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AFE1256
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
AFE1256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors
1 Features
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2 Application
Flat-Panel, X-Ray Detector
256 Channels
On-Chip, 16-Bit ADC
Photodiode Short Immunity
Column Short Immunity
High Performance:
– Noise: 758 e-RMS with 28-pF Sensor
Capacitor in 1.2-pC Range
– Integral Nonlinearity:
±2 LSB with Internal 16-Bit ADC
– Minimum Scan Time:
– 37.9 µs in Normal Mode
– 20 µs in 2x Binning Mode
Integration:
– Eight Selectable Full-Scale Ranges:
0.15 pC (Min) to 9.6 pC (Max)
– Built-In Correlated Double Sampler
– 2x Binning (Averages Charge of Two Adjacent
Channels) for Faster Throughput
– Pipelined Integrate and Read: Allows Data
Read During Integration
Flexibility:
– Electron and Hole Integration
Low Power:
– 2.9 mW/Ch with ADC
– 2.3 mW/Ch without ADC
– 0.1 mW/Ch in Nap Mode
– Total Power-Down Feature
22-mm × 5-mm Gold-Bump Die,
Suitable for TCP and COF
3 Description
The AFE1256 is a 256-channel, analog front-end
(AFE) designed to suit the requirements of flat-panel
detectors (FPDs) based on digital X-ray systems. The
device includes 256 integrators, a programmable gain
amplifier (PGA) for full-scale, charge-level selection, a
correlated double sampler (CDS) with dual banking,
256:4 analog multiplexers, and four 16-bit,
successive-approximation register (SAR) analog-todigital converters (ADCs) onboard. Serial data from
the ADCs are available in SPI™ format.
Hardware-selectable integration polarity allows for the
integration of positive or negative charge and
provides more flexibility in system design. The Nap
feature enables substantial power saving. This power
savings is especially useful in battery-powered
systems.
The device is available as a 22-mm × 5-mm goldbumped die and a 38-mm × 28-mm, COF-314 TDS
package in singulated forms.
To request a full data sheet or other design
resources: request AFE1256
Device Information(1)
ORDER NUMBER
PACKAGE
BODY SIZE
AFE1256GBTD
Gold-bump die (533)
22 mm × 5 mm
AFE1256TDS
COF (314)
38 mm × 28 mm
(1) For all available packages, see the package option addendum
at the end of the data sheet.
(2) Product-preview device.
space
AFE1256 Schematic
REFP, REFM
Integrators and
CDS
Mux
16-Bit
ADC[3:0]
ADC
ADC
ADC
TFT Switch
Pixel
Capacitor
[255:0]
Device
Reference
Voltage
SPI
Interface
SDO[3:0]
[255:0]
Timing and Control
STI, CLK, A_BZ, RST, IRST, SHR, SHS, LPF_ON
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE1256
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
www.ti.com
Table of Contents
1
2
3
4
5
Features ..................................................................
Application .............................................................
Description .............................................................
Revision History.....................................................
Device and Documentation Support....................
1
1
1
2
3
5.1 Trademarks ............................................................... 3
5.2 Electrostatic Discharge Caution ................................ 3
5.3 Glossary .................................................................... 3
6
Mechanical, Packaging, and Orderable
Information ............................................................. 3
6.1 Tray Dimensions ....................................................... 4
6.2 GBTD Die.................................................................. 5
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (August 2015) to Revision D
•
Page
Added link to request full data sheet ...................................................................................................................................... 1
Changes from Revision B (April 2014) to Revision C
Page
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Changed document status from Mixed to Production Data ................................................................................................... 1
•
Deleted TDQ package from document ................................................................................................................................... 1
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Changed last paragraph of Description section .................................................................................................................... 1
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Deleted second row from Device Information table ............................................................................................................... 1
•
Changed Tray Dimensions section: deleted Figure 1 ........................................................................................................... 4
Changes from Revision A (March 2014) to Revision B
•
Changed TDS package to Production Data .......................................................................................................................... 1
Changes from Original (October 2013) to Revision A
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2
Page
Page
Made changes to product preview data sheet ...................................................................................................................... 1
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
AFE1256
www.ti.com
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
5 Device and Documentation Support
5.1 Trademarks
SPI is a trademark of Motorola.
All other trademarks are the property of their respective owners.
5.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
5.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
3
AFE1256
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
www.ti.com
6.1 Tray Dimensions
Tray dimensions for the TDS package is shown in Figure 1.
Figure 1. TDS Tray Dimensions
4
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
AFE1256
www.ti.com
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
6.2 GBTD Die
Figure 2 does not take into account the scribe seal.
Figure 2. GBTD Die Mechanical Data
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
5
AFE1256
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
www.ti.com
GBTD Die (continued)
Figure 3 provides the tray dimensions for the GBTD die.
Figure 3. GBTD Die Tray Dimension Details
6
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
AFE1256
www.ti.com
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
GBTD Die (continued)
Dies are placed active side up (bumps up) into waffle pack. The waffle pack notch is at the upper right, as shown
in Figure 4.
Figure 4. GBTD Die, Pin 1 Location
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
7
PACKAGE OPTION ADDENDUM
www.ti.com
10-Nov-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
AFE1256GBTD
ACTIVE
AFE1256TDS
ACTIVE
COF
TDS
0
39
RoHS & Green
Call TI
Call TI
0 to 70
AFE1256
Samples
314
35
RoHS & Green
AU
N / A for Pkg Type
0 to 70
AFE1256TDS
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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