AM3352BZCE30

Product Folder Order Now Technical Documents Tools & Software Support & Community Reference Design AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 AM335x Sitara™ Processors 1 Device Overview 1.1 Features 1 • Up to 1-GHz Sitara™ ARM® Cortex®-A8 32‑Bit RISC Processor – NEON™ SIMD Coprocessor – 32KB of L1 Instruction and 32KB of Data Cache With Single-Error Detection (Parity) – 256KB of L2 Cache With Error Correcting Code (ECC) – 176KB of On-Chip Boot ROM – 64KB of Dedicated RAM – Emulation and Debug - JTAG – Interrupt Controller (up to 128 Interrupt Requests) • On-Chip Memory (Shared L3 RAM) – 64KB of General-Purpose On-Chip Memory Controller (OCMC) RAM – Accessible to All Masters – Supports Retention for Fast Wakeup • External Memory Interfaces (EMIF) – mDDR(LPDDR), DDR2, DDR3, DDR3L Controller: – mDDR: 200-MHz Clock (400-MHz Data Rate) – DDR2: 266-MHz Clock (532-MHz Data Rate) – DDR3: 400-MHz Clock (800-MHz Data Rate) – DDR3L: 400-MHz Clock (800-MHz Data Rate) – 16-Bit Data Bus – 1GB of Total Addressable Space – Supports One x16 or Two x8 Memory Device Configurations – General-Purpose Memory Controller (GPMC) – Flexible 8-Bit and 16-Bit Asynchronous Memory Interface With up to Seven Chip Selects (NAND, NOR, Muxed-NOR, SRAM) – Uses BCH Code to Support 4-, 8-, or 16-Bit ECC – Uses Hamming Code to Support 1-Bit ECC – Error Locator Module (ELM) – Used in Conjunction With the GPMC to Locate Addresses of Data Errors from Syndrome Polynomials Generated Using a BCH Algorithm – Supports 4-, 8-, and 16-Bit per 512-Byte Block Error Location Based on BCH Algorithms • Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS) – Supports Protocols such as EtherCAT®, PROFIBUS, PROFINET, EtherNet/IP™, and More – Two Programmable Real-Time Units (PRUs) – 32-Bit Load/Store RISC Processor Capable of Running at 200 MHz – 8KB of Instruction RAM With Single-Error Detection (Parity) – 8KB of Data RAM With Single-Error Detection (Parity) – Single-Cycle 32-Bit Multiplier With 64-Bit Accumulator – Enhanced GPIO Module Provides ShiftIn/Out Support and Parallel Latch on External Signal – 12KB of Shared RAM With Single-Error Detection (Parity) – Three 120-Byte Register Banks Accessible by Each PRU – Interrupt Controller (INTC) for Handling System Input Events – Local Interconnect Bus for Connecting Internal and External Masters to the Resources Inside the PRU-ICSS – Peripherals Inside the PRU-ICSS: – One UART Port With Flow Control Pins, Supports up to 12 Mbps – One Enhanced Capture (eCAP) Module – Two MII Ethernet Ports that Support Industrial Ethernet, such as EtherCAT – One MDIO Port • Power, Reset, and Clock Management (PRCM) Module – Controls the Entry and Exit of Stand-By and Deep-Sleep Modes – Responsible for Sleep Sequencing, Power Domain Switch-Off Sequencing, Wake-Up Sequencing, and Power Domain Switch-On Sequencing – Clocks – Integrated 15- to 35-MHz High-Frequency Oscillator Used to Generate a Reference Clock for Various System and Peripheral Clocks – Supports Individual Clock Enable and Disable Control for Subsystems and Peripherals to Facilitate Reduced Power Consumption – Five ADPLLs to Generate System Clocks (MPU Subsystem, DDR Interface, USB and 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Peripherals [MMC and SD, UART, SPI, I2C], L3, L4, Ethernet, GFX [SGX530], LCD Pixel Clock) – Power – Two Nonswitchable Power Domains (RealTime Clock [RTC], Wake-Up Logic [WAKEUP]) – Three Switchable Power Domains (MPU Subsystem [MPU], SGX530 [GFX], Peripherals and Infrastructure [PER]) – Implements SmartReflex™ Class 2B for Core Voltage Scaling Based On Die Temperature, Process Variation, and Performance (Adaptive Voltage Scaling [AVS]) – Dynamic Voltage Frequency Scaling (DVFS) • Real-Time Clock (RTC) – Real-Time Date (Day-Month-Year-Day of Week) and Time (Hours-Minutes-Seconds) Information – Internal 32.768-kHz Oscillator, RTC Logic and 1.1-V Internal LDO – Independent Power-on-Reset (RTC_PWRONRSTn) Input – Dedicated Input Pin (EXT_WAKEUP) for External Wake Events – Programmable Alarm Can be Used to Generate Internal Interrupts to the PRCM (for Wakeup) or Cortex-A8 (for Event Notification) – Programmable Alarm Can be Used With External Output (PMIC_POWER_EN) to Enable the Power Management IC to Restore Non-RTC Power Domains • Peripherals – Up to Two USB 2.0 High-Speed DRD (DualRole Device) Ports With Integrated PHY – Up to Two Industrial Gigabit Ethernet MACs (10, 100, 1000 Mbps) – Integrated Switch – Each MAC Supports MII, RMII, RGMII, and MDIO Interfaces – Ethernet MACs and Switch Can Operate Independent of Other Functions – IEEE 1588v1 Precision Time Protocol (PTP) – Up to Two Controller-Area Network (CAN) Ports – Supports CAN Version 2 Parts A and B – Up to Two Multichannel Audio Serial Ports (McASPs) – Transmit and Receive Clocks up to 50 MHz – Up to Four Serial Data Pins per McASP Port With Independent TX and RX Clocks – Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats 2 Device Overview www.ti.com – – – – – – – – – – Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats) – FIFO Buffers for Transmit and Receive (256 Bytes) Up to Six UARTs – All UARTs Support IrDA and CIR Modes – All UARTs Support RTS and CTS Flow Control – UART1 Supports Full Modem Control Up to Two Master and Slave McSPI Serial Interfaces – Up to Two Chip Selects – Up to 48 MHz Up to Three MMC, SD, SDIO Ports – 1-, 4- and 8-Bit MMC, SD, SDIO Modes – MMCSD0 has Dedicated Power Rail for 1.8‑V or 3.3-V Operation – Up to 48-MHz Data Transfer Rate – Supports Card Detect and Write Protect – Complies With MMC4.3, SD, SDIO 2.0 Specifications Up to Three I2C Master and Slave Interfaces – Standard Mode (up to 100 kHz) – Fast Mode (up to 400 kHz) Up to Four Banks of General-Purpose I/O (GPIO) Pins – 32 GPIO Pins per Bank (Multiplexed With Other Functional Pins) – GPIO Pins Can be Used as Interrupt Inputs (up to Two Interrupt Inputs per Bank) Up to Three External DMA Event Inputs that can Also be Used as Interrupt Inputs Eight 32-Bit General-Purpose Timers – DMTIMER1 is a 1-ms Timer Used for Operating System (OS) Ticks – DMTIMER4–DMTIMER7 are Pinned Out One Watchdog Timer SGX530 3D Graphics Engine – Tile-Based Architecture Delivering up to 20 Million Polygons per Second – Universal Scalable Shader Engine (USSE) is a Multithreaded Engine Incorporating Pixel and Vertex Shader Functionality – Advanced Shader Feature Set in Excess of Microsoft VS3.0, PS3.0, and OGL2.0 – Industry Standard API Support of Direct3D Mobile, OGL-ES 1.1 and 2.0, and OpenMax – Fine-Grained Task Switching, Load Balancing, and Power Management – Advanced Geometry DMA-Driven Operation for Minimum CPU Interaction Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com – – – – SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 – Programmable High-Quality Image AntiAliasing – Fully Virtualized Memory Addressing for OS Operation in a Unified Memory Architecture LCD Controller – Up to 24-Bit Data Output; 8 Bits per Pixel (RGB) – Resolution up to 2048 × 2048 (With Maximum 126-MHz Pixel Clock) – Integrated LCD Interface Display Driver (LIDD) Controller – Integrated Raster Controller – Integrated DMA Engine to Pull Data from the External Frame Buffer Without Burdening the Processor via Interrupts or a Firmware Timer – 512-Word Deep Internal FIFO – Supported Display Types: – Character Displays - Uses LIDD Controller to Program these Displays – Passive Matrix LCD Displays - Uses LCD Raster Display Controller to Provide Timing and Data for Constant Graphics Refresh to a Passive Display – Active Matrix LCD Displays - Uses External Frame Buffer Space and the Internal DMA Engine to Drive Streaming Data to the Panel 12-Bit Successive Approximation Register (SAR) ADC – 200K Samples per Second – Input can be Selected from any of the Eight Analog Inputs Multiplexed Through an 8:1 Analog Switch – Can be Configured to Operate as a 4-Wire, 5Wire, or 8-Wire Resistive Touch Screen Controller (TSC) Interface Up to Three 32-Bit eCAP Modules – Configurable as Three Capture Inputs or Three Auxiliary PWM Outputs Up to Three Enhanced High-Resolution PWM Modules (eHRPWMs) – Dedicated 16-Bit Time-Base Counter With Time and Frequency Controls – Configurable as Six Single-Ended, Six DualEdge Symmetric, or Three Dual-Edge Asymmetric Outputs • • • • • • • – Up to Three 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules Device Identification – Contains Electrical Fuse Farm (FuseFarm) of Which Some Bits are Factory Programmable – Production ID – Device Part Number (Unique JTAG ID) – Device Revision (Readable by Host ARM) Debug Interface Support – JTAG and cJTAG for ARM (Cortex-A8 and PRCM), PRU-ICSS Debug – Supports Device Boundary Scan – Supports IEEE 1500 DMA – On-Chip Enhanced DMA Controller (EDMA) has Three Third-Party Transfer Controllers (TPTCs) and One Third-Party Channel Controller (TPCC), Which Supports up to 64 Programmable Logical Channels and Eight QDMA Channels. EDMA is Used for: – Transfers to and from On-Chip Memories – Transfers to and from External Storage (EMIF, GPMC, Slave Peripherals) Inter-Processor Communication (IPC) – Integrates Hardware-Based Mailbox for IPC and Spinlock for Process Synchronization Between Cortex-A8, PRCM, and PRU-ICSS – Mailbox Registers that Generate Interrupts – Four Initiators (Cortex-A8, PRCM, PRU0, PRU1) – Spinlock has 128 Software-Assigned Lock Registers Security – Crypto Hardware Accelerators (AES, SHA, RNG) – Secure Boot (optional; requires custom part engagement with TI) Boot Modes – Boot Mode is Selected Through Boot Configuration Pins Latched on the Rising Edge of the PWRONRSTn Reset Input Pin Packages: – 298-Pin S-PBGA-N298 Via Channel Package (ZCE Suffix), 0.65-mm Ball Pitch – 324-Pin S-PBGA-N324 Package (ZCZ Suffix), 0.80-mm Ball Pitch Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Device Overview 3 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 1.2 • • • • • Applications Gaming Peripherals Home and Industrial Automation Consumer Medical Appliances Printers Smart Toll Systems 1.3 www.ti.com • • • • Connected Vending Machines Weighing Scales Educational Consoles Advanced Toys Description The AM335x microprocessors, based on the ARM Cortex-A8 processor, are enhanced with image, graphics processing, peripherals and industrial interface options such as EtherCAT and PROFIBUS. The devices support high-level operating systems (HLOS). Processor SDK Linux® and TI-RTOS are available free of charge from TI. The AM335x microprocessor contains the subsystems shown in the Functional Block Diagram and a brief description of each follows: The contains the subsystems shown in the Functional Block Diagram and a brief description of each follows: The microprocessor unit (MPU) subsystem is based on the ARM Cortex-A8 processor and the PowerVR SGX™ Graphics Accelerator subsystem provides 3D graphics acceleration to support display and gaming effects. The PRU-ICSS is separate from the ARM core, allowing independent operation and clocking for greater efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces and real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others. Additionally, the programmable nature of the PRU-ICSS, along with its access to pins, events and all system-on-chip (SoC) resources, provides flexibility in implementing fast, real-time responses, specialized data handling operations, custom peripheral interfaces, and in offloading tasks from the other processor cores of SoC. Device Information (1) PART NUMBER PACKAGE BODY SIZE AM3359ZCZ NFBGA (324) 15.0 mm × 15.0 mm AM3358ZCZ NFBGA (324) 15.0 mm × 15.0 mm AM3357ZCZ NFBGA (324) 15.0 mm × 15.0 mm AM3356ZCZ, AM3356ZCE NFBGA (324), NFBGA (298) 15.0 mm × 15.0 mm, 13.0 mm × 13.0 mm AM3354ZCZ, AM3354ZCE NFBGA (324), NFBGA (298) 15.0 mm × 15.0 mm, 13.0 mm × 13.0 mm AM3352ZCZ, AM3352ZCE NFBGA (324), NFBGA (298) 15.0 mm × 15.0 mm, 13.0 mm × 13.0 mm NFBGA (298) 13.0 mm × 13.0 mm AM3351ZCE (1) 4 For more information, see Section 9, Mechanical, Packaging, and Orderable Information. Device Overview Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 1.4 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Functional Block Diagram Figure 1-1 shows the AM335x microprocessor functional block diagram. Graphics Display PowerVR SGX 3D GFX 24-bit LCD controller Touch screen controller 32KB and 32KB L1 + SED Crypto PRU-ICSS 256KB L2 + ECC 64KB shared RAM ® ARM ® Cortex -A8 Up to 1 Ghz 176KB ROM 64KB RAM EtherCAT, PROFINET, EtherNet/IP, and more L3 and L4 interconnect Serial System UART x6 eDMA SPI x2 Timers x8 2 I C x3 McASP x2 (4 channel) CAN x2 (Ver. 2 A and B) USB 2.0 HS DRD + PHY x2 eCAP x3 ADC (8 channel) 12-bit SAR WDT RTC Parallel MMC, SD and SDIO x3 GPIO JTAG eHRPWM x3 eQEP x3 PRCM EMAC (2-port) 10M, 100M, 1G IEEE 1588v1, and switch (MII, RMII, RGMII) Crystal Oscillator x2 Memory interface mDDR(LPDDR), DDR2, DDR3, DDR3L (16-bit; 200, 266, 400, 400 MHz) NAND and NOR (16-bit ECC) Figure 1-1. AM335x Functional Block Diagram Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Device Overview 5 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table of Contents 1 Device Overview ......................................... 1 Features .............................................. 1 1.2 Applications ........................................... 4 7.3 OPP50 Support .................................... 115 Description ............................................ 4 7.4 Controller Area Network (CAN) .................... 116 ........................... 5 Revision History ......................................... 7 Device Comparison ..................................... 8 3.1 Related Products ..................................... 9 Terminal Configuration and Functions ............ 10 4.1 Pin Diagram ......................................... 10 4.2 Pin Attributes ........................................ 18 4.3 Signal Descriptions .................................. 50 Specifications ........................................... 79 5.1 Absolute Maximum Ratings ......................... 79 5.2 ESD Ratings ........................................ 80 5.3 Power-On Hours (POH) ............................. 81 5.4 Operating Performance Points (OPPs) ............. 81 5.5 Recommended Operating Conditions ............... 84 5.6 Power Consumption Summary...................... 86 5.7 DC Electrical Characteristics ........................ 88 7.5 7.6 DMTimer ........................................... 117 Ethernet Media Access Controller (EMAC) and Switch .............................................. 118 7.7 External Memory Interfaces ........................ 126 7.8 I2C .................................................. 189 1.4 4 5 Functional Block Diagram 5.8 7 6.2 Clock Specifications................................ 106 Peripheral Information and Timings .............. 115 7.1 6 Parameter Information ............................. 115 Table of Contents LCD Controller (LCDC) 7.11 Multichannel Audio Serial Port (McASP) 7.15 8 192 208 213 219 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS) 222 Universal Asynchronous Receiver Transmitter (UART) ............................................. 231 8.1 Device Nomenclature .............................. 234 8.2 Tools and Software ................................ 235 8.3 Documentation Support ............................ 239 8.4 Related Links 242 8.5 Support Resources 242 8.7 8.8 9 ............................ .......... Multichannel Serial Port Interface (McSPI) ........ Multimedia Card (MMC) Interface ................. Device and Documentation Support .............. 234 8.6 Power and Clocking ................................... 98 Power Supplies ...................................... 98 JTAG Electrical Data and Timing .................. 190 7.10 7.13 7.14 External Capacitors ................................. 93 Touch Screen Controller and Analog-to-Digital Subsystem Electrical Parameters ................... 96 6.1 7.9 7.12 Thermal Resistance Characteristics for ZCE and ZCZ Packages ...................................... 92 5.9 5.10 6 Recommended Clock and Control Signal Transition Behavior............................................ 115 1.1 1.3 2 3 7.2 ...................................... ................................ Trademarks ........................................ Electrostatic Discharge Caution ................... Glossary............................................ 243 243 243 Mechanical, Packaging, and Orderable Information ............................................. 244 9.1 Via Channel ........................................ 244 9.2 Packaging Information ............................. 244 Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from December 1, 2018 to March 31, 2020 (from K Revision (December 2018) to L Revision) • • • • • • • • • • • • • • • • Page Changed IEEE 1588v2 feature to IEEE 1588v1. ................................................................................ 2 Updated Secure Boot feature description. ........................................................................................ 3 Updated AM335x Functional Block Diagram. .................................................................................... 5 Added U16 to rmii2_crs_dv Signal in the GEMAC_CPSW/RMII2 Signals Description table. ............................. 71 Updated ADC Clock Frequency in the TSC_ADC Electrical Parameters table. ............................................ 97 Updated DCAN Timing Conditions table. ...................................................................................... 116 Updated DMTimer Timing Conditions table. .................................................................................. 117 Updated Switching Characteristics for MDIO_DATA.......................................................................... 119 Updated MDIO_DATA Timing - Output Mode image.......................................................................... 119 Added Transition time, RD and Transition time, RX_CTL to Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL - RGMII Mode. ................................................................................................. 124 Updated GPMC and NOR Flash—Synchronous Burst Read—4x16-Bit (GpmcFCLKDivider = 0) image. ............ 132 Updated GPMC and Multiplexed NOR Flash—Synchronous Burst Write image. ........................................ 134 Updated JTAG Timing Conditions table. ....................................................................................... 191 Updated MMC[x]_CLK (Output) Timing image. ................................................................................ 220 Updated PRU-ICSS MDIO Switching Characteristics - MDIO_DATA ...................................................... 228 Updated PRU-ICSS MDIO_DATA Timing – Output Mode image. .......................................................... 228 Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Revision History 7 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 3 Device Comparison Table 3-1 lists the features supported across different AM335x devices. Table 3-1. Device Features Comparison FUNCTION ARM Cortex-A8 Frequency(1) MIPS(2) AM3351 AM3352 AM3354 AM3356 AM3357 AM3358 AM3359 Yes Yes Yes Yes Yes Yes Yes 300 MHz 600 MHz 300 MHz 600 MHz 800 MHz 1000 MHz 600 MHz 800 MHz 1000 MHz 300 MHz 600 MHz 800 MHz 300 MHz 600 MHz 800 MHz 600 MHz 800 MHz 1000 MHz 800 MHz 600 1200 600 1200 1600 2000 1200 1600 2000 600 1200 1600 600 1200 1600 1200 1600 2000 1600 On-chip L1 cache 64KB 64KB 64KB 64KB 64KB 64KB 64KB On-chip L2 cache 256KB 256KB 256KB 256KB 256KB 256KB 256KB — — 3D — — 3D 3D Crypto accelerator Crypto accelerator Crypto accelerator Crypto accelerator Crypto accelerator Crypto accelerator Crypto accelerator Features including all Industrial protocols Features including basic Industrial protocols Features including all Industrial protocols 128KB Graphics accelerator (SGX530) Hardware acceleration — — — Features including basic Industrial protocols; ZCE: Limited PRU I/Os pinned out 128KB 128KB 128KB 128KB 128KB 128KB LCD LCD LCD LCD LCD LCD LCD 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (GPMC, NAND flash, NOR flash, SRAM) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) 1 16-bit (LPDDR-400, DDR2-532, DDR3-800) Universal serial bus (USB) ZCE: 1 port ZCE: 1 port ZCZ: 2 ports ZCE: 1 port ZCZ: 2 ports ZCE: 1 port ZCZ: 2 ports No ZCE Available ZCZ: 2 ports No ZCE Available ZCZ: 2 ports No ZCE Available ZCZ: 2 ports Ethernet media access controller (EMAC) with 2port switch 10/100/1000 ZCE: 1 port 10/100/1000 ZCE: 1 port ZCZ: 2 ports 10/100/1000 ZCE: 1 port ZCZ: 2 ports 10/100/1000 ZCE: 1 port ZCZ: 2 ports 10/100/1000 No ZCE Available ZCZ: 2 ports 10/100/1000 No ZCE Available ZCZ: 2 ports 10/100/1000 No ZCE Available ZCZ: 2 ports Multimedia card (MMC) 3 3 3 3 3 3 3 Controller-area network (CAN) — 2 2 2 2 2 2 Universal asynchronous receiver and transmitter (UART) 6 6 6 6 6 6 6 Analog-to-digital converter (ADC) 8-ch 12-bit 8-ch 12-bit 8-ch 12-bit 8-ch 12-bit 8-ch 12-bit 8-ch 12-bit 8-ch 12-bit Enhanced high-resolution PWM modules (eHRPWM) 3 3 3 3 3 3 3 Enhanced capture modules (eCAP) 3 3 3 3 3 3 3 Enhanced quadrature encoder pulse (eQEP) 3 3 3 3 3 3 3 Real-time clock (RTC) 1 1 1 1 1 1 1 Inter-integrated circuit (I2C) 3 3 3 3 3 3 3 Programmable real-time unit subsystem and industrial communication subsystem (PRU-ICSS) On-chip memory Display options General-purpose memory DRAM(3) 8 Device Comparison Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 3-1. Device Features Comparison (continued) FUNCTION AM3351 AM3352 AM3354 AM3356 AM3357 AM3358 AM3359 Multichannel audio serial port (McASP) 2 2 2 2 2 2 2 Multichannel serial port interface (McSPI) 2 2 2 2 2 2 2 Enhanced direct memory access (EDMA) 64-Ch 64-Ch 64-Ch 64-Ch 64-Ch 64-Ch 64-Ch Input/output (I/O) supply 1.8 V, 3.3 V 1.8 V, 3.3 V 1.8 V, 3.3 V 1.8 V, 3.3 V 1.8 V, 3.3 V 1.8 V, 3.3 V 1.8 V, 3.3 V Operating temperature range 0 to 90°C –40 to 105°C -40 to 125°C(4) –40 to 105°C –40 to 90°C 0 to 90°C –40 to 105°C –40 to 90°C 0 to 90°C –40 to 105°C –40 to 90°C 0 to 90°C –40 to 105°C –40 to 90°C –40 to 105°C –40 to 90°C 0 to 90°C –40 to 105°C –40 to 90°C DEV_FEATURE register value(5) 0x00FC0302 0x00FC0382 0x20FC0382 0x00FD0383 0x00FF0383 0x20FD0383 0x20FF0383 (1) Frequencies listed correspond to silicon revision 2.x. Earlier silicon revisions support 275 MHz, 500 MHz, 600 MHz, and 720 MHz. (2) MIPS listed correspond to silicon revision 2.x. Earlier silicon revisions support 560, 1000, 1200, and 1440. (3) DRAM speeds listed are data rates. (4) Industrial extended temperature only supported for 300-MHz and 600-MHz frequencies. (5) For more details about the DEV_FEATURE register, see the AM335x TRM. 3.1 Related Products For information about other devices in this family of products, see the following links: Sitara Processors Scalable processors based on ARM Cortex-A cores with flexible peripherals, connectivity and unified software support – perfect for sensors to servers. TI's ARM Cortex-A8 Advantage The ARM Cortex-A8 core is highly-optimized by ARM for performance and power efficiency. With the ability to scale in speed from 300 MHz to 1.35 GHz, the ARM Cortex-A8-based processor can meet the requirements for power optimized devices with a power budget of less than the Cortex-A8 core a dual-issue superscalar, achieving twice the instructions executed per clock cycle at 2 DMIPS/MHz. AM335x Sitara Processors Scalable ARM Cortex-A8-based core from 300 MHz up to 1 GHz, 3D graphics option for enhanced user interface, dual-core PRU-ICSS for industrial Ethernet protocols and position feedback control, and premium secure boot option. Companion Products for AM335x Sitara Processors Review products that are frequently purchased or used with this product. TI Designs for AM335x Sitara Processors The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor and connectivity. Created by TI experts to help you jump start your system design, all TI Designs include schematic or block diagrams, BOMs and design files to speed your time to market. Search and download designs at ti.com/tidesigns. Device Comparison Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 9 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 4 Terminal Configuration and Functions 4.1 Pin Diagram NOTE The terms 'ball', 'pin', and 'terminal' are used interchangeably throughout the document. An attempt is made to use 'ball' only when referring to the physical package. 4.1.1 ZCE Package Pin Maps (Top View) The pin maps that follow show the pin assignments on the ZCE package in three sections (left, middle, and right). 10 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-1. ZCE Pin Map [Section Left - Top View] A B C D E F 19 VSS I2C0_SCL UART1_TXD UART1_RTSn UART0_RXD UART0_CTSn 18 SPI0_SCLK SPI0_D0 I2C0_SDA UART1_RXD ECAP0_IN_PWM0_OUT UART0_RTSn 17 SPI0_CS0 SPI0_D1 EXTINTn XXXX UART1_CTSn UART0_TXD 16 WARMRSTn SPI0_CS1 XXXX XXXX XXXX VDDS 15 EMU0 XDMA_EVENT_INTR1 XDMA_EVENT_INTR0 XXXX PWRONRSTn XXXX 14 TDO TCK TMS EMU1 XXXX VDDSHV6 13 TRSTn TDI CAP_VBB_MPU CAP_VDD_SRAM_MPU VDDSHV6 VSS 12 AIN7 AIN5 VDDS_SRAM_MPU_BB VDDS VDDSHV6 VSS 11 AIN1 AIN3 XXXX XXXX VDDSHV6 VDD_CORE 10 AIN6 CAP_VDD_SRAM_CORE VDDS_SRAM_CORE_BG VSS VSS XXXX 9 VREFP VREFN XXXX XXXX VSS VDD_CORE 8 AIN2 AIN0 AIN4 VSSA_ADC VSS VSS 7 RTC_KALDO_ENn RTC_PWRONRSTn PMIC_POWER_EN VDDA_ADC VSS VSS 6 RTC_XTALIN RESERVED VDDS_RTC CAP_VDD_RTC XXXX VSS 5 RTC_XTALOUT EXT_WAKEUP VDDS_PLL_DDR XXXX DDR_A4 XXXX 4 DDR_WEn DDR_BA2 XXXX XXXX XXXX DDR_A12 3 DDR_BA0 DDR_A3 DDR_A8 XXXX DDR_A15 DDR_A0 2 DDR_A5 DDR_A9 DDR_CK DDR_A7 DDR_A10 DDR_RASn 1 VSS DDR_A6 DDR_CKn DDR_A2 DDR_BA1 DDR_CASn Pin map section location Left Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 11 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com ZCE Pin Map [Section Middle - Top View] G H J K L M 19 MMC0_CLK MMC0_DAT3 MII1_COL MII1_RX_ER MII1_RX_DV MII1_RX_CLK 18 MMC0_DAT0 MMC0_DAT2 MII1_CRS RMII1_REF_CLK MII1_TXD0 MII1_TXD1 17 MMC0_CMD MMC0_DAT1 XXXX MII1_TX_EN XXXX MII1_TXD3 16 USB0_DRVVBUS VDDS_PLL_MPU XXXX VDD_CORE XXXX VDDS 15 VDDSHV4 VDDSHV4 VSS VDD_CORE VSS VDDSHV5 14 XXXX VDDSHV4 VSS XXXX VSS VDDSHV5 13 XXXX VDD_CORE VDD_CORE XXXX VDD_CORE VDD_CORE 12 VSS VDD_CORE VDD_CORE VSS VDD_CORE VDD_CORE 11 VDD_CORE VSS VSS VSS VSS VSS 10 XXXX VSS XXXX XXXX XXXX VSS 9 VDD_CORE VSS VSS VSS VSS VSS 8 VSS VDD_CORE VDD_CORE VSS VDD_CORE VDD_CORE 7 XXXX VDD_CORE VDD_CORE XXXX VDD_CORE VDD_CORE 6 XXXX VDDS_DDR VSS XXXX VSS VDDS_DDR 5 VDDS_DDR VDDS_DDR VSS VDDS_DDR VSS VDDS_DDR 4 DDR_A11 DDR_VREF XXXX VDDS_DDR XXXX DDR_D11 3 DDR_CKE DDR_A14 XXXX DDR_DQM1 XXXX DDR_D10 2 DDR_RESETn DDR_CSn0 DDR_A1 DDR_D8 DDR_DQSn1 DDR_D12 1 DDR_ODT DDR_A13 DDR_VTP DDR_D9 DDR_DQS1 DDR_D13 Pin map section location Middle 12 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 ZCE Pin Map [Section Right - Top View] N P R T U V W 19 MII1_TX_CLK MII1_RXD1 MDC USB0_VBUS USB0_DP USB0_ID VSS 18 MII1_TXD2 MII1_RXD0 VDDA3P3V_USB0 USB0_CE USB0_DM GPMC_BEn1 GPMC_WPn 17 MII1_RXD3 MDIO VDDA1P8V_USB0 XXXX GPMC_CSn3 GPMC_AD15 GPMC_AD14 16 MII1_RXD2 VSSA_USB XXXX XXXX XXXX GPMC_CLK GPMC_AD9 15 VDDSHV5 XXXX GPMC_WAIT0 XXXX GPMC_CSn2 GPMC_AD8 GPMC_AD7 14 XXXX VSS XXXX VDDS GPMC_AD6 GPMC_CSn1 GPMC_AD5 13 XXXX VSS VDDSHV1 GPMC_AD13 GPMC_AD12 GPMC_AD4 GPMC_AD3 12 VSS VSS VDDSHV1 GPMC_AD10 GPMC_AD11 GPMC_AD2 XTALOUT 11 VDD_CORE VDD_CORE VDDSHV1 XXXX XXXX VSS_OSC XTALIN 10 XXXX XXXX VSS VSS VDDS_OSC GPMC_ADVn_ALE GPMC_AD0 9 VDD_CORE VDD_CORE VDDSHV1 XXXX XXXX GPMC_AD1 GPMC_OEn_REn 8 VSS VSS VDDSHV1 VDDS_PLL_CORE_LCD GPMC_WEn GPMC_BEn0_CLE GPMC_CSn0 7 XXXX VSS VDDSHV6 LCD_HSYNC LCD_VSYNC LCD_DATA15 LCD_AC_BIAS_EN 6 XXXX VDDSHV6 XXXX VDDS LCD_DATA13 LCD_DATA12 LCD_DATA14 5 VDDS_DDR XXXX VPP XXXX LCD_DATA10 LCD_DATA11 LCD_PCLK 4 DDR_D0 DDR_D1 XXXX XXXX XXXX LCD_DATA8 LCD_DATA9 3 DDR_DQM0 DDR_D4 DDR_D7 XXXX LCD_DATA7 LCD_DATA6 LCD_DATA5 2 DDR_D14 DDR_D2 DDR_DQSn0 DDR_D6 LCD_DATA1 LCD_DATA3 LCD_DATA4 1 DDR_D15 DDR_D3 DDR_DQS0 DDR_D5 LCD_DATA0 LCD_DATA2 VSS Pin map section location Right Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 13 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.1.2 www.ti.com ZCZ Package Pin Maps (Top View) The pin maps that follow show the pin assignments on the ZCZ package in three sections (left, middle, and right). 14 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 ZCZ Pin Map [Section Left - Top View] A B C D E F 18 VSS EXTINTn ECAP0_IN_PWM0_OUT UART1_CTSn UART0_CTSn MMC0_DAT2 17 SPI0_SCLK SPI0_D0 I2C0_SDA UART1_RTSn UART0_RTSn MMC0_DAT3 16 SPI0_CS0 SPI0_D1 I2C0_SCL UART1_RXD UART0_TXD USB0_DRVVBUS 15 XDMA_EVENT_INTR0 PWRONRSTn SPI0_CS1 UART1_TXD UART0_RXD USB1_DRVVBUS 14 MCASP0_AHCLKX EMU1 EMU0 XDMA_EVENT_INTR1 VDDS VDDSHV6 13 MCASP0_ACLKX MCASP0_FSX MCASP0_FSR MCASP0_AXR1 VDDSHV6 VDD_MPU 12 TCK MCASP0_ACLKR MCASP0_AHCLKR MCASP0_AXR0 VDDSHV6 VDD_MPU 11 TDO TDI TMS CAP_VDD_SRAM_MPU VDDSHV6 VDD_MPU 10 WARMRSTn TRSTn CAP_VBB_MPU VDDS_SRAM_MPU_BB VDDSHV6 VDD_MPU 9 VREFN VREFP AIN7 CAP_VDD_SRAM_CORE VDDS_SRAM_CORE_BG VDDS 8 AIN6 AIN5 AIN4 VDDA_ADC VSSA_ADC VSS 7 AIN3 AIN2 AIN1 VDDS_RTC VDDS_PLL_DDR VDD_CORE 6 RTC_XTALIN AIN0 PMIC_POWER_EN CAP_VDD_RTC VDDS VDD_CORE 5 VSS_RTC RTC_PWRONRSTn EXT_WAKEUP DDR_A6 VDDS_DDR VDDS_DDR 4 RTC_XTALOUT RTC_KALDO_ENn DDR_BA0 DDR_A8 DDR_A2 DDR_A10 3 RESERVED DDR_BA2 DDR_A3 DDR_A15 DDR_A12 DDR_A0 2 VDD_MPU_MON DDR_WEn DDR_A4 DDR_CK DDR_A7 DDR_A11 1 VSS DDR_A5 DDR_A9 DDR_CKn DDR_BA1 DDR_CASn Pin map section location Left Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 15 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com ZCZ Pin Map [Section Middle - Top View] G H J K L M 18 MMC0_CMD RMII1_REF_CLK MII1_TXD3 MII1_TX_CLK MII1_RX_CLK MDC 17 MMC0_CLK MII1_CRS MII1_RX_DV MII1_TXD0 MII1_RXD3 MDIO 16 MMC0_DAT0 MII1_COL MII1_TX_EN MII1_TXD1 MII1_RXD2 MII1_RXD0 15 MMC0_DAT1 VDDS_PLL_MPU MII1_RX_ER MII1_TXD2 MII1_RXD1 USB0_CE 14 VDDSHV6 VDDSHV4 VDDSHV4 VDDSHV5 VDDSHV5 VSSA_USB 13 VDD_MPU VDD_MPU VDD_MPU VDDS VSS VDD_CORE 12 VSS VSS VDD_CORE VDD_CORE VSS VSS 11 VSS VDD_CORE VSS VSS VSS VDD_CORE 10 VDD_CORE VSS VSS VSS VSS VSS 9 VSS VSS VSS VSS VDD_CORE VSS 8 VSS VSS VSS VDD_CORE VDD_CORE VSS 7 VDD_CORE VSS VSS VSS VDD_CORE VSS 6 VDD_CORE VSS VSS VDD_CORE VDD_CORE VSS 5 VDDS_DDR VDDS_DDR VDDS_DDR VDDS_DDR VDDS_DDR VPP 4 DDR_RASn DDR_A14 DDR_VREF DDR_D12 DDR_D14 DDR_D1 3 DDR_CKE DDR_A13 DDR_VTP DDR_D11 DDR_D13 DDR_D0 2 DDR_RESETn DDR_CSn0 DDR_DQM1 DDR_D10 DDR_DQSn1 DDR_DQM0 1 DDR_ODT DDR_A1 DDR_D8 DDR_D9 DDR_DQS1 DDR_D15 Pin map section location Middle 16 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 ZCZ Pin Map [Section Right - Top View] N P R T U V 18 USB0_DM USB1_CE USB1_DM USB1_VBUS GPMC_BEn1 VSS 17 USB0_DP USB1_ID USB1_DP GPMC_WAIT0 GPMC_WPn GPMC_A11 16 VDDA1P8V_USB0 USB0_ID VDDA1P8V_USB1 GPMC_A10 GPMC_A9 GPMC_A8 15 VDDA3P3V_USB0 USB0_VBUS VDDA3P3V_USB1 GPMC_A7 GPMC_A6 GPMC_A5 14 VSSA_USB VDDS GPMC_A4 GPMC_A3 GPMC_A2 GPMC_A1 13 VDD_CORE VDDSHV3 GPMC_A0 GPMC_CSn3 GPMC_AD15 GPMC_AD14 12 VDD_CORE VDDSHV3 GPMC_AD13 GPMC_AD12 GPMC_AD11 GPMC_CLK 11 VSS VDDSHV2 VDDS_OSC GPMC_AD10 XTALOUT VSS_OSC 10 VSS VDDSHV2 VDDS_PLL_CORE_LCD GPMC_AD9 GPMC_AD8 XTALIN 9 VDD_CORE VDDS GPMC_AD6 GPMC_AD7 GPMC_CSn1 GPMC_CSn2 8 VDD_CORE VDDSHV1 GPMC_AD2 GPMC_AD3 GPMC_AD4 GPMC_AD5 7 VSS VDDSHV1 GPMC_ADVn_ALE GPMC_OEn_REn GPMC_AD0 GPMC_AD1 6 VDDS VDDSHV6 LCD_AC_BIAS_EN GPMC_BEn0_CLE GPMC_WEn GPMC_CSn0 5 VDDSHV6 VDDSHV6 LCD_HSYNC LCD_DATA15 LCD_VSYNC LCD_PCLK 4 DDR_D5 DDR_D7 LCD_DATA3 LCD_DATA7 LCD_DATA11 LCD_DATA14 3 DDR_D4 DDR_D6 LCD_DATA2 LCD_DATA6 LCD_DATA10 LCD_DATA13 2 DDR_D3 DDR_DQSn0 LCD_DATA1 LCD_DATA5 LCD_DATA9 LCD_DATA12 1 DDR_D2 DDR_DQS0 LCD_DATA0 LCD_DATA4 LCD_DATA8 VSS Pin map section location Right Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 17 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.2 www.ti.com Pin Attributes The AM335x and AMIC110 Sitara Processors Technical Reference Manual and this document may reference internal signal names when discussing peripheral input and output signals because many of the AM335x package terminals can be multiplexed to one of several peripheral signals. The following table has a Pin Name column that lists all device terminal names and a Signal Name column that lists all internal signal names multiplexed to each terminal which provides a cross reference of internal signal names to terminal names. This table also identifies other important terminal characteristics. (1) BALL NUMBER: Package ball numbers associated with each signals. (2) PIN NAME: The name of the package pin or terminal. Note: The table does not take into account subsystem terminal multiplexing options. (3) SIGNAL NAME: The signal name for that pin in the mode being used. (4) MODE: Multiplexing mode number. a. Mode 0 is the primary mode; this means that when mode 0 is set, the function mapped on the terminal corresponds to the name of the terminal. There is always a function mapped on the primary mode. Notice that primary mode is not necessarily the default mode. b. Note: The default mode is the mode at the release of the reset; also see the RESET REL. MODE column. Modes 1 to 7 are possible modes for alternate functions. On each terminal, some modes are effectively used for alternate functions, while some modes are not used and do not correspond to a functional configuration. (5) TYPE: Signal direction – I = Input – O = Output – I/O = Input and Output – D = Open drain – DS = Differential – A = Analog – PWR = Power – GND = Ground Note: In the safe_mode, the buffer is configured in high-impedance. (6) BALL RESET STATE: State of the terminal while the active low PWRONRSTn terminal is low. – 0: The buffer drives VOL (pulldown or pullup resistor not activated) 0(PD): The buffer drives VOL with an active pulldown resistor – 1: The buffer drives VOH (pulldown or pullup resistor not activated) 1(PU): The buffer drives VOH with an active pullup resistor – Z: High-impedance – L: High-impedance with an active pulldown resistor – H : High-impedance with an active pullup resistor (7) BALL RESET REL. STATE: State of the terminal after the active low PWRONRSTn terminal transitions from low to high. – 0: The buffer drives VOL (pulldown or pullup resistor not activated) 0(PD): The buffer drives VOL with an active pulldown resistor – 1: The buffer drives VOH (pulldown or pullup resistor not activated) 1(PU): The buffer drives VOH with an active pullup resistor – Z: High-impedance. – L: High-impedance with an active pulldown resistor – H : High-impedance with an active pullup resistor (8) RESET REL. MODE: The mode is automatically configured after the active low PWRONRSTn terminal transitions from low to high. (9) POWER: The voltage supply that powers the I/O buffers of the terminal. (10) HYS: Indicates if the input buffer is with hysteresis. (11) BUFFER STRENGTH: Drive strength of the associated output buffer. (12) PULLUP OR PULLDOWN TYPE: Denotes the presence of an internal pullup or pulldown resistor. Pullup and pulldown resistors can be enabled or disabled via software. (13) I/O CELL: I/O cell information. Note: Configuring two terminals to the same input signal is not supported as it can yield unexpected results. This can be easily prevented with the proper software configuration. 