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bq27421-G1
SLUSB85E – MAY 2013 – REVISED JANUARY 2016
bq27421-G1 System-Side Impedance Track™ Fuel Gauge With Integrated Sense Resistor
1 Features
3 Description
•
The Texas Instruments bq27421-G1 fuel gauge is a
minimally configured microcontroller peripheral that
provides system-side fuel gauging for single-cell LiIon batteries. The device requires very little user
configuration and system microcontroller firmware
development.
1
•
•
Single-Cell Li-Ion Battery Fuel Gauge
– Resides on System Board
– Supports Embedded or Removable Batteries
– Powered Directly from Battery with Integrated
LDO
– Low-Value Integrated Sense Resistor
(7 mΩ, Typical)
Easy-to-Configure Fuel Gauging Based on
Patented Impedance Track™ Technology
– Reports Remaining Capacity and State-ofCharge (SOC) with Smoothing Filter
– Automatically Adjusts for Battery Aging, SelfDischarge, Temperature, and Rate Changes
– Battery State-of-Health (Aging) Estimation
Microcontroller Peripheral Supports:
– 400-kHz I2C Serial Interface
– Configurable SOC Interrupt or
Battery Low Digital Output Warning
– Internal Temperature Sensor or
Host-Reported Temperature
The bq27421-G1 fuel gauge uses the patented
Impedance TrackTM algorithm for fuel gauging, and
provides information such as remaining battery
capacity (mAh), state-of-charge (%), and battery
voltage (mV).
Battery fuel gauging with the bq27421-G1 fuel gauge
requires connections only to PACK+ (P+) and PACK–
(P–) for a removable battery pack or embedded
battery circuit. The tiny 9-ball, 1.62 mm × 1.58 mm,
0.5-mm pitch NanoFree™ chip scale package
(DSBGA) is ideal for space-constrained applications.
Device Information(1)
PART NUMBER
PACKAGE
bq27421-G1
YZF (9)
BODY SIZE (NOM)
1.62 mm × 1.58 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
•
•
•
Smartphones, Feature Phones, and Tablets
Digital Still and Video Cameras
Handheld Terminals
MP3 or Multimedia Players
Simplified Schematic
I2C
Bus
SRX
SCL
Coulomb
Counter
SDA
Integrated
Sense
Resistor
CPU
GPOUT
BIN
VSYS
BatteryPack
BAT
ADC
VDD
1.8 V
LDO
VSS
PACKP
047
. µF
Li-Ion
Cell
T
Protection
IC
PACKN
NFET NFET
1 µF
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq27421-G1
SLUSB85E – MAY 2013 – REVISED JANUARY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
Absolute Maximum Ratings ...................................... 4
ESD Ratings ............................................................ 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 5
Supply Current .......................................................... 5
Digital Input and Output DC Characteristics ............. 5
LDO Regulator, Wake-Up, and Auto-Shutdown DC
Characteristics ........................................................... 5
7.8 ADC (Temperature and Cell Measurement)
Characteristics ........................................................... 6
7.9 Integrating ADC (Coulomb Counter) Characteristics
................................................................................... 6
7.10 Integrated Sense Resistor Characteristics, –40°C to
85°C .......................................................................... 6
7.11 Integrated Sense Resistor Characteristics, –40°C to
70°C .......................................................................... 6
7.12 I2C-Compatible Interface Communication Timing
Characteristics ........................................................... 6
7.13 Typical Characteristics ............................................ 8
8
Detailed Description .............................................. 9
8.1
8.2
8.3
8.4
8.5
9
Overview ................................................................... 9
Functional Block Diagram ......................................... 9
Feature Description................................................... 9
Device Functional Modes........................................ 10
Programming........................................................... 10
Applications and Implementation ...................... 14
9.1 Application Information............................................ 14
9.2 Typical Applications ................................................ 15
10 Power Supply Recommendation ....................... 18
10.1 Power Supply Decoupling ..................................... 18
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 19
12 Device and Documentation Support ................. 20
12.1
12.2
12.3
12.4
12.5
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
20
20
20
20
20
13 Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
Changes from Revision D (July 2015) to Revision E
Page
•
Changed Pin Configuration and Functions............................................................................................................................. 3
•
Changed Mechanical, Packaging, and Orderable Information ............................................................................................ 20
Changes from Revision C (December 2014) to Revision D
Page
•
Changed the Integrated Sense Resistor Characteristics, –40°C to 85°C specifications ...................................................... 6
•
Changed the Integrated LDO Capacitor section ................................................................................................................. 16
•
Added Community Resources ............................................................................................................................................. 20
Changes from Revision B (November 2014) to Revision C
Page
•
Changed simplified schematic by adding 1-µF capacitor ....................................................................................................... 1
•
Added description for connecting a 1-µF capacitor ................................................................................................................ 3
•
Added information for connecting GPOUT ............................................................................................................................. 3
•
Changed connection description for BAT pin ....................................................................................................................... 18
•
Changed "recommend" to "required".................................................................................................................................... 19
2
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5 Device Comparison Table
PART NUMBER
BATTERY TYPE
bq27421YZFR-G1A
LiCoO2
(4.2 V maximum charge)
0x128
LiCoO2
(4.3 V to 4.35 V maximum charge)
0x312
LiCoO2
(4.3 V to 4.4 V maximum charge)
0x3142
bq27421YZFT-G1A
bq27421YZFR-G1B
bq27421YZFT-G1B
bq27421YZFR-G1D
bq27421YZFT-G1D
(1)
(2)
CHEM_ID
(1)
PACKAGE
(2)
CSP-9
COMMUNICATION FORMAT
I2C
See the CHEM_ID subcommand to confirm the battery chemistry type.
