User's Guide
SBAU177E – September 2010 – Revised May 2016
AMC7812EVM-PDK User’s Guide
This user's guide describes the characteristics, operation, and use of the AMC7812 evaluation module
(EVM). This user’s guide also discusses the proper setup and configuration of software and hardware and
reviews various aspects of program operation. A complete circuit description, schematic diagram, and bill
of materials are also included.
1
2
3
4
5
6
Contents
Overview ...................................................................................................................... 3
AMC7812EVM Hardware Setup ........................................................................................... 4
AMC7812EVM Software Setup ............................................................................................ 7
AMC7812EVM Hardware Overview ....................................................................................... 9
AMC7812EVM Software Overview ...................................................................................... 13
AMC7812EVM Documentation ........................................................................................... 22
List of Figures
1
AMC7812EVM Hardware Setup ........................................................................................... 4
2
AMC7812 Test Board Block Diagram ..................................................................................... 4
3
SDM-USB-DIG Platform Block Diagram .................................................................................. 6
4
AMC7812EVM Installer Directory.......................................................................................... 7
5
AMC7812EVM Install Path ................................................................................................. 8
6
Typical Hardware Connections on the AMC7812EVM ................................................................ 10
7
Confirmation of SDM-USB-DIG Platform Driver Installation .......................................................... 10
8
AMC7812EVM GUI Location ............................................................................................. 13
9
AMC7812EVM GUI – Power On ......................................................................................... 13
10
Software Reset Button ..................................................................................................... 14
11
Low-Level Configuration Page............................................................................................ 14
12
ADC Page ................................................................................................................... 15
13
ADC Block Activation Sequence ......................................................................................... 15
14
ADC Channel MUX
15
ADC CH0 to CH3 Config .................................................................................................. 15
16
ADC External Ref Value ................................................................................................... 16
17
ADC Report Window ....................................................................................................... 17
18
DAC Page ................................................................................................................... 17
19
Program DAC Registers ................................................................................................... 17
20
DAC Gain Button ........................................................................................................... 18
21
DAC External Ref Value ................................................................................................... 18
22
DAC Clear and Latch Settings............................................................................................ 18
23
DAC Clear Triggers ........................................................................................................ 18
24
ALARMS Page.............................................................................................................. 19
25
Alarm LEDs
26
27
28
........................................................................................................
.................................................................................................................
Alarm LEDs Activated .....................................................................................................
Alarm Control Registers ...................................................................................................
GPIO + Temp Page ........................................................................................................
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19
19
20
20
1
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29
Temperature Read ......................................................................................................... 20
30
Threshold Limit Configuration
21
31
Temperature Conversion Rate
21
32
33
34
35
36
37
............................................................................................
...........................................................................................
GPIO Page ..................................................................................................................
GPIO Write/Read ...........................................................................................................
AMC7812EVM Schematic (1 of 3) .......................................................................................
AMC7812EVM Schematic (2 of 3) .......................................................................................
AMC7812EVM Schematic (3 of 3) .......................................................................................
AMC7812EVM PCB Components Layout...............................................................................
21
21
22
23
24
25
List of Tables
1
Contents of AMC7812EVM Kit ............................................................................................. 3
2
Related Documentation ..................................................................................................... 3
3
J1 Signal Definition .......................................................................................................... 5
4
Default Jumper Settings
5
6
7
8
9
10
2
.................................................................................................... 9
AMC7812EVM Jumper and Shunt Resistor Settings .................................................................. 11
AMC7812EVM ADC Signal Connections ............................................................................... 11
AMC7812EVM DAC Signal Connections ............................................................................... 12
AMC7812EVM GPIO Signal Definition .................................................................................. 12
Conversion Rates .......................................................................................................... 16
Bill of Materials ............................................................................................................. 26
AMC7812EVM-PDK User’s Guide
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Overview
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1
Overview
This EVM features the AMC7812, a highly-integrated, low-power, complete analog monitoring and control
solution that includes a 16-channel (12-bit) ADC, 12-channel (12-bit) DAC, eight GPIOs, and two
remote/one local temperature sensor channels. The device also features input out-of-range alarms, and
configurable I2C-compatible/SPI interface with 5-V/3-V logic.
1.1
AMC7812EVM Kit Contents
Table 1 details the contents of the EVM kit. Contact the Texas Instruments Product Information Center
nearest you if any component is missing. TI highly recommends to check the TI website (www.ti.com) to
verify that you have the latest versions of the related software.
Table 1. Contents of AMC7812EVM Kit (1)
(1)
1.2
ITEM
QUANTITY
AMC7812EVM PCB evaluation board
1
SDM-USB-DIG platform PCB
1
USB extender cable
1
The 24-V wall adapter is not included with the evaluation module (EVM). Optionally, a 24-V (750-mA)
center-positive wall adapter can be separately purchased to interface to the onboard 2.1 x 5.5-mm DC
jack. In the case that a wall adapter is not available, external terminal blocks are included, which can
interface with external supplies.
Related Documentation from TI
The following document provides information regarding TI integrated circuits used in the assembly of the
AMC7812EVM. This user's guide is available from the TI website, literature number SBAU177. Newer
revisions may be available from the TI website at www.ti.com, or call the TI Literature Response Center at
(800) 477-8924 or the Product Information Center at (972) 644-5580. When ordering, identify the
document by both title and literature number.
Table 2. Related Documentation
Document
Literature Number
AMC7812 Product Data Sheet
SBAS513
SDM-USB-DIG Platform User’s Guide
SBOU136
Microsoft, Windows are registered trademarks of Microsoft Corporation.
All other trademarks are the property of their respective owners.
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3
AMC7812EVM Hardware Setup
2
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AMC7812EVM Hardware Setup
This section provides the overall system setup for the EVM. A PC runs software that communicates with
the SDM-USB-DIG platform, which generates the power and digital signals used to communicate with the
EVM board. An optional +24-V wall supply can provide power through the J5 connector to provide power
to on-board power regulators (LDOs) that regulate the analog and digital supplies. By default, on-board
connectors are included on the EVM board for external supplies. Figure 1 displays the system setup for
the AMC7812EVM.