18 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] PIN NAME [2] SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] B8 B6 AIN0 AIN0 0 A (22) Z Z 0 VDDA_ADC / VDDA_ADC NA 25 NA Analog A11 C7 AIN1 AIN1 0 A (21) Z Z 0 VDDA_ADC / VDDA_ADC NA 25 NA Analog A8 B7 AIN2 AIN2 0 A (21) Z Z 0 VDDA_ADC / VDDA_ADC NA 25 NA Analog B11 A7 AIN3 AIN3 0 A (20) Z Z 0 VDDA_ADC / VDDA_ADC NA 25 NA Analog C8 C8 AIN4 AIN4 0 A (20) Z Z 0 VDDA_ADC / VDDA_ADC NA 25 NA Analog B12 B8 AIN5 AIN5 0 A Z Z 0 VDDA_ADC / VDDA_ADC NA NA NA Analog A10 A8 AIN6 AIN6 0 A Z Z 0 VDDA_ADC / VDDA_ADC NA NA NA Analog A12 C9 AIN7 AIN7 0 A Z Z 0 VDDA_ADC / VDDA_ADC NA NA NA Analog C13 C10 CAP_VBB_MPU CAP_VBB_MPU NA A D6 D6 CAP_VDD_RTC CAP_VDD_RTC NA A B10 D9 CAP_VDD_SRAM_CORE CAP_VDD_SRAM_CORE NA A D13 D11 CAP_VDD_SRAM_MPU CAP_VDD_SRAM_MPU NA A F3 F3 DDR_A0 ddr_a0 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL J2 H1 DDR_A1 ddr_a1 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL D1 E4 DDR_A2 ddr_a2 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL B3 C3 DDR_A3 ddr_a3 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL E5 C2 DDR_A4 ddr_a4 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL A2 B1 DDR_A5 ddr_a5 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL B1 D5 DDR_A6 ddr_a6 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL D2 E2 DDR_A7 ddr_a7 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL C3 D4 DDR_A8 ddr_a8 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL B2 C1 DDR_A9 ddr_a9 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL E2 F4 DDR_A10 ddr_a10 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL G4 F2 DDR_A11 ddr_a11 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 19 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] PIN NAME [2] SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] F4 E3 DDR_A12 ddr_a12 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL H1 H3 DDR_A13 ddr_a13 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL H3 H4 DDR_A14 ddr_a14 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL E3 D3 DDR_A15 ddr_a15 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL A3 C4 DDR_BA0 ddr_ba0 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL E1 E1 DDR_BA1 ddr_ba1 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL B4 B3 DDR_BA2 ddr_ba2 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL F1 F1 DDR_CASn ddr_casn 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL C2 D2 DDR_CK ddr_ck 0 O L 0 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL G3 G3 DDR_CKE ddr_cke 0 O L 0 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL C1 D1 DDR_CKn ddr_nck 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL H2 H2 DDR_CSn0 ddr_csn0 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL N4 M3 DDR_D0 ddr_d0 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL P4 M4 DDR_D1 ddr_d1 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL P2 N1 DDR_D2 ddr_d2 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL P1 N2 DDR_D3 ddr_d3 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL P3 N3 DDR_D4 ddr_d4 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL T1 N4 DDR_D5 ddr_d5 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL T2 P3 DDR_D6 ddr_d6 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL R3 P4 DDR_D7 ddr_d7 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL K2 J1 DDR_D8 ddr_d8 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL K1 K1 DDR_D9 ddr_d9 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL M3 K2 DDR_D10 ddr_d10 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL 20 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] PIN NAME [2] SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] M4 K3 DDR_D11 ddr_d11 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL M2 K4 DDR_D12 ddr_d12 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL M1 L3 DDR_D13 ddr_d13 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL N2 L4 DDR_D14 ddr_d14 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL N1 M1 DDR_D15 ddr_d15 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL N3 M2 DDR_DQM0 ddr_dqm0 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL K3 J2 DDR_DQM1 ddr_dqm1 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL R1 P1 DDR_DQS0 ddr_dqs0 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL L1 L1 DDR_DQS1 ddr_dqs1 0 I/O L Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL R2 P2 DDR_DQSn0 ddr_dqsn0 0 I/O H Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL L2 L2 DDR_DQSn1 ddr_dqsn1 0 I/O H Z 0 VDDS_DDR / VDDS_DDR Yes 8 PU/PD LVCMOS/SSTL/ HSTL G1 G1 DDR_ODT ddr_odt 0 O L 0 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL F2 G4 DDR_RASn ddr_rasn 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL G2 G2 DDR_RESETn ddr_resetn 0 O L 0 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL H4 J4 DDR_VREF ddr_vref 0 A NA NA NA VDDS_DDR / VDDS_DDR NA NA NA Analog J1 J3 DDR_VTP ddr_vtp 0 I (19) NA NA NA VDDS_DDR / VDDS_DDR NA NA NA Analog A4 B2 DDR_WEn ddr_wen 0 O H 1 0 VDDS_DDR / VDDS_DDR NA 8 PU/PD LVCMOS/SSTL/ HSTL E18 C18 ECAP0_IN_PWM0_OUT eCAP0_in_PWM0_out 0 I/O Z L 7 4 PU/PD LVCMOS 1 O VDDSHV6 / VDDSHV6 Yes uart3_txd spi1_cs1 2 I/O pr1_ecap0_ecap_capin_apwm_o 3 I/O spi1_sclk 4 I/O mmc0_sdwp 5 I xdma_event_intr2 6 I gpio0_7 7 I/O EMU0 0 I/O H H 0 6 PU/PD LVCMOS 7 I/O VDDSHV6 / VDDSHV6 Yes gpio3_7 A15 C14 EMU0 (18) Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 21 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] D14 B14 PIN NAME [2] EMU1 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] EMU1 0 I/O gpio3_8 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] H H 0 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS C17 B18 EXTINTn nNMI 0 I Z H 0 VDDSHV6 / VDDSHV6 Yes NA PU/PD LVCMOS B5 C5 EXT_WAKEUP EXT_WAKEUP 0 I L Z 0 VDDS_RTC / VDDS_RTC Yes NA NA LVCMOS NA R13 GPMC_A0 gpmc_a0 0 O L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS gmii2_txen 1 O rgmii2_tctl 2 O rmii2_txen 3 O gpmc_a16 4 O pr1_mii_mt1_clk 5 I ehrpwm1_tripzone_input 6 I gpio1_16 7 I/O gpmc_a1 0 O L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS gmii2_rxdv 1 I rgmii2_rctl 2 I mmc2_dat0 3 I/O gpmc_a17 4 O pr1_mii1_txd3 5 O ehrpwm0_synco 6 O gpio1_17 7 I/O gpmc_a2 0 O L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS gmii2_txd3 1 O rgmii2_td3 2 O mmc2_dat1 3 I/O gpmc_a18 4 O pr1_mii1_txd2 5 O ehrpwm1A 6 O gpio1_18 7 I/O gpmc_a3 0 O L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS gmii2_txd2 1 O rgmii2_td2 2 O mmc2_dat2 3 I/O gpmc_a19 4 O pr1_mii1_txd1 5 O ehrpwm1B 6 O gpio1_19 7 I/O NA NA NA 22 V14 U14 T14 GPMC_A1 GPMC_A2 GPMC_A3 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] NA NA NA NA R14 V15 U15 T15 PIN NAME [2] GPMC_A4 GPMC_A5 GPMC_A6 GPMC_A7 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] gpmc_a4 0 O gmii2_txd1 1 O rgmii2_td1 2 O rmii2_txd1 3 O gpmc_a20 4 O pr1_mii1_txd0 5 O eQEP1A_in 6 I gpio1_20 7 I/O gpmc_a5 0 O gmii2_txd0 1 O rgmii2_td0 2 O rmii2_txd0 3 O gpmc_a21 4 O pr1_mii1_rxd3 5 I eQEP1B_in 6 I gpio1_21 7 I/O gpmc_a6 0 O gmii2_txclk 1 I rgmii2_tclk 2 O mmc2_dat4 3 I/O gpmc_a22 4 O pr1_mii1_rxd2 5 I eQEP1_index 6 I/O gpio1_22 7 I/O gpmc_a7 0 O gmii2_rxclk 1 I rgmii2_rclk 2 I mmc2_dat5 3 I/O gpmc_a23 4 O pr1_mii1_rxd1 5 I eQEP1_strobe 6 I/O gpio1_23 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 23 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] NA NA NA NA W10 V9 24 V16 U16 T16 V17 U7 V7 PIN NAME [2] GPMC_A8 GPMC_A9 (10) GPMC_A10 GPMC_A11 GPMC_AD0 GPMC_AD1 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] gpmc_a8 0 O gmii2_rxd3 1 I rgmii2_rd3 2 I mmc2_dat6 3 I/O gpmc_a24 4 O pr1_mii1_rxd0 5 I mcasp0_aclkx 6 I/O gpio1_24 7 I/O gpmc_a9 0 O gmii2_rxd2 1 I rgmii2_rd2 2 I mmc2_dat7 / rmii2_crs_dv 3 I/O gpmc_a25 4 O pr1_mii_mr1_clk 5 I mcasp0_fsx 6 I/O gpio1_25 7 I/O gpmc_a10 0 O gmii2_rxd1 1 I rgmii2_rd1 2 I rmii2_rxd1 3 I gpmc_a26 4 O pr1_mii1_rxdv 5 I mcasp0_axr0 6 I/O gpio1_26 7 I/O gpmc_a11 0 O gmii2_rxd0 1 I rgmii2_rd0 2 I rmii2_rxd0 3 I gpmc_a27 4 O pr1_mii1_rxer 5 I mcasp0_axr1 6 I/O gpio1_27 7 I/O gpmc_ad0 0 I/O mmc1_dat0 1 I/O gpio1_0 7 I/O gpmc_ad1 0 I/O mmc1_dat1 1 I/O gpio1_1 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV3 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] V12 W13 V13 W14 U14 W15 V15 W16 R8 T8 U8 V8 R9 T9 U10 T10 PIN NAME [2] GPMC_AD2 GPMC_AD3 GPMC_AD4 GPMC_AD5 GPMC_AD6 GPMC_AD7 GPMC_AD8 GPMC_AD9 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] gpmc_ad2 0 I/O mmc1_dat2 1 I/O gpio1_2 7 I/O gpmc_ad3 0 I/O mmc1_dat3 1 I/O gpio1_3 7 I/O gpmc_ad4 0 I/O mmc1_dat4 1 I/O gpio1_4 7 I/O gpmc_ad5 0 I/O mmc1_dat5 1 I/O gpio1_5 7 I/O gpmc_ad6 0 I/O mmc1_dat6 1 I/O gpio1_6 7 I/O gpmc_ad7 0 I/O mmc1_dat7 1 I/O gpio1_7 7 I/O gpmc_ad8 0 I/O lcd_data23 1 O mmc1_dat0 2 I/O mmc2_dat4 3 I/O ehrpwm2A 4 O pr1_mii_mt0_clk 5 I gpio0_22 7 I/O gpmc_ad9 0 I/O lcd_data22 1 O mmc1_dat1 2 I/O mmc2_dat5 3 I/O ehrpwm2B 4 O pr1_mii0_col 5 I gpio0_23 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] L L 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV2 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV2 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 25 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] T12 U12 U13 T13 W17 26 T11 U12 T12 R12 V13 PIN NAME [2] GPMC_AD10 GPMC_AD11 GPMC_AD12 GPMC_AD13 GPMC_AD14 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] gpmc_ad10 0 I/O lcd_data21 1 O mmc1_dat2 2 I/O mmc2_dat6 3 I/O ehrpwm2_tripzone_input 4 I pr1_mii0_txen 5 O gpio0_26 7 I/O gpmc_ad11 0 I/O lcd_data20 1 O mmc1_dat3 2 I/O mmc2_dat7 3 I/O ehrpwm0_synco 4 O pr1_mii0_txd3 5 O gpio0_27 7 I/O gpmc_ad12 0 I/O lcd_data19 1 O mmc1_dat4 2 I/O mmc2_dat0 3 I/O eQEP2A_in 4 I pr1_mii0_txd2 5 O pr1_pru0_pru_r30_14 6 O gpio1_12 7 I/O gpmc_ad13 0 I/O lcd_data18 1 O mmc1_dat5 2 I/O mmc2_dat1 3 I/O eQEP2B_in 4 I pr1_mii0_txd1 5 O pr1_pru0_pru_r30_15 6 O gpio1_13 7 I/O gpmc_ad14 0 I/O lcd_data17 1 O mmc1_dat6 2 I/O mmc2_dat2 3 I/O eQEP2_index 4 I/O pr1_mii0_txd0 5 O pr1_pru0_pru_r31_14 6 I gpio1_14 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] L L 7 VDDSHV1 / VDDSHV2 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV2 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV2 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV2 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV2 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] V17 V10 V8 V18 V16 W8 U13 R7 T6 U18 V12 V6 PIN NAME [2] GPMC_AD15 GPMC_ADVn_ALE GPMC_BEn0_CLE GPMC_BEn1 GPMC_CLK GPMC_CSn0 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] gpmc_ad15 0 I/O lcd_data16 1 O mmc1_dat7 2 I/O mmc2_dat3 3 I/O eQEP2_strobe 4 I/O pr1_ecap0_ecap_capin_apwm_o 5 I/O pr1_pru0_pru_r31_15 6 I gpio1_15 7 I/O gpmc_advn_ale 0 O timer4 2 I/O gpio2_2 7 I/O gpmc_be0n_cle 0 O timer5 2 I/O gpio2_5 7 I/O gpmc_be1n 0 O gmii2_col 1 I gpmc_csn6 2 O mmc2_dat3 3 I/O gpmc_dir 4 O pr1_mii1_rxlink 5 I mcasp0_aclkr 6 I/O gpio1_28 7 I/O gpmc_clk 0 I/O lcd_memory_clk 1 O gpmc_wait1 2 I mmc2_clk 3 I/O pr1_mii1_crs 4 I pr1_mdio_mdclk 5 O mcasp0_fsr 6 I/O gpio2_1 7 I/O gpmc_csn0 0 O gpio1_29 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] L L 7 VDDSHV1 / VDDSHV2 Yes 6 PU/PD LVCMOS H H 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS H H 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS H H 7 VDDSHV1 / VDDSHV3 Yes 6 PU/PD LVCMOS L L 7 VDDSHV1 / VDDSHV2 Yes 6 PU/PD LVCMOS H H 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 27 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] V14 U15 U17 W9 R15 U8 28 U9 V9 T13 T7 T17 U6 PIN NAME [2] GPMC_CSn1 GPMC_CSn2 GPMC_CSn3 (6) GPMC_OEn_REn GPMC_WAIT0 GPMC_WEn SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] gpmc_csn1 0 O gpmc_clk 1 I/O mmc1_clk 2 I/O pr1_edio_data_in6 3 I pr1_edio_data_out6 4 O pr1_pru1_pru_r30_12 5 O pr1_pru1_pru_r31_12 6 I gpio1_30 7 I/O gpmc_csn2 0 O gpmc_be1n 1 O mmc1_cmd 2 I/O pr1_edio_data_in7 3 I pr1_edio_data_out7 4 O pr1_pru1_pru_r30_13 5 O pr1_pru1_pru_r31_13 6 I gpio1_31 7 I/O gpmc_csn3 0 O gpmc_a3 1 O rmii2_crs_dv 2 I mmc2_cmd 3 I/O pr1_mii0_crs 4 I pr1_mdio_data 5 I/O EMU4 6 I/O gpio2_0 7 I/O gpmc_oen_ren 0 O timer7 2 I/O gpio2_3 7 I/O gpmc_wait0 0 I gmii2_crs 1 I gpmc_csn4 2 O rmii2_crs_dv 3 I mmc1_sdcd 4 I pr1_mii1_col 5 I uart4_rxd 6 I gpio0_30 7 I/O gpmc_wen 0 O timer6 2 I/O gpio2_4 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] H H 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS H H 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS H H 7 VDDSHV1 / VDDSHV2 Yes 6 PU/PD LVCMOS H H 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS H H 7 VDDSHV1 / VDDSHV3 Yes 6 PU/PD LVCMOS H H 7 VDDSHV1 / VDDSHV1 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] W18 C18 B19 W7 U1 U17 C17 C16 R6 R1 PIN NAME [2] GPMC_WPn I2C0_SDA I2C0_SCL LCD_AC_BIAS_EN LCD_DATA0 (5) SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] gpmc_wpn 0 O gmii2_rxerr 1 I gpmc_csn5 2 O rmii2_rxerr 3 I mmc2_sdcd 4 I pr1_mii1_txen 5 O uart4_txd 6 O gpio0_31 7 I/O I2C0_SDA 0 I/OD timer4 1 I/O uart2_ctsn 2 I eCAP2_in_PWM2_out 3 I/O gpio3_5 7 I/O I2C0_SCL 0 I/OD timer7 1 I/O uart2_rtsn 2 O eCAP1_in_PWM1_out 3 I/O gpio3_6 7 I/O lcd_ac_bias_en 0 O gpmc_a11 1 O pr1_mii1_crs 2 I pr1_edio_data_in5 3 I pr1_edio_data_out5 4 O pr1_pru1_pru_r30_11 5 O pr1_pru1_pru_r31_11 6 I gpio2_25 7 I/O lcd_data0 0 I/O gpmc_a0 1 O pr1_mii_mt0_clk 2 I ehrpwm2A 3 O pr1_pru1_pru_r30_0 5 O pr1_pru1_pru_r31_0 6 I gpio2_6 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] H H 7 VDDSHV1 / VDDSHV3 Yes 6 PU/PD LVCMOS Z H 7 VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS Z H 7 VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS Z L 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 29 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] U2 V1 V2 W2 W3 30 R2 R3 R4 T1 T2 PIN NAME [2] LCD_DATA1 LCD_DATA2 LCD_DATA3 LCD_DATA4 LCD_DATA5 (5) (5) (5) (5) (5) SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] lcd_data1 0 I/O gpmc_a1 1 O pr1_mii0_txen 2 O ehrpwm2B 3 O pr1_pru1_pru_r30_1 5 O pr1_pru1_pru_r31_1 6 I gpio2_7 7 I/O lcd_data2 0 I/O gpmc_a2 1 O pr1_mii0_txd3 2 O ehrpwm2_tripzone_input 3 I pr1_pru1_pru_r30_2 5 O pr1_pru1_pru_r31_2 6 I gpio2_8 7 I/O lcd_data3 0 I/O gpmc_a3 1 O pr1_mii0_txd2 2 O ehrpwm0_synco 3 O pr1_pru1_pru_r30_3 5 O pr1_pru1_pru_r31_3 6 I gpio2_9 7 I/O lcd_data4 0 I/O gpmc_a4 1 O pr1_mii0_txd1 2 O eQEP2A_in 3 I pr1_pru1_pru_r30_4 5 O pr1_pru1_pru_r31_4 6 I gpio2_10 7 I/O lcd_data5 0 I/O gpmc_a5 1 O pr1_mii0_txd0 2 O eQEP2B_in 3 I pr1_pru1_pru_r30_5 5 O pr1_pru1_pru_r31_5 6 I gpio2_11 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] V3 U3 V4 W4 T3 T4 U1 U2 PIN NAME [2] LCD_DATA6 LCD_DATA7 LCD_DATA8 LCD_DATA9 (5) (5) (5) (5) SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] lcd_data6 0 I/O gpmc_a6 1 O pr1_edio_data_in6 2 I eQEP2_index 3 I/O pr1_edio_data_out6 4 O pr1_pru1_pru_r30_6 5 O pr1_pru1_pru_r31_6 6 I gpio2_12 7 I/O lcd_data7 0 I/O gpmc_a7 1 O pr1_edio_data_in7 2 I eQEP2_strobe 3 I/O pr1_edio_data_out7 4 O pr1_pru1_pru_r30_7 5 O pr1_pru1_pru_r31_7 6 I gpio2_13 7 I/O lcd_data8 0 I/O gpmc_a12 1 O ehrpwm1_tripzone_input 2 I mcasp0_aclkx 3 I/O uart5_txd 4 O pr1_mii0_rxd3 5 I uart2_ctsn 6 I gpio2_14 7 I/O lcd_data9 0 I/O gpmc_a13 1 O ehrpwm0_synco 2 O mcasp0_fsx 3 I/O uart5_rxd 4 I pr1_mii0_rxd2 5 I uart2_rtsn 6 O gpio2_15 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 31 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] U5 V5 V6 U6 32 U3 U4 V2 V3 PIN NAME [2] LCD_DATA10 (5) LCD_DATA11 (5) LCD_DATA12 (5) LCD_DATA13 (5) SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] lcd_data10 0 I/O gpmc_a14 1 O ehrpwm1A 2 O mcasp0_axr0 3 I/O pr1_mii0_rxd1 5 I uart3_ctsn 6 I gpio2_16 7 I/O lcd_data11 0 I/O gpmc_a15 1 O ehrpwm1B 2 O mcasp0_ahclkr 3 I/O mcasp0_axr2 4 I/O pr1_mii0_rxd0 5 I uart3_rtsn 6 O gpio2_17 7 I/O lcd_data12 0 I/O gpmc_a16 1 O eQEP1A_in 2 I mcasp0_aclkr 3 I/O mcasp0_axr2 4 I/O pr1_mii0_rxlink 5 I uart4_ctsn 6 I gpio0_8 7 I/O lcd_data13 0 I/O gpmc_a17 1 O eQEP1B_in 2 I mcasp0_fsr 3 I/O mcasp0_axr3 4 I/O pr1_mii0_rxer 5 I uart4_rtsn 6 O gpio0_9 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] W6 V7 T7 W5 V4 T5 R5 V5 PIN NAME [2] LCD_DATA14 (5) LCD_DATA15 (5) LCD_HSYNC (7) LCD_PCLK SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] lcd_data14 0 I/O gpmc_a18 1 O eQEP1_index 2 I/O mcasp0_axr1 3 I/O uart5_rxd 4 I pr1_mii_mr0_clk 5 I uart5_ctsn 6 I gpio0_10 7 I/O lcd_data15 0 I/O gpmc_a19 1 O eQEP1_strobe 2 I/O mcasp0_ahclkx 3 I/O mcasp0_axr3 4 I/O pr1_mii0_rxdv 5 I uart5_rtsn 6 O gpio0_11 7 I/O lcd_hsync 0 O gpmc_a9 1 O gpmc_a2 2 O pr1_edio_data_in3 3 I pr1_edio_data_out3 4 O pr1_pru1_pru_r30_9 5 O pr1_pru1_pru_r31_9 6 I gpio2_23 7 I/O lcd_pclk 0 O gpmc_a10 1 O pr1_mii0_crs 2 I pr1_edio_data_in4 3 I pr1_edio_data_out4 4 O pr1_pru1_pru_r30_10 5 O pr1_pru1_pru_r31_10 6 I gpio2_24 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z Z 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z L 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Z L 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 33 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] U7 NA NA NA 34 U5 B13 B12 C12 PIN NAME [2] LCD_VSYNC (7) MCASP0_FSX MCASP0_ACLKR MCASP0_AHCLKR SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] lcd_vsync 0 O gpmc_a8 1 O gpmc_a1 2 O pr1_edio_data_in2 3 I pr1_edio_data_out2 4 O pr1_pru1_pru_r30_8 5 O pr1_pru1_pru_r31_8 6 I gpio2_22 7 I/O mcasp0_fsx 0 I/O ehrpwm0B 1 O spi1_d0 3 I/O mmc1_sdcd 4 I pr1_pru0_pru_r30_1 5 O pr1_pru0_pru_r31_1 6 I gpio3_15 7 I/O mcasp0_aclkr 0 I/O eQEP0A_in 1 I mcasp0_axr2 2 I/O mcasp1_aclkx 3 I/O mmc0_sdwp 4 I pr1_pru0_pru_r30_4 5 O pr1_pru0_pru_r31_4 6 I gpio3_18 7 I/O mcasp0_ahclkr 0 I/O ehrpwm0_synci 1 I mcasp0_axr2 2 I/O spi1_cs0 3 I/O eCAP2_in_PWM2_out 4 I/O pr1_pru0_pru_r30_3 5 O pr1_pru0_pru_r31_3 6 I gpio3_17 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] Z L 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV6 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV6 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV6 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] NA NA NA NA NA A14 A13 C13 D12 D13 PIN NAME [2] MCASP0_AHCLKX MCASP0_ACLKX MCASP0_FSR MCASP0_AXR0 MCASP0_AXR1 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] mcasp0_ahclkx 0 I/O eQEP0_strobe 1 I/O mcasp0_axr3 2 I/O mcasp1_axr1 3 I/O EMU4 4 I/O pr1_pru0_pru_r30_7 5 O pr1_pru0_pru_r31_7 6 I gpio3_21 7 I/O mcasp0_aclkx 0 I/O ehrpwm0A 1 O spi1_sclk 3 I/O mmc0_sdcd 4 I pr1_pru0_pru_r30_0 5 O pr1_pru0_pru_r31_0 6 I gpio3_14 7 I/O mcasp0_fsr 0 I/O eQEP0B_in 1 I mcasp0_axr3 2 I/O mcasp1_fsx 3 I/O EMU2 4 I/O pr1_pru0_pru_r30_5 5 O pr1_pru0_pru_r31_5 6 I gpio3_19 7 I/O mcasp0_axr0 0 I/O ehrpwm0_tripzone_input 1 I spi1_d1 3 I/O mmc2_sdcd 4 I pr1_pru0_pru_r30_2 5 O pr1_pru0_pru_r31_2 6 I gpio3_16 7 I/O mcasp0_axr1 0 I/O eQEP0_index 1 I/O mcasp1_axr0 3 I/O EMU3 4 I/O pr1_pru0_pru_r30_6 5 O pr1_pru0_pru_r31_6 6 I gpio3_20 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] L L 7 NA / VDDSHV6 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV6 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV6 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV6 Yes 6 PU/PD LVCMOS L L 7 NA / VDDSHV6 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 35 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] R19 P17 L19 K17 36 M18 M17 J17 J16 PIN NAME [2] MDC MDIO MII1_RX_DV MII1_TX_EN SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] mdio_clk 0 O timer5 1 I/O uart5_txd 2 O uart3_rtsn 3 O mmc0_sdwp 4 I mmc1_clk 5 I/O mmc2_clk 6 I/O gpio0_1 7 I/O mdio_data 0 I/O timer6 1 I/O uart5_rxd 2 I uart3_ctsn 3 I mmc0_sdcd 4 I mmc1_cmd 5 I/O mmc2_cmd 6 I/O gpio0_0 7 I/O gmii1_rxdv 0 I lcd_memory_clk 1 O rgmii1_rctl 2 I uart5_txd 3 O mcasp1_aclkx 4 I/O mmc2_dat0 5 I/O mcasp0_aclkr 6 I/O gpio3_4 7 I/O gmii1_txen 0 O rmii1_txen 1 O rgmii1_tctl 2 O timer4 3 I/O mcasp1_axr0 4 I/O eQEP0_index 5 I/O mmc2_cmd 6 I/O gpio3_3 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] H H 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS H H 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] K19 M19 N19 J19 J15 L18 K18 H16 PIN NAME [2] MII1_RX_ER MII1_RX_CLK MII1_TX_CLK MII1_COL SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] gmii1_rxerr 0 I rmii1_rxerr 1 I spi1_d1 2 I/O I2C1_SCL 3 I/OD mcasp1_fsx 4 I/O uart5_rtsn 5 O uart2_txd 6 O gpio3_2 7 I/O gmii1_rxclk 0 I uart2_txd 1 O rgmii1_rclk 2 I mmc0_dat6 3 I/O mmc1_dat1 4 I/O uart1_dsrn 5 I mcasp0_fsx 6 I/O gpio3_10 7 I/O gmii1_txclk 0 I uart2_rxd 1 I rgmii1_tclk 2 O mmc0_dat7 3 I/O mmc1_dat0 4 I/O uart1_dcdn 5 I mcasp0_aclkx 6 I/O gpio3_9 7 I/O gmii1_col 0 I rmii2_refclk 1 I/O spi1_sclk 2 I/O uart5_rxd 3 I mcasp1_axr2 4 I/O mmc2_dat3 5 I/O mcasp0_axr2 6 I/O gpio3_0 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 37 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] J18 P18 P19 N16 38 H17 M16 L15 L16 PIN NAME [2] MII1_CRS MII1_RXD0 MII1_RXD1 MII1_RXD2 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] gmii1_crs 0 I rmii1_crs_dv 1 I spi1_d0 2 I/O I2C1_SDA 3 I/OD mcasp1_aclkx 4 I/O uart5_ctsn 5 I uart2_rxd 6 I gpio3_1 7 I/O gmii1_rxd0 0 I rmii1_rxd0 1 I rgmii1_rd0 2 I mcasp1_ahclkx 3 I/O mcasp1_ahclkr 4 I/O mcasp1_aclkr 5 I/O mcasp0_axr3 6 I/O gpio2_21 7 I/O gmii1_rxd1 0 I rmii1_rxd1 1 I rgmii1_rd1 2 I mcasp1_axr3 3 I/O mcasp1_fsr 4 I/O eQEP0_strobe 5 I/O mmc2_clk 6 I/O gpio2_20 7 I/O gmii1_rxd2 0 I uart3_txd 1 O rgmii1_rd2 2 I mmc0_dat4 3 I/O mmc1_dat3 4 I/O uart1_rin 5 I mcasp0_axr1 6 I/O gpio2_19 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] N17 L18 M18 N18 L17 K17 K16 K15 PIN NAME [2] MII1_RXD3 MII1_TXD0 MII1_TXD1 MII1_TXD2 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] gmii1_rxd3 0 I uart3_rxd 1 I rgmii1_rd3 2 I mmc0_dat5 3 I/O mmc1_dat2 4 I/O uart1_dtrn 5 O mcasp0_axr0 6 I/O gpio2_18 7 I/O gmii1_txd0 0 O rmii1_txd0 1 O rgmii1_td0 2 O mcasp1_axr2 3 I/O mcasp1_aclkr 4 I/O eQEP0B_in 5 I mmc1_clk 6 I/O gpio0_28 7 I/O gmii1_txd1 0 O rmii1_txd1 1 O rgmii1_td1 2 O mcasp1_fsr 3 I/O mcasp1_axr1 4 I/O eQEP0A_in 5 I mmc1_cmd 6 I/O gpio0_21 7 I/O gmii1_txd2 0 O dcan0_rx 1 I rgmii1_td2 2 O uart4_txd 3 O mcasp1_axr0 4 I/O mmc2_dat2 5 I/O mcasp0_ahclkx 6 I/O gpio0_17 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 39 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] M17 G17 G19 G18 40 J18 G18 G17 G16 PIN NAME [2] MII1_TXD3 MMC0_CMD MMC0_CLK MMC0_DAT0 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] gmii1_txd3 0 O dcan0_tx 1 O rgmii1_td3 2 O uart4_rxd 3 I mcasp1_fsx 4 I/O mmc2_dat1 5 I/O mcasp0_fsr 6 I/O gpio0_16 7 I/O mmc0_cmd 0 I/O gpmc_a25 1 O uart3_rtsn 2 O uart2_txd 3 O dcan1_rx 4 I pr1_pru0_pru_r30_13 5 O pr1_pru0_pru_r31_13 6 I gpio2_31 7 I/O mmc0_clk 0 I/O gpmc_a24 1 O uart3_ctsn 2 I uart2_rxd 3 I dcan1_tx 4 O pr1_pru0_pru_r30_12 5 O pr1_pru0_pru_r31_12 6 I gpio2_30 7 I/O mmc0_dat0 0 I/O gpmc_a23 1 O uart5_rtsn 2 O uart3_txd 3 O uart1_rin 4 I pr1_pru0_pru_r30_11 5 O pr1_pru0_pru_r31_11 6 I gpio2_29 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] L L 7 VDDSHV5 / VDDSHV5 Yes 6 PU/PD LVCMOS H H 7 VDDSHV4 / VDDSHV4 Yes 6 PU/PD LVCMOS H H 7 VDDSHV4 / VDDSHV4 Yes 6 PU/PD LVCMOS H H 7 VDDSHV4 / VDDSHV4 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] H17 H18 H19 G15 F18 F17 PIN NAME [2] MMC0_DAT1 MMC0_DAT2 MMC0_DAT3 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] mmc0_dat1 0 I/O gpmc_a22 1 O uart5_ctsn 2 I uart3_rxd 3 I uart1_dtrn 4 O pr1_pru0_pru_r30_10 5 O pr1_pru0_pru_r31_10 6 I gpio2_28 7 I/O mmc0_dat2 0 I/O gpmc_a21 1 O uart4_rtsn 2 O timer6 3 I/O uart1_dsrn 4 I pr1_pru0_pru_r30_9 5 O pr1_pru0_pru_r31_9 6 I gpio2_27 7 I/O mmc0_dat3 0 I/O gpmc_a20 1 O uart4_ctsn 2 I timer5 3 I/O uart1_dcdn 4 I pr1_pru0_pru_r30_8 5 O pr1_pru0_pru_r31_8 6 I gpio2_26 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] H H 7 VDDSHV4 / VDDSHV4 Yes 6 PU/PD LVCMOS H H 7 VDDSHV4 / VDDSHV4 Yes 6 PU/PD LVCMOS H H 7 VDDSHV4 / VDDSHV4 Yes 6 PU/PD LVCMOS C7 C6 PMIC_POWER_EN PMIC_POWER_EN 0 O H 1 0 VDDS_RTC / VDDS_RTC NA 6 NA LVCMOS E15 B15 PWRONRSTn porz 0 I Z Z 0 VDDSHV6 / VDDSHV6 (12) Yes NA NA LVCMOS B6 A3 RESERVED testout 0 O NA NA NA VDDSHV6 / VDDSHV6 NA NA NA Analog K18 H18 RMII1_REF_CLK rmii1_refclk 0 I/O L L 7 6 PU/PD LVCMOS 1 I VDDSHV5 / VDDSHV5 Yes xdma_event_intr2 spi1_cs0 2 I/O uart5_txd 3 O mcasp1_axr3 4 I/O mmc0_pow 5 O mcasp1_ahclkx 6 I/O gpio0_29 7 I/O ENZ_KALDO_1P8V 0 I Z Z 0 VDDS_RTC / VDDS_RTC NA NA NA Analog A7 B4 (3) RTC_KALDO_ENn Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 41 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] PIN NAME [2] SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] B7 B5 RTC_PWRONRSTn RTC_PORz 0 I Z Z 0 VDDS_RTC / VDDS_RTC Yes NA NA A6 A6 RTC_XTALIN OSC1_IN 0 I H H 0 VDDS_RTC / VDDS_RTC Yes NA PU A5 A4 RTC_XTALOUT OSC1_OUT 0 O Z (23) Z (23) 0 VDDS_RTC / VDDS_RTC NA NA A18 A17 SPI0_SCLK spi0_sclk 0 I/O Z H 7 1 I VDDSHV6 / VDDSHV6 Yes uart2_rxd I2C2_SDA 2 I/OD ehrpwm0A 3 O pr1_uart0_cts_n 4 I pr1_edio_sof 5 O EMU2 6 I/O gpio0_2 7 I/O spi0_cs0 0 I/O Z H 7 mmc2_sdwp 1 I VDDSHV6 / VDDSHV6 I2C1_SCL 2 I/OD ehrpwm0_synci 3 I pr1_uart0_txd 4 O pr1_edio_data_in1 5 I pr1_edio_data_out1 6 O gpio0_5 7 I/O spi0_cs1 0 I/O Z H 7 uart3_rxd 1 I eCAP1_in_PWM1_out 2 I/O mmc0_pow 3 O xdma_event_intr2 4 I mmc0_sdcd 5 I EMU4 6 I/O gpio0_6 7 I/O spi0_d0 0 I/O Z H 7 uart2_txd 1 O I2C2_SCL 2 I/OD ehrpwm0B 3 O pr1_uart0_rts_n 4 O pr1_edio_latch_in 5 I EMU3 6 I/O gpio0_3 7 I/O A17 B16 B18 42 A16 C15 B17 SPI0_CS0 SPI0_CS1 SPI0_D0 (15) I/O CELL [13] LVCMOS (1) LVCMOS NA LVCMOS 6 PU/PD LVCMOS Yes 6 PU/PD LVCMOS VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] B17 B16 PIN NAME [2] SPI0_D1 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] spi0_d1 0 I/O mmc1_sdwp 1 I I2C1_SDA 2 I/OD ehrpwm0_tripzone_input 3 I pr1_uart0_rxd 4 I pr1_edio_data_in0 5 I pr1_edio_data_out0 6 O gpio0_4 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] Z H 7 VDDSHV6 / VDDSHV6 Yes 6 PU/PD LVCMOS B14 A12 TCK TCK 0 I H H 0 VDDSHV6 / VDDSHV6 Yes NA PU/PD LVCMOS B13 B11 TDI TDI 0 I H H 0 VDDSHV6 / VDDSHV6 Yes NA PU/PD LVCMOS A14 A11 TDO TDO 0 O H H 0 VDDSHV6 / VDDSHV6 NA 4 PU/PD LVCMOS C14 C11 TMS TMS 0 I H H 0 VDDSHV6 / VDDSHV6 Yes NA PU/PD LVCMOS A13 B10 TRSTn nTRST 0 I L L 0 VDDSHV6 / VDDSHV6 Yes NA PU/PD LVCMOS F17 E16 UART0_TXD uart0_txd 0 O Z H 7 4 PU/PD LVCMOS 1 I/O VDDSHV6 / VDDSHV6 Yes spi1_cs1 dcan0_rx 2 I I2C2_SCL 3 I/OD eCAP1_in_PWM1_out 4 I/O pr1_pru1_pru_r30_15 5 O pr1_pru1_pru_r31_15 6 I gpio1_11 7 I/O uart0_ctsn 0 I Z H 7 4 PU/PD LVCMOS 1 I VDDSHV6 / VDDSHV6 Yes uart4_rxd dcan1_tx 2 O I2C1_SDA 3 I/OD spi1_d0 4 I/O timer7 5 I/O pr1_edc_sync0_out 6 O gpio1_8 7 I/O F19 E18 UART0_CTSn Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 43 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] E19 F18 C19 D18 D19 44 E15 E17 D15 D16 D17 PIN NAME [2] UART0_RXD UART0_RTSn UART1_TXD UART1_RXD UART1_RTSn SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] uart0_rxd 0 I spi1_cs0 1 I/O dcan0_tx 2 O I2C2_SDA 3 I/OD eCAP2_in_PWM2_out 4 I/O pr1_pru1_pru_r30_14 5 O pr1_pru1_pru_r31_14 6 I gpio1_10 7 I/O uart0_rtsn 0 O uart4_txd 1 O dcan1_rx 2 I I2C1_SCL 3 I/OD spi1_d1 4 I/O spi1_cs0 5 I/O pr1_edc_sync1_out 6 O gpio1_9 7 I/O uart1_txd 0 O mmc2_sdwp 1 I dcan1_rx 2 I I2C1_SCL 3 I/OD pr1_uart0_txd 5 O pr1_pru0_pru_r31_16 6 I gpio0_15 7 I/O uart1_rxd 0 I mmc1_sdwp 1 I dcan1_tx 2 O I2C1_SDA 3 I/OD pr1_uart0_rxd 5 I pr1_pru1_pru_r31_16 6 I gpio0_14 7 I/O uart1_rtsn 0 O timer5 1 I/O dcan0_rx 2 I I2C2_SCL 3 I/OD spi1_cs1 4 I/O pr1_uart0_rts_n 5 O pr1_edc_latch1_in 6 I gpio0_13 7 I/O BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] Z H 7 VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS Z H 7 VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS Z H 7 VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS Z H 7 VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS Z H 7 VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] E17 T18 D18 M15 PIN NAME [2] UART1_CTSn USB0_CE SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] uart1_ctsn 0 I timer6 1 I/O dcan0_tx 2 O I2C2_SDA 3 I/OD spi1_cs0 4 I/O pr1_uart0_cts_n 5 I pr1_edc_latch0_in 6 I gpio0_12 7 I/O USB0_CE 0 A BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] Z H 7 VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS Z Z 0 VDDA*_USB0 / VDDA*_USB0 NA NA NA Analog NA NA NA Analog Yes 8 NA Analog (26) T19 P15 USB0_VBUS USB0_VBUS 0 A Z Z 0 VDDA*_USB0 / VDDA*_USB0 (26) U18 N18 USB0_DM USB0_DM 0 A Z Z 0 (13) VDDA*_USB0 / VDDA*_USB0 (16) (16) (26) G16 V19 F16 P16 USB0_DRVVBUS USB0_ID USB0_DRVVBUS 0 O gpio0_18 7 I/O USB0_ID 0 A L 0(PD) 0 VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS Z Z 0 VDDA*_USB0 / VDDA*_USB0 NA NA NA Analog Yes 8 NA Analog (26) U19 N17 USB0_DP USB0_DP 0 A Z Z 0 (13) VDDA*_USB0 / VDDA*_USB0 (16) (16) (26) NA P18 USB1_CE USB1_CE 0 A Z Z 0 NA / VDDA*_USB1 NA NA NA Analog NA NA NA Analog NA NA NA Analog Yes 8 NA Analog PU/PD LVCMOS NA Analog (27) NA P17 USB1_ID USB1_ID 0 A Z Z 0 NA / VDDA*_USB1 (27) NA T18 USB1_VBUS USB1_VBUS 0 A Z Z 0 NA / VDDA*_USB1 (27) NA R17 USB1_DP USB1_DP 0 A Z Z 0 (14) NA / VDDA*_USB1 (17) (17) (27) NA NA F15 R18 USB1_DRVVBUS USB1_DM USB1_DRVVBUS 0 O gpio3_13 7 I/O USB1_DM 0 A L 0(PD) 0 Z Z 0 (14) NA / VDDSHV6 Yes 4 NA / VDDA*_USB1 8 Yes (17) (17) (27) R17 N16 VDDA1P8V_USB0 VDDA1P8V_USB0 NA PWR NA R16 VDDA1P8V_USB1 VDDA1P8V_USB1 NA PWR R18 N15 VDDA3P3V_USB0 VDDA3P3V_USB0 NA PWR NA R15 VDDA3P3V_USB1 VDDA3P3V_USB1 NA PWR Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 45 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] D7 SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] BUFFER STRENGTH (mA) [11] PULLUP /DOWN TYPE [12] I/O CELL [13] VDDA_ADC VDDA_ADC NA PWR D12, F16, E6, E14, F9, M16, T6, T14 K13, N6, P9, P14 VDDS VDDS NA PWR R8, R9, R11, R12, R13 P7, P8 VDDSHV1 VDDSHV1 NA PWR NA P10, P11 VDDSHV2 VDDSHV2 NA PWR NA P12, P13 VDDSHV3 VDDSHV3 NA PWR G15, H14, H15 H14, J14 VDDSHV4 VDDSHV4 NA PWR M14, M15, N15 K14, L14 VDDSHV5 VDDSHV5 NA PWR E11, E12, E10, E11, VDDSHV6 E13, F14, P6, E12, E13, R7 F14, G14, N5, P5, P6 