AFE1594, AFE159P4, AFE159RP3, AFE159RP4
SBASB28A – JUNE 2024 – REVISED NOVEMBER 2024
AFE159x Low-Power, 4-Channel, 24-Bit Analog Front-Ends for Bio-Potential
Measurements
1 Features
•
•
•
•
•
•
Integrated Signal Chain for ECG, Pace Detection,
and Respiration Measurement
ECG Receiver
– Four high resolution channels at low power of
0.42mW/channel
– Flexible four leads selectable from six
electrodes
– Programmable gain: 1.25 to 9
– Input-referred noise: 4μVPP in 150Hz BW
– Differential input range: ±1V with Gain = 4
– CMRR: -140dB
– Data rate: 125SPS to 128kSPS
Pace Detection
– On-chip digital pace detection algorithm on
programmable two leads
– High-speed 128kSPS pace output on two
channels for software pace detection
Respiration
– Low-noise of 24mΩPP with 2kΩ body
impedance and 1kΩ defibrillator protection
resistor on each electrode
– Supports Sine and Square wave excitation
Other Features
– Built-in right leg drive amplifier steerable to any
electrode
– DC lead-off detection, AC lead impedance
detection, Wilson Center Terminal (WCT),
Goldberger Central Terminals (GCT), test
signals
– Battery voltage monitoring
– Flexible power-down and standby modes
– Built-in oscillator, PLL, and reference
– 1k sample main FIFO and 2k sample pace
FIFO
– SPI-compatible serial interface
– Analog supply voltage 1: 3.15V to 5.25V
– Analog supply voltage 2: 1.7V to 1.9V
– I/O supply voltage: 1.65V to 3.6V
Supports systems meeting AAMI EC11, AMI
EC13, AMI EC38, IEC60601-1, IEC60601-2-25,
IEC60601-2-27, and IEC60601-2-51 standards
2 Applications
•
•
Medical instrumentation (ECG, EMG, and EEG):
– Bedside patient monitoring and diagnostic ECG
– Portable telemetry
– Holter monitor and multi-lead patch
Event, stress, and vital sign monitors:
– ECGs
– AEDs
– Telemedicine Bispectral Index (BIS)
– Evoked Audio Potential (EAP)
– Sleep study monitor
3 Description
The AFE1594 is a family of multichannel,
simultaneous sampling, 24-bit, delta-sigma (ΔΣ)
analog-to-digital converters (ADCs) with built-in
programmable gain Instrumentation Amplifiers (INAs),
internal reference, and an on-chip PLL. The AFE
supports digital pace pulse detection, thoracic
impedance measurement and incorporates all of
the features that are commonly required in medical
electrocardiogram (ECG) and electroencephalogram
(EEG) applications. Multiple AFE159x devices can be
cascaded in high channel count systems. With high
levels of integration and exceptional performance,
the AFE159x enables the development of scalable
medical instrumentation systems at significantly
reduced size, power, and overall cost.
Package Information
PART NUMBER
PACKAGE(1)
PACKAGE SIZE(2)
AFE1594
QFN
7mm × 7mm
AFE1593/AFE1594
WCSP
3.7mm × 3.7mm
(1)
(2)
For all available packages, see Mechanical, Packaging, and
Orderable Information.
The package size (length × width) is a nominal value and
includes pins, where applicable.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE1594, AFE159P4, AFE159RP3, AFE159RP4
www.ti.com
SBASB28A – JUNE 2024 – REVISED NOVEMBER 2024
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Device Comparison......................................................... 3
5 Device and Documentation Support..............................4
5.1 Receiving Notification of Documentation Updates......4
2
Submit Document Feedback
5.2 Support Resources..................................................... 4
5.3 Trademarks................................................................. 4
5.4 Electrostatic Discharge Caution..................................4
5.5 Glossary......................................................................4
6 Revision History.............................................................. 4
Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: AFE1594 AFE159P4 AFE159RP3 AFE159RP4
AFE1594, AFE159P4, AFE159RP3, AFE159RP4
www.ti.com
SBASB28A – JUNE 2024 – REVISED NOVEMBER 2024
4 Device Comparison
Table 4-1. Comparison of the features between the AFE159x variants
AFE159RP3
AFE159RP4
AFE159P4
AFE1594
Number of ECG electrode pins
6
6
6
6
Number of ECG channels
3
4
4
4
Number of Respiration electrode pins
4
3/4(1)
3/4(1) (2)
3/4(1) (2)
Number of Respiration receiver channel
1
1
-
-
Number of internal Pace detect channels
1
2
2
-
(1)
(2)
4 electrodes supported in WCSP package.
Only RESP_OUT pins available, RESP_IN pins are NC.
Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: AFE1594 AFE159P4 AFE159RP3 AFE159RP4
Submit Document Feedback
3
AFE1594, AFE159P4, AFE159RP3, AFE159RP4
www.ti.com
SBASB28A – JUNE 2024 – REVISED NOVEMBER 2024
5 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
5.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Notifications to register and receive a weekly digest of any product information that has changed. For change
details, review the revision history included in any revised document.
5.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
6 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (June 2024) to Revision A (July 2024)
Page
• Updated device status to Production Data......................................................................................................... 1
4
Submit Document Feedback
Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: AFE1594 AFE159P4 AFE159RP3 AFE159RP4
PACKAGE OPTION ADDENDUM
www.ti.com
8-Nov-2025
PACKAGING INFORMATION
Orderable part number
(1)
Status
Material type
(1)
(2)
Package | Pins
Package qty | Carrier
RoHS
(3)
Lead finish/
Ball material
MSL rating/
Peak reflow
(4)
(5)
Op temp (°C)
Part marking
(6)
AFE1594RGZR
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
NIPDAU
Level-3-260C-168 HR
-20 to 85
AFE1594
AFE1594RGZR.A
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
NIPDAU
Level-3-260C-168 HR
-20 to 85
AFE1594
AFE1594YAFR
Active
Production
DSBGA (YAF) | 49
6000 | LARGE T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE1594
AFE1594YAFR.A
Active
Production
DSBGA (YAF) | 49
6000 | LARGE T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE1594
AFE1594YAFT
Active
Production
DSBGA (YAF) | 49
250 | SMALL T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE1594
AFE1594YAFT.A
Active
Production
DSBGA (YAF) | 49
250 | SMALL T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE1594
AFE159P4RGZR
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
NIPDAU
Level-3-260C-168 HR
-20 to 85
AFE159P4
AFE159P4RGZR.A
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
NIPDAU
Level-3-260C-168 HR
-20 to 85
AFE159P4
AFE159P4RGZT
Active
Production
VQFN (RGZ) | 48
250 | SMALL T&R
Yes
NIPDAU
Level-3-260C-168 HR
-20 to 85
AFE159P4
AFE159P4RGZT.A
Active
Production
VQFN (RGZ) | 48
250 | SMALL T&R
Yes
NIPDAU
Level-3-260C-168 HR
-20 to 85
AFE159P4
AFE159P4YAFR
Active
Production
DSBGA (YAF) | 49
6000 | LARGE T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159P4
AFE159P4YAFR.A
Active
Production
DSBGA (YAF) | 49
6000 | LARGE T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159P4
AFE159P4YAFT
Active
Production
DSBGA (YAF) | 49
250 | SMALL T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159P4
AFE159P4YAFT.A
Active
Production
DSBGA (YAF) | 49
250 | SMALL T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159P4
AFE159RP3YAFR
Active
Production
DSBGA (YAF) | 49
6000 | LARGE T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159RP3
AFE159RP3YAFR.A
Active
Production
DSBGA (YAF) | 49
6000 | LARGE T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159RP3
AFE159RP3YAFT
Active
Production
DSBGA (YAF) | 49
250 | SMALL T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159RP3
AFE159RP3YAFT.A
Active
Production
DSBGA (YAF) | 49
250 | SMALL T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159RP3
AFE159RP4RGZR
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
NIPDAU
Level-3-260C-168 HR
-20 to 85
AFE159RP4
AFE159RP4RGZR.A
Active
Production
VQFN (RGZ) | 48
2500 | LARGE T&R
Yes
NIPDAU
Level-3-260C-168 HR
-20 to 85
AFE159RP4
AFE159RP4RGZT
Active
Production
VQFN (RGZ) | 48
250 | SMALL T&R
Yes
NIPDAU
Level-3-260C-168 HR
-20 to 85
AFE159RP4
AFE159RP4RGZT.A
Active
Production
VQFN (RGZ) | 48
250 | SMALL T&R
Yes
NIPDAU
Level-3-260C-168 HR
-20 to 85
AFE159RP4
AFE159RP4YAFR
Active
Production
DSBGA (YAF) | 49
6000 | LARGE T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159RP4
AFE159RP4YAFR.A
Active
Production
DSBGA (YAF) | 49
6000 | LARGE T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159RP4
AFE159RP4YAFT
Active
Production
DSBGA (YAF) | 49
250 | SMALL T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159RP4
AFE159RP4YAFT.A
Active
Production
DSBGA (YAF) | 49
250 | SMALL T&R
Yes
SNAGCU
Level-1-260C-UNLIM
-20 to 85
AFE159RP4
PAFE159RP4RGZR.A
Active
Preproduction
VQFN (RGZ) | 48
2500 | LARGE T&R
-
Call TI
Call TI
-20 to 85
Status: For more details on status, see our product life cycle.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Nov-2025
(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.
