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User’s Guide
BOOSTXL-TECDRV BoosterPack™ User's Guide
Milos Acanski
ABSTRACT
The BOOSXL-TECDRV BoosterPack allows users to evaluate the Texas Instruments’ TPS63810 buck-boost
converter as a driver for a thermoelectric cooling (TEC) module. The TPS63810 is a high efficiency, high output
current buck-boost converter programmable through I2C interface. The BoosterPack operates from input voltage
of 3.3 V, and can drive the TEC with an output current of up to 2.5 A.
Figure 1-1. BOOSTXL-TECDRV BoosterPack
This user's guide includes a detailed description of the hardware (HW), bill of materials (BOM), schematic, and
software (code and GUI) when using the LaunchPad MSP-EXP432P401R.
Table 1-1. Related Documentation
Device
Literature Number
TPS63810
SLVSEK4
MSP-EXP432P401R
SLAU597
Table of Contents
1 Introduction.............................................................................................................................................................................3
2 Quick Start...............................................................................................................................................................................4
2.1 Step 1: Software Installation.............................................................................................................................................. 4
2.2 Step 2: Firmware Completition and Flashing..................................................................................................................... 4
2.3 Step 3: Hardware Setup.....................................................................................................................................................4
2.4 Step 4: GUI........................................................................................................................................................................ 4
3 System Overview.................................................................................................................................................................... 6
4 Hardware Overview................................................................................................................................................................ 7
4.1 Buck-Boost Converter........................................................................................................................................................ 7
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4.2 Thermoelectric Cooler (TEC)............................................................................................................................................. 7
4.3 LaunchPad......................................................................................................................................................................... 8
4.4 Voltage Reference..............................................................................................................................................................8
4.5 Temperature Sensor...........................................................................................................................................................9
5 Firmware Overview...............................................................................................................................................................10
6 Graphical User Interface (GUI).............................................................................................................................................11
7 Setup Details......................................................................................................................................................................... 12
8 Bill of Materials, PCB Layout, and Schematic................................................................................................................... 14
8.1 Bill of Materials.................................................................................................................................................................14
8.2 PCB Layout...................................................................................................................................................................... 16
8.3 Schematic........................................................................................................................................................................ 18
List of Figures
Figure 1-1. BOOSTXL-TECDRV BoosterPack............................................................................................................................ 1
Figure 1-1. BOOSTXL-TECDRV Block Diagram......................................................................................................................... 3
Figure 2-1. LaunchPad and BoosterPack Combo....................................................................................................................... 4
Figure 3-1. TEC System Block Diagram......................................................................................................................................6
Figure 4-1. Buck-Boost Converter as TEC Driver........................................................................................................................7
Figure 4-2. Typical TEC Module.................................................................................................................................................. 7
Figure 4-3. TPS63810 Operating Area When Driving TEC Module............................................................................................ 8
Figure 5-1. Firmware Flow Chart............................................................................................................................................... 10
Figure 6-1. GUI Interface Window..............................................................................................................................................11
Figure 7-1. Hardware Setup...................................................................................................................................................... 12
Figure 8-1. Assembly Layer.......................................................................................................................................................16
Figure 8-2. Top Layer.................................................................................................................................................................16
Figure 8-3. Bottom Layer (Top View)......................................................................................................................................... 17
Figure 8-4. BOOSTXL-TECDRV Schematic..............................................................................................................................18
List of Tables
Table 1-1. Related Documentation.............................................................................................................................................. 1
Table 8-1. Bill of Materials..........................................................................................................................................................14
Trademarks
SMBus™ is a trademark of Texas Instruments.
Windows® is a registered trademark of Microsoft.
All trademarks are the property of their respective owners.
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Introduction
1 Introduction
The BOOSTXL-TECDRV BoosterPack is an evaluation platform designated to highlight the TPS63810 use as a
driver for a thermoelectric cooling (TEC) module.
The BOOSTXL-TECDRV interfaces to LaunchPad development platforms using the XL connector format. To use
the BOOSTXL-TECDRV BoosterPack GUI a specific LaunchPad (the MSP-EXP432P401R) must be used. The
LaunchPad communicates to the TPS63810 through its I2C interface and also acts as a USB-to-PC GUI
communication bridge.
Note
The BOOSTXL-TECDRV requires a LaunchPad or external master controller to evaluate the
TPS63810.
