User's Guide
SLUUBC8A – August 2015 – Revised May 2016
bq2512x Evaluation Module
The bq2512x evaluation module (EVM) is a high-performance, easy-to-use development kit for the design
of a compact, flexible, high-efficiency, lower power management solution for single-cell, Li-ion and Lipolymer batteries used in wearables and low-power portable applications.
This user's guide details both the bq25120EVM and bq25121EVM features, test summary, and test
results. Also included are the EVM schematic, bill of materials, and PCB board layouts.
PCB Configurations
1
2
3
4
5
Device
PCB
bq25120
PWR731
bq25121
PWR812
Contents
Introduction ................................................................................................................... 2
1.1
bq2512x IC Features ............................................................................................... 2
1.2
bq2512x EVM Features ............................................................................................ 2
1.3
Schematic ............................................................................................................ 3
1.4
I/O Description ...................................................................................................... 4
1.5
Test Points ........................................................................................................... 5
1.6
Default Settings ..................................................................................................... 5
1.7
Recommended Operating Conditions ............................................................................ 6
Test Summary ................................................................................................................ 6
2.1
Recommended Test Equipment .................................................................................. 6
2.2
Recommended Test Equipment Setup .......................................................................... 7
2.3
Software GUI (When I2C Communication is Used) ............................................................. 8
Test Procedure ............................................................................................................... 9
3.1
Set the Potentiometers ............................................................................................. 9
3.2
Charge Disabled .................................................................................................... 9
3.3
Charge Current Regulation ........................................................................................ 9
3.4
Ship Mode (Optional if I2C Control not Used) ................................................................... 9
Helpful Hints ................................................................................................................ 10
Bill of Materials and Board Layout ....................................................................................... 11
5.1
Bill of Materials .................................................................................................... 11
5.2
Board Layouts ..................................................................................................... 13
List of Figures
1
bq2512xEVM Schematic (bq25120 Represented) ...................................................................... 3
2
BAT Load (PR1010) Schematic
3
Test Setup (PWR731 for bq2512xEVM-731 Shown)
4
5
6
7
8
9
........................................................................................... 6
................................................................... 7
EV2400 Interface Box Connection ........................................................................................ 8
bq2512x Software GUI ...................................................................................................... 8
Select EN_SHIPMODE .................................................................................................... 10
Top Overlay ................................................................................................................. 13
Top Solder Mask ........................................................................................................... 13
Top Layer.................................................................................................................... 14
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..............................................................................................................
Signal Layer 2 ..............................................................................................................
Bottom Layer ................................................................................................................
Bottom Solder Mask .......................................................................................................
Bottom Overlay .............................................................................................................
Drill Drawing ................................................................................................................
Board Dimensions ..........................................................................................................
PWR812 Composite Layout ..............................................................................................
1
Description of the IO Connectors on PCB ................................................................................ 4
2
Test Points Description
3
Default Settings .............................................................................................................. 5
4
Initial Jumper Position ....................................................................................................... 5
5
Recommended Operating Conditions ..................................................................................... 6
6
bq2512xEVM Bill of Materials
10
11
12
13
14
15
16
Signal Layer 1
14
15
15
16
16
17
17
18
List of Tables
1
Introduction
1.1
bq2512x IC Features
.....................................................................................................
............................................................................................
5
11
The bq2512x is a highly-integrated battery charge management IC that integrates the most common
functions for wearable devices: linear charger, regulated output, load switch, manual reset with timer, and
battery voltage monitor. The low quiescent current during operation and shutdown enables maximum
battery life. The device supports charge currents from 5 mA to 300 mA. The input current limit, charge
current, PWM output voltage, LDO output voltage, and other parameters are programmable through the
I2C interface. The battery is charged using a standard Li-Ion charge profile with three phases: precharge,
constant current, and constant voltage.
1.2
bq2512x EVM Features
The bq2512x EVM is a complete battery power management module for evaluating compact, highlyintegrated, flexible, high efficiency, linear charging solution for single cell, Li-Ion and Li-Polymer batterypowered systems used in wearables and low-power portable applications. Key EVM features include:
• Configurable 300-mA buck regulator (1.8-V default)
• 700-nA typical IQ with PWM enabled
• 0.5% accurate battery voltage regulation (configurable from 3.6 V to 4.65 V in 10-mV steps)
• Configurable termination current down to 500 µA
• 2.5 mm × 2.5 mm WCSP package and 6 external components for minimum solution
• Power path management for powering the system and charging the battery
• Power path management enables < 150 nA ship mode battery quiescent current for longest shelf life
• Push-button wake-up and reset with adjustable timers
• Battery charger operates from 3.4 V – 5.5 V VIN (5.5-V OVP / 20-V tolerant)
• I2C control of key parameters
2
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Introduction
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1.3
Schematic
Figure 1 illustrates the EVM schematic.
