User's Guide
SLUUBA2B – March 2015 – Revised November 2015
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM
and bq25895MEVM(PWR664)
This user's guide provides detailed testing instructions for the PWR664 evaluation modules (EVM) using
the bq25890, bq25892, bq25895, bq25896 or bq25895M (bq2589x) devices. Also included are
descriptions of the necessary equipment, equipment setup, and procedures. The reference documentation
contains the printed-circuit board layouts, schematics, and the bill of materials (BOM).
1
2
3
4
Contents
Introduction ................................................................................................................... 2
1.1
EVM Features ....................................................................................................... 2
1.2
I/O Descriptions ..................................................................................................... 2
Test Summary ................................................................................................................ 4
2.1
Equipment ........................................................................................................... 4
2.2
Equipment Setup.................................................................................................... 5
2.3
Procedure ............................................................................................................ 9
PCB Layout Guideline ..................................................................................................... 11
Board Layout, Schematic, and Bill of Materials ........................................................................ 12
4.1
PWR664 PCB Layouts ........................................................................................... 12
4.2
Schematics ......................................................................................................... 16
4.3
Bill of Materials .................................................................................................... 21
List of Figures
1
Verify Windows 7 Properties ............................................................................................... 4
2
Connections of the EV2300 ................................................................................................ 5
3
Original Test Setup for PWR664 (bq2589x EVM) ....................................................................... 5
4
Start Window of the bq2589x Evaluation Software
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
..................................................................... 6
Part Select Window of the bq2589x Evaluation Software .............................................................. 6
Communications Adapter Error ............................................................................................ 7
Acknowledge Error .......................................................................................................... 7
DashBoard Status Tab ...................................................................................................... 7
Select Field View ............................................................................................................ 8
Main Window of the bq2589x Evaluation Software ..................................................................... 8
Top Assembly............................................................................................................... 12
Top Layer ................................................................................................................... 13
Mid-Layer 1 ................................................................................................................. 13
Mid-Layer 2 ................................................................................................................. 14
Bottom Layer................................................................................................................ 14
Bottom Solder............................................................................................................... 15
Bottom Assembly .......................................................................................................... 15
bq25890 EVM Schematic ................................................................................................. 16
bq25892 EVM Schematic ................................................................................................. 17
bq25895 EVM Schematic ................................................................................................. 18
bq25895M EVM Schematic ............................................................................................... 19
bq25896 EVM Schematic ................................................................................................. 20
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1
Introduction
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List of Tables
1
Device Data Sheets ......................................................................................................... 2
2
EVM Connections............................................................................................................ 2
3
Jumper Connections
4
Recommended Operating Conditions ..................................................................................... 3
5
bq25890EVM-664 Bill of Materials ....................................................................................... 21
6
bq25892EVM-664 Bill of Materials ....................................................................................... 23
7
bq25895EVM-664 Bill of Materials ....................................................................................... 25
8
bq25895MEVM-664 Bill of Materials
9
bq25896EVM-664 Bill of Materials ....................................................................................... 29
........................................................................................................
....................................................................................
3
27
Trademarks
Microsoft, Windows are registered trademarks of Microsoft Corporation.
1
Introduction
1.1
EVM Features
For detailed features and operation, refer to Table 1 for a list of devices and their data sheets.
Table 1. Device Data Sheets
Device
Document
bq25890, bq25892
SLUSC86
bq25895
SLUSC88
bq25895M
SLUSCC8
bq25896
SLUSC76
The bq2589x evaluation module (EVM) is a complete charger modules for evaluating an I2C-controlled
single NVDC-1 charge using the bq2589x device.
This EVM doesn’t include the USB-to-GPIO interface board. To evaluate the EVM, a USB-to-GPIO
interface board must be ordered separately.
1.2
I/O Descriptions
Table 2 lists the jumper connections available on this EVM.
Table 2. EVM Connections
2
Jack
Description
J1–VBUS
Input: positive terminal
J1–GND
Input: negative terminal (ground terminal)
J2–PMID
PMID pin connection/Power bank output
J2–GND
Ground/Power bank output negative terminal
J3–SYS
Connected to system
J3–GND
Ground
J4–BAT+
Connected to battery pack
J4–GND
Ground
J5
Input mini-USB port
J6
Output mini-USB port
J7
USB-to-GPIO connector
J8
I2C 4-pin connector
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
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Introduction
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Table 3 lists the EVM jumper connections.
Table 3. Jumper Connections
Jack
Description
Factory Setting
JP1
For bq25892/6 input current setting: Low: adaptor port; High: USB
input
bq25890/5/5M: Not installed; bq25892/6: short PSEL
to LOW
JP2
D–/PG pin selection
bq25890/5/5M: short to D–; bq25892/6: short to PG
JP3
Pin 24 selection: to DSEL, PG, or NC
bq25890/5/5M_DSEL: short to DSEL; bq25892/6:
not installed
JP4
STAT, PG, CE, INT, OTG pins internal pullup source (VSYS or BAT) Short to VSYS
JP5
D+/D– connections for input current limit setting
bq25890/5/5M: installed; bq25892/6: Not installed
JP6
USB current limit selection pin during buck mode and PSEL is high/
Enable pin during boost mode
Not installed
JP7
CE pin setting: pull low to enable the charge
Not Installed
JP8
TS pin to GND
Not Installed
JP9
TS resistor divider pullup source (REGN) connection
Installed
JP10
Internal 10 k to GND to TS pin
Installed
Table 4 lists the recommended operating conditions for this EVM.
Table 4. Recommended Operating Conditions
Symbol
Description
MIN
Supply voltage, VIN
bq25890/2/5/5M/6
Input voltage from AC adapter
Battery voltage, VBAT 0 3.7 4.4 V
Voltage applied at VBAT terminal
IBAT
Fast charging current
Supply current, IIN
MAX
Unit
3.9
14
V
0
4.5
V
5
A
Discharging current through internal MOSFET
9
Maximum input current from AC adapter input
0
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TYP
A
3.25
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A
3
Test Summary
2
Test Summary
2.1
Equipment
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This section includes a list of supplies required to perform tests on this EVM.
1. Power Supplies
Power supply #1 (PS#1): a power supply capable of supplying 5 V at 1 A is required. While this part
can handle larger voltage and current, it is not necessary for this procedure.
2. Load #1 (4-Quadrant Supply, Constant Voltage < 4.5 V)
A 0–20 V/0–5 A, > 30-W system, DC electronic load and setting as constant voltage load mode.
Or:
Kepco load: BOP 20–5M, DC 0 to ±20 V, 0 to ±5 A (or higher).
3. Load #2 – Use with Boost Mode
PMID to GND load, 10 Ω, 5 W or greater.
4. Meters
Six Fluke 75 multimeters, (equivalent or better).
Or:
Four equivalent voltage meters and two equivalent current meters. The current meters must be
capable of measuring 5 A+ current.
5. Computer
A computer with at least one USB port and a USB cable. The bq2589xEVM evaluation software must
be properly installed.
6. USB-to-GPIO Communication Kit (EV2300 USB-Based PC Interface Board)
7. Software
Double click the “BatteryManagementStudio-1.3.35_Build2-windows-installer” installation file, follow the
installation steps. The software supports the Microsoft® Windows® XP and Windows 7 operating
systems.
Install EV2300 Software
For Windows 7 64-bit users:
http://e2e.ti.com/support/power_management/battery_management/m/videos__files/458983.aspx.
Verify the computer Windows 7 settings by right clicking on computer and selecting properties:
Figure 1. Verify Windows 7 Properties
Windows XP or Windows 7 32-bit users must access the following: http://www.ti.com/litv/zip/slec003a.
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Test Summary
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2.2
Equipment Setup
1.
2.
3.
4.
Set PS#1 for 5-V DC, 1-A current limit and then turn off the supply.
Connect the output of PS#1 in series with a current meter (multimeter) to J1 (VBUS and GND).
Connect a voltage meter across TP3 (VBUS) and TP6 (PGND).
Turn on the Load, set to constant voltage mode and output to 2.5 V. Turn off (disable) Load. Connect
Load in series with a current meter (multimeter), ground side, to J4 (BAT+ and GND) as shown in
Figure 3.
5. Connect a voltage meter across J4 (BAT+ and GND).
6. Connect the EV2300 USB interface board to the computer with a USB cable and from I2C port to J8
with the 4-pin cable. The connections are shown in Figure 2.
7. Remove jumper (if installed) from JP5.
Figure 2. Connections of the EV2300
8. Install shunts as shown in Table 3.
PWR664
PWR583
TP1
TP1
bq2589xMEVM
J2
3
bq24780EVM
Power
Powe
Iin
Supply #1#1
supply
GN
GND
J1
II
VV
SY
SYS
Ibat
VIN
VIN
VV
GND
I
V
U
U1
J4
VV
Load
BAT
BAT
GND
T
U
Application Circuit
APPLICATION
CIRCUIT
O
P
IN
M
EV2300
D
L
NA
D C
GS
S
3
V
3
C
J8
USB
Figure 3. Original Test Setup for PWR664 (bq2589x EVM)
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Test Summary
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9. Turn on the computer. Launch the bq2589x evaluation software, choose Charger as shown in Figure 4,
then choose the appropriate .bqz file as shown in Figure 5.
Figure 4. Start Window of the bq2589x Evaluation Software
Figure 5 illustrates the following part selection options:
• Select the Charger_1_00-bq25890-895.bqz file, if evaluating the bq25890 or bq25895
• Select Charger_1_00-bq25892-896.bqz, if evaluating the bq25892
Figure 5. Part Select Window of the bq2589x Evaluation Software
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Test Summary
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10. If an error pops up stating the communications adapter was not found (Figure 6), click OK to proceed.
Next, unplug and re-plug the adapter.