The MSP-EXP432P401R LaunchPad is controlled by commands received from the BOOSTXL-TECDRV
BoosterPack GUI. The LaunchPad sends data to the GUI for display. If a LaunchPad is not used, the
BoosterPack plug-in module format allows an alternate external host to communicate with the TPS63810 using
the LaunchPad connectors.
The BOOSTXL-TECDRV incorporates circuitry and components with the following features:
• The TPS63810 high efficiency, high output current buck-boost converter with I2C interface.
• On board precision 2.5-V voltage reference.
• External power supply and temperature sensors can be connected through screw terminal blocks.
• I2C interface for the TPS63810 device configuration and communication.
Note
The BOOSTXL-TECDRV requires an external 3.3-V power supply to power the TPS63810.
Figure 1-1shows the BOOSTXL-TECDRV architecture along with the key components and blocks listed in the
features.
Power Supply
Terminal Block
TP63810
Buck-Boost
TEC
Terminal Block
I2C
ADC
3.3 V
Temperature Sensor
Terminal Block
REF2050
2.5-V Reference
BoosterPack
Header
2.5 V
Figure 1-1. BOOSTXL-TECDRV Block Diagram
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Quick Start
2 Quick Start
The quick start presented in this section is a minimalist view of the startup procedure to get the system up and
running. More details regarding the hardware and software setup can be found in Section 7.
2.1 Step 1: Software Installation
Download the LaunchPad firmware from the BOOSTXL-TECDRV tools folder . Download and install Energia IDE
from the Energia website. The LaunchPad firmware is written in Energia, and needs to be modified for the
particular temperature sensor and the TEC module that are used. Alternatively, the Energia code can be used
and modified using the cloud CCS tool.
2.2 Step 2: Firmware Completition and Flashing
Depending on the used temperature sensor and the TEC module, the LaunchPad firmware needs to be
completed. This can be done using the Energia IDE or the cloud version of the CCS IDE. The completed
firmware then needs to be downloaded to the LaunchPad using the micro USB cable provided with the
LaunchPad kit. Details regarding these steps can be found in Section 7.
2.3 Step 3: Hardware Setup
After the firmware file has successfully downloaded to the LaunchPad, unplug the USB cable from the
LaunchPad. Align properly the connectors (as shown in Figure 2-1) and attach the BOOSTXL-TECDRV
BoosterPack to the bottom set of connectors on the LaunchPad.
Figure 2-1. LaunchPad and BoosterPack Combo
When the BoosterPack is attached, plug the USB cable into the bottom connector of the LaunchPad and also to
the PC. A green LED lights up indicating that the LaunchPad is powered. The LaunchPad communication to the
PC is USB communications device class (CDC) using a virtual COM port. Windows® 10 automatically installs the
required driver. Earlier versions of the operating system may require a manual driver installation.
Connect the temperature sensor to the sensor input terminal block J7 on the BoosterPack. Depending on the
temperature sensor, different connectors need to be used. Details regarding these steps can be found in Section
7. Make sure that the jumper on JP2 header is connecting EN and ON pins, and that the jumper on JP1 header
is connecting VSEL and VOUT1 pins.
Connect the TEC module to the output terminal block J6 on the BoosterPack, minding the TEC module polarity.
Connect the 3.3-V power supply to the input power terminal block on the BoosterPack, and turn the power
supply on.
2.4 Step 4: GUI
From the Windows Start menu, go to the Texas Instruments folder and under BOOSTXL-TECDRV start the GUI
application. A cloud version of the GUI is also available from dev.ti.com in the software gallery. The
communication between the GUI and the LaunchPad should be automatically established. If the hardware does
not connect, manually try to make the connection by clicking on the connect icon in the lower left portion of the
GUI. If the correct serial COM port cannot be found, the desired port can be selected from the Options drop
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Quick Start
down menu and selecting Serial Port. When the firmware program is successfully downloaded, the GUI software
can now communicate with the LaunchPad.
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System Overview
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3 System Overview
Thermoelectric cooler (TEC) is a device that operates using the Peltier effect to create a heat flux at the junction
of two different types of materials. It is a solid-state active heat pump which transfers heat from one side of the
device to the other, depending on the direction of the current. Therefore, depending on the direction of the heat
flow, TEC can be used for heating or for cooling.
With a feedback circuitry, TEC can be used to implement a highly stable temperature controller to maintain a
precise and stable temperature of a material, component or system. A block diagram of such a controller is
shown in Figure 3-1.
