User's Guide
SLUUB62A – August 2014 – Revised March 2015
bq24296M and bq24298 EVM (PWR655) User’s Guide
This user's guide describes the characteristics, operation, and use of the PWR655 bq24296MEVM and
bq24298EVM (EVM). This document details the equipment required, equipment setup, testing procedures,
schematics, PCB assembly and layout drawings, and bill of materials (BOM).
1
2
3
4
Contents
Introduction ................................................................................................................... 2
1.1
EVM Features ....................................................................................................... 2
1.2
I/O Descriptions ..................................................................................................... 2
Test Summary ................................................................................................................ 4
2.1
Equipment ........................................................................................................... 4
2.2
Equipment Setup.................................................................................................... 5
2.3
Test Procedure ...................................................................................................... 7
PCB Layout Guideline ..................................................................................................... 10
Board Layout, Schematic, and Bill of Materials ........................................................................ 11
4.1
Board Layout ....................................................................................................... 11
4.2
Schematics ......................................................................................................... 15
4.3
Bill of Materials .................................................................................................... 17
List of Figures
1
Connections of the EV2300 or EV2400 Kit ............................................................................... 5
2
Original Test Setup for PWR655
3
Main Window of the bq24296M Evaluation Software ................................................................... 6
4
Main Window of the bq24298 Evaluation Software ..................................................................... 6
5
CHG Mode Ripple and Duty Cycle: VBUS = 5 V, VBAT = 3.7 V
..........................................................................................
5
12
.......................................................... 8
Boost Mode Ripple and Duty Cycle: VBAT = 3.7 V ....................................................................... 9
PWR655 EVM Top Layer ................................................................................................. 11
PWR655 EVM Second Layer ............................................................................................. 12
PWR655 EVM Third Layer ................................................................................................ 13
PWR655 EVM Bottom Layer ............................................................................................. 14
bq24296M Schematic ...................................................................................................... 15
bq24298 Schematic ........................................................................................................ 16
1
Device Data Sheets ......................................................................................................... 2
2
EVM Connections ............................................................................................................ 2
3
Jumper Connections
6
7
8
9
10
11
List of Tables
4
5
6
7
........................................................................................................ 3
Recommended Operating Conditions ..................................................................................... 3
Device ID JEITA Settings ................................................................................................... 9
bq24296M Bill of Materials ................................................................................................ 17
bq24298 Bill of Materials .................................................................................................. 19
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1
Introduction
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1
Introduction
1.1
EVM Features
For detailed features and operation, refer to Table 1 for a list of devices and their data sheets.
Table 1. Device Data Sheets
Device
Document
bq24296M
SLUSBU3
bq24298
SLUSC59
The bq24296M and bq24298 evaluation modules (EVM) are complete charger modules for evaluating an
I2C-controlled single NVDC-1 charge using the bq24296M and bq24298 devices.
This EVM doesn’t include the USB-to-GPIO interface board. To evaluate the EVM, a USB-to-GPIO
interface board must be ordered separately.
1.2
I/O Descriptions
Table 2 lists the jumper connections available on this EVM.
Table 2. EVM Connections
2
Jack
Description
J1–VBUS
Input: positive terminal
J1–GND
Input: negative terminal (ground terminal)
J2–PMID
PMID pin connection/Power bank output
J2–GND
Ground/Power bank output negative terminal
J3–SYS
Connected to system
J3–GND
Ground
J4–BAT+
Connected to battery pack
J4–GND
Ground
J6–INT
INT pin connection
J6– OTG
OTG pin connection
J6–CE
CE pin connection
J6–GND
Ground
J7
USB-to-GPIO connector (USB interface adapter connector – EV2300 or EV2400)
J8
External TS1 pin connection
J8
Ground
J9
External TS2 pin connection
J9
Ground
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Introduction
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Table 3 lists the controls and key parameter settings for this EVM.
Table 3. Jumper Connections
Jack
Description
Factory Setting
JP1
For bq24296M and bq24298 input current setting:
spacePSEL LOW: Adaptor input
spacePSEL HIGH: USB input
bq24296M and bq24298:
Short PSEL to LOW
JP2
D-/PG pin selection
bq24296M and bq24298:
Short D–/PG to PG
JP3
TS2 or QON selector
bq24296M and bq24298:
Select QON Installed
JP4
TS2 pin setting
Not installed
JP5
D+/D– connections for bq24296M input current limit setting
Not installed
JP6
USB current limit selection pin during buck mode and PSEL is high (JP1High)/Enable pin during boost mode.
In buck mode: OTG = High, IIN limit = 500 mA; OTG = Low, IIN limit = 100 mA.
The boost mode is activated when the REG01[5:4] = 10 and OTG pin is HIGH.
