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AFE5804EVM

AFE5804EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    AFE5804 - Interface, Analog Front End (AFE) Evaluation Board

  • 数据手册
  • 价格&库存
AFE5804EVM 数据手册
User's Guide SLOU241A – September 2008 – Revised March 2015 AFE5804EVM The AFE5804EVM is an evaluation tool designed for the ultrasound analog front-end (AFE) device AFE5804. In order to deserialize the outputs of the AFE5804, use of the ADSDeSer-50EVM during evaluation is also recommended. Contents Introduction ................................................................................................................... 2 1.1 Features .............................................................................................................. 2 1.2 Power Supplies ..................................................................................................... 2 1.3 Indicators............................................................................................................. 2 2 Board Configuration ......................................................................................................... 4 2.1 I/O and Power Connectors ........................................................................................ 4 2.2 Jumpers and Setup ................................................................................................. 5 2.3 Test Points ........................................................................................................... 7 3 Board Operation ............................................................................................................. 8 3.1 Software Installation and Operation .............................................................................. 8 3.2 Hardware Setup ................................................................................................... 10 3.3 Clock Selection .................................................................................................... 11 3.4 Data Analysis ...................................................................................................... 11 4 Schematics and Layout .................................................................................................... 12 4.1 Schematics ......................................................................................................... 12 4.2 PCB Layout ........................................................................................................ 12 4.3 Bill of Materials .................................................................................................... 20 5 Typical Performance ....................................................................................................... 23 Appendix A TSW1400 for Evaluating AFE5804/5 .......................................................................... 24 Appendix B High Speed Data Converter Pro (HSDCPro) GUI Installation ............................................... 28 1 List of Figures 1 AFE5804EVM LED Locations .............................................................................................. 3 2 AFE5804EVM I/O Connectors and Locations 3 Locations of Jumpers, JTAG, and Switches on the AFE5804EVM ................................................... 5 4 Default Setup for Jumpers .................................................................................................. 6 5 AFE5804EVM USB SPI Interface for TGC Mode 6 AFE5804EVM USB SPI Interface for CW Mode......................................................................... 9 7 AFE5804EVM USB SPI Interface for ADC Setup...................................................................... 10 8 Typical AFE5804 Bench Setup ........................................................................................... 11 9 Clock Selection Jumper Configurations ................................................................................. 11 10 Top Layer, Signal........................................................................................................... 12 11 Inner Layer 1, Ground ..................................................................................................... 