User's Guide
SLAU355A – July 2011 – Revised March 2015
ADS5294, 8-Channel, Analog-to-Digital Converter
Evaluation Module
This user’s guide gives a general overview of the evaluation module (EVM) and provides a general
description of the features and functions to be considered while using this module. This manual is
applicable to the ADS5294 analog-to-digital converters (ADC), which collectively are referred to as
ADS529x. Use this document in combination with the respective ADC data sheet. The ADS529xEVM
provides a platform for evaluating the ADC under various signal, clock, reference, and power supply
conditions.
Contents
Quick View of Evaluation Setup ........................................................................................... 3
Default Configuration ........................................................................................................ 4
Software Installation and Operation ....................................................................................... 5
3.1
GUI Installation – Mandatory ...................................................................................... 5
3.2
USB Interface Driver Installation .................................................................................. 5
4
Test Setup .................................................................................................................... 6
5
Power Up ADS5294 ......................................................................................................... 7
6
Launch ADS5294 GUI ...................................................................................................... 8
7
Launch TSW1400 GUI..................................................................................................... 11
8
TEST ADS5294............................................................................................................. 12
8.1
Step 2: Single Tone FFT ......................................................................................... 15
9
Board Configuration ........................................................................................................ 17
9.1
Input/Output, Power Supply, and USB ......................................................................... 17
9.2
ADC Clock.......................................................................................................... 19
9.3
Light-Emitting Diodes ............................................................................................. 21
9.4
Miscellaneous Test Points ....................................................................................... 22
10
EVM Schematics ........................................................................................................... 23
11
ADS5294EVM Bill of Materials ........................................................................................... 31
12
ADS5294EVM Printed-Circuit Board Layout............................................................................ 33
Appendix A
High Speed Data Converter Pro (HSDCPro) GUI Installation ............................................... 41
1
2
3
List of Figures
1
Evaluation Setup ............................................................................................................. 3
2
ADS5294EVM Basic Configuration ........................................................................................ 4
3
HW Setup With Connection Between TSW1400EVM and ADS5294EVM ........................................... 7
4
Power-Up Indications........................................................................................................ 8
5
ADS5294 GUI Launch
6
TSW1400 GUI Launch..................................................................................................... 11
7
ADS5294 Time Domain Setup
8
ADS5294 Test Pattern ..................................................................................................... 13
9
User Interface: Time Domain Format .................................................................................... 14
10
User Interface: Single FFT Format ....................................................................................... 16
11
I/O, PWR, and USB Connector ........................................................................................... 17
12
ADS5294EVM Default Clock Jumper Locations
19
13
ADS5294EVM LED Location
21
......................................................................................................
...........................................................................................
......................................................................
............................................................................................
9
12
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14
ADS5294EVM Test Point Locations ..................................................................................... 22
15
Schematic, Sheet 1 of 9 ................................................................................................... 23
16
Schematic, Sheet 2 of 9 ................................................................................................... 24
17
Schematic, Sheet 3 of 9 ................................................................................................... 24
18
Schematic, Sheet 4 of 9 ................................................................................................... 25
19
Schematic, Sheet 5 of 9 ................................................................................................... 26
20
Schematic, Sheet 6 of 9 ................................................................................................... 27
21
Schematic, Sheet 7 of 9 ................................................................................................... 28
22
Schematic, Sheet 8 of 9 ................................................................................................... 29
23
Schematic, Sheet 9 of 9 ................................................................................................... 30
24
ADS5294EVM Top Layer Assembly Drawing – Top View ............................................................ 33
25
ADS5294EVM Bottom Layer Assembly Drawing – Bottom View .................................................... 34
26
ADS5294EVM Top Layer Copper – Top View ......................................................................... 35
27
ADS5294EVM Internal Layer 1, Ground – Top View .................................................................. 36
28
ADS5294EVM Internal Layer 2, Power – Top View ................................................................... 37
29
ADS5294EVM Internal Layer 3, Power – Top View ................................................................... 38
30
ADS5294EVM Internal Layer 4, Ground – Top View .................................................................. 39
31
ADS5294EVM Bottom Layer Copper – Top View
32
HSDCPro Install (Begin)................................................................................................... 41
33
HSDCPro Install (Install Directory) ....................................................................................... 42
34
HSDCPro Install (TI License Agreement) ............................................................................... 43
35
HSDCPro Install (NI License Agreement) ............................................................................... 44
36
HSDCPro Install (Start Installation) ...................................................................................... 45
37
HSDCPro Install (Installation Progress) ................................................................................. 46
38
HSDCPro Install (Installation Complete) ................................................................................ 47
39
HSDCPro Install (h) ........................................................................................................ 48
40
HSDCPro Install ............................................................................................................ 48
.....................................................................