Not installed
JP7
CE pin setting: pull low to enable the charge
Not Installed:
(GUI also can pull CE low)
JP8
STAT, PG, CE, INT, OTG pin internal pull-up source (VSYS) jumper
bq24296M and bq24298:
Installed
JP9
TS1 Resistor Divider pull-up source (REGN)
bq24296M and bq24298:
Installed
JP10
Internal 10 kΩ from TS1 to ground
bq24296M and bq24298:
Short TS2 and TS2-I
JP11
TS2 Connection
Not Installed
Table 4 lists the recommended operating conditions for this EVM.
Table 4. Recommended Operating Conditions
Symbol
Description
MIN
TYP
MAX
Unit
Supply voltage, VIN
Input voltage from AC adapter
3.9
5
6.2
VDC
Battery voltage, VBAT
Voltage applied at VBAT terminal
0
3.7
4.4
V
IBAT
Fast charging current
Discharging current through internal MOSFET
3
A
5.5
A
3
A
Supply current, IAC
Maximum input current from AC adapter input
0
Output current, ISYS
Output current (SYS)
0
3.5
A
0
125
°C
Operating junction
temperature range, TJ
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Test Summary
2
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Test Summary
Section 2.1 through Section 2.3 explains the equipment, equipment setup, and test procedure.
2.1
2.1.1
Equipment
Power Supplies
Power supply #1 (PS #1): a power supply capable of supplying 5 V at 1 A is required. While this part can
handle larger voltage and current, it is not necessary for this procedure.
2.1.2
Load #1 (4-Quadrant Supply, Constant Voltage < 4.5 V)
A 0–20 V/0–5 A, > 30-W system, DC electronic load and setting as constant voltage load mode.
or:
Kepco load: BOP 20–5M, DC 0 to ±20 V, 0 to ±5 A (or higher).
or:
Real single-cell battery.
2.1.3
Load #2 – Use with Boost Mode
PMID to GND load, 10 Ω, 5 W or greater.
2.1.4
Meters
Six Fluke 75 multimeters, (equivalent or better).
or:
Four equivalent voltage meters and two equivalent current meters.
The current meters must be capable of measuring 5 A+ current.
2.1.5
Computer
A computer with at least one USB port and a USB cable. The Battery Management Studio (bqStudio)
(SLUC525) must be properly installed.
2.1.6
USB-to-GPIO Communication Kit (EV2300 or EV2400 - USB Interface Adapter)
2.1.7
Software
Download the bqStudio software and double-click on the file. Follow the installation steps. The software
supports the Microsoft® Windows® XP and Windows 7 operating systems.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
4
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Test Summary
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2.2
Equipment Setup
Use the following steps to setup the equipment:
Step 1. Set PS #1 for 5-V DC, 1-A current limit and then turn off the supply.
Step 2. Connect the output of PS #1 in series with a current meter (multimeter) to J1 (VBUS and GND).
Step 3. Connect a voltage meter across J1 (VBUS) and J1 (GND).
Step 4. Turn on the Load, set to constant voltage mode and output to 2.5 V. Turn off (disable) Load.
Connect Load in series with a current meter (multimeter), ground side, to J4 (BAT+ and
GND) as shown in Figure 2.
Step 5. Connect a voltage meter across J4 (BAT+ and GND).
Step 6. Connect the USB interface adapt to the computer and connect SDA, SCL, and GND to
TP12(SDA), TP13(SCL), and TP8 (AGND) on the EVM, respectively. Figure 1 shows the
connections.
Figure 1. Connections of the EV2300 or EV2400 Kit
Step 7.
Figure 2 illustrates the shunt installation.
Figure 2. Original Test Setup for PWR655
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Test Summary
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8. Turn on the computer. Launch the evaluation software. The main windows of the bq24296M and
bq24298 software are shown in Figure 3 and Figure 4, respectively.
Figure 3. Main Window of the bq24296M Evaluation Software
Figure 4. Main Window of the bq24298 Evaluation Software
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2.3
Test Procedure
2.3.1
Current Settings
1. Make sure equipment setup steps are followed.
ILIM Setting: Set the potentiometer to its lowest value for max input current by connecting an
ohmmeter between point TP9 and ground. Turn the screw on the potentiometer counterclockwise until
the resistance drops to its lowest point (this should be in the range of 125 Ω to 175 Ω, the value of R7)
2. Launch the GUI software, if not already done
3. Turn on PS #1
Measure → V (J3(SYS), J3(GND)) = 4.10 ±300 mV
2.3.2
Charge Voltage and Current Regulation of VIN and Device ID Verification
Follow steps 1–7 and verify the outputs and IC for the EVM:
Step 1. Software setup (all of Step 1 is done in the GUI)
(a) Device address: bq24296M and bq24298
(b) Click the Read button
(c) Select Disabled for I2C Watchdog Timer Limit
(d) Set Input Voltage Limit to 4.2 V
(e) Set Input Current Limit to 500 mA
(f) Set Charge Voltage Limit to 4.208 V
(g) Set Fast Charge Current, ICHG to 512 mA
(h) Set Pre-Charge Current to 256 mA
(i) Deselect Enable Termination (see the following images)
(j)
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Test Summary
Step 2.
