BQ33100EVM-001

User's Guide SLUU466 – March 2011 bq33100 Super Capacitor Pack Manager EVM NOTE: BEFORE YOU START: Download the latest revision of the device firmware and the evaluation software from the TI bq33100 product page at www.ti.com. Go to the Tools and Software section. For step-by-step instructions on reprogramming the device firmware, refer to the application report SLUA336B. This evaluation module (EVM) is a complete evaluation system for the bq33100 super capacitor manager. The EVM includes one bq33100 circuit module. An EV2300 PC interface board for gas gauge interface and a PC USB cable are required for communication with a PC and can be ordered online. Windows™-based PC software is available online as well. The circuit module includes one bq33100 integrated circuit (IC), charging circuitry, and all other onboard components necessary to monitor and predict state of health, perform charging, perform cell balancing, monitor critical parameters, and protect the super capacitors from overvoltage, short-circuit, and overtemperature in 2-, 3-, 4-, or 5-series super capacitor stacks. The circuit module connects directly across the super capacitor stack. With the EV2300 interface board and software, the user can read the bq33100 data registers, program the chipset for different stack configurations, log cycling data for further evaluation, and evaluate the overall functionality of the bq33100 under different conditions. 1 2 3 4 5 6 7 8 9 10 11 Contents Features ...................................................................................................................... 2 bq33100-Based Circuit Module ........................................................................................... 2 bq33100 Circuit Module Schematic ...................................................................................... 3 Circuit Module Physical Layouts and Bill of Materials .................................................................. 3 EVM Hardware and Software Setup .................................................................................... 12 Troubleshooting Unexpected Dialog Boxes ............................................................................ 12 Hardware Connection ..................................................................................................... 12 Operation ................................................................................................................... 13 Calibration Screen ......................................................................................................... 16 Pro (Advanced) Screen ................................................................................................... 17 Stack Assembly and the bq33100 ....................................................................................... 19 List of Figures 1 2 3 4 5 6 7 8 9 10 11 12 ................................................................................. Top Assembly ............................................................................................................... Top Layer .................................................................................................................... Internal Layer 1 .............................................................................................................. Internal Layer 2 .............................................................................................................. Bottom Layer ................................................................................................................ Bottom Assembly ........................................................................................................... Schematic .................................................................................................................. bq33100 Circuit Module Connection to Cells, System Load, and System Power ................................ SBS Data Screen .......................................................................................................... Data Flash Screen, Safety Class ....................................................................................... Calibration Screen ......................................................................................................... bq33100EVM-001 Layout (Silk Screen) 4 4 5 5 6 6 7 11 13 14 15 17 Windows is a trademark of Microsoft. All other trademarks are the property of their respective owners. SLUU466 – March 2011 Submit Documentation Feedback bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated 1 Features www.ti.com 13 Pro (Advanced) Screen ................................................................................................... 