User's Guide
SLUU532A – November 2011 – Revised December 2011
bq3050EVM SBS 1.1 Compliant Advanced Gas Gauge
Battery Management Solution EVM
The bq3050EVM is a complete evaluation system for the bq3050/bq29440 battery management system.
This system includes one bq3050/bq29440 circuit module, a current sense resistor, four thermistors, and a
link to Windows®-based PC software.
The circuit module includes one bq3050 IC, one bq29440 IC, and all other onboard components
necessary to monitor and predict capacity, perform cell balancing, monitor critical parameters, protect the
cells from overcharge, overdischarge, short circuit, and overcurrent in 2-series, 3-series, or 4-series cell
Li-Ion or Li-Polymer battery packs. The circuit module connects directly across the cells in a battery.
With the EV2300 interface board and software, users can read the bq3050 data registers, program the
chipset for different pack configurations, log cycling data for further evaluation, and evaluate the overall
functionality of the bq3050/bq29440 solution under different charge and discharge conditions.
1
2
3
4
5
6
7
8
9
10
11
Contents
Features ...................................................................................................................... 2
bq3050 Device-Based Circuit Module .................................................................................... 2
bq3050 Circuit Module Schematic ........................................................................................ 3
Circuit Module Physical Layouts and Bill of Materials .................................................................. 3
EVM Hardware and Software Setup .................................................................................... 10
Troubleshooting Unexpected Dialog Boxes ............................................................................ 10
Hardware Connection ..................................................................................................... 10
Operation ................................................................................................................... 12
Calibration Screen ......................................................................................................... 14
Pro (Advanced) Screen ................................................................................................... 16
Related Documentation from Texas Instruments ..................................................................... 17
List of Figures
1
bq3050EVM-001 Layout (Silk Screen) ................................................................................... 4
2
Top Assembly ............................................................................................................... 4
3
Top Layer .................................................................................................................... 5
4
Inner Layer 1
13
................................................................................................................
Inner Layer 2 ................................................................................................................
Bottom Layer ................................................................................................................
Bottom Assembly ...........................................................................................................
Schematic ....................................................................................................................
bq3050 Circuit Module Connection to Cells and System Load/Charger ...........................................
SBS Data Screen ..........................................................................................................
Data Flash Screen, 1st Level Safety Class ............................................................................
Calibration Screen .........................................................................................................
Pro (Advanced) Screen ...................................................................................................
1
Ordering Information ........................................................................................................ 2
2
Bill of Materials .............................................................................................................. 7
5
6
7
8
9
10
11
12
5
5
5
6
9
11
12
13
15
16
List of Tables
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1
Features
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3
Performance Specification Summary ................................................................................... 10
4
Circuit Module to EV2300 Connections
1
•
•
Complete evaluation system for the bq3050 SBS 1.1-compliant advanced gas gauge, bq3050 and
bq29440 independent overvoltage protection integrated circuit (IC)
Populated circuit module for quick setup
Link to software that allows data logging for system analysis
Kit Contents
•
•
1.2
11
Features
•
1.1
................................................................................
bq3050/bq29440 circuit module
Set of support documentation
Ordering Information
Table 1. Ordering Information
2
EVM PART NUMBER
CHEMISTRY
CONFIGURATION
CAPACITY
bq3050EVM-001
Li-Ion
2-series, 3-series, or
4-series cell
Any
bq3050 Device-Based Circuit Module
The bq3050/bq29440-based circuit module is a complete and compact example solution of a bq3050
circuit for battery management and protection of Li-Ion or Li-Polymer packs. The circuit module
incorporates a bq3050 battery monitor IC, bq29440 independent overvoltage protection IC, and all other
components necessary to accurately predict the capacity of 2-series, 3-series, or 4-series cells.
2.1
Circuit Module Connections
Contacts on the circuit module provide the following connections:
• Direct connection to the cells: 1N (BAT–), 1P, 2P, 3P, 4P (BAT+)
• To the serial communications port (SMBC, SMBD, VSS)
• The system load and charger connect across PACK+ and PACK–
• To the system present pin (SYS PRES)
2
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bq3050 Circuit Module Schematic
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2.2
Pin Descriptions
PIN NAME
1N
1P
2P
3P
4P
SMBC
SMBD
VSS
PACK–
SYS PRES
PACK+
3
DESCRIPTION
–ve connection of first (bottom) cell
+ve connection of first (bottom) cell
+ve connection of second cell
+ve connection of third cell
+ve connection of fourth (top) cell
Serial communication port clock
Serial communication data port
Pack negative terminal
Pack negative terminal
System present pin (if low, system is present)
Pack positive terminal
bq3050 Circuit Module Schematic
This section contains information on the schematic for the bq3050/bq29440 implementation.
