BQ35100PWR

Product Folder Order Now Support & Community Tools & Software Technical Documents BQ35100 SLUSCM6E – JUNE 2016 – REVISED APRIL 2019 BQ35100 Lithium Primary Battery Fuel Gauge and End-Of-Service Monitor 1 Features 3 Description • The BQ35100 Battery Fuel Gauge and End-OfService Monitor provides highly configurable fuel gauging for non-rechargeable (primary) lithium batteries without requiring a forced discharge of the battery. Built so that optimization is not necessary to achieve accurate gauging, the BQ35100 device uses patented TI gauging algorithms to support the option to seamlessly replace an old battery with a new one. 1 • • Fuel gauge and battery diagnostics for flow meter applications predict end-of-service or early battery failure – Supports lithium thionyl chloride (Li-SOCl2) and lithium manganese dioxide (Li-MnO2) chemistry batteries – Accurate voltage, temperature, current, and coulomb counter measurements that report battery health and service life – State-of-health (SOH) algorithm for Li-MnO2 – End-of-service (EOS algorithm for Li-SOCl2) – Coulomb accumulation (ACC) algorithm for all battery types Ultra-low average power consumption to maximize battery run time – Gauge enabled through host-controlled periodic updates – State-of-health (SOH) ~0.06 µA – End-of-service (EOS) ~0.35 µA – Coulomb accumulation (ACC) diagnostic updates ~0.3 µA System interaction capabilities – I2C host communication, providing battery parameter and status access – Configurable host interrupt – Battery information data logging options for in operation diagnostics and failure analysis – SHA-1 authentication to help prevent counterfeit battery use The BQ35100 device provides accurate results with ultra-low average power consumption where less than 2 µA can be achieved through host control via the GAUGE ENABLE (GE) pin. The device is only required to be powered long enough, at a systemdetermined update frequency, to gather data and to make calculations to support the selected algorithm. A typical system may need to only be updated once every 8 hours as the gauge is not required to be powered to measure all discharge activity. The fuel gauging functions use voltage, current, and temperature measurements to provide state-of-health (SOH) data and end-of-service (EOS) warning information where the host can read the gathered data through a 400-kHz I2C bus. An ALERT output, based on a variety of configurable status and data options, is also available to interrupt the host. Device Information(1) PART NUMBER PACKAGE BQ35100 TSSOP (14) BODY SIZE (NOM) 5.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic BAT+ 2 Applications • • • Used in primary battery systems and suitable for dynamic load and large ambient temperature change applications – Smart meters and flow meters – Door access control – Smoke and gas leak detectors – Building automation – IoT, including sensor nodes – Asset tracking Battery status reporting and diagnostics with early failure detection for flow meter systems Extends battery runtime with accurate battery gauging for smoke detector, sensor node, and asset tracker applications REGIN I2C CLK 10 k 10 k I2C DATA REG25 ALERT 1 VIN 100k 100 SDA 14 2 ALERT SCL 13 3 NC VEN 12 REG 25 10k NTC 4 BAT GAUGE ENABLE TS 11 0.1 µF REGIN VSUPPLY 1 M REG25 1 µF 5 GE SRN 10 6 REGIN SRP 9 7 REG25 VSS 8 0.1 µF 0.1 µF 100 0.1 75 ppm 100 0.1 µF 1 µF PACK– Copyright © 2017, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. BQ35100 SLUSCM6E – JUNE 2016 – REVISED APRIL 2019 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 6.11 6.12 6.13 6.14 6.15 1 1 1 2 4 5 Absolute Maximum Ratings ...................................... 5 ESD Ratings.............................................................. 5 Recommended Operating Conditions....................... 5 Thermal Information .................................................. 6 Power Supply Current Static Modes ......................... 6 Digital Input and Outputs ......................................... 6 Power-On Reset........................................................ 7 LDO Regulator .......................................................... 