VDDSHV6 NA PWR G5, H5, H6, K4, K5, M5, M6, N5 E5, F5, G5, VDDS_DDR H5, J5, K5, L5 VDDS_DDR NA PWR U10 R11 VDDS_OSC VDDS_OSC NA PWR T8 R10 VDDS_PLL_CORE_LCD VDDS_PLL_CORE_LCD NA PWR C5 E7 VDDS_PLL_DDR VDDS_PLL_DDR NA PWR H16 H15 VDDS_PLL_MPU VDDS_PLL_MPU NA PWR C6 D7 VDDS_RTC VDDS_RTC NA PWR C10 E9 VDDS_SRAM_CORE_BG VDDS_SRAM_CORE_BG NA PWR C12 D10 VDDS_SRAM_MPU_BB VDDS_SRAM_MPU_BB NA PWR F9, F11, G9, G11, H7, H8, H12, H13, J7, J8, J12, J13, K15, K16, L7, L8, L12, L13, M7, M8, M12, M13, N9, N11, P9, P11 F6, F7, G6, VDD_CORE G7, G10, H11, J12, K6, K8, K12, L6, L7, L8, L9, M11, M13, N8, N9, N12, N13 VDD_CORE NA PWR NA F10, F11, F12, F13, G13, H13, J13 VDD_MPU VDD_MPU (30) NA PWR NA A2 VDD_MPU_MON VDD_MPU_MON NA A R5 M5 VPP VPP NA PWR B9 A9 VREFN VREFN 0 AP Z Z 0 VDDA_ADC / VDDA_ADC NA NA NA Analog A9 B9 VREFP VREFP 0 AP Z Z 0 VDDA_ADC / VDDA_ADC NA NA NA Analog 46 D8 PIN NAME [2] (31) Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued) ZCE BALL ZCZ BALL NUMBER [1] NUMBER [1] PIN NAME [2] SIGNAL NAME [3] MODE [4] BALL RESET TYPE BALL RESET RESET REL. ZCE POWER / HYS REL. STATE [5] STATE [6](25) MODE [8] ZCZ POWER [9] [10] [7] A1, A19, D10, E7, E8, E9, E10, F6, F7, F8, F12, F13, G8, G12, H9, H10, H11, J5, J6, J9, J11, J14, J15, K8, K9, K11, K12, L5, L6, L9, L11, L14, L15, M9, M10, M11, N8, N12, P7, P8, P12, P13, P14, R10, T10, W1, W19 A1, A18, F8, VSS G8, G9, G11, G12, H6, H7, H8, H9, H10, H12, J6, J7, J8, J9, J10, J11, K7, K9, K10, K11, L10, L11, L12, L13, M6, M7, M8, M9, M10, M12, N7, N10, N11, V1, V18 VSS NA GND D8 E8 VSSA_ADC VSSA_ADC NA GND P16 M14, N14 VSSA_USB VSSA_USB NA GND V11 V11 VSS_OSC VSS_OSC (28) NA A NA A5 VSS_RTC VSS_RTC (29) NA A A16 A10 WARMRSTn nRESETIN_OUT 0 I/OD 0 0(PU) Z (11) B15 A15 D14 XDMA_EVENT_INTR0 XDMA_EVENT_INTR1 xdma_event_intr0 0 I timer4 2 I/O clkout1 3 O spi1_cs1 4 I/O pr1_pru1_pru_r31_16 5 I EMU2 6 I/O gpio0_19 7 I/O xdma_event_intr1 0 I tclkin 2 I clkout2 3 O timer7 4 I/O pr1_pru0_pru_r31_16 5 I EMU3 6 I/O gpio0_20 7 I/O PULLUP /DOWN TYPE [12] I/O CELL [13] 0 VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS (4) (9) VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS Z L 7 VDDSHV6 / VDDSHV6 Yes 4 PU/PD LVCMOS PD (8) C15 BUFFER STRENGTH (mA) [11] W11 V10 XTALIN OSC0_IN 0 I Z Z 0 VDDS_OSC / VDDS_OSC Yes NA W12 U11 XTALOUT OSC0_OUT 0 O (24) (24) 0 VDDS_OSC / VDDS_OSC NA NA (15) NA (2) LVCMOS LVCMOS Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 47 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com (1) An internal 10 kohm pullup is turned on when the oscillator is disabled. The oscillator is disabled by default after power is applied. (2) An internal 15 kohm pulldown is turned on when the oscillator is disabled. The oscillator is enabled by default after power is applied. (3) Do not connect anything to this terminal. (4) If sysboot[5] is low on the rising edge of PWRONRSTn, this terminal has an internal pulldown turned on after reset is released. If sysboot[5] is high on the rising edge or PWRONRSTn, this terminal will initially be driven low after reset is released then it begins to toggle at the same frequency of the XTALIN terminal. (5) LCD_DATA[15:0] terminals are respectively SYSBOOT[15:0] inputs, latched on the rising edge of PWRONRSTn. (6) Mode1 and Mode2 signal assignments for this terminal are only available with silicon revision 2.0 or newer devices. (7) Mode2 signal assignment for this terminal is only available with silicon revision 2.0 or newer devices. (8) Refer to the External Warm Reset section of the AM335x Technical Reference Manual for more information related to the operation of this terminal. (9) Reset Release Mode = 7 if sysboot[5] is low. Mode = 3 if sysboot[5] is high. (10) Silicon revision 1.0 devices only provide the MMC2_DAT7 signal when Mode3 is selected. Silicon revision 2.0 and newer devices implement another level of pin multiplexing which provides the original MMC2_DAT7 signal or RMII2_CRS_DV signal when Mode3 is selected. This new level of of pin multiplexing is selected with bit zero of the SMA2 register. For more details refer to Section 1.2 of the AM335x Technical Reference Manual. (11) The 0(PU) indicates that this terminal is initially low based on the description in the AM335x Technical Reference Manual. However, it is also has a weak internal pullup applied. (12) The input voltage thresholds for this input are not a function of VDDSHV6. Please refer to the DC Electrical Characteristics section for details related to electrical parameters associated with this input terminal. (13) The internal USB PHY can be configured to multiplex the UART2_TX or UART2_RX signals to this terminal. For more details refer to USB GPIO Details section of the AM335x Technical Reference Manual. (14) The internal USB PHY can be configured to multiplex the UART3_TX or UART3_RX signals to this terminal. For more details refer to USB GPIO Details section of the AM335x Technical Reference Manual. (15) This output should only be used to source the recommended crystal circuit. (16) This parameter only applies when this USB PHY terminal is operating in UART2 mode. (17) This parameter only applies when this USB PHY terminal is operating in UART3 mode. (18) This terminal is a analog input used to set the switching threshold of the DDR input buffers to (VDDS_DDR / 2). (19) This terminal is a analog passive signal that connects to an external 49.9 ohm 1%, 20mW reference resistor which is used to calibrate the DDR input/output buffers. (20) This terminal is analog input that may also be configured as an open-drain output. (21) This terminal is analog input that may also be configured as an open-source or open-drain output. (22) This terminal is analog input that may also be configured as an open-source output. (23) This terminal is high-Z when the oscillator is disabled. This terminal is driven high if RTC_XTALIN is less than VIL, driven low if RTC_XTALIN is greater than VIH, and driven to a unknown value if RTC_XTALIN is between VIL and VIH when the oscillator is enabled. The oscillator is disabled by default after power is applied. (24) This terminal is high-Z when the oscillator is disabled. This terminal is driven high if XTALIN is less than VIL, driven low if XTALIN is greater than VIH, and driven to a unknown value if XTALIN is between VIL and VIH when the oscillator is enabled. The oscillator is enabled by default after power is applied. (25) For all pins with content in the Ball Reset State column of this table, the terminal is not defined until all the supplies are ramped. (26) This terminal requires two power supplies, VDDA3p3v_USB0 and VDDA1p8v_USB0. The "*" character in the power supply name is a wild card that represents "3p3v" and "1p8v". (27) This terminal requires two power supplies, VDDA3p3v_USB1 and VDDA1p8v_USB1. The "*" character in the power supply name is a wild card that represents "3p3v" and "1p8v". (28) Refer to Section 6.2.2 for additional details about VSS_OSC. (29) Refer to Section 6.2.2 for additional details about VSS_RTC. (30) This power rail is connected to VDD_CORE in the ZCE package. (31) This terminal provides a Kelvin connection to VDD_MPU. It can be connected to the power supply feedback input to provide remote sensing which compensates for voltage drop in the 48 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 PCB power distribution network and package. When the Kelvin connection is not used it should be connected to the same power source as VDD_MPU. Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 49 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.3 www.ti.com Signal Descriptions The AM335x device contains many peripheral interfaces. In order to reduce package size and lower overall system cost while maintaining maximum functionality, many of the AM335x terminals can multiplex up to eight signal functions. Although there are many combinations of pin multiplexing that are possible, only a certain number of sets, called I/O Sets, are valid due to timing limitations. These valid I/O Sets were carefully chosen to provide many possible application scenarios for the user. Texas Instruments has developed a Windows-based application called Pin Mux Utility that helps a system designer select the appropriate pin-multiplexing configuration for their AM335x-based product design. The Pin Mux Utility provides a way to select valid I/O Sets of specific peripheral interfaces to ensure the pinmultiplexing configuration selected for a design only uses valid I/O Sets supported by the AM335x device. 50 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 (1) SIGNAL NAME: The signal name (2) DESCRIPTION: Description of the signal (3) TYPE: Ball type for this specific function: – I = Input – O = Output – I/O = Input/Output – D = Open drain – DS = Differential – A = Analog (4) BALL: Package ball location Table 4-3. ADC Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] AIN0 Analog Input/Output A B8 B6 AIN1 Analog Input/Output A A11 C7 AIN2 Analog Input/Output A A8 B7 AIN3 Analog Input/Output A B11 A7 AIN4 Analog Input/Output A C8 C8 AIN5 Analog Input A B12 B8 AIN6 Analog Input A A10 A8 AIN7 Analog Input A A12 C9 VREFN Analog Negative Reference Input AP B9 A9 VREFP Analog Positive Reference Input AP A9 B9 Table 4-4. Debug Subsystem Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] EMU0 MISC EMULATION PIN I/O A15 C14 EMU1 MISC EMULATION PIN I/O D14 B14 EMU2 MISC EMULATION PIN I/O A18, C15 A15, A17, C13 EMU3 MISC EMULATION PIN I/O B15, B18 B17, D13, D14 EMU4 MISC EMULATION PIN I/O B16, U17 A14, C15, T13 nTRST JTAG TEST RESET (ACTIVE LOW) I A13 B10 TCK JTAG TEST CLOCK I B14 A12 TDI JTAG TEST DATA INPUT I B13 B11 TDO JTAG TEST DATA OUTPUT O A14 A11 TMS JTAG TEST MODE SELECT I C14 C11 Table 4-5. LCD Controller Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] lcd_ac_bias_en LCD AC bias enable chip select O W7 R6 lcd_data0 LCD data bus I/O U1 R1 lcd_data1 LCD data bus I/O U2 R2 lcd_data10 LCD data bus I/O U5 U3 lcd_data11 LCD data bus I/O V5 U4 lcd_data12 LCD data bus I/O V6 V2 lcd_data13 LCD data bus I/O U6 V3 lcd_data14 LCD data bus I/O W6 V4 lcd_data15 LCD data bus I/O V7 T5 lcd_data16 LCD data bus O V17 U13 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 51 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-5. LCD Controller Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] lcd_data17 LCD data bus O W17 V13 lcd_data18 LCD data bus O T13 R12 lcd_data19 LCD data bus O U13 T12 lcd_data2 LCD data bus I/O V1 R3 lcd_data20 LCD data bus O U12 U12 lcd_data21 LCD data bus O T12 T11 lcd_data22 LCD data bus O W16 T10 lcd_data23 LCD data bus O V15 U10 lcd_data3 LCD data bus I/O V2 R4 lcd_data4 LCD data bus I/O W2 T1 lcd_data5 LCD data bus I/O W3 T2 lcd_data6 LCD data bus I/O V3 T3 lcd_data7 LCD data bus I/O U3 T4 lcd_data8 LCD data bus I/O V4 U1 lcd_data9 LCD data bus I/O W4 U2 lcd_hsync LCD Horizontal Sync O T7 R5 lcd_memory_clk LCD MCLK O L19, V16 J17, V12 lcd_pclk LCD pixel clock O W5 V5 lcd_vsync LCD Vertical Sync O U7 U5 52 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 4.3.1 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 External Memory Interfaces Table 4-6. External Memory Interfaces/DDR Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] ddr_a0 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O F3 F3 ddr_a1 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O J2 H1 ddr_a10 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O E2 F4 ddr_a11 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O G4 F2 ddr_a12 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O F4 E3 ddr_a13 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O H1 H3 ddr_a14 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O H3 H4 ddr_a15 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O E3 D3 ddr_a2 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O D1 E4 ddr_a3 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O B3 C3 ddr_a4 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O E5 C2 ddr_a5 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O A2 B1 ddr_a6 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O B1 D5 ddr_a7 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O D2 E2 ddr_a8 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O C3 D4 ddr_a9 DDR SDRAM ROW/COLUMN ADDRESS OUTPUT O B2 C1 ddr_ba0 DDR SDRAM BANK ADDRESS OUTPUT O A3 C4 ddr_ba1 DDR SDRAM BANK ADDRESS OUTPUT O E1 E1 ddr_ba2 DDR SDRAM BANK ADDRESS OUTPUT O B4 B3 ddr_casn DDR SDRAM COLUMN ADDRESS STROBE OUTPUT (ACTIVE LOW) O F1 F1 ddr_ck DDR SDRAM CLOCK OUTPUT (Differential+) O C2 D2 ddr_cke DDR SDRAM CLOCK ENABLE OUTPUT O G3 G3 ddr_csn0 DDR SDRAM CHIP SELECT OUTPUT O H2 H2 ddr_d0 DDR SDRAM DATA INPUT/OUTPUT I/O N4 M3 ddr_d1 DDR SDRAM DATA INPUT/OUTPUT I/O P4 M4 ddr_d10 DDR SDRAM DATA INPUT/OUTPUT I/O M3 K2 ddr_d11 DDR SDRAM DATA INPUT/OUTPUT I/O M4 K3 ddr_d12 DDR SDRAM DATA INPUT/OUTPUT I/O M2 K4 ddr_d13 DDR SDRAM DATA INPUT/OUTPUT I/O M1 L3 ddr_d14 DDR SDRAM DATA INPUT/OUTPUT I/O N2 L4 ddr_d15 DDR SDRAM DATA INPUT/OUTPUT I/O N1 M1 ddr_d2 DDR SDRAM DATA INPUT/OUTPUT I/O P2 N1 ddr_d3 DDR SDRAM DATA INPUT/OUTPUT I/O P1 N2 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 53 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-6. External Memory Interfaces/DDR Signals Description (continued) SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] ddr_d4 DDR SDRAM DATA INPUT/OUTPUT I/O P3 N3 ddr_d5 DDR SDRAM DATA INPUT/OUTPUT I/O T1 N4 ddr_d6 DDR SDRAM DATA INPUT/OUTPUT I/O T2 P3 ddr_d7 DDR SDRAM DATA INPUT/OUTPUT I/O R3 P4 ddr_d8 DDR SDRAM DATA INPUT/OUTPUT I/O K2 J1 ddr_d9 DDR SDRAM DATA INPUT/OUTPUT I/O K1 K1 ddr_dqm0 DDR WRITE ENABLE / DATA MASK FOR DATA[7:0] O N3 M2 ddr_dqm1 DDR WRITE ENABLE / DATA MASK FOR DATA[15:8] O K3 J2 ddr_dqs0 DDR DATA STROBE FOR DATA[7:0] (Differential+) I/O R1 P1 ddr_dqs1 DDR DATA STROBE FOR DATA[15:8] (Differential+) I/O L1 L1 ddr_dqsn0 DDR DATA STROBE FOR DATA[7:0] (Differential-) I/O R2 P2 ddr_dqsn1 DDR DATA STROBE FOR DATA[15:8] (Differential-) I/O L2 L2 ddr_nck DDR SDRAM CLOCK OUTPUT (Differential-) O C1 D1 ddr_odt ODT OUTPUT O G1 G1 ddr_rasn DDR SDRAM ROW ADDRESS STROBE OUTPUT (ACTIVE LOW) O F2 G4 ddr_resetn DDR3/DDR3L RESET OUTPUT (ACTIVE LOW) O G2 G2 ddr_vref Voltage Reference Input A H4 J4 ddr_vtp VTP Compensation Resistor I J1 J3 ddr_wen DDR SDRAM WRITE ENABLE OUTPUT (ACTIVE LOW) O A4 B2 Table 4-7. External Memory Interfaces/General-Purpose Memory Controller Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] gpmc_a0 GPMC Address O U1 R1, R13 gpmc_a1 GPMC Address O U2, U7 R2, U5, V14 gpmc_a10 GPMC Address O W5 T16, V5 gpmc_a11 GPMC Address O W7 R6, V17 gpmc_a12 GPMC Address O V4 U1 gpmc_a13 GPMC Address O W4 U2 gpmc_a14 GPMC Address O U5 U3 gpmc_a15 GPMC Address O V5 U4 gpmc_a16 GPMC Address O V6 R13, V2 gpmc_a17 GPMC Address O U6 V14, V3 gpmc_a18 GPMC Address O W6 U14, V4 gpmc_a19 GPMC Address O V7 T14, T5 gpmc_a2 GPMC Address O T7, V1 R3, R5, U14 gpmc_a20 GPMC Address O H19 F17, R14 gpmc_a21 GPMC Address O H18 F18, V15 gpmc_a22 GPMC Address O H17 G15, U15 gpmc_a23 GPMC Address O G18 G16, T15 gpmc_a24 GPMC Address O G19 G17, V16 54 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-7. External Memory Interfaces/General-Purpose Memory Controller Signals Description (continued) SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] gpmc_a25 GPMC Address O G17 G18, U16 gpmc_a26 GPMC Address O NA T16 gpmc_a27 GPMC Address O NA V17 gpmc_a3 GPMC Address O U17, V2 R4, T13, T14 gpmc_a4 GPMC Address O W2 R14, T1 gpmc_a5 GPMC Address O W3 T2, V15 gpmc_a6 GPMC Address O V3 T3, U15 gpmc_a7 GPMC Address O U3 T15, T4 gpmc_a8 GPMC Address O U7 U5, V16 gpmc_a9 GPMC Address O T7 R5, U16 gpmc_ad0 GPMC Address and Data I/O W10 U7 gpmc_ad1 GPMC Address and Data I/O V9 V7 gpmc_ad10 GPMC Address and Data I/O T12 T11 gpmc_ad11 GPMC Address and Data I/O U12 U12 gpmc_ad12 GPMC Address and Data I/O U13 T12 gpmc_ad13 GPMC Address and Data I/O T13 R12 gpmc_ad14 GPMC Address and Data I/O W17 V13 gpmc_ad15 GPMC Address and Data I/O V17 U13 gpmc_ad2 GPMC Address and Data I/O V12 R8 gpmc_ad3 GPMC Address and Data I/O W13 T8 gpmc_ad4 GPMC Address and Data I/O V13 U8 gpmc_ad5 GPMC Address and Data I/O W14 V8 gpmc_ad6 GPMC Address and Data I/O U14 R9 gpmc_ad7 GPMC Address and Data I/O W15 T9 gpmc_ad8 GPMC Address and Data I/O V15 U10 gpmc_ad9 GPMC Address and Data I/O W16 T10 gpmc_advn_ale GPMC Address Valid / Address Latch Enable O V10 R7 gpmc_be0n_cle GPMC Byte Enable 0 / Command Latch Enable O V8 T6 gpmc_be1n GPMC Byte Enable 1 O U15, V18 U18, V9 gpmc_clk GPMC Clock I/O V14, V16 U9, V12 gpmc_csn0 GPMC Chip Select O W8 V6 gpmc_csn1 GPMC Chip Select O V14 U9 gpmc_csn2 GPMC Chip Select O U15 V9 gpmc_csn3 GPMC Chip Select O U17 T13 gpmc_csn4 GPMC Chip Select O R15 T17 gpmc_csn5 GPMC Chip Select O W18 U17 gpmc_csn6 GPMC Chip Select O V18 U18 gpmc_dir GPMC Data Direction O V18 U18 gpmc_oen_ren GPMC Output / Read Enable O W9 T7 gpmc_wait0 GPMC Wait 0 I R15 T17 gpmc_wait1 GPMC Wait 1 I V16 V12 gpmc_wen GPMC Write Enable O U8 U6 gpmc_wpn GPMC Write Protect O W18 U17 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 55 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.3.2 www.ti.com General-Purpose IOs Table 4-8. General-Purpose IOs/GPIO0 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] gpio0_0 GPIO I/O P17 M17 gpio0_1 GPIO I/O R19 M18 gpio0_10 GPIO I/O W6 V4 gpio0_11 GPIO I/O V7 T5 gpio0_12 GPIO I/O E17 D18 gpio0_13 GPIO I/O D19 D17 gpio0_14 GPIO I/O D18 D16 gpio0_15 GPIO I/O C19 D15 gpio0_16 GPIO I/O M17 J18 gpio0_17 GPIO I/O N18 K15 gpio0_18 GPIO I/O G16 F16 gpio0_19 GPIO I/O C15 A15 gpio0_2 GPIO I/O A18 A17 gpio0_20 GPIO I/O B15 D14 gpio0_21 GPIO I/O M18 K16 gpio0_22 GPIO I/O V15 U10 gpio0_23 GPIO I/O W16 T10 gpio0_26 GPIO I/O T12 T11 gpio0_27 GPIO I/O U12 U12 gpio0_28 GPIO I/O L18 K17 gpio0_29 GPIO I/O K18 H18 gpio0_3 GPIO I/O B18 B17 gpio0_30 GPIO I/O R15 T17 gpio0_31 GPIO I/O W18 U17 gpio0_4 GPIO I/O B17 B16 gpio0_5 GPIO I/O A17 A16 gpio0_6 GPIO I/O B16 C15 gpio0_7 GPIO I/O E18 C18 gpio0_8 GPIO I/O V6 V2 gpio0_9 GPIO I/O U6 V3 Table 4-9. General-Purpose IOs/GPIO1 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] gpio1_0 GPIO I/O W10 U7 gpio1_1 GPIO I/O V9 V7 gpio1_10 GPIO I/O E19 E15 gpio1_11 GPIO I/O F17 E16 gpio1_12 GPIO I/O U13 T12 gpio1_13 GPIO I/O T13 R12 gpio1_14 GPIO I/O W17 V13 gpio1_15 GPIO I/O V17 U13 gpio1_16 GPIO I/O NA R13 gpio1_17 GPIO I/O NA V14 gpio1_18 GPIO I/O NA U14 56 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-9. General-Purpose IOs/GPIO1 Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] gpio1_19 GPIO I/O NA T14 gpio1_2 GPIO I/O V12 R8 gpio1_20 GPIO I/O NA R14 gpio1_21 GPIO I/O NA V15 gpio1_22 GPIO I/O NA U15 gpio1_23 GPIO I/O NA T15 gpio1_24 GPIO I/O NA V16 gpio1_25 GPIO I/O NA U16 gpio1_26 GPIO I/O NA T16 gpio1_27 GPIO I/O NA V17 gpio1_28 GPIO I/O V18 U18 gpio1_29 GPIO I/O W8 V6 gpio1_3 GPIO I/O W13 T8 gpio1_30 GPIO I/O V14 U9 gpio1_31 GPIO I/O U15 V9 gpio1_4 GPIO I/O V13 U8 gpio1_5 GPIO I/O W14 V8 gpio1_6 GPIO I/O U14 R9 gpio1_7 GPIO I/O W15 T9 gpio1_8 GPIO I/O F19 E18 gpio1_9 GPIO I/O F18 E17 Table 4-10. General-Purpose IOs/GPIO2 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] gpio2_0 GPIO I/O U17 T13 gpio2_1 GPIO I/O V16 V12 gpio2_10 GPIO I/O W2 T1 gpio2_11 GPIO I/O W3 T2 gpio2_12 GPIO I/O V3 T3 gpio2_13 GPIO I/O U3 T4 gpio2_14 GPIO I/O V4 U1 gpio2_15 GPIO I/O W4 U2 gpio2_16 GPIO I/O U5 U3 gpio2_17 GPIO I/O V5 U4 gpio2_18 GPIO I/O N17 L17 gpio2_19 GPIO I/O N16 L16 gpio2_2 GPIO I/O V10 R7 gpio2_20 GPIO I/O P19 L15 gpio2_21 GPIO I/O P18 M16 gpio2_22 GPIO I/O U7 U5 gpio2_23 GPIO I/O T7 R5 gpio2_24 GPIO I/O W5 V5 gpio2_25 GPIO I/O W7 R6 gpio2_26 GPIO I/O H19 F17 gpio2_27 GPIO I/O H18 F18 gpio2_28 GPIO I/O H17 G15 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 57 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-10. General-Purpose IOs/GPIO2 Signals Description (continued) SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] gpio2_29 GPIO I/O G18 G16 gpio2_3 GPIO I/O W9 T7 gpio2_30 GPIO I/O G19 G17 gpio2_31 GPIO I/O G17 G18 gpio2_4 GPIO I/O U8 U6 gpio2_5 GPIO I/O V8 T6 gpio2_6 GPIO I/O U1 R1 gpio2_7 GPIO I/O U2 R2 gpio2_8 GPIO I/O V1 R3 gpio2_9 GPIO I/O V2 R4 Table 4-11. General-Purpose IOs/GPIO3 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] gpio3_0 GPIO I/O J19 H16 gpio3_1 GPIO I/O J18 H17 gpio3_10 GPIO I/O M19 L18 gpio3_13 GPIO I/O NA F15 gpio3_14 GPIO I/O NA A13 gpio3_15 GPIO I/O NA B13 gpio3_16 GPIO I/O NA D12 gpio3_17 GPIO I/O NA C12 gpio3_18 GPIO I/O NA B12 gpio3_19 GPIO I/O NA C13 gpio3_2 GPIO I/O K19 J15 gpio3_20 GPIO I/O NA D13 gpio3_21 GPIO I/O NA A14 gpio3_3 GPIO I/O K17 J16 gpio3_4 GPIO I/O L19 J17 gpio3_5 GPIO I/O C18 C17 gpio3_6 GPIO I/O B19 C16 gpio3_7 GPIO I/O A15 C14 gpio3_8 GPIO I/O D14 B14 gpio3_9 GPIO I/O N19 K18 58 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 4.3.3 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Miscellaneous Table 4-12. Miscellaneous/Miscellaneous Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] clkout1 Clock out1 O C15 A15 clkout2 Clock out2 O B15 D14 ENZ_KALDO_1P8V Active low enable input for internal CAP_VDD_RTC voltage regulator I A7 B4 EXT_WAKEUP EXT_WAKEUP input I B5 C5 nNMI External Interrupt to ARM Cortex-A8 core I C17 B18 nRESETIN_OUT Active low Warm Reset I/OD A16 A10 OSC0_IN High frequency oscillator input I W11 V10 OSC0_OUT High frequency oscillator output O W12 U11 OSC1_IN Low frequency (32.768 kHz) Real Time Clock oscillator input I A6 A6 OSC1_OUT Low frequency (32.768 kHz) Real Time Clock oscillator output O A5 A4 PMIC_POWER_EN PMIC_POWER_EN output O C7 C6 porz Active low Power on Reset I E15 B15 RTC_PORz Active low RTC reset input I B7 B5 tclkin Timer Clock In I B15 D14 xdma_event_intr0 External DMA Event or Interrupt 0 I C15 A15 xdma_event_intr1 External DMA Event or Interrupt 1 I B15 D14 xdma_event_intr2 External DMA Event or Interrupt 2 I B16, E18, K18 C15, C18, H18 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 59 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.3.3.1 www.ti.com eCAP Table 4-13. eCAP/eCAP0 Signals Description SIGNAL NAME [1] eCAP0_in_PWM0_out DESCRIPTION [2] Enhanced Capture 0 input or Auxiliary PWM0 output TYPE [3] I/O ZCE BALL [4] E18 ZCZ BALL [4] C18 Table 4-14. eCAP/eCAP1 Signals Description SIGNAL NAME [1] eCAP1_in_PWM1_out DESCRIPTION [2] Enhanced Capture 1 input or Auxiliary PWM1 output TYPE [3] I/O ZCE BALL [4] B16, B19, F17 ZCZ BALL [4] C15, C16, E16 Table 4-15. eCAP/eCAP2 Signals Description SIGNAL NAME [1] eCAP2_in_PWM2_out 60 DESCRIPTION [2] Enhanced Capture 2 input or Auxiliary PWM2 output Terminal Configuration and Functions TYPE [3] I/O ZCE BALL [4] C18, E19 ZCZ BALL [4] C12, C17, E15 Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 4.3.3.2 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 eHRPWM Table 4-16. eHRPWM/eHRPWM0 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] ehrpwm0A eHRPWM0 A output. O A18 A13, A17 ehrpwm0B eHRPWM0 B output. O B18 B13, B17 ehrpwm0_synci Sync input to eHRPWM0 module from an external pin I A17 A16, C12 ehrpwm0_synco Sync Output from eHRPWM0 module to an external pin O U12, V2, W4 R4, U12, U2, V14 ehrpwm0_tripzone_input eHRPWM0 trip zone input I B17 B16, D12 Table 4-17. eHRPWM/eHRPWM1 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] ehrpwm1A eHRPWM1 A output. O U5 U14, U3 ehrpwm1B eHRPWM1 B output. O V5 T14, U4 ehrpwm1_tripzone_input eHRPWM1 trip zone input I V4 R13, U1 Table 4-18. eHRPWM/eHRPWM2 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] ehrpwm2A eHRPWM2 A output. O U1, V15 R1, U10 ehrpwm2B eHRPWM2 B output. O U2, W16 R2, T10 ehrpwm2_tripzone_input eHRPWM2 trip zone input I T12, V1 R3, T11 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 61 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.3.3.3 www.ti.com eQEP Table 4-19. eQEP/eQEP0 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] eQEP0A_in eQEP0A quadrature input I M18 B12, K16 eQEP0B_in eQEP0B quadrature input I L18 C13, K17 eQEP0_index eQEP0 index. I/O K17 D13, J16 eQEP0_strobe eQEP0 strobe. I/O P19 A14, L15 Table 4-20. eQEP/eQEP1 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] eQEP1A_in eQEP1A quadrature input I V6 R14, V2 eQEP1B_in eQEP1B quadrature input I U6 V15, V3 eQEP1_index eQEP1 index. I/O W6 U15, V4 eQEP1_strobe eQEP1 strobe. I/O V7 T15, T5 Table 4-21. eQEP/eQEP2 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] eQEP2A_in eQEP2A quadrature input I U13, W2 T1, T12 eQEP2B_in eQEP2B quadrature input I T13, W3 R12, T2 eQEP2_index eQEP2 index. I/O V3, W17 T3, V13 eQEP2_strobe eQEP2 strobe. I/O U3, V17 T4, U13 62 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 4.3.3.4 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Timer Table 4-22. Timer/Timer4 Signals Description SIGNAL NAME [1] timer4 DESCRIPTION [2] Timer trigger event / PWM out TYPE [3] I/O ZCE BALL [4] C15, C18, K17, V10 ZCZ BALL [4] A15, C17, J16, R7 Table 4-23. Timer/Timer5 Signals Description SIGNAL NAME [1] timer5 DESCRIPTION [2] Timer trigger event / PWM out TYPE [3] I/O ZCE BALL [4] D19, H19, R19, V8 ZCZ BALL [4] D17, F17, M18, T6 Table 4-24. Timer/Timer6 Signals Description SIGNAL NAME [1] timer6 DESCRIPTION [2] Timer trigger event / PWM out TYPE [3] I/O ZCE BALL [4] E17, H18, P17, U8 ZCZ BALL [4] D18, F18, M17, U6 Table 4-25. Timer/Timer7 Signals Description SIGNAL NAME [1] timer7 DESCRIPTION [2] Timer trigger event / PWM out TYPE [3] I/O ZCE BALL [4] B15, B19, F19, W9 ZCZ BALL [4] C16, D14, E18, T7 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 63 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.3.4 www.ti.com PRU-ICSS Table 4-26. PRU-ICSS/eCAP Signals Description SIGNAL NAME [1] pr1_ecap0_ecap_capin_apwm_o TYPE [3] DESCRIPTION [2] Enhanced capture input or Auxiliary PWM out I/O ZCE BALL [4] E18, V17 ZCZ BALL [4] C18, U13 Table 4-27. PRU-ICSS/ECAT Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] pr1_edc_latch0_in Data In I E17 D18 pr1_edc_latch1_in Data In I D19 D17 pr1_edc_sync0_out Data Out O F19 E18 pr1_edc_sync1_out Data Out O F18 E17 pr1_edio_data_in0 Data In I B17 B16 pr1_edio_data_in1 Data In I A17 A16 pr1_edio_data_in2 Data In I U7 U5 pr1_edio_data_in3 Data In I T7 R5 pr1_edio_data_in4 Data In I W5 V5 pr1_edio_data_in5 Data In I W7 R6 pr1_edio_data_in6 Data In I V14, V3 T3, U9 pr1_edio_data_in7 Data In I U15, U3 T4, V9 pr1_edio_data_out0 Data Out O B17 B16 pr1_edio_data_out1 Data Out O A17 A16 pr1_edio_data_out2 Data Out O U7 U5 pr1_edio_data_out3 Data Out O T7 R5 pr1_edio_data_out4 Data Out O W5 V5 pr1_edio_data_out5 Data Out O W7 R6 pr1_edio_data_out6 Data Out O V14, V3 T3, U9 pr1_edio_data_out7 Data Out O U15, U3 T4, V9 pr1_edio_latch_in Latch In I B18 B17 pr1_edio_sof Start of Frame O A18 A17 Table 4-28. PRU-ICSS/MDIO Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] pr1_mdio_data MDIO Data I/O U17 T13 pr1_mdio_mdclk MDIO Clk O V16 V12 Table 4-29. PRU-ICSS/MII0 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] pr1_mii0_col MII Collision Detect I W16 T10 pr1_mii0_crs MII Carrier Sense I U17, W5 T13, V5 pr1_mii0_rxd0 MII Receive Data bit 0 I V5 U4 pr1_mii0_rxd1 MII Receive Data bit 1 I U5 U3 pr1_mii0_rxd2 MII Receive Data bit 2 I W4 U2 pr1_mii0_rxd3 MII Receive Data bit 3 I V4 U1 pr1_mii0_rxdv MII Receive Data Valid I V7 T5 pr1_mii0_rxer MII Receive Data Error I U6 V3 64 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-29. PRU-ICSS/MII0 Signals Description (continued) SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] pr1_mii0_rxlink MII Receive Link I V6 V2 pr1_mii0_txd0 MII Transmit Data bit 0 O W17, W3 T2, V13 pr1_mii0_txd1 MII Transmit Data bit 1 O T13, W2 R12, T1 pr1_mii0_txd2 MII Transmit Data bit 2 O U13, V2 R4, T12 pr1_mii0_txd3 MII Transmit Data bit 3 O U12, V1 R3, U12 pr1_mii0_txen MII Transmit Enable O T12, U2 R2, T11 pr1_mii_mr0_clk MII Receive Clock I W6 V4 pr1_mii_mt0_clk MII Transmit Clock I U1, V15 R1, U10 Table 4-30. PRU-ICSS/MII1 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] pr1_mii1_col MII Collision Detect I R15 T17 pr1_mii1_crs MII Carrier Sense I V16, W7 R6, V12 pr1_mii1_rxd0 MII Receive Data bit 0 I NA V16 pr1_mii1_rxd1 MII Receive Data bit 1 I NA T15 pr1_mii1_rxd2 MII Receive Data bit 2 I NA U15 pr1_mii1_rxd3 MII Receive Data bit 3 I NA V15 pr1_mii1_rxdv MII Receive Data Valid I NA T16 pr1_mii1_rxer MII Receive Data Error I NA V17 pr1_mii1_rxlink MII Receive Link I V18 U18 pr1_mii1_txd0 MII Transmit Data bit 0 O NA R14 pr1_mii1_txd1 MII Transmit Data bit 1 O NA T14 pr1_mii1_txd2 MII Transmit Data bit 2 O NA U14 pr1_mii1_txd3 MII Transmit Data bit 3 O NA V14 pr1_mii1_txen MII Transmit Enable O W18 U17 pr1_mii_mr1_clk MII Receive Clock I NA U16 pr1_mii_mt1_clk MII Transmit Clock I NA R13 Table 4-31. PRU-ICSS/UART0 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] pr1_uart0_cts_n UART Clear to Send I A18, E17 A17, D18 pr1_uart0_rts_n UART Request to Send O B18, D19 B17, D17 pr1_uart0_rxd UART Receive Data I B17, D18 B16, D16 pr1_uart0_txd UART Transmit Data O A17, C19 A16, D15 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 65 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.3.4.1 www.ti.com PRU0 Table 4-32. PRU0/General-Purpose Inputs Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] pr1_pru0_pru_r31_0 PRU0 Data In I NA A13 pr1_pru0_pru_r31_1 PRU0 Data In I NA B13 pr1_pru0_pru_r31_10 PRU0 Data In I H17 G15 pr1_pru0_pru_r31_11 PRU0 Data In I G18 G16 pr1_pru0_pru_r31_12 PRU0 Data In I G19 G17 pr1_pru0_pru_r31_13 PRU0 Data In I G17 G18 pr1_pru0_pru_r31_14 PRU0 Data In I W17 V13 pr1_pru0_pru_r31_15 PRU0 Data In I V17 U13 pr1_pru0_pru_r31_16 PRU0 Data In Capture Enable I B15, C19 D14, D15 pr1_pru0_pru_r31_2 PRU0 Data In I NA D12 pr1_pru0_pru_r31_3 PRU0 Data In I NA C12 pr1_pru0_pru_r31_4 PRU0 Data In I NA B12 pr1_pru0_pru_r31_5 PRU0 Data In I NA C13 pr1_pru0_pru_r31_6 PRU0 Data In I NA D13 pr1_pru0_pru_r31_7 PRU0 Data In I NA A14 pr1_pru0_pru_r31_8 PRU0 Data In I H19 F17 pr1_pru0_pru_r31_9 PRU0 Data In I H18 F18 Table 4-33. PRU0/General-Purpose Outputs Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] pr1_pru0_pru_r30_0 PRU0 Data Out O NA A13 pr1_pru0_pru_r30_1 PRU0 Data Out O NA B13 pr1_pru0_pru_r30_10 PRU0 Data Out O H17 G15 pr1_pru0_pru_r30_11 PRU0 Data Out O G18 G16 pr1_pru0_pru_r30_12 PRU0 Data Out O G19 G17 pr1_pru0_pru_r30_13 PRU0 Data Out O G17 G18 pr1_pru0_pru_r30_14 PRU0 Data Out O U13 T12 pr1_pru0_pru_r30_15 PRU0 Data Out O T13 R12 pr1_pru0_pru_r30_2 PRU0 Data Out O NA D12 pr1_pru0_pru_r30_3 PRU0 Data Out O NA C12 pr1_pru0_pru_r30_4 PRU0 Data Out O NA B12 pr1_pru0_pru_r30_5 PRU0 Data Out O NA C13 pr1_pru0_pru_r30_6 PRU0 Data Out O NA D13 pr1_pru0_pru_r30_7 PRU0 Data Out O NA A14 pr1_pru0_pru_r30_8 PRU0 Data Out O H19 F17 pr1_pru0_pru_r30_9 PRU0 Data Out O H18 F18 66 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 4.3.4.2 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 PRU1 Table 4-34. PRU1/General-Purpose Inputs Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] pr1_pru1_pru_r31_0 PRU1 Data In I U1 R1 pr1_pru1_pru_r31_1 PRU1 Data In I U2 R2 pr1_pru1_pru_r31_10 PRU1 Data In I W5 V5 pr1_pru1_pru_r31_11 PRU1 Data In I W7 R6 pr1_pru1_pru_r31_12 PRU1 Data In I V14 U9 pr1_pru1_pru_r31_13 PRU1 Data In I U15 V9 pr1_pru1_pru_r31_14 PRU1 Data In I E19 E15 pr1_pru1_pru_r31_15 PRU1 Data In I F17 E16 pr1_pru1_pru_r31_16 PRU1 Data In Capture Enable I C15, D18 A15, D16 pr1_pru1_pru_r31_2 PRU1 Data In I V1 R3 pr1_pru1_pru_r31_3 PRU1 Data In I V2 R4 pr1_pru1_pru_r31_4 PRU1 Data In I W2 T1 pr1_pru1_pru_r31_5 PRU1 Data In I W3 T2 pr1_pru1_pru_r31_6 PRU1 Data In I V3 T3 pr1_pru1_pru_r31_7 PRU1 Data In I U3 T4 pr1_pru1_pru_r31_8 PRU1 Data In I U7 U5 pr1_pru1_pru_r31_9 PRU1 Data In I T7 R5 Table 4-35. PRU1/General-Purpose Outputs Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] pr1_pru1_pru_r30_0 PRU1 Data Out O U1 R1 pr1_pru1_pru_r30_1 PRU1 Data Out O U2 R2 pr1_pru1_pru_r30_10 PRU1 Data Out O W5 V5 pr1_pru1_pru_r30_11 PRU1 Data Out O W7 R6 pr1_pru1_pru_r30_12 PRU1 Data Out O V14 U9 pr1_pru1_pru_r30_13 PRU1 Data Out O U15 V9 pr1_pru1_pru_r30_14 PRU1 Data Out O E19 E15 pr1_pru1_pru_r30_15 PRU1 Data Out O F17 E16 pr1_pru1_pru_r30_2 PRU1 Data Out O V1 R3 pr1_pru1_pru_r30_3 PRU1 Data Out O V2 R4 pr1_pru1_pru_r30_4 PRU1 Data Out O W2 T1 pr1_pru1_pru_r30_5 PRU1 Data Out O W3 T2 pr1_pru1_pru_r30_6 PRU1 Data Out O V3 T3 pr1_pru1_pru_r30_7 PRU1 Data Out O U3 T4 pr1_pru1_pru_r30_8 PRU1 Data Out O U7 U5 pr1_pru1_pru_r30_9 PRU1 Data Out O T7 R5 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 67 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.3.5 www.ti.com Removable Media Interfaces Table 4-36. Removable Media Interfaces/MMC0 