User's Guide
SLVU495B – July 2011 – Revised January 2012
600-kHz Synchronous Switch-Mode Li-Ion and Li-Polymer
Host-Controlled Battery Charger With Integrated
MOSFETs
1
2
3
4
Contents
Introduction .................................................................................................................. 2
1.1
EVM Features ...................................................................................................... 2
1.2
General Description ................................................................................................ 2
1.3
I/O Description ...................................................................................................... 2
1.4
Control and Key Parameters Setting ............................................................................ 2
1.5
Recommended Operating Conditions ........................................................................... 3
Test Summary ............................................................................................................... 4
2.1
Definitions ........................................................................................................... 4
2.2
Safety ................................................................................................................ 4
2.3
Quality ............................................................................................................... 4
2.4
Apparel .............................................................................................................. 4
2.5
Equipment ........................................................................................................... 4
2.6
Equipment Setup ................................................................................................... 5
2.7
Procedure ........................................................................................................... 5
PCB Laout Guideline ....................................................................................................... 7
Bill of Materials, Board Layouts and Schematics ....................................................................... 7
4.1
Bill of Materials ..................................................................................................... 7
4.2
Board Layout ....................................................................................................... 9
4.3
Schematic ......................................................................................................... 12
List of Figures
.......................................................................
1
Original Test Setup for HPA624 (bq24130EVM)
2
Top Assembly ............................................................................................................... 9
3
Top Layer .................................................................................................................... 9
4
Second Layer .............................................................................................................. 10
5
Third Layer ................................................................................................................. 10
6
Bottom Assembly .......................................................................................................... 11
7
Bottom Layer ............................................................................................................... 11
8
bq24130 EVM Schematic
................................................................................................
5
12
List of Tables
1
I/O Description............................................................................................................... 2
2
Control and Key Parameters Setting ..................................................................................... 2
3
Recommended Operating Conditions .................................................................................... 3
4
Bill of Materials .............................................................................................................. 7
SLVU495B – July 2011 – Revised January 2012
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600-kHz Synchronous Switch-Mode Li-Ion and Li-Polymer Host-Controlled
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1
Introduction
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1
Introduction
1.1
EVM Features
•
•
•
•
•
•
•
•
1.2
Evaluation Module for bq24130
Synchronous Switch-Mode Battery Charge, Host-Controlled Charger
Integrated 20 V N-MOSFETs
CELL pin setting up to 12.6 V Battery Voltage; 1, 2, or 3-cell with 4.2 V/cell
Input Operating Range 5.5 V–17 V
LED Indication for Charge Status
Test Points for Key Signals Available for Testing Purpose—Easy Probe Hook-up
Jumpers Available—Easy to Change Setting
General Description
The bq24130 is highly integrated host-controlled Li-ion and Li-polymer switch-mode battery charge
controllers with two integrated N-channel power MOSFETs. It offers a constant-frequency synchronous
PWM controller with high accuracy regulation of charge current and voltage. It also provides charge status
monitoring.
The bq24130 automatically enters a low-quiescent current sleep mode when the input voltage falls below
the battery voltage. The bq24130 charges one, two or three cell (selected by CELL pin), supporting up to
4A charge current. The bq24130 is available in a 20-pin, 3.5×4.5 mm2 thin QFN package.
For details, see bq24130 data sheet (SLUSAN2).
1.3
I/O Description
Table 1. I/O Description
1.4
Jack
Description
J1 – VIN
Positive input
J1 – PGND
Negative input
J2 – VBAT
Connected to charger output
J2 – PGND
Ground
J3 – CMOD
Charge mode selection
J3 – CE
Charge enable
J3–TS_EXT
Temperature qualification voltage Input
Control and Key Parameters Setting
Table 2. Control and Key Parameters Setting
2
Jack
Description
Factory Setting
JP1
Select external TS input or internal valid TS setting
IN 1-2 : External TS input
IN 2-3 : Internal valid TS setting
Jumper ON 1-2 (external TS)
JP2
The pull-up power source supplies the LED when JP5 ON. LED has no
power source when JP5 OFF.
