User's Guide
SLVU824A – January 2013 – Revised January 2013
bq500211A bqTESLA Wireless Power TX EVM
The bqTESLA™ wireless power transmitter evaluation module from Texas Instruments is a highperformance, easy-to-use development module for the design of wireless power solutions. The singlechannel transmitter enables designers to speed the development of their end-applications. The
bq500211A EVM evaluation module (EVM) provides all basic functions of a Qi-compliant, wireless charger
pad. The EVM is intended to be used with bq51013AEVM-764, -765 or any other Qi-compliant receiver.
The EVM supports both the WPC 1.0 and WPC 1.1 receivers. The transmitter EVM is a 5-V input design
which powers a standard WPC low-power 5-W receiver. The bq500211AEVM-210 supports the
bq500211A device.
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7
8
Contents
Applications .................................................................................................................. 2
bq500211AEVM-210 Electrical Performance Specifications .......................................................... 2
Modifications ................................................................................................................. 2
Connector and Test Point Descriptions .................................................................................. 3
4.1
Input/Output Connections ......................................................................................... 3
4.2
Test Point Descriptions ............................................................................................ 3
Schematic and Bill of Materials ........................................................................................... 5
Test Setup .................................................................................................................. 10
6.1
Equipment ......................................................................................................... 10
6.2
Equipment Setup ................................................................................................. 10
bq500211AEVM-210 Assembly Drawings and Layout ............................................................... 12
Reference ................................................................................................................... 16
List of Figures
1
2
3
4
5
6
7
8
9
10
11
..........................................................................
bq500211AEVM-210 Schematic, Page 2 of 3 ..........................................................................
bq500211AEVM-210 Schematic, Page 3 of 3 ..........................................................................
Equipment Setup ..........................................................................................................
Efficiency versus Power, bq500211AEVM-210 Transmitter and HPA764 Receiver..............................
Assembly Top ..............................................................................................................
Top Silk .....................................................................................................................
Top Layer ...................................................................................................................
Layer 2 ......................................................................................................................
Layer 3 ......................................................................................................................
Bottom Layer ...............................................................................................................
bq500211AEVM-210 Schematic, Page 1 of 3
5
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15
15
List of Tables
1
bq500211AEVM-210 Electrical Performance Specifications .......................................................... 2
2
Bill of Materials .............................................................................................................. 8
bqTESLA, Dynamic Power Limiting are trademarks of Texas Instruments.
SLVU824A – January 2013 – Revised January 2013
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1
Applications
1
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Applications
The bq500211AEVM-210 evaluation module demonstrates the transmitter portion of the bqTESLA™
wireless power system. This transmitter EVM is a complete transmitter-side solution that powers a
bqTESLA™ receiver. The bq500211A EVM requires a single 5-V power supply capable of up to 2 A to
operate and combines the transmitter electronics, input power socket, LED indicators, and the transmitting
coil on the single printed-circuit board (PCB). The open design allows easy access to key points of the
electrical schematic. The board has an installed serial interface connector for more advanced operation.
This EVM has the following features:
• WPC 1.1 Foreign Object Detection (FOD) and WPC 1.0 Parasitic Metal Object Detection (PMOD)
• Dynamic Power Limiting™ (DPL) allows operation from a 5-V supply with limited current capability (for
example, a USB port).
• Transmitter-coil mounting pad providing the correct receiver interface
• Input power is really available at 5 V
• Standard WPC A11-type transmitter coil with no magnet
• LED indicates power transfer or power fault state
• Audio indication of start-of-power transfer though a board-mounted buzzer
2
bq500211AEVM-210 Electrical Performance Specifications
Table 1 provides a summary of the bq500211AEVM-210 performance specifications. All specifications are
given for an ambient temperature of 25°C.