(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.
Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Apr-2025
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
AFE1594RGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.1
12.0
16.0
Q2
AFE1594YAFR
DSBGA
YAF
49
6000
330.0
12.4
3.91
3.96
0.81
8.0
12.0
Q1
AFE1594YAFT
DSBGA
YAF
49
250
180.0
12.4
3.91
3.96
0.81
8.0
12.0
Q1
AFE159P4RGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.1
12.0
16.0
Q2
AFE159P4RGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.1
12.0
16.0
Q2
AFE159P4YAFR
DSBGA
YAF
49
6000
330.0
12.4
3.91
3.96
0.81
8.0
12.0
Q1
AFE159P4YAFT
DSBGA
YAF
49
250
180.0
12.4
3.91
3.96
0.81
8.0
12.0
Q1
AFE159RP3YAFR
DSBGA
YAF
49
6000
330.0
12.4
3.91
3.96
0.81
8.0
12.0
Q1
AFE159RP3YAFT
DSBGA
YAF
49
250
180.0
12.4
3.91
3.96
0.81
8.0
12.0
Q1
AFE159RP4RGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.1
12.0
16.0
Q2
AFE159RP4RGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.1
12.0
16.0
Q2
AFE159RP4YAFR
DSBGA
YAF
49
6000
330.0
12.4
3.91
3.96
0.81
8.0
12.0
Q1
AFE159RP4YAFT
DSBGA
YAF
49
250
180.0
12.4
3.91
3.96
0.81
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Apr-2025
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
AFE1594RGZR
VQFN
RGZ
48
2500
367.0
367.0
35.0
AFE1594YAFR
DSBGA
YAF
49
6000
335.0
335.0
25.0
AFE1594YAFT
DSBGA
YAF
49
250
182.0
182.0
20.0
AFE159P4RGZR
VQFN
RGZ
48
2500
367.0
367.0
35.0
AFE159P4RGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
AFE159P4YAFR
DSBGA
YAF
49
6000
335.0
335.0
25.0
AFE159P4YAFT
DSBGA
YAF
49
250
182.0
182.0
20.0
AFE159RP3YAFR
DSBGA
YAF
49
6000
335.0
335.0
25.0
AFE159RP3YAFT
DSBGA
YAF
49
250
182.0
182.0
20.0
AFE159RP4RGZR
VQFN
RGZ
48
2500
367.0
367.0
35.0
AFE159RP4RGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
AFE159RP4YAFR
DSBGA
YAF
49
6000
335.0
335.0
25.0
AFE159RP4YAFT
DSBGA
YAF
49
250
182.0
182.0
20.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RGZ 48
VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD
7 x 7, 0.5 mm pitch
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224671/A
www.ti.com
PACKAGE OUTLINE
RGZ0048D
VQFN - 1 mm max height
SCALE 1.900
PLASTIC QUAD FLATPACK - NO LEAD
7.1
6.9
B
A
0.5
0.3
PIN 1 INDEX AREA
7.1
6.9
0.30
0.18
DETAIL
OPTIONAL TERMINAL
TYPICAL
1.0
0.8
C
SEATING PLANE
0.05
0.00
0.08 C
5.6
0.1
2X 5.5
(0.2) TYP
13
44X 0.5
24
12
25
EXPOSED
THERMAL PAD
2X
5.5
49
SYMM
SEE TERMINAL
DETAIL
1
PIN 1 ID
(OPTIONAL)
36
37
48
SYMM
48X
0.5
0.3
48X
0.30
0.18
0.1
0.05
C A B
4219046/B 11/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RGZ0048D
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 5.6)
SYMM
48
37
48X (0.6)
1
36
48X (0.24)
6X
(1.22)
44X (0.5)
10X
(1.33)
49
SYMM
(6.8)
(R0.05)
TYP
( 0.2) TYP
VIA
25
12
24
13
10X (1.33)
6X (1.22)
(6.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4219046/B 11/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RGZ0048D
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.665 TYP)
(1.33) TYP
16X ( 1.13)
37
48
48X (0.6)
49
1
36
48X (0.24)
44X (0.5)
(1.33)
TYP
(0.665)
TYP
SYMM
(6.8)
(R0.05) TYP
25
12
METAL
TYP
13
24
SYMM
(6.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 49
66% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:15X
4219046/B 11/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
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warranties or warranty disclaimers for TI products. Unless TI explicitly designates a product as custom or customer-specified, TI products
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IMPORTANT NOTICE
Copyright © 2026, Texas Instruments Incorporated
Last updated 10/2025
