User's Guide
SLUUA14C – October 2012 – Revised August 2013
bq24190/2/2i/3/6 and bq24292i EVM (PWR021) User's
Guide
1
2
3
4
Contents
Introduction .................................................................................................................. 2
1.1
EVM Features ...................................................................................................... 2
1.2
I/O Descriptions .................................................................................................... 2
Test Summary ............................................................................................................... 4
2.1
Equipment ........................................................................................................... 4
2.2
Equipment Setup ................................................................................................... 5
2.3
Procedure ........................................................................................................... 6
PCB Layout Guideline .................................................................................................... 10
Board Layout, Schematic, and Bill of Materials ....................................................................... 11
4.1
Board Layout ...................................................................................................... 11
4.2
Schematic ......................................................................................................... 17
4.3
Bill of Materials .................................................................................................... 18
List of Figures
1
Connections of the HPA172 Kit ...........................................................................................
2
Original Test Setup for PWR021 (bq24x9xEVM)
5
12
......................................................................
Main Window of the bq2419x Evaluation Software ....................................................................
CHG Mode Ripple and Duty Cycle: VBUS = 5 V, VBAT = 3.7 V ..........................................................
Boost Mode Ripple and Duty Cycle; VBAT = 3.7 V ......................................................................
bq24x9xEVM Top Layer ..................................................................................................
bq24x9xEVM Second Layer .............................................................................................
bq24x9xEVM Third Layer ................................................................................................
bq24x9xEVM Bottom Layer ..............................................................................................
bq24x9xEVM Top Assembly .............................................................................................
bq24x9xEVM Bottom Assembly .........................................................................................
bq24x9xEVM Schematic..................................................................................................
1
Device Data Sheet ..........................................................................................................
2
2
EVM Connections ...........................................................................................................
2
3
Jumper Connections ........................................................................................................
3
4
Recommended Operating Conditions ....................................................................................
3
5
Device ID JEITA Settings ..................................................................................................
9
6
Bill of Materials.............................................................................................................
18
3
4
5
6
7
8
9
10
11
5
6
8
9
11
12
13
14
15
16
17
List of Tables
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Introduction
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1
Introduction
1.1
EVM Features
Refer to the respective data sheet (shown in Table 1) for detailed features and operation.
Table 1. Device Data Sheet
Device Name
Literature Number
bq24190/2/2i/3
SLUSAW5B
bq24196
SLUSB98
bq24292i
SLUSBI4
The bq24x9x evaluation module (EVM) is a complete charger module for evaluating an I2C-controlled
single NVDC-1 charge using the bq24x9x devices.
This EVM does not include the USB-to-GPIO interface board. To evaluate the bq24x9x EVM, a USB-toGPIO interface board must be ordered separately.
1.2
I/O Descriptions
Table 2 lists the jumper connections available on this EVM.
Table 2. EVM Connections
2
Jack
Description
J1 – PMID
PMID pin connection/Power bank output
J1 – VBUS
Input: positive terminal
J1 – GND
Input: negative terminal (ground terminal)
J2 – SYS
Connected to system
J2 – BAT+
Connected to battery pack
J2 – GND
Ground
J3
USB-to-GPIO connector (USB Interface Adapter Connector - HPA172)
J4 – INT
INT pin connection
J4 – OTG
OTG pin connection
J4-CE
CE pin connection
J4-GND
Ground
J5-TS2
External TS2 pin connection
J5-GND
Ground
J6-TS1
External TS1 pin connection
J6-GND
Ground
J7
Mini_USB Connector
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Introduction
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Table 3 lists the controls and key parameter settings for this EVM.
Table 3. Jumper Connections
Jack
Description
Factory Setting
JP1
For bq24190/2/2i/3/6 and bq24292i input current setting:
PSEL LOW: Adaptor input
PSEL HIGH: USB input
bq24190: Not installed
bq24192/2i/3/6 and bq24292i :
Short PSEL to LOW
JP2
D-/PG pin selection
Bq24190: Short D-/PG to Dbq24192/2i/3/6 and bq24292i :
Short D-/PG to PG
JP3
STAT, PG, /CE, INT, OTG pin internal pull-up source (VSYS) jumper
Installed
JP4
USB current limit selection pin during buck mode and PSEL is high (JP1High)/Enable pin during boost mode.