3.1
Schematic
The schematic follows the bill of materials in this user's guide.
3.2
Choosing Particular Precharge Mode
The bq3050 contains an internal precharge FET; however, the default firmware configuration uses the
Charge FET for precharge. To evaluate the internal precharge FET, change the least two significant bits in
DF:Configuration:Charging Configuration to be 0,0. See the bq3050 Technical Reference Manual
(SLUU485) for additional information.
3.3
Testing Fuse-Blowing Circuit
To prevent the loss of board functionality during the fuse-blowing test, the actual chemical fuse is not
provided in the circuit. FET Q1 drives TP8 low if a fuse-blow condition occurs; monitoring TP8 can be
used to test this condition.
4
Circuit Module Physical Layouts and Bill of Materials
This section contains the board layout, bill of materials, and assembly drawings for the bq3050/bq29440
circuit module.
4.1
Board Layout
This section shows the dimensions, PCB layers, and assembly drawing for the bq3050 module.
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Figure 1. bq3050EVM-001 Layout (Silk Screen)
Figure 2. Top Assembly
4
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Circuit Module Physical Layouts and Bill of Materials
Figure 3. Top Layer
Figure 4. Inner Layer 1
Figure 5. Inner Layer 2
Figure 6. Bottom Layer
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Figure 7. Bottom Assembly
6
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4.2
Bill of Materials
Table 2. Bill of Materials
Count
Reference Design
Value
Description
Size
Part Number
Manufacturer
18
C1, C2, C3, C4, C5,
C6, C7, C8, C11, C12,
C13, C14, C15, C16,
C17, C21, C22, C25
0.1 µF
Capacitor, Ceramic,
50 V, X7R, 20%
0603
Std
Std
1
C10
0.22 µF
Capacitor, Ceramic,
25 V, X7R, 20%
0603
Std
Std
2
C23, C24
0.1 nF
Capacitor, Ceramic,
50 V, X7R, 20%
0603
Std
Std
4
C9, C18, C19, C20
1.0 µF
Capacitor, Ceramic,
25 V, X7R, 20%
0805
Std
Std
2
D1, D2
1SS355
Diode, Switching, 90
V, 225 mA Ifm, High
speed
SOD-323
1SS355TE-17
Rohm
1
D3
MM3Z5V6C
Diode, Zener, 5.6 V,
200 mw
SOD323
MM3Z5V6C
Fairchild
5
D4, D5, D6, D7, D8
LN1361C
Diode, LED, Green,
Gullwing, GW Type,
20 ma, 7.5 mcd typ.
.120 * .087
inches
LN1361C
Panasonic
0
F1
Un-install
Fuse, Chemical,
Thermal, xxA
SFDxxx
SFDxxxx
Sony
1
J1
56579-0519
Connector, USB, Mini
AB 5-pins
0.354 X 0.307
Inches
56579-0519
Molex
1
J2
22-05-3041
Header, Friction Lock
Ass'y, 4-pin Right
Angle,
0.400 x 0.500
22-05-3041
Molex
1
Q1
FDN339AN
MOSFET, N-ch, 20-V, SOT23
3 A, 0.05 Ω
FDN339AN
Fairchild
2
Q2, Q3
Si7114DN
MOSFET, Fast
Switching, NChan, 30
V, 18.3 A, 7.5 mΩ
PWRPAK 1212
Si7114DN-T1-E3
Vishay
1
Q4
2N7002K
MOSFET, Nch, 60 V,
300 mA, 2 Ω
SOT23
2N7002K-T1-E3
Vishay
9
R1, R2, R3, R4, R11,
R12, R18, R26, R27
100
Resistor, Chip, 1/16
W, 5%
0603
Std
Std
1
R10
0.01
Resistor, Chip,
75ppm, 1 W, 1%
2512
WSL2512R0100FEA
Vishay
2
R13, R28
50K
Resistor, Chip, 1/16
W, 5%
0603
Std
Std
1
R14
220K
Resistor, Chip, 1/16
W, 5%
0603
Std
Std
1
R15
301
Resistor, Chip, 1 W,
1%
2512
CRCW2512301R
FKEG
Vishay
2
R16, R20
3M
Resistor, Chip, 1/16
W, 5%
0603
Std
Std
2
R17, R19
5.1K
Resistor, Chip, 1/16
W, 5%
0603
Std
Std
1
R21
10k
Resistor, Chip, 1/16
W, 5%
0603
Std
Std
2
R22, R23
200
Resistor, Chip, 1/16
W, 5%
0603
Std
Std
3
R24, R30, R31
10K
Resistor, Chip, 1/16
W, 5%
0603
Std
Std
1
R29
0
Resistor, Chip, 1/16
W, 5%
0603
Std
Std
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Table 2. Bill of Materials (continued)
