR
82
0.2
0.4
0.6
0.8
1.4
1.6
1.8
2
67.5
2.2
Figure 138.
Figure 139.
PERFORMANCE vs INPUT CLOCK AMPLITUDE
PERFORMANCE vs INPUT CLOCK DUTY CYCLE
71
72
94
Input Frequency = 150MHz
Input Frequency = 10MHz
70
93
71.5
87
69
92
71
84
68
91
70.5
81
67
90
70
78
66
89
69.5
75
65
88
69
72
64
69
63
87
68.5
66
62
86
68
61
85
60
2.2
84
63
60
0.2
SFDR
SNR
0.4
0.6
0.8
1
1.2
1.4
1.6
Differential Clock Amplitude (VPP)
Figure 140.
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1.8
2
THD (dBc)
90
SNR (dBFS)
SFDR (dBc)
1.2
Differential Clock Amplitude (VPP)
93
72
1
68
SNR
THD
30
35
40
45
50
55
60
Input Clock Duty Cycle (%)
65
70
SNR (dBFS)
SFDR (dBc)
Input Frequency = 40MHz
SNR (dBFS)
87
67.5
67
Figure 141.
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: General
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
CMRR vs TEST SIGNAL FREQUENCY
PSRR vs TEST SIGNAL FREQUENCY
0
0
Input Frequency = 40MHz
50mVPP Signal Superimposed
on Input Common−Mode Voltage 0.95V
−5
Input Frequency = 10MHz
50mVPP Signal Superimposed on AVDD Supply
−5
−10
−10
−15
−15
−25
PSRR (dB)
CMRR (dB)
−20
−30
−35
−40
−20
−25
−30
−35
−45
−40
−50
−45
−55
−60
0
50
100
150
200
250
Frequency of Input Common−Mode Signal (MHz)
−50
300
0
50
100
150
200
250
Frequency of Signal on Supply (MHz)
Figure 142.
300
Figure 143.
ANALOG POWER vs SAMPLING FREQUENCY
DIGITAL POWER LVDS CMOS
240
240
fIN = 2.5 MHz
AVDD = 1.8V
Input Frequency = 2.5MHz
220
220
200
180
180
DRVDD Power (mW)
Analog Power (mW)
200
160
140
120
160
140
120
100
80
60
100
40
80
60
LVDS, 350mV Swing
CMOS
20
0
20
40
60
80
100
120
Sampling Speed (MSPS)
Figure 144.
Copyright © 2011, Texas Instruments Incorporated
140
160
0
0
20
40
60
80
100
120
Sampling Speed (MSPS)
140
160
Figure 145.
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73
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: General (continued)
At TA = +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential
clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB gain, DDR
LVDS output interface, and 32k point FFT, unless otherwise noted.
DIGITAL POWER IN VARIOUS MODES (LVDS)
260
Default
EN Digital = 1
EN Digital = 1, Offset Correction Enabled
240
DRVDD Power (mW)
220
200
180
160
140
120
100
80
0
20
40
60
80
100
120
Sampling Speed (MSPS)
140
160
Figure 146.
74
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ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS: Contour
All graphs are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock. 1.5VPP
differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB
gain, DDR LVDS output interface, and 32k point FFT, unless otherwise noted.
SPURIOUS-FREE DYNAMIC RANGE (0dB Gain)
160
79
83
150
73
87
140
Sampling Frequency (MSPS)
76
83
87
130
87
79
120
76
110
87
73
87
100
79
90
83
76
80
70
65
83
91
10
50
100
150
73
83
87
200
250
300
350
73
400
450
Input Frequency (MHz)
75
70
80
85
90
SFDR (dBc)
Figure 147.
SPURIOUS-FREE DYNAMIC RANGE (6dB Gain)
160
77
79
150
83
83
86
Sampling Frequency (MSPS)
140
83
86
86
81
79
130
83
120
83
86
110
81
79
83
89
100
79
89
90
79
81
80
89
70
65
83
86
79
79
92
10
50
100
150
200
250
300
350
400
450
Input Frequency (MHz)
78
80
82
84
86
88
90
92
SFDR (dBc)
Figure 148.
Copyright © 2011, Texas Instruments Incorporated
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ADS4222, ADS4225, ADS4226
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SBAS533C – MARCH 2011 – REVISED JUNE 2011
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TYPICAL CHARACTERISTICS: Contour (continued)
All graphs are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock. 1.5VPP
differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB
gain, DDR LVDS output interface, and 32k point FFT, unless otherwise noted.
ADS424x SIGNAL-TO-NOISE RATIO (0dB Gain)
160
150
73
71
72
70
69
Sampling Frequency (MSPS)
140
67
68
130
120
73
71
72
68
70
110
69
67
100
71
90
72
73
68
70
80
67
69
70
65
10
50
100
150
200
250
300
350
400
450
Input Frequency (MHz)
69
68
67
70
72
71
73
SNR (dBFS)
Figure 149.
