ADS5271IPFP

ADS5271 SBAS313A − JUNE 2004 − REVISED JUNE 2004 8-Channel, 12-Bit, 50MSPS ADC with Serial LVDS Interface FEATURES D D D D D D D D D D D D D D D D D D D Maximum Sample Rate: 50MSPS 12-Bit Resolution No Missing Codes Power Dissipation: 957mW CMOS Technology Simultaneous Sample-and-Hold 70.5dB SNR at 10MHz IF Internal and External References 3.3V Digital/Analog Supply Serialized LVDS Outputs Integrated Frame and Synch Patterns MSB and LSB First Modes Option to Double LVDS Clock Output Currents Pin- and Format-Compatible Family TQFP-80 PowerPAD Package or LSB first. The bit coinciding with the rising edge of the 1x clock output is the first bit of the word. Data is to be latched by the receiver on both the rising and falling edges of the 6x clock. The ADS5271 provides internal references, or can optionally be driven with external references. Best performance can be achieved through the internal reference mode. The device is available in a PowerPAD TQFP-80 package and is specified over a −40°C to +85°C operating range. 6X ADCLK LCLKP LCLKN PLL ADCLK 1X ADCLK ADCLKP ADCLKN IN1P IN1N IN2P IN2N IN3P IN3N IN4P IN4N IN5P IN5N IN6P IN6N IN7P IN7N IN8P IN8N S/H 12−Bit ADC Serializer OUT1P OUT1N OUT2P OUT2N OUT3P OUT3N OUT4P OUT4N OUT5P OUT5N OUT6P OUT6N OUT7P OUT7N OUT8P OUT8N S/H APPLICATIONS Portable Ultrasound Systems Tape Drives Test Equipment Optical Networking 12−Bit ADC Serializer S/H 12−Bit ADC Serializer S/H 12−Bit ADC Serializer DESCRIPTION The ADS5271 is a high-performance, 50MSPS, 8-channel, parallel analog-to-digital converter (ADC). Internal references are provided, simplifying system design requirements. Low power consumption allows for the highest of system integration densities. Serial LVDS (low-voltage differential signaling) outputs reduce the number of interface lines and package size. An integrated phase lock loop multiplies the incoming ADC sampling clock by a factor of 12. This 12x clock is used in the process of serializing the data output from each channel. The 12x clock is also used to generate a 1x and a 6x clock, both of which are transmitted as LVDS clock outputs. The 6x clock is denoted by the differential pair LCLKP and LCLKN, while the 1x clock is denoted by ADCLKP and ADCLKN. The word output of each ADC channel can be transmitted either as MSB S/H 12−Bit ADC Serializer S/H 12−Bit ADC Serializer S/H 12−Bit ADC Serializer S/H 12−Bit ADC Serializer Reference Registers Control Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright  2004, Texas Instruments Incorporated www.ti.com SDATA RESET CS SCLK REFT VCM REFB INT/EXT PD ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage Range, AVDD . . . . . . . . . . . . . . . . . . . . . . −0.3V to 3.8V Supply Voltage Range, LVDD . . . . . . . . . . . . . . . . . . . . . . −0.3V to 3.8V Voltage Between AVSS and LVSS . . . . . . . . . . . . . . . . . . −0.3V to 0.3V Voltage Between AVDD and LVDD . . . . . . . . . . . . . . . . . −0.3V to 0.3V Voltages Applied to External REF Pins . . . . . . . . . . . . . . −0.3V to 2.4V All LVDS Data and Clock Outputs . . . . . . . . . . . . . . . . . . −0.3V to 2.4V Analog Input Pins Clock Running . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 2.7V Clock Not Running . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.15V to 2.7V Peak Total Input Current (all inputs) . . . . . . . . . . . . . . . . . . . . . . −30mA Operating Free-Air Temperature Range, TA . . . . . . . . . −40°C to 85°C Lead Temperature 1.6mm (1/16″ from case for 10s) . . . . . . . . . 220°C (1) This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. ORDERING INFORMATION PRODUCT ADS5271 ″ (1) (2) PACKAGE-LEAD HTQFP-80 ″ PACKAGE DESIGNATOR(1) PFP ″ SPECIFIED TEMPERATURE RANGE −40°C to +85°C ″ PACKAGE MARKING ADS5271IPFP ″ ORDERING NUMBER ADS5271IPFP ADS5271IPFPT TRANSPORT MEDIA, QUANTITY Tray, 96 Tape and Reel, 250 For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. Thermal pad size: 4.69mm x 4.69mm (min), 6.20mm x 6.20mm (max). RELATED PRODUCTS MODEL ADS5270 ADS5272 ADS5273 ADS5275 ADS5276 ADS5277 RESOLUTION (BITS) 12 12 12 10 10 10 SAMPLE RATE (MSPS) 40 65 70 40 50 65 CHANNELS 8 8 8 8 8 8 RECOMMENDED OPERATING CONDITIONS ADS5271 MIN SUPPLIES AND REFERENCES Analog Supply Voltage, AVDD Output Driver Supply Voltage, LVDD CLOCK INPUT AND OUTPUTS ADCLK Input Sample Rate (low-voltage TTL) Low Level Voltage Clock Input High Level Voltage Clock Input ADCLKP and ADCLKN Outputs (LVDS) LCLKP and LCLKN Outputs (LVDS)(1) Operating Free-Air Temperature, TA Thermal Characteristics qJA qJC (1) TYP 3.3 3.3 MAX 3.6 3.6 50 UNIT V V MSPS V V MHz MHz °C °C/W °C/W 3.0 3.0 20 20 120 −40 21 68 50 300 +85 6 × ADCLK. REFERENCE SELECTION MODE INT/EXT DESCRIPTION Default with internal pull-up. Internal reference is powered down. Common mode of external reference should be within 50mV of VCM. VCM is derived from the internal bandgap voltage. 