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ADS
782
0
ADS7820
782 0
ADS
12-Bit 10µs Sampling CMOS ANALOG-to-DIGITAL CONVERTER
FEATURES
q 100kHz min SAMPLING RATE q 0 to +5V INPUT RANGE q 72dB min SINAD WITH 45kHz INPUT q ±1/2 LSB max INL AND DNL q SINGLE +5V SUPPLY OPERATION q PIN-COMPATIBLE WITH 16-BIT ADS7821 q USES INTERNAL OR EXTERNAL REFERENCE q COMPLETE WITH S/H, REF, CLOCK, ETC. q FULL PARALLEL DATA OUTPUT q 100mW max POWER DISSIPATION q 28-PIN 0.3" PLASTIC DIP AND SOIC
DESCRIPTION
The ADS7820 is a complete 12-bit sampling A/D using state-of-the-art CMOS structures. It contains a complete 12-bit, capacitor-based SAR A/D with S/H, reference, clock, interface for microprocessor use, and three-state output drivers. The ADS7820 is specified at a 100kHz sampling rate, and guaranteed over the full temperature range. Lasertrimmed scaling resistors provide a 0 to +5V input range, with power dissipation under 100mW. The 28-pin ADS7820 is available in a plastic 0.3" DIP and in an SOIC, both fully specified for operation over the industrial –40°C to +85°C range.
Clock
Successive Approximation Register and Control Logic
R/C CS BYTE BUSY
CDAC 5kΩ 0 to +5V Input 6.66kΩ 20kΩ Comparator CAP Buffer 4kΩ REF Internal +2.5V Ref Output Latches and Three State Drivers Three State Parallel Data Bus
International Airport Industrial Park • Mailing Address: PO Box 11400 • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Tel: (520) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
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©
1996 Burr-Brown Corporation
1 PDS-1322
Printed in U.S.A. ADS7820 June, 1996
SPECIFICATIONS
ELECTRICAL
TA = –40°C to +85 °C, fS = 100kHz, VDIG = VANA = +5V, using internal reference, unless otherwise specified. ADS7820P/U PARAMETER RESOLUTION ANALOG INPUT Voltage Ranges Impedance Capacitance THROUGHPUT SPEED Conversion Time Complete Cycle Throughput Rate DC ACCURACY Integral Linearity Error Differential Linearity Error No Missing Codes Transition Noise(2) Full Scale Error(3,4) Full Scale Error Drift Full Scale Error(3,4) Full Scale Error Drift Offset Error Offset Error Drift Power Supply Sensitivity (VDIG = VANA = VD) AC ACCURACY Spurious-Free Dynamic Range Total Harmonic Distortion Signal-to-(Noise+Distortion) Signal-to-Noise Full-Power Bandwidth(6) SAMPLING DYNAMICS Aperture Delay Transient Response Overvoltage Recovery(7) REFERENCE Internal Reference Voltage Internal Reference Source Current (Must use external buffer.) External Reference Voltage Range for Specified Linearity External Reference Current Drain DIGITAL INPUTS Logic Levels VIL VIH IIL IIH DIGITAL OUTPUTS Data Format Data Coding VOL VOH Leakage Current Output Capacitance DIGITAL TIMING Bus Access Time Bus Relinquish Time CONDITIONS MIN TYP MAX 12 D D D 8 10 D ±1.0 ±1.0 Guaranteed 0.1 ±7 Ext. 2.5000V Ref Ext. 2.5000V Ref ±2 ±2 +4.75V < VD < +5.25V ±0.5 ±0.5 ±8 D ±0.75 ±0.5 ±5 D ±4 D D ±0.25 ±0.25 ±0.5 ±0.5 D D D MIN ADS7820PB/UB TYP MAX D UNITS Bits
0 to +5 10 35 5.7 Acquire and Convert 100
V kΩ pF µs µs kHz LSB(1) LSB Bits LSB % ppm/°C % ppm/°C mV ppm/°C LSB
fIN = fIN = fIN = fIN =
45kHz 45kHz 45kHz 45kHz
80 –80 70 70 250 40
D D 72 72 D D 2 150 D 2.52 D D D D D D
dB(5) dB dB dB kHz ns µs ns V µA V µA
FS Step
2.48
2.5 1 2.5
2.3 Ext. 2.5000V Ref
