User's Guide
SLAU608B – December 2014 – Revised May 2016
AMC7834 Evaluation Module
This user's guide describes the characteristics, operation, and use of the AMC7834 evaluation boards
(EVMs). This user’s guide also discusses the proper setup and configuration of software and hardware,
and reviews various aspects of program operation. A complete circuit description, schematic diagram, and
bill of materials (BOM) are also included.
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2
3
4
5
6
Contents
Overview ...................................................................................................................... 3
1.1
AMC7834EVM Kit Contents ....................................................................................... 3
1.2
Related Documentation from TI ................................................................................... 3
AMC7834EVM Hardware Setup ........................................................................................... 4
2.1
Theory of Operation for AMC7834 Hardware ................................................................... 4
2.2
Signal Definitions of J4 (20-Pin Male Connector Socket) ..................................................... 5
2.3
Theory of Operation for SDM-USB-DIG Platform .............................................................. 6
AMC7834EVM Software Setup ............................................................................................ 7
3.1
Operating Systems for AMC7834EVM Software ............................................................... 7
3.2
AMC7834EVM Software Installation ............................................................................. 7
AMC7834EVM Hardware Overview ....................................................................................... 8
4.1
Electrostatic Discharge Warning .................................................................................. 8
4.2
Connecting the Hardware.......................................................................................... 9
4.3
Connecting the USB Cable to the SDM-USB-DIG ............................................................. 9
4.4
AMC7834EVM Power Configurations ............................................................................ 9
4.5
ADC/SENSE Signal Pins ......................................................................................... 10
4.6
Reference Configuration Options ............................................................................... 10
4.7
DAC Signal Pins ................................................................................................... 11
4.8
PA ON Signal ...................................................................................................... 11
4.9
External Remote Temperature .................................................................................. 11
4.10 Digital Inputs and GPIO Signal Pins ............................................................................ 12
4.11 SPI Communication Signals ..................................................................................... 12
AMC7834EVM Software Overview ...................................................................................... 13
5.1
Starting the AMC7834EVM Software ........................................................................... 13
5.2
AMC7834EVM Software Features .............................................................................. 13
AMC7834EVM Documentation ........................................................................................... 23
6.1
AMC7834EVM Board Schematic................................................................................ 23
6.2
AMC7834EVM PCB Components Layout...................................................................... 25
6.3
AMC7834 Test Board Bill of Materials ......................................................................... 26
List of Figures
1
AMC7834EVM Hardware Setup ........................................................................................... 4
2
AMC7834 Test Board Block Diagram ..................................................................................... 4
3
SDM-USB-DIG Platform Block Diagram .................................................................................. 6
4
AMC7834EVM Installer Directory.......................................................................................... 7
5
AMC7834EVM Install Path ................................................................................................. 7
6
Typical Hardware Connections on the AMC7834EVM
7
8
................................................................. 9
Confirmation of SDM-USB-DIG Platform Driver Installation ........................................................... 9
AMC7834EVM GUI Location ............................................................................................. 13
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9
AMC7834EVM GUI – Power On ......................................................................................... 13
10
Software Reset Button ..................................................................................................... 13
11
Low Level Configuration Page ............................................................................................ 14
12
ADC Page ................................................................................................................... 15
13
Powerdown Mode Reference Selection ................................................................................. 15
14
........................................................................................................
ADC Channel MUX ........................................................................................................
ADC Controls Block ........................................................................................................
ADC Chart ...................................................................................................................
DAC Page ...................................................................................................................
Program DAC Registers ...................................................................................................
Program DAC Registers ...................................................................................................
DAC Read ...................................................................................................................
PA ON Button ...............................................................................................................
ALARMS Page..............................................................................................................
Low Level Configuration Page ............................................................................................
CH-FALR-CT Menu ........................................................................................................
Alarmout .....................................................................................................................
Alarmout .....................................................................................................................
GPIO Page ..................................................................................................................
GPIO Write/Read ...........................................................................................................
AMC7834EVM Schematic (1 of 2) .......................................................................................
AMC7834EVM Schematic (2 of 2) .......................................................................................
AMC7834EVM PCB Components Layout...............................................................................
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25
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30
31
32
ADC Channel MUX
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24
25
List of Tables
1
Contents of AMC7834EVM Kit ............................................................................................. 3
2
Related Documentation ..................................................................................................... 3
3
J4 Signal Definition .......................................................................................................... 5
4
Default Jumper Settings
5
AMC7834EVM Power Shunt Jumper Settings ......................................................................... 10
6
AMC7834EVM ADC/SENSE Signal Connections
7
Reference Configuration Settings ........................................................................................ 10
8
Optional 2.5-V Reference Generated From Wall Adapter ............................................................ 11
9
AMC7834EVM DAC Signal Connections ............................................................................... 11
10
AMC7834EVM PA ON
11
12
13
14
15
2
....................................................................................................
.....................................................................
....................................................................................................
External Remote Temperature Inputs ...................................................................................
AMC7834EVM GPIO Signal Definition ..................................................................................
SPI Signal Definition .......................................................................................................
ADC Block Reference Selection..........................................................................................
AMC7834EVM Bill of Materials ...........................................................................................
AMC7834 Evaluation Module
8
10
11
11
12
12
15
26
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Overview
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1
Overview
This EVM features the AMC7834 device, a highly integrated, low-power, analog monitoring and control
solution for power amplifier biasing capable of current, temperature, and voltage supervision. The
AMC7834 integrates a multi-channel (12-bit) ADC, 8 (12-bit) DACs, and four high-side current sense
amplifiers supporting common mode voltages from +4-V up to +60-V into a single device. The DACs
include a flexible output range that allows the device to be fully compatible with a large array of biasing
technologies, such as LDMOS, GaAs, and GaN. The device also features 4 GPIO, out-of-range alarms,
an internal reference, and a low-power, SPI compatible interface.
1.1
AMC7834EVM Kit Contents
Table 1 details the contents of the EVM kit. Contact the TI Product Information Center nearest you if any
component is missing. TI highly recommends verifying you have the latest versions of the related software
at the TI website, www.ti.com.
Table 1. Contents of AMC7834EVM Kit (1)
(1)
1.2
Item
Quantity
AMC7834EVM PCB Evaluation Board
1
SDM-USB-DIG Platform PCB
1
USB Extender Cable
1
The 24-V wall adapter is not included with the evaluation module (EVM). Optionally, a 24-V (750-mA)
center-positive wall adapter can be separately purchased to interface to the onboard 2.1 x 5.5-mm DC
jack. In the case that a wall adapter is not available, external terminal blocks are included, which can
interface with external supplies.
