User's Guide
SLUUBA6 – April 2015
bq24780S EVM
The bq24780S evaluation module (EVM) is an SMBus 1- to 4-cell hybrid power boost mode battery
charge controller with power and processor hot monitoring. The input voltage range is between 4.5 V and
24 V, with a programmable output of 1–4 cells charge voltage and 128-mA to 8.128-A charge current. This
EVM does not include the EV2400 interface device; it must be ordered separately to evaluate the
bq24780S EVM.
1
2
3
4
5
Contents
Introduction ................................................................................................................... 3
1.1
EVM Features ....................................................................................................... 3
1.2
I/O Descriptions ..................................................................................................... 3
1.3
Controls and Key Parameters Setting ........................................................................... 3
1.4
Recommended Operating Conditions ............................................................................ 3
Test Summary ................................................................................................................ 4
2.1
Equipment ........................................................................................................... 4
2.2
Equipment Setup.................................................................................................... 5
Procedure ..................................................................................................................... 7
3.1
AC Adapter Detection Threshold ................................................................................. 7
3.2
Charger Parameter Settings....................................................................................... 7
3.3
Charge Current and AC Current Regulation (DPM) ............................................................ 7
3.4
Boost Mode .......................................................................................................... 9
3.5
Power Path Selection .............................................................................................. 9
PCB Layout Guideline ..................................................................................................... 10
Board Layout, Schematic, and Bill of Materials ........................................................................ 11
5.1
PWR583 PCB Layouts ........................................................................................... 11
5.2
Schematics ......................................................................................................... 14
5.3
Bill of Materials .................................................................................................... 15
List of Figures
1
Connections of the EV2400 Kit ............................................................................................ 5
2
Original Test Setup for PWR583 (bq24780S EVM) ..................................................................... 6
3
Main Window of bq24780S Evaluation Software ........................................................................ 6
4
Test Setup for PWR583 ..................................................................................................... 8
5
Top Assembly ............................................................................................................... 11
6
Top Layer.................................................................................................................... 11
7
Mid-Layer 1
12
8
Mid-Layer 2
12
9
10
11
.................................................................................................................
.................................................................................................................
Bottom Layer ................................................................................................................
Bottom Assembly ...........................................................................................................
bq24780SEVM-583 Schematic ...........................................................................................
13
13
14
List of Tables
1
I/O Descriptions .............................................................................................................. 3
2
Controls and Key Parameters Setting
3
Recommended Operating Conditions ..................................................................................... 3
....................................................................................
3
Microsoft, Windows are registered trademarks of Microsoft Corporation.
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4
EV2400 and bq24780S EVM Connections ............................................................................... 5
5
bq24780SEVM-583 Bill of Materials ..................................................................................... 15
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Introduction
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1
Introduction
1.1
EVM Features
Refer to the data sheet (SLUSC27) for detailed features and operation.
1.2
I/O Descriptions
Table 1 lists the I/O descriptions.
Table 1. I/O Descriptions
Jack
Description
J1– DCIN
Connect to AC adapter positive output
J1– GND
Connect to AC adapter, negative output
J2 – SYS
Connect to system
J2 – GND
Power ground, same as J1 – GND
J2 – BAT
Connect to battery positive
J3 – 1 GND
Analog ground
J3 – 2 SDA
J3 – 3 SCL
1.3
Communication interface
J3 – 4 3V3
External 3.3-V power supply
J3 – 5 CMPIN
Integrated comparator input (pin 13)
J3 – 6 CMPOUT
Integrated comparator output (pin 14)
Controls and Key Parameters Setting
Table 2 lists the controls and key parameter settings of the EVM.
Table 2. Controls and Key Parameters Setting
1.4
Jack
Description
Factory Setting
JP1
Connect battery positive input (BAT) to TPS3898 SENSE pin through resistor
divider (R33/R34)
Jumper not installed
JP2
Connect REGN to TPS3898 VCC pin
Jumper not installed
JP3
Connect BAT to bq24780 CMPIN pin through resistor divider (R35/R36)
Jumper not installed
JP4
Connect bq24780 CMPOUT to bq24780/BATPRES pin
Jumper not installed
JP5
Connect TPS3898/SENSE_OUT pin to bq24780/BATPRES pin
Jumper not installed
JP6
Connect battery positive input (BAT) to diode D1
Jumper Installed
Recommended Operating Conditions
Table 3 provides the recommended operating conditions.
