0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
BQ20Z70EVM-001

BQ20Z70EVM-001

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    MODULE EVAL BQ20Z70/29330/29412

  • 数据手册
  • 价格&库存
BQ20Z70EVM-001 数据手册
User's Guide SLUU242B – May 2006 – Revised October 2013 bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module This EVM is a complete evaluation system for the bq20z70/bq29330/bq29412 battery management system. The EVM includes one bq20z70/bq29330/bq29412 circuit module, a current sense resistor, two thermistors, and Windows®-based PC software. The circuit module includes one bq20z70 IC, one bq29330 IC, one bq29412 IC, and all other onboard components necessary to monitor and predict capacity, perform cell balancing, monitor critical parameters, protect the cells from overcharge, over discharge, short circuit, and overcurrent in 2-, 3- or 4-series cell Li-ion or Li-polymer battery packs. The circuit module connects directly across the cells in a battery. An EV2300 board for gas gauge interface is required to interface this EVM with the PC and can be purchased separately. With the EV2300 interface board and software, the user can read the bq20z70 data registers, program the chipset for different pack configurations, log cycling data for further evaluation, and evaluate the overall functionality of the bq20z70/bq29330/bq29412 solution under different charge and discharge conditions. 1 2 3 4 5 6 7 8 9 10 11 Contents Features ...................................................................................................................... 2 bq20z70/bq29330-Based Circuit Module ................................................................................ 2 bq20z70/bq29330 Circuit Module Schematic ........................................................................... 3 Circuit Module Physical Layouts and Bill of Materials .................................................................. 3 EVM Hardware and Software Setup ..................................................................................... 9 Troubleshooting Unexpected Dialog Boxes ............................................................................. 9 Hardware Connection ...................................................................................................... 9 Operation ................................................................................................................... 11 Calibration Screen ......................................................................................................... 14 Pro (Advanced) Screen ................................................................................................... 16 Related Documentation from Texas Instruments ..................................................................... 17 List of Figures 1 bq20z70EVM-001 Layout (Silk Screen) .................................................................................. 4 2 Top Assembly ............................................................................................................... 4 3 Top Layer .................................................................................................................... 4 4 Bottom Layer ................................................................................................................ ........................................................................................................... Schematic .................................................................................................................... bq20z70/bq29330 Circuit Module Connection to Cells and System Load/Charger............................... SBS Data Screen .......................................................................................................... Data Flash Screen, 1st Level Safety Class ............................................................................ Calibration Screen ......................................................................................................... Pro (Advanced) Screen ................................................................................................... 5 5 Bottom Assembly 5 6 7 8 9 10 11 8 10 12 13 15 16 List of Tables 1 Ordering Information ........................................................................................................ 