ADS424x SIGNAL-TO-NOISE RATIO (6dB Gain)
160
67
64.5
150
66.5
66.75
67
66.25
65
65.5
66
Sampling Frequency (MSPS)
140
67.25
67
130
66.75
120
66
66.5
110
67.25
67.5
100
65.5
66.25
65
67
66.75
90
80
67.25
67.5
70
65
10
50
100
66.5
66.25
66
65.5
65
67
150
200
250
300
350
400
64.5
450
Input Frequency (MHz)
64.5
65
65.5
66
66.5
67
67.5
SNR (dBFS)
Figure 150.
76
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Product Folder Link(s): ADS4222 ADS4225 ADS4226 ADS4242 ADS4245 ADS4246
ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
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TYPICAL CHARACTERISTICS: Contour (continued)
All graphs are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock. 1.5VPP
differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, High-Performance Mode disabled, 0dB
gain, DDR LVDS output interface, and 32k point FFT, unless otherwise noted.
ADS422x SIGNAL-TO-NOISE RATIO (0dB Gain)
160
70
70.5
150
69
69.5
67.5
68
68.5
67
66.5
Sampling Frequency (MSPS)
140
130
120
69.5
70
70.5
69
68
68.5
67
67.5
66
66.5
110
100
90
67
69.5
80
69
70
70.5
68.5
66.5
67.5
68
66
69
70
65
10
50
100
150
200
250
300
350
400
450
Input Frequency (MHz)
67
66.5
66
67.5
68.5
68
69
69.5
70
70.5
SNR (dBFS)
Figure 151.
ADS422x SIGNAL-TO-NOISE RATIO (6dB Gain)
160
65.75
150
66
66.25
65.75
Sampling Frequency (MSPS)
140
66.25
66.5
130
65.5
64.5
65
66
120
110
65.75
66.5
65.5
65
100
64.5
66
90
66.25
80
65.5
66.75
65
65.75
66.5
64.5
70
65
10
50
100
150
200
250
300
350
400
450
Input Frequency (MHz)
64
64.5
65
65.5
66
66.5
SNR (dBFS)
Figure 152.
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APPLICATION INFORMATION
THEORY OF OPERATION
The ADS424x/422x belong to TI's ultralow-power family of dual-channel 12-bit and 14-bit analog-to-digital
converters (ADCs). At every rising edge of the input clock, the analog input signal of each channel is
simultaneously sampled. The sampled signal in each channel is converted by a pipeline of low-resolution stages.
In each stage, the sampled/held signal is converted by a high-speed, low-resolution, flash sub-ADC. The
difference between the stage input and the quantized equivalent is gained and propagates to the next stage. At
every clock, each succeeding stage resolves the sampled input with greater accuracy. The digital outputs from all
stages are combined in a digital correction logic block and digitally processed to create the final code after a data
latency of 16 clock cycles. The digital output is available as either DDR LVDS or parallel CMOS and coded in
either straight offset binary or binary twos complement format. The dynamic offset of the first stage sub-ADC
limits the maximum analog input frequency to approximately 400MHz (with 2VPP amplitude) or approximately
600MHz (with 1VPP amplitude).
ANALOG INPUT
The analog input consists of a switched-capacitor based, differential sample-and-hold (S/H) architecture. This
differential topology results in very good ac performance even for high input frequencies at high sampling rates.
The INP and INM pins must be externally biased around a common-mode voltage of 0.95V, available on the
VCM pin. For a full-scale differential input, each input pin (INP and INM) must swing symmetrically between
VCM + 0.5V and VCM – 0.5V, resulting in a 2VPP differential input swing. The input sampling circuit has a high
3dB bandwidth that extends up to 550MHz (measured from the input pins to the sampled voltage). Figure 153
shows an equivalent circuit for the analog input.
Sampling
Switch
LPKG
2nH
INP
10W
CBOND
1pF
100W
RESR
200W
INM
10W
CBOND
1pF
RESR
200W
CPAR2
1pF
RON
15W
CSAMP
2pF
3pF
3pF
LPKG
2nH
Sampling
Capacitor
RCR Filter
CPAR1
0.5pF
RON
10W
100W
RON
15W
CPAR2
1pF
CSAMP
2pF
Sampling
Capacitor
Sampling
Switch
Figure 153. Analog Input Equivalent Circuit
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Drive Circuit Requirements
For optimum performance, the analog inputs must be driven differentially. This operation improves the
common-mode noise immunity and even-order harmonic rejection. A 5Ω to 15Ω resistor in series with each input
pin is recommended to damp out ringing caused by package parasitics.
SFDR performance can be limited as a result of several reasons, including the effects of sampling glitches;
nonlinearity of the sampling circuit; and nonlinearity of the quantizer that follows the sampling circuit. Depending
on the input frequency, sample rate, and input amplitude, one of these factors plays a dominant part in limiting
performance. At very high input frequencies (greater than approximately 300MHz), SFDR is determined largely
by the device sampling circuit nonlinearity. At low input amplitudes, the quantizer nonlinearity usually limits
performance.
Glitches are caused by the opening and closing of the sampling switches. The driving circuit should present a
low source impedance to absorb these glitches. Otherwise, glitches could limit performance, primarily at low
input frequencies (up to approximately 200MHz). It is also necessary to present low impedance (less than 50Ω)
for the common-mode switching currents. This configuration can be achieved by using two resistors from each
input terminated to the common-mode voltage (VCM).