Table 1. bq500211AEVM-210 Electrical Performance Specifications
Parameter
Notes and Conditions
Min
Typ
Max
Unit
V
Input Characteristics
VIN
Input voltage
5.0
5.10
IIN
Input current
VIN = Nom, IOUT = Max
4.90
1.50
2.0
Input no-load current
VIN = Nom, IOUT = 0 A
200
mA
Input stand-by current
VIN = Nom
20
mA
A
Output Characteristics – Receiver bq51013AEVM-764 or -765
VOUT
IOUT
Output voltage
VIN = Nom, IOUT = Nom
4.5
5
5.1
V
Output ripple
VIN = Nom, IOUT = Max
VIN = Min to Max
VIN = Min to Max
0
200
1
mVPP
A
Output overcurrent
VIN = Nom
1
1.1
A
205
kHz
Systems Characteristics
3
FS
Switching frequency
Switching frequency varies with load
ηpk
Peak efficiency
VIN = Nom, P Out RX = 2.5 W
110
72
%
η
Full-load efficiency
VIN = Nom, IOUT = Max
70
%
Modifications
See the data sheet (SLUSBB1) when changing components.
Use LED Mode – Resistor R23 to change the behavior of the status LED, D4. The standard value is
42.2 kΩ for control option 1, see the data sheet for additional settings.
NTC – Connector JP1 provides the option for connecting a negative temperature coefficient (NTC)
sensor for thermal protection, see the data sheet for additional settings.
EMI Shield – The board is laid out so that a shield can be placed over the active circuit area, Laird
Technology BMIS-207 can be used.
2
bq500211A bqTESLA Wireless Power TX EVM
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Connector and Test Point Descriptions
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4
Connector and Test Point Descriptions
4.1
Input/Output Connections
The connection points are described in the following paragraphs.
4.1.1
J1 – VIN
Input power 5 V ±100 mV, return at J2.
4.1.2
J2 – GND
Return for input power, input at J1.
4.1.3
J3 –JTAG
Factory use only.
4.1.4
J4 – Serial Interface
Factory use only.
4.1.5
JP2 – LED Mode
External connection for LED MODE resistor, if R23 is removed.
4.1.6
JP4 – Select for Normal or Power Limiting
Shorting this header enables the DPL feature and the input current is limited to 500 mA. With this
connector open, operation is normal, there is no restriction on input power.
4.1.7
JP3 – FOD / PMOD Enable
With this header open, FOD / PMOD is not active. With the shorting jumper installed, FOD is active for
WPC 1.1 RX and PMOD active for WPC 1.0 RX. See the data sheet for additional details.
4.1.8
JP1 – NTC
The connection point for the external temperature sensor. See the data sheet for more information.
4.2
Test Point Descriptions
The test points are described in the following paragraphs.
4.2.1
TP1 – Coil Drive Q1 / Q2
H-Bridge drive signal.
4.2.2
TP2 – Coil Monitor L / C
Coil signal at junction between coil and capacitors.
4.2.3
TP3 – PWR GND
Ground for switch circuits.
4.2.4
TP4 – Analog GND
Low-noise GND
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Connector and Test Point Descriptions
4.2.5
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TP5 – Analog GND
Low-noise GND
4.2.6
TP6 – Analog GND
Low-noise GND
4.2.7
TP7 – Analog GND
Low-noise GND
4.2.8
TP8 – DC Buzzer Output
The connection point for an external DC buzzer; logic high for 500 ms at the start of power transfer to
receiver unit.
4.2.9
TP9 – 3.3-VDC
Voltage for low-power circuits.
4.2.10
TP10 - Filtered 3.3 V
3.3-V output with additional filtering for A-to-D converters.
4.2.11
TP11 – Input voltage
Input voltage from J1.
4.2.12
TP12 – MSP430 3.3 V
Filtered 3.3 V for MSP430, U4.
4.2.13
TP13 – Demodulation Comm 1 Output
Primary communications channel, input to bq500211A, U1 from demodulation circuit.
4.2.14
TP14 – Sleep
Output from bq500211A, U1 to sleep timer circuit.
4.2.15
TP15 – Coil Drive Q3 and Q4 Side
H-Bridge drive signal Q3 and Q4.
4.2.16
TP16 – DPWM Signal
Digital output signal from bq500211A to H-Bridge drive for Q1 and Q2.