Figure 6. Communications Adapter Error
If an error pops up stating there is no acknowledge from the device (Figure 7), click OK to proceed and
then pick the appropirate I2C address from the drop-down menu in the GUI (see the Procedure
section).
Figure 7. Acknowledge Error
Check the connection status of the EV2300 in bqStudio by going to View → DashBoard. A panel on
the left-hand side should appear, with the status of the EV2300 at the top (Figure 8).
Figure 8. DashBoard Status Tab
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Test Summary
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11. Choose Field View, as shown in Figure 9. The main window of the bq2589x software is shown in
Figure 10.
Figure 9. Select Field View
Figure 10. Main Window of the bq2589x Evaluation Software
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2.3
Procedure
2.3.1
Communication Verification
1. In the EVM software, specify device “I2C Address” as D6 for bq25892/6, and D4 for bq25890/5.
2. Enable Load#1 from Section 2.2, step 4. Click the Read button
3. In the EVM GUI software (see example screen shot below) , make the following changes as
necessary:
• Select “Disabled” for the “Watchdog Timer”
• Select "Force VINDPM"
• Set “Input Voltage Limit” to 4.2
• Set “Input Current Limit” to 500 mA
• Set “Charge Voltage Limit” to 4.208 V
• Set “Fast Charge Current” ICHG to 960 mA
• Set "Minimum System Voltage" to 3.5V
• Set “Pre-Charge Current” to 256 mA
• Select "Charge Enable"
• Deselect "Enable ILIM pin"
• Deselect "Enable ICD"
• Deselect “Enable Termination”
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Test Summary
2.3.2
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Charger Mode Verification
1. Turn on PS#1, click the Read button twice:
• Observe → Everything Normal at Fault box
• Observe → D3 (STAT) is on
• Observe → D4 (PG) is on (bq25892/6)
2. Measure the voltage across J3 and J4 as follows:
• Measure → V(TP4(SYS), TP7(GND)) = 3.65 V ±300 mV
• Measure → V(TP5(BAT), TP7(GND)) = 2.5 V ±200 mV
3. Change load to 3.7 V
• Measure → I(BAT) = 625 mA ± 100 mA
• Measure → V(TP5(BAT), TP7(GND)) = 3.7 V ±200 mV
• Measure → I(VBUS) = 500 mA ± 200mA
2.3.3
Boost Mode Verification
1. Turn off and disconnect PS#1
2. If the constant voltage load connected from BAT+ to GND is not a four-quadrant supply (sources
current), remove the load and use the power source disconnected in step one, set to 3.7-V and 2-A
current limit and connect between BAT+ and GND
3. Check the OTG configurations option in the GUI
4. Apply 10 Ω (5 W or greater) across J2 (PMID(+) to GND(–))
•
2.3.4
Measure: V: (TP2 (PMID) and TP6 (GND)) = 5.0 V ±200 mV
Helpful Hints
1. The leads/cables to the various power supplies, batteries and loads have resistance. The current
meters also have series resistance. The charger dynamically reduces charge current depending on the
voltage sensed at its VBUS pin (using the VINDPM feature), BAT pin (as part of normal termination)
and TS pin (through its battery temperature monitoring feature via battery thermistor). Therefore, you
must use voltmeters to measure the voltage as close to the IC pins as possible instead of relying on
the power supply's digital readouts. If a battery thermistor is not available, either disable the TS
function or replace with an appropriately sized (typically) 10 kΩ resistor.
2. When using a sourcemeter that can source and sink current as your battery simulator, it is highly
recommended to add a large (1000 µF+) capacitor at the EVM BAT and GND connectors in order to
prevent oscillations at the BAT pin due to mismatched impedances of the charger output and
sourcemeter input within their respective regulation loop bandwidths. Configuring the sourcemeter for
4-wire sensing eliminates the need for a separate voltmeter to measure the voltage at the BAT pin.
When using 4-wire sensing, always ensure that the sensing leads are connected in order to prevent
accidental overvoltage by the power leads.
3. For precise measurements of charge current and battery regulation near termination, the current meter
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PCB Layout Guideline
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in series with the battery or battery simulator should not be set to auto-range and may need be
removed entirely. An alternate method for measuring charge current is to either use an oscilloscope
with hall effect current probe or place a 1% or better, thermally capable (for example, 0.010 Ω in 1210
or larger footprint) resistor in series between the BAT pin and battery and measure the voltage across
that resistor.
3
PCB Layout Guideline
Minimize the switching node rise and fall times for minimum switching loss. Proper layout of the
components minimizing high-frequency current path loop is important to prevent electrical and magnetic
field radiation and high-frequency resonant problems. This PCB layout priority list must be followed in the
order presented for proper layout:
1. Place the input capacitor as close as possible to the PMID and GND pin connections and use the
shortest possible copper trace connection or GND plane.
2. Place the inductor input terminal as close to the SW pin as possible. Minimize the copper area of this
trace to lower electrical and magnetic field radiation but make the trace wide enough to carry the
charging current. Do not use multiple layers in parallel for this connection. Minimize parasitic
capacitance from this area to any other trace or plane.
3. Put an output capacitor near to the inductor and the IC. Tie ground connections to the IC ground with a
short copper trace connection or GND plane.
4. Route analog ground separately from power ground. Connect analog ground and connect power
ground separately. Connect analog ground and power ground together using power pad as the single
ground connection point or use a 0-Ω resistor to tie analog ground to power ground.
5. Use a single ground connection to tie the charger power ground to the charger analog ground just
beneath the IC. Use ground copper pour but avoid power pins to reduce inductive and capacitive noise
coupling.
6. Place decoupling capacitors next to the IC pins and make the trace connection as short as possible.
7. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB
ground. Ensure that there are sufficient thermal vias directly under the IC, connecting to the ground
plane on the other layers.
8. The via size and number should be enough for a given current path.
See the EVM design for the recommended component placement with trace and via locations. For the
QFN information, refer to Quad Flatpack No-Lead Logic Packages (SCBA017) and QFN/SON PCB
Attachment (SLUA271).
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Board Layout, Schematic, and Bill of Materials
4
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Board Layout, Schematic, and Bill of Materials
This section contains the board layouts, schematics, and BOM.
4.1
PWR664 PCB Layouts
Figure 11 through Figure 17 show the PCB layouts for the PWR664 EVM.
Figure 11. Top Assembly
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Board Layout, Schematic, and Bill of Materials
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Figure 12. Top Layer
Figure 13. Mid-Layer 1
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Board Layout, Schematic, and Bill of Materials
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Figure 14. Mid-Layer 2
Figure 15. Bottom Layer
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Figure 16. Bottom Solder
Figure 17. Bottom Assembly
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Board Layout, Schematic, and Bill of Materials
4.2
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Schematics
The bq25890EVM (Figure 18), bq25892EVM (Figure 19), bq25895EVM (Figure 21), bq25896EVM (Figure 22) and bq25895MEVM (Figure 21)
schematics are provided for reference.