The device includes an internal R-C filter from each input to ground. The purpose of this filter is to absorb the
sampling glitches inside the device itself. The cutoff frequency of the R-C filter involves a trade-off. A lower cutoff
frequency (larger C) absorbs glitches better, but it reduces the input bandwidth. On the other hand, with a higher
cutoff frequency (smaller C), bandwidth support is maximized. However, the sampling glitches now must be
supplied by the external drive circuit. This tradeoff has limitations as a result of the presence of the package
bond-wire inductance.
In the ADS424x/422x, the R-C component values have been optimized while supporting high input bandwidth (up
to 550MHz). However, in applications with input frequencies up to 200MHz to 300MHz, the filtering of the glitches
can be improved further using an external R-C-R filter; see Figure 156 and Figure 157.
In addition, the drive circuit may have to be designed to provide a low insertion loss over the desired frequency
range and matched impedance to the source. Furthermore, the ADC input impedance must be considered.
Figure 154 and Figure 155 show the impedance (ZIN = RIN || CIN) looking into the ADC input pins.
5
Differential Input Capacitance (pF)
Differential Input Resistance (kW)
100
10
1
0.1
0.01
4.5
4
3.5
3
2.5
2
1.5
1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Input Frequency (GHz)
Figure 154. ADC Analog Input Resistance (RIN)
Across Frequency
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1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Input Frequency (GHz)
Figure 155. ADC Analog Input Capacitance (CIN)
Across Frequency
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Driving Circuit
Two example driving circuit configurations are shown in Figure 156 and Figure 157—one optimized for low
bandwidth (low input frequencies) and the other one for high bandwidth to support higher input frequencies. Note
that both of the drive circuits have been terminated by 50Ω near the ADC side. The termination is accomplished
by a 25Ω resistor from each input to the 1.5V common-mode (VCM) from the device. This architecture allows the
analog inputs to be biased around the required common-mode voltage.
The mismatch in the transformer parasitic capacitance (between the windings) results in degraded even-order
harmonic performance. Connecting two identical RF transformers back-to-back helps minimize this mismatch;
good performance is obtained for high-frequency input signals. An additional termination resistor pair may be
required between the two transformers, as shown in Figure 156, Figure 157, and Figure 158. The center point of
this termination is connected to ground to improve the balance between the P and M sides. The values of the
terminations between the transformers and on the secondary side must be chosen to obtain an effective 50Ω (in
the case of 50Ω source impedance).
0.1mF
T1
15W
INx_P
T2
0.1mF
0.1mF
25W
25W
3.3pF
25W
RIN
CIN
25W
INx_M
1:1
1:1
15W
0.1mF
VCM
ADS42xx
Figure 156. Drive Circuit with Low Bandwidth (for Low Input Frequencies Less Than 150MHz)
0.1mF
T1
5W
INx_P
T2
0.1mF
0.1mF
25W
50W
3.3pF
25W
RIN
CIN
50W
INx_M
1:1
1:1
5W
0.1mF
VCM
ADS42xx
Figure 157. Drive Circuit with High Bandwidth (for High Input Frequencies Greater Than 150MHz and
Less Than 270MHz)
0.1mF
T1
5W
T2
INx_P
0.1mF
0.1mF
25W
RIN
CIN
25W
INx_M
1:1
1:1
0.1mF
5W
VCM
ADS42xx
Figure 158. Drive Circuit with Very High Bandwidth (Greater than 270MHz)
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All of these examples show 1:1 transformers being used with a 50Ω source. As explained in the Drive Circuit
Requirements section, this configuration helps to present a low source impedance to absorb the sampling
glitches. With a 1:4 transformer, the source impedance is 200Ω. The higher source impedance is unable to
absorb the sampling glitches effectively and can lead to degradation in performance (compared to using 1:1
transformers).
In almost all cases, either a band-pass or low-pass filter is required to obtain the desired dynamic performance,
as shown in Figure 159. Such filters present low source impedance at the high frequencies corresponding to the
sampling glitch and help avoid the performance loss with the high source impedance.
5W
INx_P
T1
0.1mF
Differential
Input Signal
Band-Pass
or
Low-Pass
Filter
0.1mF
100W
RIN
CIN
100W
INx_M
1:4
5W
VCM
ADS42xx
Figure 159. Drive Circuit with a 1:4 Transformer
CLOCK INPUT
The ADS424x/422x clock inputs can be driven differentially (sine, LVPECL, or LVDS) or single-ended
(LVCMOS), with little or no difference in performance between them. The common-mode voltage of the clock
inputs is set to VCM using internal 5kΩ resistors. This setting allows the use of transformer-coupled drive circuits
for sine-wave clock or ac-coupling for LVPECL and LVDS clock sources are shown in Figure 160, Figure 161
and Figure 162. The internal clock buffer is shown in Figure 163.
(1) RT = termination resister, if necessary.