4.2.17
TP17 – DPWM Signal
Digital output signal from bq500211A to H-Bridge drive for Q3 and Q4.
4.2.18
TP18 – Spare Pin
Unused output from bq500211A.
4.2.19
TP19 – I_Sense
Input current-sense voltage, scale 1 V = 1 A.
4
bq500211A bqTESLA Wireless Power TX EVM
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Schematic and Bill of Materials
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5
Schematic and Bill of Materials
L1
1.0 uH
U5
VIN
J1
TP11
1
DC IN
5 Vin
C26
2
4.7uF
R4
D3
C2
1
4.7uF
1
SW 2
3 VIN
5 EN
2
3V3_VCC
FB 6
1 MODE
365
TP9
TPS62237DRY
GND 4
C25
4.7uF
J5
1
DC IN
D1
2
GND
R25
523k
LTST-C190GKT
1
GND
TP4 TP5 TP6 TP7
1
R37
1.0
VIN
2
2
J2
4
6
TP14
SLEEP
Q4
BSS138
C31
0.1uF
R32
C7
1.0k
.020 Ohm
C22
4.7uF
3
22uF
R46
5
INA199A1
TP19
U7
3V3_VCC
R36
1.0
C21
I_SENSE
C16
0.1uF
0.01uF
R18
10.0k
Q1
CSD17308Q3
U2
TPS28225D
6 VDD
VIN
DPWM-1A
BOOT 2
7 EN/PG
PHSE 8
4 GND
22uF
L2
TX Coil
UGATE 1
3 PWM
TP1
C6
Q3
CSD17308Q3
C23
R3
10.0
TP15
TP2
0.22uF
C15
6.3 uH
LGATE 5
Q2
CSD17308Q3
C9
0.1uF
R34
0
R1
10.0
C18
4700pF
C27
100nF
C28
100nF
C29
100nF
3V3_VCC C30
100nF
0.22uF
Q5
R6
100k
TP13
R29
10
R14
12.1k
2 BOOT
PWM 3
8 PHSE
EN/PG 7
5 LGATE
VIN
DPWM-1B
GND 4
C13
0.1uF
CSD17308Q3
TP3
U6
TPS28225D
1 UGATE
VDD 6
R13
0
D2
COMM+
BAT54SW
R26
10
R5
10.0k
C14
33pF
COMM-
Figure 1. bq500211AEVM-210 Schematic, Page 1 of 3
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Schematic and Bill of Materials
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U3
R24
10
TLV70033DCK
VIN
1 IN
OUT 5
3V3_VCC
2 GND
C17
0.1uF
3 EN
NC 4
-
C11
4.7uF
R16
C8
1.0uF
C10
0.01uF
R12
10.0k
Q6
BSS138
10.0k
MSP_RST
U4
MSP430G2001
TP12
Temp Sensor
3V3_ADC
3V3_VCC
R7
22
R19
JP1
10.0k
1 VCC
TP10
C24
3V3_VCC
MSP_CLK
4.7nF
MSP_MISO
C19
4.7uF
1.0uF
C1
3V3_VCC
U1
BQ500211A
I_SENSE
C4
4700pF
SLEEP
MSP_RST
MSP_MISO
MSP_TEST
TP18
MSP_CLK
10k
COMM+
COMMR50
MSP_RDY
V33A 34
4
3
2
1
46 V_IN
45 AIN7
42 I_IN
6
7
8
9
SLEEP
MSP_RST/LED_A
MSP_MISO/LED_B
MSP_TEST
1.0uF
R33
TEST 11
5 P1.3
RST 10
6 P1.4
P1.7 9
7 P1.5
P1.6 8
MSP_TEST
C12
1000pF
10.0k
R28
475
C20
PMB_CTRL 20
PMB_ALRT 19
PMB_DATA 11
PMB_CLK 10
DPWM_A 12
DPMB_B 13
MSP_SYNC 14
DOUT_2B 15
DOUT_4A 16
DOUT_4B 17
R27
475
1
R8
10.0k
/TRST
TMS
TDI
TDO
TCK
STATUS
PM_DATA
PM_CLK
18 MSP_TCK/CLK
MSP_TDO/PROG 26
21 DOUT_TX
MSP_MOSI/LPWR_EN 25