Table 3. Recommended Operating Conditions
Description
VIN (1) Supply voltage
Input voltage from AC adapter input
VBAT
Battery voltage
Voltage applied at VBAT terminal
IAC
Supply current
Maximum input current from AC adapter input
IS
Output current
Output current (SYS and CHG)
TJ
Operating junction temperature range
(1)
MIN
TYP
MAX
18
19–20
23
V
3–16.8
17.408
V
4.5
A
0
UNIT
8
A
125
°C
ACDET bias, R5 and R6, is set for this range. For lower adapter voltages, this divider has to be modified. With the proper bias,
VIN MIN can be as low as 4.5 VDC. See the data sheet (SLUSC27) for more information.
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Test Summary
2
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Test Summary
Section 2.1 and Section 2.2 explain the equipment and the equipment setup.
2.1
2.1.1
Equipment
Power Supplies
Power Supply #1 (PS#1): a power supply capable of supplying 20 V at 5 A is required.
Power Supply #2 (PS#2): a power supply capable of supplying 5 V at 1 A is required.
Power Supply #3 (PS#3): a power supply capable of supplying 20 V at 3 A is required.
2.1.2
Loads
LOAD #1: A 30 V (or above), 5-A (or above) electronic load that can operate at constant current mode.
LOAD #2: An HP 6060B 3–60 V/0–60 A, 300-W system DC electronic load, or equivalent.
2.1.3
Meters
Seven Fluke 75 multimeters, (equivalent or better), or four equivalent voltage meters and three equivalent
current meters.
The current meters must be capable of measuring 5 A+ current.
2.1.4
Computer
A computer with at least one USB port and a USB cable. The EV2400 USB driver and the bq24780 SMB
evaluation software must be properly installed.
2.1.5
SMBUS Communication Kit
This EVM is compatible with both the EV2400 and EV2300 hardware kit. TI recommends using the
EV2400 hardware kit.
2.1.6
Install Battery Management Studio (bqStudio) Software
Double click the Battery Management Studio software installation file, follow the installation steps.
2.1.7
Upon First Insertion of EV2400 Into USB Port of PC
Follow the instructions of the Found New Hardware Wizard
• Allow Microsoft® Windows® to connect to Windows Update to search for software, then click Next
• Select Install software automatically (Recommended), then click Next
• If a window pops up informing that the TI USB Firmware Updater has not passed Windows Logo
testing click Continue Anyway
• If a target file already exists and is newer, do not overwrite the newer file
• Click Finish
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Test Summary
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2.2
Equipment Setup
•
•
•
•
•
•
•
•
Set power supply #1 (PS#1) for 0 V ±100 mVDC, with the current limit set to > 5 A. Turn off supply.
Connect PS#1 output in series with a current meter (multimeter) to J1 (VIN, GND)
Connect a voltage meter across J1 (VIN, GND)
Set power supply #2 (PS#2) for 3.3 V ±100 mVDC, with the current limit set to > 0.2 A. Turn off supply.
Connect PS#2 output to J3 (3V3, GND)
Connect a voltage meter across J2 (BAT, GND)
Connect a voltage meter across J2 (SYS, GND)
Connect J3 (SDA, SCL) and J3 (GND) to the EV2400 kit SMB port. Refer to Table 4 for EVM
connections. Connect the USB port of the EV2400 kit to the USB port of the computer. The
connections are shown in Figure 2.
Table 4. EV2400 and bq24780S EVM Connections
bq24780S EVM
EV2400
GND (J3)
VSS 1.1
SCL (J3)
SCL 1.2
SDA (J3)
SDA 1.3
Figure 1. Connections of the EV2400 Kit
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Test Summary
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After completing the previous steps, the test setup for PWR583 appears as shown in Figure 2.