0.1mF
0.1mF
Zo
CLKP
Differential
Sine-Wave
Clock Input
CLKP
RT
Typical LVDS
Clock Input
0.1mF
100W
CLKM
ADS42xx
0.1mF
Zo
CLKM
Figure 160. Differential Sine-Wave Clock Driving
Circuit
Zo
ADS42xx
Figure 161. LVDS Clock Driving Circuit
0.1mF
CLKP
150W
Typical LVPECL
Clock Input
100W
Zo
0.1mF
CLKM
ADS42xx
150W
Figure 162. LVPECL Clock Driving Circuit
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Clock Buffer
LPKG
2nH
20W
CLKP
CBOND
1pF
RESR
100W
LPKG
2nH
5kW
CEQ
2pF
20W
CEQ
VCM
5kW
CLKM
CBOND
1pF
RESR
100W
NOTE: CEQ is 1pF to 3pF and is the equivalent input capacitance of the clock buffer.
Figure 163. Internal Clock Buffer
A single-ended CMOS clock can be ac-coupled to the CLKP input, with CLKM connected to ground with a 0.1μF
capacitor, as shown in Figure 164. For best performance, the clock inputs must be driven differentially, thereby
reducing susceptibility to common-mode noise. For high input frequency sampling, it is recommended to use a
clock source with very low jitter. Band-pass filtering of the clock source can help reduce the effects of jitter. There
is no change in performance with a non-50% duty cycle clock input.
CMOS
Clock Input
0.1mF
CLKP
VCM
0.1mF
CLKM
ADS42xx
Figure 164. Single-Ended Clock Driving Circuit
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DIGITAL FUNCTIONS
The device has several useful digital functions (such as test patterns, gain, and offset correction). These
functions require extra clock cycles for operation and increase the overall latency and power of the device. These
digital functions are disabled by default after reset and the raw ADC output is routed to the output data pins with
a latency of 16 clock cycles. Figure 165 shows more details of the processing after the ADC. In order to use any
of the digital functions, the EN DIGITAL bit must be set to '1'. After this, the respective register bits must be
programmed as described in the following sections and in the Serial Register Map section.
Output
Interface
12-/14-Bit
ADC
12-Bit (ADS422x)
14-Bit (ADS424x)
Digital Functions
(Gain, Offset Correction, Test Patterns)
DDR LVDS
or CMOS
EN DIGITAL Bit
Figure 165. Digital Processing Block
GAIN FOR SFDR/SNR TRADE-OFF
The ADS424x/422x include gain settings that can be used to get improved SFDR performance (compared to no
gain). The gain is programmable from 0dB to 6dB (in 0.5dB steps). For each gain setting, the analog input
full-scale range scales proportionally, as shown in Table 11.
The SFDR improvement is achieved at the expense of SNR; for each gain setting, the SNR degrades
approximately between 0.5dB and 1dB. The SNR degradation is reduced at high input frequencies. As a result,
the gain is very useful at high input frequencies because the SFDR improvement is significant with marginal
degradation in SNR. Therefore, the gain can be used as a trade-off between SFDR and SNR. Note that the
default gain after reset is 0dB.
Table 11. Full-Scale Range Across Gains
GAIN (dB)
TYPE
FULL-SCALE (VPP)
0
Default after reset
2
1
Fine, programmable
1.78
2
Fine, programmable
1.59
3
Fine, programmable
1.42
4
Fine, programmable
1.26
5
Fine, programmable
1.12
6
Fine, programmable
1
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OFFSET CORRECTION
The ADS424x/422x have an internal offset corretion algorithm that estimates and corrects dc offset up to ±10mV.
The correction can be enabled using the ENABLE OFFSET CORR serial register bit. Once enabled, the
algorithm estimates the channel offset and applies the correction every clock cycle. The time constant of the
correction loop is a function of the sampling clock frequency. The time constant can be controlled using the
OFFSET CORR TIME CONSTANT register bits, as described in Table 12.
After the offset is estimated, the correction can be frozen by setting FREEZE OFFSET CORR = 0. Once frozen,
the last estimated value is used for the offset correction of every clock cycle. Note that offset correction is
disabled by default after reset.
Table 12. Time Constant of Offset Correction Algorithm
(1)
OFFSET CORR TIME CONSTANT
TIME CONSTANT, TCCLK
(Number of Clock Cycles)
TIME CONSTANT, TCCLK × 1/fS (ms) (1)
0000
1M
7
0001
2M
13
0010
4M
26
0011
8M
52
0100
16M
105
0101
32M
210
0110
64M
419
0111
128M
839
1000
256M
1678
1001
512M
3355
1010
1G
6711
1011
2G
13422
1100
Reserved
—
1101
Reserved
—
1110
Reserved
—
1111
Reserved
—
Sampling frequency, fS = 160MSPS.
POWER-DOWN
The ADS424x/422x have two power-down modes: global power-down and channel standby. These modes can
be set using either the serial register bits or using the control pins CTRL1 to CTRL3 (as shown in Table 13).
Table 13. Power-Down Settings
84
CTRL1
CTRL2
CTRL3
Low
Low
Low
Default
Low
Low
High
Not available
Low
High
Low
Not available
Low
High
High
Not available
High
Low
Low
Global power-down
High
Low
High
Channel A powered down, channel B is active
High
High
Low
Not available
High
High
High
MUX mode of operation, channel A and B data is
multiplexed and output on DB[10:0] pins
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DESCRIPTION
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Global Power-Down
In this mode, the entire chip (including ADCs, internal reference, and output buffers) are powered down, resulting
in reduced total power dissipation of approximately 20mW when the CTRL pins are used and 3mW when the
PDN GLOBAL serial register bit is used. The output buffers are in high-impedance state. The wake-up time from
global power-down to data becoming valid in normal mode is typically 100µs.