2 2 Bill of Materials .............................................................................................................. 6 Impedance Track is a trademark of Texas Instruments. Windows is a registered trademark of Microsoft Corporation. SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module Copyright © 2006–2013, Texas Instruments Incorporated 1 Features 1 3 Performance Specification Summary..................................................................................... 4 Circuit Module to EV2300 Connections • • • 10 Complete evaluation system for the bq20z70 SBS 1.1-compliant advanced gas gauge with Impedance Track Technology, bq29330 analog front end (AFE) and protection IC, and bq29412 independent overvoltage protection IC Populated circuit module for quick setup PC software and interface board for easy evaluation Software that allows data logging for system analysis Kit Contents • • • 1.2 ................................................................................ 9 Features • 1.1 www.ti.com bq20z70/bq29330/bq29412 circuit module Software CD with the evaluation software Set of support documentation Ordering Information Table 1. Ordering Information 2 EVM PART NUMBER CHEMISTRY CONFIGURATION CAPACITY bq20z70EVM-001 Li-ion 2, 3, or 4 cell Any bq20z70/bq29330-Based Circuit Module The bq20z70/bq29330/bq29412-based circuit module is a complete and compact example solution of a bq20z70 and bq29330 circuit for battery management and protection of Li-ion or Li-polymer packs. The circuit module incorporates a bq20z70 battery monitor IC, bq29330 AFE and protection IC, bq29412 independent overvoltage protection IC, and all other components necessary to accurately predict the capacity of 2-, 3-, or 4-series cells. 2.1 Circuit Module Connections Contacts on the circuit module provide the following connections: • Direct connection to the cells: 1N (BAT–), 1P, 2P, 3P, 4P (BAT+) • To the serial communications port (SMBC, SMBD, VSS) • The system load and charger connect across PACK+ and PACK– • To the system present pin (SYS PRES) 2 bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated bq20z70/bq29330 Circuit Module Schematic www.ti.com 2.2 Pin Descriptions PIN NAME 1N 1P 2P 3P 4P SMBC SMBD VSS PACK– SYS PRES PACK+ 3 DESCRIPTION –ve connection of first (bottom) cell +ve connection of first (bottom) cell +ve connection of second cell +ve connection of third cell +ve connection of fourth (top) cell Serial communication port clock Serial communication data port Pack negative terminal Pack negative terminal System present pin (if low, system is present) Pack positive terminal bq20z70/bq29330 Circuit Module Schematic This section contains information for modifying and choosing a precharge mode for bq20z70/bq29330/bq29412 implementation. 3.1 Schematic The schematic follows the bill of materials in this user's guide. 3.2 Choosing Particular Precharge Mode The chipset supports both a charger that has a precharge mode and one that does not. The EVM by default supports a charger that does not have a precharge mode. This is configured by grounding the PMS pin with a resistor. R12 and Q2 are used as the precharge current path in order to sustain sufficient Pack+ voltage when the battery voltage is too low to power up the bq29330 IC. If the charger has a precharge function, R12 and FET Q2 are not used. The PMS pin must be pulled high to disable ZVCHG output. The charge FET Q1 is used as the precharge FET, and the charger must control the precharge current and voltage. Note: The configuration at PMS pin is a hardware level control. Once the bq20z70 is up and running, the firmware may change the precharge settings. Please refer to bq20z70 datasheet for further information. 3.3 Testing Fuse-Blowing Circuit To prevent the loss of board functionality during the fuse-blowing test, the actual chemical fuse is not provided in the circuit. FET Q4 drives TP3 low if a fuse-blow condition occurs; so monitoring TP3 can be used to test this condition. 