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AFE7225IRGCR

AFE7225IRGCR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VQFN64_EP

  • 描述:

    IC AFE 12BIT 125/250MSPS 64VQFN

  • 数据手册
  • 价格&库存
AFE7225IRGCR 数据手册
AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Analog Front End Wideband Mixed-Signal Transceiver Check for Samples: AFE7222, AFE7225 1 INTRODUCTION 1.1 FEATURES 1 • AFE7225 – Dual 12-Bit 250MSPS TX DACs – Dual 12-Bit 125MSPS RX ADCs • AFE7222 – Dual 12-Bit 130MSPS TX DACs – Dual 12-Bit 65MSPS RX ADCs • OPTIONS – Dual 12-Bit Auxiliary DACs – Dual Input 12-Bit Auxiliary ADC 1.2 • • • • – – – – – – – – TX Path Interpolation by 2 or 4 RX Path Decimation by 2 3.0V/1.8V Supplies, Low Power Fast Wakeup Modes for Half-Duplex Coarse or Fine Digital Mixer Quadrature Modulation Corrections Clock Input Divide/Multiply Serial LVDS or Interleaved Parallel CMOS Interface – 64-Pin QFN Package (9mm × 9mm) APPLICATIONS Portable, Low Power Radio Wireless Infrastructure Point-to-Point Radio Pico-Cell BTS 1.3 DESCRIPTION The AFE7225/7222 is an analog front end designed for full- or half-duplex radios. Over-sampling transmit 12-bit DACs provide output frequencies from baseband to Nyquist. Under-sampling receive 12-bit ADCs allow analog inputs from baseband to ~230MHz. Most blocks within the AFE7225/7222 are independently controlled for optimization of power consumption versus utilization. Two auxiliary control 12-bit DACs and a dual input auxiliary monitoring 12-bit ADC are available via serial interface. Digital features include QMC (quadrature modulation correction), interpolation, decimation, RMS/peak power meter and mixers with independent NCOs for RX and TX path. The AFE7225/7222 is available in a 64-pin 9x9mm QFN package (RGC). The AFE7225/7222 is built on Texas Instrument’s low power analog CMOS process and is specified over the full industrial temperature range (–40°C to 85°C). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2012, Texas Instruments Incorporated AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. SYNC SYNC SYNC VCM ADC CLK Clock Divide/Multiply 12b Aux DAC AUXDAC_B 12b Aux DAC SYNC SYNC SYNC AUXADC_A AUXADC_B 2-1 MUX 12b Aux ADC Serial LVDS or Parallel CMOS (8 deep FIFO) SYNC DVDD18 = 1.8 V DVDD18_CLK = 1.8 V 2x HBF Interpolation Fine Mixer SYNC AUXDAC_A ±Fs/4 Coarse Mixer IOUTN_B_DAC 12b TX DAC B AVDD18_ADC = 1.8 V Internal Reference SYNC QMC Gain/ Phase IOUTP_B_DAC 12b TX DAC A DVDD18_DAC = 1.8 V NCO Inverse SINC IOUTN_A_DAC AVDD3_DAC = 3 V SYNC SYNC SYNC QMC Offset IOUTP_A_DAC AVDD3_AUX = 3 V NCO DAC CLK BIASJ 12-Bit ADC Outputs SYNC RX RMS / Peak Power Meter 2x HBF Interpolation CLKINP CLKINN Serial LVDS or Parallel CMOS 12b RX ADC B /2 HBF Decimation INP_B_ADC INN_B_ADC Fine Mixer 12b RX ADC A ±Fs/4 Coarse Mixer INP_A_ADC INN_A_ADC QMC Gain/ Phase DETAILED BLOCK DIAGRAM QMC Offset 1.4 SYNC SPI Interface, Registers and Control Thermal Pad = Ground 12-Bit DAC Inputs SYNC SEN SCLK SDATA SDOUT RESET PDN SYNC Figure 1-1. Block Diagram of AFE7222/AFE7225 2 INTRODUCTION Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 2 DEVICE INFORMATION 2.1 PACKAGE/ORDERING INFORMATION PRODUCT AFE7222 AFE7225 2.2 SPECIFIED TEMPERATURE RANGE PACKAGE DESIGNATOR PACKAGE-LEAD QFN-64 RGC QFN-64 –40°C to 85°C RGC ORDERING NUMBER TRANSPORT MEDIA, QUANTITY AFE7222IRGCT Tape and Reel PACKAGE MARKING AFE7222I –40°C to 85°C AFE7225I AFE7222IRGCR Tape and Reel AFE7222IRGC25 Tape and Reel AFE7225IRGCT Tape and Reel AFE7225IRGCR Tape and Reel AFE7225IRGC25 Tape and Reel DEVICE PINOUT, CMOS INPUT/OUTPUT MODE DVDD18 ADCDATA5 ADCDATA4 ADCDATA3 ADCDATA2 ADCDATA1 ADCDATA0 PDN SEN SDATA SCLK SDOUT RESET AVDD18_ADC VCM AVDD18_ADC RGC Package (Top View) ADCDATA6 INN_B_ADC 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 1 48 2 47 46 ADCDATA7 45 ADCDATA8 AVDD18_ADC ADC_DCLKOUT INP_B_ADC 3 AVDD18_ADC 4 INN_A_ADC 5 44 ADCDATA9 43 ADCDATA10 42 ADCDATA11 41 DVDD18 40 SYNCIN Thermal pad connected to ground INP_A_ADC 6 AVDD18_ADC 7 CLKINN 8 CLKINP 9 DVDD18_CLK 10 39 DACDATA0 64 QFN 64-QFN AVDD3_DAC 11 38 DACDATA1 IOUTP_A_DAC 12 37 DACDATA2 IOUTN_A_DAC 13 36 DACDATA3 AVDD3_DAC 14 35 DACDATA4 IOUTP_B_DAC 15 DAC_DCLKIN DACDATA5 DVDD18 DACDATA6 DACDATA7 DACDATA9 DACDATA8 DACDATA10 DACDATA11 AVDD18_ADC AUXADC_B AUXADC_A AVDD3_AUX AUXDAC_B AUXDAC_A DVDD18_DAC BIASJ AVDD3_DAC IOUTN_B_DAC 34 33 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Figure 2-1. Device Pinout, CMOS Input/Output Mode Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 DEVICE INFORMATION 3 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Table 2-1. Pin Configuration: CMOS Input/Output Mode PIN 4 DESCRIPTION NO. NAME 1 AVDD18_ADC 2 INN_B_ADC RX ADC channel B analog input, negative 3 INP_B_ADC RX ADC channel B analog input, positive 4 AVDD18_ADC 5 INN_A_ADC RX ADC channel A analog input, negative 6 INP_A_ADC RX ADC channel A analog input, positive 7 AVDD18_ADC 8 CLKINN main clock input, negative side if differential mode, TX side if single-ended 2 clock mode 9 CLKINP main clock input, positive side if differential mode, RX side if single-ended 2 clock mode 10 DVDD18_CLK 1.8V supply for Clocking circuit 11 AVDD3_DAC 3V supply for TX DACs 12 IOUTP_A_DAC TX DAC channel A current output, positive (current sink DACs) 13 IOUTN_A_DAC TX DAC channel A current output, negative (current sink DACs) 14 AVDD3_DAC 1.8V supply for RX ADCs 1.8V supply for RX ADCs 1.8V supply for RX ADCs 3V supply for TX DACs 15 IOUTP_B_DAC TX DAC channel B current output, positive (current sink DACs) 16 IOUTN_B_DAC TX DAC channel B current output, negative (current sink DACs) 17 AVDD3_DAC 18 BIASJ 19 DVDD18_DAC 20 AUXDAC_A auxiliary DAC channel A output, current sourcing up to 7.5mA (SPI programmable) 21 AUXDAC_B auxiliary DAC channel B output, current sourcing up to 7.5mA (SPI programmable) 22 AVDD3_AUX 3V supply for auxiliary ADC/DACs 23 AUXADC_A auxiliary ADC channel A input 24 AUXADC_B auxiliary ADC channel B input 25 AVDD18_ADC 26 DACDATA11 CMOS data input for TX data, MSB of TX DACs 27 DACDATA10 CMOS data input for TX data 28 DACDATA9 CMOS data input for TX data 29 DACDATA8 CMOS data input for TX data 30 DACDATA7 CMOS data input for TX data 31 DACDATA6 CMOS data input for TX data 32 DVDD18 33 DACDATA5 34 DAC_DCLKIN 35 DACDATA4 CMOS data input for TX data 36 DACDATA3 CMOS data input for TX data 37 DACDATA2 CMOS data input for TX data 38 DACDATA1 CMOS data input for TX data 39 DACDATA0 CMOS data input for TX data. LSB of TX DACs 40 SYNCIN CMOS sync input. Used to reset internal clock dividers and reset TX data FIFO pointer 41 DVDD18 1.8V supply for digital interface 42 ADCDATA11 CMOS data output for RX data, MSB of RX ADCs 43 ADCDATA10 CMOS data output for RX data 44 ADCDATA9 CMOS data output for RX data 45 ADCDATA8 CMOS data output for RX data 46 ADCDATA7 CMOS data output for RX data DEVICE INFORMATION 3V supply for TX DACs sets the TX DAC output current (resistor from pin to ground). Use 960 Ohm to set a full scale current of 20 mA. 1.8V DAC digital supply 1.8V supply for RX ADCs 1.8V supply for digital interface CMOS data input for TX data CMOS clock input for TX data. Send clock with data. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Table 2-1. Pin Configuration: CMOS Input/Output Mode (continued) PIN DESCRIPTION NO. NAME 47 ADC_DCLKOUT CMOS clock output for RX data 48 ADCDATA6 CMOS data output for RX data 49 DVDD18 1.8V supply for digital interface 50 ADCDATA5 CMOS data output for RX data 51 ADCDATA4 CMOS data output for RX data 52 ADCDATA3 CMOS data output for RX data 53 ADCDATA2 CMOS data output for RX data 54 ADCDATA1 CMOS data output for RX data 55 ADCDATA0 CMOS data output for RX data, LSB of RX ADCs 56 PDN Can be programmed as global powerdown (deep sleep), fast recovery powerdown (light sleep) or TX/RX switch. Active high. 57 SEN SPI enable (1.8V CMOS) 58 SDATA SPI data input (1.8V CMOS) 59 SCLK SPI clock input (1.8V CMOS) 60 SDOUT SPI data output (1.8V CMOS) 61 RESET Reset the SPI. Active high (1.8V CMOS). 62 AVDD18_ADC 63 VCM 64 AVDD18_ADC Thermal pad VSS 1.8V supply for RX ADCs Common mode voltage output. Outputs the ideal common mode input voltage for the ADC. Nominally around 0.95V. 1.8V supply for RX ADCs Connect thermal pad to the board ground Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 DEVICE INFORMATION 5 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 2.3 www.ti.com DEVICE PINOUT, LVDS INPUT/OUTPUT MODE DVDD18 ADC_DCLKOUTN ADC_DCLKOUTP ADCA_DATA_0N ADCA_DATA_0P ADCA_DATA_1N ADCA_DATA_1P PDN SEN SDATA SCLK SDOUT RESET AVDD18_ADC VCM AVDD18_ADC RGC Package (Top View) NC INN_B_ADC 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 1 48 2 47 INP_B_ADC 3 46 ADC_FCLKOUTN AVDD18_ADC Thermal pad connected to ground ADC_FCLKOUTP AVDD18_ADC 4 45 ADCB_DATA_0P INN_A_ADC INP_A_ADC 5 44 ADCB_DATA_0N 6 43 ADCB_DATA_1P AVDD18_ADC 7 42 ADCB_DATA_1N CLKINN QFN 8 64-QFN 41 DVDD18 40 SYNCINN CLKINP DVDD18_CLK 10 39 SYNCINP AVDD3_DAC 11 38 DACB_DATA_1N 9 IOUTP_A_DAC 12 37 DACB_DATA_1P IOUTN_A_DAC 13 14 36 35 DACB_DATA_0N AVDD3_DAC IOUTP_B_DAC 15 DACB_DATA_0P DAC_DCLKINN DAC_DCLKINP DVDD18 DAC_FCLKINN DAC_FCLKINP DACA_DATA_0N DACA_DATA_0P DACA_DATA_1P DACA_DATA_1N AUXADC_B AVDD18_ADC AUXADC_A AVDD3_AUX AUXDAC_B AUXDAC_A DVDD18_DAC BIASJ AVDD3_DAC IOUTN_B_DAC 34 33 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Figure 2-2. Device Pinout, LVDS Input/Output Mode Table 2-2. Pin Configuration: LVDS Input/Output Mode PIN 6 DESCRIPTION NO. NAME 1 AVDD18_ADC 2 INN_B_ADC RX ADC channel B analog input, negative 3 INP_B_ADC RX ADC channel B analog input, positive 4 AVDD18_ADC 5 INN_A_ADC RX ADC channel A analog input, negative 6 INP_A_ADC RX ADC channel A analog input, positive 7 AVDD18_ADC 8 CLKINN DEVICE INFORMATION 1.8V supply for RX ADCs 1.8V supply for RX ADCs 1.8V supply for RX ADCs main clock input, negative side if differential mode, TX side if single-ended 2 clock mode Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Table 2-2. Pin Configuration: LVDS Input/Output Mode (continued) PIN NO. DESCRIPTION NAME 9 CLKINP 10 DVDD18_CLK main clock input, positive side if differential mode, RX side if single-ended 2 clock mode 1.8V supply for Clocking circuit 11 AVDD3_DAC 3V supply for TX DACs 12 IOUTP_A_DAC TX DAC channel A current output, positive (current sink DACs) 13 IOUTN_A_DAC TX DAC channel A current output, negative (current sink DACs) 14 AVDD3_DAC 3V supply for TX DACs 15 IOUTP_B_DAC TX DAC channel B current output, positive (current sink DACs) 16 IOUTN_B_DAC TX DAC channel B current output, negative (current sink DACs) 17 AVDD3_DAC 18 BIASJ 19 DVDD18_DAC 20 AUXDAC_A auxiliary DAC channel A output, current sourcing up to 7.5mA (SPI programmable) 21 AUXDAC_B auxiliary DAC channel B output, current sourcing up to 7.5mA (SPI programmable) 22 AVDD3_AUX 3V supply for auxiliary ADC/DACs 23 AUXADC_A auxiliary ADC channel A input 24 AUXADC_B auxiliary ADC channel B input 25 AVDD18_ADC 26, 27 3V supply for TX DACs sets the TX DAC output current (resistor from pin to ground). Use 960 Ohm to set a full scale current of 20 mA. 1.8V DAC digital supply 1.8V supply for RX ADCs LVDS Wire 1 data input for Channel A TX data – inactive in 1-wire mode, LSB byte in 2-wire mode 26 DAC_DATA_11 Positive 27 DAC_DATA_10 Negative 28, 29 LVDS Wire 0 data input for Channel A TX data – active in 1-wire mode, MSB byte in 2-wire mode 28 DAC_DATA_9 Positive 29 DAC_DATA_8 Negative 30, 31 LVDS frame clock input 30 DAC_FCLKINP Positive 31 DAC_FCLKINN Negative 32 DVDD18 33, 34 1.8V supply for digital interface LVDS bit clock input 33 DAC_DCLKINP Positive 34 DAC_DCLKINN Negative 35, 36 LVDS Wire 0 data input for Channel B TX data – active in 1-wire mode, LSB byte in 2-wire mode 35 DACB_DATA_0P Positive 36 DACB_DATA_0N Negative 37, 38 LVDS Wire 1 data input for Channel B TX data – inactive in 1-wire mode, MSB byte in 2-wire mode 37 DACB_DATA_1P Positive 38 DACB_DATA_1N Negative 39, 40 LVDS SYNC input – Used to reset internal clock dividers and reset TX data FIFO pointer 39 SYNCINP Positive 40 SYNCINN Negative 41 DVDD18 1.8V supply for digital interface 42, 43 LVDS Wire 1 data output for Channel B RX data – inactive in 1-wire mode, MSB byte in 2-wire mode 42 ADCB_DATA_1N Positive 43 ADCB_DATA_1P Negative 44, 45 LVDS Wire 0 data output for Channel B RX data – active in 1-wire mode, LSB byte in 2-wire mode 44 ADCB_DATA_0N Positive 45 ADCB_DATA_0P Negative Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 DEVICE INFORMATION 7 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Table 2-2. Pin Configuration: LVDS Input/Output Mode (continued) PIN NO. 46, 47 LVDS frame clock output 46 ADC_FCLKOUTN Positive 47 ADC_FCLKOUTP Negative 48 NC 49 DVDD18 50, 51 No Connect 1.8V supply for digital interface LVDS bit clock output 50 ADC_DCLKOUTN Positive 51 ADCDCLKOUTP Negative 52,53 LVDS Wire 0 data output for Channel A RX data – active in 1-wire mode, MSB byte in 2-wire mode 52 ADCA_DATA_0N Positive 53 ADCA_DATA_0P Negative 54,55 8 DESCRIPTION NAME LVDS Wire 1 data output for Channel A RX data – inactive in 1-wire mode, LSB byte in 2-wire mode 54 ADCA_DATA_1N Positive 55 ADCA_DATA_1P Negative 56 PDN Can be programmed as global powerdown (deep sleep), fast recovery powerdown (light sleep) or TX/RX switch. Active high. 57 SEN SPI enable (1.8V CMOS) 58 SDATA SPI data input (1.8V CMOS) 59 SCLK SPI clock input (1.8V CMOS) 60 SDOUT SPI data output (1.8V CMOS) 61 RESET Reset the SPI. Active high (1.8V CMOS). 62 AVDD18_ADC 63 VCM 64 AVDD18_ADC Thermal pad VSS DEVICE INFORMATION 1.8V supply for RX ADCs Common mode voltage output. Outputs the ideal common mode input voltage for the ADC. Nominally around 0.95V. 1.8V supply for RX ADCs Connect thermal pad to the board ground Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 3 ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS (1) 3.1 over operating free-air temperature range (unless otherwise noted) MIN MAX Supply voltage range, *VDD3* –0.3 3.6 V Supply voltage range, *VDD18* –0.3 2.1 V Voltage betweeen *VDD3* to *VDD18* –2.4 3.9 V INP_A_ADC, INM_A_ADC, INP_B_ADC, INM_B_ADC, AUXADC_A, AUXADC_B, CLKINN, CLKINP –0.3 2.1 V RESET, SCLK, SDATA SEN –0.3 3.9 V DAC*_DATA_nP/M, DAC_DCLK –0.3 2.1 V TA Operating free-air temperature range –40 85 °C TJ Operating junction tamperature range 125 °C Tstg Storage temperature range –65 150 °C 2 kV ESD rating Human Body Model (HBM) (1) UNIT Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 3.2 THERMAL INFORMATION AFE7222/AFE7225 THERMAL METRIC RGC PACKAGE UNITS 64 PINS θJA Junction-to-ambient thermal resistance 22.8 θJCtop Junction-to-case (top) thermal resistance 6.7 θJB Junction-to-board thermal resistance 2.3 ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 2.2 θJCbot Junction-to-case (bottom) thermal resistance 0.2 3.3 °C/W RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS AFE7222 AFE7225 MIN TYP MAX DVDD18 voltage range 1.7 1.8 AVDD3 voltage range 2.85 3.0 VCM-0.05 VCM Common mode voltage at ADC input pins Common mode voltage at DAC output pins DAC_CLK speed (1) (2) TYP MAX 1.9 1.7 1.8 1.9 V 3.6 2.85 3.0 3.6 V VCM VCM+0.05 V VCM+0.05 VCM–0.05 AVDD3 ADC_CLK speed (1) (1) UNIT MIN AVDD3 V 2.5 (2) 65 2.5 (2) 125 MSPS 1 130 1 250 MSPS See Table 10-1 and Table 10-2 for corresponding maximum interface rates. Minimum ADC_CLK speed can be reduced to 0.8 MSPS by writing the following serial interface registers: • Register address 0x208, value 0x8 • Register address 0x4, value 0x8 Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 ELECTRICAL SPECIFICATIONS 9 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 3.4 www.ti.com SUPPLY CHARACTERISTICS AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, IOUTFS=20mA, typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, unless otherwise noted. PARAMETER TEST CONDITIONS AFE7225 POWER IN LVDS MODE Dual RX ADC, Dual TX DAC with Interpolate by 2, 2-wire LVDS interface FADCCLK = 125 MSPS fADCIN = 10 MHz FDACCLK = 250 MSPS fDACOUT = 10 MHz MIN Power dissipation, full duplex mode Supply current, full duplex mode TYP MAX RX and TX active, No input signal applied on ADC and DAC 577 650 AVDD18_ADC, RX and TX active, No input signal applied on ADC and DAC 115 DVDD18, RX and TX active, No input signal applied on ADC and DAC 95 DVDD18_CLK, RX and TX active, No input signal applied on ADC and DAC 12 DVDD18_DAC, RX and TX active, No input signal applied on ADC and DAC 7 AVDD3_DAC, RX and TX active, No input signal applied on ADC and DAC 48 AVDD3_AUX, RX and TX active, No input signal applied on ADC and DAC 7 UNIT mW mA Power dissipation, half duplex RX mode RX active, TX in light sleep, TX clock is off, No input signal applied on ADC and DAC 362 417 mW Power dissipation, half duplex TX mode TX active, RX in light sleep, RX clock is on, No input signal applied on ADC and DAC 419 482 mW Global powerdown enabled Power dissipation in Sleep modes 12 40 Fast recovery powerdown enabled, TX/RX sleeping, clocks on 215 246 Fast recovery powerdown enabled, TX/RX sleeping, TX clock off, RX clock on 177 231 PARAMETER TEST CONDITIONS AFE7222/AFE7225 POWER IN CMOS MODE Dual RX ADC, Dual TX DAC with Interpolate by 2, CMOS interface FADCCLK = 65 MSPS fADCIN = 10 MHz FDACCLK = 130 MSPS fDACOUT = 10 MHz MIN Power dissipation, full duplex mode RX and TX active, No input signal applied on ADC and DAC Power (AVDD18_ADC, DVDD18_CLK, DVDD18_DAC, AVDD3_DAC, AVDD3_AUX) Digital Power (1) (DVDD18) Total Power Supply current, full duplex mode Power dissipation, half duplex RX mode 391 mW mW 9 DVDD18_DAC, RX and TX active, No input signal applied on ADC and DAC 4 AVDD3_DAC, RX and TX active, No input signal applied on ADC and DAC 48 AVDD3_AUX, RX and TX active, No input signal applied on ADC and DAC 7 TX active, RX in light sleep, RX clock is on, No input signal applied on ADC and DAC mW 72 40 Power (AVDD18_ADC, DVDD18_CLK, DVDD18_DAC, AVDD3_DAC, AVDD3_AUX) UNIT 398 DVDD18_CLK, RX and TX active, No input signal applied on ADC and DAC 176 mA 211 mW 36 Total Power 212 Power (AVDD18_ADC, DVDD18_CLK, DVDD18_DAC, AVDD3_DAC, AVDD3_AUX) 235 Total Power 10 326 DVDD18, RX and TX active, No input signal applied on ADC and DAC Digital Power (1) (DVDD18) (1) MAX 77 Digital Power (1) (DVDD18) Power dissipation, half duplex TX mode TYP AVDD18_ADC, RX and TX active, No input signal applied on ADC and DAC RX active, TX in light sleep, TX clock is off, No input signal applied on ADC and DAC mW 282 mW 56 291 These numbers belong to no-load capacitance present on board. The maximum DVDD18 current with CMOS interface depends on the actual load capacitance on the digital output lines. ELECTRICAL SPECIFICATIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com 3.5 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 SUPPLY CHARACTERISTICS (Continued) AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, IOUTFS=20mA, typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, unless otherwise noted. PARAMETER TEST CONDITIONS AFE7222/AFE7225 POWER IN CMOS MODE Dual RX ADC, Dual TX DAC with Interpolate by 2, CMOS interface FADCCLK = 65 MSPS fADCIN = 10 MHz FDACCLK = 130 MSPS fDACOUT = 10 MHz MIN Global powerdown enabled Power dissipation in Sleep modes TYP UNIT MAX 12 40 Fast recovery powerdown enabled, TX/RX sleeping, clocks on 140 165 Fast recovery powerdown enabled, TX/RX sleeping, TX clock off, RX clock on. 120 165 mW Power Up and Power Down Time in Different Modes Differential input clock 25 Single-ended input clock 20 Global powerdown in Low power RX Differential input clock CMOS mode, RX recovery time (ADC Single-ended input clock running at less than 40 MSPS) 25 Global powerdown, RX recovery time Global powerdown, TX recovery time RX recovery time in fast recovery mode Differential input clock Single-ended input clock RX clock is ON during powerdown TX recovery time in fast recovery mode RX recovery time from RX powerdown RX clock is on during powerdown TX recovery time fromTX powerdown Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 13 25 4 µs µs µs 5 µs 4 µs 5 µs 4 µs ELECTRICAL SPECIFICATIONS 11 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 3.6 www.ti.com RX ADC ELECTRICAL CHARACTERISTICS Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, supplies at nominal voltages, 50% clock duty cycle, LVDS output interface, –1dBFS differential input, unless otherwise noted. PARAMETER TEST CONDITIONS AFE7222 MIN AFE7225 TYP MAX Maximum Clock Rate 65 Resolution 12 MIN TYP MAX UNIT 125 MSPS 12 bits ANALOG INPUTS Differential input range VCM Common mode output voltage 2 2 Vpp 0.95 0.95 Input resistance (DC) Differential >1 >1 MΩ Input capacitance Differential 4 4 pF 550 550 MHz 40 40 dB Analog input bandwidth CMRR Common mode rejection ratio Fin = 10MHz V DYNAMIC ACCURACY DNL Differential linearity error No Missing Codes, Fin =10MHz INL Integral linearity error Fin = 10MHz Offset error –0.95 ±0.5 1.4 –0.95 ±0.5 1.4 LSB –1.7 ±0.2 1.7 –1.7 ±0.2 1.7 LSB –15 2 15 –15 3 15 mV Offset temperature co-efficient >0.005 Gain error as a result of internal reference inaccuracy alone – EGREF –2.5 >0.005 2.5 Gain error of channel alone – EGCHAN –2.5 ±1 mV/°C 2.5 %FS ±1 %FS 70.7 dBFS 70.1 dBFS 69.5 dBFS DYNAMIC AC CHARACTERISTICS Fin = 10MHz SNR Signal-to-noise ratio (1) 67.5 70.5 Fin = 70MHz Fin = 140MHz Fin = 10MHz SFDR (1) 12 Spurious free dynamic range (1) 67 70 68.7 73 85 73 84 dBc Fin = 70MHz 81 79 dBc Fin = 140MHz 77 76 dBc Up to 65MSPS typical SNR and SFDR performance in CMOS interface is same as with LVDS interface. ELECTRICAL SPECIFICATIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com 3.7 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 TX DAC ELECTRICAL CHARACTERISTICS Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, 50% clock duty cycle, supplies at nominal voltages, IOUTFS = 20 mA, DAC output common mode voltage is AVDD3=3.0V, unless otherwise noted. AFE7222 PARAMETER AFE7225 TEST CONDITIONS UNIT MIN TYP MAX Maximum clock output rate Resolution MIN TYP MAX 130 250 MSPS 12 12 Bits 20 mA ANALOG OUTPUTS Full scale output current, per DAC Output voltage compliance range 2 IOUTFS = 20 mA, Current sink output AVDD3_DAC –0.5 Output resistance 20 2 AVDD3_DAC+0.5 AVDD3_DAC –0.5 300 Output capacitance Offset error Mid code offset Gain error Internal reference Gain mismatch Internal reference dual DAC AVDD3_DAC+0.5 V 300 kΩ 5 5 ±0.03 ±0.03 %FS (1) pF ±1 ±1 %FS (1) ±0.5 ±0.5 %FS (1) DC PERFORMANCE INL Integral non-linearity Fout = 10 MHz DNL Differential non-linearity Fout = 10 MHz –2 ±1 2 –2 ±0.5 ±1 2 LSB ±0.5 LSB AC PERFORMANCE Noise spectral density SFDR Fout = 10 MHz, 0 dBFS 145.5 149 148.5 151 dBc/Hz Fout = 10 MHz, 0 dBFS 70 76 70 76 dBc Spurious free dynamic range IMD Inter-modulation distortion ACLR Adjacent channel leakage ratio Fout = 20 MHz, 0 dBFS 75 74 dBc Fout = 5.1/6.1 MHz, –7 dBFS each 73 73 dBc DAC clock = 122.88 MSPS, Fout = 30.72 MHz 75 dB DAC clock = 245.76 MSPS, Fout = 61.44 MHz (1) 3.8 73 %FS = % Differential Full Scale AUXILIARY ADC ELECTRICAL CHARACTERISTICS Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, supplies at nominal voltages, unless otherwise noted. PARAMETER TEST CONDITIONS AFE7222 / AFE7225 MIN TYP MAX Maximum Clock Rate Resolution UNIT 100 kSPS 12 Bits ANALOG INPUTS Input voltage range Input capacitance Maximum input signal frequency 1.5 V 4 pF 10 kHz DC PERFORMANCE INL Integral non-linearity Static conditions (near DC input) Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 –4.5 ±2 4.5 ELECTRICAL SPECIFICATIONS LSB 13 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 3.9 www.ti.com AUXILIARY DAC ELECTRICAL CHARACTERISTICS Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, supplies at nominal voltages, IOUTFS = 5mA, 300 Ω termination, unless otherwise noted. PARAMETER Maximum Clock Rate AFE7222/AFE7225 TEST CONDITIONS MIN TYP MAX Continuous refresh of AUX DAC Channel A from SDATA and Channel B from SDOUT UNIT 3.33 (1) MSPS Resolution 12 Bits 7.5 mA ANALOG OUTPUTS Output current, per auxDAC 2.5 Output voltage compliance range 1.5 V DYNAMIC PERFORMANCE INL Integral non-linearity Static conditions (near DC input) DNL Differential non-linearity Static conditions (near DC input) (1) –1.7 ±0.5 1.7 ±0.3 LSB LSB 12 bits x (1/SCLK) in direct access mode, SCLK max limit is 40MHz 3.10 DIGITAL CHARACTERISTICS The DC specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level 0 or 1. AVDD18*, DVDD18* = 1.8V, AVDD3* = 3.0V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL INPUTS – RESET, SCLK, SDATA, SEN, PDN High-level input voltage All these pins support 1.8V and 3V CMOS logic levels. 