Channel Standby
In this mode, each ADC channel can be powered down. The internal references are active, resulting in a quick
wake-up time of 50µs. The total power dissipation in standby is approximately 200mW at 160MSPS.
Input Clock Stop
In addition to the previous modes, the converter enters a low-power mode when the input clock frequency falls
below 1MSPS. The power dissipation is approximately 160mW.
DIGITAL OUTPUT INFORMATION
The ADS424x/422x provide 14-bit/12-bit digital data for each channel and an output clock synchronized with the
data.
Output Interface
Two output interface options are available: double data rate (DDR) LVDS and parallel CMOS. They can be
selected using the serial interface register bit or by setting the proper voltage on the SEN pin in parallel
configuration mode.
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DDR LVDS Outputs
In this mode, the data bits and clock are output using low-voltage differential signal (LVDS) levels. Two data bits
are multiplexed and output on each LVDS differential pair, as shown in Figure 166.
Pins
CLKOUTP
CLKOUTM
DB0_P
LVDS Buffers
DB0_M
DB2_P
DB2_M
DB4_P
14-Bit ADC Data,
Channel B
DB4_M
DB6_P
DB6_M
DB8_P
DB8_M
DB10_P
DB10_M
DB12_P
DB12_M
Output
Clock
Data Bits
D0, D1
Data Bits
D2, D3
Data Bits
D4, D5
Data Bits
D6, D7
Data Bits
D8, D9
Data Bits
D10, D11
Data Bits
D12, D13
Figure 166. LVDS Interface
86
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Even data bits (D0, D2, D4, etc.) are output at the CLKOUTP rising edge and the odd data bits (D1, D3, D5, etc.)
are output at the CLKOUTP falling edge. Both the CLKOUTP rising and falling edges must be used to capture all
the data bits, as shown in Figure 167.
CLKOUTM
CLKOUTP
DA0P/M, DB0P/M
D0
D1
D0
D1
DA2P/M, DB2P/M
D2
D3
D2
D3
DA4P/M, DB4P/M
D4
D5
D4
D5
DA6P/M, DB6P/M
D6
D7
D6
D7
DA8P/M, DB8P/M
D8
D9
D8
D9
DA10P/M, DB10P/M
D10
D11
D10
D11
DA12P/M, DB12P/M
D12
D13
D12
D13
Sample N
Sample N + 1
Figure 167. DDR LVDS Interface Timing
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LVDS Buffer
The equivalent circuit of each LVDS output buffer is shown in Figure 168. After reset, the buffer presents an
output impedance of 100Ω to match with the external 100Ω termination.
VDIFF
High
Low
OUTP
External
100W Load
OUTM
VOCM
ROUT
VDIFF
High
Low
NOTE: Default swing across 100Ω load is ±350mV. Use the LVDS SWING bits to change the swing.
Figure 168. LVDS Buffer Equivalent Circuit
The VDIFF voltage is nominally 350mV, resulting in an output swing of ±350mV with 100Ω external termination.
The VDIFF voltage is programmable using the LVDS SWING register bits from ±125mV to ±570mV.
Additionally, a mode exists to double the strength of the LVDS buffer to support 50Ω differential termination, as
shown in Figure 169. This mode can be used when the output LVDS signal is routed to two separate receiver
chips, each using a 100Ω termination. The mode can be enabled using the LVDS DATA STRENGTH and LVDS
CLKOUT STRENGTH register bits for data and output clock buffers, respectively.
The buffer output impedance behaves in the same way as a source-side series termination. By absorbing
reflections from the receiver end, it helps to improve signal integrity.
Receiver Chip # 1
(for example, GC5330)
DAnP/M
CLKIN1
100W
CLKIN2
100W
CLKOUTP
CLKOUTM
DBnP/M
Receiver Chip # 2
ADS42xx
Make LVDS CLKOUT STRENGTH = 1
Figure 169. LVDS Buffer Differential Termination
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Parallel CMOS Interface
In the CMOS mode, each data bit is output on separate pins as CMOS voltage level, every clock cycle, as
Figure 170 shows. The rising edge of the output clock CLKOUT can be used to latch data in the receiver. It is
recommended to minimize the load capacitance of the data and clock output pins by using short traces to the
receiver. Furthermore, match the output data and clock traces to minimize the skew between them.
DB0
DB1
¼
DB2
¼
14-Bit ADC Data,
Channel B
DB11
DB12
DB13
SDOUT
CLKOUT
DA0
DA1
¼
DA2
¼
14-Bit ADC Data,
Channel A
DA11
DA12
DA13
Figure 170. CMOS Outputs
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CMOS Interface Power Dissipation
With CMOS outputs, the DRVDD current scales with the sampling frequency and the load capacitance on every
output pin. The maximum DRVDD current occurs when each output bit toggles between 0 and 1 every clock
cycle. In actual applications, this condition is unlikely to occur. The actual DRVDD current would be determined
by the average number of output bits switching, which is a function of the sampling frequency and the nature of
the analog input signal. This relationship is shown by the formula:
Digital current as a result of CMOS output switching = CL × DRVDD × (N × FAVG),
where CL = load capacitance, N × FAVG = average number of output bits switching.