External Power
or
Optional 24-V Wall Adapter
Personal
Computer
(PC)
USB Bus
from
Computer
SDM-USBDIG
J5 connection or
terminal blocks
20-Pin
Connector
AMC7812EVM
Figure 1. AMC7812EVM Hardware Setup
2.1
Theory of Operation for AMC7812 Hardware
Figure 2 shows a block diagram of the AMC7812EVM test board. The EVM board provides testpoints for
the supplies, internal reference, ground connections, SPI inputs, ADC inputs, and DAC outputs.
Optional:
LDO Regulated
Power
Default:
External Power
(Terminal Blocks)
Power
20-Pin
Conn. To
SDMUSB-DIG
SPI
8 GPIO
Connection
AMC7812
12-CH DAC
Vout
16-CH ADC
Input
Figure 2. AMC7812 Test Board Block Diagram
4
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2.2
Signal Definitions of J1 (20-Pin Male Connector Socket)
The AMC7812EVM includes a 20-pin connector socket used to communicate between the EVM and the
SDM-USB-DIG platform. The pin out of the J1 connector is shown in Table 3.
Table 3. J1 Signal Definition
Pin on J1
Signal
Description
1
SCL
I2C clock signal (SCL)
2
DIG_GPIO2
GPIO – Control output or measure input
3
DIG_GPIO0
GPIO – Control output or measure input
4
DIG_GPIO3
GPIO – Control output or measure input
5
SDA
I2C data signal (SDA)
6
DIG_GPIO4
GPIO – Control output or measure input
7
DIG_GPIO1
GPIO – Control output or measure input
8
DIG_GPIO5
GPIO – Control output or measure input
9
MOSI
SPI data output (MOSI)
10
DIG_GPIO6
GPIO – Control output or measure input
11
VDUT
Switchable DUT power supply: +3.3 V, +5 V, Hi-Z (disconnected).
Note: When VDUT is Hi-Z all digital I/O are Hi-Z as well.
12
DIG_GPIO7
GPIO – Control output or measure input
13
SCLK
SPI clock signal (SCLK)
14
DIG_GPIO8
GPIO – Control output or measure input
15
GND
Power return (GND)
16
DIG_GPIO9
GPIO – Control output or measure input
17
CS
SPI chip select signal (/CS)
18
DIG_GPIO10
GPIO – Control output or measure input
19
MISO
SPI data input (MISO)
20
DIG_GPIO11
GPIO – Control output or measure input
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AMC7812EVM Hardware Setup
2.3
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Theory of Operation for SDM-USB-DIG Platform
The SDM-USB-DIG platform is a general-purpose data acquisition system that is used on select TI EVMs.
The core component of the platform is the MSP430F5528, an ultra-low power 16-bit MCU. The
microcontroller receives information from the host PC and translates it into I2C, SPI, or other digital I/O
patterns. The connected device (in this case, the AMC7812 device) connects to the I/O interface of the
platform. During digital I/O transactions, the platform obtains information from the AMC7812 device and
sends it to the host PC for interpretation. Figure 3 shows a block diagram of the platform.
SDM-USB-DIG
+3.3 V
USB Bus
from
Computer
USB
+5.0 V
MSP430F5528
Microcontroller
Level
Translators
I2C
SPI
GPIO
To Test Board
To Computer and Power Supplies
3.3-V
Regulator
Power on
Reset
USB +5.0 V
+3.3 V
Power
Switching
Vdut
(Hi-Z, 3.3 V or 5 V) Switched Power
Figure 3. SDM-USB-DIG Platform Block Diagram
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3
AMC7812EVM Software Setup
This section provides the procedure for EVM software installation.
3.1
Operating Systems for AMC7812EVM Software
The EVM software was tested on the Microsoft® Windows® XP and Windows 7 operating systems with the
United States and European regional settings. The software should also be compatible with other
Windows operating systems.
3.2
AMC7812EVM Software Installation
The software is available through the EVM product folder (AMC7812EVM) on the TI website. After the
software is downloaded on the PC, navigate to the AMC7812EVM_Installer folder, and run the setup.exe
file as shown in Figure 4. When the software is launched, an installation dialog opens and prompts the
user to select an installation directory. If left unchanged, the software location defaults to C:\Program Files
(x86)\AMC7812EVM (Windows 7), as shown in Figure 5. The software installation automatically copies the
required drivers for the SDM-USB-DIG and AMC7812EVM to the PC. After the software is installed,
connecting the SDM-USB-DIG to a USB port may launch a driver installation dialog. Choose the Install
this driver software anyway option to continue with installation. (Note: On XP machines, choose to have
the system automatically find the driver or software.)
Figure 4. AMC7812EVM Installer Directory
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Figure 5. AMC7812EVM Install Path
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4
AMC7812EVM Hardware Overview
The subsequent sections provide detailed information on the EVM hardware and jumper configuration
settings. To use the +24-V wall supply, set the AVDD and IOVDD jumper connections to the default
configuration listed in Table 4. The table also displays the default configurations of all jumper connections
on the AMC7812EVM. Connect the USB extender cable from the SDM-USB-DIG to the PC, and the +24V wall adapter to the J5 terminal.
Table 4. Default Jumper Settings (1)
Jumper
Function
Shunt on 1-2
Selecting bus
• 1~2: (Default) SPI
• 2~3: (I2C)
JP2
Shunt on 1-2
Selecting DAC reference
• 1~2: (REF-OUT to REF-DAC)
• 3~4: (DACREF to REF-DAC)
• 5~6: (2.5 V REF to REF-DAC)
JP3
Shunt on 1-2
Selecting AVDD/DVDD voltage
• 1~2: Onboard 5-V supply
• 2~3: External supply
JP4
Shunt on 1-2
Selecting AVCC voltage
• 1~2: (On board 14-V supply)
• 2~3: (External supply)
JP5
Shunt on 1-2
Selecting IOVDD voltage
• 1~2: (On board VDUT)
• 2~3: (External supply)
JP6
Not installed
J7
Shunt on 5-6
Shunt on 7-8
JP1
(1)
4.1
Default Position
• Installed: Onboard temp sensors
• Not installed: External temperature sensors
Default OPA to GND for protection
Table 4 lists the default connections for the 24-V wall adapter connection. Refer to Table 5 for external
power connections.