TP2
D2
PMID
PMID
GND
DNP
DNPC13
10µF
J2
DNP C12
10µF
DNPC11
10µF
DNP C10
22µF
DNPC9
1000pF
C2
10µF
REGN
C3
4.7µF
DSEL
L1
SYS
AGND
3
PGND
Vbus: 3.9V to 14V
DNP D1
TP3
DSEL
VBUS
VBUS
GND
2
C5
10µF
DNP
C4
C6
10µF
DNPC14
DNP C15
0.1µF
10µF
DNPC16
10µF
DNPC17
1000pF
VSYS: 3.5V to 4.75V
1.5µH
1
DNP C8
1000pF
J3
L2
PG
C1
1µF
J1
System
GND
1uH
JP3
PG
0.047µF
R17
DNP
1.00
R13
0
PGND
3
D-/PG
3
1
PG
4
STAT
PGND
5
SCL
AGND
R14
19
U1
DSTAT
SYS
BQ25890RTWR
SCL
BAT
SDA
BAT
R15
INT
10.0k
Net-Tie
17
PGND
JP4
2
PULL-UP
TP5
15
Battery
GND
13
ICHG: 0 ~ 5A
C7
10µF
DNP C18
1µF
11
QON
R5
TS
10.0k
PULL-UP
R23
4.7k
ILIM
R6
10.0k
PULL-UP
JP6
VBUS
REGN
R1
130
OTG
R2
5.23k
S1
3.3V
VIN
R10
100k
VOUT
R7
DNP
10.0k
U2
GND
TS
GND
R19
AGND
10k
TS
R3
30.1k
R24
10.0k
JP7
JP10
R8
10.0k
AGND
2
C22
0.01µF
R22
2.21k
JP8
CE
C24
2.2µF
LP2985AIM5-3.3/NOPB
BYPASS
R18
768
AGND
5
ON/OFF
R21
2.21k
JP9
R16
0
4
DNP C20
1000pF
INT
CE
3
DNPC19
10µF
PGND
PGND
200
1
J4
BAT
14
12
9
10
7
SDA
200
R9
D3
Green
D4
Green
STAT
PG
AGND
AGND
S2A
VBUS
PGND
9
10
11
TP9
1
PGND
TP13
TP16
TP19
TP6
TP7
4
S2B
11
10
9
C23
1µF
TP4
AGND
16
SDA
R12
10
8
6
4
2
8
J7
SYS
NT1
1
20
SW
SW
21
BTST
PGND
SCL
200
9
7
5
3
1
REGN
PGND
D+
10.0k
PULL-UP
R11
6
VBUS
D5
18
3
PG
J8
DNP
25
QON
2
2
TS
DD+/PSEL
ILIM
JP1
2
1
CE
1
HI
PSEL
LOW
SCL
D+/PSEL
OTG/IUSB
SDA
JP2
DNP C21
0.01µF
PAD
D-
3
CE
4
3
2
1
23
24
DSEL
R4
10.0k
PMID
REGN
22
PGND
2
3
PGND
DSEL
SCL
TP10
D-
OTG
TP14
ILIM
TP17
TP20
PGND
D-
J5
D+
ID
GND
1
7
8
2
2
1
1D1D+
3
U3
4
5
5
GND
JP5
VBUS
1
2
4
3
2D2D+
9
6
S
OE
ID
PGND
8
7
6
DD+
D+/PSEL
ID
R20
10.0k
10
VCC
3
DSEL
4
5
VBUS
J6
D-/PG
TP11
DD+
D+/PSEL
CE
TP15
INT
STAT
TP8
TS
TP18
REGN
TP21
QON
AGND
TP12
ID
GND
SDA
TEST POINTS
PGND
PGND
TS3USB221ARSER
6
7
8
VBUS
3.3V
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Figure 18. bq25890 EVM Schematic
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TP2
D2
PMID
PMID
GND
DNP
DNPC13
10µF
J2
DNP C12
10µF
DNPC11
10µF
DNP C10
22µF
DNPC9
1000pF
C2
10µF
REGN
C3
4.7µF
DSEL
L1
SYS
AGND
3
PGND
Vbus: 3.9V to 14V
DNP D1
TP3
DSEL
VBUS
VBUS
GND
2
C5
10µF
DNP
C4
C6
10µF
DNPC14
DNP C15
0.1µF
10µF
DNPC16
10µF
DNPC17
1000pF
VSYS: 3.5V to 4.75V
1.5µH
1
DNP C8
1000pF
J3
L2
PG
C1
1µF
J1
System
GND
1uH
JP3
PG
0.047µF
R17
DNP
1.00
R13
0
PGND
3
D-/PG
3
1
J8
PG
4
STAT
PGND
5
SCL
AGND
R14
19
SW
PGND
U1
PG
STAT
SYS
BQ25892RTWR
SCL
BAT
SDA
BAT
R15
INT
SCL
10.0k
200
PGND
JP4
2
PULL-UP
TP5
15
Battery
GND
13
ICHG: 0 ~ 5A
C7
10µF
DNP C18
1µF
PGND
TS
10.0k
PULL-UP
R23
4.7k
ILIM
R6
10.0k
PULL-UP
JP6
VBUS
REGN
R1
130
OTG
R2
5.23k
S1
3.3V
VIN
R10
100k
VOUT
R7
DNP
10.0k
U2
GND
TS
GND
R19
AGND
10k
TS
R3
30.1k
R24
10.0k
JP7
JP10
R8
10.0k
AGND
2
C22
0.01µF
R22
2.21k
JP8
CE
C24
2.2µF
LP2985AIM5-3.3/NOPB
BYPASS
R18
768
AGND
5
ON/OFF
R21
2.21k
JP9
R16
DNP
0
4
DNP C20
1000pF
QON
R5
CE
3
DNPC19
10µF
INT
200
1
J4
BAT
14
PGND
R9
D3
Green
D4
Green
STAT
PG
AGND
AGND
S2A
VBUS
PGND
9
10
11
TP9
1
PGND
TP13
TP16
TP19
TP6
TP7
4
S2B
11
10
9
C23
1µF
TP4
AGND
16
12
11
9
200
10
7
SDA
10
8
6
4
2
Net-Tie
17
SDA
R12
8
J7
SYS
NT1
18
1
22
20
SW
BTST
REGN
PGND
PSEL
10.0k
PULL-UP
R11
6
VBUS
D5
3
PG
DNP
25
QON
2
TS
1
2
ILIM
DD+/PSEL
CE
JP1
2
D+/PSEL
OTG/IUSB
1
3
HI
PSEL
LOW
SCL
JP2
DNP C21
0.01µF
PAD
D-
SDA
9
7
5
3
1
PMID
NC
R4
10.0k
CE
4
3
2
1
23
24
REGN
21
PGND
2
3
PGND
DSEL
SCL
TP10
D-
OTG
TP14
ILIM
TP17
TP20
PGND
DD+
J5
ID
GND
1
7
8
2
U3
4
2
1
1D1D+
3
5
5
GND
JP5
VBUS
1
2
4
3
2D2D+
9
6
S
OE
ID
PGND
8
7
6
DD+
D+/PSEL
ID
R20
10.0k
10
VCC
3
DSEL
4
5
VBUS
J6
D-/PG
TP11
DD+
D+/PSEL
CE
TP15
INT
STAT
TP8
TS
TP18
REGN
TP21
QON
AGND
TP12
ID
GND
SDA
TEST POINTS
PGND
PGND
TS3USB221ARSER
6
7
8
VBUS
3.3V
Copyright © 2016, Texas Instruments Incorporated
Figure 19. bq25892 EVM Schematic
SLUUBA2B – March 2015 – Revised November 2015
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17
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TP2
D2
PMID
PMID
GND
C13
10µF
J2
C12
10µF
C11
10µF
C10
22µF
DNPC9
1000pF
C2
10µF
REGN
C3
4.7µF
DSEL
L1
SYS
AGND
3
PGND
Vbus: 3.9V to 14V
DNP D1
TP3
DSEL
VBUS
VBUS
GND
2
C5
10µF
DNP
C4
C6
10µF
DNPC14
DNP C15
0.1µF
10µF
DNPC16
10µF
DNPC17
1000pF
VSYS: 3.5V to 4.75V
1.5µH
1
DNP C8
1000pF
J3
L2
PG
C1
1µF
J1
System
GND
2.2uH
JP3
PG
0.047µF
R17
DNP
1.00
R13
0
PGND
PG
3
D-/PG
3
PG
R14
19
SW
SDA
BAT
Net-Tie
PGND
TP4
JP4
AGND
16
2
INT
PULL-UP
TP5
15
Battery
GND
13
ICHG: 0 ~ 5A
C7
10µF
DNP C18
1µF
12
9
11
7
QON
INT
R5
TS
10.0k
PULL-UP
R23
4.7k
ILIM
R6
10.0k
PULL-UP
JP6
VBUS
REGN
R1
130
OTG
R2
5.23k
S1
3.3V
VIN
R10
100k
VOUT
R7
DNP
10.0k
U2
GND
TS
GND
R19
AGND
10k
TS
R3
30.1k
R24
10.0k
JP7
JP10
R8
10.0k
AGND
2
C22
0.01µF
R22
2.21k
JP8
CE
C24
2.2µF
LP2985AIM5-3.3/NOPB
BYPASS
R18
768
AGND
5
ON/OFF
R21
2.21k
JP9
R16
0
4
DNP C20
1000pF
PGND
PGND
CE
3
DNPC19
10µF
SDA
SDA
200
200
1
J4
BAT
14
R15
R9
D3
Green
D4
Green
STAT
PG
AGND
AGND
S2A
VBUS
PGND
9
10
11
TP9
1
PGND
TP13
TP16
TP19
TP6
TP7
4
S2B
11
10
9
C23
1µF
1
21
20
SW
22
BAT
10.0k
R12
10
8
6
4
2
SYS
SCL
6
10
J7
SYS
BQ25895RTWR
SCL
200
9
7
5
3
1
BTST
U1
NT1
17
10.0k
PULL-UP
R11
PGND
STAT
5
SCL
AGND
PGND
D+
D-
4
STAT
PGND
VBUS
D5
18
QON
1
J8
DNP
25
3
2
2
TS
DD+/PSEL
ILIM
JP1
2
1
CE
1
HI
PSEL
LOW
SCL
D+/PSEL
OTG
SDA
JP2
8
4
3
2
1
DNP C21
0.01µF
PAD
D-
3
CE
REGN
DSEL
R4
10.0k
PMID
REGN
23
24
PGND
2
3
PGND
DSEL
SCL
OTG
TP10
D-
TP14
ILIM
TP17
TP20
PGND
D-
J5
D+
ID
GND
1
7
8
2
U3
4
2
1
1D1D+
3
5
5
GND
JP5
VBUS
1
2
4
3
2D2D+
9
6
S
OE
ID
PGND
8
7
6
DD+
D+/PSEL
ID
R20
10.0k
10
VCC
3
DSEL
4
5
VBUS
J6
D-/PG
D+
D+/PSEL
CE
TP15
INT
STAT
TP8
TS
TP18
REGN
TP21
QON
AGND
TP12
ID
GND
SDA
TP11
D-
TEST POINTS
PGND
PGND
TS3USB221ARSER
6
7
8
VBUS
3.3V
Copyright © 2016, Texas Instruments Incorporated
Figure 20. bq25895 EVM Schematic
18
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
SLUUBA2B – March 2015 – Revised November 2015
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TP2
D2
PMID
PMID
GND
C13
10µF
J2
C12
10µF
C11
10µF
C10
22µF
DNPC9
1000pF
C2
10µF
REGN
C3
4.7µF
DSEL
L1
SYS
AGND
3
PGND
Vbus: 3.9V to 14V
DNP D1
TP3
DSEL
VBUS
VBUS
GND
2
C5
10µF
DNP
C4
C6
10µF
DNPC14
DNP C15
0.1µF
10µF
DNPC16
10µF
DNPC17
1000pF
VSYS: 3.5V to 4.75V
1.5µH
1
DNP C8
1000pF
J3
L2
PG
C1
1µF
J1
System
GND
2.2uH
JP3
PG
0.047µF
R17
DNP
1.00
R13
0
PGND
3
D-/PG
3
1
PG
4
STAT
PGND
5
SCL
AGND
R14
U1
DSTAT
SYS
BQ25895MRTWR
SCL
BAT
SDA
BAT
R15
INT
10.0k
Net-Tie
17
PGND
JP4
2
PULL-UP
TP5
15
Battery
GND
13
ICHG: 0 ~ 5A
C7
10µF
DNP C18
1µF
QON
R5
TS
10.0k
PULL-UP
R23
4.7k
ILIM
R6
10.0k
PULL-UP
JP6
VBUS
REGN
R1
130
OTG
R2
5.23k
S1
3.3V
VIN
R10
100k
VOUT
R7
DNP
10.0k
U2
GND
TS
GND
R19
AGND
10k
TS
R3
30.1k
R24
10.0k
JP7
JP10
R8
10.0k
AGND
2
C22
0.01µF
R22
2.21k
JP8
CE
C24
2.2µF
LP2985AIM5-3.3/NOPB
BYPASS
R18
768
AGND
5
ON/OFF
R21
2.21k
JP9
R16
0
4
DNP C20
1000pF
INT
CE
3