Step 3.
Step 4.
Step 5.
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Click the Read button twice
Observe → Everything normal at FAULT box
Observe → D3 (STAT) is on
Observe → D4 (PG) is on
Enable Load #1 from Section 2.2, step 4. Measure the voltage across J3 and J4 as follows:
Measure → V(J3(SYS), J3(GND)) = 3.65 V ±300 mV
Measure → V(J4(BAT), J4(GND)) = 2.5 V ±200 mV
Increase the constant voltage load to 3.7 VDC
Measure → V(J3(SYS), J3(GND)) = 3.75 V ±200 mV
Measure → IBAT = 500 mA ±200 mA
Measure → V(J4(BAT), J4(GND)) = 3.7 V ±200 mV
In the software, set Fast Charge Current, ICHG to 1024 mA
Measure → IIN = 500 mA ±200 mA
Verify scope measurements (See Figure 5 – 500 ns/div)
C1 (AC coupled 20 mV/div): Vac_PMID (TP2 to GND) – Ripple excluding high frequency
spikes < 10 mV
C2 (5 V/div): Vdc_SW (TP1) – Frequency between 1.25 MHz and 1.5 MHz, duty cycle
between 73% and 81%
C3 (AC coupled, 20 mV/div): Vac_VSYS (TP4 to GND) – Excluding high frequency spikes <
15 mV
Figure 5. CHG Mode Ripple and Duty Cycle: VBUS = 5 V, VBAT = 3.7 V
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6. Switch to Boost mode
(a) Turn off and disconnect PS #1
(b) If the constant voltage load connected from BAT+ to GND is not a four-quadrant supply
(sources current), remove the load and use the power source disconnected in step one,
set to 3.7 V and 2-A current limit and connect between BAT+ and GND
(c) Apply 10 Ω (5 W or greater) across J2 (PMID(+) to GND(–)
(d) Uncheck the OTG Low box in the GUI
(e) Check the Enable OTG option in the GUI
(f) Verify VPMID to GND on J2 is between 4.9 V and 5.3 V
(g) Verify scope measurement (see Figure 6):
C1 (AC coupled 20 mV/div): Vac_PMID (TP2 to GND) – Ripple excluding high frequency
spikes
C2 (5 V/div): Vdc_SW (TP1) – Frequency between 1.2 MHz and 1.7 MHz, duty cycle
between 67% and 74%
Figure 6. Boost Mode Ripple and Duty Cycle: VBAT = 3.7 V
spacer
Step 6.
Verify Device ID JEITA shown in software matches Table 5.
Table 5. Device ID JEITA Settings
Assembly Number
EVM Part Number
Device ID
JEITA
PWR655-001
bq24296EVM-655
bq24296M
Disabled
PWR655-002
bq24298EVM-655
bq24298
Disabled
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PCB Layout Guideline
3
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PCB Layout Guideline
Minimize the switching node rise and fall times for minimum switching loss. Proper layout of the
components minimizing high-frequency current path loop is important to prevent electrical and magnetic
field radiation and high-frequency resonant problems. This PCB layout priority list must be followed in the
order presented for proper layout:
1. Place the input capacitor as close as possible to the PMID and GND pin connections and use the
shortest possible copper trace connection or GND plane.
2. Place the inductor input terminal as close to the SW pin as possible. Minimize the copper area of this
trace to lower electrical and magnetic field radiation but make the trace wide enough to carry the
charging current. Do not use multiple layers in parallel for this connection. Minimize parasitic
capacitance from this area to any other trace or plane.
3. Put an output capacitor near to the inductor and the IC. Tie ground connections to the IC ground with a
short copper trace connection or GND plane.
4. Route analog ground separately from power ground. Connect analog ground and connect power
ground separately. Connect analog ground and power ground together using power pad as the single
ground connection point or use a 0-Ω resistor to tie analog ground to power ground.
5. Use a single ground connection to tie the charger power ground to the charger analog ground just
beneath the IC. Use ground copper pour but avoid power pins to reduce inductive and capacitive noise
coupling.
6. Place decoupling capacitors next to the IC pins and make the trace connection as short as possible.
7. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB
ground. Ensure that there are sufficient thermal vias directly under the IC, connecting to the ground
plane on the other layers.
8. The via size and number should be enough for a given current path.
See the EVM design for the recommended component placement with trace and via locations. For the
QFN information, refer to Quad Flatpack No-Lead Logic Packages (SCBA017) and QFN/SON PCB
Attachment (SLUA271).
10
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Board Layout, Schematic, and Bill of Materials
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4
Board Layout, Schematic, and Bill of Materials
This section contains the board layouts, schematics, and BOMs.
4.1
Board Layout
Figure 7 through Figure 10 illustrate the board layouts for this EVM.