Electrostatic Discharge (ESD) Caution
Many of the components on the AMC7812EVM are susceptible to damage by ESD. Observe proper ESD
handling precautions when unpacking and handling the EVM, including the use of a grounded wrist strap
at an approved ESD workstation.
4.2
Connecting the Hardware
To connect the SDM-USB-DIG to the EVM board, align and firmly connect the female and male ends of
the 20-pin connectors (see Figure 6). Verify the connection is snug, as loose connections may cause
intermittent operation.
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Figure 6. Typical Hardware Connections on the AMC7812EVM
4.3
Connecting the USB Cable to the SDM-USB-DIG
Figure 7 shows the typical response when connecting the SDM-USB-DIG platform to a USB port of a PC
for the first time. The PC usually responds with a Found New Hardware, USB Device popup dialog
window. The popup window then changes to Found New Hardware, Virtual COM Port (CDC). This popup
indicates that the device is ready for use. The CDC driver is used for communication between the SDMUSB-DIG and PC.
Figure 7. Confirmation of SDM-USB-DIG Platform Driver Installation
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4.4
AMC7812EVM Power Configurations
This section describes the various power configurations that can be used by the EVM.
The AMC7812EVM provides onboard power conditioning to convert the 24-V supply into a 14-V, 5-V, and
3.3-V supply. Jumpers JP3 and JP5 allow the AVDD and IOVDD inputs to be configured to use these
onboard supplies, or external supplies through the J6 terminal block. The AVCC input is configured to use
the onboard regulated supplies, but can be connected externally by populating the shunt resistors as
shown in Table 5.
Table 5. AMC7812EVM Jumper and Shunt Resistor Settings
Jumper
Default Position
Function
JP3
Shunt on 1-2
Selecting AVDD/DVDD voltage
• 1~2: Onboard 5-V supply
• 2~3: External supply
JP4
Shunt on 1-2
Selecting AVCC voltage
• 1~2: (Onboard 14-V supply)
• 2~3: (External supply)
JP5
Shunt on 1-2
Selecting IOVDD voltage
• 1~2: (Onboard VDUT)
• 2~3: External supply
R62, R63
R62 - 0-Ω shunt
R63 - Not populated
• (R62) +5-V LDO supply (default)
• (R63) +3.3-V LDO supply
R65, R66, R67
R65 - 0-Ω shunt
R66 - Not populated
R67 - Not populated
• (R65) +14-V LDO supply (default)
• (R66) +5-V LDO supply
• (R67) +3.3-V LDO supply
R69, R70, R71
R69 - 0-Ω shunt
R70 - Not populated
R71 - Not populated
• (R69) SDM-USB-DIG supply (default)
• (R70) +5-V LDO supply
• (R71) +3.3-V LDO supply
Additionally, IOVDD is supplied by the SDM-USB-DIG but can be externally sourced by setting the JP5
jumper, and connecting the external source to the J6 terminal block.
4.5
ADC Signal Pins
The AMC7812 device contains 16 analog inputs, 12 of which are single-ended (ADC4 through ADC15)
and have an input range of 0 to 5 V. The other four inputs (ADC0 through ADC3) can be configured as
four single-ended inputs for two fully differential channels, depending on the setup of the ADC channel
registers. These signal pins are connected to the J2, J3, and J7 connectors, which are described in
Table 6.
Table 6. AMC7812EVM ADC Signal Connections
Name
Connector
Description
ADC0
J7-1
ADC channel 0 input
ADC1
J7-3
ADC channel 1 input
(1)
J7-5
ADC channel 2 input
ADC3 (1)
J7-7
ADC channel 3 input
ADC4
J2-4
ADC channel 4 input
ADC5
J2-6
ADC channel 5 input
ADC6
J2-8
ADC channel 6 input
ADC2
(1)
The AMC7812EVM includes two OPA2320 devices, which are
configured to buffer the ADC2/ADC3 inputs. By default, the two inputs
are connected to ground; this is accomplished by using the J7 shunts.
Table 4 shows the default configuration for the shunts. To use the
channels, remove the shunts and apply the desired voltage input to
ADC2 or ADC3.
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Table 6. AMC7812EVM ADC Signal
Connections (continued)
4.6
Name
Connector
Description
ADC7
J2-10
ADC channel 7 input
ADC8
J2-12
ADC channel 8 input
ADC9
J2-14
ADC channel 9 input
ADC10
J3-4
ADC channel 10 input
ADC11
J3-6
ADC channel 11 input
ADC12
J3-8
ADC channel 12 input
ADC13
J3-10
ADC channel 13 input
ADC14
J3-12
ADC channel 14 input
ADC15
J3-14
ADC channel 15 input
DAC Signal Pins
The 12 DAC voltage outputs of the AMC7812 device are accessible through the J2 and J3 connectors, as
shown in Table 4. The DAC voltage ranges are configurable through software to either 5 or 12.5 V.
Table 7. AMC7812EVM DAC Signal Connections
4.7
Name
Connector
Description
DACC0
J2-3
DAC-C0 output
DACC1
J2-5
DAC-C1 output
DACD2
J2-7
DAC-D2 output
DACD3
J2-9
DAC-D3 output
DACD4
J2-11
DAC-D4 output
DACD5
J2-13
DAC-D5 output
DACB6
J3-3
DAC-B6 output
DACB7
J3-5
DAC-B7 output
DACA8
J3-7
DAC-A8 output
DACA9
J3-9
DAC-A9 output
DACA10
J3-11
DAC-A10 output
DACA11
J3-13
DAC-A11 output
GPIO Signal Pins
The four GPIO signals on the EVM can be measured on the J4 header. Table 8 provides a signal
description of the J4 header.