Figure 2. Original Test Setup for PWR583 (bq24780S EVM)
Turn on the computer. Launch the bqstudio evaluation software and select charger and bq24780S. And
then click the Registers button. The main window of the bq24780S software is shown in Figure 3.
Figure 3. Main Window of bq24780S Evaluation Software
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Procedure
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3
Procedure
3.1
AC Adapter Detection Threshold
Use the following steps for AC adapter detection threshold:
1. Ensure Equipment Setup steps are followed. Turn on PS#2.
NOTE: Load #1 and Load #2 are not connected during this step.
2. Turn on PS#1
3. Increase the output voltage of PS#1 to 19.5 V
• Measure → V[TP(ACDET)] = 2.6 V ±0.1 V
• Measure → V[TP(ACOK)] = 3.3 V ±0.1 V
• Measure → V[J2(SYS)] = 19.5 V ±0.5 V
• Measure → V[TP(REGN)] = 5.4 V ±0.5 V
• Measure → V[TP(ACDRV, CMSRC)] = 6 V ±0.5 V
• Measure → V[J2(BAT, GND)] = 2 V ±2 V
3.2
Charger Parameter Settings
In the main software window, click the Refresh button on the top right corner. Make sure there is no error
information.
Type “512” (mA) in ChargeCurrent Register and click OK. This sets the battery charge current regulation
threshold.
Type “12592” (mV) in ChargeVoltage Register and click OK. This sets the battery voltage regulation
threshold:
• Measure → V(J2(BAT)) = 12.6 V ±200 mV
3.3
Charge Current and AC Current Regulation (DPM)
1. Connect Load #2 in series with a current meter (multimeter) to J2 (BAT, GND). Make sure a voltage
meter is connected across J2 (BAT, GND). Turn on Load #2. Use the constant voltage mode. Set
output voltage to 10.5 V.
2. Connect the output of Load #1 in series with a current meter (multimeter) to J2 (SYS, GND). Make
sure a voltage meter is connected across J2 (SYS, GND). Turn on the power of Load #1.
The setup is now like Figure 4 for PWR583.
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Procedure
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Figure 4. Test Setup for PWR583
3. Type “2944” (mA) in ChargeCurrent Register and click OK.
This sets the battery charge current regulation threshold to 2.944 A.
• Measure → IBAT = 3000 mA ±300 mA
• Measure → V[TP(IIADP)] = 340 mV ±40 mV
4. Set Load #1 current to 3.0 A ±50 mA but disable the output. Make sure ISYS = 0 A ±10 mA. Enable
the output of Load #1.
• Measure → ISYS = 3000 mA ±300 mA
• Measure → IBAT = 1800 mA ±300 mA
• Measure → IIN = 4100 mA ±400 mA
• Measure → V[TP(IIADP]) = 820 mV ±100 mV
5. Turn off the Load #1.
• Measure → ISYS = 0 ±100 mA
• IBAT = 3000 mA ±300 mA
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Procedure
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3.4
Boost Mode
Use the following steps for boost mode:
1. Enter “1A44” in ChargeOption3 value to enable the turbo boost function
2. Change Load #2 with PS#3. Make sure a voltage meter is connected across J2 (BAT, GND).
3. Enable the output of PS#3. Make sure the output voltage is 10 V ±500 mV and 3-A current limit.
4. Set Load #1 load current to 5.0 A ±50 mA. Enter boost mode.
• Measure → ISYS = 5000 mA ±500 mA
• Measure → IBAT = –1700 mA ±300 mA
• Measure → IIN = 4100 mA ±400 mA
• Measure → V[TP(IIADP)] = 820 mV ±100 mV
• Measure → V[TP(IIDCHG)] = 270 mV±100 mV
5. Set Load #1 load current to 0.5 A ±50 mA. Exit boost mode. Back to charging mode.
• Measure → ISYS = 500 mA ±50 mA
• Measure → IBAT = 3000 mA ±300 mA
• Measure → IIN = 2100 mA ±400 mA
3.5
Power Path Selection
The setup for power path selection follows:
1. Change Load #2 with PS#3. Make sure a voltage meter is connected across J2 (BAT, GND)
2. Enable the output of PS#3. Ensure the output voltage is 10 V ±500 mV and 3-A current limit.
3. Set Load #1 load current to 0.5 A ±50 mA
4. Enter “E109” in ChargeOption0, this disables charging
5. Make sure a voltage meter is connected across J2 (BAT, GND)
• Measure → V(J2(SYS)) = 19.5 V ±1 V (adapter connected to system)
6. Turn off PS#1
• Measure → V[J2(SYS)] = 10 V ±1 V (battery connected to system)
• Measure → V[J2(BAT)] = 10 V ±1 V (battery connected to system)
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PCB Layout Guideline
4
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PCB Layout Guideline
The switching node rise and fall times should be minimized for minimum switching loss. Proper layout of
the components to minimize high frequency current path loop is important to prevent electrical and
magnetic field radiation and high-frequency resonant problems. Here is a PCB layout priority list for proper
layout. Layout of the PCB according to this specific order is essential.
1. Place input capacitor as close as possible to switching MOSFET’s supply and ground connections and
use the shortest possible copper trace connection. These parts should be placed on the same layer of
PCB instead of on different layers and using vias to make this connection.
2. The IC should be placed close to the switching MOSFET’s gate pins and keep the gate drive signal
traces short for a clean MOSFET drive. The IC can be placed on the other side of the PCB from the
switching MOSFETs.
3. Place the inductor input pin to the switching MOSFET’s output pin as close as possible. Minimize the
copper area of this trace to lower electrical and magnetic field radiation but make the trace wide
enough to carry the charging current. Do not use multiple layers in parallel for this connection.
Minimize parasitic capacitance from this area to any other trace or plane.
4. The charging current sensing resistor should be placed right next to the inductor output. Route the
sense leads connected across the sensing resistor back to the IC in same layer, close to each other
(minimize loop area) and do not route the sense leads through a high-current path. Place decoupling
capacitor on these traces next to the IC.
5. Place the output capacitor next to the sensing resistor output and ground.
6. Output capacitor ground connections need to be tied to the same copper that connects to the input
capacitor ground before connecting to system ground.
7. Use a single ground connection to tie charger power ground to charger analog ground. Just beneath
the IC, use analog ground copper pour but avoid power pins to reduce inductive and capacitive noise
coupling.
8. Route analog ground separately from power ground. Connect analog ground and connect power
ground separately. Connect analog ground and power ground together using the power pad as the
single ground connection point or using a 0-Ω resistor to tie analog ground to power ground (power
pad should tie to analog ground in this case, if possible).
9. Decoupling capacitors should be placed next to the IC pins and make the trace connection as short as
possible.
10. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB
ground. Ensure that there are sufficient thermal vias directly under the IC, connecting to the ground
plane on the other layers.
11. The via size and number should be enough for a given current path.
See the EVM design for the recommended component placement with trace and via locations. For the
WQFN information, see SCBA017 and SLUA271.
10
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Board Layout, Schematic, and Bill of Materials
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5
Board Layout, Schematic, and Bill of Materials
This section contains the PWR583 PCB layouts, schematics, and bill of materials.
5.1
PWR583 PCB Layouts
Figure 5 through Figure 10 show the PCB layouts for the PWR583 EVM.
Figure 5. Top Assembly
Figure 6. Top Layer
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Board Layout, Schematic, and Bill of Materials
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Figure 7. Mid-Layer 1
Figure 8. Mid-Layer 2
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Figure 9. Bottom Layer
Figure 10. Bottom Assembly
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Board Layout, Schematic, and Bill of Materials
5.2
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Schematics
The bq24780SEVM-583 (Figure 11) schematic is provided for reference.