In buck mode: OTG = High, IIN limit = 500 mA;
OTG = Low, IIN limit = 100 mA.
The boost mode is activated when the REG01[5:4] = 10 and OTG pin is
HIGH.
Not installed
JP5
CE pin setting: pull low to enable the charge
Not Installed
(GUI also can pull /CE low)
JP6
For bq24190 input current limit setting:
bq24190: installed
bq24192/2i/3/6 and bq24292i :
Not installed
JP7
TS1 resistor divider pull-up source (REGN) connection
Installed
JP8
internal 10k to ground to TS1
Installed
JP9
internal 10k to ground to TS2
Installed
JP10
TS2 pin setting:
bq24193: Short TS2 and TS1
bq24190/2/2i/6 and bq24292i: Short
TS2 and TS2-I
Table 4 lists the recommended operating conditions for this EVM.
Table 4. Recommended Operating Conditions
Symbol
Description
MIN
TYP
MAX
Unit
Supply voltage, VIN
Input voltage from AC adapter
3.9
5/12
17
VDC
Battery voltage, VBAT
Voltage applied at VBAT terminal
0
3.7
4.25
VDC
Supply current, IAC
Maximum input current from AC adapter
input
0
3
A
Output current, IOUT
Output current
0
4
A
0
125
°C
Operating junction temperature
range, TJ
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Test Summary
2
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Test Summary
Section 2.1 – Section 2.3 explains the equipment, the equipment setup, and the test procedures.
2.1
2.1.1
Equipment
Power Supplies
Power supply #1 (PS#1): a power supply capable of supplying 5 V at 1 A is required. While this part can
handle larger voltage and current, it is not necessary for this procedure.
2.1.2
Load #1 (4-Quadrant Supply, Constant Voltage < 4.5 V)
A 0–20 V/0–5 A, > 30-W system, DC electronic load and setting as constant voltage load mode.
Or:
Kepco load: BOP 20–5M, DC 0 to ±20 V, 0 to ±5 A (or higher)
Or:
Real single-cell battery
2.1.3
Load#2 – Use with Boost Mode
PMID to GND load, 10 Ω, 5 W or greater
2.1.4
Meters
Six Fluke 75 multimeters, (equivalent or better)
Or:
Four equivalent voltage meters and two equivalent current meters.
The current meters must be capable of measuring 5 A+ current.
2.1.5
Computer
A computer with at least one USB port and a USB cable. The bq2419xEVM evaluation software must be
properly installed.
2.1.6
USB-to-GPIO Communication Kit (HPA172-USB Interface Adapter)
2.1.7
Software
Unzip the bq2419xEVM_GUI.zip and double-click on the SETUP.EXE file. Follow the installation steps.
The software supports the Windows® XP and Windows 7 operating systems.
4
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Test Summary
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2.2
Equipment Setup
1.
2.
3.
4.
Set PS#1 for 5-V DC, 1-A current limit and then turn off the supply.
Connect the output of PS#1 in series with a current meter (multimeter) to J1 (VBUS and GND).
Connect a voltage meter across J1 (VBUS) and J1 (GND).
Turn on the Load, set to constant voltage mode and output to 2.5 V. Turn off (disable) Load. Connect
Load in series with a current meter (multimeter), ground side, to J2 (BAT+ and GND) as shown in
Figure 2.
5. Connect a voltage meter across J2 (BAT+ and GND).
6. Connect the HPA172 USB interface adapter to the computer with a USB mini-cable and to J3 with the
10-pin ribbon cable. The connections are shown in Figure 1.
I/O
USB Interface
Adapter
Texas Instruments
© 2006
USB
To Computer
USB Port
10-pin
Ribbon Cable
‘To EVM’
Figure 1. Connections of the HPA172 Kit
7. Install shunts as shown in Table 3.
J4
Figure 2. Original Test Setup for PWR021 (bq24x9xEVM)
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Test Summary
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8. Turn on the computer. Launch the bq2419x evaluation software. The main window of the software is
shown in Figure 3.
