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BQ294506DRVT

BQ294506DRVT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    WDFN6_EP

  • 描述:

    电池 电池保护 IC 锂离子 6-WSON(2x2)

  • 数据手册
  • 价格&库存
BQ294506DRVT 数据手册
BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 BQ2945xy Overvoltage Protection For 2-Series and 3-Series Cell Li-Ion Batteries 1 Features 3 Description • The BQ2945xy family of products is a secondary-level voltage monitor and protector for Li-ion battery pack systems. Each cell is monitored independently for an overvoltage condition. Based on the configuration, an output is triggered after a fixed delay if any of the two or three cells has an overvoltage condition. This output is triggered into a high state after an overvoltage condition satisfies the specified delay timer. • • • • • • • 2-series and 3-series cell overvoltage monitor for secondary protection Fixed programmable delay timer Fixed OVP threshold – Available range from 3.85 V to 4.6 V Fixed OVP delay option: 4 s or 6.5 s High-accuracy overvoltage protection: ±10 mV Low power consumption ICC ≈ 1 µA (VCELL(ALL) < VPROTECT) Low leakage current per cell input < 100 nA Small package footprint – 6-pin SON Device Information PART NUMBER(1) BQ2945xy (1) 2 Applications • PACKAGE BODY SIZE (NOM) SON (6) 2.00 mm × 2.00 mm For all available packages, see the orderable addendum at the end of the data sheet. Second-level protection in Li-ion battery packs in: – Tablets – Slates – Power tools – Notebook computers – Portable equipment and instrumentation Pack + RVD RIN VCELL3 RIN VCELL2 RIN CIN V3 OUT V2 VDD CIN V1 VSS CVD PWRPAD VCELL1 CIN Pack– Copyright © 2017, Texas Instruments Incorporated Simplified Schematic An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Device Comparison Table...............................................3 6 Pin Configuration and Functions...................................3 7 Specifications.................................................................. 4 7.1 Absolute Maximum Ratings........................................ 4 7.2 ESD Ratings............................................................... 4 7.3 Recommended Operating Conditions.........................4 7.4 Thermal Information....................................................4 7.5 Electrical Characteristics.............................................5 7.6 Typical Characteristics................................................ 6 8 Detailed Description........................................................7 8.1 Overview..................................................................... 7 8.2 Functional Block Diagram........................................... 7 8.3 Feature Description.....................................................7 8.4 Device Functional Modes............................................8 9 Application and Implementation.................................. 10 9.1 Application Information............................................. 10 9.2 Typical Application.................................................... 10 9.3 System Examples..................................................... 11 10 Power Supply Recommendations..............................12 11 Layout........................................................................... 12 11.1 Layout Guidelines................................................... 12 11.2 Layout Example...................................................... 12 12 Device and Documentation Support..........................13 12.1 Device Support....................................................... 13 12.2 Related Documentation.......................................... 13 12.3 Receiving Notification of Documentation Updates..13 12.4 Support Resources................................................. 13 12.5 Trademarks............................................................. 13 12.6 Electrostatic Discharge Caution..............................13 12.7 Glossary..................................................................13 13 Mechanical, Packaging, and Orderable Information.................................................................... 