Table 8. AMC7812EVM GPIO Signal Definition (1)
(1)
12
Name
Connector
Description
GPIO0
J4-4
General-purpose I/O (GPIO0)
GPIO1
J4-3
General-purpose I/O (GPIO1)
GPIO2
J4-2
General-purpose I/O (GPIO2)
GPIO3
J4-1
General-purpose I/O (GPIO3)
The remote sensor channels, D1+/D1– and D2+/D2–, can be configured as GPIO, if remote
temperature sensors are not needed. Use a shunt to connect JP6 to remove the connection to the
onboard remote temperature sensors.
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5
AMC7812EVM Software Overview
This section discusses how to use the AMC7812EVM software.
5.1
Starting the AMC7812EVM Software
After the hardware connections are established and jumper settings configured, launch the software
located in the AMC7812EVM folder of the Start All Programs menu, and select the AMC7812EVM icon.
Figure 8. AMC7812EVM GUI Location
If the SDM-USB-DIG is properly connected to the AMC7812EVM, the GUI should automatically power on
the system and display CONNECTED: Power On in the upper right area of the GUI (see Figure 9).
Figure 9. AMC7812EVM GUI – Power On
If the SDM-USB-DIG has a faulty connection, or is not connected at all, the GUI launches in simulation
mode. In simulation mode, NOT CONNECTED: Simulating is displayed in the top-right area of the GUI. If
this text appears while the SDM-USB-DIG device is connected, then unplug the SDM-USB-DIG and close
the GUI. Reconnect the SDM-USB-DIG, and ensure that the connectors are correctly aligned. After doing
those steps, verify the USB extender cable is properly connected to both the SDM-USB-DIG and PC, and
relaunch the GUI. This connection issue can also occur if the CDC driver is installed incorrectly. The
AMC7812EVM software may need to be reinstalled.
5.2
AMC7812EVM Software Features
The following subsections describe the functionality of each page of the AMC7812EVM GUI.
5.2.1
Software Reset
The AMC7812 Software Reset button, shown in Figure 10, resets the AMC7812 device and resets all
registers to their default settings.
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Figure 10. Software Reset Button
5.2.2
AMC7812EVM Low-Level Configuration Page
The AMC7812EVM features a register map page that allows access to low-level communication by
directly writing to and reading from the AMC7812 registers. Selecting a register on the Register Map list
presents a description of the values in that register and also displays information such as the register’s
address, default value, size, and current value. The register values can be modified through the Hex Write
Register field, or set through Boolean checkboxes in the Register Data column, as displayed in Figure 11.
Figure 11. Low-Level Configuration Page
This low-level configuration page also provides the option to save the register map settings as a
configuration file, which is done by pressing the Save Config button. Additionally, the configuration files
can be accessed through the Load Config button.
5.2.3
AMC7812EVM ADC Page
This page provides insight into the functionality of the AMC7812’s 16-channel 12-bit ADC. The ADC block
can be configured as 16 single-ended inputs (ADC0 to ADC15) or 2 differential inputs (ADC0 to ADC3)
plus 12 single-ended (ADC4 to ADC15). The analog input range for the device can be selected as 0 V to
Vref (2.5 V) or 0 V to 2 × Vref (5 V). Figure 12 displays the ADC Page.
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Figure 12. ADC Page
To completely activate the ADC block, the Enable Reference Block must be enabled, along with the
Enable Internal Reference Buffer and Power ADC Block. Figure 13 shows this sequence.
Figure 13. ADC Block Activation Sequence
After the device is configured, individual channels can be enabled by selecting their respective ADC MUX
button, as shown in Figure 14.
Figure 14. ADC Channel MUX
CH0 to CH3 can be selected by using the dropdown menu and choosing various options such as
differential mode, single-ended mode, and so forth, as shown in Figure 15.
Figure 15. ADC CH0 to CH3 Config
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The input range can be adjusted by clicking the button next to each ADC channel on the right-hand side of
the page. Conversions can be triggered by pressing the Start Conv button or can be automatically
triggered before every read by enabling the Auto-Trigger check box. The ADC data registers, displayed on
the right side of the GUI, are updated with the converted results when the Read ADC button is pressed.
NOTE: The AMC7812EVM includes two OPA2320 devices, which are configured to buffer the
ADC2/ADC3 inputs. By default, the two inputs are connected to ground, this is accomplished
by using the J7 shunts. The default configuration for the shunts are located in Table 4. To
use the channels, remove the shunts and apply the desired voltage input to ADC2 or ADC3.
Most of the controls listed within the ADC image are used to setup the ADC configuration register. These
include the conversion rate and conversion mode parameters, which are selectable through their
respective dropdown list. The selectable conversion rates are listed in Table 9.
Table 9. Conversion Rates
Conversion Rate
Throughput (ADC0–ADC11)
(Single-Channel Auto Mode)
00
500 kSPS
01
250 kSPS
10
125 kSPS
11
62.5 kSPS
The conversion mode can be either Auto or Direct mode. In Direct Mode, the analog inputs, specified in
the ADC channel registers, are converted sequentially one time. In Auto Mode, the analog inputs are
converted sequentially and repeatedly. After a conversion is completed, the ADC multiplexer returns to the
first channel and repeats the process.
The ADCs also have an option to use an External or Internal reference. Select this option by using a
dropdown menu, then choosing the External or Internal option. When the Internal option is chosen, the
ADC External Ref Value box is grayed out. But when an External reference option is selected, the ADC
External Ref Value box becomes active and the value of external reference voltage can be entered in the
box as shown in Figure 16.
Figure 16. ADC External Ref Value
The ADC Report window displays the decimal value for each activated ADC channel. If the Auto Read
button is pressed, the graph periodically updates with the new ADC value. To obtain new data, setup the
device for either Auto mode or Direct mode. If in Direct mode, verify that the Trigger ADCs before read?
button is enabled. To stop the periodic updates press the Auto Read button once again. Figure 17 shows
the ADC Report window. Additionally, the Clear ADC Data button clears the memory of the chart.