Q7
BSS138W-7-F
50V
PGND
5
4
3
2
3.01Meg
PGND
C1
2.2µF
0.01
4
C15
1µF
C16
R3
430k
C2
10µF
C3
10µF
HIDRV
0.1µF
C12
1000pF
R1
3.9
7,8
5,6,
7,8
5,6,
Q2
30V
R7
4.7
BTST
R2
3.9
R4
66.5k
JP6
REGN
C18 C19
0.1µF 0.1µF
C24
0.047µF
D2
DNP
DNP
DNP
C6
10µF
ACDET
SRN
19
BATDRV
18
BATSRC
17
TB_STAT
16
BATPRES
15
5,6,
7,8
PGND
1,2,3
23
25
22
GND
LODRV
REGN
BTST
HIDRV
IADP
IDCHG
GND
21
20
R21
316k
C29
0.1uF
R25
DNP
DNP
30V
C25
470pF
C30
0.1µF
3V3
ILIM
PGND
SRP
R26
SRN
10.0
BATDRV
R28
10.0
BATSRC
4.02k
R29
GND
R27
10.0
TB_STAT
R10
DNP
DNP
BATPRES
R41
10.0k
CMPOUT
ACOK
6
CMPIN
5
7
ACDET
ILIM
SRP
BQ24780SRUY
SCL
CMSRC
ACDRV
0.1µF
DNPC26
DNP
Q5
4
C22
0.01µF
U1
SDA
3
4
GND
ACOK
DNPC14
DNP
ACP
PROCHOT
R11
10.0k
PHASE
PAD
GND
ACN
2
3V3
VCC
2.2µF
ACN
ACP
1
R14
DNP
DNP
C28
100k
PGND
CMSRC
ACDRV
R17
10.0
24
28
R13
4.02k
C7 DNPC8 DNPC9 DNP D8
10µF
DNP
DNP
DNP
PGND
R20
26
R16
0
PMON
R12
4.02k
30V
ILIM
JP1
3V3
14
13
12
IDCHG
11
10
8
IADP
9
30V
C20
1µF
GND
R15
0
GND
27
GND
PGND D7
BAT
0.01
L1
IHLP3232DZER3R3M01
3.3µH
C21
LODRV
VCC
D1
J2
C27
0.01µF
PGND
DNP
BAT
DNP
C11
C10 DNPDNP
22µF
R23
D9
VCC
SYS
4
PGND
R19
6.8
DNPC17
DNP
C5
10µF
30V
DNPC23
DNP
PHASE
PGND
C13
0.047µF
C4
10µF
Q4
4
1,2,3
1,2,3
5,6,
7,8
1,2,3
Q1
30V
1,2,3
7,8
5,6,
J1
Q6
DNP
30V
Q3
30V
R8
7,8
5,6,
4.5 ~ 24V
DNP
1,2,3
R6
VIN
TP1
1
R5
1.00Meg
JP4
PMON
C31
100pF
3V3
J3
C32 DNPC33
100pF
100pF
R45
1.00Meg
R40
10.0k
GND
NT1
Net-Tie
SCL
SDA
CMPOUT
R39
10.0k
CMPIN
R37
10.0k
PROCHOT
C37
2.2µF
PGND
3V3
R46
10.0k
5
6
R9
10.0k
R33
499k
R35
140k
R34
49.9k
R36
100k
U2
JP3
CMPIN
SCL
R31
10.0k
4
CMPOUT
6
5
4
3
2
1
BAT
JP2
REGN
JP5
R47
30.1k
C34
2200pF
C35
0.1µF
SENSE_OUT
SENSE
CT
GND
VCC
ENABLE
3
2
1
R32
10.0k
TPS3898ADRY
SDA
GND
GND
GND
GND
GND
3V3
R38
2.00k
TP2
TP3
TP4
TP5
CMSRC
TP6
TP7
TP8
TP9
PROCHOT
ACOK
Q8
2N7002ET1G
60V
BATPRES
TB_STAT
D6
Orange
D3
Green
GND
REGN
BATPRES
IADP
D4
Green
BATDRV
PROCHOT
ACDET
R44
2.00k
ACOK
D5
Orange
ILIM
PMON
R30
2.00k
TP12 TP13 TP14 TP15 TP16 TP17
TP10 TP11
IDCHG
ACDRV
R42
2.00k
TB_STAT
GND
VCC
Figure 11. bq24780SEVM-583 Schematic
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5.3
Bill of Materials
Table 5 lists the bq24780SEVM-583 BOM.