Count
Reference Design
Value
Description
Size
Part Number
Manufacturer
6
R5, R6, R7, R8, R9,
R25
1K
Resistor, Chip, 1/16
W, 5%
0603
Std
Std
2
RT1, RT2
10K
Thermistor
0.095 X 0.150
BN35-3H103 or
103AT-2
Mitsubishi
Material or
Semitec
2
SW1, SW2
EVQ-PLHA15
Switch, Push button,
Momentary, 1P1T, 50
mA, 12 V
0.200 x 0.200
inch
EVQ-PLHA15
Panasonic
1
TB1
ED1514
Terminal Block, 2-pin,
6 A, 3.5 mm
0.27 x 0.25
ED555/2DS
OST
2
TB2, TB3
ED1515
Terminal Block, 3-pin,
6 A, 3.5 mm
0.41 x 0.25
ED555/3DS
OST
17
TP10, TP11, TP12,
TP13, TP14, TP15,
TP16, TP17, TP18,
TP19, TP1, TP2, TP3,
TP4, TP5, TP6, TP7,
TP8, TP9
Test Point, White,
Thru Hole Color
Keyed
0.100 x 0.100
inch
5002
Keystone
1
U1
BQ29440DRB
IC, Voltage Protection VSON
with Automatic Cell
Balance for 2-, 3-, or
4-Cell Li-Ion Batteries
(2nd-Level Protection)
BQ29440DRB
TI
1
U2
BQ3050DBT
IC, 2-, 3-, and
TSSOP-38
4-Series Battery Pack (DBT)
Manager
BQ3050DBT
TI
1
—
PCB
HPA729
Std
Notes:
108.161 x
32.550 mm
1. These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants.
Use of no clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk ('**') cannot be substituted.
All other components can be substituted with equivalent MFG's components.
5. Assembly instruction for SW1: pay attention to its orientation
6. Make one SMBus connector wire assembly for each assembly produced, from J1 mate, 4–24 Awg wires and Crimp
terminals. Wire colors for Pin numbers are listed below. The wire assembly shall have a J1 mate on each end.
Red—Pin # 4 (Signal USB_5V)
Brown—Pin # 3 (Signal SDA)
White—Pin # 2 (Signal SCL)
Black—Pin # 1 (GND)
8
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Figure 8. Schematic
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EVM Hardware and Software Setup
4.3
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bq3050/bq29440 Circuit Module Performance Specification Summary
This section summarizes the performance specifications of the bq3050/bq29440 circuit module.
Table 3. Performance Specification Summary
Specification
5
Min
Typ
Max
Units
Input voltage Pack+ to Pack–
5
15
25
V
Charge and discharge current
0
2
7
A
EVM Hardware and Software Setup
This section describes how to install the bq3050EVM-001 PC software, and how to connect the different
components of the EVM.
5.1
System Requirements
The bq3050EVSW requires Windows 2000, XP, Vista, or 7.
5.2
Software Installation
NOTE: To get the latest software archive, contact the Texas Instruments field representative
assigned to work with this device.
To install the bq3050EVSW software, do the following:
1. Save the archive to a temporary directory.
2. Double-click on the executable filename, and follow the installer instructions to complete the bq3050
EVSW installation.
If the EV2300 was not previously installed: After bq3050 EVSW installation, a TI USB DRIVER
INSTALLER pops up. Click Yes for the agreement message and follow its instructions.
3. Plug the EV2300 into a USB port.
6
Troubleshooting Unexpected Dialog Boxes
Users downloading the files must be logged in as the administrator, or must have privileges to install new
programs.
The driver is not signed, so the administrator must allow installation of unsigned drivers in the operating
system policy.
7
Hardware Connection
The bq3050EVM-001 comprises two hardware components: the bq3050/bq29440 circuit module and the
EV2300 PC interface box.