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] mmc0_clk MMC/SD/SDIO Clock I/O G19 G17 mmc0_cmd MMC/SD/SDIO Command I/O G17 G18 mmc0_dat0 MMC/SD/SDIO Data Bus I/O G18 G16 mmc0_dat1 MMC/SD/SDIO Data Bus I/O H17 G15 mmc0_dat2 MMC/SD/SDIO Data Bus I/O H18 F18 mmc0_dat3 MMC/SD/SDIO Data Bus I/O H19 F17 mmc0_dat4 MMC/SD/SDIO Data Bus I/O N16 L16 mmc0_dat5 MMC/SD/SDIO Data Bus I/O N17 L17 mmc0_dat6 MMC/SD/SDIO Data Bus I/O M19 L18 mmc0_dat7 MMC/SD/SDIO Data Bus I/O N19 K18 mmc0_pow MMC/SD Power Switch Control O B16, K18 C15, H18 mmc0_sdcd SD Card Detect I B16, P17 A13, C15, M17 mmc0_sdwp SD Write Protect I E18, R19 B12, C18, M18 Table 4-37. Removable Media Interfaces/MMC1 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] mmc1_clk MMC/SD/SDIO Clock I/O L18, R19, V14 K17, M18, U9 mmc1_cmd MMC/SD/SDIO Command I/O M18, P17, U15 K16, M17, V9 mmc1_dat0 MMC/SD/SDIO Data Bus I/O N19, V15, W10 K18, U10, U7 mmc1_dat1 MMC/SD/SDIO Data Bus I/O M19, V9, W16 L18, T10, V7 mmc1_dat2 MMC/SD/SDIO Data Bus I/O N17, T12, V12 L17, R8, T11 mmc1_dat3 MMC/SD/SDIO Data Bus I/O N16, U12, W13 L16, T8, U12 mmc1_dat4 MMC/SD/SDIO Data Bus I/O U13, V13 T12, U8 mmc1_dat5 MMC/SD/SDIO Data Bus I/O T13, W14 R12, V8 mmc1_dat6 MMC/SD/SDIO Data Bus I/O U14, W17 R9, V13 mmc1_dat7 MMC/SD/SDIO Data Bus I/O V17, W15 T9, U13 mmc1_sdcd SD Card Detect I R15 B13, T17 mmc1_sdwp SD Write Protect I B17, D18 B16, D16 Table 4-38. Removable Media Interfaces/MMC2 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] mmc2_clk MMC/SD/SDIO Clock I/O P19, R19, V16 L15, M18, V12 mmc2_cmd MMC/SD/SDIO Command I/O K17, P17, U17 J16, M17, T13 mmc2_dat0 MMC/SD/SDIO Data Bus I/O L19, U13 J17, T12, V14 mmc2_dat1 MMC/SD/SDIO Data Bus I/O M17, T13 J18, R12, U14 mmc2_dat2 MMC/SD/SDIO Data Bus I/O N18, W17 K15, T14, V13 mmc2_dat3 MMC/SD/SDIO Data Bus I/O J19, V17, V18 H16, U13, U18 mmc2_dat4 MMC/SD/SDIO Data Bus I/O V15 U10, U15 mmc2_dat5 MMC/SD/SDIO Data Bus I/O W16 T10, T15 mmc2_dat6 MMC/SD/SDIO Data Bus I/O T12 T11, V16 mmc2_dat7 MMC/SD/SDIO Data Bus I/O U12 U12 mmc2_sdcd SD Card Detect I W18 D12, U17 mmc2_sdwp SD Write Protect I A17, C19 A16, D15 68 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 4.3.6 4.3.6.1 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Serial Communication Interfaces CAN Table 4-39. CAN/DCAN0 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] dcan0_rx DCAN0 Receive Data I D19, F17, N18 D17, E16, K15 dcan0_tx DCAN0 Transmit Data O E17, E19, M17 D18, E15, J18 Table 4-40. CAN/DCAN1 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] dcan1_rx DCAN1 Receive Data I C19, F18, G17 D15, E17, G18 dcan1_tx DCAN1 Transmit Data O D18, F19, G19 D16, E18, G17 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 69 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.3.6.2 www.ti.com GEMAC_CPSW Table 4-41. GEMAC_CPSW/MDIO Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] mdio_clk MDIO Clk O R19 M18 mdio_data MDIO Data I/O P17 M17 Table 4-42. GEMAC_CPSW/MII1 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] gmii1_col MII Colision I J19 H16 gmii1_crs MII Carrier Sense I J18 H17 gmii1_rxclk MII Receive Clock I M19 L18 gmii1_rxd0 MII Receive Data bit 0 I P18 M16 gmii1_rxd1 MII Receive Data bit 1 I P19 L15 gmii1_rxd2 MII Receive Data bit 2 I N16 L16 gmii1_rxd3 MII Receive Data bit 3 I N17 L17 gmii1_rxdv MII Receive Data Valid I L19 J17 gmii1_rxer MII Receive Data Error I K19 J15 gmii1_txclk MII Transmit Clock I N19 K18 gmii1_txd0 MII Transmit Data bit 0 O L18 K17 gmii1_txd1 MII Transmit Data bit 1 O M18 K16 gmii1_txd2 MII Transmit Data bit 2 O N18 K15 gmii1_txd3 MII Transmit Data bit 3 O M17 J18 gmii1_txen MII Transmit Enable O K17 J16 Table 4-43. GEMAC_CPSW/MII2 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] gmii2_col MII Colision I V18 U18 gmii2_crs MII Carrier Sense I R15 T17 gmii2_rxclk MII Receive Clock I NA T15 gmii2_rxd0 MII Receive Data bit 0 I NA V17 gmii2_rxd1 MII Receive Data bit 1 I NA T16 gmii2_rxd2 MII Receive Data bit 2 I NA U16 gmii2_rxd3 MII Receive Data bit 3 I NA V16 gmii2_rxdv MII Receive Data Valid I NA V14 gmii2_rxer MII Receive Data Error I W18 U17 gmii2_txclk MII Transmit Clock I NA U15 gmii2_txd0 MII Transmit Data bit 0 O NA V15 gmii2_txd1 MII Transmit Data bit 1 O NA R14 gmii2_txd2 MII Transmit Data bit 2 O NA T14 gmii2_txd3 MII Transmit Data bit 3 O NA U14 gmii2_txen MII Transmit Enable O NA R13 Table 4-44. GEMAC_CPSW/RGMII1 Signals Description SIGNAL NAME [1] rgmii1_rclk 70 TYPE [3] DESCRIPTION [2] RGMII Receive Clock Terminal Configuration and Functions I ZCE BALL [4] M19 ZCZ BALL [4] L18 Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-44. GEMAC_CPSW/RGMII1 Signals Description (continued) SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] rgmii1_rctl RGMII Receive Control I L19 J17 rgmii1_rd0 RGMII Receive Data bit 0 I P18 M16 rgmii1_rd1 RGMII Receive Data bit 1 I P19 L15 rgmii1_rd2 RGMII Receive Data bit 2 I N16 L16 rgmii1_rd3 RGMII Receive Data bit 3 I N17 L17 rgmii1_tclk RGMII Transmit Clock O N19 K18 rgmii1_tctl RGMII Transmit Control O K17 J16 rgmii1_td0 RGMII Transmit Data bit 0 O L18 K17 rgmii1_td1 RGMII Transmit Data bit 1 O M18 K16 rgmii1_td2 RGMII Transmit Data bit 2 O N18 K15 rgmii1_td3 RGMII Transmit Data bit 3 O M17 J18 Table 4-45. GEMAC_CPSW/RGMII2 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] rgmii2_rclk RGMII Receive Clock I NA T15 rgmii2_rctl RGMII Receive Control I NA V14 rgmii2_rd0 RGMII Receive Data bit 0 I NA V17 rgmii2_rd1 RGMII Receive Data bit 1 I NA T16 rgmii2_rd2 RGMII Receive Data bit 2 I NA U16 rgmii2_rd3 RGMII Receive Data bit 3 I NA V16 rgmii2_tclk RGMII Transmit Clock O NA U15 rgmii2_tctl RGMII Transmit Control O NA R13 rgmii2_td0 RGMII Transmit Data bit 0 O NA V15 rgmii2_td1 RGMII Transmit Data bit 1 O NA R14 rgmii2_td2 RGMII Transmit Data bit 2 O NA T14 rgmii2_td3 RGMII Transmit Data bit 3 O NA U14 Table 4-46. GEMAC_CPSW/RMII1 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] rmii1_crs_dv RMII Carrier Sense / Data Valid I J18 H17 rmii1_refclk RMII Reference Clock I/O K18 H18 rmii1_rxd0 RMII Receive Data bit 0 I P18 M16 rmii1_rxd1 RMII Receive Data bit 1 I P19 L15 rmii1_rxer RMII Receive Data Error I K19 J15 rmii1_txd0 RMII Transmit Data bit 0 O L18 K17 rmii1_txd1 RMII Transmit Data bit 1 O M18 K16 rmii1_txen RMII Transmit Enable O K17 J16 Table 4-47. GEMAC_CPSW/RMII2 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] rmii2_crs_dv RMII Carrier Sense / Data Valid I R15, U17 T13, T17, U16 rmii2_refclk RMII Reference Clock I/O J19 H16 rmii2_rxd0 RMII Receive Data bit 0 I NA V17 rmii2_rxd1 RMII Receive Data bit 1 I NA T16 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 71 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 4-47. GEMAC_CPSW/RMII2 Signals Description (continued) SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] rmii2_rxer RMII Receive Data Error I W18 U17 rmii2_txd0 RMII Transmit Data bit 0 O NA V15 rmii2_txd1 RMII Transmit Data bit 1 O NA R14 rmii2_txen RMII Transmit Enable O NA R13 72 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 4.3.6.3 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 I2C Table 4-48. I2C/I2C0 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] I2C0_SCL I2C0 Clock I/OD B19 C16 I2C0_SDA I2C0 Data I/OD C18 C17 Table 4-49. I2C/I2C1 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] I2C1_SCL I2C1 Clock I/OD A17, C19, F18, K19 A16, D15, E17, J15 I2C1_SDA I2C1 Data I/OD B17, D18, F19, J18 B16, D16, E18, H17 Table 4-50. I2C/I2C2 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] I2C2_SCL I2C2 Clock I/OD B18, D19, F17 B17, D17, E16 I2C2_SDA I2C2 Data I/OD A18, E17, E19 A17, D18, E15 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 73 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.3.6.4 www.ti.com McASP Table 4-51. McASP/MCASP0 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] mcasp0_aclkr McASP0 Receive Bit Clock I/O L19, V18, V6 B12, J17, U18, V2 mcasp0_aclkx McASP0 Transmit Bit Clock I/O N19, V4 A13, K18, U1, V16 mcasp0_ahclkr McASP0 Receive Master Clock I/O V5 C12, U4 mcasp0_ahclkx McASP0 Transmit Master Clock I/O N18, V7 A14, K15, T5 mcasp0_axr0 McASP0 Serial Data (IN/OUT) I/O N17, U5 D12, L17, T16, U3 mcasp0_axr1 McASP0 Serial Data (IN/OUT) I/O N16, W6 D13, L16, V17, V4 mcasp0_axr2 McASP0 Serial Data (IN/OUT) I/O J19, V5, V6 B12, C12, H16, U4, V2 mcasp0_axr3 McASP0 Serial Data (IN/OUT) I/O P18, U6, V7 A14, C13, M16, T5, V3 mcasp0_fsr McASP0 Receive Frame Sync I/O M17, U6, V16 C13, J18, V12, V3 mcasp0_fsx McASP0 Transmit Frame Sync I/O M19, W4 B13, L18, U16, U2 Table 4-52. McASP/MCASP1 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] mcasp1_aclkr McASP1 Receive Bit Clock I/O L18, P18 K17, M16 mcasp1_aclkx McASP1 Transmit Bit Clock I/O J18, L19 B12, H17, J17 mcasp1_ahclkr McASP1 Receive Master Clock I/O P18 M16 mcasp1_ahclkx McASP1 Transmit Master Clock I/O K18, P18 H18, M16 mcasp1_axr0 McASP1 Serial Data (IN/OUT) I/O K17, N18 D13, J16, K15 mcasp1_axr1 McASP1 Serial Data (IN/OUT) I/O M18 A14, K16 mcasp1_axr2 McASP1 Serial Data (IN/OUT) I/O J19, L18 H16, K17 mcasp1_axr3 McASP1 Serial Data (IN/OUT) I/O K18, P19 H18, L15 mcasp1_fsr McASP1 Receive Frame Sync I/O M18, P19 K16, L15 mcasp1_fsx McASP1 Transmit Frame Sync I/O K19, M17 C13, J15, J18 74 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 4.3.6.5 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 SPI Table 4-53. SPI/SPI0 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] spi0_cs0 SPI Chip Select I/O A17 A16 spi0_cs1 SPI Chip Select I/O B16 C15 spi0_d0 SPI Data I/O B18 B17 spi0_d1 SPI Data I/O B17 B16 spi0_sclk SPI Clock I/O A18 A17 Table 4-54. SPI/SPI1 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] spi1_cs0 SPI Chip Select I/O E17, E19, F18, K18 C12, D18, E15, E17, H18 spi1_cs1 SPI Chip Select I/O C15, D19, E18, F17 A15, C18, D17, E16 spi1_d0 SPI Data I/O F19, J18 B13, E18, H17 spi1_d1 SPI Data I/O F18, K19 D12, E17, J15 spi1_sclk SPI Clock I/O E18, J19 A13, C18, H16 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 75 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.3.6.6 www.ti.com UART Table 4-55. UART/UART0 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] uart0_ctsn UART Clear to Send I F19 E18 uart0_rtsn UART Request to Send O F18 E17 uart0_rxd UART Receive Data I E19 E15 uart0_txd UART Transmit Data O F17 E16 Table 4-56. UART/UART1 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] uart1_ctsn UART Clear to Send I E17 D18 uart1_dcdn UART Data Carrier Detect I H19, N19 F17, K18 uart1_dsrn UART Data Set Ready I H18, M19 F18, L18 uart1_dtrn UART Data Terminal Ready O H17, N17 G15, L17 uart1_rin UART Ring Indicator I G18, N16 G16, L16 uart1_rtsn UART Request to Send O D19 D17 uart1_rxd UART Receive Data I D18 D16 uart1_txd UART Transmit Data O C19 D15 Table 4-57. UART/UART2 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] uart2_ctsn UART Clear to Send I C18, V4 C17, U1 uart2_rtsn UART Request to Send O B19, W4 C16, U2 uart2_rxd UART Receive Data I A18, G19, J18, N19 A17, G17, H17, K18 uart2_txd UART Transmit Data O B18, G17, K19, M19 B17, G18, J15, L18 Table 4-58. UART/UART3 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] uart3_ctsn UART Clear to Send I G19, P17, U5 G17, M17, U3 uart3_rtsn UART Request to Send O G17, R19, V5 G18, M18, U4 uart3_rxd UART Receive Data I B16, H17, N17 C15, G15, L17 uart3_txd UART Transmit Data O E18, G18, N16 C18, G16, L16 Table 4-59. UART/UART4 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] uart4_ctsn UART Clear to Send I H19, V6 F17, V2 uart4_rtsn UART Request to Send O H18, U6 F18, V3 uart4_rxd UART Receive Data I F19, M17, R15 E18, J18, T17 uart4_txd UART Transmit Data O F18, N18, W18 E17, K15, U17 76 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 4-60. UART/UART5 Signals Description SIGNAL NAME [1] TYPE [3] DESCRIPTION [2] ZCE BALL [4] ZCZ BALL [4] uart5_ctsn UART Clear to Send I H17, J18, W6 G15, H17, V4 uart5_rtsn UART Request to Send O G18, K19, V7 G16, J15, T5 uart5_rxd UART Receive Data I J19, P17, W4, W6 H16, M17, U2, V4 uart5_txd UART Transmit Data O K18, L19, R19, V4 H18, J17, M18, U1 Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 77 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 4.3.6.7 www.ti.com USB Table 4-61. USB/USB0 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] USB0_CE USB0 Active high Charger Enable output A T18 M15 USB0_DM USB0 Data minus A U18 N18 USB0_DP USB0 Data plus A U19 N17 USB0_DRVVBUS USB0 Active high VBUS control output O G16 F16 USB0_ID USB0 ID (Micro-A or Micro-B Plug) A V19 P16 USB0_VBUS USB0 VBUS A T19 P15 Table 4-62. USB/USB1 Signals Description SIGNAL NAME [1] DESCRIPTION [2] TYPE [3] ZCE BALL [4] ZCZ BALL [4] USB1_CE USB1 Active high Charger Enable output A NA P18 USB1_DM USB1 Data minus A NA R18 USB1_DP USB1 Data plus A NA R17 USB1_DRVVBUS USB1 Active high VBUS control output O NA F15 USB1_ID USB1 ID (Micro-A or Micro-B Plug) A NA P17 USB1_VBUS USB1 VBUS A NA T18 78 Terminal Configuration and Functions Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 5 Specifications 5.1 Absolute Maximum Ratings over junction temperature range (unless otherwise noted)(1)(2) MIN MAX UNIT VDD_MPU(3) Supply voltage for the MPU core domain –0.5 1.5 V VDD_CORE Supply voltage for the core domain –0.5 1.5 V CAP_VDD_RTC(4) Supply voltage for the RTC core domain –0.5 1.5 V VPP(5) Supply voltage for the FUSE ROM domain –0.5 2.2 V VDDS_RTC Supply voltage for the RTC domain –0.5 2.1 V VDDS_OSC Supply voltage for the System oscillator –0.5 2.1 V VDDS_SRAM_CORE_BG Supply voltage for the Core SRAM LDOs –0.5 2.1 V VDDS_SRAM_MPU_BB Supply voltage for the MPU SRAM LDOs –0.5 2.1 V VDDS_PLL_DDR Supply voltage for the DPLL DDR –0.5 2.1 V VDDS_PLL_CORE_LCD Supply voltage for the DPLL Core and LCD –0.5 2.1 V VDDS_PLL_MPU Supply voltage for the DPLL MPU –0.5 2.1 V VDDS_DDR Supply voltage for the DDR I/O domain –0.5 2.1 V VDDS Supply voltage for all dual-voltage I/O domains –0.5 2.1 V VDDA1P8V_USB0 Supply voltage for USBPHY –0.5 2.1 V VDDA1P8V_USB1(6) Supply voltage for USBPHY –0.5 2.1 V VDDA_ADC Supply voltage for ADC –0.5 2.1 V VDDSHV1 Supply voltage for the dual-voltage I/O domain –0.5 3.8 V VDDSHV2(6) Supply voltage for the dual-voltage I/O domain –0.5 3.8 V VDDSHV3(6) Supply voltage for the dual-voltage I/O domain –0.5 3.8 V VDDSHV4 Supply voltage for the dual-voltage I/O domain –0.5 3.8 V VDDSHV5 Supply voltage for the dual-voltage I/O domain –0.5 3.8 V VDDSHV6 Supply voltage for the dual-voltage I/O domain –0.5 3.8 V VDDA3P3V_USB0 Supply voltage for USBPHY –0.5 4 V VDDA3P3V_USB1(6) Supply voltage for USBPHY –0.5 4 V USB0_VBUS(7) Supply voltage for USB VBUS comparator input –0.5 5.25 V USB1_VBUS(6)(7) Supply voltage for USB VBUS comparator input –0.5 5.25 V DDR_VREF Supply voltage for the DDR SSTL and HSTL reference voltage –0.3 1.1 V Steady state max voltage at all I/O pins(8) (9) –0.5 V to I/O supply voltage + 0.3 V USB0_ID Steady state maximum voltage for the USB ID input –0.5 2.1 V USB1_ID(6)(9) Steady state maximum voltage for the USB ID input –0.5 2.1 V Transient overshoot and undershoot specification at I/O terminal 25% of corresponding I/O supply voltage for up to 30% of signal period Class II (105°C) Latch-up performance(10) Class II (125°C) 45 mA 1.8-V mode –100 100 3.3-V mode; applies to all I/O pins except those included in latch-up pin groups A(12), B(13), and C(14) –100 100 3.3-V mode; applies to latch-up pin group A(12) –35 100 3.3-V mode; applies to latch-up pin group B(13) –45 75 3.3-V mode; applies to latch-up pin group C(14) –100 70 –55 155 Storage temperature, Tstg(11) mA °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to their associated VSS or VSSA_x. (3) Not available on the ZCE package. VDD_MPU is merged with VDD_CORE on the ZCE package. (4) This supply is sourced from an internal LDO when RTC_KALDO_ENn is low. If RTC_KALDO_ENn is high, this supply must be sourced from an external power supply. Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Specifications 79 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Absolute Maximum Ratings (continued) over junction temperature range (unless otherwise noted)(1)(2) (5) During functional operation, this pin is a no connect. (6) Not available on the ZCE package. (7) This terminal is connected to a fail-safe I/O and does not have a dependence on any I/O supply voltage. (8) This parameter applies to all I/O terminals which are not fail-safe and the requirement applies to all values of I/O supply voltage. For example, if the voltage applied to a specific I/O supply is 0 volts the valid input voltage range for any I/O powered by that supply will be –0.5 to +0.3 V. Apply special attention anytime peripheral devices are not powered from the same power sources used to power the respective I/O supply. It is important the attached peripheral never sources a voltage outside the valid input voltage range, including power supply ramp-up and ramp-down sequences. (9) This terminal is connected to analog circuits in the respective USB PHY. The circuit sources a known current while measuring the voltage to determine if the terminal is connected to VSSA_USB with a resistance less than 10 Ω or greater than 100 kΩ. The terminal should be connected to ground for USB host operation or open-circuit for USB peripheral operation, and should never be connected to any external voltage source. (10) Based on JEDEC JESD78D [IC Latch-Up Test]. (11) For tape and reel the storage temperature range is [–10°C; +50°C] with a maximum relative humidity of 70%. TI recommends returning to ambient room temperature before usage. (12) Latch-up pin group A: V7, R8, T8, U8, V8, R9, T9, U10, T10, T11, U12, T12, R12, V13, U13, R13, V14, U14, T14, R14, V15, U15, T15, V16, U16, T16, V17, U17, U18, U9, V9, T13, V12, V4 (13) Latch-up pin group B: R1, R2, R3, R4, T1, T2, T3, V2, V3 (14) Latch-up pin group C: T4, U1, U2, U3, U4, V5, F17, F18, G15, G16, G17, G18, H16, H17, J15, J16, J17, J18, K15, K16, K17, K18, L18, L17, L16, L15, M16, H18, M17, M18 Fail-safe I/O terminals are designed such they do not have dependencies on the respective I/O power supply voltage. This allows external voltage sources to be connected to these I/O terminals when the respective I/O power supplies are turned off. The USB0_VBUS and USB1_VBUS are the only fail-safe I/O terminals. All other I/O terminals are not fail-safe and the voltage applied to them should be limited to the value defined by the steady state max. Voltage at all I/O pins parameter in Section 5.1. 5.2 ESD Ratings VALUE VESD (1) (2) 80 Electrostatic discharge (ESD) performance: Human Body Model (HBM), per ANSI/ESDA/JEDEC JS001 (1) ±2000 Charged Device Model (CDM), per JESD22-C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Specifications Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 5.3 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Power-On Hours (POH) Table 5-1. Reliability Data(1)(2)(3)(4) OPERATING CONDITION COMMERCIAL INDUSTRIAL EXTENDED INDUSTRIAL EXTENDED JUNCTION TEMP (TJ) LIFETIME (POH)(5) JUNCTION TEMP (TJ) LIFETIME (POH)(5) JUNCTION TEMP (TJ) LIFETIME (POH)(5) JUNCTION TEMP (TJ) LIFETIME (POH)(5) Nitro 0°C to 90°C 100K –40°C to 90°C 100K –40°C to 105°C 37K –40°C to 125°C – Turbo 0°C to 90°C 100K –40°C to 90°C 100K –40°C to 105°C 80K –40°C to 125°C – OPP120 0°C to 90°C 100K –40°C to 90°C 100K –40°C to 105°C 100K –40°C to 125°C – OPP100 0°C to 90°C 100K –40°C to 90°C 100K –40°C to 105°C 100K –40°C to 125°C 35K OPP50 0°C to 90°C 100K –40°C to 90°C 100K –40°C to 105°C 100K –40°C to 125°C 95K (1) The power-on hours (POH) information in this table is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard terms and conditions for TI semiconductor products. (2) To avoid significant degradation, the device power-on hours (POH) must be limited as described in this table. (3) Logic functions and parameter values are not assured out of the range specified in the recommended operating conditions. (4) The previous notations cannot be deemed a warranty or deemed to extend or modify the warranty under TI's standard terms and conditions for TI semiconductor products. (5) POH = Power-on hours when the device is fully functional. 5.4 Operating Performance Points (OPPs) Device OPPs are defined in Table 5-2 through Table 5-9. Table 5-2. VDD_CORE OPPs for ZCZ Package Device Rev. "A or Newer"(1) VDD_CORE OPP Device Rev. "A or Newer" VDD_CORE MIN NOM MAX DDR3, DDR3L(2) DDR2(2) mDDR(2) L3 and L4 OPP100 1.056 V 1.100 V 1.144 V 400 MHz 266 MHz 200 MHz 200 and 100 MHz OPP50 0.912 V 0.950 V 0.988 V — 125 MHz 90 MHz 100 and 50 MHz (1) Frequencies in this table indicate maximum performance for a given OPP condition. (2) This parameter represents the maximum memory clock frequency. Because data is transferred on both edges of the clock, double-data rate (DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table. Table 5-3. VDD_MPU OPPs for ZCZ Package With Device Revision Code "Blank"(1) VDD_MPU OPP Device Rev. "Blank" VDD_MPU ARM (A8) MIN NOM MAX Turbo 1.210 V 1.260 V 1.326 V 720 MHz OPP120 1.152 V 1.200 V 1.248 V 600 MHz OPP100(2) 1.056 V 1.100 V 1.144 V 500 MHz OPP100(3) 1.056 V 1.100 V 1.144 V 275 MHz (1) Frequencies in this table indicate maximum performance for a given OPP condition. (2) Applies to all orderable AM335__ZCZ_50 (500-MHz speed grade) or higher devices. (3) Applies to all orderable AM335__ZCZ_27 (275-MHz speed grade) devices. Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Specifications 81 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 5-4. Valid Combinations of VDD_CORE and VDD_MPU OPPs for ZCZ Package With Device Revision Code "Blank" VDD_CORE VDD_MPU OPP50 OPP100 OPP100 OPP100 OPP100 OPP120 OPP100 Turbo Table 5-5. VDD_CORE OPPs for ZCE Package With Device Revision Code "Blank"(1) VDD_CORE OPP Device Rev. "Blank" VDD_MPU(2) ARM (A8) DDR3, DDR3L(3) DDR2(3) mDDR(3) L3 and L4 1.144 V 500 MHz 400 MHz 266 MHz 200 MHz 200 and 100 MHz 1.144 V 275 MHz 400 MHz 266 MHz 200 MHz 200 and 100 MHz MIN NOM MAX OPP100 1.056 V 1.100 V OPP100 1.056 V 1.100 V (1) Frequencies in this table indicate maximum performance for a given OPP condition. (2) VDD_MPU is merged with VDD_CORE on the ZCE package. (3) This parameter represents the maximum memory clock frequency. Because data is transferred on both edges of the clock, double-data rate (DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table. Table 5-6. VDD_CORE OPPs for ZCZ Package With Device Revision Code "A" or Newer(1) VDD_CORE OPP Rev "A" or Newer Industrial extended temperature (–40°C to 125°C) OPP100 VDD_CORE MIN NOM MAX 1.056 V 1.100 V 1.144 V OPP50 DDR2(2) mDDR(2) L3 and L4 266 MHz 200 MHz 200 and 100 MHz 125 MHz 90 MHz 100 and 50 MHz 333 MHz All other temperature ranges Industrial extended temperature (–40°C to 125°C) DDR3, DDR3L(2) 400 MHz 0.912 V 0.950 V 0.988 V — All other temperature ranges (1) Frequencies in this table indicate maximum performance for a given OPP condition. (2) This parameter represents the maximum memory clock frequency. Because data is transferred on both edges of the clock, double-data rate (DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table. Table 5-7. VDD_MPU OPPs for ZCZ Package With Device Revision Code "A" or Newer(1) VDD_MPU OPP Rev "A" or Newer VDD_MPU ARM (A8) MIN NOM MAX Nitro 1.272 V 1.325 V 1.378 V 1 GHz Turbo 1.210 V 1.260 V 1.326 V 800 MHz OPP120 1.152 V 1.200 V 1.248 V 720 MHz (2) 1.056 V 1.100 V 1.144 V 600 MHz OPP100(3) 1.056 V 1.100 V 1.144 V 300 MHz OPP50 0.912 V 0.950 V 0.988 V 300 MHz OPP100 82 Specifications Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 (1) Frequencies in this table indicate maximum performance for a given OPP condition. (2) Applies to all orderable AM335__ZCZ_60 (600-MHz speed grade) or higher devices. (3) Applies to all orderable AM335__ZCZ_30 (300-MHz speed grade) devices. Table 5-8. Valid Combinations of VDD_CORE and VDD_MPU OPPs for ZCZ Package With Device Revision Code "A" or Newer VDD_CORE VDD_MPU OPP50 OPP50 OPP50 OPP100 OPP100 OPP50 OPP100 OPP100 OPP100 OPP120 OPP100 Turbo OPP100 Nitro Table 5-9. VDD_CORE OPPs for ZCE Package With Device Revision Code "A" or Newer(1) VDD_CORE OPP Rev "A" or newer VDD_MPU(2) ARM (A8) DDR3, DDR3L(3) DDR2(3) mDDR(3) L3 and L4 1.144 V 600 MHz 400 MHz 266 MHz 200 MHz 200 and 100 MHz 1.100 V 1.144 V 300 MHz 400 MHz 266 MHz 200 MHz 200 and 100 MHz 0.950 V 0.988 V 300 MHz – 125 MHz 90 MHz 100 and 50 MHz MIN NOM MAX OPP100 1.056 V 1.100 V OPP100 1.056 V OPP50 0.912 V (1) Frequencies in this table indicate maximum performance for a given OPP condition. (2) VDD_MPU is merged with VDD_CORE on the ZCE package. (3) This parameter represents the maximum memory clock frequency. Because data is transferred on both edges of the clock, double-data rate (DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table. Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Specifications 83 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 5.5 www.ti.com Recommended Operating Conditions over junction temperature range (unless otherwise noted) SUPPLY NAME DESCRIPTION MIN NOM MAX Supply voltage range for core domain; OPP100 1.056 1.100 1.144 Supply voltage range for core domain; OPP50 0.912 0.950 0.988 Supply voltage range for MPU domain, Nitro 1.272 1.325 1.378 Supply voltage range for MPU domain; Turbo 1.210 1.260 1.326 Supply voltage range for MPU domain; OPP120 1.152 1.200 1.248 Supply voltage range for MPU domain; OPP100 1.056 1.100 1.144 Supply voltage range for MPU domain; OPP50 0.912 0.950 0.988 CAP_VDD_RTC(3) Supply voltage range for RTC domain input 0.900 1.100 1.250 V VDDS_RTC Supply voltage range for RTC domain 1.710 1.800 1.890 V Supply voltage range for DDR I/O domain (DDR2) 1.710 1.800 1.890 Supply voltage range for DDR I/O domain (DDR3) 1.425 1.500 1.575 Supply voltage range for DDR I/O domain (DDR3L) 1.283 1.350 1.418 VDDS(4) Supply voltage range for all dualvoltage I/O domains 1.710 1.800 1.890 V VDDS_SRAM_CORE_BG Supply voltage range for Core SRAM LDOs, analog 1.710 1.800 1.890 V VDDS_SRAM_MPU_BB Supply voltage range for MPU SRAM LDOs, analog 1.710 1.800 1.890 V VDDS_PLL_DDR(5) Supply voltage range for DPLL DDR, analog 1.710 1.800 1.890 V VDDS_PLL_CORE_LCD(5) Supply voltage range for DPLL CORE and LCD, analog 1.710 1.800 1.890 V VDDS_PLL_MPU(5) Supply voltage range for DPLL MPU, analog 1.710 1.800 1.890 V VDDS_OSC Supply voltage range for system oscillator I/Os, analog 1.710 1.800 1.890 V VDDA1P8V_USB0(5) Supply voltage range for USBPHY and PER DPLL, analog, 1.8 V 1.710 1.800 1.890 V VDDA1P8V_USB1(6) Supply voltage range for USB PHY, analog, 1.8 V 1.710 1.800 1.890 V VDDA3P3V_USB0 Supply voltage range for USB PHY, analog, 3.3 V 3.135 3.300 3.465 V VDDA3P3V_USB1(6) Supply voltage range for USB PHY, analog, 3.3 V 3.135 3.300 3.465 V VDDA_ADC Supply voltage range for ADC, analog 1.710 1.800 1.890 V VDDSHV1 Supply voltage range for dualvoltage I/O domain (1.8-V operation) 1.710 1.800 1.890 V VDDSHV2(6) Supply voltage range for dualvoltage I/O domain (1.8-V operation) 1.710 1.800 1.890 V VDD_CORE(1) VDD_MPU(1)(2) VDDS_DDR 84 Specifications UNIT V V V Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Recommended Operating Conditions (continued) over junction temperature range (unless otherwise noted) SUPPLY NAME MIN NOM MAX UNIT VDDSHV3(6) Supply voltage range for dualvoltage I/O domain (1.8-V operation) DESCRIPTION 1.710 1.800 1.890 V VDDSHV4 Supply voltage range for dualvoltage I/O domain (1.8-V operation) 1.710 1.800 1.890 V VDDSHV5 Supply voltage range for dualvoltage I/O domain (1.8-V operation) 1.710 1.800 1.890 V VDDSHV6 Supply voltage range for dualvoltage I/O domain (1.8-V operation) 1.710 1.800 1.890 V VDDSHV1 Supply voltage range for dualvoltage I/O domain (3.3-V operation) 3.135 3.300 3.465 V VDDSHV2(6) Supply voltage range for dualvoltage I/O domain (3.3-V operation) 3.135 3.300 3.465 V VDDSHV3(6) Supply voltage range for dualvoltage I/O domain (3.3-V operation) 3.135 3.300 3.465 V VDDSHV4 Supply voltage range for dualvoltage I/O domain (3.3-V operation) 3.135 3.300 3.465 V VDDSHV5 Supply voltage range for dualvoltage I/O domain (3.3-V operation) 3.135 3.300 3.465 V VDDSHV6 Supply voltage range for dualvoltage I/O domain (3.3-V operation) 3.135 3.300 3.465 V DDR_VREF Voltage range for DDR SSTL and HSTL reference input (DDR2, 0.49 × VDDS_DDR 0.50 × VDDS_DDR 0.51 × VDDS_DDR DDR3, DDR3L) V USB0_VBUS Voltage range for USB VBUS comparator input 0.000 5.000 5.250 V USB1_VBUS(6) Voltage range for USB VBUS comparator input 0.000 5.000 5.250 V USB0_ID Voltage range for the USB ID input (7) V USB1_ID(6) Voltage range for the USB ID input (7) V Commercial temperature Operating temperature range, TJ 0 90 Industrial temperature –40 90 Extended temperature –40 105 Industrial Extended temperature –40 125 °C (1) The supply voltage defined by OPP100 should be applied to this power domain before the device is released from reset. (2) Not available on the ZCE package. VDD_MPU is merged with VDD_CORE on the ZCE package. (3) This supply is sourced from an internal LDO when RTC_KALDO_ENn is low. If RTC_KALDO_ENn is high, this supply must be sourced from an external power supply. (4) VDDS should be supplied irrespective of 1.8- or 3.3-V mode of operation of the dual-voltage I/Os. (5) For more details on power supply requirements, see Section 6.1.4. (6) Not available on the ZCE package. (7) This terminal is connected to analog circuits in the respective USB PHY. The circuit sources a known current while measuring the voltage to determine if the terminal is connected to VSSA_USB with a resistance less than 10 Ω or greater than 100 kΩ. The terminal should be connected to ground for USB host operation or open-circuit for USB peripheral operation, and should never be connected to any external voltage source. Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Specifications 85 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 5.6 www.ti.com Power Consumption Summary Table 5-10 summarizes the power consumption at the AM335x power terminals. Table 5-10. Maximum Current Ratings at AM335x Power Terminals(1) SUPPLY NAME DESCRIPTION VDD_CORE(2) MAX Maximum current rating for the core domain; OPP100 400 Maximum current rating for the core domain; OPP50 250 Maximum current rating for the MPU domain; Nitro at 1 GHz Maximum current rating for the MPU domain; Turbo Maximum current rating for the MPU domain; OPP120 VDD_MPU(2) Maximum current rating for the MPU domain; OPP100 Maximum current rating for the MPU domain; OPP50 UNIT mA 1000 at 800 MHz 800 at 720 MHz 720 at 720 MHz 720 at 600 MHz 600 at 600 MHz 600 at 500 MHz 500 at 300 MHz 380 at 275 MHz 350 at 300 MHz 330 at 275 MHz 300 mA CAP_VDD_RTC(3) Maximum current rating for RTC domain input and LDO output 2 mA VDDS_RTC Maximum current rating for the RTC domain 5 mA VDDS_DDR Maximum current rating for DDR I/O domain 250 mA VDDS Maximum current rating for all dual-voltage I/O domains 50 mA VDDS_SRAM_CORE_BG Maximum current rating for core SRAM LDOs 10 mA VDDS_SRAM_MPU_BB Maximum current rating for MPU SRAM LDOs 10 mA VDDS_PLL_DDR Maximum current rating for the DPLL DDR 10 mA VDDS_PLL_CORE_LCD Maximum current rating for the DPLL Core and LCD 20 mA VDDS_PLL_MPU Maximum current rating for the DPLL MPU 10 mA VDDS_OSC Maximum current rating for the system oscillator I/Os 5 mA VDDA1P8V_USB0 Maximum current rating for USBPHY 1.8 V 25 mA VDDA1P8V_USB1(4) Maximum current rating for USBPHY 1.8 V 25 mA VDDA3P3V_USB0 Maximum current rating for USBPHY 3.3 V 40 mA VDDA3P3V_USB1(4) Maximum current rating for USBPHY 3.3 V 40 mA VDDA_ADC Maximum current rating for ADC 10 mA VDDSHV1(5) Maximum current rating for dual-voltage I/O domain 50 mA (4) Maximum current rating for dual-voltage I/O domain 50 mA VDDSHV3(4) Maximum current rating for dual-voltage I/O domain 50 mA VDDSHV4 Maximum current rating for dual-voltage I/O domain 50 mA VDDSHV5 Maximum current rating for dual-voltage I/O domain 50 mA VDDSHV6 Maximum current rating for dual-voltage I/O domain 100 mA VDDSHV2 (1) Current ratings specified in this table are worst-case estimates. Actual application power supply estimates could be lower. For more information, see AM335x Power Consumption Summary. (2) VDD_MPU is merged with VDD_CORE and is not available separately on the ZCE package. The maximum current rating for VDD_CORE on the ZCE package is the sum of VDD_CORE and VDD_MPU shown in this table. (3) This supply is sourced from an internal LDO when RTC_KALDO_ENn is low. If RTC_KALDO_ENn is high, this supply must be sourced from an external power supply. (4) Not available on the ZCE package. (5) VDDSHV1 and VDDSHV2 are merged in the ZCE package. The maximum current rating for VDDSHV1 on the ZCE package is the sum of VDDSHV1 and VDDSHV2 shown in this table. 