Related Documentation from TI
The following document provides information regarding Texas Instruments integrated circuits used in the
assembly of the AMC7834EVM. This user's guide is available from the TI web site under literature number
SLAU608. Any letter appended to the literature number corresponds to the document revision that is
current at the time of the writing of this document. Newer revisions may be available from the TI web site
at http://www.ti.com/, or call the Texas Instruments Literature Response Center at (800) 477-8924 or the
Product Information Center at (972) 644-5580. When ordering, identify the document by both title and
literature number
Table 2. Related Documentation
Document
Literature Number
AMC7834 Product Data Sheet
SLAS972
SDM-USB-DIG Platform User’s Guide
SBOU136
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AMC7834EVM Hardware Setup
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AMC7834EVM Hardware Setup
This section provides the overall system setup for the EVM. A personal computer (PC) runs software that
communicates with the SDM-USB-DIG platform, which generates the power and digital signals used to
communicate with the EVM board. An optional +24-V wall supply can provide power through the J7
connector to provide power to on-board power regulators (LDOs) that regulate the analog and digital
supplies. By default, on-board connectors are included on the EVM board for external supplies. Figure 1
displays the system setup for the AMC7834EVM.
Personal
Computer
(PC)
External Power
or
Optional 24-V Wall Adapter
USB Bus
From
Computer
J7 Connection or
Terminal Blocks
20-Pin
Connector
SDM-USB-DIG
AMC7834EVM
Figure 1. AMC7834EVM Hardware Setup
2.1
Theory of Operation for AMC7834 Hardware
A block diagram of the AMC7834EVM test board is displayed in Figure 2. The EVM board provides test
points and connections for the supplies, internal reference, ground connections, SPI inputs, ADC inputs,
current sense inputs, external temp sensing diodes, and analog outputs of the DAC.
Default:
External Power
(Terminal Blocks)
Optional:
LDO-Regulated
Power
4-GPIO
Connection
Power
20-Pin
Conn. To
SDMUSB-DIG
SPI
AMC7834
4-CH Ext ADC
4 High-Side Current
Input (0í 2.5-V Range) Sense Channels
8 12-Bit
DACs
(4 Bipolar/ 4 Unipolar)
2 Remote Temp
Diode Drivers
Figure 2. AMC7834 Test Board Block Diagram
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2.2
Signal Definitions of J4 (20-Pin Male Connector Socket)
The AMC7834EVM includes a 20-pin connector socket used to communicate between the EVM and the
SDM-USB-DIG platform. The pin out of the J4 connector is shown in Table 3.
Table 3. J4 Signal Definition
Pin on J4
Signal
Description
1
SCL
I2C clock signal (SCL)
2
DIG_GPIO2
GPIO – control output or measure input
3
DIG_GPIO0
GPIO – control output or measure input
4
DIG_GPIO3
GPIO – control output or measure input
5
SDA
I2C data signal (SDA)
6
DIG_GPIO4
GPIO – control output or measure input
7
DIG_GPIO1
GPIO – Control Output or Measure Input
8
DIG_GPIO5
GPIO – control output or measure input
9
MOSI
SPI data output (MOSI)
10
DIG_GPIO6
GPIO – control output or measure input
11
VDUT
Switchable DUT power supply: +3.3 V, +5 V, Hi-Z
(disconnected). Note: When VDUT is Hi-Z all digital I/O are
Hi-Z as well.
12
DIG_GPIO7
GPIO – control output or measure input
13
SCLK
SPI clock signal (SCLK)
14
DIG_GPIO8
GPIO – control output or measure input
15
GND
Power return (GND)
16
DIG_GPIO9
GPIO – control output or measure input
17
CS
SPI chip select signal (CS)
18
DIG_GPIO10
GPIO – control output or measure input
19
MISO
SPI data input (MISO)
20
DIG_GPIO11
GPIO – control output or measure input
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Theory of Operation for SDM-USB-DIG Platform
The SDM-USB-DIG platform is a general-purpose data acquisition system that is used on select TI EVMs.
The core component of the platform is the MSP430F5528, an ultra-low power 16-bit MCU. The
microcontroller receives information from the host PC and translates it into I2C, SPI, or other digital I/O
patterns. The connected device (in this case, the AMC7834 device) connects to the I/O interface of the
platform. During digital I/O transactions, the platform obtains information from the AMC7834 device and
sends to the host PC for interpretation. A block diagram of the platform is shown in Figure 3.
3.3-V
Regulator
USB Bus
From
Computer
USB
+5.0 V
MSP430F5528
uC
Level
Translators
I2C
SPI
GPIO
To Test Board
SDM-USB-DIG
+3.3 V
Power on
Reset
USB +5.0 V
+3.3 V
Power
Switching
Vdut
(Hi-Z, 3.3 V or 5 V) Switched Power
Figure 3. SDM-USB-DIG Platform Block Diagram
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3
AMC7834EVM Software Setup
This section provides the procedure for EVM software installation.
3.1
Operating Systems for AMC7834EVM Software
The EVM software was tested on the Microsoft® Windows® XP and Windows 7 operating systems with the
United States and European regional settings. The software should also be compatible with other
Windows operating systems.
3.2
AMC7834EVM Software Installation
The software is available through the EVM product folder on the TI website. After the software is
downloaded on the PC, navigate to the AMC7834EVM_Installer folder, and run the setup.exe file, as
shown in Figure 4. When the software is launched, an installation dialog opens and prompts the user to
select an installation directory. If left unchanged, the software location defaults to C:\Program Files
(x86)\AMC7834EVM. The software installation automatically copies the required drivers for the SDM-USBDIG and AMC7834EVM to the PC. After the software is installed, connecting the SDM-USB-DIG to a USB
port may launch a driver installation dialog. Choose the ‘Install this driver software anyway’ option to
continue with installation. (Note: On Windows XP machines, choose to have the system automatically find
the driver or software.)
