AMC1300EVM

(1) User's Guide SBAU256C – May 2016 – Revised June 2018 AMC130x Evaluation Module This user's guide describes the characteristics, operation, and use of the AMC130xEVM. This evaluation module (EVM) is an evaluation and development kit for evaluating the AMC1300 or AMC1301, precision isolation amplifiers. A complete circuit description as well as schematic diagram and bill of materials are included. The following related documents are available through the Texas Instruments web site at www.ti.com. Related Documentation 1 2 3 4 5 Device Literature Number AMC1300 SBAS895 AMC1301 SBAS667 AMC1302 SBAS812 SN6501 SLLSEA0 Contents EVM Overview ............................................................................................................... Analog Interface.............................................................................................................. Power Supplies .............................................................................................................. EVM Operation ............................................................................................................... Layout, BOM, and Schematic .............................................................................................. 2 2 3 4 5 List of Figures 1 AMC130xEVM Schematic: Analog Input Section........................................................................ 2 2 AMC130xEVM Schematic: Analog Output Section 3 VDD1 Input ................................................................................................................... 3 4 VDD2 Input Connector ...................................................................................................... 3 5 AMC130x Top Layer Silkscreen ........................................................................................... 5 6 AMC130xEVM Schematic .................................................................................................. 7 ..................................................................... 3 List of Tables 1 J1: Analog Inputs ............................................................................................................ 4 2 J2: Isolated Power ........................................................................................................... 4 3 J3: VDD2 Power ............................................................................................................. 4 4 J4: Analog Output 5 (1) ........................................................................................................... AMC130xEVM Bill of Materials ............................................................................................ 4 6 All trademarks are the property of their respective owners. SBAU256C – May 2016 – Revised June 2018 Submit Documentation Feedback AMC130x Evaluation Module Copyright © 2016–2018, Texas Instruments Incorporated 1 EVM Overview 1 EVM Overview 1.1 Features www.ti.com This EVM supports the following features: • Full-featured evaluation board for the AMC1300, AMC1301, or AMC1302 single-channel precision isolation amplifier • Screw terminals for easy access to analog inputs and outputs • Optional isolated power to VDD1 from VDD2 1.2 Introduction The AMC1300, AMC1301, and AMC1302 are precision isolation amplifiers with an output separated from the input circuitry by a silicon dioxide (SiO2) barrier that is highly resistant to magnetic interference. This barrier has been certified to provide basic galvanic isolation of up to 7000 VPEAK according to UL1577 and IEC60747-5-2 specifications. For use in high-resolution measurement applications, the input of the AMC1300, AMC1301, and AMC1302 is optimized for direct connection to shunt resistors or other low-level signal sources. Throughout this document, the abbreviation EVM and the term evaluation module are synonymous with the AMC130xEVM. 2 Analog Interface The analog inputs to the AMC1300, AMC1301, and AMC1302 are routed from the two-wire screw terminal at J1. These screw terminals provide access to the inverting and noninverting inputs of the AMC130x device installed at U2. 