4 Circuit Module Physical Layouts and Bill of Materials This section contains the board layout, bill of materials, and assembly drawings for the bq20z70/ bq29330/ bq29412 circuit module. NOTE: For the battery pack designer: D3 is not recommended, and should be shorted out if the DSG FET does not have built-in zener diode protection. SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module Copyright © 2006–2013, Texas Instruments Incorporated 3 Circuit Module Physical Layouts and Bill of Materials 4.1 www.ti.com Board Layout This section shows the dimensions, PCB layers, and assembly drawing for the bq20z70/bq29330 module. Figure 1. bq20z70EVM-001 Layout (Silk Screen) Figure 2. Top Assembly Figure 3. Top Layer 4 bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Circuit Module Physical Layouts and Bill of Materials www.ti.com Figure 4. Bottom Layer Figure 5. Bottom Assembly SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module Copyright © 2006–2013, Texas Instruments Incorporated 5 Circuit Module Physical Layouts and Bill of Materials 4.2 www.ti.com Bill of Materials Table 2. Bill of Materials Count Ref Des Value Description Size Part No. MFR C1–C11, C14, C16–C20, C22–C24 0.1 μF Capacitor, ceramic, 0.1 μF, 50 V, X7R, 20% 0603 STD Any 1 C12 0.22 μF Capacitor, ceramic, 0.22 μF, 25 V, X7R, 20% 0603 STD Any 3 C13, C15, C27 1.0 μF Capacitor, ceramic, 1.0 μF, 25 V, X7R, 20% 0805 STD Any 2 C21, C26 0.47 μF Capacitor, ceramic, 0.47 μF, 16 V, X7R, 20% 0603 STD Any 1 C25 2.2 μF Capacitor, ceramic, 2.2 μF, 10 V, X7R, 20% 0805 STD Any 4 D1, D3, D4, D6 BAS16 Diode, Switching, 150-mA, 75-V, 350 mW SOT23 BAS16 Vishay-Liteon 2 D2, D5 AZ23C5V6 Diode, dual, zener, 5.6V, 300mW SOT23 AZ23C5V6 Vishay-Telefunken 1 J1 22-05-3041 Header, friction lock assembly, 4-pin right angle 0.400 x 0.500 22-05-3041 Molex 2 Q1, Q3 FDS6690A MOSFET, N-ch, Logic Level, Power Trench, 30 V, 11 A, 12.5 mΩ SO8 FDS6690A Fairchild 1 Q2 Si4435DY MOSFET, P-ch, 30 V, 8 A, 20 mΩ SO8 Si4435DY Siliconix 1 Q4 NDS331N MOSFET, N-ch, 20 V, 1.3 A, 0.16 Ω SOT23 NDS331N Fairchild 1 Q5 BSS138 MOSFET, N-ch, 50 V, 0.22 A, 6 Ω SOT23 BSS138 Fairchild 12 R1–R5, R21–R24, R31, R32, R36 100 Resistor, chip, 100 Ω, 1/16 W, 5% 0603 STD STD 2 R11, R19 3M Resistor, chip, 3 MΩ, 1/16 W, 5% 0603 STD STD 1 R12 301 Resistor, chip, 301 Ω, 1 W, 1% 2512 WSL-2512-301 Vishay 3 R13, R15, R18 5.1K Resistor, chip, 5.1 kΩ, 1/16 W, 5% 0603 STD STD 3 R14, R25, R30 1M Resistor, chip, 1 MΩ, 1/16 W, 5% 0603 STD STD 1 R16 100K Resistor, chip, 100 kΩ, 1/16 W, 5% 0603 STD STD 1 R17 0.010 75ppm Resistor, chip, 0.010 Ω, 1 W, 1% 2512 WSL-2512-010 Vishay 1 R20 10K Resistor, chip, 10 kΩ, 1/16 W, 5% 0603 STD STD 2 R26, R34 8.45K Resistor, chip, 8.45 kΩ, 1/16 W, 1% 0603 STD STD 2 R27, R33 61.9K Resistor, chip, 61.9 kΩ, 1/16 W, 1% 0603 STD STD 3 R28, R29, R35 220K Resistor, chip, 220 kΩ, 1/16 W, 5% 0603 STD STD 6 R6–R10, R37 1K Resistor, Chip 1 kΩ, 1/16W, 5% 0603 STD STD 2 RT1, RT2 10K Thermistor, 10 kΩ 0.095 x 0.150 NTC103AT Sematec 2 TB1, TB3 ED1515 Terminal block, 3 pin, 6 A, 3,5 mm 0.41 x 0.25 ED1515 OST 1 TB2 ED1514 Terminal block, 2 pin, 6 A, 3,5 mm 0.27 x 0.25 ED1514 OST 1 TP1 GND Test point, White, Thru Hole Color Keyed 0.100 × 0.100 in 5002 Keystone 1 TP2 VCC Test point, White, Thru Hole Color Keyed 0.100 × 0.100 in 5002 Keystone 1 TP3 ~FUSE Test point, White, Thru Hole Color Keyed 0.100 × 0.100 in 5002 Keystone 1 U1 IC, voltage protection for 2, 3, or 4 cell Li-Ion, 2nd protection, 4.45 OVP ±25 mV MSOP-08 (DCT3) BA29412DT3R TI 1 U2 IC, 2, 3, or 4 cell series protection control AFE TSSOP-30 bq29330DBT TI 1 U3 IC, SBS 1.1-Compliant GG Enabled with Impedance Track™ technology, use with the bq29330 TSSOP-20 bq20z70PW TI 2 J5 mate Connector, Female, 0.100 centers Molex 22-01-3407 8 N/A Terminals, crimp, tin Molex 08-50-0114 N/A Wire, insulated 24 AWG. red, 18 inches (±3 inches) (USB_5V) Alpha 1854-3 N/A Wire, insulated 24 AWG. white, 18 inches (±3 inches) (SCL) Alpha 1854-1 N/A Wire, insulated 24 AWG. black, 18 inches (±3 inches) (GND) Alpha 1854-2 N/A Wire, insulated 24 AWG. brown, 18 inches (±3 inches) (SDA) Alpha 1854-7 N/A Heatsink, 1 inch Any Any 20 Connector 1 Notes: 1. These assemblies are ESD sensitive; observe ESD precautions. 2. This assembly must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable. 6 bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Circuit Module Physical Layouts and Bill of Materials www.ti.com Table 2. Bill of Materials (continued) Count Ref Des Value Description Size Part No. MFR 3. This assembly must comply with workmanship standards IPC-A-610 Class 2. 