Figure 4. AMC7834EVM Installer Directory
Figure 5. AMC7834EVM Install Path
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AMC7834EVM Hardware Overview
The subsequent sections provide detailed information on the EVM hardware and jumper configuration
settings. To use the +24-V wall supply, set the AVDD and IOVDD jumper connections to the default
configuration listed in Table 4. The table also displays the default configurations of all jumper connections
on the AMC7834EVM. Connect the USB extender cable from the SDM-USB-DIG to the PC, and the +24V wall adapter to the J7 terminal.
Table 4. Default Jumper Settings (1)
Jumper
Default Position
Function
JP1
Shunt on 1-2
Q2 Remote Diode Configuration
• 1-2: Connects Q2 in diode configuration with base-collector connected
• Remove: Q2 in diode configuration with collector floating
JP3/JP5
Shunt on 2-3
Remote Diode Selection
• 1-2: Connects D1+ and D1– to terminal block J1
• 2-3: Connects D1+ and D1– to the onboard diode-connected transistor Q2
JP2/JP4
Shunt on 2-3
Remote Diode Selection
• 1-2: Connects D2+ and D2– to terminal block J1
• 2-3: Connects D2+ and D2– to the onboard diode-connected transistor Q1
JP6
Installed
Reference Selection
• Installed: REF_ADC/CMP connects to onboard +2.5-V supply
• Not Installed: External reference signal is applied to REF_ADC/CMP
JP7
Shunt on 1-2
PAVDD Connection (Power Supply for PA_ON Control Signal.)
• 1-2: PAVDD_EX: Connects to external supply
• 2-3: Connects to VDD supply
JP8
Shunt on 1-2
VCLAMP2 Connection
• 1-2: Connects to onboard voltage divider
• 2-3: Connects to GND
JP9
Shunt on 1-2
VCLAMP1 Connection
• 1-2: Connects to onboard voltage divider
• 2-3: Connects to GND
JP10
Shunt on 1-2
REF_IN Selection
• 1-2: Connects to onboard 2.5-V REF supply
• 2-3: Connects to REF_OUT pin
JP11
Shunt on 1-2
Selecting Internal or External AVDD/DVDD
• 1-2: Connects AVDD/DVDD pins to onboard +5-V
• 2-3: Connects AVDD/DVDD pins to external connector (J8)
JP12
Shunt on 1-2
Selecting Internal or External VCC
• 1-2: Connects VCC pins to onboard +5-V
• 2-3: Connects VCC pins to external connector (J9)
JP13
Shunt on 1-2
Selecting Internal or External AVSS
• 1-2: Connects AVSS pins to onboard –5-V
• 2-3: Connects AVSS pins to external connector (J10)
JP14
Shunt on 1-2
Selecting Internal or External IOVDD
• 1-2: Connects IOVDD pins to SDM-USB-DIG supplied +3.3 V
• 2-3: Connects IOVDD pins to external connector (J11)
(1)
4.1
Table 4 lists the default connections for the 24-V wall adapter connection. Refer to Table 5 and Table 7 for external power and
reference connections.
Electrostatic Discharge Warning
Many of the components on the AMC7834EVM are susceptible to damage by electrostatic discharge
(ESD). Customers are advised to observe proper ESD handling precautions when unpacking and handling
the EVM, including the use of a grounded wrist strap at an approved ESD workstation.
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4.2
Connecting the Hardware
To connect the SDM-USB-DIG to the EVM board, align and firmly connect the female and male ends of
the 20-pin connectors (see Figure 6). Verify the connection is snug, as loose connections may cause
intermittent operation.
Figure 6. Typical Hardware Connections on the AMC7834EVM
4.3
Connecting the USB Cable to the SDM-USB-DIG
Figure 7 shows the typical response when connecting the SDM-USB-DIG platform to a USB port of a PC
for the first time. The PC usually responds with a popup dialog window that states Found New Hardware,
USB Device. The popup window then changes to Found New Hardware, Virtual COM Port (CDC). This
popup indicates that the device is ready for use. The CDC driver is used for communication between the
SDM-USB-DIG and PC.
Figure 7. Confirmation of SDM-USB-DIG Platform Driver Installation
4.4
AMC7834EVM Power Configurations
This section describes the various power configurations that can be used by the EVM.
The AMC7834EVM provides terminal blocks for external supplies as well as (optional) onboard power
conditioning to convert a 24-V supply into a +5-V, –5-V, and +2.5-V supply. Jumpers JP11, JP12, JP13,
and JP14 allow the AVDD / DVDD, VCC, AVss, and IOVDD inputs to be configured to use these onboard
supplies, or external supplies through the terminal blocks. The reference can also be connected to the
onboard +2.5-V supply or the external REFIN or REF_ADC/CMP pins located on J3-17 and J3-18,
respectively
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Table 5. AMC7834EVM Power Shunt Jumper Settings
4.5
Jumper
Default Position
Function
JP11
Shunt on 1-2
Selecting Internal/External AVDD/DVDD
• 1-2: Connects AVDD/DVDD pins to onboard +5-V
• 2-3: Connects AVDD/DVDD pins to external connector (J8)
JP12
Shunt on 1-2
Selecting Internal/External VCC
• 1-2: Connects VCC pins to onboard +5-V
• 2-3: Connects VCC pins to external connector (J9)
JP13
Shunt on 1-2
Selecting Internal/External AVSS
• 1-2: Connects AVSS pins to onboard -5-V
• 2-3: Connects AVSS pins to external connector (J10)
JP14
Shunt on 1-2
Selecting Internal/External IOVDD
• 1-2: Connects IOVDD pins to onboard +3.3-V
• 2-3: Connects IOVDD pins to external connector (J11)
ADC/SENSE Signal Pins
The AMC7834 device contains a multi-channel 12-bit SAR ADC with four external ADC inputs, which
range from 0 to +2.5 V. The device also features four high-side current sense amplifiers that have
common-mode voltages of 4- to +60-V, and can be programmed for closed-loop (drain current) operation.
These signal pins connect to the J3 header, which is described in Table 6.
Table 6. AMC7834EVM ADC/SENSE Signal
Connections
4.6
Name
Connector
Description
ADC1
J3-15
ADC channel 1 input
ADC2
J3-13
ADC channel 2 input
ADC3
J3-11
ADC channel 3 input
ADC4
J3-9
ADC channel 4 input
SNS1+/–
J3-7,8
SENSE 1 input
SNS2+/–
J3-5,6
SENSE 2 input
SNS3+/–
J3-3,4
SENSE 3 input
SNS4+/–
J3-1,2
SENSE 4 input
Reference Configuration Options
As described in AMC7834EVM Power Configurations, the reference has multiple configuration schemes
that can connect to an internal or external +2.5 V, and can be configured to connect to the ADC or DAC
block. The different connection schemes are displayed in Table 7.