Thermally coupled
Temperature
Stabilized
Component
TEC
-1.5 V .. +1.9 V
3.3 V
Power
Sypply
Temperature Sensor
I2C/Analog
BOOSTXL-TECDRV
I2C Vref ADC
C Control
Figure 3-1. TEC System Block Diagram
The temperature is measured using an analog or digital temperature sensor. The sensor is interfaced to the
LaunchPad through the BOOSTXL-TECDRV BoosterPack, either through the analog-to-digital converter (ADC)
or through the I2C interface of the LaunchPad. The LaunchPad reads out the temperature and implements a
control algorithm that generates the driving signal needed to perform temperature stabilization. The driving signal
is sent back to the BoosterPack and is used to set the output voltage of the TPS63810 buck-boost converter.
The TPS63810 sets the voltage across the TEC and control the direction and amount of heat flow, heating or
cooling the target that is thermally coupled to the TEC.
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Hardware Overview
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4 Hardware Overview
4.1 Buck-Boost Converter
The TPS63810 is a buck-boost converter with an I2C interface. The ability of the buck-boost converter to
increase or decrease the input voltage can be used to drive a TEC with positive or negative voltage. In this way,
the heat flow through the TEC can be controlled in order to heat or cool the target device. Figure 4-1 shows how
the TEC can be driven using the buck-boost converter. When the converter operates in buck mode, VOUT is
lower than VIN, and VTEC and ITEC are therefore positive. It should be noted that in this mode, ITEC flows from VIN
into VOUT pin of the TPS63810, therefore the TPS63810 output is sinking the TEC current. When the converter
operates in boost mode, VOUT is higher than VIN, and VTEC and ITEC are therefore negative. It should be noted
that in this mode, ITEC flows from VOUT pin of the TPS63810 back to the power source VIN, therefore the
TPS63810 output is sourcing the TEC current.
VTEC
+
TEC
ITEC
L
L1
VIN
L2
VOUT
VOUT
VIN
TPS63810
CIN
I2C
I2C
COUT
GND
Figure 4-1. Buck-Boost Converter as TEC Driver
With the TPS63810, the TEC voltage can be easily changed via I2C interface. This reduces the component
count when compared to conventional voltage scaling approaches, where a dedicated DAC or a PWM signal
with associated filters and scaling resistors is used.
4.2 Thermoelectric Cooler (TEC)
As mentioned, thermoelectric cooler (TEC) is a solid-state heat pump which transfers heat from one side of the
device to the other. The direction of the heat flow depends on the polarity of the applied voltage. Figure 4-2
shows a typical TEC module. Typically, when connecting the positive end of the power supply to the red wire,
and the negative end to the black wire, the top side of the TEC will be cold and the bottom side will be hot.
Figure 4-2. Typical TEC Module
TEC modules differ in power that they can handle and the operating resistance they have. A TEC module with
appropriate power rating should be used to maintain the goal system temperature under all conditions. To fully
leverage the voltage/current capabilities of the TPS63810, there is an optimal range of resistance that the
selected TEC should meet. The shaded area in Figure 4-3 shows the operating area, for example, the output
voltage and current, of the TPS63810 when driving the TEC module, when the input voltage is 3.3 V. The
specific operating points for several values of the TEC element resistance are shown with different lines. The
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Hardware Overview
TPS63810 can drive the TEC module with up to 5.3 W when operating in forward direction (when sourcing
current), and up to 1.5 W when operating in reverse (when sinking current). The user can determine if cooling or
heating is more important, and appropriately configure the polarity of the TEC module.
4
3.5
3
RTEC = 0.5 :
RTEC = 1 :
RTEC = 2 :
TEC Current (A)
2.5
2
1.5
1
0.5
0
-0.5
-1
-1.5
1.5
2
2.5
3
3.5
4
Output Voltage (V)
4.5
5
5.5
D001
Figure 4-3. TPS63810 Operating Area When Driving TEC Module
4.3 LaunchPad
The BOOSTXL-TECDRV requires the MSP-EXP432P401R LaunchPad for control. The MSP-EXP432P401R
LaunchPad features the SimpleLink MSP432P401R microcontroller (MCU) with an integrated 16-bit precision
ADC, delivering ultra-low-power performance including 80 µA/MHz in active power and 660 nA in standby power
with FPU and DSP extensions.