Figure 7. PWR655 EVM Top Layer
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Figure 8. PWR655 EVM Second Layer
12
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Figure 9. PWR655 EVM Third Layer
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Figure 10. PWR655 EVM Bottom Layer
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4.2
Schematics
This section includes the bq24296M and bq24298 schematics.
D2
TP1
2
3
5
TP2
PMID
PMID
GND
4
1
DNP
C3
2
1
REGN
PGND
4.7µF
DNP C13
10µF
J2
DNP C12
10µF
DNP C11
10µF
DNP C10
1000pF
DNP C9
2.2µF
C2
10µF
DNP D1
AGND
C4
L1
PGND
PGND
SYS
0.047µF
Vbus: 3.9V to 6.2V
R13
0
TP3
2
1
1uH
C1
1µF
DNP C8
1000pF
R1
768
130
1
24
VBUS
VBUS
23
PGND
1
D-
R19
50k
JP2
AGND
D-
10
ILIM
4
BTST
PMID
SW
SW
ILIM
SYS
SYS
STAT
2
REGN
C5
10µF
U1
R18
REGN
C6
10µF
DNP C14
0.1µF
DNP C15
10µF
DNP C16
10µF
DNP C17
1000pF
21
PGND
19
20
JP8
15
16
TP4
22
2
1
2
J1
1
VBUS
GND
System
GND
J3
VBUS
PULL-UP
PG
JP1
2
D+/PSEL
1
10.0k
SDA
9
CE
11
10
9
PGND
D+
ID
GND
DNP C18
1µF
DNP C19
10µF
DNP C20
1000pF
TS2
QON/TS2
JP3
PGND
TS2
QON
R5
NT1
10.0k
Net-Tie
REGN
QON
C22
AGND
OTG
PGND
PGND
D5
ZLLS350TA
JP6
0.1µF
2
1
R17
75.0k
R2
5.23k
J8
1µF
TS1
GND
S1
KSR221GLFS
JP9
TS2
1
2
AGND
R7
AGND
D+/PSEL
JP4
1
2
J9
JP5
R3
30.1k
R24
TS1
DNP5.23k
TS2
TS2-1
2
TS1
1
2
AGND
4
REGN
3
R6
DNP
10.0k
REGN
D1
2
C7
10µF
R20
100k
TS1
1
PULL-UP
C21
VBUS
J5
11
17
18
25
bq24296MRGE
R16
150k
1
2
TS
PGND
PGND
PAD
2
SYS
3
INT
OTG
INT
D-
SCL
8
Battery
GND
12
D+/PSEL
AGND
VBUS
QON
7
R15
J4
BAT
2
1
SDA
5
10.0k
PULL-UP
TP5
PG
6
R14
13
14
1
3
SCL
BAT
BAT
1
STAT
PSEL
2
3
PG
3
HI
PSEL
LOW
2
3
D-/PG
R4
10.0k
JP10
R23
10.0k
TS2
GND
1
2
R25
DNP30.1k
JP11
R26
DNP10.0k
10.0k
5
CE
AGND
2
1
6
7
8
JP7
PGND
AGND
AGND
TP10
PULL-UP
R21
2.21k
D-/PG
R22
2.21k
TP11
REGN
TP14
TP12
SDA
TP15
TP13
TP6
TP7
SCL
TP16
TP17
PGND
J7
R11
INT
1
2
3
4
SCL
OTG
200
R10
D+/PSEL
CE
J6
OTG
200
R8
200
9
7
5
3
1
R12
10
8
6
4
2
ILIM
SDA
200
STAT
TP18
D3
Green
PGND
D4
Green
OTG
D+/PSEL
TP19
CE
TP8
INT
TP20
TS1
TP9
QON/TS2
AGND
R9
200
CE
TEST POINTS
STAT
PG
PGND
Figure 11. bq24296M Schematic
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Board Layout, Schematic, and Bill of Materials
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D2
TP1
2
3
5
TP2
PMID
PMID
GND
4
1
DNP
C3
2
1
REGN
PGND
4.7µF
DNP C13
10µF
J2
DNP C12
10µF
DNP C11
10µF
DNP C10
1000pF
DNP C9
2.2µF
C2
10µF
DNP D1
AGND
C4
L1
PGND
PGND
SYS
0.047µF
Vbus: 3.9V to 6.2V
R13
0
TP3
2
1
1uH
C1
1µF
DNP C8
1000pF
U1
R18
R1
768
130
1
24
23
PGND
1
D-
R19
50k
JP2
AGND
D-
10
ILIM
