AFE4300PN

Order Now Product Folder Support & Community Tools & Software Technical Documents AFE4300 SBAS506 – AUGUST 2019 AFE4300 Low-Cost, Integrated Analog Front-End for Weight-Scale and Body Composition Measurement 1 Features 3 Description • The AFE4300 is a low-cost analog front-end incorporating two separate signal chains: one chain for weight-scale (WS) measurement and the other for body composition measurement (BCM) analysis. A 16-bit, 860-SPS analog-to-digital converter (ADC) is multiplexed between both chains. The weight measurement chain includes an instrumentation amplifier (INA) with the gain set by an external resistor, followed by a 6-bit digital-to-analog converter (DAC) for offset correction, and a circuit to drive the external bridge/load cell with a fixed 1.7 V for ratiometric measurements. 1 • • Weight-scale front-end: – Supports up to four load cell inputs – On-chip load cell 1.7-V excitation voltage for ratiometric measurement – 68-nVrms Input-Referred noise (0.1 Hz to 2 Hz) – Best-fit linearity: 0.01% of full-scale – Weight-scale measurement : 540 µA Body composition front-end: – Supports up to three tetra-polar complex impedance measurements – 6-Bit, 1-MSPS sine-wave generation digital-toanalog converter (DAC) – 247.5-µArms, ±20% Excitation source – 0.1-Ω Measurement RMS noise in 2-Hz BW – Body composition measurement : 970 µA Analog-to-digital converter (ADC): – 16 Bits, 860 SPS – Supply current: 110 µA The AFE4300 can also measure body composition by applying a sinusoidal current into the body. The sinusoidal current is generated with an internal pattern generator and a 6-bit, 1-MSPS DAC. A voltage-to-current converter applies this sinusoidal current into the body, between two terminals. The voltage created across these two terminals as a result of the impedance of the body is measured back with a differential amplifier, rectified, and the amplitude is extracted and measured by the 16-bit ADC. The AFE4300 operates from 2 V to 3.6 V, is specified from 0°C to +70°C, and is available in a LQFP-80 package. 2 Applications Weight scales measurements with body composition Device Information(1) PART NUMBER AFE4300 PACKAGE BODY SIZE (NOM) LQFP (80) 12.00 mm × 12.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Functional Block Diagram RG CLK OUTx_FILT AVDD VLDO INPx A1 MUX INMx + y A2 offset STE VSENSEPx Patient & ESD Protection VSENSEMx SDIN MUX MUX Full Wave Rectifier A3 ADC (16bit, 860SPS) SPI SDOUT SCLK RDY IOUTPx Zs Patient & ESD Protection I/Q Demodulator MUX IOUTMx 0.9V VDAC_FILT_IN 1.5k +/- 20% VDACOUT CLK DAC (6bit) DDS (10bits) Reference AUXx LDO VREF VLDO AVSS 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AFE4300 SBAS506 – AUGUST 2019 www.ti.com 4 Device and Documentation Support 4.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 4.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 4.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 4.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 2 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: AFE4300 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) AFE4300PN ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR 0 to 70 AFE4300 AFE4300PNR ACTIVE LQFP PN 80 1000 RoHS & Green NIPDAU Level-3-260C-168 HR 0 to 70 AFE4300 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of