BQ25570EVM-206

BQ25570EVM-206

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    Module

  • 描述:

  • 数据手册
  • 价格&库存
BQ25570EVM-206 数据手册
User's Guide SLUUAA7A – July 2013 – Revised August 2014 User's Guide for bq25570 Battery Charger Evaluation Module for Energy Harvesting This user’s guide describes the bq25570 evaluation module (EVM), how to perform a stand-alone evaluation and how to allow the EVM to interface with the system and host. The boost charger output is configured to deliver up to 4.2-V maximum voltage to its output, VSTOR, using external resistors. This voltage will be applied to the storage element as long as the storage element voltage at VBAT is above the internally programmed undervoltage of 2.0 V. The integrated buck converter provides up to 1.8 V and 100 mA at VOUT. The VBAT_OK indicator toggles high when VSTOR ramps up to 3.0 V and toggles low when VSTOR ramps down to 2.8 V. 1 2 3 4 5 Contents Introduction ................................................................................................................... 2 1.1 EVM Features ....................................................................................................... 2 1.2 General Description ................................................................................................ 2 1.3 Design and Evaluation Considerations .......................................................................... 3 1.4 EVM Schematic ..................................................................................................... 4 1.5 EVM I/O Connections .............................................................................................. 5 EVM Performance Specification Summary ............................................................................... 7 Test and Measurment Summary........................................................................................... 7 3.1 Test Setups and Results ........................................................................................... 8 Bill of Materials and Board Layout ....................................................................................... 17 4.1 Bill of Materials .................................................................................................... 17 4.2 EVM Board Layout ................................................................................................ 18 PCB Layout Guideline ..................................................................................................... 20 List of Figures 1 EVM Schematic .............................................................................................................. 4 2 Test Setup for Measuring Boost Charger Efficiency .................................................................... 9 3 Charger Efficiency versus Input Voltage .................................................................................. 9 4 Charger Efficiency versus Input Current ................................................................................ 10 5 Test Setup for Measuring Buck Converter Efficiency 11 6 Buck Converter Efficiency versus Output Current 11 7 8 9 10 11 12 13 14 15 ................................................................. .................................................................... Test Setup for Performing Load Transient on Buck Output .......................................................... 50-mA Load Transient on VOUT ........................................................................................... Charger Operational Waveforms During 50-mA Load Transient .................................................... Buck Operational Waveforms During 50-mA Load Transient ........................................................ Test Setup for Charging a Super Capacitor from Buck Output ...................................................... Charging a Super Cap from VOUT ........................................................................................ EVM PCB Top Assembly .................................................................................................. EVM PCB Top Layer ...................................................................................................... EVM PCB Bottom Layer ................................................................................................... 12 12 13 14 15 15 18 18 19 List of Tables 1 2 ................................................. 5 Bill of Materials ............................................................................................................. 17 I/O Connections and Configuration for Evaluation of bq25570 EVM SLUUAA7A – July 2013 – Revised August 2014 Submit Documentation Feedback User's Guide for bq25570 Battery Charger Evaluation Module for Energy Harvesting Copyright © 2013–2014, Texas Instruments Incorporated 1 Introduction 1 Introduction 1.1 EVM Features • • • • • • 1.2 www.ti.com Evaluation module for bq25570 Ultra-low power boost charger and buck converter with battery management for energy harvester applications Resistor-programmable settings for over voltage providing flexible battery management Programmable push-pull output indicator for battery status (VBAT_OK) Test points for key signals available for testing purpose – easy probe hook-up. Jumpers available – easy to change settings General Description The bq25570 is an integrated energy harvesting Nano-Power management solution that is well suited for meeting the special