18 14 Connection Sequence .................................................................................................... 19 List of Tables 1 1 Ordering Information ........................................................................................................ 2 2 Common Charging Voltage Configurations for 2-, 3-, 4-, and 5- Cell Monitors ..................................... 3 3 Bill of Materials .............................................................................................................. 8 4 Performance Specification Summary ................................................................................... 12 5 Circuit Module to EV2300 Connections Complete evaluation system for the bq33100 SBS 1.1-compliant super capacitor management IC Populated circuit module for quick setup PC software and interface board for easy evaluation Software that allows data logging for system analysis Kit Contents • • 1.2 13 Features • • • • 1.1 ................................................................................ bq33100 circuit module Set of support documentation Ordering Information Table 1. Ordering Information 2 EVM PART NUMBER CHEMISTRY CONFIGURATION CAPACITY bq33100EVM-001 Super Capacitor 2, 3, 4, or 5 cell Any bq33100-Based Circuit Module The bq33100-based circuit module is a complete and compact example solution of a bq33100 circuit for super capacitor management and protection. The circuit module incorporates a bq33100 battery monitor IC, charging circuitry and all other components necessary to accurately predict the capacity of 2-, 3-, 4-, or 5-series cells. 2.1 Circuit Module Connections Contacts on the circuit module provide the following connections: • Direct connection to the cells: 1N, 1P, 2P, 3P, 4P, 5P • To the serial communications port (SMBC, SMBD) • The system load across CAPOUT and VSS • The system power across System PWR and System GND • To the fault pin (FAULT) 2 PIN NAME DESCRIPTION 1N -ve connection of first (bottom) cap 1P +ve connection of first (bottom) cap 2P +ve connection of second cap 3P +ve connection of third cap 4P +ve connection of fourth cap 5P +ve connection of fifth (top) cap SMBC Serial communication clock port SMBD Serial communication data port bq33100 Super Capacitor Pack Manager EVM SLUU466 – March 2011 Submit Documentation Feedback © 2011, Texas Instruments Incorporated bq33100 Circuit Module Schematic www.ti.com PIN NAME 3 DESCRIPTION CAPOUT System load positive terminal VSS System load negative terminal System PWR System power positive terminal System GND System power negative terminal FAULT Fault indicator pin bq33100 Circuit Module Schematic This section contains information to consider when changing the cell configuration. 3.1 Schematic The schematic follows the bill of materials in this user's guide. 3.1.1 Modifications for Changing the Cell Configuration The bq33100 charger provides the option for changing the 4 voltage levels for various cell configurations. The default configuration assumes a 5-cell configuration. An adjustment to these voltages will need to be made for 2-, 3-, or 4- cell configurations. Adjusting the charging levels requires changing out R5, R6, and R7. See Table 2 for common 2-, 3-, 4-, and 5- cell configurations. Table 2. Common Charging Voltage Configurations for 2-, 3-, 4-, and 5- Cell Monitors 2-Cell 3-Cell 4-Cell 5-Cell R4 30kΩ 30kΩ 30kΩ 30kΩ R5 137kΩ 93.1kΩ 68.1kΩ 57.6kΩ R6 300kΩ 187kΩ 150kΩ 125kΩ R7 44.2kΩ 19.6kΩ 12.7kΩ 9.31kΩ Another modification to consider is to R26. This resistor is used to dissipate extra power in the learn load circuit. For 4- and 5-cell configurations the resistor should be 7.5 Ω, 2 W. For 2- and 3-cell configurations, R26 should be removed. 4 Circuit Module Physical Layouts and Bill of Materials This section contains the board layout, bill of materials, and assembly drawings for the bq33100 circuit module. 4.1 Board Layout This section shows the dimensions, PCB layers (Figure 1 through Figure 7), and assembly drawing for the bq33100 module. SLUU466 – March 2011 Submit Documentation Feedback bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated 3 Circuit Module Physical Layouts and Bill of Materials www.ti.com Figure 1. bq33100EVM-001 Layout (Silk Screen) Figure 2. Top Assembly 4 bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated SLUU466 – March 2011 Submit Documentation Feedback www.ti.com Circuit Module Physical Layouts and Bill of Materials Figure 3. Top Layer Figure 4. Internal Layer 1 SLUU466 – March 2011 Submit Documentation Feedback bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated 5 Circuit Module Physical