Table 7. Reference Configuration Settings
Setting Number
Reference Config
Jumper Position
Description
Setting 1
External ADC/ External DAC
Reference (two supplies)
JP6 not installed
(Verify that both ADC and DAC Reference
buffers are disabled.) Apply external
reference voltages to ADC/CMP and
REF_IN pins, J3–18 and J3–17 respectively.
Internal ADC/DAC Reference
JP6 not installed
Setting 2
JP10 is not installed
(Enable ADC and DAC Reference buffers
through software.) Use REF_OUT to supply
REF_IN pin (J3–17).
JP10 set to 2-3
Setting 3
10
External ADC/ External DAC
Reference (one supply)
AMC7834 Evaluation Module
JP6 not installed
(Enable ADC and DAC Reference buffers
through software.) Use external reference to
supply REF_IN pin (J3–17).
JP10 is not installed
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Table 8. Optional 2.5-V Reference Generated From Wall Adapter
4.7
Configuration
Jumper Position
Function
Description
On board 2.5-V reference
JP6 installed
Connect to 2.5-V onboard
reference
JP10 set to 1-2
Connect to 2.5-V onboard
reference
(Verify the ADC internal buffer is
off.) 2.5 V is supplied to both
CMP and REF_IN pins.
DAC Signal Pins
The eight 12-bit DACs of the AMC7834 device are accessible through the J5 connector, as shown in
Table 9. The DACs are separated into four bipolar DACs, and four unipolar DACs. The bipolar can be
programmed for any of the following ranges: –4- to +1-V, –5- to 0-V, and 0- to 5-V range. The unipolar
DACs range can be set from the following two ranges: 0 to 5 V, and 2.5 to 7.5 V.
Table 9. AMC7834EVM DAC Signal Connections
4.8
Name
Connector
Description
DAC1
J5–7
DAC1 bipolar DAC output
DAC2
J5–5
DAC2 bipolar DAC output
DAC3
J5–3
DAC3 bipolar DAC output
DAC4
J5–1
DAC4 bipolar DAC output
ADAC1
J5–15
ADAC1 unipolar DAC output
ADAC2
J5–13
ADAC2 unipolar DAC output
ADAC3
J5–11
ADAC3 unipolar DAC output
ADAC4
J5–9
ADAC4 unipolar DAC output
PA ON Signal
The PA ON signal provides the control voltage to drive an external PMOS switch capable of turning on/off
the drain current to a PA transistor. Maximum output voltage is set by PAVDD and limited to +20-V.
Table 10. AMC7834EVM PA ON
4.9
Name
Connector
Description
PA_ON
J3-10
PA ON signal
External Remote Temperature
The AMC7834 device includes two remote temperature sensor diode drivers. These pins can be
connected to the onboard diode-connected transistors, or connected externally through the J1 and J2
terminal blocks. This information is presented in Table 11.
Table 11. External Remote Temperature Inputs
Name
Connector
Description
D1+/D1–
J1-1,2
External connection for D1+/D1– pins
D2+/D2–
J2-1,2
External connection for D2+/D2– pins
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4.10 Digital Inputs and GPIO Signal Pins
The four GPIO signals on the EVM can be measured on the J6 header. The J6 header also includes most
of the digital inputs to the AMC7834 device — these inputs include Sleep1, Sleep2, ALARMOUT, RESET,
DACTRIG, and DIGTEST. A signal description of the J6 header is provided in Table 12.
Table 12. AMC7834EVM GPIO Signal Definition
Name
Connector
Description
GPIO1
J6-13
General Purpose I/O (GPIO1)
GPIO2
J6-15
General Purpose I/O (GPIO2)
GPIO3
J6-17
General Purpose I/O (GPIO3)
GPIO4
J6-19
General Purpose I/O (GPIO4)
Sleep1
J6-8
Power down digital input
Sleep2
J6-7
Power down digital input
ALARMOUT
J6-9
Global alarm open drain output
RESET
J6-6
Reset input
DACTRIG
J6-5
DAC trigger control input
DIGTEST
J6-11
DAV/ADC_RDY data available indicator
4.11 SPI Communication Signals
The SPI signals are located on the J6 header and are described in Table 13.
Table 13. SPI Signal Definition
12
Name
Connector
Description
SCLK
J6-4
Serial Interface Clock
SDI
J6-2
Serial interface data input
SDO
J6-1
Serial interface data output
/CS
J6-3
Active low serial data enable
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5
AMC7834EVM Software Overview
This section discusses how to use the AMC7834EVM software.
5.1
Starting the AMC7834EVM Software
After the hardware connections are established and jumper settings configured, launch the software
located in the AMC7834EVM folder of the Start All Programs menu, and select the AMC7834EVM icon.
Figure 8. AMC7834EVM GUI Location
If the SDM-USB-DIG is properly connected to the AMC7834EVM, the GUI should automatically power on
the system and display CONNECTED: Power On in the upper right area of the GUI (see Figure 9).
Figure 9. AMC7834EVM GUI – Power On
If the SDM-USB-DIG has a faulty connection, or is not connected at all, the GUI launches in simulation
mode. In simulation mode, NOT CONNECTED: Simulating is displayed in the top right area of the GUI. If
this text appears while the SDM-USB-DIG device is connected, then unplug the SDM-USB-DIG and close
the GUI. Reconnect the SDM-USB-DIG, and ensure that the connectors are correctly aligned. After doing
those steps, verify the USB extender cable is properly connected to both the SDM-USB-DIG and PC, and
relaunch the GUI. This issue can also occur if the CDC driver is installed incorrectly. The AMC7834EVM
software may need to be reinstalled.
5.2
AMC7834EVM Software Features
The following subsections describe the functionality of each page of the AMC7834EVM GUI.
5.2.1
Software Reset
The AMC7834 Software Reset button, shown in Figure 10, resets the AMC7834 device and resets all
registers to their default setting.
Figure 10. Software Reset Button
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AMC7834EVM Low Level Configuration Page
The AMC7834EVM features a register map page that allows access to low-level communication by
directly writing to and reading from the AMC7834 device’s registers. Selecting a register on the Register
Map list presents a description of the values in that register and also displays information such as the
register’s address, default value, size, and current value. The register values can be modified through the
Hex Write Register field, or set through Boolean checkboxes in the Register Data column, as displayed in
Figure 11.