22 DRV_CFG
BUZ_DC 24
BUZ_AC 23
37 COMM_A+
R45
38 COMM_A10.0k
39 COMM_B+
LED_MODE 44
40 COMM_B43
PMOD_THR
47 AGND
36 AGND
32 DGND
49 EPAD
VIN
D4
HSMF-C165
R2
10.0
R47
10.0
TP17
TP16
DPWM-1A
MSP_SYNC
DPWM-1B
R48
10.0k
MSP_RDY
MSP_MOSI
TP8
R17
10.0k
AGND
BUZ
R44
475
R22
56.2k
1
4 P1.2
MSP_SYNC
MSP_MOSI
BPCAP 35
JTAG_TRSTN 31
JTAG_TMS 30
JTAG_TDI 29
JTAG_TDO 28
JTAG_TCK 27
AIN8
AIN3
T_SENSE
AIN5
R10
3V3_VCC
41 V33FB
48 REFIN
5 RESET
15.4k
R51
1.0uF
XOUT 12
R15
V33D 33
10K
R9
JP4
2.00k
4.7uF
C3
10.0k
XIN 13
3 P1.1
AGND
100k
R20
R11
C5
R30
GND 14
2 P1.0
JP3
R23
42.2k
JP2
D5
LTST-C190GKT
Parts with no values are not installed
Figure 2. bq500211AEVM-210 Schematic, Page 2 of 3
6
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J4
14
13
12
11
10
9
8
7
6
5
4
3
2
1
TCK
TDO
TDI
/TRST
TMS
1
2
3
4
5
6
7
8
9
10
PM_CLK
PM_DATA
J3
R40
10.0k
R41
10.0k
3V3_VCC
R43
10.0k
R21
R31
R35
R38
R49
R39
R42
3V3_VCC
SHD1
Figure 3. bq500211AEVM-210 Schematic, Page 3 of 3
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Schematic and Bill of Materials
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Table 2. Bill of Materials
Count
RefDes
Value
Description
Size
Part Number
MFR
1
BUZ
Buzzer
Piezoelectronic, 12 mm
12 mm
PS1240P02CT3
TDK
1
C14
33pF
Capacitor, Ceramic, 50V, C0G, 5%
0603
Std
Std
1
C12
1000pF
Capacitor, Ceramic, 10V, COG, 5%
0603
Std
Std
3
C4, C18, C24
4700pF
Capacitor, Ceramic, 50V, X7R, 10%
0603
Std
Std
2
C21, C10
0.01uF
Capacitor, Ceramic, 50V, X7R, 10%
0603
Std
Std
5
C13, C16, C17, C9, C31
0.1uF
Capacitor, Ceramic, 50V, X7R, 10%
0603
Std
Std
4
C27, C28, C29, C30
100nF
Capacitor, Ceramic, COG, 50V, 5%
1812
C4532COG1H104J
TDK
2
C15, C6
0.22uF
Capacitor, Ceramic, 50V, X7R, 20%
0603
Std
Std
4
C1, C3, C8, C20
1.0uF
Capacitor, Ceramic, 16V, X7R, 20%
0603
Std
Std
7
C22, C25, C5, C11, C19, C26, 4.7uF
C2
Capacitor, Ceramic, 10V, X5R, 20%
0603
Std
Std
1
C31
2.2uF
Capacitor, Ceramic, 10V, X5R, 20%
0603
Std
Std
2
C23, C7
22uF
Capacitor, Ceramic, 25V, X5R, 20%
1210
Std
Std
2
D1, D5
LTST-C190GKT
Diode, LED, Green, 2.1-V, 20-mA, 6-mcd
0603
LTST-C190GKT
Lite On
1
D2
BAT54SW
Diode, Dual Schottky, 200mA, 30V
SOT523
BAT54SWT1G
On Semi
0
D3
Open
Diode, Schottky, 0.5A, 30V
SOD-123
MMSZ5251BT1G
On Semi
1
D4
HSMF-C165
Diode, Bi-Color LED, [GRN/RED] 20mA, 52 mW Max.