7 Internal Temperature Sensor .................................... 7 Internal Clock Oscillators ....................................... 7 Integrating ADC (Coulomb Counter)....................... 7 ADC (Temperature and Voltage Measurements) ... 8 Data Flash Memory................................................. 8 I2C-Compatible Interface Timing Characteristics .... 8 Typical Characteristics ........................................... 9 7 Detailed Description ............................................ 10 7.1 7.2 7.3 7.4 8 Overview ................................................................. Functional Block Diagram ...................................... Feature Description................................................. Device Functional Modes........................................ 10 10 10 15 Application and Implementation ........................ 17 8.1 Application Information .......................................... 17 8.2 Typical Applications ................................................ 17 9 Power Supply Recommendations...................... 21 10 Layout................................................................... 22 10.1 Layout Guidelines ................................................. 22 10.2 Layout Example .................................................... 22 10.3 ESD Spark Gap .................................................... 24 11 Device and Documentation Support ................. 25 11.1 11.2 11.3 11.4 11.5 11.6 Documentation Support ........................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 25 25 25 25 25 25 12 Mechanical, Packaging, and Orderable Information ........................................................... 25 4 Revision History Changes from Revision D (May 2018) to Revision E • Page Corrected a typo in Features ................................................................................................................................................. 1 Changes from Revision C (September 2017) to Revision D Page • Added further information to Features and Applications ........................................................................................................ 1 • Changed Recommended Operating Conditions .................................................................................................................... 5 • Added Power Supply Current Static Modes ........................................................................................................................... 6 • Changed Basic Measurement Systems ............................................................................................................................... 10 • Changed Device Functional Modes ..................................................................................................................................... 15 • Added EOS Mode Load Pulse Synchronization................................................................................................................... 20 • Added Benefits of the bq35100 Gauge Compared to Alternative Monitoring Techniques .................................................. 20 Changes from Revision B (September 2016) to Revision C Page • Changed Features, Applications, and Description ................................................................................................................ 1 • Added Preparation for Gauging ........................................................................................................................................... 18 • Changed Detailed Design Procedure .................................................................................................................................. 18 • Added Using the bq35100 with a Battery and Capacitor in Parallel ................................................................................... 20 2 Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: BQ35100 BQ35100 www.ti.com SLUSCM6E – JUNE 2016 – REVISED APRIL 2019 Changes from Revision A (July 2016) to Revision B Page • Changed Device Information ................................................................................................................................................. 