For the most current package and ordering information see the Package Option Addendum at the end of this document or see the TI
website at www.ti.com.
6 Pin Configuration and Functions
(TOP VIEW)
(BOTTOM VIEW)
C3
C2
C1
C1
C2
C3
B3
B2
B1
B1
B2
B3
A3
A2
A1
A1
A2
A3
Pin A1
Index Area
Pin Functions
PIN
NAME
BAT
BIN
NUMBER
C3
B1
TYPE (1)
DESCRIPTION
PI, AI
LDO regulator input, battery voltage input, and coulomb counter input typically connected to the
PACK+ terminal. Connect a capacitor (1 µF) between BAT and VSS. Place the capacitor close to the
gauge.
DI
Battery insertion detection input. If Operation Configuration bit [BIE] = 1 (default), a logic low on
the pin is detected as battery insertion. For a removable pack, the BIN pin can be connected to VSS
through a pulldown resistor on the pack, typically the 10-kΩ thermistor; the system board should use
a 1.8-MΩ pullup resistor to VDD to ensure the BIN pin is high when a battery is removed. If the
battery is embedded in the system, it is recommended to leave [BIE] = 1 and use a 10-kΩ pulldown
resistor from BIN to VSS. If [BIE] = 0, then the host must inform the gauge of battery insertion and
removal with the BAT_INSERT and BAT_REMOVE subcommands. A 10-kΩ pulldown resistor
should be placed between BIN and VSS, even if this pin is unused.
NOTE: The BIN pin must not be shorted directly to VCC or VSS and any pullup resistor on the BIN
pin must be connected only to VDD and not an external voltage rail.
This open-drain output can be configured to indicate BAT_LOW when the Operation Configuration
[BATLOWEN] bit is set. By default [BATLOWEN] is cleared and this pin performs an interrupt
function (SOC_INT) by pulsing for specific events, such as a change in State of Charge. Signal
polarity for these functions is controlled by the [GPIOPOL] configuration bit. This pin should not be
left floating, even if unused, so a 10-kΩ pullup resistor is recommended. If the device is in
SHUTDOWN mode, then toggling GPOUT will make the gauge exit SHUTDOWN. Therefore, it is
recommended to connect GPOUT to a GPIO of the host MCU.
GPOUT
A1
DO
SCL
A3
DIO
SDA
A2
DIO
SRX
C2
AI
(1)
Slave I2C serial bus for communication with system (Master). Open-drain pins. Use with external
10-kΩ pullup resistors (typical) for each pin. If the external pullup resistors will be disconnected from
these pins during normal operation, it is recommended to use external 1-MΩ pulldown resistors to
VSS at each pin to avoid floating inputs.
Integrated high-side sense resistor and coulomb counter input typically connected to system power
rail VSYS.
IO = Digital input-output, AI = Analog input, P = Power connection
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Pin Functions (continued)
PIN
NAME
VDD
NUMBER
B3
VSS
B2, C1
TYPE (1)
DESCRIPTION
PO
1.8-V Regulator Output. Decouple with 0.47-μF ceramic capacitor to VSS. This pin is not intended to
provide power for other devices in the system.
PI
Ground pins. The center pin B2 is the actual device ground pin while pin C1 is floating internally and
therefore C1 may be used as a bridge to connect to the board ground plane without requiring a via
under the device package. It is recommended to route the center pin B2 to the corner pin C1 using
a top-layer metal trace on the board. Then route the corner pin C1 to the board ground plane.