EV2400 I2C
J1
R4
1
R9
TP2 2.00
TP4
2.00
4
3
2
1
5V USB
6
7
8
9
10
11
2
GND
PMID
3
J10
TP11
0
R16
4
PMID
J22
SYS_S+
5
U1
IN
TP13
C1
4.7µF
A2
C2
1µF
B5
A3
B3
GND
VINLS
GND
TS
C3
S1
Input Voltage
3.4V - 5.5V
1
2
SYS
4
3
TP3
SYS
J2
BAT
BAT
TS
LS/LDO
SDA
E4
LSCTRL
ISET
/CD
RESET
MR
PG
LSCTRL
CD
IPRETERM
C2
/CD
J11
GND
INT
ISET
GND
GND
ILIM
PGND
J14
3
2
1
GND
R20
3
2
1
J24
GND
BAT
GND
LS/LDO_S+
R18
C5
0
J25
1
2
3
D4
TP7
J26
L1
D2
1
TP10
MDT2012-CH2R2AN
A1
D5
R19
0
SYS
GND_S-
J17
A5
Output Voltage
1.1V - 3.3V
2
PEC03SAAN
100k
0
J28
PGND
GND
ILIM
PGND
GND
GND
GND_S-
PEC03SAAN
R7
499
R11
499
GND
SYS
J7
TP8
1µF
R5
4.99k
R8
R12
50k
5K
Battery Voltage
3.6V - 4.65V
BAT
C6
SYS
J27
C9
10µF
R14
SYS
PEC03SAAN
PMID
VINLS
SYS
/RESET
D3
BQ25120YFF
R6
0
0
PEC03SAAN
SDA
E3
C1
R17
B1
B2
VINLS
E2
D1
IPRETERM
3
2
1
PMID
PMID
SCL
GND
J9
BAT_S+
E5
E1
SW
A4
TP14
SCL
GND_S-
GND
SW
SYS
VINLS
VINLS
J3
J4
IN
B4
C4
/MR
J8
VIN
C3
4.7µF
SYS
R15 0
IN_S+
J29
GND
BAT
GND_S-
PMID
J30
PMID
GND
J31
J5
GND
LS/LDO
R2
14.0k
J6
3
2
1
TP9
C7
PEC03SAAN
1
R3
14.3k
1
1µF
TP1
D2
Green
GND
20k
LS/LDO
GND_S-
J33
2
2
D1
Red
R1
J32
GND
R10
499
R13
499
J34
GND
/PG
J15
INT
J12
TP6
GND
TP5
Figure 1. bq2512xEVM Schematic (bq25120 Represented)
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1.4
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I/O Description
Table 1 lists the descriptions of the IO connectors on the PCB.
Table 1. Description of the IO Connectors on PCB
4
Header or Terminal Block
Description
J1 - USB power input
Micro USB connector for USB input power
J2 - IN (Force line)
Headers for extra connections to IN-Force
J3 - IN/GND (Sense line)
Headers for IN-Sense and GND
J4 - GND
Headers for extra connections to GND
J5 - TS to PMID
Headers for TS pin to be pulled up to PMID
J6 - TS
Headers for TS pin to be connected either to PMID or external resistor
J7 - CD
Headers for /CD pin to be pulled up to SYS pin
J8 - LS/CTRL
Headers for LS/CTRL pin to be pulled up to SYS pin
J9 - IPRETERM
Headers for IPRETERM pin to be connected to an external resistor or shorted to GND
J10 - EV2400
The 4-wire connector for EV2400 communication interface
J11 - ISET
Headers for ISET pin to be connected to an external resistor or shorted to GND
J12 - INT
Headers for INT pin to be pulled up to SYS pin through a LED light
J14 - ILIM
Headers for ILIM pin to be connected to an external resistor or shorted to GND
J15 - /PG
Headers for /PG pin to be pulled up to SYS pin through a LED light
J17 - /RESET
Headers for /RESET pin to be pulled up to SYS pin through a 100-kΩ resistor
J22 - PMID
Headers for extra connections to PMID
J24 - GND
Headers for extra connections to GND
J25 - PMID/VINLS/SYS
Headers for PMID/VINLS/SYS connections
J26 - SYS
Headers for extra connections to SYS-Force
J27 - SYS/GND (Sense line)
Headers for SYS-Sense and GND
J28 - GND
Headers for extra connections to GND
J29 - BAT
Headers for extra connections to BAT-Force
J30 - BAT/GND (Sense line)
Headers for BAT-Sense and GND
J31 - GND
Headers for extra connections to GND
J32 - LS/LDO
Headers for extra connections to LS/LDO-Force
J33 - LS/LDO (Sense line)
Headers for LS/LDO-Sense and GND
J34 - GND
Headers for extra connections to GND
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1.5
Test Points
Table 2 provides descriptions of the test points.