13 12 Inner Layer 2, Signal ....................................................................................................... 14 13 Inner Layer 3, Power....................................................................................................... 15 14 Inner Layer 4, Ground ..................................................................................................... 16 15 Bottom Layer, Signal ....................................................................................................... 17 16 Top Silk Screen Layer ..................................................................................................... 18 ........................................................................... ....................................................................... 4 8 SPI is a trademark of Motorola, Inc.. SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 1 Introduction www.ti.com 17 Bottom Silk Screen Layer ................................................................................................. 19 18 Typical Performances of AFE5804....................................................................................... 23 19 User Interface: Step-by-Step setup ...................................................................................... 24 20 User Interface: Frequency Load Value to Signal Generator .......................................................... 25 21 TSW1400 Interface 26 22 Analysis of Noncoherent Sampled Data 27 23 24 25 26 27 28 29 30 31 ........................................................................................................ ................................................................................ HSDCPro Install (Begin)................................................................................................... HSDCPro Install (Install Directory) ....................................................................................... HSDCPro Install (TI License Agreement) ............................................................................... HSDCPro Install (NI License Agreement) ............................................................................... HSDCPro Install (Start Installation) ...................................................................................... HSDCPro Install (Installation Progress) ................................................................................. HSDCPro Install (Installation Complete) ................................................................................ HSDCPro Install (h) ........................................................................................................ HSDCPro Install ............................................................................................................ 28 29 30 31 32 33 34 35 35 List of Tables 1 1 AFE5804EVM Default Settings When Powered On ................................................................... 10 2 Channel-to-Channel Matching Between the AFE5804EVM and ADSDeSER-50EVM ............................ 11 3 Bill of Materials ............................................................................................................. 20 Introduction The AFE5804 includes an 8-channel, voltage-controlled amplifier (VCA) and an 8-channel, 50-MSPS analog-to-digital converter (ADC). The outputs of the ADC are 8-channel LVDS outputs, which can be deserialized by the ADSDeSer-50EVM. The AFE5804 evaluation module (EVM) provides an easy way to examine the performance and functionalities of AFE5804. 1.1 Features • • • • • • • • 1.2 Characterizes the AFE5804 Supports CW functionalities test Provides 8-channel, low-voltage differential signal (LVDS) outputs from the ADC Compatible with the standard TI LVDS deserializer ADSDeSer-50EVM Communicates with a personal computer (PC) through a USB interface RS-232 interface also can be configured in case users wish to control the AFE5804 with a microcontroller. MSP430 programming is required. Includes multiple power management solutions for the AFE5804 and other devices. Onboard Vcntl generator (0 V - 1.2 V). Power Supplies The AFE5804EVM requires only ±5-V power supplies for operation. 