7 Specifications
7.1 Absolute Maximum Ratings
Over-operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
VBAT
BAT pin input voltage range
–0.3
6
V
VSRX
SRX pin input voltage range
VBAT – 0.3
VBAT + 0.3
V
VDD
VDD pin supply voltage range (LDO output)
–0.3
2
V
VIOD
Open-drain IO pins (SDA, SCL, GPOUT)
–0.3
6
V
VIOPP
Push-pull IO pins (BIN)
–0.3
VDD + 0.3
V
TA
Operating free-air temperature range
–40
85
°C
Tstg
Storage temperature
–65
150
°C
(1)
UNIT
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±1500
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
UNIT
V
±250
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
TA = 30°C and VREGIN = VBAT = 3.6V (unless otherwise noted)
MIN
CBAT (1)
External input capacitor for internal
LDO between BAT and VSS
CLDO18 (1)
External output capacitor for
internal LDO between VDD and VSS
VPU (1)
External pull-up voltage for opendrain pins (SDA, SCL, GPOUT)
(1)
4
Nominal capacitor values specified. A 5%
ceramic X5R-type capacitor located close to
the device is recommended.
1.62
NOM
MAX
UNIT
0.1
μF
0.47
μF
3.6
V
Specified by design. Not production tested.
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7.4 Thermal Information
bq27421-G1
THERMAL METRIC (1)
YZF (DSBGA)
UNIT
9 PINS
RθJA
Junction-to-ambient thermal resistance
107.8
°C/W
RθJCtop
RθJB
Junction-to-case (top) thermal resistance
0.7
°C/W
Junction-to-board thermal resistance
60.4
°C/W
ψJT
Junction-to-top characterization parameter
3.5
°C/W
ψJB
Junction-to-board characterization parameter
60.4
°C/W
RθJCbot
Junction-to-case (bottom) thermal resistance
NA
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Supply Current
TA = 30°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ICC (1)
NORMAL mode current
ILOAD > Sleep Current
(2)
93
μA
ISLP (1)
SLEEP mode current
ILOAD < Sleep Current
(2)
21
μA
9
μA
0.6
μA
IHIB
(1)
ISD (1)
(1)
(2)
(2)
HIBERNATE mode current
ILOAD < Hibernate Current
SHUTDOWN mode current
Fuel gauge in host commanded
SHUTDOWN mode
(LDO regulator output disabled)
Specified by design. Not production tested.
Wake Comparator Disabled.
7.6 Digital Input and Output DC Characteristics
TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1)
PARAMETER
TEST CONDITIONS
VIH(OD)
Input voltage, high (2)
VIL
Input voltage, low (2)
VOL
Output voltage, low (2)
External pullup resistor to VPU
MIN
TYP
Output source current, high
IOL(OD)
Output sink current, low (2)
CIN (1)
Input capacitance (2)
Ilkg
Input leakage current
(SCL, SDA, BIN)
(2) (3)
(3)
0.6
V
0.6
V
0.5
mA
–3
mA
5
pF
0.1
Input leakage current (GPOUT)
(1)
(2)
(3)
UNIT
V
(3)
IOH
MAX
VPU × 0.7
μA
1
Specified by design. Not production tested.
Open Drain pins: (SCL, SDA, GPOUT)
Push-pull pin: (BIN)
7.7 LDO Regulator, Wake-Up, and Auto-Shutdown DC Characteristics
TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1)
PARAMETER
VBAT
BAT pin regulator input
VDD
Regulator output voltage
UVLOIT+
VBAT undervoltage lockout
LDO wake-up rising threshold
UVLOIT–
VBAT undervoltage lockout
LDO auto-shutdown falling threshold
(1)
TEST CONDITIONS
MIN
TYP
2.45
MAX
UNIT
4.5
V
1.8
V
2
V
1.95
V
Specified by design. Not production tested.
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7.8 ADC (Temperature and Cell Measurement) Characteristics
TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1)
PARAMETER
BAT pin voltage measurement
range.
VIN(BAT)
tADC_CONV
(1)
TEST CONDITIONS
MIN
Voltage divider enabled.
TYP
2.45
MAX
4.5
Conversion time
Effective resolution
UNIT
V
125
ms
15
bits
Specified by design. Not tested in production.
7.9 Integrating ADC (Coulomb Counter) Characteristics
TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VSR
Input voltage range from BAT to
SRX pins
tSR_CONV
Conversion time
Single conversion
1
s
Effective Resolution
Single conversion
16
bits
(1)
BAT ± 25
mV
Assured by design. Not tested in production.
