BQ27Z561YPHR-R1

Product Folder Order Now Support & Community Tools & Software Technical Documents BQ27Z561-R1 SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 BQ27Z561-R1 Impedance Track™ Battery Gas Gauge Solution for 1-Series Cell Li-ion Battery Packs 1 Features 2 Applications • • • • • • 1 • • • • • • • • • • • • • • Supports current sense resistors down to 1 mΩ Supports pack-side gauging including enhanced state of health (SOH) algorithm Fast QMAX update option based on predicted OCV SHA-256 authentication responder for increased battery pack security Sophisticated charge algorithms: – JEITA – Enhanced charging – RSOC() charging compensation option Two independent ADCs – Support for simultaneous current and voltage sampling – High-accuracy coulomb counter with input offset error < 1 µV (typical) Low-voltage (2-V) operation Wide-range current applications (1 mA to > 5 A) Active high or low pulse or level interrupt pin Supports battery trip point (BTP) Reduced power modes (typical battery pack operating range conditions) – Typical SLEEP mode: < 11 μA – Typical DEEP SLEEP mode: < 9 μA – Typical OFF mode: < 1.9 μA Internal and external temperature sense functions Diagnostic lifetime data monitor and black box recorder 400-kHz I2C bus communications interface for high-speed programming and data access HDQ one-wire for communication with host Compact 12-pin DSBGA package (YPH) Smartphones Digital still and video cameras Tablet computing Portable and wearable health devices and portable audio devices 3 Description The Texas Instruments BQ27Z561-R1 Impedance Track™ gas gauge solution is a highly integrated, accurate 1-series cell gas gauge with a flash programmable custom reduced instruction-set CPU (RISC) and SHA-256 authentication for Li-Ion and LiPolymer battery packs. The 1-series cell capability includes parallel cells for increased capacity. The BQ27Z561-R1 gas gauge communicates via I2Ccompatible and HDQ one-wire interfaces and includes several key features that can help facilitate accurate gas gauging applications. Integrated temperature sense functions (internal and external options) enable system and battery temperature measurements. Device Information(1) PART NUMBER BQ27Z561-R1 PACKAGE BODY SIZE (NOM) DSBGA (12) 1.67 mm × 2.05 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic PACK+ Protector IC CE SDA/HDQ SCL BAT_SNS INT BAT + PULS TS VSS SRN SRP PACK- 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. BQ27Z561-R1 SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Description (cont.) ................................................. Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 4 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 7.15 7.16 7.17 4 4 4 4 5 5 5 5 5 5 6 6 6 7 7 7 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Supply Current .......................................................... Internal 1.8-V LDO (REG18)..................................... I/O (CE, PULS, INT).................................................. Internal Temperature Sensor .................................... NTC Thermistor Measurement Support.................... Coulomb Counter (CC) ........................................... Analog Digital Converter (ADC) .............................. Internal Oscillator Specifications ............................. Voltage Reference1 (REF1).................................... Voltage Reference2 (REF2).................................... Flash Memory ......................................................... I2C I/O ..................................................................... I2C Timing — 100 kHz ............................................ 7.18 I2C Timing — 400 kHz ............................................ 7 7.19 HDQ Timing ............................................................ 8 7.20 Typical Characteristics .......................................... 10 8 Detailed Description ............................................ 10 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 10 11 11 13 Applications and Implementation ...................... 14 9.1 Application Information............................................ 15 9.2 Typical Applications ............................................... 15 10 Power Supply Requirements ............................. 17 11 Layout................................................................... 17 11.1 Layout Guidelines ................................................. 