The MSP-EXP432P401R LaunchPad provides an I2C interface for controlling the TPS63810. Additionally, the
I2C interface can also be used to connect a digital I2C temperature sensor. Alternatively, analog temperature
sensors can be interfaced to the integrated 16-bit ADC. The MSP-EXP432P401R LaunchPad is supported by
Energia, an open-source electronics prototyping platform. The advantage of the MSP-EXP432P401R
LaunchPad is that the ADC external reference pin is available on the BoosterPack pinout, enabling the use of a
more precise external voltage reference instead of the integrated one.
Other LaunchPads can be used as well with the BOOSTXL-TECDRV. If so, attention should be given to the
Launchpad’s pinout. If the ADC external reference pin is not available on the BoosterPack pinout, a hardware
modification is needed. Otherwise, the internal reference can be used for the ADC. It should be noted that this
may affect the temperature accuracy, as the external voltage references are typically more accurate and stable
than the integrated voltage reference of the MCU. The control and sensing lines of the BoosterPack can be rerouted to different header pins, as explained in Section 8.3.
The MSP-EXP432P401R LaunchPad also provides a 3.3-V supply used for the voltage reference and the digital
temperature sensor, if used.
4.4 Voltage Reference
The BOOSTXL-TECDRV BoosterPack includes a REF2025 voltage reference. The REF2025 is a low-power
band-gap voltage reference with initial accuracy of ±0.05%, and very low temperature drift of 8 ppm/°C. This
reference is connected to the VeREF+ pin of the MSP-EXP432P401R LaunchPad’s MCU, to be used as voltage
reference for the integrated 16-bit ADC. Using the precision external reference instead of the integrated voltage
reference of the MCU improves the accuracy and stability of the temperature tracking.
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Hardware Overview
4.5 Temperature Sensor
Different types of temperature sensors can be used with the BOOSTXL-TECDRV BoosterPack. The sensors can
be connected to the screw terminal on the BoosterPack to interface them to the I2C interface or the ADC of the
LaunchPad’s MCU.
By default, the provided firmware is intended to be used with the TMP117 temperature sensor. The TMP117 is a
high-precision digital temperature sensor. The TMP117 provides a 16-bit temperature result with a resolution of
0.0078°C and an accuracy of up to ±0.1°C across the temperature range of -20°C to 50°C with no calibration.
The TMP117 has an I2C-compatible interface. The low power consumption of the TMP117 minimizes the impact
of self-heating on measurement accuracy. The TMP117 operates from 1.8 V to 5.5 V and typically consumes 3.5
μA.
An nalog temperature sensor can also be used. The analog sensor is interfaced to the 16-bit ADC integrated into
the MSP-EXP432P401R LaunchPad. The provided firmware is already prepared for reading the analog input.
The user only has to provide the conversion equation to translate the ADC value into the temperature. Typically,
three types of analog temperature sensors are used:
1. Linear analog temperature sensors, which provides a voltage output that changes linearly with the
temperature. An example is the LMT70, an ultra-small, high-precision, low-power CMOS analog temperature
sensor with NTC output slope of -5.19 mV/°C and accuracy of ±0.05°C.
2. Positive temperature coefficient (PTC) thermistor, which is a resistor whose resistance increases as
temperature rises. An example is the TMP61, a ±1% 10-kΩ silicon-based thermistor offering linearity and
consistent sensitivity across temperature.
3. Negative temperature coefficient (NTC) thermistor, which is a resistor whose resistance decreases as
temperature rises.
Note that PTC and NTC thermistors require a biasing resistor to form a resistive voltage divider whose output
voltage depends on the temperature. The BOOSTXL-TECDRV BoosterPack has already included place for this
resistor on board. It should also be noted that PTC thermistors have benefits over NTC thermistors such as no
extra linearization circuitry, minimized calibration, less resistance tolerance variation, larger sensitivity at high
temperatures, and simplified conversion methods to save time and memory in the processor. Use the thermistor
design tool to view resistance tables and begin your design with example temperature conversion methods and
code.
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Firmware Overview
5 Firmware Overview
The firmware for the MSP-EXP432P401R LaunchPad is implemented in Energia. While this firmware is meant to
be used with the MSP-EXP432P401R only, it can be easily modified for other TI LaunchPads. For this reason
the BOOSTXL-TECDRV BoosterPack has multiple connection options for the BoosterPack header. By moving
the jumper resistors, the signal and control lines can be re-routed between multiple pins. This is shown in more
details in the schematic in Section 8.3.
Figure 5-1 shows the firmware flow chart.
Main
Initialization
MCU configuration
Program variables
Software libraries
TPS63810 configuration
Sensor configuration
Main loop
Timer 1 tasks
Timer 1
task due?