Figure 3. Main Window of the bq2419x Evaluation Software
2.3
Procedure
2.3.1
Current Settings
1. Make Sure EQUIPMENT SETUP steps are followed.
ILIM Setting: Set the potentiometer to its lowest value for max input current by connecting an ohmmeter between point TP9 and ground. Turn the screw on the potentiometer counterclockwise until the
resistance drops to its lowest point (this should be in the range of 125 Ω to 175 Ω, the value of R7)
2. Launch the BQ2419x EVM GUI software, if not already done
3. Turn on PS#1
Measure → V (J2(SYS), J2(GND)) = 4.10 ±300 mV
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2.3.2
Charge Voltage and Current Regulation of VIN and Device ID Verification
Follow the steps and verify the outputs and IC for the EVM.
2.3.2.1
Software setup (all of Section 2.3.2.1 is done in the GUI):
1. Device address: bq24190/192/192i/193/196 (6B) and bq24292i
2.
3.
4.
5.
6.
7.
8.
9.
Click the Read button
Select Disabled for I2C Watchdog Timer Limit
Set Input Voltage Limit to 4.2 V
Set Input Current Limit to 500 mA
Set Charge Voltage Limit to 4.208 V
Set Fast Charge Current, ICHG to 512 mA
Set Pre-Charge Current to 256 mA
Deselect Enable Termination (see the following image)
10. Click the Read button twice
Observe → Everything normal at FAULT box
Observe → D1 (STAT) is on, except the bq24192i/292iEVM
Observe → D2 (/PG) is on for bq24190/192/192i/193/196/292iEVM
2.3.2.2
Enable Load#1 from Section 2.2 step 4. Measure the voltage across J2 at two different points:
Measure → V(J2(SYS), J2(GND)) = 3.65 V ±300 mV
Measure → V(J2(BAT), J2(GND)) = 2.5V ±200 mV
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Test Summary
2.3.2.3
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Increase the Constant Voltage Load to 3.7 VDC
Measure → V(J2(SYS), J2(GND)) = 3.75 V ±200 mV
Measure → IBAT = 500 mA ±200 mA
Measure → V(J2(BAT), J2(GND)) = 3.7 V ±200 mV
2.3.2.4
In the software, set Fast Charge Current, ICHG to 1.012 A
Measure → Iin = 500 mA ±200 mA
2.3.2.5
Verify Scope Measurements (See Figure 4 – 500 ns/div)
C1 (AC coupled 20 mV/div): Vac_PMID (TP20 to GND) – Ripple excluding high frequency spikes < 10 mV
C2 (5 V/div): Vdc_SW (TP2) - Frequency between 1.25 MHz and 1.5 MHz, duty cycle between 73% and
81%
C3 (AC coupled 20 mV/div): Vac_VSYS (TP3 to GND) - excluding high frequency spikes < 15 mV
CHG Mode: VBUS = 5 V VBAT = 3.7 V
Vsw
C2
Vprnid_AC coupled
C1
Vsys_AC coupled
C3
Figure 4. CHG Mode Ripple and Duty Cycle: VBUS = 5 V, VBAT = 3.7 V
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2.3.2.6
Switch to Boost Mode
1. Turn off and disconnect PS#1
2. If the constant voltage load connected from BAT+ to GND is not a four-quadrant supply (sources
current) remove the load and use the power source disconnected in step one, set to 3.7 V and 2 A
current limit and connect between BAT+ and GND
3. Apply 10 Ω (5 W or greater) across J5 (PMID(+) to GND(–)
4. Uncheck the OTG Low box in the GUI
5. Select OTG in the Configuration drop-down window
6. Verify VPMID to GND on J5 is between 4.9 V and 5.3 V
7. Verify scope measurement (See Figure 6)
C1 (AC coupled 20 mV/div): Vac_PMID (TP20 to GND) – Ripple excluding high frequency spikes
C2 (5 V/div): Vdc_SW (TP2) - Frequency between 1.2 MHz and 1.7 MHz, Duty cycle between 67%
and 74%
Boost Mode: Vbat = 3.7 V
Vsw
C2
Vprnid_AC coupled
C1
Figure 5. Boost Mode Ripple and Duty Cycle; VBAT = 3.7 V
2.3.2.7
Verify Device ID JEITA shown in software matches Table 5
Table 5. Device ID JEITA Settings
Assembly Number
EVM Part Number
Device ID
JEITA
PWR021-001
bq24190EVM-021
100
Disabled
PWR021-003
bq24192EVM-021
101
Disabled
PWR021-004
bq24192iEVM-021
011
Disabled
PWR021-005
bq24193EVM-021
101
Enabled
PWR021-006
bq24196EVM-021
101
Disabled
PWR021-007
bq24292iEVM-021
011
Disabled
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PCB Layout Guideline
3
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PCB Layout Guideline
Minimize the switching node rise and fall times for minimum switching loss. Proper layout of the
components minimizing high-frequency current path loop is important to prevent electrical and magnetic
field radiation and high frequency resonant problems. This PCB layout priority list must be followed in the
order presented for proper layout:
1. Place the input capacitor as close as possible to the PMID and GND pin connections and use the
shortest possible copper trace connection or GND plane.