needs of ultra-low power applications. The product is specifically designed to efficiently acquire and manage the microwatts (µW) to miliwatts (mW) of power generated from a variety of high output impedance (HiZ) DC sources like photovoltaic (solar) or thermal electric generators; or with an AC/DC rectifier, a piezoelectric generator. The bq25570 implements a highly efficient, pulse-frequency modulated (PFM) boost converter/charger targeted toward products and systems, such as wireless sensor networks (WSN) which have stringent power and operational demands. Assuming a depleted storage element has been attached, the bq25570 DC-DC boost converter/charger that requires only microwatts of power to begin operating in cold start mode. Once the boost converter output, VSTOR, reaches ~1.8 V and can now power the converter, the main boost converter can now more efficiently extract power from low voltage output harvesters such as thermoelectric generators (TEGs) or single and dual cell solar panels. For example, assuming the HiZ input source can provide at least 5 µW typical and the load on VSTOR (including the storage element leakage current) is less than 1 µA of leakage current, the boost converter can be started with VIN_DC as low as 330 mV typical, and once VSTOR reaches 1.8 V, can continue to harvest energy down to VIN_DC ≃ 120 mV. The integrated PFM buck converter is also powered from VSTOR and, assuming enough input power is available, provides up to 100 mA from the VOUT pin. The VOUT voltage is externally programmed to slightly less than the VSTOR voltage. HiZ DC sources have a maximum output power point (MPP) that varies with ambient conditions. For example, a solar panel's MPP varies with the amount of light on the panel and with temperature. The MPP is listed by the harvesting source manufacturer as a percentage of its open circuit (OC) voltage. Therefore, the bq25570 implements a programmable maximum power point tracking (MPPT) sampling network to optimize the transfer of power into the device. The bq25570 periodically samples the open circuit input voltage every 16 seconds by disabling the boost converter for 256 ms and stores the programmed MPP ratio of the OC voltage on the external reference capacitor (C2) at VREF_SAMP. Typically solar cells are at their MPP when loaded to ~70–80% of their OC voltage and TEGs at ~50%. While the storage element is less than the user programmed maximum voltage (VBAT_OV), the boost charger loads the harvesting source until VIN_DC reaches the MPP (voltage at VREF_SAMP). This results in the boost charger regulating the input voltage of the converter until the output reaches VBAT_OV, thus transferring the maximum amount of power currently available per ambient conditions to the output. The battery undervoltage, VBAT_UV, threshold is checked continuously to ensure that the internal battery FET, connecting VSTOR to VBAT, does not turn on until VSTOR is above the VBAT_UV threshold (2.0 V).The over voltage (VBAT_OV) setting initially is lower than the programmed value at startup (varies on conditions) and is updated after the first ~32 ms. Subsequent updates are every ~64 ms. The VBAT_OV threshold sets maximum voltage on VSTOR and the boost converter stops switching when the voltage on VSTOR reaches the VBAT_OV threshold. The open circuit input voltage (VIN_OC) is measured every ~16 seconds in order for the Maximum Power Point Tracking (MPPT) circuit to sample and hold the input regulation voltage. This periodic update continually optimizes maximum power delivery based on the harvesting conditions. 2 User's Guide for bq25570 Battery Charger Evaluation Module for Energy Harvesting SLUUAA7A – July 2013 – Revised August 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Introduction www.ti.com The bq25570 was designed with the flexibility to support a variety of energy storage elements. The availability of the sources from which harvesters extract their energy can often be sporadic or timevarying. Systems will typically need some type of energy storage element, such as a re-chargeable battery, super capacitor, or conventional capacitor. The storage element will make certain constant power is available when needed for the systems. In general, the storage element also allows the system to handle any peak currents that can not directly come from the input source. It is important to remember that batteries and super capacitors can have significant leakage currents that need to be included with determining the loading on VSTOR. To prevent damage to a customer’s storage element, both maximum and minimum voltages are monitored against the internally programmed under-voltage (VBAT_UV) and user programmed over-voltage (VBAT_OV) levels. To further assist users in the strict management of their energy budgets, the bq25570 toggles a user programmable battery good flag (VBAT_OK), checked every 64 ms, to signal the microprocessor when the voltage on an energy storage element or capacitor has risen above (OK_HYST threshold) or dropped below (OK_PROG threshold) a pre-set critical level. To prevent the system from entering an undervoltage condition or if starting up into a depleted storage element, it is highly recommended to isolate the system load from VSTOR by 1) setting VBAT_OK equal to the buck converter's enable signal VOUT_EN and 2) using an NFET to invert the BAT_OK signal so that it drives the gate of PFET, which isolates the system load from VSTOR. For details, see the bq25570 data sheet (SLUSBH2). 