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ADS8320
SBAS108E – MAY 2000 – REVISED DECEMBER 2016
ADS8320 16-Bit, High-Speed, 2.7-V to 5-V microPower Sampling
Analog-to-Digital Converter
1 Features
3 Description
•
•
The ADS8320 device is a 16-bit, sampling analog-todigital (A/D) converter with ensured specifications
over a 2.7-V to 5.25-V supply range. It requires very
little power even when operating at the full 100-kHz
data rate. At lower data rates, the high speed of the
device enables it to spend most of its time in the
power-down mode. The average power dissipation is
less than 100 mW at 10-kHz data rate.
1
•
•
•
•
100-kHz Sampling Rate
microPower:
– 1.8 mW at 100 kHz and 2.7 V
– 0.3 mW at 10 kHz and 2.7 V
Power Down: 3 µA (Maximum)
8-Pin VSSOP Package
Pin-Compatible to ADS7816 and ADS7822
Serial (SPI™/SSI) Interface
2 Applications
•
•
•
•
•
•
•
Battery-Operated Systems
Remote Data Acquisition
Isolated Data Acquisition
Simultaneous Sampling, Multichannel Systems
Industrial Controls
Robotics
Vibration Analysis
The ADS8320 also features operation from 2 V to
5.25 V, a synchronous serial (SPI/SSI compatible)
interface, and a differential input. The reference
voltage can be set to any level within the range of
500 mV to VCC.
Ultra-low power and small size make the ADS8320
ideal for portable and battery-operated systems. It is
also a perfect fit for remote data acquisition modules,
simultaneous multi-channel systems, and isolated
data acquisition. The ADS8320 is available in an
8-pin VSSOP package.
Device Information(1)
PART NUMBER
ADS8320
PACKAGE
VSSOP (8)
BODY SIZE (NOM)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Block Diagram
Control
SAR
VREF
DOUT
+In
CDAC
Serial
Interface
±In
S/H Amp
Comparator
DCLOCK
CS/SHDN
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ADS8320
SBAS108E – MAY 2000 – REVISED DECEMBER 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
6
8
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics: VCC = 5 V.........................
Electrical Characteristics: VCC = 2.7 V......................
Typical Characteristics ..............................................
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 13
8
Application and Implementation ........................ 16
8.1 Application Information............................................ 16
8.2 Typical Applications ................................................ 16
9 Power Supply Recommendations...................... 22
10 Layout................................................................... 22
10.1 Layout Guidelines ................................................. 22
10.2 Layout Example .................................................... 23
10.3 Power Dissipation ................................................. 23
11 Device and Documentation Support ................. 27
11.1
11.2
11.3
11.4
11.5
11.6
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
27
27
27
27
27
27
12 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
Changes from Revision D (March 2007) to Revision E
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
•
Added Thermal Information table ........................................................................................................................................... 4
•
Changed Application Circuits section To: Typical Connection Diagram .............................................................................. 11
2
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SBAS108E – MAY 2000 – REVISED DECEMBER 2016
5 Pin Configuration and Functions
DGK Package
8-Pin VSSOP
Top View
VREF
1
+In
2
8
+VCC
7
DCLOCK
ADS8320
±In
3
6
DOUT
GND
4
5
CS/SHDN
Pin Functions
PIN
NO.
NAME
TYPE (1)
DESCRIPTION
1
VREF
AI
Reference input
2
+In
AI
Noninverting input
3
–In
AI
Inverting input: Connect to ground or to remote ground sense point.
4
GND
GND
5
CS/SHDN
DI
Chip select when LOW; Shutdown mode when HIGH.
6
DOUT
DO
The serial output data word is comprised of 16 bits of data. In operation the data is valid on
the falling edge of DCLOCK. The second clock pulse after the falling edge of CS enables the
serial output. After one null bit the data is valid for the next 16 edges.
7
DCLOCK
DI
Data clock synchronizes the serial data transfer and determines conversion speed.