Figure 11. Low Level Configuration Page
This low-level configuration page also provides the option to save the register map settings as a
configuration file, which is done by pressing the Save Config button. Additionally, the configuration files
can be accessed through the Load Config button.
5.2.3
AMC7834EVM ADC Page
This page provides insight into the functionality of the AMC7834 device’s 12-bit ADC. The ADC page
includes the ability to monitor the four external analog inputs, as well as the four internal inputs for bipolar
DAC monitoring, four high-side current sense inputs, the local temperature, and two remote temperature
sensing devices. The analog inputs are controlled through the Enable MUX button, with the data visible on
the right hand side of the page located in their respective indicator boxes (see Figure 12).
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Figure 12. ADC Page
To completely activate the ADC block, the Powerdown Mode option must be set for reference
configuration. The Powerdown Mode option changes the POWER-MODE bits of the Device Configuration
Register, 0x02. The Powerdown Mode allows the user to configure the ADC block to use the internal
reference of the device or an external reference. The reference selection should adhere to the Reference
Configuration Options, listed in Table 7. The EVM is currently configured to use the onboard +2.5-V
reference. Figure 13 displays the options for internal or external reference operation. These options can
be selected in the Powerdown Mode drop-down menu illustrated in Table 14. For default EVM operation,
select Power Mode “11” to use the onboard +2.5-V supply.
Table 14. ADC Block Reference Selection
Power Mode
0X
ADC Ref Buffer Description
OFF
ADC block powered off
10
ON
Configured for internal reference
11
OFF
Configured for external reference
Figure 13. Powerdown Mode Reference Selection
Once the POWER-MODE is configured, individual channels can be enabled by selecting their respective
ADC MUX button, as shown in Figure 14. Selecting a channel enables the button’s respective indicator
field for register readout. To view the contents of the read in volts, select Display ADC Value in Volts.
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Figure 14. ADC Channel MUX
The Conversion Mode is selectable in the ADC Controls ADC Block Diagram.
If choosing Direct Mode, a Start Conv is required to update every new read. In Direct Mode, the analog
inputs enabled in the ADC MUX register are converted sequentially one time. When one set of
conversions is complete, the ADC is idle and waits for a new trigger. Conversions are triggered by
pressing the Start Conv button or can automatically be triggered by enabling the Auto-convert? check box.
The ADC data registers, displayed on the right side of the GUI, are updated with the converted results
when the Read button is pressed. These controls are illustrated in Figure 15.
Figure 15. ADC Channel MUX
If choosing Auto Mode, the Start Conv button must be pressed to start the auto conversion process. The
analog inputs that are enabled in the ADC MUX register are converted sequentially and repeatedly. When
one set of conversions is complete, the ADC multiplexer returns to the first channel and repeats the
process. Stop the auto conversion process by pressing Start Conv button again.
In both modes, the state of the 12-Bit ADC is viewable from the 12-Bit ADC field displayed in the ADC
Controls Block. If the ADC is in the OFF state, then ensure that the ADC block is configured in the
Powerdown Mode drop-down menu. If the ADC is in the IDLE state, press the Start Conv button for ADC
conversion and register readout. While converting, the 12-Bit ADC indicator turns yellow and displays the
text CNVT. These different ADC states are displayed in Figure 16.
Figure 16. ADC Controls Block
An ADC Chart is included in the ADC page to keep a history of the contents of the data registers (see
Figure 17). Pressing the (Auto) Read button starts the ADC Chart to periodically read the ADC data
registers. If in Direct Mode, the chart automatically issues a software conversion before every read. In
Auto Mode, ensure that all input channels are enabled in the ADC MUX block and press the Start Conv
button before starting the (Auto) Read. The contents of the chart can be copied into Microsoft® Excel® by
right clicking on the chart and selecting Export Data to Excel.
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Figure 17. ADC Chart
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AMC7834EVM DAC Page
The DAC page provides an interface to observe and control the different data registers, modes, and
configurations available for each individual DAC channel (see Figure 18).
Figure 18. DAC Page
Before setting the DAC channels, ensure that the DAC reference is configured correctly for use. By
default, the EVM is configured to use the on board +2.5-V supply. Additional DAC reference configurations
are illustrated in Table 7.
After the DAC reference configuration is set, the DACs can be programmed and released from the clamp
voltage by unchecking the Enable DACX Clamp, see the blue boxes in Figure 19. The eight DACs are
separated into 4 bipolar and 4 unipolar DAC outputs. The bipolar DACs include the following ranges,
which are selectable in the DAC Range drop-down menu: –4 to +1 V, –5 to 0 V, and 0 to +5 V. The
unipolar DACs are programmable with the following ranges: 0 to 5 V, and 2.5 to 7.5 V. The DAC ranges
and DAC input fields are respectively highlighted in green and red boxes. Either one of the DAC input
fields can be programmed with the desired DAC output voltage or hexadecimal value.
Figure 19. Program DAC Registers
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The DACs can be set to output synchronously or asynchronously by selecting the DAC X Settings,
displayed in Figure 20. Press the Trigger DAC button to synchronously load the DACs that have been set
in synchronous mode in the DAC Sync register. The Read DACs button also reads from the DAC data
registers and updates the input fields with the read values. The DAC read buttons are displayed in
Figure 21.
Figure 20. Program DAC Registers
Figure 21. DAC Read
The last item on the DACs page is the PA ON button, which is responsible for direct control of the PA_ON
terminal. When cleared to ‘0’, the PA_ON terminal is in the ‘off’ state, when set to ‘1’, the PA_ON terminal
is set to the ‘on’ state. Figure 22 displays the PA ON button.
Figure 22. PA ON Button
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AMC7834EVM ALARMS Page
The AMC7834 ALARMS page provides access to the programmable out-of-range alarms for the internal
and external temperature sensors, the DAC internal monitoring channels, and the bipolar DAC outputs.
Figure 23 displays the ALARMS Page of the AMC7834EVM. The page displays the name of each alarm,
shown under the Alarm Name column, and provides information such as the Value, High Limit, Low Limit,
and Alarm Status, with additional options.
Figure 23. ALARMS Page
To use the page, the ADC channel, Temperature Sensors, or bipolar DACs should be enabled in their
respective ADC and DAC page of the GUI. This is achieved by enabling the appropriate channel’s mux.