2.1 Analog Inputs The analog inputs to the AMC130xEVM printed-circuit board (PCB) consists of optional RC filter circuit. By default, R1 and R2 on the analog input are populated as 0-Ω resistors. Capacitors C4, C5, and C8 are not installed. An example input circuit for the AMC130x is shown in Figure 1. R2 J1 1 2 +IN 0 C8 DNP R1 -IN 0 C4 C5 DNP DNP isoGND Figure 1. AMC130xEVM Schematic: Analog Input Section 2 AMC130x Evaluation Module SBAU256C – May 2016 – Revised June 2018 Submit Documentation Feedback Copyright © 2016–2018, Texas Instruments Incorporated Analog Interface www.ti.com 2.2 Analog Outputs The analog outputs from the AMC130xEVM board are fully-differential signals centered at VDD2 / 2. The outputs are available on the two screw terminals of J4, as Figure 2 shows. J4 7 VOUT+ 1 6 2 VOUT- Figure 2. AMC130xEVM Schematic: Analog Output Section 3 Power Supplies The AMC130xEVM require two separate power rails, VDD1 and VDD2. VDD1 is on the high voltage side of the amplifier. VDD2 is on the user side of the amplifier. 3.1 VDD1 Input J2 provides access to the to the VDD1 supply. For power provided from high-side isolated rails (such as from a gate-drive supply), move the shunt on jumper JP1 to cover pins 1 and 2. Use a voltage between 4.5 VDC and 5.5 VDC for the user-applied VDD1 supply. In the EVM default configuration, VDD1 is provided from VDD2 by means of an isolation transformer and U3, an SN6501 transformer driver. In the default configuration, apply 5 V to VDD2 through J3. The input power is shown in Figure 3. 5Viso VDD1 2 VDD2 J2 J3 JP1 2 1 1 2 1 3 C11 C1 10µF 4.7µF DGND isoGND VDD2 D1 U1 5 OUT C2 22µF IN NC 2 GND EN 1 8 4 C3 3 0.1µF T1 VDD2 C10 1µF 4 C6 7 3 6 2 U3 1 22µF TPS76350DBV 2 D2 isoGND isoGND 5 isoGND 1 DA2303-ALB isoGND 3 D1 GND 4 VCC D2 GND 5 SN6501DBV DGND Figure 3. VDD1 Input 3.2 VDD2 Input The user side of the AMC1300, AMC1301, and AMC1302 isolation amplifier is rated for 2.7 VDC to 5.5 VDC and is applied to the amplifier using J3. Figure 4 illustrates the power input for VDD2. VDD2 J3 2 1 C11 10µF DGND Figure 4. VDD2 Input Connector SBAU256C – May 2016 – Revised June 2018 Submit Documentation Feedback AMC130x Evaluation Module Copyright © 2016–2018, Texas Instruments Incorporated 3 EVM Operation 4 www.ti.com EVM Operation This section describes the general operation of the AMC130xEVM. 4.1 Isolated Power and Analog Inputs: J1 and J2 The analog input to the AMC130xEVM board can be applied directly to J1 pins 1 and 2. CAUTION For the limitations of the analog input range, and to ensure that the appropriate analog and digital voltages are applied before connecting any analog input to the EVM, see AMC1301 Fully-Differential Isolation Amplifier. Table 1 summarizes the details of J1. Table 1. J1: Analog Inputs Pin Number Signal J1.1 IN+ Description Noninverting input to the AMC1300, AMC1301, or AMC1302 (pin 2) J1.2 IN– Inverting analog input to the AMC1300, AMC1301, or AMC1302 (pin 3) The isolated power input to the AMC130xEVM PCB can be applied directly to J2, pins 1 and 2. Table 2 lists the details of J2. Table 2. J2: Isolated Power 4.2 Pin Number Signal Description J2.1 GND1 Connection to the AMC1300, AMC1301, or AMC1302 GND1 terminal (pin 4) J2.2 VDD1 Connection to the AMC1300, AMC1301, or AMC1302 VDD1 terminal (pin 1) User Power and Analog Output: J3 and J4 The VDD2 power input to