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Figure 17. ADC Report Window
5.2.4
AMC7812EVM DAC Page
The DAC page gives the user an interface to observe and control the different data registers, modes, and
configurations available for each individual DAC channel. The AMC7812 contains 12 DACs with 12 bits of
resolution. The DACs can be used with an Internal (default) or External reference. To fully activate the
DAC block, set the Enable Reference Block. To set the DAC channels individually, select their respective
checkbox in the Power DAC column (see Figure 18).
Figure 18. DAC Page
The DAC page also displays two input fields under the Program DAC column, shown in Figure 19.
Figure 19. Program DAC Registers
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Either one of these windows can be programmed with the desired DAC output voltage or hexadecimal
value. The default range upon startup is the 0 to 5 V (0 V to 2x Vref) range. The range can be changed to
0 to 12.5 V (5x Vref) by clicking the 2x Vref button, Figure 20. The range button now displays 5x Vref and
the program DAC value is also updated.
Figure 20. DAC Gain Button
The DAC page also has an option to use an External or Internal reference. Select this option by using a
dropdown menu, then choosing External or Internal option. When the Internal option is chosen, the DAC
External Ref Value box is grayed out. But when an External reference option is selected, the DAC
External Ref Value box becomes active and the value of the external reference voltage can be entered in
the box as shown in Figure 21.
Figure 21. DAC External Ref Value
To the right of the Program DAC field are additional options that allow the user to configure each DAC for
different events, as shown in Figure 22. Starting from left to right, the CLR EN0/ CLR EN1 checkbox
allows the user to put the corresponding DAC in a clear state when the DAC-CLR-0 or DAC-CLR-1 pin
goes low. The SW CLR checkbox forces the DAC into a clear state through software. Auto CLR forces the
DAC to clear based on the DAC Clear Triggers located in the bottom of the page, Figure 23. Last is the
SLDA checkbox, which can be enabled for synchronous load; the registers are updated by pressing the
Update DAC Latch button.
Figure 22. DAC Clear and Latch Settings
Figure 23. DAC Clear Triggers
5.2.5
AMC7812EVM ALARMS Page
The ALARMS page allows the user to access or observe the AM7812 registers and register bits related to
common programmable settings and alarms of the AMC7812. Figure 24 displays the ALARMS page of the
AMC7812EVM.
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Figure 24. ALARMS Page
The ALARMS page displays the name of each alarm, and provides information such as the AMC7812
Local Temperature, D1 Temperature, D2 Temperature status, and the Analog Input (CH0-CH3) Out of
Range alarms. Figure 25 shows these indicators.
Figure 25. Alarm LEDs
The false alarm protection setting for each alarm is also displayed; these settings allow the user to choose
how many consecutive triggers must occur before the alarm is activated. Additionally, the bottom left of
the GUI includes a checkbox function for enabling or disabling the alarm pin function and alarm latch
settings.
Pressing the Read Alarm Status button enables the capture of the current state of the AMC7812, and if an
alarm has occurred, it activates the corresponding LED, as seen in Figure 26.
Figure 26. Alarm LEDs Activated
To associate the ALARM pin with an alarm event, select the appropriate event. Figure 27 displays these
checkboxes.
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Figure 27. Alarm Control Registers
5.2.6
AMC7812EVM GPIO + Temp Page
The AMC7812EVM contains one internal local temperature sensor and two temperature measurement
ports, D1 and D2, that are used for sensing temperatures from external remote locations. Figure 28 shows
the GPIO + Temp page.
Figure 28. GPIO + Temp Page
The GPIO + Temp page allows the user to access or observe the AMC7812 registers related to the three
temperature monitoring functions. Pressing the READ TEMP button enables a temperature conversion
and updates the temperature value for all temperature functions in Celsius (°C) and hexadecimal.
Additionally, these functions can be modified by adjusting the corresponding Hysteresis and nFactor
values.
Figure 29. Temperature Read
The ALARMS page also ties into the functionality of the GPIO + Temp page, as this page determines the
low and high threshold for all temperature configurations. Figure 30 shows where to program the limits by
entering the desired Celsius values into the low or high limit fields.
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Figure 30. Threshold Limit Configuration
The AMC7812 implements a technology to automatically cancel out the effect of series resistance caused
by the length of wire attached to any external remote temperature sensor. The resistance cancellation can
be disabled or enabled when the RC bit is cleared or set.
The conversion rate of the temperature data can also be set by adjusting the Temp-Conversion Rate
dropdown, displayed in Figure 31.
Figure 31. Temperature Conversion Rate
The GPIO + Temp page also features four (GPIO0 through GPIO3) general-purpose I/Os of the AMC7812
device as shown in Figure 32.
Figure 32. GPIO Page
Use the GPIO Block section of the GPIO tab, as shown in Figure 33, to set the various GPIO functions.
The dropdown menu defaults to general-purpose I/O. To perform a write or read, set the W/R Function
pulldown to either Write or Read. The W/R value enables the user to input or observe the Boolean value
of the GPIO register. Press the Generate Write/Read button to write to or read from the GPIO pin.
Figure 33. GPIO Write/Read
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AMC7812EVM Documentation
This section contains the schematic diagrams and complete bill of materials for the AMC7812EVM. Documentation information for the SDM-USBDIG platform can be found in the SDM-USB-DIG Platform User’s Guide, SBOU136, available at the TI website at www.ti.com.
6.1
AMC7812EVM Board Schematic
Figure 34 through Figure 36 show the schematics for this EVM.