(100 ms)
Yes
Read temperature
PID controller
Update TEC voltage
No
Timer 2 tasks
Timer 2
task due?
(200 ms)
Yes
Update GUI values
No
GUI commands
GUI
command
received?
Yes
Update PID/control
No
Figure 5-1. Firmware Flow Chart
The code starts by initializing various variables, configuring MCU and its peripherals, and configuring digital
sensors. After that the main loop takes care of three main processes:
1. A 100-ms timer takes care of the main control process. Here, the temperature is read either from the analog
sensor via ADC or the digital sensor via I2C. After that, the PID controller calculates the necessary control
voltage for the TPS63810. This voltage is transmitted to the TPS63810 via the same I2C interface used for
the digital temperature sensor, and the TEC voltage is updated. This period depends on the thermal
dynamics of the system and can be changed in the code.
2. A 200-ms timer periodically sends the currently sensed temperature and the current output voltage of the
TPS63810 to the GUI. This period can be extended in order to send less data to the GUI. When used with the
BOOSTXL-TECDRV GUI, it is not recommended to send the data more than 10 times per second, as the
GUI might not be able to process all the incoming data.
3. The third process checks if there is a message received from the GUI. These messages are sent from the
GUI to the Launchpad on user commands, such as initializing the TPS63810 or changing the control modes
and PID parameters.
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Graphical User Interface (GUI)
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6 Graphical User Interface (GUI)
A graphical user interface (GUI) is available from dev.ti.com in the software gallery, allowing a simple and
convenient interface to the BOOSTXL-TECDRV BoosterPack through the MSP-EXP432P401R LaunchPad. A
standalone version of the GUI can be downloaded or the web-based version can be used directly from the
browser.
This section gives an overview of the BOOSTXL-TECDRV GUI. Figure 6-1 shows the layout of the BOOSTXLTECDRV GUI. The left portion of the GUI is used to control and monitor the system operation. The right part of
the GUI shows a time chart of the measured temperature.
Figure 6-1. GUI Interface Window
Upon startup, the GUI automatically connects to the EVM. If not, click on the Connect button in the lower left
corner of the GUI window.
To select the correct serial COM port for communication with the LaunchPad, the desired port can be selected
from the Options drop down menu in the upper left corner by selecting Serial Port.
Once the communication is established and the hardware is connected, the temperature control can be started
by clicking on the Initialize TPS63810 button. This will turn the TPS63810 output on, and turn on the closed loop
control by starting the PID controller in the LaunchPad. In the left side of the GUI interface, the goal temperature
can be set, and the actual temperature and the current output voltage of the TPS63810 can be monitored. Upon
initialization, the GUI will read the default PID parameters set in the firmware and display them. If needed, these
PID parameters can be changed in real time to tune the response of the system.
Alternatively, the system can be run open loop by selecting OPEN in the Control loop drop-box. In this mode the
goal temperature is ignored. Instead, the output voltage of the TPS63810 can be changed manually. This can be
used to create a step response for tuning the system for the particular TEC/sensor combination being used. This
is explained in more details in Section 7.
Clicking the Clear chart button clears the temperature time chart, whereas the Save chart button saves the
currently displayed chart in CSV format. Clicking the User’s guide button leads to the online version of this user’s
guide.
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Setup Details
7 Setup Details
Figure 7-1 shows the hardware setup of the system. A 3.3-V power supply connected to J5 terminal block is
used to power the BOOSTXL-TECDRV BoosterPack. Make sure that the jumper on JP2 header is connecting
EN and ON pins, and that the jumper on JP1 header is connecting VSEL and VOUT1 pins. Connect the TEC
module to J6 terminal block, with positive (red) wire connected to VOUT connection and negative (black) wire to
VIN connection. In this arrangement, the sensor and the component that is thermally stabilized need to be
mounted on the cold side of the TEC module. Nevertheless, when finally turning on the system, if the
temperature drifts away from the set temperature, the wires of the TEC module can be simply swapped reverse
the TEC polarity.
Figure 7-1. Hardware Setup
The BOOSTXL-TECDRV BoosterPack can be used with an analog or a digital I2C temperature sensor.
If an I2C temperature sensor is used, connect it to J7 block terminal using the 3V3, GND, SDA and SCL
connections. Resistors R3 and R4 on the BoosterPack are the pull-up resistor for the I2C lines. 2.2-kΩ resistors
are already mounted on the board, and can be removed or changed if needed.