4
BTST
PMID
SW
SW
ILIM
SYS
SYS
STAT
2
REGN
VBUS
VBUS
REGN
C6
10µF
DNP C14
0.1µF
DNP C15
10µF
DNP C16
10µF
DNP C17
1000pF
21
PGND
19
20
JP8
15
16
TP4
22
2
1
2
J1
C5
10µF
1
VBUS
GND
System
GND
J3
VBUS
PULL-UP
PG
JP1
2
D+/PSEL
10.0k
PULL-UP
R15
1
10.0k
SDA
SCL
7
INT
8
OTG
9
CE
11
10
9
PGND
J5
D+
ID
GND
11
17
18
25
DNP C18
1µF
DNP C19
10µF
DNP C20
1000pF
TS2
QON/TS2
JP3
PGND
TS2
Net-Tie
REGN
1
R5
10.0k
AGND
PGND
PGND
DNP D5
ZLLS350TA
JP6
0.1µF
2
1
R17
75.0k
R2
5.23k
J8
0
TS1
GND
S1
KSR221GLFS
JP9
TS2
1
2
AGND
R7
AGND
D+/PSEL
JP4
1
2
J9
JP5
R3
30.1k
R24
TS1
DNP5.23k
TS2
TS2-1
2
TS1
1
2
AGND
4
REGN
3
QON
C22
OTG
REGN
D1
2
C7
10µF
R20
DNP100k
TS1
QON
NT1
R6
DNP
10.0k
C21
VBUS
3
PULL-UP
R16
150k
1
2
TS
PGND
PGND
PAD
2
SYS
Battery
GND
12
BQ24298RTWR
INT
D-
QON
5
J4
BAT
2
1
SDA
D+/PSEL
AGND
VBUS
TP5
PG
6
R14
13
14
1
3
SCL
BAT
BAT
1
STAT
PSEL
2
3
PG
3
HI
PSEL
LOW
2
3
D-/PG
R4
10.0k
JP10
R23
10.0k
TS2
GND
1
2
R25
DNP30.1k
JP11
R26
DNP10.0k
10.0k
5
CE
AGND
2
1
6
7
8
JP7
PGND
AGND
AGND
TP10
PULL-UP
R21
2.21k
D-/PG
R22
2.21k
TP11
REGN
TP14
TP12
SDA
TP15
TP13
TP6
TP7
SCL
TP16
TP17
PGND
J7
R11
INT
1
2
3
4
SCL
OTG
200
R10
D+/PSEL
CE
J6
OTG
200
9
7
5
3
1
R12
10
8
6
4
2
ILIM
SDA
200
STAT
TP18
D3
Green
PGND
D4
Green
OTG
D+/PSEL
TP19
CE
TP8
INT
TP20
TS1
TP9
QON/TS2
AGND
R8
R9
200
200
CE
TEST POINTS
STAT
PG
PGND
Figure 12. bq24298 Schematic
16
bq24296M and bq24298 EVM (PWR655) User’s Guide
SLUUB62A – August 2014 – Revised March 2015
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Board Layout, Schematic, and Bill of Materials
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4.3
Bill of Materials
This section includes the bq24296M and bq24298 BOMs.
Table 6. bq24296M Bill of Materials
Designator
Qty
PCB
1
Value
Description
Package Reference
Part Number
Manufacturer
PWR655
C1
1
1uF
CAP, CERM, 1uF, 25V, ±10%, X7R, 0603
Any
0603
C1608X7R1E105K080AB
C2
1
10uF
TDK
CAP, CERM, 10uF, 25V, ±10%, X5R, 0805
0805
C2012X5R1E106K125AB
C3
1
TDK
4.7uF
CAP, CERM, 4.7uF, 10V, ±20%, X5R, 0402
0402
GRM155R61A475M
C4
MuRata
1
0.047uF
CAP, CERM, 0.047uF, 25V, ±10%, X7R, 0402
0402
GRM155R71E473KA88D
MuRata
C5, C6, C7, C15, C16, C19
6
10uF
CAP, CERM, 10uF, 10V, ±20%, X5R, 0603
0603
C1608X5R1A106M
TDK
C21
1
0.1uF
CAP, CERM, 0.1uF, 10V, ±10%, X7R, 0402
0402
GRM155R71A104KA01D
MuRata
C22
1
1uF
CAP, CERM, 1uF, 10V, ±10%, X5R, 0402
0402
GRM155R61A105KE15D
MuRata
D3, D4
2
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190GKT
Lite-On
D5
1
40V
Diode, Schottky, 40V, 0.38A, SOD-523
SOD-523
ZLLS350TA
Diodes Inc.