IOVDD
SDMini Dig Connector
SPI / I2C MUX
J1
DIG_GPIO2
DIG_GPIO3
DIG_GPIO4
DIG_GPIO5
DIG_GPIO6
2
4
6
8
10
12
14
16
18
20
1
3
5
7
9
11
13
15
17
19
R1
IOVDD
SCL
DIG_GPIO0
SDA
DIG_GPIO1
MOSI
U1
16
C1
VDUT
SCLK
4
SCLK/SCL
1A
1B1
0.1μF
1B2
C65
CS
MISO
7
MOSI/SDA
0.1μF
2A
2B1
GND
IOVDD
2B2
SDMini Dig connector
GND
9
CS/A0
R17
20.0k
3A
3B1
3B2
1
JP1
12
MISO/A1
4A
4B1
DIG_GPIO6
2
R2
20.0k
20.0k
VCC
4B2
1
2
IOVDD
SCL
3
SCLK
5
SDA
6
R3
0
MOSI
10
CS
AVDD/DVDD
14
13
C2
MISO
R5
NI
S
15
GND
8
R6
NI
0.1μF
C3
C4
0.1μF
0.1μF
3
OE
R4
0
11
GND
TS5N412PW
AVCC
GND
AGND
IOVDD
GND
IOVDD
GND
GND
C5
C6
C7
0.1μF
0.1μF
0.1μF
0
R13
0
R15
0
R19
0
AMC D2-
2
4
6
8
10
12
14
16
AMC D2+
R20
0
R22
0
R25
0
R21
0
R23
0
R26
C14
NI
NI
C15
C16
C17
C18
C19
C20
NI
NI
NI
NI
NI
NI
J3
1
3
5
7
9
11
13
15
C13
NI
AGND
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
26
25
24
20
19
18
51
52
53
59
60
61
0
R31
0
R33
0
R35
0
R37
0
R39
0
R41
0
R32
0
R34
0
R36
0
R38
0
R40
0
R43
0
57
58
7
DVDD
IOVDD
AVDD1
AVDD2
AVCC1
AVCC2
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CH8
CH9
CH10
CH11
CH12
CH13
CH14
CH15
C22
C23
C24
C25
C26
C27
C28
C29
C30
C31
TP6 TP7 TP8 TP9
0
SDI/SDA
SCLK/SCL
CS/A0
SDO/A1
A2
SPI/I2C
DAC0-OUT
DAC1-OUT
DAC2-OUT
DAC3-OUT
DAC4-OUT
DAC5-OUT
DAC6-OUT
DAC7-OUT
DAC8-OUT
DAC9-OUT
DAC10-OUT
DAC11-OUT
4
5
9
10
11
12
MOSI/SDA
SCLK/SCL
CS/A0
MISO/A1
DIG_GPIO6
R24
NI
GND
IOVDD
R27
R28
R29
R30
20.0k 20.0k 20.0k 20.0k
J4
REF-OUT
REF-DAC
R42
GPIO-0
GPIO-1
GPIO-2
GPIO-3
13
14
15
16
4
3
2
1
AMC GPIO0
AMC GPIO1
AMC GPIO2
AMC GPIO3
0
TP2
AGND
C32
DIG_GPIO3
DIG_GPIO4
DIG_GPIO2
DIG_GPIO5
DIG_GPIO1
DIG_GPIO0
R18
TP1
C21
17
63
62
1
2
3
IOVDD
DGND2
DGND
0
R16
C12
NI
R7
R8
20.0k
R9
20.0k
R10
20.0k
20.0k
64
6
R14
C11
NI
PAD
0
C10
NI
AGND3
AGND4
R12
C9
DAC-CLR-0
DAC-CLR-1
ALARM
RESET
DAV
CNVT
22
21
AMC D1+
AMC7812SRGC
R11
20.0k
ADC-REF-IN/CMP
ADC-GND
54
55
AMC D1-
2
4
6
8
10
12
14
16
8
56
23
31
32
D2-/GPIO-6
D2+/GPIO-7
D1-/GPIO-4
D1+/GPIO-5
AGND1
AGND2
ADCREF
C8
J2
GND
AGND
27
28
29
30
4.7μF
1
3
5
7
9
11
13
15
49
50
U2
AMC D2AMC D2+
AMC D1AMC D1+
ADC0
ADC1
ADC2
ADC3
GND
C64
NI
NI
NI
NI
NI
NI
NI
NI
NI
NI
NI
NI
0.01μF
DACREF SEL
JP2
AGND
AGND
DACREF
2.5V REF
1
3
5
2
4
6
Figure 34. AMC7812EVM Schematic (1 of 3)
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Onboard ADC Filter and Buffer
Onboard Temperature Diode Selection
NI
C55
NI
R72
0
R73
Note: If onboard buffers are not used,
jumpers should be installed
on J7-5,6 and J7-7,8.
ADC0
ADC1
0
1
C56
Jumper Table:
C54
MMBT3904
Q1
2
0
GND
U7
NI
14
AVDD/DVDD
J7
2
C58
R75
IOVDD
AGND
NI
13
0.1μF
8
1
3
5
7
9
11
4
ADCREF
DACREF
0.1μF
C57
NI
R74
2
4
6
8
10
12
- JP6 (DIODE SELECT): Remote temperature diode selection.