2. Place the inductor input terminal as close to the SW pin as possible. Minimize the copper area of this
trace to lower electrical and magnetic field radiation but make the trace wide enough to carry the
charging current. Do not use multiple layers in parallel for this connection. Minimize parasitic
capacitance from this area to any other trace or plane.
3. Put an output capacitor near to the inductor and the IC. Tie ground connections to the IC ground with a
short copper trace connection or GND plane.
4. Route analog ground separately from power ground. Connect analog ground and connect power
ground separately. Connect analog ground and power ground together using power pad as the single
ground connection point or use a 0-Ω resistor to tie analog ground to power ground.
5. Use a single ground connection to tie the charger power ground to the charger analog ground just
beneath the IC. Use ground copper pour but avoid power pins to reduce inductive and capacitive noise
coupling.
6. Place decoupling capacitors next to the IC pins and make the trace connection as short as possible.
7. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB
ground. Ensure that there are sufficient thermal vias directly under the IC, connecting to the ground
plane on the other layers.
8. The via size and number should be enough for a given current path.
See the EVM design for the recommended component placement with trace and via locations. For the
QFN information, refer to SCBA017 and SLUA271.
10
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Board Layout, Schematic, and Bill of Materials
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Board Layout, Schematic, and Bill of Materials
4.1
Board Layout
Figure 6 through Figure 11 illustrate the board layouts for this EVM.
Figure 6. bq24x9xEVM Top Layer
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Figure 7. bq24x9xEVM Second Layer
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Figure 8. bq24x9xEVM Third Layer
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Figure 9. bq24x9xEVM Bottom Layer
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Figure 10. bq24x9xEVM Top Assembly
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Figure 11. bq24x9xEVM Bottom Assembly
16
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4.2
Schematic
Figure 12 illustrates the schematic for this EVM.
REGN
TP19
C16
C17
2
2
6.8uF
2
TP2
1
C15
C4
C18
D3
2.2uF
L1
1
2.2uH
2
1
J1
VBUS
1
R1
0
TP1
R5 10.0k
REGN
1
1
1
JP1
D+/PSEL
U1
BQ24190xRGE
3 D-/PG
4 STAT
D-
7 INT
8 OTG/IUSB
200
SCL
SDA
1
1
1
JP3
1
1
1
C11
10uF
ILIM
PULL-UP
200
R7
169
R8
/CE
PULL-UP
10.0k
200
INT
PULL-UP
R15
4
C19
10.0k
R14
2.21k
0.1uF
1
JP4
OTG
3
2
/CE
1
/CE
J4
R11
1
R16
2.21k
LTST-C190GKT
R24
768
OTG
LTST-C190GKT
INT
D1
STAT
PULL-UP
10.0k
D2
PG
JP5
1
VBUS
1
2
3
4 NC
5
JP6
R22
5.23k
J6
D+/PSEL
TS1
GND
REGN
REGN
JP7
D-
1
2
TS1
1
TS2
GND
2
J5
1
Not installed
JP8
R20
10.0k
JP10
TP6
TP5
R19
5.23k
TS2
1
R21
30.1k
D-/PG
TS1
TS2
TS2-I
REGN
2
R18
30.1k
C13
0.1uF
STAT
TP14
JP9
OTG
R17
10.0k
See BOM for component usage
C14
0.1uF
1
AGND
SCL
TP11
TP13
INT
D+/PSEL
TP17
TP16
TP15