Table 2. Test Points Description
1.6
Test Points
Description
TP1
TS pin
TP2
SDA pin
TP3
/MR pin
TP4
SCL pin
TP5
INT pin
TP6
/PG pin
TP7
/RESET pin
TP8
BAT pin
TP9
LS/LDO pin
TP10
SYS pin
TP11
PMID pin
TP13
IN pin
TP14
SW pin
TP /CD
/CD pin
Default Settings
The bq2512xEVM module has provided the capability of changing key parameters using I2C and the
EV2400 communication interface. However, I2C communication is not required for this device to operate.
The module is programmed to the default settings as is described in Table 3, Table 4 shows the initial
jumper positions on the PCB.
Table 3. Default Settings
Parameter
Options
bq2512x
BAT_UVLO
2.2 V to 3.4 V (200-mV step)
3.0 V
VSYS
1.1 V to 3.3 V (100-mV step)
1.8 V
LS/LDO
LS, 0.8 V to 3.3 V (100-mV step)
LS
VBREG
3.6 V to 4.65 V (10-mV step)
4.2 V
ICHG
5 mA to 300 mA
10 mA
IPRETERM
500 µA to 50 mA
2 mA
Input ILIM
50 mA to 400 mA (50-mA step)
100 mA
VIN_DPM_ON
On or Off
On
VIN_DPM Threshold
4.2 V to 4.9 V
4.6 V
Auto Charge
On or Off
On
Safety Timer
30 min, 3 hr, 9 hr, Disabled
3 hr
Table 4. Initial Jumper Position
J6
J9
J11
J12
J14
J15
J25
TS = TS_Pot
ITERM = GND
ISET= GND
Installed
ILIM = GND
Installed
VINLS = PMID
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1.7
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Recommended Operating Conditions
The recommended operating conditions are shown in Table 5.
Table 5. Recommended Operating Conditions (1) (2)
VIN
NOM
MAX
Unit
3.4
5
20
V
IN operating voltage range, recommended
3.4
5
5.5
VBAT
VBAT operating voltage range
5.5(1)
V
VVINLS
VINLS voltage range for Load Switch
0.8
5.5(2)
V
VVINLS
VINLS voltage range for LDO
2.2
5.5
V
IIN
Input Current, IN input
400
mA
ISW
Output Current from SW, DC
300
mA
IPMID
Output Current from PMID, DC
300
mA
ILS/LDO
Output Current from LS/LDO
100
mA
IBAT, ISYS
Charging and discharging using internal battery FET
300
mA
TJ
Operating junction temperature range
125
°C
(1)
(2)
2
MIN
IN voltage range
-40
Any voltage greater than shown should be a transient event.
These inputs will support 6.6 V for less than 10% of the lifetime at V(BAT) or VIN, with a reduced current and/or performance.
Test Summary
This section describes the test configuration of the bq2512xEVM evaluation module for bench evaluation.
2.1
Recommended Test Equipment
2.1.1
Power Supplies
1. Power Supply #1 (PS#1): a power supply capable of supplying 5 V at 1 A is required.
2. Power Supply #2 (PS#2): a power supply capable of supplying 5 V at 1 A is required.
2.1.2
Load
Testing with an actual battery is the best way to verify operation in the system. If a battery is unavailable,
then a source meter like a Keithley 2420, capable of both sourcing and sinking current, or a circuit similar
to the one shown in Figure 2 can simulate a battery when connected to PS#2.
Figure 2. BAT Load (PR1010) Schematic
6
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2.1.3
Meters
Three voltage meters and two current meters. The current meters must be able to measure at least 0.5-A
current.