4. Reference designators marked with an asterisk (**) cannot be substituted. All other components can be substituted with equivalent MFG's components. 5. Make one SMBus connector wire assembly for each assembly produced, from J5 mate, 4-24 AWG wires, and crimp terminals. Wire colors for pin numbers are listed below. The wire assembly shall have a J5 mate on each end. • • • • Red – Pin 4 (Signal USB_5V) Brown – Pin 3 (Signal Data) White – Pin 2 (Signal Clock) Black – Pin 1 (GND) 6. RT1/RT2 should be assembled horizontally laying flat against the board edge with the sensing tip out. SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module Copyright © 2006–2013, Texas Instruments Incorporated 7 Circuit Module Physical Layouts and Bill of Materials Note: For the battery pack designer:D3 is not recommended, and should be shorted out if the DSG FET does not have built-in zener diode protection. www.ti.com Figure 6. Schematic 8 bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated EVM Hardware and Software Setup www.ti.com 4.3 bq20z70/bq29330/bq29412 Circuit Module Performance Specification Summary This section summarizes the performance specifications of the bq20z70/ bq29330/bq29412 circuit module. Table 3. Performance Specification Summary Specification 5 Min Typ Max Units Input voltage Pack+ to Pack- 6 15 25 V Charge and discharge current 0 2 7 A EVM Hardware and Software Setup This section describes how to install the bq20z70EVM-001 PC software, and how to connect the different components of the EVM. 5.1 System Requirements The bq20z70EVSW requires Windows 2000 or Windows XP. Drivers for Windows 98SE are provided, but Microsoft no longer supports Windows 98; and there may be issues in Windows 98 with USB driver support. The EV2300 USB drivers have been tested for Windows 98SE, but no assurance is made for problem-free operation with specific system configurations. 5.2 Software Installation Find the latest software version in the bq20z70 tool folder on power.ti.com. Use the following steps to install the bq20z70EVSW software: 1. Copy the files from the CD into the temporary directory you selected, in the folder "bq20z70 EV SW Install", double-click on bqEVSWSetup00.09.32.exe and follow the installer instructions to complete the bq20z70 EVSW installation. 2. If the EV2300 was not previously installed, after bq20z70 EVSW installation, a TI USB DRIVER INSTALLER will pop up. Click "Yes" for the agreement message and follow its instructions. 3. Plug the EV2300 into a USB port. 4. The Win98 Driver can be found in the archive Win98EV2300Drivers-DocUpdateDec1703.zip under the "EV2300 Drivers" folder. If files were downloaded from the Web: 1. Open the archive containing the installation package, and copy its contents in a temporary directory. 2. Follow the preceding steps 1 - 4. 6 Troubleshooting Unexpected Dialog Boxes Ensure that the files were extracted from the zip file using the Preserve Folder names option. Ensure that all the files were extracted from the zip file. The user that is downloading the files must be logged in as the administrator. The driver is not signed, so the administrator must allow installation of unsigned drivers in the operating system policy. 7 Hardware Connection The bq20z70EVM-001 comprises three hardware components: the bq20z70/bq29330/bq29412 circuit module, the EV2300 PC interface board (purchased separately), and the PC. SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module Copyright © 2006–2013, Texas Instruments Incorporated 9 Hardware Connection 7.1 www.ti.com Connecting the bq20z70/bq29330/bq29412 Circuit Module to a Battery Pack Figure 7 shows how to connect the bq20z70/bq29330/bq29412 circuit module to the cells and system load/charger. The cells should be connected in the following order: 1. 4-Cell Pack: 1N (BAT-), 1P, and 2P (see Section 2.1 for definitions). 2. 3-Cell Pack: 1N (BAT-), 1P, 2P, and then connect 4P and 3P together. 3. 2-Cell Pack: 1N (BAT-), 1P, and then connect 4P, 3P, and 2P together To start charge or discharge test, connect SYS PRES pin to PACK- pin to set SYS PRES state. To test sleep mode, disconnect the SYS PRES pin. Figure 7. bq20z70/bq29330 Circuit Module Connection to Cells and System Load/Charger 7.2 PC Interface Connection The following steps configure the hardware for interface to the PC: 1. Connect the bq20z70/bq29330-based smart battery to the EV2300 using wire leads as shown in Table 4. Table 4. Circuit Module to EV2300 Connections bq20z70/bq29330-Based Battery EV2300 SMBD SMBD SMBC SMBC VSS GND 2. Connect the PC USB cable to the EV2300 and the PC USB port. The bq20z70EVM-001 is now set up for operation. 