1.3 V Low-level input voltage 0.4 V DAC DIGITAL INPUTS IN CMOS INTERFACE MODE High-level input voltage 1.8V CMOS logic levels only 1.3 V Low-level input voltage 0.4 V DAC DIGITAL INPUTS IN LVDS INTERFACE MODE VIDH High-level differential input voltage Standard swing LVDS with external 100ohms termination 350 mV VIDL Low-level differential input voltage Standard swing LVDS with external 100ohms termination –350 mV VICM Input common-mode voltage 1.2 V DIGITAL OUTPUTS – CMOS INTERFACE – SDOUT, ADC OUTPUTS (IN CMOS INTERFACE MODE) High-level output voltage DVDD18 – 0.1 Low-level output voltage DVDD18 0 V 0.1 V DIGITAL OUTPUTS – LVDS INTERFACE (ADC OUTPUTS IN LVDS MODE) VODH High-level differential output voltage Standard swing LVDS 235 375 mV VODL Low-level differential output voltage Standard swing LVDS –375 –235 mV VOCM Output common-mode voltage 14 ELECTRICAL SPECIFICATIONS 0.9 1.05 1.2 V Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com 3.11 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 TIMING REQUIREMENTS Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, unless otherwise noted. PARAMETER TEST CONDITIONS AFE7222 MIN AFE7225 TYP MAX MIN TYP UNIT MAX SCLK INPUT tSCLK CLOCK period tSCLKH CLOCK pulse width high tSCLKL CLOCK pulse width low 3.12 25 Assuming 50/50 duty cycle 25 ns 12.5 12.5 ns 12.5 12.5 ns TIMING REQUIREMENTS FOR RECEIVE PATH – LVDS AND CMOS MODES Typical values are at 25°C, AVDD3_DAC = 3.0 V, AVDD3_AUX = 3.0 V, AVDD18_ADC = 1.8 V, DVDD18_CLK = 1.8 V, DVDD18_DAC = 1.8 V, DVDD18 = 1.8 V, sampling frequency = 125 MSPS, sine wave input clock, 1.5 Vpp clock amplitude, CLOAD = 5 pF (1), RLOAD = 100 Ω (2), unless otherwise noted. Min and max values are across the full temperature range TMIN = 40°C to TMAX = 85°C, AVDD3_DAC = 3.0 V, AVDD3_AUX = 3.0 V, AVDD18_ADC = 1.8 V, DVDD18_CLK = 1.8 V, DVDD18_DAC = 1.8 V, DVDD18 = 1.7 V to 1.9 V PARAMETER TA TEST CONDITIONS MIN Aperture delay TJ TYP MAX UNIT 2 ns Aperture delay matching Between two channels on the same device ±120 ps Aperture delay matching Between two devices at same temperature and DVDD18 supply ±450 ps Aperture jitter Jitter added by internal clock distribution, specified as it relates to the receive ADC 250 fs rms ADC Latency (3) Default Mode 16 Mixer Enabled (RX_MIXER_EN = 1) 33 RX QMC Gain Phase Correction Enabled (RX_QMC_CORR_ENA=1, RX_QMC_CORR_ENB=1) 22 clock cycles LVDS OUTPUT INTERFACE 2-WIRE MODE, DDR CLOCK (4), Sampling frequency = 125MSPS tsu Data setup time (5) (5) th Data hold time tPDI Clock propagation delay tdelay Data valid (5) to zero-crossing of CLKOUTP Zero-crossing of CLKOUTP to data becoming invalid (5) Input clock rising edge cross-over to output clock rising edge cross-over 10 MSPS ≤ Sampling frequency ≤ 125 MSPS Ts = 1/Sampling frequency 0.29 0.42 ns 0.3 0.47 ns tPDI = tDELAY 11.5 13.8 Variation of tdelay Between two devices at same temperature and DVDD18 supply ±300 LVDS bit clock duty cycle Duty cycle of differential clock, (ADC_DCLKOUTPADC_DCLKOUTM) 10 MSPS ≤ Sampling frequency ≤ 125 MSPS 50% ns 15.5 ns ps 2-WIRE MODE, SDR CLOCK (4), Sampling frequency = 65MSPS (5) Data setup time th Data hold time tPDI Clock propagation delay Input clock rising edge cross-over to output clock rising edge cross-over 10 MSPS ≤ Sampling frequency ≤ 65 MSPS Ts = 1/Sampling frequency Variation of tdelay Between two devices at same temperature and DVDD18 supply ±300 LVDS bit clock duty cycle Duty cycle of differential clock, (CLKOUTP-CLKOUTM) 10 MSPS ≤ Sampling frequency ≤ 65 MSPS 50% (5) Data valid (5) tsu to zero-crossing of CLKOUTP Zero-crossing of CLKOUTP to data becoming invalid (5) tdelay 0.85 1.08 ns 1.08 1.21 ns tPDI = 0.5*Ts + tDELAY 11.5 14 16.5 ns ns ps 1-WIRE MODE (DDR CLOCK ONLY) (4), Sampling frequency = 65MSPS tsu (1) (2) (3) (4) (5) Data setup time (5) Data valid (5) to zero-crossing of CLKOUTP 0.25 0.39 ns CLOAD is the effective external single-ended load capacitance between each output pin and ground RLOAD is the differential load resistance between the LVDS output pair. At higher frequencies, tPDI is greater than one clock period and overall latency = ADC latency + 1. Measurements are done with a transmission line of 100-Ω characteristic impedance between the device and the load. Setup and hold time specifications take into account the effect of jitter on the output data and clock. Data valid refers to LOGIC HIGH of +100.0 mV and LOGIC LOW of -100.0 mV. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 ELECTRICAL SPECIFICATIONS 15 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Typical values are at 25°C, AVDD3_DAC = 3.0 V, AVDD3_AUX = 3.0 V, AVDD18_ADC = 1.8 V, DVDD18_CLK = 1.8 V, DVDD18_DAC = 1.8 V, DVDD18 = 1.8 V, sampling frequency = 125 MSPS, sine wave input clock, 1.5 Vpp clock amplitude, CLOAD = 5 pF (1), RLOAD = 100 Ω (2), unless otherwise noted. Min and max values are across the full temperature range TMIN = 40°C to TMAX = 85°C, AVDD3_DAC = 3.0 V, AVDD3_AUX = 3.0 V, AVDD18_ADC = 1.8 V, DVDD18_CLK = 1.8 V, DVDD18_DAC = 1.8 V, DVDD18 = 1.7 V to 1.9 V PARAMETER th Data hold time TEST CONDITIONS (5) MIN Zero-crossing of CLKOUTP to data becoming invalid (5) 0.26 TYP MAX 0.4 UNIT ns Clock propagation delay Input clock rising edge cross-over to output clock rising edge cross-over 10 MSPS ≤ Sampling frequency ≤ 65 MSPS Ts = 1/Sampling frequency Variation of tdelay Between two devices at same temperature and DVDD18 supply ±300 LVDS bit clock duty cycle Duty cycle of differential clock, (CLKOUTP-CLKOUTM) 10 MSPS ≤ Sampling frequency ≤ 65 MSPS 50% tRISE, tFALL Data rise time, Data fall time Rise time measured from -100 mV to +100 mV Fall time measured from +100 mV to -100 mV 10 MSPS ≤ Sampling frequency ≤ 125 MSPS 0.08 ns tCLKRISE, tCLKFALL Output clock rise time, Output clock fall time Rise time measured from -100 mV to +100 mV Fall time measured from +100 mV to -100 mV 10 MSPS ≤ Sampling frequency ≤ 125 MSPS 0.1 ns 0.5 1.4 ns 1.4 1.8 ns tPDI tdelay tPDI = 0.5*Ts + tDELAY 11.5 13.5 15.5 ns ns ps COMMON CMOS OUTPUT INTERFACE (6) , Sampling frequency = 105MSPS (7) (8) tsu Data setup time th Data hold time tPDI Clock propagation delay (8) Data valid to cross-over of ADC_DCLKOUT (8) Cross-over of ADC_DCLKOUT to data becoming invalid (8) Input clock rising edge cross-over to output clock rising edge cross-over 10 MSPS ≤ Sampling frequency ≤ 105 MSPS Ts = 1/Sampling frequency tdelay tPDI = 0.5*Ts + tDELAY 14 16.5 19 ns ns Variation of tdelay Between two devices at same temperature and DVDD18 supply ±350 Output clock duty cycle Duty cycle of output clock, ADC_DCLKOUT 10 MSPS ≤ Sampling frequency ≤ 105 MSPS 46% tRISE, tFALL Data rise time, Data fall time Rise time measured from 20% to 80% of DVDD18 Fall time measured from 80% to 20% of DVDD18 1 ≤ Sampling frequency ≤ 105 MSPS 0.76 ns tCLKRISE, tCLKFALL Output clock rise time, Output clock fall time Rise time measured from 20% to 80% of DVDD18 Fall time measured from 80% to 20% of DRVDD 1 ≤ Sampling frequency ≤ 105 MSPS 0.74 ns (6) (7) For Fs > 105 MSPS, it is recommended to use external clock for data capture and NOT the device output clock signal (ADC_DCLKOUT). For Fs > 65MSPS, CMOS output buffers strength is increased by writing serial register bits STR_CTRL = '10'. (8) Data valid refers to LOGIC HIGH of 1.26 V and LOGIC LOW of 0.54 V. 16 ELECTRICAL SPECIFICATIONS ps Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Table 3-1. LVDS Timings at Lower Sampling Frequencies 2-WIRE MODE DDR CLOCK Sampling Frequency, MSPS Setup time, ns MIN TYP 20 3.75 35 50 Hold time, ns MIN TYP 3.93 3.64 3.9 1.99 2.18 1.96 2.2 1.28 1.46 1.28 1.51 65 0.84 1.06 0.85 1.14 80 0.59 0.81 0.70 0.90 95 0.46 0.67 0.49 0.70 110 0.31 0.52 0.36 0.58 125 0.29 0.42 0.30 Fs ≤ 125MSPS MAX 0.47 Clock propagation delay, tPDI = tDELAY 11.5 13.8 15.5 MAX tDELAY, ns 11.5 13.8 15.5 2-WIRE MODE, SDR CLOCK Sampling Frequency, MSPS Setup time, ns MIN TYP 10 8.14 20 30 Hold time, ns MIN TYP 8.32 7.90 8.06 3.89 4.08 3.85 4.01 2.33 2.6 2.51 2.71 40 1.68 1.91 1.81 2.03 50 1.22 1.48 1.41 1.64 65 0.85 1.08 1.08 Fs ≤ 65MSPS MAX Clock propagation delay, tPDI = 0.5*Ts + tDELAY MAX 1.21 tDELAY, ns 11.5 14 16.5 1-WIRE MODE, DDR CLOCK Sampling Frequency, MSPS Setup time, ns MIN TYP 20 1.71 35 0.77 50 65 Hold time, ns MAX MIN TYP 1.90 1.67 1.92 0.99 0.82 1.04 0.36 0.61 0.39 0.62 0.25 0.39 0.26 MAX 0.40 tDELAY, ns Fs ≤ 65MSPS Clock propagation delay, tPDI = 0.5*Ts + tDELAY MIN TYP MAX 11.50 13.50 15.50 Table 3-2. CMOS Timings at Lower Sampling Frequencies Timings specified with respect to CLKOUT Sampling Frequency, MSPS Setup time, ns MIN TYP 20 10.90 40 65 Hold time, ns MAX MIN TYP 11.50 11.22 11.60 MAX 4.62 5.25 4.99 5.33 2.06 2.66 2.46 2.86 90 1 1.9 1.8 2.3 105 0.5 1.4 1.4 1.8 Clock propagation delay, tPDI = 0.5*Ts + tDELAY MIN TYP MAX 14 16.50 19 tDELAY, ns Fs ≤ 105MSPS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 ELECTRICAL SPECIFICATIONS 17 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 3.13 www.ti.com TIMING REQUIREMENTS FOR TRANSMIT PATH – LVDS AND CMOS MODES (1) Typical values are at 25°C, AVDD3_DAC = 3.0 V, AVDD3_AUX = 3.0 V, AVDD18_ADC = 1.8 V, DVDD18_CLK = 1.8 V, DVDD18_DAC = 1.8 V, DVDD18 = 1.8 V, sine wave input clock, 1.5 Vpp clock amplitude, unless otherwise noted. Min and max values are across the full temperature range TMIN = -40°C to TMAX = 85°C, AVDD3_DAC = 3.0 V, AVDD3_AUX = 3.0 V, AVDD18_ADC = 1.8 V, DVDD18_CLK = 1.8 V, DVDD18_DAC = 1.8 V, DVDD18 = 1.7 V to 1.9 V PARAMETER DAC Latency TEST CONDITIONS MIN Default Mode TYP 16 MAX UNIT clock cycles LVDS INPUT INTERFACE tsu Data setup time Data valid (2) to zero-crossing of DAC_DCLKINP th Data hold time Zero-crossing of DAC_DCLKINP to data becoming invalid (2) 0.5 ns 0.3 ns 0.3 ns 0.5 ns CMOS INPUT INTERFACE (3) tsu Data setup time Data valid to cross-over of DAC_DCLKIN th Data hold time Cross-over of DAC_DCLKIN to data becoming invalid (1) (2) (3) 18 (3) Timing parameters are ensured by design and characterization and not tested in production. Data valid refers to LOGIC HIGH of +100 mV and LOGIC LOW of -100 mV. Data valid refers to LOGIC HIGH of 1.26 V and LOGIC LOW of 0.54 V. ELECTRICAL SPECIFICATIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 4 SERIAL PERIPHERAL INTERFACE 4.1 DESCRIPTION The SPI (serial peripheral interface) is used to program the AFE7225/7222. It is used to read data from and write data to the registers, from the rms/peak power meter and the auxiliary ADC. It is also used to send data to the auxiliary DACs. The interface is formed with pins SEN (Serial Interface Enable), SCLK (Serial Interface Clock), SDATA (Serial interface input data) and SDOUT (Serial interface output data). The serial shift of bits into the device is enabled when SEN is low. Serial data SDATA is latched at every rising edge of SCLK when SEN is active (low). The SPI uses a 20-bit serial arrangement – the first 12-bits are the register address, and the last 8-bits represent the data for the address. The interface can work with SCLK frequency from a frequency of 40MHz down to a few Hertz and also with non-50% SCLK duty cycle. Direct access modes exist for reading from the auxiliary ADC and writing to the auxiliary DACs by using the SPI pins. REGISTER ADDRESS (A11:A0) REGISTER DATA (D7:D0) SDATA SCLK SEN Figure 4-1. Timing Address bits (A11:A8) are referred to as the Page address of the register, and address bits (A7:A0) are referred to as the Row address of the register. 4.2 SPI REGISTER READOUT Data stored in a register corresponding to a page can be read out by programming the readout bit corresponding to that page. The read out bit for a register addressed by (A11:A0) is the D0 bit of the register with the Page address of (A11:A8) and row address of 00000000. To read out a particular register, the following steps have to be followed: 1. Configure SDOUT as a digital output pin using bits 2. Set the register specific readout bit. This bit can be set by writing the following 20-bit sequence – A11:A8,00000000,00000001 where (A11..A8) is the page address of the register whose contents are desired to be read out 3. Once in the readout mode, write the address of the register to be readout as below. The new data write is ignored. The data contents of the register come out serially on the SDOUT pin (with MSB first format) as shown below. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 SERIAL PERIPHERAL INTERFACE 19 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com REGISTER DATA (D7:D0) Ignored REGISTER ADDRESS (A11:A0) SDATA SCLK SEN SDOUT Contents of addressed register (D7..D0) Figure 4-2. Timing 4. If the next register to be read out has the same page address, then repeat Step 3 with the new address to be read out. 5. To exit the register readout mode, write A11:A8,00000000,00000000. 20 SERIAL PERIPHERAL INTERFACE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 5 REGISTER DESCRIPTIONS 5.1 TRANSMIT DIGITAL SIGNAL CHAIN REGISTERS SYNC SYNC 8 deep FIFO SYNC 2x Interpolation TxFIR1 SYNC 2x Interpolation TxFIR2 Fine Mixer SYNC Coarse Mixer (CMIX) TX B output QMC Gain/ Phase DAC_CLK Inverse SINC TX A output QMC Offset NCO TX A input (I channel) TX B input (Q channel) DAC_DCLKIN DAC_CLK %1,2,4 Figure 5-1. Signal Chain Input data is shifted into the 8-deep FIFO at the rate of DAC_DCLKIN. At its output, the FIFO hands off the data using a divided version of the DAC_CLK (based on the interpolation factor). The rest of the signal chain runs off DAC_CLK and its divided derivatives. Register Name – CONFIG0 – Address 0x103, Default = 0x00 Tx_BYP_SRC TX_BYP TX_ChB_PDN_SRC TX_CHB_PDN TX_CHA_PDN_SRC TX_CHA_PDN TX_DIS TX_DIS – Disables the digital signal chain of both channels in TX . All blocks in digital signal chain are powered down, and the output is DAC mid-code. Note: the DACs are not powered down in this mode. TX_CHA_PDN – Powers down digital signal chain of Channel A in Tx . Output of the channel is mid code. Set TX_CHA_PDN_SRC for this to take effect. TX_CHA_PDN_SRC – Setting this causes the value programmed into TX_CHA_PDN to take effect. TX_CHB_PDN – Powers down digital signal chain of Channel B in Tx . Output of the channel is mid code. Set TX_CHB_PDN_SRC for this to take effect. TX_CHB_PDN_SRC – Setting this causes the value programmed into TX_CHB_PDN to take effect. Note that when in default mode of operation (none of the register-selectable digital features enabled), all 4 of above bits (TX_CHA_PDN, TX_CHA_PDN_SRC, TX_CHB_PDN, TX_CHB_PDN_SRC) have to be set together to '1' for them to take effect. However, if any of the digital features (like interpolation, Fine mixer, Coarse mixer, or QMC gain/phase or offset) are enabled, then the channel A can be independently powered down using bits TX_CHA_PDN and TX_CHA_PDN_SRC, and channel B can be independently powered down using bits TX_CHB_PDN and TX_CHB_PDN_SRC. TX_BYP – The inputs to both the Tx channels are directly passed to the outputs. FIFO is bypassed. Set TX_BYP_SRC for this to take effect. TX_BYP_SRC – Setting this causes the value programmed into TX_BYP to take effect. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 21 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Register Name – CONFIG1 – Address 0x104, Default = 0x10 MASK_2_AWAY_DET TX_CHB_8_IP_EN TX_CHA_8_IP_EN TX_CHA_8_IP_EN – Enable the 8- sample mode FIFO mode for Channel A . The 8 samples written into the regs 0x11F to 0x12E are repeatedly cycled through, and sent to the DAC A. This is a useful diagnostic mode. TX_CHB_8_IP_EN – Enable the 8- sample mode FIFO mode for Channel B . The 8 samples written into the regs 0x12F to 0x13E are repeatedly cycled through, and sent to the DAC B. MASK_2_AWAY_DET – Refer CONFIG58 for a description of the collision condition in the FIFO. Setting the MASK_2_AWAY_DET prevents the 2-away condition from triggering collision detection. If collision detection is enabled, and 2-away condition occurs, the output samples will be forced to DAC mid code, unless MASK_2_AWAY_DET is set. Register Name – CONFIG2 – Address 0x105, Default = 0x00 STORE_FIFO_PTRS RX_TX_LPBK_SRC RX_TX_LPBK STORE_FIFO_PTRS – When set , the FIFO Read and Write pointers are written into the register 0x141 at the rate of the divided DAC_CLK. The pointers are no longer written to the serial interface regs when Register readout is enabled. RX_TX_LPBK – When this bit and RX_TX_LPBK_SRC are both set , the input to the TX signal chain is tapped from the the final output of the RX signal chain. As is obvious, the ADC_CLK and DAC_CLK rates should be the same when using this mode. RX_TX_LPBK_SRC – When this bit and RX_TX_LPBK are both set , the input to the TX signal chain is tapped from the the final output of the RX signal chain The RX to TX loopback is shown below. The dotted arrows illustrate the loopback path. IOUTP_A_DAC IOUTN_A_DAC IOUTP_B_DAC IOUTN_B_DAC 12b TX DAC A 12b TX DAC B Serial LVDS or Parallel CMOS 12b RX ADC B Serial LVDS or Parallel CMOS INN_B_ADC MUX INP_B_ADC 12b RX ADC A MUX INN_A_ADC TX DIGITAL SIGNAL CHAIN INP_A_ADC RX DIGITAL SIGNAL CHAIN Note that though the data going into the TX digital signal chain is looped back internally from the RX Digital signal chain, it is still required to give an active DAC_DCLKIN in this mode because the Tx FIFO requires it for proper data transfer. 12-bit ADC Output 12-bit DAC Input Figure 5-2. Loopback 22 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Register Name – CONFIG3 – Address 0x106, Default = 0x00 FIR2B_MODE FIR1B_MODE FIR2A_MODE FIR1A_MODE TX_INT_MODE_SRC TX_INT_MODE(1:0) TX_INT_MODE(1:0) – Specifies the interpolation factor. To use this mode, set TX_INT_MODE_SRC to 1. VALUE INTERPOLATION FACTOR 0 1 1 2 2 4 3 4 While interpolating by a factor of 2, the DAC_DCLKIN rate should be set to half of the DAC_CLK rate. While interpolating by a factor of 4, the DAC_DCLKIN rate should be set to one fourth of the DAC_CLK rate. In interpolate by 2 mode , TxFIR1 alone is used. In Interpolate by 4 mode, both TxFIR1, and TxFIR2 are used. TX_INT_MODE_SRC – Needs to be set to 1 when programming TX_INT_MODE(1:0) FIR1A_MODE – Specifies whether TxFIR1 in Channel A is in low pass or high pass mode . Set this bit to configure the filter in high pass mode. In interpolate by 4 mode, always set TxFIR1 to low pass mode. FIR2A_MODE – Specifies whether TxFIR2 in Channel A is in low pass or high pass mode. Set this bit to configure the filter in high pass mode FIR1B_MODE – Specifies whether TxFIR1 in Channel B is in low pass or high pass mode. Set this bit to configure the filter in high pass mode FIR2B_MODE – Specifies whether TxFIR2 in Channel B is in low pass or high pass mode . Set this bit to configure the filter in high pass mode Register Name – CONFIG4 – Address 0x107, Default = 0x00 TX_CMIX_PHASE(1:0) TX_CMIX_PHASE_INCR TX_CMIX_MODE(1:0) TX_CMIX_EN TX_CMIX_EN – Enables the Tx Coarse Mixer. TX_CMIX_MODE (1:0) – Specifies the mode in which the TX CMIX is configured. Set TX_CMIX_EN for this to take effect. VALUE MIXING MODE 0 Normal(Low pass ) 1 Fs /2 (High Pass ) – real mixing mode 2 + Fs/4 – complex mixing mode 3 – Fs/4 – complex mixing mode TX_CMIX_PHASE_INCR – This bit is a method to control the mixing phase without using the SYNC pin. A 0 to 1 transition on this bit causes the phase of mixing in the TX CMIX to be incremented by 1 with respect to the current phase of mixing. To increment the phase of mixing more than once, clear and then set this bit once again. Syncing needs to be disabled for Tx CMIX for this mode to work. (This means that global syncing should be disabled, and CMIX-specifc syncing should also be disabled). TX_CMIX_PHASE (1:0) – The value programmed into this is applied as the current TX CMIX phase, when the CMIX is synced, Syncing needs to be enabled for CMIX for this mode to work. This mode is meant to synchronize the phase of mixing across multiple chips. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 23 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Register Name – CONFIG5 – Address 0x108, Default = 0x00 Tx_INV_SINC_FIL_EN_SRC Tx_INV_SINC_FIL_EN TX_DIV_PHASE_ INCR TX_DIV_PHASE(1:0) TX_DATA_ROUTE_ ORDER (1:0) TX_DATA_ROUTE_ORDER (1:0) – Specifies the order in which the A and B outputs of the TX Signal Chain are routed to the DACs VALUE ROUTING ORDER 0 Normal – DACA gets TX Output A and DACB gets TX Output B 1 Both DACs get TX Output A 2 Both DACs get TX Output B 3 Swapped – DACA gets TX Output B and DACB gets TX Output A TX_DIV_PHASE (1:0) – The value programmed into this is applied as the TX Divider phase, when the divider is synced. The divider here refers to the clock divider that divides the DAC_CLK depending on the interpolation factor. For division by 2, there are 2 possible phases of the divided clock. For division by 4, there are 4 possible phases. If the divider phase is not synced across chips, then it will cause a phase uncertainty in the DAC analog output, and can also cause uncertainty in the CMIX operation. TX_DIV_PHASE_INCR – This bit is a method to control the phase of the divided clock without using the SYNC pin. A 0 to 1 transition on this bit causes the phase of division in the TX Divider to be incremented by 1 with respect to the current phase of division. To increment the phase of division more than once, clear and then set this bit once again. Global syncing as well as Syncing for the Tx Divider needs to be disabled for this mode to work. Tx_INV_SINC_FIL_EN – Enables the Tx Inverse Sinc Filter. Set Tx_INV_SINC_FIL_EN_SRC for this to take effect. Tx_INV_SINC_FIL_EN_SRC – When set, this allows Tx_INV_SINC_FIL_EN to take effect. Register Name – CONFIG6 – Address 0x10B, Default = 0x00 TX_CMIX_SYNC_ SRC TX_GLOBAL_ SYNC_DIS TX_QMC_GAIN_PH_ SYNC_DIS TX_QMC_OFF_ SYNC_DIS TX_DIV_ SYNC_DIS TX_CMIX_ SYNC_DIS TX_FIFO_ SYNC_DIS TX_FIFO_SYNC_DIS – Disables Syncing of the FIFO. This takes effect only when TX_GLOBAL_SYNC_DIS is set. This is only a enable/ disable bit – the actual sync source can be set to pin or serial interface. When the FIFO is synced, the read and write pointers are initialized such that they are separated by 4 positions.This mode is common for both channels. TX_CMIX_SYNC_DIS – Disables Syncing of the Tx CMIX .This takes effect only when TX_GLOBAL_SYNC_DIS is set. CMIX syncing refers to setting the phase of the complex mixing. This mode is common for both channels. TX_DIV_SYNC_DIS – Disables Syncing of the Tx Divider phase .This takes effect only when TX_GLOBAL_SYNC_DIS is set. Common for both channels. TX_QMC_OFF_SYNC_DIS – Disables Syncing of Tx QMC Offset Correction .This takes effect only when TX_GLOBAL_SYNC_DIS is set. This mode is common for both channels. TX_QMC_GAIN_PH_SYNC_DIS – Disables Syncing of Tx QMC Gain Phase Correction .This takes effect only when TX_GLOBAL_SYNC_DIS is set. This mode is common for both channels. TX_GLOBAL_SYNC_DIS – When set, disables global syncing of TX and enables block level syncing. When cleared, a rising edge on the selected sync source causes all TX blocks to be synced. 