1.3 Indicators The AFE5804EVM has four LEDs onboard as shown in Figure 1. The states of these LEDs demonstrate the normal operation of the AFE5804EVM. • LED1, LED2: +3.3-VA and +3.3-VD power supply indicators. They show the normal operation of 3.3-V power regulators. • LED 3: MCU operation indicator. Flashing state can indicate the normal operation of the MSP430 when the MSP430 is appropriately programmed. • LED 4: 1.8-V power indicators 2 AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Introduction www.ti.com LED 1, 2 LED 3 LED 4 Figure 1. AFE5804EVM LED Locations SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 3 Board Configuration 2 www.ti.com Board Configuration This section describes in detail the locations and functionalities of inputs, outputs, jumpers, and test points of the AFE5804EVM. 2.1 I/O and Power Connectors Pin A1 of the AFE5804 is marked by a white dot on its package as well as a white dot on the board. The positions and functions of the AFE5804EVM connectors are discussed in this section. Vctrl In R12 +/- 5V PWR CW Out Low Jitter CLK In Ext CLK In USB LVDS Outputs Figure 2. AFE5804EVM I/O Connectors and Locations • • • • • • • • • • • 4 Analog Inputs Ch1-Ch8 (J1-J3, J5-J7, J9, J10): Single-ended analog signal inputs with 50-Ω termination and AC-coupling CW Output (J4): CW output after I/V translator Vcntl Input (J8 optional): VCA gain control voltage of AFE5804, 0 V to 1.2 V, when this SMA connector is used, shunt P3 must be removed. . Low-Jitter CLK Source Input (J11): This input accepts clocks with low-jitter noise, such as HP8644 output. 20- to 50-MHz, 50% duty-cycle clock with 1- to 2-Vrms amplitude can be used. When J11 is used, ensure that shunts P18, P23, and P22 are removed. External CLK Input (J13): ADC Clock input, such as FPGA outputs. However, the AFE5804 does not achieve satisfactory performances due to the high-jitter noise of the clock. ±5-V PWR connector (P2): Power supply input Regulated power supply outputs (P1, P4, and P24): 3.3-VA, 3.3-VD, 2.5-VA, 1.8-VD outputs. Connectors need to be installed. RS-232 Input (P17): PC serial port interface for setting AFE5804 USB input (P25): USB interface to control the AFE5804 (default) LVDS Outputs Ch1-Ch8 (P26): Differential LVDS data outputs R12 is used to adjust the onboard Vcntl from 0 V to 1.2 V. P3 must be shorted when onboard Vcntl is used. AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Board Configuration www.ti.com 2.2 Jumpers and Setup In the following detailed description, the board has been set to default mode (see Figure 3). P3 P5 S1 P8 SW2 P18 P16 P15 P14 P13 P11 P9 P12 P7 SW1 P6 P10 P20 P19 P22 P23 Figure 3. Locations of Jumpers, JTAG, and Switches on the AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 5 Board Configuration www.ti.com Figure 4. Default Setup for Jumpers • • • • • 6 P5: Power-down pin for the VCA section of the AFE5804. Grounded (default mode) or High (+3.3 VD) for power-down mode. P6, P10: AFE5804 ADC clock input selection: Transformer-based differential clock, single-ended LVCMOS clock, or future clock option (needs U4 for support). The default mode uses the transformerbased differential clock. P7: MSP430 microcontroller JTAG interface P8: MAX3221 (RS-232) power-off jumper. When the jumper is removed, MAX3221 is completely powered off. In the default mode, the jumper is uninstalled because the USB interface is used. P9: SPI™ interface for U4. AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Board Configuration www.ti.com • • • • • • • • • • • • • 2.3 P11: TI internal use. Default is floating. P12: Power-down pin for ADS. Active High (+3.3 VD). Floating for default mode. P13: External ADS reference voltage inputs. Floating in the internal reference mode. P14: EN_SM: In the default mode, P14 connects to +3.3 VD, and the state machine is enabled. The AFE5804 is operated using only one SPI port (ADS SPI port). P15: RST pin; connects to H4 in the default mode through 0-Ω resistors. P16: Debug port for monitoring VCA and ADS SPI signals. P19: TI internal use. Connects to 3.3 VD. P20: INT/EXT