13 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision J (June 2022) to Revision K (August 2022) Page • Changed the BQ294534 device to Production Data...........................................................................................3 • Changed the BQ294534 device to Production Data in the Electrical Characteristics ........................................5 Changes from Revision I (May 2021) to Revision J (June 2022) Page • Added the PRODUCT PREVIEW BQ294534 device......................................................................................... 3 • Added the PRODUCT PREVIEW BQ294534 device to the Electrical Characteristics ...................................... 5 Changes from Revision H (December 2017) to Revision I (May 2021) Page • Changed the BQ294506 device to Production Data...........................................................................................3 Changes from Revision G (November 2017) to Revision H (December 2017) Page • Added the BQ294506 device..............................................................................................................................3 • Added the BQ294506 device to the Electrical Characteristics .......................................................................... 5 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 5 Device Comparison Table TA PART NUMBER OVP (V) DELAY TIME (s) BQ294502 4.35 4 BQ294504 4.35 6.5 BQ294506 4.38 4 BQ294512 4.4 4 BQ294522 4.45 4 BQ294524 4.45 6.5 BQ294532 4.5 4 BQ294533 4.5 6.5 BQ294534 4.55 4 BQ294582 4.225 4 BQ294592 4.3 4 –40°C to +110°C 6 Pin Configuration and Functions V3 1 6 OUT V2 2 Thermal 5 Pad VDD 3 V1 VSS 4 Not to scale Figure 6-1. DRV Package 6-Pin SON Top View Table 6-1. Pin Functions (1) NUMBER NAME TYPE(1) 1 V3 IA Sense input for positive voltage of the third cell from the bottom of the stack. 2 V2 IA Sense input for positive voltage of the second cell from the bottom of the stack. 3 VSS P Electrically connected to IC ground and negative terminal of the lowest cell in the stack. 4 V1 IA Sense input for positive voltage of the lowest cell in the stack. 5 VDD P Power supply 6 OUT OA1 — PWRPAD — DESCRIPTION Output drive for external N-channel FET. VSS pin to be connected to the PWRPAD on the printed-circuit-board (PCB) for proper operation. IA = Input Analog, OA = Output Analog, P = Power Connection Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 3 BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) (2) Supply voltage Input voltage Output voltage MIN MAX UNIT VDD–VSS –0.3 30 V V1–VSS or V2–VSS or V3–VSS+ –0.3 30 V V3–V2 or V2–V1 –0.3 8 V OUT–VSS –0.3 30 V Continuous total power dissipation, PTOT See Section 7.4. Lead temperature (soldering, 10 s), TSOLDER Storage temperature, Tstg (1) (2) –65 300 °C 150 °C Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. See Figure 8-3. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Supply voltage, VDD (1) Input voltage V3–V2 or V2–V1 or V1–VSS Operating ambient temperature, TA (1) MIN MAX UNIT 3 25 V 0 5 V –40 110 °C See Section 9.2. 7.4 Thermal Information BQ2945xy THERMAL METRIC(1) DRV (SON) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 186.4 °C/W RθJC(top) Junction-to-case(top) thermal resistance 90.4 °C/W RθJB Junction-to-board thermal resistance 110.7 °C/W ψJT Junction-to-top characterization parameter 96.7 °C/W ψJB Junction-to-board characterization parameter 90 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application Report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 7.5 Electrical Characteristics Typical values stated where TA = 25°C and VDD = 10.8 V, MIN/MAX values stated where TA = –40°C to +110°C and VDD = 3 V to 15 V (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOLTAGE PROTECTION THRESHOLD VCx VOV BQ294502, fixed delay 4 s 4.35 BQ294504, fixed delay 6.5 s 4.35 BQ294506, fixed delay 4 s 4.38 BQ294512, fixed delay 4 s 4.4 BQ294522, fixed delay 4 s V(PROTECT) – BQ294524, fixed delay 6.5 s Overvoltage Detection BQ294532, fixed delay 4 s 4.45 BQ294533, fixed delay 6.5 s 4.5 4.55 BQ294582, fixed delay 4 s 4.225 BQ294592, fixed delay 4 s 4.3 VHYS VOA OV Detection Accuracy TA = 25°C, BQ2945xy TA = 25°C, BQ294506 only TA = –40°C TA = 0°C OV Detection Accuracy T = 60°C A due to Temperature TA = 110°C TA = 10°C to 45°C, BQ294506 only V 4.5 BQ294534, fixed delay 4 s Overvoltage Detection VHYS Hysteresis VOA –DRIFT 4.45 250 300 –10 400 mV 10 mV –7 7 mV –40 –20 –24 –54 44 20 24 54 mV –15 15 mV SUPPLY AND LEAKAGE CURRENT ICC IIN Supply Current Input Current at Vx Pins (V3–V2) = (V2–V1) = (V1–VSS) = 4 V (See Figure 8-3 for reference.) 