User's Guide
SLUU321C – June 2008 – Revised June 2011
bq24150/150A/151/151A/152 YFF EVM (HPA256)
1
2
3
4
Contents
Introduction .................................................................................................................. 1
1.1
EVM Features ...................................................................................................... 1
1.2
General Description ................................................................................................ 2
1.3
I/O Description ...................................................................................................... 2
1.4
Control and Key Parameters Setting ............................................................................ 2
1.5
Recommended Operating Conditions ........................................................................... 2
Test Summary ............................................................................................................... 3
2.1
Definitions ........................................................................................................... 3
2.2
Equipment ........................................................................................................... 3
2.3
Equipment Setup ................................................................................................... 4
2.4
Procedure ........................................................................................................... 5
PCB Layout Guideline ...................................................................................................... 6
Bill of Materials, Board Layout and Schematics ........................................................................ 8
4.1
Bill of Materials ..................................................................................................... 8
4.2
Board Layout ...................................................................................................... 10
4.3
Schematic ......................................................................................................... 12
List of Figures
1
Connections of the HPA172 Kit ........................................................................................... 4
2
Original Test Setup for HPA256 (bq2415x EVM) ....................................................................... 5
3
The Main Window of the bq2415x Evaluation Software (For bq24150/150A/151/151A/152)..................... 5
4
Test setup for HPA256
5
Top Layer ................................................................................................................... 10
6
Bottom Layer ............................................................................................................... 10
7
Top Assembly .............................................................................................................. 11
8
Top Silk ..................................................................................................................... 11
....................................................................................................
6
List of Tables
1
Factory Jumper Settings ................................................................................................... 4
1
Introduction
1.1
EVM Features
•
•
•
•
•
•
•
Evaluation Module For BQ24150/150A/151/151A/152 in chipscale (YFF) package
High Efficiency Fully Integrated NMOS-NMOS Synchronous Buck Charger With 3MHz Frequency
Integrated Power FETs for Up To 1.25-A Charge Rate
Programmable Battery Voltage, Charge Current, and Input Current via I2C Interface
Input Operating Range 4 V–6 V
Boost Mode Operation for USB OTG
LED Indication for Status Signals
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
1
Introduction
•
•
1.2
www.ti.com
Test Points for Key Signals Available for Testing Purpose. Easy Probe Hook-up
Jumpers Available. Easy to Change Connections.
General Description
The BQ24150/150A/151/151A/152 evaluation module is a complete charger module for evaluating
compact, flexible, high-efficiency, USB-friendly switch-mode charge management solution for single-cell
Li-ion and Li-polymer batteries used in a wide range of portable applications.
The BQ24150/150A/151/151A/152 integrates a synchronous PWM controller, power MOSFETs, input
current sensing, high-accuracy current and voltage regulation, and charge termination, into a small WCSP
package.
The charge parameters can be programmed through an I2C interface.
For details, see the appropriate data sheets (SLUS824, SLUS847, SLUSA27, and SLUS931).
1.3
1.4
1.5
I/O Description
Jack
Description
J1–DC+
AC adapter or USB, positive output
J1–DC–
AC adapter or USB, negative output
J2–BAT–
Battery negative terminal, connect to DC-
J2-AUXPWR/CD
Connect to AUXPWR pin or CD pin
J2-BAT+
Charger positive output, connect to CSOUT pin
J3–SCL
I2C clock, connect to SCL pin
J3–SDA
I2C data, connect to SDA pin
J3–DC–
AC adapter or USB, negative output
J4–STAT
Status output, can be connected to STAT pin by JMP1 set to EXT (2-3)
J4–OTG/SLRST
Connect to OTG/SLRST pin
J4–DC–
AC adapter or USB, negative output
Control and Key Parameters Setting
Jack
Description
Factory Setting
JMP1
LED 1-2: Connect STAT pin to LED on EVM
EXT 2-3: Connect STAT pin to J4-1
Jumper On LED (1-2)
JMP2
HI 1-2: OTG or SLRST high (input or battery voltage)
LO 2-3: OTG or SLRST low (ground)
JMP3
J2-BAT+ connect to J2-AUXPWR/CD
JMP4
AUXPWR/CD pin connect to high or low or float
JMP5
OTG/SLRST pin 10k resistor to ground or float
Jumper ON
Recommended Operating Conditions
Min
Typ
Max
4
5
6
V
Battery voltage, VBAT Voltage applied at VBAT terminal of J8
0
3-4.2
4.44
V
Supply current, IAC
Maximum input current from ac adapter input
0 0.1–0.5
1.5
A
Charge current, Ichrg
Battery charge current
Supply voltage, VIN
Input voltage from ac adapter input
Operating junction temperature range, TJ
2
See Table 1
0.55
0
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
0.7
Unit
1.25
A
125
°C
Notes
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
Test Summary
www.ti.com
2
Test Summary
2.1
Definitions
This procedure details how to configure the HPA256 evaluation board. On the test procedure the following
naming conventions are followed. Refer to the HPA256 schematic for details.