reference mode selection. +3.3 VD for the internal reference mode (default); GND for the external reference mode. P22: Uses onboard 40-MHz clock or external clock through J13. The default mode uses the onboard clock P23: Power-on onboard 40-MHz clock generator. Default is on. P18: Because U4 is uninstalled, this jumper must be set as Figure 4 shows S1: MSP430 reset button SW1, SW2: CW outputs summation switch. Individual CW output current can be summed through the I/V translator U1 when its corresponding switch is set to ON. Test Points Multiple test points are provided on the EVM. Detail descriptions follow. Under normal operation mode, it is unnecessary to measure voltages at most of these test points. • TP1: GND • TP2: GND • TP3: VCM • TP4: Vcntl test point • TP5: GND • TP6: GND • TP7: Test point, TI internal only • TP8: +5 V • TP9: CM • TP10:GND • TP11: -5 V SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 7 Board Operation 3 www.ti.com Board Operation This section describes how to operate the AFE5804EVM for evaluation purposes. Both software and hardware installation and operation are discussed. 3.1 Software Installation and Operation The AFE5804EVM has USB SPI software and AFE58XXEVM driver that are located on the TI website on the AFE5804 product folder under Tools & software. Run the AFE58XXEVM Driver install.exe and the setup.exe to install the driver and software, respectively. The personal computer (PC) recognizes the EVM after software installation. To launch the software after successful installation, click: Start Menu → All Programs → Texas Instruments → AFE5804EVM USB SPI → AFE5804EVM USB SPI Three different modes are shown in Figure 5, Figure 6, and Figure 7. The software updates the AFE5804 registers as soon as users change any current setup (i.e., the program sends out new register values due to any value change). It is recommended that users change at least one register value before measurement. Therefore, the register values in a device can be synchronized to the displayed values on the software interface. In most cases, users only need to change the VCA setup. The ADC setup can remain the same as the integrated circuit (IC) is powered up. Figure 5. AFE5804EVM USB SPI Interface for TGC Mode 8 AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Board Operation www.ti.com Figure 6. AFE5804EVM USB SPI Interface for CW Mode SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 9 Board Operation www.ti.com Figure 7. AFE5804EVM USB SPI Interface for ADC Setup 3.2 Hardware Setup When the AFE5804EVM is powered on in the default mode, the AFE5804 is set as described in Table 1. Table 1. AFE5804EVM Default Settings When Powered On VCA ADS TGC mode 1 Single End Clock PGA = 20 dB Digital Gain = 0 Filter = 17 MHz Other parameters are as stated in data sheet Initial measurements can be made under these default settings. See the AFE5804 data sheet (SBOS442) for additional settings. As previously mentioned, the deserializer ADSDeSER-50EVM is required. See details in the ADSDeSER50EVM user's guide (SBAU091). An example bench setup is shown in Figure 7. Band-pass filters are required for signal source in order to ensure the correct SNR measurements of the AFE5804. 10 AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Board Operation www.ti.com PC+GPIB +LabVIEWTM Log. Analyzer 16500C Fun. Gen. Signal+ BPF Fun. Gen. CLK AFE5804EVM +ADSDeSER (LabVIEW is a trademark of National Instruments Corporation.) Figure 8. Typical AFE5804 Bench Setup The channel order of the AFE5804 outputs is not the same as that of the ADS527x outputs. Consequently, the channel number on the ADSDeSER-50EVM or AFE5804EVM can be misleading. Table 1 provides channel-to-channel sequence matching between the ADSDeSER-50EVM and the AFE5804EVM. Table 2. Channel-to-Channel Matching Between the AFE5804EVM and ADSDeSER-50EVM AFE5804 FCLK CH4 CH3 CH2 CH1 CH5 CH6 CH7 CH8 LCLK ADSDESER FCLK CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 LCLK For example, when an analog signal is present on CH1 of the AFE5804EVM, the corresponding 12-bit digital output can be seen on CH4 of the ADSDeSER-50EVM. 3.3 Clock Selection The AFE5804 