17 11.2 Layout Example .................................................... 18 12 Device and Documentation Support ................. 19 12.1 12.2 12.3 12.4 12.5 12.6 Documentation Support ........................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 19 19 19 19 19 19 13 Mechanical, Packaging, Orderable Information ........................................................... 19 4 Revision History Changes from Original (March 2019) to Revision A • 2 Page Changed body size in Device Information ............................................................................................................................. 1 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 BQ27Z561-R1 www.ti.com SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 5 Description (cont.) The integrated SHA-256 functionality helps enable secure identification between systems and packs. The interrupt and BTP functions facilitate the BQ27Z561-R1 device to inform the system when a specific state-ofcharge (SOC), voltage, or temperature condition occurs. The low-voltage operation enables the system to continue monitoring the battery even in deeply discharged conditions. During low-activity situations, the device can be set to the low power coulomb counting (CC) mode, which enables the device to continue its coulomb counting while reducing operating current significantly. 6 Pin Configuration and Functions 1 2 3 D SRP BAT CE C SRN BAT_SNS NU B TS VSS SCL A INT PULS SDA/HDQ Not to scale Pin Functions NUMBER (1) NAME I/O P (1) DESCRIPTION Battery voltage measurement input. Kelvin battery sense connection to BAT_SNS. Connect a capacitor (1 µF) between BAT and VSS. Place the capacitor close to the gauge. D2 BAT D3 CE C2 BAT_SNS AI Battery sense A1 INT O Interrupt for voltage, temperature, and state of charge (programmable active high or low) A2 PULS O Programmable pulse width with active high or low option B1 TS AI Temperature input for ADC C3 NU NU Makes no external connection B3 SCL I/O Serial clock for I2C interface; requires external pull up when used. It can be left floating if unused. A3 SDA/HDQ I/O Serial data for I2C interface and one-wire interface for HDQ (selectable); requires external pull up when used. It can be left floating if unused. D1 SRP I Analog input pin connected to the internal coulomb counter peripheral for integrating a small voltage between SRP (positive side) and SRN C1 SRN I Analog input pin connected to the internal coulomb counter peripheral for integrating a small voltage between SRP (positive side) and SRN. B2 VSS P Device ground I Active high chip enable P = Power Connection, O = Digital Output, AI = Analog Input, I = Digital Input, I/O = Digital Input/Output, NU = Not Used Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 3 BQ27Z561-R1 SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) Input Voltage MIN MAX UNIT BAT –0.3 6 V INT, PULS, CE –0.3 6 V SRP, SRN, BAT_SNS –0.3 VBAT + 0.3 V TS –0.3 2.1 V SCL, SDA/HDQ –0.3 6 V Operating ambient temperature, TA –40 85 °C Operating junction temperature, TJ –40 125 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM) on all pins, per ANSI/ESDA/JEDEC JS-001 (1) ±1500 Charged-device model (CDM) on all pins, per JEDEC specification JESD22-C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM enables safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM enables safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ MIN VBAT Supply voltage CBAT External capacitor from BAT to VSS No operating restrictions 1 VTS Temperature sense NOM 2.0 MAX 5.5 UNIT V µF 0 1.8 V VPULS, Input and output pins VINT, VCE 0 VBAT V VSCL, Communication pins VSDA/HDQ 0 VBAT V 7.4 Thermal Information Over-operating free-air temperature range (unless otherwise noted) BQ27Z561-R1 THERMAL METRIC (1) DSBGA (YPH) UNIT (12 PINS) RθJA Junction-to-ambient thermal resistance 64.1 RθJC(top) Junction-to-case (top) thermal resistance 59.8 RθJB Junction-to-board thermal resistance 52.7 ψJT Junction-to-top characterization parameter 0.3 ψJB Junction-to-board characterization parameter 28.3 RθJC(bot) Junction-to-case (bottom) thermal resistance 2.4 (1) 4 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 BQ27Z561-R1 www.ti.com SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 7.5 Supply Current Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INORMAL Standard operating Conditions 60 µA ISLEEP Sense resistor current below SLEEP mode threshold 