VXXX :
LOADW:
V(TPyyy):
V(Jxx):
V(TP(XXX)):
V(XXX, YYY):
I(JXX(YYY)):
Jxx(BBB):
Jxx ON :
Jxx OFF:
Jxx (-YY-)
Measure: → A,B
Observe → A,B
External voltage supply name (VADP, VBT, VSBT)
External load name (LOADR, LOADI)
Voltage at internal test point TPyyy. For example, V(TP12) means the voltage at
TP12.
Voltage at jack terminal Jxx
Voltage at test point “XXX”. For example, V(ACDET) means the voltage at the test
point which is marked as “ACDET”.
Voltage across point XXX and YYY.
Current going out from the YYY terminal of jack XX.
Terminal or pin BBB of jack xx
Internal jumper Jxx terminals are shorted
Internal jumper Jxx terminals are open
ON: Internal jumper Jxx adjacent terminals marked as “YY” are shorted
Check specified parameters A, B. If measured values are not within specified limits
the unit under test has failed.
Observe if A, B occur. If they do not occur, the unit under test has failed.
Assembly drawings have location for jumpers, test points and individual components.
2.2
2.2.1
Equipment
POWER SUPPLIES
Power Supply #1 (PS#1): a power supply capable of supplying 5-V at 2-A is required.
2.2.2
LOAD #1
A 10V (or above), 2A (or above) electronic load that can operate at constant current mode.
2.2.3
LOAD #2
A HP 6060B 3-60V/0–60A, 300W system DC electronic load.
Or: equivalent
2.2.4
METERS
Four Fluke 75, (equivalent or better)
Or: Two equivalent voltage meters and two equivalent current meters. The current meters must be able to
measure 2A current.
2.2.5
COMPUTER
A computer with at least one USB port and a USB cable. The bq2415x evaluation software must be
properly installed.
2.2.6
HPA172 COMMUNICATION KIT
A HPA172 USB to I2C communication kit.
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
3
Test Summary
2.2.7
www.ti.com
SOFTWARE
Unzip BQ2415xSetup.zip and double click on the “SETUP.EXE” file. Follow the installation steps.
2.3
Equipment Setup
(A) Set the power supply #1 for 5V ± 100mV DC, 2.0 ± 0.1A current limit and then turn off supply.
(B) Connect the output of power supply #1 in series with a current meter (multimeter) to J1 (DC+, DC–).
(C) Connect a voltage meter across J1 (DC+, DC–).
(D) Connect the Load #2 in series with a current meter (multimeter) to J2 (BAT+, BAT–). Make sure a
voltage meter is connected across J2 (BAT+, BAT–). Turn on the Load #2. Use the constant voltage
mode. Set the output voltage to 2.5V.
(E) Turn off Load #2.
(F) Connect J5 to HPA172 kit by 10-pin ribbon cable. Connect the USB port of the HPA172 kit to the USB
port of the computer. The connections are shown in Figure 1.
