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ADS7924
SBAS482C – JANUARY 2010 – REVISED SEPTEMBER 2017
ADS7924 2.2 V, 12-Bit, 4-Channel, MicroPOWER
Analog-to-Digital Converter With I2C Interface
1 Features
3 Description
•
The ADS7924 is a four-channel, 12-bit, analog-todigital converter (ADC) with an I2C™ interface. With
its low-power ADC core, support for low-supply
operation, and a flexible measurement sequencer
that essentially eliminates power consumption
between conversions, the ADS7924 forms a complete
monitoring system for power-critical applications such
as battery-powered equipment and energy harvesting
systems.
1
•
•
•
Intelligent Monitoring:
– Auto-Sequencing of 4-Channel Multiplexer
– Individual Alarm Thresholds for Each Channel
– Programmable Scan Rate
MicroPOWER™ Monitoring:
– Four-Channel Scanning:
– Every 1 ms → 25 μW
– Every 10 ms → 5 μW
– < 1 µA of Power-Down Current
– Programmable Interrupt Pin Controls
Shutdown/Wakeup of the Microcontroller
– Auto Power-Down Control
– PWRCON Pin Allows Shutdown of External
Operational Amplifiers
Wide Supply Range:
– Analog Supply: 2.2 V to 5.5 V
– Digital Supply: 1.65 V to 5.5 V
Small Footprint: 3-mm × 3-mm WQFN
2 Applications
•
•
The ADS7924 features dedicated data registers and
onboard programmable digital threshold comparators
for each input. Alarm conditions can be programmed
that generate an interrupt. The combination of data
buffering, programmable threshold comparisons, and
alarm interrupts minimize the host microcontroller
time needed to supervise the ADS7924.
The four-channel input multiplexer (MUX) is routed
through external pins to allow a common signal
conditioning circuit to be used between the MUX and
ADC, thereby reducing overall component count. The
low-power ADC uses the analog supply as its
reference and can acquire and convert signals in only
10 μs. An onboard oscillator eliminates the need to
supply a master clock.
The ADS7924 is offered in a small 3-mm × 3-mm
WQFN and is fully specified for operation over the
industrial temperature range of –40°C to 85°C.
Portable and Battery-Powered Systems:
– Medical, Communications, Remote Sensor
Signal Monitoring, Power-Supply Monitoring
Energy Harvesting
Device Information(1)
PART NUMBER
ADS7924
PACKAGE
WQFN (16)
BODY SIZE (NOM)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
MUX OUT
ADCIN
AVDD
DVDD
SDA
2
IC
Interface
CH0
CH1
CH2
4-Channel
MUX
SAR
ADC
Data Buffers,
Sequencer, and
Alarms
SCL
A0
INT
CH3
PWRCON
RESET
Oscillator
AGND
DGND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ADS7924
SBAS482C – JANUARY 2010 – REVISED SEPTEMBER 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
6
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
I2C Timing Requirements..........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 13
7.5 Programming........................................................... 20
7.6 Register Map........................................................... 26
8
Application and Implementation ........................ 33
8.1 Application Information............................................ 33
8.2 Typical Application ................................................. 39
9 Power Supply Recommendations...................... 41
10 Layout................................................................... 41
10.1 Layout Guidelines ................................................. 41
10.2 Layout Example .................................................... 41
11 Device and Documentation Support ................. 42
11.1
11.2
11.3
11.4
11.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
42
42
42
42
42
12 Mechanical, Packaging, and Orderable
Information ........................................................... 42
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (September 2015) to Revision C
Page
•
Changed QFN to WQFN throughout document .................................................................................................................... 1
•
Changed direction of RESET arrow in Simplified Schematic figure....................................................................................... 1
•
Changed maximum operating temperature range in Absolute Maximum Ratings table ........................................................ 4
•
Changed direction of RESET arrow in Functional Block Diagram figure ............................................................................ 10
•
Changed description of bits 7:5 in INTCONFIG: Interrupt Configuration Register .............................................................. 30
Changes from Revision A (May 2010) to Revision B
•
2
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
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Copyright © 2010–2017, Texas Instruments Incorporated
Product Folder Links: ADS7924
ADS7924
www.ti.com
SBAS482C – JANUARY 2010 – REVISED SEPTEMBER 2017
5 Pin Configuration and Functions
(1)
DVDD
AVDD
ADCIN
MUXOUT
15
14
13
8
4
AGND
SDA
(1)
7
3
Pad
PWRCON
SCLK
Thermal
6
2
DGND
INT
5
1
A0
RESET
16
RTE Package
16-Pin WQFN
Top View
12
CH0
11
CH1
10
CH2
9
CH3
Connect to AGND.
Pin Functions
PIN
I/O
DESCRIPTION
NO.