86 Specifications Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 5-11 summarizes the power consumption of the AM335x low-power modes. Table 5-11. AM335x Low-Power Modes Power Consumption Summary POWER MODES Standby Deepsleep1 Deepsleep0 APPLICATION STATE POWER DOMAINS, CLOCKS, AND VOLTAGE SUPPLY STATES NOM MAX UNIT DDR memory is in self-refresh and contents are preserved. Wake up from any GPIO. Cortex-A8 context/register contents are lost and must be saved before entering standby. On exit, context must be restored from DDR. For wakeup, boot ROM executes and branches to system resume. Power supplies: • All power supplies are ON. • VDD_MPU = 0.95 V (nom) • VDD_CORE = 0.95 V (nom) Clocks: • Main Oscillator (OSC0) = ON • All DPLLs are in bypass. Power domains: • PD_PER = ON • PD_MPU = OFF • PD_GFX = OFF • PD_WKUP = ON DDR is in self-refresh. 16.5 22.0 mW On-chip peripheral registers are preserved. Cortex-A8 context/registers are lost, so the application must save them to the L3 OCMC RAM or DDR before entering DeepSleep. DDR is in selfrefresh. For wakeup, boot ROM executes and branches to system resume. Power supplies: • All power supplies are ON. • VDD_MPU = 0.95 V (nom) • VDD_CORE = 0.95 V (nom) Clocks: • Main Oscillator (OSC0) = OFF • All DPLLs are in bypass. Power domains: • PD_PER = ON • PD_MPU = OFF • PD_GFX = OFF • PD_WKUP = ON DDR is in self-refresh. 6.0 10.0 mW PD_PER peripheral and CortexA8/MPU register information will be lost. On-chip peripheral register (context) information of PD-PER domain must be saved by application to SDRAM before entering this mode. DDR is in selfrefresh. For wakeup, boot ROM executes and branches to peripheral context restore followed by system resume. Power supplies: • All power supplies are ON. • VDD_MPU = 0.95 V (nom) • VDD_CORE = 0.95 V (nom) Clocks: • Main Oscillator (OSC0) = OFF • All DPLLs are in bypass. Power domains: • PD_PER = OFF • PD_MPU = OFF • PD_GFX = OFF • PD_WKUP = ON DDR is in self-refresh. 3.0 4.3 mW Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Specifications 87 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 5.7 www.ti.com DC Electrical Characteristics over recommended ranges of supply voltage and operating temperature (unless otherwise noted)(1) PARAMETER MIN NOM MAX UNIT DDR_RESETn,DDR_CSn0,DDR_CKE,DDR_CK,DDR_CKn,DDR_CASn,DDR_RASn,DDR_WEn,DDR_BA0,DDR_BA1,DDR_BA2,DDR_A0,DDR_A1,DDR_A 2,DDR_A3,DDR_A4,DDR_A5,DDR_A6,DDR_A7,DDR_A8,DDR_A9,DDR_A10,DDR_A11,DDR_A12,DDR_A13,DDR_A14,DDR_A15,DDR_ODT,DDR_D0,DD R_D1,DDR_D2,DDR_D3,DDR_D4,DDR_D5,DDR_D6,DDR_D7,DDR_D8,DDR_D9,DDR_D10,DDR_D11,DDR_D12,DDR_D13,DDR_D14,DDR_D15,DDR_DQM 0,DDR_DQM1,DDR_DQS0,DDR_DQSn0,DDR_DQS1,DDR_DQSn1 Pins (mDDR - LVCMOS Mode) 0.65 × VDDS_DDR VIH High-level input voltage VIL Low-level input voltage VHYS Hysteresis voltage at an input VOH High level output voltage, driver enabled, pullup or pulldown disabled IOH = 8 mA VOL Low level output voltage, driver enabled, pullup or pulldown disabled IOL = 8 mA V 0.07 Input leakage current, Receiver disabled, pullup enabled Input leakage current, Receiver disabled, pulldown enabled IOZ V 0.25 V VDDS_DDR – 0.4 V 0.4 Input leakage current, Receiver disabled, pullup or pulldown inhibited II 0.35 × VDDS_DDR V 10 –240 –80 80 240 Total leakage current through the terminal connection of a driver-receiver combination that may include a pullup or pulldown. The driver output is disabled and the pullup or pulldown is inhibited. 10 µA µA DDR_RESETn,DDR_CSn0,DDR_CKE,DDR_CK,DDR_CKn,DDR_CASn,DDR_RASn,DDR_WEn,DDR_BA0,DDR_BA1,DDR_BA2,DDR_A0,DDR_A1,DDR_A 2,DDR_A3,DDR_A4,DDR_A5,DDR_A6,DDR_A7,DDR_A8,DDR_A9,DDR_A10,DDR_A11,DDR_A12,DDR_A13,DDR_A14,DDR_A15,DDR_ODT,DDR_D0,DD R_D1,DDR_D2,DDR_D3,DDR_D4,DDR_D5,DDR_D6,DDR_D7,DDR_D8,DDR_D9,DDR_D10,DDR_D11,DDR_D12,DDR_D13,DDR_D14,DDR_D15,DDR_DQM 0,DDR_DQM1,DDR_DQS0,DDR_DQSn0,DDR_DQS1,DDR_DQSn1 Pins (DDR2 - SSTL Mode) DDR_VREF + 0.125 VIH High-level input voltage VHYS Hysteresis voltage at an input VOH High-level output voltage, driver enabled, pullup or pulldown disabled IOH = 8 mA VOL Low-level output voltage, driver enabled, pullup or pulldown disabled IOL = 8 mA V N/A V 0.4 Input leakage current, Receiver disabled, pullup or pulldown inhibited II Input leakage current, Receiver disabled, pullup enabled Input leakage current, Receiver disabled, pulldown enabled IOZ V VDDS_DDR – 0.4 V 10 –240 –80 80 240 Total leakage current through the terminal connection of a driver-receiver combination that may include a pullup or pulldown. The driver output is disabled and the pullup or pulldown is inhibited. 10 µA µA DDR_RESETn,DDR_CSn0,DDR_CKE,DDR_CK,DDR_CKn,DDR_CASn,DDR_RASn,DDR_WEn,DDR_BA0,DDR_BA1,DDR_BA2,DDR_A0,DDR_A1,DDR_A 2,DDR_A3,DDR_A4,DDR_A5,DDR_A6,DDR_A7,DDR_A8,DDR_A9,DDR_A10,DDR_A11,DDR_A12,DDR_A13,DDR_A14,DDR_A15,DDR_ODT,DDR_D0,DD R_D1,DDR_D2,DDR_D3,DDR_D4,DDR_D5,DDR_D6,DDR_D7,DDR_D8,DDR_D9,DDR_D10,DDR_D11,DDR_D12,DDR_D13,DDR_D14,DDR_D15,DDR_DQM 0,DDR_DQM1,DDR_DQS0,DDR_DQSn0,DDR_DQS1,DDR_DQSn1 Pins (DDR3, DDR3L - HSTL Mode) VIH High-level input voltage VDDS_DDR = 1.5 V DDR_VREF + 0.1 VDDS_DDR = 1.35 V DDR_VREF + 0.09 V VDDS_DDR = 1.5 V DDR_VREF – 0.1 VDDS_DDR = 1.35 V DDR_VREF – 0.09 VIL Low-level input voltage VHYS Hysteresis voltage at an input VOH High-level output voltage, driver enabled, pullup or pulldown disabled IOH = 8 mA VOL Low-level output voltage, driver enabled, pullup or pulldown disabled IOL = 8 mA N/A Input leakage current, Receiver disabled, pullup enabled Input leakage current, Receiver disabled, pulldown enabled IOZ 88 V 0.4 V 10 –240 –80 80 240 Total leakage current through the terminal connection of a driver-receiver combination that may include a pullup or pulldown. The driver output is disabled and the pullup or pulldown is inhibited. Specifications V VDDS_DDR – 0.4 Input leakage current, Receiver disabled, pullup or pulldown inhibited II V 10 µA µA Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 DC Electrical Characteristics (continued) over recommended ranges of supply voltage and operating temperature (unless otherwise noted)(1) PARAMETER MIN NOM MAX UNIT ECAP0_IN_PWM0_OUT,UART0_CTSn,UART0_RTSn,UART0_RXD,UART0_TXD,UART1_CTSn,UART1_RTSn,UART1_RXD,UART1_TXD,I2C0_SDA,I2C0_ SCL,XDMA_EVENT_INTR0,XDMA_EVENT_INTR1,WARMRSTn,EXTINTn,TMS,TDO,USB0_DRVVBUS,USB1_DRVVBUS (VDDSHV6 = 1.8 V) VIH High-level input voltage VIL Low-level input voltage 0.65 × VDDSHV6 VHYS Hysteresis voltage at an input VOH High-level output voltage, driver enabled, pullup or pulldown disabled IOH = 4 mA VOL Low-level output voltage, driver enabled, pullup or pulldown disabled IOL = 4 mA V 0.18 Input leakage current, Receiver disabled, pullup enabled Input leakage current, Receiver disabled, pulldown enabled IOZ V 0.305 V VDDSHV6 – 0.45 V 0.45 Input leakage current, Receiver disabled, pullup or pulldown inhibited II 0.35 × VDDSHV6 V 8 –161 –100 –52 52 100 170 Total leakage current through the terminal connection of a driver-receiver combination that may include a pullup or pulldown. The driver output is disabled and the pullup or pulldown is inhibited. 8 µA µA ECAP0_IN_PWM0_OUT,UART0_CTSn,UART0_RTSn,UART0_RXD,UART0_TXD,UART1_CTSn,UART1_RTSn,UART1_RXD,UART1_TXD,I2C0_SDA,I2C0_ SCL,XDMA_EVENT_INTR0,XDMA_EVENT_INTR1,WARMRSTn,EXTINTn,TMS,TDO,USB0_DRVVBUS,USB1_DRVVBUS (VDDSHV6 = 3.3 V) VIH High-level input voltage VIL Low-level input voltage 2 VHYS Hysteresis voltage at an input VOH High-level output voltage, driver enabled, pullup or pulldown disabled IOH = 4 mA VOL Low-level output voltage, driver enabled, pullup or pulldown disabled IOL = 4 mA V 0.265 Input leakage current, Receiver disabled, pullup enabled Input leakage current, Receiver disabled, pulldown enabled IOZ V 0.44 V VDDSHV6 – 0.45 V 0.45 Input leakage current, Receiver disabled, pullup or pulldown inhibited II 0.8 V 18 –243 –100 –19 51 110 210 Total leakage current through the terminal connection of a driver-receiver combination that may include a pullup or pulldown. The driver output is disabled and the pullup or pulldown is inhibited. 18 µA µA TCK (VDDSHV6 = 1.8 V) VIH High-level input voltage VIL Low-level input voltage VHYS Hysteresis voltage at an input 1.45 V 0.46 0.4 V Input leakage current, Receiver disabled, pullup or pulldown inhibited II Input leakage current, Receiver disabled, pullup enabled Input leakage current, Receiver disabled, pulldown enabled V 8 –161 –100 –52 52 100 170 µA TCK (VDDSHV6 = 3.3 V) VIH High-level input voltage VIL Low-level input voltage VHYS Hysteresis voltage at an input 2.15 V 0.46 0.4 V Input leakage current, Receiver disabled, pullup or pulldown inhibited II Input leakage current, Receiver disabled, pullup enabled Input leakage current, Receiver disabled, pulldown enabled V 18 –243 –100 –19 51 110 210 µA PWRONRSTn (VDDSHV6 = 1.8 or 3.3 V)(2) VIH High-level input voltage VIL Low-level input voltage VHYS Hysteresis voltage at an input II Input leakage current 1.35 V 0.5 0.07 V V VI = 1.8 V 0.1 VI = 3.3 V 2 µA RTC_PWRONRSTn VIH High-level input voltage 0.65 × VDDS_RTC Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 V Specifications 89 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com DC Electrical Characteristics (continued) over recommended ranges of supply voltage and operating temperature (unless otherwise noted)(1) PARAMETER VIL Low-level input voltage VHYS Hysteresis voltage at an input II Input leakage current MIN NOM MAX UNIT 0.35 × VDDS_RTC V 1 µA 0.065 V –1 PMIC_POWER_EN VOH High-level output voltage, driver enabled, pullup or pulldown disabled IOH = 6 mA VOL Low-level output voltage, driver enabled, pullup or pulldown disabled IOL = 6 mA Input leakage current, Receiver disabled, pullup or pulldown inhibited II IOZ VDDS_RTC – 0.45 V 0.45 –1 1 –200 –40 Input leakage current, Receiver disabled, pulldown enabled 40 200 Total leakage current through the terminal connection of a driver-receiver combination that may include a pullup or pulldown. The driver output is disabled and the pullup or pulldown is inhibited. –1 1 Input leakage current, Receiver disabled, pullup enabled V µA µA EXT_WAKEUP VIH High-level input voltage VIL Low-level input voltage VHYS Hysteresis voltage at an input 0.65 × VDDS_RTC 0.35 × VDDS_RTC 0.15 Input leakage current, Receiver disabled, pullup or pulldown inhibited II V Input leakage current, Receiver disabled, pullup enabled Input leakage current, Receiver disabled, pulldown enabled V V –1 1 –200 –40 40 200 µA XTALIN (OSC0) VIH High-level input voltage VIL Low-level input voltage 0.65 × VDDS_OSC V 0.35 × VDDS_OSC V RTC_XTALIN (OSC1) VIH High-level input voltage VIL Low-level input voltage 0.65 × VDDS_RTC V 0.35 × VDDS_RTC V All other LVCMOS pins (VDDSHVx = 1.8 V; x = 1 to 6) VIH High-level input voltage VIL Low-level input voltage 0.65 × VDDSHVx VHYS Hysteresis voltage at an input VOH High-level output voltage, driver enabled, pullup or pulldown disabled IOH = 6 mA VOL Low-level output voltage, driver enabled, pullup or pulldown disabled IOL = 6 mA V 0.18 Input leakage current, Receiver disabled, pullup enabled Input leakage current, Receiver disabled, pulldown enabled IOZ V 0.305 V VDDSHVx – 0.45 V 0.45 Input leakage current, Receiver disabled, pullup or pulldown inhibited II 0.35 × VDDSHVx V 8 –161 –100 –52 52 100 170 Total leakage current through the terminal connection of a driver-receiver combination that may include a pullup or pulldown. The driver output is disabled and the pullup or pulldown is inhibited. 8 µA µA All other LVCMOS pins (VDDSHVx = 3.3 V; x = 1 to 6) VIH High-level input voltage VIL Low-level input voltage VHYS Hysteresis voltage at an input VOH High-level output voltage, driver enabled, pullup or pulldown disabled IOH = 6 mA VOL Low-level output voltage, driver enabled, pullup or pulldown disabled IOL = 6 mA 90 Specifications 2 0.265 V 0.8 V 0.44 V VDDSHVx – 0.45 V 0.45 V Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 DC Electrical Characteristics (continued) over recommended ranges of supply voltage and operating temperature (unless otherwise noted)(1) PARAMETER MIN NOM Input leakage current, Receiver disabled, pullup or pulldown inhibited II Input leakage current, Receiver disabled, pullup enabled Input leakage current, Receiver disabled, pulldown enabled IOZ MAX UNIT 18 –243 –100 –19 51 110 210 Total leakage current through the terminal connection of a driver-receiver combination that may include a pullup or pulldown. The driver output is disabled and the pullup or pulldown is inhibited. 18 µA µA (1) The interfaces or signals described in this table correspond to the interfaces or signals available in multiplexing mode 0. All interfaces or signals multiplexed on the terminals described in this table have the same DC electrical characteristics. (2) The input voltage thresholds for this input are not a function of VDDSHV6. Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Specifications 91 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 5.8 www.ti.com Thermal Resistance Characteristics for ZCE and ZCZ Packages Failure to maintain a junction temperature within the range specified in Section 5.5 reduces operating lifetime, reliability, and performance—and may cause irreversible damage to the system. Therefore, the product design cycle should include thermal analysis to verify the maximum operating junction temperature of the device. It is important this thermal analysis is performed using specific system use cases and conditions. TI provides an application report to aid users in overcoming some of the existing challenges of producing a good thermal design. For more information, see AM335x Thermal Considerations. Table 5-12 provides thermal characteristics for the packages used on this device. NOTE Table 5-12 provides simulation data and may not represent actual use-case values. Table 5-12. Thermal Resistance Characteristics (PBGA Package) [ZCE and ZCZ] ZCE (°C/W) (1) ZCZ (°C/W) (1) (2) AIR FLOW (m/s) (3) (2) RΘJC Junction-to-case 10.3 10.2 N/A RΘJB Junction-to-board 11.6 12.1 N/A 24.7 24.2 0 20.5 20.1 1.0 19.7 19.3 2.0 19.2 18.8 3.0 0.4 0.3 0.0 0.6 0.6 1.0 0.7 0.7 2.0 RΘJA φJT φJB (1) (2) (3) 92 Junction-to-free air Junction-to-package top Junction-to-board 0.9 0.8 3.0 11.9 12.7 0.0 11.7 12.3 1.0 11.7 12.3 2.0 11.6 12.2 3.0 These values are based on a JEDEC-defined 2S2P system (with the exception of the theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70ºC is assumed. °C/W = degrees Celsius per watt. m/s = meters per second. Specifications Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 5.9 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 External Capacitors To improve module performance, decoupling capacitors are required to suppress the switching noise generated by high frequency and to stabilize the supply voltage. A decoupling capacitor is most effective when it is close to the device, because this minimizes the inductance of the circuit board wiring and interconnects. 5.9.1 Voltage Decoupling Capacitors Table 5-13 summarizes the Core voltage decoupling characteristics. 5.9.1.1 Core Voltage Decoupling Capacitors To improve module performance, decoupling capacitors are required to suppress high-frequency switching noise and to stabilize the supply voltage. A decoupling capacitor is most effective when located close to the AM335x device, because this minimizes the inductance of the circuit board wiring and interconnects. Table 5-13. Core Voltage Decoupling Characteristics TYP UNIT CVDD_CORE(1) PARAMETER 10.08 μF CVDD_MPU(2)(3) 10.05 μF TYP UNIT (1) The typical value corresponds to one capacitor of 10 μF and eight capacitors of 10 nF. (2) Not available on the ZCE package. VDD_MPU is merged with VDD_CORE on the ZCE package. (3) The typical value corresponds to one capacitor of 10 μF and five capacitors of 10 nF. 5.9.1.2 I/O and Analog Voltage Decoupling Capacitors Table 5-14 summarizes the power-supply decoupling capacitor recommendations. Table 5-14. Power-Supply Decoupling Capacitor Characteristics PARAMETER CVDDA_ADC 10 nF CVDDA1P8V_USB0 10 nF CCVDDA3P3V_USB0 10 nF (1) 10 nF CVDDA3P3V_USB1(1) 10 nF 10.04 μF CVDDA1P8V_USB1 CVDDS(2) CVDDS_DDR (3) CVDDS_OSC 10 nF CVDDS_PLL_DDR 10 nF CVDDS_PLL_CORE_LCD 10 nF 10.01 μF CVDDS_SRAM_CORE_BG (4) CVDDS_SRAM_MPU_BB(5) CVDDS_PLL_MPU CVDDS_RTC 10.01 μF 10 nF 10 nF CVDDSHV1(6) 10.02 μF CVDDSHV2(1)(6) 10.02 μF (1)(6) CVDDSHV3 10.02 μF CVDDSHV4(6) 10.02 μF CVDDSHV5(6) 10.02 μF CVDDSHV6(7) 10.06 μF Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Specifications 93 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com (1) Not available on the ZCE package. (2) Typical values consist of one capacitor of 10 μF and four capacitors of 10 nF. (3) For more details on decoupling capacitor requirements for the mDDR(LPDDR), DDR2, DDR3, DDR3L memory interface, see Section 7.7.2.1.2.6 and Section 7.7.2.1.2.7 when using mDDR(LPDDR) memory devices, Section 7.7.2.2.2.6 and Section 7.7.2.2.2.7 when using DDR2 memory devices, or Section 7.7.2.3.3.6 and Section 7.7.2.3.3.7 when using DDR3 or DDR3L memory devices. (4) VDDS_SRAM_CORE_BG supply powers an internal LDO for SRAM supplies. Inrush currents could cause voltage drop on the VDDS_SRAM_CORE_BG supplies when the SRAM LDO is enabled after powering up VDDS_SRAM_CORE_BG terminals. A 10 µF is recommended to be placed close to the terminal and routed with widest traces possible to minimize the voltage drop on VDDS_SRAM_CORE_BG terminals. (5) VDDS_SRAM_MPU_BB supply powers an internal LDO for SRAM supplies. Inrush currents could cause voltage drop on the VDDS_SRAM_MPU_BB supplies when the SRAM LDO is enabled after powering up VDDS_SRAM_MPU_BB terminals. A 10 µF is recommended to be placed close to the terminal and routed with widest traces possible to minimize the voltage drop on VDDS_SRAM_MPU_BB terminals. (6) Typical values consist of one capacitor of 10 μF and two capacitors of 10 nF. (7) Typical values consist of one capacitor of 10 μF and six capacitors of 10 nF. 5.9.2 Output Capacitors Internal low dropout output (LDO) regulators require external capacitors to stabilize their outputs. These capacitors should be placed as close as possible to the respective terminals of the AM335x device . Table 5-15 summarizes the LDO output capacitor recommendations. Table 5-15. Output Capacitor Characteristics PARAMETER TYP UNIT CCAP_VDD_SRAM_CORE(1) 1 μF CCAP_VDD_RTC(1)(2) 1 μF 1 μF 1 μF CCAP_VDD_SRAM_MPU (1) CCAP_VBB_MPU(1) (1) LDO regulator outputs should not be used as a power source for any external components. (2) The CAP_VDD_RTC terminal operates as an input to the RTC core voltage domain when the RTC_KALDO_ENn terminal is high. 94 Specifications Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Figure 5-1 shows an example of the external capacitors. AM335x Device VDDS_PLL_MPU MPU PLL VDD_MPU CVDDS_PLL_MPU MPU CVDD_MPU VDDS_PLL_CORE_LCD CORE PLL VDD_CORE CORE CVDDS_PLL_CORE_LCD LCD PLL CAP_VBB_MPU CVDD_CORE CCAP_VBB_MPU CVDDS CVDDSHV1 VDDS I/O VDDS_SRAM_MPU_BB VDDSHV1 I/Os Back Bias LDO CVDDSHV2 CVDDS_SRAM_MPU_BB MPU SRAM LDO CAP_VDD_SRAM_MPU CCAP_VDD_SRAM_MPU VDDSHV2 I/Os VDDS_SRAM_CORE_BG CVDDSHV3 VDDSHV3 I/Os CVDDSHV4 VDDSHV4 I/Os CVDDSHV5 VDDSHV5 I/Os CVDDSHV6 VDDSHV6 I/Os CVDDS_SRAM_CORE_BG CORE SRAM LDO Band Gap Reference CAP_VDD_SRAM_CORE CCAP_VDD_SRAM_CORE VDDA_3P3V_USBx CVDDA_3P3V_USBx VSSA_USB CVDDS_DDR USB PHYx VDDA_1P8V_USBx CVDDA_1P8V_USBx VSSA_USB VDDS_DDR I/Os VDDA_ADC CVDDA_ADC ADC CVDDS_RTC VDDS_RTC I/Os VSSA_ADC VDDS_OSC CVDDS_OSC VDDS_PLL_DDR CVDDS_PLL_DDR DDR PLL CAP_VDD_RTC RTC A. B. CCAP_VDD_RTC Decoupling capacitors must be placed as closed as possible to the power terminal. Choose the ground closest to the power pin for each decoupling capacitor. In case of interconnecting powers, first insert the decoupling capacitor and then interconnect the powers. The decoupling capacitor value depends on the characteristics of the board. Figure 5-1. External Capacitors Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Specifications 95 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 5.10 Touch Screen Controller and Analog-to-Digital Subsystem Electrical Parameters The touch screen controller (TSC) and analog-to-digital converter (ADC) subsystem (TSC_ADC) is an 8channel general-purpose ADC with optional support for interleaving TSC conversions for 4-wire, 5-wire, or 8-wire resistive panels. The TSC_ADC subsystem can be configured for use in one of the following applications: • 8 general-purpose ADC channels • 4-wire TSC with 4 general-purpose ADC channels • 5-wire TSC with 3 general-purpose ADC channels • 8-wire TSC. Table 5-16 summarizes the TSC_ADC subsystem electrical parameters. Table 5-16. TSC_ADC Electrical Parameters PARAMETER TEST CONDITIONS MIN NOM MAX UNIT Analog Input VREFP(1) (0.5 × VDDA_ADC) + 0.25 VDDA_ADC V VREFN(1) 0 (0.5 × VDDA_ADC) – 0.25 V VREFP + VREFN(1) VDDA_ADC Internal voltage reference Full-scale input range Differential nonlinearity (DNL) Integral nonlinearity (INL) V 0 VDDA_ADC External voltage reference VREFN VREFP Internal voltage reference: VDDA_ADC = 1.8 V External voltage reference: VREFP – VREFN = 1.8 V –1 0.5 1 Source impedance = 50 Ω Internal voltage reference: VDDA_ADC = 1.8 V External voltage reference: VREFP – VREFN = 1.8 V –2 ±1 2 V LSB LSB Source impedance = 1 kΩ Internal voltage reference: VDDA_ADC = 1.8 V External voltage reference: VREFP – VREFN = 1.8 V ±1 Gain error Internal voltage reference: VDDA_ADC = 1.8 V External voltage reference: VREFP – VREFN = 1.8 V ±2 LSB Offset error Internal voltage reference: VDDA_ADC = 1.8 V External voltage reference: VREFP – VREFN = 1.8 V ±2 LSB Input sampling capacitance 5.5 pF Signal-to-noise ratio (SNR) Internal voltage reference: VDDA_ADC = 1.8 V External voltage reference: VREFP – VREFN = 1.8 V Input signal: 30-kHz sine wave at –0.5-dB full scale 70 dB Total harmonic distortion (THD) Internal voltage reference: VDDA_ADC = 1.8 V External voltage reference: VREFP – VREFN = 1.8 V Input signal: 30-kHz sine wave at –0.5-dB full scale 75 dB 96 Specifications Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 5-16. TSC_ADC Electrical Parameters (continued) PARAMETER TEST CONDITIONS MIN NOM MAX UNIT Spurious free dynamic range Internal voltage reference: VDDA_ADC = 1.8 V External voltage reference: VREFP – VREFN = 1.8 V Input signal: 30-kHz sine wave at –0.5-dB full scale 80 dB Signal-to-noise plus distortion Internal voltage reference: VDDA_ADC = 1.8 V External voltage reference: VREFP – VREFN = 1.8 V Input signal: 30-kHz sine wave at –0.5-dB full scale 69 dB 20 kΩ VREFP and VREFN input impedance Input impedance of AIN[7:0](2) ƒ = Input frequency –12 [1 / ((65.97 × 10 ) × ƒ)] Ω Sampling Dynamics ADC clock frequency 1 Conversion time 3 13 Acquisition time 2 Sampling rate Channel-to-channel isolation MHz ADC clock cycles 257 ADC clock cycles 200 kSPS 100 dB 2 Ω Touch Screen Switch Drivers Pullup and pulldown switch ON resistance (Ron) Pullup and pulldown switch current leakage Ileak Source impedance = 500 Ω 0.5 uA 25 mA Touch screen resistance 6 kΩ Pen touch detect 2 kΩ Drive current (1) VREFP and VREFN must be tied to ground if the internal voltage reference is used. (2) This parameter is valid when the respective AIN terminal is configured to operate as a general-purpose ADC input. Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Specifications 97 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 6 Power and Clocking 6.1 6.1.1 Power Supplies Power Supply Slew Rate Requirement To maintain the safe operating range of the internal ESD protection devices, TI recommends limiting the maximum slew rate for powering on the supplies to be less than 1.0E +5 V/s. For instance, as shown in Figure 6-1, TI recommends a value greater than 18 µs for the supply ramp slew for a 1.8-V supply. Supply value t slew rate < 1E + 5 V/s slew > (supply value) / (1E + 5V/s) supply value ´ 10 µs 0 Figure 6-1. Power Supply Slew and Slew Rate 98 Power and Clocking Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 1.8 V VDDS_RTC 1.8 V RTC_PWRONRSTn 1.8 V PMIC_POWER_EN 1.8 V All 1.8-V Supplies 1.8 V/1.5 V/1.35 V VDDS_DDR 3.3 V I/O 3.3-V Supplies 1.1 V VDD_CORE, VDD_MPU PWRONRSTn CLK_M_OSC A. B. C. D. E. F. G. RTC_PWRONRSTn should be asserted for at least 1 ms to provide enough time for the internal RTC LDO output to reach a valid level before RTC reset is released. When using the ZCZ package option, VDD_MPU and VDD_CORE power inputs may be powered from the same source if the application only uses operating performance points (OPPs) that define a common power supply voltage for VDD_MPU and VDD_CORE. The ZCE package option has the VDD_MPU domain merged with the VDD_CORE domain. If a USB port is not used, the respective VDDA1P8V_USB terminal may be connected to any 1.8-V power supply and the respective VDDA3P3V_USB terminal may be connected to any 3.3-V power supply. If the system does not have a 3.3-V power supply, the VDDA3P3V_USB terminal may be connected to ground. If the system uses mDDR or DDR2 memory devices, VDDS_DDR can be ramped simultaneously with the other 1.8-V I/O power supplies. VDDS_RTC can be ramped independent of other power supplies if PMIC_POWER_EN functionality is not required. If VDDS_RTC is ramped after VDD_CORE, there might be a small amount of additional leakage current on VDD_CORE. The power sequence shown provides the lowest leakage option. To configure VDDSHVx [1-6] as 1.8 V, power up the respective VDDSHVx [1-6] to 1.8 V following the recommended sequence. To configure VDDSHVx [1-6] as 3.3 V, power up the respective VDDSHVx [1-6] to 3.3 V following the recommended sequence. If all the 1.8-V supplies are not sourced from the same power supply, it is required to power up VDDS before other 1.8-V supplies. Further, it is also recommended to source VDDS and VDDSHvx [x = 1-6] when configured as 1.8V from the same power supply. Figure 6-2. Preferred Power-Supply Sequencing With Dual-Voltage I/Os Configured as 3.3 V Power and Clocking Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 99 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 1.8 V VDDS_RTC 1.8 V RTC_PWRONRSTn 1.8 V PMIC_POWER_EN 3.3 V All 1.8-V Supplies All 3.3-V Supplies 1.8 V See Notes Below 1.8 V/1.5 V/1.35 V VDDS_DDR 1.1 V VDD_CORE, VDD_MPU PWRONRSTn CLK_M_OSC A. B. C. D. E. F. G. H. RTC_PWRONRSTn should be asserted for at least 1 ms to provide enough time for the internal RTC LDO output to reach a valid level before RTC reset is released. The 3.3-V I/O power supplies may be ramped simultaneously with the 1.8-V I/O power supplies if the voltage sourced by any 3.3-V power supplies does not exceed the voltage sourced by any 1.8-V power supply by more than 2 V. Serious reliability issues may occur if the system power supply design allows any 3.3-V I/O power supplies to exceed any 1.8-V I/O power supplies by more than 2 V. When using the ZCZ package option, VDD_MPU and VDD_CORE power inputs may be powered from the same source if the application only uses operating performance points (OPPs) that define a common power supply voltage for VDD_MPU and VDD_CORE. The ZCE package option has the VDD_MPU domain merged with the VDD_CORE domain. If a USB port is not used, the respective VDDA1P8V_USB terminal may be connected to any 1.8-V power supply and the respective VDDA3P3V_USB terminal may be connected to any 3.3-V power supply. If the system does not have a 3.3-V power supply, the VDDA3P3V_USB terminal may be connected to ground. If the system uses mDDR or DDR2 memory devices, VDDS_DDR can be ramped simultaneously with the other 1.8-V I/O power supplies. VDDS_RTC can be ramped independent of other power supplies if PMIC_POWER_EN functionality is not required. If VDDS_RTC is ramped after VDD_CORE, there might be a small amount of additional leakage current on VDD_CORE. The power sequence shown provides the lowest leakage option. To configure VDDSHVx [1-6] as 1.8 V, power up the respective VDDSHVx [1-6] to 1.8 V following the recommended sequence. To configure VDDSHVx [1-6] as 3.3 V, power up the respective VDDSHVx [1-6] to 3.3 V following the recommended sequence. If all the 1.8-V supplies are not sourced from the same power supply, it is required to power up VDDS before other 1.8-V supplies. Further, it is also recommended to source VDDS and VDDSHvx [x = 1-6] when configured as 1.8V from the same power supply. Figure 6-3. Alternate Power-Supply Sequencing With Dual-Voltage I/Os Configured as 3.3 V 100 Power and Clocking Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 1.8 V VDDS_RTC 1.8V RTC_PWRONRSTn 1.8 V PMIC_POWER_EN 1.8 V All 1.8-V Supplies 1.8 V/1.5 V/1.35 V VDDS_DDR 3.3 V All 3.3-V Supplies 1.1 V VDD_CORE, VDD_MPU PWRONRSTn CLK_M_OSC A. B. C. D. E. F. G. RTC_PWRONRSTn should be asserted for at least 1 ms to provide enough time for the internal RTC LDO output to reach a valid level before RTC reset is released. When using the ZCZ package option, VDD_MPU and VDD_CORE power inputs may be powered from the same source if the application only uses operating performance points (OPPs) that define a common power supply voltage for VDD_MPU and VDD_CORE. The ZCE package option has the VDD_MPU domain merged with the VDD_CORE domain. If a USB port is not used, the respective VDDA1P8V_USB terminal may be connected to any 1.8-V power supply and the respective VDDA3P3V_USB terminal may be connected to any 3.3-V power supply. If the system does not have a 3.3-V power supply, the VDDA3P3V_USB terminal may be connected to ground. If the system uses mDDR or DDR2 memory devices, VDDS_DDR can be ramped simultaneously with the other 1.8-V I/O power supplies. VDDS_RTC can be ramped independent of other power supplies if PMIC_POWER_EN functionality is not required. If VDDS_RTC is ramped after VDD_CORE, there might be a small amount of additional leakage current on VDD_CORE. The power sequence shown provides the lowest leakage option. To configure VDDSHVx [1-6] as 1.8 V, power up the respective VDDSHVx [1-6] to 1.8 V following the recommended sequence. To configure VDDSHVx [1-6] as 3.3 V, power up the respective VDDSHVx [1-6] to 3.3 V following the recommended sequence. If all the 1.8-V supplies are not sourced from the same power supply, it is required to power up VDDS before other 1.8-V supplies. Further, it is also recommended to source VDDS and VDDSHvx [x = 1-6] when configured as 1.8V from the same power supply. Figure 6-4. Power-Supply Sequencing With Dual-Voltage I/Os Configured as 1.8 V Power and Clocking Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 101 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 1.8 V 1.1 V VDDS_RTC, CAP_VDD_RTC 1.8 V RTC_PWRONRSTn 1.8 V PMIC_POWER_EN 1.8 V VDDSHV 1-6 All other 1.8-V Supplies 1.8 V/1.5 V/1.35 V VDDS_DDR 3.3 V All 3.3-V Supplies 1.1 V VDD_CORE, VDD_MPU PWRONRSTn CLK_M_OSC A. B. C. D. E. F. G. H. RTC_PWRONRSTn should be asserted for at least 1 ms to provide enough time for the internal RTC LDO output to reach a valid level before RTC reset is released. The CAP_VDD_RTC terminal operates as an input to the RTC core voltage domain when the internal RTC LDO is disabled by connecting the RTC_KALDO_ENn terminal to VDDS_RTC. If the internal RTC LDO is disabled, CAP_VDD_RTC should be sourced from an external 1.1-V power supply. When using the ZCZ package option, VDD_MPU and VDD_CORE power inputs may be powered from the same source if the application only uses operating performance points (OPPs) that define a common power supply voltage for VDD_MPU and VDD_CORE. The ZCE package option has the VDD_MPU domain merged with the VDD_CORE domain. If a USB port is not used, the respective VDDA1P8V_USB terminal may be connected to any 1.8-V power supply and the respective VDDA3P3V_USB terminal may be connected to any 3.3-V power supply. If the system does not have a 3.3-V power supply, the VDDA3P3V_USB terminal may be connected to ground. If the system uses mDDR or DDR2 memory devices, VDDS_DDR can be ramped simultaneously with the other 1.8-V I/O power supplies. VDDS_RTC should be ramped at the same time or before CAP_VDD_RTC, but these power inputs can be ramped independent of other power supplies if PMIC_POWER_EN functionality is not required. If CAP_VDD_RTC is ramped after VDD_CORE, there might be a small amount of additional leakage current on VDD_CORE. The power sequence shown provides the lowest leakage option. To configure VDDSHVx [1-6] as 1.8 V, power up the respective VDDSHVx [1-6] to 1.8 V following the recommended sequence. To configure VDDSHVx [1-6] as 3.3 V, power up the respective VDDSHVx [1-6] to 3.3 V