1 • Changed Specifications ......................................................................................................................................................... 5 • Changed Application Curves ............................................................................................................................................... 21 • Changed VCC to VREG25 in Layout Guidelines ...................................................................................................................... 22 • Changed VCC to VREG25 in Board Offset Considerations ..................................................................................................... 23 Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: BQ35100 3 BQ35100 SLUSCM6E – JUNE 2016 – REVISED APRIL 2019 www.ti.com 5 Pin Configuration and Functions TSSOP (PW) Package 14-Pin Top View VIN 1 14 SDA ALERT 2 13 SCL NC 3 12 VEN BAT 4 11 TS GE 5 10 SRN REGIN 6 9 SRP REG25 7 8 V SS Not to scale Pin Functions (1) 4 NUMBER NAME I/O 1 VIN AI (1) DESCRIPTION 2 ALERT O Active low interrupt open-drain output. Requires an external pullup 3 NC — Not used and should be connected to VSS. 4 BAT P Voltage measurement input and can be left floating or tied to VSS if not used. 5 GE I Gauge enable. Internal LDO is disconnected from REGIN when driven low. 6 REGIN P Internal integrated LDO input. Decouple with 0.1-µF ceramic capacitor to VSS. 7 REG25 P 2.5-V output voltage of the internal integrated LDO. Decouple with 1-µF ceramic capacitor VSS. 8 VSS P Device ground 9 SRP I Analog input pin connected to the internal coulomb-counter peripheral for integrating a small voltage between SRP and SRN where SRP is nearest the BAT– connection. 10 SRN I Analog input pin connected to the internal coulomb-counter peripheral for integrating a small voltage between SRP and SRN where SRN is nearest the PACK– connection. Optional voltage measurement input 11 TS I Pack thermistor voltage sense (use 103AT-type thermistor) 12 VEN O Optional open-drain external voltage divider control output 13 SCL I Slave I2C serial communication clock input. Use with a 10-K pullup resistor (typical). 14 SDA I/O Open-drain slave I2C serial communication data line. Use with a 10-kΩ pullup resistor (typical). P = Power Connection, O = Digital Output, AI = Analog Input, I = Digital Input, I/OD = Digital Input/Output Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: BQ35100 BQ35100 www.ti.com SLUSCM6E – JUNE 2016 – REVISED APRIL 2019 6 Specifications 6.1 Absolute Maximum Ratings Over-operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VREGIN Regulator Input Range –0.3 5.5 V VREG25 Supply Voltage Range –0.3 2.75 V Open-drain I/O pins (SDA, SCL, VEN) –0.3 5.5 V Open-drain I/O pins (ALERT) –0.3 2.75 V VBAT BAT Input Pin –0.3 5.5 V VI Input voltage range (SRN, SRP, TS) –0.3 VREG25 + 0.3 V TA Operating free-air temperature range –40 85 °C TF Functional Temperature Range –40 100 °C Storage temperature range –65 150 °C Lead temperature (soldering, 10 s) –40 100 °C VIOD TSTG (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) Electrostatic discharge Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001 (1), BAT pin ±1500 Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001 (1), all other pins ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (1) (2) (2) UNIT V ±500 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions TA =–40°C to 85°C; Typical Values at TA = 25°C CLDO25 = 1.0 μF, and VREGIN = 3.6 V (unless otherwise noted) MIN VREGIN CREGIN CLDO25 Supply Voltage No operating restrictions No FLASH writes External input capacitor for internal LDO between REGIN and Nominal capacitor values specified. VSS Recommend a 10% ceramic X5R type capacitor located close to the device. External output capacitor for internal LDO between VREG25 NOM MAX UNIT 2.7 4.5 V 2.45 2.7 V 0.47 0.1 µF 1 µF 0.05 µA 0.3 µA ICC_GELOW (1) Gas gauge in Disabled mode ICC_ACC_AVE (1) Gas gauge in ACCUMULATOR mode Update every 30 minutes otherwise GE = Low average current ICC_SOH_AVE (1) State-of-health average Update every 8 hours otherwise GE = Low current 0.06 µA ICC_EOS_AVE (1) End-of-service average Update every 8 hours 3- s Load Pulse current otherwise GE = Low 0.35 µA VA1 Input voltage range (VIN, TS) VSS – 0.05 1 V VA2 Input voltage range (BAT) VSS – 0.125 5.0 V (1) GE = Low Not production tested Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: BQ35100 5 BQ35100 SLUSCM6E – JUNE 2016 – REVISED APRIL 2019 www.ti.com Recommended Operating Conditions (continued) TA =–40°C to 85°C; Typical Values at TA = 25°C CLDO25 = 1.0 μF, and VREGIN = 3.6 V (unless otherwise noted) MIN VA3 Input voltage range (SRP, SRN) ILKG Input leakage current (I/O pins) tPUCD Power-up communication NOM VSS – 0.125 MAX UNIT 0.125 V 0.3 µA 250 ms 6.4 Thermal Information BQ35100 THERMAL METRIC (1) TSSOP (PW) UNIT 14 PINS RθJA, High K Junction-to-ambient thermal resistance 103.8 °C/W RθJC(top) Junction-to-case(top) thermal resistance 31.9 °C/W RθJB Junction-to-board thermal resistance 46.6 °C/W ψJT Junction-to-top characterization parameter 2.0 °C/W ψJB Junction-to-board characterization parameter 45.9 °C/W RθJC(bottom) Junction-to-case(bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Power Supply Current Static Modes over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ICC_ACCU (1) Gas gauge in ACCUMULATOR mode GE = High AND GaugeStart() received and GaugeStop() not Received (GMSEL1,0 = 0,0) 130 µA ICC_SOH (1) State-of-health operating current GE = High AND GaugeStart() received and GaugeStop() not Received (GMSEL1,0 = 0,1) 40 µA ICC_EOS_Burst (1) End-of-service operating current—data burst GE = High AND GaugeStart() received and GaugeStop() not Received (GMSEL1,0 = 1,0) 315 µA ICC_EOS_Gather (1) End-of-service operating current—data gathering GE = High AND GaugeStart() AND GaugeStop() Received (GMSEL1,0 = 1,0) 75 µA ICC_GELOW (1) Device Disabled GE = LOW 0.05 µA (1) Not production tested 6.6 Digital Input and Outputs PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOL Output voltage low (SDA, SCL, VEN) IOL = 3 mA VOH(PP) Output high voltage IOH = –1 mA VREG25 – 0.5 V VOH(OD) Output high voltage (SDA, SCL, VEN, ALERT) External pullup resistor connected to VREG25 VREG25 – 0.5 V VIL Input voltage low (SDA, SCL) –0.3 0.6 V VIH Input voltage high (SDA, SCL) 1.2 5.5 V VIL(GE) GE Low-level input voltage VIH(GE) GE High-level input voltage Ilkg Input leakage current (I/O pins) 6 VREGIN = 2.8 to 4.5 V 0.4 0.8 2.65 0.3 Submit Documentation Feedback V V μA Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: BQ35100 BQ35100 www.ti.com SLUSCM6E – JUNE 2016 – REVISED APRIL 2019 6.7 Power-On Reset TA = –40°C to 85°C; Typical Values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted) PARAMETER VIT+ Positive-going battery voltage input at REG25 VHYS Power-on reset hysteresis TEST CONDITIONS MIN TYP MAX UNIT 2.05 2.20 2.31 V 115 mV 6.8 LDO Regulator TA = 25°C, CLDO25 = 1.0 μF, VREGIN = 3.6 V (unless otherwise noted) (1) PARAMETER VREG25 ISHORT (2) (1) (2) Regulator output voltage Short circuit current limit TEST CONDITIONS MIN TYP MAX 2.7 V ≤ VREGIN ≤ 4.5 V, IOUT ≤ 16 mA TA = –40°C to 85°C 2.3 2.5 2.7 2.45 V ≤ VREGIN < 2.7 V, IOUT ≤ 3 mA TA = –40°C to 85°C 2.3 UNIT V VREG25 = 0 V TA = –40°C to 85°C 250 mA LDO output current, IOUT, is the sum of internal and external load currents. Specified by design. Not production tested. 6.9 Internal Temperature Sensor TA = –40°C to 85°C, 2.4 V < REG25 < 2.6 V; Typical Values at TA = 25°C and REG25 = 2.5 V (unless otherwise noted) PARAMETER GTEMP TEST CONDITIONS MIN Internal temperature sensor voltage gain TYP MAX –2 UNIT mV/°C 6.10 Internal Clock Oscillators TA = –40°C to 85°C, 2.4 V < REG25 < 2.6 V; Typical Values at TA = 25°C and REG25 = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT f(LOSC) Operating frequency 32.768 kHz f(OSC) Operating frequency 2.097 MHz t(SXO) Start-up time (1) (1) 2.5 5 ms The startup time is defined as the time it takes for the oscillator output frequency to be ±3%. 