NAME
1
RESET
Digital input
2
INT
Digital output
3
SCLK
Digital input
Serial clock input
4
SDA
Digital
input/output
Serial data
5
A0
Digital input
I2C address selection
External reset, active low
Interrupt pin, active low; generated when input voltage is beyond programmed threshold
6
DGND
Digital
7
PWRCON
Digital output
Digital ground
8
AGND
Analog
Analog ground
9
CH3
Analog input
Input channel 3
10
CH2
Analog input
Input channel 2
11
CH1
Analog input
Input channel 1
12
CH0
Analog input
Input channel 0
13
MUXOUT
Analog output
14
ADCIN
Analog input
15
AVDD
Analog
Analog supply
16
DVDD
Digital
Digital supply
Power control pin to control shutdown/power-up of external operational amplifier
Multiplexer output
ADC input
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Product Folder Links: ADS7924
3
ADS7924
SBAS482C – JANUARY 2010 – REVISED SEPTEMBER 2017
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range, unless otherwise noted. (1)
MIN
MAX
UNIT
Supply voltage, AVDD to AGND
–0.3
6
V
Supply voltage, DVDD to DGND
–0.3
6
V
Supply voltage, DVDD to AVDD
AVDD ≥ DVDD
AGND to DGND
V
–0.3
0.3
V
Analog input voltage
AGND – 0.3
0.3
V
Digital input voltage with respect to DGND (SCL and SDA)
DGND – 0.3
6
V
Digital input voltage with respect to DGND (A0, RESET)
DGND – 0.3
DVDD + 0.3
V
Input current to all pins except supply pins
–10
10
mA
Maximum operating temperature
–40
85
°C
Storage temperature
–60
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±750
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
AVDD
Analog Supply Voltage
2.2
5.5
V
DVDD
Digital Supply Voltage
1.65
AVDD
V
6.4 Thermal Information
ADS7924
THERMAL METRIC (1)
RTE (WQFN)
UNIT
16 PINS
RθJA
Junction-to-ambient thermal resistance
48.1
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
47.3
°C/W
RθJB
Junction-to-board thermal resistance
60.8
°C/W
ψJT
Junction-to-top characterization parameter
0.3
°C/W
ψJB
Junction-to-board characterization parameter
14.1
°C/W
RθJC(bot)
Junction-to-case(bottom) thermal resistance
0.4
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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Product Folder Links: ADS7924
ADS7924
www.ti.com
SBAS482C – JANUARY 2010 – REVISED SEPTEMBER 2017
6.5 Electrical Characteristics
Minimum and maximum specifications are at TA = –40°C to 85°C, 1.65 V < DVDD < 5.5 V, and 2.2 V < AVDD < 5.5 V.
Typical specifications are at TA = 25°C, AVDD = 5 V, and DVDD = 5 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ANALOG INPUT
Full-scale input span
(CHX – AGND)
0
Input capacitance (1)
4
AVDD
V
10
pF
ADC sampling capacitance
15
MUX resistance
60
pF
Ω
Input channel crosstalk
85
dB
12
Bits
SYSTEM PERFORMANCE
Resolution
No missing codes
12
Integral linearity
Bits
–1.5
±0.5
1.5
LSBs
Differential linearity
–1
±0.6
1.5
LSBs
Offset error
–5
Offset error drift
5
0.01
Gain error
–0.2%
Gain error drift
–0.01%
0.2%
0.6
Noise (rms)
LSBs
LSB/°C
ppm/°C
0.125
LSB
SAMPLING DYNAMICS
Monitoring time/channel (2)
10
µs
CLOCK
Internal clock frequency variation
±20%
DIGITAL INPUT/OUTPUT
Logic family
CMOS
Logic level:
VIH (SDA, SCL, A0, RESET)
0.8 DVDD
DVDD + 0.3
VIL (SDA, SCL, A0, RESET)
DGND – 0.3
0.4
V
VI = DVDD or DGND
–10
10
μA
IOH = 100 μA, INT pin
0.8 DVDD
DVDD
V
IOH = 100 µA, PWRCON pin
0.8 AVDD
AVDD
V
DGND
0.4
Input current
II
VOH (PWRCON, INT)
VOL (PWRCON, INT, SDA)
IOL = 100 μA
Low-level output current
IOL
SDA pin, VOL = 0.6 V
Load capacitance
CB
SDA pin
Data format
V
V
3
mA
400
pF
5.5
V
Straight binary
POWER-SUPPLY REQUIREMENTS
Power-supply voltage:
DVDD (3)
1.65
AVDD
IAVDD (4)
2.2
tCYCLE = 2.5 ms, AVDD = 2.2 V
5
IPWRD, power-down current
5.5
V
8
μA