Layouts and Bill of Materials www.ti.com Figure 5. Internal Layer 2 Figure 6. Bottom Layer 6 bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated SLUU466 – March 2011 Submit Documentation Feedback www.ti.com Circuit Module Physical Layouts and Bill of Materials Figure 7. Bottom Assembly SLUU466 – March 2011 Submit Documentation Feedback bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated 7 Circuit Module Physical Layouts and Bill of Materials 4.2 www.ti.com Bill of Materials and Schematic Table 3. Bill of Materials COUNT RefDes Value Description SIZE Part Number Mfr 9 C1, C2, C3, C4, C6, C7, C8, C11, C15 0.1 µF Capacitor, Ceramic, 50V, X7R, 20% 0603 STD Any 3 C12, C13, C14 100 pF Capacitor, Ceramic, 50V, X7R, 10% 0603 STD Any 3 C5, C9, C10 1.0 µF Capacitor, Ceramic, 25V, X7R, 20% 0805 STD Any 2 D1, D2 TL431CPK IC, Adjustable precision shunt regulator SOT-89 TL431CPK TI 2 D3, D4 S1A-13-F Diode, Glass Passivated Rect. 1A, 50V SMA S1A-13-F Diodes 1 J1 22-05-3041 Header, Friction Lock Ass'y, 4-pin Right Angle 0.400 x 0.500 22-05-3041 Molex 2 Q1, Q7 2SD1758TLR Transistor, NPN Medium Power, 32V, 2A SC-63 2SD1758TLR Rohm 2 Q2, Q3 2SK3019 MOSFET, Nch, 30V, 100mA, 8 Ohm SC-75A 2SK3019 Rohm 2 Q4, Q5 Si1023X MOSFET, Pch, -20V, 350mA, 1.2 Ohm SC-89 Si1023X-T1-E3 Vishay 1 Q6 Si4435DDY MOSFET, Pch, 30V, 8.0A, 20 milliohm SOT23 Si4435DDY-T1-E3 Vishay 1 Q8 ZXMN3A14FTA MOSFET, Nch, 30V, 3.2A, 65 milliOhm SOT23 ZXMN3A14FTA Diodes/Zetex 1 Q9 BSS223PW MOSFET, Pch, -20V, -0.39A, 1.2 Ohm SOT323 BSS223PW Infineon 5 R1, R8, R9, R10, R11 1K Resistor, Chip, 1/16W, 5% 0603 STD Any 5 R12, R13, 100 R21, R23, R25 Resistor, Chip, 1/16W, 5% 0603 STD Any 5 R14, R15, 100 R16, R17, R31 Resistor, Chip, 1/4W, 5% 1206 CRCW1206100RJNEA Vishay 1 R18 .020 75ppm Resistor, Chip, 1/2W, 1%, 75ppm 2010 WSL2010R0200FEA Dale 1 R19 3M Resistor, Chip, 1/16W, 5% 0603 STD Any 2 R2, R3 10 Resistor, Chip, 1W, 1% 2010 CRCW201010R0FKEFHP Vishay/Dale 3 R20, R22, R24 200 Resistor, Chip, 1/16W, 5% 0603 STD Any 1 R26 7.5 Resistor, Chip, 2W, 1% 2512 RHC2512FT7R50 Stackpole 2 R27, R28 8.2 Resistor, Chip, 1W, 1% 2512 ERJ-1TRQF8R2U Panasonic - ECG 0 R29 DNP Resistor, Chip, 1/16W, 5% 0603 STD Any 1 R30 20K Resistor, Chip, 1/16W, 5% 0603 STD Any 1 R32 20K Resistor, Chip, 1/16W, 1% 0603 STD Any 1 R33 10K Resistor, Chip, 1/16W, 1% 0603 STD Any 1 R4 30.0K Resistor, Chip, 1/16W, 1% 0402 STD Any 1 R5 57.6K Resistor, Chip, 1/16W, 1% 0402 STD Any 1 R6 124K Resistor, Chip, 1/16W, 1% 0402 STD Any 1 R7 9.31K Resistor, Chip, 1/16W, 1% 0402 STD Any 8 bq33100 Super Capacitor Pack Manager EVM SLUU466 – March 2011 Submit Documentation Feedback © 2011, Texas Instruments Incorporated Circuit Module Physical Layouts and Bill of Materials www.ti.com Table 3. Bill of Materials (continued) COUNT RefDes Value Description SIZE Part Number Mfr 1 RT1 10K Thermistor, 10K Ohm 0.095 x 0.150 inches 103AT-2 Semitec 4 TB1, TB2, TB3, TB4 ED555/3DS Terminal Block, 3-pin, 6A, 3.5mm 0.41 x 0.25 inch ED555/3DS OST 1 TP1 CHG+ Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone 1 TP2 CHG- Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone 1 TP3 CHGFET Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone 1 TP4 2.7V Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone 1 TP5 GND Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone 1 U1 BQ33100PW IC, SUPERCAP PACKMANAGER and PROTECTION TSSOP-24 BQ33100PW TI 1 – PCB 2 x 3 inches HPA681 Any Connector 2 J1 mate Connector, Female, 0.100 Centers Molex 22-01-3047 8 N/A Terminals, Crimp, Tin Molex 08-50-0114 1 N/A Wire, Insulated 24 Awg, Red, 18 Inches (+/- 3 inches)(USB_5V) Alpha 1854-3 1 N/A Wire, Insulated 24 Awg, White, 18 Inches (+/- 3 inches)(SCL) Alpha 1854-1 1 N/A Wire, Insulated 24 Awg, Black, 18 Inches (+/- 3 inches)(GND) Alpha 1854-2 1 N/A Wire, Insulated 24 Awg, Brown, 18 Inches (+/- 3 inches) (SDA) Alpha 1854-7 1 N/A Heatshrink 1" Any Any SLUU466 – March 2011 Submit Documentation Feedback bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated 9 Circuit Module Physical Layouts and Bill of Materials www.ti.com Table 3. Bill of Materials (continued) COUNT RefDes Value Description SIZE Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed. Part Number Mfr 2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable. 3. These assemblies must comply with workmanship standards IPC-A-610 Class 2. 4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components. 