the AMC130xEVM PCB can be applied directly to J3, pins 1 and 2. Table 3 lists the details of J3. Table 3. J3: VDD2 Power Pin Number Signal Description J3.1 GND2 Connection to the AMC1300, AMC1301, or AMC1302 GND2 terminal (pin 5) J3.2 VDD2 Connection to the AMC1300, AMC1301, or AMC1302 VDD2 terminal (pin 8) The analog output from the AMC130xEVM board is applied directly to J4, pins 1 and 2. Table 4 summarizes the details of J4. Table 4. J4: Analog Output 4 Pin Number Signal Description J4.1 VOUT– Inverting analog output from the AMC1300, AMC1301, or AMC1302 (pin 7) J4.2 VOUT+ Noninverting output from the AMC1300, AMC1301, or AMC1302 (pin 6) AMC130x Evaluation Module SBAU256C – May 2016 – Revised June 2018 Submit Documentation Feedback Copyright © 2016–2018, Texas Instruments Incorporated EVM Operation www.ti.com 4.3 Device Operation After the VDD1 and VDD2 power is applied to the AMC130xEVM, the analog outputs are available with a fixed gain and a dc offset equal to 1.44 V. An analog input signal may be applied directly at screw terminal J2. Refer to Figure 1 and Table 1 for details. For the AMC1300EVM and AMC1301EVM the differential analog input range, (VIN+) – (VIN–), is specified at ±250 mV with a maximum of ±320 mV before clipping occurs. The analog output has a nominal gain of 8 through the AMC1300 or AMC1301 isolation amplifier. With an input voltage of ±250 mV, the nominal output is therefore ±2.0 V. For the AMC1302EVM, the differential analog input range is specified at ±50 mV with a maximum of ±64 mV with a fixed gain of 41 V/V. With an input voltage of ±50 mV, the nominal output is also ±2.0 V. The output voltage of the AMC130xEVM is centered on VDD / 2 and provides a convenient analog input range to the embedded analog-to-digital converters (ADCs) of the MSP430 and TMS320C2000 series of digital processors. 5 Layout, BOM, and Schematic This sections contains the PCB layout, bill of materials, and schematic of the AMC130xEVM. 5.1 Layout Figure 5 shows the AMC130xEVM PCB layout. NOTE: Board layout is not to scale. This figure is intended to show how the board is laid out; it is not intended to be used for manufacturing AMC130xEVM PCBs. Copyright © 2017, Texas Instruments Incorporated Figure 5. AMC130x Top Layer Silkscreen SBAU256C – May 2016 – Revised June 2018 Submit Documentation Feedback AMC130x Evaluation Module Copyright © 2016–2018, Texas Instruments Incorporated 5 Layout, BOM, and Schematic 5.2 www.ti.com Bill of Material The bills of material is listed in Table 5. NOTE: All components should be RoHS compliant. Some part numbers may be either leaded or RoHS. Verify that purchased components are RoHS compliant. Table 5. AMC130xEVM Bill of Materials 6 Item Qty Ref Des 1 1 C1 2 2 C2, C6 3 3 C3, C7, C9 4 1 C10 5 1 C11 6 2 D1, D2 7 4 8 1 JP1 Description Manufacturer Part Number CAP, CERM, 4.7uF, 50V, +/-10%, X5R, 0805 TDK C2012X5R1H475K125AB CAP, CERM, 22uF, 6.3V, +/-20%, X5R, 0805 Taiyo Yuden CAP, CERM, 0.1uF, 25V, +/-10%, X7R, 0603 TDK C1608X7R1E104K CAP, CERM, 1uF, 16V, +/-10%, X5R, 0603 TDK C1608X5R1C105K CAP, CERM, 10uF, 10V, +/-10%, X5R, 0805 Murata Diode, Schottky, 20V, 0.5A, SOD-123 ON Semiconductor J1, J2, J3, J4 Terminal Block, 6A, 3.5mm Pitch, 2-Pos, TH 3x1 2mm male header RES, 0 ohm, 5%, 0.1W, 0603 On-Shore Technology JMK212BJ226MG-T GRM219R61A106KE44D MBR0520LT1G ED555/2DS Samtec TMM-103-01-T-S Rohm MCR03EZPJ000 9 2 R1, R2 10 1 T1 Isolation Transformer 11 1 U1 TPS76350DBV TI TPS76350DBV 12 1 U2 AMC1300BDWV or AMC1301BDWV TI AMC1300BDWV or AMC1301BDWV 13 1 U3 SN6501DBV TI SN6501DBV 14 0 C4, C5 DNP - Optional CAP, CERM, 10pF, 50V, +/5%, C0G/NP0, 0603 15 0 C8 DNP - Optional CAP, CERM, 330pF, 50V, +/5%, C0G/NP0, 0603 16 1 N/A Shunt AMC130x Evaluation Module Coilcraft DA2303-ALB AVX 06035A100JAT2A TDK C1608C0G1H331J Samtec 2SN-BK-G SBAU256C – May 2016 – Revised June 2018 Submit Documentation Feedback Copyright © 2016–2018, Texas Instruments Incorporated Layout, BOM, and Schematic www.ti.com 5.3 Schematic Figure 6 shows the AMC130xEVM schematic. 