2.1.4
Tool/Software GUI (Optional)
The following optional items can be used for testing:
1. EV2400 Communication Interface Board
2. bqStudio Software GUI
2.2
Recommended Test Equipment Setup
The following guidelines provide the recommended test equipment setup:
1. Set power supply #1 (PS#1) for 5 V ±100 mV DC, 1-A current limit and then turn off supply. Set power
supply #2 (PS#2) for 3.5 V and then turn off supply.
2. Connect the positive output of PS#1 through a current meter (CM#2) to IN (J2) and negative output to
GND (J34).
3. Connect a voltage meter (VM#1) across J2 and J34.
4. Connect the PR1010 BAT+ terminal of PR1010 in series with a current meter (CM#1) to BAT (J29).
Connect PR1010 BAT – to GND (J34). Connect the P/S+ and P/S return side of PR1010 to PS#2, set
the voltage to 3.5 V ±50 mV, then disable PS#2.
5. Connect a voltage meter (VM#2) across BAT (J29) and GND (J34).
6. Connect a DMM (VM#3) across SYS (SYS_S+ of J27) and GND (GND_S– of J27).
7. Configure jumpers as shown in Table 4.
After the preceding steps are accomplished, the test setup for PWR731 is as shown in Figure 3. The
setup is similar for PWR812 with the bq25121.
Figure 3. Test Setup (PWR731 for bq2512xEVM-731 Shown)
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Test Summary
2.3
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2
Software GUI (When I C Communication is Used)
When using I2C communication, implement the following steps with the software GUI:
1. Install the bqStudio software GUI.
2. Connect the EV2400 interface board to the EVM (as shown in Figure 4) http://www.ti.com/tool/EV2400.
3. Open Software GUI and go to “Field View” page (as shown in Figure 5).
4. Change the parameters in the pull-down menu or check/uncheck the selection box.
Figure 4. EV2400 Interface Box Connection
Figure 5. bq2512x Software GUI
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Test Procedure
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3
Test Procedure
3.1
Set the Potentiometers
1. Set VM#3 DMM to measure resistance
2. Install J11 to POT
3. Install J14 to POT
4. Turn the potentiometer R8 until the measure on VM#3 → R[J11 (ISET), J11(GND)] = 2 kΩ.
5. Move the positive side of VM#3 DMM to J14 (ILIM).
6. Turn the potentiometer R12 until the measure on VM#3 → R[J14(ILIM), J14(GND)] = 499 Ω.
7. Move the positive side of VM#3 DMM to J6 (TS).
8. Turn the potentiometer R1 until the measure on VM#3 → R[J6 (TS), J14(GND)] = 5.5 kΩ – 6.5 kΩ.
9. Move the positive side of VM#3 DMM to J27 (SYS_S+).
10. Set VM#3 DMM to measure voltage.
3.2
Charge Disabled
1.
2.
3.
4.
5.
6.
7.
3.3
Charge Current Regulation
1.
2.
3.
4.
5.
6.
7.
8.
9.
3.4
Install the jumper on J7 – connect CD to SYS
Enable PS#1 and PS#2
Observe D2 is on, D1 is off
Measure on VM#3 → V[J27(SYS_S+) J14(GND)] = 1.8V ±50 mV
Measure on CM#2 → ICHRG ≤ 0–1 mA
Measure on CM#1 → IIN < 2 mA
Disable PS#1 and PS#2
Remove the jumper on J7 – disconnect CD to SYS
Enable PS#1 and PS#2
Observe D2 is on, D1 is on
Adjust PS#2 so that the voltage measured by VM#2, across BAT and GND, measures 3.5 V
Adjust the PS#1 so that VM#1 still reads 5.0 V ±100 mV
Measure on VM#3 → V[J27(SYS_S+) J14(GND)] = 1.8 V ±50 mV
Measure on CM#2 → ICHRG = 90–110 mA
Measure on CM#1 → IIN = 93–113 mA
Disable PS#1 and PS#2
Ship Mode (Optional if I2C Control not Used)
1. Enable PS#1 and PS#2
2. Open the software GUI
3. Go to Field View of the GUI and then read all the registers. All the default register values should be
shown in the register map (as shown in Figure 3).