5. Make one SMBus connector wire assembly for each assembly produced, from J1 mate, 4 - 24 Awg wires and Crimp terminals. Wire colors for Pin numbers are listed below. The wire assembly shall have a J1 mate on each end. Red - Pin # 4 (Signal USB_5V) Brown - Pin # 3 (Signal SDA) White - Pin # 2 (Signal SCL) Black - Pin # 1 (GND) 6. RT1 should be assembled horizontally laying flat against the board Edge. 10 bq33100 Super Capacitor Pack Manager EVM SLUU466 – March 2011 Submit Documentation Feedback © 2011, Texas Instruments Incorporated Circuit Module Physical Layouts and Bill of Materials www.ti.com Figure 8. Schematic SLUU466 – March 2011 Submit Documentation Feedback bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated 11 EVM Hardware and Software Setup 4.3 www.ti.com bq33100 Circuit Module Performance Specification Summary Table 4. Performance Specification Summary Specification 5 Minimum Typical Maximum Units Input Voltage System PWR to System GND 6 12 15 V Discharge current 0 2 7 A EVM Hardware and Software Setup This section describes how to install the bq33100EVM-001 PC software, and how to connect the different components of the EVM. 5.1 System Requirements The bq33100EVSW software requires Windows™ 2000 or Windows XP™. Drivers for Windows 98SE are provided, but Microsoft™ no longer supports Windows 98 and there may be issues in Windows 98 with USB driver support. The EV2300 USB drivers have been tested for Windows 98SE, but no assurance is made for problem-free operation with specific system configurations. 5.2 Software Installation Get the latest software version in the bq33100 tool folder on www.ti.com, and follow these steps to install the bq33100 EVSW software: 1. Save the archive to a temporary directory. Open the archive containing the installation package, and copy its contents to a temporary directory. The executable filename can consist of several component names and versions. Double-click on the executable filename, and follow the installer instructions to complete the bq33100 EVM installation. 2. If the EV2300 was not previously installed, after bq33100 EVM installation, a TI USB DRIVER INSTALLER pops up. Click "Yes" for the agreement message and follow its instructions. 3. Plug the EV2300 into a USB port. 6 Troubleshooting Unexpected Dialog Boxes Ensure that the files were extracted from the zip file using the Preserve Folder names option. Ensure that all the files were extracted from the zip file. The user that is downloading the files must be logged in as the administrator. The driver is not signed, so the administrator must allow installation of unsigned drivers in the operating system policy. 7 Hardware Connection The bq33100EVM-001 comprises three hardware components: the bq33100 circuit module, the EV2300 PC interface board, and the PC. 7.1 Connecting bq33100 Circuit Module to Super Capacitor Stack Figure 9 shows how to connect the bq33100 circuit module to the super capacitors, system load, and system power. The super capacitors should be connected in the following order: 1. 5-Cell Pack: 1N, 1P, 2P, 3P, 4P, and 5P (see Section 2.1 for definitions). 2. 4-Cell Pack: 1N and 1P are connected together, 2P, 3P, 4P, and 5P. 3. 3-Cell Pack: 1N and 1P are connected together, 2P, 3P, and then connect 4P and 5P together. 4. 2-Cell Pack: 1N and 1P are connected together, 2P, and then connect 3P, 4P and 5P together. 12 bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated SLUU466 – March 2011 Submit Documentation Feedback Operation www.ti.com Connect the system load between the CAPOUT and VSS terminals. Connect the system power between the System PWR and System GND terminals. System Power - + System PWR Fault VSS System GND 5P 4P TB2 3P 2P 1P TB3 1N + CAPOUT TB4 TB1 - HPA681 J1 SMBus Cable System Load SMB EV2300 Figure 9. bq33100 Circuit Module Connection to Cells, System Load, and System Power 7.2 PC Interface Connection The following steps configure the hardware for interface to the PC: 1. Connect the bq33100 circuit module to the EV2300 using wire leads as shown in Table 5. Table 5. Circuit Module to EV2300 Connections bq33100 Circuit Module EV2300 SMBD SMBD SMBC SMBC VSS GND 2. Connect the PC USB cable to the EV2300 and the PC USB port. The bq33100EVM-001 is now set up for operation. 8 Operation This section details the operation of the bq33100 EVSW software. 