1 µA (V3–V2) = (V2–V1) = (V1–VSS) = 2.8 V with TA = –40°C to 60°C Measured at V3, V2, and V1 = 4 V (V2–V1) = (V1–VSS) = 4 V TA = 0°C to 60°C (See Figure 8-3 for reference.) 2 1.25 –0.1 0.1 µA OUTPUT DRIVE OUT (V3–V2) or (V2–V1) or (V1–VSS) > VOV VDD = 7.2 V, IOH = 100 µA, TA = –40°C to +110°C VOUT Output Drive Voltage 6 Two of the three cells are short circuit and only one cell is powered (V3–V2) or (V2–V1) or (V1–VSS) > VOV VDD = Vx (Cell voltage), IOH = 100 µA, TA = –40°C to +110°C VDD – 0.2 (V3–V2), (V2–V1), and (V1–VSS) < VOV, IOL = 100 µA, TA = 25°C TA = –40°C to +110°C IOUT(Short) OUT Short Circuit Current OUT = 0 V (V3–V2) or (V2–V1) or (V1–VSS) > VOV tR Output Rise Time CL = 1 nF, VOH(OUT) = 0 V to 5 V(1) ZO Output Impedance V 250 V 400 mV 4.5 mA 5 µs 2 5 kΩ FIXED DELAY TIMER tDELAY Fault Detection Delay Time Fixed Delay, BQ2945xy with delay set to 4s typ 3.2 4 4.8 Fixed Delay, BQ2945xy with delay set to 6.5 s 5.2 6.5 7.8 Copyright © 2022 Texas Instruments Incorporated s Submit Document Feedback Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 5 BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 7.5 Electrical Characteristics (continued) Typical values stated where TA = 25°C and VDD = 10.8 V, MIN/MAX values stated where TA = –40°C to +110°C and VDD = 3 V to 15 V (unless otherwise noted). PARAMETER tDELAY_CTM (1) TEST CONDITIONS Fault Detection Delay Time in Test Mode MIN Fixed Delay (Internal settings) TYP MAX 15 UNIT ms Specified by design. It is not 100% tested in production. 7.6 Typical Characteristics 1.3 4.38 4.37 Overvoltage Threshold (V) ICC Current (PA) 1.2 1.1 1 0.9 0.8 0.7 -40 Min Max Mean 4.36 4.35 4.34 4.33 4.32 -20 0 20 40 60 Temperature (qC) 80 100 4.31 -40 120 D001 Figure 7-1. ICC Current Consumption vs Temperature -20 0 20 40 60 Temperature (qC) 80 100 120 D002 Figure 7-2. BQ294502 Overvoltage Threshold (OVT) vs Temperature 325 -3.85 324 -3.9 Output Current (mA) Hysteresis (mV) 323 322 321 320 319 318 -3.95 -4 -4.05 317 316 315 -40 -20 0 20 40 60 Temperature (qC) 80 100 120 D003 Figure 7-3. Hysteresis VHYS vs Temperature 6 Submit Document Feedback -4.1 -40 -20 0 20 40 60 Temperature (qC) 80 100 120 D004 Figure 7-4. Output Current IOUT vs Temperature Copyright © 2022 Texas Instruments Incorporated Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 8 3-Cell Data 2-Cell Data 7.5 Output Voltage (V) 7 6.5 6 5.5 5 4.5 4 0 100 200 300 400 500 600 700 Output Current (PA) 800 900 1000 D005 Figure 7-5. Output Voltage vs Output Current 8 Detailed Description 8.1 Overview The BQ2945xy is a second-level overvoltage (OV) protector. Each cell is monitored independently by comparing the actual cell voltage to a protection voltage threshold, VOV. The protection threshold is preprogrammed at the factory with a range from 3.85 V to 4.65 V. 8.2 Functional Block Diagram PACK+ R VD CVD VDD RIN V3 CIN V2 RIN CIN V1 RIN Multiplexer Switch Network REG INT_EN VOV Delay Timer OUT OSC CIN VSS PWRPAD PACK– Copyright © 2017, Texas Instruments Incorporated 8.3 Feature Description The voltage sensing for each cell is done independently using a multiplexer. The method of overvoltage detection is comparing the voltage to an overvoltage protection voltage VOV. Once the voltage exceeds the programmed fixed value, the delay timer circuit is activated. This delay (tDELAY) is fixed for either a 4-s or 6.5-s delay. When these conditions are satisfied, the OUT terminal is transitioned to a high level. This output (OUT) is released to a low condition if all of the cell inputs (Vx) are below the OVP threshold minus the Vhys. Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 7 BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com Cell Voltage (V) (V3 –V2, V2 – V1, V1–VSS) SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 VOV VOV –VHYS tDELAY OUT (V) Figure 8-1. Timing for Overvoltage Sensing 8.3.1 Sense Positive Input for VX This is an input to sense each single battery cell voltage. A series resistor and a capacitor across the cell for each input is required for noise filtering and stable voltage monitoring. 