I/O
USB Interface
Adapter
Texas Instruments
© 2006
USB
To
Computer
USB port
10-pin
Ribbon
Cable
To EVM
Figure 1. Connections of the HPA172 Kit
(G) Installed jumpers per Table 1
Table 1. Factory Jumper Settings
4
Spin
JMP1
JMP2
JMP3
JMP4
JMP5
HPA256-001
(bq24150)
(-LED-) ON
(-LO-) ON
ON
OFF
ON
HPA256-002
(bq24151)
(-LED-) ON
(-LO-) ON
ON
OFF
ON
HPA256-003
(bq24152)
(-LED-) ON
(-LO-) ON
ON
OFF
ON
HPA256-004
(bq24150A)
(-LED-) ON
(-LO-) ON
ON
OFF
ON
HPA256-005
(bq24151A)
(-LED-) ON
(-LO-) ON
ON
OFF
ON
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
Test Summary
www.ti.com
(H) After the steps above, the test setup is shown in Figure 2
BQ2415x
EVM
J2
JMP3
U1
J3
JMP4
D C-
J5
JMP2
OTG
S LRS T
JMP1
SC L
HPA172
Ribbon
Cable
V
Load
#2
JMP5
CIRCUIT
D1
USB
Cable
I
APPLICATION
DC+
DC -
ST AT
V
D C-
Iin
SD A
Power
supply #1
AUXPWR
CD
BAT -
J1
I
Ichrg
BAT+
J4
Figure 2. Original Test Setup for HPA256 (bq2415x EVM)
(I) Turn on the computer.
• Open the bq2415x evaluation software. The main window of the software is shown in Figure 3.
Figure 3. The Main Window of the bq2415x Evaluation Software (For bq24150/150A/151/151A/152)
2.4
Procedure
2.4.1
Charge Voltage and Current Regulation
1. Make sure the EQUIPMENT SETUP steps are followed. Turn on PS#1.
2. Software setup:
• Click Immediate Update Disabled button. It changes to Immediate Update Enabled. Check Auto
Reset Enable, set Rate to 5 seconds. Check Periodic Updates, set Rate to 1 second. Make sure
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
5
PCB Layout Guideline
www.ti.com
Operation Mode is Charger Mode. Uncheck Charge Current Termination. Check STAT Pin. Select
Battery Regulation Voltage to 4.20V.
Measure → V(J2(VBAT+, VBAT–)) = 4.2 ± 100mV
Observe → D1 is on.
3. Enable Load #2.
Measure → V(J2(VBAT+, VBAT–)) = 2.5 ± 100mV
Measure → Ichrg = 160mA ± 40mA
Measure → Iin = 93mA ± 5mA
4. Select Charge Current to 950mA, select Input Current Limit to 500mA.
Measure → Ichrg = 750mA ± 100mA
Measure → Iin = 475mA ± 25mA
5. Check Disable Charger. Turn off PS#1, turn off Load #2 and disconnect
2.4.2
Boost Function
1. Adjust PS#1 output to 3.7V and disable the output. Connect the PS#1 in series with a current meter
(multimeter) to J2 (BAT+, BAT–). Make sure a voltage meter is connected across J2 (BAT+, BAT–).
2. Set the Load #1 current to 200mA ± 20mA but disable the output. Connect the output of the Load #1 in
series with a current meter (multimeter) to J1 (DC+, DC–). Make sure a voltage meter is connected
across J1 (DC+, DC–). The setup is now like Figure 4 for HPA256.
BQ2415x
EVM
J2
JMP3
U1
APPLICATION
Ribbon
Cable
J5
J3
JMP2
ST AT
HPA172
JMP1
SC L
USB
Cable
V
Power
supply #1
JMP5
CIRCUIT
D1
I
JMP4
D C-
DC -
OT G
SL R S T
DC+
V
D C-
Io
SD A
Load
#1
AUXPWR
CD
BAT -
J1
I
I in
BAT+
J4
Figure 4. Test setup for HPA256
3. Turn on PS#1 output
4. Software setup: Change Operation Mode to Boost Mode.
Measure → V(J1(DC+, DC–))=5V ± 0.2V
5. Enable Load #1.
Measure → V(J1(DC+, DC–))=5V ± 0.2V
Measure → Iin = 330mA ± 40mA
Measure → Io = 200mA ± 20mA
3
PCB Layout Guideline
1. To obtain optimal performance, the power input capacitors, connected from input to PGND, should be
placed as close as possible to the IC.