2.0VPP Internal Reference External Reference 2 1 0 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 ELECTRICAL CHARACTERISTICS TMIN = −40°C, and TMAX = +85°C. Typical values are at TA = 25°C, clock frequency = maximum specified, 50% clock duty cycle, AVDD = 3.3V, LVDD = 3.3V, −1dBFS, internal voltage reference, and LVDS buffer current at 3.5mA per channel, unless otherwise noted. ADS5271 PARAMETER DC ACCURACY No Missing Codes DNL INL Differential Nonlinearity Integral Nonlinearity Offset Error(1) Offset Temperature Coefficient Fixed Attenuation in Channel(2) Variable Attenuation in Channel(3) Gain Error(4) Gain Temperature Coefficient(5) POWER SUPPLY ICC I(AVDD) I(LVDD) Total Supply Current Analog Supply Current Digital Output Driver Supply Current Power Dissipation Power Down REFERENCE VOLTAGES VREFT VREFB VCM VREFT VREFB ANALOG INPUT Differential Input Capacitance Analog Input Common-Mode Range Differential Input Voltage Range Voltage Overload Recovery Time Input Bandwidth DIGITAL DATA OUTPUTS Data Bit Rate SERIAL INTERFACE SCLK VIN LOW VIN HIGH Serial Clock Input Frequency Input Low Voltage Input High Voltage Input Current Input Pin Capacitance 5.0 0 2.1 20 0.6 VDD ±10 MHz V V µA pF 240 600 MBPS Differential Input Signal at 4VPP Recovery to Within 1% of Code −3dBFS 1.5 4.0 300 7.0 VCM ± 0.05 2.02 pF V VPP CLK Cycles MHz Reference Top (internal) Reference Bottom (internal) Common-Mode Voltage VCM Output Current(6) Reference Top (external) Reference Bottom (external) Reference Input Resistance(7) 2.5 ±50mV Change in Voltage 1.875 1.125 1.95 0.95 1.45 2.0 1.0 1.5 ±2.0 2.05 1.05 1.55 V V V mA V V mA Clock Running VIN = FS, FIN = 5MHz VIN = FS, FIN = 5MHz VIN = FS, FIN = 5MHz, LVDS Into 100Ω Load 290 232 58 957 90 1000 mA mA mA mW mW −2.5 fIN = 5MHz fIN = 5MHz −0.9 −2.0 −0.75 Assured ±0.5 ±0.6 ±0.2 14 1 0.2 ±1.0 44 2.5 0.9 2.0 0.75 LSB LSB %FS ppm/°C %FS %FS %FS ppm/°C TEST CONDITIONS MIN TYP MAX UNITS (1) Offset error is the deviation of the average code from mid-code for a zero input. Offset error is expressed in terms of % of full scale. (2) Fixed attenuation in the channel arises due to a fixed attenuation of about 1% in the sample-and-hold amplifier. When the differential voltage at the analog input pins are changed from −VREF to +VREF, the swing of the output code is expected to deviate from the full-scale code (4096LSB) by the extent of this fixed attenuation. NOTE: VREF is defined as (REFT − REFB). (3) Variable attenuation in the channel refers to the attenuation of the signal in the channel over and above the fixed attenuation. (4) The reference voltages are trimmed at production so that (VREFT − VREFB) is within ± 25mV of the ideal value of 1V. It does not include fixed attenuation. (5) The gain temperature coefficient refers to the temperature coefficient of the attenuation in the channel. It does not account for the variation of the reference voltages with temperature. (6) VCM provides the common-mode current for the inputs of all eight channels when the inputs are AC-coupled. The VCM output current specified is the additional drive of (7) Average current drawn from the reference pins in the external reference mode. the VCM buffer if loaded externally. 3 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 AC CHARACTERISTICS TMIN = −40°C, TMAX = +85°C. Typical values are at TA = 25°C, clock frequency = maximum specified, 50% clock duty cycle, AVDD = 3.3V, LVDD = 3.3V, −1dBFS, internal voltage reference, and LVDS buffer current at 3.5mA per channel, unless otherwise noted. ADS5271 PARAMETER DYNAMIC CHARACTERISTICS fIN = 1MHz fIN = 5MHz fIN = 10MHz fIN = 20MHz fIN = 1MHz fIN = 5MHz fIN = 10MHz fIN = 20MHz fIN = 1MHz fIN = 5MHz fIN = 10MHz fIN = 20MHz fIN = 1MHz fIN = 5MHz fIN = 10MHz fIN = 20MHz fIN = 1MHz fIN = 5MHz fIN = 10MHz fIN = 20MHz fIN = 5MHz Signal Applied to 7 Channels; Measurement Taken on the Channel with No Input Signal 78 87 85 84 82 90 90 87 85 87 85 84 82 70.5 70.5 70.5 70.5 70 70 70 70 11.3 −90 dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS Bits