Jumper ON (LED power available)
JP3
CELL selection
IN 2-3 : CELL-GND, 1CELL
IN 2-1 : CELL-VREF, 3CELL
IN OPEN: CELL- FLOAT, 2CELL
Jumper ON 2-1 (3 CELL)
JP4
Charge mode selection:
IN ON: CMOD-GND for pre-charge set by ISET2
IN OFF: CMOD-VREF for fast charge set by ISET1
Jumper ON ( Pre-charge setting )
600-kHz Synchronous Switch-Mode Li-Ion and Li-Polymer Host-Controlled
Battery Charger With Integrated MOSFETs
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Introduction
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Table 2. Control and Key Parameters Setting (continued)
1.5
Jack
Description
Factory Setting
JP5
Charger enable/disable setting. ISET is pulled to GND and the charger is
disabled when JP5 OPEN; charger is enable when JP5 ON.
Jumper OPEN (disable charger)
Recommended Operating Conditions
Table 3. Recommended Operating Conditions
Symbol
Description
Min
Max
Unit
Supply voltage, VBUS
Input voltage
5.5
17
V
Battery voltage, VBAT
Voltage applied at VBAT terminal of J2
0
12.6
V
Supply current
Maximum input current
0
4
A
Charge current, Ichrg
Battery charge current
0
Operating junction
temperature range, TJ
Typ
2
0
4
A
125
°C
Notes
The bq24130 EVM board requires a regulated supply approximately 1V minimum above the regulated
voltage of the battery pack to a maximum input voltage of 17 VDC. The bq24130 uses CELL pin to select
number of cells with a fixed 4.2V/cell. Connecting CELL to AGND gives 1 cell, floating CELL pin gives 2
cell configure, and connecting to VREF gives 3 cells configure. CELL pin adjusts internal resistor voltage
divider from BAT pin to AGND pin for voltage feedback and regulate to internal 2.1V voltage reference.
CELL Pin
Voltage Regulation
AGND
4.2V
Floating
8.4V
VREF
12.6V
The default setting is 12.6V for BAT voltage.
A low-level signal on the CMOD pin forces the IC to charge at the pre-charge rate set on the ISET2 pin. A
high-level signal forces charge at fast-charge rate as set by the ISET1 pin. If the battery reaches the
voltage regulation level, the IC transitions to voltage regulation phase regardless of the status of the
CMOD input.
The ISET1 input sets the maximum charging current. Battery current is sensed by current sensing resistor
RSR connected between SRP and SRN. The full-scale differential voltage between SRP and SRN is
40mV max. The equation for charge current is:
VISET1
ICHARG E =
20 ´ R7
(1)
The precharge current is determined by the voltage on the ISET2 pin according to the formula
VISET2
IPRECHARGE =
100 ´ R7
(2)
The default setting is 2ADC for fast charge current and 0.2ADC for pre-charge current.
SLVU495B – July 2011 – Revised January 2012
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3
Test Summary
2
Test Summary
2.1
Definitions
www.ti.com
This procedure details how to configure the HPA624 evaluation board. On the test procedure the following
naming conventions are followed.
VXX:
LOADW;
V(TPyYy):
External voltage supply name (VIN, VBAT, VTS)
External load name (LOADR, LOADI)
Voltage at internal test point TPyyy. For example, V(TP1) means the voltage at
TP1.
V(Jxx):
Voltage at jack terminal Jxx.
V(TP(XXX)):
Voltage at test point “XXX”. For example, V(REGN) means the voltage at the test
point which is marked as “REGN”.
V(XXX, YYY):
Voltage across point XXX and YYY.
I(JXX(YYY)):
Current going out from the YYY terminal of jack XX.
Jxx(BBB):
Terminal or pin BBB of jack xx
Jxx ON:
Internal jumper Jxx terminals are shorted
Jxx OFF:
Internal jumper Jxx terminals are open
Jxx (-YY-) ON: Internal jumper Jxx adjacent terminals marked as “YY” are shorted
Measure → A,B Check specified parameters A, B. If measured values are not within specified limits
the unit under test has failed.
Observe → A,B Observe if A, B occur. If they do not occur, the unit under test has failed.
Assembly drawings have location for jumpers, test points and individual components.
2.2
Safety
•
•
•
•
2.3
Quality
•
2.4
Electrostatic smock
Electrostatic Gloves or finger cots
Safety Glasses
Ground ESD wrist strap
Equipment
•
•
•
4
Test data shall be made available upon request by Texas Instruments.
Apparel
•
•
•
•
2.5
Safety Glasses are to be worn.
This test must be performed by qualified personnel trained in electronics theory and understand the
risks and hazards of the assembly to be tested.
ESD precautions must be followed while handling electronic assemblies while performing this test.
Precautions should be observed to avoid touching areas of the assembly that may get hot or present a
shock hazard during testing.