DNPC19
10µF
PGND
PGND
200
1
J4
BAT
14
12
11
9
10
7
SDA
200
R9
D3
Green
D4
Green
STAT
PG
AGND
AGND
S2A
VBUS
PGND
9
10
11
TP9
1
PGND
TP13
TP16
TP19
TP6
TP7
4
S2B
11
10
9
C23
1µF
TP4
AGND
16
SDA
R12
10
8
6
4
2
SYS
NT1
1
20
19
SW
SW
22
21
PGND
SCL
200
J7
9
7
5
3
1
BTST
PGND
D+
10.0k
PULL-UP
R11
6
VBUS
D5
18
3
PG
J8
DNP
25
QON
2
2
TS
DD+/PSEL
ILIM
JP1
2
1
CE
1
HI
PSEL
LOW
SCL
D+/PSEL
OTG/IUSB
SDA
JP2
8
4
3
2
1
DNP C21
0.01µF
PAD
D-
3
CE
REGN
DSEL
R4
10.0k
PMID
REGN
23
24
PGND
2
3
PGND
DSEL
SCL
TP10
D-
OTG
TP14
ILIM
TP17
TP20
PGND
DD+
J5
ID
GND
1
7
8
2
U3
4
2
1
1D1D+
3
5
GND
JP5
VBUS
1
2
4
3
2D2D+
9
6
S
OE
ID
5
PGND
8
7
6
DD+
D+/PSEL
ID
R20
10.0k
10
VCC
3
DSEL
4
5
VBUS
J6
D-/PG
TP11
DD+
D+/PSEL
CE
TP15
INT
STAT
TP8
TS
TP18
REGN
TP21
QON
AGND
TP12
ID
GND
SDA
TEST POINTS
PGND
PGND
TS3USB221ARSER
6
7
8
VBUS
3.3V
Copyright © 2016, Texas Instruments Incorporated
Figure 21. bq25895M EVM Schematic
SLUUBA2B – March 2015 – Revised November 2015
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bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
Copyright © 2015, Texas Instruments Incorporated
19
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Copyright © 2016, Texas Instruments Incorporated
Figure 22. bq25896 EVM Schematic
20
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
SLUUBA2B – March 2015 – Revised November 2015
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Board Layout, Schematic, and Bill of Materials
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4.3
Bill of Materials
Table 5 lists the bq25890EVM-664 BOM, Table 6 lists the bq25892EVM-664 BOM, Table 7 lists the bq25895EVM-664 BOM, Table 8 lists the
bq25895MEVM-664 BOM and Table 9 lists the bq25896EVM-664 BOM.
Table 5. bq25890EVM-664 Bill of Materials
Designator
Value
Description
Package Reference
Part Number
Manufacturer
C1
Qty.
1
1µF
CAP, CERM, 1 µF, 25 V, ±10%, X7R, 0805
0805
GRM219R71E105KA88D
Murata
C2
1
10µF
CAP, CERM, 10uF, 25V, ±10%, X5R, 0805
0805
C2012X5R1E106K125AB
TDK
C3
1
4.7µF
CAP, CERM, 4.7uF, 16V, ±10%, X5R, 0603
0603
GRM188R61C475KAAJ
Murata
C4
1
0.047µF
CAP, CERM, 0.047uF, 25V, ±10%, X7R, 0402
0402
GRM155R71E473KA88D
Murata
C5, C6, C7
3
10µF
CAP, CERM, 10 µF, 10 V, ±10%, X7R, 0805
0805
GRM21BR71A106KE51L
Murata
C22
1
0.01µF
CAP, CERM, 0.01uF, 25V, ±10%, X7R, 0402
0402
C1005X7R1E103K
TDK
C23
1
1µF
CAP, CERM, 1uF, 25V,±10%, X7R, 0603
0603
C1608X7R1E105K080AB
TDK
C24
1
2.2µF
CAP, CERM, 2.2uF, 10V, ±10%, X5R, 0402
0402
C1005X5R1A225K050BC
TDK
D3, D4
2
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190GKT
Lite-On
H1, H2, H3, H4
4
Bumpon, Hemisphere, 0.44 × 0.20, Clear
Transparent Bumpon
SJ-5303 (CLEAR)
3M
J1, J2, J3, J4
4
Conn Term Block, 2POS, 3.81mm, TH
2POS Terminal Block
1727010
Phoenix Contact
J5, J6
2
Connector, Receptacle, Micro-USB Type B, R/A,
Bottom Mount SMT
7.5x2.45x5mm
0473460001
Molex
J7
1
Header (shrouded), 100mil, 5x2,
High-Temperature, Gold, TH
5x2 Shrouded header
N2510-6002-RB
3M
J8
1
Header, 100mil, 4x1, R/A, TH
4x1 R/A Header
22-05-3041
Molex
JP1–JP4
4
Header, 100mil, 3x1, Tin plated, TH
Header, 3 PIN, 100mil, Tin
PEC03SAAN
Sullins Connector Solutions
JP5–JP10
6
Header, 100mil, 2x1, Tin plated, TH
Header, 2 PIN, 100mil, Tin
PEC02SAAN
Sullins Connector Solutions
L1
1
Inductor, Shielded Drum Core, Powdered Iron,
1µH, 7A, 0.0181 Ω, SMD
5.49x2x5.18mm
IHLP2020BZER1R0M11
Vishay-Dale
LBL1
1
Thermal Transfer Printable Labels,
0.650" W x 0.200" H - 10,000 per roll
PCB Label 0.650"H x 0.200"W
THT-14-423-10
Brady
R1
1
130
RES, 130 Ω, 1%, 0.063W, 0402
0402
CRCW0402130RFKED
Vishay-Dale
R2
1
5.23k
RES, 5.23kΩ, 1%, 0.063W, 0402
0402
CRCW04025K23FKED
Vishay-Dale
R3
1
30.1k
RES, 30.1kΩ, 1%, 0.063W, 0402
0402
CRCW040230K1FKED
Vishay-Dale
R4–R6, R8, R14, R15,
R20, R24
8
10.0k
RES, 10.0kΩ, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R9, R11, R12
3
200
RES, 200 Ω, 1%, 0.063W, 0402
0402
CRCW0402200RFKED
Vishay-Dale
R10
1
100k
RES, 100kΩ, 1%, 0.063W, 0402
0402
CRCW0402100KFKED
Vishay-Dale
R13, R16
2
0
RES, 0 Ω, 5%, 0.063W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R18
1
768
RES, 768 Ω, 1%, 0.063W, 0402
0402
CRCW0402768RFKED
Vishay-Dale
R19
1
10k
Trimmer, 10kΩ, 0.25W, TH
4.5x8x6.7mm
3266W-1-103LF
Bourns
R21, R22
2
2.21k
RES, 2.21kΩ, 1%, 0.063W, 0402
0402
CRCW04022K21FKED
Vishay-Dale
R23
1
4.7k
RES, 4.7kΩ, 5%, 0.063W, 0402
0402
CRCW04024K70JNED
Vishay-Dale
S1
1
Switch, Normally open, 2.3N force, 200k operations, SMD
KSR
KSR221GLFS
C and K Components
S2
1
DIP Switch, SPST, 2Pos, Slide, SMT
SW, 4.7x1.45x3mm
CVS-02TB
Copal Electronics
SH-JP2—SH-JP5, SHJP9, SH-JP10
6
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
2x1
1µH
1x2
SLUUBA2B – March 2015 – Revised November 2015
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bq25895MEVM(PWR664)
Copyright © 2015, Texas Instruments Incorporated
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Table 5. bq25890EVM-664 Bill of Materials (continued)
Designator
Value
Description
Package Reference
Part Number
Manufacturer
TP2, TP3
Qty.
2
Red
Test Point, Miniature, Red, TH
Red Miniature Testpoint
5000
Keystone
TP4, TP18
2
Orange
Test Point, Miniature, Orange, TH
Orange Miniature Testpoint
5003
Keystone
TP5
1
Yellow
Test Point, Miniature, Yellow, TH
Yellow Miniature Testpoint
5004
Keystone
TP6, TP7, TP8
3
SMT
Test Point, Compact, SMT
Testpoint_Keystone_Compact
5016
Keystone
TP9–TP17, TP19–TP21
12
White
Test Point, Miniature, White, TH
White Miniature Testpoint
5002
Keystone
U1
1
I2C Controlled 5A Single Cell Charger with NVDC Power Path
Management and MaxChargeTM High Voltage Adapter Support,
RTW0024H
RTW0024H
BQ25890RTWR
Texas Instruments
U2
1
Micropower 150 mA Low-Noise Ultra Low-Dropout Regulator in SOT-23
Package, DBV0005A
DBV0005A
LP2985AIM5-3.3/NOPB
Texas Instruments
U3
1
ESD Protected,High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer /
Demultiplexer Switch, 1:2 Mux / Demux, 6 Ω RON, 2.5 to 3.3V, –40 to
85°C, 10-Pin UQFN (RSE), Green (RoHS & no Sb/Br)
RSE0010A
TS3USB221ARSER
Texas Instruments
C8, C9, C17, C20
0
1000pF
CAP, CERM, 1000pF, 25V, ±5%, C0G/NP0, 0402
0402
C1005C0G1E102J
TDK
C10
0
22µF
CAP, CERM, 22 µF, 25 V, ±20%, X5R, 0805
0805
GRM21BR61E226ME44
Murata
C11, C12, C13
0
10µF
CAP, CERM, 10uF, 25V, ±20%, X5R, 0603
0603
GRM188R61E106MA73
Murata
C14
0
0.1µF
CAP, CERM, 0.1uF, 16V, ±10%, X7R, 0603
0603
C1608X7R1C104K
TDK
C15, C16, C19
0
10µF
CAP, CERM, 10 µF, 10 V, ±10%, X7R, 0805
0805
GRM21BR71A106KE51L
Murata
C18
0
1µF
CAP, CERM, 1uF, 16V, ±10%, X7R, 0603
0603
C1608X7R1C105K
TDK
C21
0
0.01µF
CAP, CERM, 0.01uF, 25V,±10%, X7R, 0402
0402
C1005X7R1E103K
TDK
D1
0
40V
Diode, Schottky, 40V, 0.38A, SOD-523
SOD-523
ZLLS350TA
Diodes Inc.