11 µA IDEEPSLEEP Sense resistor current below DEEP SLEEP mode threshold 9 µA IOFF CE = VIL 0.5 µA 7.6 Internal 1.8-V LDO (REG18) Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER VREG18 Regulator output voltage VPORth POR threshold VPORhy POR hysteresis TEST CONDITIONS Rising Threshold MIN TYP MAX 1.6 1.8 2.0 V 1.7 V 1.45 UNIT 0.1 V 7.7 I/O (CE, PULS, INT) Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER TEST CONDITIONS VIH High-level input voltage VREG18 = 1.8 V VIL Low-level input voltage low VREG18 = 1.8 V VOL Output voltage low for INT/PULS VREG18 = 1.8 V, IOL = 1 mA CI Input capacitance Ilkg Input leakage current MIN TYP MAX UNIT 1.15 V 0.50 V 0.4 V 1 µA 5 pF 7.8 Internal Temperature Sensor Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER V(TEMP) Internal Temperature sensor voltage drift MIN TYP MAX VTEMPP TEST CONDITIONS 1.65 1.73 1.8 VTEMPP – VTEMPN (assured by design) 0.17 0.18 0.19 UNIT mV/°C 7.9 NTC Thermistor Measurement Support Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ MIN TYP MAX UNIT RNTRC(PU) PARAMETER Internal pullup resistance TEST CONDITIONS 14.4 18 21.6 kΩ RNTC(DRIFT) Resistance drift over temperature –250 –120 0 MIN TYP MAX PPM/°C 7.10 Coulomb Counter (CC) Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER TEST CONDITIONS V(CC_IN) Input voltage range –0.1 t(CC_CONV) Conversion time Single conversion Effective Resolution 1 LSB Integral nonlinearity 16-bit, Best fit over input voltage range Differential nonlinearity 16-bit, No missing codes Offset error 16- bit Post-Calibration Offset error drift 15-bit + sign, Post Calibration Gain Error 15-bit + sign, Over input voltage range –22.3 –492 V 1000 ms 3.8 µV 5.2 +22.3 1.5 –2.6 UNIT 0.1 LSB LSB 1.3 +2.6 LSB 0.04 0.07 LSB/°C 131 +492 LSB Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 5 BQ27Z561-R1 SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 www.ti.com Coulomb Counter (CC) (continued) Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER Gain Error drift TEST CONDITIONS MIN 15-bit + sign, Over input voltage range Effective input resistance TYP MAX 4.3 9.8 7 UNIT LSB/°C MΩ 7.11 Analog Digital Converter (ADC) Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER VADC_TS_GPIO Input voltage range VBAT_MODE Battery Input Voltage TEST CONDITIONS UNIT V VFS = VREG18 * 2 –0.2 1.44 V 16-bit, Best fit, –0.1 V to 0.8 * VREF2 Differential nonlinearity 16-bit, No missing codes 16-bit Post-Calibration VREF2 (1) Offset error drift 16-bit Post-Calibration VREF2 (1) Gain Error 16-bit, –0.1 to 0.8 * VFS Gain Error drift 16-bit, –0.1 to 0.8 * VFS , VFS = –0.2 5.5 V –8.4 +8.4 LSB 1.5 –4.2 , VFS = –492 LSB 1.8 +4.2 LSB 0.02 0.1 LSB/°C 131 +492 2 4.5 8 Conversion time Effective resolution (1) MAX 1.0 Effective input resistance t(ADC_CONV) TYP –0.2 Integral nonlinearity Offset error MIN VFS = VREF2 LSB LSB/°C MΩ 11.7 ms 14 15 bits MIN TYP Factory calibration. 7.12 Internal Oscillator Specifications Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER TEST CONDITIONS MAX UNIT High Frequency Oscillator (HFO) fHFO Operating frequency fHFO HFO frequency drift tHFOSTART HFO start-up time 16.78 MHz TA = –20°C to 70°C –2.5% 2.5% TA = –40°C to 85°C –3.5 3.5 TA = –40°C to 85°C, oscillator frequency within +/– 3% of nominal frequency or a power-on reset 4 ms Low Frequency Oscillator (LFO) fLFO Operating frequency fLFO(ERR) Frequency error 65.536 TA = –40°C to 85°C –2.5% kHz +2.5% 7.13 Voltage Reference1 (REF1) Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER VREF1 Internal reference voltage (1) VREF1_DRIFT Internal reference voltage drift (1) 6 TEST CONDITIONS TA = –40 °C to 85°C MIN TYP MAX UNIT 1.195 1.21 1.227 V –80 +80 PPM/C Used for CC and LDO Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 BQ27Z561-R1 www.ti.com SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 7.14 Voltage Reference2 (REF2) Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER TEST CONDITIONS (1) VREF2 Internal reference voltage VREF2_DRIFT Internal reference voltage drift (1) TA = –40 °C to 85°C MIN TYP MAX 1.2 1.21 1.22 –20 20 UNIT V PPM/°C Used for ADC 7.15 Flash Memory Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER TEST CONDITIONS MIN Data retention Flash programming write cycles t(ROWPROG) Row programming time t(MASSERASE) Mass-erase time t(PAGEERASE) TYP 10 Data Flash MAX UNIT 100 Years 20000 Instruction Flash Cycles 1000 Cycles 40 µs TA = –40°C to 85°C 40 ms Page-erase time TA = –40°C to 85°C 40 