40
List of Tables
2
1
Input/Output, Power, and USB ........................................................................................... 17
2
Channel 8 Configuration................................................................................................... 18
3
ADC Clock Various Mode Jumper Settings
4
LED Indicators .............................................................................................................. 21
5
Miscellaneous Test Points ................................................................................................ 22
............................................................................
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Quick View of Evaluation Setup
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1
Quick View of Evaluation Setup
Figure 1 shows an overview of the evaluation setup that includes the ADS5294EVM evaluation module
(EVM), TSW1400EVM, external equipment, personal computer (PC), and software requirements.
Figure 1. Evaluation Setup
TSW1400EVM: The high-speed LVDS deserializer board is required for capturing data from the
ADS5294EVM and its analysis using the TSW1400 graphical user interface (GUI).
For more information pertaining to be TSW1400EVM, see:
http://www.ti.com/tool/tsw1400evm.
Equipment: Signal generators (with low-phase noise) must be used as source of input signal and clock
(optional) in order to get the desired performance. Additionally, band-pass filters (BPF) are required in
signal and clock (optional) paths to attenuate the harmonics and noise from the generators.
Power Supply: A single +5-V supply powers the ADS5294EVM. The supplies for the ADS5294 device are
derived from the +5-V supply. The power supply must be able to source up to 1.5 A. A +6-V supply can
power the TSW1400EVM using a wall adapter.
USB Interface to PC: The USB connection from the ADS5294EVM and TSW1400EVM to the personal
computer (PC) must be set up; Section 3.2 explains the USB driver installation.
ADS5294GUI: Section 3.1 explains the GUI installation procedure and its operation.
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Default Configuration
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Default Configuration
Figure 2. ADS5294EVM Basic Configuration
1. The ADS5294EVM basic configuration uses the onboard single-ended clock as the default option. See
Section 9.2 for the ADC clock, various-mode jumper settings.
2. P1: +5-V Power supplies the connector.
3. JP4, JP5, and JP6 are set to enable +3.3V Analog, +1.8VD Digital, and +1.8VA Analog to device,
4
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Software Installation and Operation
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respectively.
4. JP13: Enable onboard CMOS clock.
5. JP16, JP18, JP19, JP20: ADC clock source selection jumpers.
3
Software Installation and Operation
The ADS5294EVM comes with a software install. To Dowload the software, visit the ADS5294 product
folder under Tools & software .
3.1
GUI Installation – Mandatory
Once the zip folder is downloaded, run setup.exe to install the software. The software to use the
TSW1400EVM is called HSDCPro (High Speed Data Converter Pro). For information on how to download
this software, please see Appendix A.
3.2
USB Interface Driver Installation
•
•
•
•
Connect the USB port of EVM to your PC.
If the driver has not been installed, then the message Window Found New Hardware appears. The
Wizard as shown in the following illustration launches. Otherwise, skip Section 3.2 and go to Section 4.
Select No, not this time from the options. Press Next button
Select Install from a list or specific location (Advanced) as shown in the following illustration, and then
click Next.
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Test Setup
•
•
4
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Select Search for the best driver in these locations, and enter the file path for (C:\Program Files\Texas
Instruments\ADS 5294EVM\CDM 2.04.06 WHQL Certified) in the combo-box. or browse to it by
clicking the browse button. Once the file path has been entered in the box, click Next to proceed.
If Windows™ XP is configured to warn when unsigned (non-WHQL certified) drivers are about to be
installed, the following screen is displayed unless installing a Microsoft™ WHQL-certified Driver. Click
on Continue Anyway to continue with the installation. If Windows XP is configured to ignore file
signature warnings, no message appears.
Test Setup
To evaluate the ADS5294 device, a TSW1400EVM is required. Figure 3 shows the exact setup of these
two boards and external connectors.
• Connect +5-V supply at P1 connector or across TP_VP (+5V) and TP2 (GND).
• Connect USB cable from PC to USB1 on ADS5294EVM.
• Connect ADS5294EVM to TSW1400EVM using P10 connector.
• Connect USB cable from PC to USB port J8 of TSW1400EVM.
• Connect +6-V wall adapter to TSW1400EVM at J7 connector.
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Power Up ADS5294
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For the default configuration as shown in Figure 2, it is unnecessary to have an external sampling clock.
The onboard CMOS clock oscillator is used.
Figure 3. HW Setup With Connection Between TSW1400EVM and ADS5294EVM
5
Power Up ADS5294
After connecting the ADS5294EVM to the TSW1400 using the P10 connector, +6-V adapter to
TSW1400EVM, and +5 V (from the external power supply) to P1 connector, then power up is complete.
Three green LEDs and one orange LED turned on as shown in Figure 4 (also see Figure 13).