2.7 100
D
D D
–0.3 +2.0
+0.8 VD +0.3V ±10 ±10
D D
D D D D
V V µA µA
ISINK = 1.6mA ISOURCE = 500µA High-Z State, VOUT = 0V to VDIG High-Z State
+4
Parallel 12 bits Straight Binary +0.4 D ±5 15
D D D D D
V V µA pF
83 83
ns ns
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
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ADS7820
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SPECIFICATIONS (CONT)
ELECTRICAL
TA = –40°C to +85 °C, fS = 100kHz, VDIG = VANA = +5V, using internal reference, unless otherwise specified. ADS7820P/U PARAMETER POWER SUPPLIES Specified Performance VDIG VANA +IDIG +IANA Power Dissipation TEMPERATURE RANGE Specified Performance Derated Performance Storage Thermal Resistance (θJA) Plastic DIP SOIC CONDITIONS MIN TYP MAX MIN ADS7820PB/UB TYP MAX UNITS
Must be ≤ VANA
+4.75 +4.75
+5 +5 0.3 16
+5.25 +5.25
D D
D D D D
D D
V V mA mA mW °C °C °C °C/W °C/W
f S = 100kHz –40 –55 –65 75 75
100 +85 +125 +150 D D D D D
D D D D
NOTES: (1) LSB means Least Significant Bit. For the 12-bit, 0 to +5V input ADS7820, one LSB is 1.22mV. (2) Typical rms noise at worst case transitions and temperatures. (3) Adjustable to zero with external potentiometer as shown in Figure 4b. (4) Full scale error is the worst case of Full Scale untrimmed deviation from ideal last code transition divided by the transition voltage and includes the effect of offset error. (5) All specifications in dB are referred to a full-scale input. (6) FullPower Bandwidth defined as Full-Scale input frequency at which Signal-to-(Noise + Distortion) degrades to 60dB, or 10 bits of accuracy. (7) Recovers to specified performance after 2 x FS input overvoltage.
ABSOLUTE MAXIMUM RATINGS
Analog Inputs: VIN .................................................... –0.7V to +VANA +0.3V REF .................................... +VANA +0.3V to AGND2 –0.3V CAP ........................................... Indefinite Short to AGND2 Momentary Short to VANA Ground Voltage Differences: DGND, AGND1, AGND2 ................... ±0.3V VANA ....................................................................................................... 7V VDIG to VANA ..................................................................................... +0.3V VDIG ....................................................................................................... 7V Digital Inputs ............................................................ –0.3V to +VDIG +0.3V Maximum Junction Temperature ................................................... +165°C Internal Power Dissipation ............................................................. 825mW Lead Temperature (soldering, 10s) ................................................ +300°C
ELECTROSTATIC DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from performance degradation to complete device failure. BurrBrown Corporation recommends that all integrated circuits be handled and stored using appropriate ESD protection methods. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet published specifications.
PACKAGE INFORMATION
PRODUCT ADS7820P ADS7820PB ADS7820U ADS7820UB PACKAGE Plastic DIP Plastic DIP SOIC SOIC PACKAGE DRAWING NUMBER(1) 246 246 217 217
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix D of Burr-Brown IC Data Book.