ms IFLASHREAD Flash read current TA = –40°C to 85°C 1 mA IFLASHWRTIE Flash write current TA = –40°C to 85°C 5 mA IFLASHERASE Flash erase current TA = –40°C to 85°C 15 mA 7.16 I2C I/O Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃ PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIH High-level input voltage SCL, SDA/HDQ, VREG18 = 1.8 V 1.26 V VIL Low-level input voltage low VREG18 = 1.8 V 0.54 VOL Low-level output voltage IOL = 1 mA, VREG18 = 1.8 V 0.36 V CI Input capacitance 10 pF Ilkg Input leakage current V 1 µA 7.17 I2C Timing — 100 kHz PARAMETER TEST CONDITIONS MIN NOM MAX SCL duty cycle = 50% UNIT fSCL Clock operating frequency tHD:STA Start condition hold time 4.0 100 kHz µs tLOW Low period of the SCL Clock 4.7 µs tHIGH High period of the SCL Clock 4.0 µs tSU:STA Setup repeated START 4.7 µs tHD:DAT Data hold time (SDA input) 0 ns tSU:DAT Data setup time (SDA input) tr Clock rise time 10% to 90% 1000 ns tf Clock fall time 90% to 10% 300 ns tSU:STO Setup time STOP condition 4.0 µs tBUF Bus free time STOP to START 4.7 µs 250 ns 7.18 I2C Timing — 400 kHz PARAMETER TEST CONDITIONS MIN NOM SCL duty cycle = 50% MAX UNIT fSCL Clock operating frequency 400 tHD:STA START condition hold time 0.6 µs tLOW Low period of the SCL Clock 1.3 µs Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 kHz 7 BQ27Z561-R1 SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 www.ti.com I2C Timing — 400 kHz (continued) PARAMETER TEST CONDITIONS MIN NOM MAX UNIT tHIGH High period of the SCL Clock 600 ns tSU:STA Setup repeated START 600 ns tHD:DAT Data hold time (SDA input) 0 ns tSU:DAT Data setup time (SDA input) tr Clock rise time 10% to 90% tf Clock fall time 90% to 10% tSU:STO Setup time STOP condition 0.6 µs tBUF Bus free time STOP to START 1.3 µs 100 ns 300 300 ns ns 7.19 HDQ Timing PARAMETER TEST CONDITIONS MIN NOM tB Break time tBR Break recovery time tHW1 Host write 1 time Host drives HDQ tHW0 Host write 0 time Host drives HDQ tCYCH Cycle time, host to device Device drives HDQ 190 tCYCD Cycle time, device to Host Device drives HDQ 190 tDW1 Device write 1 time Device drives HDQ tDW0 Device write 0 time Device drives HDQ tRSPS Device response time tTRND Host turn around time tRISE HDQ line rising time to logic 1 tRST HDQ Reset MAX UNIT 190 µs 40 µs 0.5 50 µs 86 145 µs µs 205 250 µs 32 50 µs 80 145 µs Device drives HDQ 190 950 µs Host drives HDQ after device drives HDQ 250 µs 1.8 Host drives HDQ low before device reset 2.2 µs s SDA tLOW tf tHD;STA tr tf tr tBUF tSP SCL tSU;STA tHD;STA tHIGH tHD;DAT START tSU;STO tSU;DAT REPEATED START STOP START Figure 1. I2C Timing 8 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 BQ27Z561-R1 www.ti.com SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 1.2V t( R IS E ) t(BR ) t( B ) (b) H D Q line ris e tim e (a) B reak and B reak R ec ov ery t( D W 1 ) t(H W 1) t(D W 0) t(C YC D ) t(H W 0) t( C Y C H ) (d) G auge T rans m itted B it (c ) H os t T rans m itted B it B reak 1 - b it 7-bit addres s R /W 8-bit data t( R S P S ) (e) G auge to Hos t Res pons e t(R ST ) (f) H D Q R es et a. b. c. d. e. f. H D Q B r e a k in g R is e tim e o f H D Q lin e H D Q H o s t to fu e l g a u g e c o m m u n ic a tio n F u e l g a u g e to H o s t c o m m u n ic a tio n F u e l g a u g e to H o s t r e s p o n s e fo r m a t H D Q H o s t to fu e l g a u g e Figure 2. HDQ Timing Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 9 BQ27Z561-R1 SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 www.ti.com 7.20 Typical Characteristics 1.8 1.21 Min Nom Max 1.795 1.206 LDO (V) VREF1 (v) 1.208 1.204 1.79 1.785 1.202 1.2 -60 Min Nom Max -40 BAT Min = 2 V -20 0 20 40 Temperature (qC) 60 80 1.78 -60 100 BAT Nom = 3.6 V BAT Max = 5 V Figure 3. REF1 Voltage Versus Battery and Temperature BAT Min = 2 V 60 80 100 D002 BAT Nom = 3.6 V BAT Max = 5 V ADVC Offset (PV) 15 65.6 LFO (kHz) 0 20 40 Temperature (qC) 20 Min Nom Max 65.8 65.4 65.2 10 5 0 Min Nom Max -5 65 BAT Min = 2 V -20 Figure 4. LDO Voltage Versus Battery and Temperature 66 64.8 -60 -40 D001 -40 -20 0 20 40 Temperature (qC) 60 BAT Nom = 3.6 V 80 100 -10 -60 -40 D003 BAT Max = 5 V Figure 5. LFO Frequency Versus Battery and Temperature BAT Min = 2 V -20 0 20 40 Temperature (qC) 60 BAT Nom = 3.6 V 80 100 D004 BAT Max = 5 V Figure 6. ADVC Offset Voltage Versus Battery and Temperature 8 Detailed Description 8.1 Overview The BQ27Z561-R1 gas gauge is a fully integrated battery manager that employs flash-based firmware to provide a complete solution for battery-stack architectures composed of 1-series cells. The BQ27Z561-R1 device interfaces with a host system via an I2C or HDQ protocol. High-performance, integrated analog peripherals enable support for a sense resistor down to 1 mΩ, and simultaneous current/voltage data conversion for instant power calculations. The following sections detail all of the major component blocks included as part of the BQ27Z561-R1 device. 