D2
0
20V
Diode, Schottky, 20 V, 1 A, 1.4x0.6x0.31mm
1.4x0.6x0.31mm
NSR10F20NXT5G
ON Semiconductor
D5
0
30V
Diode, Schottky, 30 V, 1 A, SOD-123
SOD-123
B130LAW-7-F
Diodes Inc.
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or mount.
Fiducial
N/A
N/A
L2
0
1.5µH
Inductor, Flat Wire, Powdered Iron, 1.5 µH, 3 A, 0.05 Ω, SMD
4.7x1.2x4.0mm
SRP4012-1R5M
Bourns
R7
0
10.0k
RES, 10.0kΩ, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R17
0
1.00
RES, 1.00 Ω, 1%, 0.125W, 0805
0805
CRCW08051R00FKEA
Vishay-Dale
SH-JP1
0
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
spacer
spacer
spacer
spacer
spacer
spacer
spacer
22
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
SLUUBA2B – March 2015 – Revised November 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Board Layout, Schematic, and Bill of Materials
www.ti.com
Table 6. bq25892EVM-664 Bill of Materials
Designator
Value
Description
Package Reference
PartNumber
Manufacturer
C1
Qty.
1
1µF
CAP, CERM, 1 µF, 25 V, ±10%, X7R, 0805
0805
GRM219R71E105KA88D
MuRata
C2
1
10µF
CAP, CERM, 10uF, 25V, ±10%, X5R, 0805
0805
C2012X5R1E106K125AB
TDK
C3
1
4.7µF
CAP, CERM, 4.7uF, 16V, ±10%, X5R, 0603
0603
GRM188R61C475KAAJ
MuRata
C4
1
0.047µF
CAP, CERM, 0.047uF, 25V, ±10%, X7R, 0402
0402
GRM155R71E473KA88D
MuRata
C5, C6, C7
3
10µF
CAP, CERM, 10 µF, 10 V, ±10%, X7R, 0805
0805
GRM21BR71A106KE51L
MuRata
C22
1
0.01µF
CAP, CERM, 0.01uF, 25V, ±10%, X7R, 0402
0402
C1005X7R1E103K
TDK
C23
1
1µF
CAP, CERM, 1uF, 25V, ±10%, X7R, 0603
0603
C1608X7R1E105K080AB
TDK
C24
1
2.2µF
CAP, CERM, 2.2uF, 10V, ±10%, X5R, 0402
0402
C1005X5R1A225K050BC
TDK
D3, D4
2
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190GKT
Lite-On
H1, H2, H3, H4
4
Bumpon, Hemisphere, 0.44 × 0.20, Clear
Transparent Bumpon
SJ-5303 (CLEAR)
3M
J1, J2, J3, J4
4
Conn Term Block, 2POS, 3.81mm, TH
2POS Terminal Block
1727010
Phoenix Contact
J5, J6
2
Connector, Receptacle, Micro-USB Type B, R/A,
Bottom Mount SMT
7.5x2.45x5mm
0473460001
Molex
J7
1
Header (shrouded), 100mil, 5x2, High-Temperature,
Gold, TH
5x2 Shrouded header
N2510-6002-RB
3M
J8
1
Header, 100mil, 4x1, R/A, TH
4x1 R/A Header
22-05-3041
Molex
JP1, JP2, JP3, JP4
4
Header, 100mil, 3x1, Tin plated, TH
Header, 3 PIN, 100mil, Tin
PEC03SAAN
Sullins Connector Solutions
JP5, JP6, JP7, JP8,
JP9, JP10
6
Header, 100mil, 2x1, Tin plated, TH
Header, 2 PIN, 100mil, Tin
PEC02SAAN
Sullins Connector Solutions
L1
1
Inductor, Shielded Drum Core, Powdered Iron,
1µH, 7A, 0.0181 Ω, SMD
5.49x2x5.18mm
IHLP2020BZER1R0M11
Vishay-Dale
LBL1
1
Thermal Transfer Printable Labels,
0.650" W x 0.200" H - 10,000 per roll
PCB Label 0.650"H x 0.200"W
THT-14-423-10
Brady
R1
1
130
RES, 130 Ω, 1%, 0.063W, 0402
0402
CRCW0402130RFKED
Vishay-Dale
R2
1
5.23k
RES, 5.23kΩ, 1%, 0.063W, 0402
0402
CRCW04025K23FKED
Vishay-Dale
R3
1
30.1k
RES, 30.1kΩ, 1%, 0.063W, 0402
0402
CRCW040230K1FKED
Vishay-Dale
R4–R6, R8, R14, R15,
R20, R24
8
10.0k
RES, 10.0kΩ, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R9, R11, R12
3
200
RES, 200 Ω, 1%, 0.063W, 0402
0402
CRCW0402200RFKED
Vishay-Dale
R10
1
100k
RES, 100kΩ, 1%, 0.063W, 0402
0402
CRCW0402100KFKED
Vishay-Dale
R13
1
0
RES, 0 Ω, 5%, 0.063W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R18
1
768
RES, 768 Ω, 1%, 0.063W, 0402
0402
CRCW0402768RFKED
Vishay-Dale
R19
1
10k
Trimmer, 10kΩ, 0.25W, TH
4.5x8x6.7mm
3266W-1-103LF
Bourns
R21, R22
2
2.21k
RES, 2.21kΩ, 1%, 0.063W, 0402
0402
CRCW04022K21FKED
Vishay-Dale
R23
1
4.7k
RES, 4.7kΩ, 5%, 0.063W, 0402
0402
CRCW04024K70JNED
Vishay-Dale
S1
1
Switch, Normally open, 2.3N force, 200k operations, SMD
KSR
KSR221GLFS
C and K Components
S2
1
DIP Switch, SPST, 2Pos, Slide, SMT
SW, 4.7x1.45x3mm
CVS-02TB
Copal Electronics
SH-JP1—SH-JP4, SHJP9, SH-JP10
6
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
TP2, TP3
2
Red
Test Point, Miniature, Red, TH
Red Miniature Testpoint
5000
Keystone
TP4, TP18
2
Orange
Test Point, Miniature, Orange, TH
Orange Miniature Testpoint
5003
Keystone
TP5
1
Yellow
Test Point, Miniature, Yellow, TH
Yellow Miniature Testpoint
5004
Keystone
TP6, TP7, TP8
3
SMT
Test Point, Compact, SMT
Testpoint_Keystone_Compact
5016
Keystone
2x1
1uH
SLUUBA2B – March 2015 – Revised November 2015
Submit Documentation Feedback
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
Copyright © 2015, Texas Instruments Incorporated
23
Board Layout, Schematic, and Bill of Materials
www.ti.com
Table 6. bq25892EVM-664 Bill of Materials (continued)
Designator
Qty.
Value
Description
Package Reference
PartNumber
Manufacturer
TP9–TP17,
TP19–TP21
12
White
Test Point, Miniature, White, TH
White Miniature Testpoint
5002
Keystone
U1
1
I2C Controlled 5A Single Cell Charger with NVDC Power Path
Management and MaxCharge™ High Voltage Adapter Support,
RTW0024H
RTW0024H
BQ25892RTWR
Texas Instruments
U2
1
Micropower 150 mA Low-Noise Ultra Low-Dropout Regulator in SOT-23
Package, DBV0005A
DBV0005A
LP2985AIM5-3.3/NOPB
Texas Instruments
U3
1
ESD Protected,High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer /
Demultiplexer Switch, 1:2 Mux / Demux, 6 Ω RON, 2.5 to 3.3V, -40 to
85°C, 10-Pin UQFN (RSE), Green (RoHS & no Sb/Br)
RSE0010A
TS3USB221ARSER
Texas Instruments
C8, C9, C17, C20
0
1000pF
CAP, CERM, 1000pF, 25V, ±5%, C0G/NP0, 0402
0402
C1005C0G1E102J
TDK
C10
0
22µF
CAP, CERM, 22 µF, 25 V, ±20%, X5R, 0805
0805
GRM21BR61E226ME44
Murata
C11, C12, C13
0
10µF
CAP, CERM, 10uF, 25V, ±20%, X5R, 0603
0603
GRM188R61E106MA73
Murata
C14
0
0.1µF
CAP, CERM, 0.1uF, 16V, ±10%, X7R, 0603
0603
C1608X7R1C104K
TDK
C15, C16, C19
0
10µF
CAP, CERM, 10 µF, 10 V, ±10%, X7R, 0805
0805
GRM21BR71A106KE51L
Murata
C18
0
1µF
CAP, CERM, 1uF, 16V, ±10%, X7R, 0603
0603
C1608X7R1C105K
TDK
C21
0
0.01µF
CAP, CERM, 0.01uF, 25V, ±10%, X7R, 0402
0402
C1005X7R1E103K
TDK
D1
0
40V
Diode, Schottky, 40V, 0.38A, SOD-523
SOD-523
ZLLS350TA
Diodes Inc.