8
+VCC
PWR
(1)
Ground
Power supply
AI = Analog Input, DI = Digital Input, DO = Digital Output, GND = Ground, PWR = Power
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ADS8320
SBAS108E – MAY 2000 – REVISED DECEMBER 2016
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
6
V
VCC
Analog input
–0.3
VCC + 0.3
V
Logic input
–0.3
6
°C
External reference voltage
5.5
V
Input current to any pin except supply
±10
mA
Case temperature
100
°C
Junction temperature
150
°C
Storage temperature, Tstg
125
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
(2)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
Low voltage levels
Supply voltage, VCC to GND
NOM
MAX
2.7
3.3
5-V logic levels
4.75
–IN to GND
–0.1
+IN to GND
–0.1
VCC + 0.1
0
VREF
–40
85
Reference input voltage, VREF
5
5.25
0.5
Analog input voltage
+IN to – (–IN)
Operating temperature, TA
VCC
0
UNIT
V
V
0.5
V
°C
6.4 Thermal Information
ADS8320
THERMAL METRIC (1)
DGK (VSSOP)
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
163.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
56.6
°C/W
RθJB
Junction-to-board thermal resistance
83.4
°C/W
ψJT
Junction-to-top characterization parameter
6.7
°C/W
ψJB
Junction-to-board characterization parameter
82
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SBAS108E – MAY 2000 – REVISED DECEMBER 2016
6.5 Electrical Characteristics: VCC = 5 V
at –40°C to 85°C, VREF = 5 V, –IN = GND, fSAMPLE = 100 kHz, and fCLK = 24 × fSAMPLE (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RESOLUTION
Resolution
16
Bits
ANALOG INPUT
Full-scale input span
Absolute input
+In – (–In)
0
VREF
+In
–0.1
VCC + 0.1
–In
–0.1
1
Capacitance
Leakage current
V
V
45
pF
1
nA
SYSTEM PERFORMANCE
No missing codes
Integral linearity error
Offset error
ADS8320E
14
ADS8320EB
15
ADS8320E
±0.008%
±0.018%
ADS8320EB
±0.006%
±0.012%
±1
±2
±0.5
±1
ADS8320E
ADS8320EB
Offset temperature drift
Gain error
±3
ADS8320E
FSR
mV
µV/°C
±0.05%
ADS8320EB
FSR
±0.024%
Gain error temperature drift
Noise
Power-supply rejection ratio
Bits
4.7 V < VCC < 5.25 V
±0.3
ppm/°C
20
µVrms
3
LSB (1)
SAMPLING DYNAMICS
Conversion time
16
Acquisition time
Clock
Cycles
4.5
Throughput rate
Clock frequency
Clock
Cycles
0.024
100
kHz
2.4
MHz
DYNAMIC CHARACTERISTICS
Total harmonic distortion
VIN = 5 VP-P at 10 kHz
SINAD
VIN = 5 VP-P at 10 kHz
Spurious-free dynamic
VIN = 5 VP-P at 10 kHz
SNR
ADS8320E
–84
ADS8320EB
–86
ADS8320E
82
ADS8320EB
84
ADS8320E
84
ADS8320EB
86
ADS8320E
90
ADS8320EB
92
dB
dB
dB
dB
REFERENCE INPUT
Voltage
Resistance
0.5
VCC
CS = GND, fSAMPLE = 0 Hz
5
CS = VCC
5
40
Current drain
(1)
fSAMPLE = 0 Hz
0.8
CS = VCC
0.1
V
GΩ
80
µA
3
LSB means Least Significant Bit with VREF equal to 2.5 V, one LSB is 0.038 mV.
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ADS8320
SBAS108E – MAY 2000 – REVISED DECEMBER 2016
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Electrical Characteristics: VCC = 5 V (continued)
at –40°C to 85°C, VREF = 5 V, –IN = GND, fSAMPLE = 100 kHz, and fCLK = 24 × fSAMPLE (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUT/OUTPUT
Logic family
Logic levels
CMOS
VIH
IIH = 5 µA
3
VCC + 0.3
VIL
IIL = 5 µA
–0.3
0.8
VOH
IOH = –250 µA
VOL
IOL = 250 µA
4
V
0.4
Data format
Straight Binary
POWER SUPPLY REQUIREMENTS
VCC
Specified performance
4.75
5.25
V
2
5.25
V
VCC (2)
Quiescent current
900
fSAMPLE = 10 kHz (3) (4)
Power dissipation
Power down
(2)
(3)
(4)
1700
200
CS = VCC
µA
4.5
8.5
mW
0.3
3
µA
See Typical Characteristics for more information.
fCLK = 2.4 MHz, CS = VCC for 216 clock cycles out of every 240.
See Power Dissipation for more information regarding lower sample rates.