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Launch ADS5294 GUI
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Figure 4. Power-Up Indications
6
Launch ADS5294 GUI
After launching the ADS5294 GUI, the GUI appears as is shown in Figure 5. After the GUI is completely
launched, the window appears as is displayed in Figure 5. Select the Top Level tab to observe the default
condition. The bottom status bar indicates Ready for new command and green (highlighted). Click on
checkbox PD, and select it for power down to ensure proper software link to the hardware by observing
change in current reading (approximately 450 mA to 150 mA) of the external +5-V power supply. For the
rest of the test, PD must be unchecked. Click on Soft Reset button to reset device internally.
8
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Launch ADS5294 GUI
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Figure 5. ADS5294 GUI Launch
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Launch ADS5294 GUI
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After GUI launch and verification of software communication with EVM, click on button EN_2WIRE. This
configures the ADC output interface in 2-WIRE LVDS mode. Also click button ADC Bit Resolution to set
ADC in 14 Bits mode. Ensure that the MSB_LSB button status shows LSB_First.
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Launch TSW1400 GUI
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Launch TSW1400 GUI
Launch TSW1400 GUI. The Message window displays this message to indicate that the setup of the
TSW1400EVM and ADS5294EVM is working properly. If a different message or an error message
appears, contact TI FAE.
1. Select ADS5294_2W, 14bits, from the GUI.
2. ADC Sampling Rate (Fs) is fixed at 80 MHz; this is the onboard CMOS clock frequency.
3. ADC Input Frequency – enter 5M and the GUI calculates the real coherent frequency (Fc) to
4.99633789M.
Figure 6. TSW1400 GUI Launch
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TEST ADS5294
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TEST ADS5294
Step 1: Time Domain
• Select Time Domain page from TSW1400 GUI.
Figure 7. ADS5294 Time Domain Setup
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•
From ADS5294 GUI, go to Test Pattern page, then select RAMP PATTERN.
RAMP PATTERN
Figure 8. ADS5294 Test Pattern
•
•
•
•
Press Capture button on TSW1400 GUI. You observe a ramping waveform on the TSW1400 GUI
display area as shown in Figure 9.
Repeat for Channel 2...Channel 8.
If each channel has the output as shown in the following illustration, you can proceed with the
next step; otherwise, contact the TI FAE (Field Application Engineer) to troubleshoot the
problem.
On the ADS5294 GUI, change Test Pattern to None from RAMP PATTERN for next step.
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TEST ADS5294
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Figure 9. User Interface: Time Domain Format
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TEST ADS5294
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8.1
Step 2: Single Tone FFT
•
•
•
•
•
•
•
Select Single Tone FFT page at TSW1400 GUI.
Connect Channel 1 of ADS5294EVM to a signal generator through a BP filter. If no BP filter is
presented, the result is not good.
Set Amplitude of the signal generator to 10dBm
Set Frequency of the signal generator to 4.99633789M to match the GUI.
Change window option to Hanning. This is due to the fact that input signal and onboard CMOS clock
are noncoherent.
Press Capture button to get the test result.
Repeat for Channel 2...Channel 8.
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TEST ADS5294
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Figure 10. User Interface: Single FFT Format
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Board Configuration
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9
Board Configuration
9.1
Input/Output, Power Supply, and USB
USB1
J15
J14
JP4
J13
J12
JP5
JP6
J11
J10
J5
J7
J6
TP2
P1
J16
J8
J4
TP_VP
Figure 11. I/O, PWR, and USB Connector
Table 1. Input/Output, Power, and USB
Connector
Description
J6,J7,J10….J15
Analog Input signals for Ch1-Ch8. Connect to a signal generator. A band-pass filter must be applied between
the generator and the SMA to get a better result. (See Figure 3)
J16
It is an alternative input for channel 8. Need to install two resistors (R169 and R170) and remove two
resistors(R171 and R172) from J6.
P1/TP_VP
P1 is the +5-V power supply connector. TP_VP is the test point for +5-V power supply.
JP4
Onboard 3.3-V Analog enables. Set up as Figure 2 is a must to use onboard 3.3 V
JP5
Onboard 1.8-V Digital enables. Set up as Figure 2 is a must to use onboard 1.8 V
JP6
Onboard 1.8-V Analog enables. Set up as Figure 2 is a must to use onboard 1.8 V
TP1, TP2, TP3,
TP4, TP5, TP14,
TP21, TP23,
TP25, TP34,
Ground test points.
USB1
USB interface connector
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Board Configuration
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Table 2. Channel 8 Configuration
18
Input Interface Type
Connector
Through Transformer
(Default)
J6
Description
In default configuration, R171 and R172 are already populated
Through Amplifier (Not
Default)
J16
It is an alternative input for channel 8. Need to install two resistors (R169 and
R170) and remove two resistors(R171 and R172) from J6.It uses TI THS4509
single-ended to differential amplifier.
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9.2
ADC Clock
Five options are available for the source of the ADC clocks. Refer to Table 3 for details. In Figure 12,
ADS5294EVM uses an onboard, single-ended clock as the default option.