4. Measure on CM#2 → ICHRG = 9–11 mA
5. Install the jumper on J7 – connect CD to SYS
6. Disable PS#1
7. Measure on CM#2 → ICHRG = 5–7 µA
8. Check the box in front of “EN_SHIPMODE” in the software GUI
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Helpful Hints
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Figure 6. Select EN_SHIPMODE
9. Measure on CM#2 → ICHRG < 100 nA
10. Disable PS#2
4
Helpful Hints
The following steps provide useful information when using the EVM:
1. The leads and cables to the various power supplies have resistance. The current meters also have
series resistance. Therefore, voltmeters must be used to measure the voltage as close to the IC pins
as possible instead of relying on each supply’s digital measurement.
2. When using a source meter as your battery simulator, it is highly recommended to configure the source
meter for 4-wire sensing, eliminating the need for a separate voltmeter to measure the voltage at the
OUT pin.
3. To observe the taper current as the battery voltage approaches the set regulation voltage, allow the
battery to charge, or if using BAT_Load (PR1010), slowly increase the PS#2 voltage powering
BAT_Load (PR1010). Use VM#2 across OUT and GND to measure the battery voltage seen by the IC.
4. To find out more details about battery IQ and how to measure it on power supplies, please refer to the
application note: IQ: What it is, what it isn’t, and how to use it (SLYT412)
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Bill of Materials and Board Layout
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5
Bill of Materials and Board Layout
This section provides the bq2512x EVM bill of materials (BOM) and the printed-circuit board (PCB) layout illustrations.
5.1
Bill of Materials
Table 6 lists the EVM BOM.
Table 6. bq2512xEVM Bill of Materials
Item # Designator
Qty
Part Number
Manufacturer
Description
PWR812
Any
Printed Circuit Board
4.7uF
GRM188R61E475KE11D
Murata
CAP, CERM, 4.7 µF, 25 V, +/- 10%, X5R, 0603
0603
1uF
C1005X5R1E105K050BC
TDK
CAP, CERM, 1 µF, 25 V, +/- 10%, X5R, 0402
0402
2
1uF
GRM155R61A105KE15D
Murata
CAP, CERM, 1 µF, 10 V, +/- 10%, X5R, 0402
0402
C9
1
10uF
CL05A106MP5NUNC
Samsung ElectroMechanics
CAP, CERM, 10 µF, 10 V, +/- 20%, X5R, 0402
0402
6
D1
1
Red
LTST-C190CKT
Lite-On
LED, Red, SMD
Red LED, 1.6x0.8x0.8mm
7
D2
1
Green
LTST-C190GKT
Lite-On
LED, Green, SMD
1.6x0.8x0.8mm
8
H12, H13,
H14, H15
4
SJ61A1
3M
Bumpon, Cylindrical, 0.312 X 0.200, Black
Black Bumpon
1
!PCB
1
2
C1, C3
2
3
C2
1
4
C6, C7
5
Value
Package Reference
9
J1
1
105017-0001
Molex
Receptacle, Micro-USB-B, Right Angle, SMD
Micro USB receptacle
10
J2, J3, J4,
J5, J7, J8,
J12, J15,
J17, J22,
J24, J26,
J27, J28,
J29, J30,
J31, J32,
J33, J34
20
PEC02SAAN
Sullins Connector
Solutions
Header, 100mil, 2x1, Tin plated, TH
Header, 2 PIN, 100mil, Tin
11
J6, J9, J11,
J14, J25
5
PEC03SAAN
Sullins Connector
Solutions
Header, 100mil, 3x1, Tin, TH
Header, 3 PIN, 100mil, Tin
12
J10
1
22-05-3041
Molex
Header (friction lock), 100mil, 4x1, R/A, TH
4x1 R/A Header
13
L1
1
LQM21PN2R2MGH
Murata
Inductor, Multilayer, Ferrite, 2.2 µH, 0.7 A, 0.125 ohm, SMD
2.0x1.0x1.2mm
14
LBL1
1
THT-14-423-10
Brady
Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll
PCB Label 0.650"H x 0.200"W
15
R1
1
20k
3266W-1-203LF
Bourns
Trimmer, 20k ohm, 0.25W, TH
4.5x8x6.7mm
16
R2
1
14.0k
CRCW040214K0FKED
Vishay-Dale
RES, 14.0k ohm, 1%, 0.063W, 0402
0402
17
R3
1
14.3k
CRCW040214K3FKED
Vishay-Dale
RES, 14.3k ohm, 1%, 0.063W, 0402
0402
18
R4, R9
2
2.00
CRCW06032R00FKEA
Vishay-Dale
RES, 2.00 ohm, 1%, 0.1W, 0603
0603
19
R5
1
4.99k
CRCW04024K99FKED
Vishay-Dale
RES, 4.99 k, 1%, 0.063 W, 0402
0402
20
R6, R15,
R16, R17,