Table 5. bq24780SEVM-583 Bill of Materials
Designator
Qty
Value
Description
Package
Reference
PartNumber
Manufacturer
!PCB
1
C1
1
2.2uF
CAP, CERM, 2.2uF, 25V, +/-10%, X7R, 1206
1206
PWR583
Any
GRM31MR71E225KA93L
C2, C3, C4, C5, C6, C7
6
10uF
CAP, CERM, 10uF, 25V, +/-10%, X5R, 1206
MuRata
1206
GRM31CR61E106KA12L
C10
1
22uF
MuRata
CAP, CERM, 22uF, 25V, +/-10%, X5R, 1210
1210
GRM32ER61E226KE15L
C12
1
MuRata
1000pF
CAP, CERM, 1000pF, 50V, +/-10%, X7R,
0603
0603
GRM188R71H102KA01D
MuRata
C13, C24
2
0.047uF
CAP, CERM, 0.047uF, 50V, +/-10%, X7R,
0603
0603
GRM188R71H473KA61D
MuRata
C15, C20
2
1uF
CAP, CERM, 1uF, 25V, +/-10%, X7R, 0603
0603
GRM188R71E105KA12D
MuRata
C16, C18, C19, C28, C29,
C30, C35
7
0.1uF
CAP, CERM, 0.1uF, 25V, +/-10%, X7R, 0603
0603
GRM188R71E104KA01D
MuRata
C21
1
2.2uF
CAP, CERM, 2.2uF, 16V, +/-10%, X5R, 0603
0603
GRM188R61C225KE15D
MuRata
C22, C27
2
0.01uF
CAP, CERM, 0.01uF, 50V, +/-10%, X7R,
0603
0603
C0603X103K5RACTU
Kemet
C25
1
470pF
CAP, CERM, 470pF, 50V, +/-10%, X7R, 0603
0603
GRM188R71H471KA01D
MuRata
C31, C32
2
100pF
CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0,
0603
0603
C0603C101J5GAC
Kemet
C34
1
2200pF
CAP, CERM, 2200pF, 50V, +/-5%, C0G/NP0,
0805
0805
C2012C0G1H222J
TDK
C37
1
2.2uF
CAP, CERM, 2.2uF, 10V, +/-10%, X7R, 0603
0603
GRM188R71A225KE15D
MuRata
D1, D7
2
30V
Diode, Schottky, 30V, 0.2A, SOD-323
SOD-323
BAT54HT1G
ON Semiconductor
D3, D4
2
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190GKT
Lite-On
D5, D6
2
Orange
LED, Orange, SMD
1.6x0.8x0.8mm
LTST-C190KFKT
Lite-On
H9, H10, H11, H12
4
Bumpon, Hemisphere, 0.44 X 0.20, Clear
Transparent
Bumpon
SJ-5303 (CLEAR)
3M
J1
1
TERMINAL BLOCK 5.08MM VERT 2POS
TERM_BLK, 2pos,
5.08mm
ED120/2DS
On-Shore
Technology, Inc.
J2
1
TERMINAL BLOCK 5.08MM VERT 3POS
TERM_BLK, 3pos,
5.08mm
ED120/3DS
On-Shore
Technology, Inc.
J3
1
Terminal Block, 6A, 3.5mm Pitch, 6-Pos, TH
20.5x8.2x6.5mm
ED555/6DS
On-Shore
Technology, Inc.