7.10 Integrated Sense Resistor Characteristics, –40°C to 85°C
TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1)
PARAMETER
SRXRES (1)
Resistance of Integrated Sense
Resistor from SRX to BAT
TEST CONDITIONS
MIN
TYP
TA = 30°C
7
Long term RMS, average device
utilization
Recommended Sense Resistor input Peak RMS current, 10% device
current
utilization (3)
ISRX (2)
Peak pulsed current, 250 ms
maximum, 1% device utilization, (3)
(1)
(2)
(3)
MAX
UNIT
mΩ
2000
mA
2500
mA
3500
mA
MAX
UNIT
Firmware compensation applied for temperature coefficient of resistor.
Specified by design. Not tested in production.
Device utilization is the long-term usage profile at a specific condition compared to the average condition.
7.11 Integrated Sense Resistor Characteristics, –40°C to 70°C
TA = –40°C to 70°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1)
PARAMETER
SRXRES
(1)
Resistance of Integrated Sense
Resistor from SRX to BAT
TEST CONDITIONS
MIN
TYP
TA = 30°C
7
Long term RMS, average device
utilization
ISRX (2)
Recommended Sense Resistor input Peak RMS current, 10% device
current
utilization (3)
Peak pulsed current, 250 ms
maximum, 1% device utilization, (3)
(1)
(2)
(3)
mΩ
2000
mA
3500
mA
4500
mA
MAX
UNIT
Firmware compensation applied for temperature coefficient of resistor.
Specified by design. Not tested in production.
Device utilization is the long-term usage profile at a specific condition compared to the average condition.
7.12 I2C-Compatible Interface Communication Timing Characteristics
TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1)
MIN
NOM
STANDARD Mode (100 kHz)
(1)
6
Specified by design. Not production tested.
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I2C-Compatible Interface Communication Timing Characteristics (continued)
TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1)(1)
MIN
NOM
MAX
UNIT
4
μs
4.7
μs
4
μs
4.7
μs
250
ns
td(STA)
Start to first falling edge of SCL
tw(L)
SCL pulse duration (low)
tw(H)
SCL pulse duration (high)
tsu(STA)
Setup for repeated start
tsu(DAT)
Data setup time
Host drives SDA
th(DAT)
Data hold time
Host drives SDA
0
ns
tsu(STOP)
Setup time for stop
4
μs
t(BUF)
Bus free time between stop and start Includes Command Waiting Time
tf
SCL or SDA fall time
tr
SCL or SDA rise time
fSCL
Clock frequency
μs
66
(1)
(1)
(2)
300
ns
300
ns
100
kHz
FAST Mode (400 kHz)
td(STA)
Start to first falling edge of SCL
600
ns
tw(L)
tw(H)
SCL pulse duration (low)
1300
ns
SCL pulse duration (high)
600
ns
tsu(STA)
Setup for repeated start
600
ns
tsu(DAT)
Data setup time
Host drives SDA
100
ns
th(DAT)
Data hold time
Host drives SDA
tsu(STOP)
Setup time for stop
t(BUF)
Bus free time between stop and start Includes Command Waiting Time
tf
SCL or SDA fall time
tr
SCL or SDA rise time
fSCL
Clock frequency (2)
(2)
0
ns
600
ns
66
μs
(1)
300
(1)
ns
300
ns
400
kHz
If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at
400 kHz. (See and )
tSU(STA)
tw(H)
tf
tw(L)
tr
t(BUF)
SCL
SDA
td(STA)
tsu(STOP)
tf
tr
th(DAT)
tsu(DAT)
REPEATED
START
STOP
START
Figure 1. I2C-Compatible Interface Timing Diagrams
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7.13 Typical Characteristics
0.14
10
0.12
5
Temperature Accuracy Error(%)
Voltage Accuracy Error (%)
0.1
0.08
0.06
0
-5
-10
0.04
0.02
-40
-20
0
20
40
Temperature (°C)
60
80
100
-15
-40
-20
Figure 2. Voltage Accuracy
0
20
40
Temperature (°C)
60
80
100
Figure 3. Temperature Accuracy
0
-0.1
Current Accuracy Error (%)
-0.2
-0.3
-0.4
-0.5
-0.6
-40
-20
0
20
40
Temperature (°C)
60
80
100
Figure 4. Current Accuracy
8
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8 Detailed Description
8.1 Overview
The fuel gauge accurately predicts the battery capacity and other operational characteristics of a single Li-based
rechargeable cell. It can be interrogated by a system processor to provide cell information, such as state-ofcharge (SOC).