Once the channels are active, the Low Limit and High Limit fields are available for edit (see Figure 24).
Figure 24. Low Level Configuration Page
The Write Settings button is used to write the values from the Low Limit and High Limit fields into the
device. The Read Alarm button is used to read the state of the active channels. When an alarm is
triggered, the Alarm Status displays the text Tripped in red. If the channel values are within the range of
the alarm thresholds, the status displays No Alarm in black text.
Figure 25 displays the ADC Channel False Alarm protection, CH-FALR, drop-down list, which contains
integer values that are related to the consecutive number of samples required for the alarm to activate.
The lists defaults to 16 consecutive samples, therefore requiring 16 conversions with an over-range value
before the alarm is triggered. The temperature sensing inputs also have their respective False alarm
protection. The lists for these inputs default to 4 consecutive samples before the alarms are triggered.
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Figure 25. CH-FALR-CT Menu
Figure 26 shows the Alarmout column where alarms are activated to enable the ALARMOUT terminal.
When the Alarmout checkbox is selected, an alarm event associated with the corresponding Alarm Name
will trigger the ALARMOUT terminal. By default the ALARMOUT terminal is active low, the polarity of the
ALARMOUT terminal can be configured by setting the ALARMOUT-POLARITY bit in the ALARMOUT
configuration register.
Figure 26. Alarmout
The alarm page also includes the ability to check the status of the following signals: PA ON, SLEEP1,
SLEEP2, and GDAV. These flags are located in the General Status Register and default to ‘0’. If any of
the signals are in an active state, the LED lights up after the Read Alarms button is pressed, Figure 27.
Figure 27. Alarmout
5.2.6
AMC7834EVM GPIO Page
The AMC7834 GPIO Page features the four (GPIO1–GPIO4) GPIOs of the AMC7834 device.
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Figure 28. GPIO Page
Use the GPIO Block section of the GPIO tab, as shown in Figure 29, to set the various GPIO functions. To
perform a write or read, set the W/R Function pull-down to either Write or Read. The W/R value enables
the user to input or observe the Boolean value of the GPIO register. Press the W/R button to write to or
read from the GPIO pin.
Figure 29. GPIO Write/Read
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6
AMC7834EVM Documentation
This section contains the schematic diagrams and complete BOM for the AMC7834EVM. Documentation information for the SDM-USB-DIG
platform can be found in the SDM-USB-DIG Platform User’s Guide (SBOU136), available at the TI website at www.ti.com.
6.1
AMC7834EVM Board Schematic
Figure 30 and Figure 31 illustrate the EVM schematic.
J2
2
1
2
1
3
J1
Q1
MMBT3904
1
JP2
2
JP1
3
1
3
1
C2
C3
C4
NI
NI
NI
2
C1
NI
3
2
GND
GND
JP3
Q2
MMBT3906
1
JP4
3
1
3
1
R1
0
R2
0
R4
0
R3
0
ADC1
R5
0
ADC2
R7
0
ADC3
R8
0
ADC4
2
2
2
C5
1000pF
JP5
3
1
2
C6
R6
1000pF
0
VDD
C7
0.1uF
REF_ADC/CMP
1
2
2.5V REF
JP6
37
SENSE2+
7
SCLK
SENSE2-
36
SENSE2-
8
CS
AGND3
35
SDI
SENSE3+
34
GND
33
SENSE3-
32
SENSE4+
31
SENSE4-
30
VCLAMP1
29
VCLAMP2
J3
1
3
5
7
9
11
13
15
17
REF_IN
19
21
23
25
27
29
31
SENSE3+
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
PA_ON
REF_ADC/CMP
REF_OUT
PAVDD_EX
GND
VDD
GND
VDD
DAC3
PAVDD_EX
28
27
26
25
24
23
22
15
0.1uF
DAC4
VCLAMP2
AVDD1
VCLAMP1
AVCC
AVSS
DVDD
DAC2
SENSE4-
DAC1
SENSE4+
IOVDD
AGND2
SENSE3-
DGND
REF_OUT
C11
SDO
0.1uF
1
2
44
43
AVDD2
AGND4
46
47
48
49
51
45
ADC4
ADC3
ADC2
ADC1
D2-
52
50
SENSE2+
14
VCC
D1-
DACTRIG
13
C10
0.1uF
D2+
SENSE1-
6
3
PA_ON
SENSE1-
RESET
VDD
REF_ADC/CMP
SENSE1+
12
VDD
C9
4.7μF
38
REF_IN
GND
IOVDD
JP7
39
11
GND
53
SENSE1+
10
SD Mini Dig
54
SLEEP2
5
9
SDI
SDO
D1+
40
21
CS
GPIO4
PA_ON
20
DACTRIG
SCLK
55
SLEEP1
AUXDAC4
RESET
SCL
GPIO0
SDA
INT
SDI
VDUT
3
AUXDAC3
1
3
5
7
9
11
13
15
17
19
41
19
2
4
6
8
10
ALARMOUT
12
SLEEP1
14
SLEEP2
16
RESET
18
DACTRIG
20
TOUT
42
PAVDD
18
GPIO1
GPIO2
GPIO3
GPIO4
REF_ADC/CMP
ALARMOUT
4
SLEEP2
J4
C8
TP1
DIGTEST
2
AGND1
SLEEP1
GND
U1
AMC7834IRTQ
1
17
DIGTEST
GPIO3
PAD
R57
10.0k
ALARMOUT
AUXDAC2
IOVDD
R15
10.0k
AUXDAC1
R13
R14
10.0k 10.0k
GPIO2
IOVDD
16
R9
R10
R11
R12
10.0k 10.0k 10.0k 10.0k
GPIO1
56
VSS
GND
R18
0
R19
0
R22
0
GND
C12
R16
274k
VDD
1
R20
100k
GND
R23
0
C13
R24
0
0.1uF
R25
0
R26
0
VSS
GND
J5
GND
20
18
16
14
12
10
8
6
