BOOST-CCEMADAPTER

EM Adapter BoosterPack User’s Guide Literature number SWRU338 revision A SWRU338A Table of Contents 1 INTRODUCTION .............................................................................................................................. 3 2 ABOUT THIS MANUAL ................................................................................................................... 3 3 ACRONYMS AND DEFINITIONS.................................................................................................... 3 4 HARDWARE DESCRIPTION .......................................................................................................... 4 4.1 EM CONNECTORS ....................................................................................................................... 4 4.2 LAUNCHPAD CONNECTORS .......................................................................................................... 4 4.3 LAUNCHPAD TO EM INTERCONNECTION ....................................................................................... 5 4.3.1 Interconnect Concept ......................................................................................................... 5 4.3.2 Detailed Pin-out ................................................................................................................. 6 4.4 POWERING THE ADAPTER BOARD................................................................................................. 7 4.5 MEASURING THE CURRENT CONSUMPTION ................................................................................... 8 4.6 GPIO SWAP RESISTORS ............................................................................................................. 8 4.7 OPTIONAL 32K OSCILLATOR......................................................................................................... 8 5 SCHEMATICS .................................................................................................................................. 9 6 REFERENCES ............................................................................................................................... 10 7 DOCUMENT HISTORY.................................................................................................................. 10 List of Figures Figure 1 - EM Adapter BoosterPack Details ............................................................................................ 4 Figure 2 - Interconnect Concept .............................................................................................................. 5 Figure 3 - Re-wiring Concept .................................................................................................................. 5 Figure 4 - Power Select Jumper Detailed Overview ............................................................................... 7 Figure 5 - Power Select Jumper .............................................................................................................. 7 Figure 6 - GPIO Swap Resistors ............................................................................................................. 8 Figure 7 - GPIO Swap Resistor Positions ............................................................................................... 8 Figure 8 - Oscillator Solder Pads ............................................................................................................ 8 2/10 SWRU338A 1 Introduction Thank you for purchasing the EM Adapter BoosterPack. The adapter board is a simple sandwich board that makes it easy to connect one of the many available RF Evaluation Modules (EM), like the CC1101EM, CC1120EM, CC2500EM, and CC2520EM to a TI MCU LaunchPad development board. The adapter board provides access to all of the pins on the EM connector and is designed to make it easy to re-configure the connections between the EM and LaunchPad (LP) to fit any combination of evaluation modules and LaunchPads. The adapter board is equipped with a USB connector to make it possible to power the assembly (LaunchPad + adapter + EM, or just the adapter + EM) if the power supply on the LaunchPad is insufficient. If you like to build your own BoosterPack, please refer to the "Build Your Own BoosterPack" wiki [2]. 2 About this Manual This manual describes the EM Adapter BoosterPack hardware. 3 Acronyms and Definitions BP CS EM LP MCU MISO MOSI RF SCLK SoC SPI TI USB BoosterPack Chip Select Evaluation Module LaunchPad Micro Controller Unit Master Out Slave In Master In Slave Out Radio Frequency Serial Clock System on Chip Serial Peripheral Interface Texas Instruments Universal Serial bus 3/10 SWRU338A 4 Hardware Description USB Power Supply EM Signal Probe Area EM Connectors Power Source Select Optional 32.768 kHz Crystal External Power Source 0-Ohm breakout resistors LaunchPad Connectors LaunchPad Signal Probe Area Voltage Regulator Figure 1 - EM Adapter BoosterPack Details 4.1 EM Connectors The part number of the EM connectors on the adapter board is TFM-110-02-L-D-A from Samtec [7]. They mate with e.g. SFM-110-02-L-D-A, also from Samtec. 4.2 LaunchPad Connectors The LaunchPad connectors on the adapter board are SSQ-110-23-L-D from Samtec. Dual-row headers/sockets are used to allow full pass-through of all signals from an XL type LaunchPad, e.g. the Tiva TM4C LaunchPad [4], to an appropriate BoosterPack [6] stacked on top of the EM Adapter BoosterPack. At the time of writing this document, the EM Adapter BoosterPack is compatible with the following LaunchPads:    MSP430 ValueLine LaunchPad [3] Tiva TM4C LaunchPad [4] C2000 Piccolo LaunchPad [5] 4/10 SWRU338A 4.3 4.3.1 LaunchPad to EM Interconnection Interconnect Concept 0 Ohm Resistors LaunchPad Connector Probe Header EM Connector (RF2) EM Connector (RF1) 0 Ohm Resistors Probe Header Probe Header LaunchPad Connector Probe Header Figure 2 below shows the basic concept of how the signals from the LaunchPad connectors are connected to signals on the EM connectors. All of the pins on the connectors are available on probe headers or pin holes on the board. Figure 2 - Interconnect Concept All signals between the LP and EM connectors are interconnected with a 0-Ohm resistor. By removing the