H1, H2, H3, H4
4
Bumpon, Cylindrical, 0.312 X 0.200, Black
Black Bumpon
SJ61A1
3M
J1, J2, J3, J4
4
Conn Term Block, 2POS, 3.81mm, TH
2POS Terminal Block
1727010
Phoenix Contact
J5
1
Connector, Receptacle, Micro-USB Type B, R/A, Bottom Mount SMT
7.5x2.45x5mm
0473460001
Molex
J6
1
Terminal Block, 6A, 3.5mm Pitch, 4-Pos, TH
14x8.2x6.5mm
ED555/4DS
On-Shore Technology
J7
1
Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH
5x2 Shrouded header
N2510-6002-RB
3M
J8, J9, JP5, JP6, JP7, JP8, JP9,
JP10, JP11
9
Header, 100mil, 2x1, Tin plated, TH
Header, 2 PIN, 100mil, Tin
PEC02SAAN
Sullins Connector Solutions
JP1, JP2, JP3, JP4
4
Header, 100mil, 3x1, Tin plated, TH
Header, 3 PIN, 100mil, Tin
PEC03SAAN
Sullins Connector Solutions
L1
1
Inductor, Flat Wire, Powdered Iron, 1uH, 4.8A, 0.0336 ohm, SMD
4.7x1.2x4.0mm
SRP4012-1R0M
Bourns
LBL1
1
Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll
PCB Label 0.650"H x 0.200"W
THT-14-423-10
Brady
R1
1
130
RES, 130 ohm, 1%, 0.063W, 0402
0402
CRCW0402130RFKED
Vishay-Dale
R2
1
5.23k
RES, 5.23k ohm, 1%, 0.063W, 0402
0402
CRCW04025K23FKED
Vishay-Dale
R3
1
30.1k
RES, 30.1k ohm, 1%, 0.063W, 0402
0402
CRCW040230K1FKED
Vishay-Dale
R4, R5, R7, R14, R15, R23
6
10.0k
RES, 10.0k ohm, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R8, R9, R10, R11, R12
5
200
RES, 200 ohm, 1%, 0.063W, 0402
0402
CRCW0402200RFKED
Vishay-Dale
R13
1
0
RES, 0 ohm, 5%, 0.063W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R16
1
150k
RES, 150k ohm, 1%, 0.063W, 0402
0402
CRCW0402150KFKED
Vishay-Dale
R17
1
75.0k
RES, 75.0k ohm, 1%, 0.063W, 0402
0402
CRCW040275K0FKED
Vishay-Dale
R18
1
768
RES, 768 ohm, 1%, 0.063W, 0402
0402
CRCW0402768RFKED
Vishay-Dale
R19
1
50k
Trimmer, 50k, 0.25W, SMT
4.8x5.3x3.5mm
3214W-1-503E
Bourns
R20
1
100k
RES, 100k ohm, 1%, 0.063W, 0402
0402
CRCW0402100KFKED
Vishay-Dale
R21, R22
2
2.21k
RES, 2.21k ohm, 1%, 0.063W, 0402
0402
CRCW04022K21FKED
Vishay-Dale
S1
1
Switch, Normally open, 2.3N force, 200k operations, SMD
KSR
KSR221GLFS
C and K Components
TP1
1
Compact Probe Tip Circuit Board Test Points, TH, 25 per
TH Scope Probe
131-5031-00
Tektronix
TP2, TP3
2
Red
Test Point, Miniature, Red, TH
Red Miniature Testpoint
5000
Keystone
TP4, TP11
2
Orange
Test Point, Miniature, Orange, TH
Orange Miniature Testpoint
5003
Keystone
TP5
1
Yellow
Test Point, Miniature, Yellow, TH
Yellow Miniature Testpoint
5004
Keystone
Printed Circuit Board
2x1
1uH
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17
Board Layout, Schematic, and Bill of Materials
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Table 6. bq24296M Bill of Materials (continued)
Designator
Qty
Value
Description
Package Reference
Part Number
Manufacturer
TP6, TP7, TP8
3
SMT
Test Point, Compact, SMT
Testpoint_Keystone_Compact
5016
Keystone
TP9, TP10, TP12, TP13, TP14,
TP15, TP16, TP17, TP18, TP19,
TP20
11
White
Test Point, Miniature, White, TH
White Miniature Testpoint
5002
Keystone
U1
1
I2C Controlled 3A Single Cell USB Charger With Narrow VDC Power Path
Management and Adjustable Voltage USB OTG, RGE0024H
RGE0024H
bq24296MRGE
Texas Instruments
C8, C10, C17, C20
0
1000pF
CAP, CERM, 1000pF, 25V, ±5%, C0G/NP0, 0402
0402
C1005C0G1E102J
TDK
C9
0
2.2uF
CAP, CERM, 2.2uF, 25V, ±10%, X5R, 0402
0402
C1005X5R1E225K050BC
TDK
C11, C12, C13
0
10uF
CAP, CERM, 10uF, 25V, ±20%, X5R, 0603
0603
GRM188R61E106MA73
MuRata
C14
0
0.1uF
CAP, CERM, 0.1uF, 10V, ±10%, X5R, 0402
0402
GRM155R61A104KA01D
MuRata
C18
0
1uF
CAP, CERM, 1uF, 10V, ±10%, X5R, 0402
0402
GRM155R61A105KE15D
MuRata
D1
0
40V
Diode, Schottky, 40V, 0.38A, SOD-523
SOD-523
ZLLS350TA
Diodes Inc.
D2
0
20V
Diode, Schottky, 20V, 1A, 1.4x0.6x0.31mm
1.4x0.6x0.31mm
NSR10F20NXT5G
ON Semiconductor
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or mount.