JP16
JP18
JP15
J5
JP17
JP20
JP13
JP19
J16
J8
J4
Figure 12. ADS5294EVM Default Clock Jumper Locations
Table 3. ADC Clock Various Mode Jumper Settings
Reference
Designator
Jumper Setting
Diagram
Onboard CMOS
Oscillator
JP13, JP19, JP20,
JP16, JP18
JP13 (1-2), JP20 (2-3), JP19 (1-2), JP16 (2-3),
JP18 (2-3)
Dia. 1
(Default Option)
External CMOS
Clock Generator
J8, JP19, JP20, JP16, JP20 (2-3), JP19 (2-3), JP16 (2-3), JP18 (2-3)
JP18
and Connect CMOS clock generator output at
SMA connector J8.
Clock Type
Single Ended
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Dia. 2
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Board Configuration
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Table 3. ADC Clock Various Mode Jumper Settings (continued)
Reference
Designator
Clock Type
Differential
Clock Signal
Jumper Setting
Diagram
Transformer Based
External
JP15, JP17, JP16,
JP18, J4
JP15 (1-2), JP16 (1-2),JP17 (1-2), JP18 (1-2),
and Connect external Clock source at SMA
connector J4
Dia. 3
Onboard Clock
Buffer
(CDCLVP1102,U4)
JP13, JP19, JP20,
JP15, JP17, JP16,
JP18
JP13 (1-2), JP20 (1-2), JP19 (1-2), JP15 (2-3),
JP17 (2-3), JP16 (1-2), JP18 (1-2).
Dia. 4
This configures the onboard CMOS oscillator
as clock input to buffer.
J8, JP19, JP20, JP15, JP19 (2-3), JP20 (1-2), JP15 (2-3), JP17 (2-3),
JP17, JP16, JP18
JP16 (1-2), JP18 (1-2) and Connect External
CMOS generator output at SMA connector J8.
Dia. 5
This configures the external CMOS source as
clock input to buffer.
Dia.1
Dia.2
Dia.4
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Dia.3
Dia.5
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9.3
Light-Emitting Diodes
LED33VA
LED18VA
LED18VD
LED_+5V
Figure 13. ADS5294EVM LED Location
Table 4. LED Indicators
Reference Designator
Power Supply
Color
LED_+5V
+5 V
Green
LED1.8VA
+1.8 VA
Green
LED1.8VD
+1.8 VD
Green
LED3.3VA
+3.3 VA
Orange
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Board Configuration
9.4
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Miscellaneous Test Points
TP_D1
JP12
JP14
TP_D0
TP_D2
TP_D7
TP22
TP6
Figure 14. ADS5294EVM Test Point Locations
Table 5. Miscellaneous Test Points
Reference Designator
22
Description
TP22
VCM: Common-mode output pin, 0.95-V output
TP6
CDC_VTH: Fixed voltage level (1.65 V)
TP_D0
SCLK: Serial clock input
TP_D1
SDA: Serial data input
TP_D2
SEN: Serial enable chip select
TP_D7
SDOUT: Serial data output
JP14
RESET: Install to reset the device (DUT1) manually
JP12
PD: Install to power down the device (DUT1) manually
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EVM Schematics
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EVM Schematics
Figure 15. Schematic, Sheet 1 of 9
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EVM Schematics
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Figure 16. Schematic, Sheet 2 of 9
Figure 17. Schematic, Sheet 3 of 9
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EVM Schematics
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Figure 18. Schematic, Sheet 4 of 9
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EVM Schematics
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Figure 19. Schematic, Sheet 5 of 9
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EVM Schematics
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Figure 20. Schematic, Sheet 6 of 9
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EVM Schematics
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Figure 21. Schematic, Sheet 7 of 9
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EVM Schematics