10 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 BQ27Z561-R1 www.ti.com SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 8.2 Functional Block Diagram BAT_SNS VSS TS BAT GPIO Internal Temp Sensor REG18 CE REF1 SRP SRN CC ADC MUX ADC REF2 HFO LFO INT PULS CC /ADC Digital Filter Test Interface ROM 12kBytes Timers COM Engine SDA/HDQ SCL Data (8bit) bqBMP CPU PMInstr (8 bit) IO and Interrupt Controller DMAddr (16bit) PMAddr (16 bit) Program Flash 32-kBytes Data Flash 4-kBytes Data SRAM 2-kBytes Copyright © 2017, Texas Instruments Incorporated 8.3 Feature Description 8.3.1 BQ27Z561-R1 Processor The BQ27Z561-R1 device uses a custom TI-proprietary processor design that features a Harvard architecture and operates at frequencies up to 4.2 MHz. Using an adaptive, three-stage instruction pipeline, the BQ27Z561R1 processor supports variable instruction lengths of 8, 16, or 24 bits. 8.3.2 Battery Parameter Measurements The BQ27Z561-R1 device measures cell voltage and current simultaneously, and also measures temperature to calculate the information related to remaining capacity, full charge capacity, state-of-health, and other gauging parameters. 8.3.2.1 Coulomb Counter (CC) The first ADC is an integrating analog-to-digital converter designed specifically for tracking charge and discharge activity, or coulomb counting, of a rechargeable battery. It features a single-channel differential input that converts the voltage difference across a sense resistor between the SRP and SRN terminals with a resolution of 3.74 µV. Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 11 BQ27Z561-R1 SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 www.ti.com Feature Description (continued) 8.3.2.2 CC Digital Filter The CC digital filter generates a 16-bit conversion value from the delta-sigma CC front-end. Its FIR filter uses the HFO clock output. New conversions are available every 1 s. 8.3.2.3 ADC Multiplexer The ADC multiplexer provides selectable connections to the external pins BAT, BAT_SNS, TS, the internal temperature sensor, internal reference voltages, internal 1.8-V regulator, and VSS ground reference input. In addition, the multiplexer can independently enable the TS input connection to the internal thermistor biasing circuitry, and enables the user to short the multiplexer inputs for test and calibration purposes. 8.3.2.4 Analog-to-Digital Converter (ADC) The second ADC is a 16-bit delta-sigma converter designed for general-purpose measurements. The ADC automatically scales the input voltage range during sampling based on channel selection. The converter resolution is a function of its full-scale range and number of bits, yielding a 38-µV resolution. 8.3.2.5 Internal Temperature Sensor An internal temperature sensor is available on the BQ27Z561-R1 device to reduce the cost, power, and size of the external components necessary to measure temperature. It is available for connection to the ADC using the multiplexer, and is ideal for quickly determining pack temperature under a variety of operating conditions. 8.3.2.6 External Temperature Sensor Support The TS input is enabled with an internal 18-kΩ (Typ.) linearization pull-up resistor to support the use of a 10-kΩ (25°C) NTC external thermistor, such as the Semitec 103AT-2. The NTC thermistor should be connected between VSS and the individual TS pin. The analog measurement is then taken via the ADC through its input multiplexer. If a different thermistor type is required, then changes to configurations may be required. REG18 TS ADC NTC Figure 7. External Thermistor Biasing 8.3.3 Power Supply Control The BQ27Z561-R1 device uses the BAT pin as its power source. BAT powers the internal voltage sources that supply references for the device. BAT_SNS is a non-current carrying path and used at the Kelvin reference for BAT. 12 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 BQ27Z561-R1 www.ti.com SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 Feature Description (continued) 8.3.4 Bus Communication Interface The BQ27Z561-R1 device has an I2C bus communication interface. Alternatively, the BQ27Z561-R1 can be configured to communicate through the HDQ pin (shared with SDA). NOTE Once the device is switched to the HDQ protocol, it is not reversible. 