2. The output inductor should be placed close to the IC and the output capacitor connected between the
inductor and PGND of the IC. The intent is to minimize the current path loop area from the SW pin
through the LC filter and back to the PGND pin. To prevent high frequency oscillation problems, proper
layout to minimize high frequency current path loop is critical.
3. The sense resistor should be adjacent to the junction of the inductor and output capacitor. Route the
sense leads connected across the RSNS back to the IC, close to each other (minimize loop area) or
6
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
PCB Layout Guideline
www.ti.com
on top of each other on adjacent layers (do not route the sense leads through a high-current path).
4. Place all decoupling capacitor close to their respective IC pin and as close as to PGND (do not place
components such that routing interrupts power stage currents). All small control signals should be
routed away from the high current paths.
5. The PCB should have a ground plane (return) connected directly to the return of all components
through vias (two vias per capacitor for power-stage capacitors, two vias for the IC PGND, one via per
capacitor for small-signal components). A star ground design approach is typically used to keep circuit
block currents isolated (high-power/low-power small-signal) which reduces noise-coupling and
ground-bounce issues. A single ground plane for this design gives good results. With this small layout
and a single ground plane, there is no ground-bounce issue, and having the components segregated
minimizes coupling between signals.
6. The high-current charge paths into VBUS, PMID and from the SW pins must be sized appropriately for
the maximum charge current in order to avoid voltage drops in these traces. The PGND pins should be
connected to the ground plane to return current through the internal low-side FET.
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
7
Bill of Materials, Board Layout and Schematics
www.ti.com
4
Bill of Materials, Board Layout and Schematics
4.1
Bill of Materials
'24150001
'24151002
bq24152
-003
'24150A- '24151A- RefDes
004
005
Value
Description
Size
Part Number
MFR
1
1
1
1
1
C1
1uF
Capacitor, Ceramic, X5R,
16V, +-10%
603
GRM188R61C105K
muRata
1
1
1
1
1
C2
4.7uF
Capacitor, Ceramic, X7R,
16V, +-10%
805
GRM21BR71C475K
muRata
2
2
2
2
2
C3, C9
10uF
Capacitor, Ceramic, X5R,
6.3V, +-20%
603
GRM188R60J106M
muRata
2
2
2
2
2
C4, C5
1uF
Capacitor, Ceramic, X5R,
10V, +-10%
402
GRM155R61A105K
muRata
1
1
1
1
1
C6
10nF
Capacitor, Ceramic, X5R,
16V, +-10%
402
GRM155R61C103K
muRata
2
2
2
2
2
C7, C8
0.1uF
Capacitor, Ceramic, X7R,
16V, +-10%
402
GRM155R71C104K
muRata
1
1
1
1
1
D1
Green
Diode, LED, Green, 2.1-V,
20-mA, 6-mcd
603
LTST-C190GKT
Liteon
1
1
1
1
1
D2
BAT54C
Diode, Dual Schottky,
200-mA, 30-V
SOT23
BAT54C
Vishay-Liteon
1
1
1
1
1
J1
ED1514/2DS
Terminal Block, 2-pin, 6-A,
3.5mm
0.27 x 0.25 inch
ED1514/2DS
OST
3
3
3
3
3
J2, J3, J4
ED1515/3DS
Terminal Block, 3-pin, 6-A,
3.5mm
0.41 x 0.25 inch
ED1515/3DS
OST
1
1
1
1
1
J5
2510-6002UB
Connector, Male Straight 2x5
pin, 100mil spacing, 4 Wall
0.338 x 0.788 inch 2510-6002UB
3M
3
3
3
3
3
JMP1,
JMP2, JMP4
PTC03SAAN
Header, 3-pin, 100mil
spacing, (36-pin strip)
0.100 inch x 3
PTC03SAAN
Sullins
2
2
2
2
2
JMP3, JMP5
PTC02SAAN
Header, 2-pin, 100mil
spacing, (36-pin strip)
0.100 inch x 2
PTC02SAAN
Sullins
4
4
4
4
4
929950-00
Shorting jumpers, 2-pin,
100mil spacing,
929950-00
3M/ESD
1
1
1
1
1
1.0uH
2.5mmx2mm, 1.0uH, +/-30%,
1.5A
"LQM2HPN1R0MJ0 or
muRata or
MIPS2520D1R0 or
FDK or
MDT2520-CN1R0M or
TOKO or
L1
0.11x0.09 inch
CP1008"
Inter-Technical
1
1
1
1
1
R1
0.068
Resistor, Chip, 68mohm,
125mW, 5%
402
ERJ-2BWJR068X
Panasonic
1
1
1
1
1
R2
5.1k
Resistor, Chip, 5.1k-Ohms,
1/16-W, 5%
603
Std
Std
8
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
Bill of Materials, Board Layout and Schematics
www.ti.com
'24150001
'24151002
bq24152
-003
'24150A- '24151A- RefDes
004
005
Value
Description
Size
Part Number
MFR
1
1
1
1
1
R3
10k
Resistor, Chip, 10k-Ohms,
1/16-W, 5%
603
Std
Std
1
1
1
1
1
R4
200
Resistor, Chip, 200-Ohms,
1/16-W, 5%
603
Std
Std
1
1
1
1
1
R5
200
Resistor, Chip, 200-Ohms,
1/16-W, 5%
603
Std
Std
1
0
0
0
0
U1
BQ24150YFF
IC, Battery Charger for