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Figure 22. Schematic, Sheet 8 of 9
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EVM Schematics
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Figure 23. Schematic, Sheet 9 of 9
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ADS5294EVM Bill of Materials
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ADS5294EVM Bill of Materials
Bill of Materials
QTY
MFR P/N
Description
Value
MFR
REF DES
1
ADS5294IPFP
14-Bit 8-Channel ADC
ADS5294
Texas
Instruments
DUT1
17
ADT4-1WT+
RF TRANSFORMER WIDEBAND, 2-775 MHz,
50 Ω
ADT4-1WT+
Mini-Circuits
T1–T17
1
CDCLVP1102RGT
TWO LVPECL OUTPUT CLOCK BUFFER
CDCLVP1102
Texas
Instruments
U4
2
CRCW06034R99FKEA
RES 4.99 Ω, 1/10 W, 1% 0603 SMD
4.99 Ω
Vishay/Dale
R37, R38
16
CRCW040210R0FKED
RES 10 Ω, 1/16,W, 1% 0402 SMD
10 Ω
Vishay/Dale
R45, R46, R51, R52, R57, R58,
R63, R64, R69, R70, R75, R76,
R81, R82, R87, R88
1
CRCW040249R9FKED
RES 49.9 Ω, 1/16,W, 1% 0402 SMD
49.9 Ω
Vishay/Dale
R34
2
CRCW060353R6FKEA
RES 53.6 Ω 1/10W 1% 0603 SMD
53.6 Ω
Vishay/Dale
R31, R40
1
CRCW06030000Z0EA
RES 0 Ω 1/10W 0603 SMD
0Ω
Vishay/Dale
R36
2
CRCW0603487RFKEA
RES 487 Ω 1/10W 1% 0603 SMD
487 Ω
Vishay/Dale
R32, R35
4
CRCW0402100RFKED
RES 100 Ω 1/16W 1% 0402 SMD
100 Ω
Vishay/Dale
R3, R4, R21, R22
3
CRCW04021K00FKED
RES 1K Ω 1/16W 1% 0402 SMD
1 kΩ
Vishay/Dale
R2, R12, R168
2
CRCW0402499RFKED
RES 499 Ω 1/16W 1% 0402 SMD
499 Ω
Vishay/Dale
R33, R164
3
CRCW080510K0FKEA
RES 10K Ω 1/8W 1% 0805 SMD
10K Ω
Vishay/Dale
R11, R13, R14
7
C0402C104K8PACTU
CAP 0.10UF 10V CERAMIC X5R 0402
0.1 µF
Kemet
C36, C37, C40, C41, C44, C45,
C48
1
ECJ-0EB1H102K
CAPACITOR, SMT, 0402, CER, 1000pF, 50V,
10%, X7R
1000 pF
Panasonic
C55
4
ECJ-0EB1H122K
CAPACITOR, SMT, 0402, CER, 1200pF, 50V,
10%, X7R
1200 pF
Panasonic
C71, C72, C75, C76
2
ECJ-0EB1E181K
CAP 180PF 25V CERAMIC X7R 0402
180 pF
Panasonic
C73, C74
2
ECJ-0EC1H390J
CAP 39PF 50V CERAMIC 0402 SMD
39 PF
Panasonic
C29, C30
5
ECJ-1V41E105M
CAP 1UF 25V CERAMIC 0603 X5S
1 µF
Panasonic - ECG C26, C31, C52, C68, C70
1
ECS-3953M-800-BN
OSC, SMT, 3.3V, 50ppm, -40~85°C, 5nS, 80.000
MHz
OSC 80 MHz
ECS Inc
U3
4
ELJ-RE33NGFA
INDUCTOR 33NH 2% 0603 SMD
33NH
Panasonic
L1–L4
2
ERJ-2GEJ131
RESISTOR, SMT, 0402, THICK FILM, 5%,
1/16W, 130
130 Ω
Panasonic
R27, R29
2
ERJ-2GEJ820
RESISTOR, SMT, 0402, THICK FILM, 5%,
1/16W, 82
82 Ω
Panasonic
R28, R30
27
ERJ-2GE0R00X
RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,
1/16W
0Ω
Panasonic
R5–R8, R10, R47, R48, R53,
R54, R59, R60, R65, R66, R71,
R72, R77, R78, R83, R84, R89,
R90, R93, R166, R167,
R171–R173
16
ERJ-2RKF24R9X
RESISTOR, SMT, 0402, 24.9 Ω, 1%, 1/16W
24.9 Ω
Panasonic
R43, R44, R49, R50, R55, R56,
R61, R62, R67, R68, R73, R74,
R79, R80, R85, R86
2
ERJ-2RKF49R9X
RESISTOR, SMT, 0402, 49.9 Ω, 1%, 1/16W
49.9 Ω
Panasonic
R1, R20
3
ERJ-2RKF1000X
RESISTOR, SMT, 0402, 100 Ω, 1%, 1/10W
100 Ω
Panasonic
R15, R16, R18
1
ERJ-2RKF3320X
RESISTOR, SMT, 0402, 332 Ω, 1%, 1/16W
332 Ω
Panasonic
R17
1
FT245RL
USB FIFO IC INCORPORATE FTDICHIP-ID
SECURITY DONGLE
USB
FTDI
U10
9
GRM1555C1H3R3CZ01D
CAP CER 3.3PF 50V C0G 0402
3.3 pF
Murata
C77, C85, C92, C99, C106,
C113, C120, C127, C134
8
HI0805R800R-10
FERRITE CHIP POWER 80 Ω SMD
FERRITE
Laird-Signal
Integrity
Products
FB1–FB8
2
ISO7240MDW
QUAD DIGITAL ISOLATORS
IC DGTL ISOL
Texas
Instruments
U9, U11
3
JMK107BJ106MA-T
CAPACITOR, SMT, 0603, CERAMIC, 10µF,
6.3V, 20%, X5R
10 µF
Taiyo Yuden
C33, C51, C54
10
JUMPER-0603(UN)
UNINSTALLED JUMPER, SMT0603
DNI
SLAU355A – July 2011 – Revised March 2015
Submit Documentation Feedback
TP8–TP11, TP15–TP20
ADS5294, 8-Channel, Analog-to-Digital Converter Evaluation Module