Fiducial
N/A
N/A
R6, R26
0
10.0k
RES, 10.0k ohm, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R24
0
5.23k
RES, 5.23k ohm, 1%, 0.063W, 0402
0402
CRCW04025K23FKED
Vishay-Dale
R25
0
30.1k
RES, 30.1k ohm, 1%, 0.063W, 0402
0402
CRCW040230K1FKED
Vishay-Dale
18
bq24296M and bq24298 EVM (PWR655) User’s Guide
SLUUB62A – August 2014 – Revised March 2015
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Board Layout, Schematic, and Bill of Materials
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Table 7. bq24298 Bill of Materials
Designator
Qty
Part Number
Manufacturer
Alternate Part
Number
Alternate
Manufacturer
PCB
1
C1
1
1uF
CAP, CERM, 1uF, 25V, +/-10%, X7R, 0603
0603
PWR655
Any
-
-
C1608X7R1E105K080AB
TDK
C2
1
10uF
CAP, CERM, 10uF, 25V, +/-10%, X5R, 0805
C3
1
4.7uF
CAP, CERM, 4.7uF, 16V, +/-10%, X5R, 0603
0805
C2012X5R1E106K125AB
TDK
0603
GRM188R61C475KAAJ
C4
1
0.047uF
MuRata
CAP, CERM, 0.047uF, 25V, +/-10%, X7R, 0402
0402
GRM155R71E473KA88D
C5, C6, C7
3
MuRata
10uF
CAP, CERM, 10uF, 10V, +/-20%, X5R, 0603
0603
C1608X5R1A106M
C21
TDK
1
0.1uF
CAP, CERM, 0.1uF, 10V, +/-10%, X7R, 0402
0402
GRM155R71A104KA01D
MuRata
C22
1
0
RES, 0, 5%, 0.063 W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
D3, D4
2
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190GKT
Lite-On
H1, H2, H3, H4
4
Bumpon, Cylindrical, 0.312 X 0.200, Black
Black Bumpon
SJ61A1
3M
J1, J2, J3, J4
4
Conn Term Block, 2POS, 3.81mm, TH
2POS Terminal Block
1727010
Phoenix Contact
J5
1
Connector, Receptacle, Micro-USB Type B, R/A,
Bottom Mount SMT
7.5x2.45x5mm
0473460001
Molex
J6
1
Terminal Block, 6A, 3.5mm Pitch, 4-Pos, TH
14x8.2x6.5mm
ED555/4DS
On-Shore Technology
J7
1
Header (shrouded), 100mil, 5x2, High-Temperature,
Gold, TH
5x2 Shrouded header
N2510-6002-RB
3M
J8, J9, JP5, JP6, JP7,
JP8, JP9, JP10, JP11
9
Header, 100mil, 2x1, Tin plated, TH
Header, 2 PIN, 100mil,
Tin
PEC02SAAN
Sullins Connector Solutions
JP1, JP2, JP3, JP4
4
Header, 100mil, 3x1, Tin plated, TH
Header, 3 PIN, 100mil,
Tin
PEC03SAAN
Sullins Connector Solutions
L1
1
Inductor, Flat Wire, Powdered Iron, 1uH, 4.8A,
0.0336 ohm, SMD
4.7x1.2x4.0mm
SRP4012-1R0M
Bourns
LBL1
1
Thermal Transfer Printable Labels, 0.650" W x 0.200"
H - 10,000 per roll
PCB Label 0.650"H x
0.200"W
THT-14-423-10
Brady
-
-
R1
1
130
RES, 130 ohm, 1%, 0.063W, 0402
0402
CRCW0402130RFKED
Vishay-Dale
R2
1
5.23k
RES, 5.23k ohm, 1%, 0.063W, 0402
0402
CRCW04025K23FKED
Vishay-Dale
R3
1
30.1k
RES, 30.1k ohm, 1%, 0.063W, 0402
0402
CRCW040230K1FKED
Vishay-Dale
R4, R5, R7, R14, R15,
R23
6
10.0k
RES, 10.0k ohm, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R8, R9, R10, R11,
R12
5
200
RES, 200 ohm, 1%, 0.063W, 0402
0402
CRCW0402200RFKED
Vishay-Dale
R13
1
0
RES, 0 ohm, 5%, 0.063W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R16
1
150k
RES, 150k ohm, 1%, 0.063W, 0402
0402
CRCW0402150KFKED
Vishay-Dale
R17
1
75.0k
RES, 75.0k ohm, 1%, 0.063W, 0402
0402
CRCW040275K0FKED
Vishay-Dale
R18
1
768
RES, 768 ohm, 1%, 0.063W, 0402
0402
CRCW0402768RFKED
Vishay-Dale
R19
1
50k
Trimmer, 50k, 0.25W, SMT
4.8x5.3x3.5mm
3214W-1-503E
Bourns
R21, R22
2
2.21k
RES, 2.21k ohm, 1%, 0.063W, 0402
0402
CRCW04022K21FKED
Vishay-Dale
S1
1
Switch, Normally open, 2.3N force, 200k operations,
SMD
KSR
KSR221GLFS
C and K Components
SH-JP1, SH-JP2, SHJP3, SH-JP8, SH-JP9,
SH-JP10
6
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
SNT-100-BK-G
Samtec
(1)
Value
Description
Package Reference
(1)
Printed Circuit Board
2x1
1uH
1x2
Unless otherwise noted in the Alternate Part Number and/or Alternate Manufacturer columns, all parts may be substituted with equivalents.