10 bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Operation www.ti.com 8 Operation This section details the operation of the bq20z70 EVSW software. Note: the EV2300 driver does not support Windows Sleep or Hibernate. In case there is a problem communicating with the EV2300 or the EVM, first unplug the USB cable then plug it back in. If the problem persists, check whether the EVM is in Shutdown mode. The bq20z70 can be waken up by momentarily applying a voltage higher than 5.5V (but less than 25V) at Pack+ pin of the EVM. 8.1 Starting the Program With the EV2300 and the bq20z70 EVM connected to the computer, run bq20z70 EVSW from the Start | Programs | Texas Instruments | bq20z70 EVSW menu sequence. The SBS Data screen appears. Data begins to appear once the (single time scan) button is clicked, or when the check box is checked. To disable the scan feature, deselect . The continuous scanning period can be set via the |Options| and |Set Scan Interval| menu selections. The range for this interval is 0 ms to 65535 ms. Only items that are selected for scanning are scanned within this period. The bq20z70 EVSW provides a logging function which logs the values that were last scanned by EVSW. To enable this function, select the Start Logging button; this causes the Keep Scanning button to be selected. When logging is Stopped, the keep scanning button is still selected and has to be manually unchecked. The logging interval are specified under the |Options| menu with the maximum value of 65535 milliseconds. The Log interval cannot be smaller than the scan interval because this results in the same value being logged at least twice. SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module Copyright © 2006–2013, Texas Instruments Incorporated 11 Operation www.ti.com Figure 8. SBS Data Screen This screen shows the SBS data set along with additional ManufacturersAccess() command information such as individual cell measurements. Additional Flag and Static data can be viewed by selecting the appropriate tab at the bottom of the SBS screen. Data such as SBS.ManufacturerName( ) is static and does not change. This data is viewed separately using the Static Data tab available at the bottom of the screen. Dragging the splitter bar (line that separates the Flags/Static data from SBS values) changes the height of the Flags/Static Data display. Selecting |View| then |Auto Arrange| returns the splitter bar to its original location. 8.2 Setting Programmable bq20z70 and bq29330 Options The bq20z70 data flash comes configured per the default settings detailed in the bq20z70 data sheet (SLUS686). Ensure that the settings are correctly changed to match the pack and application for the bq20z70/bq29330 solution being evaluated. IMPORTANT: The correct setting of these options is essential to get the best performance. 12 bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Operation www.ti.com The settings can be configured using the Data Flash screen. Figure 9. Data Flash Screen, 1st Level Safety Class To read all the data from the bq20z70 data flash, click on menu option | Data Flash | Read All |. To write to a data flash location, click on the desired location, enter the data, and press , which writes the entire tab of flash data, or select menu option |Data Flash|Write All|. The data flash must be read before any writes are performed to avoid any incorrect data being written to the device. The | File | Special Export | menu options allows the data flash to be exported, but it configures the exported data flash to a learned state ready for mass production use. The data flash configuration can be saved to a file by selecting | File | Export |, and entering a file name. A data flash file can also be retrieved in this way, imported, and written to the bq20z70 using the | Write All | button. The configuration information of the bq29330 and module calibration data is also held in the bq20z70 data