NOTE
The following formatting conventions are used in this document:
Commands: italics with parentheses() and no breaking spaces, for example, Control()
Data Flash: italics, bold, and breaking spaces, for example, Design Capacity
Register bits and flags: italics with brackets [ ], for example, [TDA]
Data Flash bits: italics, bold, and brackets [ ], for example, [LED1]
Modes and states: ALL CAPITALS, for example, UNSEALED mode
8.2 Functional Block Diagram
I2C
Bus
SRX
SCL
Coulomb
Counter
SDA
Integrated
Sense
Resistor
CPU
GPOUT
BIN
VSYS
BatteryPack
BAT
ADC
VDD
1.8 V
LDO
PACKP
047
. µF
T
Protection
IC
PACKN
NFET NFET
1 µF
VSS
Li-Ion
Cell
8.3 Feature Description
Information is accessed through a series of commands, called Standard Commands. Further capabilities are
provided by the additional Extended Commands set. Both sets of commands, indicated by the general format
Command(), are used to read and write information contained within the control and status registers, as well as
its data locations. Commands are sent from system to gauge using the I2C serial communications engine, and
can be executed during application development, system manufacture, or end-equipment operation.
The key to the high-accuracy gas gauging prediction is Texas Instruments proprietary Impedance Track™
algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-of-charge
predictions that can achieve high-accuracy across a wide variety of operating conditions and over the lifetime of
the battery.
The fuel gauge measures the charging and discharging of the battery by monitoring the voltage across a smallvalue sense resistor. When a cell is attached to the fuel gauge, cell impedance is computed, based on cell
current, cell open-circuit voltage (OCV), and cell voltage under loading conditions.
The fuel gauge uses an integrated temperature sensor for estimating cell temperature. Alternatively, the host
processor can provide temperature data for the fuel gauge.
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Feature Description (continued)
The bq27421-G1 Technical Reference Manual (SLUUAC5) provides more details.
8.4 Device Functional Modes
To minimize power consumption, the fuel gauge has several power modes: INITIALIZATION, NORMAL, SLEEP,
HIBERNATE, and SHUTDOWN. The fuel gauge passes automatically between these modes, depending upon
the occurrence of specific events, though a system processor can initiate some of these modes directly. See the
bq27421-G1 Technical Reference Manual (SLUUAC5) for more details.
8.5 Programming
8.5.1 Standard Data Commands
The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery
information. Each standard command has an associated command-code pair, as indicated in Table 1. Because
each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to
initiate the command function, and to read or write the corresponding two bytes of data. See the bq27421-G1
Technical Reference Manual (SLUUAC5) for more details.
Table 1. Standard Commands
COMMAND
CODE
NAME
UNIT
SEALED ACCESS
Control()
CNTL
0x00 and 0x01
NA
RW
Temperature()
TEMP
0x02 and 0x03
0.1°K
RW
Voltage()
VOLT
0x04 and 0x05
mV
R
FLAGS
0x06 and 0x07
NA
R
NominalAvailableCapacity()
0x08 and 0x09
mAh
R
FullAvailableCapacity()
0x0A and 0x0B
mAh
R
Flags()
RemainingCapacity()
RM
0x0C and 0x0D
mAh
R
FullChargeCapacity()
FCC
0x0E and 0x0F
mAh
R
AverageCurrent()
0x10 and 0x11
mA
R
StandbyCurrent()
0x12 and 0x13
mA
R
MaxLoadCurrent()
0x14 and 0x15
mA
R
AveragePower()
0x18 and 0x19
mW
R
0x1C and 0x1D
%
R
0x1E and 0x1F
0.1°K
R
StateOfCharge()
SOC
InternalTemperature()
StateOfHealth()
0x20 and 0x21
num/%
R
RemainingCapacityUnfiltered()
0x28 and 0x29
mAh
R
RemainingCapacityFiltered()
0x2A and 0x2B
mAh
R
FullChargeCapacityUnfiltered()
0x2C and 0x2D
mAh
R
FullChargeCapacityFiltered()
0x2E and 0x2F
mAh
R
StateOfChargeUnfiltered()
0x30 and 0x31
%
R
10
SOH
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8.5.2 Control(): 0x00 and 0x01
Issuing a Control() command requires a subsequent 2-byte subcommand. These additional bytes specify the
particular control function desired. The Control() command allows the system to control specific features of the
fuel gauge during normal operation and additional features when the device is in different access modes, as
described in Table 2. See the bq27421-G1 Technical Reference Manual (SLUUAC5) for more details.