24 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 TX_CMIX_SYNC_SRC – Specifies the sync source for TX CMIX. When cleared, SYNC pin is used as the sync source. When set, a rising edge on serial interface bit TX_CMIX_SER_IF_SYNC in Register 0x10D is used as the sync source for TX CMIX. This is applicable when TX_GLOBAL_SYNC_DIS is set and TX_CMIX_SYNC_DIS is cleared. VALUE SYNC SOURCE 0 Pin 1 Serial interface bit Register Name – CONFIG7 – Address 0x10C, Default = 0x00 TX_GLOBAL_ SYNC_SRC TX_QMC_GAIN_PH_ SYNC_SRC TX_QMC_OFF_SYNC_ TX_DIV_SYNC_ SRC SRC TX_FIFO_SYNC_SRC – Specifies the Sync source for TX TX_GLOBAL_SYNC_DIS is set and TX_FIFO_SYNC_DIS is cleared. VALUE FIFO. It is TX_FIFO_SYNC_ SRC applicable when SYNC SOURCE 0 Pin 1 Serial interface bit When the value programmed is 1, a rising edge on the serial interface bit TX_FIFO_SER_IF_SYNC in register 0x10D is used as the sync source for the FIFO. TX_DIV_SYNC_SRC – Specifies the sync source for TX Divider. When cleared, SYNC pin is used as the sync source. When set, a rising edge on serial interface bit TX_DIV_SER_IF_SYNC in register 0x10D is used as the sync source for TX Divider. This is applicable when TX_GLOBAL_SYNC_DIS is set and TX_DIV_SYNC_DIS is cleared. TX_QMC_OFF_SYNC_SRC – Specifies the sync source for TX QMC Offset Correction. When cleared, SYNC pin is used as the sync source. When set, a rising edge on serial interface bit TX_QMC_OFF_SER_IF_SYNC in register 0x10D is used as the sync source for TX QMC Offset Correction. This is applicable when TX_GLOBAL_SYNC_DIS is set and TX_QMC_OFF_SYNC_DIS is cleared. TX_QMC_GAIN_PH_SYNC_SRC – Specifies the sync source for TX QMC Gain Phase Correction. When cleared, SYNC pin is used as the sync source. When set, a rising edge on serial interface bit TX_QMC_GAIN_PH_SER_IF_SYNC in register 0x10D is used as the sync source for TX QMC Gain Phase Correction. This is applicable when TX_GLOBAL_SYNC_DIS is set and TX_QMC_GAIN_PH_SYNC_DIS is cleared. TX_GLOBAL_SYNC_SRC – Specifies TX_GLOBAL_SYNC_DIS is cleared. VALUE the sync source for TX. This is applicable when SYNC SOURCE 0 All blocks synced from the SYNC pin 1 All blocks synced using serial Interface bit When serial interface is specified to be the sync source, a rising edge on the serial interface bit TX_GLOB_SER_IF_SYNC in register 0x10D is used as the sync source. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 25 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Register Name – CONFIG8 – Address 0x10D, Default = 0x00 TX_GLOBAL_SER_ IF_SYNC TX_QMC_GAIN_PH_ SER_IF_SYNC TX_QMC_OFF_ SER_IF_SYNC TX_DIV_SER_ IF_SYNC TX_CMIX_SER_ IF_SYNC TX_FIFO_SER_ IF_SYNC TX_FIFO_SER_IF_SYNC – A rising edge on this bit is used as the sync source for TX FIFO. This is applicable when TX_GLOBAL_SYNC_DIS is set, and TX_FIFO_SYNC_DIS is cleared, and TX_FIFO_SYNC_SRC specifies serial interface bit to be the sync source for the FIFO. TX_CMIX_SER_IF_SYNC – A rising edge on this bit is used as the sync source for TX CMIX. This is applicable when TX_GLOBAL_SYNC_DIS is set, and TX_CMIX_SYNC_DIS is cleared, and TX_CMIX_SYNC_SRC specifies serial interface bit to be the sync source for the TX CMIX. TX_DIV_SER_IF_SYNC – A rising edge on this bit is used as the sync source for TX Divider. This is applicable when TX_GLOBAL_SYNC_DIS is set, and TX_DIV_SYNC_DIS is cleared, and TX_DIV_SYNC_SRC specifies serial interface bit to be the sync source for the TX Divider. TX_QMC_OFF_SER_IF_SYNC – A rising edge on this bit is used as the sync source for TX QMC Offset correction block. This is applicable when TX_GLOBAL_SYNC_DIS is set, and TX_QMC_OFF_SYNC_DIS is cleared, and TX_QMC_OFF_SYNC_SRC specifies serial interface bit to be the sync source for the TX QMC Offset correction. TX_QMC_GAIN_PH_SER_IF_SYNC – A rising edge on this bit is used as the sync source for TX QMC Gain Phase correction block. This is applicable when TX_GLOBAL_SYNC_DIS is set, and TX_QMC_GAIN_PH_SYNC_DIS is cleared, and TX_QMC_GAIN_PH_SYNC_SRC specifies serial interface bit to be the sync source for the TX QMC Gain Phase correction. TX_GLOBAL_SER_IF_SYNC – A rising edge on this is used as the sync source for TX. This is applicable when TX_GLOBAL_SYNC_DIS is cleared, and TX_GLOBAL_SYNC_SRC(1:0) specifies serial interface bit to be the sync source for TX. Register Name – CONFIG9 – Address 0x10E, Default = 0x00 TX_QMC_CORR_ ENA TX_QMC_OFFSET_ ENA TX_QMC_GAIN_PH_ SYNC_NEEDED TX_QMC_OFF_ SYNC_NEEDED TX_QMC_OFF_SYNC_NEEDED – Specifies if syncing is needed for TX QMC Offset Correction . If set, QMC Offset values programmed in the serial interface registers are not applied to the QMC Offset correction block until a sync is applied. TX_QMC_GAIN_PH_SYNC_NEEDED – Specifies if syncing is needed for TX QMC Gain Phase Correction. If set, QMC gain and Phase values programmed into the serial interface registers are not applied to the QMC Gain Phase correction block until a sync is applied. TX_QMC_OFFSET_ENA – Enables TX QMC Offset Correction. Common for both channels. TX_QMC_CORR_ENA – Enable TX QMC Gain Phase Correction. Common for both channels. Note that by default, the TX_QMC_GAINA(2:0) and TX_QMC_GAINB(2:0) are set to 0. So when TX_QMC_CORR_ENA is written, the output goes to zero until the time TX_QMC_GAINA(2:0) and TX_QMC_GAINB(2:0) are written to the desired value. Register Name – CONFIG10 – Address 0x10F Default = 0x00 (Optionally Synced) TX_QMC_OFFSETA(12:5) TX_QMC_OFFSETA(12:5) – Upper 8 bits of DAC A Offset Correction . The lower 5 bits are in CONFIG11 Register. Offset is a signed value (2s complement). 26 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Register Name – CONFIG11 – Address 0x110 Default = 0x00 (Optionally Synced ) TX_QMC_OFFSETA(4:0) TX_QMC_GAINA(2:0) TX_QMC_OFFSETA(4:0) – Lower 5 bits of DAC A Offset Correction . TX_QMC_GAINA(2:0) – Lower 3 bits of the 11 bit QMC Gain word for DAC A. The upper 8 bits are in CONFIG12 register.The full 11 bit TX_QMC_GAINA(10:0) word is formatted as UNSIGNED with a range or 0 to 1.9990 . The implied decimal point for the multiplication is between bits (9) and (10). Register Name – CONFIG12 – Address 0x111 Default = 0x00 (Synced ) TX_QMC_GAINA(10:3) TX_QMC_GAINA(10:3) –Upper 8 bits if the 11 bit QMC Gain word for DAC A. Register Name – CONFIG13 – Address 0x112 Default = 0x00 (Synced) TX_QMC_OFFSETB(12:5) TX_QMC_OFFSETB(12:5) –Upper 8 bits of DAC B Offset Correction. The lower 5 bits are in CONFIG14 Register. Register Name – CONFIG14 – Address 0x113 Default = 0x00 (Synced) TX_QMC_OFFSETB(4:0) TX_QMC_GAINB(2:0) TX_QMC_OFFSETB(4:0) – Lower 5 bits of DAC B Offset Correction . TX_QMC_GAINB(2:0) – Lower 3 bits of the 11 bit QMC Gain word for DAC B. The upper 8 bits are in CONFIG15 register.The full 11 bit TX_QMC_GAINB(10:0) word is formatted as UNSIGNED with a range or 0 to 1.9990. Register Name – CONFIG15 – Address 0x114 Default = 0x00 (Synced) TX_QMC_GAINB(10:3) TX_QMC_GAINB(10:3) – Upper 8 bits if the 11 bit QMC Gain word for DAC B. Register Name – CONFIG16 – Address 0x115 Default = 0x00 (Synced) TX_QMC_PHASE(9:2) TX_QMC_PHASE(9:2) – Upper Upper 8 bits if the 10 bit QMC Phase word. The lower two bits are in the CONFIG17 register. The full QMC_PHASE(9:0) correction word is formatted as 2s complement and scaled to occupy a range of -0.125 to 0.12475. To acomplish QMC Phase correction, this value is multiplied by the current Q sample, then summed to the I sample. Register Name – CONFIG17 – Address 0x116 Default = 0x00 (Synced) TX_QMC_PHASE(1:0) TX_QMC_PHASE(1:0) – Lower 2 bits of the 10 bit QMC Phase word . Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 27 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Register Name – CONFIG18 – Address 0x117 Default = 0x00 (Synced) TX_NCO_FREQ_WORD(31:24) TX_NCO_FREQ_WORD(31:24) – See CONFIG21 below. Register Name – CONFIG19 – Address 0x118 Default = 0x00 (Synced) TX_NCO_FREQ_WORD(23:16) TX_NCO_FREQ_WORD(23:16) – See CONFIG21 below. Register Name – CONFIG20 – Address 0x119 Default = 0x00 (Synced) TX_NCO_FREQ_WORD(15:8) TX_NCO_FREQ_WORD(15:8) – See CONFIG21 below. Register Name – CONFIG21 – Address 0x11A Default = 0x00 (Synced) TX_NCO_FREQ_WORD(7:0) TX_NCO_FREQ_WORD(7:0) – This is used to determine the frequency, Fmix of the NCO. The twos complement formatted value can be positive or negative, and the LSB is equal to Fs/232 Register Name – CONFIG22 – Address 0x11B Default = 0x00 (Synced) TX_NCO_PHASE_OFF(15:8) TX_NCO_FREQ_WORD(15:8) – See CONFIG23 below. Register Name – CONFIG23 – Address 0x11C Default = 0x00 (Synced) TX_NCO_PHASE_OFF(7:0) TX_NCO_PHASE_OFF(7:0) – This is the 2s complement Phase offset added to the NCO accumulator just before the generation of the SIN and COS values. Register Name – CONFIG24 – Address 0x11D, Default = 0x00 TX_MIXER_EN TX_MIXER_GAIN(1:0) TX_MIXER_GAIN(1:0) – The fine mixer realizes the functions {Acos(ωmixt) – B sin(ωmixt)} and {Asin(ωmixt) + Bcos(ωmixt)} This can cause the fine mixer output to be up to 3 dB higher than the individual inputs.The mixer gain can restore the signal level to the desired level by providing a programmable attenuation. VALUE GAIN 0 –2.5 dB (default) – use when complex mixing 1 –6 dB 2 0 dB – use when one input is zero 3 0 dB TX_MIXER_EN – This enables the fine mixer, which also causes the NCO to be enabled. 28 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Register Name – CONFIG25– Address 0x11E Default = 0x00 TX_NCO_SYNC_ DIS TX_NCO_SYNC_ SRC TX_NCO_SER_IF_ SYNC TX_NCO_SYNC_ NEEDED TX_NCO_SYNC_NEEDED – Specifies if syncing is needed for TX NCO. If set, NCO Frequency and Offset words programmed into the serial interface registers are not applied to the NCO until a sync is applied TX_NCO_SER_IF_SYNC – A rising edge on this bit is used as the sync source for TX NCO. This is applicable when TX_GLOBAL_SYNC_DIS is set, and TX_NCO_SYNC_DIS is cleared, and TX_NCO_SYNC_SRC specifies serial interface bit to be the sync source for the NCO. TX_NCO_SYNC_SRC – Specifies the sync source for TX NCO. When cleared, SYNC pin is used as the sync source. When set, a rising edge on serial interface bit TX_NCO_SER_IF_SYNC is used as the sync source for TX NCO. This is applicable when TX_GLOBAL_SYNC_DIS is set. TX_NCO_SYNC_DIS – Disables TX_GLOBAL_SYNC_DIS is set. Syncing of the Tx NCO. This takes effect only when Register Name – CONFIG26 – Address 0x11F, Default = 0x00 CHA_REG1(15:8) CHA_REG1(15:8) – Upper 8 bits for sample 1 for DAC A in 8-sample FIFO mode . TX_CHA_8_IP_EN in CONFIG 1 needs to be set for Regs CONFIG26 to CONFIG41 to take effect. Register Name – CONFIG27 – Address 0x120, Default = 0x00 CHA_REG1(7:0) CHA_REG1(7:0) – Lower 8 bits for sample 1 for DAC A Register Name – CONFIG28 – Address 0x121, Default = 0x00 CHA_REG2(15:8) CHA_REG2(15:8) – Upper 8 bits for sample 2 for DAC A . Register Name – CONFIG29 – Address 0x122, Default = 0x00 CHA_REG2(7:0) CHA_REG2(7:0) – Lower 8 bits for sample 2 for DAC A Register Name – CONFIG30 – Address 0x123, Default = 0x00 CHA_REG3(15:8) CHA_REG3(15:8) – Upper 8 bits for sample 3 for DAC A Register Name – CONFIG31 – Address 0x124, Default = 0x00 CHA_REG3(7:0) CHA_REG3(7:0) – Lower 8 bits for sample 3 for DAC A Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 29 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Register Name – CONFIG32 – Address 0x125, Default = 0x00 CHA_REG4(15:8) CHA_REG4(15:8) – Upper 8 bits for sample 4 for DAC A . Register Name – CONFIG33 – Address 0x126, Default = 0x00 CHA_REG4(7:0) CHA_REG4(7:0) – Lower 8 bits for sample 4 for DAC A Register Name – CONFIG34 – Address 0x127, Default = 0x00 CHA_REG5(15:8) CHA_REG5(15:8) – Upper 8 bits for sample 5 for DAC A Register Name – CONFIG35 – Address 0x128, Default = 0x00 CHA_REG5(7:0) CHA_REG5(7:0) – Lower 8 bits for sample 5 for DAC A . Register Name – CONFIG36 – Address 0x129, Default = 0x00 CHA_REG6(15:8) CHA_REG6(15:8) – Upper 8 bits for sample 6 for DAC A Register Name – CONFIG37 – Address 0x12A, Default = 0x00 CHA_REG6(7:0) CHA_REG6(7:0) – Lower 8 bits for sample 6 for DAC A Register Name – CONFIG38 – Address 0x12B, Default = 0x00 CHA_REG7(15:8) CHA_REG7(15:8) – Upper 8 bits for sample 7 for DAC A Register Name – CONFIG39 – Address 0x12C, Default = 0x00 CHA_REG7(7:0) CHA_REG7(7:0) – Lower 8 bits for sample 7 for DAC A. Register Name – CONFIG40 – Address 0x12D, Default = 0x00 CHA_REG8(15:8) CHA_REG8(15:8) – Upper 8 bits for sample 8 for DAC A 30 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Register Name – CONFIG41 – Address 0x12E, Default = 0x00 CHA_REG8(7:0) CHA_REG8(7:0) – Lower 8 bits for sample 8 for DAC A Register Name – CONFIG42 – Address 0x12F, Default = 0x00 CHB_REG1(15:8) CHB_REG1(15:8) – Upper 8 bits for sample 1 for DAC B . TX_CHB_8_IP_EN in CONFIG 1 needs to be set for Regs CONFIG42 to CONFIG57 to take effect. Register Name – CONFIG43 – Address 0x130, Default = 0x00 CHB_REG1(7:0) CHB_REG1(7:0) – Lower 8 bits for sample 1 for DAC B Register Name – CONFIG44 – Address 0x131, Default = 0x00 CHB_REG2(15:8) CHB_REG2(15:8) – Upper 8 bits for sample 2 for DAC B. Register Name – CONFIG45 – Address 0x132, Default = 0x00 CHB_REG2(7:0) CHB_REG2(7:0) – Lower 8 bits for sample 2 for DAC B Register Name – CONFIG46 – Address 0x133, Default = 0x00 CHB_REG3(15:8) CHB_REG3(15:8) – Upper 8 bits for sample 3 for DAC B. Register Name – CONFIG47 – Address 0x134, Default = 0x00 CHB_REG3(7:0) CHB_REG3(7:0) – Lower 8 bits for sample 3 for DAC B Register Name – CONFIG48 – Address 0x135, Default = 0x00 CHB_REG4(15:8) CHB_REG4(15:8) – Upper 8 bits for sample 4 for DAC B. Register Name – CONFIG49 – Address 0x136, Default = 0x00 CHB_REG4(7:0) CHB_REG4(7:0) – Lower 8 bits for sample 4 for DAC B. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 31 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Register Name – CONFIG50 – Address 0x137, Default = 0x00 CHB_REG5(15:8) CHB_REG5(15:8) – Upper 8 bits for sample 5 for DAC B. Register Name – CONFIG51 – Address 0x138, Default = 0x00 CHB_REG5(7:0) CHB_REG5(7:0) – Lower 8 bits for sample 5 for DAC B Register Name – CONFIG52 – Address 0x139, Default = 0x00 CHB_REG6(15:8) CHB_REG6(15:8) – Upper 8 bits for sample 6 for DAC B. Register Name – CONFIG53 – Address 0x13A, Default = 0x00 CHB_REG6(7:0) CHB_REG6(7:0) – Lower 8 bits for sample 6 for DAC B. Register Name – CONFIG54 – Address 0x13B, Default = 0x00 CHB_REG7(15:8) CHB_REG7(15:8) – Upper 8 bits for sample 7 for DAC B. Register Name – CONFIG55 – Address 0x113C, Default = 0x00 CHB_REG7(7:0) CHB_REG7(7:0) – Lower 8 bits for sample 7 for DAC B Register Name – CONFIG56 – Address 0x13D, Default = 0x00 CHB_REG8(15:8) CHB_REG8(15:8) – Upper 8 bits for sample 8 for DAC B. Register Name – CONFIG57 – Address 0x13E, Default = 0x00 CHB_REG8(7:0) CHB_REG8(7:0) – Lower 8 bits for sample 8 for DAC B Register Name – CONFIG58 – Address 0x13F, Default = 0x00 EN_IP_CLK_STOP_DET EN_FIFO_COLLISION_DET EN_FIFO_COLLISION_DET – On RESET (and when synced), the read and write pointers of the FIFO are set 4 positions away. The read pointer increments at the DAC_DCLKIN rate whereas the write pointer increments at the divided DAC_CLK rate. While the frequencies of these 2 clocks are expected to be the same, relative phase drifts can cause this relative difference of 4 positions to drift. When the EN_FIFO_COLLISION_DET bit is set, a collision condition is detected when the relative difference 32 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 between the read and write pointers becomes either 0,1 or 2. Detection of this collision condition automatically causes masks the DACs to give out an output corresponding to mid code. The read and write pointer differing by 2 is referred to as 2-way detection. 2-away detection can be prevented from triggering collision by setting MASK_2_AWAY_DET in CONFIG 1. Collision detection is done once every 8 input samples. EN_IP_CLK_STOP_DET – When set, the condition of input clock being stopped causes the DAC outputs to be forced to mid code. Register Name – CONFIG59 – Address 0x140, Default = 0x00 (Read Only) FIFO_ERROR FIFO_COLLISION FIFO_1_AWAY FIFO_2_AWAY INP_CLK_STOP These are refreshed at the rate of the divided DAC_CLK. INP_CLK_STOP – If set, it indicates that the input clock has been detected as having been stopped. FIFO_2_AWAY – If set, it indicates that the condition of the read and write pointers being 2 locations away from each other has been detected. FIFO_1_AWAY – If set, it indicates that the condition of the read and write pointers being 1 location away from each other has been detected. FIFO_COLLISION – If set, this indicates that the read and write pointers have been detected as overlapping with each other FIFO_ERROR – If set, this indicates that either Collision , or 1-away or 2-away condition has been detected. Register Name – CONFIG60 – Address 0x141, Default = 0x00 (Read Only) FIFO_INP_PTR(2:0) FIFO_OP_PTR(2:0) FIFO_OP_PTR(2:0) – Containts the FIFO read pointer value. Its written into the register when STORE_FIFO_PTRS is set in CONFIG2. It is not updated once the device is configured into readout mode. FIFO_INP_PTR(2:0) – Containts the FIFO write pointer value. Its written into the register when STORE_FIFO_PTRS is set in CONFIG2. It is not updated once the device is configured into readout mode. SYNC SYNC RX RMS / Peak Power Meter /2 HBF Decimation Fine Mixer RX Input B QMC Gain/ Phase RX Input A Coarse Mixer (CMIX) RECEIVE DIGITAL SIGNAL CHAIN REGISTERS QMC Offset 5.2 RX Output A (I Channel) RX Output B (Q Channel) SYNC NCO SYNC SYNC Figure 5-3. Signal Chain Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 33 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Register Name – CONFIG61 – Address 0x165, Default = 0x00 TX_RX_LPBK_ SRC TX_RX_LPBK RX_DECB_MODE RX_DECA_MODE RX_DEC_FIL_ EN_SRC RX_DEC_FIL_ EN RX_DEC_FIL_EN – Enables the decimation filter in the RX path in both the A and B channels. Set RX_DEC_FIL_EN_SRC for this to take effect. Output clock automatically set to 0.5X. RX_DEC_FIL_EN_SRC – When set, this allows RX_DEC_FIL_EN to take effect. RX_DECA_MODE – When set, configures the decimation filter in Channel A in high pass mode. By default, the filter is in low pass mode. RX_DECB_MODE – When set, configures the decimation filter in Channel B in high pass mode. By default, the filter is in low pass mode. TX_RX_LPBK – When this bit and TX_Rx_LPBK_SRC are both set , the input to the RX signal chain is tapped from the the final output of the TX signal chain. TX_Rx_LPBK_SRC – When this bit and TX_RX_LPBK are both set , the input to the RX signal chain is tapped from the the final output of the TX signal chain. IOUTP_A_DAC 12b TX DAC A IOUTN_A_DAC IOUTP_B_DAC 12b TX DAC B IOUTN_B_DAC Serial LVDS or Parallel CMOS INN_B_ADC Serial LVDS or Parallel CMOS 12b RX ADC B RX DIGITAL SIGNAL CHAIN INP_B_ADC TX DIGITAL SIGNAL CHAIN 12b RX ADC A INN_A_ADC MUX INP_A_ADC MUX The TX to RX loopback is illustrated below. The dotted arrows show the loopback mode. 12-bit ADC Output 12-bit DAC Input Figure 5-4. Signal Chain Register Name – CONFIG62 – Address 0x166, Default = 0x00 RX_DIV_PHASE_INV RX_DIV_PHASE RX_CMIX_PHASE(1:0) RX_CMIX_PHASE_ INCR RX_CMIX_MODE(1:0) RX_CMIX_EN RX_CMIX_EN – Enables the RX Coarse mixer. RX_CMIX_MODE(1:0) – Specifies the mode in which the RX Coarse mixer is configured . Set RX_CMIX_EN for this to take effect. 34 REGISTER DESCRIPTIONS VALUE MIXING MODE 0 Normal(Low pass ) 1 Fs /2 (High Pass ) 2 + Fs/4 3 – Fs/4 Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 RX_CMIX_PHASE_INCR – This bit can be used to control the mixing phase without the need for the SYNC pin. A 0 to 1 transition on this bit causes the phase of mixing in the RX CMIX to be incremented by 1 with respect to the current phase of mixing . To increment the phase of mixing more than once, clear and then set this bit once again. Syncing needs to be disabled for RX CMIX for this mode to work. (This means that both global syncing, as well as block level syncing needs to be disabled for CMIX ) RX_CMIX_PHASE(1:0) – The value programmed into this is applied as the RX CMIX phase, when the CMIX is synced, Syncing needs to be enabled for CMIX for this mode to work. RX_DIV_PHASE – The value programmed into this is applied as the RX Divider phase, when the divider is synced. If divider is not synced, then output latency can differ by 1 with respect to the sampling clock. The RX divider is used whenever the decimation filter is enabled. RX_DIV_PHASE_INV – This bit is used to control the phase of the RX divider without the need for the SYNC pin. A 0 to 1 transition on this bit causes the phase of division in the RX Divider to be inverted by 1 with respect to the current phase of division. To invert the phase of division more than once, clear and then set this bit once again. Syncing needs to be disabled for RX Divider for this mode to work. Register Name – CONFIG63 – Address 0x167, Default = 0x00 RX_BYP_SRC RX_BYP RX_CHB_PDN_SRC RX_CHB_PDN RX_CHA_PDN RX_CHA_PDN_S RC RX_DIS RX_DIS – Disables the RX signal chain of both channels. All blocks in the signal chain are powered down, and the RX output is mid-code. RX_CHA_PDN_SRC – Setting this causes the value programmed into RX_CHA_PDN to take effect. RX_CHA_PDN – Powers down Channel A in Rx signal chain. Output of the channel is mid code. Set RX_CHA_PDN_SRC for this to take effect. Output clock is not powered down. RX_CHB_PDN – Powers down Channel B in Rx signal chain. Output of the channel is mid code. Set RX_CHB_PDN_SRC for this to take effect. Output clock is not powered down. RX_CHB_PDN_SRC – Setting this causes the value programmed into RX_CHB_PDN to take effect. Note that when in default mode of operation (none of the register-selectable digital features enabled), all 4 of above bits (RX_CHA_PDN, RX_CHA_PDN_SRC, RX_CHB_PDN, RX_CHB_PDN_SRC) have to be set together to ‘1’ for them to take effect. However, if any of the digital features (like interpolation, Fine mixer, Coarse mixer, or QMC gain/phase or offset) are enabled, then the channel A can be independently powered down using bits RX_CHA_PDN and RX_CHA_PDN_SRC, and channel B can be independently powered down using bits RX_CHB_PDN and RX_CHB_PDN_SRC. RX_BYP – The inputs to both the Rx channels are directly passed to the outputs. Set RX_BYP_SRC for this to take effect. Use this mode to operate the Rx with lowest latency. RX_BYP_SRC – Setting this causes the value programmed into RX_BYP to take effect. Register Name – CONFIG64 – Address 0x168, Default = 0x00 RX_GLOBAL_SYNC_ DIS RX_QMC_GAIN_PH_SYNC_ DIS RX_QMC_OFF_SYNC_ DIS RX_DIV_SYNC_ DIS RX_CMIX_SYNC_ DIS RX_CMIX_SYNC_DIS – Disables Syncing of the Rx Coarse mixer. This takes effect only when RX_GLOBAL_SYNC_DIS is set. RX_DIV_SYNC_DIS – Disables Syncing of the Rx clock divider .This takes effect only when RX_GLOBAL_SYNC_DIS is set. RX_QMC_OFF_SYNC_DIS – Disables Syncing of Rx QMC Offset Correction .This takes effect only when RX_GLOBAL_SYNC_DIS is set. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 35 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com RX_QMC_GAIN_PH_SYNC_DIS – Disables Syncing of Rx QMC Gain Phase Correction. This takes effect only when RX_GLOBAL_SYNC_DIS is set. RX_GLOBAL_SYNC_DIS – When set, disables global syncing of RX signal chain. When cleared, a rising edge on the selected sync source causes RX blocks to be synced. Register Name – CONFIG65 – Address 0x169, Default = 0x00 RX_GLOBAL_SYNC_ SRC RX_QMC_GAIN_PH_SYNC_ SRC RX_QMC_OFF_SYNC_ SRC RX_DIV_SYNC_ SRC RX_CMIX_SYNC_ SRC RX_CMIX_SYNC_SRC – Specifies the sync source for the RX Coarse mixer. When cleared, SYNC pin is used as the sync source . When set, a rising edge on serial interface bit RX_CMIX_SER_IF_SYNC in Register 0x16A is used as the sync source for RX CMIX. This is applicable when RX_GLOBAL_SYNC_DIS is set, and RX_CMIX_SYNC_DIS is cleared. RX_DIV_SYNC_SRC – Specifies the sync source for the RX Divider. When cleared, SYNC pin is used as the sync source . When set, a rising edge on serial interface bit RX_DIV_SER_IF_SYNC in register 0x16A is used as the sync source for RX Divider. This is applicable when RX_GLOBAL_SYNC_DIS is set and RX_DIV_SYNC_DIS is cleared. RX_QMC_OFF_SYNC_SRC – Specifies the sync source for RX QMC Offset Correction. When cleared, SYNC pin is used as the sync source . When set , a rising edge on serial interface bit RX_QMC_OFF_SER_IF_SYNC in register 0x16A is used as the sync source for RX QMC Offset Correction. This is applicable when RX_GLOBAL_SYNC_DIS is set and RX_QMC_OFF_SYNC_DIS is cleared. RX_QMC_GAIN_PH_SYNC_SRC – Specifies the sync source for RX QMC Gain Phase Correction. When cleared, SYNC pin is used as the sync source. When set, a rising edge on serial interface bit RX_QMC_GAIN_PH_SER_IF_SYNC in register 0x16A is used as the sync source for RX QMC Gain Phase Correction. This is applicable when RX_GLOBAL_SYNC_DIS is set and RX_QMC_GAIN_PH_SYNC_DIS is cleared. RX_GLOBAL_SYNC_SRC – Specifies the sync source for RX. When cleared, SYNC pin is used as the sync source. When set, a rising edge on serial interface bit RX_GLOB_SER_IF_SYNC in register 0x16A is used as the sync source for RX. This is applicable when RX_GLOBAL_SYNC_DIS is cleared. Register Name – CONFIG66 – Address 0x16A, Default = 0x00 RX_GLOBAL_SER_ IF_SYNC RX_QMC_GAIN_PH_ SER_ IF_SYNC RX_QMC_OFF_SER_ IF_SYNC RTX_DIV_SER_ IF_SYNC RX_CMIX_SER_IF_ SYNC RX_CMIX_SER_IF_SYNC – A rising edge on this bit is used as the sync source for RX CMIX. This is applicable when RX_GLOBAL_SYNC_DIS is set, and RX_CMIX_SYNC_DIS is cleared, and RX_CMIX_SYNC_SRC specifies serial interface bit to be the sync source for the RX CMIX. RX_DIV_SER_IF_SYNC – A rising edge on this bit is used as the sync source for RX Divider. This is applicable when RX_GLOBAL_SYNC_DIS is set, and RX_DIV_SYNC_DIS is cleared, and RX_DIV_SYNC_SRC specifies serial interface bit to be the sync source for the RX Divider. RX_QMC_OFF_SER_IF_SYNC – A rising edge on this bit is used as the sync source for RX QMC Offset correction block. This is applicable when RX_GLOBAL_SYNC_DIS is set, and RX_QMC_OFF_SYNC_DIS is cleared, and RX_QMC_OFF_SYNC_SRC specifies serial interface bit to be the sync source for the RX QMC Offset correction. RX_QMC_GAIN_PH_SER_IF_SYNC – A rising edge on this bit is used as the sync source for RX QMC Gain Phase correction block. This is applicable when RX_GLOBAL_SYNC_DIS is set, and RX_QMC_GAIN_PH_SYNC_DIS is cleared, and RX_QMC_GAIN_PH_SYNC_SRC specifies serial interface bit to be the sync source for the RX QMC Gain Phase correction. 36 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 RX_GLOBAL_SER_IF_SYNC – A rising edge on this is used as the sync source for RX . This is applicable when RX_GLOBAL_SYNC_DIS is cleared, and RX_GLOBAL_SYNC_SRC specifies serial interface bit to be the sync source for RX. Register Name – CONFIG67 – Address 0x16B, Default = 0x00 RX_QMC_CORR_ ENA RX_QMC_OFFSET_ ENA RX_QMC_GAIN_PH_SYNC_ NEEDED RX_QMC_OFF_SYNC_ NEEDED RX_QMC_OFF_SYNC_NEEDED – Specifies if syncing is needed for RX QMC Offset Correction. If set, QMC Offset values programmed into the serial interface registers are not applied to the QMC Offset correction block until a Sync is applied. RX_QMC_GAIN_PH_SYNC_NEEDED – Specifies if syncing is needed for RX QMC Gain Phase Correction. If set, QMC gain and Phase values programmed into the serial interface registers are not applied to the QMC Gain Phase correction block until a sync is applied. RX_QMC_OFFSET_ENA – Enables RX QMC Offset Correction. RX_QMC_CORR_ENA – Enable RX QMC Gain Phase Correction. Register Name – CONFIG68 – Address 0x16C, Default = 0x00 (Synced) RX_QMC_OFFSETA(12:5) RX_QMC_OFFSETA(12:5) – Upper 8 bits of ADC A Offset Correction . The lower 5 bits are in CONFIG69 Register. Register Name – CONFIG69 – Address 0x16D, Default = 0x00 (Synced) RX_QMC_OFFSETA(4:0) RX_QMC_GAINA(2:0) RX_QMC_OFFSETA(4:0) – Lower 5 bits of ADC A Offset Correction . RX_QMC_GAINA(2:0) – Lower 3 bits of the 11 bit QMC Gain word for ADC A. The upper 8 bits are in CONFIG70 register.The full 11 bit RX_QMC_GAINA(10:0) word is formatted as UNSIGNED with a range or 0 to 1.9990. The implied decimal point for the multiplication is between bits (9) and (10). Register Name – CONFIG70 – Address 0x16E, Default = 0x00 (Synced) RX_QMC_GAINA(10:3) RX_QMC_GAINA(10:3) – Upper 8 bits if the 11 bit QMC Gain word for ADC A Register Name – CONFIG71 – Address 0x16F, Default = 0x00 (Synced) RX_QMC_OFFSETB(12:5) RX_QMC_OFFSETB(12:5) – Upper 8 bits of ADC B Offset Correction . The lower 5 bits are in CONFIG72 Register. Register Name – CONFIG72 – Address 0x170, Default = 0x00 (Synced) RX_QMC_OFFSETB(4:0) RX_QMC_GAINB(2:0) RX_QMC_OFFSETB(4:0) – Lower 5 bits ofADC B Offset Correction . RX_QMC_GAINB(2:0) – Lower 3 bits of the 11 bit QMC Gain word for ADC B. The upper 8 bits are in CONFIG73 register.The full 11 bit RX_QMC_GAINB(10:0) word is formatted as UNSIGNED with a range or 0 to 1.9990. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 37 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Register Name – CONFIG73 – Address 0x171, Default = 0x00 (Synced) RX_QMC_GAINB(10:3) RX_QMC_GAINB(10:3) – Upper 8 bits of the 11 bit QMC Gain word for ADC B. Register Name – CONFIG74 – Address 0x172, Default = 0x00 RX_QMC_PHASE(9:2) RX_QMC_PHASE(9:2) – Upper 8 bits of the 10 bit QMC Phase word. The lower two bits are in the CONFIG75 register. The full QMC_PHASE(9 :0) correction word is formatted as 2s complement and scaled to occupy a range of -0.125 to 0.12475. To acomplish QMC Phase correction, this value is multiplied by the current Q sample, then summed to the I sample. Register Name – CONFIG75 – Address 0x173, Default = 0x00 (Synced) RX_QMC_PHASE(1:0) RX_QMC_PHASE(1:0) – Lower 2 bits of the 10 bit QMC Phase word. Register Name – CONFIG76 – Address 0x174, Default = 0x00 (Synced) RX_NCO_FREQ_WORD(31:24) RX_NCO_FREQ_WORD(31:24) – See CONFIG79 below. Register Name – CONFIG77 – Address 0x175, Default = 0x00 (Synced) RX_NCO_FREQ_WORD(23:16) RX_NCO_FREQ_WORD(23:16) – See CONFIG79 below. Register Name – CONFIG78 – Address 0x176, Default = 0x00 (Synced) RX_NCO_FREQ_WORD(15:8) RX_NCO_FREQ_WORD(15:8) – See CONFIG79 below. Register Name – CONFIG79 – Address 0x177, Default = 0x00 (Synced) RX_NCO_FREQ_WORD(7:0) RX_NCO_FREQ_WORD(7:0) – This 32-bit word specifies the frequency of the NCO used by the fine mixer. The twos complement formatted value can be positive or negative, and the LSB is equal to (Fs/232). Register Name – CONFIG80 – Address 0x178, Default = 0x00 (Synced) RX_NCO_PHASE_OFF(15:8) RX_NCO_PHASE_OFF(15:8) – See CONFIG81 below. 38 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Register Name – CONFIG81 – Address 0x179, Default = 0x00 (Synced) RX_NCO_PHASE_OFF(7:0) RX_NCO_PHASE_OFF(7:0) – This is the Phase offset added to the NCO accumulator just before the generation of the SIN and COS values. Register Name – CONFIG82 – Address 0x17A, Default = 0x00 PWR_MTR_COARSE_SAMPLES(2:0) RX_MIXER_EN RX_MIXER_GAIN(1:0) RX_MIXER_GAIN(1:0) – This specifies the gain to be applied to the mixer output to prevent it from saturating. VALUE GAIN 0 -2.5 dB 1 -6 dB 2 0 dB 3 0 dB RX_MIXER_EN – This enables the Full mixer, which also causes the NCO to be enabled. PWR_MTR_COARSE_SAMPLES(2:0) – Specifies the number of samples, ‘N’ over which power is to be computed when the power meter is configured in the coarse mode. Keeps refreshing every ‘N’ samples but writes to serial interface register only when serial clock is available – which requires a write to this page. Stops refreshing once you get into readout mode. VALUE NUMBER OF SAMPLES 0 16 1 32 2 64 3 128 4 256 5 512 6 1024 7 16 Register Name – CONFIG83 – Address 0x17B, Default = 0x00 PWR_MTR_ SYNC_DIS PWR_MTR_ SYNC_SRC PWR_MTR_ SER_IF_SYNC PWR_MTR_ SYNC_NEEDED RX_NCO_ SYNC_DIS RX_NCO_ SYNC_SOURCE RX_NCO_SER_ IF_SYNC RX_NCO_ SYNC_ NEEDED RX_NCO_SYNC_NEEDED – Specifies if syncing is needed for RX NCO. If set , NCO Frequency and Offset words programmed into the serial interface registers are not applied to the NCO until a sync is applied RX_NCO_SER_IF_SYNC – A rising edge on this bit is used as the sync source for RX NCO. This is applicable when RX_GLOBAL_SYNC_DIS is set, and RX_NCO_SYNC_DIS is cleared, and RX_NCO_SYNC_SRC specifies serial interface bit to be the sync source for the NCO. RX_NCO_SYNC_SRC – Specifies the sync source for RX NCO. When cleared, SYNC pin is used as the sync source. When set, a rising edge on serial interface bit RX_NCO_SER_IF_SYNC is used as the sync source for RX NCO. This is applicable when RX_GLOBAL_SYNC_DIS is set RX_NCO_SYNC_DIS – Disables RX_GLOBAL_SYNC_DIS is set Syncing of the RX NCO Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 .This takes effect only REGISTER DESCRIPTIONS when 39 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com PWR_MTR_SYNC_NEEDED – Specifies if syncing is needed for the RX Power Meter . If set, power computation begins a programmable number of cycles after the detection of a sync pulse. Applies for both the coarse and fine power meters. PWR_MTR_SER_IF_SYNC – A rising edge on this bit is used as the sync source for RX Power Meter. This is applicable when RX_GLOBAL_SYNC_DIS is set, and PWR_MTR_SYNC_DIS is cleared, and PWR_MTR_SYNC_SRC specifies serial interface bit to be the sync source for the Power Meter. PWR_MTR_SYNC_SRC – Specifies the sync source for RX Power Meter . When cleared, SYNC pin is used as the sync source . When set, a rising edge on serial interface bit PWR_MTR_SER_IF_SYNC is used as the sync source for RX Power Meter. This is applicable when RX_GLOBAL_SYNC_DIS is set PWR_MTR_SYNC_DIS – Disables Syncing of the RX Power Meter .This takes effect only when RX_GLOBAL_SYNC_DIS is set. Register Name – CONFIG84 – Address 0x17C, Default = 0x00 INTGR_CNT (20:13) INTGR_CNT(20:13) – Upper 8 bits of the 21 bit Integration count for the fine power meter. Integration is done over (8N + 3) samples where N is the unsigned integer represented by INTGR_CNT (20:0) Register Name – CONFIG85 – Address 0x17D, Default = 0x00 INTGR_CNT(12:5) INTGR_CNT(12:5) – Middle 8 bits of the 21 bit Integration count for the Power meter. Register Name – CONFIG86 – Address 0x17E, Default = 0x00 INTGR_CNT(4:0) SYNC_CNT(8:6) SYNC_CNT(8:6) – Upper 3 bits of the 9 bit Sync count for the fine power meter. After the detection of a sync pulse, there is a delay of 8N +4 cycles before Integration begins, where N is the unsigned integer represented by SYNC_CNT(8:0) INTGR_CNT(4:0) – Lower 5 bits of the 21 bit Integration count for the fine power meter. Register Name – CONFIG87 – Address 0x17F, Default = 0x00 SYNC_CNT(5:0) SYNC_CNT(5:0) – Lower 3 bits of the 9 bit Sync count. Register Name – CONFIG88 – Address 0x180, Default = 0x00 INTRV_CNT (20:13) INTRV_CNT (20:13) – Upper 8 bits of the 21 bit Interval count for the fine power meter. The actual Interval period is (8N + 3) samples where N is the unsigned integer represented by INTRV_CNT (20:0) 40 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Register Name – CONFIG89 – Address 0x181, Default = 0x00 INTRV_CNT(12:5) INTRV_CNT(12:5) – Middle 8 bits of the 21 bit Interval count for the Power meter Register Name – CONFIG90 – Address 0x182, Default = 0x00 INTRV_CNT (4:0) PWR_MTR_MODE PWR_MTR_FINE PWR_MTR_EN INTRV_CNT(4:0) – Lower 4 bits of the 21 bit Interval count for the Power meter PWR_MTR_EN – Enables the power meter. Common for fine and coarse power meters. PWR_MTR_FINE – When cleared, configures the power meter in ‘Fine ‘ mode where it gives linear output . When set, configures it in the coarse mode, where it gives output in the db scale.In coarse mode, the number of samples over which power is computed is specified in the PWR_MTR_COARSE_SAMPLES(2:0) in CONFIG82. PWR_MTR_MODE – When cleared, configures the power meter in the real mode – Output I = I2, Output Q = Q2. When set, configures it in complex mode – Output = I2 + Q2. Register Name – CONFIG91 – Address 0x183, Default = 0x00 (Read Only) PWR_OP_I(57:50) PWR_OP_I(57:50) – Upper 8 bits of the Power meter output for I channel when it is configured in the Fine mode. This represents power of I channel when configured in the real mode, and the complex power when configured in the complex mode. Register Name – CONFIG92 – Address 0x184, Default = 0x00 (Read Only) PWR_OP_I(49:42) PWR_OP_I(49:42) Register Name – CONFIG93 – Address 0x185, Default = 0x00 (Read Only) PWR_OP_I(41:34) PWR_OP_I(41:34) Register Name – CONFIG94 – Address 0x186, Default = 0x00 (Read Only) PWR_OP_I(33:26) PWR_OP_I(33:26) Register Name – CONFIG95 – Address 0x187, Default = 0x00 (Read Only) PWR_OP_I(25:18) PWR_OP_I(25:18) Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 41 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Register Name – CONFIG96 – Address 0x188, Default = 0x00 (Read Only) PWR_OP_I(17:10) PWR_OP_Q(57:52) PWR_OP_I(17:10) Register Name – CONFIG97 – Address 0x189, Default = 0x00 (Read Only) PWR_OP_I(9:2) PWR_OP_I(9:2) Register Name – CONFIG98 – Address 0x18A, Default = 0x00 (Read Only) PWR_OP_I(1:0) PWR_OP_Q(57:0) – Power meter output for Q channel when it is configured in the Fine mode . This represents power of Q channel when configured in the real mode. In the complex mode, this does not contain any information. For a 12-bit output (as is the case in AFE722x), the lower eight bits will not contain any information; so it is sufficient to read out PWR_OP_Q(57:8). PWR_OP_I(57:0) – Power meter output for I channel when it is configured in the Fine real mode. This represent the power of the I channel, and in the complex mode, it represents the complex power. For a 12-bit output (as is the case in AFE722x), the lower eight bits will not contain any information; so it is sufficient to read out PWR_OP_I(57:8). Register Name – CONFIG99 – Address 0x18B, Default = 0x00 (Read Only) PWR_OP_Q(51:44) PWR_OP_Q(51:44) Register Name – CONFIG100 – Address 0x18C, Default = 0x00 (Read Only) PWR_OP_Q(43:36) PWR_OP_Q(43:36) Register Name – CONFIG101 – Address 0x18D, Default = 0x00 (Read Only) PWR_OP_Q(35:28) PWR_OP_Q(35:28) Register Name – CONFIG102 – Address 0x18E, Default = 0x00 (Read Only) PWR_OP_Q(27:20) PWR_OP_Q(27:20) Register Name – CONFIG103 – Address 0x18F, Default = 0x00 (Read Only) 42 REGISTER DESCRIPTIONS PWR_OP_Q(19:12) Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 PWR_OP_Q(19:12) Register Name – CONFIG104 – Address 0x190, Default = 0x00 (Read Only) PWR_OP_Q(11:4) PWR_OP_Q(11:4) Register Name – CONFIG105 – Address 0x191, Default = 0x00 (Read Only) PWR_OP_Q(3:0) PWR_OP_Q_RDY PWR_OP_I_RDY PWR_OP_I_RDY – Set when the very first computation from the ‘I’ power meter is complete. PWR_OP_Q_RDY – Set when the very first computation from the ‘Q’ power meter is complete. PWR_OP_Q(3:0) – Lowest two bits of the power meter output for Q channel when it is configured to do fine power computation in the real mode. Register Name – CONFIG106 – Address 0x1B2, Default = 0x00 (Read Only) COARSE_PWR_OP_I(3:0) COARSE_PWR_OP_Q(3:0) COARSE_PWR_OP_Q(3:0) – Represents the power in the Q channel when power meter is configured in the coarse power computation mode. In complex power computation mode, this output should be ignored. The mapping of this value to the db scale is given below table. COARSE_PWR_OP_I(3:0) – Represents the power in the I channel when power meter is configured in the coarse power computation mode. In complex power computation mode, this output represents the complex power. Note – In complex power computation mode, the full scale is twice of what it is in the real power computation mode. VALUE POWER IN DB SCALE 15 Greater than –1 dbFS 14 Greater than –2 dbFS 13 Greater than –3 dbFS 12 Greater than –4 dbFS 11 Greater than –5 dbFS 10 Greater than –6 dbFS 9 Greater than –7 dbFS 8 Greater than –8 dbFS 7 Greater than –9 dbFS 6 Greater than –10 dbFS 5 Greater than –11 dbFS 4 Greater than –12 dbFS 3 Greater than –13 dbFS 2 Greater than –14 dbFS 1 Greater than –15 dbFS 0 Lesser than –15 dbFS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 43 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 5.3 www.ti.com CHIP CONTROL REGISTERS Register Name – CONFIG107 – Address 0x000, Default = 0x00 SOFTWARE_RESET SOFTWARE_RESET:-Register bit to reset the device. Once set, the bit generates a reset pulse, which resets all the register bits including itself. Register Name – CONFIG108 – Address 0x207, Default = 0x00 REG_PDNFRM_REG REG_PDN_FAST REG_PDN_GBL REG_PDNQ REG_PDNI REG_PDN_RX REG_PDN_TX REG_PDN_FRM_REG : Specifies whether the PDN control is through PIN or register bit. When cleared, PDN pin is used as the master control. For all the below power down modes to work, either set REG_PDN_FRM_REG or pull PDN pin to ‘High’. REG_PDN_FAST : When REG_PDN_FRM_REG is low, this bit configures the PDN pin for fast powerdown control. When REG_PDN_FRM_REG is high, this bit directly controls the fast powerdown mode. When set, it power downs both transmitter and receiver but keeps certain blocks like reference circuitry active. Also the Rx output clock is still active. This mode can be used where fast wake up times are required. REG_PDN_GBL : When REG_PDN_FRM_REG is low, this bit configures the PDN pin for global powerdown control. When REG_PDN_FRM_REG is high, this bit directly controls the global powerdown mode. When set, it powers down almost all circuitry inside the chip. Thus this mode can be used when lowest power is desired. The wakeup times in this mode are much higher than in the fast powerdown mode. REG_PDNQ : Power downs Q channel of both transmitter and reciever. REG_PDNI : Power down I channel of both transmitter and reciever. REG_PDN_RX : Power downs reciever i.e both the ADC’s. Clock path is still active. REG_PDN_TX : Power downs transmitter i.e both the DAC’s. REG_PDN_FRM_REG has a similar role to play for the above modes (REG_PDNQ, REG_PDNI, REG_PDN_RX, REG_PDN_TX). When REG_PDN_FRM_REG is low, it configures the PDN pin to the function of the bit that is set. When REG_PDN_FRM_REG is high, the set bit directly controls the described powerdown mode. At 20 MHz Fs, the typical power consumption in different modes are as follows: CURRENT ON 1.8 V SUPPLY (mA) CURRENT ON 3 V SUPPLY (mA) Normal 63 58 Global Power down (REG_PDN_GBL = 1) 2.4 3 Fast power down (REG_PDN_FAST = 1) 25 13 Rx_power down (REG_PDN_RX = 1) 27 58 Tx power down (REG_PDN_TX = 1) 62 13 Both Rx and Tx (REG_PDN_TX = 1, REG_PDN_RX = 1) 25 13 CONDITION Register Name – CONFIG109 – Address 0x208, Default = 0x00 REG_PDNI_TX 44 REG_PDNQ_TX REGISTER DESCRIPTIONS REG_PDNI_RX REG_PDNQ_RX MODE_LP_CMOS REG_SINGLE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 REG_PDNI_TX : Power downs TX Channel A (I Channel) alone. REG_PDNQ_TX : Power downs TX Channel B (Q Channel) alone. REG_PDNI_RX : Power downs RX Channel A (I Channel) alone. REG_PDNQ_RX : Power downs RX Channel B (Q Channel) alone. REG_PDN_FRM_REG has a similar role to play for the above modes (REG_PDNI_TX, REG_PDNQ_TX, REG_PDNI_RX, REG_PDNQ_RX). When REG_PDN_FRM_REG is low, it configures the PDN pin to the function of the bit that is set. When REG_PDN_FRM_REG is high, the set bit directly controls the described powerdown mode. MODE_LP_CMOS : Low power RX CMOS mode. When the RX interface is set to CMOS interface, the device power can be lowered by about 20 mW by setting this bit. Use this mode only for Fs less than 40 MSPS. Refer to section Low power RX CMOS mode. REG_SINGLE : Setting this bit power downs one ADC (Channel A) and One DAC (Channel A). The output data format is SDR. In this mode DAC Channel B and ADC Channel B are active. Register Name – CONFIG110 – Address 0x209, Default = 0x00 REG_OEZ_ LVDS_ CHB REG_OEZ_ LVDS_ CHA REG_OEZ_ LVDS_CLK REG_OEZ_ CMOS_ CLK REG_OEZ_ CMOS_DAT REG_OEZ_CMOS_DAT: 3-state RX CMOS data buffers (use for Half Duplex TX mode when using CMOS interface) REG_OEZ_CMOS_CLK: 3-state RX CMOS clock buffer (use for Half Duplex TX mode when using CMOS interface) REG_OEZ_LVDS_CLK: 3-state RX LVDS clock buffer (use for Half Duplex TX mode when using LVDS interface) REG_OEZ_LVDS_CHA: 3-state RX LVDS data buffers for Channel A (use for Half Duplex TX mode when using LVDS interface) REG_OEZ_LVDS_CHB: 3-state RX LVDS data buffers for Channel B (use for Half Duplex TX mode when using LVDS interface) Register Name – CONFIG111 – Address 0x20A, Default = 0x00 REG_SE_CLK REG_LVDS_TX REG_LVDS_RX WHAT_IS_SDOUT REG_SE_CLK: When set, the device is configured to expect two single ended clocks on CLKINP and CLKINN. DAC_CLK gets derived from the clock on CLKINN and ADC_CLK from the clock on CLKINP. The differential clock buffer is turned off, saving about 6mA of current on the 1.8 V supply. REG_LVDS_TX: By default both RX and TX interfaces are in CMOS mode, this bit sets the TX input interface in LVDS mode REG_LVDS_RX: this bit sets the RX output interface in LVDS mode. In addition to setting this bit, also set bit MASTER_OVERRIDE_RX (in CONFIG131) for proper LVDS settings. WHAT_IS_SDOUT: Configures the SDOUT pin. WHAT_IS_SDOUT Mode 00 Floating 01 Analog test o/p (Do not use) 10 Digital o/p (Use for Aux ADC and register readout) 11 Digital i/p (Use for Aux DAC input mode) Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 45 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 5.4 www.ti.com TX DAC CONTROL REGISTERS Register Name – CONFIG112 – Address 0x237, Default = 0x00 DACQ_GAIN DACQ_GAIN: Fine control of Channel B (DACQ) output current. Output current range is 0.04*FS to -0.04*FS, where FS is Full scale current of DACQ. The word is in 2’s complement format. DACQ_GAIN(decimal equivalent) OUTPUT CURRENT 0 FS 127 FS+.04*FS 128 FS-.04*FS Register Name – CONFIG113 – Address 0x238, Default = 0x00 DACI_GAIN DACI_GAIN: Fine control of Channel A (DACI) output current. Similar to DACQ_GAIN. Register Name – CONFIG114 – Address 0x239, Default = 0x00 DACI_COARSEZ DACQ_COARSEZ DACI_COARSEZ: Coarse control of the Channel A (DACI) output current. Let FS be full scale current then, DACI_COARSEZ OUTPUT CURRENT 0000 FS 0001 15*FS/16 0010 14*FS/16 0011 13*FS/16 0100 12*FS/16 0101 11*FS/16 0110 10*FS/16 0111 9*FS/16 1000 8*FS/16 1001 7*FS/16 1010 6*FS/16 1011 5*FS/16 1100 4*FS/16 1101 3*FS/16 1110 2*FS/16 1111 FS/16 DACQ_COARSEZ: Coarse control of the Channel B (DACQ) output current - similar to DACI_COARSEZ. 