following the recommended sequence. If all the 1.8-V supplies are not sourced from the same power supply, it is required to power up VDDS before other 1.8-V supplies. Further, it is also recommended to source VDDS and VDDSHvx [x = 1-6] when configured as 1.8V from the same power supply. Figure 6-5. Power-Supply Sequencing With Internal RTC LDO Disabled 102 Power and Clocking Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 1.8 V VDDS_RTC, All other 1.8-V Supplies 1.8 V/1.5 V/1.35 V VDDS_DDR 3.3 V All 3.3-V Supplies 1.1 V VDD_CORE, VDD_MPU CAP_VDD_RTC PWRONRSTn CLK_M_OSC A. B. C. D. E. F. G. CAP_VDD_RTC terminal operates as an input to the RTC core voltage domain when the internal RTC LDO is disabled by connecting the RTC_KALDO_ENn terminal to VDDS_RTC. If the internal RTC LDO is disabled, CAP_VDD_RTC should be sourced from an external 1.1-V power supply. The PMIC_POWER_EN output cannot be used when the RTC is disabled. When using the ZCZ package option, VDD_MPU and VDD_CORE power inputs may be powered from the same source if the application only uses operating performance points (OPPs) that define a common power supply voltage for VDD_MPU and VDD_CORE. The ZCE package option has the VDD_MPU domain merged with the VDD_CORE domain. If a USB port is not used, the respective VDDA1P8V_USB terminal may be connected to any 1.8-V power supply and the respective VDDA3P3V_USB terminal may be connected to any 3.3-V power supply. If the system does not have a 3.3-V power supply, the VDDA3P3V_USB terminal may be connected to ground. If the system uses mDDR or DDR2 memory devices, VDDS_DDR can be ramped simultaneously with the other 1.8-V I/O power supplies. VDDS_RTC should be ramped at the same time or before CAP_VDD_RTC, but these power inputs can be ramped independent of other power supplies if PMIC_POWER_EN functionality is not required. If CAP_VDD_RTC is ramped after VDD_CORE, there might be a small amount of additional leakage current on VDD_CORE. The power sequence shown provides the lowest leakage option. To configure VDDSHVx [1-6] as 1.8 V, power up the respective VDDSHVx [1-6] to 1.8 V following the recommended sequence. To configure VDDSHVx [1-6] as 3.3 V, power up the respective VDDSHVx [1-6] to 3.3 V following the recommended sequence. If all the 1.8-V supplies are not sourced from the same power supply, it is required to power up VDDS before other 1.8-V supplies. Further, it is also recommended to source VDDS and VDDSHvx [x = 1-6] when configured as 1.8V from the same power supply. Figure 6-6. Power-Supply Sequencing With RTC Feature Disabled 6.1.2 Power-Down Sequencing PWRONRSTn input terminal should be taken low, which stops all internal clocks before power supplies are turned off. All other external clocks to the device should be shut off. The preferred way to sequence power down is to have all the power supplies ramped down sequentially in the exact reverse order of the power-up sequencing. In other words, the power supply that has been ramped up first should be the last one that should be ramped down. This ensures there would be no spurious current paths during the power-down sequence. The VDDS power supply must ramp down after all 3.3-V VDDSHVx [1-6] power supplies. If it is desired to ramp down VDDS and VDDSHVx [1-6] simultaneously, it should always be ensured that the difference between VDDS and VDDSHVx [1-6] during the entire power-down sequence is 5 pF 18 24 Cshunt ≤ 5 pF 12 24 Cshunt > 5 pF 18 24 7 ƒxtal = 19.2 MHz, oscillator has nominal negative resistance of 272 Ω and worstcase negative resistance of 163 Ω 54.4 ƒxtal = 24 MHz, oscillator has nominal negative resistance of 240 Ω and worstcase negative resistance of 144 Ω 48.0 ƒxtal = 25 MHz, oscillator has nominal negative resistance of 233 Ω and worstcase negative resistance of 140 Ω 46.6 ƒxtal = 26 MHz, oscillator has nominal negative resistance of 227 Ω and worstcase negative resistance of 137 Ω 45.3 ppm pF pF pF Ω Initial accuracy, temperature drift, and aging effects should be combined when evaluating a reference clock for this requirement. Power and Clocking Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 107 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 6-3. OSC0 Crystal Circuit Characteristics NAME DESCRIPTION MIN TYP ZCE package 0.01 ZCZ package 0.01 Cpkg Shunt capacitance of package Pxtal The actual values of the ESR, ƒxtal, and CL should be used to yield a typical crystal power dissipation value. Using the maximum values specified for ESR, ƒxtal, and CL parameters yields a maximum power dissipation value. tsX Start-up time UNIT pF Pxtal = 0.5 ESR (2 π ƒxtal CL VDDS_OSC)2 1.5 VDD_CORE (min.) MAX ms VDD_CORE Voltage VSS VDDS_OSC (min.) VSS VDDS_OSC XTALOUT tsX Time Figure 6-10. OSC0 Start-Up Time 108 Power and Clocking Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 6.2.2.2 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 OSC0 LVCMOS Digital Clock Source Figure 6-11 shows the recommended oscillator connections when OSC0 is connected to an LVCMOS square-wave digital clock source. The LVCMOS clock source is connected to the XTALIN terminal. The ground for the LVCMOS clock source and VSS_OSC should be connected directly to the nearest PCB digital ground (VSS). In this mode of operation, the XTALOUT terminal should not be used to source any external components. The PCB design should provide a mechanism to disconnect the XTALOUT terminal from any external components or signal traces that may couple noise into OSC0 via the XTALOUT terminal. The XTALIN terminal has a 15- to 40-kΩ internal pulldown resistor which is enabled when OSC0 is disabled. This internal resistor prevents the XTALIN terminal from floating to an invalid logic level which may increase leakage current through the oscillator input buffer. AM335x XTALIN VSS_OSC XTALOUT VDDS_OSC LVCMOS Digital Clock Source Copyright © 2016, Texas Instruments Incorporated Figure 6-11. OSC0 LVCMOS Circuit Schematic Table 6-4. OSC0 LVCMOS Reference Clock Requirements NAME ƒ(XTALIN) DESCRIPTION MIN Frequency, LVCMOS reference clock Frequency, LVCMOS reference clock stability and tolerance (1) TYP MAX 19.2, 24, 25, or 26 UNIT MHz –50 50 tdc(XTALIN) Duty cycle, LVCMOS reference clock period 45% 55% tjpp(XTALIN) Jitter peak-to-peak, LVCMOS reference clock period –1% 1% tR(XTALIN) Time, LVCMOS reference clock rise 5 ns tF(XTALIN) Time, LVCMOS reference clock fall 5 ns (1) ppm Initial accuracy, temperature drift, and aging effects should be combined when evaluating a reference clock for this requirement. 6.2.2.3 OSC1 Internal Oscillator Clock Source Figure 6-12 shows the recommended crystal circuit for OSC1 of the ZCE package and Figure 6-13 shows the recommended crystal circuit for OSC1 of the ZCZ package. TI recommends that preproduction PCB designs include the two optional resistors Rbias and Rd in case they are required for proper oscillator operation when combined with production crystal circuit components. In most cases, Rbias is not required and Rd is a 0-Ω resistor. These resistors may be removed from production PCB designs after evaluating oscillator performance with production crystal circuit components installed on preproduction PCBs. The RTC_XTALIN terminal has a 10- to 40-kΩ internal pullup resistor which is enabled when OSC1 is disabled. This internal resistor prevents the RTC_XTALIN terminal from floating to an invalid logic level which may increase leakage current through the oscillator input buffer. Power and Clocking Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 109 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com AM335x (ZCE Package) RTC_XTALIN RTC_XTALOUT Optional Rbias Optional Rd Crystal C1 C2 Copyright © 2016, Texas Instruments Incorporated A. B. Oscillator components (Crystal, C1, C2, optional Rbias and Rd) must be located close to the AM335x package. Parasitic capacitance to the PCB ground and other signals should be minimized to reduce noise coupled into the oscillator. VSS_RTC and respective crystal circuit component grounds should be connected directly to the nearest PCB digital ground (VSS). C1 and C2 represent the total capacitance of the respective PCB trace, load capacitor, and other components (excluding the crystal) connected to each crystal terminal. The value of capacitors C1 and C2 should be selected to provide the total load capacitance, CL, specified by the crystal manufacturer. The total load capacitance is CL = [(C1 × C2) / (C1 + C2)] + Cshunt, where Cshunt is the crystal shunt capacitance (C0) specified by the crystal manufacturer plus any mutual capacitance (Cpkg + CPCB) seen across the AM335x RTC_XTALIN and RTC_XTALOUT signals. For recommended values of crystal circuit components, see Table 6-5. Figure 6-12. OSC1 (ZCE Package) Crystal Circuit Schematic AM335x (ZCZ Package) VSS_RTC RTC_XTALIN RTC_XTALOUT C1 C2 Crystal Optional Rd Optional Rbias Copyright © 2016, Texas Instruments Incorporated A. B. Oscillator components (Crystal, C1, C2, optional Rbias and Rd) must be located close to the AM335x package. Parasitic capacitance to the PCB ground and other signals should be minimized to reduce noise coupled into the oscillator. VSS_RTC and respective crystal circuit component grounds should be connected directly to the nearest PCB digital ground (VSS). C1 and C2 represent the total capacitance of the respective PCB trace, load capacitor, and other components (excluding the crystal) connected to each crystal terminal. The value of capacitors C1 and C2 should be selected to provide the total load capacitance, CL, specified by the crystal manufacturer. The total load capacitance is CL = [(C1 × C2) / (C1 + C2)] + Cshunt, where Cshunt is the crystal shunt capacitance (C0) specified by the crystal manufacturer plus any mutual capacitance (Cpkg + CPCB) seen across the AM335x RTC_XTALIN and RTC_XTALOUT signals. For recommended values of crystal circuit components, see Table 6-5. Figure 6-13. OSC1 (ZCZ Package) Crystal Circuit Schematic 110 Power and Clocking Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 6-5. OSC1 Crystal Circuit Requirements NAME DESCRIPTION MIN Crystal parallel resonance frequency ƒxtal Crystal frequency stability and tolerance (1) Fundamental mode oscillation only TYP MAX 32.768 UNIT kHz Maximum RTC error = 10.512 minutes per year –20.0 20.0 ppm Maximum RTC error = 26.28 minutes per year –50.0 50.0 ppm CC1 C1 capacitance 12.0 24.0 pF CC2 C2 capacitance 12.0 24.0 pF Cshunt Shunt capacitance 1.5 pF ESR Crystal effective series resistance 80 kΩ (1) ƒxtal = 32.768 kHz, oscillator has nominal negative resistance of 725 kΩ and worstcase negative resistance of 250 kΩ Initial accuracy, temperature drift, and aging effects should be combined when evaluating a reference clock for this requirement. Table 6-6. OSC1 Crystal Circuit Characteristics NAME DESCRIPTION MIN Cpkg Shunt capacitance of package Pxtal The actual values of the ESR, ƒxtal, and CL should be used to yield a typical crystal power dissipation value. Using the maximum values specified for ESR, ƒxtal, and CL parameters yields a maximum power dissipation value. tsX Start-up time TYP MAX UNIT ZCE package 0.17 pF ZCZ package 0.01 pF Pxtal = 0.5 ESR (2 π ƒxtal CL VDDS_RTC)2 2 CAP_VDD_RTC (min.) s CAP_VDD_RTC Voltage VSS_RTC VDDS_RTC (min.) VDDS_RTC RTC_XTALOUT VSS_RTC tsX Time Figure 6-14. OSC1 Start-up Time Power and Clocking Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 111 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 6.2.2.4 www.ti.com OSC1 LVCMOS Digital Clock Source Figure 6-15 shows the recommended oscillator connections when OSC1 of the ZCE package is connected to an LVCMOS square-wave digital clock source and Figure 6-16 shows the recommended oscillator connections when OSC1 of the ZCZ package is connected to an LVCMOS square-wave digital clock source. The LVCMOS clock source is connected to the RTC_XTALIN terminal. The ground for the LVCMOS clock source and VSS_RTC of the ZCZ package should be connected directly to the nearest PCB digital ground (VSS). In this mode of operation, the RTC_XTALOUT terminal should not be used to source any external components. The PCB design should provide a mechanism to disconnect the RTC_XTALOUT terminal from any external components or signal traces that may couple noise into OSC1 through the RTC_XTALOUT terminal. The RTC_XTALIN terminal has a 10- to 40-kΩ internal pullup resistor which is enabled when OSC1 is disabled. This internal resistor prevents the RTC_XTALIN terminal from floating to an invalid logic level which may increase leakage current through the oscillator input buffer. AM335x (ZCE Package) RTC_XTALIN RTC_XTALOUT VDDS_RTC LVCMOS Digital Clock Source N/C Copyright © 2016, Texas Instruments Incorporated Figure 6-15. OSC1 (ZCE Package) LVCMOS Circuit Schematic AM335x (ZCZ Package) RTC_XTALIN VSS_RTC RTC_XTALOUT VDDS_RTC LVCMOS Digital Clock Source N/C Copyright © 2016, Texas Instruments Incorporated Figure 6-16. OSC1 (ZCZ Package) LVCMOS Circuit Schematic Table 6-7. OSC1 LVCMOS Reference Clock Requirements NAME DESCRIPTION MIN Frequency, LVCMOS reference clock ƒ(RTC_XTALIN) Frequency, LVCMOS reference clock stability and tolerance (1) TYP MAX 32.768 UNIT kHz Maximum RTC error = 10.512 minutes/year –20 20 ppm Maximum RTC error = 26.28 minutes/year –50 50 ppm tdc(RTC_XTALIN) Duty cycle, LVCMOS reference clock period 45% 55% tjpp(RTC_XTALIN) Jitter peak-to-peak, LVCMOS reference clock period –1% 1% tR(RTC_XTALIN) Time, LVCMOS reference clock rise 5 ns tF(RTC_XTALIN) Time, LVCMOS reference clock fall 5 ns (1) 112 Initial accuracy, temperature drift, and aging effects should be combined when evaluating a reference clock for this requirement. Power and Clocking Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 6.2.2.5 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 OSC1 Not Used Figure 6-17 shows the recommended oscillator connections when OSC1 of the ZCE package is not used and Figure 6-18 shows the recommended oscillator connections when OSC1 of the ZCZ package is not used. An internal 10-kΩ pullup on the RTC_XTALIN terminal is turned on when OSC1 is disabled to prevent this input from floating to an invalid logic level which may increase leakage current through the oscillator input buffer. OSC1 is disabled by default after power is applied. Therefore, both RTC_XTALIN and RTC_XTALOUT terminals should be a no connect (NC) when OSC1 is not used. AM335x (ZCE Package) RTC_XTALIN RTC_XTALOUT N/C N/C Copyright © 2016, Texas Instruments Incorporated Figure 6-17. OSC1 (ZCE Package) Not Used Schematic AM335x (ZCZ Package) RTC_XTALIN N/C VSS_RTC RTC_XTALOUT N/C Copyright © 2016, Texas Instruments Incorporated Figure 6-18. OSC1 (ZCZ Package) Not Used Schematic Power and Clocking Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 113 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 6.2.3 www.ti.com Output Clock Specifications The AM335x device has two clock output signals. The CLKOUT1 signal is always a replica of the OSC0 input clock which is referred to as the master oscillator (CLK_M_OSC) in the AM335x and AMIC110 Sitara Processors Technical Reference Manual. The CLKOUT2 signal can be configured to output the OSC1 input clock, which is referred to as the 32K oscillator (CLK_32K_RTC) in the AM335x and AMIC110 Sitara Processors Technical Reference Manual, or four other internal clocks. For more information related to configuring these clock output signals, see the CLKOUT Signals section of the AM335x and AMIC110 Sitara Processors Technical Reference Manual. 6.2.4 Output Clock Characteristics NOTE The AM335x CLKOUT1 and CLKOUT2 clock outputs should not be used as a synchronous clock for any of the peripheral interfaces because they were not timing closed to any other signals. These clock outputs also were not designed to source any time critical external circuits that require a low jitter reference clock. The jitter performance of these outputs is unpredictable due to complex combinations of many system variables. For example, CLKOUT2 may be sourced from several PLLs with each PLL supporting many configurations that yield different jitter performance. There are also other unpredictable contributors to jitter performance such as application specific noise or crosstalk into the clock circuits. Therefore, there are no plans to specify jitter performance for these outputs. 6.2.4.1 CLKOUT1 The CLKOUT1 signal can be output on the XDMA_EVENT_INTR0 terminal. This terminal connects to one of seven internal signals via configurable multiplexers. The XDMA_EVENT_INTR0 multiplexer must be configured for Mode 3 to connect the CLKOUT1 signal to the XDMA_EVENT_INTR0 terminal. The default reset configuration of the XDMA_EVENT_INTR0 multiplexer is selected by the logic level applied to the LCD_DATA5 terminal on the rising edge of PWRONRSTn. The XDMA_EVENT_INTR0 multiplexer is configured to Mode 7 if the LCD_DATA5 terminal is low on the rising edge of PWRONRSTn or Mode 3 if the LCD_DATA5 terminal is high on the rising edge of PWRONRSTn. This allows the CLKOUT1 signal to be output on the XDMA_EVENT_INTR0 terminal without software intervention. In this mode, the output is held low while PWRONRSTn is active and begins to toggle after PWRONRSTn is released. 6.2.4.2 CLKOUT2 The CLKOUT2 signal can be output on the XDMA_EVENT_INTR1 terminal. This terminal connects to one of seven internal signals via configurable multiplexers. The XDMA_EVENT_INTR1 multiplexer must be configured for Mode 3 to connect the CLKOUT2 signal to the XDMA_EVENT_INTR1 terminal. The default reset configuration of the XDMA_EVENT_INTR1 multiplexer is always Mode 7. Software must configure the XDMA_EVENT_INTR1 multiplexer to Mode 3 for the CLKOUT2 signal to be output on the XDMA_EVENT_INTR1 terminal. 114 Power and Clocking Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7 Peripheral Information and Timings The AM335x device contains many peripheral interfaces. In order to reduce package size and lower overall system cost while maintaining maximum functionality, many of the AM335x terminals can multiplex up to eight signal functions. Although there are many combinations of pin multiplexing that are possible, only a certain number of sets, called I/O Sets, are valid due to timing limitations. These valid I/O Sets were carefully chosen to provide many possible application scenarios for the user. Texas Instruments has developed a Windows-based application called Pin Mux Utility that helps a system designer select the appropriate pin-multiplexing configuration for their AM335x-based product design. The Pin Mux Utility provides a way to select valid I/O Sets of specific peripheral interfaces to ensure the pinmultiplexing configuration selected for a design only uses valid I/O Sets supported by the AM335x device. 7.1 Parameter Information The data provided in the following Timing Requirements and Switching Characteristics tables assumes the device is operating within the Recommended Operating Conditions defined in Section 5, unless otherwise noted. 7.1.1 Timing Parameters and Board Routing Analysis The timing parameter values specified in this data manual do not include delays by board routings. As a good board design practice, such delays must always be taken into account. Timing values may be adjusted by increasing or decreasing such delays. TI recommends using the available I/O buffer information specification (IBIS) models to analyze the timing characteristics correctly. If needed, external logic hardware such as buffers may be used to compensate any timing differences. The timing parameter values specified in this data manual assume the SLEWCTRL bit in each pad control register is configured for fast mode (0b). For the mDDR(LPDDR), DDR2, DDR3, DDR3L memory interface, it is not necessary to use the IBIS models to analyze timing characteristics. TI provides a PCB routing rules solution that describes the routing rules to ensure the mDDR(LPDDR), DDR2, DDR3, DDR3L memory interface timings are met. 7.2 Recommended Clock and Control Signal Transition Behavior All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic manner. 7.3 OPP50 Support Some peripherals and features have limited support when the device is operating in OPP50. A complete list of these limitations follows. Not supported when operating in OPP50: Reduced performance when operating in OPP50: • • • • • • • • • • • • • • • CPSW DDR3 DEBUGSS-Trace GPMC Asynchronous Mode LCDC LIDD Mode MDIO PRU-ICSS MII DDR2 DEBUGSS-JTAG GPMC Synchronous Mode LCDC Raster Mode LPDDR McASP McSPI MMCSD Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 115 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.4 www.ti.com Controller Area Network (CAN) For more information, see the Controller Area Network (CAN) section of the AM335x and AMIC110 Sitara Processors Technical Reference Manual. 7.4.1 DCAN Electrical Data and Timing Table 7-1. DCAN Timing Conditions (see Figure 7-1) PARAMETER MIN TYP MAX UNIT Input Conditions tR Input signal rise time 10 ns tF Input signal fall time 10 ns 10 pF Output Conditions CLOAD Output load capacitance Table 7-2. Timing Requirements for DCANx Receive (see Figure 7-1) NO. 1 MIN ƒbaud(baud) Maximum programmable baud rate tw(RX) Pulse duration, receive data bit H – 2(1) MAX UNIT 1 Mbps H + 2(1) ns (1) H = Period of baud rate, 1 / programmed baud rate Table 7-3. Switching Characteristics for DCANx Transmit (see Figure 7-1) NO. 2 PARAMETER ƒbaud(baud) Maximum programmable baud rate tw(TX) Pulse duration, transmit data bit MIN MAX UNIT 1 Mbps H – 2(1) H + 2(1) ns (1) H = Period of baud rate, 1 / programmed baud rate 1 DCANx_RX 2 DCANx_TX Figure 7-1. DCANx Timings 116 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 7.5 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 DMTimer 7.5.1 DMTimer Electrical Data and Timing Table 7-4. DMTimer Timing Conditions (see Figure 7-1) PARAMETER MIN TYP MAX UNIT Input Conditions tR Input signal rise time 10 ns tF Input signal fall time 10 ns 10 pF Output Conditions CLOAD Output load capacitance Table 7-5. Timing Requirements for DMTimer [1-7] (see Figure 7-2) NO. 1 (1) MIN tc(TCLKIN) Cycle time, TCLKIN 4P + 1 MAX UNIT (1) ns P = Period of PICLKOCP (interface clock). Table 7-6. Switching Characteristics for DMTimer [4-7] (see Figure 7-2) NO. (1) PARAMETER MIN MAX UNIT 2 tw(TIMERxH) Pulse duration, high 4P – 3 (1) ns 3 tw(TIMERxL) Pulse duration, low 4P – 3 (1) ns P = Period of PICLKTIMER (functional clock). 1 TCLKIN 2 3 TIMER[x] Figure 7-2. Timer Timing Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 117 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.6 www.ti.com Ethernet Media Access Controller (EMAC) and Switch 7.6.1 EMAC and Switch Electrical Data and Timing The EMAC and Switch implemented in the AM335x device supports GMII mode, but the AM335x design does not pin out 9 of the 24 GMII signals. This was done to reduce the total number of package terminals. Therefore, the AM335x device does not support GMII mode. MII mode is supported with the remaining GMII signals. The AM335x and AMIC110 Sitara Processors Technical Reference Manual and this document may reference internal signal names when discussing peripheral input and output signals because many of the AM335x package terminals can be multiplexed to one of several peripheral signals. For example, the AM335x terminal names for port 1 of the EMAC and switch have been changed from GMII to MII to indicate their Mode 0 function, but the internal signal is named GMII. However, documents that describe the Ethernet switch reference these signals by their internal signal name. For a cross-reference of internal signal names to terminal names, see Table 4-2. Operation of the EMAC and switch is not supported for OPP50. Table 7-7. EMAC and Switch Timing Conditions PARAMETER MIN TYP MAX UNIT Input Conditions tR Input signal rise time tF Input signal fall time 1(1) 5(1) ns (1) (1) ns 30 pF 1 5 Output Condition CLOAD Output load capacitance 3 (1) Except when specified otherwise. 7.6.1.1 EMAC/Switch MDIO Electrical Data and Timing Table 7-8. Timing Requirements for MDIO_DATA (see Figure 7-3) NO. MIN 1 tsu(MDIO-MDC) Setup time, MDIO valid before MDC high 2 th(MDIO-MDC) Hold time, MDIO valid from MDC high TYP MAX UNIT 90 ns 0 ns 1 2 MDIO_CLK (Output) MDIO_DATA (Input) Figure 7-3. MDIO_DATA Timing - Input Mode Table 7-9. Switching Characteristics for MDIO_CLK (see Figure 7-4) NO. 118 PARAMETER MIN TYP MAX UNIT 1 tc(MDC) Cycle time, MDC 400 ns 2 tw(MDCH) Pulse duration, MDC high 160 ns 3 tw(MDCL) Pulse duration, MDC low 160 ns Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 1 3 2 MDIO_CLK Figure 7-4. MDIO_CLK Timing Table 7-10. Switching Characteristics for MDIO_DATA (see Figure 7-5) NO. 1 PARAMETER td(MDC-MDIO) MIN Delay time, MDC high to MDIO valid TYP -150 MAX UNIT 150 ns 1 MDIO_CLK (Output) MDIO_DATA (Output) Figure 7-5. MDIO_DATA Timing - Output Mode 7.6.1.2 EMAC and Switch MII Electrical Data and Timing Table 7-11. Timing Requirements for GMII[x]_RXCLK - MII Mode (see Figure 7-6) 10 Mbps NO. MIN TYP 100 Mbps MAX MIN TYP MAX UNIT 1 tc(RX_CLK) Cycle time, RX_CLK 399.96 400.04 39.996 40.004 ns 2 tw(RX_CLKH) Pulse duration, RX_CLK high 140 260 14 26 ns 3 tw(RX_CLKL) Pulse duration, RX_CLK low 140 260 14 26 ns 4 tt(RX_CLK) Transition time, RX_CLK 5 ns 5 4 1 2 3 GMII[x]_RXCLK 4 Figure 7-6. GMII[x]_RXCLK Timing - MII Mode Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 119 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 7-12. Timing Requirements for GMII[x]_TXCLK - MII Mode (see Figure 7-7) 10 Mbps NO. MIN 100 Mbps TYP MAX MIN TYP MAX UNIT 1 tc(TX_CLK) Cycle time, TX_CLK 399.96 400.04 39.996 40.004 ns 2 tw(TX_CLKH) Pulse duration, TX_CLK high 140 260 14 26 ns 3 tw(TX_CLKL) Pulse duration, TX_CLK low 140 260 14 26 ns 4 tt(TX_CLK) Transition time, TX_CLK 5 ns 5 4 1 3 2 GMII[x]_TXCLK 4 Figure 7-7. GMII[x]_TXCLK Timing - MII Mode Table 7-13. Timing Requirements for GMII[x]_RXD[3:0], GMII[x]_RXDV, and GMII[x]_RXER - MII Mode (see Figure 7-8) 10 Mbps NO . 1 2 MIN tsu(RXD-RX_CLK) Setup time, RXD[3:0] valid before RX_CLK tsu(RX_DV-RX_CLK) Setup time, RX_DV valid before RX_CLK tsu(RX_ER-RX_CLK) Setup time, RX_ER valid before RX_CLK th(RX_CLK-RXD) Hold time RXD[3:0] valid after RX_CLK th(RX_CLK-RX_DV) Hold time RX_DV valid after RX_CLK th(RX_CLK-RX_ER) Hold time RX_ER valid after RX_CLK 100 Mbps TYP MAX MIN TYP MAX UNIT 8 8 ns 8 8 ns 1 2 GMII[x]_MRCLK (Input) GMII[x]_RXD[3:0], GMII[x]_RXDV, GMII[x]_RXER (Inputs) Figure 7-8. GMII[x]_RXD[3:0], GMII[x]_RXDV, GMII[x]_RXER Timing - MII Mode 120 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 7-14. Switching Characteristics for GMII[x]_TXD[3:0], and GMII[x]_TXEN - MII Mode (see Figure 7-9) NO. 1 PARAMETER td(TX_CLK-TXD) Delay time, TX_CLK high to TXD[3:0] valid td(TX_CLK-TX_EN) Delay time, TX_CLK to TX_EN valid 10 Mbps MIN 5 TYP 100 Mbps MAX MIN 25 5 TYP MAX 25 UNIT ns 1 GMII[x]_TXCLK (input) GMII[x]_TXD[3:0], GMII[x]_TXEN (outputs) Figure 7-9. GMII[x]_TXD[3:0], GMII[x]_TXEN Timing - MII Mode Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 121 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.6.1.3 www.ti.com EMAC and Switch RMII Electrical Data and Timing Table 7-15. Timing Requirements for RMII[x]_REFCLK - RMII Mode (see Figure 7-10) NO. MIN TYP MAX UNIT 1 tc(REF_CLK) Cycle time, REF_CLK 19.999 20.001 ns 2 tw(REF_CLKH) Pulse duration, REF_CLK high 7 13 ns 3 tw(REF_CLKL) Pulse duration, REF_CLK low 7 13 ns 1 2 RMII[x]_REFCLK (Input) 3 Figure 7-10. RMII[x]_REFCLK Timing - RMII Mode Table 7-16. Timing Requirements for RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER - RMII Mode (see Figure 7-11) NO. 1 2 MIN tsu(RXD-REF_CLK) Setup time, RXD[1:0] valid before REF_CLK tsu(CRS_DV-REF_CLK) Setup time, CRS_DV valid before REF_CLK tsu(RX_ER-REF_CLK) Setup time, RX_ER valid before REF_CLK th(REF_CLK-RXD) Hold time RXD[1:0] valid after REF_CLK th(REF_CLK-CRS_DV) Hold time, CRS_DV valid after REF_CLK th(REF_CLK-RX_ER) Hold time, RX_ER valid after REF_CLK TYP MAX UNIT 4 ns 2 ns 1 2 RMII[x]_REFCLK (input) RMII[x]_RXD[1:0], RMII[x]_CRS_DV, RMII[x]_RXER (inputs) Figure 7-11. RMII[x]_RXD[1:0], RMII[x]_CRS_DV, RMII[x]_RXER Timing - RMII Mode 122 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 7-17. Switching Characteristics for RMII[x]_TXD[1:0], and RMII[x]_TXEN - RMII Mode (see Figure 7-12) NO. 1 PARAMETER td(REF_CLK-TXD) td(REF_CLK-TXEN) MIN Delay time, REF_CLK high to TXD[1:0] valid Delay time, REF_CLK to TXEN valid TYP 2 MAX 13 UNIT ns 1 RMII[x]_REFCLK (Input) RMII[x]_TXD[1:0], RMII[x]_TXEN (Outputs) Figure 7-12. RMII[x]_TXD[1:0], RMII[x]_TXEN Timing - RMII Mode Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 123 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.6.1.4 www.ti.com EMAC and Switch RGMII Electrical Data and Timing Table 7-18. Timing Requirements for RGMII[x]_RCLK - RGMII Mode (see Figure 7-13) 10 Mbps NO. 1 MIN 100 Mbps TYP MAX MIN TYP 1000 Mbps MAX MIN TYP MAX UNIT tc(RXC) Cycle time, RXC 360 440 36 44 7.2 8.8 ns 2 tw(RXCH) Pulse duration, RXC high 160 240 16 24 3.6 4.4 ns 3 tw(RXCL) Pulse duration, RXC low 160 240 16 24 3.6 4.4 ns 4 tt(RXC) Transition time, RXC 0.75 ns 0.75 0.75 1 2 3 RGMII[x]_RCLK Figure 7-13. RGMII[x]_RCLK Timing - RGMII Mode Table 7-19. Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL - RGMII Mode (see Figure 7-14) 10 Mbps NO. MIN 100 Mbps MAX MIN TYP 1000 Mbps MAX MIN TYP MAX tsu(RD-RXC) Setup time, RD[3:0] valid before RXC high or low 1 1 1 tsu(RX_CTL-RXC) Setup time, RX_CTL valid before RXC high or low 1 1 1 th(RXC-RD) Hold time, RD[3:0] valid after RXC high or low 1 1 1 th(RXC-RX_CTL) Hold time, RX_CTL valid after RXC high or low 1 1 1 tt(RD) Transition time, RD 0.75 0.75 0.75 tt(RX_CTL) Transition time, RX_CTL 0.75 0.75 0.75 1 2 3 TYP UNIT ns ns ns (A) RGMII[x]_RCLK 1 1st Half-byte 2 2nd Half-byte (B) RGMII[x]_RD[3:0] (B) RGMII[x]_RCTL A. B. RGRXD[3:0] RGRXD[7:4] RXDV RXERR RGMII[x]_RCLK must be externally delayed relative to the RGMII[x]_RD[3:0] and RGMII[x]_RCTL signals to meet the respective timing requirements. Data and control information is received using both edges of the clocks. RGMII[x]_RD[3:0] carries data bits 3-0 on the rising edge of RGMII[x]_RCLK and data bits 7-4 on the falling edge of RGMII[x]_RCLK. Similarly, RGMII[x]_RCTL carries RXDV on rising edge of RGMII[x]_RCLK and RXERR on falling edge of RGMII[x]_RCLK. Figure 7-14. RGMII[x]_RD[3:0], RGMII[x]_RCTL Timing - RGMII Mode 124 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 7-20. Switching Characteristics for RGMII[x]_TCLK - RGMII Mode (see Figure 7-15) NO. 1 10 Mbps PARAMETER MIN 100 Mbps TYP MAX MIN TYP 1000 Mbps MAX MIN TYP MAX UNIT tc(TXC) Cycle time, TXC 360 440 36 44 7.2 8.8 ns 2 tw(TXCH) Pulse duration, TXC high 160 240 16 24 3.6 4.4 ns 3 tw(TXCL) Pulse duration, TXC low 160 240 16 24 3.6 4.4 ns 1 2 3 RGMII[x]_TCLK Figure 7-15. RGMII[x]_TCLK Timing - RGMII Mode Table 7-21. Switching Characteristics for RGMII[x]_TD[3:0], and RGMII[x]_TCTL - RGMII Mode (see Figure 7-16) NO. 10 Mbps PARAMETER 1 MIN TYP 100 Mbps MAX MIN TYP 1000 Mbps MAX MIN TYP MAX tsk(TD-TXC) TD to TXC output skew –0.5 0.5 –0.5 0.5 –0.5 0.5 tsk(TX_CTL-TXC) TX_CTL to TXC output skew –0.5 0.5 –0.5 0.5 –0.5 0.5 UNIT ns (A) RGMII[x]_TCLK 1 (B) 1st Half-byte 2nd Half-byte (B) TXEN TXERR RGMII[x]_TD[3:0] RGMII[x]_TCTL A. B. 1 The EMAC and switch implemented in the AM335x device supports internal delay mode, but timing closure was not performed for this mode of operation. Therefore, the AM335x device does not support internal delay mode. Data and control information is transmitted using both edges of the clocks. RGMII[x]_TD[3:0] carries data bits 3-0 on the rising edge of RGMII[x]_TCLK and data bits 7-4 on the falling edge of RGMII[x]_TCLK. Similarly, RGMII[x]_TCTL carries TXEN on rising edge of RGMII[x]_TCLK and TXERR of falling edge of RGMII[x]_TCLK. Figure 7-16. RGMII[x]_TD[3:0], RGMII[x]_TCTL Timing - RGMII Mode Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 125 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.7 www.ti.com External Memory Interfaces The device includes the following external memory interfaces: • General-purpose memory controller (GPMC) • mDDR(LPDDR), DDR2, DDR3, DDR3L Memory Interface (EMIF) 7.7.1 General-Purpose Memory Controller (GPMC) NOTE For more information, see the Memory Subsystem and General-Purpose Memory Controller section of the AM335x and AMIC110 Sitara Processors Technical Reference Manual. The GPMC is the unified memory controller used to interface external memory devices such as: • Asynchronous SRAM-like memories and ASIC devices • Asynchronous page mode and synchronous burst NOR flash • NAND flash 7.7.1.1 GPMC and NOR Flash—Synchronous Mode Table 7-23 and Table 7-24 assume testing over the recommended operating conditions and electrical characteristic conditions shown in Table 7-22 (see Figure 7-17 through Figure 7-21). Table 7-22. GPMC and NOR Flash Timing Conditions—Synchronous Mode PARAMETER MIN TYP MAX UNIT Input Conditions tR Input signal rise time 1 5 ns tF Input signal fall time 1 5 ns 3 30 pF Output Condition CLOAD Output load capacitance Table 7-23. GPMC and NOR Flash Timing Requirements—Synchronous Mode OPP100 NO. F12 F13 F21 F22 MIN tsu(dV-clkH) Setup time, input data gpmc_ad[15:0] valid before output clock gpmc_clk high th(clkH-dV) Hold time, input data gpmc_ad[15:0] valid after output clock gpmc_clk high tsu(waitV-clkH) Setup time, input wait gpmc_wait[x](1) valid before output clock gpmc_clk high th(clkH-waitV) Hold time, input wait gpmc_wait[x](1) valid after output clock gpmc_clk high MAX OPP50 MIN 3.2 13.2 Industrial extended temperature (-40°C to 125°C) 4.74 4.74 All other temperature ranges 4.74 2.75 3.2 13.2 Industrial extended temperature (-40°C to 125°C) 4.74 4.74 All other temperature ranges 4.74 2.75 MAX UNIT ns ns ns ns (1) In gpmc_wait[x], x is equal to 0 or 1. 