BQ24003PWP



 www.ti.com SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004                        FEATURES D Highly Integrated Solution With FET Pass Transistor and Reverse-Blocking Schottky and Thermal Protection D Integrated Voltage and Current Regulation With Programmable Charge Current D High-Accuracy Voltage Regulation (±1%) D Ideal for Low-Dropout Linear Charger Designs for Single-Cell Li-Ion Packs With Coke or Graphite Anodes D Up to 1.2-A Continuous Charge Current D Safety-Charge Timer During Preconditioning and Fast Charge D Integrated Cell Conditioning for Reviving Deeply Discharged Cells and Minimizing Heat Dissipation During Initial Stage of Charge D Optional Temperature or Input-Power Monitoring Before and During Charge D Various Charge-Status Output Options for Driving Single, Double, or Bicolor LEDs or Host-Processor Interface D Charge Termination by Minimum Current and Time D Low-Power Sleep Mode D Packaging: 5 mm × 5 mm MLP or 20-Lead TSSOP PowerPAD APPLICATIONS D D D D PDAs Internet Appliances MP3 Players Digital Cameras DESCRIPTION The bq2400x series ICs are advanced Li-Ion linear charge management devices for highly integrated and space-limited applications. They combine highaccuracy current and voltage regulation; FET passtransistor and reverse-blocking Schottky; battery conditioning, temperature, or input-power monitoring; charge termination; charge-status indication; and charge timer in a small package. The bq2400x measures battery temperature using an external thermistor. For safety reasons, the bq2400x inhibits charge until the battery temperature is within the user-defined thresholds. Alternatively, the user can monitor the input voltage to qualify charge. The bq2400x series then charge the battery in three phases: preconditioning, constant current, and constant voltage. If the battery voltage is below the internal low-voltage threshold, the bq2400x uses low-current precharge to condition the battery. A preconditioning timer is provided for additional safety. Following preconditioning, the bq2400x applies a constant-charge current to the battery. An external sense-resistor sets the magnitude of the current. The constant-current phase is maintained until the battery reaches the charge-regulation voltage. The bq2400x then transitions to the constant voltage phase. The user can configure the device for cells with either coke or graphite anodes. The accuracy of the voltage regulation is better than ±1% over the operating junction temperature and supply voltage range. Charge is terminated by maximum time or minimum taper current detection The bq2400x automatically restarts the charge if the battery voltage falls below an internal recharge threshold. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments.    !"#  $%&# "  '%
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 www.ti.com SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION PACKAGE TJ 20-LEAD HTTSOP PowerPAD (PWP)(1) 20-LEAD 5 mm × 5 mm MLP (RGW)(2) CHARGE STATUS CONFIGURATION bq24001PWP bq24001RGW Single LED bq24002PWP bq24002RGW 2 LEDs −40°C −40 C to 125 125°C C bq24003PWP bq24003RGW Single bicolor LED (1) The PWP package is available taped and reeled. Add R suffix to device type (e.g. bq24001PWPR) to order. Quantities 2500 devices per reel. (2) The RGW package is available taped and reeled. Add R suffix to device type (e.g. bq24001RGWR) to order. Quantities 3000 devices per reel. PACKAGE DISSIPATION RATINGS PACKAGE ΘJA ΘJC TA ≤ 25°C POWER RATING PWP(1) RGW(2) 30.88°C/W 1.19°C/W 3.238 W DERATING FACTOR ABOVE TA = 25°C 0.0324W/°C 31.41°C/W 1.25°C/W 3.183 W 0.0318W/°C (1) This data is based on using the JEDEC high-K board and topside traces, top and bottom thermal pad (6.5 × 3.4 mm), internal 1 oz power and ground planes, 8 thermal via underneath the die connecting to ground plane. (2) This data is based on using the JEDEC high-K board and topside traces, top and bottom thermal pad (3.25 × 3.25 mm), internal 1 oz power and ground planes, 9 thermal via underneath the die connecting to ground plane. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) bq24001 bq24002 bq24003 Supply voltage (Vcc with respect to GND) 13.5 V Input voltage (IN, ISNS, EN, APG/THERM/CR/STAT1/STAT2, VSENSE, TMR SEL, VSEL) (all with respect to GND) 13.5 V Output current (OUT pins) 2A Output sink/source current (STAT1 and STAT2) 10 mA Operating free-air temperature range, TA −40°C to 70°C Storage temperature range, Tstg −65°C to 150°C Junction temperature range, TJ −40°C to 125°C Lead temperature (Soldering, 10 sec) 300°C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS MIN MAX Supply voltage, VCC 4.5 10 V Input voltage, VIN 4.5 10 V 1.2 A −40 125 °C Continuous output current Operating junction temperature range, TJ 2 UNIT 