Table 2. Control() Subcommands
CNTL DATA
SEALED
ACCESS
CONTROL_STATUS
0x0000
Yes
Reports the status of device
DEVICE_TYPE
0x0001
Yes
Reports the device type (0x0421)
FW_VERSION
0x0002
Yes
Reports the firmware version of the device
DM_CODE
0x0004
Yes
Reports the Data Memory Code number stored in NVM
PREV_MACWRITE
0x0007
Yes
Returns previous MAC command code
CHEM_ID
0x0008
Yes
Reports the chemical identifier of the battery profile used by the fuel gauge
BAT_INSERT
0x000C
Yes
Forces the Flags() [BAT_DET] bit set when the OpConfig [BIE] bit is 0
BAT_REMOVE
0x000D
Yes
Forces the Flags() [BAT_DET] bit clear when the OpConfig [BIE] bit is 0
SET_HIBERNATE
0x0011
Yes
Forces CONTROL_STATUS [HIBERNATE] to 1
CLEAR_HIBERNATE
0x0012
Yes
Forces CONTROL_STATUS [HIBERNATE] to 0
SET_CFGUPDATE
0x0013
No
Force CONTROL_STATUS [CFGUPMODE] to 1 and gauge enters
CONFIG UPDATE mode
SHUTDOWN_ENABLE
0x001B
No
Enables device SHUTDOWN mode
SHUTDOWN
0x001C
No
Commands the device to enter SHUTDOWN mode
SEALED
0x0020
No
Places the device in SEALED ACCESS mode
TOGGLE_GPOUT
0x0023
Yes
Commands the device to toggle the GPOUT pin for 1 ms
RESET
0x0041
No
Performs a full device reset
SOFT_RESET
0x0042
No
Gauge exits CONFIG UPDATE mode
EXIT_CFGUPDATE
0x0043
No
Exits CONFIG UPDATE mode without an OCV measurement and without
resimulating to update StateOfCharge()
EXIT_RESIM
0x0044
No
Exits CONFIG UPDATE mode without an OCV measurement and
resimulates with the updated configuration data to update StateOfCharge()
CNTL FUNCTION
DESCRIPTION
8.5.3 Extended Data Commands
Extended data commands offer additional functionality beyond the standard set of commands. They are used in
the same manner; however, unlike standard commands, extended commands are not limited to 2-byte words.
The number of command bytes for a given extended command ranges in size from single to multiple bytes, as
specified in Table 3.
Table 3. Extended Commands
Name
Command Code
Unit
SEALED
Access (1) (2)
UNSEALED
Access (1) (2)
R
OpConfig()
0x3A and 0x3B
NA
R
DesignCapacity()
0x3C and 0x3D
mAh
R
R
0x3E
NA
NA
RW
DataClass()
(2)
DataBlock()
(2)
0x3F
NA
RW
RW
0x40 through 0x5F
NA
R
RW
BlockDataCheckSum()
0x60
NA
RW
RW
BlockDataControl()
0x61
NA
NA
RW
0x62 through 0x7F
NA
R
R
BlockData()
Reserved
(1)
(2)
SEALED and UNSEALED states are entered via commands to Control() 0x00 and 0x01
In SEALED mode, data cannot be accessed through commands 0x3E and 0x3F.
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8.5.4 Communications
8.5.4.1 I2C Interface
The fuel gauge supports the standard I2C read, incremental read, quick read, one-byte write, and incremental
write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as
1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively.
Host generated
S
ADDR[6:0]
0 A
Gauge generated
CMD [7:0]
A
DATA [7:0]
A P
S
ADDR[6:0]
(a) 1-byte write
S
ADDR[6:0]
0 A
1 A
DATA [7:0]
N P
(b) quick read
CMD [7:0]
A Sr
ADDR[6:0]
1 A
DATA [7:0]
N P
(c) 1- byte read
S
ADDR[6:0]
0 A
CMD [7:0]
A Sr
ADDR[6:0]
1 A
DATA [7:0]
A ...
DATA [7:0]
N P
(d) incremental read
S
ADDR[6:0]
0 A
CMD[7:0]
A
DATA [7:0]
A
DATA [7:0]
A
...
A P
(e) incremental write
(S = Start , Sr = Repeated Start , A = Acknowledge , N = No Acknowledge , and P = Stop).
Figure 5. I2C Format
The quick read returns data at the address indicated by the address pointer. The address pointer, a register
internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the
I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to
consecutive command locations (such as two-byte commands that require two bytes of data).
The following command sequences are not supported:
Figure 6. Attempt To Write a Read-only Address (Nack After Data Sent By Master)
Figure 7. Attempt To Read an Address Above 0x6B (Nack Command)
8.5.4.2 I2C Time Out
The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the fuel gauge is holding
the lines, releasing them frees them for the master to drive the lines.
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8.5.4.3 I2C Command Waiting Time
To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus-free waiting time must be inserted between all
packets addressed to the fuel gauge. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1byte write commands for proper data flow control. The following diagram shows the standard waiting time
required between issuing the control subcommand the reading the status result. For read-write standard
command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands,
there is no waiting time required, but the host must not issue any standard command more than two times per
second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer.