Power Supplies
Power Supply #1 (PS#1): a power supply capable of supplying 30-V at 5-A is required.
Loads
LOAD #1 A 20V (or above), 3A (or above) electronic load that can operate at constant current and
constant voltage mode.
Meters
Five Fluke 75 multi-meters, (equivalent or better)
600-kHz Synchronous Switch-Mode Li-Ion and Li-Polymer Host-Controlled
Battery Charger With Integrated MOSFETs
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Test Summary
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Or: Four equivalent voltage meters and three equivalent current meters.
The current meters must be capable of measuring 5A+ current.
2.6
Equipment Setup
•
•
•
•
•
•
Set the power supply #1 (PS#1) for 16V ± 200mV, 2A ± 0.1A current limit and then turn off supply.
Connect the output of PS#1 in series with a current meter (multi-meter) to J1 (VIN, GND).
Connect a voltage meter across J1 (VIN, PGND).
Connect Load #1 in series with a current meter to J2 (VBAT, PGND). Turn off Load #1.
Connect a voltage meter across J2 (VBAT, PGND).
Check all jumper shunts. JP1: connect 1-2 (External TS); JP2: ON; JP3: connect 1-2 (3-cell); JP4: ON;
JP5: OPEN.
BQ24130EVM
HPA624
J1
Iin
Power supply
#1
TP1
SW
I
VIN
V
PGND
J2
U1
VBAT
Iout
GND
APPLICATION CIRCUIT
I
Load #1
V
J3
CMOD
SETTINGS
JP2
JP4
JP1
JP3
JP5
/CE
TS_EXT
TEST POINTS
Figure 1. Original Test Setup for HPA624 (bq24130EVM)
2.7
Procedure
Make sure EQUIPMENT SETUP steps are followed.
1. Disconnect LOAD #1. Turn on PS#1
Measure → V(J2(VBAT)) = 0.5V ± 500mV
Measure → V(TP(VREF)) = 3.3V ± 200mV
Measure → V(TP(REGN)) = 0.5V ± 500mV
2. Charger Enable
Connect 2-3 of JP1 (Internal TS); Short JP4 (Charger Enable)
Measure → V(TP(VREF)) = 3.3V ± 200mV
Measure → V(TP(REGN)) = 6V ± 200mV
Measure → V(J2(VBAT))=12.6V ± 200mV
3. Charge Voltage Setting
Connect 2-3 of JP3
Measure → V(J2(VBAT))=4.2V ± 200mV
Disconnect JP3
Measure → V(J2(VBAT))=8.4V ± 200mV
4. Charge Current Regulation and Battery Temperature Qualification
Reconnect 1-2 of JP3
Reconnect LOAD#1. Turn on. Use the constant voltage mode. Set the output voltage to be 10V.
Measure → I(J2(VBAT)) = 0.2A ± 100mA
SLVU495B – July 2011 – Revised January 2012
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Test Summary
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Observe → D1 (STAT) ON
Open JP4 (set fast charge)
Measure → I(J2(VBAT)) = 2A ± 200mA
Observe → D1 (STAT) ON
Open 2-3 of JP1 (external TS)
Measure → I(J2(VBAT)) = 0A ± 100mA
Observe → D1 (STAT) BLINK
Connect 2-3 of JP1 (Internal TS)
Measure → I(J2(VBAT)) = 2A ± 200mA
Observe → D1 (STAT) ON
5. Charge Voltage Regulation
Observe → I(J2(VBAT)) decreases from 2A while V(J2(VBAT)) becomes constant.
6. Test Complete
Turn off the power supply and remove all connections from the unit under test (UUT).
6
600-kHz Synchronous Switch-Mode Li-Ion and Li-Polymer Host-Controlled
Battery Charger With Integrated MOSFETs
SLVU495B – July 2011 – Revised January 2012
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PCB Laout Guideline
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3
PCB Laout Guideline
1. It is critical that the exposed thermal pad on the backside of the BQ24130 package be soldered to the
PCB ground. Make sure there are sufficient thermal vias right underneath the IC, connecting to the
ground plane on the other layers.
2. The control stage and the power stage should be routed separately. At each layer, the signal ground
and the power ground are connected only at the thermal pad.
3. Charge current sense resistor must be connected to SRP, SRN with a Kelvin contact. The area of this
loop must be minimized. The decoupling capacitors for these pins should be placed as close to the IC
as possible.