dBc CONDITIONS MIN TYP MAX UNITS SFDR Spurious-Free Dynamic Range HD2 2nd-Order Harmonic Distortion 85 HD3 3rd-Order Harmonic Distortion 78 SNR Signal-to-Noise Ratio 68 SINAD Signal-to-Noise and Distortion 67.5 ENOB Crosstalk Effective Number of Bits LVDS DIGITAL DATA AND CLOCK OUTPUTS Test conditions at IO = 3.5mA, RLOAD = 100Ω, and CLOAD = 9pF. IO refers to the current setting for the LVDS buffer. RLOAD is the differential load resistance between the differential LVDS pair. CLOAD is the effective single-ended load capacitance between the differential LVDS pins and ground. CLOAD includes the receiver input parasitics as well as the routing parasitics. Measurements are done with a transmission line of 100Ω differential impedance between the device and the load. All LVDS specifications are functionally tested, but not parametrically tested. PARAMETER DC SPECIFICATIONS(1) VOH VOL  VOD VOS CO  ∆VOD ∆VOS ISOUT Output Voltage High, OUTP or OUTN Output Voltage Low, OUTP or OUTN Output Differential Voltage,  OUTP or OUTN Output Offset Voltage(2) Output Capacitance(3) Change in  VOD Between 0 and 1 Change Between 0 and 1 Output Short-Circuit Current RLOAD = 100Ω ± 1%; See LVDS Timing Diagram, Page 7 RLOAD = 100Ω ± 1% RLOAD = 100Ω ± 1% RLOAD = 100Ω ± 1%; See LVDS Timing Diagram, Page 7 VCM = 1.0V and 1.4V RLOAD = 100Ω ± 1% RLOAD = 100Ω ± 1% Drivers Shorted to Ground Drivers Shorted Together 6 × ADCLK 45 50 400 400 IO = 2.5mA IO = 3.5mA IO = 4.5mA IO = 6mA 400 250 200 150 ps ps ps 1375 900 300 1100 1025 350 1200 4 25 25 40 12 55 400 1300 1500 mV mV mV mV pF mV mV mA mA % ps ps CONDITIONS MIN TYP MAX UNITS ISOUTNP Output Current DRIVER AC SPECIFICATIONS Clock Clock Signal Duty Cycle Minimum Data Setup Time(4, 5) Minimum Data Hold Time(4, 5) tRISE/tFALL VOD Rise Time or VOD Fall Time (1) The DC specifications refer to the condition where the LVDS outputs are not switching, but are permanently at a valid logic level 0 or 1. (2) VOS refers to the common-mode of OUTP and OUTN. (3) Output capacitance inside the device, from either OUTP or OUTN to ground. (4) Refer to the LVDS application note (SBAA118) for a description of data setup and hold times. (5) Setup and hold time specifications take into account the effect of jitter on the output data and clock. These specifications also assume that the data and clock paths are perfectly matched within the receiver. Any mismatch in these paths within the receiver would appear as reduced timing margins. 4 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 SWITCHING CHARACTERISTICS TMIN = −40°C, TMAX = +85°C. Typical values are at TA = 25°C, clock frequency = maximum specified, 50% clock duty cycle, AVDD = 3.3V, LVDD = 3.3V, −1dBFS, internal voltage reference, and LVDS buffer current at 3.5mA per channel, unless otherwise noted. ADS5271 PARAMETER SWITCHING SPECIFICATIONS tSAMPLE tD(A) tD(pipeline) tPROP Aperture Delay Aperture Jitter (uncertainty) Latency Propagation Delay 20 2.5 1 6.5 5 50 ns ns ps cycles ns CONDITIONS MIN TYP MAX UNITS SERIAL INTERFACE TIMING Data is shifted in MSB first. Outputs change on next rising clock edge after CS goes high. ADCLK CS Start Sequence t1 t2 Data latched on each rising edge of SCLK. SCLK t3 SDATA t4 t5 MSB D6 D5 D4 D3 D2 D1 D0 PARAMETER t1 t2 t3 t4 t5 DESCRIPTION Serial CLK Period Serial CLK High Time Serial CLK Low Time Minimum Data Setup Time Minimum Data Hold Time MIN 50 TYP 13 13 5 5 MAX UNIT ns ns ns ns ns 5 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 SERIAL INTERFACE TIMING ADDRESS D7 0 D6 0 D5 0 D4 0 0 0 1 1 0 1 0 1 0 0 1 1 0 0 0 1 D3 0 0 0 0 0 1 0 D3 X 0 0 1 1 D3 X D2 X D1 X D0 X Power-Down Channels 5 to 8; D3 is for Channel 8 and D0 for Channel 5 CUSTOM PATTERN (registers 4-6) 0 0 0 1 1 1 0 0 1 0 1 0 D3 MSB X X D2 X X X D1 X X X D0 X X LSB D2 X D1 X D0 X Power-Down Channels 1 to 4; D3 is for Channel 4 and D0 for Channel 1 3. POWER-DOWN ADC CHANNELS Example: 1010 Powers Down Channels 4 and 2 and Keeps Channels 1 and 3 Alive D2 X 0 1 D1 X X X D0 1 X X 0 1 0 1 D3 DATA D2 D1 D0 0. LVDS BUFFERS Normal ADC Output Deskew Pattern Sync Pattern Custom Pattern Output Current in LVDS = 3.5mA Output Current in LVDS = 2.5mA Output Current in LVDS = 4.5mA Output Current in LVDS = 6.0mA 1. LSB/MSB MODE Default LVDS Clock Output Current 2X LVDS Clock Output Current LSB Mode MSB Mode 2. POWER-DOWN ADC CHANNELS DESCRIPTION REMARKS Patterns Get Reversed in MSB First Mode of LVDS Bits for Custom Pattern TEST PATTERNS(1) Deskew Sync Custom 101010101010 000000111111 Any 12-bit pattern that is defined in the custom pattern registers 4 to 6. The output comes out in the following order: D0(4) D1(4) D2(4) D3(4) D0(5) D1(5) D2(5) D3(5) D0(6) D1(6) D2(6) D3(6) where, for example, D0(4) refers to the D0 bit of register 4, etc. (1) Default is LSB first. If MSB is selected the above patterns will be reversed. 