JP1, JP2, JP3, JP4, JP5,
JP6
6
Header, 100mil, 2x1, Gold plated, TH
Header, 2x1,
100mil
5-146261-1
TE Connectivity
L1
1
Inductor, Shielded, Powdered Iron, 3.3uH,
9.2A, 17.7 ohm, SMD
322x158x322mil
IHLP3232DZER3R3M01
Vishay-Dale
LBL1
1
Thermal Transfer Printable Labels, 0.650" W
x 0.200" H - 10,000 per roll
PCB Label
0.650"H x 0.200"W
THT-14-423-10
Brady
Q1, Q2, Q3, Q4, Q5
5
30V
MOSFET, N-CH, 30V, 47A, SON 3.3x3.3mm
SON 3.3x3.3mm
CSD17308Q3
Texas Instruments
Q7
1
50V
MOSFET, N-CH, 50V, 0.2A, SOT-323
SOT-323
BSS138W-7-F
Diodes Inc.
Q8
1
60V
MOSFET, N-CH, 60V, 0.26A, SOT-23
SOT-23
2N7002ET1G
ON Semiconductor
R1, R2
2
3.9
RES, 3.9 ohm, 5%, 0.5W, 1210
1210
ERJ-14YJ3R9U
Panasonic
R3
1
430k
RES, 430k ohm, 1%, 0.1W, 0603
0603
RC0603FR-07430KL
Yageo America
R4
1
66.5k
RES, 66.5k ohm, 1%, 0.1W, 0603
0603
CRCW060366K5FKEA
Vishay-Dale
R5, R45
2
1.00Meg
RES, 1.00Meg ohm, 1%, 0.1W, 0603
0603
CRCW06031M00FKEA
Vishay-Dale
R6
1
3.01Meg
RES, 3.01Meg ohm, 1%, 0.1W, 0603
0603
CRCW06033M01FKEA
Vishay-Dale
R7
1
4.7
RES, 4.7 ohm, 5%, 0.1W, 0603
0603
CRCW06034R70JNEA
Vishay-Dale
R8, R23
2
0.01
RES, 0.01 ohm, 1%, 1W, 1206
1206
WSLP1206R0100FEA
Vishay-Dale
R9, R11, R31, R32, R37,
R39, R40, R41, R46
9
10.0k
RES, 10.0k ohm, 1%, 0.1W, 0603
0603
CRCW060310K0FKEA
Vishay-Dale
R12, R13, R28
3
4.02k
RES, 4.02k ohm, 1%, 0.1W, 0603
0603
CRCW06034K02FKEA
Vishay-Dale
R15, R16
2
0
RES, 0 ohm, 5%, 0.1W, 0603
0603
CRCW06030000Z0EA
Vishay-Dale
R17
1
10.0
RES, 10.0 ohm, 1%, 0.25W, 1206
1206
ERJ-8ENF10R0V
Panasonic
R19
1
6.8
RES, 6.8 ohm, 5%, 0.1W, 0603
0603
CRCW06036R80JNEA
Vishay-Dale
R20, R36
2
100k
RES, 100k ohm, 5%, 0.1W, 0603
0603
CRCW0603100KJNEA
Vishay-Dale
R21
1
316k
RES, 316k ohm, 1%, 0.1W, 0603
0603
CRCW0603316KFKEA
Vishay-Dale
R26, R27, R29
3
10.0
RES, 10.0 ohm, 1%, 0.1W, 0603
0603
RC0603FR-0710RL
Yageo America
R30, R38, R42, R44
4
2.00k
RES, 2.00k ohm, 1%, 0.1W, 0603
0603
CRCW06032K00FKEA
Vishay-Dale
R33
1
499k
RES, 499k ohm, 1%, 0.1W, 0603
0603
CRCW0603499KFKEA
Vishay-Dale
Printed Circuit Board
3.3uH
SLUUBA6 – April 2015
Submit Documentation Feedback
bq24780S EVM
Copyright © 2015, Texas Instruments Incorporated
15
Board Layout, Schematic, and Bill of Materials
www.ti.com
Table 5. bq24780SEVM-583 Bill of Materials (continued)
16
Designator
Qty
Value
Description
Package
Reference
PartNumber
Manufacturer
R34
1
49.9k
RES, 49.9k ohm, 1%, 0.1W, 0603
0603
CRCW060349K9FKEA
Vishay-Dale
R35
1
140k
RES, 140k ohm, 1%, 0.1W, 0603
0603
CRCW0603140KFKEA
Vishay-Dale
R47
1
30.1k
RES, 30.1k ohm, 1%, 0.1W, 0603
0603
CRCW060330K1FKEA
Vishay-Dale
TP2, TP3, TP4, TP5, TP6,
TP7, TP8, TP9, TP10,
TP11, TP12, TP13, TP17
13
White
Test Point, TH, Miniature, White
Keystone5002
5002
Keystone
TP14
1
Orange
Test Point, Miniature, Orange, TH
Orange Miniature
Testpoint
5003
Keystone
TP15, TP16
2
Black
Test Point, Miniature, Black, TH
Black Miniature
Testpoint