Installed shunt selects external temperature diodes connected to J2-1,2 and J3-1,2
Uninstalled shunt selects onboard temperature diodes Q1 and Q2
IOVDD
3
C53
AGND
AGND
2
3
A
ADC2
17.4
9
2700pF
AGND
6
10
JP6
DIODE SELECT
AGND
1
12
2
R79
0
1
C59
NO2
270pF
3
AMC D2AMC D2+
IN2
COM3
NO3
8
C61
IN3
COM4
AMC D1AMC D1+
270pF
NO4
IN4
11
7
GND
MMBT3906
Q2
1
3
6
5
COM2
GND
NI
AGND
NO1
IN1
TS12A44514PW
GND
R78
COM1
NI
2
C62
5
C60
4
U8A
OPA2320AIDGK
AGND
R76
20.0k
R77
1
V+
V-
V+
B
V+
V-
7
R80
ADC3
17.4
C63
U8B
OPA2320AIDGK
2700pF
AGND
Figure 35. AMC7812EVM Schematic (2 of 3)
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Supply Regulation
USEWALL WART T1094-P5P-ND19-30V
J5
+14V
1
3
2
C35
C33
22μF
4.7μF
C34
U3
4.7μF
R44
49.9k
R45
174k
26
PJ-102A
U4
VIN
R49
24.9k
GND
D1
MMSZ4689-V
5.1V
R50
13.7k
R51
C42
178k 31
NI
28
2
GND
R54
NI
29
GND
10
11
12
13
14
15
39
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
INH/UVLO
1
27
RT/CLK
SS/TR
STSEL
C36
R48
165k
47μF
C37
47μF
35
6
7
21
22
23
24
38
41
2
3
25
10μF
15
16
C39
R47
0
1μ F
R52
GND
VADJ
R53
R55
R56
R57
R58
R59
R60
R61
VDUT
PWRGD
1
4
5
30
32
33
34
37
9
8
16
17
18
19
20
40
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
GND_PT
GND_PT
PGND
PGND
PGND
PGND
PGND
PGND
PH
PH
PH
PH
PH
PH
PH
PH
DNC
DNC
DNC
13
IN
IN
EN
OUT
OUT
SENSE
1
20
C40
C41
3
47μF
10μF
+5V
R46
300
NI
GND
36
GND
GND
C38
GND
NI 4
NI 5
0 6
NI 8
NI 9
0 10
NI 11
NI 12
NR
6P4V2
6P4V1
3P2V
1P6V
0P8V
0P4V
0P2V
0P1V
NC
NC
NC
NC
GND
PAD
14
GND
C43
19
18
17
2
D2
5V
1μ F
GND
7
TPS7A4700RGW
GND
GND
GND
Power Selection
LMZ35003RKG
+5V
U5
+3.3V
4
IN
OUT
TAB
GND
+3.3V
2
0
R63
NI
1
3
C44
10μF
R62
+3.3V
1
LM1086CS-3.3
JP3
AVDD/DVDD
TP3
AVDD/DVDD
C45
10μF
R64
120
2
AVDD/DVDD
3
GND
GND
GND
C46
D3
3.3V
10μF
GND
GND
R65
0
R66
NI
1
+14V
+5V
JP4
AVCC
TP4
AVCC
2
NI
J6
AVCC
1
2
3
4
3
+3.3V
R67
Onboard VREF
C47
ED555/4DS
2
C48
C49
10μF
0.1μF
VOUT
TRIM/NR
NC
TEMP
DNC
DNC
GND
GND
2.5V REF
EXT POWER
GND
5
3
C50
4
1μF
R68
0.47
C51
VDUT
R69
0
R70
NI
R71
NI
1
GND
VIN
6
10μF
REF5025IDGK
GND
+5V
JP5
IOVDD
TP5
IOVDD
2
GND
+3.3V
IOVDD
3
- JP4 (AVCC): Onboard / external AVCC supply select.
1-2 selects onboard supply (default +14V)
2-3 selects external supply (pin J6-2)
7
8
1
Jumper Table:
- JP3 (AVDD/DVDD): Onboard / external AVDD/DVDD supply select.
1-2 selects onboard supply (default +5V)
2-3 selects external supply (pin J6-1)
10μF
U6
AVDD/DVDD
- JP5 (IOVDD): Onboard / external IOVDD supply select.
1-2 selects onboard supply (default VDUT)
2-3 selects external supply (pin J6-3)
C52
10μF
GND
Figure 36. AMC7812EVM Schematic (3 of 3)
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6.2
AMC7812EVM PCB Components Layout
Figure 37 shows the layout of the components for the AMC7812EVM board.
Figure 37. AMC7812EVM PCB Components Layout
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6.3
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AMC7812 Test Board Bill of Materials
Table 10 lists the BOM for this EVM.
Table 10. Bill of Materials
Item Qty
Description
Manufacturer
Part Number
Printed Circuit Board
Any
6517852
C1, C2, C3, C4, C5, C6, C7, C49, C54,
C58, C65
CAP, CERM, 0.1uF, 25V, +/-5%, X7R, 0603
AVX
06033C104JAT2A
1
C8
CAP, CERM, 4.7uF, 10V, +/-10%, X5R, 0603
TDK
CGB3B1X5R1A475K055AC
0
C9, C10, C11, C12, C13, C14, C15, C16,
C17, C18, C19, C20, C21, C22, C23, C24,
C25, C26, C27, C28, C29, C30, C31, C32,
C42, C53, C55, C56, C57, C62
NI
5
2
C33, C34
CAP, CERM, 4.7uF, 50V, +/-10%, X7R, 1210
MuRata
GRM32ER71H475KA88L
6
1
C35
CAP, AL, 22uF, 35V, +/-20%, 1 ohm, SMD
Panasonic
EEE-FC1V220P
7
3
C36, C37, C40
CAP, CERM, 47uF, 25V, +/-20%, X5R, 1206
TDK
C3216X5R1E476M160AC
8
5
C38, C41, C46, C47, C52
CAP, CERM, 10uF, 25V, +/-10%, X7R, 1206
MuRata
GRM31CR71E106KA12L
9
2
C39, C43
CAP, CERM, 1uF, 25V, +/-10%, X5R, 0805
TDK
C2012X5R1E105K
10
1
C44
CAP, CERM, 10uF, 50V, +/-10%, X7R, 1210
MuRata
GRM32ER71H106KA12L
11
1
C45
CAP, TA, 10uF, 10V, +/-10%, 0.9 ohm, SMD
AVX
TPSA106K010R0900
12
2
C48, C51
CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603
TDK
C1608X5R0J106M
13
1
C50
CAP, CERM, 1uF, 16V, +/-10%, X5R, 0603
TDK
C1608X5R1C105K
14
2
C59, C61
CAP, CERM, 270pF, 50V, +/-5%, C0G/NP0, 0603
TDK
C1608C0G1H271J
15
2
C60, C63
CAP, CERM, 2700pF, 25V, +/-10%, X7R, 0603
MuRata
GRM188R71E272KA01D
16
1
C64
CAP, CERM, 0.01uF, 50V, +/-10%, X7R, 0603
TDK
C1608X7R1H103K
17
1
D1
Diode, Zener, 5.1V, 500mW, SOD-123
Vishay-Semiconductor
MMSZ4689-V
18
2
D2, D3
LED, Green, SMD
Lumex
SML-LX0603GW-TR
19
1
J1
Receptacle, 50mil 10x2, R/A, TH
Mill-Max
853-43-020-20-001000
20
2
J2, J3
Header, TH, 100mil, 2x8, Gold plated, 230 mil above insulator
Sullins Connector Solutions
PBC08DAAN
21
1
J4
Header, TH, 100mil, 4x1, Gold plated, 230 mil above insulator
Samtec
TSW-104-07-G-S
22
1
J5
Connector, DC Jack 2.1X5.5 mm, TH
CUI Inc.