ORDERING INFORMATION
MINIMUM SIGNAL-TO(NOISE + DISTORTION) RATIO (dB) 70 72 70 72
PRODUCT ADS7820P ADS7820PB ADS7820U ADS7820UB
MAXIMUM LINEARITY ERROR (LSB) ±1.0 ±0.5 ±1.0 ±0.5
SPECIFICATION TEMPERATURE RANGE –40°C –40°C –40°C –40°C to to to to +85°C +85°C +85°C +85°C
PACKAGE Plastic DIP Plastic DIP SOIC SOIC
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ADS7820
PIN CONFIGURATION
VIN AGND1 REF CAP AGND2 D11 (MSB) D10 D9 D8 1 2 3 4 5 6 7 ADS7820 8 9 21 DZ 20 DZ 19 DZ 18 D0 (LSB) 17 D1 16 D2 15 D3 28 VDIG 27 VANA 26 BUSY 25 CS 24 R/C 23 BYTE 22 DZ
D7 10 D6 11 D5 12 D4 13 DGND 14
PIN ASSIGNMENTS
PIN # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 NAME VIN AGND1 REF CAP AGND2 D11 (MSB) D10 D9 D8 D7 D6 D5 D4 DGND D3 D2 D1 D0 (LSB) DZ DZ DZ DZ BYTE DESCRIPTION Analog Input. Full-scale input range is 0 to +5V. Analog Ground. Used internally as ground reference point. Reference Input/Output. Outputs internal reference of +2.5V nominal. Can also be driven by external system reference. In both cases, connect to ground with a 2.2µF Tantalum capacitor. Reference Buffer Capacitor. 2.2µF Tantalum to ground. Analog Ground. Data Bit 11. Most Significant Bit (MSB) of conversion results. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Bit 10. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Bit 9. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Bit 8. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Bit 7. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Bit 6. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Bit 5. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Bit 4. Hi-Z state when CS is HIGH, or when R/C is LOW. Digital Ground. Data Bit 3. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Bit 2. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Bit 1. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Bit 0. Lease Significant Bit (LSB) of conversion results. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Zero. LOW when CS LOW and R/C HIGH. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Zero. LOW when CS LOW and R/C HIGH. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Zero. LOW when CS LOW and R/C HIGH. Hi-Z state when CS is HIGH, or when R/C is LOW. Data Zero. LOW when CS LOW and R/C HIGH. Hi-Z state when CS is HIGH, or when R/C is LOW. Byte Select. With BYTE LOW, data will be output as indicated above, causing pin 6 (D11) to output the MSB, and pin 18 (D0) to output the LSB. Pins 19 to 22 will output LOWs. With BYTE HIGH, the top and bottom 8 bits of data will be switched, so that pin 6 outputs data bit 3, pin 9 outputs data bit 0 (LSB), pin 10 to 13 output LOWs, pin 15 outputs data bit 11 (MSB) and pin 22 outputs data bit 4. Read/Convert input. With CS LOW, a falling edge on R/C puts the internal sample/hold into the hold state and starts a conversion. With CS LOW, a rising edge on R/C enables the output data bits. Chip Select. Internally OR’d with R/C. With R/C LOW, a falling edge on CS will initiate a conversion. With R/C HIGH, a falling edge on CS will enable the output data bits. Busy Output. Falls when a conversion is started, and remains LOW until the conversion is completed and the data is latched into the output register. With CS LOW and R/C HIGH, output data will be valid when BUSY rises, so that the rising edge can be used to latch the data. CS or R/C must be high when BUSY rises, or another conversion will start, without time for signal acquisition. Analog Supply Input. Nominally +5V. Connect directly to pin 28. Decouple to ground with 0.1µF ceramic and 10µF Tantalum capacitors. Digital Supply Input. Nominally +5V. Connect directly to pin 27. Must be ≤ VANA.
24 25 26
R/C CS BUSY
27 28
VANA VDIG
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TYPICAL PERFORMANCE CURVES
At TA = –40°C to +85°C, fS = 100kHz, VDIG = VANA = +5V, using internal reference, unless otherwise specified.
INTERNAL REFERENCE VOLTAGE vs TEMPERATURE 2.52 2.515
Internal Reference (V)
CONVERSION TIME vs TEMPERATURE 6.2 6.1
Conversion Time (µs)
2.51 2.505 2.5 2.495 2.49 2.485 2.48 –40 –15 10 35 60 85 Temperature (°C)
6 5.9 5.8 5.7 5.6 5.5 5.4 –40 –15 10 35 60 85 Temperature (°C)
ADS7820 AT +25°C Min/Max INL Errors –0.051 at 03962 0.086 at 02048 0.2 +0.1 0 –0.1 –0.2 0.2 +0.1 0 –0.1 –0.2
ADS7820 AT +25°C Min/Max DNL Errors –0.073 at 00512 0.087 at 02047
12-Bit LSBs
0
512
1024
1536
2048
2560
3072
3584
4096
12-Bit LSBs
0
512
1024
1536
2048
2560
3072
3584
4096
Decimal Code
Decimal Code
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ADS7820
BASIC OPERATION
Figure 1 shows a basic circuit to operate the ADS7820 with a full parallel data output. Taking R/C (pin 24) LOW for a minimum of 40ns (5.4µs max) will initiate a conversion. BUSY (pin 26) will go LOW and stay LOW until the conversion is completed and the output registers are updated. Data will be output in Straight Binary with the MSB on pin 6. BUSY going HIGH can be used to latch the data. All convert commands will be ignored while BUSY is LOW. The ADS7820 will begin tracking the input signal at the end of the conversion. Allowing 10µs between convert commands assures accurate acquisition of a new signal.