46 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com 5.5 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 CLOCKING CONTROL REGISTERS Register Name – CONFIG115 – Address 0x23C, Default = 0x00 STR_CTRL DIV_ADC DIV_DAC STR_CTRL: Controls the strength of the RX CMOS output clock (ADC_DCLKOUT) and data buffers (increases the strength). When running at Fs higher than 90 MSPS, set to ‘10’ to get more timing margins. Enabling this mode might increase the digital noise coupled to analog and may degrade the ADC SNR by up to a dB. DIV_ADC: Divides the clock going to the ADC. DIV_ADC DIVISION FACTOR 00 Default (no division) 01 2 10 4 11 2 DIV_DAC: Divides the clock going to the DAC. DIV_ADC DIVISION FACTOR 00 Default (no division) 01 2 10 4 11 2 Register Name – CONFIG116 – Address 0x23D, Default = 0x00 PLL_ENABLE PLL_DIVM PLL_DIVN PLL_ENABLE: Setting this bit enables the PLL. Output clock of the PLL is either 2X or 4X of Fs (input clock rate). PLL_DIVN: Selects multiplication by 4 (default is multiplication by 2). PLL_DIVM: Different values as listed in the below table need to be programmed for different Fs ranges. PLL_DIVM FS in MSPS Multiplication by 2 Multiplication by 4 15-20 3 2 20-35 2 1 35-80 1 0 > 80-180 0 Out of range While operating PLL with a multiplication factor set by PLL_DIVN = X, there can be significant spurs at (NFs/X+/-Fin) where N is an integer. At Fin = 10 MHz, these spurs can be about -60dBc. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 47 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Register Name – CONFIG117A – Address 0xDB, Default = 0x00 ENABLE_DCC_CHB ENABLE_DCC_CHB: Enables the duty cycle correction circuit (DCC) for the ADC_CLK for ADC Channel B. It is recommended to use the DCC when operating at frequencies of ADC_CLK higher than 65 MSPS. Register Name – CONFIG117B – Address 0xF2, Default = 0x00 ENABLE_DCC_CHA ENABLE_DCC_CHA: Enables the duty cycle correction circuit (DCC) for the ADC_CLK for ADC Channel A. It is recommended to use the DCC when operating at frequencies of ADC_CLK higher than 65 MSPS. 5.6 AUX DAC REGISTERS Register Name – CONFIG118 – Address 0x242, Default = 0x00 AUX_DAC_TERM_N EN_AUXDACB EN_AUXDACA AUX_DAC_TERM_N: Termination resistor for the negative terminal of the AUX DAC (internal node). Choose it to be close to the termination resistor on the pin. AUX_DAC_TERM_N TERMINTION RESISTOR (ohm) 0 200 (default) 1 infinite 10 67 11 100 100 133 101 400 110 57 111 80 EN_AUXDACB: Enables AUXDACB. EN_AUXDACA: Enables AUXDACA. Register Name – CONFIG119 – Address 0x243, Default = 0x00 REG_AUXDACA_IN REG_AUXDACA_IN – Register bits for DACA data in Register Access mode Register Name – CONFIG120 – Address 0x244, Default = 0x00 REG_AUXDACA_IN REG_AUXDACA_IN – Register bits for DACA data in Register Access mode. 48 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Register Name – CONFIG121 – Address 0x245, Default = 0x00 REG_AUXDACB_IN REG_AUXDACB_IN – Register bits for DACB data in Register Access mode Register Name – CONFIG122 – Address 0x246, Default = 0x00 REG_AUXDACB_IN FS_AUXDACI REG_AUXDACB_IN – Register bits for DACB data in Register Access mode Register Name – CONFIG123 – Address 0x248, Default = 0x00 FS_AUXDACI – Sets full scale output current for AUXDACA. The 16 levels in mA are: FS_AUXDACI OUTPUT CURRENT(mA) 0000 5 0001 5.5 0010 4 0011 4.5 0100 7 0101 7.5 0110 6 0111 6.5 1000 Do not use 1001 Do not use 1010 Do not use 1011 Do not use 1100 3 1101 3.5 1110 Do not use 1111 2.5 Register Name – CONFIG124 – Address 0x249, Default = 0x00 FS_AUXDACQ FS_AUXDACQ – Sets full scale input current for AUXDACB. This register is similar to Register 0x248. 5.7 LVDS TX INPUT INTERFACE REGISTERS Register Name – CONFIG125 – Address 0x30B, Default = 0x00 TWOWIRE_TX RESOLUTION_TX MSB_FIRST_TX SERIALIZATION_TX SDR_TX All the modes of register 0x30B works only if MASTER_OVERRIDE_TX (Bit in Address 0x30C) is enabled. TWOWIRE_TX: Sets two wire modes in the transmitter side. RESOLUTION_TX: To set the input resolution of the Transmitter. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 49 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com RESOLUTION_TX RESOLUTION 000 12 MSB_FIRST_TX: Decides whether LSB first or MSB first. Default is LSB first.. MSB_FIRST_TX DATA PATTERN 0 LSB first 1 MSB first SERIALIZATION_TX: Sets serialization factor of the transmitter. SERIALIZATION_TX SERIALIZATION FACTOR 00 12x (default) 01 14x 10 16x SDR_TX: By setting this Tx expects SDR input pattern, where as the default is DDR. Bit clock is double rate in SDR mode. Register Name – CONFIG126 – Address 0x30C, Default = 0x00 MASTER_OVERRIDE_TX BITWISE_TX DFS_TX All the modes of register 0x30C works only if MASTER_OVERRIDE_TX (Bit in Address 0x30C) is enabled. MASTER_OVERRIDE_TX: Master bit for various override modes BITWISE_TX: To set the device in bitwise mode. DFS_TX: Determines the data format of the incoming data. DFS_TX DATA FORMAT 0 2’s complement (default) 1 straight offset binary Register Name – CONFIG127 – Address 0x30d, Default = 0x00 WORDWISE_TX All the modes of register 0x30D works only if MASTER_OVERRIDE_TX (Bit in Address 0x30C) is enabled. WORDWISE_TX: If set, TX expects word mode format data. 50 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com 5.8 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 LVDS RX OUTPUT INTERFACE REGISTERS Register Name – CONFIG128 – Address 0x337, Default = 0x00 OVR_EN_RX WORDWISE_ RX PATTERN_SEL_RX All the modes of register 0x337 work only if MASTER_OVERRIDE_RX (Bit in Address 0x33A) is enabled. OVR_EN_RX: Overrange indicator enable bit. When 0 – Overrange is not sent along with data. If 1 – D0 is replaced by Overrange indicator bit. WORDWISE_RX: When selected, wordwise mode is enabled. PATTERN_SEL_RX: To select the output pattern from the serializer PATTERN_SEL OUTPUT PATTERN 000 Normal ADC pattern 001 All Zeros 010 All ones 011 alternate between 1 and 0 (D11..D0 alternates between 010101010101 and 101010101010) 100 Data ramp pattern (D11..D0 ramps continuously every 4 clock cycles in steps of 1 LSB) 101 Output custom pattern 110 Deskew pattern – D11..D0 replaced by 010101010101 111 Sync pattern – D11..D0 replaced by 111111000000 in 1-wire mode and by 111000111000 in 2-wire mode Register Name – CONFIG129 – Address 0x338, Default = 0x00 CUSTOM PATTERN Register Name – CONFIG130 – Address 0x339, Default = 0x00 CUSTOM PATTERN Register Name – CONFIG131 – Address 0x33A, Default = 0x00 MASTER_OVERRIDE_RX SERIALIZATION_RX DFS_RX MSB_FIRST_RX TWOWIRE_RX SDR_RX All the modes of register 0x33A work only if MASTER_OVERRIDE_RX (Bit in Address 0x33A) is enabled. MASTER_OVERRIDE_RX: Master override bit for RX interface registers. This bit needs to be set to 1 whenever the RX interface mode is chosen to be LVDS interface. SERIALIZATION_RX: Sets the serialization factor. SERIALIZATION_RX SERIALIZATION 00 12 01 14 10 16 In two wire mode for 14x serialization the frame clock is 0.5X, where as 12X and 16X frame clock is still 1X. DFS_RX: Sets the output data format. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 51 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com DFS_RX DATA FORMAT 0 2s-complememt 1 straight offset binary MSB_FIRST_RX: Flips the out data order to MSB first. MSB_FIRST_RX DATA ORDER 0 LSB first 1 MSB first TWOWIRE_RX: Configure the device to give data in two wire mode. SDR_RX: Configure the device to give data in SDR mode. Register Name – CONFIG132 – Address 0x33B, Default = 0x00 HALFX_IN_2WIRE_RX BITWISE_RX All the modes of register 0x33B work only if MASTER_OVERRIDE_RX (Bit in Address 0x33A) is enabled. BITWISE_RX: Configure the device to give data in bit wise mode. HALFX_IN_2WIRE_RX: Makes the frame clock output 0.5X (default is 1X). To be used when in wordwise mode. Register Name – CONFIG133 – Address 0x23A, Default = 0x00 CLK_STR_2X DATA_STR_2X CLK_STR_RX: When set, the LVDS clock buffers has double strength (to be used with 50 ohms external termination) DATA_STR_2X: When set, all the LVDS clock buffers have double strength (to be used with 50 ohms external termination) Register Name – CONFIG134 – Address 0x001, Default = 0x00 5.9 LVDS_SWING AUX ADC REGISTERS Register Name – CONFIG135 – Address 0x364, Default = 0x00 SHIGH_WIDTH NO_OF_SAMPLES_AVGED NO_OF_SAMPLES CONV_START SHIGH_WIDTH: No. of clock cycles width of sampling clock. SHIGH_WIDTH NO.OF CLOCK CYCLE WIDTH 00 15(default) 01 30 10 60 11 150 NO_OF_SAMPLES: No. of samples to convert in 1 conversion cycle. 52 REGISTER DESCRIPTIONS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 NO_OF_SAMPLES NO.OF SAMPLES TO CONVERT 000 1 001 2 010 4 011 8 100 16 101 Continuous 110 Continuous 111 Continuous NO_OF_SAMPLES_AVERAGED: No. of samples within the same conversion cycle to be averaged. Should be less than or equal to NO_OF_SAMPLES. NO_OF_SAMPLES_AVERAGED NO. OF SAMPLES TO BE AVERAGED 00 No averaging 01 2 10 4 11 8 If averaging is set, then the Aux ADC output is updated once in every X samples where X is equal to the no. of samples to be averaged. CONV_START: Starts Conversion. Register Name – CONFIG136 – Address 0x36F, Default = 0x00 BYPASSZ_BUF RANGE_AUXADC BYPASSZ_BUF: Enables the high impedance input buffer. RANGE_AUXADC: Sets the input full scale range of the Aux ADC. Default is 0-1.5V. Setting this bit to 1 makes the input full scale range 0-DVDD18. Register Name – CONFIG137 – Address 0x370, Default = 0x00 EN_AUX_ADC MODE_INPUT EN_AUX_ADC: Static control bit that “wakes up” the Aux ADC. MODE_INPUT: selects which of the 4 inputs (2 external and 2 internal) is multiplexed into the Aux ADC. Default is AUXADC_A. MODE_INPUT AUX_ADC_INPUT 00 AUX_ADC_A 01 AUX_ADC_B 5.10 HALF DUPLEX MODE REGISTERS Register Name – CONFIG138 – Address 0x24D, Default = 0x00 REG_HALF_DUPLEX_ THRU_PIN Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 REGISTER DESCRIPTIONS 53 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com REG_HALF_DUPLEX_THRU_PIN: Configures the PDN pin as a toggle pin between half duplex RX mode and half duplex TX mode. When this bit is set, a ‘1’ on the PDN pin puts the device in half duplex RX mode (TX shutdown), and a ‘0’ on the PDN pin puts the device in half duplex TX mode (RX shutdown). 5.11 LOW POWER RX CMOS MODE REGISTERS In Low power CMOS mode, there are various ways to move output data of ADC with respect to output clock to achieve required setup and hold time. This can be done using following register. Register Name – CONFIG139 – Address 0x33D, Default = 0x00 DELAY_CLK_LP_CMOS DELAY_CLK_LP_CMOS: Programmable delay for the output clock (ADC_DCLKOUT) when in low power CMOS mode. DELAY_CLK_LP_CMOS DELAY (1) (ns) 00 4*X - 0.3 01 5*X - 0.3 10 2*X - 0.3 11 3*X - 0.3 (1) X is the unit delay programmed by CHANGE_UNIT_DELAY bits. Register Name – CONFIG140 – Address 0x33F, Default = 0x00 DELAY_DATA_LP_CMOS CHANGE_UNIT_DELAY CHANGE_UNIT_DELAY: Changes the delay step for the DELAY_CLK_LP_CMOS DELAY_DATA_LP_CMOS programming when in low power CMOS mode (MODE_LP_CMOS=’1’). CHANGE_UNIT_DELAY DELAY UNIT "X" (ns) 000 1.12 001 1.5 010 0.55 011 0.9 100 1.85 101 2.2 110 1.25 111 1.62 and DELAY_DATA_LP_CMOS: Programmable delay for the output data when in low power CMOS mode (MODE_LP_CMOS=’1’). DELAY_DATA_LP_CMOS DELAY (1) (ns) 000 4*X - 0.3 001 5*X - 0.3 010 6*X - 0.3 011 7*X - 0.3 (1) 54 REGISTER DESCRIPTIONS 100 NA 101 1*X - 0.3 110 2*X - 0.3 111 3*X - 0.3 X is the unit delay programmed by CHANGE_UNIT_DELAY bits. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 6 TYPICAL CHARACTERISTICS FOR AFE7222 6.1 RECEIVE PATH All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, 0 dB gain, CMOS output interface for AFE7222, 32k point FFT (unless otherwise noted) AMPLITUDE vs FREQUENCY AMPLITUDE vs FREQUENCY 0 0 SNR = 71.2dBFS SINAD = 71.1dBFS THD = 86.1dBc SFDR = 88.3dBc −10 −20 −30 −30 −40 −40 Amplitude (dBFS) Amplitude (dBFS) −20 −50 −60 −70 −50 −60 −70 −80 −80 −90 −90 −100 −100 −110 −110 −120 0 6.5 13 19.5 Frequency (MHz) 26 SNR = 70.2dBFS SINAD = 69.6dBFS SFDR = 79.2dBc THD = 77.3dBc −10 −120 32.5 0 6.5 13 19.5 Frequency (MHz) 26 32.5 G001 G002 Figure 6-1. FFT Plot 10MHz 65MSPS Figure 6-2. FFT Plot 70MHz 65MSPS AMPLITUDE vs FREQUENCY AMPLITUDE vs FREQUENCY 0 0 Each Tone at −7dBFS Amplitude fIN1 = 50.1MHz fIN2 = 55.1MHz Two-Tone IMD = 77.5dBc −10 −20 −30 −20 −30 −40 Amplitude (dBFS) Amplitude (dBFS) −40 −50 −60 −70 −50 −60 −70 −80 −80 −90 −90 −100 −100 −110 −110 −120 SNR = 71.2dBFS SINAD = 71.1dBFS THD = 86.1dBc SFDR = 88.3dBc −10 0 6.5 13 19.5 Frequency (MHz) 26 32.5 −120 0 6.5 13 19.5 Frequency (MHz) 26 G003 Figure 6-3. FFT Two-Tone Signal G001 Figure 6-4. Spectrum With Decimation Filter OFF TYPICAL CHARACTERISTICS FOR AFE7222 Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated 32.5 55 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, 0 dB gain, CMOS output interface for AFE7222, 32k point FFT (unless otherwise noted) AMPLITUDE vs FREQUENCY SNR vs INPUT FREQUENCY 71 0 fIN = 10MHz SNR = 71.9dBFS SFDR = 92.8dBc −10 −20 70.5 −30 70 SNR (dBFS) Amplitude (dBFS) −40 −50 −60 −70 −80 69.5 69 −90 −100 68.5 −110 −120 0 3.5 7 10.5 Frequency (MHz) 14 68 16.2 20 40 60 80 100 Frequency (MHz) 120 140 G005 G006 Figure 6-5. Spectrum With Decimation Filter ON Figure 6-6. SNR vs Input Frequency SFDR vs INPUT FREQUENCY SNR vs TEMPERATURE 72 86 Input frequency = 10MHz 71.5 83 SNR (dBFS) SFDR (dBc) 71 80 70.5 70 77 69.5 74 20 40 60 80 100 Frequency (MHz) 120 140 G007 Figure 6-7. SFDR vs Input Frequency 56 69 −40 AVDD18_ADC = 1.7V AVDD18_ADC = 1.8V AVDD18_ADC = 1.9V −15 10 35 Temperature (°C) 60 85 G008 Figure 6-8. SNR Across Temperature and ADC Analog Supply TYPICAL CHARACTERISTICS FOR AFE7222 Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, 0 dB gain, CMOS output interface for AFE7222, 32k point FFT (unless otherwise noted) SFDR vs TEMPERATURE SNR and SFDR vs DVDD Supply Voltage 90 72 90 Input Frequency = 10MHz Input frequency = 10MHz 71.5 88 71 86 70.5 84 70 82 69.5 80 86 84 82 SNR SFDR AVDD18_ADC = 1.7V AVDD18_ADC = 1.8V AVDD18_ADC = 1.9V 80 −40 −15 10 35 Temperature (°C) 60 SFDR (dBc) SNR (dBFS) SFDR (dBc) 88 69 1.70 1.75 85 1.80 Supply Voltage (V) 78 1.90 1.85 G010 G009 Figure 6-9. SFDR vs Temperature Figure 6-10. Performance Across DVDD Supply Voltage SNR and SFDR vs COMMON-MODE INPUT VOLTAGE SNR and SFDR vs ANALOG INPUT AMPLITUDE 87 72 100 74 SFDR (dBc) SNR (dBFS) 83 71 SNR (dBFS) 85 71.5 81 70.5 73.5 90 73 80 72.5 70 72 60 71.5 50 71 40 70.5 SNR SFDR 70 0.85 0.90 0.95 1.00 Common-Mode Input Voltage (V) 79 1.05 70 −40 SNR SFDR(dBc) SFDR (dBFS) −35 30 Input Frequency = 10MHz −30 −25 −20 −15 −10 Analog Input Amplitude (dB) −5 −1 20 G011 Figure 6-11. Performance Across Common-Mode Input Voltage G012 Figure 6-12. Performance Across Input Amplitude TYPICAL CHARACTERISTICS FOR AFE7222 Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated SFDR (dBc, dBFS) Input Frequency = 10MHz 57 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, 0 dB gain, CMOS output interface for AFE7222, 32k point FFT (unless otherwise noted) SNR and SFDR vs INPUT CLOCK AMPLITUDE SNR and THD vs INPUT CLOCK DUTY CYCLE 83 71.5 90 72.5 Input Frequency = 10MHz 72 88 70.5 81 71.5 86 70 80 71 84 69.5 79 70.5 82 69 78 70 80 SFDR (dBc) SNR (dBFS) 82 SNR (dBFS) 71 SNR SFDR 68.5 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 Input Clock Amplitude, Differential (Vpp) 2.1 THD (dBC) Input Frequency = 10MHz SNR THD 77 69.5 25 30 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 70 75 78 G013 G014 Figure 6-13. Performance Across Input Clock Amplitude Figure 6-14. Performance Across Input Clock Duty Cycle SNR vs Input Clock Duty Cycle DNL vs OUTPUT CODE 0.3 72 Input Frequency = 10MHz 71 0.2 70 0.1 DNL (LSB) SNR (dBFS) 69 68 0 67 −0.1 66 −0.2 65 SNR DCC OFF SNR DCC ON 64 35 40 45 50 55 60 65 Input Clock Duty Cycle (%) 70 75 −0.3 250 750 1250 1750 2250 2750 Output Code (LSB) G054 Figure 6-15. SNR vs Input Clock Duty Cycle 58 3250 3750 G015 Figure 6-16. DNL Plot TYPICAL CHARACTERISTICS FOR AFE7222 Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, 0 dB gain, CMOS output interface for AFE7222, 32k point FFT (unless otherwise noted) INL vs OUTPUT CODE 0.3 0.2 INL (LSB) 0.1 0 −0.1 −0.2 −0.3 250 750 1250 1750 2250 2750 Output Code (LSB) 3250 3750 G016 Figure 6-17. INL Plot 6.2 TRANSMIT PATH All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, 0 dBFS digital input, 0 dB gain, CMOS input interface for AFE7222, 32k point FFT (unless otherwise noted) AMPLITUDE vs FREQUENCY AMPLITUDE vs FREQUENCY 10 10 DAC Output Frequency = 10MHz SFDR = 75dBc 0 −10 −10 −20 −20 Amplitude (dBm) Amplitude (dBm) −30 −40 −50 −60 −70 −30 −40 −50 −60 −70 −80 −90 −80 −100 −90 −110 DAC Output Frequency = 50MHz SFDR = 69dBc 0 5 15 25 35 Frequency (MHz) 45 55 −100 15 40 65 90 115 Frequency (MHz) 140 165 180 G017 Figure 6-18. Spectrum Analyzer Plot CMOS Mode 10MHz IF G018 Figure 6-19. Spectrum Analyzer Plot CMOS Mode 50MHz IF TYPICAL CHARACTERISTICS FOR AFE7222 Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated 59 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, 0 dBFS digital input, 0 dB gain, CMOS input interface for AFE7222, 32k point FFT (unless otherwise noted) NOISE SPECTRAL DENSITY vs DAC OUTPUT FREQUENCY NOISE SPECTRAL DENSITY vs DAC OUTPUT FREQUENCY −120 −130 DAC Input Amplitude = −12dBFs DAC Input Amplitude = −6dBFs DAC Input Amplitude = 0dBFs DAC Full-Scale = 2mA DAC Full-Scale = 10mA DAC Full-Scale = 20mA −125 Noise Spectral Density (dBc/Hz) Noise Spectral Density (dBc/Hz) −135 −140 −145 −130 −135 −140 −145 −150 −150 −155 10 20 30 40 DAC Output Frequency (MHz) 50 −155 10 20 30 40 DAC Output Frequency (MHz) G019 G020 Figure 6-20. NSD vs Frequency Across Input Scale Figure 6-21. NSD Vs Iouts SFDR vs DAC OUTPUT FREQUENCY SFDR vs DAC OUTPUT FREQUENCY 80 80 DAC Input = 0dBFS DAC Input = −6dBFS DAC Input = −12dBFS Interpolation = 1 Interpolation = 2 75 SFDR (dBc) SFDR (dBc) 76 72 68 64 70 65 10 20 30 40 50 DAC Output Frequency (MHz) 60 60 10 20 30 40 DAC Output Frquency (MHz) G021 Figure 6-22. SFDR vs Frequency 60 50 50 G022 Figure 6-23. SFDR vs Interpolation TYPICAL CHARACTERISTICS FOR AFE7222 Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, 0 dBFS digital input, 0 dB gain, CMOS input interface for AFE7222, 32k point FFT (unless otherwise noted) SFDR vs DAC OUTPUT FREQUENCY HD2, HD3 vs DAC OUTPUT FREQUENCY 82 80 DAC Output Range = 2mA DAC Output Range = 10mA DAC Output Range = 20mA DAC Interpolation by 2 HD2 HD3 76 HD2, HD3 (dB) SFDR (dBc) 78 72 68 74 70 64 60 10 20 30 40 DAC Output Frequency (MHz) 50 66 10 20 30 40 DAC Output Frequency (MHz) G023 Figure 6-24. SFDR Vs IOUTFS 50 G024 Figure 6-25. HD2, HD3 Across Frequency IMD3 vs DAC OUTPUT FREQUENCY −80 IMD3 (dBc) −82 −84 −86 −88 −90 10 20 30 40 50 DAC Output Frequency (MHz) 60 70 G025 Figure 6-26. IMD3 vs Frequency CMOS TYPICAL CHARACTERISTICS FOR AFE7222 Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated 61 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com 7 TYPICAL CHARACTERISTICS FOR AFE7225 7.1 RECEIVE PATH All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, 0 dB gain, LVDS output interface for AFE7225, 32k point FFT (unless otherwise noted) AMPLITUDE vs FREQUENCY AMPLITUDE vs FREQUENCY 0 0 SNR = 70.8dBFS SINAD = 70.7dBFS SFDR = 87.9dBc THD = 85.2dBc −10 −20 −30 −30 −40 −40 Amplitude (dBFS) Amplitude (dBFS) −20 −50 −60 −70 −50 −60 −70 −80 −80 −90 −90 −100 −100 −110 −110 −120 0 12.5 25 37.5 Frequency (MHz) 50 SNR = 70.0dBFS SINAD = 69.5dBFS SFDR = 80.1dBc THD = 77.8dBc −10 −120 62.5 0 12.5 25 37.5 Frequency (MHz) 50 62.5 G026 G027 Figure 7-1. FFT Plot 10MHz 125MSPS Figure 7-2. FFT Plot 70MHz 125MSPS AMPLITUDE vs FREQUENCY AMPLITUDE vs FREQUENCY 0 0 Each Tone at −7dBFS Amplitude fIN1 = 50.1MHz fIN2 = 55.1MHz Two-Tone IMD = 83.7dBc −10 −20 −30 −20 −30 −40 Amplitude (dBFS) Amplitude (dBFS) −40 −50 −60 −70 −60 −70 −80 −90 −90 −100 −100 −110 −110 0 12.5 25 37.5 Frequency (MHz) 50 62.5 G028 Figure 7-3. FFT Two-Tone Signal 62 −50 −80 −120 SNR = 70.8dBFS SINAD = 70.7dBFS SFDR = 87.9dBc THD = 85.2dBc −10 −120 0 12.5 25 37.5 Frequency (MHz) 50 62.5 G026 Figure 7-4. Spectrum With Decimation Filter OFF TYPICAL CHARACTERISTICS FOR AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, 0 dB gain, LVDS output interface for AFE7225, 32k point FFT (unless otherwise noted) AMPLITUDE vs FREQUENCY SNR vs INPUT FREQUENCY 0 71 fIN = 10MHz SNR = 71.8dBFS SINAD = 71.8dBFS SFDR = 85.6dBc THD = 85.25dBc −10 −20 −30 70 SNR (dBFS) Amplitude (dBFS) −40 −50 −60 −70 −80 69 −90 −100 −110 −120 0 10.5 21 Frequency (MHz) 68 31.5 50 100 150 Frequency (MHz) 200 G030 G031 Figure 7-5. Spectrum With Decimation Filter ON Figure 7-6. SNR vs Input Frequency SFDR vs INPUT FREQUENCY SINAD vs GAIN 90 72 86 71 82 70 SINAD (dBFS) SFDR (dBc) fIN = 70MHz fIN = 140MHz 78 69 74 68 70 67 66 50 100 150 Frequency (MHz) 66 200 0 0.5 1 1.5 2 2.5 3 3.5 4 Digital Gain (dB) 4.5 5 5.5 G032 Figure 7-7. SFDR vs Input Frequency G033 Figure 7-8. SINAD Across Gain TYPICAL CHARACTERISTICS FOR AFE7225 Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated 6 63 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, 0 dB gain, LVDS output interface for AFE7225, 32k point FFT (unless otherwise noted) SFDR vs GAIN SNR vs TEMPERATURE 72 90 fIN = 70MHz fIN = 140MHz Input Frequency = 10MHz 88 71.5 86 SNR (dBFS) SFDR (dBc) 84 82 71 80 78 70.5 AVDD18_ADC = 1.7V AVDD18_ADC = 1.8V AVDD18_ADC = 1.9V 76 0 0.5 1 1.5 2 2.5 3 3.5 4 Digital Gain (dB) 4.5 5 5.5 70 −40 6 −15 10 35 Temperature (°C) 60 85 G034 G035 Figure 7-9. SFDR vs Gain Figure 7-10. SNR Across Temperature and ADC Analog Supply SFDR vs TEMPERATURE SNR and SFDR vs DVDD SUPPLY VOLTAGE Input Frequency = 10MHz Input Frequency = 10MHz 89 SNR (dBFS) 88 SFDR (dBc) 88 74 90 87 73 87 72 86 71 85 70 84 SFDR (dBc) 74 86 83 69 85 84 −40 SNR SFDR AVDD18_ADC = 1.7 V AVDD18_ADC = 1.8 V AVDD18_ADC = 1.9 V −15 10 35 Temperature (°C) 68 1.70 60 85 1.75 1.80 Supply Voltage (V) 1.85 82 1.90 G037 G036 Figure 7-11. SFDR Across Temperature and ADC Analog Supply 64 Figure 7-12. Performance Across DVDD Supply Voltage TYPICAL CHARACTERISTICS FOR AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, 0 dB gain, LVDS output interface for AFE7225, 32k point FFT (unless otherwise noted) SNR and SFDR vs COMMON-MODE INPUT VOLTAGE SNR and SFDR vs INPUT CLOCK AMPLITUDE 84 74 100 73 Input Frequency = 10MHz 90 72 80 71.5 70 71 60 70.5 50 70 40 70 80 69 79 69.5 SNR SFDR 68 0.85 Input Frequency = 10MHz 78 1.05 0.90 0.95 1.00 Common-Mode Input Voltage (V) 69 −50 −40 SNR SFDR (dBc) SFDR (dBFS) −30 −20 −10 Analog Input Amplitude (dBFS) SFDR (dBc, dBFS) 81 SFDR (dBc) 71 SNR (dBFS) 82 72 SNR (dBFS) 72.5 83 73 30 0 20 G038 G040 Figure 7-13. Performance Across Common-Mode Input Voltage Figure 7-14. Performance Across Input Clock Amplitude SNR and SFDR vs INPUT CLOCK DUTY CYCLE DNL vs OUTPUT CODE 79 0.3 71 78 0.2 70 77 69 76 68 75 72 Input Frequency = 10MHz DNL (LSB) THD (dBc) SNR (dBFS) 0.1 0 −0.1 −0.2 SNR THD 67 25 30 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 70 75 74 G039 −0.3 255 755 1255 1755 2255 2755 Output Code (LSB) 3255 3755 G041 Figure 7-15. Performance Across Input Clock Duty Cycle Figure 7-16. DNL Plot TYPICAL CHARACTERISTICS FOR AFE7225 Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated 65 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, 0 dB gain, LVDS output interface for AFE7225, 32k point FFT (unless otherwise noted) INL vs OUTPUT CODE 0.3 0.2 INL (LSB) 0.1 0 −0.1 −0.2 −0.3 350 850 1350 1850 2350 Output Code (LSB) 2850 3350 3750 G042 Figure 7-17. INL Plot 7.2 TRANSMIT PATH All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, 0 dBFS digital input, 0 dB gain, LVDS input interface for AFE7225, 32k point FFT (unless otherwise noted) AMPLITUDE vs FREQUENCY AMPLITUDE vs FREQUENCY 10 5 0 DAC Output Frequency = 10MHz SFDR = 74.5dBc 0 −10 −10 −20 −20 −30 −30 Amplitude (dBm) Amplitude (dBm) DAC Output Frequency = 50MHz SFDR = 69.2dBc −40 −50 −60 −40 −50 −60 −70 −70 −80 −80 −90 −90 −100 −110 0 10 20 30 40 Frequency (MHz) 50 60 G043 Figure 7-18. Spectrum Analyzer Plot LVDS Mode 10MHz IF 66 −100 50 100 Frequency (MHz) 150 200 G044 Figure 7-19. Spectrum Analyzer Plot LVDS Mode 50MHz IF TYPICAL CHARACTERISTICS FOR AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, 0 dBFS digital input, 0 dB gain, LVDS input interface for AFE7225, 32k point FFT (unless otherwise noted) NOISE SPECTRAL DENSITY vs DAC OUTPUT FREQUENCY NOISE SPECTRAL DENSITY vs DAC OUTPUT FREQUENCY −125 −125 Input Amplitude = −12dBFs Input Amplitude = −6dBFs Input Amplitude = 0dBFs −130 Noise Spectral Density (dBc/Hz) Noise Spectral Density (dBc/Hz) −130 −135 −140 −145 −150 −155 DAC Output Range = 2mA DAC Output Range = 10mA DAC Output Range = 20mA −135 −140 −145 −150 10 20 30 40 DAC Output Frequency (MHz) 50 −155 10 20 30 40 DAC Output Frequency (MHz) G045 50 G046 Figure 7-20. NSD vs Frequency Across Input Scale Figure 7-21. NSD Vs Iouts SFDR vs DAC OUTPUT FREQUENCY SFDR vs DAC OUTPUT FREQUENCY 88 85 DAC Input Amplitude = −12dBFS DAC Input Amplitude = −6dBFS DAC Input Amplitude = 0dBFS 84 Interpolation = 1 Interpolation = 2 80 SFDR (dBc) SFDR (dBc) 80 76 75 72 70 68 64 10 20 30 40 50 DAC Output Frequency (MHz) 60 65 10 20 30 40 DAC Output Frquency (MHz) G047 Figure 7-22. SFDR vs Frequency G048 Figure 7-23. SFDR vs Interpolation TYPICAL CHARACTERISTICS FOR AFE7225 Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated 50 67 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com All plots are at 25°C, AVDD18_ADC=1.8V, DVDD18_CLK=1.8V, DVDD18=1.8V, DVDD18_DAC=1.8V, AVDD3_DAC=3.0V, AVDD3_AUX=3.0V, maximum rated clock frequency, sine wave input clock. 1.5 VPP differential clock amplitude, 50% clock duty cycle, 0 dBFS digital input, 0 dB gain, LVDS input interface for AFE7225, 32k point FFT (unless otherwise noted) SFDR vs DAC OUTPUT FREQUENCY HD2, HD3 vs DAC OUTPUT FREQUENCY 86 88 DAC Output Range = 2mA DAC Output Range = 10mA DAC Output Range = 20mA 82 HD2 HD3 84 80 HD2, HD3 (dBc) SFDR (dBc) 78 74 76 72 70 68 66 62 64 10 20 30 40 DAC Output Frequency (MHz) 50 60 10 20 30 40 DAC Output Frequency (MHz) G049 Figure 7-24. SFDR Vs IOUTFS 50 G050 Figure 7-25. HD2, HD3 Across Frequency IMD3 vs DAC OUTPUT FREQUENCY −70 Spacing Between Two Tones = 1MHz Each Tone Amplitude = −7dBFS −75 IMD3 (dBc) −80 −85 −90 −95 −100 20 40 60 80 Output Tone Frequency (MHz) 100 G051 Figure 7-26. IMD3 vs Frequency 68 TYPICAL CHARACTERISTICS FOR AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 8 TYPICAL CHARACTERISTICS FOR COMMON PLOTS TOTAL POWER vs SAMPLING FREQUENCY TOTAL POWER vs SAMPLING FREQUENCY 650 0.55 Full Duplex Half Duplex RX On Half Duplex TX On Power Down I Channel Power Down Q Channel 0.5 0.45 550 500 Total Power (mW) Total Power (mW) 0.4 0.35 0.3 0.25 0.2 450 400 350 300 250 0.15 200 0.1 150 0.05 Full Duplex Half Duplex RX On Half Duplex TX On Power Down I Channel Power Down Q Channel 600 10 30 50 70 90 Sampling Frequency (MSPS) 110 130 100 10 40 70 100 130 160 190 Sampling Frequency (MSPS) 220 G052 Figure 8-1. Power vs fclk CMOS G053 Figure 8-2. Power vs fclk 2-Wire LVDS TYPICAL CHARACTERISTICS FOR COMMON PLOTS Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 Copyright © 2011–2012, Texas Instruments Incorporated 250 69 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com 9 APPLICATION INFORMATION 9.1 DEVICE DESCRIPTION The AFE7225/7222 is designed to offer small footprint, high performance, low power and flexibility in applications that require half or full duplex software defined radios. The receive path consists of dual 12-bit 125MSPS ADCs, a digital quadrature modulation correction block, FCLK/4 digital frequency shifter and /2 decimation filter. The transmit path consists of dual 12-bit 250MSPS DACs, a digital quadrature modulation correction block, FCLK /4 digital frequency shifter, and x2/x4 interpolation filters as well as a FIFO. A peak/rms power meter is available to the receive path. Fine Mixers with NCOs are available for both receive and transmit path. These NCOs can be programmed independently. The primary digital interface is selectable as either interleaved parallel CMOS or serialized LVDS. Device control is provided via SPI (serial peripheral interface). An auxiliary 12-bit 100kSPS ADC with two single-ended voltage inputs via a multiplexer is provided for voltage monitoring. A dual auxiliary 12-bit 2MSPS single-ended current source output DAC is available for control and/or board calibration. Most blocks can be independently powered on/off as needed to save power. All of this capability is available in a small 9mm x 9mm 64-pin QFN package. INN_B_ADC 12b RX ADC B SYNC SYNC /2 HBF Decimation INP_B_ADC 12b RX ADC A Fine Mixer (FMIX) INN_A_ADC QMC Gain/ Phase INP_A_ADC Coarse Mixer (CMIX) RECEIVER SIGNAL CHAIN QMC Offset 9.2 RX Output A RX Output B SYNC RX RMS / Peak Power Meter NCO SYNC SYNC Figure 9-1. Signal Chain 9.3 RECEIVE ADC The dual receive ADCs are created using a pipeline architecture and are powered from a 1.8V analog supply (AVDD18_ADC). The common-mode of the differential inputs is 0.95V. A VCM pin is provided which outputs the common-mode voltage for use in setting up the proper input level. If the VCM pin cannot be used in your application, ensure that the analog inputs are centered at 0.95V. The full scale range of the inputs is 2.0Vpp differential, or 0.95 ± 0.5V on both INN and INP pins. The receive ADCs are capable of under-sampling intermediate frequencies (IF) at high frequency. The 3dB full power input bandwidth (FPBW) is approximately 550MHz. Good distortion and noise is maintained to ~230MHz. The dual ADCs can be used to capture complex I/Q inputs from a quadrature demodulator, or two independent IFs or used in a diversity configuration. In order to obey the Nyquist-Shannon sampling theorem, ensure that the bandwidth to be sampled does not exceed FADCCLK/2. An external anti-aliasing filter is recommended that confines the analog input energy to a single Nyquist band (multiple of FADCCLK/2) to avoid unwanted aliasing and reduced overall performance. 9.4 RECEIVE DECIMATION FILTER The user has the option of a decimation filter in the receive data path. The decimation filter can be used to reduce the ADC data sample rate by half. The extra sampling bandwidth could be used for processing gain and to ease the roll-off requirements of an external anti-aliasing filter. The decimation filter is a 43 tap half-band filter. The transition band is from 0.38 to 0.62 of FADCCLK/4, and the stop band attenuation is greater than 80dB. The pass-band ripple is less than 0.1dB. Coefficients 1 to 22 are listed. Coefficients 23 to 43 are the same as those from 22 to 1. 70 APPLICATION INFORMATION Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 RXFIR (decimation filter) coefficients = [+9 0 –33 0 +88 0 –196 0 +387 0 –704 0 +1210 0 –2024 0 +3432 0 –6485 0 +20700 +32768] The frequency response of the filter is shown below. Frequency Response of Decimation Filter 20 0 Frequency Response(dB) -20 -40 -60 -80 -100 -120 -140 -160 -180 0 0.1 0.2 0.3 0.4 0.5 0.6 Normalized Frequency 0.7 0.8 0.9 1 Figure 9-2. Decimation Filter Frequency Response (from 0 to FADCCLK/2) 9.5 RECEIVE FINE FREQUENCY MIXER (FMIX) The fine mixer uses a Numerically Controlled Oscillator (NCO) to generate two complementary outputs of a finely programmable frequency, which is then mixed with the A and B inputs to generate complex outputs. The mixer computes two outputs as follows: Output I = {Acos(ωmixt) – B sin(ωmixt)} and Output Q = {Asin(ωmixt) + Bcos(ωmixt)} where ωmix is the programmed fine frequency. The NCO has a 32 bit frequency register, and a 20 bit phase register. The 32 bit frequency register can be used to set the mixing frequency over a range of ±Fs/2 in steps of Fs/232. 9.6 RECEIVE COARSE FREQUENCY MIXER (CMIX) The receive path contains an optional ±FADCCLK/4 coarse digital frequency mixer. An example of its use is the capture of an IF centered in the middle of a Nyquist band. The digital mixer can move the carrier or block of carriers to baseband or near baseband. If the total bandwidth of the carrier or summation of carriers is less than 0.4 × FADCCLK/4, the decimation filter can also be employed. The CMIX block does a complex mixing on the A and B channels as shown below. The SYNC pin can be used to ensure that across chips, the phase of mixing is maintained. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 APPLICATION INFORMATION 71 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com MIXING PATTERN (1) MIXING MODE MIXING 00 Normal (Low Pass, No Mixing) Iout = { +A, +A , +A, +A } Qout = { +B, +B , +B, +B } 01 High Pass (Fs/2) Iout = { +A, –A , +A, –A } Qout = { +B, –B , +B, –B } 10 +Fs/4 Iout = { +A, –B , –A, +B } Qout = { +B, +A , –B, –A } 11 –Fs/4 Iout = { +A, +B , –A, –B } Qout = { +B, –A , –B, +A } (1) A and B are the inputs to the CMIX block. Iout and Qout are the outputs. 9.7 RMS POWER METER The RX signal chain has two power meters – the coarse power meter and fine power meter. 9.7.1 Coarse Power Meter The fine power meter estimates the total integrated power in linear scale based on a much larger set of samples. The resulting integrated power number is stored in a register for readout. The interval time (how often to start integration) and integration time (number of samples to integrate) is programmable. The power meter can be configured in either real mode (where the power of each channel is calculated individually) or in a complex mode {where the power of (I^2+Q^2) is calculated}. This is illustrated below. I 0 b a*a + b*b a Q Average Power in dB scale Power Meter 1 COARSE_PWR_OP_I (3:0) Complex mode 0 b Average Power in dB scale a a*a + b*b Power Meter 2 COARSE_PWR_OP_Q (3:0) PWR_METER_COARSE_SAMPLES(2:0) Figure 9-3. Coarse Power Meter 9.7.2 Fine Power Meter The fine power meter estimates the total integrated power in linear scale based on a much larger set of samples. The resulting integrated power number is stored in a register for readout. The interval time (how often to start integration) and integration time (number of samples to integrate) is programmable. The power meter can be configured in either real mode (where the power of each channel is calculated individually) or in a complex mode {where the power of (I2+Q2)is calculated}. This is illustrated below. 72 APPLICATION INFORMATION Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Power Meter 1 I PWR_OP_I (57:0) 0 Q Complex mode Power Meter 2 PWR_OP_Q (57:0) 0 SYNC_CNT(8:0) INTRV_CNT(20:0) INTGR_CNT(20:0) Figure 9-4. Fine Power Meter Power in the fine power meter is calculated by squaring each I (I and Q for complex inputs) sample, summing, and then integrating the summed-squared results into a 58 bit accumulator over a programmable integration period. The integration period is programmed into the 21 bit counter, in 8 sample increments. The power stored in the 58-bit register is: Power = [ (I*I) x (Nx8 + 3) ] for real inputs where N is the integration count. Power = [ (I*I + Q*Q) x (Nx8 + 3) ] for complex inputs where N is the integration count. The power meter operation can be optionally synced. If power meter syncing is enabled, it waits for a programmable number of cycles after a valid sync, and then starts computation. If syncing is disabled, it starts computation as soon as the power meter is enabled. Once the computation interval is completed, the computed power is written to a set of serial interface registers, and the next computation interval begins. The contents of these registers can be read out serially through SDOUT. The process begins with a sync event starting the 9 bit delay counter. After (8xsync_delay + 4) samples, the integration interval is started. Integration continues until the integration count is met, at which point the 58 bit integrator results are transferred to the read only register. A new measurement period will start at the end of the interval period. A more detailed diagram of the power meter is shown below (the I and Q are represented as 16-bit numbers). Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 APPLICATION INFORMATION 73 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com 32 16 I 33 58-Bit Integrator 58-Bit Register 32 16 Q Transfer Clear Sync RMS Power 9-Bit Sync Delay Counter 21-Bit Integration Counter 21-Bit Interval Counter 9 21 Interrupt 21 Delay (in 8 Sample Increments) Interval (in 8 Sample Increments) Integration (in 8 Sample Increments) SYNC_CNT(8:0) INTRV_CNT(20:0) INTGR_CNT(20:0) B0108-03 Figure 9-5. Power Meter Detailed Diagram The power meter timing is shown below: Figure 9-6. Power Meter Timing 9.8 TRANSMIT SIGNAL CHAIN SYNC SYNC 8 deep FIFO SYNC 2x Interpolation TxFIR1 SYNC 2x Interpolation TxFIR2 Fine Mixer SYNC Coarse Mixer (CMIX) TX B output QMC Gain/ Phase DAC_CLK Inverse SINC TX A output QMC Offset NCO TX A input (I channel) TX B input (Q channel) DAC_DCLKIN DAC_CLK %1,2,4 Figure 9-7. Transmit Signal Chain 9.9 TRANSMIT DAC The transmit DAC is a current-steering architecture, capable of clock rates up to 250MSPS and output currents up to 20mA. The DAC is structured as a current sink from the load. The DAC is powered from AVDD3_DAC, a 3V analog supply. This provides for an output compliance range of AVDD3_DAC ± 0.5V. To benefit from the full 1V swing available on each DAC output pin, a voltage divider load referenced to a higher voltage supply, like 5V, is recommended. The current-steering architecture will sink current into the + and – DAC outputs. The sum of the current will always be equal to the full-scale current. The full scale current is set with a resistor (RBIAS) to ground on the BIASJ pin, and will be equal to 74 APPLICATION INFORMATION Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 IOUTFS = 16 × (VREF/RBIAS), where VREF = 1.2V. IOUTFS = 16 * (VREF/RBIAS), where VREF = 1.2 V External Termination IOUTP_A_DAC IOUTN_A_DAC IDAC Figure 9-8. Current Steering Architecture of DAC 9.10 FIFO The 8-Deep FIFO is used to handoff the data from the digital clock (DAC_DCLKIN) domain to the DAC_CLK domain (or the divided version of DAC_CLK if interpolation is used). The FIFO has a read and write pointer, which are initialized to 4 away from each other when the chip is either reset or synchronized. The write pointer increments with DAC_DCLKIN whereas the read pointer increments with DAC_DCLKIN (or the divided version). Ideally, the read and write pointers maintain the difference of 4. However, if there is a drift in the relative phases of the two clocks, the instantaneous values of the read and write pointers can differ from 4. If the pointers come to within 2 positions of each other, the FIFO can be set to identify that condition as a possible "collision" condition and can shut off the DAC outputs by pulling it to mid code. A stoppage of the input clock can also be detected by the FIFO. 9.11 TRANSMIT INTERPOLATION FILTERS The AFE7225/7222 can enable 2x or 4x interpolation using on-chip half-band interpolation filters. The additional oversampling provided by interpolation can be used to reduce the order of the low pass antialiasing filter that follows the transmit DACs or so that the digital carrier can be block shifted by the coarse mixer to a higher output IF. While interpolating by a factor of 2, the DAC_DCLKIN rate should be set to half of the input clock rate. While interpolating by a factor of 4, the DAC_DCLKIN rate should be set to one fourth of the input clock rate. Each channel has two filters TxFIR1, and TxFIR2, of which TxFIR1 alone is enabled in the Interpolate by 2 mode, Both filters are enabled in Intertpolate by 4 mode. The 2 filters in each of the two channels can individually be configured to operate in the ‘low pass ‘ or the high pass mode. By default, all filters are configured to opearate in the low pass mode. The following table lists the address and data mask values to be programmed to configure each of these filters in the high pass mode. TXFIR1 is a 43 tap half-band filter. The transition band is from 0.4 to 0.6 of FCLKFIR1/2, and the stop band attenuation is 70 dB. Pass band ripple is less than 0.1dB. It has the following coefficients (listed only up to the middle one) TXFIR1 (interpolation filter 1) coefficients = [12 0 –33 0 73 0 –143 0 254 0 –426 0 685 0 –1090 0 1781 0 –3286 0 10365 16384 ] The frequency response is shown below. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 APPLICATION INFORMATION 75 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Frequency Response of Interpolation Filter 1 20 0 Frequency Response(dB) -20 -40 -60 -80 -100 -120 -140 -160 0 0.1 0.2 0.3 0.4 0.5 0.6 Normalized Frequency 0.7 0.8 0.9 1 Figure 9-9. Interpolation Filter 1 freq Response (from 0 to FDACCLK/2) (2X Interpolation mode) TXFIR2 is a 19 tap half-band filter. The transition band is from 0.27 to 0.75 of FCLKFIR2/2, and the stop band attenuation is 70dB. Pass band ripple is less than 0.1dB. It has the following coefficients (listed only up to the middle one). TXFIR2 (interpolation filter 2) coefficients = [11 0 –64 0 224 0 –648 0 2525 4096] Individual and Composite Responses of Interpolation Filters 50 Frequency Response(dB) 0 -50 -100 -150 -200 0 0.2 0.4 0.6 0.8 1.2 1.4 1 Normalized Frequency 1.6 1.8 2 Figure 9-10. Interpolation filters individual and composite responses – TXFIR1 response is shown in blue, TXFIR2 response is in red, and the composite response is in green. (4X interpolation mode, from 0 to FDACCLK/2) 76 APPLICATION INFORMATION Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 9.12 TRANSMIT FINE FREQUENCY MIXER (FMIX) The fine mixer uses a Numerically Controlled Oscillator (NCO) to generate two complementary outputs of a finely programmable frequency, which is then mixed with the A and B inputs to generate complex outputs. The mixer computes two outputs as follows: Output I = {Acos(ωmixt) – B sin(ωmixt)} and Output Q = {Asin(ωmixt) + Bcos(ωmixt)} where ωmix is the programmed fine frequency. The NCO has a 32 bit frequency register, and a 20 bit phase register. The 32 bit frequency register can be used to set the mixing frequency over a range of ±Fs/2 in steps of Fs/232. 9.13 TRANSMIT COARSE FREQUENCY MIXER The transmit path contains an optional ±FDACCLK/4 coarse digital frequency mixer. An example of its use is the processing of an input pattern to the AFE7225/7222 at or near baseband. The digital mixer can move the carrier or block of carriers to a higher IF after interpolation. This is useful especially in quadrature modulation as it creates more separation between the wanted signal and its image, making it easier to filter the unwanted image at RF after the analog quadrature modulator. (1) MIXING PATTERN (1) MIXING MODE MIXING 00 Normal (Low Pass, No Mixing) Iout = { +A, +A , +A, +A } Qout = { +B, +B , +B, +B } 01 High Pass (Fs/2) Iout = { +A, –A , +A, –A } Qout = { +B, –B , +B, –B } 10 +Fs/4 Iout = { +A, –B , –A, +B } Qout = { +B, +A , –B, –A } 11 –Fs/4 Iout = { +A, +B , –A, –B } Qout = { +B, –A , –B, +A } A and B are the inputs to the CMIX block. Iout and Qout are the outputs. 