Multiplexed Mode of Operation
In this mode, the digital outputs of both channels are multiplexed and output on a single bus (DB[13:0] pins), as
shown in Figure 171. The channel A output pins (DA[13:0]) are in 3-state. Because the output data rate on the
DB bus is effectively doubled, this mode is recommended only for low sampling frequencies (less than 80MSPS).
This mode can be enabled using the POWER-DOWN MODE register bits or using the CTRL[3:1] parallel pins.
CLKM
Input
Clock
CLKP
tPDI
Output
Clock
CLKOUT
tSU
Output
Data
DBn
(1)
Channel A
DAn
(2)
tH
Channel B
DBn
(2)
Channel A
DAn
(2)
(1) In multiplexed mode, both channels outputs come on the channel B output pins.
(2) Dn = bits D0, D1, D2, etc.
Figure 171. Multiplexed Mode Timing Diagram
Output Data Format
Two output data formats are supported: twos complement and offset binary. The format can be selected using
the DATA FORMAT serial interface register bit or by controlling the DFS pin in parallel configuration mode.
In the event of an input voltage overdrive, the digital outputs go to the appropriate full-scale level. For a positive
overdrive, the output code is FFFh for the ADS422x and 3FFFh for the ADS424x in offset binary output format;
the output code is 7FFh for the ADS422x and 1FFFh for the ADS424x in twos complement output format. For a
negative input overdrive, the output code is 0000h in offset binary output format and 800h for the ADS422x and
2000h for the ADS424x in twos complement output format.
DEFINITION OF SPECIFICATIONS
Analog Bandwidth – The analog input frequency at which the power of the fundamental is reduced by 3 dB with
respect to the low-frequency value.
Aperture Delay – The delay in time between the rising edge of the input sampling clock and the actual time at
which the sampling occurs. This delay is different across channels. The maximum variation is specified as
aperture delay variation (channel-to-channel).
Aperture Uncertainty (Jitter) – The sample-to-sample variation in aperture delay.
Clock Pulse Width/Duty Cycle – The duty cycle of a clock signal is the ratio of the time the clock signal remains
at a logic high (clock pulse width) to the period of the clock signal. Duty cycle is typically expressed as a
percentage. A perfect differential sine-wave clock results in a 50% duty cycle.
90
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Maximum Conversion Rate – The maximum sampling rate at which specified operation is given. All parametric
testing is performed at this sampling rate unless otherwise noted.
Minimum Conversion Rate – The minimum sampling rate at which the ADC functions.
Differential Nonlinearity (DNL) – An ideal ADC exhibits code transitions at analog input values spaced exactly
1LSB apart. The DNL is the deviation of any single step from this ideal value, measured in units of LSBs.
Integral Nonlinearity (INL) – The INL is the deviation of the ADC transfer function from a best fit line determined
by a least squares curve fit of that transfer function, measured in units of LSBs.
Gain Error – Gain error is the deviation of the ADC actual input full-scale range from its ideal value. The gain
error is given as a percentage of the ideal input full-scale range. Gain error has two components: error as a
result of reference inaccuracy (EGREF) and error as a result of the channel (EGCHAN). Both errors are specified
independently as EGREF and EGCHAN.
To a first-order approximation, the total gain error is ETOTAL ~ EGREF + EGCHAN.
For example, if ETOTAL = ±0.5%, the full-scale input varies from (1 – 0.5/100) x FSideal to (1 + 0.5/100) x FSideal.
Offset Error – The offset error is the difference, given in number of LSBs, between the ADC actual average idle
channel output code and the ideal average idle channel output code. This quantity is often mapped into millivolts.
Temperature Drift – The temperature drift coefficient (with respect to gain error and offset error) specifies the
change per degree Celsius of the parameter from TMIN to TMAX. It is calculated by dividing the maximum deviation
of the parameter across the TMIN to TMAX range by the difference TMAX – TMIN.
Signal-to-Noise Ratio – SNR is the ratio of the power of the fundamental (PS) to the noise floor power (PN),
excluding the power at dc and the first nine harmonics.
SNR = 10Log10
PS
PN
(1)
SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the
reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter
full-scale range.
Signal-to-Noise and Distortion (SINAD) – SINAD is the ratio of the power of the fundamental (PS) to the power
of all the other spectral components including noise (PN) and distortion (PD), but excluding dc.
SINAD = 10Log10
PS
PN + PD
(2)
SINAD is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the
reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter
full-scale range.
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Effective Number of Bits (ENOB) – ENOB is a measure of the converter performance as compared to the
theoretical limit based on quantization noise.
ENOB =
SINAD - 1.76
6.02
(3)
Total Harmonic Distortion (THD) – THD is the ratio of the power of the fundamental (PS) to the power of the
first nine harmonics (PD).
THD = 10Log10
PS
PN
(4)
THD is typically given in units of dBc (dB to carrier).