8.3.2 Output Drive, OUT The gate of an external N-channel MOSFET is connected to this terminal. This output transitions to a high level when an overvoltage condition is detected and after the programmed delay timer. OUT resets to a low level if the cell voltage falls below the VOV threshold before the fixed delay timer expires. 8.3.3 Supply Input, VDD This terminal is the unregulated input power source for the IC. A series resistor is connected to limit the current, and a capacitor is connected to ground for noise filtering. 8.3.4 Thermal Pad, PWRPAD For correct operation, the power pad (PWRPAD) is connected to the VSS terminal on the PCB. 8.4 Device Functional Modes 8.4.1 NORMAL Mode When all of the cell voltages are below the overvoltage threshold, VOV, the device operates in NORMAL mode. The device monitors the differential cell voltages connected across (V1–VSS), (V2–V1) and (V3–V2). The OUT pin is inactive in this mode. 8.4.2 OVERVOLTAGE Mode OVERVOLTAGE mode is detected if any of the cell voltages exceeds the overvoltage threshold, VOV for the configured OV delay time, tDELAY. The OUT pin pulls high internally. An external FET then turns on, shorting the fuse to ground, which enables the battery or charger power to blow the fuse. When all of the cell voltages fall below (VOV–VHYS), the device returns to NORMAL mode. 8.4.3 Customer Test Mode Customer Test Mode (CTM) helps to reduce test time for checking the overvoltage delay timer parameter once the circuit is implemented in the battery pack. To enter CTM, set VDD to at least 10 V higher than V3 (see Figure 8-2). The delay timer is greater than 10 ms, but considerably shorter than the timer delay in normal operation. To exit CTM, remove the VDD to VC3 voltage differential of 10 V so that the decrease in this value automatically causes an exit. 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 CAUTION Avoid exceeding any Absolute Maximum Voltages on any pins when placing the part into CTM. Also avoid exceeding Absolute Maximum Voltages for the individual cell voltages (V3–V2), (V2–V1), and (V1–VSS). Stressing the pins beyond the rated limits may cause permanent damage to the device. Cell Voltage (V) (V3) VDD – V3 (V) Figure 8-2 shows the timing for CTM. 10 V VOV VOV – VHYS t DELAY > 10 ms OUT (V) Figure 8-2. Timing for Customer Test Mode Figure 8-3 shows the measurement for current consumption for the product for both VDD and Vx. bq2945xx IIN 3.6 V IIN 3.6 V IIN 3.6 V 1 V3 OUT 6 2 V2 VDD 5 V1 4 3 VSS I CC PWRPAD Figure 8-3. Configuration for IC Current Consumption Test Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 9 BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 9 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The BQ2945xy devices are second-level protectors used for overvoltage protection for the battery pack in the application. The device, when configuring the OUT pin with active high, drives an NMOS FET that connects the fuse to ground in the event of a fault condition. This provides a shorted path to use the battery or charger power to blow the fuse and cut the power path. 9.2 Typical Application Pack + RVD RIN VCELL3 RIN VCELL2 RIN CIN V3 OUT V2 VDD CIN CVD V1 VSS PWRPAD VCELL1 CIN Pack– Copyright © 2017, Texas Instruments Incorporated Figure 9-1. Application Configuration Schematic 9.2.1 Design Requirements Changes to the ranges stated in Table 9-1 impact the accuracy of the cell measurements. Figure 9-1 shows each external component. Table 9-1. Parameters PARAMETER EXTERNAL COMPONENT MIN TYP MAX Voltage monitor filter resistance RIN 100 1000 4700 Ω Voltage monitor filter capacitance CIN 0.1 1 µF Supply voltage filter resistance RVD 100 Supply voltage filter capacitance CVD 1K 0.1 UNIT Ω µF 9.2.2 Detailed Design Procedure 1. Determine the overvoltage threshold and delay time. Select the proper device from the table in Section 5 or contact TI for a different configuration. 2. Determine the number of cell in series. The device supports 2-series to 3-series cell configurations. For a 2-series configuration, the V3 pin is shorted to V2. 3. To connect to the device, follow the application configuration schematic (see Figure 9-1). 