can be clocked through a transformer-based differential clock, single-ended clock, or future clock input options provided by U4 as Figure 9 shows. (b) Single-Ended Clock (a) Transformer Default (c) Future CLK Input Option Based on U4 Figure 9. Clock Selection Jumper Configurations The clock source of the EVM can be the onboard 40-MHz clock, HP8644 low-jitter clock source, or external clock source. The best performance of this EVM is achieved when the low-jitter clock source HP8644 is used. P22, P23, and P18 must be removed in order to disable the onboard clock. When HP8644 or similar clock sources are unavailable, the onboard 40-MHz clock is the desirable source. The jumpers P22, P23, and P18 must be configured as shown in Figure 4 (i.e., the default setup for AFE5804EVM). In this mode, the transformer-based differential clock is used. 3.4 Data Analysis Based on the data file acquired by a logic analyzer, the performance of AFE5804 can be evaluated. Appendix A provides one solution (TI TSW1400 software) to analyze the data file captured. Coherent sampling is recommended but is not mandatory. Due to the frequency accuracy requirement of coherence sampling, two HP8644s are required for generating an ADC clock and analog signal. For most users, this may be infeasible. Data analysis based on windowing is a more suitable approach. SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 11 Schematics and Layout 4 www.ti.com Schematics and Layout This section provides the schematics, the AFE5804EVM board layout, and the bill of materials. 4.1 Schematics The schematics appear at the end of the document. 4.2 PCB Layout The AFE5804EVM uses a six-layer printed-circuit board. The following figures show each layer. Figure 10. Top Layer, Signal 12 AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Schematics and Layout www.ti.com Figure 11. Inner Layer 1, Ground SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 13 Schematics and Layout www.ti.com Figure 12. Inner Layer 2, Signal 14 AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Schematics and Layout www.ti.com Figure 13. Inner Layer 3, Power SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 15 Schematics and Layout www.ti.com Figure 14. Inner Layer 4, Ground 16 AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Schematics and Layout www.ti.com Figure 15. Bottom Layer, Signal SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 17 Schematics and Layout TP1 J3 GND C2 R3 R6 EP1 R5 C3 +5V G -5V C C Y1 LED4 FB6 LED3 FB7 C42 R47 + R45 DOUT R46 A R33 R29 R30 R31 R32 VCA_SDATA VCA_SCLK C43 + C39 +1.8V G AFE5804 CH4 CH3 CH2 CH1 CH5 CH6 CH7 CH8 ADSDESER CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 P21 U6 FB9 1 2 + C48 5 4 3 2 1 P24 +3.3VD P19 P20 VCA_CSZ R36 R37 R35 R34 REFB GND REFT ADS_CSZ C40 INT/EXT ADS_SDATA ADS_SCLK C46 A P23 R48 C H4 R49 C45 FB8 P22 FB5 CLK IN TP9 U3 C41 C38 C37 R42 EP5 R41 C36 GND U5 TP10 C44 EXT/INT GND R43 FB3 FB2 R44 FB4 GND U4 EP4 P12 TP7 TP EP6 P13 RST P15 EN_SM P14 C26 C31 J13 ADS_PD C C29 C28 EP3 C27 J12 +3.3VD R27 P18 C30 P16 ADS_RET + CW4 P11 P10 C32 C33 R39 C34 R22 C35 LED5 R40 TP6 CW0 CW5 C25 J10 P17 U2 C24 R38 P9 C22 C23 R28 P8 SW2 R21 S1 C16 DUT1 CW9 GND TP2 CH5 P7 +3.3VD DIFF1 Single R25 DIFF2 C18 SW1 P2 TP8 +5V GND C19 C20 C21 R23 R65 CH6 J7 PWR J11 P6 D2 D3 GND R24 H1 VCA_PD +3.3 T2 C17 P5 TP5 TP3 VCM R20 2.5V G TP4 C C12 R17 A 1 2 C13 LED1 LED2 TP11 -5V C5 R16 L1 C15 C14 R18 U1 R19 P3 J8 J9 R8 FB1 P1 C11 R13 C9 R14 P4 R15 C10 R12 J6 C7 R10 C8 D1 Vctrl CH1 C124 CH7 R11 J4 J1 T1 R4 C4 A R2 S/N: AFE5804EVM RevB CH2 TI 06/2008 R7 +3.3VA G G 3.3VD C1 J5 C6 R1 EP2 CH8 R9 CH4 J2 1 2 3 4 CH3 A H2 CW OUT www.ti.com C47 P25 C49 H3 Figure 16. Top Silk Screen Layer 18 AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Schematics and Layout www.ti.com Figure 17. Bottom Silk Screen Layer SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 19 Schematics and Layout 4.3 www.ti.com Bill of Materials Table 3. Bill of Materials Item MFG MFG Part Number RefDes Value or Function 1 TI MSP430F1232IPW U3 MIXED SIGNAL MICROCONTROLLER 2 KEMET C0402C103K3RAC C9 CAPACITOR,SMT,0402,CER,0.01μF,25V,10%,X7R 3 KEMET C0402C104K8PAC