Spurious-Free Dynamic Range (SFDR) – The ratio of the power of the fundamental to the highest other
spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier).
Two-Tone Intermodulation Distortion – IMD3 is the ratio of the power of the fundamental (at frequencies f1
and f2) to the power of the worst spectral component at either frequency 2f1 – f2 or 2f2 – f1. IMD3 is either given
in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB
to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range.
DC Power-Supply Rejection Ratio (DC PSRR) – DC PSSR is the ratio of the change in offset error to a change
in analog supply voltage. The dc PSRR is typically given in units of mV/V.
AC Power-Supply Rejection Ratio (AC PSRR) – AC PSRR is the measure of rejection of variations in the
supply voltage by the ADC. If ΔVSUP is the change in supply voltage and ΔVOUT is the resultant change of the
ADC output code (referred to the input), then:
DVOUT
PSRR = 20Log 10
(Expressed in dBc)
DVSUP
(5)
Voltage Overload Recovery – The number of clock cycles taken to recover to less than 1% error after an
overload on the analog inputs. This is tested by separately applying a sine wave signal with 6 dB positive and
negative overload. The deviation of the first few samples after the overload (from the expected values) is noted.
Common-Mode Rejection Ratio (CMRR) – CMRR is the measure of rejection of variation in the analog input
common-mode by the ADC. If ΔVCM_IN is the change in the common-mode voltage of the input pins and ΔVOUT is
the resulting change of the ADC output code (referred to the input), then:
DVOUT
CMRR = 20Log10
(Expressed in dBc)
DVCM
(6)
Crosstalk (only for multi-channel ADCs) – This is a measure of the internal coupling of a signal from an
adjacent channel into the channel of interest. It is specified separately for coupling from the immediate
neighboring channel (near-channel) and for coupling from channel across the package (far-channel). It is usually
measured by applying a full-scale signal in the adjacent channel. Crosstalk is the ratio of the power of the
coupling signal (as measured at the output of the channel of interest) to the power of the signal applied at the
adjacent channel input. It is typically expressed in dBc.
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ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
BOARD DESIGN CONSIDERATIONS
Grounding
A single ground plane is sufficient to give good performance, provided the analog, digital, and clock sections of
the board are cleanly partitioned. See the ADS4226 Evaluation Module (SLAU333) for details on layout and
grounding.
Supply Decoupling
Because the ADS424x/422x already include internal decoupling, minimal external decoupling can be used
without loss in performance. Note that decoupling capacitors can help filter external power-supply noise; thus,
the optimum number of capacitors depends on the actual application. The decoupling capacitors should be
placed very close to the converter supply pins.
Exposed Pad
In addition to providing a path for heat dissipation, the PowerPAD is also electrically connected internally to the
digital ground. Therefore, it is necessary to solder the exposed pad to the ground plane for best thermal and
electrical performance. For detailed information, see application notes QFN Layout Guidelines (SLOA122) and
QFN/SON PCB Attachment (SLUA271).
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ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
Routing Analog Inputs
It is advisable to route differential analog input pairs (INP_x and INM_x) close to each other. To minimize the
possibility of coupling from a channel analog input to the sampling clock, the analog input pairs of both channels
should be routed perpendicular to the sampling clock. See the ADS4226 Evaluation Module (SLAU333) for
reference routing. Figure 172 shows a snapshot of the PCB layout from the ADS424x EVM.
Figure 172. ADS42xx EVM PCB Layout
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ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (May 2011) to Revision C
Page
•
Changed device status from Mixed Status to Production Data ............................................................................................ 1
•
Changed 125MSPS sub-bullet of first Features bullet .......................................................................................................... 1
•
Changed sub-bullets of second Features bullet ................................................................................................................... 1
•
Changed status of ADS4222 and ADS4225 from Product Preview to Production Data ...................................................... 2
•
Moved High-Performance Modes into separate table .......................................................................................................... 4
•
Changed ADS4246 fIN = 170MHz Worst spur typical spcification in the ADS4246/ADS4245/ADS4242 Electrical
Characteristics table ............................................................................................................................................................. 5
•
Added ADS4225/ADS4222 fIN = 70MHz SNR, SINAD, SFDR, THD, HD2, HD3, and Worst spur minimum and typical
spcifications in the ADS4226/ADS4225/ADS4222 Electrical Characteristics table .............................................................. 7
•
Added ADS4225/ADS4222 DNL minimum and maximum spcifications in the ADS4226/ADS4225/ADS4222
Electrical Characteristics table .............................................................................................................................................. 8
•
Added ADS4225/ADS4222 INL maximum spcifications in the ADS4226/ADS4225/ADS4222 Electrical
Characteristics table ............................................................................................................................................................. 8
•
Changed ADS4242/ADS4222 Power Supply, Digital power LVDS interface typical specification in Electrical
Characteristics: General table .............................................................................................................................................. 9
•
Changed ADS4245/ADS4225 Power Supply, Digital power CMOS interface typical specification in Electrical
Characteristics: General table .............................................................................................................................................. 9
•
Changed description of pin 64 in Pin Descriptions: LVDS Mode table .............................................................................. 13
•
Changed description of pin 64 in Pin Descriptions: CMOS Mode table ............................................................................. 17
•
Changed description of READOUT disabled in Serial Register Readout section .............................................................. 27
•
Updated Figure 14 .............................................................................................................................................................. 27
•
Changed READOUT desciption in Register Address 00h section ..................................................................................... 29
•
Changed CLKOUT FALL POSN and CLKOUT RISE POSN description in Register Address 42h section ....................... 34
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ADS4222, ADS4225, ADS4226
ADS4242, ADS4245, ADS4246
SBAS533C – MARCH 2011 – REVISED JUNE 2011
www.ti.com
Changes from Revision A (May 2011) to Revision B
