AM26C31
SLLS103N – DECEMBER 1990 – REVISED OCTOBER 2011
www.ti.com
QUADRUPLE DIFFERENTIAL LINE DRIVER
Check for Samples: AM26C31
FEATURES
1
1A
1
16
VCC
1Y
2
15
4A
1Z
3
14
4Y
G
4
13
4Z
2Z
5
12
G
2Y
6
11
2A
7
10
3Z
3Y
GND
8
9
3A
2
1 20 19
4A
1A
3
1Z
4
18
4Y
G
5
17
4Z
NC
6
16
NC
2Z
7
15
G
2Y
8
14
3Z
3Y
3A
9 10 11 12 13
2A
The AM26C31 is a differential line driver with
complementary outputs, designed to meet the
requirements of TIA/EIA-422-B and ITU (formerly
CCITT). The 3-state outputs have high-current
capability for driving balanced lines, such as
twisted-pair or parallel-wire transmission lines, and
they provide the high-impedance state in the
power-off condition. The enable functions are
common to all four drivers and offer the choice of an
active-high (G) or active-low (G) enable input.
BiCMOS circuitry reduces power consumption without
sacrificing speed.
NC
VCC
AM26C31M. . .FK PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
NC
•
•
AM26C31M. . .J OR W PACKAGE
AM26C31Q. . .D PACKAGE
AM26C31C. . .D, DB, OR NS PACKAGE
AM26C31I. . .D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
1Y
•
•
•
•
•
Meets or Exceeds the Requirements of
TIA/EIA-422-B and ITU Recommendation V.11
Low Power, ICC = 100 μA Typ
Operates From a Single 5-V Supply
High Speed, tPLH = tPHL = 7 ns Typ
Low Pulse Distortion, tsk(p) = 0.5 ns Typ
High Output Impedance in Power-Off
Conditions
Improved Replacement for AM26LS31
Available in Q-Temp Automotive
– High-Reliability Automotive Applications
– Configuration Control/Print Support
– Qualification to Automotive Standards
GND
•
NC – No internal connection
The AM26C31C is characterized for operation from 0°C to 70°C, the AM26C31I is characterized for operation
from –40°C to 85°C, the AM26C31Q is characterized for operation over the automotive temperature range
of –40°C to 125°C, and the AM26C31M is characterized for operation over the full military temperature range
of –55°C to 125°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1990–2011, Texas Instruments Incorporated
AM26C31
SLLS103N – DECEMBER 1990 – REVISED OCTOBER 2011
www.ti.com
ORDERING INFORMATION
PACKAGE (1)
TA
PDIP (N)
0°C to 70°C
–40°C to 125°C
–55°C to 125°C
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
Tube of 25
AM26C31CN
Tube of 40
AM26C31CD
Reel of 2500
AM26C31CDR
SOP (NS)
Reel of 2000
AM26C31CNSR
26C31
SSOP (DB)
Reel of 2000
AM26C31CDBR
26C31
PDIP (N)
Tube of 25
AM26C31IN
AM26C31IN
Tube of 40
AM26C31ID
Reel of 2500
AM26C31IDR
SOP (NS)
Reel of 2000
AM26C31INSR
26C31I
SSOP (DB)
Reel of 2000
AM26C31IDBR
26C31I
TSSOP (PW)
Tube of 90
AM26C31IPW
26C31I
Tube of 40
AM26C31QD
Reel of 2500
AM26C31QDR
CDIP (J)
Tube of 25
AM26C31MJ
AM26C31MJ
CFP (W)
Tube of 150
AM26C31MW
AM26C31MW
LCCC (FK)
Tube of 55
AM26C31MFK
AM26C31MFK
SOIC (D)
SOIC (D)
–40°C to 85°C
(2)
SOIC (D)
AM26C31CN
AM26C31C
AM26C31I
AM26C31QD
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Table 1. FUNCTION TABLE
(Each Driver) (1)
INPUT
A
(1)
2
ENABLES
OUTPUTS
G
G
Y
Z
H
H
X
H
L
H
L
H
X
L
H
X
L
H
L
L
X
L
L
H
X
L
H
Z
Z
H = High level, L = Low level, X = Irrelevant,
Z = High impedance (off)
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Product Folder Link(s): AM26C31
AM26C31
SLLS103N – DECEMBER 1990 – REVISED OCTOBER 2011
www.ti.com
LOGIC DIAGRAM (POSITIVE LOGIC)
4
G
G
12
2
1
1A
2A
3A
3
6
7
5
10
9
11
14
4A
15
13
1Y
1Z
2Y
2Z
3Y
3Z
4Y
4Z