4
2
JP9
3
GND
1
R21
100k
3
GND
GND
GND
R27
0
GND
REF_IN
VDUT
SLEEP1
RESET
SCLK
SDI
C14
C15
C16
C17
C18
C19
C20
C21
C22
NI
NI
NI
NI
NI
NI
NI
NI
NI
2
DIGTEST
ALARMOUT
SLEEP2
DACTRIG
CS
SDO
19
17
15
13
11
9
7
5
3
1
R17
274k
JP8
0.1uF
2
GND
19
17
15
13
11
9
7
5
3
1
2
20
18
16
14
12
10
8
6
4
2
GND
2.5V REF
J6
GND
1
3
REF_OUT
JP10
Figure 30. AMC7834EVM Schematic (1 of 2)
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USEWALL WART T1094-P5P-ND19-30V
J7
1
3
2
C25
C23
C24
22μF
4.7μF
4.7μF
U2
R28
49.9k
R29
174k
26
PJ-102A
R33
24.9k
GND
D1
MMSZ4689-V
5.1V
R34
13.7k
R35
C32
178k 31
NI
28
2
GND
R38
NI
29
GND
U3
+14V
VIN
SS/TR
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
STSEL
VADJ
INH/UVLO
1
27
RT/CLK
10
11
12
13
14
15
39
C26
C27
C28
C29
R32
165k
47μF
47μF
10μF
1μF
35
R36
PH
PH
PH
PH
PH
PH
PH
PH
2
3
25
ISHARE
DNC
DNC
1
4
5
30
32
33
34
37
9
8
16
17
18
19
20
40
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
GND_PT
GND_PT
PGND
PGND
PGND
PGND
PGND
PGND
13
EN
+5V
OUT
OUT
SENSE
1
20
C30
C31
3
47μF
10μF
POS_5V_SUP
R30
300
0
GND
R37
R39
R40
R41
R42
R43
R44
R45
36
PWRGD
6
7
21
22
23
24
38
41
IN
IN
NI
VDUT
GND
GND
GND
15
16
R31
NI 4
NI 5
0 6
NI 8
NI 9
0 10
NI 11
NI 12
GND
14
NR
6P4V2
6P4V1
3P2V
1P6V
0P8V
0P4V
0P2V
0P1V
GND
C33
19
18
17
2
NC
NC
NC
NC
D2
Green
1μF
GND
7
GND
PAD
TPS7A4700RGW
GND
GND
GND
LMZ35003RKG
C34
2.2μF
U4
-14V
26
C35
4.7μF
C36
4.7μF
R46
174k
27
31
R52
GND
JP11
1
1
2
2
POS_5V_SUP
3
J8
TP2
VDD
C46
C54
C55
10μF
1μF
0.1μF
R53
13.7k
C45
NI 29
NI
28
6
7
21
22
23
24
38
41
GND
GND
VIN
INH/UVLO
CLK
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
16
17
18
19
20
40
RT
30
STSEL
PH
PH
PH
PH
PH
PH
PH
PH
A_VOUT
A_VOUT
A_VOUT
A_VOUT
A_VOUT
A_VOUT
A_VOUT
1
2
2
3
J9
TP3
VCC
C47
C56
2
3
25
35
GND
1μF
47μF
10μF
GND
R50
NI
1μF
VDUT
GND
15
16
C40
R51
36
GND
GND
GND
GND
GND
GND
GND
10
11
12
13
14
15
39
DNC
DNC
DNC
DNC
13
EN
4
5
6
8
9
10
11
12
NC
NC
NC
NC
NC
NC
NC
NC
1
20
OUT
OUT
C41
1μF
3
FB
R48
332k
C44
19
18
17
2
NC
NC
NC
NC
GND
GND
C48
C49
1μF
0.1μF
7
VIN
VOUT
6
TRIM/NR
5
TEMP
3
GND
4
NC
DNC
DNC
2.5V REF
C50
C51
10μF
GND
C58
C59
0.1μF
J11
J10
JP14
1
2
3
L1
1
GND
GND
VDUT
TP6
600 ohm
2
2
1
2
1μF
R56
0.47
1μF
REF5025IDGK
C52
D3
Green
U6
2
VDD
JP13
10μF
NEG_5V_SUP
R49
300
R54
102k
1μF
7
GND
PAD
8
1
VSS
10μF
14
NR/SS
GND
0.1μF
TP4
47μF
R55
165k
C57
3
C43
GND
GND
1
C42
TPS7A3301RGW
GND
NEG_5V_SUP
IN
IN
0
GND
1
4
5
32
33
34
37
LMZ34002RKG
10μF
47μF
C39
R47
NI
8
9
VADJ
JP12
1
C38
SS
VOUT_PT
VOUT_PT
-5V
U5
C37
TP5
TP7
IOVDD
GND
C53
TP8
C60
TP9
1μF
0.1μF
GND
GND
GND
Figure 31. AMC7834EVM Schematic (2 of 2)
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6.2
AMC7834EVM PCB Components Layout
Figure 32 shows the layout of the components for the AMC7834EVM board.
Figure 32. AMC7834EVM PCB Components Layout
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6.3
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AMC7834 Test Board Bill of Materials
Table 15 lists the BOM for this EVM.
Table 15. AMC7834EVM Bill of Materials
26
Item
Quantity
1
1
Designator
Description
Manufacturer
Part Number
Printed Circuit Board
Any
2
0
C1, C2, C3, C4, C14, C15,
C16, C17, C18, C19, C20,
C21, C22, C32, C45
Not Installed
6572459
3
2
C5, C6
4
6
C7, C9, C10, C11, C12, C13
CAP, CERM, 1000pF, 50V, +/-5%, C0G/NP0, 0603
MuRata
GRM1885C1H102JA01D
CAP, CERM, 0.1uF, 50V, +/-10%, X7R, 0603
AVX
5
1
06035C104KAT2A
C8
CAP, CERM, 4.7uF, 50V, +/-10%, X5R, 0805
TDK
6
C2012X5R1H475K125AB
4
C23, C24, C35, C36
CAP, CERM, 4.7uF, 50V, +/-10%, X7R, 1210
MuRata
GRM32ER71H475KA88L
7
1
C25
CAP, AL, 22uF, 35V, +/-20%, 1 ohm, SMD
Panasonic
EEE-FC1V220P
8
6
C26, C27, C30, C37, C38, C42
CAP, CERM, 47uF, 25V, +/-20%, X5R, 1206
TDK
C3216X5R1E476M160AC
9
7
C28, C31, C39, C43, C46,
C47, C52
CAP, CERM, 10uF, 25V, +/-10%, X7R, 1206
MuRata
GRM31CR71E106KA12L
10
5
C29, C33, C40, C41, C44
CAP, CERM, 1uF, 25V, +/-10%, X5R, 0805
TDK
C2012X5R1E105K
11
1
C34
CAP, CERM, 2.2uF, 25V, +/-10%, X5R, 1206
AVX
12063D225KAT2A
12
6
C48, C50, C53, C54, C56, C58
CAP, CERM, 1uF, 25V, +/-10%, X5R, 0603
TDK
C1608X5R1E105K080AC
13
5
C49, C55, C57, C59, C60
CAP, CERM, 0.1uF, 25V, +/-5%, X7R, 0603
AVX
06033C104JAT2A
14
1
C51
CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603
TDK
C1608X5R0J106M
15
1
D1
Diode, Zener, 5.1V, 500mW, SOD-123
Vishay-Semiconductor
MMSZ4689
16
2
D2, D3
LED, Green, SMD
Lumex
SML-LX0603GW-TR
17
6
J1, J2, J8, J9, J10, J11
Terminal Block, 6A, 3.5mm Pitch, 2-Pos, TH
On-Shore Technology,
Inc.