Page
•
Changed sub-bullets of first Features bullet ......................................................................................................................... 1
•
Changed last row of Performance Summary table ............................................................................................................... 1
•
Updated ADS424x/422x Family Pins section in Table 1 ...................................................................................................... 2
•
Changed ENOB, DNL, and INL test conditions in the Electrical Characteristics: ADS4246/ADS4245/ADS4242 table ...... 6
•
Deleted INL minimum specifications from Electrical Characteristics: ADS4246/ADS4245/ADS4242 table ......................... 6
•
Changed INL maximum specifications in the Electrical Characteristics: ADS4246/ADS4245/ADS4242 table .................... 6
•
Changed ENOB, DNL, and INL test conditions in the Electrical Characteristics: ADS4226/ADS4225/ADS4222 table ...... 8
•
Changed ADS4226 INL maximum specification in the Electrical Characteristics: ADS4226/ADS4225/ADS4222 table ..... 8
•
Changed Power Supply, IDRVDD and Digital power CMOS interface rows in the Electrical Characteristics: General
table ...................................................................................................................................................................................... 9
•
Updated Figure 2 NC note .................................................................................................................................................. 11
•
Updated Figure 3 NC note .................................................................................................................................................. 12
•
Updated description of NC pin in LVDS Pin Descriptions table ......................................................................................... 14
•
Updated Figure 4 NC note .................................................................................................................................................. 15
•
Updated Figure 5 NC note .................................................................................................................................................. 16
•
Updated description of NC pin in CMOS Pin Descriptions table ........................................................................................ 17
•
Changed 111110 and 001111 LVDS SWING description in Register Address 01h .......................................................... 29
•
Updated Figure 26 .............................................................................................................................................................. 42
•
Updated Figure 28 .............................................................................................................................................................. 43
•
Updated Figure 48 and Figure 49 ....................................................................................................................................... 48
•
Updated Figure 50 and Figure 51 ....................................................................................................................................... 49
•
Updated Figure 70 and Figure 71 ....................................................................................................................................... 54
•
Updated Figure 72 and Figure 73 ....................................................................................................................................... 55
•
Updated Figure 92 and Figure 93 ....................................................................................................................................... 60
•
Updated Figure 94 and Figure 95 ....................................................................................................................................... 61
•
Updated Figure 113 ............................................................................................................................................................ 65
•
Updated Figure 114 and Figure 115 ................................................................................................................................... 66
•
Updated Figure 133 ............................................................................................................................................................ 70
•
Updated Figure 145 ............................................................................................................................................................ 73
•
Changed title of Figure 146 ................................................................................................................................................ 74
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
ADS4222IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4222
ADS4222IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4222
ADS4225IRGC25
ACTIVE
VQFN
RGC
64
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4225
ADS4225IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4225
ADS4225IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4225
ADS4226IRGC25
ACTIVE
VQFN
RGC
64
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4226
ADS4226IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4226
ADS4226IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4226
ADS4242IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4242
ADS4242IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4242
ADS4245IRGC25
ACTIVE
VQFN
RGC
64
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4245
ADS4245IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4245
ADS4245IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4245
ADS4246IRGC25
ACTIVE
VQFN
RGC
64
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4246
ADS4246IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4246
ADS4246IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ4246
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Mar-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
ADS4222IRGCR
VQFN
RGC
64
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS4222IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS4225IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS4225IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS4226IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS4226IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS4242IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS4242IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS4245IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS4245IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS4246IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
ADS4246IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Mar-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS4222IRGCR
VQFN
RGC
64
2000
336.6
336.6
28.6
ADS4222IRGCT
VQFN
RGC
64
250
213.0
191.0
55.0
ADS4225IRGCR
VQFN
RGC
64
2000
336.6
336.6
28.6
ADS4225IRGCT
VQFN
RGC
64
250
213.0
191.0
55.0
ADS4226IRGCR
VQFN
RGC
64
2000
336.6
336.6
28.6
ADS4226IRGCT
VQFN
RGC
64
250
213.0
191.0
55.0
ADS4242IRGCR
VQFN
RGC
64
2000
336.6
336.6
28.6
ADS4242IRGCT
VQFN
RGC
64
250
213.0
191.0
55.0
ADS4245IRGCR
VQFN
RGC
64
2000
336.6
336.6
28.6
ADS4245IRGCT
VQFN
RGC
64
250
213.0
191.0
55.0
ADS4246IRGCR
VQFN
RGC
64
2000
336.6
336.6
28.6
ADS4246IRGCT
VQFN
RGC
64
250
213.0
191.0
55.0
Pack Materials-Page 2
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