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
SCHEMATICS OF INPUTS AND OUTPUTS
EQUIVALENT OF EACH INPUT
TYPICAL OF ALL OUTPUTS
VCC
VCC
Input
Output
GND
GND
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Product Folder Link(s): AM26C31
3
AM26C31
SLLS103N – DECEMBER 1990 – REVISED OCTOBER 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
(2)
MAX
UNIT
VCC
Supply voltage range
–0.5
7
V
VI
Input voltage range
–0.5
VCC + 0.5
V
VID
Differential input voltage range
–14
14
V
VO
Output voltage range
–0.5
7
IIK
IOK
Input or output clamp current
IO
Output current
VCC current
Package thermal impedance
(3) (4)
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
mA
±150
mA
200
mA
–200
GND current
θJA
±20
mA
D package
73
DB package
82
N package
67
NS package
64
PW package
108
–65
°C/W
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to the network ground terminal.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
MIN
4.5
NOM
MAX
5
5.5
UNIT
VCC
Supply voltage
VID
Differential input voltage
VIH
High-level input voltage
VIL
Low-level input voltage
0.8
V
IOH
High-level output current
–20
mA
IOL
Low-level output current
20
mA
±7
TA
4
Operating free-air temperature
V
2
AM26C31C
0
V
70
AM26C31I
–40
85
AM26C31Q
–40
125
AM26C31M
–55
125
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V
°C
Copyright © 1990–2011, Texas Instruments Incorporated
Product Folder Link(s): AM26C31
AM26C31
SLLS103N – DECEMBER 1990 – REVISED OCTOBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
AM26C31C
AM26C31I
TEST CONDITIONS
MIN TYP (1)
UNIT
MAX
VOH
High-level output voltage
IO = –20 mA
VOL
Low-level output voltage
IO = 20 mA
VOD
Differential output voltage magnitude
RL = 100 Ω,
See Figure 1
Δ|VOD|
Change in magnitude of differential output voltage (2)
RL = 100 Ω,
See Figure 1
±0.4
V
VOC
Common-mode output voltage
RL = 100 Ω,
See Figure 1
3
V
RL = 100 Ω,
See Figure 1
±0.4
V
±1
μA
(2)
2.4
0.2
Δ|VOC|
Change in magnitude of common-mode output voltage
II
Input current
VI = VCC or GND
IO(off)
Driver output current with power off
VCC = 0
IOS
Driver output short-circuit current
VO = 0
IOZ
High-impedance off-state output current
ICC
Quiescent supply current
Ci
Input capacitance
3.4
2
3.1
VO = 6 V
–100
–30
–150
VO = 2.5 V
20
VO = 0.5 V
–20
(3)
IO = 0
VI = 2.4 V or 0.5
V (3)
V
V
100
VO = –0.25 V
VI = 0 or 5 V
(1)
(2)
V
0.4
μA
mA
μA
100
μA
3
mA
1.5
6
pF
All typical values are at VCC = 5 V and TA = 25°C.
Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level
to a low level.
This parameter is measured per input. All other inputs are at 0 or 5 V.
SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tPLH
Propagation delay time, low-to-high-level output
tPHL
Propagation delay time, high-to-low-level output
tsk(p)
tr(OD), tf(OD)
tPZH
Output enable time to high level
tPZL
Output enable time to low level
tPHZ
Output disable time from high level
tPLZ
Output disable time from low level
Cpd
Power dissipation capacitance (each driver) (2)
(1)
(2)
AM26C31C
AM26C31I
UNIT
MIN
TYP (1)
MAX
3
7
12
3
7
12
S1 is open,
See Figure 2
Pulse skew time (|tPLH – tPHL|)
S1 is open,
See Figure 2
0.5
4
ns
Differential output rise and fall times
S1 is open,
See Figure 3
5
10
ns
10
19
10
19
7
16
7
16
S1 is closed,
See Figure 4
S1 is closed,
See Figure 4
S1 is open,
See Figure 2
170
ns
ns
ns
pF
All typical values are at VCC = 5 V and TA = 25°C.