Copyright © 2011–2015, Texas Instruments Incorporated
31
ADS5294EVM Bill of Materials
www.ti.com
Bill of Materials (continued)
QTY
MFR P/N
Description
Value
MFR
REF DES
3
LNJ308G8PRA
LED, SMT, 0603, PURE GREEN, 2.03V
LED
Panasonic
LED18VA, LED18VD,
LED_+5V
1
LNJ808R8ERA
LED, SMT, 0603, ORANGE, 1.8V
LED
Panasonic
LED33VA
1
897-43-005-00-100001
CONN RECEPT MINI-USB TYPE B SMT
USB Mini B
Mill-Max
USB1
1
QTH-060-01-L-D-A
HEADER, SMT, 120P, 0.5mm, FEM, 2BANK,
RECEPTACLE, 168/198H
CONN
Samtec Inc
P10
2
TEST POINT YELLOW
NOT INSTALLED
DNI
1
THS4509QRGTRQ1
WIDEBAND, LOW NOISE, LOW DISTORTION
FULLY DIFF AMP, 1900 MHz
IC OPAMP
Texas
Instruments
U12
9
TPSC226K016R0375
10%, 16V, 22µF
22 µF
AVX
C35, C38, C39, C4, C43, C46,
C47, C78, C79
2
TPS79618DCQR
ULTRALOW-NOISE HI PSRR FAST RF 1-A LDO LDO REG
LINEAR REGULATOR, 1.8V
Texas
Instruments
U6, U7
1
TPS79633DCQR
ULTRALOW-NOISE HI PSRR FAST RF 1-A LDO LDO REG
LINEAR
Texas
Instruments
U8
1
1SMB5921BT3G
DIODE ZENER 6.8V 3W SMB
DIODE Zener
ON
Semiconductor
Z1
TP22, TP35
5
9-146285-0-02
CONN HEADR BRKWAY 0.100 02POS STR
CONN Header
TE Connectivity
JP10–JP14
10
9-146285-0-03
CONN HEADR BRKWAY 0.100 03POS STR
CONN Header
TE Connectivity
JP4–JP6, JP15–JP21
12
901-144-8
SMA COAX STRAIGHT PCB CURRENT P/N IS
901-144-8RFX
SMA
Amphenol
J4–J8, J10–J16
76
0402YD104KAT2A
CAP CERM 0.1µF 10% 16V X5R 0402
0.1 µF
AVX
C1–C8, C13 C14, C17, C25,
C27, C28, C32, C34, C53,
C56–C58, C6, C63, C65–C67,
C69, C81–C84, C86–C91,
C93–C98, C100–C105,
C107–C112, C114–C119,
121–C126, C128–C133,
C135–C138
1
5000
TESTPOINT, THU, MINIATURE, 0.1LS, 120TL,
RED
Test Point,Red
Keystone
Electronics
TP_VP
9
5001
TESTPOINT, THU, MINIATURE, 0.1LS, 120TL,
BLACK
Test
Point,Black
Keystone
Electronics
TP1–TP5, TP14, TP21, TP23,
TP25
5
5002
TESTPOINT, THU, MINIATURE, 0.1LS, 120TL,
WHITE
Test
Point,White
Keystone
Electronics
TP6, TP_D0-TP_D2, TP_D7
1
5003
TESTPOINT, THU, MINIATURE, 0.1LS, 120TL,
ORANGE
Test
Point,Orange
Keystone
Electronics
TP34
1
39357-0002
HEADER, THRU, POWER, 2P, 3.5MM,
EUROSTYLE
CONN
TERMINAL
Molex Connector
Corp
P1
2
RESISTOR (DNI)
NOT INSTALLED
DNI
4
24436
STANDOFF HEX M3 THR ALUM 18MM
STANDOFF
Keystone
STANDOFF HEX M3 THR
ALUM 18MM
4
29311
SCREW STEEL M3 THR 6MM
SCREW
Keystone
SCREW STEEL M3 THR 6MM
32
ADS5294, 8-Channel, Analog-to-Digital Converter Evaluation Module
Copyright © 2011–2015, Texas Instruments Incorporated
R169, R170
SLAU355A – July 2011 – Revised March 2015
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ADS5294EVM Printed-Circuit Board Layout
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ADS5294EVM Printed-Circuit Board Layout
P10
1
ADS529 EVM
REV. C
R5
R11
R7
2
TP25
GND
C33
PD
R12 JP14
L2
L1
R3
C75
R166
C73
TP10
TP8
L4
L3
R4
C76
R167
TP11
C74
TP9
C67
C72
R38
R35
GND
JP21
+2.5V
C95
C96
+1.8VA
AVDD
GND
S/E
C89
T5
GND
CH2
J11
TP16
C138
R93
R48
R46
JP13
C53
CH1
C82
R45
R47
R30
U4
C17
TP20
TP18
C86
C63
R29
JP17
R43
R44
TP19
C51
TP17
T3
J7
T1
TP2
TP15
GND
C52
C54
C56
C55
XTAL
SMA
R20
EDGE NUMBER: 6527886
GND P1
U3
J8
J4
TP5
EXT
CLK
B
TP4
C88
C
C90
DIFF
DIFF
C62
R50
R2
A
T6
C87
9
87
JP20
R
C135
R85
C132
R37
U12
R164
C65
-2.5V
C70
FB7
FB6
BUFF
S/E
J13
LED18VA
TP6
XFMR
BUFF
R28
JP19
C71
R31
C69
R33
R32
GND
TP21
+1.65V
BUFF
R1
6
C130
R90
R89
T9
C97
R
56
R88 R172
R27
JP15
C77
R34
R40
C66
S/E
R79
C128
R86
C134
C131
C136
XFMR
REFT
TP1
J16
JP18
JP16
JP10
R54
R52
8
C125
TP22
VCM
REFM
GND
CH8
AUX
TP35
R83
R81
R170
R171
J6
R51
R53
NC
C57
R8
0
R82
R84
JP11
T4
C101
C83
C120
C122
R74
C118
C117
C116
C124
C127
J5
T2
C100
JP6
16
TP3
C
CH3
T10
R58
JP5
C123
C129
SYNC
GND
A
R60
R
T7
CH8
T8
5
R5