If an analog temperature sensor is used, connect it to J7 block terminal using the 3V3, GND and AIN
connections. 3V3 connection is useful in case when an active sensor that requires a power supply, such as the
LMT70, is used. In case a PTC or an NTC thermistor is used, it can be connected between AIN and GND
connections. A 10-kΩ, 0.1% resistor R7 on the BoosterPack is already mounted, serving as the high side resistor
that forms a voltage divider with the thermistor.
The provided firmware assumes that a digital I2C temperature sensor TMP117 is used. To change the sensor
type, the sensType variable needs to be set to either SENS_TYPE_I2C for digital, or SENS_TYPE_ANL for
analog sensor.
If a digital sensor is used it needs to be initialized. For the TMP117 in particular, this is done in the initialization
part of the code, where it is configured for continuous conversion without averaging. The value that is read from
the sensor is converted into temperature using the following conversion:
tempSens = tmp*0.0078125
where tempSens is the sensed temperature in °C and tmp is the value received from TMP117. For more
information on the TMP117, refer to the TMP117 High-Accuracy, Low-Power, Digital Temperature Sensor with
SMBus™ -and I2C-Compatible Interface data sheet.
If an analog temperature sensor is used, the value read from the ADC needs to be converted to temperature
before being used in the PID controller. Use the thermistor design tool to view resistance tables for TI devices,
and begin your design with example temperature conversion methods and code.
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Setup Details
The initial PID controller parameters can be set by changing the PID_KP, PID_KI, PID_KD constants. It should
be noted that the provided firmware implements PI controller, which is sufficient for majority of controllers for
thermal processes. To prevent the integrator from saturation, an anti-windup is implemented using the backcalculation method. The anti-windup can be tuned modifying the PID_KAWU constant. All PID parameters can
be changed in GUI during runtime, to fine tune the system response.
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Bill of Materials, PCB Layout, and Schematic
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8 Bill of Materials, PCB Layout, and Schematic
This section contains the BOOSTXL-TECDRV board schematic, bill of materials (BOM), and printed circuit board
(PCB) layout.
8.1 Bill of Materials
Table 8-1 lists the bill of materials (BOM) for the BOOSTXL-TECDRV.
Table 8-1. Bill of Materials
Designator
Quantity
Value
Description
Part Number
Manufacturer
C1
1
10uF
CAP, CERM, 10 uF, 6.3 V, +/- 20%,
X5R, 0603
GRM188R60J106ME84D
MuRata
C5
1
150uF
CAP, Tantalum Polymer, 150 uF, 10
T530D157M010ATE005
V, +/- 20%, 0.005 ohm, 7343-31 SMD
Kemet
C6, C7
2
47uF
CAP, CERM, 47 uF, 6.3 V, +/- 20%,
X5R, 0603
GRM188R60J476ME15D
MuRata
C12, C13,
C16, C17,
C18
5
1uF
CAP, CERM, 1 uF, 25 V, +/- 10%,
X7R, 0603
GRM188R71E105KA12D
MuRata
C15
1
4.7uF
CAP, CERM, 4.7 uF, 10 V, +/- 20%,
X7R, 0603
GRM188Z71A475ME15D
MuRata
C19
1
0.047uF
CAP, CERM, 0.047 uF, 16 V, +/- 10%, GRM188R71C473KA01D
X7R, 0603
MuRata
J1/J3, J2/J4
2
Receptacle, 2.54mm, 10x2, Tin, TH
SSQ-110-03-T-D
Samtec
J5
1
Terminal Block, 3.5mm Pitch, 2x1,
TH
ED555/2DS
On-Shore
Technology
J6
1
Terminal Block, 3.5mm Pitch, 3x1,
TH
ED555/3DS
On-Shore
Technology
J7
1
Terminal Block, 3.5mm Pitch, 6x1,
TH
ED555/6DS
On-Shore
Technology
JP1, JP2
2
Header, 2.54 mm, 3x1, Gold, TH
