AMC7932FPHPR

AMC7932 SLASF17 – NOVEMBER 2021 AMC7932 32-Channel, 12-Bit Analog Monitor and Controller With Multichannel ADC, Bipolar DACs, Temperature Sensor and GPIO Ports 1 Features • • • • • • • • • • 32 monotonic 12-bit DACs – Programmable ranges: –10 V to 0 V, –5 V to 0 V, 0 V to 5 V, and 0 V to 10 V – High current drive capability – Autorange detector FlexIO pins; ADC and GPIO configurable – AMC7932: 6 FlexIO pins – AMC7932F: 5 FlexIO pins 12-bit, 250-kSPS SAR ADC – Input ranges: 0 V to 5 V and 0 V to 2.5 V – Programmable out-of-range alarms General-purpose I/O (GPIO) Built-in sequencing features Internal 2.5-V reference Internal temperature sensor – Accuracy: ±2.5°C (maximum) – Resolution: 0.0625°C SPI-compatible interface: 1.65-V to 5.5-V operation – AMC7932: 3-wire mode – AMC7932F: 4-wire mode Specified temperature range: –40°C to +125°C Operating temperature range: –40°C to +150°C The device includes flexible input/output (FlexIO) pins that can be configured as either analog inputs to the ADC or as GPIOs with two available options: AMC7932 (six FlexIO pins) and AMC7932F (five FlexIO pins). Communication to the device is performed through a 3-wire (AMC7932) or 4-wire (AMC7932F) SPI-compatible interface. The AMC7932 high-integration and wide operating temperature range make the device an excellent choice as an all-in-one, bias-control circuit for the power amplifiers (PA) found in multichannel RF communication systems. The flexible DAC output ranges and built-in sequencing features allow the device to be used as a biasing controller for a large variety of transistor technologies, such as LDMOS, GaAs, and GaN. Device Information PACKAGE(1) PART NUMBER AMC7932 (1) TQFP (48) BODY SIZE (NOM) 7.00 mm × 7.00 mm For all available packages, see the package option addendum at the end of the data sheet. AMC7932 2.5-V Reference 2 Applications Macro remote radio unit (RRU) Active antenna system mMIMO (AAS) Distributed antenna systems (DAS) Outdoor backhaul unit Radar 32 Bipo lar DAC O utp uts DAC-0 DAC-31 GPIO Control 3-Wire or 4-Wire SPI MUX The AMC7932 is a highly integrated analog monitor and control device designed for high-density, generalpurpose monitor and control systems. The AMC7932 includes 32 12-bit, digital-to-analog converters (DACs) with programmable output ranges. The device also incorporates a multiplexed, 12-bit analog-todigital converter (ADC) with programmable threshold detectors, a temperature sensor, and an internal reference. The AMC7932 high level of integration significantly reduces component count and simplifies closed-loop system designs, thus making it a great choice for high-density applications where board space is critical. Ser ial Interface 3 Description ADC Temperature Sen sor 6 or 5 Pins fo r Ana log Inp uts or GPIOs • • • • • Simplified Schematic An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AMC7932 www.ti.com SLASF17 – NOVEMBER 2021 4 Device and Documentation Support 4.1 Documentation Support 4.1.1 Related Documentation For related documentation see the following: • Texas Instruments, LMP8480 / LMP8481 Precision 76V High-Side Current Sense Amplifiers with Voltage Output data sheet • Texas Instruments, LM50/LM50-Q1 SOT-23 Single-Supply Centigrade Temperature Sensor data sheet 4.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 4.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 4.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 4.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: AMC7932 PACKAGE OPTION ADDENDUM www.ti.com 16-Dec-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) AMC7932FPHPR ACTIVE HTQFP PHP 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 AMC7932F AMC7932FPHPT ACTIVE HTQFP PHP 48 250 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 AMC7932F AMC7932PHPR ACTIVE HTQFP PHP 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 AMC7932 AMC7932PHPT ACTIVE HTQFP PHP 48 250 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 AMC7932 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of