CS and R/C are internally OR’d and level triggered. There is not a requirement which input goes LOW first when initiating a conversion. If, however, it is critical that CS or R/C initiates conversion ‘n’, be sure the less critical input is LOW at least 10ns prior to the initiating input. To reduce the number of control pins, CS can be tied LOW using R/C to control the read and convert modes. However, the output will become active whenever R/C goes HIGH. Refer to the Reading Data section.
CS 1 ↓ 0 0 ↓ ↓ 0 0
R/C X 0 ↓ 1 1 1 ↑ 0
BUSY X 1 1 ↑ 1 0 0 ↑
OPERATION None. Databus is in Hi-Z state. Initiates conversion “n”. Databus remains in Hi-Z state. Initiates conversion “n”. Databus enters Hi-Z state. Conversion “n” completed. Valid data from conversion “n” on the databus. Enables databus with valid data from conversion “n”. Enables databus with valid data from conversion “n-1”(1). Conversion n in process. Enables databus with valid data from conversion “n-1”(1). Conversion “n” in process. New conversion initiated without acquisition of a new signal. Data will be invalid. CS and/or R/C must be HIGH when BUSY goes HIGH. New convert commands ignored. Conversion “n” in process.
STARTING A CONVERSION
The combination of CS (pin 25) and R/C (pin 24) LOW for a minimum of 40ns immediately puts the sample/hold of the ADS7820 in the hold state and starts conversion ‘n’. BUSY (pin 26) will go LOW and stay LOW until conversion ‘n’ is completed and the internal output register has been updated. All new convert commands during BUSY LOW will be ignored. CS and/or R/C must go HIGH before BUSY goes HIGH or a new conversion will be initiated without sufficient time to acquire a new signal. The ADS7820 will begin tracking the input signal at the end of the conversion. Allowing 10µs between convert commands assures accurate acquisition of a new signal. Refer to Table I for a summary of CS, R/C, and BUSY states and Figures 3 through 5 for timing diagrams.
X
X
0
NOTE: (1) See Figures 2 and 3 for constraints on data valid from conversion “n-1”.
Table I. Control Line Functions for “Read” and “Convert”.
0 to +5V 2.2µF
1 2 + + 3 4 5
28 27 26 25 24 23 22 ADS7820 21 20 19 18 17 16 15 LOW LOW LOW LOW B0 (LSB) B1 B2 B3 40ns min 5.4µs max Convert Pulse + 0.1µF + +5V 10µF
2.2µF
B11 (MSB) B10 B9 B8 B7 B6 B5 B4
6 7 8 9 10 11 12 13 14
FIGURE 1. Basic Operation (Byte Low).
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READING DATA
The ADS7820 outputs full or byte-reading parallel data in Straight Binary data output format. The parallel output will be active when R/C (pin 24) is HIGH and CS (pin 25) is LOW. Any other combination of CS and R/C will tri-state the parallel output. Valid conversion data can be read in a full parallel, 12-bit word or two 8-bit bytes on pins 6-13 and pins 15-22. BYTE (pin 23) can be toggled to read both bytes within one conversion cycle. Refer to Table II for ideal output codes and Figure 2 for bit locations relative to the state of BYTE.
DIGITAL OUTPUT STRAIGHT BINARY DESCRIPTION Full Scale Range Least Significant Bit (LSB) Full Scale Midscale One LSB below Midscale Zero Scale ANALOG INPUT 0 to +5V 1.22mV 4.99878V 2.5V 2.49878V 0V 1111 1111 1111 1000 0000 0000 0111 1111 1111 0000 0000 0000 FFF 800 7FF 0 BINARY CODE HEX CODE
PARALLEL OUTPUT (During a Conversion) After conversion ‘n’ has been initiated, valid data from conversion ‘n-1’ can be read and will be valid up to 16µs after the start of conversion ‘n’. Do not attempt to read data from 16µs after the start of conversion ‘n’ until BUSY (pin 26) goes HIGH; this may result in reading invalid data. Refer to Table III and Figures 3 and 5 for timing specifications. Note! For the best possible performance, data should not be read during a conversion. The switching noise of the asynchronous data transfer can cause digital feedthrough degrading the converter’s performance. The number of control lines can be reduced by tieing CS LOW while using R/C to initiate conversions and activate the output mode of the converter. See Figure 3.