7.1
Connecting the bq3050/bq29440 Circuit Module to a Battery Pack
Figure 9 shows how to connect the bq3050/bq29440 circuit module to the cells and system load/charger.
The cells must be connected in the following order:
1. 4-Cell Pack: 1N (BAT–), 1P, 2P, 3P, then 4P (see Section 2.2 for definitions).
2. 3-Cell Pack: 1N (BAT–), 1P, 2P, and then connect 4P and 3P together.
3. 2-Cell Pack: 1N (BAT–), 1P, and then connect 4P, 3P, and 2P together.
To start charge or discharge test, connect SYS PRES pin to Pack– pin to set SYS PRES state. To test
sleep mode, disconnect the SYS PRES pin.
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Hardware Connection
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-
LOAD/CHARGER
EV2300
+
COMPUTER
USB
SMBus cable
Figure 9. bq3050 Circuit Module Connection to Cells and System Load/Charger
7.2
PC Interface Connection
To configure the hardware to interface to the PC, do the following:
1. Connect the bq3050 device-based smart battery to the EV2300 using the provided cable or the
connections shown in Table 4.
Table 4. Circuit Module to EV2300 Connections
bq3050 Device-Based Battery
EV2300
SMBD
SMBD
SMBC
SMBC
VSS
GND
2. Connect the PC USB cable to the EV2300 and the PC USB port.
The bq3050EVM-001 is now set up for operation.
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Operation
8
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Operation
This section details the operation of the bq3050 EVSW software.
NOTE: The EV2300 driver does not support Windows Sleep or Hibernate states. If communicating
with the EV2300 or the EVM presents a problem, unplug the USB cable and then plug it
back in. If the problem continues, determine if the EVM is in Shutdown mode. The bq3050
can be awakened by momentarily pressing SW2 if cell voltage is present.
8.1
Starting the Program
With the EV2300 and the bq3050EVM connected to the computer, run bq3050 EVSW from the Desktop
Icon or Start | All Programs | Texas Instruments | bq Evaluation Software menu sequence. The SBS Data
Screen appears. Data begins to appear once the Refresh (single time scan) button is clicked, or when the
Keep Scanning check box is checked. To disable the scan feature, deselect Keep Scanning.
The continuous scanning period can be set via the Options and Set Scan Interval menu selections. The
range for this interval is 0 ms to 65535 ms. Only items that are selected for scanning are scanned within
this period.
The bq3050 EVSW provides a logging function that logs the values that were last scanned by EVSW. To
enable this function, click the Start Logging button; this causes the Keep Scanning button to be
selected. When logging is Stopped, the Keep Scanning button is still selected and has to be manually
unchecked.
The logging interval is specified under the Options menu with the maximum value of 65535 ms. The Log
interval cannot be smaller than the scan interval because this results in the same value being logged at
least twice.
Figure 10. SBS Data Screen
This screen shows the SBS data set along with additional ManufacturersAccess() command information,
such as individual cell measurements. Additional Flag and Static data can be viewed by selecting the
appropriate tab at the bottom of the SBS screen.
12
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Data such as SBS.ManufacturerName( ) is static and does not change. This data is viewed separately
using the Static Data tab at the bottom of the screen.
Dragging the splitter bar (line that separates the Flags/Static data from SBS values) changes the height of
the Flags/Static Data display. Selecting View then Auto Arrange returns the splitter bar to its original
location.
8.2
Setting Programmable bq3050 Options
The bq3050 data flash comes configured per the default settings detailed in the bq3050 data sheet.
Ensure that the settings are correctly changed to match the pack and application for the bq3050 solution
being evaluated.
IMPORTANT: To get the best performance, it is essential to correctly set these options.
Use the Data Flash Screen to configure the settings.
Figure 11. Data Flash Screen, 1st Level Safety Class
To read all the data from the bq3050 data flash, click on menu option | Data Flash | Read All |.
To write to a data flash location, click on the desired location, enter the data, and click Enter, which writes
the entire tab of flash data, or select menu option | Data Flash | Write All |. The data flash must be read
before any writes are performed to avoid any incorrect data being written to the device.
The | File | Special Export | menu options allows the data flash to be exported.
The data flash configuration can be saved to a file by selecting | File | Export |, and entering a file name.
A data flash file also can be retrieved in this way, imported, and written to the bq3050 using the Write All
button.
The configuration information of the bq3050 data is held in the data flash.