4. Decoupling capacitors for VREF, AVCC, REGN should make the interconnections to the IC as short as
possible.
5. Decoupling capacitors for BAT must be placed close to the corresponding IC pins and make the
interconnections to the IC as short as possible.
6. Decoupling capacitor(s) for the charger input must be placed very close to SW and PGND.
7. Take the EVM layout for design reference.
4
Bill of Materials, Board Layouts and Schematics
4.1
Bill of Materials
Table 4. Bill of Materials
Count
RefDes
Value
Description
Size
Part Number
MFR
1
C1
2.2 µF
Capacitor, Ceramic, 25V, X7R, 10%
805
STD
STD
3
C11,C12,
C17
0.1 µF
Capacitor, Ceramic, 50V, X7R, 10%
603
STD
STD
0
C13
NONE
Capacitor, Ceramic, 50V, X7R, 10%
603
STD
STD
2
C14, C16
1.0 µF
Capacitor, Ceramic, 16V, X7R, 10%
805
STD
STD
0
C15
NONE
Capacitor, Ceramic, 16V, X7R, 10%
805
STD
STD
2
C2, C3
4.7 µF
Capacitor, Ceramic, 25V, X7R, 10%
805
STD
STD
2
C4, C10
1.0 µF
Capacitor, Ceramic, 25V, X7R, 10%
805
STD
STD
0
C5
NONE
Capacitor, Ceramic, Low Inductance, 50V, X7R,
10%
603
STD
STD
1
C6
47 nF
Capacitor, Ceramic, 50V, X7R, 10%
603
STD
STD
2
C7, C8
10 µF
Capacitor, Ceramic, 25V, X7R, 10%
1206
STD
STD
1
C9
1 µF
Capacitor, Ceramic, 25V, X7R, 10%
805
STD
STD
1
D1
PDS1040
Diode, Schottky Barrier, 10A, 40V
Power DI 5
PDS1040-13
Diodes
1
D2
BAT54XV2T1G
Diode, Schottky, 10 mA, 30 V
SOD523
BAT54XV2T1G
On Semi
0
D3
B220A
Diode, Schottky, 20V, 2A
SMA
B220A-13-F
Diodes
1
D4
Green
Diode, LED, Green, 2.1V, 20mA, 6mcd
603
LTST-C190GKT
Lite On
0
D5
BAT54XV2T1G
Diode, Schottky, 10 mA, 30 V
SOD523
BAT54XV2T1G
On Semi
1
J1, J2
ED120/2DS
Terminal Block, 2-pin, 15-A, 5.1mm
0.40 x 0.35 inch
ED120/2DS
OST
1
J3
ED555/3DS
Terminal Block, 3-pin, 6-A, 3.5mm
0.41 x 0.25 inch
ED555/3DS
OST
3
JP2, JP4,
JP5
PEC02SAAN
Header, 2 pin, 100mil spacing
0.100 inch x 2
PEC02SAAN
Sullins
2
JP1, JP3
PEC03SAAN
Header, 3 pin, 100mil spacing
0.100 inch x 3
PEC03SAAN
Sullins
1
L1
6.8uH
Inductor, SMT, 8A, 21milliohm
0.400 x 0.453 inch
HLP4040DZER6R8M01
Vishay
1
Q1
2N7002-7-F
MOSFET, N-ch, 60V, 115mA, 1.2Ohms
SOT23
2N7002-7-F
Diodes Inc
2
R10, R14
0
Resistor, Chip, 1/16W, 1%
603
STD
STD
1
R11
100
Resistor, Chip, 1/16W, 1%
603
STD
STD
1
R12
30.1k
Resistor, Chip, 1/16W, 1%
603
STD
STD
2
R13, R5
10k
Resistor, Chip, 1/16W, 1%
603
STD
STD
1
R15
232k
Resistor, Chip, 1/16W, 1%
603
STD
STD
1
R16
154k
Resistor, Chip, 1/16W, 1%
603
STD
STD
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Bill of Materials, Board Layouts and Schematics
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Table 4. Bill of Materials (continued)
Count
RefDes
Value
Description
Size
Part Number
MFR
2
R17, R18
100k
Resistor, Chip, 1/16W, 1%
603
STD
STD
1
R19
4.99k
Resistor, Chip, 1/16W, 1%
603
STD
STD
2
R2, R3
3.9
Resistor, Chip, 1/4W, 5%
1206
STD
STD
1
R20
32.4k
Resistor, Chip, 1/16W, 1%
603
STD
STD
1
R4
10
Resistor, Chip, 1/10W, 1%
805
STD
STD
0
R6
NONE
Resistor, Chip, 1/16W, 1%
805
STD
STD
1
R7
0.01
Resistor, Chip, 1/2 watt, 1.0%
1206
WSL1206R0100FEA
Vishay
1
R8
0
Resistor, Chip, 1/16W, 5%
603
STD
STD
1
R9
5.23k
Resistor, Chip, 1/16W, 1%
603
STD
STD
0
SH1
None
Short jumper
1
TP
131-4244-00
Adaptor, 3.5-mm probe clip ( or 131-5031-00)
0.200 inch
131-4244-00
Tektronix
1
TP1
VCC
Test Point, White, Thru Hole Color Keyed
0.100 x 0.100 inch
5002
Keystone
0
TP2, TP4,
TP5
NONE
Test Point, White, Thru Hole Color Keyed
0.02 x 0.02 inch
STD
STD
1
TP3
VREF
Test Point, White, Thru Hole Color Keyed
0.100 x 0.100 inch
5002
Keystone
1
TP6
REGN
Test Point, White, Thru Hole Color Keyed
0.100 x 0.100 inch
5002
Keystone
1
TP7
TS
Test Point, White, Thru Hole Color Keyed
0.100 x 0.100 inch
5002
Keystone
1
TP8
GND
Test Point, Black, Thru Hole Color Keyed
0.100 x 0.100 inch
5001
Keystone
1
TP9
STAT
Test Point, White, Thru Hole Color Keyed
0.100 x 0.100 inch
5002
Keystone
1
TP10
CELL
Test Point, White, Thru Hole Color Keyed
0.100 x 0.100 inch
5002
Keystone
1
TP11
CMOD
Test Point, White, Thru Hole Color Keyed
0.100 x 0.100 inch
5002
Keystone
1
TP12
ISET1
Test Point, White, Thru Hole Color Keyed
0.100 x 0.100 inch
5002
Keystone
1
TP13
ISET2
Test Point, White, Thru Hole Color Keyed
0.100 x 0.100 inch