SYMBOL t1 t2 t3 t4 t5 t6 t7
DESCRIPTION Convert Pulse Width Data Valid Delay after R/C LOW BUSY Delay from R/C LOW BUSY LOW BUSY Delay after End of Conversion Aperture Delay Conversion Time Acquisition Time Bus Relinquish Time BUSY Delay after Data Valid Previous Data Valid after R/C LOW Throughput Time R/C to CS Setup Time Time Between Conversions Bus Access Time and BYTE Delay
MIN TYP MAX UNITS 40 5400 8 65 8 220 40 7.6 8 2 10 50 35 200 7.4 9 10 10 10 83 10 83 ns µs ns µs ns ns µs µs ns ns µs µs ns µs ns
Table II. Ideal Input Voltages and Output Codes.
PARALLEL OUTPUT (After a Conversion) After conversion ‘n’ is completed and the output registers have been updated, BUSY (pin 26) will go HIGH. Valid data from conversion ‘n’ will be available on D11-D0 (pin 6-13 and 15-18 when BYTE is LOW). BUSY going HIGH can be used to latch the data. Refer to Table III and Figures 3 and 5 for timing specifications.
t8 t9 t10 t11 t7 + t6 t12 t13 t14
TABLE III. Conversion Timing.
BYTE LOW
Bit 11 (MSB) Bit 10 Bit 9 Bit 8 6 7 ADS7820 8 9 21 LOW 20 LOW 19 LOW 18 Bit 0 (LSB) 17 Bit 1 16 Bit 2 15 Bit 3 Bit 1 Bit 0 (LSB) 8 9 23 22 LOW Bit 3 Bit 2 6 7
BYTE HIGH
+5V 23 22 Bit 4 ADS7820 21 Bit 5 20 Bit 6 19 Bit 7 18 Bit 8 17 Bit 9 16 Bit 10 15 Bit 11
Bit 7 10 Bit 6 11 Bit 5 12 Bit 4 13 14
LOW 10 LOW 11 LOW 12 LOW 13 14
FIGURE 2. Bit Locations Relative to State of BYTE (pin 23).
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ADS7820
t1 R/C t13 t2 BUSY t3 t6 MODE Acquire Convert t7 Acquire t8 t5 Convert t4
DATA BUS
Previous Data Valid t9
Hi-Z
Previous Data Valid t11
Not Valid
Data Valid t10
Hi-Z
Data Valid
FIGURE 3. Conversion Timing with Outputs Enabled after Conversion (CS Tied LOW.)
t12 R/C t1 CS
t12
t12
t12
t3 BUSY t4
t6 MODE Acquire Convert t7 Acquire
DATA BUS
Hi-Z State
Data Valid t14 t9
Hi-Z State
FIGURE 4. Using CS to Control Conversion and Read Timing.
t12 R/C
t12
CS
BYTE
Pins 6 - 13
Hi-Z
High Byte t14
Low Byte t14 High Byte t9
Hi-Z
Pins 15 - 22
Hi-Z
Low Byte
Hi-Z
FIGURE 5. Using CS and BYTE to Control Data Bus.
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INPUT RANGE The ADS7820 offers a standard 0V to 5V input range. Figure 6 shows the required circuit connections for the ADS7820 with and without the gain adjustment hardware. Adjustments for offset and gain are described in the calibration section of this data sheet.
REF REF (pin 3) is an input for an external reference or the output for the internal 2.5V reference. A 2.2µF capacitor should be connected as close to the REF pin as possible. The capacitor and the output resistance of REF create a low pass filter to bandlimit noise on the reference. Using a smaller value capacitor will introduce more noise to the reference degrading the SNR and SINAD. The REF pin should not be used to drive external AC or DC loads. The range for the external reference is 2.3V to 2.7V and determines the actual LSB size. Increasing the reference voltage will increase the full scale range and the LSB size of the converter which can improve the SNR. CAP CAP (pin 4) is the output of the internal reference buffer. A 2.2µF capacitor should be placed as close to the CAP pin as possible to provide optimum switching currents for the CDAC throughout the conversion cycle and compensation for the output of the internal buffer. Using a capacitor any smaller than 1µF can cause the output buffer to oscillate and may not have sufficient charge for the CDAC. Capacitor values larger than 2.2µF will have little affect on improving performance. The output of the buffer is capable of driving up to 2mA of current to a DC load. DC loads requiring more than 2mA of current from the CAP pin will begin to degrade the linearity of the ADS7820. Using an external buffer will allow the internal reference to be used for larger DC loads and AC loads. Do not attempt to directly drive an AC load with the output voltage on CAP. This will cause performance degradation of the converter.