8.1 Starting the Program Run bq Evaluation Software from the Start | Programs | Texas Instruments | bq33100 EVSW menu sequence. The SBS Data screen (Figure 10) appears. Data begins to appear once the (single time scan) button is clicked, or when the check box is checked. To disable the scan feature, deselect . The continuous scanning period can be set via the | Options | and | Set Scan Interval | menu selections. The range for this interval is 0 ms to 65535 ms. Only items that are selected for scanning are scanned within this period. The bq Evaluation Software provides a logging function which logs the values that were last scanned by EVSW. To enable this function, select the Start Logging button, this causes the Keep Scanning button to be selected. When logging is Stopped, the keep scanning button is still selected and has to be manually unchecked. SLUU466 – March 2011 Submit Documentation Feedback bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated 13 Operation www.ti.com The logging intervals are specified under the | Options | menu with the maximum value of 65535 ms. The Log interval cannot be smaller than the Scan interval because this results in the same value being logged at least twice. Figure 10. SBS Data Screen This screen (Figure 10) shows the SBS data set along with additional ManufacturersAccess() command information such as individual cell measurements. Additional Flag and Static data can be viewed by selecting the appropriate tab at the bottom of the SBS screen. Data such as SBS.ManufacturerName( ) is static and does not change. This data is viewed separately using the Static Data tab available at the bottom of the screen. Dragging the splitter bar (line that separates the Flags/Static data from SBS values) changes the height of the Flags/Static Data display. Selecting | View |, then | Auto Arrange | returns the splitter bar to its original location. 14 bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated SLUU466 – March 2011 Submit Documentation Feedback Operation www.ti.com 8.2 Setting Programmable bq33100 Options The bq33100 data flash comes configured per the default settings detailed in the bq33100 data sheet. Ensure that the settings are correctly changed to match the capacitor stack and application for the bq33100 solution being evaluated. IMPORTANT: The correct setting of these options is essential to get the best performance. The settings can be configured using the Data Flash screen (Figure 11). Figure 11. Data Flash Screen, Safety Class To read all the data from the bq33100 data flash, click on menu option | Data Flash | Read All |. To write to a data flash location, click on the desired location, enter the data and press , which writes the entire tab of flash data, or select menu option | Data Flash | Write All |. The data flash must be read before any writes are performed to avoid any incorrect data being written to the device. The | File | Special Export | menu options allows the data flash to be exported, but it configures the exported data flash to a learned state ready for mass production use. The data flash configuration can be saved to a file by selecting | File | Export | and entering a file name. A data flash file also can be retrieved in this way, imported, and written to the bq33100 using the | Write All | button. SLUU466 – March 2011 Submit Documentation Feedback bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated 15 Calibration Screen www.ti.com The configuration information of the bq33100 and module calibration data also is held in the bq33100 data flash. The bq33100 allows for an automatic data flash export function, similar to the SBS Data logging function. This feature, when selected via | Options | Auto Export |, exports Data Flash to a sequential series of files named as FilenameNNNNN.gg where N = a decimal number from 0 to 9. The AutoExport interval is set under the | Options menu | with a minimum value of 15 s. The AutoExport filename also is set under the | Options menu |. When a check mark is next to | AutoExport |, the AutoExport is in progress. The same menu selection is used to turn on / off AutoExport. If the data flash screen is blank, then the bq33100 that is being used may not be supported by the bqEVSW version that is being used. An upgrade may be required. 9 Calibration Screen 9.1 How to Calibrate Before the bq33100 is calibrated: • Connect 12V to System PWR and System GND inputs • Connect a load to CAPOUT and VSS that draws approximately 0.5 A and measures discharge current to use the FET, or • Connect a current source to 1N and VSS to calibrate without using the FET. • Measure individual cell stack voltage from 1N, to Cap1(1P), Cap1 + 2(2P), Cap1 + 2 + 3(3P), Cap1 + 2 + 3 + 4(4P), Cap1 + 2 + 3 + 4 + 5(5P). • Measure the voltage from the System PWR to System GND inputs • Measure the temperature of the pack. These steps may not be required, depending on the type of calibration being performed. Note that voltage calibration with capacitors attached requires special consideration. Capacitors must be in a resting state. 9.2 To Calibrate the bq33100 Select the types of calibration to be performed (see Figure 12). Enter the measured values for the types selected. If Capacitor Stack Voltage Calibration is selected, then enter the capacitor voltages. If the load is connected between CAPOUT and VSS-, then select the On (External Load) radio button. Press the Calibrate Part button. 