9.14 TRANSMIT INVERSE SINC FILTER The inverse SINC filter is 9-tap and has a response that is inverse of the natural DAC droop versus frequency (due to sin(x)/x roll-off caused by zero-order hold of DAC sampling. It uses the same coefficients as in DAC5688. The inverse sinc filter has a gain > 1 at all frequencies. Therefore, the signal input to the inverse SINC must be reduced from full scale to prevent saturation in the filter. The amount of backoff required depends on the signal frequency, and is set such that at the signal frequencies the combination of the input signal and filter response is less than 1 (0dB). For example, if the signal input to the inverse SINC filter is at FDACCLK/4, the response of the inverse SINC is 0.9 dB, and the signal must be backed off from full scale by 0.9 dB. The gain function in the QMC block can be used to reduce the amplitude of the input signal. The coefficients are same as those in the inverse SINC filter in DAC5688 (listed only up to the middle one). Coefficients = [ 1 –4 13 –50 592 ] Its frequency response is shown below: Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 APPLICATION INFORMATION 77 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Frequency Response of Inverse SINC Filter 3.5 Frequency Response(dB) 3 2.5 2 1.5 1 0.5 0 0 0.1 0.2 0.3 0.4 0.5 0.6 Normalized Frequency 0.7 0.8 0.9 1 Figure 9-11. Inverse SINC Filter Frequency Response (0 to Fdac/2) 9.15 QUADRATURE MODULATION CORRECTION (QMC) – SIMILAR FOR TRANSMIT AND RECEIVE The Quadrature Modulator Correction (QMC) block provides a means for changing the phase balance of the complex signal to compensate for I and Q imbalance present in an analog quadrature modulator. The block diagram for the QMC block is shown below. The QMC block contains 3 programmable parameters. Registers QMC_GAINA(10:0) and QMC_GAINB(10:0) control the I and Q path gains and are 11 bit values with a range of 0 to 1.99. The gain adjustment value is determined by dividing the register value by 1024. A value of 1024 is therefore a gain of 1, a value of 512 is a gain of 0.5 and a value of 2047 is a gain of 1.99. Note that the I and Q gain can also be controlled by setting the DAC full scale output current. Register QMC_PHASE(9:0) controls the phase imbalance between I and Q and is a 10-bit value with a range of –0.125 to +0.125 that is multiplied by the Q sample and added to the I sample. QMC_GAINA(10:0) 11 12 A Data In x S 12 A Data Out 10 x QMC_PHASE(9:0) x B Data In 12 12 B Data Out 11 QMC_GAINB(10:0) Figure 9-12. QMC Block Diagram 78 APPLICATION INFORMATION Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 9.16 DIGITAL OFFSET CONTROL Registers QMC_OFFSETA(12:0) and QMC_OFFSETB(12:0) control the A and B path offsets and are 13bit values with a range of -4096 to 4095. The offset adjustment value is got by dividing the register value by 16, so the range of the offset adjustment is ±256 LSB. The DAC offset value adds a digital offset to the digital data before digital-to-analog conversion. The data and offset values are LSB aligned. QMC_OFFSETA 13 12 S A Data In 12 S B Data In 12 A Data Out 12 B Data Out 13 QMC_OFFSETB Figure 9-13. Digital Offset Block Diagram 9.17 SYNCHRONIZING MULTIPLE CHIPS The AFE722x has a SYNC pin that can be used to synchronize multiple chips. When such synchronization is not required, the SYNC pin can be tied to ground (or in the case of differential SYNC input, tie SYNCINP to logic low and SYNCINN to logic high). On the transmit side, several blocks need to be synchronized. These include the clock divider, FIFO read and write pointersm, coarse mixer mixing phase, NCO phase, power meter, QMC gain/ phase correction block. Note however that all these blocks can function even without synchronization. The simplest way to synchronize all blocks is using the global synchronizing mode, which is enabled by default. The synchronization source, by default, is the SYNC pin. A rising edge on the SYNC pin will cause all blocks to be synced in an order that is internally controlled. The synchronization source can also be set to a serial interface bit (TX_GLOBAL_SYNC_SRC and RX_GLOBAL_SYNC_SRC). When using the serial interface bit, a 0-1 transition on the register bit triggers syncing. In most cases, global synchronizing mode is sufficient. However, each block can be independently synchronized by disabling the global synchronization modes (TX_GLOBAL_SYNC_DIS and RX_GLOBAL_SYNC_DIS) and enabling the block-specific synchronization register controls. The blockspecific synchronization can also be done either using the SYNC pin or using 0-1 transitions on specific register bits. For some blocks, there is an option to specify whether or not syncing is neede. An example is the QMC offset register control. When syncing is specified as not needed, the values in the QMC offset register are applied as soon as they are written into. However when syncing is specified as needed, the values written into this register are applied to the block only when a valid SYNC pulse is applied. When applying block specific syncing, it is recommended that the following order be followed: 1. Synchronize the clock divider first 2. Synchronize the FIFO next 3. Synchronize all other other blocks next in no specific order The effect on synchronizing on various blocks is listed below: • FIFO – the write pointer is reset to zero and the read pointer is reset to 4. • QMC offset correction – The QMC offset correction values programmed into the serial interface registers are loaded into the block • QMC Gain/ Phase correction block – The gain and phase correction values programmed into the serial interface registers are loaded into the block Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 APPLICATION INFORMATION 79 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 • • • 80 www.ti.com Fine mixer – The NCO frequency and phase register values programmed into the serial interface registers are loaded into the block. Also the NCO phase accumulator is initialized to the programmed phase offset. Coarse mixer – The phase programmed for the mixing is applied on SYNC. Power meter – After a SYNC event, power computation begins after a programmable number of cycles. APPLICATION INFORMATION Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 10 DIGITAL INTERFACE The digital interface is capable of operating in two distinct modes – interleaved parallel CMOS and serialized LVDS. The supported maximum speed of operation varies depending upon mode in which digital interface is operating. AFE722x has constraints on maximum frequencies of ADC_CLK and DAC_CLK. Using these constraints, a comprehensive table showing maximum frequencies of different clocks in different interfaces is listed in Table 10-1. The following table shows the maximum frequency of operation of various clocks of AFE7225 in LVDS interface mode (set register bit REG_LVDS_TX=’1’ to put DAC in LVDS interface mode, and MASTER_OVERRIDE_RX=’1’ and REG_LVDS_RX=’1’ to put ADC in LVDS interface mode.) Table 10-1. Maximum Interface Rates in LVDS Mode RX PATH Wire Mode (register bit TWOWIRE_RX) SDR or DDR (register bit SDR_RX) 1-wire DDR 2-wire 2-wire DDR SDR Decimation Factor (register bits RX_DEC_FIL_EN, RX_DEC_FIL_EN_SRC) 1 Max ADC Sampling Clock (ADC_CLK (1)) MHz Max ADC Frame Clock (ADC_FCLKOUTP/N) MHz Max ADC Bit Clock (ADC_DCLKOUTP/N) MHz Max Serial Output Data Rate (ADCx_DATA_nP/N) Mbps, per wire 65 390 780 32.5 195 390 125 375 750 62.5 187.5 375 65 390 390 32.5 195 195 Max DAC Output Clock (DAC_CLK (1)) MHz Max DAC Frame Clock (DAC_FCLKINP/N) MHz Max DAC Bit Clock ( DAC_DCLKINP/N) MHz Max Serial Input Data Rate (ADCx_DATA_nP/N) Mbps, per wire 1 65 65 390 780 2 130 65 390 780 4 250 62.5 375 750 1 65 65 390 390 2 130 65 390 390 4 250 62.5 375 375 1 130 130 390 780 2 250 125 375 780 4 250 62.5 187.5 375 65 2 1 125 2 1 65 2 TX PATH Wire Mode (register bit TWOWIRE_TX) SDR or DDR (register bit SDR_TX) 1-wire DDR 2-wire 2-wire (1) SDR DDR Interpolation By (register bits TX_INT_MODE(1:0), TX_INT_MODE_SRC) ADC_CLK and DAC_CLK are derived from clocks on CLKINP and CLKINN (differential clock, a single-ended clock or two independent single-ended clocks). See Clocking section for details. For Full-Duplex operation requiring two single-ended clocks, see section Full Duplex Operation – Coupling Considerations. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 DIGITAL INTERFACE 81 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Table 10-2 shows the maximum frequency of operation of various clocks of AFE7225 in CMOS interface mode (by default after reset, AFE722x operates in CMOS interface mode for both RX and TX path). Table 10-2. Maximum Interface Rates in CMOS Mode RX PATH Low Power CMOS Mode (register bit MODE_LP_CMOS) Disabled (default) Enabled Decimation Factor (register bits RX_DEC_FIL_EN, RX_DEC_FIL_EN_SRC) Max ADC Sampling Clock (ADC_CLK (1)) MHz 1 Max ADC_DCLKOUT MHz Max Parallel Output Data Rate Mbps, per pin 105 2 1 40 2 105 210 52.5 105 40 80 20 40 TX PATH Interpolation Factor (register bits TX_INT_MODE(1:0), TX_INT_MODE_SRC) Max DAC Output Clock (DAC_CLK (1)) MHz Max DAC_DCLKIN MHz Max Parallel Input Data Rate Mbps, per pin 130 260 65 130 32.5 65 1 2 130 4 (1) ADC_CLK and DAC_CLK are derived from clocks on CLKINP and CLKINN (differential clock, a single-ended clock or two independent single-ended clocks). See Clocking section for details. For Full-Duplex operation requiring two single-ended clocks, see section Full Duplex Operation – Coupling Considerations. 10.1 PARALLEL CMOS ADC RX DATA The 12-bit ADC-A and ADC-B data is interleaved (A then B) into one 12-bit word on pins ADCDATA0:ADCDATA11 at twice the rate of each pattern with a DDR clock (data transitions on rising and falling edges). This can be quadrature data or two independent receive channels. Note that in the default RX CMOS mode, the edges of the ADC_DCLKOUT are aligned in the middle of the data window. ADC_DCLKOUT ADCDATA B A B A B A B Figure 10-1. RX CMOS Interleaved Output 10.2 TIMING INFORMATION FOR PARALLEL CMOS ADC RX DATA tCLK ADC_DCLKOUT th ADCDATA A tsu th tsu B A tCLK = Time period of ADC output data clock (same as time period of ADC sampling clock when decimation is set to 1). Figure 10-2. RX CMOS Output Timing 82 DIGITAL INTERFACE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 10.3 PARALLEL CMOS DAC TX DATA The 12-bit DAC-A and DAC-B data is interleaved (A then B) into one 12-bit word on pins DACDATA0:DACDATA11 at twice the rate of each pattern with a DDR clock (data transitions on rising and falling edges). This can be quadrature data or two independent transmit channels. DAC_DCLKIN DACDATA B A B A B A B Figure 10-3. TX CMOS Interleaved Input 10.4 TIMING INFORMATION FOR PARALLEL CMOS DAC TX DATA tCLK DAC_DCLKIN th DACDATA A tsu th tsu B A tCLK = Time period of DAC input data clock (same as time period of DAC output clock when interpolation is set to 1). Figure 10-4. TX CMOS Input Timing 10.5 LOW POWER RX CMOS MODE The default RX CMOS mode uses an internal PLL to position the clock edges in the middle of the data window. While operating at speeds lower than 40 MSPS, a low power CMOS mode can be enabled (set bit MODE_LP_CMOS to 1). In this mode, the PLL is bypassed and the clock edges are set relative to the data transitions through delay elements. Bypassing the PLL saves about 20 mW of power. However, because the delay elements operate in open loop, there is no tight control on the precise delay and there can be a chip to chip variation. At low speeds, there will be sufficient set up and hold time inspite of the variations in the clock edge relative to the data. An advantage of the low power RX CMOS mode is that the recovery of the RX from powerdown is much faster because of the absence of the PLL. For example, with the low power RX CMOS mode enabled, the RX recovers from a state of OFF clock to a state of ON clock in 5 us (as compared to 20 us when in default RX CMOS mode). Another advantage of this low power RX CMOS mode is that the minimum frequency of operation is extended down to 2.5 MSPS (from 10 MSPS). 10.6 SERIAL LVDS DAC TX INTERFACE 12-bit DAC input data is serialized onto one or two LVDS pairs per DAC. DACA and DACB data inputs can be quadrature data or two independent receive channels. Two serialization modes are available. • 1-Wire mode: 1 LVDS pair for the data to each DAC. It will operate in a DDR fashion serialized to a frequency of 6x the pattern word rate. A frame clock (DAC_FCLKINP/N) at the word rate and a bit clock (DAC_DCLKINP/N) at 6x. Example: 50MSPS 12-bit pattern will serialize to 300MHz on each LVDS pair, frame clock of 50MHz and bit clock of 300MHz. Effective serial data rate is 600Mbps due to bit transitions on rising and falling edge of bit clock. Recommended maximum word rate is ~65MSPS in this mode. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 DIGITAL INTERFACE 83 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com tCLK/6 DAC_DCLK th DACDATA A. B. C. • tsu Ch A th tsu Ch B tCLK = Time period of DAC input data clock (same as time period of DAC output clock when interpolation is set to 1). th is minimum hold time required at the AFE722x input. tsu is minimum setup time required at the AFE722x input. Figure 10-5. TX 1-Wire Mode Timing Diagram 2-Wire mode, DDR clock: 2 LVDS pairs for the data to each DAC. It will operate in a DDR fashion serialized to a frequency of 3x the pattern word rate. A frame clock (DAC_FCLKINP/N) at half the word rate and a bit clock (DAC_DCLKINP/N) at 3x. Example: 50MSPS 12-bit pattern will serialize to 150MHz on each LVDS pair, frame clock of 25MHz and bit clock of 150MHz. Effective serial data rate is 300Mbps on each LVDS pair due to bit transitions on rising and falling edge of bit clock. Recommended maximum word rate is ~125MSPS in this mode. tCLK/3 DAC_DCLK th DAC_DATA A. B. C. • 84 Ch A tsu th tsu Ch B tCLK = Time period of DAC input data clock (same as time period of DAC output clock when interpolation is set to 1). th is minimum hold time required at the AFE722x input. tsu is minimum setup time required at the AFE722x input. Figure 10-6. TX 2-Wire Mode, DDR Clock Timing Diagram 2-Wire mode, SDR clock: 2 LVDS pairs for the data to each DAC. It will operate in a SDR fashion serialized to a frequency of 6x the pattern word rate. A frame clock (DAC_FCLKINP/N) at the word rate and a bit clock (DAC_DCLKINP/N) at 6x. Example: 50MSPS 12-bit pattern will serialize to 300MHz on each LVDS pair, frame clock of 50MHz and bit clock of 300MHz. Effective serial data rate is 300Mbps on each LVDS pair due to bit transitions on rising edge of bit clock. Recommended maximum word rate is ~65MSPS in this mode. DIGITAL INTERFACE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 10.6.1 LVDS TX Interface Input Clock, CLK Freq = Fs DAC Frame Clock, DAC_FCLK Freq = 1X Fs 12 bit serialization DAC Bit Clock, DAC_DCLK Freq = 6X Fs Input Data, DACB_DATA 0 DACA_DATA 0 Data rate = 12X Fs D0 (D11) D1 (D10) D2 (D9) D3 (D8) D4 (D7) D5 (D6) D6 (D5) D7 (D4) D8 (D3) D9 (D2) D10 (D1) D11 (D0) D0 (D11) D1 (D10) SAMPLE N+1 SAMPLE N Data bit in LSB First mode D0 (D11) Data bit in MSB First mode Figure 10-7. 1-WIRE MODE Input Clock, CLK Freq = Fs DAC Frame Clock, DAC_FCLK Freq = 1X Fs DAC Bit Clock – DDR (def) DAC_DCLK Freq = 3X Fs in BYTE-WISE MODE (DEFAULT) DAC Bit Clock – SDR DAC_DCLK Freq = 6X Fs Input Data (LSB byte) DACA_DATA _1 DACB_DATA _0 D0 (D5) D1 (D4) D2 (D3) D3 (D2) D4 (D1) D5 (D0) D0 (D5) D1 (D4) D2 (D3) D3 (D2) D4 (D1) D5 (D0) Input Data (MSB byte) DACA_DATA _0 DACB_DATA _1 D6 (D11) D7 (D10) D8 (D9) D9 (D8) D10 (D7) D11 (D6) D6 (D11) D7 (D10) D8 (D9) D9 (D8) D10 (D7) D11 (D6) in WORD-WISE MODE in BIT-WISE MODE Data rate = 6X Fs Input Data (Even bits) DACA_DATA _1 DACB_DATA _0 D0 (D10) D2 (D8) D4 (D6) D6 (D4) D8 (D2) D10 (D0) D0 (D10) D2 (D8) D4 (D6) D6 (D4) D8 (D2) D10 (D0) Input Data (Odd bits) DACA_DATA _0 DACB_DATA _1 D1 (D11) D3 (D9) D5 (D7) D7 (D5) D9 (D3) D11 (D1) D1 (D11) D3 (D9) D5 (D7) D7 (D5) D9 (D3) D11 (D1) D0 (D11) D1 (D10) D2 (D9) D3 (D8) D4 (D7) D5 (D6) D6 (D5) D7 (D4) D8 (D3) D9 (D2) D10 (D1) D11 (D0) D0 (D11) D1 (D10) D2 (D9) D3 (D8) D4 (D7) D5 (D6) D6 (D5) D7 (D4) D8 (D3) D9 (D2) D10 (D1) D11 (D0) Input Data (Sample N) DACA_DATA _1 DACB_DATA _0 Input Data (Sample N+1) DACA_DATA _0 DACB_DATA _1 Data bit in LSB First mode White cells – Sample N D0 (D5) Data bit in MSB First mode Grey cells – Sample N+1 Figure 10-8. 2-WIRE MODE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 DIGITAL INTERFACE 85 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com 10.7 SERIAL LVDS ADC RX INTERFACE Note: Set MASTER_OVERRIDE_RX bit to ‘1’ before entering RX LVDS interface. The 12-bit ADC output data is serialized onto one or two LVDS pairs per ADC. ADCA and ADCB data outputs can be quadrature data or two independent receive channels. Two serialization modes are available. • 1-Wire mode: 1 LVDS pair for the data from each ADC. It will operate in a DDR fashion serialized to a frequency of 6x the pattern word rate. A frame clock (ADC_FCLKOUT) at the word rate and a bit clock (ADC_DCLKOUT) at 6x. Example: 50MSPS 12-bit pattern will serialize to 300MHz on each LVDS pair, frame clock of 50MHz and bit clock of 300MHz. Effective serial data rate is 600Mbps due to bit transitions on rising and falling edge of bit clock. tCLK/6 ADC_DCLK th ADC_DATA A. B. C. • tsu Ch A th tsu Ch B tCLK = Time period of ADC output frame clock. th is minimum hold time required at the AFE722x output. tsu is minimum setup time required at the AFE722x output. Figure 10-9. RX 1-Wire Mode Timing Diagram 2-Wire mode, DDR clock: 2 LVDS pairs for the data from each ADC. It will operate in a DDR fashion serialized to a frequency of 3x the pattern word rate. A frame clock (ADC_FCLKOUT) at half the word rate and a bit clock (ADC_DCLKOUT) at 3x. Example: 50MSPS 12-bit pattern will serialize to 150MHz on each LVDS pair, frame clock of 25MHz and bit clock of 150MHz. Effective serial data rate is 300Mbps on each LVDS pair due to bit transitions on rising and falling edge of bit clock. tCLK/3 ADC_DCLK th ADC_DATA A. B. C. • 86 Ch A tsu th tsu Ch B tCLK = Time period of ADC output frame clock. th is minimum hold time required at the AFE722x output. tsu is minimum setup time required at the AFE722x output. Figure 10-10. RX 2-Wire Mode, DDR Clock Timing Diagram 2-Wire mode, SDR clock: 2 LVDS pairs for the data from each ADC. It will operate in a SDR fashion serialized to a frequency of 6x the pattern word rate. A frame clock (ADC_FCLKOUT) at the word rate and a bit clock (ADC_DCLKOUT) at 6x. Example: 50MSPS 12-bit pattern will serialize to 300MHz on each LVDS pair, frame clock of 50MHz and bit clock of 300MHz. Effective serial data rate is 300Mbps on each LVDS pair due to bit transitions on rising edge of bit clock. DIGITAL INTERFACE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 10.7.1 LVDS RX Interface Input Clock, CLK Freq = Fs ADC Frame Clock, ADC_FCLK Freq = 1X Fs 12 bit serialization ADC Bit Clock, ADC_DCLK Freq = 6X Fs ADC Output Data, ADCB_DATA 0 ADCA_DATA 0 Data rate = 12X Fs D0 (D11) D1 (D10) D2 (D9) D3 (D8) D4 (D7) D5 (D6) D6 (D5) D7 (D4) D8 (D3) D9 (D2) D10 (D1) D11 (D0) D0 (D11) D1 (D10) SAMPLE N+1 SAMPLE N Data bit in LSB First mode D0 (D11) Data bit in MSB First mode Figure 10-11. 1-WIRE MODE Input Clock, CLK Freq = Fs ADC Frame Clock, ADC_FCLK Freq = 1X Fs ADC Bit Clock – DDR (def) DCLK Freq = 3X Fs in BYTE-WISE MODE (DEFAULT) ADC Bit Clock – SDR DCLK Freq = 6X Fs Output Data (LSB byte) ADCA_DATA _1 ADCB_DATA _0 D0 (D5) D1 (D4) D2 (D3) D3 (D2) D4 (D1) D5 (D0) D0 (D5) D1 (D4) D2 (D3) D3 (D2) D4 (D1) D5 (D0) Output Data (MSB byte) ADCA_DATA _0 ADCB_DATA _1 D6 (D11) D7 (D10) D8 (D9) D9 (D8) D10 (D7) D11 (D6) D6 (D11) D7 (D10) D8 (D9) D9 (D8) D10 (D7) D11 (D6) in WORD-WISE MODE in BIT-WISE MODE Data rate = 6X Fs Output Data (Even bits) ADCA_DATA _1 ADCB_DATA _0 D0 (D10) D2 (D8) D4 (D6) D6 (D4) D8 (D2) D10 (D0) D0 (D10) D2 (D8) D4 (D6) D6 (D4) D8 (D2) D10 (D0) Output Data (Odd bits) ADCA_DATA _0 ADCB_DATA _1 D1 (D11) D3 (D9) D5 (D7) D7 (D5) D9 (D3) D11 (D1) D1 (D11) D3 (D9) D5 (D7) D7 (D5) D9 (D3) D11 (D1) Output Data (Sample N) ADCA_DATA _1 ADCB_DATA _0 D0 (D11) D1 (D10) D2 (D9) D3 (D8) D4 (D7) D5 (D6) D6 (D5) D7 (D4) D8 (D3) D9 (D2) D10 (D1) D11 (D0) D0 (D11) D1 (D10) D2 (D9) D3 (D8) D4 (D7) D5 (D6) D6 (D5) D7 (D4) D8 (D3) D9 (D2) D10 (D1) D11 (D0) Output Data (Sample N+1) ADCA_DATA _0 ADCB_DATA _1 Data bit in LSB First mode White cells – Sample N D0 (D5) Data bit in MSB First mode Grey cells – Sample N+1 Figure 10-12. 2-WIRE MODE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 DIGITAL INTERFACE 87 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com 10.7.2 CLOCKING The clock inputs are versatile. The AFE7225/7222 can be driven by a differential clock, a single-ended clock or two independent single-ended clocks. Low voltage CMOS for single-ended and LVDS for differential are supported clock levels. Since routing single-ended clocks on the printed circuit board is different from system to system, it is possible to see some performance degradation in the data converters if the clock becomes corrupted prior to entering the AFE7225/7222. This is less likely to occur if using a differential clock routed on the board due to the common-mode noise rejection of the differential clock receiver. The full block diagram of the clocking to the ADC and DAC is shown below. DIV_ADC Singleended Buffer MUX ENABLE_DCC Clock Divider %1,2,4 DCC (Duty Cycle Correction) MUX CLKINP CLKINN Differential Buffer ADC_CLK REG_SE_CLK PLL_ENABLE Singleended Buffer MUX PLL X2,4 DIV_DAC Clock Divider %1,2,4 MUX DAC_CLK Figure 10-13. Clocking Depending on the ADC input frequency and the target SNR of the receiver, it may be important to provide a low jitter clock source to the AFE7225/7222. A good estimate for required clock jitter to achieve a certain SNR can be found using SNR = 20*log10(2*pi*FINadc *JITTERtotal). The JITTERtotal is the rms summation of the external clock jitter and the internal AFE7225/7222 RX ADC clocking aperture jitter, specified in the timing characteristics table. A good target for the total jitter is a value that allows an SNR that meets or exceeds the ADC SNR so that the clock source jitter will not degrade the SNR. Note that the SNR is dependent on the analog input frequency and not the clock frequency. When different rate clocks are required for the ADC and the DAC (for example, DAC_CLK is 2X rate of ADC_CLK), it is strongly recommended that the input clock be at the higher of the two rates. Dividing the high speed clock to derive the half rate clock always gives much lower jitter than using the PLL to multiply the lower rate clock to derive the higher rate inside the chip. Use the PLL only when performance requirements are relaxed and the additional jitter is tolerable (usually when the analog I/O frequencies are low). The equivalent circuit model of the differential buffer is shown below. Note that even with the single ended buffer is enabled, the loading from the passive components in the differential buffer circuit (including the 2 pF differential cap, the two 5 kOhm resistors and the equivalent input load, Ceq are still present). 88 DIGITAL INTERFACE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Differential Clock buffer Lpkg ~ 1 nH 20 W CLKINP Ceq Cbond ~ 1 pF Ceq 5 kW Resr ~100 W VCM 2 pF 5 kW Lpkg ~ 1 nH 20 W CLKINN Cbond ~ 1 pF Resr ~100 W Ceq ~ 1 to 3 pF, equivalent input capacitance of differential clock buffer Figure 10-14. Input Clock Equivalent Circuit 10.8 Auxiliary ADC The schematic of the Auxiliary ADC is shown below. MODE_INPUT BYPASSZ_BUF AUXADC_A SHIGH Input Buffer 12-Bit SAR ADC Serializer SDOUT AUXADC_B SCLK SCLK Figure 10-15. Auxiliary ADC Schematic The Auxiliary ADC comprises a 12-bit SAR ADC with a high impedance input buffer that is bypassed by default (BYPASSZ_BUF=0). The Auxiliary ADC can select its input from 2 external pins called AUXADC_A and AUXADC_B. This selection is done using the bits MODE_INPUT . The conversion is started by setting bit CONV_START to 1, and SCLK is used as the conversion clock. The SAR ADC converts the selected input and the 12-bit output is serialized using the SCLK and given out on the SDOUT pin. After setting CONV_START to 1, the Auxiliary ADC can be configured for either a single conversion, multiple conversions or in continuous conversion mode. With the input buffer bypassed, the input range of the Auxiliary ADC is 0-1.5V when RANGE_AUXADC is set to 0. When the Auxiliary ADC is converting, the SAR ADC draws switching current from the input pin if the input buffer is bypassed. This may not be desirable for applications where the voltage being monitored does not have drive capability. With the input buffer introduced in the path of the input, the AUXADC inputs are high impedance and do not draw current. However, the input voltage range (at the AUXADC pins) is slightly reduced to 0.1-1.5V. With RANGE_AUXADC set to 1, the input range is increased to 0-DVDD18 with the buffer bypassed and 0.1-(DVDD18-0.1)V with the buffer enabled. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 DIGITAL INTERFACE 89 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com 10.8.1 Enabling the Auxiliary ADC The Auxiliary ADCs are disabled by default. Below is the timing diagram illustrating the Aux ADC operation. Before starting conversion, set bit EN_AUX_ADC to '1'. Also set WHAT_IS_SDOUT to configure SDOUT as a digital output pin. tPER SCLK SEN SET CONVERSION START=1 SDATA 20 clocks Write Address: 364 Data: 01 SHIGH (INTERNAL SAMPLING CLOCK) AUXADC goes back to sampling mode AUXADC input sampled here SDOUT DO11DO10 DO9 DO8 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 DATA LATENCY = 27.5 CLOCKS DATA PROPAGATION DELAY = 20 ns Figure 10-16. AUX ADC Timing Diagram Note that throughout the Aux ADC conversion, SEN is kept low (active). Also keep SDATA low once the CONV_START bit has been written. To get out of Aux ADC conversion mode, pull SEN high, then pull it low again and write the bit to make CONV_START=0. 10.9 Auxiliary DAC The schematic of the Auxiliary DAC (for channel A) is shown below. AVDD3_AUX (3 V) IAUX_DAC AUXDAC_A_N (Internal node) RINT AUXDAC_A (Pin) REXT Figure 10-17. Auxiliary DAC Schematic The Auxiliary DAC is a 12-bit current output DAC with the current steered into the AUXDAC_A pin dependent on the digital code. The data format of the Auxiliary DAC input is offset binary. REXT is the external connected to the AUXDAC_A pin and along with the value of the full scale current, sets the full scale output voltage range. For zero input code, voltage on AUXDAC_A is equal to 0 V. For maximum input code, voltage on AUXDAC_A is equal to IAUX_DAC*REXT. IAUX_DAC is the full scale current of the Auxiliary DAC, and can be programmed from 2.5 mA to 7.5 mA (using bits FS_AUXDACI). For best linearity, limit the maximum voltage at AUXDAC_A to 1.5V. For example, with IAUX_DAC set to 5 mA, and REXT set to 300 Ohm, the voltage on AUXDAC_A will swing from 0 to 1.5V. 90 DIGITAL INTERFACE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 AUXDAC_A_N is the internal complementary node and has an internal resistor, RINT programmable from 57 Ohm to 400 Ohm (using bits AUX_DAC_TERM_N). For best linearity, choose a value of this resistor to be as close to REXT as possible. 10.10 Enabling the Auxiliary DAC The Auxiliary DACs are disabled by default. Note that address of the 20 bit serial interface write bus is the 1st 12 bits out of which the 1st 4 bits determine the access mode for the Auxiliary DAC. Let us denote this address as ADDR. Following are Aux DAC modes: If ADDR = 0100, then we enter Direct Access mode for DAC. In this mode, DAC data is dynamically written through SDATA (and SDOUT). If ADDR = 0101, then we enter the Register Access mode. In this mode, DAC is loaded with the data from contents of pre-loaded registers. In direct access mode If ADDR = 01: DAC_A will get written with the 12 serial bits from SDATA, DAC_B will get written with the 12 serial bits from SDOUT (both at the rising edge of SCLK) If ADDR = 10: DAC_A will get 12 bits from SDATA, DAC_B will get next 12 bits from SDATA (both at the rising edge of SCLK) If ADDR = 11: DAC_A will get 12 bits from SDATA at the rising edge of SCLK, DAC_B will get 12 bits from SDATA at the falling edge of SCLK. In register access mode: ADDR = 01: Only DAC_A will be loaded with the register ADDR = 10: Only DAC_B will be loaded ADDR = 11: Both DAC_A and DAC_B are loaded. For either direct access or register access modes, only the 1st 6 bits of the address need to be written for the serial interface state machine. Remainig bits are considered as applicable to the DAC data. Below diagram shows the Aux DAC timing for the direct access mode where DAC_A is written through SDATA and DAC_B through SDOUT. Start by already setting EN_AUXDACA and EN_AUXDACB bits high. tPER SCLK SEN TO GET INTO DIRECT ACCESS MODE AUX DAC A INPUT1 AUX DAC A INPUT2 SDATA 0 1 0 0 0 1 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 DA11 DA10 DA9 DA8 DA7 AUX DAC B INPUT1 DA6 DA5 DA4 DA3 DA2 DA1 DA0 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 DB2 DB1 DB0 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 AUX DAC B INPUT2 SDOUT DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 AUXDAC_A tSETTLE tSETTLE DELAY FOR FIRST UPDATE = 22 CLOCKS AUXDAC_B DELAY FOR SUBSEQUENT UPDATE = 12 CLOCKS Figure 10-18. Aux DAC Timing Diagram: DAC_A is Written Through SDATA and DAC_B Through SDOUT tPER = SCLK period > 25 ns tSETTLE = Settling time of Aux DAC for full scale output (0-1.5V) = 40 ns Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 DIGITAL INTERFACE 91 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Therefore fastest update time: First update = 22*25ns + 40ns = 590 ns Subsequent update = 12*25ns = 300 ns For the direct access mode where DAC_A and DAC_B are both written through SDATA, the timing is shown in figure below. tPER SCLK SEN TO GET INTO DIRECT ACCESS MODE AUX DAC A INPUT1 AUX DAC B INPUT1 SDATA 0 1 0 0 0 1 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 AUXDAC_A tSETTLE DELAY FOR FIRST UPDATE = 34 CLOCKS AUXDAC_B Figure 10-19. Aux DAC Timing Diagram: DAC_A and DAC_B are Both Written Through SDATA Therefore fastest update time: First update = 34*25ns + 40ns = 890 ns Subsequent update = 24*25ns = 600 ns After the first Aux DAC refresh, subsequent refresh of the Aux DAC outputs in the above mentioned direct access mode takes place after every 24 clocks. Note that the Aux DAC takes about 12 mA on AVDD3_AUX (when full scale output is set to 5 mA each Aux DAC). 10.11 Full Duplex Operation – Coupling Considerations When operating the transmit and receive channels simultaneously, several factors need to be considered in order to minimize the coupling between the transmit and receive channels. In a general case, the DAC and ADC clocks can be at arbitrary rates, with or without harmonic relations to each other. In such a case, there exist serious possibilities of coupling between the ADC and DAC. As far as possible, we recommend driving the ADC and DAC with the same clock rate externally, and use the internal clock division and multiplication to adjust to the required ADC and DAC clock rates internally. The internal block diagram of the clocking path is repeated below. 92 DIGITAL INTERFACE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 DIV_ADC Singleended Buffer MUX ENABLE_DCC Clock Divider %1,2,4 DCC (Duty Cycle Correction) MUX CLKINP CLKINN Differential Buffer ADC_CLK REG_SE_CLK PLL_ENABLE MUX Singleended Buffer PLL X2,4 MUX DIV_DAC Clock Divider %1,2,4 DAC_CLK Figure 10-20. Block Diagram of Clocking Path Three cases are considered: Case 1: DAC_CLK and ADC_CLK are at same rate: In this case, either CLKINP and CLKINN should be driven by a differential clock (common to both the ADC and DAC) or two single ended clocks, both at the same rate. Case 2: DAC_CLK and ADC_CLK are at different rates such that the higher rate is 2X or 4X of the lower rate: In this case, we again recommend driving CLKINP/CLKINN differentially (or by two equal rate single ended clocks) at the higher of two rates and dividng internally by the factor of 2 (or 4) on the channel that requires the lower rate clock. Case 3: DAC_CLK and ADC_CLK are at different rates with the DAC_CLK being at 8X or 16X of the ADC_CLK: In this case, we recommend driving CLKINP/CLKINN differentially (or by two equal rate single ended clocks) at 4X of ADC_CLK rate, dividing it by 4 for the ADC, and multiplying it by 2 (or 4) for the DAC. Case 4: DAC_CLK and ADC_CLK are at different rates that are harmonically related but not at rates covered by Case 2 or Case 3: In this case, there is no alternative but to drive CLKINP and CLKINN with two different rate clocks. If phase control of the two clocks is possible, we recommend that the phases be adjusted such that the two clocks have rise/fall edges that do not come within 5 ns of each other. We also recommend that the driving clock rates be as close to each other as possible. Case 5: DAC_CLK and ADC_CLK are at different rates that are non-harmonically related: This is the worst case and it is recommended to avoid operating the AFE in full duplex mode with such clock rates. The presence of non-harmonically related clocks at two adjacent pins can cause periodic modulation in the sampling instant that can result in huge spurs that get worse at higher ADC input frequencies (and DAC output frequencies). At 70 MHz IF, these spur levels could be as large as –45 dBc. 10.12 Half Duplex Operation – Coupling Considerations If the ADC and DAC are driven externally by unequal rate clocks, then ensure that these clocks are not on simultaneously. For example, in half duplex mode with the Tx active, ensure that the ADC clock to the device is shut off. If the ADC and DAC are driven by equal rate clocks, then it is not required to shut off the ADC clock when the Tx is active (and DAC clock when the Rx is active). 10.13 Half Duplex Operation Through a Common I/O Interface If the AFE7222/7225 is to be always operated in Half Duplex mode through a common I/O interface for the RX and TX (to reuse the same bus), then the RX and TX data and clocks can be tied on the board as illustrated below: Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 DIGITAL INTERFACE 93 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 REG_PDN_RX www.ti.com AFE7222/ 7225 REG_OEZ_CMOS_DAT CMOS RX DATA ADCDATA ADC CMOS RX CLK ADC_DCLKOUT TO FPGA TX CLK CMOS REG_OEZ_CMOS_CLK DAC_DCLKIN TX DATA CMOS DAC DACDATA REG_PDN_TX Figure 10-21. I/O Interface To enable the TX in Half Duplex mode, set: REG_PDN_RX=1, REG_OEZ_CMOS_DAT=1, REG_OEZ_CMOS_CLK=1, and drive the DACDATA and DAC_DCLKIN pins as TX input pins. To enable the RX in Half Duplex mode, set: REG_PDN_TX=1 and receive data and clock from the RX on the same bus. For a pin control to be able to toggle between RX half duplex and TX half duplex modes, set bit REG_HALF_DUPLEX_THRU_PIN. When this mode is set, the PDN pin serves as a toggle pin – when the PDN pin is high, the device operates in Half duplex RX mode and when the PDN pin is low, the device operates in Half duplex TX mode. Note that half duplex mode through a common I/O interface and the full duplex mode will require different board configurations, since in the former mode, the I/O bus is shared. 11 QUICK GUIDE Supplies: We recommend driving the Device with 3 supplies : 3V supply – Tie pins 11, 14, 17, 22 to this supply 1.8V analog supply – Tie pins 1, 4, 7, 10, 19, 25, 62, 64 to this supply 1.8V digital supply – Tie pins 32, 41, 49 to this supply Power up sequence: Power on the 3V and 1.8V supplies in any sequence Apply a high going pulse on RESET of minimum width 100 ns to reset the internal registers of the device. Software RESET: In addition to the hardware RESET pin, the device also has a software RESET bit. This is a self-clearing bit, so it needs to be only asserted whenever the device needs to be reset. The software RESET can be applied by programming register address 000, Data 02. 94 QUICK GUIDE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Clocking: By default, the device expects a differential clock on CLKINP and CLKINN. This differential clock is used to drive both the ADC and DAC. In case the clock source is single ended, then short CLKINN to a voltage of 0.95V and apply the single ended clock source on CLKINP – alternatively, CLKINP can be driven with a voltage of 0.95V and the single ended clock source can be applied on CLKINN. A third alternative is to use the single ended clock buffer inside the device. This mode saves about 9 mW of power since the differential clock buffer is shut down. By setting register (address 20A, Data 20), the single ended clock buffer can be enabled. In that case, Pin 8 provides the single ended clock for the DAC whereas Pin 9 provides the single ended clock for the ADC – if a single clock source is to be used for both, then tie pins 8 and 9 to this clock source. Biasing the ADC inputs: The common mode of the ADC input pins should set to VCM, which is nominally 0.95V (measured after programming the initialization registers). Deviating from this input common mode can cause degraded performance. The full scale input swing on the inputs is 2 Volt differential peak-to-peak. When biased optimally at 0.95V, the device gives a full scale output code when the positive input swings between roughly 0.45V and 1.45V (and correspondingly the negative input swings between 1.45V and 0.45V). It is recommended to operate the ADC at an input that is at least 1 dB below full scale. ADC output format: The ADC gives out a 12-bit output in 2s complement format. For the most negative input, the ADC gives out a code of 100000000000. For the most positive input, the output code is 011111111111. RX data output capture (CMOS mode) : The RX output data format is DDR (Dual data rate) CMOS. The output of the ADC channel A can be captured using the rising edge of ADC_DCLKOUT. The output of ADC channel B can be captured using the falling edge of ADC_DCLKOUT. The clock rate of ADC_DCLKOUT matches with the input clock rate (on CLKINP, CLKINN). ADC_DCLKOUT ADCDATA B A B A B A B Figure 11-1. RX CMOS Output Interface A variety of test patterns can be output by the device in order to debug issues with the capture. To enable the test patterns, program register address 042, Data 08. Once this register is programmed, we can change the output pattern as follows : TO REPLACE NORMAL DATA WITH THE FOLLOWING .. ON CHANNEL A WRITE .. ON CHANNEL B WRITE All bits 0 Address 031, Data 01 Address 037, Data 01 All bits 1 Address 031, Data 02 Address 037, Data 02 All bits toggle between 0 and 1 Address 031, Data 03 Address 037, Data 03 Linearly ramping code that ramps through min to max code Address 031, Data 04 Address 037, Data 04 12-bit Custom code Address 031, Data 05 Address 037, Data 05 The 12 bits for the custom code (C) can be set (common for Channel A and B) using the following bits: C = Bit D5 of regster address 03F C = Bit D4 of regster address 03F C = Bit D3 of regster address 03F Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 QUICK GUIDE 95 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 C = C = C = C = C = C = C = C = C = Bit Bit Bit Bit Bit Bit Bit Bit Bit D2 D1 D0 D7 D6 D5 D4 D3 D2 of of of of of of of of of www.ti.com regster address 03F regster address 03F regster address 03F regster address 040 regster address 040 regster address 040 regster address 040 regster address 040 regster address 040 For example, programming registers (Address 03F Data 29) and (Address 040 Data 34) replaces the normal ADC data for both channels with the static binary code 101001001101. DAC input format: The DAC input format is also 2s complement similar to the ADC. Full scale DAC current: The full scale DAC current (IOUTFS) is set by the resistor (of value RBIASJ) on the BIASJ pin. IOUTFS = 19.2/RBIASJ. For RBIASJ=960Ω, IOUTFS = 20 mA For the 12-bit input code (where CODE is the decimal representation of the DAC data input word in straight offset binary format): IOUTP = IOUTFS × CODE / 4096 IOUTN = IOUTFS × (4096 – CODE) / 4096 TX data input (CMOS mode): The TX input data format is also DDR CMOS. The rising edge of the DAC_DCLKIN latches the Channel A data inside the AFE7225/7222, and the falling edge latches the Channel B data. The clock rate of DAC_DCLKIN is same as the input clock rate when interpolation is not set. When 2X interpolation is set, it should be half the input clock rate, and when 4X interpolation is set, it should be one-fourth the input clock rate. DAC_DCLKIN DACDATA B A B A B A B Figure 11-2. TX CMOS Input Interface Interpolation: While interpolating by a factor of 2, the DAC_DCLKIN rate should be set to half of the input clock rate. The 2X interpolation mode on the TX side can be set by the following register : Address 106, Data 05. Powerdown modes: The device has several powerdown modes which provide a tradeoff between power consumed and speed of recovery from powerdown. The nature of the powerdown mode can be set through the registers. Also the assertion of the powerdown can be done either through the PDN pin or through a register bit. While using the PDN pin to control the powerdown state, the following are the register configurations (see specifications table for recovery times) Global powerdown mode through PDN pin : Set Address 207, Data 20, and control PDN pin to assert/ de-assert global powerdown mode. Most functions are shutdown. 96 QUICK GUIDE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 AFE7222 AFE7225 www.ti.com SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 Fast recovery powerdown mode through PDN pin : Set Address 207, Data 40, and control PDN pin to assert/ de-assert fast recovery powerdown mode. RX and TX are both put to light sleep, for fast recovery. Powerdown TX through PDN pin : Set Address 207, Data 02, and control PDN pin to assert/ de-assert TX powerdown mode. In this mode, the TX path is shut down and the RX is fully active, but TX is waiting for fast recovery. Powerdown RX through PDN pin : Set Address 207, Data 04, and control PDN pin to assert/ de-assert RX powerdown mode. In this mode, the RX path is shut down and the TX is fully active, but RX is waiting for fast recovery. In the above cases, the PDN pin was used to assert/ de-assert the powerdown state. Alternatively, a register bit can be used to assert/ de-assert the powerdown state. This is bit D7 of register address 207. The corresponding register configurations to assert/ de-assert the powerdown through the register bit are as follows (in this case, keep the PDN pin low). MODE TO ASSERT POWERDOWN WRITE TO DE-ASSERT POWERDOWN WRITE Global powerdown through register Address 207, Data A0 Address 207, Data 20 Fast recovery powerdown through register Address 207, Data C0 Address 207, Data 40 TX powerdown through register Address 207, Data 82 Address 207, Data 02 RX powerdown through register Address 207, Data 84 Address 207, Data 04 Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 QUICK GUIDE 97 AFE7222 AFE7225 SLOS711B – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (November 2011) to Revision A • • • • • • • • • • • • Page Changed DETAILED BLOCK DIAGRAM ........................................................................................ 2 Deleted product preview for AFE7225 from PACKAGE/ORDERING INFORMATION ................................. 3 Changed SUPPLY CHARACTERISTICS ...................................................................................... 10 Changed TX DAC ELECTRICAL CHARACTERISTICS ..................................................................... 13 Changed Data setup times ...................................................................................................... 16 Changed Data hold times ....................................................................................................... 16 Added Note to TIMING REQUIREMENTS FOR RECEIVE PATH – LVDS AND CMOS MODES ..................... 16 Changed tdelay times .............................................................................................................. 16 Changed Output clock duty cycle ............................................................................................. 16 Changed Table 3-2 ................................................................................................................ 17 Changed Table 10-1 .............................................................................................................. 81 Changed Table 10-2 .............................................................................................................. 82 Changes from Revision A (December 2011) to Revision B • • • • • • • • • • • • • • • • • 98 Page Added note to RECOMMENDED OPERATING CONDITIONS .............................................................. 9 Changed SUPPLY CHARACTERISTICS table ............................................................................... 10 Added RX and TX active, No input signal applied on ADC and DAC to Supply current, full duplex mode test conditions ..................................................................................................................... 10 Changed Power dissipation to Supply current in POWER IN CMOS MODE .......................................... 10 Added RX and TX active, No input signal applied on ADC and DAC to Supply current, full duplex mode test conditions ..................................................................................................................... 10 Added Power dissipation in Sleep modes MAX values ................................................................... 11 Added (with MSB first format) to SPI REGISTER READOUT 3rd bullet ............................................... 20 Changed Figure 8-1 ............................................................................................................... 69 Changed Figure 9-3 figure title ................................................................................................. 72 Changed Figure 9-4 figure title ................................................................................................. 73 Changed Figure 9-5 figure title ................................................................................................. 74 Changed Figure 9-8 figure title ................................................................................................. 75 Added Figure 10-5 figure title .................................................................................................. 84 Added Figure 10-6 figure title .................................................................................................. 84 Added Figure 10-9 figure title .................................................................................................. 86 Added Figure 10-10 figure title ................................................................................................. 86 Changed BYPASS_BUF to BYPASSZ_BUF in Figure 10-15 .............................................................. 89 QUICK GUIDE Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): AFE7222 AFE7225 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) AFE7222IRGCR ACTIVE VQFN RGC 64 2000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 AFE7222I AFE7222IRGCT ACTIVE VQFN RGC 64 250 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 AFE7222I AFE7225IRGCR ACTIVE VQFN RGC 64 2000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 AFE7225I AFE7225IRGCT ACTIVE VQFN RGC 64 250 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 AFE7225I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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