TS1
/CE
TP12
TP8
TP7
SDA
TP10
TP9
ILIM
1
2
1
R2
0
PULL-UP
R3
1
1
TS1
10.0k
Mini_USB
J2
C10
1
TP4
R6 1
D+/PSEL
PULL-UP
J7
C12
1
SDA
2
OTG
INT
OTG
/CE
GND
C3
TS2
PULL-UP
SCL
R10
C9
1
R23 1
R13 200
J3
0.1uF
TP3
SYS 16
SYS 15
BAT 14
BAT 13
STAT
R4
10uF
PGND 18
PGND 17
2
9 CE
ILIM
JP2
R9
C8
10uF
1.0uF
5 SCL
6 SDA
PG
10
9
8
7
6
5
4
3
2
1
24
1 VBUS
2 D+/PSEL
D-/PG
R12
C7
1
10
1
BTST 21
SW 20
1.0uF
HI
PSEL
LO
PMID 23
REGN 22
C1
BAT+
System Output
3.4 - 4.4V
GND
3
D+/PSEL
25
C2
VBUS
1
47nF
SW 19
2
C5
11 TS1
TS2
12
3
1
PWPD
PMID
VIN 3.9 to 17V
GND
SW
C6 4.7uF
TS2
TP18
PGND
TEST POINTS
1
Figure 12. bq24x9xEVM Schematic
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Board Layout, Schematic, and Bill of Materials
4.3
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Bill of Materials
Table 6 contains the bill of materials.
Table 6. Bill of Materials
COUNT
RefDes
Value
Description
Size
Part Number
RefDes
1
C1
1.0uF
Capacitor, Ceramic, 25V, X7R, 10%
1206
STD
STD
0
C2
OPEN
Capacitor, Ceramic,
0603
STD
STD
0
0
C3, C12
OPEN
Capacitor, Ceramic, 10V, X5R, 10%
1206
STD
STD
1
1
1
C4
6.8uF
Capacitor, Ceramic, 25V, X5R, 10%
0805
STD
STD
1
1
1
1
C5
47nF
Capacitor, Ceramic, 16V, X7R, 10%
0603
STD
STD
1
1
1
1
1
C6
4.7uF
Capacitor, Ceramic, 10V, X5R, 10%
0603
STD
STD
2
2
2
2
2
2
C7, C8
10uF
Capacitor, Ceramic, 10V X5R, 10%
0805
STD
STD
1
1
1
1
1
1
C9
0.1uF
Capacitor, Ceramic, 25V, X7R, 10%
0603
STD
STD
0
0
0
0
0
0
C13-14, C19
0.1uF
Capacitor, Ceramic, 25V, X7R, 10%
0603
STD
STD
1
1
1
1
1
1
C10
1.0uF
Capacitor, Ceramic, 10V, X7R, 10%
0805
STD
STD
1
1
1
1
1
1
C11
10uF
Capacitor, Ceramic, 10V, X5R, 10%
0603
STD
STD
1
1
1
1
1
1
C15
2.2uF
Capacitor, Ceramic, 25V, X5R, 10%
0805
STD
STD
0
0
0
0
0
0
C16, C17, C18
47uF
Capacitor, Ceramic, 10V, X5R, 20%
1206
STD
STD
2
2
2
2
2
2
D1, D2
LTST-C190GKT
Diode, LED, Green, 2.1-V, 20-mA, 6-mcd
0603
LTST-C190GKT
Lite On
0
0
0
0
0
0
D3
ZLLS350
Diode, Schottky, 1.16A, 40-V
SOD-523
ZLLS350TA
Zetex
2
2
2
2
2
2
J1,2
ED120/3DS
Terminal Block, 3-pin, 15-A, 5.1mm
0.60 x 0.35 inch
ED120/3DS
OST
1
1
1
1
1
1
J3
N2510-6002RB
Connector, Male Straight 2x5 pin, 100mil spacing, 4 Wall
0.338 x 0.788 inch
N2510-6002RB
3M
1
1
1
1
1
1
J4
ED555/4DS
Terminal Block, 4-pin, 6-A, 3.5mm
0.55 x 0.25 inch
ED555/4DS
OST
2
2
2
2
2
2
J5-6
PEC02SAAN
Header, Male 2-pin, 100mil spacing,
0.100 inch x 2
PEC02SAAN
Sullins
1
1
1
1
1
1
J7
56579-0519
Connector, USB-B, Mini, 5-pins
0.354 X 0.307 Inches
56579-0519
Molex
3
3
3
3
3
3
JP1-2, JP10
PEC03SAAN
Header, Male 3-pin, 100mil spacing,
0.100 inch x 3
PEC03SAAN
Sullins
7
7
7
7
7
7
JP3-9
PEC02SAAN
Header, Male 2-pin, 100mil spacing,
0.100 inch x 2
PEC02SAAN
Sullins
1
1
1
1
1
1
L1
2.2uH
Inductor, SMT, 4.2A, 45.6-milliohm
0.216 x 0.204 inch
IHLP2020BZER2R2M01
Vishay
1
1
1
1
1
1
R1
0
Resistor, Chip, 1/16W,
0603
STD
STD
1
1
1
1
1
1
R2
0
Resistor, Chip, 0.5W
2010
STD
STD
6
6
6
6
6
6
R3 R5 R8 R11 R17 R20
10.0k
Resistor, Chip, 1/16W, 1%
0603
STD
STD
4
4
4
4
4
4
R4 R10 R12 R13
200
Resistor, Chip, 1/16W, 1%
0603
STD
STD
0
0
0
0
0
0
R6 R23
OPEN
Resistor, Chip, 1/16W,
0603
STD
STD
1
1
1
1
1
1
R7
130
Resistor, Chip, 1/16W, 1%
0603
STD
STD
0
1
1
1
1