D2
0
20V
Diode, Schottky, 20 V, 1 A, 1.4x0.6x0.31mm
1.4x0.6x0.31mm
NSR10F20NXT5G
ON Semiconductor
D5
0
30V
Diode, Schottky, 30 V, 1 A, SOD-123
SOD-123
B130LAW-7-F
Diodes Inc.
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or mount.
Fiducial
N/A
N/A
L2
0
1.5µH
Inductor, Flat Wire, Powdered Iron, 1.5 µH,
3 A, 0.05 Ω, SMD
4.7x1.2x4.0mm
SRP4012-1R5M
Bourns
R7
0
10.0k
RES, 10.0kΩ, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R16
0
0
RES, 0 Ω 5%, 0.063W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R17
0
1.00
RES, 1.00 Ω, 1%, 0.125W, 0805
0805
CRCW08051R00FKEA
Vishay-Dale
SH-JP5
0
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
spacer
spacer
spacer
spacer
spacer
spacer
spacer
spacer
24
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
SLUUBA2B – March 2015 – Revised November 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Board Layout, Schematic, and Bill of Materials
www.ti.com
Table 7. bq25895EVM-664 Bill of Materials
Designator
Value
Description
PackageReference
Part Number
Manufacturer
C1
Qty.
1
1µF
CAP, CERM, 1 µF, 25 V, ±10%, X7R, 0805
0805
GRM219R71E105KA88D
Murata
C2
1
10µF
CAP, CERM, 10µF, 25V, ±10%, X5R, 0805
0805
C2012X5R1E106K125AB
TDK
C3
1
4.7µF
CAP, CERM, 4.7µF, 16V, ±10%, X5R, 0603
0603
GRM188R61C475KAAJ
Murata
C4
1
0.047µF
CAP, CERM, 0.047µF, 25V, ±10%, X7R, 0402
0402
GRM155R71E473KA88D
Murata
C5, C6, C7
3
10µF
CAP, CERM, 10 µF, 10 V, ±10%, X7R, 0805
0805
GRM21BR71A106KE51L
Murata
C10
1
22µF
CAP, CERM, 22 µF, 25 V, ±20%, X5R, 0805
0805
GRM21BR61E226ME44
Murata
C11, C12, C13
3
10µF
CAP, CERM, 10µF, 25V, ±20%, X5R, 0603
0603
GRM188R61E106MA73
Murata
C22
1
0.01µF
CAP, CERM, 0.01µF, 25V, ±10%, X7R, 0402
0402
C1005X7R1E103K
TDK
C23
1
1µF
CAP, CERM, 1µF, 25V, ±10%, X7R, 0603
0603
C1608X7R1E105K080AB
TDK
C24
1
2.2µF
CAP, CERM, 2.2µF, 10V, ±10%, X5R, 0402
0402
C1005X5R1A225K050BC
TDK
D2
1
20V
Diode, Schottky, 20 V, 1 A, 1.4x0.6x0.31mm
1.4x0.6x0.31mm
NSR10F20NXT5G
ON Semiconductor
D3, D4
2
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190GKT
Lite-On
H1, H2, H3, H4
4
Bumpon, Hemisphere, 0.44 x 0.20, Clear
Transparent Bumpon
SJ-5303 (CLEAR)
3M
J1, J2, J3, J4
4
Conn Term Block, 2POS, 3.81mm, TH
2POS Terminal Block
1727010
Phoenix Contact
J5, J6
2
Connector, Receptacle, Micro-USB Type B, R/A, Bottom Mount SMT
7.5x2.45x5mm
0473460001
Molex
J7
1
Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH
5x2 Shrouded header
N2510-6002-RB
3M
J8
1
Header, 100mil, 4x1, R/A, TH
4x1 R/A Header
22-05-3041
Molex
JP1, JP2, JP3, JP4
4
Header, 100mil, 3x1, Tin plated, TH
Header, 3 PIN, 100mil, Tin
PEC03SAAN
Sullins Connector Solutions
JP5–JP10
6
Header, 100mil, 2x1, Tin plated, TH
Header, 2 PIN, 100mil, Tin
PEC02SAAN
Sullins Connector Solutions
L1
1
Inductor, Shielded Drum Core, Powdered Iron,
2.2 µH, 8 A, 0.018 ohm, SMD
IHLP-2525CZ
IHLP2525CZER2R2M01
Vishay-Dale
LBL1
1
Thermal Transfer Printable Labels,
0.650" W x 0.200" H - 10,000 per roll
PCB Label 0.650"H x 0.200"W
THT-14-423-10
Brady
R1
1
130
RES, 130 Ω, 1%, 0.063W, 0402
0402
CRCW0402130RFKED
Vishay-Dale
R2
1
5.23k
RES, 5.23kΩ, 1%, 0.063W, 0402
0402
CRCW04025K23FKED
Vishay-Dale
R3
1
30.1k
RES, 30.1kΩ, 1%, 0.063W, 0402
0402
CRCW040230K1FKED
Vishay-Dale
R4–R6, R8, R14, R15,
R20, R24
8
10.0k
RES, 10.0kΩ, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R9, R11, R12
3
200
RES, 200 Ω, 1%, 0.063W, 0402
0402
CRCW0402200RFKED
Vishay-Dale
R10
1
100k
RES, 100k Ω, 1%, 0.063W, 0402
0402
CRCW0402100KFKED
Vishay-Dale
R13, R16
2
0
RES, 0 Ω, 5%, 0.063W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R18
1
768
RES, 768 Ω, 1%, 0.063W, 0402
0402
CRCW0402768RFKED
Vishay-Dale
R19
1
10k
Trimmer, 10kΩ, 0.25W, TH
4.5x8x6.7mm
3266W-1-103LF
Bourns
R21, R22
2
2.21k
RES, 2.21k Ω, 1%, 0.063W, 0402
0402
CRCW04022K21FKED
Vishay-Dale
R23
1
4.7k
RES, 4.7kΩ 5%, 0.063W, 0402
0402
CRCW04024K70JNED
Vishay-Dale
S1
1
Switch, Normally open, 2.3N force, 200k operations, SMD
KSR
KSR221GLFS
C and K Components
S2
1
DIP Switch, SPST, 2Pos, Slide, SMT
SW, 4.7x1.45x3mm
CVS-02TB
Copal Electronics
SH-JP2, SH-JP3, SHJP4, SH-JP5, SH-JP9,
SH-JP10
6
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
TP2, TP3
2
Red
Test Point, Miniature, Red, TH
Red Miniature Testpoint
5000
Keystone
TP4, TP18
2
Orange
Test Point, Miniature, Orange, TH
Orange Miniature Testpoint
5003
Keystone
2x1
2.2µH
SLUUBA2B – March 2015 – Revised November 2015
Submit Documentation Feedback
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
Copyright © 2015, Texas Instruments Incorporated
25
Board Layout, Schematic, and Bill of Materials
www.ti.com
Table 7. bq25895EVM-664 Bill of Materials (continued)
Designator
Qty.
Value
Description
PackageReference
Part Number
Manufacturer
TP5
1
Yellow
Test Point, Miniature, Yellow, TH
Yellow Miniature Testpoint
5004
Keystone
TP6, TP7, TP8
3
SMT
Test Point, Compact, SMT
Testpoint_Keystone_Compact
5016
Keystone
TP9, TP10, TP11,
TP12, TP13, TP14,
TP15, TP16, TP17,
TP19, TP20, TP21
12
White
Test Point, Miniature, White, TH
White Miniature Testpoint
5002
Keystone
U1
1
I2C Controlled 5A Single Cell Charger with NVDC Power Path
Management and MaxCharge™ High Voltage Adapter Support,
RTW0024H
RTW0024H
BQ25895RTWR
Texas Instruments
U2
1
Micropower 150 mA Low-Noise Ultra Low-Dropout Regulator in SOT-23
Package, DBV0005A
DBV0005A
LP2985AIM5-3.3/NOPB
Texas Instruments
U3
1
ESD Protected, High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer /
Demultiplexer Switch, 1:2 Mux / Demux, 6 Ω RON, 2.5 to 3.3V, -40 to
85°C, 10-Pin UQFN (RSE), Green (RoHS & no Sb/Br)
RSE0010A
TS3USB221ARSER
Texas Instruments
C8, C9, C17, C20
0
1000pF
CAP, CERM, 1000pF, 25V, ±5%, C0G/NP0, 0402
0402
C1005C0G1E102J
TDK
C14
0
0.1µF
CAP, CERM, 0.1uF, 16V, ±10%, X7R, 0603
0603
C1608X7R1C104K
TDK
C15, C16, C19
0
10µF
CAP, CERM, 10 µF, 10 V, ±10%, X7R, 0805
0805
GRM21BR71A106KE51L
Murata
C18
0
1µF
CAP, CERM, 1uF, 16V, ±10%, X7R, 0603
0603
C1608X7R1C105K
TDK
C21
0
0.01µF
CAP, CERM, 0.01uF, 25V, ±10%, X7R, 0402
0402
C1005X7R1E103K
TDK
D1
0
40V
Diode, Schottky, 40V, 0.38A, SOD-523
SOD-523
ZLLS350TA
Diodes Inc.
D5
0
30V
Diode, Schottky, 30 V, 1 A, SOD-123
SOD-123
B130LAW-7-F
Diodes Inc.
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or mount.