LED18VD
R57
R59
73
A
C99
DUT1
R76
R78
R77
R75
GND
LVDD
+1.8D
J12
J10
C121
T11
GND
R
T12
CH7
J15
LED33VA
JP4
TP14
C
C108
+3.3V
GND
CH6
T15
C104
R64
R69
R
62
R67
C113
T14
C92
R49
C93
CH5
C114
C110
C111
T16
71
C109
R
R63
R65
R66
T13
C103
R70
R72
C106
C115
R68
J14
C112
C102
CH4
RESET
JP12
SCLK
R61
C107
SDOUT
SDA
TP_D7
TP_D1
TP_D2
TP23
C94
TP34
GND
GND
Z1
C48
EXT
CLK
A
S/N:
+5V
C47
+
GNDTP_D0
SEN
FB8
C31
C32
C81
USB1
R8
C25
LED_+5V
TP_VP
+5V
A
C26
C
12
Figure 24. ADS5294EVM Top Layer Assembly Drawing – Top View
SLAU355A – July 2011 – Revised March 2015
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ADS5294, 8-Channel, Analog-to-Digital Converter Evaluation Module
Copyright © 2011–2015, Texas Instruments Incorporated
33
ADS5294EVM Printed-Circuit Board Layout
www.ti.com
C137
R14
U9
U10
R10
C27
C34
C28
C30
U11
C29
R13
R6
JP12
JP14
J15
J14
C45
+
R17
U8
C46
JP4
FB3
+
C43
C44
J13
C37
U6
C40
+
R15
C38
C8
C7
C6
C5
C1
C4
C3
C2
JP6
J12
FB2
+
C39
JP5
U7
R16
+
FB1
C35
C42
C36
C41
R1
JP18
TP35
J11
+
TP22
JP16
J10
C13
R36
JP10
R173
R21
R22
C58
C14
J5
JP11
JP15
JP17
J7
T17
J6
JP20
JP13
JP19
J8
J16
C78
+
J4
C79
+
R18
FB4
FB5
JP21
Figure 25. ADS5294EVM Bottom Layer Assembly Drawing – Bottom View
34
ADS5294, 8-Channel, Analog-to-Digital Converter Evaluation Module
Copyright © 2011–2015, Texas Instruments Incorporated
SLAU355A – July 2011 – Revised March 2015
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ADS5294EVM Printed-Circuit Board Layout
www.ti.com
Figure 26. ADS5294EVM Top Layer Copper – Top View
SLAU355A – July 2011 – Revised March 2015
Submit Documentation Feedback
ADS5294, 8-Channel, Analog-to-Digital Converter Evaluation Module
Copyright © 2011–2015, Texas Instruments Incorporated
35
ADS5294EVM Printed-Circuit Board Layout
www.ti.com
Figure 27. ADS5294EVM Internal Layer 1, Ground – Top View
36
ADS5294, 8-Channel, Analog-to-Digital Converter Evaluation Module
Copyright © 2011–2015, Texas Instruments Incorporated
SLAU355A – July 2011 – Revised March 2015
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ADS5294EVM Printed-Circuit Board Layout
www.ti.com
Figure 28. ADS5294EVM Internal Layer 2, Power – Top View
SLAU355A – July 2011 – Revised March 2015
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ADS5294, 8-Channel, Analog-to-Digital Converter Evaluation Module
Copyright © 2011–2015, Texas Instruments Incorporated
37
ADS5294EVM Printed-Circuit Board Layout
www.ti.com
Figure 29. ADS5294EVM Internal Layer 3, Power – Top View
38
ADS5294, 8-Channel, Analog-to-Digital Converter Evaluation Module
Copyright © 2011–2015, Texas Instruments Incorporated
SLAU355A – July 2011 – Revised March 2015
Submit Documentation Feedback
ADS5294EVM Printed-Circuit Board Layout
www.ti.com
Figure 30. ADS5294EVM Internal Layer 4, Ground – Top View
SLAU355A – July 2011 – Revised March 2015
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ADS5294, 8-Channel, Analog-to-Digital Converter Evaluation Module
Copyright © 2011–2015, Texas Instruments Incorporated
39
ADS5294EVM Printed-Circuit Board Layout
www.ti.com
Figure 31. ADS5294EVM Bottom Layer Copper – Top View
40
ADS5294, 8-Channel, Analog-to-Digital Converter Evaluation Module
Copyright © 2011–2015, Texas Instruments Incorporated
SLAU355A – July 2011 – Revised March 2015
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Appendix A
SLAU355A – July 2011 – Revised March 2015
High Speed Data Converter Pro (HSDCPro) GUI
Installation
Download the HSDCPro GUI Installer using this link: HSDCPro GUI
• Unzip the saved folder and run the installer executable to obtain the pop-up shown in Figure 32.