S
ADDR [6:0]
0 A
CMD [7:0]
A
DATA [7:0]
A P
66ms
S
ADDR [6:0]
0 A
CMD [7:0]
A
DATA [7:0]
A P
66ms
S
ADDR [6:0]
0 A
CMD [7:0]
A Sr
ADDR [6:0]
1 A
DATA [7:0]
A
DATA [7:0]
N P
66ms
N P
66ms
Waiting time inserted between two 1-byte write packets for a subcommand and reading results
(required for 100 kHz < fSCL £ 400 kHz)
S
ADDR [6:0]
0 A
CMD [7:0]
A
DATA [7:0]
S
ADDR [6:0]
0 A
CMD [7:0]
A Sr
ADDR [6:0]
A
1 A
DATA [7:0]
A P
DATA [7:0]
A
66ms
DATA [7:0]
Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results
(acceptable for fSCL £ 100 kHz)
S
ADDR [6:0]
DATA [7:0]
0 A
A
CMD [7:0]
DATA [7:0]
A Sr
N P
ADDR [6:0]
1 A
DATA [7:0]
A
DATA [7:0]
A
66ms
Waiting time inserted after incremental read
Figure 8. I2C Command Wait Time
8.5.4.4 I2C Clock Stretching
A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short ≤
100-µs clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other
modes (INITIALIZATION, NORMAL) a ≤ 4-ms clock stretching period may occur within packets addressed for the
fuel gauge as the I2C interface performs normal data flow control.
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9 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The Texas Instruments bq27421-G1 fuel gauge is a microcontroller peripheral that provides system-side fuel
gauging for single-cell Li-Ion batteries. The device requires minimal user configuration and system
microcontroller firmware. Battery fuel gauging with the bq27421-G1 fuel gauge requires connections only to
PACK+ (P+) and PACK– for a removable battery pack or embedded battery circuit.
NOTE
To allow for optimal performance in the end application, special considerations must be
taken to ensure minimization of measurement error through proper printed circuit board
(PCB) board layout. These requirements are detailed in Design Requirements.
14
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9.2 Typical Applications
Figure 9. Application Schematic
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Typical Applications (continued)
9.2.1 Design Requirements
As shipped from the Texas Instruments factory, many bq27421-G1 parameters in OTP NVM are left in the
unprogrammed state (zero) while some parameters directly associated with the CHEMID are preprogrammed.
This partially programmed configuration facilitates customization for each end application. Upon device reset, the
contents of OTP are copied to associated volatile RAM-based Data Memory blocks. For proper operation, all
parameters in RAM-based Data Memory require initialization — either by updating Data Memory parameters in a
lab/evaluation situation or by programming the OTP for customer production. The bq27421-G1 Technical
Reference Manual (SLUUAC5) shows the default value that is present.
9.2.2 Detailed Design Procedure
9.2.2.1 BAT Voltage Sense Input
A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing
its influence on battery voltage measurements. It proves most effective in applications with load profiles that
exhibit high-frequency current pulses (that is, cell phones) but is recommended for use in all applications to
reduce noise on this sensitive high-impedance measurement node.
9.2.2.2 Integrated LDO Capacitor
The fuel gauge has an integrated LDO with an output on the VDD pin of approximately 1.8 V. A capacitor of
value at least 0.47 μF should be connected between the VDD pin and VSS. The capacitor should be placed
close to the gauge IC and have short traces to both the VDD pin and VSS. This regulator should not be used to
provide power for other devices in the system.
9.2.2.3 Sense Resistor Selection
Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect
the resulting differential voltage, and derived current, it senses. As such, it is recommended to select a sense
resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard
recommendation based on best compromise between performance and price is a 1% tolerance, 50 ppm drift
sense resistor with a 1-W power rating.
16
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Typical Applications (continued)
9.2.3 Application Curves
0.14
10
0.12
5
Temperature Accuracy Error(%)
Voltage Accuracy Error (%)
0.1
0.08
0.06
0
-5
-10
0.04
0.02
-40
-20
0
20
40
Temperature (°C)
60
80
100
-15
-40
-20
Figure 10. Voltage Accuracy
0
20
40
Temperature (°C)
60
80
100
Figure 11. Temperature Accuracy
0
-0.1
Current Accuracy Error (%)
-0.2
-0.3
-0.4
-0.5
-0.6
-40
-20
0
20
40
Temperature (°C)
60
80
100
Figure 12. Current Accuracy
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10 Power Supply Recommendation
10.1 Power Supply Decoupling
The battery connection on the BAT pin is used for two purposes:
• To supply power to the fuel gauge
• As an input for voltage measurement of the battery
A capacitor of value of at least 1 µF should be connected between BAT and VSS. The capacitor should be placed
close to the gauge IC and have short traces to both the BAT pin and VSS.