1
R9
200
Resistor, Chip, 1/16W, 1%
0603
STD
STD
2
2
2
2
2
2
R14, R16
2.21k
Resistor, Chip, 1/16W, 1%
0603
STD
STD
1
1
1
1
1
1
R15
10.0k
Potentiometer, 3/8 Cermet, Single-Turn
0.25x0.17 inch
3266W-1-103LF
Bourns
0
0
0
1
0
0
R21
6.81k
Resistor, Chip, 1/16W, 1%
0603
STD
STD
0
0
0
1
0
0
R22
2.26k
Resistor, Chip, 1/16W, 1%
0603
STD
STD
1
1
1
0
1
1
R21
30.1k
Resistor, Chip, 1/16W, 1%
0603
STD
STD
1
1
1
0
1
1
R22
5.23k
Resistor, Chip, 1/16W, 1%
0603
STD
STD
-001
-003
-004
-005
-006
-007
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
18
bq24190/2/2i/3/6 and bq24292i EVM (PWR021) User's Guide
SLUUA14C – October 2012 – Revised August 2013
Submit Documentation Feedback
Copyright © 2012–2013, Texas Instruments Incorporated
Board Layout, Schematic, and Bill of Materials
www.ti.com
Table 6. Bill of Materials (continued)
COUNT
RefDes
Value
Description
Size
Part Number
RefDes
1
R18
30.1k
Resistor, Chip, 1/16W, 1%
0603
STD
STD
1
R19
5.23k
Resistor, Chip, 1/16W, 1%
0603
STD
STD
1
1
R24
768
Resistor, Chip, 1/16W, 1%
0603
STD
STD
16
16
16
TP1 TP3-11 TP13-17 TP19
5002
Test Point, White, Thru Hole Color Keyed
0.100 x 0.100 inch
5002
Keystone
1
1
1
1
TP2
131-4244-00
Adaptor, 3.5-mm probe clip ( or 131-5031-00)
0.200 inch
131-4244-00
Tektronix
2
2
2
2
2
TP12 TP18
5001
Test Point, Black, Thru Hole Color Keyed
0.100 x 0.100 inch
5001
Keystone
1
0
0
0
0
0
U1
BQ24190RGE
IC, I2C Controlled 4A Single Cell USB / Adaptor Charger With Narrow
VDC Power Path Management and USB OTG
QFN-24
BQ24190RGE
TI
0
0
0
0
0
0
U1
BQ24191RGE
IC, I2C Controlled 4A Single Cell USB / Adaptor Charger With Narrow
VDC Power Path Management
QFN-24
BQ24191RGE
TI
0
1
0
0
0
0
U1
BQ24192RGE
IC, I2C Controlled 4A Single Cell USB / Adaptor Charger With Narrow
VDC Power Path Management and USB OTG
QFN-24
BQ24192RGE
TI
0
0
1
0
0
0
U1
BQ24192IRGE
IC, I2C Controlled 4A Single Cell USB / Adaptor Charger With Narrow
VDC Power Path Management and USB OTG
QFN-24
BQ24192IRGE
TI
0
0
0
1
0
0
U1
BQ24193RGE
IC, I2C Controlled 4A Single Cell USB / Adaptor Charger With Narrow
VDC Power Path Management and USB OTG
QFN-24
BQ24193RGE
TI
0
0
0
0
1
0
U1
BQ24196RGE
IC, I2C Controlled 2.5A Single Cell USB / Adaptor Charger With Narrow
VDC Power Path Management and USB OTG
QFN-24
BQ24196RGE
TI
0
0
0
0
0
1
U1
BQ24292iRGE
IC, I2C Controlled 4A Single Cell USB / Adaptor Charger With Narrow
VDC Power Path Management and USB OTG
QFN-25
BQ24292iRGE
TI
10
10
10
10
10
10
--
Shunt, 100-mil, Black
0.100
929950-00
3M
1
1
1
1
1
1
--
PCB, bq2419xEVM-021, 3"x3"
PWR021
Any
1
1
1
1
1
1
--
Label (See note 5)
1.25 x 0.25 inch
THT-13-457-10
Brady
4
4
4
4
4
4
-
Rubber foot (see note 6)
.044" X 0.20"
SJ-5303
3M
-001
-003
-004
-005
-006
-007
1
1
1
1
1
1
1
1
1
1
1
1
1
1
16
16
16
1
1
2
SJ-5303
Notes: 1. These assemblies are ESD sensitive, observe ESD precautions.
2. These assemblies must be clean and free from flux and all contaminants. Use of no-clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components.
5. Install label after final wash. Text shall be 8 pt font. Text shall be per Label Information.
6. Install after final wash.
Label Information