R18, R19,
R20
7
0
CRCW04020000Z0ED
Vishay-Dale
RES, 0, 5%, 0.063 W, 0402
0402
2.2uH
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Bill of Materials and Board Layout
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Table 6. bq2512xEVM Bill of Materials (continued)
Item # Designator
12
Value
Part Number
Manufacturer
Description
Package Reference
21
R7, R10,
R11, R13
Qty
4
499
CRCW0402499RFKED
Vishay-Dale
RES, 499 ohm, 1%, 0.063W, 0402
0402
22
R8
1
50k
3266W-1-503LF
Bourns
Trimmer, 50k ohm, 0.25W, TH
4.5x8x6.7mm
23
R12
1
5K
3266W-1-502LF
Bourns
Trimmer, 5k ohm, 0.25W, TH
4.5x8x6.7mm
24
R14
1
100k
CRCW0402100KFKED
Vishay-Dale
RES, 100k ohm, 1%, 0.063W, 0402
0402
25
S1
1
KST221JLFS
C&K Components
Switch, Tactile, SPST-NO, SMT
Switch, 6.2X5X6.2 mm
26
SH-JP1, SHJP2, SH-JP3,
SH-JP4, SHJP5, SH-JP6,
SH-JP7
7
1x2
969102-0000-DA
3M
Shunt, 100mil, Gold plated, Black
Shunt
27
TP1, TP2,
TP4
3
White
5002
Keystone
Test Point, Miniature, White, TH
White Miniature Testpoint
28
TP3, TP7,
TP11, TP14,
TP15
5
Orange
5003
Keystone
Test Point, Miniature, Orange, TH
Orange Miniature Testpoint
29
TP5, TP6
2
Yellow
5004
Keystone
Test Point, Miniature, Yellow, TH
Yellow Miniature Testpoint
30
TP8, TP9,
TP10, TP13
4
Red
5005
Keystone
Test Point, Compact, Red, TH
Red Compact Testpoint
31
U1
1
BQ25121YFPR
Texas Instruments
700-nA Low IQ Highly Integrated Battery Charge Management Solution for
Wearables and IoT, YFP0025BABD
YFP0025BABD
32
FID1, FID2,
FID3, FID4,
FID5, FID6
0
N/A
N/A
Fiducial mark. There is nothing to buy or mount.
Fiducial
bq2512x Evaluation Module
SLUUBC8A – August 2015 – Revised May 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
Bill of Materials and Board Layout
www.ti.com
5.2
5.2.1
Board Layouts
PWR731 Layouts
Figure 7 through Figure 16 illustrate the PWR731 EVM PCB board layouts.
Figure 7. Top Overlay
Figure 8. Top Solder Mask
SLUUBC8A – August 2015 – Revised May 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
bq2512x Evaluation Module
13
Bill of Materials and Board Layout
www.ti.com
Figure 9. Top Layer
Figure 10. Signal Layer 1
14
bq2512x Evaluation Module
SLUUBC8A – August 2015 – Revised May 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
Bill of Materials and Board Layout
www.ti.com
Figure 11. Signal Layer 2
Figure 12. Bottom Layer
SLUUBC8A – August 2015 – Revised May 2016
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Copyright © 2015–2016, Texas Instruments Incorporated
bq2512x Evaluation Module
15
Bill of Materials and Board Layout
www.ti.com
Figure 13. Bottom Solder Mask
Figure 14. Bottom Overlay
16
bq2512x Evaluation Module
SLUUBC8A – August 2015 – Revised May 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
Bill of Materials and Board Layout
www.ti.com
Figure 15. Drill Drawing
Figure 16. Board Dimensions
SLUUBC8A – August 2015 – Revised May 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
bq2512x Evaluation Module
17
Revision History
5.2.2
www.ti.com
PWR812 Layout
Figure 17 illustrates the PWR812 PCB composite layout.
Figure 17. PWR812 Composite Layout
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (August 2015) to A Revision ..................................................................................................... Page
•
•
18
Changed user's guide globally to accommodate both the bq25120 and bq25121 EVMs. ...................................... 1
Replaced existing BOM with PWR812A BOM. ...................................................................................... 11
Revision History
SLUUBC8A – August 2015 – Revised May 2016
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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