Fiducial
N/A
N/A
L2
0
1.5µH
Inductor, Flat Wire, Powdered Iron, 1.5 µH, 3 A, 0.05 Ω, SMD
4.7x1.2x4.0mm
SRP4012-1R5M
Bourns
R7
0
10.0k
RES, 10.0kΩ, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R17
0
1.00
RES, 1.00 Ω, 1%, 0.125W, 0805
0805
CRCW08051R00FKEA
Vishay-Dale
SH-JP1
0
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
26
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
SLUUBA2B – March 2015 – Revised November 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Board Layout, Schematic, and Bill of Materials
www.ti.com
Table 8. bq25895MEVM-664 Bill of Materials
Designator
Value
Description
PackageReference
Part Number
Manufacturer
C1
Qty.
1
1µF
CAP, CERM, 1 µF, 25 V, ±10%, X7R, 0805
0805
GRM219R71E105KA88D
Murata
C2
1
10µF
CAP, CERM, 10µF, 25V, ±10%, X5R, 0805
0805
C2012X5R1E106K125AB
TDK
C3
1
4.7µF
CAP, CERM, 4.7µF, 16V, ±10%, X5R, 0603
0603
GRM188R61C475KAAJ
Murata
C4
1
0.047µF
CAP, CERM, 0.047µF, 25V, ±10%, X7R, 0402
0402
GRM155R71E473KA88D
Murata
C5, C6, C7
3
10µF
CAP, CERM, 10 µF, 10 V, ±10%, X7R, 0805
0805
GRM21BR71A106KE51L
Murata
C10
1
22µF
CAP, CERM, 22 µF, 25 V, ±20%, X5R, 0805
0805
GRM21BR61E226ME44
Murata
C11, C12, C13
3
10µF
CAP, CERM, 10µF, 25V, ±20%, X5R, 0603
0603
GRM188R61E106MA73
Murata
C22
1
0.01µF
CAP, CERM, 0.01µF, 25V, ±10%, X7R, 0402
0402
C1005X7R1E103K
TDK
C23
1
1µF
CAP, CERM, 1µF, 25V, ±10%, X7R, 0603
0603
C1608X7R1E105K080AB
TDK
C24
1
2.2µF
CAP, CERM, 2.2µF, 10V, ±10%, X5R, 0402
0402
C1005X5R1A225K050BC
TDK
D2
1
20V
Diode, Schottky, 20 V, 1 A, 1.4x0.6x0.31mm
1.4x0.6x0.31mm
NSR10F20NXT5G
ON Semiconductor
D3, D4
2
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190GKT
Lite-On
H1, H2, H3, H4
4
Bumpon, Hemisphere, 0.44 x 0.20, Clear
Transparent Bumpon
SJ-5303 (CLEAR)
3M
J1, J2, J3, J4
4
Conn Term Block, 2POS, 3.81mm, TH
2POS Terminal Block
1727010
Phoenix Contact
J5, J6
2
Connector, Receptacle, Micro-USB Type B, R/A, Bottom Mount SMT
7.5x2.45x5mm
0473460001
Molex
J7
1
Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH
5x2 Shrouded header
N2510-6002-RB
3M
J8
1
Header, 100mil, 4x1, R/A, TH
4x1 R/A Header
22-05-3041
Molex
JP1, JP2, JP3, JP4
4
Header, 100mil, 3x1, Tin plated, TH
Header, 3 PIN, 100mil, Tin
PEC03SAAN
Sullins Connector Solutions
JP5–JP10
6
Header, 100mil, 2x1, Tin plated, TH
Header, 2 PIN, 100mil, Tin
PEC02SAAN
Sullins Connector Solutions
L1
1
Inductor, Shielded Drum Core, Powdered Iron,
2.2 µH, 8 A, 0.018 ohm, SMD
IHLP-2525CZ
IHLP2525CZER2R2M01
Vishay-Dale
LBL1
1
Thermal Transfer Printable Labels,
0.650" W x 0.200" H - 10,000 per roll
PCB Label 0.650"H x 0.200"W
THT-14-423-10
Brady
R1
1
130
RES, 130 Ω, 1%, 0.063W, 0402
0402
CRCW0402130RFKED
Vishay-Dale
R2
1
5.23k
RES, 5.23kΩ, 1%, 0.063W, 0402
0402
CRCW04025K23FKED
Vishay-Dale
R3
1
30.1k
RES, 30.1kΩ, 1%, 0.063W, 0402
0402
CRCW040230K1FKED
Vishay-Dale
R4–R6, R8, R14, R15,
R20, R24
8
10.0k
RES, 10.0kΩ, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R9, R11, R12
3
200
RES, 200 Ω, 1%, 0.063W, 0402
0402
CRCW0402200RFKED
Vishay-Dale
R10
1
100k
RES, 100k Ω, 1%, 0.063W, 0402
0402
CRCW0402100KFKED
Vishay-Dale
R13, R16
2
0
RES, 0 Ω, 5%, 0.063W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R18
1
768
RES, 768 Ω, 1%, 0.063W, 0402
0402
CRCW0402768RFKED
Vishay-Dale
R19
1
10k
Trimmer, 10kΩ, 0.25W, TH
4.5x8x6.7mm
3266W-1-103LF
Bourns
R21, R22
2
2.21k
RES, 2.21k Ω, 1%, 0.063W, 0402
0402
CRCW04022K21FKED
Vishay-Dale
R23
1
4.7k
RES, 4.7kΩ 5%, 0.063W, 0402
0402
CRCW04024K70JNED
Vishay-Dale
S1
1
Switch, Normally open, 2.3N force, 200k operations, SMD
KSR
KSR221GLFS
C and K Components
S2
1
DIP Switch, SPST, 2Pos, Slide, SMT
SW, 4.7x1.45x3mm
CVS-02TB
Copal Electronics
SH-JP2, SH-JP3, SHJP4, SH-JP5, SH-JP9,
SH-JP10
6
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
TP2, TP3
2
Red
Test Point, Miniature, Red, TH
Red Miniature Testpoint
5000
Keystone
TP4, TP18
2
Orange
Test Point, Miniature, Orange, TH
Orange Miniature Testpoint
5003
Keystone
2x1
2.2µH
SLUUBA2B – March 2015 – Revised November 2015
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bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
Copyright © 2015, Texas Instruments Incorporated
27
Board Layout, Schematic, and Bill of Materials
www.ti.com
Table 8. bq25895MEVM-664 Bill of Materials (continued)
Designator
Qty.
Value
Description
PackageReference
Part Number
Manufacturer
TP5
1
Yellow
Test Point, Miniature, Yellow, TH
Yellow Miniature Testpoint
5004
Keystone
TP6, TP7, TP8
3
SMT
Test Point, Compact, SMT
Testpoint_Keystone_Compact
5016
Keystone
TP9, TP10, TP11,
TP12, TP13, TP14,
TP15, TP16, TP17,
TP19, TP20, TP21
12
White
Test Point, Miniature, White, TH
White Miniature Testpoint
5002
Keystone
U1
1
I2C Controlled 5A Single Cell Charger with NVDC Power Path
Management and MaxCharge™ High Voltage Adapter Support,
RTW0024H
RTW0024H
BQ25895MRTWR
Texas Instruments
U2
1
Micropower 150 mA Low-Noise Ultra Low-Dropout Regulator in SOT-23
Package, DBV0005A
DBV0005A
LP2985AIM5-3.3/NOPB
Texas Instruments
U3
1
ESD Protected, High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer /
Demultiplexer Switch, 1:2 Mux / Demux, 6 Ω RON, 2.5 to 3.3V, -40 to
85°C, 10-Pin UQFN (RSE), Green (RoHS & no Sb/Br)
RSE0010A
TS3USB221ARSER
Texas Instruments
C8, C9, C17, C20
0
1000pF
CAP, CERM, 1000pF, 25V, ±5%, C0G/NP0, 0402
0402
C1005C0G1E102J
TDK
C14
0
0.1µF
CAP, CERM, 0.1uF, 16V, ±10%, X7R, 0603
0603
C1608X7R1C104K
TDK
C15, C16, C19
0
10µF
CAP, CERM, 10 µF, 10 V, ±10%, X7R, 0805
0805
GRM21BR71A106KE51L
Murata
C18
0
1µF
CAP, CERM, 1uF, 16V, ±10%, X7R, 0603
0603
C1608X7R1C105K
TDK
C21
0
0.01µF
CAP, CERM, 0.01uF, 25V, ±10%, X7R, 0402
0402
C1005X7R1E103K
TDK
D1
0
40V
Diode, Schottky, 40V, 0.38A, SOD-523
SOD-523
ZLLS350TA
Diodes Inc.
D5
0
30V
Diode, Schottky, 30 V, 1 A, SOD-123
SOD-123
B130LAW-7-F
Diodes Inc.
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or mount.
Fiducial
N/A
N/A
L2
0
1.5µH
Inductor, Flat Wire, Powdered Iron, 1.5 µH, 3 A, 0.05 Ω, SMD
4.7x1.2x4.0mm
SRP4012-1R5M
Bourns
R7
0
10.0k
RES, 10.0kΩ, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R17
0
1.00
RES, 1.00 Ω, 1%, 0.125W, 0805
0805
CRCW08051R00FKEA
Vishay-Dale
SH-JP1
0
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
spacer
spacer
spacer
spacer
spacer
spacer
spacer
spacer
spacer
spacer
28
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
SLUUBA2B – March 2015 – Revised November 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Board Layout, Schematic, and Bill of Materials
www.ti.com
Table 9. bq25896EVM-664 Bill of Materials
Designator
Value
Description
PackageReference
Part Number
Manufacturer
C1
Qty.