0603
HSMF-C165
Avago
1
L1
1.0 uH
Inductor, SMT, 800 mA, ±20%
0805
LQM21PN1R0MC0
Murata
Alternate L1
1.0 uH
Inductor, SMT, 800 mA, ±20%
0805
74479775210
Wurth
1
L2
6.3 uH
Inductor, WPC TX Coil
53 × 53 mm
760-308-111
Wurth
4
Q1, Q2, Q3, Q5
CSD17308Q3
MOSFET, NChan, 30V, 13A, 9.4 milliOhm
QFN3.3x3.3 mm
CSD17308Q3
TI
2
Q4, Q6
BSS138
MOSFET, Nch, 50V, 0.22A, 3.5 Ohm
SOT23
BSS138
Fairchild
1
R10
15.4k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R11
2.00k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
R13, R34
0
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R32
0.020 Ohm
Resistor, Chip, 1/4W, 1%, 200ppm
0805
ERJ-6BWFR020V
Panasonic
7
R1-3, R24, R26, R29, R47
10
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R7
22
Resistor, Chip, 1/10W, 1%
0805
Std
Std
2
R36, R37
1.0 ohm
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R4
365
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
R27, R28, R44
475
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R46
1k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
R16, R48
3.32k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
8
bq500211A bqTESLA Wireless Power TX EVM
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Table 2. Bill of Materials (continued)
Count
RefDes
Value
Description
Size
Part Number
MFR
14
R5, R8, R9, R12, R16, R18,
R19, R30, R33, R41, R45,
R40, R43, R51
10.0k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R14
12.1k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R23
42.2k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R6
100k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R20
100k
Resistor, Chip, 1/16W, 1%
0402
Std
Std
1
R25
523k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
R15, R50, R21, R31, R35,
R38, R49, R39, R42
Open
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
U1
BQ500211ARGZ
IC, Qi Compliant Wireless Power Transmitter Manager
7X7 QFN
BQ500211ARGZ (R/T)
TI
2
U2 U6
TPS28225D
IC, High Frequency 4-Amp Sink Synchronous Buck MOSFET SO8
Driver
TPS28225D
TI
1
U4
MSP430G2001
IC, Mixed Signal Microcontroller
TSSOP
MSP430G2001IPW14
TI
1
U5
TPS62237DRY
IC, 3MHz Ultra Small Step Down Converter, 3.3 V
USON
TPS62237DRY
TI
1
U7
INA199A1
IC, Current Monitor, High or Low Side Measurement
SC-70
INA199A1
TI
1
U8
TLV70033DCK
IC, 150mA, Low IQ, LDO Regulator
SOT
TLV70033DCK
TI
0
SHD1
Open
Shield, Copper
44.4x44.4 mm
BMI-S-207-F
Laird Tech
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Test Setup
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6
Test Setup
6.1
Equipment
6.1.1
bqTESLA™ Receiver
Use the bq51013AEVM-764 or a Qi-compliant receiver to work with this EVM.
6.1.2
Voltage Source
The input voltage source must provide a regulated DC voltage of 5 V and deliver at least 2-A continuous
load current; current limit must be set to 3 A.
CAUTION
To help assure safety integrity of the system and minimize risk of electrical
shock hazard, always use a power supply providing suitable isolation and
supplemental insulation (double insulated). Compliance to IEC 61010-1,
Safety Requirements for Electrical Equipment for Measurement, Control and
Laboratory Use, Part 1, General Requirements, or its equivalent is strongly
suggested, including any required regional regulatory compliance
certification approvals. Always select a power source that is suitably rated
for use with this EVM as referenced in this user manual.
6.1.3
Meters
Monitor the output voltage at the bq51013AEVM-764 test point TP7 with a voltmeter. Monitor the input
current into the load with an appropriate ammeter. You can also monitor the transmitter input current and
voltage, but the meter must use the averaging function for reducing error, due to communications packets.