C1, C2, C3, C4, C5, C6, C7, C8, C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20, C21, C22, C23, C24, C25, C26, C27, C28, C29, C30, C32, C33, C34, C35, C40, C41, C42, C45, C46, C47, C51, C52, C53, C55, C56, C58, C60, C63, C64, C67, C69, C70, C71, C72, C73, C74, C75, C76, C77, C78, C79, C80, C81, C82, C83, C84, C85, C86, C87, C88, C89, C90, C91, C93, C94, C96, C100, C101, C102, C103, C104, C105, C106, C107, C108, C109, C110, C111, C112, C113, C114, C115, C116, C117, C118, C119, C120, C121, C122, C123, C124 CAPACITOR,SMT,0402,CER,0.1μF,10V,10%,X5R 4 PANASONIC ECJ-0EC1H100D C66, C95, C97 CAPACITOR,SMT,0402,CER,10pF,50V,±0.5pF,NPO 5 MURATE GRM155R60J225ME15D C37, C92 CAPACITOR,SMT,0402,CERAMIC,2.2μF,6.3V,20%,X5R 6 PANASONIC ECJ-1VB0J475K C36 CAPACITOR,SMT,0603,CER,4.7μF,6.3V,10%,X5R 7 TAIYO YUDEN JMK107BJ106MA-T C31, C38 CAPACITOR,SMT,0603,CER,10μF,6.3V,20%,X5R 8 MURATA GRM31CR60J476ME19B C44 CAPACITOR,SMT,CER,1206,47μF,6.3V,20%,X5R 9 AVX TACR475M020R C98, C99 CAP,SMT,TAN,0805,4.7μF,20V,20%,R-CASE 10 AVX TPSC226K016R0375 C39, C43, C48, C49, C50, C54, C57, C59, C61, C62, C65, C68 10%, 16V, 22μF 11 SAMTEC SMA-J-P-X-ST-EM1 J1, J2, J3, J5, J6, J7, J9, J10, J13 SMA JACK EDGE MOUNT,062PCB,BRASS/GOLD,STRAIGHT,50 Ω 12 SAMTEC SMA-J-P-H-ST-TH1 J4, J8, J11, J12 SMA COAX STRAIGHT PCB JACK,SMT,175TL,50 Ω,GOLD 13 TYCO ELECTRONICS 745781-4 P17 DSUB, 9 PIN, R/A FEM 14 ADVANCED CONNECTER MNE20-5K5P10 P25 MINI-AB USB OTG RECEPTACLE R/A SMT TYPE 15 USCC HC-18/U-4.1943M Y1 4.194300 MHz 16 EPSON TOYOCOM HF-372A(UNINSTALLED) F1 CRYSTAL FILTER UNINSTALLED 17 TI N/A U4 (UNINSTALLED) 18 Not Installed PAD0201(UN) EP4, EP6 ( Uninstalled Part ) EMPTY PAD,SMT,0201 19 Not Installed PAD0402(UN) EP1, EP2 ( Uninstalled Part ) EMPTY PAD,SMT,0402 20 MURATA BLM15BD102SN1D FB2, FB3, FB4, FB8, FB22, FB23, FB24, FB25, FB26, FB27, FB28, FB29, FB30 FERRITE BEAD,SMT,0402,1 kΩ,200mA 21 MURATA BLM18EG601SN1D FB31 FERRITE BEAD,SMT,0603,600 Ω at 100MHz,25%,500mA 22 STEWARD HI0805R800R-00 FB6, FB7, FB9, FB10, FB13, FB14, FB15, FB16, FB17, FB18, FB19, FB20, FB21 FERRITE,SMT,0805,80 Ω at 100MHz 23 STEWARD LI1206H151R-00 FB5 FERRITE,SMT,1206,150 Ω at 100MHz,0.8A 24 MOLEX 39357-0003 P2 HEADER, THRU, POWER, 3P,3.5MM, EUROSTYLE 25 SAMTEC QTH-040-01-L-D-DP-A P26 HEADER,SMT,80P,0.5mm,FEM,DIFF PAIR,RECEPTACLE,168H 26 SAMTEC SSQ-104-02-F-D P9 HEADER,THU,8P,2x4,100LS,FEM,VERT,194TL 27 SAMTEC TSW-103-08-G-D P6, P10 HEADER,THU,6P,2x3,MALE,DUAL ROW,100LS,200TL 28 SAMTEC TSW-107-07-G-D P7 HEADER,THU,14P,2x7,MALE,DUAL ROW,100LS,100TL 29 SAMTEC TSW-108-07-G-D P16 HEADER,THU,16P,2x8,MALE,DUAL ROW,100LS,100TL(UNINSTALLED) 30 TYCO ELECTRONICS 103321-2 P3, P8, P12, P21, P23 HEADER W/SHUNT,2P,100LS 20 AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Schematics and Layout www.ti.com Table 3. Bill of Materials (continued) Item MFG MFG Part Number RefDes Value or Function 31 MOLEX 22-23-2021-P P4, P24 MALE,2PIN,.100CC W/ FRICTION LOCK 32 MILL-MAX 350-10-103-00-006 P13, P18, P22 HEADER,THU,MAL,0.1LS,3P,1x3,284H,110TL 33 MOLEX 22-23-2041 P1 4P, VERT, FRICTION LOCK 34 TYCO ELECTRONICS 4-103239-0x3 P5, P11, P14, P15, P19, P20 HEADER,THU,MAL,0.1LS,3P,1x3 35 TI AFE5804 DUT1 AFE5804 8-CH ULTRASOUND ANALOG FRONT END 36 MAXIM MAX3221CAE U2 RS-232 TRANSCEIVERS 37 MOTOROLA MMBD7000LT1 D1, D2 DUAL SWITCHING DIODE 38 PHILIPS BAP50-04 D3 PIN DIODE SOT 23 SINGLE JUNCTION 39 TI TPS79633DCQR U7(UNINSTALLED), U8 ULTRALOW-NOISE HI PSRR FAST RF 1-A LDO LINEAR REGULATOR,3.3V 40 TI/BURR-BROWN OPA820IDBV U1 UNITY-GAIN STABLE LOW NOISE VOLTAGE FEEDBACK OPAMP 41 TI TPS79318DBV U6 1.8V,ULTRALOW-NOISE HI PSRR FAST RF 200mA LDO LINEAR REGULATOR 42 TI TPS79325DBV U9 2.5V,ULTRALOW-NOISE HI PSRR FAST RF 200mA LDO LINEAR REGULATOR 43 FUTURE TECHNOLOGY DEVICE INT. FT245RL U10 USB FIFO IC INCORPORATE FTDICHIP-ID SECURITY DONGLE 44 PANASONIC ELJFA221J L1 220μH, 5% 45 TAIYO-YUDEN LK 1608 330M FB1, FB11, FB12 INDUCTOR,SMT0603,33.0μH,20% 46 PANASONIC LNJ308G8PRA LED1, LED2, LED3, LED5 LED,SMT,0603,PURE GREEN,2.03V 47 PANASONIC LNJ808R8ERA LED4 LED,SMT,0603,ORANGE,1.8V 48 ECS ECS-3953M-400-BN U5 OSC,SMT,3.3V,50ppm,–40~85C,5nS,40.000 MHz 49 PANASONIC ERJ-2GE0R00X R26, R27, R40, R42, R44, R48, R53, R55, R56, R63, R65 