9.3 System Voltage Calibration This calibrates the voltage at the VCC pin. Make sure Capacitor Stack Voltage Calibration has been performed for the pack. If Capacitor Stack Voltage Calibration is not performed, then System Voltage Calibration calibrates incorrectly. Remove load/external voltage applied between CAPOUT and VSS. Check the System Voltage Calibration box, and enter the measured System PWR voltage Press the Calibrate device as indicated below button to calibrate. 16 bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated SLUU466 – March 2011 Submit Documentation Feedback Pro (Advanced) Screen www.ti.com Figure 12. Calibration Screen 10 Pro (Advanced) Screen 10.1 SMB Communication The set of read/write operations over SMBus are not specific to any gas gauge. These are provided as general-purpose communication tools (Figure 13). 10.2 Hexadecimal/Decimal Converter These two boxes convert between hexadecimal and decimal as soon as values are typed into the boxes. Invalid values may cause erroneous results. When scaling converted hexadecimal values to a higher number of bytes, follow these rules: • When unsigned is selected, the left pad contains zeroes. • When signed is selected, the left pad contains zeroes for a positive number, or the left pad contains F for negative numbers. SLUU466 – March 2011 Submit Documentation Feedback bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated 17 Pro (Advanced) Screen www.ti.com 10.3 Programming This screen allows device reprogramming from unencrypted and encrypted files. Figure 13. Pro (Advanced) Screen 18 bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated SLUU466 – March 2011 Submit Documentation Feedback Stack Assembly and the bq33100 www.ti.com 11 Stack Assembly and the bq33100 This section describes a recommended assembly sequence for a bq33100-based super capacitor stack. This procedure results in the most time-efficient setup of the super capacitor stack. Following are the steps for connecting a 5-series capacitor stack to the bq33100EVM board. 5P 4P + - CAP 5 3P + - CAP 4 2P + - CAP 3 1P + - 1N + CAP 2 - EVM Connector Capacitor Stack CAP 1 Figure 14. Connection Sequence 1. Connect the most negative terminal (– terminal of cap 1) of the serially-connected, 5-capacitor stack to the 1N PIN of the TB2–TB3 connector as shown in Figure 14. (See also Figure 9 for TB2–TB3 location). 2. Connect the positive terminal of cell 1 to 1P. 3. Connect the positive terminal of cell 2 to 2P. 4. Connect the positive terminal of cell 3 to 3P. 5. Connect the positive terminal of cell 4 to 4P. 6. Connect the positive terminal of the capacitor stack (+) to 5P. 7. Connect external power (from 6 V to 15 V) to the System PWR and System GND terminals to wake up the EVM from shutdown mode. 8. Connect the SMBus connector (J1) to the EV2300 adapter and start the EV software. 9. Navigate to the Flash Screen. Change the flash constants that correspond to the specific parameters of your application (see the data sheet). For the first evaluation, the default values may be used. 10. Navigate to the Calibration screen. Select the check-box for software voltage calibration near Measured voltage field. Measure between 1P and 1N for capacitor 1, 2P and 1N for capacitors 1 + 2, 3P and 1N for capacitors 1 + 2 + 3, 4P and 1N for capacitors 1 + 2 + 3 + 4, 5P and 1N for capacitors 1 + 2 + 3 + 4 + 5 and enter the values into the Enter actual voltage field. Click the calibrate part button. 11. Now the pack is ready and charge/discharge tests can be conducted. SLUU466 – March 2011 Submit Documentation Feedback bq33100 Super Capacitor Pack Manager EVM © 2011, Texas Instruments Incorporated 19 Evaluation Board/Kit Important Notice Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards. 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No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. FCC Warning This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. EVM Warnings and Restrictions It is important to operate this EVM within the input voltage range of 6 V to 15 V and the output voltage range of 0 V to 16.4 V . Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions concerning the input range, please contact a TI field representative prior to connecting the input power. Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C. The EVM is designed to operate properly with certain components above 60°C as long as the input and output ranges are maintained. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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