10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 9.2.3 Application Curves 325 4.38 324 323 4.36 Hysteresis (mV) Overvoltage Threshold (V) 4.37 Min Max Mean 4.35 4.34 4.33 322 321 320 319 318 317 4.32 316 4.31 -40 -20 0 20 40 60 Temperature (qC) 80 100 315 -40 120 -20 D002 Figure 9-2. OVT vs Temperature 0 20 40 60 Temperature (qC) 80 100 120 D003 Figure 9-3. VHYS vs Temperature 9.3 System Examples Pack + 100 bq2945xx 1k VCELL3 VCELL2 V3 OUT V2 VDD 1k 0.1µF 1k 0.1µF VSS VCELL1 V1 0.1 µF PWRPAD 0.1µF Pack – Figure 9-4. 3-Series Cell Configuration with Fixed Delay Pack + 100 bq2945xx V3 OUT V2 VDD 1k VCELL2 1k 0.1 µF VSS VCELL1 V1 0.1µF PWRPAD 0.1µF Pack – Figure 9-5. 2-Series Cell Configuration with Internal Fixed Delay Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 11 BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 10 Power Supply Recommendations The maximum power of this device is 25 V on VDD. 11 Layout 11.1 Layout Guidelines • • • Ensure the RC filters for the V1 and VDD pins are placed as close as possible to the target terminal, reducing the tracing loop area. Route the VSS pin to the CELL– terminal. Ensure the trace connecting the fuse to the gate, source of the NFET to the Pack– is sufficient to withstand the current during a fuse blown event. 11.2 Layout Example Place the RC filters close to the device terminals Power Trace Line Pack + NC OUT VDD V2 Pack ± PWPD VCELL VSS VSS Ensure trace can support sufficient current flow for fuse blow Connect the VSS pins to the CELL- side Figure 11-1. Layout Schematic 12 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 BQ294502, BQ294504, BQ294506, BQ294512, BQ294522 BQ294524, BQ294532, BQ294533, BQ294534, BQ294582, BQ294592 www.ti.com SLUSAJ3K – SEPTEMBER 2011 – REVISED AUGUST 2022 12 Device and Documentation Support 12.1 Device Support 12.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 12.2 Related Documentation • Semiconductor and IC Package Thermal Metrics Application Report 12.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.5 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.7 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback Product Folder Links: BQ294502 BQ294504 BQ294506 BQ294512 BQ294522 BQ294524 BQ294532 BQ294533 BQ294534 BQ294582 BQ294592 13 PACKAGE OPTION ADDENDUM www.ti.com 19-Sep-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) BQ294502DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4502 Samples BQ294502DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4502 Samples BQ294504DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4504 Samples BQ294504DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4504 Samples BQ294506DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4506 Samples BQ294506DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4506 Samples BQ294512DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4512 Samples BQ294512DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4512 Samples BQ294522DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 4522 Samples BQ294522DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4522 Samples BQ294524DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4524 Samples BQ294524DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4524 Samples BQ294532DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4532 Samples BQ294532DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4532 Samples BQ294533DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4533 Samples BQ294533DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4533 Samples BQ294534DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 110 4534 Samples BQ294582DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4582 Samples BQ294582DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4582 Samples BQ294592DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4592 Samples Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 19-Sep-2023 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material RoHS & Green NIPDAU MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) BQ294592DRVT ACTIVE WSON DRV 6 250 Level-1-260C-UNLIM -40 to 85 4592 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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