The fuel gauge has an integrated LDO with an output on the VDD pin of approximately 1.8 V. A capacitor of value
at least 0.47 μF should be connected between the VDD pin and VSS. The capacitor should be placed close to the
gauge IC and have short traces to both the VDD pin and VSS.
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11 Layout
11.1 Layout Guidelines
•
•
•
•
A capacitor, of value at least 0.47 µF, is connected between the VDD pin and VSS. The capacitor should be
placed close to the gauge IC and have short traces to both the VDD pin and VSS.
It is required to have a capacitor, at least 1.0 µF, connected between the BAT pin and VSS if the connection
between the battery pack and the gauge BAT pin has the potential to pick up noise. The capacitor should be
placed close to the gauge IC and have short traces to both the VDD pin and VSS.
If the external pullup resistors on the SCL and SDA lines will be disconnected from the host during low-power
operation, it is recommended to use external 1-MΩ pulldown resistors to VSS to avoid floating inputs to the I2C
engine.
The value of the SCL and SDA pullup resistors should take into consideration the pullup voltage and the bus
capacitance. Some recommended values, assuming a bus capacitance of 10 pF, can be seen in Table 4.
Table 4. Recommended Values for SCL and SDA Pullup Resistors
VPU
RPU
•
•
•
•
1.8 V
3.3 V
Range
Typical
Range
Typical
400 Ω ≤ RPU ≤ 37.6 kΩ
10 kΩ
900 Ω ≤ RPU ≤ 29.2 kΩ
5.1 kΩ
If the GPOUT pin is not used by the host, the pin should still be pulled up to VDD with a 4.7-kΩ or 10-kΩ
resistor.
If the battery pack thermistor is not connected to the BIN pin, the BIN pin should be pulled down to VSS with a
10-kΩ resistor.
The BIN pin should not be shorted directly to VDD or VSS.
The actual device ground is the center pin (B2). The C1 pin is floating internally and can be used as a bridge
to connect the board ground plane to the device ground (B2).
11.2 Layout Example
Figure 13. bq27421-G1 Board Layout Example
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
• bq27421-G1 Technical Reference Manual (SLUUAC5)
• bq27421 EVM: Single-Cell Technology User's Guide (SLUUA63)
• Quickstart Guide for bq27421-G1 (SLUUAH7)
• Single Cell Gas Gauge Circuit Design (SLUA456)
• Key Design Considerations for the bq27500 and bq27501 (SLUA439)
• Single Cell Impedance Track Printed-Circuit Board Layout Guide (SLUA457)
• ESD and RF Mitigation in Handheld Battery Electronics (SLUA460)
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
Impedance Track, NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
20
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PACKAGE OUTLINE
YZF0009-C01
DSBGA - 0.625 mm max height
SCALE 9.000
DIE SIZE BALL GRID ARRAY
1.65
1.59
B
A
BALL A1
CORNER
1.61
1.55
C
0.625 MAX
SEATING PLANE
0.35
0.15
0.05 C
BALL TYP
1 TYP
0.5 TYP
C
SYMM
B
0.5
TYP
1
TYP
A
0.35
0.25
C A
B
9X
0.015
1
2
3
SYMM
4222180/A 07/2015
NanoFree Is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
TM
3. NanoFree package configuration.
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EXAMPLE BOARD LAYOUT
YZF0009-C01
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
9X (
0.245)
2
1
3
A
(0.5) TYP
SYMM
B
C
SYMM
LAND PATTERN EXAMPLE
SCALE:30X
0.05 MAX
( 0.245)
METAL
METAL UNDER
SOLDER MASK
0.05 MIN
( 0.245)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4222180/A 07/2015
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
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EXAMPLE STENCIL DESIGN
YZF0009-C01
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
(R0.05) TYP
9X ( 0.25)
1
3
2
A
(0.5)
TYP
SYMM
B
METAL
TYP
C
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4222180/A 07/2015
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
BQ27421YZFR-G1A
ACTIVE
DSBGA
YZF
9
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1A
BQ27421YZFR-G1B
ACTIVE
DSBGA
YZF
9
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1B
BQ27421YZFR-G1D
ACTIVE
DSBGA
YZF
9
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1D
BQ27421YZFT-G1A
ACTIVE
DSBGA
YZF
9
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1A
BQ27421YZFT-G1B
ACTIVE
DSBGA
YZF
9
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1B
BQ27421YZFT-G1D
ACTIVE
DSBGA
YZF
9
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27421
G1D
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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