8.3.5 Low Frequency Oscillator The BQ27Z561-R1 device includes a low frequency oscillator (LFO) running at 65.536 kHz. 8.3.6 High Frequency Oscillator The BQ27Z561-R1 includes a high frequency oscillator (HFO) running at 16.78 MHz. It is frequency locked to the LFO output and scaled down to 8.388 MHz with a 50% duty cycle. 8.3.7 1.8-V Low Dropout Regulator The BQ27Z561-R1 device contains an integrated capacitor-less 1.8-V LDO (REG18) that provides regulated supply voltage for the device CPU and internal digital logic. 8.3.8 Internal Voltage References The BQ27Z561-R1 device provides two internal voltage references. REF1 is used by REG18, oscillators, and CC. REF2 is used by the ADC. 8.3.9 Gas Gauging This device uses the Impedance Track™ technology to measure and determine the available charge in battery cells. See the Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm Application Report (SLUA450) for further details. 8.3.10 Charge Control Features This device supports charge control features, such as: • Reports charging voltage and charging current based on the active temperature range—JEITA temperature ranges T1, T2, T3, T4, T5, and T6 • Provides more complex charging profiles, including sub-ranges within a standard temperature range • Reports the appropriate charging current required for constant current charging, and the appropriate charging voltage needed for constant voltage charging to a smart charger, using the bus communication interface • Compensates the charging profile based on the value of RelativeStateOfCharge() • Selects the chemical state-of-charge of each battery cell using the Impedance Track method • Reports charging faults and indicates charge status via charge and discharge alarms 8.3.11 Authentication This device supports security with the following features, which can be enabled if desired: • Authentication by the host using the SHA-256 method • The gas gauge requires SHA-256 authentication before the device can be unsealed or allow full access. 8.4 Device Functional Modes This device supports four modes, but the current consumption varies, based on firmware control of certain functions and modes of operation: • NORMAL mode: In this mode, the device performs measurements, calculations, protections, and data updates every 250-ms intervals. Between these intervals, the device is operating in a reduced power stage to minimize total average current consumption. • SLEEP mode: In this mode, the device performs measurements, calculations, and data updates in adjustable Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 13 BQ27Z561-R1 SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 www.ti.com Device Functional Modes (continued) • • time intervals. Between these intervals, the device is operating in a reduced power stage to minimize total average current consumption. DEEP SLEEP mode: In this mode, the current is reduced slightly while current and voltage are still measured periodically, with a user-defined time between reads. OFF mode: The device is completely disabled by pulling CE low. CE disables the internal voltage rail. All nonvolatile memory is unprotected. 8.4.1 Lifetime Logging Features The device supports data logging of several key parameters for warranty and analysis: • Maximum and minimum cell temperature • Maximum current in CHARGE or DISCHARGE mode • Maximum and minimum cell voltages • Total run time (This data is stored with a resolution of two hours.) • Time spent different temperature ranges (This data is stored with a resolution of two hours.) 8.4.2 Configuration The device supports accurate data measurements and data logging of several key parameters. 8.4.2.1 Coulomb Counting The device uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement. The ADC measures charge/discharge flow of the battery by measuring the voltage across a very small external sense resistor. The integrating ADC measures a bipolar signal from a range of –100 mV to 100 mV, with a positive value when V(SRP) – V(SRN), indicating charge current and a negative value indicating discharge current. The current measurement is performed by measuring the voltage drop across the external sense resistor, which can be as low as 1 mΩ, and the polarity of the differential voltage determines if the cell is in the CHARGE or DISCHARGE mode. 8.4.2.2 Cell Voltage Measurements The BQ27Z561-R1 gas gauge measures the cell voltage at 1-s intervals using the ADC. This measured value is internally scaled for the ADC and is calibrated to reduce any errors due to offsets. This data is also used for calculating the impedance of the cell for Impedance Track gas gauging. 