AFE2256TDU

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents AFE2256 SBAS693B – MARCH 2015 – REVISED MAY 2016 AFE2256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors 1 Features 2 Applications • • • • • • • 1 • • • • • 256 Channels On-Chip, 16-Bit ADC Photodiode Short Immunity High Performance: – Noise: 750 Electrons RMS (1.2-pC Input Charge Range) – Low Correlated Noise – Integral Nonlinearity: ±2 LSB with Internal 16-Bit ADC – Scan Time: – < 20 µs to 204.8 µs Integration: – Six Selectable, Full-Scale Input Ranges: 0.6 pC (Min) to 9.6 pC (Max) – Internal Timing Generator (TG) – Built-In Correlated Double Sampler – Pipelined Integrate and Read for Improved Throughput: Allows Data Read During Integration – Serial LVDS Output Simple Power-Supply Scheme: – AVDD1 = 1.85 V – AVDD2 = 3.3 V Low Power Consumption Nap and Total Power-Down Mode Custom Chip-On-Film (COF) Packages Flat-Panel, X-Ray Detectors Charge Detectors Capacitance Measurement 3 Description The AFE2256 is a 256-channel, analog front-end (AFE) designed to suit the requirements of flat-panel detector (FPD)-based digital x-ray systems. The device includes 256 integrators , a programmable gain amplifier (PGA) for full-scale charge level selection, a correlated double sampler (CDS) with dual banking, and 256:4 analog multiplexers. The device also features four 16-bit successiveapproximation register (SAR) analog-to-digital converters (ADCs). Serial data from the ADCs are available in low-voltage differential signaling (LVDS) format. The Nap and power-down modes enable substantial power saving that is especially useful in batterypowered systems. To request a full datasheet or other design resources: request AFE2256 Device Information(1) PART NUMBER AFE2256 PACKAGE COF (320) BODY SIZE (NOM) 38.00 mm × 28.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. AFE2256 Schematic VREF Integrators and CDS MUX 16-Bit ADC[3:0] DCLK_P, DCLK_M ADC ADC ADC TFT Switch Pixel Cap [255:0] AFE2256 Reference Voltage LVDS Serializer 255-0 DOUT_P, DOUT_M FCLK_P, FCLK_M Timing and Control SPI MCLK, SYNC, TP_SEL SDATA, SDOUT, SCLK, SEN 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AFE2256 SBAS693B – MARCH 2015 – REVISED MAY 2016 www.ti.com Table of Contents 1 2 3 4 5 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device and Documentation Support.................... 1 1 1 2 3 5.1 5.2 5.3 5.4 6 Documentation Support ............................................ Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 3 3 3 3 Mechanical, Packaging, and Orderable Information ............................................................. 3 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (July 2015) to Revision B • Added link to request full data sheet ...................................................................................................................................... 1 Changes from Original (March 2015) to Revision A • 2 Page Page Released to production .......................................................................................................................................................... 1 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: AFE2256 AFE2256 www.ti.com SBAS693B – MARCH 2015 – REVISED MAY 2016 5 Device and Documentation Support 5.1 Documentation Support 5.1.1 Related Documentation TPS7A8300 Data Sheet, SBVS197 5.2 Trademarks All trademarks are the property of their respective owners. 5.3 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 5.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: AFE2256 3 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) AFE2256TDR ACTIVE COF TDR 325 32 RoHS & Green AU Level-1-260C-UNLIM 0 to 85 AFE2256TDR AFE2256TDU ACTIVE COF TDU 320 35 RoHS & Green AU Level-1-260C-UNLIM 0 to 85 AFE2256TDU (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of