6.6 Electrical Characteristics: VCC = 2.7 V
at –40°C to 85°C, VREF = 5 V, –IN = GND, fSAMPLE = 100 kHz, and fCLK = 24 × fSAMPLE (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RESOLUTION
Resolution
16
Bits
ANALOG INPUT
Full-scale input span
Absolute input
+In – (–In)
0
VREF
+In
–0.1
VCC + 0.1
–In
–0.1
0.5
Capacitance
Leakage current
V
V
45
pF
1
nA
SYSTEM PERFORMANCE
No missing codes
Integral linearity error
Offset error
ADS8320E
14
ADS8320EB
15
ADS8320E
±0.008%
±0.018%
ADS8320EB
±0.006%
±0.012%
±1
±2
±0.5
±1
ADS8320E
ADS8320EB
Offset temperature drift
Gain error
±3
ADS8320E
ADS8320EB
±0.024%
Noise
(1)
6
2.7 V < VCC < 3.3 V
FSR
mV
µV/°C
±0.05%
Gain error temperature drift
Power-supply rejection ratio
Bits
FSR
±0.3
ppm/°C
20
ppm/°C
3
LSB (1)
LSB means Least Significant Bit with VREF equal to 2.5 V, one LSB is 0.038 mV.
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Electrical Characteristics: VCC = 2.7 V (continued)
at –40°C to 85°C, VREF = 5 V, –IN = GND, fSAMPLE = 100 kHz, and fCLK = 24 × fSAMPLE (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SAMPLING DYNAMICS
Conversion time
16
Acquisition time
Clock
Cycles
4.5
Throughput rate
Clock frequency
Clock
Cycles
0.024
100
kHz
2.4
MHz
DYNAMIC CHARACTERISTICS
Total harmonic distortion
VIN = 2.7 VP-P at 1 kHz
SINAD
VIN = 2.7 VP-P at 1 kHz
Spurious-free dynamic
VIN = 2.7 VP-P at 1 kHz
SNR
ADS8320E
–86
ADS8320EB
–88
ADS8320E
84
ADS8320EB
86
ADS8320E
86
ADS8320EB
88
ADS8320E
88
ADS8320EB
90
dB
dB
dB
dB
REFERENCE INPUT
Voltage
0.5
Resistance
Current drain
VCC
CS = GND, fSAMPLE = 0 Hz
5
CS = VCC
5
20
50
CS = VCC
0.1
3
V
GΩ
µA
DIGITAL INPUT/OUTPUT
Logic Family
Logic levels
CMOS
VIH
IIH = 5 µA
2
VCC + 0.3
VIL
IIL = 5 µA
–0.3
0.8
VOH
IOH = –250 µA
VOL
IOL = 250 µA
2.1
V
0.4
Data format
Straight Binary
POWER SUPPLY REQUIREMENTS
VCC
Specified performance
VCC (2)
Quiescent current
See (3)
(2)
(3)
(4)
(5)
3.3
2
5.25
2
2.7
650
fSAMPLE = 10 kHz
(4) (5)
Power dissipation
Power down
2.7
CS = VCC
1300
100
V
V
µA
1.8
3.8
mW
0.3
3
µA
See Typical Characteristics for more information.
The maximum clock rate of the ADS8320 is less than 2.4 MHz in this power supply range.
fCLK = 2.4 MHz, CS = VCC for 216 clock cycles out of every 240.
See Power Dissipation for more information regarding lower sample rates.
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6.7 Typical Characteristics
3.0
2.0
2.0
0.0
Non Linearity (LSB)
Integral Non Linearity (LSB)
1.0
±1.0
±2.0
±3.0
±4.0
1.0
0.0
±1.0
±2.0
±5.0
±6.0
0000H
4000H
8000H
C000H
±3.0
0000H
FFFFH
4000H
8000H
Hex Code
Hex Code
Figure 1. Integral Non-Linearity (INL) vs Code (25°C)
600
500
5V
Supply Current (nA)
Supply Current (µA)
1000
800
2.7V
600
400
400
5V
300
200
100
200
0
0
±50
0
±25
25
50
75
100
±50
0
±25
Temperature (°C)
25
50
75
100
Temperature (°C)
Figure 3. Supply Current vs Temperature
Figure 4. Power-Down Supply Current
Code (25°C)
1200
1000
1000
Sample Rate (kHz)
Quiescent Current (µA)
FFFFH
Figure 2. Differential Non-Linearity Error vs Code (25°C)
1200
800
600
100
10
400
200
1
1
2
3
4
5
1
VCC (V)
2
3
4
5
VCC (V)
Figure 5. Quiescent Current vs VCC
8
C000H
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Figure 6. Maximum Sample Rate vs VCC
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Typical Characteristics (continued)
3
6
VCC = 5V
5
Delta from +25 C (LSB)
Change in Offset (LSB)
2
4
3
2
1
0
±1
1
5V
0
2.7V
í1
í2
±2
í3
±3
1
2
3
Reference Voltage (V)
4
í50
5
0
í25
25
50
Temperature (°C)
75
100
Figure 8. Change In Offset vs Temperature
Figure 7. Change In Offset vs Reference Voltage
5
6
VCC = 5V
4
Delta from 25°C (LSB)
Change in Gain (LSB)
4
3
2
1
0
2
0
5V
±2
2.7V
±4
±1
±6
±2
1
2
3
Reference Voltage (V)
4
±50
5
0
25
50
75
100
Temperature (°C)
Figure 9. Change In Gain Error vs Reference Voltage