8.4.2.3 Auto Calibration The auto-calibration feature helps to cancel any voltage offset across the SRP and SRN pins for accurate measurement of the cell voltage, charge/discharge current, and thermistor temperature. The auto-calibration is performed when there is no communication activity for a minimum of 5 s on the bus lines. 8.4.2.4 Temperature Measurements This device has an internal sensor for on-die temperature measurements, and the ability to support an external temperature measurement via the external NTC on the TS pin. These two measurements are individually enabled and configured. 9 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 14 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 BQ27Z561-R1 www.ti.com SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 9.1 Application Information The BQ27Z561-R1 gas gauge can be used with a 1-series Li-Ion/Li-Polymer battery pack. To implement and design a comprehensive set of parameters for a specific battery pack, the user needs Battery Management Studio (BQSTUDIO), which is a graphical user-interface tool installed on a PC during development. The firmware installed in the product has default values, which are summarized in the BQ27Z561-R1 Technical Reference Manual (SLUUBY5). Using the BQSTUDIO tool, these default values can be changed to cater to specific application requirements during development once the system parameters, such as enable/disable of certain features for operation, cell configuration, chemistry that best matches the cell used, and more are known. The final flash image, which is extracted once configuration and testing are complete, will be used for mass production and is referred to as the "golden image." 9.2 Typical Applications The following is an example BQ27Z561-R1 application schematic for a single-cell battery pack. PACK+ Protector IC CE SDA/HDQ Tie to CPU for direct control BAT_SNS SCL INT BAT 1 µF PULS + Battery - NU TS Thermistor 10 kŸ VSS SRN SRP 0.1 PF RSRN 100 Ÿ PACK- RSRP 100 Ÿ RSENSE 1 mŸ Figure 8. BQ27Z561-R1 1-Series Cell Typical Implementation 9.2.1 Design Requirements (Default) Design Parameter Example Cell Configuration 1s1p (1 series with 1 parallel) Design Capacity 5300 mAh Device Chemistry Li-Ion Design Voltage 4000 mV Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 15 BQ27Z561-R1 SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 www.ti.com Typical Applications (continued) Design Parameter Example Cell Low Voltage 2500 mV 9.2.2 Detailed Design Procedure 9.2.2.1 Changing Design Parameters For the firmware settings needed for the design requirements, refer to the BQ27Z561-R1 Technical Reference Manual (SLUUBY5). • To change design capacity, set the data flash value (in mAh) in the Gas Gauging: Design: Design Capacity register. • To set device chemistry, go to the data flash I2C Configuration: Data: Device Chemistry. The BQSTUDIO software automatically populates the correct chemistry identification. This selection is derived from using the BQCHEM feature in the tools and choosing the option that matches the device chemistry from the list. • To set the design voltage, go to Gas Gauging: Design: Design Voltage register. • To set the Cell Low Voltage or clear the Cell Low Voltage, use Settings: Configuration: Init Voltage Low Set or Clear. This is used to set the cell voltage level that will set (clear) the [VOLT_LO] bit in the Interrupt Status register. • To enable the internal temperature and the external temperature sensors: Set Settings:Configuration: Temperature Enable: Bit 0 (TSInt) = 1 for the internal sensor; set Bit 1 (TS1) = 1 for the external sensor. 9.2.3 Calibration Process The calibration of current, voltage, and temperature readings is accessible by writing 0xF081 or 0xF082 to ManufacturerAccess(). A detailed procedure is included in the BQ27Z561-R1 Technical Reference Manual (SLUUBY5) in the Calibration section. The description allows for calibration of cell voltage measurement offset, battery voltage, current calibration, coulomb counter offset, PCB offset, CC gain/capacity gain, and temperature measurement for both internal and external sensors. 