AFE8092HIABJ

AFE8092 SBASA16A – MAY 2021 – REVISED OCTOBER 2021 AFE8092 Octal-Channel RF Transceiver with Feedback Paths 1 Features 3 Description • • • The AFE8092 is a high performance, wide bandwidth multi-channel transceiver, integrating eight RF sampling transmitter chains, eight RF sampling receiver chains and two separate RF front end for the auxiliary chains (feedback paths). The high dynamic range of the transmitter and receiver chains allows generating and receiving 3G, 4G and 5G signals for wireless base stations, while the wide bandwidth capability makes the AFE8092 devices suitable for multi-band 4G and 5G base stations. • • • • • • • • • Octal RF sampling 12-GSPS transmit DACs Octal RF sampling 4-GSPS receive ADCs Maximum RF signal bandwidth: – TX/FB: 800 MHz. • 1200 MHz in 4 channels mode – RX: 400 MHz • 800 MHz in 4 channels mode RF frequency range: up to 6GHz Digital Step Attenuators (DSA): – TX: 40-dB range, 1-dB analog and 0.125-dB digital steps – RX/FB: 31/25-dB range, 1-dB step Single DUC/DDC per chain Dual NCO’s per chain for fast frequency switching Supports TDD operation with fast switching between TX and RX Internal PLL/VCO to generate DAC/ADC clocks Optional external CLK at DAC or ADC rate SerDes data interface: – JESD204B and JESD204C – 8 SerDes transceivers up to 32.5 Gbps – 8b/10b and 64b/66b Encoding – 12-bit, 16-bit, 24-bit and 32-bit resolution – Subclass 1 multi-device synchronization Package: – 17-mm × 17-mm FCBGA, 0.8-mm pitch 2 Applications • • • • • Macro remote radio unit (RRU) Active antenna system mMIMO (AAS) Small cell base station Distributed Antenna Systems (DAS) Repeater Each receiver chain includes a 31-dB range DSA (Digital Step Attenuator), followed by a 4-GSPS ADC (analog-to-digital converter). Each receiver channel has analog peak power detectors and digital peak and power detectors to assist an external or internal autonomous automatic gain controller, and RF overload detectors for device reliability protection. The digital down converters (DDC) provides up to 400 MHz of combined signal BW in 8 channels mode and 800MHz in 4 channels mode. In TDD mode, the receiver channel can be configured to dynamically switching between traffic receiver (TDD RX) and wideband feedback receiver (TDD FB), with the capability of re-using the same analog input for both purposes. Each transmitter chain includes a digital up converters (DUCs) supporting up to 800-MHz combined signal bandwidth (1200MHz in 4 channels mode). The output of the DUCs drives a 12-GSPS DAC (digital to analog converter) with a mixed mode output option to enhance 2nd Nyquist operation. The DAC output includes a variable gain amplifier (TX DSA) with 40dB range and 1-dB analog and 0.125-dB digital steps. The feedback path includes a 25-dB range DSA driving a 4-GSPS RF sampling ADC, shared with receiver chain, followed by a DDC with up to 800-MHz bandwidth(1200 MHz in 4-channel mode). Device Information(1) PART NUMBER AFE8092 (1) PACKAGE FC-BGA BODY SIZE (NOM) 17.00 mm × 17.00 mm For all available packages, see the orderable addendum at the end of the data sheet. An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AFE8092 www.ti.com SBASA16A – MAY 2021 – REVISED OCTOBER 2021 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Device and Documentation Support..............................3 5.1 Device Support........................................................... 3 5.2 Receiving Notification of Documentation Updates......3 5.3 Support Resources..................................................... 3 5.4 Trademarks................................................................. 3 5.5 Electrostatic Discharge Caution..................................3 5.6 Glossary......................................................................3 6 Mechanical, Packaging, and Orderable Information.... 3 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (May 2021) to Revision A (October 2021) Page • Added support for 4 channels wideband modes.................................................................................................1 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: AFE8092 AFE8092 www.ti.com SBASA16A – MAY 2021 – REVISED OCTOBER 2021 5 Device and Documentation Support 5.1 Device Support 5.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 5.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 5.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 5.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 5.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: AFE8092 3 AFE8092 www.ti.com SBASA16A – MAY 2021 – REVISED OCTOBER 2021 PACKAGE OUTLINE ABJ0400A FCBGA - 2.65 mm max height SCALE 0.750 BALL GRID ARRAY 17.2 16.8 BALL A1 CORNER A 17.2 16.8 ( 16) B 2.65 MAX 0.2 C (2.08) C 0.76 0.56 SEATING PLANE NOTE 4 BALL TYP 0.12 C 0.5 TYP 0.3 15.2 TYP SYMM 0.8 TYP (0.9) TYP Y W V U T R P N M SYMM L K 15.2 TYP J H G 0.55 0.45 C A B C NOTE 3 400X 0.15 0.08 F E D C B A 1 3 2 7 5 4 6 9 8 10 11 13 15 17 19 12 14 16 18 20 0.8 TYP 4221311/B 04/2020 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C. 4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls. www.ti.com 4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: AFE8092 AFE8092 www.ti.com SBASA16A – MAY 2021 – REVISED OCTOBER 2021 EXAMPLE BOARD LAYOUT ABJ0400A FCBGA - 2.65 mm max height BALL GRID ARRAY (0.8) TYP A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 B (0.8) TYP C D E F 0.415 0.385 400X G H J SYMM K L M N P R T U V W Y SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:6X ( 0.4) METAL 0.025 MAX EXPOSED METAL SOLDER MASK OPENING 0.025 MIN METAL UNDER MASK EXPOSED METAL ( 0.4) SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221311/B 04/2020 NOTES: (continued) 5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811). www.ti.com Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: AFE8092 5 AFE8092 www.ti.com SBASA16A – MAY 2021 – REVISED OCTOBER 2021 EXAMPLE STENCIL DESIGN ABJ0400A FCBGA - 2.65 mm max height BALL GRID ARRAY (0.8) TYP A 1 2 3 4 5 ( 0.4) TYP 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 B (0.8) TYP C D E F G H J SYMM K L M N P R T U V W Y SYMM SOLDER PASTE EXAMPLE BASED ON 0.15 mm THICK STENCIL SCALE:6X 4221311/B 04/2020 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com 6 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: AFE8092 PACKAGE OPTION ADDENDUM www.ti.com 3-Aug-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) AFE8092HIABJ ACTIVE FCBGA ABJ 400 90 RoHS & Green SNAGCU Level-3-260C-168 HR -40 to 85 AFE8092 Samples AFE8092IABJ ACTIVE FCBGA ABJ 400 90 RoHS & Green SNAGCU Level-3-260C-168 HR -40 to 85 AFE8092 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of