Single-Cell Li-Ion and
Li-Polymer Battery
WCSP
BQ24150YFF
TI
0
1
0
0
0
U1
BQ24151YFF
IC, Battery Charger for
Single-Cell Li-Ion and
Li-Polymer Battery
WCSP
BQ24151YFF
TI
0
0
1
0
0
U1
BQ24152YFF
IC, Battery Charger for
Single-Cell Li-Ion and
Li-Polymer Battery
WCSP
BQ24152YFF
TI
0
0
0
1
0
U1
BQ24150AYFF
IC, Battery Charger for
Single-Cell Li-Ion and
Li-Polymer Battery
WCSP
BQ24150AYFF
TI
0
0
0
0
1
U1
BQ24151AYFF
IC, Battery Charger for
Single-Cell Li-Ion and
Li-Polymer Battery
WCSP
BQ24151AYFF
TI
1
1
1
1
1
--
HPA256
PCB, 2.0 In x 2.0 In x 0.031
In
PCB
Any
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
9
Bill of Materials, Board Layout and Schematics
4.2
www.ti.com
Board Layout
Figure 5. Top Layer
Figure 6. Bottom Layer
10
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
Bill of Materials, Board Layout and Schematics
www.ti.com
Figure 7. Top Assembly
Figure 8. Top Silk
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
11
Bill of Materials, Board Layout and Schematics
4.3
Schematic
12
bq24150/150A/151/151A/152 YFF EVM (HPA256)
Copyright © 2008–2011, Texas Instruments Incorporated
www.ti.com
SLUU321C – June 2008 – Revised June 2011
Submit Documentation Feedback
Evaluation Board/Kit Important Notice
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION
PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the
product(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided are
not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations,
including product safety and environmental measures typically found in end products that incorporate such semiconductor
components or circuit boards. This evaluation board/kit does not fall within the scope of the European Union directives regarding
electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and therefore may not meet the
technical requirements of these directives or other related directives.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30
days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY
SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING
ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all
claims arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to
take any and all appropriate precautions with regard to electrostatic discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER
FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of
patents or services described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the
product. This notice contains important safety information about temperatures and voltages. For additional information on TI’s
environmental and/or safety programs, please contact the TI application engineer or visit www.ti.com/esh.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used.
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION
PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and
can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15
of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this
equipment in other environments may cause interference with radio communications, in which case the user at his own expense
will be required to take whatever measures may be required to correct this interference.
EVM Warnings and Restrictions
It is important to operate this EVM within the input voltage range of 4 V to 6 V and the output voltage range of 0 V to 4.44 V .
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are
questions concerning the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the
EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load
specification, please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than 65°C. The EVM is designed to
operate properly with certain components above 125°C as long as the input and output ranges are maintained. These components
include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of
devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near
these devices during operation, please be aware that these devices may be very warm to the touch.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and
Automotive
www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
Wireless
www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions
www.ti.com/lprf
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