6 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 LVDS TIMING DIAGRAM (PER ADC CHANNEL) Sample n Sample n+6 Input 1 tSAMPLE ADCLK tS 2 LCLKP 6X ADCLK LCLKN OUTP SERIAL DATA OUTN D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D0 D1 Sample n data ADCLKP 1X ADCLK ADCLKN tD(A) tPROP 6.5 Clock Cycles RESET TIMING t1 +AVDD Power Supply 0V t1 > 10ms t2 > 100ns +AVDD RESET 0V t2 POWER-DOWN TIMING Device Fully Powers Down PD 1 µs 10µs Device Fully Powers Up 7 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 PIN CONFIGURATION Top View INT/EXT ADCLK AVDD AVDD AVDD AVSS AVSS AVSS AVSS AVSS AVSS REFB AVSS AVSS REFT SCLK ISET TQFP SDA 80 AVDD IN1P IN1N AVSS IN2P IN2N AVDD AVSS IN3P 1 2 3 4 5 6 7 8 9 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 VCM CS 64 63 62 61 60 AVDD 59 IN8N 58 IN8P 57 AVSS 56 IN7N 55 IN7P 54 AVDD 53 AVSS 52 IN6N 51 IN6P IN3N 10 AVSS 11 IN4P 12 IN4N 13 AVDD 14 LVSS 15 PD 16 LVSS 17 LVSS 18 LCLKP 19 LCLKN 20 21 OUT1P 22 OUT1N 23 OUT2P 24 OUT2N 25 LVDD 26 LVSS 27 OUT3P 28 OUT3N 29 OUT4P 30 OUT4N 31 OUT5P 32 OUT5N 33 OUT6P 34 OUT6N 35 LVDD 36 LVSS 37 OUT7P 38 OUT7N 39 OUT8P 40 OUT8N ADS5271 50 AVSS 49 IN5N 48 IN5P 47 AVDD 46 LVSS 45 RESET 44 LVSS 43 LVSS 42 ADCLKN 41 ADCLKP 8 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 PIN DESCRIPTIONS NAME AVDD AVSS LVDD LVSS IN1P IN1N IN2P IN2N IN3P IN3N IN4P IN4N IN5P IN5N IN6P IN6N IN7P IN7N IN8P IN8N REFT REFB VCM INT/EXT PD LCLKP LCLKN ADCLK OUT1P OUT1N OUT2P OUT2N OUT3P OUT3N OUT4P OUT4N OUT5P OUT5N OUT6P OUT6N OUT7P OUT7N OUT8P OUT8N ADCLKP ADCLKN ISET RESET CS SDA SCLK PIN # 1, 7, 14, 47, 54, 60, 63, 70, 75 4, 8, 11, 50, 53, 57, 61, 62, 68, 72-74, 79, 80 25, 35 15, 17, 18, 26, 36, 43, 44, 46 2 3 5 6 9 10 12 13 48 49 51 52 55 56 58 59 67 66 65 69 16 19 20 71 21 22 23 24 27 28 29 30 31 32 33 34 37 38 39 40 41 42 64 45 76 77 78 NUMBER OF PINS 8 14 2 8 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 I/O I I I I I I I I I I I I I I I I I I I I I/O I/O O I I O O I O O O O O O O O O O O O O O O O O O I/O I I I I DESCRIPTION Analog Power Supply Analog Ground LVDS Power Supply LVDS Ground Channel 1 Differential Analog Input High Channel 1 Differential Analog Input Low Channel 2 Differential Analog Input High Channel 2 Differential Analog Input Low Channel 3 Differential Analog Input High Channel 3 Differential Analog Input Low Channel 4 Differential Analog Input High Channel 4 Differential Analog Input Low Channel 5 Differential Analog Input High Channel 5 Differential Analog Input Low Channel 6 Differential Analog Input High Channel 6 Differential Analog Input Low Channel 7 Differential Analog Input High Channel 7 Differential Analog Input Low Channel 8 Differential Analog Input High Channel 8 Differential Analog Input Low Reference Top Voltage Reference Bottom Voltage Common-Mode Output Voltage Internal/External Reference Select; 0 = External, 1 = Internal Power-Down; 0 = Normal, 1 = Power-Down Positive LVDS Clock Negative LVDS Clock Data Converter Clock Input Channel 1 Positive LVDS Data Output Channel 1 Negative LVDS Data Output Channel 2 Positive LVDS Data Output Channel 2 Negative LVDS Data Output Channel 3 Positive LVDS Data Output Channel 3 Negative LVDS Data Output Channel 4 Positive LVDS Data Output Channel 4 Negative LVDS Data Output Channel 5 Positive LVDS Data Output Channel 5 Negative LVDS Data Output Channel 6 Positive LVDS Data Output Channel 6 Negative LVDS Data Output Channel 7 Positive LVDS Data Output Channel 7 Negative LVDS Data Output Channel 8 Positive LVDS Data Output Channel 8 Negative LVDS Data Output Positive LVDS ADC Clock Output Negative LVDS ADC Clock Output Bias Current Setting Resistor of 56kΩ to Ground Reset to Default; 0 = Reset, 1 = Normal Chip Select; 0 = Select, 1 = No Select Serial Data Input Serial Data Clock 9 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 TYPICAL CHARACTERISTICS Typical values are at TA = 25°C, clock frequency = maximum specified, 50% clock duty cycle, AVDD = 3.3V, LVDD = 3.3V, −1dBFS, internal voltage reference, and LVDS buffer current at 3.5mA per channel, unless otherwise noted. SPECTRAL