Cpd is used to estimate the switching losses according to PD = Cpd × VCC 2 × f, where f is the switching frequency.
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5
AM26C31
SLLS103N – DECEMBER 1990 – REVISED OCTOBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
AM26C31Q
AM26C31M
TEST CONDITIONS
MIN TYP (1)
UNIT
MAX
VOH
High-level output voltage
IO = –20 mA
VOL
Low-level output voltage
IO = 20 mA
VOD
Differential output voltage magnitude
RL = 100 Ω,
See Figure 1
Δ|VOD|
Change in magnitude of differential output voltage (2)
RL = 100 Ω,
See Figure 1
±0.4
V
VOC
Common-mode output voltage
RL = 100 Ω,
See Figure 1
3
V
RL = 100 Ω,
See Figure 1
±0.4
V
±1
μA
(2)
2.2
0.2
Δ|VOC|
Change in magnitude of common-mode output voltage
II
Input current
VI = VCC or GND
IO(off)
Driver output current with power off
VCC = 0
IOS
Driver output short-circuit current
VO = 0
IOZ
High-impedance off-state output current
ICC
Quiescent supply current
Ci
Input capacitance
(1)
(2)
(3)
3.4
2
V
0.4
3.1
VO = 6 V
V
100
VO = –0.25 V
–100
–170
VO = 2.5 V
20
VO = 0.5 V
–20
IO = 0
V
μA
mA
μA
VI = 0 or 5 V
100
μA
VI = 2.4 V or 0.5
V (3)
3.2
mA
6
pF
All typical values are at VCC = 5 V and TA = 25°C.
Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level
to a low level.
This parameter is measured per input. All other inputs are at 0 or 5 V.
SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
AM26C31Q
AM26C31M
MIN
tPLH
Propagation delay time, low-to-high-level output
tPHL
Propagation delay time, high-to-low-level output
tsk(p)
tr(OD), tf(OD)
tPZH
Output enable time to high level
tPZL
Output enable time to low level
tPHZ
Output disable time from high level
tPLZ
Output disable time from low level
Cpd
Power dissipation capacitance (each driver) (2)
(1)
(2)
6
UNIT
TYP (1)
MAX
7
12
6.5
12
S1 is open,
See Figure 2
Pulse skew time (|tPLH – tPHL|)
S1 is open,
See Figure 2
0.5
4
ns
Differential output rise and fall times
S1 is open,
See Figure 3
5
12
ns
10
19
10
19
7
16
7
16
S1 is closed,
See Figure 4
S1 is closed,
See Figure 4
S1 is open,
See Figure 2
100
ns
ns
ns
pF
All typical values are at VCC = 5 V and TA = 25°C.
Cpd is used to estimate the switching losses according to PD = Cpd × VCC 2 × f, where f is the switching frequency.
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Product Folder Link(s): AM26C31
AM26C31
SLLS103N – DECEMBER 1990 – REVISED OCTOBER 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 1. Differential and Common-Mode Output Voltages
A.
C1, C2, and C3 include probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and
tr, tf ≤ 6 ns.
C2 = 40 pF
Input
RL/2
500 Ω
C1 =
40 pF
1.5 V
S1
C3 = 40 pF
RL/2
See Note A
TEST CIRCUIT
3V
1.3 V
0V
Input A
(see Note B)
tPLH
Output Y
50%
tPHL
50%
1.3 V
tsk(p)
Output Z
50%
tsk(p)
50%
1.3 V
tPHL
tPLH
Figure 2. Propagation Delay Time and Skew Waveforms and Test Circuit
A.
C1, C2, and C3 include probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and
tr, tf ≤ 6 ns.
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AM26C31
SLLS103N – DECEMBER 1990 – REVISED OCTOBER 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 3. Differential-Output Rise- and Fall-Time Waveforms and Test Circuit
A.
C1, C2, and C3 include probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and
tr, tf ≤ 6 ns.
C.
Each enable is tested separately.