Assembly number
Text
PWR021-001
bq24190EVM-021
PWR021-003
bq24192EVM-021
PWR021-004
bq24192IEVM-021
PWR021-005
bq24193EVM-021
PWR021-006
bq24196EVM-021
PWR021-007
bq24292iEVM-021
SLUUA14C – October 2012 – Revised August 2013
Submit Documentation Feedback
bq24190/2/2i/3/6 and bq24292i EVM (PWR021) User's Guide
Copyright © 2012–2013, Texas Instruments Incorporated
19
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO
BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH
ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and
therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
software performance, or infringement of patents or services described herein.
REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal
Communications Commission (FCC) and Industry Canada (IC) rules.
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer
use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency
interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will
be required to take whatever measures may be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and
power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local
laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this
radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and
unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory
authorities, which is responsibility of user including its acceptable authorization.
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
【Important Notice for Users of EVMs for RF Products in Japan】
】
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1.
2.
3.
Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this
product, or
Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with
respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note
that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
http://www.tij.co.jp
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
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西新宿三井ビル
http://www.tij.co.jp
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
EVALUATION BOARD/KIT/MODULE (EVM)
WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end
product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1.
2.
3.
4.
You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to
minimize the risk of electrical shock hazard.
Since the EVM is not a completed product, it may not meet all applicable regulatory and safety compliance standards (such as UL,
CSA, VDE, CE, RoHS and WEEE) which may normally be associated with similar items. You assume full responsibility to determine
and/or assure compliance with any such standards and related certifications as may be applicable. You will employ reasonable
safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to
perform as described or expected.
You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable
in electronic measurement and diagnostics normally found in development environments should use these EVMs.
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives
harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate
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