Figure 10. Change In Gain Error vs Temperature
10
0
VCC = 5V
9
Peak-to-Peak Noise (LSB)
±20
Amplitude (dB)
±25
±40
±60
±80
±100
±120
8
7
6
5
4
3
2
1
0
±140
0
10
20
30
Frequency (kHz)
40
50
Figure 11. Frequency Spectrum (8192 Point FFT,
FIN = 10.120 kHz, –0.3 dB)
0.1
1
Reference Voltage (V)
10
Figure 12. Peak-to-Peak Noise vs Reference Voltage
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Typical Characteristics (continued)
0
100
Signal-to-Noise Ratio
±10
Total Harmonic Distortion (dB)
Spurious-Free Dynamic Range
and Signal-to-Noise Ratio (dB)
90
80
Spurious-Free Dynamic Range
70
60
50
40
30
20
±20
±30
±40
±50
±60
±70
±80
10
±90
0
±100
1
10
Frequency (kHz)
50
1
100
Figure 13. Spurious-Free Dynamic Range and Signal-toNoise Ratio vs Frequency
Signal-to-(Noise + Distortion) (dB)
Signal-to-(Noise + Distortion) (dB)
90
90
80
70
60
50
40
30
20
10
1
10
Frequency (kHz)
50
80
70
60
50
40
30
20
±40
0
100
Figure 15. Signal-to-(Noise + Distortion) vs Frequency
70
70
60
60
50
40
5V
30
20
2.7V
±35
±30
±25
±20
±15
Input Level (dB)
±10
0
±5
Figure 16. Signal-to-(Noise + Distortion) vs Input Level
Reference Current (µA)
Reference Current (µA)
100
Figure 14. Total Harmonic Distortion vs Frequency
100
50
5V
40
30
2.7V
20
10
0
0
20
40
60
Sample Rate (kHz)
80
100
10
±50
±25
0
25
50
75
100
Temperature (°C)
Figure 17. Reference Current vs Sample Rate
10
10
Frequency (kHz)
Figure 18. Reference Current vs Temperature
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7 Detailed Description
7.1 Overview
The ADS8320 device is a classic successive approximation register (SAR) analog-to-digital (A/D) converter. The
architecture is based on capacitive redistribution, which inherently includes a sample and hold function. The
converter is fabricated on a 0.6µm CMOS process. The architecture and process allow the ADS8320 to acquire
and convert an analog signal at up to 100,000 conversions per second while consuming less than 4.5 mW from
+VCC.
The ADS8320 requires an external reference, an external clock, and a single power source (VCC). The external
reference can be any voltage between 500 mV and VCC. The value of the reference voltage directly sets the
range of the analog input. The reference input current depends on the conversion rate of the ADS8320.
The external clock can vary between 24 kHz (1-kHz throughput) and 2.4 MHz (100-kHz throughput). The duty
cycle of the clock is essentially unimportant, as long as the minimum high and low times are at least 200 ns
(VCC = 2.7 V or greater). The minimum clock frequency is set by the leakage on the capacitors internal to the
ADS8320.
The analog input is provided to two input pins: +In and –In. When a conversion is initiated, the differential input
on these pins is sampled on the internal capacitor array. While a conversion is in progress, both inputs are
disconnected from any internal function.
The digital result of the conversion is clocked out by the DCLOCK input and is provided serially, most significant bit
first, on the DOUT pin. The digital data that is provided on the DOUT pin is for the conversion currently in
progress—there is no pipeline delay. It is possible to continue to clock the ADS8320 after the conversion is
complete and to obtain the serial data least significant bit first. See Device Functional Modes for more
information.
7.1.1 Typical Connection Diagram
Figure 19 shows a basic data acquisition system. The ADS8320 input range is 0 V to VCC, as the reference input
is connected directly to the power supply. The 5-Ω resistor and 1-µF to 10-µF capacitor filter the microcontroller
noise on the supply, as well as any high-frequency noise from the supply itself. The exact values must be picked
such that the filter provides adequate rejection of the noise.