PERFORMANCE 0 − 20 Amplitude (dB) − 40 − 60 − 80 − 100 − 120 0 5 10 15 20 25 Input Frequency (MHz) f IN = 1MHz (− 1dBFS) SNR = 71.1dBFS SINAD = 70.9dBFS SFDR = 87.7dBc Amplitude (dB) 0 − 20 − 40 − 60 − 80 − 100 − 120 0 5 SPECTRAL PERFORMANCE f IN = 5MHz (− 1dBFS) SNR = 70.9dBFS SINAD = 70.8dBFS SFDR = 89dBc 10 15 20 25 Input Frequency (MHz) SPECTRAL PERFORMANCE 0 − 20 Amplitude (dB) − 40 − 60 − 80 − 100 − 120 0 5 10 15 20 25 Input Frequency (MHz) f IN = 10MHz (− 1dBFS) SNR = 70.9dBFS SINAD = 70.7dBFS SFDR = 95.4dBc Amplitude (dB) 0 − 20 − 40 − 60 − 80 − 100 − 120 0 5 SPECTRAL PERFORMANCE fIN = 20MHz (− 1dBFS) SNR = 70.5dBFS SINAD = 70.4dBFS SFDR = 85.6dBc 10 15 20 25 Input Frequency (MHz) INPUT FREQUENCY vs AMPLITUDE 0 − 20 Amplitude (dB) − 40 − 60 − 80 − 100 − 120 0 5 10 15 20 25 Input Frequency (MHz) f1 = 9.5MHz (− 7dBFS) f 2 = 10.2MHz (− 7dBFS) IMD(3) − 85 DNL (LSB) 0.5 0.4 0.3 0.2 0.1 0 − 0.1 − 0.2 − 0.3 − 0.4 − 0.5 0 512 fIN = 5MHz DIFFERENTIAL NONLINEARITY 1024 1536 2048 Code 2560 3072 3584 4096 10 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 TYPICAL CHARACTERISTICS (continued) Typical values are at TA = 25°C, clock frequency = maximum specified, 50% clock duty cycle, AVDD = 3.3V, LVDD = 3.3V, −1dBFS, internal voltage reference, and LVDS buffer current at 3.5mA per channel, unless otherwise noted. INTEGRAL NONLINEARITY 1.0 0.8 0.6 0.4 INL (LSB) 0.2 0 − 0.2 − 0.4 − 0.6 − 0.8 − 1.0 0 512 1024 1536 2048 Code 2560 3072 3584 4096 fIN = 5MHz SFDR, SNR (dBc, dBFS) 90 80 fIN = 5MHz SWEPT INPUT POWER SNR (dBFS) 70 60 50 40 30 20 10 0 − 70 − 60 − 50 − 40 − 30 − 20 − 10 0 SNR (dBc) SFDR (dBc) Input Amplitude (dBFS) SWEPT INPUT POWER 90 80 SFDR, SNR (dBc, dBFS) SNR (dBFS) 70 60 50 SFDR (dBc) 40 30 20 10 0 − 70 − 60 − 50 − 40 − 30 − 20 − 10 0 SNR (dBc) SFDR, SNR, SINAD (dBFS) fIN = 10MHz 95 90 85 80 75 70 DYNAMIC PERFORMANCE vs DUTY CYCLE fIN = 5MHz SFDR SNR SINAD 65 60 20 30 40 50 Duty Cycle (%) 60 70 80 Input Amplitude (dBFS) DYNAMIC PERFORMANCE vs INPUT FREQUENCY 95 SFDR, SNR, SINAD (dBFS) 90 SFDR SFDR, SNR (dBFS) 85 80 75 SNR 70 65 60 0 5 10 15 20 25 30 35 40 45 50 Input Frequency (MHz) 95 90 85 80 75 70 65 60 55 50 15 DYNAMIC PERFORMANCE vs CLOCK FREQUENCY fIN = 5MHz SFDR SNR SINAD 20 25 30 35 40 45 50 55 60 Clock Frequency (MHz) 11 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 TYPICAL CHARACTERISTICS (continued) Typical values are at TA = 25°C, clock frequency = maximum specified, 50% clock duty cycle, AVDD = 3.3V, LVDD = 3.3V, −1dBFS, internal voltage reference, and LVDS buffer current at 3.5mA per channel, unless otherwise noted. DYNAMIC PERFORMANCE vs CLOCK FREQUENCY 95 90 SFDR, SNR, SINAD (dBFS) 85 80 75 70 65 60 55 50 15 20 25 30 35 40 45 50 55 60 Clock Frequency (MHz) 0 15 SINAD SNR SFDR Supply Current (Amps) 0.30 0.25 0.20 0.15 0.10 SUPPLY CURRENT vs CLOCK FREQUENCY IAVDD IDVDD 0.05 20 25 30 35 40 45 50 55 60 Clock Frequency (MHz) POWER DISSIPATION vs TEMPERATURE 975 970 965 Power (mW) 960 955 950 945 940 − 45 − 35 − 25 − 15 − 5 5 15 25 35 45 55 65 75 Temperature (_ C) 12 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 THEORY OF OPERATION OVERVIEW The ADS5271 is an 8-channel, high-speed, CMOS ADC. It consists of a high-performance sample-and-hold circuit at the input, followed by a 12-bit ADC. The 12 bits given out by each channel are serialized and sent out on a single pair of pins in LVDS format. All eight channels of the ADS5271 operates from a single clock referred to as ADCLK. The sampling clocks for each of the eight channels are generated from the input clock using a carefully matched clock buffer tree. The 12X clock required for the serializer is generated internally from ADCLK using a phase lock loop (PLL). A 6X and a 1X clock are also output in LVDS format along with the data to enable easy data capture. The ADS5271 operate from internally generated reference voltages that are trimmed to ensure matching across multiple devices on a board. This feature eliminates the need for external routing of reference lines and also improves matching of the gain across devices. The nominal values of REFT and REFB are 2V and 1V, respectively. These values imply that a differential input of −1V corresponds to the zero code of the ADC, and a differential input of +1V corresponds to the full-scale code (4095 LSB). VCM (common-mode voltage of REFT and REFB) is also made available externally through a pin, and is nominally 1.5V. The ADC employs a pipelined converter architecture consisting