5001
Keystone
U1
1
1-4 Cell Turbo Boost Mode Battery Charge
Controller with Power Monitoring and
/PROCHOT for CPU Throttling, RUY0028A
RUY0028A
BQ24780SRUY
Texas Instruments
U2
1
Single-Channel, Adjustable Supervisory
Circuit in Ultra-Small Package, DRY0006A
DRY0006A
TPS3898ADRY
Texas Instruments
C8, C9
0
10uF
CAP, CERM, 10uF, 25V, +/-10%, X5R, 1206
1206
GRM31CR61E106KA12L
MuRata
C11
0
150uF
CAP, TA, 150uF, 16V, +/-20%, 0.05 ohm,
SMD
7.3x2.8x4.3mm
16TQC150MYF
Panasonic
C14, C26
0
DNP
CAP, CERM, 0.1uF, 25V, +/-10%, X7R, 0603
0603
GRM188R71E104KA01D
MuRata
C17
0
1uF
CAP, CERM, 1uF, 25V, +/-10%, X7R, 0603
0603
GRM188R71E105KA12D
MuRata
C23
0
0.1uF
CAP, CERM, 0.1uF, 25V, +/-10%, X7R, 0603
0603
GRM188R71E104KA01D
MuRata
C33
0
100pF
CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0,
0603
0603
C0603C101J5GAC
Kemet
D2
0
DNP
Diode, Schottky, 30V, 0.2A, SOD-323
SOD-323
BAT54HT1G
ON Semiconductor
D8
0
DNP
Diode, Schottky, 20V, 1A, SMA
SMA
SS12-E3/61T
VishaySemiconductor
D9
0
8.2V
Diode, Zener, 8.2V, 500mW, SOD-123
SOD-123
BZT52C8V2-7-F
Diodes Inc.
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or
mount.
Fiducial
N/A
N/A
H1, H2, H3, H4
0
Machine Screw, Round, #4-40 x 1/4, Nylon,
Philips panhead
Screw
NY PMS 440 0025 PH
B&F Fastener
Supply
H5, H6, H7, H8
0
Standoff, Hex, 0.5"L #4-40 Nylon
Standoff
1902C
Keystone
Q6
0
30V
MOSFET, N-CH, 30V, 47A, SON 3.3x3.3mm
SON 3.3x3.3mm
CSD17308Q3
Texas Instruments
R10
0
DNP
RES, 84.5k ohm, 0.1%, 0.1W, 0603
0603
RG1608P-8452-B-T5
Susumu Co Ltd
R14
0
DNP
RES, 0 ohm, 5%, 0.1W, 0603
0603
CRCW06030000Z0EA
Vishay-Dale
R25
0
DNP
RES, 100k ohm, 1%, 0.1W, 0603
0603
CRCW0603100KFKEA
Vishay-Dale
TP1
0
Compact Probe Tip Circuit Board Test Points,
TH, 25 per
TH Scope Probe
131-5031-00
Tektronix
bq24780S EVM
SLUUBA6 – April 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
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excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
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Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
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Copyright © 2015, Texas Instruments Incorporated
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Products
Applications
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www.ti.com/audio
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Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
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Clocks and Timers
www.ti.com/clocks
Industrial
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Logic
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Video and Imaging
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RFID
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www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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