+2.7 V to +5.25 V
5Ÿ
+ 1 µF to
10 µF
ADS8320
VREF
VCC
+In
CS
±In
DOUT
0.1µF
GND
+ 1 µF to
10 µF
Microcontroller
DCLOCK
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Figure 19. Typical Connection Diagram With ADS8320
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7.2 Functional Block Diagram
Control
SAR
VREF
DOUT
+In
CDAC
Serial
Interface
±In
S/H Amp
DCLOCK
CS/SHDN
Comparator
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7.3 Feature Description
7.3.1 Analog Input
The +In and –In input pins allow for a differential input signal. Unlike some converters of this type, the –In input is
not resampled later in the conversion cycle. When the converter goes into the hold mode, the voltage difference
between +In and –In is captured on the internal capacitor array.
The range of the –In input is limited to –0.1 V to 1 V (–0.1 V to 0.5 V when using a 2.7-V supply). Because of
this, the differential input can be used to reject only small signals that are common to both inputs. Thus, the –In
input is best used to sense a remote signal ground that may move slightly with respect to the local ground
potential.
The input current on the analog inputs depends on a number of factors: sample rate, input voltage, source
impedance, and power-down mode. Essentially, the current into the ADS8320 charges the internal capacitor
array during the sample period. After this capacitance has been fully charged, there is no further input current.
The source of the analog input voltage must be able to charge the input capacitance (45 pF) to a 16-bit settling
level within 4.5 clock cycles. When the converter goes into the hold mode or while it is in the power down mode,
the input impedance is greater than 1 GΩ.
Care must be taken regarding the absolute analog input voltage. To maintain the linearity of the converter, the
–In input must not drop below GND – 100 mV or exceed GND + 1 V. The +In input must always remain within
the range of GND – 100 mV to VCC + 100 mV. Outside of these ranges, the converter linearity may not meet
specifications. To minimize noise, low bandwidth input signals with lowpass filters must be used.
7.3.2 Reference Input
The external reference sets the analog input range. The ADS8320 operates with a reference in the range of 500
mV to VCC. There are several important implications of this.
As the reference voltage is reduced, the analog voltage weight of each digital output code is reduced. This is
often referred to as the Least Significant Bit (LSB) size and is equal to the reference voltage divided by 65,536.
This means that any offset or gain error inherent in the A/D converter appears to increase, in terms of LSB size,
as the reference voltage is reduced.
The noise inherent in the converter also appears to increase with lower LSB size. With a 5-V reference, the
internal noise of the converter typically contributes only 1.5-LSB peak-to-peak of potential error to the output
code. When the external reference is 500 mV, the potential error contribution from the internal noise is 10 times
larger (15 LSBs). The errors due to the internal noise are gaussian in nature and can be reduced by averaging
consecutive conversion results.
For more information regarding noise, see Figure 12. Note that the Effective Number of Bits (ENOB) figure is
calculated based on the converter’s signal-to-(noise + distortion) ratio with a 1-kHz, 0-dB input signal. SINAD is
related to ENOB as shown in Equation 1.
12
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SBAS108E – MAY 2000 – REVISED DECEMBER 2016
Feature Description (continued)
SINAD = 6.02 × ENOB + 1.76
(1)
With lower reference voltages, extra care must be taken to provide a clean layout including adequate bypassing,
a clean power supply, a low-noise reference, and a low-noise input signal. Because the LSB size is lower, the
converter is also more sensitive to external sources of error such as nearby digital signals and electromagnetic
interference.
7.3.3 Noise
The noise floor of the ADS8320 itself is extremely low, as can be seen from Figure 20 and Figure 21, and is
much lower than competing A/D converters. It was tested by applying a low-noise DC input and a 5-V reference
to the ADS8320 and initiating 5000 conversions. The digital output of the A/D converter varies in output code due
to the internal noise of the ADS8320. This is true for all 16-bit SAR-type A/D converters. Using a histogram to
plot the output codes, the distribution must appear bell-shaped with the peak of the bell curve representing the
nominal code for the input value. The ±1σ, ±2σ, and ±3σ distributions represents the 68.3%, 95.5%, and 99.7%,
respectively, of all codes. The transition noise can be calculated by dividing the number of codes measured by 6
and this yields the ±3σ distribution or 99.7% of all codes. Statistically, up to 3 codes could fall outside the
distribution when executing 1000 conversions. The ADS8320, with < 3 output codes for the ±3σ distribution,
yields a