of a combination of multi-bit and single-bit internal stages. Each stage feeds its data into the digital error correction logic, ensuring excellent differential linearity and no missing codes at the 12-bit level. The pipeline architecture results in a data latency of 6.5 clock cycles. The output of the ADC goes to a serializer that operates from a 12X clock generated by the PLL. The 12 data bits from each channel are serialized and sent LSB first. In addition to serializing the data, the serializer also generates a 1X clock and a 6X clock. These clocks are generated in the same way the serialized data is generated, so these clocks maintain perfect synchronization with the data. The data and clock outputs of the serializer are buffered externally using LVDS buffers. Using LVDS buffers to transmit data externally has multiple advantages, such as reduced number of output pins (saving routing space on the board), reduced power consumption, and reduced effects of digital noise coupling to the analog circuit inside the ADS5271. The ADS5271 operates from two sets of supplies and grounds. The analog supply/ground set is denoted as AVDD/AVSS, while the digital set is denoted by LVDD/LVSS. DRIVING THE ANALOG INPUTS The analog input biasing is shown in Figure 1. The recommended method to drive the inputs is through AC coupling. AC coupling removes the worry of setting the common-mode of the driving circuit, since the inputs are biased internally using two 600Ω resistors. ADS5271 IN+ 600Ω 600Ω IN− Input Circuitry CM Buffer 1 Internal Voltage Reference VCM CM Buffer 2 Figure 1. Analog Input Bias Circuitry The sampling capacitor used to sample the inputs is 4pF. The choice of the external AC coupling capacitor is dictated by the attenuation at the lowest desired input frequency of operation. The attenuation resulting from using a 10nF AC coupling capacitor is 0.04%. If the input is DC coupled, then the output common-mode voltage of the circuit driving the ADS5271 should match the VCM (which is provided as an output pin) to within ±50mV. It is recommended that the output common-mode of the driving circuit be derived from VCM provided by the device. 13 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 The sampling circuit consists of a low-pass RC filter at the input to filter out noise components that might be getting differentially coupled on the input pins. The inputs are sampled on two 4pF capacitors. The sampling on the capacitors is done with respect to an internally generated common-mode voltage (INCM). The switches connecting the sampling capacitors to the INCM are opened out first (before the switches connecting them to the analog inputs). This ensures that the charge injection arising out of the switches opening is independent of the input signal amplitude to a first-order of approximation. SP refers to a sampling clock whose falling edge comes an instant before the SAMPLE clock. The falling edge of SP determines the sampling instant. INCM (internally generated voltage) SP (defines sampling instant) 15Ω IN+ 1.5pF 15Ω IN− 1.5pF Sample 4pF All bias currents required for the internal operation of the device are set using an external resistor to ground at pin ISET. Using a 56kΩ resistor on ISET generates an internal reference current of 20µA. This current is mirrored internally to generate the bias current for the internal blocks. Using a larger external resistor at ISET reduces the reference bias current and thereby scales down the device operating power. However, it is recommended that the external resistor be within 10% of the specified value of 56k so that the internal bias margins for the various blocks are proper. Buffering the internal bandgap voltage also generates a voltage called VCM, which is set to the midlevel of REFT and REFB, and is accessible on a pin. The internal buffer driving VCM has a drive of ±2mA. It is meant as a reference voltage to derive the input common-mode in case the input is directly coupled. When using the internal reference mode, a resistor greater than 2Ω should be added between the reference pins (REFT and REFB) and the decoupling capacitor, as shown in Figure 3. 