• Click the Install button.
Figure 32. HSDCPro Install (Begin)
•
Leave the destination directories as the default location, for the TSW1400GUI installation and press
the NEXT button as shown in Figure 33.
SLAU355A – July 2011 – Revised March 2015
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High Speed Data Converter Pro (HSDCPro) GUI Installation
Copyright © 2011–2015, Texas Instruments Incorporated
41
Appendix A
www.ti.com
Figure 33. HSDCPro Install (Install Directory)
•
42
Read the License Agreement from Texas Instruments and select I accept the License Agreement and
press the Next button as shown in Figure 34.
High Speed Data Converter Pro (HSDCPro) GUI Installation
Copyright © 2011–2015, Texas Instruments Incorporated
SLAU355A – July 2011 – Revised March 2015
Submit Documentation Feedback
Appendix A
www.ti.com
Figure 34. HSDCPro Install (TI License Agreement)
•
Read the License Agreement from National Instruments and select I accept the License Agreement
and press the Next button as shown in Figure 35.
SLAU355A – July 2011 – Revised March 2015
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High Speed Data Converter Pro (HSDCPro) GUI Installation
Copyright © 2011–2015, Texas Instruments Incorporated
43
Appendix A
www.ti.com
Figure 35. HSDCPro Install (NI License Agreement)
•
44
Press the Next button as shown in Figure 36.
High Speed Data Converter Pro (HSDCPro) GUI Installation
Copyright © 2011–2015, Texas Instruments Incorporated
SLAU355A – July 2011 – Revised March 2015
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Appendix A
www.ti.com
Figure 36. HSDCPro Install (Start Installation)
•
The window shown in Figure 37 should appear indicating that the installation is in progress.
SLAU355A – July 2011 – Revised March 2015
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High Speed Data Converter Pro (HSDCPro) GUI Installation
Copyright © 2011–2015, Texas Instruments Incorporated
45
Appendix A
www.ti.com
Figure 37. HSDCPro Install (Installation Progress)
•
46
The window shown in Figure 38 appears indicating Installation Complete. Press the Next button.
High Speed Data Converter Pro (HSDCPro) GUI Installation
Copyright © 2011–2015, Texas Instruments Incorporated
SLAU355A – July 2011 – Revised March 2015
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Appendix A
www.ti.com
Figure 38. HSDCPro Install (Installation Complete)
•
The window shown in Figure 39 appears briefly to complete the process.
SLAU355A – July 2011 – Revised March 2015
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High Speed Data Converter Pro (HSDCPro) GUI Installation
Copyright © 2011–2015, Texas Instruments Incorporated
47
Appendix A
www.ti.com
Figure 39. HSDCPro Install (h)
•
As shown in Figure 40 a restart might be requested depending on whether or not the PC already had
the National Instruments MCR Installer. If requested, hit the Restart button to complete the installation.
Figure 40. HSDCPro Install
48
High Speed Data Converter Pro (HSDCPro) GUI Installation
Copyright © 2011–2015, Texas Instruments Incorporated
SLAU355A – July 2011 – Revised March 2015
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Revision History
www.ti.com
Revision History
Changes from Original (July 2011) to A Revision ........................................................................................................... Page
•
Added Appendix A: High Speed Data Converter Pro (HSDCPro) GUI Installation.
............................................
41
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
SLAU355A – July 2011 – Revised March 2015
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Revision History
Copyright © 2011–2015, Texas Instruments Incorporated
49
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan are NOT certified by
TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
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