 www.ti.com SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating junction temperature supply and input voltages, and VI (VCC) ≥ VI (IN) ( unless otherwise noted) PARAMETER TEST CONDITIONS VCC current VCC current, standby mode VCC > VCC_UVLO, EN ≤ VIL(EN) IN current, standby mode EN ≤ VIL(EN) MIN TYP EN ≤ VIH(EN) MAX 1 VOUT = 4.3 V, VOUT = 4.3 V, mA µA 1 10 Standby current (sum of currents into OUT VCC < VCC_UVLO, and VSENSE pins) EN 90%) OFF ON (LOW) Sleep-mode OFF OFF APG/Therm invalid OFF OFF Thermal shutdown OFF Battery absent OFF OFF OFF(1) (1) If thermistor is used, then the Green LED is off. Table 3. bq24003 (Single Bicolor LED) LED1 (RED) LED2 (GREEN) APPARENT COLOR Precharge ON (LOW) OFF (HIGH) RED Fast charge ON (LOW) OFF (HIGH) RED FAULT ON (LOW) ON (LOW) YELLOW CHARGE STATE Done (>90%) OFF (HIGH) ON (LOW) GREEN Sleep-mode OFF (HIGH) OFF (HIGH) OFF APG/Therm invalid OFF (HIGH) OFF (HIGH) OFF Thermal shutdown OFF (HIGH) OFF (HIGH) OFF Battery absent OFF (HIGH) OFF (HIGH)(1) OFF(1) (1) If thermistor is used, then the Green LED is off. Thermal Shutdown The bq2400x monitors the junction temperature TJ of the DIE and suspends charging if TJ exceeds 165°C. Charging resumes when TJ falls below 155°C. DETAILED DESCRIPTION POWER FET VOLTAGE SENSE The integrated transistor is a P-channel MOSFET. The power FET features a reverse-blocking Schottky diode, which prevents current flow from OUT to IN. To achieve maximum voltage regulation accuracy, the bq2400x uses the feedback on the VSENSE pin. Externally, this pin should be connected as close to the battery cell terminals as possible. For additional safety, a 10kΩ internal pullup resistor is connected between the VSENSE and OUT pins. An internal thermal-sense circuit shuts off the power FET when the junction temperature rises to approximately 165°C. Hysteresis is built into the thermal sense circuit. After the device has cooled approximately 10°C, the power FET turns back on. The power FET continues to cycle off and on until the fault is removed. CURRENT SENSE The bq2400x regulates current by sensing, on the ISNS pin, the voltage drop developed across an external sense resistor. The sense resistor must be placed between the supply voltage (Vcc) and the input of the IC (IN pins). ENABLE (EN) The logic EN input is used to enable or disable the IC. A high-level signal on this pin enables the bq2400x. A low-level signal disables the IC and places the device in a low-power standby mode. 17 


 www.ti.com SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004 THERMAL INFORMATION THERMALLY ENHANCED TSSOP-20 DIE The thermally enhanced PWP package is based on the 20-pin TSSOP, but includes a thermal pad (see Figure 20) to provide an effective thermal contact between the IC and the PWB. Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO220-type packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages, however, suffer from several shortcomings: they do not address the very low profile requirements (