SLUUB62A – August 2014 – Revised March 2015
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19
Board Layout, Schematic, and Bill of Materials
www.ti.com
Table 7. bq24298 Bill of Materials (1) (continued)
Designator
Qty
TP1
1
TP2, TP3
2
TP4, TP11
2
TP5
Description
Package Reference
Part Number
Manufacturer
Compact Probe Tip Circuit Board Test Points, TH, 25
per
TH Scope Probe
131-5031-00
Tektronix
Red
Test Point, Miniature, Red, TH
Red Miniature Testpoint
5000
Keystone
Orange
Test Point, Miniature, Orange, TH
Orange Miniature
Testpoint
5003
Keystone
1
Yellow
Test Point, Miniature, Yellow, TH
Yellow Miniature
Testpoint
5004
Keystone
TP6, TP7, TP8
3
SMT
Test Point, Compact, SMT
Testpoint_Keystone_Co
mpact
5016
Keystone
TP9, TP10, TP12,
TP13, TP14, TP15,
TP16, TP17, TP18,
TP19, TP20
11
White
Test Point, Miniature, White, TH
White Miniature Testpoint
5002
Keystone
U1
1
I2C Controlled 3A Single Cell USB Charger With
Narrow VDC Power Path Management and
Adjustable Voltage USB OTG, RTW0024H
RTW0024H
BQ24298RTWR
Texas Instruments
C8, C10, C17, C20
0
1000pF
CAP, CERM, 1000pF, 25V, +/-5%, C0G/NP0, 0402
0402
C1005C0G1E102J
TDK
C9
0
2.2uF
CAP, CERM, 2.2uF, 25V, +/-10%, X5R, 0402
0402
C1005X5R1E225K050BC
TDK
C11, C12, C13
0
10uF
CAP, CERM, 10uF, 25V, +/-20%, X5R, 0603
0603
GRM188R61E106MA73
MuRata
C14
0
0.1uF
CAP, CERM, 0.1uF, 10V, +/-10%, X5R, 0402
0402
GRM155R61A104KA01D
MuRata
C15, C16, C19
0
10uF
CAP, CERM, 10uF, 10V, +/-20%, X5R, 0603
0603
C1608X5R1A106M
TDK
C18
0
1uF
CAP, CERM, 1uF, 10V, +/-10%, X5R, 0402
0402
GRM155R61A105KE15D
MuRata
D1, D5
0
40V
Diode, Schottky, 40V, 0.38A, SOD-523
SOD-523
ZLLS350TA
Diodes Inc.
D2
0
20V
Diode, Schottky, 20V, 1A, 1.4x0.6x0.31mm
1.4x0.6x0.31mm
NSR10F20NXT5G
ON Semiconductor
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or mount.
Fiducial
N/A
N/A
R6, R26
0
10.0k
RES, 10.0k ohm, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R20
0
100k
RES, 100k ohm, 1%, 0.063W, 0402
0402
CRCW0402100KFKED
Vishay-Dale
R24
0
5.23k
RES, 5.23k ohm, 1%, 0.063W, 0402
0402
CRCW04025K23FKED
Vishay-Dale
R25
0
30.1k
RES, 30.1k ohm, 1%, 0.063W, 0402
0402
CRCW040230K1FKED
Vishay-Dale
20
Value
bq24296M and bq24298 EVM (PWR655) User’s Guide
Alternate Part
Number
Alternate
Manufacturer
BQ24298RTWT
Texas Instruments
SLUUB62A – August 2014 – Revised March 2015
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Revision History
www.ti.com
Revision History
Changes from Original (August 2014) to A Revision ..................................................................................................... Page
•
•
•
•
•
•
Added bq24298 EVM information globally to this user guide. .......................................................................
Changed HPA172 to EV2300 or EV2400 globally. ...................................................................................
Changed bq2429x evaluation software to bqStudio in the entire document. ......................................................
Deleted bq24296MEVM label from Original Test Setup for PWR655 image. .....................................................
Changed Main Window of the bq24296M Evaluation Software to update the GUI image for bqStudio. ......................
Added Main Window of the bq24298 Evaluation Software. .........................................................................
1
2
4
5
6
6
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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Copyright © 2014–2015, Texas Instruments Incorporated
Revision History
21
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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