1.7pF SP 4pF Sample SP INCM ADS5271 REFT > 2Ω REFB > 2Ω Figure 2. Input Circuitry 0.1µ F 2.2µF 2.2µ F 0.1µF INPUT OVER-VOLTAGE RECOVERY The differential full-scale input peak-to-peak supported by the ADS5271 is 2V. For a nominal value of VCM (1.5V), INP and INN can swing from 1V to 2V. The ADS5271 is specially designed to handle an over-voltage differential peak-to-peak voltage of 4V (2.5V and 0.5V swings on INP and INN). If the input common-mode is not considerably off from VCM during overload (less than 300mV), recovery from an over-voltage input condition is expected to be within 4 clock cycles. All of the amplifiers in the SHA and ADC are specially designed for excellent recovery from an overload signal. Figure 3. Internal Refernce Mode The device also supports the use of external reference voltages. This mode involves forcing REFT and REFB externally. In this mode, the internal reference buffer is tri-stated. Since the switching current for the eight ADCs come from the externally forced references, it is possible for the performance to be slightly less than when the internal references are used. It should be noted that in this mode, VCM and ISET continue to be generated from the internal bandgap voltage, as in the internal reference mode. It is therefore important to ensure that the common-mode voltage of the externally forced reference voltages matches to within 50mV of VCM. REFERENCE CIRCUIT DESIGN The digital beam-forming algorithm relies heavily on gain matching across all receiver channels. A typical system would have about 12 octal ADCs on the board. In such a case, it is critical to ensure that the gain is matched, essentially requiring the reference voltages seen by all the ADCs to be the same. Matching references within the eight channels of a chip is done by using a single internal reference voltage buffer. Trimming the reference voltages on each chip during production ensures the reference voltages are well matched across different chips. 14 CLOCKING The eight channels on the chip run off a single ADCLK input. To ensure that the aperture delay and jitter are same for all the channels, a clock tree network is used to generate individual sampling clocks to each channel. The ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 clock paths for all the channels are matched from the source point all the way to the sample-and-hold. This ensures that the performance and timing for all the channels are identical. The use of the clock tree for matching introduces an aperture delay, which is defined as the delay between the rising edge of ADCLK and the actual instant of sampling. The aperture delays for all the channels are matched, and vary between 2.5ns to 4.5ns across devices. Another critical specification is the aperture jitter that is defined as the uncertainty of the sampling instant. The gates in the clock path are designed so as to give an rms jitter of about 1ps. The input ADCLK should ideally have a 50% duty cycle. However, while routing ADCLK to different components on board, the duty cycle of the ADCLK reaching the ADS5271 could deviate from 50%. A smaller (or larger) duty cycle eats into the time available for sample or hold phases of each circuit, and is therefore not optimal. For this reason, the internal PLL is used to generate an internal clock that has 50% duty cycle. The use of the PLL automatically dictates the lower frequency of operation to be about 20MHz. data rate output by the serializer is 480 MBPS. The data comes out LSB first, with a register programmability to revert to MSB first. The serializer also gives out a 1X clock and a 6X clock. The 6X clock (denoted as LCLKP/ LCLKN) is meant to synchronize the capture of the LVDS data. The deskew mode can be enabled as well, using a register setting. This mode gives out a data stream of alternate 0s and 1s and can be used determine the relative delay between the 6X clock and the output data for optimum capture. A 1X clock is also generated by the serializer and transmitted by the LVDS buffer. The 1X clock (referred to as ADCLKP/ADCLK N) is used to determine the start of the 12-bit data frame. The sync mode (enabled through a register setting) gives out a data of six 0s followed by six 1s. Using this mode, the 1X clock can be used to determine the start of the data frame. In addition to the deskew mode pattern and the sync pattern, a custom pattern can be defined by the user and output from the LVDS buffer. NOISE COUPLING ISSUES High-speed mixed signals are sensitive to various types of noise coupling. One of the main sources of noise is the switching noise from the serializer and the output buffers. Maximum care is taken to isolate these noise sources from the sensitive analog blocks. As a starting point, the analog and digital domains of the chip are clearly demarcated. AVDD and AVSS are used to denote the supplies for the analog sections, while LVDD and LVSS are used to denote the digital supplies. Care is taken to ensure that there is minimal interaction between the supply sets within the device. The extent of noise coupled and transmitted from the digital to the analog sections depends on the following: 1. 