PJ-102A
23
1
J6
Terminal Block, 6A, 3.5mm Pitch, 4-Pos, TH
On-Shore Technology
ED555/4DS
24
1
J7
Header, TH, 100mil, 6x2, Gold plated, 230 mil above insulator
Samtec
TSW-106-07-G-D
25
4
JP1, JP3, JP4, JP5
Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-103-07-G-S
26
1
JP2
Header, TH, 100mil, 3x2, Gold plated, 230 mil above insulator
Samtec
TSW-103-07-G-D
27
1
JP6
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec
TSW-102-07-G-S
28
1
Q1
Transistor, NPN, 40V, 0.2A, SOT-23
Fairchild Semiconductor
MMBT3904
29
1
Q2
Transistor, PNP, 40V, 0.2A, SOT-23
Fairchild Semiconductor
MMBT3906
30
13
R1, R2, R7, R8, R9, R10, R11, R17, R27,
R28, R29, R30, R76
RES, 20.0k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-0720KL
1
1
2
11
3
4
26
Designator
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Table 10. Bill of Materials (continued)
Item Qty
Designator
Description
Manufacturer
Part Number
31
38
R3, R4, R12, R13, R14, R15, R16, R18,
R19, R20, R21, R22, R23, R25, R26, R31,
R32, R33, R34, R35, R36, R37, R38, R39,
R40, R41, R42, R43, R47, R56, R59, R62,
R65, R69, R72, R73, R74, R79
RES, 0 ohm, 5%, 0.1W, 0603
Yageo America
RC0603JR-070RL
32
0
R5, R6, R24, R52, R53, R54, R55, R57,
R58, R60, R61, R63, R66, R67, R70, R71,
R75, R78
NI
33
1
R44
RES, 49.9k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-0749K9L
34
1
R45
RES, 174k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07174KL
35
1
R46
RES, 300 ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07300RL
36
1
R48
RES, 165k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07165KL
37
1
R49
RES, 24.9k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-0724K9L
38
1
R50
RES, 13.7k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-0713K7L
39
1
R51
RES, 178k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07178KL
40
1
R64
RES, 120 ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07120RL
41
1
R68
RES, 0.47 ohm, 1%, 0.1W, 0603
Panasonic
ERJ-3RQFR47V
42
2
R77, R80
RES, 17.4 ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-0717R4L
43
2
TP1, TP2
Test Point, Miniature, Black, TH
Keystone
5001
44
7
TP3, TP4, TP5, TP6, TP7, TP8, TP9
Test Point, Miniature, Red, TH
Keystone
5000
45
1
U1
4-BIT 1-OF-2 FET MULTIPLEXER / DEMULTIPLEXER HIGH BANDWIDTH BUS
SWITCH, PW0016A
Texas Instruments
TS5N412PW
46
1
U2
12-Bit ANALOG MONITORING AND CONTROL SOLUTION with Multichannel ADC,
DACs, and Temperature Sensors, RGC0064A
Texas Instruments
AMC7812SRGC
47
1
U3
7-V to 50-V Input, 2.5-A Step-Down, Integrated Power Solution
Texas Instruments
LMZ35003RKG
48
1
U4
36-V, 1-A, 4.17-µVRMS, RF LDO Voltage Regulator, RGW0020A
Texas Instruments
TPS7A4700RGW
49
1
U5
1.5A Low Dropout Positive Regulators, 3-pin TO-263
National Semiconductor
LM1086CS-3.3/NOPB
50
1
U6
Low-Noise, Very Low Drift, Precision VOLTAGE REFERENCE, DGK0008A
Texas Instruments
REF5025IDGK
51
1
U7
LOW ON-STATE RESISTANCE QUAD SPST CMOS ANALOG SWITCHES, PW0014A
Texas Instruments
TS12A44514PW
52
1
U8
Precision, 20MHz, 0.9pA, Low-Noise, RRIO, CMOS Operational Amplifier with Shutdown,
DGK0008A
Texas Instruments
OPA2320AIDGK
53
4
Bumpon, Hemisphere, 0.44 X 0.20, Clear
3M
SJ-5303 (CLEAR)
54
5
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
SBAU177E – September 2010 – Revised May 2016
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AMC7812EVM-PDK User’s Guide
Copyright © 2010–2016, Texas Instruments Incorporated
27
Revision E History
www.ti.com
Revision E History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from D Revision (August 2014) to E Revision ................................................................................................ Page
•
•
•
•
•
Deleted row "+24-V wall supply" from Table 1, and added Note 1. ................................................................
Changed text "An optional +24V wall supply..." in Section 2 ........................................................................
Changed Figure 1 .........................................................................................................................
Changed "Default" and "Optional" blocks in Figure 2 ................................................................................
Added Note 1 to Table 4 .................................................................................................................
3
4
4
4
9
Revision D History
Changes from C Revision (June 2014) to D Revision .................................................................................................... Page
•
•
Updated JP1 jumper function description in Default Jumper Settings table ....................................................... 9
Removed jumper table .................................................................................................................. 22
Revision C History
Changes from B Revision (June 2014) to C Revision .................................................................................................... Page
•
Changed title of document to AMC7812EVM-PDK User’s Guide. .................................................................. 1
Revision B History
Changes from A Revision (May 2013) to B Revision ...................................................................................................... Page
•
28
Changed entire document: format and content. This user guide is now patterned after the AMC7832EVM user's guide. . 1
Revision History
SBAU177E – September 2010 – Revised May 2016
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Copyright © 2010–2016, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
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supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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Applications
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