5002
Keystone
1
U1
BQ24130RHL
IC, 1.6-MHz High Efficiency Synchronous
Switch-Mode Li-Ion and Li-Polymer Battery
Charger
VQFN
BQ24130RHL
TI
1
—
PCB, 2.500 In X 2.500 In x 0.0062 In
2.500 In X 2.500 In
HPA624
Any
929950-00
3M/ESD
4
929950-00
Shorting jumper, 2-pin, 100mil spacing
Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components.
8
600-kHz Synchronous Switch-Mode Li-Ion and Li-Polymer Host-Controlled
Battery Charger With Integrated MOSFETs
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4.2
Board Layout
TEXAS
INSTRUMENTS
Figure 2. Top Assembly
Figure 3. Top Layer
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Bill of Materials, Board Layouts and Schematics
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Figure 4. Second Layer
Figure 5. Third Layer
10
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Bill of Materials, Board Layouts and Schematics
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Figure 6. Bottom Assembly
Figure 7. Bottom Layer
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Bill of Materials, Board Layouts and Schematics
4.3
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Schematic
Figure 8. bq24130 EVM Schematic
12
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Evaluation Board/Kit Important Notice
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION
PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the
product(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided are
not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations,
including product safety and environmental measures typically found in end products that incorporate such semiconductor
components or circuit boards. This evaluation board/kit does not fall within the scope of the European Union directives regarding
electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and therefore may not meet the
technical requirements of these directives or other related directives.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30
days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY
SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING
ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all
claims arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to
take any and all appropriate precautions with regard to electrostatic discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER
FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of
patents or services described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the
product. This notice contains important safety information about temperatures and voltages. For additional information on TI’s
environmental and/or safety programs, please contact the TI application engineer or visit www.ti.com/esh.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used.
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION
PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and
can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15
of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this
equipment in other environments may cause interference with radio communications, in which case the user at his own expense
will be required to take whatever measures may be required to correct this interference.
EVM Warnings and Restrictions
It is important to operate this EVM within the input voltage range of 18 V to 22 V and the output voltage range of 0 V to 18 V .
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are
questions concerning the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the
EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load
specification, please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than 60°C. The EVM is designed to
operate properly with certain components above 125°C as long as the input and output ranges are maintained. These components
include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of
devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near
these devices during operation, please be aware that these devices may be very warm to the touch.
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