2. The effective inductances of each of the supply/ground sets. The isolation between supply/ground sets. the digital and analog LVDS BUFFERS The LVDS buffer has two current sources, as shown in Figure 4. OUTP and OUTN are loaded externally by a resistive load that is ideally about 100Ω. Depending on the data being 0 or 1, the currents are directed in one or the other direction through the resistor. The LVDS buffer has four current settings. The default current setting is 3.5mA, and gives a differential drop of about ±350mV across the 100Ω resistor. High OUTP Low External Termination Resistor Low OUTN High Smaller effective inductance of the supply/ground pins leads to better suppression of the noise. For this reason, multiple pins are used to drive each supply/ground. It is also critical to ensure that the impedances of the supply and ground lines on board are kept to the minimum possible values. Use of ground planes in the board as well as large decoupling capacitors between the supply and ground lines are necessary to get the best possible SNR from the device. It is recommended that the isolation be maintained on board by using separate supplies to drive AVDD and LVDD, as well as separate ground planes for AVSS and LVSS. Figure 4. LVDS Buffer The LVDS buffer gets data from a serializer that takes the output data from each channel and serializes it into a single data stream. For a clock frequency of 40MHz, the The use of LVDS buffers reduces the injected noise considerably, compared to CMOS buffers. The current in the LVDS buffer is independent of the direction of switching. Also, the low output swing as well as the differential nature of the LVDS buffer results in low-noise coupling. 15 ADS5271 www.ti.com SBAS313A − JUNE 2004 − REVISED JUNE 2004 POWER-DOWN MODE The ADS5271 has a power-down pin, PD. Pulling PD high causes the devices to enter the power-down mode. In this mode, the reference and clock circuitry as well as all the channels are powered down. Device power consumption drops to less than 100mW in this mode. Individual channels can also be selectively powered down by programming registers. The ADS5271 also has an internal circuit that monitors the state of stopped clocks. If ADCLK is stopped (or if it runs at a speed < 3MHz), this monitoring circuit generates a logic signal that puts the device in a power-down state. As a result, the power consumption of the device goes to less than 100mW when ADCLK is stopped. This circuit can also be disabled using register options. After the supplies have stabilized, it is required to give the device an active RESET pulse. This results in all internal registers getting reset to their default value of 0 (inactive). Without RESET, it is possible that some registers might be in their non-default state on power-up. This could cause the device to malfunction. LAYOUT OF PCB WITH POWERPAD THERMALLY ENHANCED PACKAGES The ADS5271 is housed in an 80-lead PowerPAD thermally enhanced package. To make optimum use of the thermal efficiencies designed into the PowerPAD package, the PCB must be designed with this technology in mind. Please refer to SLMA004 PowerPAD brief PowerPAD Made Easy (refer to our web site at www.ti.com), which addresses the specific considerations required when integrating a PowerPAD package into a PCB design. For more detailed information, including thermal modeling and repair procedures, please see SLMA002 technical brief PowerPAD Thermally Enhanced Package (www.ti.com). SUPPLY SEQUENCE The following supply sequence is recommended for powering up the device: 1. 2. AVDD is powered up. LVDD is powered up. 16 PACKAGE OPTION ADDENDUM www.ti.com 9-Dec-2004 PACKAGING INFORMATION Orderable Device ADS5271IPFP ADS5271IPFPT (1) Status (1) ACTIVE ACTIVE Package Type HTQFP HTQFP Package Drawing PFP PFP Pins Package Eco Plan (2) Qty 80 80 96 250 None None Lead/Ball Finish CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-3-220C-168 HR Level-3-220C-168 HR The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. 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