9.2.4 Gauging Data Updates When a battery pack enabled with the BQ27Z561-R1 gas gauge is cycled, the value of FullChargeCapacity() updates several times, including the onset of charge or discharge, charge termination, temperature delta, resistance updates during discharge, and relaxation. Figure 9 shows actual battery voltage, load current, and FullChargeCapacity() when some of those updates occur during a single application cycle. Update points from the plot include: • Charge termination at 7900 s • Relaxation at 9900 s • Resistance update at 11500 s 16 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 BQ27Z561-R1 www.ti.com SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 9.2.4.1 Application Curve Figure 9. Full Charge Capacity Tracking (X-Axis Is Seconds) 10 Power Supply Requirements The only power supply is the BAT pin, which is connected to the positive terminal of the battery. The input voltage for the BAT pin will have a minimum of 2 V to a maximum of 5 V. 11 Layout 11.1 Layout Guidelines • • • • The quality of the Kelvin connections at the sense resistor is critical. The sense resistor must have a temperature coefficient no greater than 50 ppm to minimize current measurement drift with temperature. Choose the value of the sense resistor to correspond to the available overcurrent and short-circuit ranges of the BQ27Z561-R1 gas gauge. Select the smallest value possible to minimize the negative voltage generated on the BQ27Z561-R1 VSS node during a short circuit. This pin has an absolute minimum of –0.3 V. Parallel resistors can be used as long as good Kelvin sensing is ensured. The device is designed to support a 1-mΩ to 3-mΩ sense resistor. BAT_SNS should be tied directly to the positive connection of the battery. It should not share a path with the BAT pin. In reference to the gas gauge circuit the following features require attention for component placement and layout: differential low-pass filter and I2C communication. The BQ27Z561-R1 gas gauge uses an integrating delta-sigma ADC for current measurements. Add a 100-Ω resistor from the sense resistor to the SRP and SRN inputs of the device. Place a 0.1-μF filter capacitor across the SRP and SRN inputs. If required for a circuit, 0.1-µF filter capacitors can be added for additional noise filtering for each sense input pin to ground. Place all filter components as close as possible to the device. Route the traces from the sense resistor in parallel to the filter circuit. Adding a ground plane around the filter network can provide additional noise immunity. Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 17 BQ27Z561-R1 SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 www.ti.com Layout Guidelines (continued) • • The BQ27Z561-R1 has an internal LDO that is internally compensated and does not require an external decoupling capacitor. The I2C clock and data pins have integrated high-voltage ESD protection circuits; however, adding a Zener diode and series resistor provides more robust ESD performance. The I2C clock and data lines have an internal pull-down. When the gas gauge senses that both lines are low (such as during removal of the pack), the device performs auto-offset calibration and then goes into SLEEP mode to conserve power. 11.2 Layout Example No contact to NU (BAT_SNS trace on bottom layer) Tab - Tab + RSRN INT PULS SDA/ HDQ TS VSS SCL SRN BAT_ SNS NU SRP BAT CE Device ground reference RSENSE RSRP BAT - Weld Tab Weld Tab Battery Sense path only PACK + PACK - BAT + BAT_SNS at Battery terminal Figure 10. BQ27Z561-R1 Key Trace Board Layout 18 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 BQ27Z561-R1 www.ti.com SLUSDH5A – MARCH 2019 – REVISED AUGUST 2019 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation • BQ27Z561-R1 Technical Reference Manual (SLUUBY5) • Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm Application Report (SLUA364) 12.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.4 Trademarks Impedance Track, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: BQ27Z561-R1 19 PACKAGE OPTION ADDENDUM www.ti.com 14-Feb-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) BQ27Z561YPHR-R1 ACTIVE DSBGA YPH 12 3000 RoHS & Green SAC396 Level-1-260C-UNLIM -40 to 85 Q27Z561R1 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of