AFE1256GBTD

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents AFE1256 SBAS630D – OCTOBER 2013 – REVISED MAY 2016 AFE1256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors 1 Features • • • • • 1 • • • • 2 Application Flat-Panel, X-Ray Detector 256 Channels On-Chip, 16-Bit ADC Photodiode Short Immunity Column Short Immunity High Performance: – Noise: 758 e-RMS with 28-pF Sensor Capacitor in 1.2-pC Range – Integral Nonlinearity: ±2 LSB with Internal 16-Bit ADC – Minimum Scan Time: – 37.9 µs in Normal Mode – 20 µs in 2x Binning Mode Integration: – Eight Selectable Full-Scale Ranges: 0.15 pC (Min) to 9.6 pC (Max) – Built-In Correlated Double Sampler – 2x Binning (Averages Charge of Two Adjacent Channels) for Faster Throughput – Pipelined Integrate and Read: Allows Data Read During Integration Flexibility: – Electron and Hole Integration Low Power: – 2.9 mW/Ch with ADC – 2.3 mW/Ch without ADC – 0.1 mW/Ch in Nap Mode – Total Power-Down Feature 22-mm × 5-mm Gold-Bump Die, Suitable for TCP and COF 3 Description The AFE1256 is a 256-channel, analog front-end (AFE) designed to suit the requirements of flat-panel detectors (FPDs) based on digital X-ray systems. The device includes 256 integrators, a programmable gain amplifier (PGA) for full-scale, charge-level selection, a correlated double sampler (CDS) with dual banking, 256:4 analog multiplexers, and four 16-bit, successive-approximation register (SAR) analog-todigital converters (ADCs) onboard. Serial data from the ADCs are available in SPI™ format. Hardware-selectable integration polarity allows for the integration of positive or negative charge and provides more flexibility in system design. The Nap feature enables substantial power saving. This power savings is especially useful in battery-powered systems. The device is available as a 22-mm × 5-mm goldbumped die and a 38-mm × 28-mm, COF-314 TDS package in singulated forms. To request a full data sheet or other design resources: request AFE1256 Device Information(1) ORDER NUMBER PACKAGE BODY SIZE AFE1256GBTD Gold-bump die (533) 22 mm × 5 mm AFE1256TDS COF (314) 38 mm × 28 mm (1) For all available packages, see the package option addendum at the end of the data sheet. (2) Product-preview device. space AFE1256 Schematic REFP, REFM Integrators and CDS Mux 16-Bit ADC[3:0] ADC ADC ADC TFT Switch Pixel Capacitor [255:0] Device Reference Voltage SPI Interface SDO[3:0] [255:0] Timing and Control STI, CLK, A_BZ, RST, IRST, SHR, SHS, LPF_ON 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AFE1256 SBAS630D – OCTOBER 2013 – REVISED MAY 2016 www.ti.com Table of Contents 1 2 3 4 5 Features .................................................................. Application ............................................................. Description ............................................................. Revision History..................................................... Device and Documentation Support.................... 1 1 1 2 3 5.1 Trademarks ............................................................... 3 5.2 Electrostatic Discharge Caution ................................ 3 5.3 Glossary .................................................................... 3 6 Mechanical, Packaging, and Orderable Information ............................................................. 3 6.1 Tray Dimensions ....................................................... 4 6.2 GBTD Die.................................................................. 5 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (August 2015) to Revision D • Page Added link to request full data sheet ...................................................................................................................................... 1 Changes from Revision B (April 2014) to Revision C Page • Changed document status from Mixed to Production Data ................................................................................................... 1 • Deleted TDQ package from document ................................................................................................................................... 1 • Changed last paragraph of Description section .................................................................................................................... 1 • Deleted second row from Device Information table ............................................................................................................... 1 • Changed Tray Dimensions section: deleted Figure 1 ........................................................................................................... 4 Changes from Revision A (March 2014) to Revision B • Changed TDS package to Production Data .......................................................................................................................... 1 Changes from Original (October 2013) to Revision A • 2 Page Page Made changes to product preview data sheet ...................................................................................................................... 1 Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated Product Folder Links: AFE1256 AFE1256 www.ti.com SBAS630D – OCTOBER 2013 – REVISED MAY 2016 5 Device and Documentation Support 5.1 Trademarks SPI is a trademark of Motorola. All other trademarks are the property of their respective owners. 5.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 5.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated Product Folder Links: AFE1256 3 AFE1256 SBAS630D – OCTOBER 2013 – REVISED MAY 2016 www.ti.com 6.1 Tray Dimensions Tray dimensions for the TDS package is shown in Figure 1. Figure 1. TDS Tray Dimensions 4 Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated Product Folder Links: AFE1256 AFE1256 www.ti.com SBAS630D – OCTOBER 2013 – REVISED MAY 2016 6.2 GBTD Die Figure 2 does not take into account the scribe seal. Figure 2. GBTD Die Mechanical Data Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated Product Folder Links: AFE1256 5 AFE1256 SBAS630D – OCTOBER 2013 – REVISED MAY 2016 www.ti.com GBTD Die (continued) Figure 3 provides the tray dimensions for the GBTD die. Figure 3. GBTD Die Tray Dimension Details 6 Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated Product Folder Links: AFE1256 AFE1256 www.ti.com SBAS630D – OCTOBER 2013 – REVISED MAY 2016 GBTD Die (continued) Dies are placed active side up (bumps up) into waffle pack. The waffle pack notch is at the upper right, as shown in Figure 4. Figure 4. GBTD Die, Pin 1 Location Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated Product Folder Links: AFE1256 7 PACKAGE OPTION ADDENDUM www.ti.com 10-Nov-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) AFE1256GBTD ACTIVE AFE1256TDS ACTIVE COF TDS 0 39 RoHS & Green Call TI Call TI 0 to 70 AFE1256 Samples 314 35 RoHS & Green AU N / A for Pkg Type 0 to 70 AFE1256TDS Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of