RESISTOR/JUMPER,SMT,0402,0 Ω,5%,1/16W 50 PANASONIC ERJ-2GEJ0000(UN) R6, R7, R29, R30, R31, R32, R34, R35, R36, R37, R39, R43, R46, R49, R54, R59, R60, R62, R64 UNINSTALLED PART 51 PANASONIC ERJ-2GEJ131 R66, R69 RESISTOR, SMT, 0402, 130 Ω, ±1%, 1/16W 52 PANASONIC ERJ-2GEJ49R9(UN) R4, R9, R22 UNINSTALLED PART 53 PANASONIC ERJ-2RKF5602X R57 RESISTOR, SMT, 0402, 56K Ω, 1%, 1/16W 54 PANASONIC ERJ-2GEJ820 R67, R68 RESISTOR, SMT, 0402, ±5%,82 55 PANASONIC ERJ-2RKF1000X R24, R25 RESISTOR,SMT,0402,100 Ω,1%,1/16W 56 PANASONIC ERJ-2RKF1001X R13, R14, R18, R47 RESISTOR,SMT,0402,1.00K,1%,1/16W 57 PANASONIC ERJ-2RKF1002X R33, R58 RESISTOR,SMT,0402,10.0K,1%,1/16W 58 PANASONIC ERJ-2RKF2000X R52 RES,SMT,0402,200 Ω,1%,1/16W 59 PANASONIC ERJ-2RKF3320X R16, R20, R38, R45 RES,SMT,0402,332 Ω,1%,1/16W 60 PANASONIC ERJ-2RKF4020X R8 RES,SMT,0402,402 Ω,1%,1/16W 61 PANASONIC ERJ-2RKF4992X R28 RESISTOR,SMT,0402,49.9K,1%,1/16W 62 PANASONIC ERJ-2RKF49R9X R1, R2, R3, R5, R10, R11, R15, R17, R21, R23, R61 RESISTOR,SMT,0402,49.9 Ω,1%,1/16W 63 PANASONIC ERJ-2RKF7500X R50, R51 RES,SMT,0402,750 Ω,1%,1/16W 64 VISHAY CRCW06031742F R19 RES,SMT,0603,17.4K Ω, 1% 65 PANASONIC ERJ-6RQF5R1V R41 SMT,RES,0805,1/8W, 1%, 5.1 Ω 66 PANASONIC ERJ-1GE0R00C EP3, EP5 RESISTOR,SMT,0201,THICK FILM,0 Ω,5%,0 Ω JUMPER,1/20W 67 C&K TD06H0SK1 SW1, SW2 DIP SWITCH,SMT,6POS,SPST,MINIATURE 68 PANASONIC EVQPE104K S1 SQUARE LIGHT TOUCH SWITCH,SMT,SPST 69 KEYSTONE ELECTRONICS 5005 TP8 TESTPOINT,THU,COMPACT,0.125LS,130TL, RED 70 KEYSTONE ELECTRONICS 5006 TP1, TP2, TP5, TP6, TP10 TESTPOINT,THU,COMPACT,0.125LS,130TL, BLACK 71 KEYSTONE ELECTRONICS 5006(UN) TP3, TP4, TP7, TP9 UNINSTALLED PART ( TEST POINT ) SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 21 Schematics and Layout www.ti.com Table 3. Bill of Materials (continued) Item MFG MFG Part Number RefDes Value or Function 72 KEYSTONE ELECTRONICS 5007 TP11 TESTPOINT,THU,COMPACT,0.125LS,130TL, WHITE 73 MINI-CIRCUITS ADTI-6T T1(UNINSTALLED), T2 RF TRANSFORMER WIDEBAND, 0.03-125 MHz 74 BOURNS 3296W-1-103 R12 TRIMPOT,THU,10K,10%,0.5W,100ppm,25T 75 AMP 531220-2 P3, P8, P12, P21, P23 SHUNTS 76 KEYSTONE ELECTRONICS 1892 H1,H2,H3,H4; (H3 and H4 are UNINSTALLED) STANDOFF HEX 4-40 THR 0.375”L ALUM 77 BUILDING FASTENERS PMS 440 0025 SL H1,H2,H3,H4; (H3 and H4 are UNINSTALLED) SCREW MACHINE SLOTTED 4-40x1/4 22 AFE5804EVM SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Typical Performance www.ti.com 5 Typical Performance This section provides some typical performance characteristics of the AFE5804EVM to assist users in verifying their setup. After analysis of the data file acquired by a logic analyzer, the SNR of the AFE5804 should be better than 59 dB when the PGA is set to 30 dB, the filter is set to 12.5 MHz, the mode is set to TGC1, and Vctnl is set as 1 V. A typical performance plot of the AFE5804 is shown in Figure 18. (a) PGA = 30 dB, Vcntl = 1 V, Vin = 11 mVpp (b) PGA = 30 dB, Vcntl = 0.34 V, Vin = 290 mVpp Figure 18. Typical Performances of AFE5804 As Figure 18 shows, the SNR degrades as the gain increases; the HD degrades as the input signal increases. SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated AFE5804EVM 23 Appendix A SLOU241A – September 2008 – Revised March 2015 TSW1400 for Evaluating AFE5804/5 This appendix describes the use of TSW1400 software to analyze data files acquired by logic analyzers. As previously mentioned, coherent sampling is recommended when HP8644s are used. The calculation of coherent sampling rate and signal frequency can be found in the TSW1100 user's manual (SLWU087B). Users can set the calculated frequencies for signal generators; acquire ADC data through a logic analyzer; and save the data as a text file. Following the steps in the order as indicated in the following figure to set the test condition. Figure 19. User Interface: Step-by-Step setup 24 TSW1400 for Evaluating AFE5804/5 SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Appendix A www.ti.com Figure 20. User Interface: Frequency Load Value to Signal Generator SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated TSW1400 for Evaluating AFE5804/5 25 Appendix A www.ti.com Figure 21. TSW1400 Interface 