1 2 3 A 4 5 6 A 5Viso VDD1 2 VDD2 J3 JP1 J2 2 1 1 2 1 3 C11 C1 10µF 4.7µF DGND isoGND VDD2 D1 U1 5 OUT IN C2 22µF NC 2 GND EN 1 4 3 8 C3 T1 VDD2 C10 C6 0.1µF 7 3 6 2 U3 1 22µF TPS76350DBV D1 2 5 isoGND 3 1 DA2303-ALB GND D2 GND DGND 5Viso VDD2 0.1µF C9 1 J1 1 2 0 R1 2 C8 3 DNP 4 0 C C4 C5 DNP DNP VDD1 VDD2 VINP VOUTP VINN VOUTN GND1 0.1µF DGND U2 isoGND R2 B 5 SN6501DBV isoGND C7 4 VCC D2 isoGND isoGND B 1µF 4 GND2 8 J4 7 2 1 6 5 AMC1301DWVR C isoGND DGND isoGND D D Texas Instruments and/or its licensors do not warrant curacy the ac or completeness of this specification or any tion informa contained therein. Texas Instruments and/or its sors licen do not warrant that this design will meet the specifications, be suitable will for your application or fit for any particular rpose, pu or will operate in an implementation. Texas Instrume nts and/or its licensors do not warrant that the design is production y. You worth should completely validate and test your design mentation imple to confirm the system functionality for your icatio appl 1 2 3 4 Designed for:Public Release Mod. Date: 2/25/2016 Project Title: AMC1301EVM Number: PA0023 Rev: E1 Sheet Title: SVN Rev: Version control disabled Assembly Variant:[No Variations] Sheet:1 of 1 Drawn By: File: PA023_AMC1301_sch_A.SchDoc Size: B Engineer: Tom Hendrick Contact: http://www.ti.com/support 5 http://www.ti.com © Texas Instruments 2016 6 Copyright © 2016, Texas Instruments Incorporated Figure 6. AMC130xEVM Schematic SBAU256C – May 2016 – Revised June 2018 Submit Documentation Feedback AMC130x Evaluation Module Copyright © 2016–2018, Texas Instruments Incorporated 7 Revision History www.ti.com Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from B Revision (May 2018) to C Revision ...................................................................................................... Page • • Added AMC1302 device to user's guide ............................................................................................... 1 Changed Device Operation section to differentiate between the AMC1300EVM and AMC1301EVM functionality and the AMC1302EVM functionality .............................................................................................................. 5 Revision History Changes from A Revision (August 2016) to B Revision ................................................................................................ Page • • Changed user's guide title from AMC1301EVM to AMC130xEVM to include additional devices .............................. 1 Added AMC1300 device to user's guide ............................................................................................... 1 Revision History Changes from Original (May 2016) to A Revision ........................................................................................................... Page • 8 Changed dc offset statement in first paragraph of the Device Operation section ................................................ 5 Revision History SBAU256C – May 2016 – Revised June 2018 Submit Documentation Feedback Copyright © 2016–2018, Texas Instruments Incorporated IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice. This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services. These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation modules, and samples (http://www.ti.com/sc/docs/sampterms.htm). Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2018, Texas Instruments Incorporated