6.11 Integrating ADC (Coulomb Counter) TA = –40°C to 85°C, 2.4 V < REG25 < 2.6 V; Typical Values at TA = 25°C and REG25 = 2.5 V (unless otherwise noted) PARAMETER V(SR) tSR_CONV Input voltage range, V(SRN) and V(SRP) V(SR) = V(SRN) – V(SRP) Conversion time Single conversion Resolution VOS(SR) Input offset INL Integral nonlinearity error ZIN(SR) Effective input resistance (2) ILKG(SR) Input leakage current (2) (1) (2) TEST CONDITIONS MIN TYP –0.125 MAX UNIT 0.125 V 1 14 s 15 10 bits µV FSR (1) ±0.007% 2.5 MΩ 0.3 µA Full-scale reference Specified by design. Not tested in production. Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: BQ35100 7 BQ35100 SLUSCM6E – JUNE 2016 – REVISED APRIL 2019 www.ti.com 6.12 ADC (Temperature and Voltage Measurements) TA = –40°C to 85°C, 2.4 V < REG25 < 2.6 V; Typical Values at TA = 25°C and REG25 = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX VIN(BAT) BAT Input range VSS – 0.125 5 VIN(TSAT) TS Input range VSS – 0.125 VREG25 tSR_CONV Conversion time Resolution Input offset ZADC1 Effective input resistance(TS) (1) ZADC2 Effective input resistance(BAT) (1) ILKG(ADC) Input leakage current (1) V V 125 14 VOS(SR) (1) Single conversion UNIT ms 15 bits 1 With internal pull-down activated 5 When not measuring 8 During measurement µV kΩ MΩ 100 kΩ 0.3 µA Specified by design. Not tested in production. 6.13 Data Flash Memory TA = –40°C to 85°C, 2.4 V < REG25 < 2.6 V; Typical Values at TA = 25°C and REG25 = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS Data retention tDR (1) Flash-programming write cycles (1) tWORDPROG Word programming time (1) ICCPROG Flash-write supply current (1) (1) MIN TYP MAX UNIT 10 Years 20,000 Cycles 5 2 ms 10 mA Specified by design. Not tested in production. 6.14 I2C-Compatible Interface Timing Characteristics TA = –40°C to 85°C, 2.45 V < VREGIN = VBAT < 5.5 V; Typical Values at TA = 25°C and VBAT = 3.6 V (unless otherwise noted) MIN NOM MAX UNIT tR SCL/SDA rise time 300 ns tF SCL/SDA fall time 300 ns tW(H) SCL pulse width (high) 600 ns tW(L) SCL pulse width (low) 1.3 µs tSU(STA) Setup for repeated start 600 ns td(STA) Start to first falling edge of SCL 600 ns tSU(DAT) Data setup time 100 ns th(DAT) Data hold time tSU(STOP) Setup time for stop tBUF Bus free time between stop and start fSCL Clock frequency 8 0 ns 600 ns 66 µs 400 Submit Documentation Feedback kHz Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: BQ35100 BQ35100 www.ti.com SLUSCM6E – JUNE 2016 – REVISED APRIL 2019 tSU(STA) tw(H) tf tw(L) tr t(BUF) SCL SDA td(STA) tsu(STOP) tf tr th(DAT) tsu(DAT) REPEATED START STOP START Figure 1. I2C-Compatible Interface Timing Diagrams 6.15 Typical Characteristics 15 25 20 10 Current Error (mA) Voltage Error (mV) 15 5 0 -5 -10 10 5 0 -5 -10 -15 -15 -20 2800 -40qC -20qC 3000 3200 25qC 65qC 85qC -40qC -20qC -20 3400 3600 3800 Battery Voltage (mV) 4000 4200 4400 -25 -3000 -2000 25qC 65qC -1000 D001 Figure 2. V(Err) Across VIN (0 mA) 85qC 0 1000 Current (mA) 2000 3000 D003 Figure 3. I(Err) 2 1 Temperature Error (qC) 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -40 -20 0 20 40 Temperature (qC) 60 80 100 D004 Figure 4. T(Err) Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: BQ35100 9 BQ35100 SLUSCM6E – JUNE 2016 – REVISED APRIL 2019 www.ti.com 7 Detailed Description 7.1 Overview The BQ35100 Battery Fuel Gauge and End-Of-Service Monitor provides gas gauging for lithium thionyl chloride (Li-SOCl2) and lithium manganese dioxide (Li-MnO2) primary batteries without requiring any forced discharge of the battery. The lithium primary gas gauging function uses voltage, current, and temperature data to provide state-of-health (SOH) and end-of-service (EOS) data. 7.2 Functional Block Diagram REGIN GE 2.5-V LDO + Power Mgmt REG25 Oscillator System Clock Divider BAT VIN ADC TS Temp Sensor SDA SCL I2C Communications Gauging Algorithm Coulomb Counter SRP SRN VEN Peripherals ALERT Data Memory NC VSS Program Memory Copyright © 2017 , Texas Instruments Incorporated 7.3 Feature Description 7.3.1 Basic Measurement Systems 7.3.1.1 Voltage The device measures the BAT input using the integrated delta-sigma ADC, which is scaled by the internal translation network, through the ADC. The translation gain function is determined by a calibration process. In systems where the battery voltage is greater than VIN(BAT) MAX (for example, 2-series cell or more), then an external voltage scaling circuit is required. The firmware then scales this