26 TSW1400 for Evaluating AFE5804/5 SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Appendix A www.ti.com Figure 22. Analysis of Noncoherent Sampled Data SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated TSW1400 for Evaluating AFE5804/5 27 Appendix B SLOU241A – September 2008 – Revised March 2015 High Speed Data Converter Pro (HSDCPro) GUI Installation • • Download the HSDCPro GUI Installer using this link: HSDCPro GUI Unzip the saved folder and run the installer executable to obtain the pop-up shown in Figure 23. Click the Install button. Figure 23. HSDCPro Install (Begin) • 28 Leave the destination directories as the default location, for the TSW1400GUI installation and press the NEXT button as shown in Figure 24. High Speed Data Converter Pro (HSDCPro) GUI Installation SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Appendix B www.ti.com Figure 24. HSDCPro Install (Install Directory) • Read the License Agreement from Texas Instruments and select I accept the License Agreement and press the Next button as shown in Figure 25. SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback High Speed Data Converter Pro (HSDCPro) GUI Installation Copyright © 2008–2015, Texas Instruments Incorporated 29 Appendix B www.ti.com Figure 25. HSDCPro Install (TI License Agreement) • 30 Read the License Agreement from National Instruments and select I accept the License Agreement and press the Next button as shown in Figure 26. High Speed Data Converter Pro (HSDCPro) GUI Installation SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Appendix B www.ti.com Figure 26. HSDCPro Install (NI License Agreement) • Press the Next button as shown in Figure 27. SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback High Speed Data Converter Pro (HSDCPro) GUI Installation Copyright © 2008–2015, Texas Instruments Incorporated 31 Appendix B www.ti.com Figure 27. HSDCPro Install (Start Installation) • 32 The window shown in Figure 28 should appear indicating that the installation is in progress. High Speed Data Converter Pro (HSDCPro) GUI Installation SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Appendix B www.ti.com Figure 28. HSDCPro Install (Installation Progress) • The window shown in Figure 29 appears indicating Installation Complete. Press the Next button. SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback High Speed Data Converter Pro (HSDCPro) GUI Installation Copyright © 2008–2015, Texas Instruments Incorporated 33 Appendix B www.ti.com Figure 29. HSDCPro Install (Installation Complete) • 34 The window shown in Figure 30 appears briefly to complete the process. High Speed Data Converter Pro (HSDCPro) GUI Installation SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Appendix B www.ti.com Figure 30. HSDCPro Install (h) • As shown in Figure 31 a restart might be requested depending on whether or not the PC already had the National Instruments MCR Installer. If requested, hit the Restart button to complete the installation. Figure 31. HSDCPro Install SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback High Speed Data Converter Pro (HSDCPro) GUI Installation Copyright © 2008–2015, Texas Instruments Incorporated 35 Revision History www.ti.com Revision History Changes from Original (September 2008) to A Revision ............................................................................................... Page • • • Changed Default Setup for Jumpers image............................................................................................ 6 Changed Appendix A to TSW1400 software. ........................................................................................ 24 Added Appendix B: High Speed Data Converter Pro (HSDCPro) GUI Installation. ............................................ 28 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 36 Revision History SLOU241A – September 2008 – Revised March 2015 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan are NOT certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 本開発キットは技術基準適合証明を受けておりません。 本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated
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