61300311121
Wurth Elektronik
JP3, JP4
2
Header, 2.54 mm, 1x1, Gold, TH
61300111121
Wurth Elektronik
L1
1
470nH
Inductor, Shielded, Composite, 470
nH, 3.5 A, 0.0076 ohm, SMD
XFL4015-471MEC
Coilcraft
R2, R5
2
1.00Meg
RES, 1.00 M, 1%, 0.1 W, AEC-Q200
Grade 0, 0603
CRCW06031M00FKEA
Vishay-Dale
R3, R4
2
2.20k
RES, 2.20 k, 1%, 0.1 W, 0603
RC0603FR-072K2L
Yageo
R6, R13, R14,
R20, R23
5
0
RES, 0, 1%, 0.1 W, AEC-Q200
Grade 0, 0603
RMCF0603ZT0R00
Stackpole
Electronics Inc
14
R7
1
10.0k
RES, 10.0 k, 0.1%, 0.1 W, 0603
RT0603BRD0710KL
Yageo America
R8
1
10.0k
RES, 10.0 k, 1%, 0.1 W, AEC-Q200
Grade 0, 0603
CRCW060310K0FKEA
Vishay-Dale
R26
1
330
RES, 330, 1%, 0.1 W, 0603
RC0603FR-07330RL
Yageo
U1
1
High-Current, High-Efficiency BuckBoost Converter with I2C Interface,
YFF0015AHAN (DSBGA-15)
TPS63810YFFR
Texas Instruments
U2
1
8 ppm/degC Drift, Low-Power, Dual- REF2025AIDDCR
Output Vref and Vref/2 Voltage
Reference, DDC0005A (SOT-23-T-5)
Texas Instruments
C2
0
10uF
CAP, CERM, 10 uF, 6.3 V, +/- 20%,
X5R, 0603
GRM188R60J106ME84D
MuRata
C3, C4
0
22uF
CAP, CERM, 22 uF, 25 V, +/- 20%,
X5R, 1206_190
TMK316BBJ226ML-T
Taiyo Yuden
C8
0
47uF
CAP, CERM, 47 uF, 6.3 V, +/- 20%,
X5R, 0603
GRM188R60J476ME15D
MuRata
C9, C10
0
47uF
CAP, CERM, 47 uF, 10 V, +/- 20%,
X5R, 1206_190
LMK316ABJ476ML-T
Taiyo Yuden
BOOSTXL-TECDRV BoosterPack™ User's Guide
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Bill of Materials, PCB Layout, and Schematic
Table 8-1. Bill of Materials (continued)
Designator
Quantity
Value
Description
Part Number
Manufacturer
C11
0
0.1uF
CAP, CERM, 0.1 uF, 25 V, +/- 5%,
X7R, 0603
C0603C104J3RACTU
Kemet
C14
0
1uF
CAP, CERM, 1 uF, 25 V, +/- 10%,
X7R, 0603
GRM188R71E105KA12D
MuRata
FID1, FID2,
FID3
0
Fiduciary mark. There is nothing to
buy or mount.
N/A
N/A
R1
0
75.0k
RES, 75.0 k, 1%, 0.1 W, 0603
RC0603FR-0775KL
Yageo
R9
0
511k
RES, 511 k, 1%, 0.1 W, AEC-Q200
Grade 0, 0603
CRCW0603511KFKEA
Vishay-Dale
R10
0
80.6k
RES, 80.6 k, 1%, 0.1 W, 0603
RC0603FR-0780K6L
Yageo
R11
0
10.0k
RES, 10.0 k, 1%, 0.1 W, AEC-Q200
Grade 0, 0603
CRCW060310K0FKEA
Vishay-Dale
R12
0
56.2k
RES, 56.2 k, 1%, 0.1 W, AEC-Q200
Grade 0, 0603
CRCW060356K2FKEA
Vishay-Dale
R15, R16,
R17, R18,
R19, R21,
R22, R24,
R25, R27,
R28
0
0
RES, 0, 1%, 0.1 W, AEC-Q200
Grade 0, 0603
RMCF0603ZT0R00
Stackpole
Electronics Inc
TP1, TP2
0
Test Point, Miniature, White, TH
5002
Keystone
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Bill of Materials, PCB Layout, and Schematic
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8.2 PCB Layout
Figure 8-1 to Figure 8-2 depict the BOOSTXL-TECDRV PCB layout.
Figure 8-1. Assembly Layer
Figure 8-2. Top Layer
16
BOOSTXL-TECDRV BoosterPack™ User's Guide
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Bill of Materials, PCB Layout, and Schematic
Figure 8-3. Bottom Layer (Top View)
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Bill of Materials, PCB Layout, and Schematic
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8.3 Schematic
Figure 8-4 shows the BOOSTXL-TECDRV schematic. Note that some lines can be connected to different pins
on the BoosterPack header. This is done so that the BoosterPack can be used with other TI LaunchPads. For
example, the A_IN line used to interface the analog temperature sensor to the ADC on the LaunchPad is
connected to the header pin BP6 via jumper resistor R14. If needed, this line can be re-routed to BP2 or BP26
pins of the BoosterPack header by removing R14 and populating R15 or R16 jumper resistors.