1.3 Design and Evaluation Considerations This user's guide is not a replacement for the data sheet. Reading the data sheet first will help in understanding the operations and features of this IC. In this document, “battery” or "VBAT" will be used but one could substitute any appropriate storage element. System Design Tips Compared to designing systems powered from an AC/DC converter or large battery (for example, low impedance sources), designing systems powered by HiZ sources requires that the system load-per-unit time (for example, per day for solar panel) be compared to the expected loading per the same time unit. Often there is not enough real time input harvested power (for example, at night for a solar panel) to run the system in full operation. Therefore, the energy harvesting circuit collects more energy than being drawn by the system when ambient conditions allow and stores that energy in a storage element for later use to power the system. See SLUC461 for an example spreadsheet on how to design a real solar-panelpowered system in three easy steps: 1. Referring the system rail power back to VSTOR 2. Referring the required VSTOR power back to bq255xx input power 3. Computing the minimum solar panel area from the input power requirement As demonstrated in the spreadsheet, for any boost converter, you must perform a power balance, POUT / PIN = (VSTOR × ISTOR) / (VIN × IIN)= η where η is the estimated efficiency for the same or very similar configuration in order to determine the minimum input power needed to supply the desired output power. This IC is a highly efficient charger for a storage element such as a battery or super capacitor. The main difference between a battery and a super capacitor is the capacity curve. The battery typically has little or no capacity below a certain voltage, where as the capacitor does have capacity at lower voltages. Both can have significant leakage currents that will appear as a DC load on VSTOR/VBAT. SLUUAA7A – July 2013 – Revised August 2014 Submit Documentation Feedback User's Guide for bq25570 Battery Charger Evaluation Module for Energy Harvesting Copyright © 2013–2014, Texas Instruments Incorporated 3 Introduction 1.4 www.ti.com EVM Schematic Figure 1 is the schematic for this EVM. VSTOR VSTOR TP4 VIN1 VSTOR 4.99M JP1 VOC_SAMP R4 10M J1 4.99M 0.1V-4.0V VIN J2 L1 GND C4 4.7uF 0.1uF VSTOR C10 + GND J5 GND VBAT TP5 J6 J7 JP4 80% JP1 to R3-R5 50% R5 C5 VBAT VOC_SAMP VIN TP6 C6 TP3 LBOOST TP2 LBUCK 1.8V (Adj. 1.3V-5.05V), 50mA L2 J11 5 EN 17 18 19 16 LBUCK NC VBAT VSTOR 22uF 6 VSS 15 VOUT 14 VBAT_OK 13 VOUT_SET 12 OK_PROG 11 C9 1 TP8 VOUT J9 GND GND J12 GND OK_HYST VREF_SAMP + C3 J13 BAT_OK 10 VOC_SAMP 4 NC 3 9 4.7uF 0.1uF TP9 VRDIV C7 BQ25570RGR BQ25570RGR VBAT_OV VOC_SAMP C1 VIN_DC VOUT_EN 1 C8 VSS 2 8 + 1 7 VIN1 20 21 PWPD TP1 LBOOST U1 GND J8 VOUT 10 uH J3 4.2V (Adj. up to 5.25V) VBAT J10 100u 22uH GND 4.2V (Adj. up to 5.25V), 100mA J4 1 R3 GND VRDIV VRDIV BAT_OK R6 VREF_SAMP GND TP7 JP5 JP6 887k VOUT_EN VRDIV C2 0.01uF R1 7.5M R7 6.98M R2 5.76M R8 5.36M R9 4.22M VBAT VBAT /EN GND R10 8.66M JP2 VSTOR VSTOR VOUT_EN GND JP3 1 Not Installed Figure 1. EVM Schematic 4 User's Guide for bq25570 Battery Charger Evaluation Module for Energy Harvesting Copyright © 2013–2014, Texas Instruments Incorporated SLUUAA7A – July 2013 – Revised August 2014 Submit Documentation Feedback Introduction www.ti.com 1.5 EVM I/O Connections Table 1. I/O Connections and Configuration for Evaluation of bq25570 EVM Headers and Terminals Description Comments/Recommended Setting J1–VIN Input source (+) J2 - VIN/GND Input source terminal block J3–GND Input source return (–) If VIN_DC is higher than VSTOR and VSTOR is equal to VBAT_OV, the input VIN_DC is pulled to ground through a small resistance to stop further charging of the attached battery or capacitor. It is critical that if this case is expected, the impedance of the source attached to VIN_DC be higher than 20 Ω and not a low impedance source. J4 - VSTOR Boost charger output (+) Buck converter input J5 - VSTOR/GND Boost charger output terminal block J6 - GND Boost charger return (-) J7– VBAT Rechargeable storage element connection (+) J8 - VBAT/GND Rechargeable storage element terminal block J9–GND Rechargeable storage element connection return (–) J10 – VOUT Buck converter output (+) J11 - VOUT/GND Buck converter output terminal block J12 -GND Buck converter output (-) J13 – BAT_OK Battery Status Indicator (+/-) Test Points TP1 Input source (+) TP2 Boost charger switching node TP3 Buck converter switching node TP4 Boost charger output, VSTOR (+) TP5 Rechargeable storage element connection, BAT_SEC (+) TP6 Buck converter output, VOUT (+) TP7 VRDIV node TP8 Output return (-) TP9 Input return (-) CAUTION Providing an additional low impedance current path in parallel with the feedback resistors , for example, with a 10 MΩ scope probe attached, will degrade regulation accuracy. Jumpers JP1 – VOC_SAMP VOC_SAMP = external resistors sized to configure the IC Uninstalled (NOTE: Do not install if JP4 shunt is installed) to regulate VIN to 75% of VOC_SAMP. JP2 - /EN /EN = GND enables the IC. /EN=VSTOR disables the IC. /EN=GND JP3 - VOUT_EN VOUT_EN = VSTOR enables the buck converter when VSTOR is up VOUT_EN = GND disables the buck converter VOUT_EN=VSTOR (NOTE: Do not install if JP6 shunt is installed) SLUUAA7A – July 2013 – Revised August 2014 Submit Documentation Feedback User's Guide for bq25570 Battery Charger Evaluation Module for Energy