The bq3050 allows for an automatic data flash export function, similar to the SBS Data logging function.
This feature, when selected via | Options | Auto Export |, exports data flash to a sequential series of files
named as FilenameNNNNN.gg where N = a decimal number from 0 to 9.
The AutoExport interval is set under the | Options menu | with a minimum value of 15 seconds. The
AutoExport filename is set under the | Options menu |.
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Calibration Screen
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When a check is next to | AutoExport |, the AutoExport is in progress. The same menu selection is used
to turn on/off AutoExport.
If the data flash screen is blank, then the bq3050 that is being used may not be supported by the
bqEVSW version that is being used. An upgrade may be required.
9
Calibration Screen
9.1
How to Calibrate
The bq3050 must be calibrated using power supplies or a power supply and cell simulation resistors (300
Ω or less) before cells are attached. Before the bq3050 is calibrated:
• Connect and measure a 2-A current source from 1N (–) and Pack (–) to calibrate without using the
FETs (calibration using the FETs is not recommended).
• Measure each cell voltage.
• Measure the temperature of the pack.
• Whether the foregoing steps are necessary depends on the type of calibration being performed.
9.2
To Calibrate the bq3050
To
•
•
•
•
9.3
calibrate the bq3050, do the following:
Select the types of calibration to be performed.
Enter the measured values for the types selected (except for CC Offset Calibration).
If Temperature Calibration is selected, select the sensor that is to be calibrated.
Click the appropriate button to initiate the desired calibration.
Board Offset Calibration
This performs the offset calibration for the current offset of the board.
Remove any current source, load, or external voltage from the PACK terminals.
Click the Software Board Offset Calibration button.
9.4
Pack Voltage Calibration
This calibrates the voltage at the AFE Pack pin.
Ensure that Voltage Calibration has been performed for the pack. If Voltage Calibration is not performed,
then Pack Voltage Calibration calibrates incorrectly.
Remove load/external voltage applied between Pack+ and Pack–.
Click the Pack Voltage button to calibrate.
14
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Calibration Screen
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Figure 12. Calibration Screen
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Pro (Advanced) Screen
10
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Pro (Advanced) Screen
10.1 SMB Communication
The set of read/write operations over SMBus are not specific to any gas gauge. These are provided as
general-purpose communication tools.
10.2 Hex/Decimal Converter
The Hexadecimal Value and Decimal Value boxes convert between hexadecimal (hex) and decimal as
soon as values are typed into the boxes. Invalid values can cause erroneous results.
When scaling converted hex values to a higher number of bytes, follow these rules:
• When Unsigned is selected, the left pad contains zeroes.
• When Signed is selected, the left pad contains zeroes for a positive number, or the left pad contains F
for negative numbers.
10.3 Reprogramming
To
•
•
•
•
reprogram the device, do the following:
Ensure that the gauge is in Full Access mode.
Use the Write SMB Word feature to put the gauge into ROM mode (0x0F00 to cmd 0x00).
Use the Srec programming feature to browse for the desired .srec or .senc file then click the Program
button to start the transfer.
Use the SMB Command feature to send 0x08 to execute the program.
If the firmware version was updated, close and re-launch the EVSW to synchronize the tool with the new
firmware.
Figure 13. Pro (Advanced) Screen
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11
Related Documentation from Texas Instruments
For related documentation, contact the Texas Instruments field representative assigned to work with this
device.
Documents:
bq3050 SBS 1.1-Compliant Gas Gauge With Impedance
Track™ Data Sheet
bq3050 Technical Reference Manual
Literature Number:
SLUSA92
SLUU485
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Revision History
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Revision History
Changes from Original (November 2011) to A Revision ................................................................................................ Page
•
•
Changed Reprogramming section .................................................................................................... 16
Changed input voltage range .......................................................................................................... 19
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
18
Revision History
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EVALUATION BOARD/KIT IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES
ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have
electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete
in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental
measures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit does
not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling
(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER
AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all
appropriate precautions with regard to electrostatic discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY
INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or
services described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/or
safety programs, please contact the TI application engineer or visit www.ti.com/esh.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used.
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES
ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radio
frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are
designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may
be required to correct this interference.
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 5 V to 25 V and the output voltage range of 0 V to 16.4 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions
concerning the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.
Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than 60°C. The EVM is designed to operate
properly with certain components above 60°C as long as the input and output ranges are maintained. These components include but are
not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified
using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,
please be aware that these devices may be very warm to the touch.
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