flash. SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module Copyright © 2006–2013, Texas Instruments Incorporated 13 Calibration Screen www.ti.com The bq20z70 allows for an automatic data flash export function, similar to the SBS Data logging function. This feature, when selected via | Options | Auto Export |, exports Data Flash to a sequential series of files named as FilenameNNNNN.gg where N = a decimal number from 0 to 9. The AutoExport interval is set under the | Options menu | with a minimum value of 15 seconds. The AutoExport filename is also set under the | Options menu |. When there is a check next to | AutoExport |, the AutoExport is in progress. The same menu selection is used to turn on/off AutoExport. If the data flash screen is blank, then the bq20z70 that is being used may not be supported by the bqEVSW version that is being used. An upgrade may be required. 9 Calibration Screen 9.1 How to Calibrate Before the bq20z70 is calibrated: • Connect a load to Pack- and Pack+ that draws approximately 2 A and measures discharge current to use the FETs. • Connect a current source to Batt- and Pack- to calibrate without using the FETs. • Measure the pack voltage from Batt+ to Batt- (Total of Cell voltages). • Measure the temperature of the pack. • These steps may or may not be required, depending on the type of calibration being performed. 9.2 To Calibrate the bq20z70 Select the types of calibration to be performed. Enter the measured values for the types selected (Except for CC Offset Calibration). If Voltage Calibration is selected, then enter the number of cells on the pack. If Temperature Calibration is selected, then select the sensor that is to be calibrated. If the load is connected between Pack+ and Pack-, then select the Use FETs check box. Press the Calibrate Part button. 9.3 Board Offset Calibration This performs the offset calibration for the current offset of the board. Remove load/external voltage. Press the Software Board Offset Calibration button. 9.4 Pack Voltage Calibration This calibrates the voltage at the AFE Pack pin. Make sure Voltage Calibration has been performed for the pack. If Voltage Calibration is not performed, then Pack Voltage Calibration calibrates incorrectly. Remove load/external voltage applied between Pack+ and Pack-. Press the Pack Voltage button to calibrate. 14 bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Calibration Screen www.ti.com Figure 10. Calibration Screen SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module Copyright © 2006–2013, Texas Instruments Incorporated 15 Pro (Advanced) Screen 10 www.ti.com Pro (Advanced) Screen 10.1 SMB Communication The set of read/write operations over SMBus are not specific to any gas gauge. These are provided as general-purpose communication tools. 10.2 Hex/Decimal Converter These two boxes convert between hexadecimal (hex) and decimal as soon as values are typed into the boxes. Invalid values may cause erroneous results. When scaling converted hex values to a higher number of bytes, follow these rules: • When unsigned is selected, the left pad contains zeroes. • When signed is selected, the left pad contains zeroes for a positive number, or the left pad contains F for negative numbers. 10.3 Programming Allows for device reprogramming from unencrypted and encrypted files. Figure 11. Pro (Advanced) Screen 16 bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Related Documentation from Texas Instruments www.ti.com 11 Related Documentation from Texas Instruments To obtain a copy of any of the following TI document, call the Texas Instruments Literature Response Center at (800) 477-8924 or the Product Information Center (PIC) at (972) 644-5580. When ordering, identify this document by its title and literature number. Updated documents can also be obtained through the TI Web site at www.ti.com. Documents: bq20z70 Data Sheet bq20z70 Technical Reference bq29330 Data Sheet Literature Number: SLUS686 SLUU250 SLUS673 SLUU242B – May 2006 – Revised October 2013 Submit Documentation Feedback bq20z70EVM-001 SBS 1.1 Impedance Track™Technology Enabled Battery Management Solution Evaluation Module Copyright © 2006–2013, Texas Instruments Incorporated 17 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated
BQ20Z70EVM-001 价格&库存

很抱歉,暂时无法提供与“BQ20Z70EVM-001”相匹配的价格&库存,您可以联系我们找货

免费人工找货