Output
C2 =
40 pF
0V
3V
Enable Inputs
(see Note B)
Input A
C1 =
40 pF
C3 =
40 pF
G
G
50 Ω
500 Ω
1.5 V
S1
50 Ω
Output
See Note A
TEST CIRCUIT
Enable G Input
(see Note C)
3V
1.3 V1.3 V
Enable G Input
Output WIth
0 V to A Input
0V
1.5 V
VOL + 0.3 V
VOL
tPLZ
Output WIth
3 V to A Input
0.8 V
tPZL
VOH
VOH - 0.3 V
2V
1.5 V
tPHZ
tPZH
VOLTAGE WAVEFORMS
Figure 4. Output Enable- and Disable-Time Waveforms and Test Circuit
8
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AM26C31
SLLS103N – DECEMBER 1990 – REVISED OCTOBER 2011
www.ti.com
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
SWITCHING FREQUENCY
Figure 5.
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9
AM26C31
SLLS103N – DECEMBER 1990 – REVISED OCTOBER 2011
www.ti.com
REVISION HISTORY
Changes from Revision M (June 2008) to Revision N
•
10
Page
Changed units to mA from µA to fix units typo. .................................................................................................................... 4
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Product Folder Link(s): AM26C31
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-9163901M2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629163901M2A
AM26C31M
5962-9163901MEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9163901ME
A
AM26C31M
5962-9163901MFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9163901MF
A
AM26C31M
5962-9163901Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629163901Q2A
AM26C31
MFKB
5962-9163901QEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9163901QE
A
AM26C31MJB
5962-9163901QFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9163901QF
A
AM26C31MWB
AM26C31CD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C31CDBLE
OBSOLETE
SSOP
DB
16
TBD
Call TI
Call TI
0 to 70
AM26C31CDBR
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
26C31
AM26C31CDBRG4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
26C31
AM26C31CDE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C31C
AM26C31CDG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C31C
AM26C31CDR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C31C
AM26C31CDRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C31C
Addendum-Page 1
AM26C31C
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
AM26C31CDRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C31C
AM26C31CN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
AM26C31CN
AM26C31CNE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
AM26C31CN
AM26C31CNSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
26C31
AM26C31CNSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
26C31
AM26C31ID
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AM26C31IDBLE
OBSOLETE
SSOP
DB
16
TBD
Call TI
Call TI
-40 to 85
AM26C31IDBR
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C31I
AM26C31IDBRE4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C31I
AM26C31IDBRG4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C31I
AM26C31IDE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AM26C31I
AM26C31IDG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AM26C31I
AM26C31IDR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
AM26C31I
AM26C31IDRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AM26C31I
AM26C31IDRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AM26C31I
AM26C31IN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
AM26C31IN
AM26C31INE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
AM26C31IN
AM26C31INSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C31I
Addendum-Page 2
AM26C31I
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
AM26C31IPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C31I
AM26C31IPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C31I
AM26C31IPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C31I
AM26C31MFKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629163901Q2A
AM26C31
MFKB
AM26C31MJB
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9163901QE
A
AM26C31MJB
AM26C31MWB
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9163901QF
A
AM26C31MWB
AM26C31QD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
AM26C31Q
AM26C31QDG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
26C31Q
AM26C31QDR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
AM26C31Q
AM26C31QDRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
26C31Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF AM26C31, AM26C31M :
• Catalog: AM26C31
• Enhanced Product: AM26C31-EP, AM26C31-EP
• Military: AM26C31M
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
AM26C31CDBR
Package Package Pins
Type Drawing
SSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
12.0
16.0
Q1
DB
16
2000
330.0
16.4
8.2
6.6
2.5
AM26C31CDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26C31IDBR
SSOP
DB
16
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
AM26C31IDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26C31IDR
SOIC
D
16
2500
330.0
16.8
6.5
10.3
2.1
8.0
16.0
Q1
AM26C31IDRG4
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26C31IPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
AM26C31QDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26C31QDRG4
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
AM26C31CDBR
SSOP
DB
16
2000
367.0
367.0
38.0
AM26C31CDR
SOIC
D
16
2500
333.2
345.9
28.6
AM26C31IDBR
SSOP
DB
16
2000
367.0
367.0
38.0
AM26C31IDR
SOIC
D
16
2500
333.2
345.9
28.6
AM26C31IDR
SOIC
D
16
2500
364.0
364.0
27.0
AM26C31IDRG4
SOIC
D
16
2500
333.2
345.9
28.6
AM26C31IPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
AM26C31QDR
SOIC
D
16
2500
367.0
367.0
38.0
AM26C31QDRG4
SOIC
D
16
2500
333.2
345.9
28.6
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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• DALLAS, TEXAS 75265
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