6.1.4
Loads
A single load is required at 5 V with a maximum current of 1 A. The load can be resistive or electronic.
6.1.5
Oscilloscope
Use a dual-channel oscilloscope with appropriate probes to observe the COMM_DRV signal at
bq51013AEVM-764 TP3 and other signals.
6.1.6
Recommended Wire Gauge
For proper operation, use 22-AWG wire when connecting the bq500211AEVM-210 to the input supply and
the bq51013AEVM-764 to the load.
6.2
Equipment Setup
•
•
•
6.2.1
With the power supply OFF, connect the supply to the bqTESLA™ transmitter.
Connect the VIN positive power source to J1, and connect the negative terminal of the VIN source to J2.
Do not place the bqTESLA™ receiver on the transmitter. Connect a load to J3 with a return to J4,
monitor current through the load with the ammeter, and monitor the current to the load at TP7. All
voltmeters must be Kelvin connected (at the pin) to the point of interest.
Equipment Setup Diagram
The diagram in Figure 4 shows the test setup.
10
bq500211A bqTESLA Wireless Power TX EVM
SLVU824A – January 2013 – Revised January 2013
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Test Setup
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Wireless Transmitter
bq500211EVM-045
Wireless Receiver
bq51013EVM-725
A
OUT_J2
J1
POS
A
VIN
+
-
TP1
AC1
LP
V
J2
RTN
V
AC1
TP2
AC2
OUT_TP7
VRECT_TP12
LS
V
RL
AC2
GND_J4
A
Voltmeter
Ammeter
+
-
Power Supply
Oscilloscope
Figure 4. Equipment Setup
6.2.2
EVM Procedures
This section guides the user through a few general test procedures to exercise the functionality of the
presented hardware. Some key notes follow.
6.2.2.1
Start-Up No Receiver
Turn on VIN, and observe that the green power LED, D1, illuminates. Status LED D5 is off until the power
transfer starts.
Apply the scope probe to the test point, TP1, and observe single-pulse bursts approximately every 400
ms. This is an analog ping probing environment for the presence of a receiver placed on the TX coil.
6.2.2.2
Apply Receivers
Place the bq51013AEVM-764 EVM on the top of the transmitting coil. Align the centers of the receiving
and transmitting coils across each other. In the next few seconds, observe that the status LED, D5,
flashes green, indicating that communication between the transmitter and the receiver is established and
that power transfer has started.
• The buzzer sounds at the start of power transfer. The status LED, D4, flashes a green light during
power transfer.
• Typical output voltage is 5 V, and the output current range is 0 mA to 1 A.
• Observe a continuous sine-wave on the test point TP1 when power transfer is active; the frequency is
between 110 kHz and 205 kHz.
• Make tests and measurements applicable to a normal 5-V power supply.
6.2.2.3
Efficiency
To measure system efficiency, measure the output voltage, the output current, input voltage, and input
current and calculate efficiency as the ratio of the output power to the input power. Connect voltage
meters at the input and output of TX and RX (see Figure 4). Average the input current; the comm pulses
modulate the input current, distorting the reading. See Figure 5 for efficiency.
SLVU824A – January 2013 – Revised January 2013
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11
bq500211AEVM-210 Assembly Drawings and Layout
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80
70
Efficiency (%)
60
50
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Power (W)
4.5
5.0
C001
Figure 5. Efficiency versus Power, bq500211AEVM-210 Transmitter and HPA764 Receiver
6.2.2.4
Dynamic Power Limiting
Dynamic Power Limiting (DPL) allows operation from a 5-V supply with limited current capability. DPL is
controlled by JP4, which pulls U1 pin 4 high or low. With the jumper open (pin 4 High) the IC monitors
input voltage and when that voltage is observed drooping, the output power is limited to reduce the load
and provide some operating margin relative to the supply’s capability. With a shorting jumper installed
(pin 4 Low), the IC restricts output power such that the input current remains below 500 mA, compatible
with a USB port. See the data sheet for additional information on the DPL function
6.2.2.5
Thermal Protection, NTC
Thermal protection is provided by an NTC resistor connected to JP1. At 1 V on the sense side (U1-2), the
thermal fault is set, and the unit is shut down, The status LED, D5, illuminates red. The typical resistor
value for fault is 850 Ω. The system tries to restart in 5 minutes.