Harvesting Copyright © 2013–2014, Texas Instruments Incorporated 5 Introduction www.ti.com Table 1. I/O Connections and Configuration for Evaluation of bq25570 EVM (continued) Headers and Terminals Description Comments/Recommended Setting JP4 - VOC_SAMP VOC_SAMP = 80% configures the IC to regulate VIN to 80% of OCV. VOC_SAMP = 50% configures the IC to regulate VIN to 50% of OCV. JP4 = 80% (NOTE: Do not install if JP1 shunt is installed) JP5 - VREF_SAMP to GND VREF_SAMP = GND Uninstalled (NOTE: Providing an additional leakage path for the VREF_SAMP capacitor for example, through a 10 MΩ scope probe attached to VREF_SAMP, will degrade input voltage regulation performance). JP6 - VBAT_OK to VOUT_EN BAT_OK=VOUT_EN configures the buck converter to be enabled only when VSTOR is greater than the VBAT_OK threshold per the resistors (2.786V on the EVM) Uninstalled (NOTE: Do not install if JP3 shunt is installed) 6 User's Guide for bq25570 Battery Charger Evaluation Module for Energy Harvesting Copyright © 2013–2014, Texas Instruments Incorporated SLUUAA7A – July 2013 – Revised August 2014 Submit Documentation Feedback EVM Performance Specification Summary www.ti.com 2 EVM Performance Specification Summary See Data Sheet “Recommended Operating Conditions” for component adjustments. For details about the resistor programmable settings, see bq25570 data sheet (SLUSBH2). MIN NOM UNIT VIN(DC) DC input voltage into VIN_DC VIN_Start-up(DC) DC minimum start-up voltage into depleted storage element, no load attached to VSTOR or VOUT and IBATLEAK 1MΩ is recommended. However, during board assembly, contaminants such as solder flux and even some board cleaning agents can leave residue that may form parasitic resistors across the physical resistors and/or from one end of a resistor to ground, especially in humid, fast airflow environments. This can result in the voltage regulation and threshold levels changing significantly from those expected per the installed resistor values. Therefore, it is highly recommended that no ground planes be poured near the voltage setting resistors. In addition, the boards must be carefully cleaned, possibly rotated at least once during cleaning, and then rinsed with de-ionized water until the ionic contamination of that water is well above 50 MOhm. If this is not feasible, then it is recommended that the sum of the voltage setting resistors be reduced to at least 5X below the measured ionic contamination. Revision History Changes from Original (July 2013) to A Revision ........................................................................................................... Page • Changed contents in the bill of materials ............................................................................................. 17 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 20 Revision History SLUUAA7A – July 2013 – Revised August 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated ADDITIONAL TERMS AND CONDITIONS, WARNINGS, RESTRICTIONS, AND DISCLAIMERS FOR EVALUATION MODULES Texas Instruments Incorporated (TI) markets, sells, and loans all evaluation boards, kits, and/or modules (EVMs) pursuant to, and user expressly acknowledges, represents, and agrees, and takes sole responsibility and risk with respect to, the following: 1. User agrees and acknowledges that EVMs are intended to be handled and used for feasibility evaluation only in laboratory and/or development environments. Notwithstanding the foregoing, in certain instances, TI makes certain EVMs available to users that do not handle and use EVMs solely for feasibility evaluation only in laboratory and/or development environments, but may use EVMs in a hobbyist environment. All EVMs made available to hobbyist users are FCC certified, as applicable. Hobbyist users acknowledge, agree, and shall comply with all applicable terms, conditions, warnings, and restrictions in this document and are subject to the disclaimer and indemnity provisions included in this document. 2. Unless otherwise indicated, EVMs are not finished products and not intended for consumer use. EVMs are intended solely for use by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. 3. User agrees that EVMs shall not be used as, or incorporated into, all or any part of a finished product. 4. User agrees and acknowledges that certain EVMs may not be designed or manufactured by TI. 5. User must read the user's guide and all other documentation accompanying EVMs, including without limitation any warning or restriction notices, prior to handling and/or using EVMs. Such notices contain important safety information related to, for example, temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI. 6. User assumes all responsibility, obligation, and any corresponding liability for proper and safe handling and use of EVMs. 7. Should any EVM not meet the specifications indicated in the user’s guide or other documentation accompanying such EVM, the EVM may be returned to TI within 30 days from the date of delivery for a full refund. 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User assumes sole responsibility to determine whether EVMs may be subject to any applicable federal, state, or local laws and regulatory requirements (including but not limited to U.S. Food and Drug Administration regulations, if applicable) related to its handling and use of EVMs and, if applicable, compliance in all respects with such laws and regulations. 