126 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 7-24. GPMC and NOR Flash Switching Characteristics—Synchronous Mode(2) NO. OPP100 PARAMETER OPP50 MIN MAX MIN MAX UNIT F0 1 / tc(clk) Frequency(18), output clock gpmc_clk F1 tw(clkH) Typical pulse duration, output clock gpmc_clk high 0.5P(15) 0.5P(15) 0.5P(15) 0.5P(15) ns F1 tw(clkL) Typical pulse duration, output clock gpmc_clk low 0.5P(15) 0.5P(15) 0.5P(15) 0.5P(15) ns tdc(clk) Duty cycle error, output clock gpmc_clk –500 500 –500 500 ps 33.33 ps + 9.5 ns 100 (19) Jitter standard deviation F2 td(clkH-csnV) Delay time, output clock gpmc_clk rising edge to output chip select gpmc_csn[x](14) transition F F3 td(clkH-csnIV) Delay time, output clock gpmc_clk rising edge to output chip select gpmc_csn[x](14) invalid E(5) – 2.2 E(5) + 4.5 E(5) – 3.2 E(5) + 9.5 ns F4 td(aV-clk) Delay time, output address gpmc_a[27:1] valid to output clock gpmc_clk first edge B(2) – 4.5 B(2) + 2.3 B(2) – 5.5 B(2) + 12.3 ns F5 td(clkH-aIV) Delay time, output clock gpmc_clk rising edge to output address gpmc_a[27:1] invalid –2.3 4.5 –3.3 14.5 ns td(be[x]nV-clk) Delay time, output lower byte enable and command latch enable gpmc_be0n_cle, output upper byte enable gpmc_be1n valid to output clock gpmc_clk first edge B(2) – 1.9 B(2) + 2.3 B(2) – 2.9 B(2) + 12.3 ns F7 td(clkH-be[x]nIV) Delay time, output clock gpmc_clk rising edge to output lower byte enable and command latch enable gpmc_be0n_cle, output upper byte enable gpmc_be1n invalid(11) D(4) – 2.3 D(4) + 1.9 D(4) – 3.3 D(4) + 6.9 ns F7 td(clkL-be[x]nIV) Delay time, gpmc_clk falling edge to gpmc_nbe0_cle, gpmc_nbe1 invalid(12) D(4) – 2.3 D(4) + 1.9 D(4) – 3.3 D(4) + 6.9 ns F7 td(clkL-be[x]nIV) Delay time, gpmc_clk falling edge to gpmc_nbe0_cle, gpmc_nbe1 invalid(13) D(4) – 2.3 D(4) + 1.9 D(4) – 3.3 D(4) + 11.9 ns F8 td(clkH-advn) Delay time, output clock gpmc_clk rising edge to output address valid and address latch enable gpmc_advn_ale transition G(7) – 2.3 G(7) + 4.5 G(7) – 3.3 G(7) + 9.5 ns F9 td(clkH-advnIV) Delay time, output clock gpmc_clk rising edge to output address valid and address latch enable gpmc_advn_ale invalid D(4) – 2.3 D(4) + 3.5 D(4) – 3.3 D(4) + 9.5 ns F10 td(clkH-oen) Delay time, output clock gpmc_clk rising edge to output enable gpmc_oen transition H(8) – 2.3 H(8) + 3.5 H(8) – 3.3 H(8) + 8.5 ns F11 td(clkH-oenIV) Delay time, output clock gpmc_clk rising edge to output enable gpmc_oen invalid H(8) – 2.3 H(8) + 3.5 H(8) – 3.3 H(8) + 8.5 ns F14 td(clkH-wen) Delay time, output clock gpmc_clk rising edge to output write enable gpmc_wen transition I(9) – 2.3 I(9) + 4.5 I(9) – 3.3 I(9) + 9.5 ns F15 td(clkH-do) Delay time, output clock gpmc_clk rising edge to output data gpmc_ad[15:0] transition(11) J(10) – 2.3 J(10) + 1.9 J(10) – 3.3 J(10) + 6.9 ns F15 td(clkL-do) Delay time, gpmc_clk falling edge to gpmc_ad[15:0] data bus transition(12) J(10) – 2.3 J(10) + 1.9 J(10) – 3.3 J(10) + 6.9 ns F15 td(clkL-do) Delay time, gpmc_clk falling edge to gpmc_ad[15:0] data bus transition(13) J(10) – 2.3 J(10) + 1.9 J(10) – 3.3 J(10) + 11.9 ns F17 td(clkH-be[x]n) Delay time, output clock gpmc_clk rising edge to output lower byte enable and command latch enable gpmc_be0n_cle transition(11) J(10) – 2.3 J(10) + 1.9 J(10) – 3.3 J(10) + 6.9 ns F17 td(clkL-be[x]n) Delay time, gpmc_clk falling edge to gpmc_nbe0_cle, gpmc_nbe1 transition(12) J(10) – 2.3 J(10) + 1.9 J(10) – 3.3 J(10) + 6.9 ns F17 td(clkL-be[x]n) Delay time, gpmc_clk falling edge to gpmc_nbe0_cle, gpmc_nbe1 transition(13) J(10) – 2.3 J(10) + 1.9 J(10) – 3.3 J(10) + 11.9 ns F18 F19 33.33 MHz tJ(clk) F6 , output clock gpmc_clk 50 (6) - 2.2 (6) F + 4.5 (6) F - 3.2 (6) F A (1) Write A (1) Read C(3) C(3) ns C(3) C(3) ns tw(csnV) Pulse duration, output chip select gpmc_csn[x](14) low Read tw(be[x]nV) Pulse duration, output lower byte enable and command latch enable gpmc_be0n_cle, output upper byte enable gpmc_be1n low Write A (1) ns A (1) ns Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 127 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 7-24. GPMC and NOR Flash Switching Characteristics—Synchronous Mode(2) (continued) NO. F20 OPP100 PARAMETER tw(advnV) Pulse duration, output address valid and address latch enable gpmc_advn_ale low MIN OPP50 MAX MIN MAX UNIT Read K(16) K(16) ns Write (16) K(16) ns K (1) For single read: A = (CSRdOffTime – CSOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) For burst read: A = (CSRdOffTime – CSOnTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) For burst write: A = (CSWrOffTime – CSOnTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) With n being the page burst access number. (2) B = ClkActivationTime × GPMC_FCLK(17) (3) For single read: C = RdCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK (17) For burst read: C = (RdCycleTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) For burst write: C = (WrCycleTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) With n being the page burst access number. (4) For single read: D = (RdCycleTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) For burst read: D = (RdCycleTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) For burst write: D = (WrCycleTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) (5) For single read: E = (CSRdOffTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) For burst read: E = (CSRdOffTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) For burst write: E = (CSWrOffTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) (6) For csn falling edge (CS activated): – Case GpmcFCLKDivider = 0: – F = 0.5 × CSExtraDelay × GPMC_FCLK(17) – Case GpmcFCLKDivider = 1: – F = 0.5 × CSExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and CSOnTime are odd) or (ClkActivationTime and CSOnTime are even) – F = (1 + 0.5 × CSExtraDelay) × GPMC_FCLK(17) otherwise – Case GpmcFCLKDivider = 2: – F = 0.5 × CSExtraDelay × GPMC_FCLK(17) if ((CSOnTime – ClkActivationTime) is a multiple of 3) – F = (1 + 0.5 × CSExtraDelay) × GPMC_FCLK(17) if ((CSOnTime – ClkActivationTime – 1) is a multiple of 3) – F = (2 + 0.5 × CSExtraDelay) × GPMC_FCLK(17) if ((CSOnTime – ClkActivationTime – 2) is a multiple of 3) (7) For ADV falling edge (ADV activated): – Case GpmcFCLKDivider = 0: – G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) – Case GpmcFCLKDivider = 1: – G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and ADVOnTime are odd) or (ClkActivationTime and ADVOnTime are even) – G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) otherwise – Case GpmcFCLKDivider = 2: – G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if ((ADVOnTime – ClkActivationTime) is a multiple of 3) – G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVOnTime – ClkActivationTime – 1) is a multiple of 3) – G = (2 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVOnTime – ClkActivationTime – 2) is a multiple of 3) For ADV rising edge (ADV deactivated) in Reading mode: – Case GpmcFCLKDivider = 0: – G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) – Case GpmcFCLKDivider = 1: – G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and ADVRdOffTime are odd) or (ClkActivationTime and ADVRdOffTime are even) – G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) otherwise – Case GpmcFCLKDivider = 2: – G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if ((ADVRdOffTime – ClkActivationTime) is a multiple of 3) – G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVRdOffTime – ClkActivationTime – 1) is a multiple of 3) – G = (2 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVRdOffTime – ClkActivationTime – 2) is a multiple of 3) For ADV rising edge (ADV deactivated) in Writing mode: – Case GpmcFCLKDivider = 0: – G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) – Case GpmcFCLKDivider = 1: – G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and ADVWrOffTime are odd) or (ClkActivationTime and ADVWrOffTime are even) – G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) otherwise – Case GpmcFCLKDivider = 2: – G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if ((ADVWrOffTime – ClkActivationTime) is a multiple of 3) – G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVWrOffTime – ClkActivationTime – 1) is a multiple of 3) – G = (2 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVWrOffTime – ClkActivationTime – 2) is a multiple of 3) 128 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 (8) For OE falling edge (OE activated) and I/O DIR rising edge (Data Bus input direction): – Case GpmcFCLKDivider = 0: – H = 0.5 × OEExtraDelay × GPMC_FCLK(17) – Case GpmcFCLKDivider = 1: – H = 0.5 × OEExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and OEOnTime are odd) or (ClkActivationTime and OEOnTime are even) – H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) otherwise – Case GpmcFCLKDivider = 2: – H = 0.5 × OEExtraDelay × GPMC_FCLK(17) if ((OEOnTime – ClkActivationTime) is a multiple of 3) – H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) if ((OEOnTime – ClkActivationTime – 1) is a multiple of 3) – H = (2 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) if ((OEOnTime – ClkActivationTime – 2) is a multiple of 3) For OE rising edge (OE deactivated): – Case GpmcFCLKDivider = 0: – H = 0.5 × OEExtraDelay × GPMC_FCLK(17) – Case GpmcFCLKDivider = 1: – H = 0.5 × OEExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and OEOffTime are odd) or (ClkActivationTime and OEOffTime are even) – H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) otherwise – Case GpmcFCLKDivider = 2: – H = 0.5 × OEExtraDelay × GPMC_FCLK(17) if ((OEOffTime – ClkActivationTime) is a multiple of 3) – H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) if ((OEOffTime – ClkActivationTime – 1) is a multiple of 3) – H = (2 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) if ((OEOffTime – ClkActivationTime – 2) is a multiple of 3) (9) For WE falling edge (WE activated): – Case GpmcFCLKDivider = 0: – I = 0.5 × WEExtraDelay × GPMC_FCLK(17) – Case GpmcFCLKDivider = 1: – I = 0.5 × WEExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and WEOnTime are odd) or (ClkActivationTime and WEOnTime are even) – I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) otherwise – Case GpmcFCLKDivider = 2: – I = 0.5 × WEExtraDelay × GPMC_FCLK(17) if ((WEOnTime – ClkActivationTime) is a multiple of 3) – I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) if ((WEOnTime – ClkActivationTime – 1) is a multiple of 3) – I = (2 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) if ((WEOnTime – ClkActivationTime – 2) is a multiple of 3) For WE rising edge (WE deactivated): – Case GpmcFCLKDivider = 0: – I = 0.5 × WEExtraDelay × GPMC_FCLK (17) – Case GpmcFCLKDivider = 1: – I = 0.5 × WEExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and WEOffTime are odd) or (ClkActivationTime and WEOffTime are even) – I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) otherwise – Case GpmcFCLKDivider = 2: – I = 0.5 × WEExtraDelay × GPMC_FCLK(17) if ((WEOffTime – ClkActivationTime) is a multiple of 3) – I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) if ((WEOffTime – ClkActivationTime – 1) is a multiple of 3) – I = (2 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) if ((WEOffTime – ClkActivationTime – 2) is a multiple of 3) (10) J = GPMC_FCLK(17) (11) First transfer only for CLK DIV 1 mode. (12) Half cycle; for all data after initial transfer for CLK DIV 1 mode. (13) Half cycle of GPMC_CLK_OUT; for all data for modes other than CLK DIV 1 mode. GPMC_CLK_OUT divide down from GPMC_FCLK. (14) In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. (15) P = gpmc_clk period in ns (16) For read: K = (ADVRdOffTime – ADVOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) For write: K = (ADVWrOffTime – ADVOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17) (17) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns. (18) Related to the gpmc_clk output clock maximum and minimum frequencies programmable in the GPMC module by setting the GPMC_CONFIG1_CSx configuration register bit field GpmcFCLKDivider. (19) The jitter probability density can be approximated by a Gaussian function. Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 129 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com F1 F0 F1 gpmc_clk F2 F3 F18 gpmc_csn[x] F4 gpmc_a[10:1] Valid Address F6 F7 F19 gpmc_be0n_cle F19 gpmc_be1n F6 F8 F8 F20 F9 gpmc_advn_ale F10 F11 gpmc_oen F13 F12 gpmc_ad[15:0] D0 gpmc_wait[x] A. B. In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. Figure 7-17. GPMC and NOR Flash—Synchronous Single Read—(GpmcFCLKDivider = 0) 130 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 F1 F0 F1 gpmc_clk F2 F3 gpmc_csn[x] F4 gpmc_a[10:1] Valid Address F6 F7 gpmc_be0n_cle F7 gpmc_be1n F6 F8 F8 F9 gpmc_advn_ale F10 F11 gpmc_oen F13 F13 F12 gpmc_ad[15:0] D0 F21 F12 D1 D2 D3 F22 gpmc_wait[x] A. B. In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. Figure 7-18. GPMC and NOR Flash—Synchronous Burst Read—4x16-Bit (GpmcFCLKDivider = 0) Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 131 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com F1 F1 F0 gpmc_clk F2 F3 gpmc_csn[x] F4 Valid Address gpmc_a[10:1] F17 F6 F17 F17 gpmc_be0n_cle F17 F17 F17 gpmc_be1n F6 F8 F8 F9 gpmc_advn_ale F14 F14 gpmc_wen F15 gpmc_ad[15:0] D0 D1 F15 F15 D2 D3 gpmc_wait[x] A. B. In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. Figure 7-19. GPMC and NOR Flash—Synchronous Burst Write—(GpmcFCLKDivider > 0) 132 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 F1 F0 F1 gpmc_clk F2 F3 gpmc_csn[x] F6 F7 gpmc_be0n_cle Valid F6 F7 gpmc_be1n Valid F4 gpmc_a[27:17] Address (MSB) F12 F4 gpmc_ad[15:0] F5 Address (LSB) F13 D0 F8 D1 F12 D2 F8 D3 F9 gpmc_advn_ale F10 F11 gpmc_oen gpmc_wait[x] A. B. In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. Figure 7-20. GPMC and Multiplexed NOR Flash—Synchronous Burst Read Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 133 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com F1 F1 F0 gpmc_clk F2 F3 F18 gpmc_csn[x] F4 gpmc_a[27:17] Address (MSB) F17 F6 F17 F6 F17 F17 gpmc_be1n F17 F17 gpmc_be0n_cle F8 F8 F20 F9 gpmc_advn_ale F14 F14 gpmc_wen F15 gpmc_ad[15:0] Address (LSB) F21 gpmc_wait[x] A. B. D0 D1 F15 F15 D2 D3 F22 In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. Figure 7-21. GPMC and Multiplexed NOR Flash—Synchronous Burst Write 134 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com 7.7.1.2 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 GPMC and NOR Flash—Asynchronous Mode Table 7-26 and Table 7-27 assume testing over the recommended operating conditions and electrical characteristic conditions shown in Table 7-25 (see Figure 7-22 through Figure 7-27). Table 7-25. GPMC and NOR Flash Timing Conditions—Asynchronous Mode MIN TYP MAX UNIT Input Conditions tR Input signal rise time 1 5 ns tF Input signal fall time 1 5 ns 3 30 pF Output Condition CLOAD Output load capacitance Table 7-26. GPMC and NOR Flash Internal Timing Requirements—Asynchronous Mode(1)(2) OPP100 NO. MIN FI1 Delay time, output data gpmc_ad[15:0] generation from internal functional clock GPMC_FCLK(3) FI2 Delay time, input data gpmc_ad[15:0] capture from internal functional clock GPMC_FCLK(3) FI3 OPP50 MAX MIN MAX UNIT 6.5 6.5 ns 4 4 ns Delay time, output chip select gpmc_csn[x] generation from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns FI4 Delay time, output address gpmc_a[27:1] generation from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns FI5 Delay time, output address gpmc_a[27:1] valid from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns FI6 Delay time, output lower-byte enable and command latch enable gpmc_be0n_cle, output upper-byte enable gpmc_be1n generation from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns FI7 Delay time, output enable gpmc_oen generation from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns FI8 Delay time, output write enable gpmc_wen generation from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns 100 100 ps FI9 (3) Skew, internal functional clock GPMC_FCLK (1) The internal parameters table must be used to calculate data access time stored in the corresponding CS register bit field. (2) Internal parameters are referred to the GPMC functional internal clock which is not provided externally. (3) GPMC_FCLK is general-purpose memory controller internal functional clock. Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 135 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Table 7-27. GPMC and NOR Flash Timing Requirements—Asynchronous Mode NO. OPP100 MIN FA5(1) tacc(d) (2) FA20 tacc1-pgmode(d) FA21(3) tacc2-pgmode(d) OPP50 MAX MIN UNIT MAX H(5) H(5) ns Page mode successive data access time P (4) P(4) ns Page mode first data access time H(5) H(5) ns Data access time (1) The FA5 parameter shows the amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data is internally sampled by active functional clock edge. FA5 value must be stored inside the AccessTime register bit field. (2) The FA20 parameter shows amount of time required to internally sample successive input page data. It is expressed in number of GPMC functional clock cycles. After each access to input page data, next input page data is internally sampled by active functional clock edge after FA20 functional clock cycles. The FA20 value must be stored in the PageBurstAccessTime register bit field. (3) The FA21 parameter shows amount of time required to internally sample first input page data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA21 functional clock cycles, first input page data is internally sampled by active functional clock edge. FA21 value must be stored inside the AccessTime register bit field. (4) P = PageBurstAccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(6) (5) H = AccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(6) (6) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns. Table 7-28. GPMC and NOR Flash Switching Characteristics—Asynchronous Mode NO. OPP100 PARAMETER MIN OPP50 MAX MIN MAX Read N(12) N(12) Write N(12) N(12) UNIT FA0 tw(be[x]nV) Pulse duration, output lower-byte enable and command latch enable gpmc_be0n_cle, output upper-byte enable gpmc_be1n valid time FA1 tw(csnV) Pulse duration, output chip select gpmc_csn[x](13) low Read A(1) A(1) Write (1) A(1) Read B(2) – 0.2 B(2) + 2.0 B(2) – 5 B(2) + 5 FA3 td(csnV-advnIV) Delay time, output chip select gpmc_csn[x](13) valid to output address valid and address latch enable gpmc_advn_ale invalid Write B(2) – 0.2 B(2) + 2.0 B(2) – 5 B(2) + 5 FA4 td(csnV-oenIV) Delay time, output chip select gpmc_csn[x](13) valid to output enable gpmc_oen invalid (Single read) C(3) – 0.2 C(3) + 2.0 C(3) – 5 C(3) + 5 ns FA9 td(aV-csnV) Delay time, output address gpmc_a[27:1] valid to output chip select gpmc_csn[x](13) valid J(9) – 0.2 J(9) + 2.0 J(9) – 5 J(9) + 5 ns FA10 td(be[x]nV-csnV) Delay time, output lower-byte enable and command latch enable gpmc_be0n_cle, output upper-byte enable gpmc_be1n valid to output chip select gpmc_csn[x](13) valid J(9) – 0.2 J(9) + 2.0 J(9) – 5 J(9) + 5 ns FA12 td(csnV-advnV) Delay time, output chip select gpmc_csn[x](13) valid to output address valid and address latch enable gpmc_advn_ale valid K(10) – 0.2 K(10) + 2.0 K(10) – 5 K(10) + 5 ns FA13 td(csnV-oenV) Delay time, output chip select gpmc_csn[x](13) valid to output enable gpmc_oen valid L(11) – 0.2 L(11) + 2.0 L L(11) + 5 ns FA16 tw(aIV) Pulse durationm output address gpmc_a[26:1] invalid between 2 successive read and write accesses G(7) FA18 td(csnV-oenIV) Delay time, output chip select gpmc_csn[x](13) valid to output enable gpmc_oen invalid (Burst read) I(8) – 0.2 FA20 tw(aV) Pulse duration, output address gpmc_a[27:1] valid - 2nd, 3rd, and 4th accesses FA25 td(csnV-wenV) Delay time, output chip select gpmc_csn[x](13) valid to output write enable gpmc_wen valid E(5) – 0.2 E(5) + 2.0 E(5) – 5 E(5) + 5 ns FA27 td(csnV-wenIV) Delay time, output chip select gpmc_csn[x](13) valid to output write enable gpmc_wen invalid F(6) – 0.2 F(6) + 2.0 F(6) – 5 F(6) + 5 ns 136 Peripheral Information and Timings A (11) –5 G(7) I(8) + 2.0 D(4) I(8) – 5 ns ns ns ns I(8) + 5 D(4) ns ns Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 7-28. GPMC and NOR Flash Switching Characteristics—Asynchronous Mode (continued) NO. PARAMETER FA28 td(wenV-dV) Delay time, output write enable gpmc_ wen valid to output data gpmc_ad[15:0] valid FA29 td(dV-csnV) Delay time, output data gpmc_ad[15:0] valid to output chip select gpmc_csn[x](13) valid FA37 td(oenV-aIV) Delay time, output enable gpmc_oen valid to output address gpmc_ad[15:0] phase end OPP100 MIN OPP50 MAX MIN MAX 2.0 J(9) – 0.2 J(9) + 2.0 J(9) – 5 UNIT 5 ns J(9) + 5 ns 5 ns 2.0 (1) For single read: A = (CSRdOffTime – CSOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14) For single write: A = (CSWrOffTime – CSOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14) For burst read: A = (CSRdOffTime – CSOnTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14) For burst write: A = (CSWrOffTime – CSOnTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14) with n being the page burst access number (2) For reading: B = ((ADVRdOffTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay – CSExtraDelay)) × GPMC_FCLK(14) For writing: B = ((ADVWrOffTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay – CSExtraDelay)) × GPMC_FCLK(14) (3) C = ((OEOffTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14) (4) D = PageBurstAccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(14) (5) E = ((WEOnTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14) (6) F = ((WEOffTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14) (7) G = Cycle2CycleDelay × GPMC_FCLK(14) (8) I = ((OEOffTime + (n – 1) × PageBurstAccessTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14) (9) J = (CSOnTime × (TimeParaGranularity + 1) + 0.5 × CSExtraDelay) × GPMC_FCLK(14) (10) K = ((ADVOnTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay – CSExtraDelay)) × GPMC_FCLK(14) (11) L = ((OEOnTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14) (12) For single read: N = RdCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK(14) For single write: N = WrCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK(14) For burst read: N = (RdCycleTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14) For burst write: N = (WrCycleTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14) (13) In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. (14) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns. Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 137 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com GPMC_FCLK gpmc_clk FA5 FA1 gpmc_csn[x] FA9 gpmc_a[10:1] Valid Address FA0 FA10 gpmc_be0n_cle Valid FA0 gpmc_be1n Valid FA10 FA3 FA12 gpmc_advn_ale FA4 FA13 gpmc_oen Data IN 0 gpmc_ad[15:0] Data IN 0 gpmc_wait[x] A. B. C. In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. FA5 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data will be internally sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bits field. GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally. Figure 7-22. GPMC and NOR Flash—Asynchronous Read—Single Word 138 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 GPMC_FCLK gpmc_clk FA5 FA5 FA1 FA1 gpmc_csn[x] FA16 FA9 FA9 gpmc_a[10:1] Address 0 Address 1 FA0 FA10 FA0 FA10 gpmc_be0n_cle Valid Valid FA0 gpmc_be1n FA0 Valid FA10 Valid FA10 FA3 FA3 FA12 FA12 gpmc_advn_ale FA4 FA13 FA4 FA13 gpmc_oen gpmc_ad[15:0] Data Upper gpmc_wait[x] A. B. C. In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. FA5 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data will be internally sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bits field. GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally. Figure 7-23. GPMC and NOR Flash—Asynchronous Read—32-Bit Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 139 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com GPMC_FCLK gpmc_clk FA21 FA20 FA20 FA20 Add1 Add2 Add3 D0 D1 D2 FA1 gpmc_csn[x] FA9 Add0 gpmc_a[10:1] Add4 FA0 FA10 gpmc_be0n_cle FA0 FA10 gpmc_be1n FA12 gpmc_advn_ale FA18 FA13 gpmc_oen gpmc_ad[15:0] D3 D3 gpmc_wait[x] A. B. C. D. In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. FA21 parameter illustrates amount of time required to internally sample first input page data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA21 functional clock cycles, first input page data will be internally sampled by active functional clock edge. FA21 calculation must be stored inside AccessTime register bits field. FA20 parameter illustrates amount of time required to internally sample successive input page data. It is expressed in number of GPMC functional clock cycles. After each access to input page data, next input page data will be internally sampled by active functional clock edge after FA20 functional clock cycles. FA20 is also the duration of address phases for successive input page data (excluding first input page data). FA20 value must be stored in PageBurstAccessTime register bits field. GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally. Figure 7-24. GPMC and NOR Flash—Asynchronous Read—Page Mode 4x16-Bit 140 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 gpmc_fclk gpmc_clk FA1 gpmc_csn[x] FA9 gpmc_a[10:1] Valid Address FA0 FA10 gpmc_be0n_cle FA0 FA10 gpmc_be1n FA3 FA12 gpmc_advn_ale FA27 FA25 gpmc_wen FA29 gpmc_ad[15:0] Data OUT gpmc_wait[x] A. In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. Figure 7-25. GPMC and NOR Flash—Asynchronous Write—Single Word Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 141 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com GPMC_FCLK gpmc_clk FA1 FA5 gpmc_csn[x] FA9 gpmc_a[27:17] Address (MSB) FA0 FA10 gpmc_be0n_cle Valid FA0 FA10 gpmc_be1n Valid FA3 FA12 gpmc_advn_ale FA4 FA13 gpmc_oen FA29 gpmc_ad[15:0] FA37 Data IN Address (LSB) Data IN gpmc_wait[x] A. B. C. In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. FA5 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data will be internally sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bits field. GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally. Figure 7-26. GPMC and Multiplexed NOR Flash—Asynchronous Read—Single Word 142 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 gpmc_fclk gpmc_clk FA1 gpmc_csn[x] FA9 gpmc_a[27:17] Address (MSB) FA0 FA10 gpmc_be0n_cle FA0 FA10 gpmc_be1n FA3 FA12 gpmc_advn_ale FA27 FA25 gpmc_wen FA29 gpmc_ad[15:0] FA28 Valid Address (LSB) Data OUT gpmc_wait[x] A. In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. Figure 7-27. GPMC and Multiplexed NOR Flash—Asynchronous Write—Single Word Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 143 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.7.1.3 www.ti.com GPMC and NAND Flash—Asynchronous Mode Table 7-30 and Table 7-31 assume testing over the recommended operating conditions and electrical characteristic conditions shown in Table 7-29 (see Figure 7-28 through Figure 7-31). Table 7-29. GPMC and NAND Flash Timing Conditions—Asynchronous Mode PARAMETER MIN TYP MAX UNIT Input Conditions tR Input signal rise time 1 5 ns tF Input signal fall time 1 5 ns 3 30 pF Output Condition CLOAD Output load capacitance Table 7-30. GPMC and NAND Flash Internal Timing Requirements—Asynchronous Mode(1)(2) OPP100 NO. MIN OPP50 MAX MIN MAX UNIT GNFI1 Delay time, output data gpmc_ad[15:0] generation from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns GNFI2 Delay time, input data gpmc_ad[15:0] capture from internal functional clock GPMC_FCLK(3) 4.0 4.0 ns GNFI3 Delay time, output chip select gpmc_csn[x] generation from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns GNFI4 Delay time, output address valid and address latch enable gpmc_advn_ale generation from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns GNFI5 Delay time, output lower-byte enable and command latch enable gpmc_be0n_cle generation from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns GNFI6 Delay time, output enable gpmc_oen generation from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns GNFI7 Delay time, output write enable gpmc_wen generation from internal functional clock GPMC_FCLK(3) 6.5 6.5 ns GNFI8 Skew, functional clock GPMC_FCLK(3) 100 100 ps (1) Internal parameters table must be used to calculate data access time stored in the corresponding CS register bit field. (2) Internal parameters are referred to the GPMC functional internal clock which is not provided externally. (3) GPMC_FCLK is general-purpose memory controller internal functional clock. Table 7-31. GPMC and NAND Flash Timing Requirements—Asynchronous Mode OPP100 NO. GNF12(1) MIN tacc(d) OPP50 MAX J(2) Access time, input data gpmc_ad[15:0] MIN MAX J(2) UNIT ns (1) The GNF12 parameter illustrates the amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of the read cycle and after GNF12 functional clock cycles, input data is internally sampled by the active functional clock edge. The GNF12 value must be stored inside AccessTime register bit field. (2) J = AccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(3) (3) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns. 144 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Table 7-32. GPMC and NAND Flash Switching Characteristics—Asynchronous Mode NO. GNF0 OPP100 PARAMETER tw(wenV) OPP50 MIN Pulse duration, output write enable gpmc_wen valid (13) MAX MIN A(1) MAX A(1) UNIT ns GNF1 td(csnV-wenV) Delay time, output chip select gpmc_csn[x] valid to output write enable gpmc_wen valid B(2) – 0.2 B(2) + 2.0 B(2) – 5 B(2) + 5 ns GNF2 tw(cleH-wenV) Delay time, output lower-byte enable and command latch enable gpmc_be0n_cle high to output write enable gpmc_wen valid C(3) – 0.2 C(3) + 2.0 C(3) – 5 C(3) + 5 ns GNF3 tw(wenV-dV) Delay time, output data gpmc_ad[15:0] valid to output write enable gpmc_wen valid D(4) – 0.2 D(4) + 2.0 D(4) – 5 D(4) + 5 ns GNF4 tw(wenIV-dIV) Delay time, output write enable gpmc_wen invalid to output data gpmc_ad[15:0] invalid E(5) – 0.2 E(5) + 5 E(5) – 5 E(5) + 5 ns GNF5 tw(wenIV-cleIV) Delay time, output write enable gpmc_wen invalid to output lower-byte enable and command latch enable gpmc_be0n_cle invalid F(6) – 0.2 F(6) + 2.0 F(6) – 5 F(6) + 5 ns GNF6 tw(wenIV-csnIV) Delay time, output write enable gpmc_wen invalid to output chip select gpmc_csn[x](13) invalid G(7) – 0.2 G(7) + 2.0 G(7) – 5 G(7) + 5 ns GNF7 tw(aleH-wenV) Delay time, output address valid and address latch enable gpmc_advn_ale high to output write enable gpmc_wen valid C(3) – 0.2 C(3) + 2.0 C(3) – 5 C(3) + 5 ns GNF8 tw(wenIV-aleIV) Delay time, output write enable gpmc_wen invalid to output address valid and address latch enable gpmc_advn_ale invalid F(6) – 0.2 F(6) + 2.0 F(6) – 5 F(6) + 5 ns GNF9 tc(wen) Cycle time, write H(8) ns +5 ns K(10) ns H(8) (13) GNF10 td(csnV-oenV) Delay time, output chip select gpmc_csn[x] valid to output enable gpmc_oen valid GNF13 tw(oenV) Pulse duration, output enable gpmc_oen valid GNF14 tc(oen) Cycle time, read GNF15 tw(oenIV-csnIV) Delay time, output enable gpmc_oen invalid to output chip select gpmc_csn[x](13) invalid I (9) – 0.2 I (9) + 2.0 I (9) –5 I (9) K(10) L (12) M (11) L (12) – 0.2 M + 2.0 (12) M (11) –5 ns (12) M +5 ns (1) A = (WEOffTime – WEOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14) (2) B = ((WEOnTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14) (3) C = ((WEOnTime – ADVOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay – ADVExtraDelay)) × GPMC_FCLK(14) (4) D = (WEOnTime × (TimeParaGranularity + 1) + 0.5 × WEExtraDelay) × GPMC_FCLK(14) (5) E = ((WrCycleTime – WEOffTime) × (TimeParaGranularity + 1) – 0.5 × WEExtraDelay) × GPMC_FCLK(14) (6) F = ((ADVWrOffTime – WEOffTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay – WEExtraDelay)) × GPMC_FCLK(14) (7) G = ((CSWrOffTime – WEOffTime) × (TimeParaGranularity + 1) + 0.5 × (CSExtraDelay – WEExtraDelay)) × GPMC_FCLK(14) (8) H = WrCycleTime × (1 + TimeParaGranularity) × GPMC_FCLK(14) (9) I = ((OEOnTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14) (10) K = (OEOffTime – OEOnTime) × (1 + TimeParaGranularity) × GPMC_FCLK(14) (11) L = RdCycleTime × (1 + TimeParaGranularity) × GPMC_FCLK(14) (12) M = ((CSRdOffTime – OEOffTime) × (TimeParaGranularity + 1) + 0.5 × (CSExtraDelay – OEExtraDelay)) × GPMC_FCLK(14) (13) In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. (14) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns. Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 145 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com GPMC_FCLK GNF1 GNF6 GNF2 GNF5 gpmc_csn[x] gpmc_be0n_cle gpmc_advn_ale gpmc_oen GNF0 gpmc_wen GNF3 GNF4 gpmc_ad[15:0] (1) Command In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. Figure 7-28. GPMC and NAND Flash—Command Latch Cycle GPMC_FCLK GNF1 GNF6 GNF7 GNF8 gpmc_csn[x] gpmc_be0n_cle gpmc_advn_ale gpmc_oen GNF9 GNF0 gpmc_wen GNF3 gpmc_ad[15:0] (1) GNF4 Address In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. Figure 7-29. GPMC and NAND Flash—Address Latch Cycle 146 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 GPMC_FCLK GNF12 GNF10 GNF15 gpmc_csn[x] gpmc_be0n_cle gpmc_advn_ale GNF14 GNF13 gpmc_oen gpmc_ad[15:0] DATA gpmc_wait[x] (1) (2) (3) GNF12 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after GNF12 functional clock cycles, input data will be internally sampled by active functional clock edge. GNF12 value must be stored inside AccessTime register bits field. GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally. In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1. Figure 7-30. GPMC and NAND Flash—Data Read Cycle GPMC_FCLK GNF1 GNF6 gpmc_csn[x] gpmc_be0n_cle gpmc_advn_ale gpmc_oen GNF9 GNF0 gpmc_wen GNF3 gpmc_ad[15:0] (1) GNF4 DATA In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. Figure 7-31. GPMC and NAND Flash—Data Write Cycle Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 147 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.7.2 www.ti.com mDDR(LPDDR), DDR2, DDR3, DDR3L Memory Interface The device has a dedicated interface to mDDR(LPDDR), DDR2, DDR3, and DDR3L SDRAM. It supports JEDEC standard compliant mDDR(LPDDR), DDR2, DDR3, and DDR3L SDRAM devices with a 16-bit data path to external SDRAM memory. For more details on the mDDR(LPDDR), DDR2, DDR3, and DDR3L memory interface, see the EMIF section of the AM335x and AMIC110 Sitara Processors Technical Reference Manual. 7.7.2.1 mDDR (LPDDR) Routing Guidelines It is common to find industry references to mobile double data rate (mDDR) when discussing JEDEC defined low-power double-data rate (LPDDR) memory devices. The following guidelines use LPDDR when referencing JEDEC defined low-power double-data rate memory devices. 7.7.2.1.1 Board Designs TI only supports board designs that follow the guidelines outlined in this document. The switching characteristics and the timing diagram for the LPDDR memory interface are shown in Table 7-33 and Figure 7-32. Table 7-33. Switching Characteristics for LPDDR Memory Interface NO. 1 PARAMETER tc(DDR_CK) tc(DDR_CKn) Cycle time, DDR_CK and DDR_CKn MIN MAX 5 (1) UNIT ns (1) The JEDEC JESD209B specification only defines the maximum clock period for LPDDR333 and faster speed bin LPDDR memory devices. To determine the maximum clock period, see the respective LPDDR memory data sheet. 1 DDR_CK DDR_CKn Figure 7-32. LPDDR Memory Interface Clock Timing 7.7.2.1.2 LPDDR Interface This section provides the timing specification for the LPDDR interface as a PCB design and manufacturing specification. The design rules constrain PCB trace length, PCB trace skew, signal integrity, cross-talk, and signal timing. These rules, when followed, result in a reliable LPDDR memory system without the need for a complex timing closure process. For more information regarding the guidelines for using this LPDDR specification, see Understanding TI’s PCB Routing Rule-Based DDR Timing Specification. This application report provides generic guidelines and approach. All the specifications provided in the data manual take precedence over the generic guidelines and must be adhered to for a reliable LPDDR interface operation. 7.7.2.1.2.1 LPDDR Interface Schematic Figure 7-33 shows the schematic connections for 16-bit interface on the AM335x device using one x16 LPDDR device. The AM335x LPDDR memory interface only supports 16-bit-wide mode of operation. The AM335x device can only source one load connected to the DQS[x] and DQ[x] net class signals and one load connected to the CK and ADDR_CTRL net class signals. For more information related to net classes, see Section 7.7.2.1.2.8. 148 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 16-Bit LPDDR Device AM335x DDR_D0 DQ0 DDR_D7 DDR_DQM0 DDR_DQS0 DDR_DQSn0 DDR_D8 DQ7 LDM LDQS NC (A) DQ8 DDR_D15 DDR_DQM1 DDR_DQS1 DDR_DQSn1 NC DDR_ODT NC DDR_BA0 DDR_BA1 DDR_BA2 T T NC BA0 BA1 DDR_A0 T A0 DDR_A15 DDR_CSn0 T T A15 CS DDR_CASn DDR_RASn DDR_WEn DDR_CKE DDR_CK T T T T T T CAS DDR_CKn DQ15 UDM UDQS (A) RAS WE CKE CK CK DDR_VREF NC DDR_RESETn NC DDR_VTP 49.9 Ω (±1%, 20 mW) A. B. Enable internal weak pulldown on these pins. For details, see the EMIF section of the AM335x and AMIC110 Sitara Processors Technical Reference Manual. For all the termination requirements, see Section 7.7.2.1.2.9. Figure 7-33. 16-Bit LPDDR Interface Using One 16-Bit LPDDR Device Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 149 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 7.7.2.1.2.2 Compatible JEDEC LPDDR Devices Table 7-34 shows the parameters of the JEDEC LPDDR devices that are compatible with this interface. Generally, the LPDDR interface is compatible with x16 LPDDR400 speed grade LPDDR devices. Table 7-34. Compatible JEDEC LPDDR Devices (Per Interface)(1) NO. PARAMETER 1 JEDEC LPDDR device speed grade 2 JEDEC LPDDR device bit width 3 JEDEC LPDDR device count 4 JEDEC LPDDR device terminal count MIN MAX UNIT LPDDR400 x16 x16 Bits 1 Devices 60 Terminals (1) If the LPDDR interface is operated with a clock frequency less than 200 MHz, lower-speed grade LPDDR devices may be used if the minimum clock period specified for the LPDDR device is less than or equal to the minimum clock period selected for the AM335x LPDDR interface. 7.7.2.1.2.3 PCB Stackup The minimum stackup required for routing the AM335x device is a 4-layer stackup as shown in Table 735. Additional layers may be added to the PCB stackup to accommodate other circuitry, enhance signal integrity and electromagnetic interference performance, or to reduce the size of the PCB footprint. Table 7-35. Minimum PCB Stackup(1) LAYER TYPE DESCRIPTION 1 Signal Top signal routing 2 Plane Ground 3 Plane Split Power Plane 4 Signal Bottom signal routing (1) All signals that have critical signal integrity requirements should be routed first on layer 1. It may not be possible to route all of these signals on layer 1, therefore requiring routing of some signals on layer 4. When this is done, the signal routes on layer 4 must not cross splits in the power plane. 150 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Complete stackup specifications are provided in Table 7-36. Table 7-36. PCB Stackup Specifications(1) NO. PARAMETER MIN TYP 1 PCB routing and plane layers 4 2 Signal routing layers 2 3 Full ground layers under LPDDR routing region 1 4 Number of ground plane cuts allowed within LPDDR routing region 5 Full VDDS_DDR power reference layers under LPDDR routing region 6 Number of layers between LPDDR routing layer and reference ground plane 7 PCB routing feature size 4 8 PCB trace width, w 4 9 PCB BGA escape via pad size(2) 18 (2) MAX UNIT 0 1 0 mils mils 20 mils 10 PCB BGA escape via hole size 10 11 Single-ended impedance, Zo(3) 50 75 Ω 12 Impedance control(4)(5) Zo Zo+5 Ω Zo-5 mils (1) For the LPDDR device BGA pad size, see the LPDDR device manufacturer documentation. (2) A 20-10 via may be used if enough power routing resources are available. An 18-10 via allows for more flexible power routing to the AM335x device. (3) Zo is the nominal singled-ended impedance selected for the PCB. (4) This parameter specifies the AC characteristic impedance tolerance for each segment of a PCB signal trace relative to the chosen Zo defined by the single-ended impedance parameter. (5) Tighter impedance control is required to ensure flight time skew is minimal. Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 151 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 7.7.2.1.2.4 Placement Figure 7-34 shows the required placement for the LPDDR devices. The dimensions for this figure are defined in Table 7-37. The placement does not restrict the side of the PCB on which the devices are mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for proper routing space. For single-memory LPDDR systems, the second LPDDR device is omitted from the placement. X Y OFFSET LPDDR Device Y Y OFFSET LPDDR Interface A1 AM335x A1 Recommended LPDDR Device Orientation Figure 7-34. AM335x Device and LPDDR Device Placement Table 7-37. Placement Specifications(1) NO. MAX UNIT 1 X(2)(3) PARAMETER MIN 1750 mils 2 Y(2)(3) 1280 mils 650 mils (2)(3)(4) 3 Y Offset 4 Clearance from non-LPDDR signal to LPDDR keepout region(5)(6) 4 w (1) LPDDR keepout region to encompass entire LPDDR routing area. (2) For dimension definitions, see Figure 7-34. (3) Measurements from center of the AM335x device to center of LPDDR device. (4) For single-memory systems, TI recommends that Y offset be as small as possible. (5) w is defined as the signal trace width. (6) Non-LPDDR signals allowed within LPDDR keepout region provided they are separated from LPDDR routing layers by a ground plane. 152 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.7.2.1.2.5 LPDDR Keepout Region The region of the PCB used for the LPDDR circuitry must be isolated from other signals. The LPDDR keepout region is defined for this purpose and is shown in Figure 7-35. This region should encompass all LPDDR circuitry and the region size varies with component placement and LPDDR routing. Additional clearances required for the keepout region are shown in Table 7-37. Non-LPDDR signals must not be routed on the same signal layer as LPDDR signals within the LPDDR keepout region. Non-LPDDR signals may be routed in the region provided they are routed on layers separated from LPDDR signal layers by a ground layer. No breaks should be allowed in the reference ground or VDDS_DDR power plane in this region. In addition, the VDDS_DDR power plane should cover the entire keepout region. LPDDR Device LPDDR Interface A1 A1 Figure 7-35. LPDDR Keepout Region 7.7.2.1.2.6 Bulk Bypass Capacitors Bulk bypass capacitors are required for moderate speed bypassing of the LPDDR and other circuitry. Table 7-38 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note that this table only covers the bypass needs of the AM335x LPDDR interface and LPDDR devices. Additional bulk bypass capacitance may be needed for other circuitry. Table 7-38. Bulk Bypass Capacitors(1) NO. PARAMETER 1 AM335x VDDS_DDR bulk bypass capacitor count 2 AM335x VDDS_DDR bulk bypass total capacitance 3 LPDDR#1 bulk bypass capacitor count 4 LPDDR#1 bulk bypass total capacitance 5 (2) LPDDR#2 bulk bypass capacitor count 6 LPDDR#2 bulk bypass total capacitance(2) MIN 1 MAX UNIT Devices 10 μF 1 Devices 10 μF 1 Devices 10 μF (1) These devices should be placed near the device they are bypassing, but preference should be given to the placement of the high-speed (HS) bypass capacitors. (2) Only used when two LPDDR devices are used. Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 153 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 7.7.2.1.2.7 High-Speed Bypass Capacitors High-speed (HS) bypass capacitors are critical for proper LPDDR interface operation. It is particularly important to minimize the parasitic series inductance of the HS bypass capacitors, the AM335x device LPDDR power, and the AM335x device LPDDR ground connections. Table 7-39 contains the specification for the HS bypass capacitors as well as for the power connections on the PCB. Table 7-39. High-Speed Bypass Capacitors NO. PARAMETER MIN 1 HS bypass capacitor package size(1) 2 Distance from HS bypass capacitor to device being bypassed 3 Number of connection vias for each HS bypass capacitor(2) 4 Trace length from bypass capacitor contact to connection via 5 Number of connection vias for each AM335x VDDS_DDR and VSS terminal 6 Trace length from AM335x VDDS_DDR and VSS terminal to connection via 7 Number of connection vias for each LPDDR device power and ground terminal 8 Trace length from LPDDR device power and ground terminal to connection via 9 AM335x VDDS_DDR HS bypass capacitor count(3) 10 10 AM335x VDDS_DDR HS bypass capacitor total capacitance 0.6 11 LPDDR device HS bypass capacitor count(3)(4) 12 LPDDR device HS bypass capacitor total capacitance(4) MAX UNIT 0402 10 mils 250 2 mils Vias 30 1 mils Vias 35 1 mils Vias 35 8 0.4 mils Devices μF Devices μF (1) LxW, 10-mil units; for example, a 0402 is a 40x20-mil surface-mount capacitor. (2) An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board. (3) These devices should be placed as close as possible to the device being bypassed. (4) Per LPDDR device. 7.7.2.1.2.8 Net Classes Table 7-40 lists the clock net classes for the LPDDR interface. Table 7-41 lists the signal net classes, and associated clock net classes, for the signals in the LPDDR interface. These net classes are used for the termination and routing rules that follow. Table 7-40. Clock Net Class Definitions CLOCK NET CLASS CK AM335x PIN NAMES DDR_CK and DDR_CKn DQS0 DDR_DQS0 DQS1 DDR_DQS1 Table 7-41. Signal Net Class Definitions 154 SIGNAL NET CLASS ASSOCIATED CLOCK NET CLASS ADDR_CTRL CK DQ0 DQS0 DDR_D[7:0], DDR_DQM0 DQ1 DQS1 DDR_D[15:8], DDR_DQM1 Peripheral Information and Timings AM335x PIN NAMES DDR_BA[1:0], DDR_A[15:0], DDR_CSn0, DDR_CASn, DDR_RASn, DDR_WEn, DDR_CKE Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.7.2.1.2.9 LPDDR Signal Termination There is no specific need for adding terminations on the LPDDR interface. However, system designers may evaluate the need for serial terminators for EMI and overshoot reduction. Placement of serial terminations for DQS[x] and DQ[x] net class signals should be determined based on PCB analysis. Placement of serial terminations for ADDR_CTRL net class signals should be close to the AM335x device. Table 7-42 shows the specifications for the serial terminators in such cases. Table 7-42. LPDDR Signal Terminations NO. MIN TYP MAX UNIT 1 CK net class(1) PARAMETER 0 22 Zo(2) Ω 2 ADDR_CTRL net class(1)(3)(4) 0 22 Zo(2) Ω 3 DQS0, DQS1, DQ0, and DQ1 net classes 0 22 Zo(2) Ω (1) Only series termination is permitted. (2) Zo is the LPDDR PCB trace characteristic impedance. (3) Series termination values larger than typical only recommended to address EMI issues. (4) Series termination values should be uniform across net class. Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 155 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 7.7.2.1.3 LPDDR CK and ADDR_CTRL Routing Figure 7-36 shows the topology of the routing for the CK and ADDR_CTRL net classes. The length of signal path AB and AC should be minimized with emphasis to minimize lengths C and D such that length A is the majority of the total length of signal path AB and AC. C A LPDDR Interface B A1 AM335x A1 Figure 7-36. CK and ADDR_CTRL Routing and Topology Table 7-43. CK and ADDR_CTRL Routing Specification(1)(2) NO. PARAMETER MIN TYP MAX UNIT 1 Center-to-center CK spacing 2w 2 CK differential pair skew length mismatch(2)(3) 25 mils 3 CK B-to-CK C skew length mismatch 25 mils 4 Center-to-center CK to other LPDDR trace spacing(4) 5 CK and ADDR_CTRL nominal trace length(5) CACLM+50 mils 6 ADDR_CTRL-to-CK skew length mismatch 100 mils 7 ADDR_CTRL-to-ADDR_CTRL skew length mismatch 100 mils 8 Center-to-center ADDR_CTRL to other LPDDR trace spacing(4) 4w 9 Center-to-center ADDR_CTRL to other ADDR_CTRL trace spacing(4) 3w 10 ADDR_CTRL A-to-B and ADDR_CTRL A-to-C skew length mismatch(2) 100 mils 11 ADDR_CTRL B-to-C skew length mismatch 100 mils 4w CACLM-50 CACLM (1) CK represents the clock net class, and ADDR_CTRL represents the address and control signal net class. (2) Series terminator, if used, should be located closest to the AM335x device. (3) Differential impedance should be Zo x 2, where Zo is the single-ended impedance defined in Table 7-36. (4) Center-to-center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing congestion. (5) CACLM is the longest Manhattan distance of the CK and ADDR_CTRL net classes. 156 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 A1 DQ[0] DQ[1] LPDDR Interface Figure 7-37 shows the topology and routing for the DQS[x] and DQ[x] net classes; the routes are point to point. Skew matching across bytes is not needed nor recommended. AM335x Figure 7-37. DQS[x] and DQ[x] Routing and Topology Table 7-44. DQS[x] and DQ[x] Routing Specification(1) NO. PARAMETER 1 Center-to-center DQS[x] spacing 2 Center-to-center DDR_DQS[x] to other LPDDR trace spacing(2) 3 DQS[x] and DQ[x] nominal trace length(3) 4 DQ[x]-to-DQS[x] skew length mismatch(3) MIN TYP MAX UNIT 2w 4w DQLM-50 DQLM DQLM+50 mils 100 mils 100 mils (3) 5 DQ[x]-to-DQ[x] skew length mismatch 6 Center-to-center DQ[x] to other LPDDR trace spacing(2)(4) 4w 7 Center-to-center DQ[x] to other DQ[x] trace spacing(2)(5) 3w (1) DQS[x] represents the DQS0 and DQS1 clock net classes, and DQ[x] represents the DQ0 and DQ1 signal net classes. (2) Center-to-center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing congestion. (3) There is no requirement for skew matching between data bytes; that is, from net classes DQS0 and DQ0 to net classes DQS1 and DQ1. (4) Signals from one DQ net class should be considered other LPDDR traces to another DQ net class. (5) DQLM is the longest Manhattan distance of each of the DQS[x] and DQ[x] net classes. Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 157 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.7.2.2 www.ti.com DDR2 Routing Guidelines 7.7.2.2.1 Board Designs TI only supports board designs that follow the guidelines outlined in this document. Table 7-45 and Figure 7-38 show the switching characteristics and timing diagram for the DDR2 memory interface. Table 7-45. Switching Characteristics for DDR2 Memory Interface NO. 1 PARAMETER tc(DDR_CK) tc(DDR_CKn) Cycle time, DDR_CK and DDR_CKn MIN MAX 3.75 8(1) UNIT ns (1) The JEDEC JESD79-2F specification defines the maximum clock period of 8 ns for all standard-speed bin DDR2 memory devices. Therefore, all standard-speed bin DDR2 memory devices are required to operate at 125 MHz. 1 DDR_CK DDR_CKn Figure 7-38. DDR2 Memory Interface Clock Timing 7.7.2.2.2 DDR2 Interface This section provides the timing specification for the DDR2 interface as a PCB design and manufacturing specification. The design rules constrain PCB trace length, PCB trace skew, signal integrity, cross-talk, and signal timing. These rules, when followed, result in a reliable DDR2 memory system without the need for a complex timing closure process. For more information regarding the guidelines for using this DDR2 specification, see Understanding TI’s PCB Routing Rule-Based DDR Timing Specification. This application report provides generic guidelines and approach. All the specifications provided in the data manual take precedence over the generic guidelines and must be adhered to for a reliable DDR2 interface operation. 7.7.2.2.2.1 DDR2 Interface Schematic Figure 7-39 shows the schematic connections for 16-bit interface on the AM335x device using one x16 DDR2 device and Figure 7-40 shows the schematic connections for 16-bit interface on the AM335x device using two x8 DDR2 devices. The AM335x DDR2 memory interface only supports 16-bit-wide mode of operation. The AM335x device can only source one load connected to the DQS[x] and DQ[x] net class signals and two loads connected to the CK and ADDR_CTRL net class signals. For more information related to net classes, see Section 7.7.2.2.2.8. 158 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 16-Bit DDR2 Device AM335x DDR_D0 DQ0 DDR_D7 DDR_DQM0 DDR_DQS0 DQ7 LDM LDQS DDR_DQSn0 DDR_D8 LDQS DQ8 DDR_D15 DDR_DQM1 DDR_DQS1 DDR_DQSn1 DQ15 UDM UDQS UDQS DDR_ODT T ODT DDR_BA0 DDR_BA1 DDR_BA2 T T T BA0 BA1 BA2 DDR_A0 T A0 DDR_A15 DDR_CSn0 T T A15 CS DDR_CASn DDR_RASn DDR_WEn DDR_CKE DDR_CK T T T T T T CAS DDR_CKn RAS WE CKE CK CK DDR_VREF 0.1 µF (B) 0.1 µF (A) 1 kΩ 1% DDR_VREF VREF 0.1 µF DDR_RESETn VDDS_DDR (B) 0.1 µF 1 kΩ 1% NC DDR_VTP 49.9 Ω (±1%, 20 mW) A. B. C. Copyright © 2016, Texas Instruments Incorporated VDDS_DDR is the power supply for the DDR2 memories and the AM335x DDR2 interface. One of these capacitors can be eliminated if the divider and its capacitors are placed near a DDR_VREF pin. For all the termination requirements, see Section 7.7.2.2.2.9. Figure 7-39. 16-Bit DDR2 Interface Using One 16-Bit DDR2 Device Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 159 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 8-Bit DDR2 Devices AM335x DDR_D0 DQ0 DDR_D7 DDR_DQM0 DDR_DQS0 DQ7 DM DQS DDR_DQSn0 DQS DDR_D8 DQ0 DDR_D15 DDR_DQM1 DDR_DQS1 DDR_DQSn1 DQ7 DM DQS DQS DDR_ODT T ODT ODT DDR_BA0 DDR_BA1 DDR_BA2 T T T BA0 BA1 BA2 BA0 BA1 BA2 DDR_A0 T A0 A0 DDR_A15 DDR_CSn0 T T A15 CS A15 CS DDR_CASn DDR_RASn DDR_WEn DDR_CKE DDR_CK T T T T T T CAS CAS RAS WE CKE CK CK RAS WE CKE CK CK DDR_CKn DDR_VREF VREF (B) 0.1 µF DDR_RESETn (B) 0.1 µF VDDS_DDR 0.1 µF (A) 1 kΩ 1% DDR_VREF VREF (B) 0.1 µF 0.1 µF 1 kΩ 1% NC DDR_VTP 49.9 Ω (±1%, 20 mW) A. B. C. Copyright © 2016, Texas Instruments Incorporated VDDS_DDR is the power supply for the DDR2 memories and the AM335x DDR2 interface. One of these capacitors can be eliminated if the divider and its capacitors are placed near a DDR_VREF pin. For all the termination requirements, see Section 7.7.2.2.2.9. Figure 7-40. 16-Bit DDR2 Interface Using Two 8-Bit DDR2 Devices 160 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.7.2.2.2.2 Compatible JEDEC DDR2 Devices Table 7-46 shows the parameters of the JEDEC DDR2 devices that are compatible with this interface. Generally, the DDR2 interface is compatible with x16 or x8 DDR2-533 speed grade DDR2 devices. Table 7-46. Compatible JEDEC DDR2 Devices (Per Interface)(1) NO. PARAMETER 1 JEDEC DDR2 device speed grade(2) 2 JEDEC DDR2 device bit width 3 JEDEC DDR2 device count 4 JEDEC DDR2 device terminal count(3) MIN MAX UNIT DDR2-533 x8 x16 1 2 devices bits 60 84 terminals (1) If the DDR2 interface is operated with a clock frequency less than 266 MHz, lower-speed grade DDR2 devices may be used if the minimum clock period specified for the DDR2 device is less than or equal to the minimum clock period selected for the AM335x DDR2 interface. (2) Higher DDR2 speed grades are supported due to inherent JEDEC DDR2 backward compatibility. (3) 92-terminal devices are also supported for legacy reasons. New designs will migrate to 84-terminal DDR2 devices. Electrically, the 92and 84-terminal DDR2 devices are the same. 7.7.2.2.2.3 PCB Stackup The minimum stackup required for routing the AM335x device is a 4-layer stackup as shown in Table 747. Additional layers may be added to the PCB stackup to accommodate other circuitry, enhance signal integrity and electromagnetic interference performance, or to reduce the size of the PCB footprint. Table 7-47. Minimum PCB Stackup(1) LAYER TYPE DESCRIPTION 1 Signal Top signal routing 2 Plane Ground 3 Plane Split power plane 4 Signal Bottom signal routing (1) All signals that have critical signal integrity requirements should be routed first on layer 1. It may not be possible to route all of these signals on layer 1, therefore requiring routing of some signals on layer 4. When this is done, the signal routes on layer 4 must not cross splits in the power plane. Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 161 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com Complete stackup specifications are provided in Table 7-48. Table 7-48. PCB Stackup Specifications(1) NO. PARAMETER MIN TYP 1 PCB routing and plane layers 4 2 Signal routing layers 2 3 Full ground layers under DDR2 routing region 1 4 Number of ground plane cuts allowed within DDR2 routing region 5 Full VDDS_DDR power reference layers under DDR2 routing region 6 Number of layers between DDR2 routing layer and reference ground plane 7 PCB routing feature size 4 8 PCB trace width, w 4 9 PCB BGA escape via pad size(2) 18 (2) MAX UNIT 0 1 0 mils mils 20 mils 10 PCB BGA escape via hole size 10 11 Single-ended impedance, Zo(3) 50 75 Ω 12 Impedance control(4)(5) Zo Zo+5 Ω Zo-5 mils (1) For the DDR2 device BGA pad size, see the DDR2 device manufacturer documentation. (2) A 20-10 via may be used if enough power routing resources are available. An 18-10 via allows for more flexible power routing to the AM335x device. (3) Zo is the nominal singled-ended impedance selected for the PCB. (4) This parameter specifies the AC characteristic impedance tolerance for each segment of a PCB signal trace relative to the chosen Zo defined by the single-ended impedance parameter. (5) Tighter impedance control is required to ensure flight time skew is minimal. 162 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.7.2.2.2.4 Placement Figure 7-41 shows the required placement for the DDR2 devices. The dimensions for this figure are defined in Table 7-49. The placement does not restrict the side of the PCB on which the devices are mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for proper routing space. For single-memory DDR2 systems, the second DDR2 device is omitted from the placement. X Y OFFSET DDR2 Device Y Y OFFSET DDR2 Interface A1 AM335x A1 Recommended DDR2 Device Orientation Figure 7-41. AM335x Device and DDR2 Device Placement Table 7-49. Placement Specifications(1) NO. MAX UNIT 1 X(2)(3) PARAMETER MIN 1750 mils 2 Y(2)(3) 1280 mils 650 mils (2)(3)(4) 3 Y Offset 4 Clearance from non-DDR2 signal to DDR2 keepout region(5)(6) 4 w (1) DDR2 keepout region to encompass entire DDR2 routing area. (2) For dimension definitions, see Figure 7-41. (3) Measurements from center of the AM335x device to center of the DDR2 device. (4) For single-memory systems, it is recommended that Y offset be as small as possible. (5) w is defined as the signal trace width. (6) Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane. Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 163 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 7.7.2.2.2.5 DDR2 Keepout Region The region of the PCB used for the DDR2 circuitry must be isolated from other signals. The DDR2 keepout region is defined for this purpose and is shown in Figure 7-42. This region should encompass all DDR2 circuitry and the region size varies with component placement and DDR2 routing. Additional clearances required for the keepout region are shown in Table 7-49. Non-DDR2 signals must not be routed on the same signal layer as DDR2 signals within the DDR2 keepout region. Non-DDR2 signals may be routed in the region provided they are routed on layers separated from DDR2 signal layers by a ground layer. No breaks should be allowed in the reference ground or VDDS_DDR power plane in this region. In addition, the VDDS_DDR power plane should cover the entire keepout region. DDR2 Device DDR2 Interface A1 A1 Figure 7-42. DDR2 Keepout Region 7.7.2.2.2.6 Bulk Bypass Capacitors Bulk bypass capacitors are required for moderate speed bypassing of the DDR2 and other circuitry. Table 7-50 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note that this table only covers the bypass needs of the AM335x DDR2 interface and DDR2 devices. Additional bulk bypass capacitance may be needed for other circuitry. Table 7-50. Bulk Bypass Capacitors(1) NO. PARAMETER 1 AM335x VDDS_DDR bulk bypass capacitor count 2 AM335x VDDS_DDR bulk bypass total capacitance 3 DDR2 number 1 bulk bypass capacitor count 4 DDR2 number 1 bulk bypass total capacitance 5 (2) DDR2 number 2 bulk bypass capacitor count 6 DDR2 number 2 bulk bypass total capacitance(2) MIN 1 MAX UNIT devices 10 μF 1 devices 10 μF 1 devices 10 μF (1) These devices should be placed near the device they are bypassing, but preference should be given to the placement of the high-speed (HS) bypass capacitors. (2) Only used when two DDR2 devices are used. 164 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 7.7.2.2.2.7 High-Speed (HS) Bypass Capacitors HS bypass capacitors are critical for proper DDR2 interface operation. It is particularly important to minimize the parasitic series inductance of the HS bypass capacitors, the AM335x device DDR2 power, and the AM335x device DDR2 ground connections. Table 7-51 contains the specification for the HS bypass capacitors as well as for the power connections on the PCB. Table 7-51. HS Bypass Capacitors NO. PARAMETER MIN 1 HS bypass capacitor package size(1) 2 Distance from HS bypass capacitor to device being bypassed 3 Number of connection vias for each HS bypass capacitor(2) 4 Trace length from bypass capacitor contact to connection via 5 Number of connection vias for each AM335x VDDS_DDR and VSS terminal 6 Trace length from AM335x VDDS_DDR and VSS terminal to connection via 7 Number of connection vias for each DDR2 device power and ground terminal 8 Trace length from DDR2 device power and ground terminal to connection via 9 AM335x VDDS_DDR HS bypass capacitor count(3) 10 10 AM335x VDDS_DDR HS bypass capacitor total capacitance 0.6 11 DDR2 device HS bypass capacitor count(3)(4) 12 DDR2 device HS bypass capacitor total capacitance(4) MAX UNIT 0402 10 mils 250 mils 2 vias 30 mils 1 vias 35 mils 1 vias 35 8 mils devices μF devices 0.4 μF (1) LxW, 10-mil units; for example, a 0402 is a 40x20-mil surface-mount capacitor. (2) An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board. (3) These devices should be placed as close as possible to the device being bypassed. (4) Per DDR2 device. 7.7.2.2.2.8 Net Classes Table 7-52 lists the clock net classes for the DDR2 interface. Table 7-53 lists the signal net classes, and associated clock net classes, for the signals in the DDR2 interface. These net classes are used for the termination and routing rules that follow. Table 7-52. Clock Net Class Definitions CLOCK NET CLASS CK AM335x PIN NAMES DDR_CK and DDR_CKn DQS0 DDR_DQS0 and DDR_DQSn0 DQS1 DDR_DQS1 and DDR_DQSn1 Table 7-53. Signal Net Class Definitions SIGNAL NET CLASS ASSOCIATED CLOCK NET CLASS ADDR_CTRL CK DQ0 DQS0 DDR_D[7:0], DDR_DQM0 DQ1 DQS1 DDR_D[15:8], DDR_DQM1 AM335x PIN NAMES DDR_BA[2:0], DDR_A[15:0], DDR_CSn0, DDR_CASn, DDR_RASn, DDR_WEn, DDR_CKE, DDR_ODT Peripheral Information and Timings Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Copyright © 2011–2020, Texas Instruments Incorporated 165 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 www.ti.com 7.7.2.2.2.9 DDR2 Signal Termination Signal terminations are required on the CK and ADDR_CTRL net class signals. Serial terminations should be used on the CK and ADDR_CTRL lines and is the preferred termination scheme. On-device terminations (ODTs) are required on the DQS[x] and DQ[x] net class signals. They should be enabled to ensure signal integrity. Table 7-54 shows the specifications for the series terminators. Placement of serial terminations for ADDR_CTRL net class signals should be close to the AM335x device. Table 7-54. DDR2 Signal Terminations NO. PARAMETER MIN 1 CK net class(1) 0 2 ADDR_CTRL net class(1)(2)(3) 0 3 DQS0, DQS1, DQ0, and DQ1 net classes(5) TYP 22 N/A MAX UNIT 10 Ω Zo(4) Ω N/A Ω (1) Only series termination is permitted. (2) Series termination values larger than typical only recommended to address EMI issues. (3) Series termination values should be uniform across net class. (4) Zo is the DDR2 PCB trace characteristic impedance. (5) No external termination resistors are allowed and ODT must be used for these net classes. If the DDR2 interface is operated at a lower frequency (