resistor, the signal path is broken and it is easy to wire strap between the various probe pins to adjust the interconnection to fit any EM and LP pin-out. Figure 3 illustrates the concept. Pin #r on LaunchPad Socket Pin #x on EM Header Probe Pin Pin #q on LaunchPad Socket 0-Ohm Resistor Wire strapping possible when removing the 0-Ohm resistor Figure 3 - Re-wiring Concept 5/10 Probe Pin Pin #y on EM Header SWRU338A 4.3.2 Detailed Pin-out The tables below show the pin-out from the EM connectors and LP connectors and how these signals are connected together. EM Connector 1 (RF1) EM Connector 2 (RF2) Signal name Pin Pin Signal name Signal name Pin Pin Signal name GND 1 2 - - 1 2 GND GPIO4 3 4 - - 3 4 - OSC32k 5 6 - - 5 6 - RX 7 8 - VDD 7 8 - TX 9 10 GPIO0 (A) VDD 9 10 - - 11 12 GPIO2 (B) - 11 12 - - 13 14 SPI CS - 13 14 - - 15 16 SPI SCLK RESET 15 16 - - 17 18 SPI MOSI - 17 18 GPIO3 GND 19 20 SPI MISO GPIO5 19 20 GND Adapter Board LaunchPad (LP1) Signal name LP1.1 VDD LP1.2 Adapter Board EM Header LaunchPad (LP2) Signal name EM Header VDD LP2.1 GND GND GPIOB (2) RF1.12 LP2.2 GPIOA (0) RF1.10 LP1.3 GPIO (TX) RF1.09 LP2.3 SPI CS RF1.14 LP1.4 GPIO (RX) RF1.07 LP2.4 - - LP1.5 - - LP2.5 - - LP1.6 - - LP2.6 SPI MOSI RF1.18 LP1.7 SPI SCLK RF1.16 LP2.7 SPI MISO RF1.20 LP1.8 - - LP2.8 RESET RF2.15 LP1.9 - - LP2.9 GPIO4 RF1.03 LP1.10 GPIO5 RF2.19 LP2.10 GPIO3 RF2.18 6/10 SWRU338A 4.4 Powering the Adapter Board LaunchPad Connector Use the power select jumper, P4, to switch between power sources for the evaluation module. Figure 4 shows an overview of how the various power sources are connected to the power jumper. 1 3 P4 To EM U S B 2 P3 4 3.3V Regulator Figure 4 - Power Select Jumper Detailed Overview The default option is to power the adopter board, and thus the evaluation module (EM), directly from the LaunchPad (LP). In this case, the jumper should short-circuit pin 1 and 2. See Figure 5 below (the default option on the left). Default: Power EM from LP Alternative 1: Power EM from USB Alternative 2: Power LP and EM from USB Figure 5 - Power Select Jumper The board is equipped with a USB connector and a voltage regulator to make it possible to supply power from USB. Any USB power source can be used, with a maximum voltage of 5.5V. This voltage source can be used if the LaunchPad is unable to supply sufficient current (for example for the CC3000 WiFi evaluation modules). Note that the USB connector can ONLY be used as a power source. The USB data lines are not connected. To power the assembly from USB, the jumper on header P4 must be rotated 90 degrees so that pin 2 is connected to pin 4. See Figure 5, alternative 1. The on-board buck/boost regulator will set the voltage to 3.3V. As an alternative to USB, you can connect an external power source to the board using the pin holes for connector P3 (on the right hand side of the board). The voltage source shall be in the range from 1.8V to 5.5V. The power select jumper on P4 should in this case be in the same position as when a USB cable is connected. Avoid connecting both a USB cable and an external power source to the adapter board at the same time. By connecting an additional jumper on P4, short-circuiting pin 1-3, you can use the USB supply to both power the EM and the LaunchPad, as shown in Figure 5, alternative 2. In this case, remove any other power source from the LaunchPad. You can also bypass the on-board regulator altogether by connecting an external power source directly to pin 2 on P4. In this case, the voltage supplied by the power source shall be within the maximum and minimum operating voltage limits of the evaluation module connected to the adapter board. To avoid signal level conflicts, make sure the voltage supplied to the EM is similar to the voltage on the LP. 7/10 SWRU338A 4.5 Measuring the Current Consumption By connecting an ammeter between the power source pin (pin 1 or 3) on the power select header P4 and the power sink pin (pin 2 on the same header), you can easily measure the current consumed by the connected EM board. 4.6 GPIO Swap Resistors In order to support existing software for the various EM boards available, the Adapter Board allows simple swapping on the signals from EM connector 1 to pins on the LaunchPad connector. Figure 6 - GPIO Swap Resistors In the default position, the signal GPIO0 (RF2.10) goes to GPIOA (LP1.2) and GPIO2 (RF2.12) goes to GPIOB (LP2.2). As shown in Figure 7, by rotating the two 0603 0-Ohm resistors R25 and R26, you swap these interconnections, such that GPIO0 is connected to LP2.2 (GPIOB) and GPIO2 is connected to LP1.2 (GPIOA). Default Alternate Figure 7 - GPIO Swap Resistor Positions 4.7 Optional 32k Oscillator To support some of the Bluetooth CC256x evaluation modules that require an external clock signal on EM connector pin RF1.5, it is possible to mount a 32.768 kHz crystal oscillator on the adapter board. Figure 8 - Oscillator Solder Pads The board is designed to fit a 5x7 mm oscillator from Abracon [8]. This part is easily available from suppliers like Digi-Key and Future Electronics. 8/10 SWRU338A 5 Schematics 9/10 SWRU338A 6 7 References [1] EM Adpater BoostePack product web site http://www.ti.com/tool/boost-ccemadapter [2] Build Your Own BoosterPack http://processors.wiki.ti.com/index.php/BYOB [3] MSP430 ValueLine LaunchPad http://www.ti.com/tool/msp-exp430g2 [4] Tiva TM4C LaunchPad http://www.ti.com/tool/ek-tm4c123gxl [5] C2000 Piccolo LaunchPad http://ti.com/tool/launchxl-f28027 [6] Overview of BoosterPacks http://processors.wiki.ti.com/index.php/BoosterPacks [7] Samtec http://www.samtec.com [8] Abracon ASVK 32.768 kHz Oscillator http://www.abracon.com/Oscillators/ASVK.pdf Document History Revision Date A 2013-03-12 2013-04-15 Description/Changes First revision. New pictures 10/10 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. 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SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. 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TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. 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EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. 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