10. User has sole responsibility to ensure the safety of any activities to be conducted by it and its employees, affiliates, contractors or designees, with respect to handling and using EVMs. Further, user is responsible to ensure that any interfaces (electronic and/or mechanical) between EVMs and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. 11. User shall employ reasonable safeguards to ensure that user’s use of EVMs will not result in any property damage, injury or death, even if EVMs should fail to perform as described or expected. 12. User shall be solely responsible for proper disposal and recycling of EVMs consistent with all applicable federal, state, and local requirements. Certain Instructions. User shall operate EVMs within TI’s recommended specifications and environmental considerations per the user’s guide, accompanying documentation, and any other applicable requirements. Exceeding the specified ratings (including but not limited to input and output voltage, current, power, and environmental ranges) for EVMs may cause property damage, personal injury or death. If there are questions concerning these ratings, user should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the applicable EVM user's guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using EVMs’ schematics located in the applicable EVM user's guide. When placing measurement probes near EVMs during normal operation, please be aware that EVMs may become very warm. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use EVMs. Agreement to Defend, Indemnify and Hold Harmless. User agrees to defend, indemnify, and hold TI, its directors, officers, employees, agents, representatives, affiliates, licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of, or in connection with, any handling and/or use of EVMs. User’s indemnity shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if EVMs fail to perform as described or expected. Safety-Critical or Life-Critical Applications. If user intends to use EVMs in evaluations of safety critical applications (such as life support), and a failure of a TI product considered for purchase by user for use in user’s product would reasonably be expected to cause severe personal injury or death such as devices which are classified as FDA Class III or similar classification, then user must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. RADIO FREQUENCY REGULATORY COMPLIANCE INFORMATION FOR EVALUATION MODULES Texas Instruments Incorporated (TI) evaluation boards, kits, and/or modules (EVMs) and/or accompanying hardware that is marketed, sold, or loaned to users may or may not be subject to radio frequency regulations in specific countries. General Statement for EVMs Not Including a Radio For EVMs not including a radio and not subject to the U.S. Federal Communications Commission (FCC) or Industry Canada (IC) regulations, TI intends EVMs to be used only for engineering development, demonstration, or evaluation purposes. EVMs are not finished products typically fit for general consumer use. EVMs may nonetheless generate, use, or radiate radio frequency energy, but have not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or the ICES-003 rules. Operation of such EVMs may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. General Statement for EVMs including a radio User Power/Frequency Use Obligations: For EVMs including a radio, the radio included in such EVMs is intended for development and/or professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability in such EVMs and their development application(s) must comply with local laws governing radio spectrum allocation and power limits for such EVMs. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by TI unless user has obtained appropriate experimental and/or development licenses from local regulatory authorities, which is the sole responsibility of the user, including its acceptable authorization. U.S. Federal Communications Commission Compliance For EVMs Annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at its own expense. FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. Industry Canada Compliance (English) For EVMs Annotated as IC – INDUSTRY CANADA Compliant: This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Concerning EVMs Including Radio Transmitters This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concerning EVMs Including Detachable Antennas Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Canada Industry Canada Compliance (French) Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Concernant les EVMs avec appareils radio Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated spacer Important Notice for Users of EVMs Considered “Radio Frequency Products” in Japan EVMs entering Japan are NOT certified by TI as conforming to Technical Regulations of Radio Law of Japan. If user uses EVMs in Japan, user is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after user obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after user obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless user gives the same notice above to the transferee. Please note that if user does not follow the instructions above, user will be subject to penalties of Radio Law of Japan. http://www.tij.co.jp 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 本開発キットは技術基準適合証明を受けておりません。 本製品の ご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル http://www.tij.co.jp Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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