1
1uF
CAP, CERM, 1 µF, 25 V, +/- 10%, X7R, 0805
0805
GRM219R71E105KA88D
MuRata
C2
1
10uF
CAP, CERM, 10uF, 25V, +/-10%, X5R, 0805
0805
C2012X5R1E106K125AB
TDK
C3
1
4.7uF
CAP, CERM, 4.7uF, 16V, +/-10%, X5R, 0603
0603
GRM188R61C475KAAJ
MuRata
C4
1
0.047uF
CAP, CERM, 0.047uF, 25V, +/-10%, X7R, 0402
0402
GRM155R71E473KA88D
MuRata
C5, C6, C7
3
10uF
CAP, CERM, 10 µF, 10 V, +/- 10%, X7R, 0805
0805
GRM21BR71A106KE51L
MuRata
C22
1
0.01uF
CAP, CERM, 0.01uF, 25V, +/-10%, X7R, 0402
0402
C1005X7R1E103K
TDK
C23
1
1uF
CAP, CERM, 1uF, 25V, +/-10%, X7R, 0603
0603
C1608X7R1E105K080AB
TDK
C24
1
2.2uF
CAP, CERM, 2.2uF, 10V, +/-10%, X5R, 0402
0402
C1005X5R1A225K050BC
TDK
D3, D4
2
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190GKT
Lite-On
H1, H2, H3, H4
4
Bumpon, Hemisphere, 0.44 X 0.20, Clear
Transparent Bumpon
SJ-5303 (CLEAR)
3M
J1, J2, J3, J4
4
Conn Term Block, 2POS, 3.81mm, TH
2POS Terminal Block
1727010
Phoenix Contact
J5, J6
2
Connector, Receptacle, Micro-USB Type B, R/A, Bottom Mount SMT
7.5x2.45x5mm
0473460001
Molex
J7
1
Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH
5x2 Shrouded header
N2510-6002-RB
3M
J8
1
Header, 100mil, 4x1, R/A, TH
4x1 R/A Header
22-05-3041
Molex
JP1, JP2, JP3, JP4
4
Header, 100mil, 3x1, Tin plated, TH
Header, 3 PIN, 100mil, Tin
PEC03SAAN
Sullins Connector Solutions
JP5, JP6, JP7, JP8,
JP9, JP10
6
Header, 100mil, 2x1, Tin plated, TH
Header, 2 PIN, 100mil, Tin
PEC02SAAN
Sullins Connector Solutions
L1
1
Inductor, Shielded Drum Core, Powdered Iron, 1uH, 7A, 0.0181 ohm,
SMD
5.49x2x5.18mm
IHLP2020BZER1R0M11
Vishay-Dale
LBL1
1
Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per
roll
PCB Label 0.650"H x 0.200"W
THT-14-423-10
Brady
R1
1
130
RES, 130 ohm, 1%, 0.063W, 0402
0402
CRCW0402130RFKED
Vishay-Dale
R2
1
5.23k
RES, 5.23k ohm, 1%, 0.063W, 0402
0402
CRCW04025K23FKED
Vishay-Dale
R3
1
30.1k
RES, 30.1k ohm, 1%, 0.063W, 0402
0402
CRCW040230K1FKED
Vishay-Dale
R4, R5, R6, R8, R14,
R15, R20, R24
8
10.0k
RES, 10.0k ohm, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R10
1
100k
RES, 100k ohm, 1%, 0.063W, 0402
0402
CRCW0402100KFKED
Vishay-Dale
R11, R12
2
200
RES, 200 ohm, 1%, 0.063W, 0402
0402
CRCW0402200RFKED
Vishay-Dale
R13
1
0
RES, 0 ohm, 5%, 0.063W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R18
1
768
RES, 768 ohm, 1%, 0.063W, 0402
0402
CRCW0402768RFKED
Vishay-Dale
R19
1
10k
Trimmer, 10k ohm, 0.25W, TH
4.5x8x6.7mm
3266W-1-103LF
Bourns
R21, R22
2
2.21k
RES, 2.21k ohm, 1%, 0.063W, 0402
0402
CRCW04022K21FKED
Vishay-Dale
R23
1
4.7k
RES, 4.7k ohm, 5%, 0.063W, 0402
0402
CRCW04024K70JNED
Vishay-Dale
S1
1
Switch, Normally open, 2.3N force, 200k operations, SMD
KSR
KSR221GLFS
C and K Components
S2
1
DIP Switch, SPST, 2Pos, Slide, SMT
SW, 4.7x1.45x3mm
CVS-02TB
Copal Electronics
SH-JP1, SH-JP2, SHJP3, SH-JP4, SH-JP9,
SH-JP10
6
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
TP2, TP3
2
Red
Test Point, Miniature, Red, TH
Red Miniature Testpoint
5000
Keystone
TP4, TP18
2
Orange
Test Point, Miniature, Orange, TH
Orange Miniature Testpoint
5003
Keystone
TP5
1
Yellow
Test Point, Miniature, Yellow, TH
Yellow Miniature Testpoint
5004
Keystone
TP6, TP7, TP8
3
SMT
Test Point, Compact, SMT
Testpoint_Keystone_Compact
5016
Keystone
2x1
1uH
SLUUBA2B – March 2015 – Revised November 2015
Submit Documentation Feedback
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
Copyright © 2015, Texas Instruments Incorporated
29
Board Layout, Schematic, and Bill of Materials
www.ti.com
Table 9. bq25896EVM-664 Bill of Materials (continued)
Designator
Qty.
Value
Description
PackageReference
Part Number
Manufacturer
TP9, TP10, TP11,
TP12, TP13, TP14,
TP15, TP16, TP17,
TP19, TP20, TP21
12
White
Test Point, Miniature, White, TH
White Miniature Testpoint
5002
Keystone
U1
1
I2C Controlled 3A Single Cell Charger with NVDC Power Path
Management and MaxCharge High Voltage Adapter Support,
RTW0024H
RTW0024H
BQ25896RTWR
Texas Instruments
U2
1
Micropower 150 mA Low-Noise Ultra Low-Dropout Regulator in SOT-23
Package, DBV0005A
DBV0005A
LP2985AIM5-3.3/NOPB
Texas Instruments
U3
1
ESD Protected,High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer /
Demultiplexer Switch, 1:2 Mux / Demux, 6 ohm RON, 2.5 to 3.3V, -40
to 85 degC, 10-Pin UQFN (RSE), Green (RoHS & no Sb/Br)
RSE0010A
TS3USB221ARSER
Texas Instruments
C8, C9, C17, C20
0
1000pF
CAP, CERM, 1000pF, 25V, +/-5%, C0G/NP0, 0402
0402
C1005C0G1E102J
TDK
C10
0
22uF
CAP, CERM, 22 µF, 25 V, +/- 20%, X5R, 0805
0805
GRM21BR61E226ME44
MuRata
C11, C12, C13
0
10uF
CAP, CERM, 10uF, 25V, +/-20%, X5R, 0603
0603
GRM188R61E106MA73
MuRata
C14
0
0.1uF
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0603
0603
C1608X7R1C104K
TDK
C15, C16, C19
0
10uF
CAP, CERM, 10 µF, 10 V, +/- 10%, X7R, 0805
0805
GRM21BR71A106KE51L
MuRata
C18
0
1uF
CAP, CERM, 1uF, 16V, +/-10%, X7R, 0603
0603
C1608X7R1C105K
TDK
C21
0
0.01uF
CAP, CERM, 0.01uF, 25V, +/-10%, X7R, 0402
0402
C1005X7R1E103K
TDK
D1
0
40V
Diode, Schottky, 40V, 0.38A, SOD-523
SOD-523
ZLLS350TA
Diodes Inc.
D2
0
20V
Diode, Schottky, 20 V, 1 A, 1.4x0.6x0.31mm
1.4x0.6x0.31mm
NSR10F20NXT5G
ON Semiconductor
D5
0
30V
Diode, Schottky, 30 V, 1 A, SOD-123
SOD-123
B130LAW-7-F
Diodes Inc.
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or mount.
Fiducial
N/A
N/A
L2
0
2.2uH
Inductor, Shielded Drum Core, Powdered Iron, 2.2 µH, 8 A, 0.018 ohm,
SMD
IHLP-2525CZ
IHLP2525CZER2R2M01
Vishay-Dale
R7
0
10.0k
RES, 10.0k ohm, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R9
0
200
RES, 200 ohm, 1%, 0.063W, 0402
0402
CRCW0402200RFKED
Vishay-Dale
R16
0
0
RES, 0 ohm, 5%, 0.063W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R17
0
1.00
RES, 1.00 ohm, 1%, 0.125W, 0805
0805
CRCW08051R00FKEA
Vishay-Dale
SH-JP5
0
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
30
bq25890EVM, bq25892EVM, bq25895EVM, bq25896EVM and
bq25895MEVM(PWR664)
SLUUBA2B – March 2015 – Revised November 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Revision History
www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from A Revision (July 2015) to B Revision ..................................................................................................... Page
•
•
Added bq25896 EVM Schematic Figure 22 .......................................................................................... 20
Added bq25896 EVM BOM Table 9. .................................................................................................. 29
Revision History
Changes from Original (March 2015) to A Revision ....................................................................................................... Page
•
•
•
•
•
•
•
•
•
•
Added bq25895M EVM to document. .................................................................................................. 1
Changed version number on BatteryManagementStudio-1.3.35. ................................................................... 4
Changed Install EV2300 Software section. ............................................................................................ 4
Changed Connections of the EV2300 image. ......................................................................................... 5
Deleted EV2400 reference in Original Test Setup for PWR664 (bq2589x EVM) image. ........................................ 5
Changed steps 8 and 9 in the Equipment Setup section. ........................................................................... 6
Changed image in the Communication Verification section, step 3. ............................................................... 9
Added Clean-Up section. ............................................................................................................... 10
Added bq25895M EVM Schematic image. ........................................................................................... 19
Added bq25895M EVM BOM Table 8 ................................................................................................ 27
SLUUBA2B – March 2015 – Revised November 2015
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Copyright © 2015, Texas Instruments Incorporated
Revision History
31
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