7
bq500211AEVM-210 Assembly Drawings and Layout
Figure 6 through Figure 11 show the design of the bq500211AEVM PCB. The EVM has been designed
using a 4-layer, 2-oz, copper-clad circuit board 13.2 cm × 7.24 cm with all components in a 4.5-cm x 4.5cm active area on the top side and all active traces to the top and bottom layers to allow the user to easily
view, probe, and evaluate the bq500211A control IC in a practical application. Moving components to
both sides of the PCB or using additional internal layers offers additional size reduction for spaceconstrained systems. Gerber files are available for download from the EVM product folder.
A 4-layer PCB design is recommended to provide a good low-noise ground plane for all circuits. A 2-layer
PCB presents a high risk of poor performance. Grounding between the bq500211A GND pin 47, 36, and
32 and filter capacitor returns C19, C1, C5, and C3 should be a good low-impedance path.
Coil Grounding – A ground plane area under the coil is recommended to reduce noise coupling into the
receiver. The ground plane for the EVM is slightly larger than the coil footprint and grounded at one point
back to the circuit area.
Note: The clear plastic cover thickness (0.93 in or 2.4 mm) is the z-gap thickness for the transmitter.
12
bq500211A bqTESLA Wireless Power TX EVM
SLVU824A – January 2013 – Revised January 2013
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bq500211AEVM-210 Assembly Drawings and Layout
www.ti.com
Figure 6. Assembly Top
Figure 7. Top Silk
SLVU824A – January 2013 – Revised January 2013
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bq500211AEVM-210 Assembly Drawings and Layout
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Figure 8. Top Layer
Figure 9. Layer 2
14
bq500211A bqTESLA Wireless Power TX EVM
SLVU824A – January 2013 – Revised January 2013
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bq500211AEVM-210 Assembly Drawings and Layout
www.ti.com
Figure 10. Layer 3
Figure 11. Bottom Layer
SLVU824A – January 2013 – Revised January 2013
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bq500211A bqTESLA Wireless Power TX EVM
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15
Reference
8
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Reference
For additional information about the bq500211AEVM-210 low-power, wireless, power evaluation kit from
Texas Instruments, visit the product folder on the TI Web site at http://www.ti.com/product/bq500211a
16
bq500211A bqTESLA Wireless Power TX EVM
SLVU824A – January 2013 – Revised January 2013
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Copyright © 2013, Texas Instruments Incorporated
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO
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ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and
therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
software performance, or infringement of patents or services described herein.
REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM is subject to the Federal Communications Commission (FCC), Industry
Canada (IC) and European Union CE Mark rules.
FCC – FEDERAL COMMUNICATIONS COMMISSION Part 18 Compliant
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 18 of the FCC
Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:—Reorient or relocate the receiving
antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Note: There is no required maintenance of this device from a FCC compliance perspective.
IC – INDUSTRY CANADA ICES-001 Compliant
This ISM device complies with Canadian ICES-001.
Cet appareil ISM est conforme à la norme NMB-001 du Canada.
European Union CE Mark
This ISM device complies with Directive 2004/108/EC of the European Parliament and of the Council of 15 December 2004 on the
approximation of the laws of the Member States relating to electromagnetic compatibility and repealing Directive 89/336/EEC – the EMC
Directive, tested to EN55011: 2007, Industrial Scientific and Medical (ISM) radio-frequency equipment.
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EVALUATION BOARD/KIT/MODULE (EVM)
WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end
product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1.
2.
3.
4.
You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to
minimize the risk of electrical shock hazard.
You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even
if the EVM should fail to perform as described or expected.
You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable
in electronic measurement and diagnostics normally found in development environments should use these EVMs.
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives
harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate
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