J1/J3
J2/J4
3V3
BP2
AIN*
BP6
AIN
BP9
BP10
SCL
SDA
1
2
3
4
5
6
7
8
9
10
+3.3V
Analog_In
LP_UART_RX
LP_UART_TX
GPIO !
Analog In
SPI_CLK
GPIO !
I2C_SCL
I2C_SDA
+5V
GND
Analog_In
Analog_In
Analog_In
Analog_In
Analog_In/I2S_WS
Analog_In/I2S_SCLK
Analog_Out/I2S_SDout
Analog_Out/I2S_SDin
21
22
23
24
25
26
27
28
29
30
PWM*
PWM*
BP26
BP37
VeREF
GND
BP40
BP39
AIN*
BP32
BP31
VSEL*
EN*
40
39
38
37
36
35
34
33
32
31
SSQ-110-03-T-D
R14
BP6
A_IN
BP12
TPS_EN
0
R23
R15
DNP
0
BP18
R21
DNP
0
BP13
R24
DNP
0
BP26
R16
DNP
0
BP31
R22
DNP
0
BP32
R25
DNP
0
BP19
R17
DNP
0
BP39
R18
DNP
0
BP40
R19
DNP
0
R26
BP37
VOUT
BP13
BP12
BP11
C15
4.7µF
3V3
R9
DNP
511k
A_VREF
C19
47nF
TP1
DNP
TP2
L1
L1
R13
BP9
D1
0
DNP
L2
470nH
VIN
B2
B3
L1
L1
A2
A3
VIN
VIN
A1
EN
SCL
D1
D1
B1
VSEL
SDA
E1
BP10
AGND
GND
GND
C1
C2
C3
J5
2
1
DNP C4
22uF
GND
VSEL*
VSEL
EN
3V3
R3
2.20k
R10
DNP
80.6k
R11
DNP
10.0k
R12
DNP
56.2k
DNP C14
1µF
GND
GND
DVS_PWM
R4
2.20k
BP10
BP9
L2
L2
D2
D3
VOUT
VOUT
E2
E3
VOUT
VIN
J6
3
2
1
VOUT
VIN
GND
ED555/2DS
C5
150uF
R28
DNP
0
GND
U1
VIN
GND
PWM
EN*
TPS_VSEL
330
GND
BP19
BP18
0
BP2
DVS_PWM
20
19
18
17
16
15
14
13
12
11
GND
PWM/GPIO !
GPIO !
GPIO
RST
SPI_MOSI
SPI_MISO
SPI_CS/GPIO !
SPI_CS/GPIO !
GPIO !
SSQ-110-03-T-D
R20
BP11
0
PWM/GPIO !
PWM/GPIO !
PWM/GPIO !
PWM/GPIO !
Timer_Cap/GPIO !
Timer_Cap/GPIO !
GPIO !
GPIO !
GPIO !
GPIO !
DNP C3
22uF
DNP C2
10uF
C1
10uF
ED555/3DS
C6
47uF
C7 DNP C8
47uF
47uF
DNP C9
47uF
DNP C10
47uF
GND
GND
TPS63810YFFR
GND
GND
GND
GND
GND
GND
GND
GND
GND
J7
GND
I2C_SCL
I2C_SDA
3V3
GND
A_IN
VIN
VIN
R1
DNP
75.0k
JP2
JP1
3
2
1
ON
EN
OFF
R27
DNP
0
U2
4
VIN
3
EN
C17
1µF
GND
R5
1.00M
JP3
GND
TPS_EN
GND
GND
3V3
BP10
BP9
C12
1µF
1
JP4
1
R2
DNP C11
1.00M
100nF
GND
3V3
6
5
4
3
2
1
ED555/6DS
3
2
1
VOUT2
VSEL
VOUT1
GND
A_VREF
VREF
5
VBIAS
1
GND
2
R6
R7
R8
0
10.0k
10.0k
A_IN
C18
1µF
C16
1µF
C13
1µF
REF2025AIDDCR
GND
GND
GND
TPS_VSEL
GND
GND
GND
GND
GND
Figure 8-4. BOOSTXL-TECDRV Schematic
18
BOOSTXL-TECDRV BoosterPack™ User's Guide
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