CALIBRATION
The ADS7820 can be trimmed in hardware or software. There is no external, offset adjustment. If offset adjustment is required, an op amp featuring an offset trim pin should be used to drive the ADS7820. The offset should be trimmed before the gain since the offset directly affects the gain. To achieve optimum performance, several iterations may be required. GAIN ADJUSTMENT To calibrate the gain of the ADS7820, a 576kΩ resistor must be tied between the REF pin and a 5V potentiometer (see Figure 6b). The calibration range is ±15mV for the gain.
REFERENCE
The ADS7820 can operate with its internal 2.5V reference or an external reference. By applying an external reference to pin 3, the internal reference can be bypassed. The reference voltage at REF is buffered internally with the output on CAP (pin 4). The internal reference has an 8 ppm/°C drift (typical) and accounts for approximately 20% of the full scale error (FSE = ±0.5% for low grade, ±0.25% for high grade).
a) WITHOUT EXTERNAL GAIN ADJUSTMENT
b) WITH EXTERNAL GAIN ADJUSTMENT
0 to +5V
1
VIN
0 to +5V
1
VIN
2 2.2µF +
2 AGND1 +5V 2.2µF + 3
AGND1
3
REF 576kΩ 50kΩ 4 Gain 2.2µF + 5 AGND2
REF
4 2.2µF + 5
CAP
CAP
AGND2
FIGURE 6. Circuit Diagram With and Without External Gain Adjustment.
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ADS7820
LAYOUT
POWER For optimum performance, tie the analog and digital power pins to the same +5V power supply and tie the analog and digital grounds together. As noted in the electrical specifications, the ADS7820 uses 90% of its power for the analog circuitry. The ADS7820 should be considered as an analog component. The +5V power for the A/D should be separate from the +5V used for the system’s digital logic. Connecting VDIG (pin 28) directly to a digital supply can reduce converter performance due to switching noise from the digital logic. For best performance, the +5V supply can be produced from whatever analog supply is used for the rest of the analog signal conditioning. If +12V or +15V supplies are present, a simple +5V regulator can be used. Although it is not suggested, if the digital supply must be used to power the converter, be sure to properly filter the supply. Either using a filtered digital supply or a regulated analog supply, both VDIG and VANA should be tied to the same +5V source. GROUNDING Three ground pins are present on the ADS7820. DGND is the digital supply ground. AGND2 is the analog supply ground. AGND1 is the ground which all analog signals internal to the A/D are referenced. AGND1 is more susceptible to current induced voltage drops and must have the path of least resistance back to the power supply. All the ground pins of the A/D should be tied to the analog ground plane, separated from the system’s digital logic ground, to achieve optimum performance. Both analog and digital ground planes should be tied to the “system” ground as near to the power supplies as possible. This helps to prevent dynamic digital ground currents from modulating the analog ground through a common impedance to power ground.
SIGNAL CONDITIONING The FET switches used for the sample hold on many CMOS A/D converters release a significant amount of charge injection which can cause the driving op amp to oscillate. The FET switch on the ADS7820, compared to the FET switches on other CMOS A/D converters, releases 5%-10% of the charge. There is also a resistive front end which attenuates any charge which is released. The end result is a minimal requirement for the anti-alias filter on the front end. Any op amp sufficient for the signal in an application will be sufficient to drive the ADS7820. INTERMEDIATE LATCHES The ADS7820 does have tri-state outputs for the parallel port, but intermediate latches should be used if the bus will be active during conversions. If the bus is not active during conversion, the tri-state outputs can be used to isolate the A/D from other peripherals on the same bus. Tri-state outputs can also be used when the A/D is the only peripheral on the data bus. Intermediate latches are beneficial on any monolithic A/D converter. The ADS7820 has an internal LSB size of 610µV. Transients from fast switching signals on the parallel port, even when the A/D is tri-stated, can be coupled through the substrate to the analog circuitry causing degradation of converter performance. The effects of this phenomenon will be more obvious when using the pin-compatible ADS7821 or any of the other 16-bit converters in the ADS Family. This is due to the smaller internal LSB size of 38µV.
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