ED555/2DS
18
1
J3
Header, 100mil, 16x2, SMT
Samtec, Inc.
TSM-116-01-T-DV-P
19
1
J4
Receptacle, 50mil 10x2, R/A, TH
Mill-Max
853-43-020-20-001000
20
2
J5, J6
Header, 100mil, 10x2, SMD
Samtec, Inc.
TSM-110-01-T-DV-P
21
1
J7
Connector, DC Jack 2.1X5.5 mm, TH
CUI Inc.
PJ-102A
22
13
JP1, JP2, JP3, JP4, JP5, JP7,
JP8, JP9, JP10, JP11, JP12,
JP13, JP14
Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-103-07-G-S
23
1
JP6
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
24
1
L1
Ferrite Bead, 600 ohm @ 100MHz, 0.2A, 0603
MuRata
BLM18HG601SN1D
25
1
Q1
Transistor, NPN, 40V, 0.2A, SOT-23
Fairchild Semiconductor
MMBT3904
26
1
Q2
Transistor, PNP, 40V, 0.2A, SOT-23
Fairchild Semiconductor
MMBT3906
27
20
R1, R2, R3, R4, R5, R6, R7,
R8, R18, R19, R22, R23, R24,
R25, R26, R27, R36, R40,
R43, R51
RES, 0 ohm, 5%, 0.1W, 0603
Yageo America
RC0603JR-070RL
28
8
R9, R10, R11, R12, R13, R14,
R15, R57
RES, 10.0k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-0710KL
29
2
R16, R17
RES, 274k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07274KL
30
2
R20, R21
RES, 100k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07100KL
31
1
R28
RES, 49.9k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-0749K9L
32
2
R29, R46
RES, 174k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07174KL
33
2
R30, R49
RES, 300 ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07300RL
34
0
R31, R37, R38, R39, R41,
R42, R44, R45, R47, R50, R52
Not Installed
35
2
R32, R55
RES, 165k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07165KL
36
1
R33
RES, 24.9k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-0724K9L
37
2
R34, R53
RES, 13.7k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-0713K7L
38
1
R35
RES, 178k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07178KL
39
1
R48
RES, 332k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07332KL
40
1
R54
RES, 102k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07102KL
41
1
R56
RES, 0.47 ohm, 1%, 0.1W, 0603
Panasonic
ERJ-3RQFR47V
42
5
TP1, TP2, TP3, TP4, TP5
Test Point, Miniature, Red, TH
Keystone
5000
43
4
TP6, TP7, TP8, TP9
Test Point, Miniature, Black, TH
Keystone
5001
44
0
U1
INTEGRATED POWER AMPLIFIER MONITOR AND
CONTROL SYSTEM, RTQ0056F
Texas Instruments
AMC7834IRTQ
45
1
U2
7-V to 50-V Input, 2.5-A Step-Down, Integrated Power Solution
Texas Instruments
LMZ35003RKG
AMC7834 Evaluation Module
SLAU608B – December 2014 – Revised May 2016
Submit Documentation Feedback
Copyright © 2014–2016, Texas Instruments Incorporated
Revision History
www.ti.com
Table 15. AMC7834EVM Bill of Materials (continued)
Item
Quantity
Designator
Description
Manufacturer
Part Number
46
1
U3
36-V, 1-A, 4.17-µVRMS, RF LDO Voltage Regulator,
RGW0020A
Texas Instruments
TPS7A4700RGW
47
1
U4
4.5-V to 40-V Input, 15-W, Negative Output, Integrated Power
Solution
Texas Instruments
LMZ34002RKG
48
1
U5
–36-V, –1-A, Ultralow-Noise Negative Voltage Regulator,
Adjustable, RGW0020A
Texas Instruments
TPS7A3301RGW
49
1
U6
Low-Noise, Very Low Drift, Precision VOLTAGE REFERENCE,
DGK0008A
Texas Instruments
REF5025IDGK
50
14
NA
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
51
4
NA
Bumpon, Hemisphere, 0.44 X 0.20, Clear
3M
SJ-5303 (CLEAR)
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from A Revision (January 2016) to B Revision ............................................................................................... Page
•
•
•
Changed text "An optional +24V wall supply..." in Section 2 ........................................................................ 4
Changed J1 Connection To: J7 Connection in Figure 1 ............................................................................. 4
Changed "Default" and "Optional" blocks in Figure 2 ................................................................................ 4
Revision History
Changes from Original (December 2014) to A Revision ................................................................................................ Page
•
•
•
•
•
•
•
•
Added note and removed last row in the Contents of AMC7834EVM Kit table. .................................................. 3
Modified the AMC7834EVM Hardware Setup image. ................................................................................ 4
Modified the AMC7834 Test Board Block Diagram image. .......................................................................... 4
Added a note to the Default Jumper Settings table. .................................................................................. 8
Changed the text in the AMC7834EVM Power Configurations section. ........................................................... 9
Deleted JP6 row (the last row) of the AMC7834EVM Power Shunt Jumper Settings table. .................................. 10
Changed the Reference Configuration Settings table. .............................................................................. 10
Added the Optional 2.5-V Reference Generated From Wall Adapter table. ..................................................... 11
SLAU608B – December 2014 – Revised May 2016
Submit Documentation Feedback
Copyright © 2014–2016, Texas Instruments Incorporated
Revision History
27
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
spacer
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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